JP2005150377A - Printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a printed wiring board in which a conductor pattern being insertion mounted with a lead component having an inter-terminal pitch of 2.5 mm and a conductor pattern being connected with a chip component at the time of surface mounting can be used commonly. <P>SOLUTION: Each land 20 of a conductor pattern 2 has a part 21 extending from a round shape 11 toward other land 20 with reference to the round shape 11, and a part 22 formed by cutting the round shape 11 at a position facing the extended part 21 of other land 20 wherein the extended part 21 and the cut part 22 of each land 20 are arranged on the opposite sides of a center line (c) connecting the central points of a pair of through holes 10. Since such a conductor pattern 2 is provided, a printed wiring board can mount a chip component such that the longitudinal direction thereof becomes parallel with the width direction (a) of the conductor pattern 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to printed wiring boards, and in particular, a conductor pattern to which lead components are electrically connected when inserting and mounting a lead component having a pitch of 2.5 mm between terminals, a chip capacitor, and a chip resistor. The present invention relates to a printed wiring board in which a conductor pattern to which a chip component is electrically connected when a chip component such as the above is surface-mounted is shared.

  Conventionally, it has a pair of through holes for inserting lead parts with a pitch of 5 mm between terminals, and a conductor pattern consisting of a pair of lands formed independently around the through holes. Conductor pattern in which lead components are electrically connected when 5 mm pitch lead components are inserted and mounted, and conductor pattern in which chip components are electrically connected when chip components such as chip capacitors and chip resistors are surface-mounted A printed wiring board is commonly used. In such a printed wiring board, it is possible to easily replace a part from a lead part to a chip part even after mold formation.

  On the other hand, in recent years, electronic components have been reduced in size and made into chips (or leadless). For example, as shown in FIG. 5A, lead components having a pitch of 2.5 mm between terminals are inserted and mounted. A conductive pattern 102 for this purpose is known. However, in a printed wiring board having such a conductor pattern 102, for example, when mounting a 2125 type or 1608 type chip component 4 in a direction in which the longitudinal direction is parallel to the longitudinal direction b of the conductor pattern 102 As shown in FIG. 5B, the electrode portion 41 of the chip component 4 is caught in the through hole 110 and cannot be soldered. For this reason, a conductor pattern for inserting and mounting a lead component having a 2.5 mm pitch between terminals and a conductor pattern for surface mounting the chip component 4 cannot be shared.

By the way, as land patterns that are also used for a plurality of electronic components having different terminal intervals, land portions are formed at positions corresponding to the terminals of the plurality of electronic components, and adjacent land portions on the same terminal side are formed. A printed wiring board connected with a conductive pattern narrower than the width of the land portion is known (for example, see Patent Document 1). In addition, by providing a concave conductive part on the end face of the printed wiring board and providing a land part at a position corresponding to the concave conductive part at the edge of the printed wiring board, both surface mounting and insertion part mounting are performed on the same substrate. A printed wiring board that can cope with this is known (for example, see Patent Document 2).
Japanese Utility Model Publication No. 63-59376 JP-A-8-264915

  However, in the printed wiring board described in either Patent Document 1 or Patent Document 2, the conductive pattern to which the lead component is connected when the lead component is inserted and mounted, and the chip component is connected when the chip component is surface-mounted. It is not possible to share the conductor pattern.

  The present invention has been made to solve the above-mentioned problems. When a lead component having a 2.5 mm pitch between terminals is inserted and mounted, a conductor pattern to which the lead component is connected and a surface mounting of the chip component are provided. It is an object of the present invention to provide a printed wiring board that can share a conductor pattern to which chip components are connected.

  In order to achieve the above object, the invention of claim 1 is formed independently of a pair of through holes for inserting an electrolytic capacitor having a pitch of 2.5 mm between terminals, and around the pair of through holes. A conductor pattern composed of a pair of lands, and a conductor pattern to which the electrolytic capacitor is electrically connected when the electrolytic capacitor is inserted and mounted, and a chip component such as a chip capacitor or a chip resistor is surface-mounted. In a printed wiring board in which a conductor pattern to which the chip component is electrically connected is shared, each land of the conductor pattern is based on a round shape, and the longitudinal direction of the chip component is the width direction of the conductor pattern. An extended portion extending from the round shape toward the other land for mounting in a direction parallel to the direction, and a predetermined land In order to ensure a gap, it has a notch formed by notching the round shape at a position facing the extension part of the other land, the extension part and the notch part of each land, The conductor pattern is disposed on the opposite side to the center line connecting the center points of the pair of through holes, and the width of the conductor pattern is not larger than the diameter of the round shape.

  According to a second aspect of the present invention, there is provided a conductor pattern comprising a pair of through holes for inserting lead parts having a pitch of 2.5 mm between terminals, and a pair of lands formed independently around the pair of through holes. A conductive pattern to which the lead component is electrically connected when the lead component is inserted and mounted, and the chip component is electrically connected to the surface of the chip component such as a chip capacitor or a chip resistor. In the printed wiring board that is shared with the conductor pattern to be connected, each land of the conductor pattern is based on a round shape, and the longitudinal direction of the chip component makes a predetermined angle with respect to the longitudinal direction of the conductor pattern. In order to mount in the direction, it has an extending portion extending from the round shape toward the other land side, the extending portion of each land, respectively, Characterized in that it is arranged on the opposite side with respect to the center line connecting the center points of the pair of through-holes.

  According to a third aspect of the present invention, in the printed wiring board according to the second aspect, each land of the conductor pattern is located at a position facing the extended portion of the other land in order to secure a predetermined land gap. It has a notch part formed by notching a round shape.

  As described above, according to the first aspect of the present invention, each land of the conductor pattern has the extending portion extending from the round shape toward the other land. Can be mounted in a direction in which the longitudinal direction is parallel to the width direction of the conductor pattern. As a result, the conductor pattern to which the electrolytic capacitor is connected when the electrolytic capacitor having a 2.5 mm pitch between the terminals is inserted and mounted, and the conductor pattern to which the chip component is connected when the chip component is surface-mounted are shared. It is possible to easily replace a part from an electrolytic capacitor to a chip part even after a printed wiring board is molded.

  Also, when the electrolytic capacitor is automatically inserted into the printed wiring board, the lead length of the electrolytic capacitor is inserted into the through hole of the printed wiring board, and then the unnecessary length of the lead wire is cut and attached by clinching. . At this time, since the electrolytic capacitor is usually clinched outward and attached to the printed wiring board, the round inner portion (position facing the extended portion of the other land) is not necessarily required. For this reason, a sufficient land gap can be ensured by cutting out the inner part of the round shape.

  Furthermore, by making the width of the conductor pattern not larger than the diameter of the round shape, it is possible to mount the electronic component with a mounting density equivalent to that of the conventional conductor pattern constituted by the round shape land.

  According to the second aspect of the present invention, each land of the conductor pattern has an extending portion extending from the round shape toward the other land side. It is possible to mount so that the direction is arranged in a direction that forms a predetermined angle with respect to the longitudinal direction of the conductor pattern. As a result, the conductor pattern to which the lead component is connected when inserting and mounting the lead component having a 2.5 mm pitch between the terminals and the conductor pattern to which the chip component is connected when the chip component is surface-mounted are shared. Can do.

  According to the invention of claim 3, the lead part to be bent outwardly is not necessarily required to have a round-shaped inner side (a position facing the extended portion of the other land), and therefore this portion is notched. Thus, a sufficient land gap can be secured.

  A printed wiring board according to an embodiment of the present invention will be described with reference to FIGS. The printed wiring board 1 is independently formed around a pair of through-holes 10 for inserting electrolytic capacitors 3 whose lead wires (terminals) 31 are spaced at a pitch of 2.5 mm, and around the pair of through-holes 10. A conductor pattern 2 composed of a pair of lands 20, and a conductor pattern 2 to which the electrolytic capacitor 3 is electrically connected when the electrolytic capacitor 3 is inserted and mounted, and a chip component 4 such as a chip capacitor or a chip resistor. Is used in common with the conductor pattern 2 to which the chip component 4 is electrically connected.

  Each land 20 of the conductor pattern 2 has an extending part 21 and a notch part 22 as shown in FIG. The extending portion 21 extends from the round shape 11 toward the other land 20. In the conventional conductor pattern for inserting and mounting the electrolytic capacitor 3 having a pitch of 2.5 mm between the terminals, no land is formed at the position of the extending portion 21, and therefore the chip component 4 (see FIG. 3A). Cannot be disposed in a direction in which the longitudinal direction is parallel to the width direction a of the conductor pattern 2, and the chip component 4 cannot be mounted. In the printed wiring board 1 of the present embodiment, since the land 20 has the extending portion 21, the chip component 4 is arranged in a direction in which the longitudinal direction is parallel to the width direction a of the conductor pattern 2. can do. For this reason, it becomes possible to share the conductor pattern 2 for inserting and mounting the electrolytic capacitor 3 and the conductor pattern 2 for surface-mounting the chip component 4, and even after the mold formation of the printed wiring board 1, Parts can be easily replaced from the electrolytic capacitor 3 to the chip component 4.

  Further, the notch 22 is formed by notching the round shape 11 at a position facing the extended portion 21 of the other land 20. When the electrolytic capacitor 3 is mounted on the printed wiring board 1, it is usually clinched outward and attached to the printed wiring board 1, so the inner side of the round shape 11 (position facing the extended portion of the other land) is It is not always necessary. For this reason, it is possible to secure a sufficient land gap p by cutting the inner portion of the round shape 11.

  The extended portion 21 of each land 20 is disposed on the opposite side to the center line c connecting the center points of the pair of through holes 10. The notch 22 of each land 20 is also arranged on the opposite side to the center line c. The width d of the conductor pattern 2 is formed to be substantially equal to the diameter of the round shape 11. By making the width d of the conductor pattern 2 not larger than the diameter of the round shape 11, an electron with a mounting density equivalent to that of the conventional conductor pattern 102 formed of the round shape land 120 shown in FIG. Components can be mounted.

  Next, a method for inserting and mounting the electrolytic capacitor 3 on the printed wiring board 1 and a method for surface mounting the chip component 4 will be described with reference to FIGS. First, a method for surface mounting the electrolytic capacitor 3 on the printed wiring board 1 will be described with reference to FIG. The electrolytic capacitor 3 is automatically inserted into the printed wiring board 1 by using, for example, a radial component insertion machine. At the time of automatic insertion, the electrolytic capacitor 3 is inserted into the through hole 10 of the printed wiring board 1, the lead wire 31 of the electrolytic capacitor 3 is inserted, the unnecessary length of the lead wire 31 is cut, and the lead wire 31 is at a predetermined angle. It is attached by external bending clinching. The land 20 and the lead wire 31 are joined by the solder 5, whereby the electrolytic capacitor 3 is inserted and mounted on the printed wiring board 1.

  Next, a method for surface mounting the chip component 4 on the printed wiring board 1 will be described with reference to FIG. The chip component 4 has a round shape and a square shape, and there are 2125 type, 1608 type, 1005 type, etc. according to the size of the square shape. In the present embodiment, as an example, a case where the 1608 type is mounted will be described. In the 1608 type, the external dimensions of the parts are represented by 1.6 mm × 0.8 mm. The chip component 4 is attached to the printed wiring board 1 so that its longitudinal direction is arranged in a direction parallel to the width direction a of the conductor pattern 2, and is surface-mounted by soldering. In this way, the extended portion 21 is provided on the land 20, and the chip component 4 is attached so that the longitudinal direction thereof is arranged in a direction parallel to the width direction a of the conductor pattern 2. When mounting, a sufficient solder margin can be secured on the land 20.

  The present invention is not limited to the configuration of the above embodiment, and various modifications can be made. For example, the lead component to be inserted and mounted is not limited to the electrolytic capacitor 3, and may be any other radial component, axial component, or the like that is an electronic component that is externally clinched when mounted on the printed wiring board 1. Further, the direction in which the chip component 4 is mounted on the printed wiring board 1 is not limited to the case where the longitudinal direction of the chip component 4 is arranged in a direction parallel to the width direction a of the conductor pattern 2, as shown in FIG. As shown, the longitudinal direction of the chip component 4 may be arranged in a direction that forms a predetermined angle with respect to the longitudinal direction b of the conductor pattern 2. In this case, the extended portion 21 may be formed from the round shape 11 toward the other land side in accordance with the mounting angle α of the chip component 4, and a sufficient land clearance is provided depending on the direction in which the extended portion 21 is extended. When p (see FIG. 4A) is obtained, the notch 22 as shown in FIGS. 1 to 3 is not necessarily provided. When the notch 22 is not provided, the printed wiring board 1 can be attached to the printed wiring board 1 by inward bending clinching because the lead parts can be attached by internal bending clinching. Become.

The top view of the conductor pattern of the printed wiring board by one Embodiment of this invention. (A) is a top view which shows a mode that the electrolytic capacitor was inserted and mounted in the printed wiring board, (b) is the sectional view on the AA line in (a) figure. (A) is a top view which shows a mode that the chip component was surface-mounted on the same printed wiring board, (b) is the BB sectional drawing in (a) figure. (A) is a top view of the conductor pattern of the printed wiring board by the modification of this invention, (b) is a top view which shows a mode that the chip component was surface-mounted on the printed wiring board. (A) is a top view of the conductor pattern of the conventional printed wiring board, (b) is a top view which shows a mode that the chip component was surface-mounted on the printed wiring board.

Explanation of symbols

1 Printed wiring board 2 Conductor pattern 3 Electrolytic capacitor (lead component)
4 Chip component 10 Through hole 11 Round shape 20 Land 21 Extension portion 22 Notch a Conductor pattern width direction b Conductor pattern longitudinal direction c Center line d Land width p Land gap

Claims (3)

A pair of through-holes for inserting electrolytic capacitors having a pitch of 2.5 mm between the terminals, and a conductor pattern comprising a pair of lands formed independently around the pair of through-holes, A conductor pattern to which the electrolytic capacitor is electrically connected when the capacitor is inserted and mounted, and a conductor pattern to which the chip component is electrically connected when the chip component such as a chip capacitor and a chip resistor is surface-mounted. In the shared printed wiring board,
Each land of the conductor pattern is
Based on the round shape,
In order to mount the chip component in a direction in which the longitudinal direction thereof is parallel to the width direction of the conductor pattern, an extending portion extending from the round shape toward the other land,
In order to ensure a predetermined land gap, and having a notch portion formed by notching the round shape at a position facing the extension portion of the other land,
The extended part and the notch part of each land are arranged on the opposite side to the center line connecting the center points of the pair of through holes, respectively.
A width of the conductor pattern is not larger than a diameter of the round shape. A lead pattern having a pair of through-holes for inserting lead components having a pitch of 2.5 mm between the terminals, and a conductor pattern comprising a pair of lands formed independently around the pair of through-holes, A conductor pattern in which the lead component is electrically connected when the component is inserted and mounted, and a conductor pattern in which the chip component is electrically connected when the chip component such as a chip capacitor or a chip resistor is surface-mounted. In the shared printed wiring board,
Each land of the conductor pattern is
Based on the round shape,
In order to mount the chip component in a direction in which the longitudinal direction forms a predetermined angle with respect to the longitudinal direction of the conductor pattern, the chip component has an extending portion that extends from the round shape toward the other land side,
The printed wiring board, wherein the extended portion of each land is disposed on the opposite side to the center line connecting the center points of the pair of through holes. Each land of the conductor pattern is
3. The printed wiring according to claim 2, further comprising a cutout portion formed by cutting out the round shape at a position facing the extension portion of the other land in order to secure a predetermined land gap. Board.

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