JP2005150132A - Semiconductor cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor cooling device in which cooling performance is raised by reducing the pressure loss of a cooling wind passing though radiation fins of a comb type cooler. <P>SOLUTION: In the semiconductor cooling device, the sectional shape of the radiation fin 12 in a plane perpendicular to a cooling wind blowing direction is formed in a comb shape, and a semiconductor element 14 is mounted on a heat receiver 13. The semiconductor element is disposed in a sealing part, and the radiation fin is disposed in an open part. The comb type coolers 11b1, 11b2 which blow the cooling winds to the radiation fins and radiate heats of the semiconductor element to the open part, are arranged in series in a plurality of stages to the cooling wind blowing direction. There is at least one stage in which the two or more comb type coolers are arranged in parallel with the cooling wind blowing direction, and there is at least one position where sizes of the comb type coolers aligned in series are not the same. Thickness central positions of the radiation fins are aligned and disposed opposite to one another of a windward comb type cooler disposed in the windward to the cooling wind blowing direction and a leeward comb type cooler disposed in the leeward. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a semiconductor cooling device for cooling a semiconductor element used in, for example, a power conversion device.

  For example, a vehicular power conversion device is installed under the floor of a vehicle, converts power from an overhead wire by a semiconductor element and supplies it to a vehicular drive motor or other various loads. In this case, since the semiconductor element generates heat, the vehicle power converter is provided with a semiconductor cooling device for cooling the semiconductor element.

  9A is a side view of a conventional comb cooler of a semiconductor cooling device, FIG. 9B is a cross-sectional view taken along the line AA of FIG. 9A, and FIG. The comb cooler 11 has a heat radiating fin 12 and a heat receiving part 13, and attaches the semiconductor element 14 to the heat receiving surface of the heat receiving part 13. And while the heat receiving part 13 to which the semiconductor element 14 was attached is arrange | positioned in the sealing part of the power converter device for vehicles, the radiation fin 12 is arrange | positioned in an open part, and it cools by sending the cooling air 15 to an open part.

  That is, the comb cooler 11 is formed so that the cross-sectional shape of the radiating fin portion in a plane orthogonal to the blowing direction of the cooling air 15 (AA cross-sectional view in FIG. 9A) becomes a comb shape, The semiconductor element 14 is attached to the heat receiving surface of the heat receiving unit 13 of the comb cooler 11. Heat generated from the semiconductor element 14 is transferred to the heat radiating fins 12 that are heat radiating portions via the heat receiving portion 13, and exhausted by blowing cooling air 15 to the heat radiating fins 12 installed in the open portion.

  FIG. 10 is a side view of a conventional semiconductor cooling device in which the comb cooler 11 shown in FIGS. 9A to 9C is mounted on a forced air cooling type vehicle power conversion device. The heat receiving portion 13 of the comb cooler 11 is attached to the cooler mounting surface of the vehicle power conversion device 16, and the radiation fins 12 are disposed in the wind tunnel 17 provided inside the vehicle power conversion device 16. The cooling air 15 is blown to the radiating fins 12 in the wind tunnel 17 by 18. A heating element 19 such as a transformer, a reactor, and a resistor is also disposed in the wind tunnel 17 and is simultaneously cooled by the cooling air 15.

  11A is a side view when the comb coolers are arranged in series in two stages with respect to the cooling air blowing direction, FIG. 11B is a C arrow view of FIG. 11A, FIG. 11C is a DD cross-sectional view of FIG. 11A is a cross-sectional view taken along the line E-E in FIG. 11A, FIG. 11E is a view taken along the arrow F in FIG. 11A, and FIG. 11F is a view taken along the arrow G in FIG.

  As shown in FIGS. 11A and 11B, a plurality of comb-type coolers 11 a and 11 b are arranged in series with respect to the air blowing direction of the cooling air 15, and are arranged in series, and are orthogonal to the air blowing direction of the cooling air 15. 20 includes at least one comb cooler 11.

  FIG. 11C shows the arrangement positions of the radiation fins 12 and the thicknesses d1 and fin pitches p1 of the radiation fins 12 in the windward comb coolers 11a1 and 11a2 arranged on the windward side with respect to the blowing direction of the cooling air 15. FIG. 11D shows the arrangement positions of the radiation fins 12 and the thicknesses d1 and fin pitches p1 of the radiation fins 12 in the leeward comb coolers 11b1 and 11b2 arranged leeward with respect to the blowing direction of the cooling air 15. The fin pitch of the radiation fins 12 is the distance between the center positions of the thickness d1 of the radiation fins 12.

  Since there is a gap between the center position of the radiating fins 12 in the windward comb cooler 11a and the center position of the radiating fins 12 in the leeward comb cooler 11b, as shown in FIG. When viewed from the direction, the radiating fins 12 of the leeward comb cooler 11b overlap between the radiating fins 12 of the windward comb cooler 11a.

  Therefore, as shown in FIG. 11F, in the space between the coolers y of the windward comb cooler 11a and the windward comb cooler 11b, the cooling air 15 passing through the heat radiation fins x1 of the windward comb cooler 11a is It is disturbed by the thickness d1 of the radiating fin 12 of the leeward comb cooler 11b. For this reason, the ventilation resistance of the cooling air 15 passing through between the heat radiation fins x1 is increased.

  FIG. 12A is a side view of a conventional semiconductor cooling device in which the comb-type cooler 11 shown in FIGS. 11A to 11F is mounted on a forced air cooling type vehicle power conversion device 16, and FIG. 12B is a view taken along the arrow H in FIG. FIG. Since the cooling air 15 in the wind tunnel 17 is obstructed by the thickness d1 of the radiating fin 12 of the downwind comb cooler 11b, most of the cooling air 15 passes between the heating element 19 and the radiating fin 12 in the wind tunnel 17. become. That is, it passes through a space other than the heat radiating fins 12, and the air volume necessary for the performance of the comb cooler 11 cannot be secured. Therefore, as shown in FIG. 12E, a baffle plate 21 is installed in the wind tunnel 17 to block the space other than the heat radiating fins 12 so that the cooling air 15 passes through the heat radiating fins 12. Then, since the pressure loss of the whole wind tunnel 17 becomes large, the large sized electric blower 18 was needed.

By the way, there is one in which heating elements are arranged in multiple stages in the blowing direction of the cooling air so that the total number of radiating fins on the blowing direction line is substantially the same to uniformly cool the whole (see, for example, Patent Document 1). In addition, there is a semiconductor cooling device in which a cooler in which a large number of flat radiating fins are installed at a predetermined interval in the vertical direction is installed under the floor of a vehicle (see, for example, Patent Document 2). Furthermore, there is also a configuration in which a cooling performance distribution is changed by providing a plurality of corrugated fins having different fin pitches in the cooling air blowing direction (see, for example, Patent Document 3).
JP 2003-46279 A JP 2000-92819 A JP 2001-85558 A

  In the conventional semiconductor cooling device, there is a deviation between the center position of the thickness of the radiating fin of the windward comb cooler and the center position of the thickness of the radiating fin of the leeward comb type cooler arranged on the leeward side. The pressure loss of the cooling air that passes between them increases. For this reason, sufficient cooling may not be possible. In addition, in the case of the forced air blow type, it is necessary to prepare a large electric blower to secure a predetermined air volume. In such a case, the outer shape and mass of the device become large, and it is difficult to reduce the size and weight of the device. It was.

  An object of the present invention is to provide a semiconductor cooling device in which the pressure loss of cooling air passing through between the radiating fins of the comb cooler is reduced and the cooling performance is improved.

  According to a first aspect of the present invention, there is provided a semiconductor cooling device in which a cross-sectional shape of a radiating fin portion in a plane orthogonal to a cooling air blowing direction is a comb shape, a semiconductor element is attached to a heat receiving portion, and the semiconductor element is disposed in a sealed portion. And the heat dissipating fin part is arranged in the open part, and a comb type cooler that blows cooling air to the heat dissipating fin part and dissipates heat of the semiconductor element to the open part is arranged in a plurality of stages in series with respect to the cooling air blowing direction, There are at least one stage in which two or more comb coolers are arranged in parallel with the cooling air blowing direction, and at least one place where the size of the comb coolers arranged in series is not the same, It is characterized in that the center positions of the thicknesses of the radiating fins facing each other of the upwind comb type cooler arranged on the windward side and the downwind comb type cooler arranged on the downwind side are aligned with respect to the cooling air blowing direction. Do

  According to a second aspect of the present invention, there is provided the semiconductor cooling device according to the first aspect, wherein the comb fin cooler has different heat dissipating fin thicknesses between the upwind comb cooler and the downwind comb cooler. It is characterized by.

  According to a third aspect of the present invention, there is provided the semiconductor cooling device according to the first or second aspect of the present invention, wherein the radiating fins of the comb cooler have a height of the upwind comb cooler and the downwind comb cooler. And are different from each other.

  A semiconductor cooling device according to a fourth aspect of the present invention is the semiconductor cooling device according to any one of the first to third aspects, wherein the fin pitch of the radiating fins of the comb cooler is the same as that of the upwind comb cooler. It is different from the lee comb type cooler.

  According to a fifth aspect of the present invention, there is provided a semiconductor cooling device according to any one of the first to fourth aspects of the present invention, wherein at least one of the upwind comb cooler and the downwind comb cooler is used. The fin pitch of the heat dissipating fins of the cooler is characterized by being coarse and dense according to the amount of heat generated by the semiconductor element attached to the heat receiving portion.

  A semiconductor cooling device according to a sixth aspect of the present invention is the semiconductor cooling device according to any one of the first to fifth aspects, wherein the cooling air blowing direction surface of the heat dissipating fin of the comb cooler is chamfered. Features.

  A semiconductor cooling device according to a seventh aspect of the present invention is the semiconductor cooling device according to any one of the first to sixth aspects, wherein the heat radiation fins of the comb-type cooler are different in length in the cooling air blowing direction from the adjacent heat radiation fins. It is characterized by that.

  According to the present invention, it is possible to reduce the pressure loss of the cooling air passing through between the heat dissipating fins of the comb cooler, and the cooling air can be smoothly passed, so that the cooling performance is improved. Therefore, in the case of the forced air cooling type, since the electric blower can be reduced in size, the entire apparatus can be reduced in size and weight.

  Comb shape by arranging the thickness center positions of the radiating fins facing each other of the windward comb cooler placed on the windward and the windward comb cooler placed on the leeward with respect to the cooling air blowing direction. Reduces the pressure loss of the cooling air that passes between the radiating fins of the cooler.

  1A is a side view of a comb-type cooler of a semiconductor cooling apparatus according to a first embodiment of the present invention, FIG. 1B is a cross-sectional view taken along line II in FIG. 1A, FIG. 1C is a cross-sectional view taken along line JJ in FIG. FIG. 1A is a view taken in the direction of arrow K, and FIG. 1E is a view taken in the direction of arrow L in FIG. 1A.

  As shown in FIGS. 1A to 1E, the comb coolers 11 a and 11 b are formed in a comb shape in the cross-sectional shape of the radiating fins 12 in a plane orthogonal to the blowing direction of the cooling air 15, and are multistage in the blowing direction. Are arranged in series. A semiconductor element 14 is attached to the heat receiving portion 13 of the comb coolers 11a and 11b. The semiconductor element 14 is arrange | positioned so that it may be located, for example in the sealing part of a vehicle power converter device, and the radiation fin 12 is arrange | positioned, for example in the open part of a vehicle power converter device. Cooling air is blown to the radiating fin portion, and the heat generated by the semiconductor element 14 is radiated to the open portion.

  As shown in FIG. 1E, the comb coolers 11a and 11b have at least one stage arranged in parallel with the air blowing direction of the cooling air 15 and are arranged in series. There is at least one place where the sizes of 11a and 11b are not the same. For example, the size of the comb cooler 11a1 and the comb cooler 11b1 arranged in series is not the same.

  FIG. 1B shows the arrangement positions of the radiation fins 12 and the thicknesses d1 and fin pitches p1 of the radiation fins 12 in the windward comb coolers 11a1 and 11a2 arranged on the windward side with respect to the blowing direction of the cooling air 15. FIG. 1C shows the arrangement positions of the radiation fins 12 and the thicknesses d1 and fin pitches p1 of the radiation fins 12 in the leeward comb coolers 11b1 and 11b2 arranged leeward with respect to the blowing direction of the cooling air 15.

  Then, as shown in FIGS. 1B and 1C, the upwind comb cooler 11 a disposed on the windward side with respect to the blowing direction of the cooling air 15 and the downwind comb cooler 11 b disposed on the leeward face each other. The center positions of the thicknesses d1 of the radiating fins are aligned.

  Since the center positions of the thicknesses d1 of the radiating fins 12 of the windward comb cooler 11a and the windward comb cooler 11b facing each other are aligned, as shown in FIG. 1D, the windward comb cooler 11a When the leeward comb cooler 11b is arranged, the position of the x1 between the heat radiating fins coincides. Therefore, as shown in FIG. 1E, the ventilation resistance between the coolers 15 of the cooling air 15 passing through the heat radiation fins x1 is reduced, and the pressure loss can be reduced.

  2A is a side view of a semiconductor cooling device in which the comb cooler 11 shown in FIGS. 1A to 1E is mounted on a forced air cooling type vehicle power conversion device, and FIG. 2B is a view in the direction of arrow M in FIG. 2A. . The comb cooler 11 is attached to the cooler mounting surface of the power conversion device 16 mounted under the floor of the vehicle body 22 so that the radiating fins 12 are parallel to the vehicle traveling direction 23 and come out to the open portion. Heat is dissipated by the vehicle running wind 24. In addition, about the attachment surface to the power converter device 16 of the comb cooler 11, the bottom face of the power converter device 16 or the vehicle body center side may be sufficient.

  According to the first embodiment of the present invention, the pressure loss of the cooling air 15 passing between the radiating fins 12 is reduced, so that the cooling air can be used not only in the traveling air cooling type but also in the forced air cooling type. The ventilation resistance of 15 decreases and cooling efficiency improves. In the case of forced air cooling, the electric blower can be reduced in size and weight, and the apparatus can be reduced in size and weight.

  3A is a side view of a comb cooler of a semiconductor cooling device according to a second embodiment of the present invention, FIG. 3B is a cross-sectional view taken along line NN in FIG. 3A, FIG. 3C is a cross-sectional view taken along line OO in FIG. 3A is a view taken in the direction of arrow P, and FIG. 3E is a view taken in the direction of arrow Q in FIG. 3A. The second embodiment is different from the first embodiment shown in FIGS. 1A to 1E in that the thickness of the radiating fin 12 of the comb cooler 11 is different between the windward comb cooler 11a and the leeward comb cooler 11b. It is comprised as follows. 3A to 3E show a case where the thickness d2 of the radiating fin 12a of the windward comb cooler 11a is smaller than the thickness d1 of the radiating fin 12b of the leeward comb cooler 11b. The same elements as those in FIGS. 1A to 1E are denoted by the same reference numerals, and redundant description is omitted.

  In the second embodiment, the thickness d2 of the radiating fin 12a of the windward comb cooler 11a in the first embodiment is smaller than the thickness d1 of the radiating fin 12b of the leeward comb cooler 11b. For example, in the traveling wind cooling method that dissipates heat by the vehicle traveling wind, the comb-type cooler 11 that reduces the thickness d of the radiating fin 12 has a small heating value when the vehicle speed is low and a large heating value when the vehicle speed is high. A semiconductor element 14 having a converter function is attached.

  Now, a windward comb type cooler 11a to which a semiconductor element 14 having a converter function is installed is installed on the windward, where the calorific value is small when the vehicle speed is low and the calorific value is large when the vehicle speed is high. A leeward comb cooler 11b to which a semiconductor element 14 having an inverter function is installed is attached to the leeward so that the heat generation amount is large when the vehicle speed is low and the heat generation amount is small when the vehicle speed is high. Let's consider the case.

  The relationship between the thermal resistance of the comb cooler 11 and the vehicle speed is such that when the vehicle speed is low and the cooling air 15 that can be taken into the radiating fins 12 is small, the thermal resistance at the comb cooler 11 is large, and the vehicle speed is high and heat is dissipated. When the cooling air 15 that can be taken into the fins 12 is large, the thermal resistance in the comb cooler 11 is small.

  Therefore, as shown in FIGS. 3B and 3C, the thickness d2 of the radiating fin 12a of the windward comb cooler 11a that generates a small amount of heat in the low speed region is made thinner than the thickness d1 of the radiating fin 12b of the leeward comb cooler 11b. As shown in FIG. 3D, the distance x2 between the radiating fins of the windward comb cooler 11a is made larger than the distance x1 between the radiating fins of the leeward comb cooler 11b. As a result, the pressure loss of the cooling air 15 passing through the radiating fins x2 of the windward comb cooler 11a is reduced, the intake air speed to the leeward comb cooler 11b is increased, and the thermal resistance is decreased. Reduction can be performed.

  Further, the wind-up comb cooler 11a has a reduced heat dissipation area and a reduced cooling performance due to a decrease in the thickness d2 of the heat dissipating fins 12a. However, since the heat generation amount is small in the low speed region, a high cooling performance is not required. There is no hindrance to cooling. On the other hand, since the thickness d2 of the radiating fin 12a is reduced in the high speed region where the heat generation amount is large, the airflow resistance is reduced because the space between the radiating fins x2 is enlarged. For this reason, the cooling wind speed is increased and the thermal resistance of the upwind comb cooler 11a is reduced, so that the above-described decrease in cooling performance can be compensated. Further, reducing the thickness d2 of the heat dissipating fins 12a leads to a reduction in the weight of the windward comb cooler 12a.

  Next, consider a case where the vehicle traveling direction is reversed and the disposition of the windward and leeward comb comb coolers 11 is reversed. In this case, the lee comb type cooler 11b constituting the inverter is located on the windward side, but since it is on the windward side, a larger amount of cooling airflow can be obtained. On the other hand, the windward comb type cooler 11a constituting the converter is positioned on the leeward side, and the cooling air volume is reduced. However, since the thickness d2 of the radiating fin 12a is thin, the ventilation resistance is small and the intake air speed is increased to cool the air. Performance is improved.

  According to the second embodiment, the center positions of the thicknesses of the radiating fins 12 of the windward comb cooler 11a and the leeward comb cooler 11b that are opposed to each other are aligned, and the radiating fins 12 of the comb cooler 11 are arranged. Since the thickness d is reduced, the pressure loss of the cooling air passing through the radiating fins 12 can be further reduced, and the comb cooler 11 can be reduced in weight.

  4A is a side view of a comb cooler of a semiconductor cooling device according to a third embodiment of the present invention, FIG. 4B is an RR cross-sectional view of FIG. 4A, and FIG. 4C is an SS cross-sectional view of FIG. The third embodiment is different from the first embodiment shown in FIG. 1A to FIG. 1E or the second embodiment shown in FIG. 3A to FIG. The cooler 11a and the downwind comb cooler 11b are configured to be different from each other. FIGS. 4A to 4C show the case where the height h2 of the radiating fin 12a of the windward comb cooler 11a is smaller than the height h1 of the radiating fin 12b of the leeward comb cooler 11b. The same elements as those in FIGS. 1A to 1E or FIGS. 3A to 3E are denoted by the same reference numerals, and redundant description is omitted.

  In Example 3, the assembly is performed such that the height h1 of the radiating fin 12a of the windward comb cooler 11a and the height h2 of the radiating fin 12b of the leeward comb cooler 11b are different from each other. For example, in a traveling wind cooling system that dissipates heat by the traveling wind of a vehicle, the comb-type cooler 11 that reduces the height h of the heat dissipating fin 12 has a small amount of heat generated when the vehicle speed is low, and a small amount of heat when the vehicle speed is high. When the semiconductor element 14 having the function of a converter to be enlarged is attached, the height h2 of the radiating fin 12a of the windward comb cooler 11a that generates a small amount of heat in the low speed region is lowered, and the radiating fin of the cooler 11b. The height is shorter than the height h1 of 12b.

As a result, the pressure loss of the cooling air 15 passing through the space between the heat dissipating fins x of the windward comb cooler 11a can be reduced, and the cooling performance is improved. Further, by reducing the height h2 of the radiating fins 12a, the comb cooler 11 can be reduced in weight.
According to the third embodiment, the central positions of the thicknesses of the radiating fins 12 of the windward comb cooler 11a and the leeward comb cooler 11b that are opposed to each other are aligned, and the radiating fins 12 of the comb cooler 11 are arranged. Since the height h is configured to be different between the windward comb cooler 12a and the windward comb cooler 12b, the pressure loss of the cooling air passing through between the radiating fins of the comb cooler 11 can be further reduced. It is possible to provide a semiconductor cooling device that takes into account the reduction in size and weight of the device.

  5A is a side view of a comb cooler of a semiconductor cooling device according to a fourth embodiment of the present invention, FIG. 5B is a TT cross-sectional view of FIG. 5A, FIG. 5C is a UU cross-sectional view of FIG. FIG. 5A is a view as viewed from an arrow V, and FIG. 5E is a view as viewed from an arrow W in FIG. 5A. The fourth embodiment is different from the first embodiment shown in FIGS. 1A to 1E in that the fin pitch p of the heat radiation fin 12 of the comb cooler 11 is different between the windward comb cooler 11a and the leeward comb cooler 11b. They are configured to be different from each other. 5A to 5E show the fin pitch p2 of the radiating fin 12a of the windward comb cooler 11a larger than the fin pitch p1 of the radiating fin 12b of the leeward comb cooler 11b. The same elements as those in FIGS. 1A to 1E are denoted by the same reference numerals, and redundant description is omitted.

  In Example 4, the fin pitch p of the comb cooler 11 is assembled so as to be different between the fin pitch p2 of the windward comb cooler 11a and the fin pitch p1 of the leeward comb cooler 11b. For example, in a traveling wind cooling system that dissipates heat by the traveling wind of a vehicle, the comb-type cooler 11 that reduces the height h of the heat dissipating fin 12 has a small amount of heat generated when the vehicle speed is low, and a small amount of heat when the vehicle speed is high. When the semiconductor element 14 having an increasing converter function is attached, the fin pitch p2 of the windward comb cooler 11a that generates a small amount of heat in the low speed region is an integral multiple of the fin pitch p1 of the leeward comb cooler 11b. And Thereby, the space | interval x2 between the radiation fins of the wind-up comb-type cooler 11a becomes large, and the pressure loss of the cooling wind 15 can be reduced. In addition, increasing the fin pitch reduces the number of fins and leads to weight reduction of the comb cooler. In the above description, the case where the present invention is applied to the first embodiment has been described. Needless to say, the present invention can also be applied to the second embodiment or the third embodiment.

  According to the fourth embodiment, the center positions of the radiating fins 12 of the windward comb cooler 11a and the windward comb cooler 11b facing each other are arranged so that the fin pitch p of the comb cooler 11 is Since the windward comb cooler 11a and the windward comb cooler 11b are configured to be different from each other, the pressure loss of the cooling air passing through between the radiating fins of the comb cooler 11 can be further reduced, and the apparatus is small and lightweight. It is possible to configure a semiconductor cooling device in consideration of the process.

  6A is a side view of a comb cooler of a semiconductor cooling device according to a fifth embodiment of the present invention, FIG. 6B is a cross-sectional view taken along line XX of FIG. 6A, FIG. 6C is a cross-sectional view taken along line YY of FIG. FIG. 6A is a view as viewed from an arrow Z, and FIG. 6E is a view as viewed from an arrow AA in FIG. 6A. The fifth embodiment is different from the first embodiment shown in FIGS. 1A to 1E in that the fin pitch p of the radiating fins 12a of the upwind comb cooler 11a is set according to the amount of heat generated by the semiconductor element 14 attached to the heat receiving portion 13. And dense (p2, P2 ′). The same elements as those in FIGS. 1A to 1E are denoted by the same reference numerals, and redundant description is omitted.

  In the fifth embodiment, the fin pitch p of the windward comb cooler 11a is composed of different fin pitches p2 and p2 ′, and the fin pitch p of the windward comb cooler 11b is composed of the same pitch fin pitch p1. ing. For example, when the semiconductor element 14 disposed in the central portion of the windward comb cooler 11a generates a larger amount of heat than the semiconductor elements 14 disposed at both ends, the windward comb cooler 11a The fin pitch p2 'at both ends is configured so that the fin pitch p2' at both ends is an integral multiple of the fin pitch p2 at the center. As a result, the pressure loss of the cooling air 15 passing through the radiating fin interval x2 'of the windward comb cooler 11a can be reduced, the number of the radiating fins 12a is reduced, and the weight of the comb cooler 11a is reduced.

  In the above description, the fin pitch p of the heat dissipating fins 12a of the upwind comb cooler 11a is made dense (p2, P2 ′) according to the amount of heat generated by the semiconductor element 14 attached to the heat receiving unit 13, but conversely The fin pitch p of the heat dissipating fins 12b of the downwind comb cooler 11b may be made dense according to the amount of heat generated by the semiconductor element 14 attached to the heat receiving unit 13. Moreover, although the case where it applied with respect to Example 1 was demonstrated in the above description, it cannot be overemphasized that it is applicable also to Example 2 or Example 4. FIG.

  According to the fifth embodiment, since the fin pitch p in the comb cooler 11 of at least one of the windward comb cooler 11a and the windward comb cooler 11b is made dense, the radiating fins of the comb cooler 11 are used. The pressure loss of the cooling air passing through the space x can be reduced, and a semiconductor cooling device can be configured in consideration of the size and weight of the device.

  7A is a side view of a comb cooler of a semiconductor cooling device according to a sixth embodiment of the present invention, FIG. 7B is a cross-sectional view taken along the line BB-BB of FIG. 7A, FIG. 7C is a view taken along the CC arrow of FIG. It is DD enlarged drawing of 7A. In the sixth embodiment, chamfering is performed on the surface in the blowing direction of the cooling air 15 of the radiating fin 12 of the comb cooler 11 with respect to the first embodiment shown in FIGS. 1A to 1E. The same elements as those in FIGS. 1A to 1E are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIG. 7D, chamfering is performed on the air blowing direction surface of the cooling air 15 of the radiation fin 12 of the comb cooler 11. That is, the corner 27 where the thickness direction surface 25 of each radiating fin 12 of the comb cooler 11 intersects the air blowing direction parallel surface 26 parallel to the air blowing direction of the cooling air 15 and perpendicular to the heat receiving portion 13 is chamfered. It is assembled by tilting.

  Thus, by making the tip shape of the radiating fin 12 be chamfered and inclined, the air resistance of the inlet portion of the radiating fin 12 is reduced, and the cooling air passing through the radiating fin interval x1 of the comb cooler 11 is reduced. Since the pressure loss is reduced, heat can be efficiently dissipated. Therefore, in the case of the forced cooling type, the electric blower can be reduced in size and weight, and the apparatus can be reduced in size and weight. In the above description, the case where the present invention is applied to the first embodiment has been described. Needless to say, the present invention can also be applied to the second embodiment or the fourth embodiment.

  According to the sixth embodiment, the angle at which the thickness direction surface 25 of the radiating fin 12 of the comb cooler 15 and the sending direction parallel surface 26 parallel to the air blowing direction of the cooling air 15 and perpendicular to the heat receiving portion 13 intersect. Since the part 27 is chamfered and inclined, the pressure loss of the cooling air 15 passing through the heat radiation fins x1 of the comb cooler 11 can be reduced. Therefore, it is possible to configure a semiconductor cooling device that takes into account the reduction in size and weight of the device.

  FIG. 8A is a side view of a comb-type cooler of a semiconductor cooling device according to a seventh embodiment of the present invention, and FIG. 8B is a view taken along the line EE in FIG. 8A. The seventh embodiment is different from the first embodiment shown in FIGS. 1A to 1E in that the length of the cooling air 15 in the air blowing direction of the adjacent heat dissipating fins 12a and 12a ′ of the comb cooler 11 is different. It is. In FIGS. 8A and 8B, the heat radiation fin 12a 'has a length shorter than that of the heat radiation fin 12a. The same elements as those in FIGS. 1A to 1E are denoted by the same reference numerals, and redundant description is omitted.

  The length f1 of the radiating fin 12a that is parallel to the blowing direction of the cooling air 15 of the comb cooler 11 is longer than the length f2 of the adjacent radiating fin 12a '. At both end portions 28 of the cooling fins 15 in the blowing direction of the cooling air 15, the heat radiation fins 12 a having a longer dimension in the blowing direction of the cooling air 15 are longer between the radiation fins 12 of the radiation fins 12 a having a longer dimension in the blowing direction of the cooling air 15. And the dimension of the ventilation direction of the cooling air 15 becomes larger than x11 between heat radiation fins with the short heat radiation fin 12a '.

  Accordingly, the pressure loss at the air flow direction end portion 28 of the cooling air 15 of the heat radiation fin 12 that is the inlet portion of the heat radiation fin 12 is reduced, and the cooling air 15 can easily pass through the heat radiation fin 12. Since the pressure loss of the cooling air passing through the heat radiation fin x11 is reduced, the cooling efficiency is improved. In the case of forced air cooling, the electric blower can be reduced in size and weight, and the apparatus can be reduced in size and weight. In the above description, the case where the present invention is applied to the first embodiment has been described. Needless to say, the present invention can also be applied to the second embodiment or the fourth embodiment.

  According to the seventh embodiment, since the length of the radiation fin 12 that is parallel to the blowing direction of the cooling air 15 of the comb cooler 11 is different from that of the adjacent radiation fins 12a and 12a ′, the comb shape It is possible to reduce the pressure loss of the cooling air 15 passing through the space between the heat dissipating fins x11 of the cooler 11, and it is possible to configure a semiconductor cooling device in consideration of the size and weight reduction of the device.

The side view of the comb type cooler of the semiconductor cooling device concerning Example 1 of the present invention. II sectional drawing of FIG. 1A. JJ sectional drawing of FIG. 1A. FIG. L arrow line view of FIG. 1A. The side view of the semiconductor cooling device which mounted | wore the forced-air-cooling type vehicle power converter with the comb type cooler shown in Drawing 1A-Drawing 1E. The M arrow line view of FIG. 2A. The side view of the comb type cooler of the semiconductor cooling device concerning Example 2 of the present invention. NN sectional drawing of FIG. 3A. OO sectional drawing of FIG. 3A. The P arrow line view of FIG. 3A. The Q arrow line view of FIG. 3A. The side view of the comb type cooler of the semiconductor cooling device concerning Example 3 of the present invention. RR sectional drawing of FIG. 4A. SS sectional drawing of FIG. 4A. The side view of the comb-type cooler of the semiconductor cooling device concerning Example 4 of this invention. TT sectional drawing of FIG. 5A. FIG. 5B is a cross-sectional view taken along the line U-U in FIG. 5A. The V arrow line view of FIG. 5A. The W arrow line view of FIG. 5A. The side view of the comb type cooler of the semiconductor cooling device concerning Example 5 of the present invention. XX sectional drawing of FIG. 6A. FIG. 6B is a YY sectional view of FIG. 6A. FIG. 6B is a view taken along the arrow Z in FIG. 6A. FIG. 6A is a view taken along arrow AA in FIG. 6A. The side view of the comb-type cooler of the semiconductor cooling device concerning Example 6 of this invention. BB-BB sectional drawing of FIG. 7A. CC arrow line view of FIG. 7A. The DD enlarged view of FIG. 7A. The side view of the comb-type cooler of the semiconductor cooling device concerning Example 7 of this invention. EE arrow line view of FIG. 8A. The side view of the comb type cooler of the conventional semiconductor cooling device. FIG. 9B is a cross-sectional view taken along line AA in FIG. 9A. The B arrow directional view of FIG. 9B. 9A to 9C are side views of a conventional semiconductor cooling device in which the comb cooler 11 shown in FIGS. 9A to 9C is mounted on a forced air cooling type vehicle power conversion device. The side view at the time of arranging a comb type cooler in two steps in series with respect to the cooling air blowing direction. FIG. 11C is a C arrow view. FIG. 11D is a sectional view taken along line DD in FIG. 11A. EE sectional drawing of FIG. 11A. The F arrow line view of FIG. 11A. FIG. 11B is a G arrow view. The side view of the conventional semiconductor cooling device which mounted | wore the forced-air-cooling type vehicle power converter with the comb-type cooler shown to FIG. 11A-FIG. 11F. The H arrow line view of FIG. 12A.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Comb type | mold cooler, 12 ... Radiation fin, 13 ... Heat receiving part, 14 ... Semiconductor element, 15 ... Cooling air, 16 ... Power converter for vehicles, 17 ... Wind tunnel, 18 ... Electric blower, 19 ... Heating element, 20 ... Orthogonal direction of air flow, 21... Baffle plate, 22... Car body, 23 .. vehicle traveling direction, 24.

Claims (7)

  The cross-sectional shape of the radiating fin portion in a plane orthogonal to the cooling air blowing direction is a comb and a semiconductor element is attached to the heat receiving portion, the semiconductor element is disposed in a sealed portion and the radiating fin portion is disposed in an open portion, A comb-type cooler that blows cooling air to the heat radiating fins and dissipates heat generated by the semiconductor elements to the open part is arranged in a plurality of stages in series with respect to the cooling air blowing direction. There are at least one stage arranged in parallel, and at least one place where the size of the comb-type coolers arranged in series is not the same. A semiconductor cooling apparatus characterized in that the center positions of the thicknesses of the radiating fins facing each other of the windward comb cooler and the windward comb cooler arranged on the leeward side are aligned.   2. The semiconductor cooling device according to claim 1, wherein thicknesses of the radiation fins of the comb cooler are different from each other between the upwind comb cooler and the downwind comb cooler.   3. The semiconductor cooling device according to claim 1, wherein heights of the radiation fins of the comb cooler are different from each other between the upwind comb cooler and the downwind comb cooler.   The fin pitch of the radiation fin of the comb cooler is different between the upwind comb cooler and the downwind comb cooler, according to any one of claims 1 to 3. Semiconductor cooling device.   The fin pitch of the radiating fins of at least one of the upwind comb cooler and the downwind comb cooler is adjusted according to the heat generation amount of the semiconductor element attached to the heat receiving portion. The semiconductor cooling device according to any one of claims 1 to 4, wherein the semiconductor cooling device is characterized.   The semiconductor cooling device according to claim 1, wherein chamfering is performed on a cooling air blowing direction surface of the radiation fin of the comb cooler.   The semiconductor cooling device according to any one of claims 1 to 6, wherein a length of the radiating fin of the comb cooler in a cooling air blowing direction is different from that of adjacent radiating fins.

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