JP2005148121A - Method and device for manufacturing laminated substrate, method for manufacturing liquid crystal device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for accurately and highly efficiently cutting a laminated substrate in dividing and cutting the laminated substrate for respective units in-plane. <P>SOLUTION: The method for manufacturing the laminated substrate is the method for manufacturing the laminated substrate 100b constructed by laminating a pair of substrates 110, 120 to each other, which includes a supporting step to support each of the pair of substrates 110, 120, respectively, while supporting stages 69, 71 and a bonding step to bond the respective substrates 110, 120 to each other by approximating the supporting stages 69, 71 to each other and which is characterized by using the supporting stages having substrate supporting faces equipped with curved surfaces with warpage nearly equal to warpage w of the bonded substrate after bonding as the supporting stages 69, 71 in the supporting step. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method and apparatus for manufacturing a bonded substrate, and a method for manufacturing a liquid crystal device.

  In recent years, liquid crystal devices are widely used as display devices in the field of display devices and the like. A liquid crystal device is composed of a liquid crystal panel, an electric circuit for driving, and the like, and the liquid crystal panel generally has a configuration in which a liquid crystal material as an electro-optical material is sandwiched between a pair of substrates that are spaced apart from each other. (For example, refer to Patent Document 1).

Conventionally, when this type of liquid crystal panel is manufactured, a sealing material such as an adhesive is formed in a frame shape on one inner surface of the substrate, and liquid crystal is dropped inside the sealing material by a dispenser or the like. Then, these substrates are bonded together in a vacuum, and after being released to the atmosphere, the adhesive is cured by heat treatment or light irradiation treatment. In bonding the substrates, after aligning the substrates using a microscope or the like, each substrate is held in a vacuum chamber using a chuck device, and both substrates are stacked and pressed. The sealing material between the substrates is crushed and crimped.
JP 2000-66163 A

  However, there are the following problems in the prior art as described above. In other words, the substrates are flattened by pressurization when the substrates are pressed by the chuck device, but each substrate is originally warped. Then, the substrate (bonded substrate) bonded together is warped (warped back). Further, the occurrence of warpage during pressure release causes a shift between the upper and lower substrates, and as a result, the reliability of the manufactured liquid crystal device may be reduced.

  The present invention has been made in view of the above-described circumstances, and a manufacturing method capable of manufacturing a highly reliable bonded substrate by preventing or suppressing the occurrence of deviation between the substrates during bonding by a simple technique. And it aims at providing a manufacturing apparatus. It is another object of the present invention to provide a method for manufacturing a liquid crystal device that can manufacture a highly reliable liquid crystal device that is less likely to cause defects such as display defects, particularly using such a method for manufacturing a bonded substrate.

  In order to solve the above-described problems, a method for manufacturing a bonded substrate according to the present invention is a method for manufacturing a bonded substrate by bonding a pair of substrates, and each of the pair of substrates is supported by a support base. Including a supporting step and a laminating step for laminating the substrates by bringing the supporting bases close to each other. In the supporting step, the substrate supporting surface is bonded after the laminating as the supporting base. A support base having a curved surface substantially equal to the amount of warpage of the substrate is used.

  According to such a manufacturing method of a bonded substrate, since the substrate support surface of the support base has a curved surface substantially equal to the warpage amount of the bonded substrate after bonding, each substrate supported by the support base is bonded. Bonding is performed while maintaining the warpage along the curved surface without flattening the substrates during alignment. Therefore, after releasing from the support base (that is, after the bonding process is finished), the bonded substrate that is produced is unlikely to be warped back as in the past, and the bonding is performed while maintaining the curvature along the curved surface. A substrate is manufactured. As a result, misalignment between the substrates at the time of warping hardly occurs, and as a result, a highly reliable bonded substrate can be manufactured.

  A support base is prepared for each substrate, and supports each substrate in a facing manner. And each support stand which supported each board | substrate shall press each board | substrate to the bonding direction, and shall perform bonding. Moreover, the support process in this invention shall include the adsorption | suction process which adsorb | sucks a board | substrate with respect to the board | substrate support surface of a support stand. In this way, when the substrate is supported by suction with respect to the substrate support surface of the support base, the bonding is performed along the shape of the substrate support surface. Occurrence can be prevented or suppressed.

  In the method for producing a bonded substrate of the present invention, the first substrate and the second substrate having the same material and the same thickness are used as the pair of substrates, respectively, and the amount of warpage of the first substrate before the supporting step is performed. Where x is the amount of warpage of the second substrate before the supporting step and y is the amount of warpage z of the substrate support surface of the support base, generally satisfying z = (x + y) / 2. . As a result of intensive studies by the inventors, it has been found that the warpage amount of the bonded substrate after bonding is approximately equal to the average value of the warpage amount of each substrate before bonding. Therefore, when the warpage amount z of the substrate support surface of the support base is designed to be approximately equal to the average value ((x + y) / 2) of the warpage amount before bonding (before support) of each substrate, the warpage returns after bonding. Thus, it is possible to provide a bonded substrate that hardly causes misalignment of bonding.

  The said bonding process is made into a temporary bonding process, and after this temporary bonding process, the presence or absence of the position shift of a board | substrate is confirmed, and this bonding process which raises bonding strength further can be performed after that. In this way, after bonding each substrate in a form in which the substrate is supported by a support stand, the presence or absence of positional displacement of the substrate is confirmed, and the bonding process is performed to further increase the bonding strength. It is possible to further increase the positional accuracy and the bonding strength.

  Next, in order to solve the above-described problem, the bonded substrate manufacturing apparatus of the present invention is a manufacturing apparatus for manufacturing a bonded substrate formed by bonding a pair of substrates, each of the pair of substrates. The support base includes a support base for bonding the substrates by bringing the substrates close to each other while facing each other, and the support base has a warpage amount of the bonded substrate after bonding. And a curved surface substantially equal to the above.

  According to such a manufacturing apparatus, since the substrate support surface of the support base has a curved surface substantially equal to the warping amount of the bonded substrate after bonding, each substrate supported by the support table is bonded to each other. Bonding can be performed while maintaining the warpage along the curved surface without flattening the substrate. Accordingly, when a bonded substrate is manufactured using such a manufacturing apparatus, after the substrate is released from the support base (that is, after the bonding step is completed), the warp as in the past is generated in the generated bonded substrate. It becomes difficult to return, and it becomes possible to manufacture a bonded substrate while maintaining warpage along the curved surface. As a result, misalignment between the substrates at the time of warping hardly occurs, and as a result, a highly reliable bonded substrate can be manufactured.

  When the first substrate and the second substrate having the same material and the same thickness are used as the pair of substrates, the amount of warpage before bonding of the first substrate is x, and the warpage before bonding of the second substrate is When the amount is y, the amount of warpage z of the substrate support surface of the support base can generally satisfy z = (x + y) / 2. In this way, the warpage amount z of the substrate support surface of the support base is designed to be approximately equal to the average value ((x + y) / 2) of the warpage amount before bonding (before support) of each substrate, and the manufacturing apparatus is used. As a result of bonding, it is possible to provide a bonded substrate that hardly undergoes warping after bonding and hardly causes displacement of the bonding.

  Next, a method for manufacturing a liquid crystal device according to the present invention is a method for manufacturing a liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates, wherein the pair of substrates is bonded by the above-described method. . In this case, since the positional accuracy of bonding of the substrates sandwiching the liquid crystal layer becomes very high, a highly reliable liquid crystal device can be provided. Before supporting the pair of substrates on a support, a step of forming an electrode and an alignment film on each substrate, a step of applying a frame-shaped sealing material on at least one substrate, and the frame shape And a step of disposing a liquid crystal inside the sealing material.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, an embodiment of a liquid crystal device manufactured using the method for manufacturing a bonded substrate of the present invention will be described. FIG. 1 is a plan view of a liquid crystal device according to the present invention as seen from the counter substrate side shown together with each component, and FIG. 2 is a cross-sectional view taken along the line HH ′ of FIG. FIG. 3 is an equivalent circuit diagram of various elements and wirings in a plurality of pixels formed in a matrix in the image display region of the liquid crystal device, and FIG. 4 is a partial enlarged cross-sectional view of the liquid crystal device. In each drawing used in the following description, the scale is different for each layer and each member so that each layer and each member can be recognized on the drawing.

  1 and 2, the liquid crystal device 100 of the present embodiment includes a TFT array substrate 10 and a counter substrate 20 that form a pair, which are bonded together by a photocurable sealing material 52, and in a region partitioned by the sealing material 52. Liquid crystal 50 is sealed and held in The sealing material 52 is formed in a frame shape that is closed in a region within the substrate surface, does not include a liquid crystal injection port, and does not have a trace sealed with the sealing material.

  A peripheral parting 53 made of a light shielding material is formed in a region inside the region where the sealing material 52 is formed. A data line driving circuit 201 and a mounting terminal 202 are formed along one side of the TFT array substrate 10 in a region outside the sealing material 52, and the scanning line driving circuit 204 is formed along two sides adjacent to the one side. Is formed. On the remaining side of the TFT array substrate 10, a plurality of wirings 205 are provided for connecting between the scanning line driving circuits 204 provided on both sides of the image display area. Further, at least one corner of the counter substrate 20 is provided with an inter-substrate conductive material 206 for establishing electrical continuity between the TFT array substrate 10 and the counter substrate 20.

  In the liquid crystal device 100, depending on the type of the liquid crystal 50 to be used, that is, depending on the operation mode such as TN (Twisted Nematic) mode, STN (Super Twisted Nematic) mode, and the normally white mode / normally black mode. A retardation plate, a polarizing plate and the like are arranged in a predetermined direction, but are not shown here. In the case where the liquid crystal device 100 is configured for color display, for example, red (R), green (G), blue, and the like are disposed in a region of the counter substrate 20 facing each pixel electrode (described later) of the TFT array substrate 10. The color filter (B) is formed together with the protective film.

  In the image display area of the liquid crystal device 100 having such a structure, as shown in FIG. 3, a plurality of pixels 100a are arranged in a matrix, and each of these pixels 100a has a pixel switching area. A TFT 30 is formed, and a data line 6 a for supplying pixel signals S 1, S 2,... Sn is electrically connected to the source of the TFT 30. The pixel signals S1, S2,..., Sn to be written to the data line 6a may be supplied line-sequentially in this order, or may be supplied for each group to a plurality of adjacent data lines 6a. . Further, the scanning line 3a is electrically connected to the gate of the TFT 30, and the scanning signals G1, G2,... Gm are applied to the scanning line 3a in a pulse-sequential manner in this order at a predetermined timing. It is configured.

  The pixel electrode 9 is electrically connected to the drain of the TFT 30, and the pixel signal S1, S2,... Sn supplied from the data line 6a is obtained by turning on the TFT 30 as a switching element for a certain period. Write to each pixel at a predetermined timing. The pixel signals S1, S2,... Sn written in the liquid crystal via the pixel electrode 9 in this way are held for a certain period with the counter electrode 21 of the counter substrate 20 shown in FIG. In order to prevent leakage of the held pixel signals S1, S2,..., Sn, a storage capacitor 60 is added in parallel with the liquid crystal capacitor formed between the pixel electrode 9 and the counter electrode 21. For example, the voltage of the pixel electrode 9 is held by the storage capacitor 60 for a time that is three orders of magnitude longer than the time when the source voltage is applied. Thereby, the charge retention characteristic is improved, and the liquid crystal device 100 with a high contrast ratio can be realized.

  FIG. 4 is a partial enlarged cross-sectional view of the liquid crystal device 100. The TFT array substrate 10 mainly composed of a glass substrate 10 ′ is composed of transparent electrodes mainly composed of ITO (indium tin oxide). The pixel electrodes 9 are formed in a matrix (see FIG. 3), and pixel switching TFTs 30 (see FIG. 3) are electrically connected to the pixel electrodes 9, respectively. A data line 6a, a scanning line 3a, and a capacitor line 3b are formed along the vertical and horizontal boundaries of the region where the pixel electrode 9 is formed, and the TFT 30 is connected to the data line 6a and the scanning line 3a. That is, the data line 6a is electrically connected to the high concentration source region 1a of the TFT 30 through the contact hole 8, and the pixel electrode 9 is electrically connected to the high concentration drain region of the TFT 30 through the contact hole 15 and the drain electrode 6b. Connected. Note that an alignment film 12 is formed on the surface layer of the pixel electrode 9 by performing a rubbing process on a film mainly composed of polyimide.

  On the other hand, in the counter substrate 20, a light shielding referred to as a black matrix or a black stripe is formed on the glass substrate 20 ′ on the counter substrate side and in a region facing the vertical and horizontal boundary regions of the pixel electrodes 9 on the TFT array substrate 10. A film 23 is formed, and a counter electrode 21 made of an ITO film is formed on the upper layer side (liquid crystal layer side). An alignment film 22 made of a polyimide film is formed on the upper layer side of the counter electrode 21. A liquid crystal 50 is sealed between the TFT array substrate 10 and the counter substrate 20 by a sealing material 52 (see FIG. 1).

  When manufacturing the liquid crystal device 100 having the above-described configuration, a so-called multi-sided process is performed in which a TFT substrate and a counter substrate of a plurality of liquid crystal devices are collectively stacked on a large substrate and then cut into individual liquid crystal device sizes. Is adopted. That is, it includes a bonding step in which large substrates are bonded together via a liquid crystal layer.

Hereinafter, a process from formation of a sealing material to liquid crystal dripping, substrate bonding, and sealing material curing will be described for one embodiment of a method for manufacturing a liquid crystal device. FIG. 5 is a schematic configuration diagram of the bonded substrate manufacturing apparatus 61.
The manufacturing apparatus 61 is mainly composed of a material supply unit 63 and a substrate bonding unit 64 arranged on both sides of a substrate supply / removal unit 62 for supplying and removing a substrate. In the following description, the direction along the surface of the substrate is defined as the X direction (for example, the left-right direction in FIG. 5) and the Y direction (for example, the direction perpendicular to the paper surface in FIG. 5), and the direction orthogonal to the XY plane is Z. This will be described as a direction.

  The material supply unit 63 holds a substrate and is movable in the X direction, the Y direction, and the heel direction (rotation direction around an axis parallel to the Z axis), and a liquid crystal material disposed above the table 65. The liquid crystal dropping part 66 to be dripped and a seal material application part 67 that is disposed in the vicinity of the liquid crystal drop part 66 and applies a seal material are mainly configured. Then, the liquid crystal material is dropped from the liquid crystal dropping unit 66 in synchronization with the movement of the table 65, and the sealing material is applied from the sealing material applying unit 67, whereby the liquid crystal and the sealing material are arranged (supplied) at predetermined positions on the substrate. )can do.

  The substrate bonding unit 64 holds the substrate and is movable in the X direction, the Y direction, and the heel direction, a lower table (support table) 69 installed on the base 68, and above the lower table 69. The arranged vacuum chamber 70, the upper table (support stand) 71 disposed opposite to the lower table 69 in the vacuum chamber 70, and the upper table 71 are supported so as to be movable in the Z direction and are pressed toward the lower table 69. An UV lamp (not shown) such as a mercury lamp that irradiates ultraviolet light that cures the sealing material 52, an alignment microscope 74 that detects an alignment mark on the substrate through a pressure mechanism 72, and a viewing window 70 a formed in the vacuum chamber 70. Z)).

  The lower table 69 and the upper table 71 are a suction mechanism (not shown) for vacuum-sucking a substrate with substrate suction surfaces (substrate support surfaces) 69a and 71a facing each other, and cooling and heating the tables 69 and 71, respectively. Each is provided with a temperature adjustment mechanism (not shown). A gas supply source 77 that supplies a dry gas such as dry air or dry nitrogen into the vacuum chamber 70 is connected to the vacuum chamber 70 via a gas supply unit 75. Further, a suction device (vacuum pump) 78 for exhausting (evacuating) the gas in the accommodation space 70 b is connected to the vacuum chamber 70 via an exhaust unit 76.

  Here, the board | substrate adsorption | suction surfaces 69a and 71a of each table 69 and 71 have a curved surface substantially equal to the curvature amount of the bonding board | substrate after bonding. This prevents the substrates from being flattened when the substrates are bonded together, and as a result, the substrates are bonded together while maintaining warpage along the curved surface. Therefore, after releasing from a support stand (that is, after a bonding process is completed), warpage (warping back) hardly occurs in the produced bonded substrate.

  Next, a procedure for manufacturing the liquid crystal device 100 using the manufacturing apparatus 61 will be described. First, as shown in FIG. 4, a TFT 30 is formed on a glass substrate (here, a large glass substrate) 10 ′, and further a pixel electrode 9 and an alignment film 12 are formed to obtain a large TFT array substrate. A light shielding film 23, a counter electrode 21, an alignment film 22 and the like are formed on a glass substrate (here, a large glass substrate) 20 'to obtain a large counter substrate. In the following description, the large TFT array substrate is referred to as the lower substrate 110 or the substrate 110, and the large counter substrate is referred to as the upper substrate 120 or the substrate 120. Each of the substrates 110 and 120 is larger than the pair of substrates 10 and 20 applied to the liquid crystal device 100, and corresponds to each liquid crystal device after the large substrates 110 and 120 are bonded together. It is supposed to be cut to size.

  First, the upper substrate 120 on which the counter electrodes and the like are formed is supplied from the substrate supply / removal unit 62 shown in FIG. And in the board | substrate bonding part 64, the suction mechanism which is not illustrated is operated and this upper board | substrate 120 is adsorbed with respect to the board | substrate adsorption | suction surface 71a of the upper table 71 (refer FIG.6 (b)).

  Subsequently, the lower substrate 110 on which TFTs and the like are formed is supplied onto the table 65 of the material supply unit 63 from the substrate supply / removal unit 62 shown in FIG. 5, and as shown in FIG. The sealing material is applied from the sealing material application portion 67 while moving the frame, and a closed frame shape (see FIG. 1, reference numeral 52) is formed. Further, liquid crystal is dropped from the liquid crystal dropping section 66 while moving the table 65, and the liquid crystal 50 is disposed at a predetermined position surrounded by the sealing material 52, as shown in FIG. In FIG. 6A, for convenience, the liquid crystal 50 is illustrated as being formed in one place, but in reality, the liquid crystal 50 is dropped and formed corresponding to the number of panels to be formed on the lower substrate 110. Further, the sealing material application and the liquid crystal dropping can be performed in parallel.

  In this way, the lower substrate 110 onto which the liquid crystal has been dropped is supplied onto the lower table 69 by the substrate supply / removal unit 62 as shown in FIG. Then, similarly to the upper substrate 120, in order to hold the lower substrate 110 on the lower table 69 more reliably, the lower substrate 110 is held by vacuum suction by an adsorption mechanism.

  Next, as shown in FIG. 6C, the vacuum chamber 70 is lowered and brought into contact with the lower table 69 to close the housing space 70b in a sealed state. After that, negative pressure is sucked by the exhaust part 76 to make the inside of the accommodation space 70b into a substantially vacuum state. When the inside of the accommodation space 70b is in a substantially vacuum state, as shown in FIG. 7A, using an alignment microscope 74, an alignment mark (not shown) formed on the upper substrate 120 is viewed through the viewing window 70a. And aligning the alignment mark formed on the lower substrate 110 with the alignment mark on the upper substrate 120 by moving the base 68. Thereby, the upper substrate 120 and the lower substrate 110 are aligned.

  Note that the evacuation in the accommodation space 70b and the alignment of the substrates 110 and 120 may be simultaneously performed in parallel. In this case, the manufacturing time can be shortened. Further, the upper table 71 is formed with a through hole 71b at a position directly below the alignment microscope 74 and the viewing window 70a, and the alignment marks of the substrates 110 and 120 can be detected through the through hole 71b. it can.

  When the respective substrates 110 and 120 are aligned, as shown in FIG. 7B, the upper table 71 is lowered (relatively moved) by the pressurizing mechanism 72 so that the opposing substrates 110 and 120 are bonded to each other. By applying pressure toward the table 69, the sealing material 52 is crushed and the substrates 110 and 120 are pressure-bonded. By this pressurization and pressure bonding, the relative positional relationship between the substrates 110 and 120 may be slightly shifted. Therefore, in order to correct this misalignment, as shown in FIG. 7C, the base 68 is driven in a state where the substrates 110 and 120 are pressurized, and realignment is performed.

  When the alignment of the substrates 110 and 120 is completed, the sealing material 52 is cured by irradiating ultraviolet rays with a UV lamp. If the sealing material 52 is a thermosetting type, it may be heated to a temperature suitable for curing. Thereafter, as shown in FIG. 8A, the upper table 71 is lifted by releasing the substrate suction of the upper table 71 and driving the pressurizing mechanism 72. Further, the atmosphere is introduced into the accommodation space 70b by the gas supply unit 75 to return to the atmospheric pressure.

  When the accommodation space 70b of the vacuum chamber 70 reaches atmospheric pressure, the vacuum chamber 70 is raised as shown in FIG. Then, the substrate placed on the lower table 69 (in this case, a bonded substrate on which the substrates 110 and 120 are bonded) is removed by the substrate supply / removal unit 62. The large-sized bonded substrate thus obtained is separated and cut for each predetermined liquid crystal device, thereby completing the production of the liquid crystal device 100 described above.

  According to the manufacturing method of the present embodiment as described above, individual liquid crystal devices 100 are obtained by bonding large substrates 110 and 120 together and separating and cutting the obtained bonded substrates. Here, in the manufacturing apparatus 61 for manufacturing the bonded substrate, and thus the liquid crystal device 100, particularly in the substrate bonding portion 64, the substrate suction surfaces 69 a and 71 a of the tables 69 and 71 that suck (support) the substrates 110 and 120 are provided. It is composed of a curved surface. Specifically, since the substrate suction surfaces 69a and 71a of the tables 69 and 71 have curved surfaces substantially equal to the warpage amount of the bonded substrates after bonding, the substrates 110 and 71 supported by the tables 69 and 71, respectively. When the substrates 120 are bonded together, the substrates 110 and 120 are not flattened, and bonding is performed while maintaining warpage along the curved surface. Therefore, after bonding is completed, warpage (warping back after the substrate is flattened) hardly occurs in the produced bonded substrate, and a bonded substrate is produced while maintaining warpage along the curved surface. . As a result, misalignment between the substrates hardly occurs, and as a result, a highly reliable bonded substrate, that is, a liquid crystal device can be manufactured.

  FIG. 9 is an explanatory view showing a change in warpage of the substrate accompanying the bonding of the substrates 110 and 120, and FIG. 11 is an explanatory view showing the amount of warpage before and after the bonding of the substrates 110 and 120. As shown in FIG. 11, the warpage amount of each of the substrates 110 and 120 is measured in each of the X direction and the Y direction in the substrate surface, and the circle mark in the figure indicates the warpage amount of the lower substrate 110 in the figure. The mark indicates the amount of warpage of the upper substrate 120. In addition, for each of the substrates 110 and 120, black painting indicates the amount of warping before bonding, and white outline indicates the amount of warping after bonding.

  As shown in FIG. 9A, it is assumed that the warpage amount of the upper substrate 120 is x and the warpage amount of the lower substrate 110 is y before bonding, that is, before suction to the tables 69 and 71. In this case, the warping amount w of the bonded substrate 100b after bonding illustrated in FIG. 9C is approximately (x + y) / 2 in the X direction where the change is large as illustrated in FIG. That is, when each substrate 110, 120 is formed of a glass substrate made of the same material as in the present embodiment, and the thickness thereof is substantially equal, the amount of warpage in the bonded substrate 100b after bonding is increased. w is (x + y) / 2. Therefore, as in the present embodiment, the warp amount z (see FIG. 9B) of the substrate suction surfaces 69a and 71a of the tables 69 and 71 is equal to the warp amount w of the bonded substrate 100b. That is, the average value of the warpage amount of each of the substrates 110 and 120 before bonding is set. Here, the “warp amount” means the maximum distance between the surface connecting the outer ends of the substrate and the curved inner surface of the substrate. In the present embodiment, the change in the amount of warpage in the Y direction is about an error.

  In this way, the warpage amount z of the substrate support surfaces 69a and 71a of the tables 69 and 71 is designed to be approximately equal to the average value ((x + y) / 2) of the warpage amount before bonding of the substrates 110 and 120. Therefore, it is possible to provide a bonded substrate that hardly undergoes warping after bonding, and therefore is extremely unlikely to cause a positional shift in bonding, and thus can provide a highly reliable liquid crystal device. The manufacturing method of a bonded substrate using the manufacturing apparatus 61 as described above is a manufacturing process of an electro-optical device having a configuration in which, for example, a pair of substrates such as an organic EL device is bonded, in addition to manufacturing the liquid crystal device. It can be applied to the above.

  Next, an example of an electronic apparatus including the liquid crystal device 100 obtained by the manufacturing method of the present invention will be described with reference to FIG. FIG. 10 is a perspective view showing an example of a mobile phone. In FIG. 10, a mobile phone (electronic device) 600 includes a display unit 601 using the liquid crystal device 100. Since such an electronic device includes the above-described liquid crystal device 100 as the display unit 601, a high-quality electronic device in which substrates are bonded with high accuracy can be realized.

  As mentioned above, although the example of suitable embodiment which concerns on this invention was demonstrated referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

The top view which looked at the liquid crystal device of this Embodiment from the counter substrate side. Sectional drawing which follows the HH 'line | wire of FIG. FIG. 2 is an equivalent circuit diagram of the liquid crystal device of FIG. 1. FIG. 2 is a partially enlarged cross-sectional view of the liquid crystal device of FIG. The schematic block diagram which shows an example of the manufacturing apparatus of a bonded substrate board. Explanatory drawing which shows an example of the manufacturing process of a bonded substrate board. Explanatory drawing which shows an example of the manufacture procedure following FIG. Explanatory drawing which shows an example of the manufacture procedure following FIG. Explanatory drawing which shows the curvature change of the board | substrate accompanying bonding. The perspective view which shows an example of an electronic device. Explanatory drawing which shows the curvature amount before and behind bonding of a board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Lower substrate (TFT array substrate), 20 ... Upper substrate (counter substrate), 50 ... Liquid crystal, 52 ... Sealing material, 61 ... Manufacturing apparatus, 69, 71 ... Table (support stand), 69a, 71a ... Substrate adsorption surface (Substrate support surface), 100 ... liquid crystal device, 110 ... lower substrate (large substrate), 120 ... upper substrate (large substrate)

Claims (8)

A method of manufacturing a bonded substrate obtained by bonding a pair of substrates,
A supporting step of supporting each of the pair of substrates on a support base;
A bonding step of bonding each substrate by bringing the support bases close to each other,
In the supporting step, a method of manufacturing a bonded substrate, wherein a substrate having a curved surface substantially equal to a warping amount of the bonded substrate after bonding is used as the supporting table.   The method for manufacturing a bonded substrate according to claim 1, wherein the supporting step includes an adsorption step of adsorbing the substrate to a substrate support surface of the support base.   As the pair of substrates, a first substrate and a second substrate having the same material and the same thickness are used, respectively, the amount of warpage of the first substrate before the supporting step is x, and the second substrate is before the supporting step. 3. The method for manufacturing a bonded substrate according to claim 1, wherein a warpage amount z of the substrate support surface of the support base substantially satisfies z = (x + y) / 2, where y is a warpage amount. .   The bonding process is defined as a temporary bonding process, and after the temporary bonding process, the presence or absence of positional deviation of the substrate is confirmed, and then the main bonding process for further increasing the bonding strength is performed. 4. The method for producing a bonded substrate according to any one of items 3 to 3. A manufacturing apparatus for manufacturing a bonded substrate obtained by bonding a pair of substrates,
While supporting each of the pair of substrates, including a support base for bonding each substrate by bringing the substrates close to each other while facing each other,
The said support stand is provided with the curved surface in which the board | substrate support surface is substantially equal to the curvature amount of the bonded board | substrate after bonding, The manufacturing apparatus of the bonded board | substrate characterized by the above-mentioned.   The first substrate and the second substrate having the same material and the same thickness are used as the pair of substrates, respectively, and the amount of warpage before bonding of the first substrate is x, and the amount of warpage before bonding of the second substrate. The board | substrate manufacturing apparatus of the bonded substrate of Claim 5 characterized by the curvature amount z of the board | substrate support surface of the said support stand substantially satisfying z = (x + y) / 2 when y is set to y. A method of manufacturing a liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates,
A method for manufacturing a liquid crystal device, wherein the pair of substrates are bonded together by the method according to claim 1. Before supporting the pair of substrates on a support base,
Forming an electrode and an alignment film on each substrate;
Applying a frame-shaped sealing material on at least one substrate;
The method of manufacturing a liquid crystal device according to claim 7, further comprising: disposing liquid crystal inside the frame-shaped sealing material.

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