JP2005146069A - Resin composition, its molded article and composite resin sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin composition which is hardly charged by friction with electronic devices and hardly causes electrostatic troubles of electronic parts, and its molded article. <P>SOLUTION: The resin composition comprises (A) a copolymer comprising an aromatic vinyl compound and a conjugated diene, (B) carbon black and (C) a surfactant, where the content of the component (B) is 5-50 pts. wt. based on 100 pts. wt. of the component (A) and the content of the component (C) is at most 15 pts. wt. based on the total of the components (A) and (B). The molded article is obtained by molding the resin composition. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a resin composition, a molded product thereof, and a composite resin sheet, and more particularly to a resin composition used for constituting an electronic device packaging material, and a molded product and a composite resin sheet comprising the same.

  As a packaging form for electronic devices such as ICs, injection trays, vacuum forming trays, magazines, embossed carrier tapes, and the like are used. In order to prevent the destruction of electronic devices due to static electricity in these packaging containers, a method of applying an antistatic agent to the surface of the packaging container, a method of applying a conductive paint, an antistatic agent in order to remove the generated static electricity And antistatic treatment such as a method of dispersing a conductive filler.

  However, even with the use of packaging containers that have undergone anti-static treatment along with the miniaturization of the wiring in the electronic devices as the integrated circuit becomes highly integrated, the electronic devices are affected by static electricity generated by friction between the electronic devices and the packaging containers. In some cases, an electronic device adheres to the packaging container at the time of breakage or transportation, resulting in a mounting trouble such as a pickup failure.

Also, as a plastic sheet used in packaging containers for electronic devices, a surface conductive composite in which a polystyrene resin film or sheet containing carbon black is laminated on one side or both sides of a polystyrene resin sheet substrate by coextrusion. A plastic sheet has been proposed (see Patent Document 1). This plastic sheet has excellent processability, mechanical strength, and impact resistance, and retains the holding power of the conductive effect for a long time. However, since only carbon black is added as a conductive material, externally charged materials The effect of electrostatic shielding such as suppression of inductive charging from the surface is limited.
JP-A-57-205145 (first and second pages)

  The present invention has been made in view of such background art, and provides a resin composition that can be suitably used for a packaging material for electronic devices in which a charging phenomenon due to static electricity itself is suppressed. In other words, the conventional antistatic treatment efficiently diffuses and eliminates static electricity, but the present invention suppresses the static electricity generated by friction between the electronic device and its packaging material so as not to occur. An object of the present invention is to provide a resin composition that is less susceptible to static electricity damage such as destruction of electronic components due to static electricity.

  Another object of the present invention is to provide a molded article and a composite resin sheet that are less likely to be charged due to friction with an electronic device and in which an electronic component is less susceptible to electrostatic damage.

  That is, the present invention comprises (A) a copolymer comprising an aromatic vinyl compound and a conjugated diene, (B) carbon black and (C) a surfactant, and with respect to 100 parts by weight of the component (A). The resin composition comprises 5 to 50 parts by weight of component (B) and 15 parts by weight or less of component (C) relative to the total of components (A) + (B).

  The surfactant is preferably any one of polyoxyethylene alkyl ether, alkyl diethanolamine, alkyl benzene sulfonate, alkyl sulfonate, alkyl diethanolamide, and polyether amide.

Moreover, this invention is a molded article formed by shape | molding said resin composition.
It is preferable that the charge amount of the surface of the electronic device encapsulant charged by frictional contact between the molded product and the electronic device having the encapsulant is ± 0.3 nC or less.

  Moreover, this invention is a composite resin sheet characterized by laminating | stacking the film or sheet which consists of said resin composition on the at least one surface of a resin base film or sheet.

  Since the present invention can suppress charging due to static electricity caused by friction between an electronic device and its packaging material, the resin composition is less likely to be charged due to friction with the electronic device and less susceptible to electrostatic damage such as destruction of electronic components due to static electricity. Things can be provided.

  In addition, the present invention can provide a molded product and a composite resin sheet that are less likely to be charged due to friction with an electronic device and in which an electronic component is less susceptible to electrostatic damage.

Hereinafter, the present invention will be described in detail.
The resin composition of the present invention comprises (A) a copolymer comprising an aromatic vinyl compound and a conjugated diene, (B) carbon black and (C) a surfactant, and the content ratio of each component is as follows: The component (A) contains 5 to 50 parts by weight of the component (B) with respect to 100 parts by weight of the component, and the component (C) contains 15 parts by weight or less with respect to the total of the components (A) + (B). To do.

(Copolymer)
The copolymer composed of the aromatic vinyl compound and conjugated diene as component (A) used in the present invention is a copolymer containing an aromatic vinyl compound and a conjugated diene monomer in its structure.

  Aromatic vinyl compounds include styrene, o-methylstyrene, p-methylstyrene, p-tert-butylstyrene, 1,3-dimethylstyrene, α-methylstyrene, vinylnaphthalene, vinylanthracene, 1,1-diphenylethylene. Etc.

Examples of the conjugated diene include butadiene rubber and imprene rubber.
Specific examples of the copolymer include impact-resistant polystyrene resin, styrene-butadiene random copolymer, styrene-butadiene block copolymer, styrene-isoprene copolymer, and styrene monomer derivatives such as α-methylstyrene and styrene monomer. And a copolymer of a styrene monomer and a conjugated diene having maleic anhydride or an acrylic acid monomer unit in half or less of the styrene monomer unit.

(Carbon black)
The carbon black of the component (B) used in the present invention is not particularly limited, but acetylene black, furnace black, channel black, ketjen black and the like can be used.

  The content of carbon black contained in the resin composition of the present invention is 5 to 50 parts by weight, preferably 10 to 40 parts by weight of carbon black of component (B) with respect to 100 parts by weight of component (A). desirable. If it is less than 5 parts by weight, sufficient electrical conductivity cannot be obtained and the surface resistivity increases, and if it exceeds 50 parts by weight, the uniform dispersibility with the resin is deteriorated, the molding processability is significantly lowered, the mechanical strength, etc. Since the characteristic value is lowered, it is not preferable.

(Surfactant)
The surfactant (C) used in the present invention is not particularly limited, and cationic, anionic, betaine (zwitterionic), and nonionic surfactants can be used. For example, polyoxyethylene alkyl ether, alkyl diethanolamine, alkyl benzene sulfonate, alkyl sulfonate, alkyl diethanolamide, or polyether amide is preferable. Specific examples include polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene cetyl ether, lauryl diethanolamine, stearyl diethanolamine, cetyl diethanolamine, sodium dodecylbenzenesulfonate, and the like. Since the resin is kneaded and kneaded, it is particularly preferable to use a nonionic or anionic surfactant having excellent heat resistance. The above surfactants can be used alone or in combination of two or more.

  The content of the component (C) surfactant contained in the resin composition of the present invention is 15 wt.% Of the component (C) surfactant with respect to the total of the components (A) + (B). Or less, preferably 1 to 10 parts by weight. Exceeding 15 parts by weight is not preferable because bleeding out to the surface of the molded product becomes remarkable.

  In addition to the above components (A) to (C), the resin composition of the present invention contains various fillers, reinforcing materials, modifiers, plasticizers, antioxidants, processing aids, lubricants, and other substances. be able to.

  The resin composition of the present invention comprises the components (A) a copolymer comprising an aromatic vinyl compound and a conjugated diene, (B) carbon black, and (C) a surfactant. A composition in which (B) carbon black is added to the copolymer of component A) is a composition for a conductive sheet, and by friction with an epoxy resin which is the mainstream of semiconductor encapsulant resins for electronic devices such as ICs, Depending on the composition ratio, the semiconductor encapsulant acts to be positively charged, while the (C) surfactant is charged by adding a surfactant in order to act negatively charge the semiconductor encapsulant. The amount can be adjusted.

  Therefore, by using the resin composition in which the components (A) to (C) are appropriately adjusted and blended, the positive and negative charges of the semiconductor sealing material can be adjusted. As a result, the semiconductor sealing material Can be prevented from being charged easily. In other words, the charge of the electronic device can be controlled by adjusting the amount of the surfactant, and as a result, the failure due to static electricity generated by friction can be suppressed.

Next, the present invention is a molded product obtained by molding the above resin composition.
The molded product using the resin composition of the present invention is not particularly limited, and examples thereof include a magazine, a tray, and a carrier tape. These can be obtained by molding a sheet produced by injection molding or extrusion from a T-die into an electronic component packaging container such as a carrier tape or a saddle lay by a known method such as press molding, vacuum molding, or air pressure molding. it can. These containers can be used mainly when storing, storing and transporting electronic devices, or can be used when mounting these components.

  The molded product of the present invention has a charge amount of ± 0.3 nC or less, preferably ± 0.2 nC, on the surface of the electronic device encapsulant charged by frictional contact between the molded product and the electronic device having the encapsulant. Is desirable. For the sealant, silica or the like is used as a reinforcing material to be added to the epoxy resin and the epoxy resin.

  The electronic device that can be used in the present invention is not particularly limited. For example, IC, resistor, capacitor, inductor, transistor, diode, light emitting diode (LED), liquid crystal, piezoelectric element register, filter, crystal oscillator, crystal resonator, connector , Switch, polyum, relay, etc. The IC format is not particularly limited, and examples thereof include SOP, HEMT, SQFP, BGA, CSP, SOJ, QFP, and PLCC.

Moreover, this invention is a composite resin sheet formed by laminating | stacking the film or sheet which consists of said resin composition on one surface or both surfaces of a resin base film or sheet.
The resin base film or sheet is not particularly limited. For example, the copolymer (A) is composed of an aromatic vinyl compound and a conjugated diene, an acrylonitrile-butadiene-styrene copolymer resin (ABS resin), and a polystyrene resin. A film or sheet of a resin or the like containing

  The composite resin sheet can be produced, for example, by molding each of the above resin compositions separately into a thermoplastic resin sheet or film using an extruder and then laminating them stepwise by a thermal laminating method, a dry laminating method, or an extrusion laminating method. Can be carried out by laminating together by multi-layer coextrusion using a feed block, a multi-manifold die or the like.

  The thickness of the composite resin sheet is 100 to 3000 μm, and the thickness of the film or sheet made of the resin composition that is adjusted to the total thickness is preferably 2% to 80%. If the thickness of the composite sheet is less than 100 μm, the strength of the molded product obtained by molding the sheet tends to be insufficient, and if it exceeds 3000 μm, molding such as pressure forming, vacuum forming, and hot plate forming becomes difficult. Further, when the thickness of the film or sheet made of the resin composition is less than 2%, the antistatic effect on the surface may be impaired when the composite sheet is molded, and when it exceeds 80%, the pressure forming, vacuum forming, Formability such as hot plate molding may be deteriorated.

EXAMPLES Hereinafter, although this invention is demonstrated in detail using an Example, this invention is not limited to these.
After blending 100 parts by weight of impact-resistant styrene resin (rubber content 5%) and 20 parts by weight of acetylene black with a tumbler mixer, melt using a Ikegai Machinery Co., Ltd., φ45 mm co-rotating twin screw extruder. An extrusion compound was prepared. To this compound, 1.2 parts by weight of lauryl diethanolamine (Electro Stripper EA; manufactured by Kao Corporation) was further added as a surfactant, and a 3 cm square plate-shaped friction test piece was produced from these compounds using an injection molding machine. .

  A 3 cm square plate-shaped friction test piece was prepared from the same compound as in Example 1 by using an injection molding machine except that 5 parts by weight of sodium benzenesulfonate (Electro Stripper PC; manufactured by Kao Corporation) was added as a surfactant. Produced.

  From the same compound as in Example 1 except that 5 parts by weight of polyoxyethylene lauryl ether (Emalex E-709; manufactured by Nihon Emulsion Co., Ltd.) was added as a surfactant, a 3 cm square plate shape was used. A friction test piece was prepared.

  A 3 cm square plate-shaped friction test piece using an injection molding machine from the same compound as in Example 1 except that 13 parts by weight of polyether ester amide (Perestat NC6321; manufactured by Sanyo Chemical Industries, Ltd.) was added as a surfactant. Was made.

Comparative Example 1

  After blending 100 parts by weight of impact-resistant styrene resin (rubber content 5%) and 20 parts by weight of acetylene black with a tumbler mixer, melt using a Ikegai Machinery Co., Ltd., φ45 mm co-rotating twin screw extruder. An extrusion compound was prepared. A 3 cm square plate-like friction test piece was prepared from this compound for testing.

  Using the above resin composition compound, as shown in FIG. 1, an impact-resistant polystyrene resin is used as the base material layer 1, and the resin composition used in Examples 1 to 4 and Comparative Example 1 is used as the surface layer 2. Φ65 mm extruder (L / D = 28), Φ40 mm extruder (L / D = 26) and a feed block method using a 500 mm width T-die, the total thickness is 300 μm, and the surface layer thickness is 30 μm on both sides 3 A layer thermoplastic sheet was prepared. Carrier tape-shaped products were produced from these by press molding. Any resin composition could be formed into a carrier tape shape.

(Measuring method)
The sample of the obtained carrier tape shaped product was ionized using an ionizer (manufactured by Keyence Corporation, Ionizer SJ-F020), and then the IC (NEC Corporation, V25 microprocessor; 28 mm square), which was similarly neutralized, was removed. The sample was placed and rubbed at 700 rpm for 1 minute using a vibrator (manufactured by Tokyo Science Instrument Co., Ltd., cute mixer). Thereafter, the IC was sandwiched with tweezers, placed in an Faraday cup manufactured by Electro-Tech System, and the charge amount of the electronic device was measured with a nanocoulomb meter. Table 1 shows the measured charge amount.

  Since the resin composition of the present invention can suppress electrostatic charging caused by friction between the electronic device and its packaging material, it is difficult to be charged by friction with the electronic device, and electrostatic damage such as destruction of electronic components due to static electricity is prevented. It can be used as a packaging resin composition for electronic devices such as ICs that are difficult to receive.

  In addition, the molded product of the present invention is less likely to be charged due to friction with the electronic device, and the electronic component is less susceptible to static electricity damage.

It is explanatory drawing which shows the 3 layer thermoplastic sheet produced in the Example of this invention.

Explanation of symbols

1 Base material layer 2 Surface layer

Claims (5)

  (A) a copolymer comprising an aromatic vinyl compound and a conjugated diene, (B) carbon black and (C) a surfactant, and 5 parts of component (B) with respect to 100 parts by weight of component (A). A resin composition characterized by containing ˜50 parts by weight of the component (C) in an amount of 15 parts by weight or less based on the total of the components (A) + (B).   2. The resin composition according to claim 1, wherein the surfactant is at least one selected from polyoxyethylene alkyl ether, alkyl diethanol amine, alkyl benzene sulfonate, alkyl sulfonate, alkyl diethanolamide, and polyether amide.   A molded article obtained by molding the resin composition according to claim 1.   The molded article according to claim 3, wherein the charge amount of the surface of the electronic device encapsulant charged by frictional contact between the molded article and the electronic device having the encapsulant is ± 0.3 nC or less.   A composite resin sheet obtained by laminating a film or sheet comprising the resin composition according to claim 1 or 2 on at least one surface of a resin base film or sheet.

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