JP2005146008A5 - - Google Patents
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- Publication number
- JP2005146008A5 JP2005146008A5 JP2003381352A JP2003381352A JP2005146008A5 JP 2005146008 A5 JP2005146008 A5 JP 2005146008A5 JP 2003381352 A JP2003381352 A JP 2003381352A JP 2003381352 A JP2003381352 A JP 2003381352A JP 2005146008 A5 JP2005146008 A5 JP 2005146008A5
- Authority
- JP
- Japan
- Prior art keywords
- general formula
- organic residue
- group
- represented
- carboxylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 5
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims 1
- 125000005394 methallyl group Chemical group 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003381352A JP2005146008A (ja) | 2003-11-11 | 2003-11-11 | 封止材用熱硬化性樹脂、熱硬化性樹脂組成物、熱硬化性樹脂組成物で封止する方法、および熱硬化性樹脂組成物で封止された電子部品装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003381352A JP2005146008A (ja) | 2003-11-11 | 2003-11-11 | 封止材用熱硬化性樹脂、熱硬化性樹脂組成物、熱硬化性樹脂組成物で封止する方法、および熱硬化性樹脂組成物で封止された電子部品装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005146008A JP2005146008A (ja) | 2005-06-09 |
| JP2005146008A5 true JP2005146008A5 (enExample) | 2006-12-28 |
Family
ID=34690753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003381352A Pending JP2005146008A (ja) | 2003-11-11 | 2003-11-11 | 封止材用熱硬化性樹脂、熱硬化性樹脂組成物、熱硬化性樹脂組成物で封止する方法、および熱硬化性樹脂組成物で封止された電子部品装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005146008A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5186144B2 (ja) * | 2006-07-18 | 2013-04-17 | 昭和電工株式会社 | 透明反射防止板 |
| JP7519587B2 (ja) * | 2019-07-17 | 2024-07-22 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
| JP7547067B2 (ja) * | 2020-03-31 | 2024-09-09 | 日本ユピカ株式会社 | 電気電子部品固定用結晶性ラジカル重合性組成物、車載ロータコア、及びロータコア固定体の製造方法 |
-
2003
- 2003-11-11 JP JP2003381352A patent/JP2005146008A/ja active Pending
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