JP2005142419A - Managing method of component and component tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a managing method of a component which surely manages an electronic component mounted on a substrate. <P>SOLUTION: The managing method of a component comprises a read step S106 for reading out component data 105 from an IC tag 104 for a tape attached to the tip end of a component tape 103 which receives a plurality of electronic components 3; a mounting step S112 for taking sequentially out the electronic components 3 from the tip end of the component tape 103, and mounting them on the print substrate 2; and a write step S116 for coping the contents of the component data 105 read out in the read step S106 with the electronic components 3 mounted in the mounting step S112, and writing the component data on the IC tag 106 for substrate attached to the print substrate 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a component management method for managing a component mounted on a substrate, and a component tape for storing or fixing the component.

A component mounter for mounting electronic components on a printed circuit board includes a reel on which a component tape for storing or fixing electronic components is wound, and an electronic component stored or fixed on the component tape while being pulled out from the reel. The component is taken out and the electronic component is mounted on the printed board.
FIG. 10 is an external view showing an external appearance of a reel around which a conventional component tape is wound.

The reel 903 has a shaft core that is integrally formed by connecting the centers of two disks, and a component tape 900 is wound around the shaft core.
The component tape 900 includes a carrier tape 901 on which the electronic component 1 is placed and a cover tape 902 attached to the carrier tape 901.
The carrier tape 901 is made of a thin resin molded product or paper, and the plurality of electronic components 1 are placed on the carrier tape 901 at substantially equal intervals. The cover tape 902 is made of, for example, a light-transmitting synthetic resin, and is affixed to the carrier tape 901 so as to sandwich the electronic component 1 so that the electronic component 1 is not detached from the carrier tape 901.

  The component mounter equipped with such a reel 903 performs the mounting operation of the electronic component 1 while pulling out the component tape 900. During the mounting operation, the end of the component tape 1 approaches the surface of the reel 903 and is stored in the component tape 900. When the remaining amount of the electronic component 1 is reduced, the worker connects the end of the component tape 900 to the tip of the component tape 900 wound around a new replacement reel 903. This prevents the mounting operation from being interrupted due to the completion of the mounting of all the electronic components 1 housed in one component tape 900.

Here, the electronic component 1 accommodated in each of the component tapes 900 before and after the replacement may be different in shape, type, and the like. As a result, the component mounting machine detects the wrong electronic component 1. The electronic component may be mounted, or the electronic component 1 may be damaged by the same handling as the electronic component 1 before replacement.
Therefore, conventionally, a component mounter that detects the joint of the component tape 900, identifies the shape and type of the electronic component 1 stored in the replaced component tape 900, and performs a mounting operation based on the result is provided. It has been proposed (see, for example, Patent Document 1 and Patent Document 2).

  In the component mounting machine disclosed in Patent Document 1, a barcode on which identification information indicating the shape and type of the electronic component 1 is recorded is affixed to the reel 903, and an operator can replace the component tape 900. The identification information written in the barcode is read out by a barcode reader and stored in a memory. When the component mounter detects the joint of the component tape 900 and recognizes that the component tape 900 has been replaced, it reads out the identification information stored in the memory and authenticates the electronic component of the newly replaced component tape 900. And perform the mounting work according to the authentication result.

In the component mounting machine of Patent Document 2, as in the component mounting machine of Patent Document 1, using the unique data as identification information, the electronic component 1 of the newly replaced component tape 900 is authenticated, and the authentication is performed. Depending on the result, the mounting operation is continued or stopped.
JP 2000-13092 A Japanese Patent Laid-Open No. 10-341096

However, the component mounters disclosed in Patent Document 1 and Patent Document 2 use the identification information and the unique data to grasp the contents related to the electronic components of the newly replaced component tape and perform the mounting work based on the contents. However, there is a problem that various electronic components are mounted on the printed circuit board, and these electronic components cannot be managed.
In addition, when an operator replaces a component tape, the lots may differ even if the component tapes that have the same function and shape of the electronic components are connected before and after the replacement. The electronic parts of different lots get mixed up.

As a result, when a printed circuit board mounted with such a component mounting machine is distributed to the market and a problem such as a failure occurs, it is difficult to pursue the cause of the problem.
Therefore, the present invention has been made in view of such problems, and an object of the present invention is to provide a component management method and a component tape for reliably managing components such as electronic components mounted on a substrate.

  In order to achieve the above object, a component management method according to the present invention is a component management method for managing components mounted on a board, and is attached to the tip of a component tape for storing or fixing a plurality of components. A read step for reading out the contents related to the plurality of components from the first memory, a mounting step for sequentially taking out the components from the tip of the component tape and mounting them on the substrate, and the content read in the read step, A write step of writing to a second memory attached to the board in association with the component mounted in the mounting step. For example, in the read step, the lot number of the part, the serial number of the part, information indicating the manufacturer of the part, information indicating the shape of the part, the date of manufacture of the part, and the part are sealed from the first memory. At least one of the date indicating when the package is opened and the number of components stored or fixed on the component tape is read out as the content related to the plurality of components.

  As a result, the contents related to a plurality of parts stored or fixed in the part tape are read out, and after the parts are mounted in order from the front end of the part tape, the read contents are added to the mounted parts. Correspondingly, since it is written in the second memory on the board, the components mounted on the board can be managed easily and reliably for each board, and the mounting from one component tape is completed and the other By starting mounting from a component tape, even if a component that has been stored or fixed in a different component tape is mounted on the same board, the component mounted on the board is stored or fixed. It can be managed for each part tape. In addition, when a lot number or the like is included as contents related to a plurality of parts, management according to the lot number can be performed.

Further preferably, in the read step, contents relating to the plurality of components are read from the first memory configured as an IC tag.
Thereby, it is possible to easily read from the first memory by non-contact communication.

More preferably, in the write step, data is written to the second memory configured as an IC tag.
As a result, writing to the second memory can be easily performed by non-contact communication.
Here, the end of the component tape is joined to the tip of the other component tape, and the component management method is further provided by the first memory attached to the succeeding joined component tape. Each time the first memory is detected in the detection step, the read step, the mounting step, and the write step are the component tapes to which the detected first memory is attached. It is good also as a feature to be performed with respect to.
As a result, when the component tapes are joined together, the components mounted on the board can be managed without reducing the work efficiency of component mounting.

  In addition, the component tape according to the present invention is a component tape that stores or fixes a plurality of components, and includes a storage means having an area for storing contents related to the plurality of components at the tip of the component tape. It is characterized by. For example, the contents related to the plurality of parts include the lot number, serial number, information indicating the manufacturer, information indicating the shape, date of manufacture, date of opening, and storage or fixing in the part tape. It includes at least one of the number of parts that are used.

  As a result, since the storage means is at the tip of the component tape, if contents related to a plurality of components are stored in the storage means, for example, for a component mounter that takes out the component from the tip of the component tape and mounts it on the board Thus, when the component is taken out, the content regarding the component can be notified in advance, and the component mounter can be surely handled and managed according to the content. Here, when the component tapes are joined, the component mounter can be easily recognized by the joint of the component tapes. Furthermore, for example, when a lot number is included as the contents related to a plurality of parts, it is possible to cause the component mounter to manage the parts according to the lot numbers.

Preferably, the storage means is an IC tag.
As a result, for example, a larger amount of information can be written in the storage means than a bar code or the like, and further, the contents related to a plurality of components can be easily notified to the component mounter by non-contact communication.

  In addition, the component mounter according to the present invention includes a read means for reading out the contents related to the plurality of components from the first memory attached to the tip of the component tape for storing or fixing the plurality of components, and the tip of the component tape. The mounting means for sequentially taking out the components from the mounting means and mounting them on the board, and the contents read by the reading means are written in a second memory attached to the board in association with the parts mounted by the mounting means And a light means.

  As a result, the contents related to a plurality of parts stored or fixed in the part tape are read out, and after the parts are mounted in order from the front end of the part tape, the read contents are added to the mounted parts. Correspondingly, since it is written in the second memory on the board, the components mounted on the board can be managed easily and reliably for each board, and the mounting from one component tape is completed and the other By starting mounting from a component tape, even if a component that has been stored or fixed in a different component tape is mounted on the same board, the component mounted on the board is stored or fixed. It can be managed for each part tape.

  Further, the mounting means may mount the component on the board in a manner corresponding to the content read by the read means. For example, the mounting means includes a head that sucks a component from the component tape and places it on a substrate, and a driving means that drives the head, and the driving means reads the content read by the read means. The suction mode of the head is changed according to the above.

  Thereby, since the components are mounted on the substrate in a manner corresponding to the contents regarding the plurality of components, it is possible to prevent erroneous mounting of the components. In addition, since the suction mode of the head changes according to the contents, it is possible to appropriately handle the component and prevent the component from being damaged.

  The board according to the present invention is a board on which a component is mounted, and the lot number of the mounted component, the serial number of the component, information indicating the manufacturer of the component, information indicating the shape of the component, and manufacturing of the component Writable with an area for storing at least one of the date, the date indicating when the part is opened from the sealed state, and the number of parts stored or fixed in the part tape It is characterized by comprising a storage means.

  Thus, by providing a writable storage means, for example, even when a component to be mounted is added, the contents related to the component such as the lot number of the added component are written in the storage means and mounted on the board. It is possible to easily manage all the parts that have been used. That is, it is possible to reduce troublesome work such as re-writing barcodes that cannot be written.

Preferably, the storage means is an IC tag.
As a result, the amount of information written in the storage means can be increased as compared with the barcode, and can be easily written by non-contact communication.
In addition, the board includes a plurality of sub-boards, and the storage unit is writable having an area attached to each sub-board and storing contents relating to components mounted on the sub-boards. It may be characterized by comprising a child storage means.

Thereby, for example, even if a board is divided and a plurality of child boards are distributed in the market, since the child storage means is attached to each child board, it is possible to reliably manage the components mounted on the child boards. it can.
The present invention can be realized not only as a component tape as described above but also as a method for attaching a memory to the component tape.

  In the component management method of the present invention, after the contents related to a plurality of components stored or fixed in the component tape are read and the components are mounted in order from the tip of the component tape, the read contents Is written in the second memory on the board in association with the mounted component, so that the component mounted on the board can be easily and reliably managed for each board.

Hereinafter, a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a configuration diagram showing a configuration of a component mounting system according to the present embodiment.
This component mounting system includes component mounters 100 and 200 that mount electronic components 3 on a printed circuit board 2, and a control device 300 that controls these component mounters 100 and 200, and is mounted on the printed circuit board 2. In addition, the individual electronic components 3 are reliably managed.

The component mounters 100 and 200 each include a component supply unit 102 in which a plurality of reels 101 are disposed. Then, the component mounting machines 100 and 200 pull out the component tape 103 from the reel 101 in the component supply unit 102, take out the electronic component 3 stored in the component tape 103, and electronically place it on the printed circuit board 2 that has been put in. The component 3 is mounted.
Here, the IC tag 104 for tape is attached to the component tape 103, and the IC tag 104 for tape stores in advance component data 105 indicating the contents related to the electronic component 3 accommodated in the component tape 103. is doing.

Also, a board IC tag 106 is attached on the printed circuit board 2, and the board IC tag 106 stores management data 107 indicating contents of the electronic component 3 mounted on the board 2 and the mounting operation result. It has an area for storing.
Such IC tags 104 and 106 for tape and substrate perform non-contact communication using so-called RFID (Radio Frequency Identification) technology, and store or store information by the communication. Or send information.

  That is, the component mounting machines 100 and 200 according to the present embodiment read the component data 105 of the electronic component 3 stored in the component tape 103 from the IC tag 104 for tape, and performed the mounting operation when the mounting operation is completed. The contents related to the mounted electronic component 3 and the contents indicating the mounting work result are written as management data 107 to the board IC tag 106 of the printed board 2. Furthermore, the component mounting machines 100 and 200 in the present embodiment change the mounting operation according to the content of the read component data 105.

Further, the control device 300 acquires management data 107 written to the board IC tag 106 by the component mounting machines 100 and 200 from the component mounting machines 100 and 200 and stores them collectively.
FIG. 2 is an explanatory diagram for explaining the component tape 103 according to the present embodiment.
The component tape 103 in the present embodiment is wound around a reel 101, a carrier tape 103b on which the electronic component 3 is placed, a cover tape 103a attached to the carrier tape 103b, and the above-described IC tag for tape. 104.

The carrier tape 103b is made of a thin resin molded product, paper, or the like, and the plurality of electronic components 3 are stored in storage recesses 103c formed on the carrier tape 103 at substantially equal intervals.
The cover tape 103a is made of, for example, translucent synthetic resin, and is affixed to the carrier tape 103b so that the electronic component 3 does not come off from the storage recess 103c of the carrier tape 103b, that is, closes each storage recess 103c. .

The IC tag 104 for tape is attached to the tip of the carrier tape 103b, and the component data 105 stored therein includes information indicating the lot or manufacturer of the electronic component 3.
Such a tape IC tag 104 is attached to the carrier tape 103b in advance, and after the electronic component 3 is placed and stored on the carrier tape 103b, the component data 105 corresponding to the electronic component 3 is used for the tape. It is written in the IC tag 104.

  For example, as shown in FIG. 2, the component data 105 includes a serial number column A <b> 1 in which the serial number of each electronic component 3 stored in the component tape 103 is stored, and the electronic component 3 stored in the component tape 103. A lot number column A2 for storing the lot number, a component name column A3 for storing the component name of the electronic component 3, a vendor column A4 for storing a vendor code indicating the manufacturer of the electronic component 3, A shape column A5 in which contents indicating the shape of the electronic component 3 are stored, a manufacturing column A6 in which the date of manufacture of the electronic component 3 is stored, and the electronic component 3 is opened after being sealed after manufacturing The opening column A7 for storing the date and time stored, the number column A8 for storing the number of electronic components 3 stored in the component tape 103, and the interval (pitch) between the stored electronic components 3 )But There is a pitch column A9 to be accommodated.

  Specifically, “ser0001,..., Ser0500” indicating the serial number of each electronic component 3 is stored in the serial number column A1, and the lot number “rot0002” of the electronic component 3 is stored in the lot number column A2. The name column A3 stores the component name “1005CR” of the electronic component 3, and the vendor column A4 stores the vendor code “ven0003” indicating the manufacturer of the electronic component 3. Note that the serial numbers of the electronic components 3 are stored in the order in which the electronic components 3 are arranged on the component tape 103, for example.

Further, the width “10 mm”, the depth “5 mm”, and the height “2 mm” of the electronic component 3 are stored in the shape column A5.
Further, the date of manufacture of the electronic component 3 “January 31, 2002” is stored in the manufacture column A6, and the date “February 1, 2003” when the electronic component 3 was opened is stored in the opening column A7. ”Is stored, the number“ 500 ”of electronic components 3 stored in the component tape 103 is stored in the number column A8, and the pitch“ 10 mm ”of the electronic components 3 is stored in the pitch column A9. .

When such a component tape 103 is replaced, the tip of a new replacement component tape 103 is joined to the end of the component tape 103 drawn out to the component mounters 100 and 200.
FIG. 3 is an explanatory diagram for explaining a state in which the tip of the replacement component tape 103 is joined to the end of the component tape 103.

  As shown in FIG. 3A, the connecting tape 4 for joining is attached to the end and the tip of the component tape 103. In other words, when joining the component tape 103, the operator butts the end of the component tape 103 drawn out to the component mounters 100 and 200 and the tip of the replacement component tape 103 and connects to the butt portion. Adhere tape 4.

Further, as shown in FIG. 3B, two hooks 5b provided at the tip of the replacement component tape 103 are attached to the two U-shaped locking portions 5a provided at the end of the component tape 103. The two component tapes 103 may be joined together by hooking them individually.
When the component tapes 103 are joined together in this way, the tape IC tag 104 is located at the joint.

  That is, the component mounters 100 and 200 of the present embodiment always monitor the drawing portion of the component tape 103 during the mounting operation, and when the tape IC tag 104 is detected, the tape IC tag 104 removes it. It is recognized that a replacement part tape 103 is joined from the worn part, that is, the part tape 103 has been replaced.

FIG. 4 is a block diagram showing an internal configuration of the component mounter 100 in the present embodiment. The component mounter 200 has the same configuration as the component mounter 100.
The component mounter 100 includes a component lead unit 111, a head 112, a head drive unit 113, a board RW unit 114, a data storage unit 115, a communication unit 116, and a control unit 117 that controls these components. And.
The component lead unit 111 detects the IC tag 104 for tape attached to the component tape 103, performs non-contact communication with the IC tag 104 for tape, and stores the component data 105 stored in the IC tag 104 for tape. read.

The head 112 sucks the electronic component 3 stored in the component tape 103 and places it on the printed circuit board 2.
The head drive unit 113 drives the head 112 in accordance with control from the control unit 117.
The board RW unit 114 performs non-contact communication with the board IC tag 106 attached on the printed board 2, reads the management data 107 stored in the board IC tag 106, and newly updates the management data 107. Data 107 is written to the IC tag 106 for substrates.

The data storage unit 115 stores management data 107 and component data 105 in accordance with control from the control unit 117.
The communication unit 116 transmits the management data 107 and the component data 105 stored in the data storage unit 115 to the control device 300 in accordance with the control from the control unit 117.
Here, the management data 107 includes work result information 107a indicating the work result of each facility (component mounting machine or the like) that has performed the mounting operation on the printed circuit board 2, and the electronic component 3 mounted in each facility. Mounting component information 107b indicating the contents related to.

FIG. 5 is an information content display diagram showing the contents of the work result information 107a.
The work result information 107a includes a board ID (for example, “PB01ID”) assigned to identify the printed board 2 and a lot number (for example, “PB01Rt”) of the printed board 2.
Further, the work result information 107a stores the equipment name column B1 in which the name of the equipment that has worked on the printed circuit board 2 (equipment name), and the date and time when the printed circuit board 2 was inserted into the equipment. The input date and time field B2, the tact field B3 in which the time (tact) required for the work in the facility is stored, and the PG field B4 in which the name of the program executed by the facility on the printed circuit board 2 is stored. When an error occurs during the execution of the program, there are an error column B5 in which contents relating to the error are stored, and an index column B6 in which an index indicating the mounted component information 107b related to the work of the facility is stored. Here, by including an index in the work result information 107a, the work result information 107a is associated with the mounted component information 107b for each facility.

  For example, the equipment name “CM402” of the component mounting machine 100 is stored in the equipment name column B1, and the date and time “2003/01/06 11 when the printed circuit board 2 is inserted into the component mounting machine 100 is stored in the input date and time column B2. : 16:34 ”is stored, the time“ 35 seconds ”required for the mounting work by the component mounting machine 100 is stored in the tact column B3, and the printed circuit board 2 is stored in the PG column B4 by the component mounting machine 100. The name “PTEST” of the program executed for the electronic component 3 is stored, and the index “Idx01” of the mounting component information 107b related to the electronic component 3 mounted by the component mounting machine 100 is stored in the index B6 column. In the error column B5, for example, an error occurrence date “2003/01/06 11:16:55” generated when the program is executed, an error code “MC0005” of the error, and an error are generated. The stored step “100” is stored.

FIG. 6 is an information content display diagram for displaying the contents of the mounted component information 107b.
The mounting component information 107b is assigned the above-mentioned index for each facility, and each mounting component information 107b is identified by the index.
For example, the mounting component information 107 b with the index “Idx01” includes the component name and serial number of each electronic component 3 mounted on the component mounter 100.

  That is, the mounting component information 107b includes a position column C1 where the position on the printed circuit board 2 is stored, a component name column C2 where the component name of the electronic component 3 mounted at the position is stored, and the electronic component. The serial number column C3 in which the serial number 3 is stored, the lot number column C4 in which the lot number of the electronic component 3 is stored, and the location where the reel 101 of the electronic component 3 is disposed (Z-axis position) Is stored in the Z-axis column C5.

  For example, the position column C1 stores the position “X1, Y1” of the mounted electronic component 3 on the printed circuit board 2, and the component name column C2 stores the component name “1005CR” of the electronic component 3. The serial number column C3 stores the serial number “ser0001” of the electronic component 3, the lot number column C4 stores the lot number “rot0002” of the electronic component 3, and the Z-axis column C5 stores the electronic component. The Z-axis position “10” on which the three reels 101 are arranged is stored. The Z axis refers to the arrangement direction of the plurality of reels 101 arranged in the component supply unit 102 of the component mounter 100.

  When the printed circuit board 2 is inserted, the control unit 117 of the component mounter 100 according to the present embodiment controls the circuit board RW unit 114 to control the circuit board IC tag 106 attached to the printed circuit board 2. The management data 107 is read and temporarily stored in the data storage unit 115. When the mounting operation for the printed circuit board 2 is completed, the control unit 117 overwrites the mounting operation result on the management data 107 stored in the data storage unit 115 and controls the substrate RW unit 114 again. The overwritten (updated) management data 107 is written in the substrate IC tag 106.

  Further, the control unit 117 of the component mounter 100 according to the present embodiment determines whether or not the IC tag 104 for tape is attached to the component tape 103 that has been pulled out, based on the communication result by the component lead unit 111. When it is determined that the tape IC tag 104 is attached, it is recognized that the component tape 103 has been replaced from the portion of the tape IC tag 104. Thereafter, the control unit 117 controls the component lead unit 111 to read the component data 105 stored in the tape IC tag 104 and store the component data 105 in the data storage unit 115.

  When the management data 107 is updated, the control unit 117 reads out the component data 105 corresponding to the mounted electronic component 3 from the data storage unit 115, and the content is the component name of the mounting component information 107 b of the management data 107. Stored in the column C2 and the serial number column C3. Specifically, since a plurality of reels 101 are mounted on the component mounter 100, each component data 105 read from the tape IC tag 104 attached to the component tape 103 of those reels 101 is And stored in the data storage unit 115 in association with the Z-axis position of the reel 101. Then, when mounting each electronic component 3, the control unit 117 of the component mounting machine 100 stores the Z-axis position of the reel 101 from which each electronic component 3 is taken out, and stores the mounting component information 107 b in the management data 107. When updating, the component data 105 associated with the stored Z-axis position is read from the data storage unit 115. The control unit 117 writes each content such as the component name and serial number included in the read component data 105 in the corresponding part of the mounted component information 107b. As a result, the IC tag 106 for a board attached to the printed board 2 has a serial number, a lot number, and a mounting number for each electronic component 3 mounted on the printed board 2 for each facility as shown in FIG. Points (positions mounted on the printed circuit board 2) and the like are indicated.

  Here, when the control unit 117 determines that the IC tag 104 for tape is attached to the component tape 103, the control unit 117 determines whether the detection position of the IC tag 104 for tape (the reading position of the component data 105) and the head 112. The electronic component 3 attracted to the head 112 recognizes that the electronic component 3 of the replaced component tape 103 is switched after the component tape 103 is fed N times. Then, the control unit 117 determines whether or not the shape of the electronic component 3 is different before and after the replacement of the component tape 103 based on the component data 105 read by the component lead unit 111, and if the shape of the electronic component 3 is different. When the determination is made, the head driving unit 113 is controlled so that the suction mode of the head 112 changes according to the shape of the electronic component 3 accommodated in the replaced component tape 103 after the N times of feeding.

For example, when the control unit 117 determines that the height of the electronic component 3 is low, the control unit 117 controls the head driving unit 113 so that the suction portion of the head 112 is lowered according to the height. Thereby, it can mount reliably and safely, without damaging the electronic component 3. FIG.
The control unit 117 controls the head driving unit 113 to stop the suction operation of the head 112 when determining that the functions of the electronic component 3 are different, for example. Thereby, erroneous mounting of the electronic component 3 can be prevented.

FIG. 7 is a flowchart showing the operation of the component mounter 100 in the present embodiment.
First, the component mounter 100 reads the component data 105 from the tape IC tag 104 attached to the component tape 103 (step S100), and further receives the management data 107 from the substrate IC tag 106 of the input printed circuit board 2. Reading (step S101), the component data 105 and management data 107 are stored.

Next, the component mounting machine 100 starts mounting the electronic component 3 accommodated therein on the printed circuit board 2 while pulling out the component tape 103 (step S102).
Here, the component mounter 3 monitors the portion of the component tape 103 that has been pulled out, and another tape IC tag 104 that is different from the tape IC tag 104 from which the component data 105 has been read in step S100. Through the communication, it is determined whether or not the component tape 103 has been replaced (step S104).

When it is determined that the component tape 103 has been replaced (Y in step S104), the component mounter 100 reads and stores the component data 105 from the IC tag 104 for the tape (step S106), and the replaced component tape 105. The contents relating to the electronic component 3 housed in the device, for example, the shape is specified (step S108).
Then, the component mounter 100 feeds the component tape 103 a predetermined number of times, and when the electronic component 3 of the replaced component tape 103 reaches the suction position of the head 112, the component mounter 100 responds to the shape of the electronic component 3 and the like. The height of the head 112 is adjusted (step S110). After adjusting the head 112, the component mounting machine 100 picks up the electronic component 3 with the head 112 and mounts it on the printed circuit board 2 (step S112).

In addition, after mounting the electronic component 3 in step S112 or determining that the component tape 103 has not been replaced in step S104 (N in step S104), the component mounter 100 prints all the electronic components 3 It is determined whether or not it is mounted on the substrate 2 (step S114).
When it is determined that all the electronic components 3 are not mounted (N in step S114), the component mounter 100 repeatedly executes the operation from step S102 again, and when it is determined that all the electronic components 3 are mounted. (Y in step S114), the stored management data 107 is updated, and the updated management data 107 is written in the board IC tag 106 on the printed board 2 (step S116).

  As described above, since the component tape 103 according to the present embodiment includes the IC tag 104 for tape at the tip, the component mounter 100 can easily detect the joint of the component tape 103, and the Since the tape IC tag 104 stores the component data 105, the component mounter 100 can easily read the component data 105 at the timing when the component tape 103 is switched. As a result, the worker can improve the work efficiency without performing the work of reading the barcode attached to the reel with the barcode reader when the component tapes are joined together as in the conventional example. .

  In addition, the component mounters 100 and 200 according to the present embodiment include the component lead unit 111 that communicates with the tape IC tag 104, thereby detecting the joint of the component tape 103 and newly connecting the component tape 103. The contents relating to the electronic component 3 housed in can be easily grasped from the component data 105 stored in the IC tag 104 for tape. Furthermore, the component mounters 100 and 200 according to the present embodiment include a board RW unit 114 that communicates with the board IC tag 106 mounted on the printed board 2, and the contents related to the electronic component 3 mounted on the printed board 2. In order to write to the IC tag 106 for the board on the printed circuit board 2 based on the content grasped from the component data 105, for example, the component tapes 103 are joined together, and the electronic components stored in the joined component tapes 103 Even if the three lots are different, since the contents related to all the electronic components mounted on the printed circuit board 2 are stored as the management data 107 in the board IC tag 106, the print data can be printed based on the management data 107. The lot of each electronic component 3 mounted on the substrate 2 can be specified. As a result, each electronic component 3 mounted on the printed circuit board 2 can be reliably managed.

  In addition, since the printed circuit board 2 in the present embodiment includes the substrate IC tag 106, the result of the mounting operation and the contents related to the mounted electronic component 3 are written on the substrate IC tag 106 as needed. The contents can be managed every two. That is, when managing the contents of the electronic component 3 mounted by pasting a barcode on the printed circuit board 2, when the electronic component 3 is further mounted on the printed circuit board 2, the barcode is rewritten. Since the barcode cannot be replaced because it is not possible, the electronic component 3 can be easily managed without requiring such troublesome work by providing the substrate IC tag 106 in this embodiment.

  Furthermore, in the component mounting system according to the present embodiment, the control device 300 communicates with each of the component mounting machines 100 and 200 and collectively holds the management data 107. Without reading the management data 107 from the IC tag 106, the contents related to the electronic component 3 mounted on each printed circuit board 2 and the contents indicating the work result can be centrally managed.

(Modification 1)
Next, a modified example of the printed circuit board in the present embodiment will be described.
FIG. 8 is a front view of a printed circuit board according to this modification.
As shown in FIG. 8, the printed circuit board 2a according to this modification is a multi-sided board in which a plurality of sub boards 2b are generated by being divided, and each sub board 2b includes The substrate IC tags 106 are attached one by one.
Specifically, a plurality of grooves 9 penetrating from the front surface to the back surface are formed in the printed circuit board 2a, and the above-described child substrate 2b is formed from a portion surrounded by each groove 9 on the printed circuit board 2a. . A substrate IC tag 106 is attached to the corner of each of the sub-substrates 2b.

  In general, printed circuit boards for multi-sided processing are put into a component mounting machine for each board, and electronic components are mounted. After all mounting operations are completed, they are divided and distributed to the market as divided child boards. To do. Here, if only one board IC tag 106 is attached to the printed circuit board as in the above embodiment, the electronic components cannot be managed for each sub board. End up.

  Therefore, the multi-sided printed circuit board 2a according to the present modification can manage the mounted electronic component 3 for each child board 2b by providing the board IC tag 106 for each child board 2b.

(Modification 2)
Next, a modification of the component tape in the present embodiment will be described.
FIG. 9 is a front view of a component tape according to this modification.
A component tape 103e according to this modification includes a plurality of IC tags 104 for tape.
That is, the tape IC tag 104 is attached to the tip of the carrier tape 103b of the component tape 103e, and the tape IC tag 104 is also provided at a position between the electronic components 3 to be stored. Is attached.

  The tape IC tag 104 at the front end stores component data corresponding to the electronic component 3 at the rear (end side), and the second IC tag 104 for tape from the front end is the other Component data corresponding to the electronic component 3 is stored. That is, each tape IC tag 104 records component data corresponding to one electronic component 3 behind it.

As described above, by providing the component tape 103e with a plurality of IC tags 104 for tape corresponding to each electronic component 3, the contents such as the component name and lot number of each electronic component 3 stored in the component tape 103e are different. Even in such a case, the contents can be reliably associated with each electronic component 3.
Since the tape IC tag 104 corresponding to the electronic component 3 is attached to the front (front end side) of each electronic component 3, the component tape 103e is joined to the end of the component tape 103e in use from the middle. be able to. That is, when the component tape 103e is cut at the halfway position, if the tape IC tag 104 is cut so that it remains at the new tip after the cutting, the new component tape 103e is cut. It can be connected from the tip. Thereby, the usability of the component tape 103e can be improved.

(Modification 3)
Next, a modified example regarding the update timing of the management data 107 in the present embodiment will be described.
In the present embodiment, the management data 107 is updated after all the electronic components 3 are mounted on the printed circuit board 2 in each component mounting machine. However, in this modification, the tape of the replaced component tape 103 is used. At the timing when the component data 105 is read from the IC tag 104 and stored in the data storage unit 115, the mounted component information 107b of the management data 107 is updated. Furthermore, when the printed circuit board 2 is loaded into the component mounting machine, the management data 107 is read from the IC tag 106 for the printed circuit board 2 and stored in the data storage unit 115, and is already stored in the data storage unit 115. The mounted component information 107b of the management data 107 is updated using the component data 105 that has been recorded.

  That is, when the printed circuit board 2 is inserted, the component mounter has already taken out the electronic component 3 from the component tape 103 at any Z-axis position with respect to the printed circuit board 2 and mounted the electronic component at any position. I recognize that. As a result, when the printed circuit board 2 is inserted and the management data 107 is read, the component mounting machine reads the contents of the component data 105 stored in association with the Z-axis position as the mounting component information of the management data 107b. Write in each column 107b to update the mounted component information 107b.

  Here, since the number of electronic components 3 is included in the component data 105, the component mounting machine grasps the remaining amount of the electronic components 3 by counting the number of electronic components 3 taken out. As a result, when it is determined that the remaining amount of the electronic component 3 is smaller than the number of electronic components 3 to be mounted on one printed circuit board 2, the contents of the mounted component information 107b are updated by the remaining amount. Then, at the timing when the component data 105 is read from the tape IC tag 104 of the replaced component tape 103 and stored in the data storage unit 115, the remaining parts to be mounted based on the contents of the read component data 105. For the electronic component 3, the mounting component information 107b of the management data 107b is updated.

When an electronic component 3 adsorption error or mounting error occurs during the mounting process, the remaining amount of the electronic component 3 grasped by the component mounting machine may differ from the actual remaining amount. The machine detects the occurrence of such an error and corrects the remaining amount ascertained.
Further, the mounting component information 107b of the management data 107 may be updated at any time when each electronic component 3 is mounted on the printed circuit board 2.

  For example, the component mounter takes out the electronic component 3 from the component tape 103 at the predetermined Z-axis position, and stores the electronic component 3 in association with the predetermined Z-axis position when the electronic component 3 is mounted on the printed circuit board 2. The content of the component data 105 being written is written in each column of the mounting component information 107b of the management data 107b, and the mounting component information 107b is updated. Then, when the component mounter detects the IC tag 104 for tape of the replaced component tape 103, the component mounter grasps the Z-axis position of the component tape 103, and already stores the component tape in association with the Z-axis position. The data 103 is deleted, and new component data 105 is read from the IC tag 104 for tape of the replaced component tape 103 and stored in association with the Z-axis position. After that, the component mounter writes the contents of the new component data 105 in each column of the mounted component information 107b of the management data 107b at the mounting timing, and updates the mounted component information 107b.

As described above, the present invention has been described using the embodiment and the modified examples, but the present invention is not limited thereto.
For example, in the present embodiment and the modification, the component data 105 is written in the IC tag 104 for tape that is previously attached to the carrier tape 103b. However, after the component data 105 is written in the IC tag 104 for tape, the component data is written. The tape IC tag 104 in which 105 is written may be attached to the component tape 103. In this case, the component tape 103 can be easily joined from any part (on the way). That is, when the replacement component tape 103 is joined to the end of the component tape 103 in use from the middle, the replacement component tape 103 is cut at the middle portion, and at the tip of the new component tape 103, The tape IC tag 104 in which the component data 105 is written is attached.

Further, in the present embodiment and the modification, the tape IC tag 104 is attached to the component tape 103. However, for example, a two-dimensional barcode may be attached.
Further, in the present embodiment and the modification, the part name, serial number, and lot number are stored in the part mounting information 107b of the management data 107. Further, the vendor code, shape, and manufacturing date included in the part data 105 are stored. It goes without saying that the date, date of opening, etc. may be stored. By storing these, the electronic component 3 mounted on the printed circuit board 2 can be managed by a vendor code, an opening date, and the like.

  Furthermore, in Modification 2, the plurality of tape IC tags 104 are provided in the component tape 103e, but other tape IC tags 104 other than the tape IC tag 104 arranged at the head are replaced with, for example, a barcode. May be. In this case, the IC tag 104 for the top tape stores only the content related to the top electronic component 3 stored in the component tape 103e as the component data 105, and the bar codes corresponding to the other electronic components 3 are Only the contents different from the component data 105 are shown. In general, the amount of information contained in a barcode is small compared to an IC tag, but the production cost of the component tape 103e can be reduced by representing only the differences with the barcode.

  The component management method of the present invention has an effect that it is possible to reliably manage electronic components mounted on a substrate, and can be applied to the electronic equipment manufacturing industry and the like.

It is a block diagram which shows the structure of the component mounting system in embodiment of this invention. It is explanatory drawing for demonstrating a component tape same as the above. It is explanatory drawing for demonstrating the state by which the front-end | tip of the component tape for replacement | exchange was joined to the terminal end of the component tape same as the above. It is a block diagram which shows the internal structure of a component mounting machine same as the above. It is an information content display figure which shows the content of work result information same as the above. It is an information content display figure which displays the content of the mounting component information same as the above. It is a flowchart which shows operation | movement of a component mounting machine same as the above. It is a front view of the printed circuit board concerning a modification same as the above. It is a front view of the component tape which concerns on a modification same as the above. It is an external view which shows the external appearance of the reel around which the conventional component tape was wound.

Explanation of symbols

2 substrate 3 electronic component 100 component mounter 101 reel 102 component supply unit 103 component tape 104 IC tag for tape 105 component data 106 IC tag for substrate 107 management data 200 component mounter 300 management data

Claims (22)

A component management method for managing components mounted on a board,
A read step of reading out the contents related to the plurality of components from a first memory attached to the tip of a component tape for storing or fixing the plurality of components;
A mounting step of sequentially removing components from the tip of the component tape and mounting them on a substrate;
A component management method comprising: a write step of writing the content read in the read step into a second memory attached to the substrate in association with the component mounted in the mounting step . In the lead step,
From the first memory, the lot number of the part, the serial number of the part, the information indicating the manufacturer of the part, the information indicating the shape of the part, the date of manufacture of the part, and the time when the part is opened from the sealed state The part management method according to claim 1, wherein at least one of the indicated date and the number of parts housed or fixed in the part tape is read out as the contents relating to the plurality of parts. In the lead step,
The component management method according to claim 1, wherein contents related to the plurality of components are read out from the first memory configured as an IC tag. In the light step,
The component management method according to claim 1, wherein writing is performed to the second memory configured as an IC tag. The other end of the component tape is joined to the end of the component tape,
The part management method further includes:
Detecting the first memory attached to the succeeding connected component tapes;
Each time the first memory is detected in the detection step, the read step, the mounting step, and the write step are executed on the component tape to which the detected first memory is attached. The component management method according to claim 1, wherein the component management method is any one of claims 1 to 4. A component tape for storing or fixing a plurality of components,
A component tape comprising storage means having an area for storing contents relating to the plurality of components at a tip of the component tape. The contents regarding the plurality of parts are as follows:
Of the part number, serial number, information indicating the manufacturer, information indicating the shape, date of manufacture, date of opening, and the number of parts stored or fixed on the part tape The component tape according to claim 6, comprising one. The component tape according to claim 6 or 7, wherein the storage means comprises an IC tag. Read means for reading out the contents related to the plurality of components from the first memory attached to the tip of the component tape for storing or fixing the plurality of components;
Mounting means for sequentially taking out components from the tip of the component tape and mounting them on a substrate;
A component mounting machine comprising: a writing unit that writes the content read by the reading unit to a second memory attached to the board in association with the component mounted by the mounting unit. The lead means is
From the first memory, the lot number of the part, the serial number of the part, the information indicating the manufacturer of the part, the information indicating the shape of the part, the date of manufacture of the part, and the time when the part is opened from the sealed state 10. The component mounter according to claim 9, wherein at least one of the indicated date and the number of components housed or fixed on the component tape is read as content related to the plurality of components. The lead means is
11. The component mounter according to claim 9, wherein contents relating to a plurality of components are read from the first memory configured as an IC tag. The light means is
The component mounting machine according to any one of claims 9 to 11, wherein writing is performed to the second memory configured as an IC tag. The other end of the component tape is joined to the end of the component tape,
The component mounter further includes:
Detecting means for detecting the first memory attached to the subsequent component tapes joined together;
The reading means, mounting means and writing means are:
The process for the component tape to which the detected first memory is attached is executed each time the first memory is detected by the detecting means. The component mounting machine described in the section. The mounting means includes
The component mounting machine according to any one of claims 9 to 13, wherein the component is mounted on a board in a manner corresponding to the content read by the read means. The mounting means includes
A head that adsorbs components from the component tape and places them on a substrate;
Driving means for driving the head,
The component mounting machine according to claim 14, wherein the driving unit changes a suction mode of the head in accordance with contents read by the reading unit. A board on which components are mounted,
The lot number of the mounted part, the serial number of the part, information indicating the manufacturer of the part, information indicating the shape of the part, date of manufacture of the part, date indicating when the part was opened from the sealed state And a writable storage means having an area for storing at least one of the number of components housed or fixed in the component tape. The substrate is configured to include a plurality of child substrates,
The storage means
The board according to claim 16, comprising a writable child storage means attached to each of the child boards and having a region for storing contents relating to components mounted on the child boards. The substrate according to claim 17, wherein the child storage means includes an IC tag. A memory mounting method comprising: attaching a memory having an area for storing contents relating to the plurality of components to a tip of a component tape for storing or fixing the plurality of components. The method of attaching a memory according to claim 19, wherein an IC tag is attached as the memory. After attaching the memory to the component tape,
21. The memory mounting method according to claim 19, wherein contents relating to the plurality of parts are written into the memory. After writing the contents related to the plurality of parts in the memory,
The memory mounting method according to claim 19 or 20, wherein the memory is mounted on a component tape.

Images