JP2005136390A - Method and material for manufacturing circuit formation substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance the reliability of interlayer connection in a circuit formation substrate. <P>SOLUTION: This manufacturing method comprises: a process of bonding or temporarily fixing a cover film and a warp inhibitor to a substrate material 1 simultaneously or sequentially; or a process of providing a slip prevention means or a warp prevention means used for the substrate material 1 to one or both of the substrate material 1 having an interlayer connection means and a stocker 9 holding the substrate material 1; or a process of bonding or temporarily bonding a sheet material, which absorbs or adsorbs some components of the interlayer connection means and is peeled off afterward, to one surface of the substrate material, and of laying one or more of metal foil, a circuit formation substrate for a core, and a substrate material to form a layered structure, in or before a process of providing conductive paste 5 or the interlayer connection means mainly made of the conductive paste to the substrate material 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a circuit-formed substrate used in various electronic devices and a material for manufacturing the circuit-formed substrate.

  As electronic devices have become smaller and more dense in recent years, more and more circuits and components can be integrated on a circuit-forming board on which electronic components are mounted, instead of the conventional single-sided board. High density substrates have been developed.

  A conventional example will be described below with reference to FIG.

  A substrate material 21 shown in FIG. 6A is a so-called prepreg in which a glass fiber woven fabric used for a circuit-forming substrate is impregnated with a thermosetting epoxy resin or the like and is brought into a B-stage state by a method such as drying. A film 22 is attached to both sides of the substrate material 21 by a laminating method using a hot roll or the like.

  Next, as shown in FIG. 6B, via holes 24 are formed in the substrate material 21 by a processing method such as a laser, and then conductive particles such as copper powder and a thermosetting resin, a curing agent, a solvent, and the like are kneaded. Then, the paste shown in FIG. 6C is obtained by filling the conductive paste 25 in the form of paste.

  Thereafter, the film 22 is peeled off to obtain a shape in which the conductive paste 25 protrudes as shown in FIG. 6D, and copper foils 26 are arranged on both sides thereof and heated by a hot press device (not shown). By applying pressure, the substrate material 21 is thermally cured as shown in FIG. 6E, the conductive paste 25 is compressed, and the front and back copper foils 26 are electrically connected. At that time, the epoxy resin impregnated in the substrate material 21 flows and flows out.

  Thereafter, excess portions at the ends are cut off to form the shape as shown in FIG. 6F, and the copper foil 26 is processed into a desired pattern by a method such as etching to form a circuit 27, as shown in FIG. 6G. Such a double-sided circuit-formed substrate is prepared and cut into a desired product size to obtain a product as a circuit-formed substrate as shown in FIG. In FIG. 6, a finishing process such as a plating process on the solder resist of the outer layer portion or the circuit 27 disposed on the normal circuit forming substrate is not shown, but it is disposed as necessary.

  Further, when manufacturing a multilayer circuit forming substrate, as shown in FIG. 7, the substrate material 21 filled with the conductive paste 25 on the upper and lower sides of the both-side circuit forming substrate once and the copper foil 26 are aligned. A multilayer circuit-formed substrate can be obtained by overlapping and hot pressing.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-6-268345

  However, in the manufacturing method of the circuit forming substrate as described above, when the thickness of the substrate material is reduced in the present situation where the circuit forming substrate is required to be thinned, the substrate material is handled (conveyed, transported). Manufacturing challenges arise.

  That is, for the substrate material 21 from which the film 22 is peeled after filling with the conductive paste 25 as shown in FIG. 6D, FIG. 7B, etc., the projection shape of the conductive paste 25 is not impaired. However, while the substrate material 21 is held without being in contact with other members, the process from peeling of the film 22 to the step of superimposing it with the copper foil 26 or other circuit forming substrate must be performed.

  When contacted with another member, the conductive paste 25 is lost from the portion where the interlayer connection is necessary, and is less than the necessary amount, so that the quality reliability of the interlayer connection is impaired in the completed circuit forming substrate. . In addition, the conductive paste 25 scraped by contact spreads around the periphery, which may cause an electrical failure such as a short circuit between adjacent circuits 27.

  In addition, the above-described handling problem also arises when the manufacturing process is performed with the size of the substrate material 21 increased in order to reduce manufacturing efficiency and manufacturing cost.

  That is, when the process is attempted without bringing the conductive paste 25 into contact with other members, the substrate material 21 can be held only at the peripheral portion, and the inside of the process is handled while holding only the peripheral portion of the substrate material 21. There must be. At that time, when the thickness of the substrate material 21 is thin or large, the sagging occurs at the center of the substrate material 21 and the probability of contact with other members increases.

  In order to avoid the sagging phenomenon and to carry out the process stably, it is effective to mechanically hold the peripheral portion of the substrate material 21, that is, to chuck it and pull it laterally. In many cases, it is necessary to provide a chucking and pulling mechanism in many equipments, so that it is necessary to provide all parts in the process of peeling the film 22 and laminating it with the copper foil 26. The equipment cost will rise.

  Further, when stocking the substrate material 21 with the film 22 peeled off, the same chucking mechanism as described above must be provided in the stocking jig, that is, the stocker, so that the substrate materials 21 do not come into contact with each other. In order to achieve smooth production, a large number of stockers are required, which causes a lot of cost.

  In the experimental trial production or verification by the inventor, when the substrate material 21 is a prepreg in which a glass fiber woven fabric often used for manufacturing a circuit-formed substrate is impregnated with an epoxy resin, the substrate material 21 having a thickness of 100 μm or less has the above problem. In particular, the substrate material 21 of 60 μm or less became a significant problem.

  The size of the substrate material 21 is related to its thickness, but the above-mentioned problem occurs when the vertical or horizontal size of the substrate material 21 is 200 mm or more, and becomes a significant problem at 500 mm or more.

  Further, when a prototype of a mechanism that sandwiches the substrate material 21 using the chucking mechanism as described above, powder was generated from the substrate material 21 at the portion to be chucked. That is, the substrate material 21 was powdered by friction or the like and scattered around. Such powdery substrate material debris becomes a cause of a decrease in manufacturing yield as a foreign substance in the manufacturing process of the high-density circuit forming substrate.

  For these reasons, a method for easily handling a thin substrate material 21 or a large substrate material 21 has been desired as a method for manufacturing a circuit-formed substrate.

  In the method for producing a circuit-formed substrate and the material for producing a circuit-formed substrate of the present invention, the rigidity of the substrate material after the film is peeled is improved, or is fixed to the stocker by a simple method, or integrated with the sheet material. In this state, the sheet material is handled and the sheet material is peeled off at the time of lamination.

  According to the present invention, even when the substrate material is thin or adopts a large size, it is possible to prevent the conductive paste after peeling the film from contacting other members.

  As a result of the above, the quality reliability of the electrical connection between layers using a conductive paste or the like is greatly improved, and a circuit forming substrate having high density and excellent quality can be provided.

  The invention according to claim 1 of the present invention is a method for manufacturing a circuit-formed substrate, comprising a step of bonding or temporarily fixing a cover film and a deflection preventing material to a substrate material simultaneously or sequentially. In addition, the rigidity of the substrate material is improved and the handling property is improved.

  The invention according to claim 2 of the present invention is the method of manufacturing a circuit forming substrate according to claim 1, wherein the deflection preventing material is a metal material, and the substrate material is made of a thin deflection preventing material. It has the effect that the rigidity of can be improved.

  The invention according to claim 3 of the present invention is the method for manufacturing a circuit-formed substrate according to claim 1, characterized in that a groove for improving strength is formed in a deflection preventing material. Thus, there is an effect that the bending rigidity in the thickness direction of the substrate material is further improved.

  In the invention according to claim 4 of the present invention, the substrate material slip prevention means or the deflection prevention means is provided in both or one of the substrate material provided with the interlayer connection means and the stocker for holding the substrate material. This is a method for manufacturing a circuit-formed substrate, which has the advantage that the substrate material can be prevented from being bent by a simple mechanism, and the amount of dust generated from the substrate material is small.

  According to a fifth aspect of the present invention, a magnetic material is applied to, bonded to, or temporarily bonded to a substrate material before being placed on the stocker, and the magnetic material is placed at a position corresponding to the position of the magnetic material of the stocker. It is a method for manufacturing a circuit-formed substrate characterized by providing a suction means, which can reliably hold the substrate material and eases the need for positional accuracy when the substrate material is transferred to the stocker. Has an effect.

  The invention according to claim 6 of the present invention includes a step of applying, bonding or temporarily bonding a magnetic material to a substrate material, and the position of the magnetic material in a facility for holding or transporting the substrate material in a manufacturing facility. The circuit-forming board manufacturing method is characterized by providing a magnetic substance adsorbing means at a position corresponding to the above, and the board material can be securely held in the equipment, and the board material can be transferred to the equipment. This has the effect of reducing the need for positional accuracy.

  According to a seventh aspect of the present invention, in the step of disposing the interlayer connection means mainly composed of the conductive paste or the conductive paste on the substrate material or before the step, the interlayer connection means is disposed on one side of the substrate material. Adhering or temporarily adhering a sheet material that absorbs or adsorbs some of the components, and laminating the sheet material in one or more of metal foil or core circuit forming substrate or substrate material, the sheet material is peeled off The circuit-formed substrate manufacturing method is such that the rigidity of the substrate material is improved to facilitate handling, and at the same time, the sheet material can be used as a mask to prevent adhesion of foreign matter to the substrate material. Has an effect.

  The invention according to claim 8 of the present invention includes a step of attaching a cover film to one side of the substrate material, and a step of arranging an interlayer connection means mainly composed of the conductive paste or the conductive paste on the substrate material. Before and after the step, after holding or temporarily bonding or temporarily placing a sheet material that absorbs or adsorbs some components in the interlayer connection means on the opposite surface of the substrate material to which the cover film is attached, a holding time is provided for the interlayer. Forming a circuit characterized in that a partial component in the connecting means is absorbed or adsorbed on the sheet material, and then pressurization and heating are performed simultaneously or separately with a time difference to form an integrated laminate. This is a method for manufacturing a substrate. By attaching a cover film, the rigidity of the substrate material is further improved, and handling is improved. At the same time, when filling the via holes with conductive paste, the cover film serves as a print mask, enabling efficient print filling, and the sheet material can be used as a mask to create a substrate material. It is possible to prevent adhesion of foreign matters.

  Furthermore, by providing the holding time, the resin component or the like in the conductive paste is discharged to the sheet material side, so that the ratio of the conductive particles in the conductive paste increases and the quality reliability of the interlayer connection is improved.

  According to a ninth aspect of the present invention, in the step of disposing the interlayer connection means mainly composed of conductive paste or conductive paste on the substrate material or before the step, the interlayer connection means is disposed on one side of the substrate material. A method for producing a circuit-forming board comprising: adhering or temporarily adhering a metal foil that absorbs or adsorbs a partial component of the metal foil, and then laminating one or more of the metal foil, the core circuit-forming board, or the board material. Since metal foil is used as the sheet material, the sheet material is effectively used without being peeled off and discarded in the laminating process.

  According to a tenth aspect of the present invention, there is provided the substrate material on one side or both sides of the substrate material before or after the step of providing the substrate material with the conductive paste or the interlayer connection means mainly composed of the conductive paste. After bonding, temporarily adhering, or temporarily placing a metal foil that absorbs or adsorbs some of the components in the connecting means, a holding time is provided, and after absorbing or adsorbing some of the components in the interlayer connecting means to the metal foil, the metal foil is added. A method for producing a circuit-forming board characterized in that pressure and heating are performed simultaneously or sequentially with a time difference or separately to form an integrated laminate, wherein the resin component in the conductive paste is a metal Conductivity absorbed or adsorbed on metal foil improves the reliability of the quality of interlayer connection by increasing the ratio of conductive particles in the conductive paste by discharging to the foil side It has the effect of such adhesive strength or reliability of the substrate material and the metal foil is improved by components in paste.

  The invention according to claim 11 of the present invention includes a step of attaching a cover film to one side of a substrate material, and a step of arranging an interlayer connection means mainly composed of a conductive paste or a conductive paste on the substrate material. Before and after the step, a metal foil that absorbs or adsorbs some components in the interlayer connection means is bonded, temporarily bonded, or temporarily placed on the opposite surface of the substrate material to which the cover film is pasted. A circuit-forming board characterized in that a partial component in the connection means is absorbed or adsorbed on the metal foil, and then pressurization and heating are performed simultaneously or sequentially with a time difference or separately to form an integrated laminate. The substrate material rigidity is further improved by attaching a cover film, making handling easier. At the same time, when filling the via holes with the conductive paste, the cover film serves as a print mask, enabling efficient print filling, and using metal foil as the sheet material, The sheet material can be effectively used without being peeled off and discarded.

  Furthermore, by providing the holding time, the resin component in the conductive paste is discharged to the sheet material side, the ratio of the conductive particles in the conductive paste is increased, and the quality reliability of the interlayer connection is improved. The component in the conductive paste absorbed or adsorbed has an effect of improving the adhesive strength or reliability between the substrate material and the metal foil.

  The invention according to claim 12 of the present invention is characterized in that the position of the deflection preventing material is adjusted before the step of adhering or temporarily fixing so that the position of the deflection preventing material is a constant position based on the outer shape of the substrate material. The method for manufacturing a circuit-formed substrate according to claim 1, wherein a portion where a deflection preventing material is present cannot be drilled, so that a position for processing a via hole with a laser or the like is accurately determined. It is possible to realize stable drilling, and it is possible to prevent the deflection prevention material from remaining in the product when it is cut to the required product size to make the final product. Has the effect of maintaining quality.

  The invention according to claim 13 of the present invention is characterized in that the position of the deflection preventing material is arranged at a position not remaining in the product size when the substrate material is cut into the product size. 12 is a method for manufacturing a circuit-formed substrate as described in No. 12, and prevents deterioration of the product quality due to the remaining deflection preventing material, particularly when the deflection preventing material is a metal sheet. It is necessary to cut off and remove.

  The invention according to claim 14 of the present invention is the method for producing a circuit-forming substrate according to claim 1, characterized in that the deflection preventing material is composed of a thermoplastic resin, and in particular, the thermoplastic resin. When it is used, since it softens and melts when heated and pressed, it is possible to obtain an effect that it is difficult to prevent compression of the substrate material and the conductive paste.

  According to a fifteenth aspect of the present invention, the sheet material is separated from the substrate material by pulling in a shearing direction with respect to a contact portion between the interlayer connection means and the sheet material. This is a method for manufacturing a circuit-forming board, and when peeling off the sheet material, by preventing the conductive paste from being taken on the sheet material side, the reliability of the electrical connection between the electrical connections in the via holes is improved. It has the effect of preventing the decrease.

  The invention described in claim 16 of the present invention is the method for manufacturing a circuit forming substrate according to claim 7 or 8, characterized in that the sheet material is paper. The fluid component can be absorbed efficiently and the sheet material cost can be reduced.

  The invention according to claim 17 of the present invention is the method for producing a circuit-forming substrate according to claim 7 or 8, characterized in that the sheet material is a porous resin sheet. The resin component in the conductive paste is absorbed by the porous portion of the resin sheet, and this has the effect of increasing the conductive powder ratio of the conductive paste in the via hole.

  The invention according to claim 18 of the present invention is characterized in that the average roughness of the surface of the metal foil is 5 μm or more, preferably 10 μm or more in terms of 10-point average roughness Rz. When the metal foil is a copper foil, the roughness of the copper foil surface can be increased by a 10-point average roughness Rz of 5 μm or more, preferably 10 μm or more. Like the phenomenon, it can promote diffusion. Thereby, the resin component is absorbed by the copper foil, and the conductive powder ratio of the conductive paste in the via hole is increased.

  According to a nineteenth aspect of the present invention, the conductive paste or the interlayer connecting means mainly composed of the conductive paste contains a silicon-modified epoxy resin as a resin component. This is a method for manufacturing a circuit-formed substrate as described in 1., thereby providing flexibility, and in particular, a so-called pad-on-via configuration in which the copper foil in the via hole portion becomes a land at the time of component mounting. In the case of this circuit formation substrate, it has the effect of increasing the adhesion between the substrate material and the copper foil.

  The invention according to claim 20 of the present invention is a material for manufacturing a circuit-formed substrate, characterized in that the substrate material is provided with a deflection preventing material or a cover film and a deflection preventing material. Has an effect of improving the handling property and the like.

  The invention according to claim 21 of the present invention is characterized in that a substrate material is provided with a cover film on one side and a sheet material is provided on the other side, and the sheet material can absorb liquid or fluid resin. In the circuit forming substrate having the interlayer connection means mainly composed of the conductive paste or the conductive paste, the rigidity of the substrate material is improved and the handling property is improved. In addition, it is possible to provide a manufacturing material for increasing the ratio of the conductive powder of the conductive paste in the via hole, which has the effect of improving the reliability of the electrical interlayer connection of the circuit forming substrate.

  In the method for producing a circuit-formed substrate and the material for producing a circuit-formed substrate according to the present invention, a cover film and a deflection preventing material are simultaneously or sequentially bonded or temporarily fixed to the substrate material, or an interlayer connection means is provided. A substrate material and a stocker that holds the substrate material are provided with either or both of a slip prevention means or a deflection prevention means of the substrate material, or an interlayer connection means mainly composed of a conductive paste or a conductive paste. In the step of arranging or before the step, a sheet material that absorbs or adsorbs a partial component in the interlayer connecting means is bonded or temporarily bonded to one side of the substrate material, and the metal foil or the core circuit forming substrate or the substrate material In the process of laminating with one or more of them, the manufacturing method and configuration for peeling the sheet material .

  According to the present invention, in the manufacture of a circuit forming substrate using an interlayer connection means such as a conductive paste, the manufacture of a circuit forming substrate using a thin substrate material or a large-sized substrate material can be performed efficiently and with high quality. Is.

  In particular, when a woven fabric using fibers such as glass is used as a reinforcing material for a prepreg as a substrate material, the woven fabric is used as a reinforcing material while taking advantage of the dimensional stability of the woven fabric. The effect which can complement the fall of the rigidity in the prepreg state which becomes disadvantageous than a nonwoven fabric is exhibited.

  In addition, in a configuration in which a sheet material that absorbs or adsorbs some components in the interlayer connection means is arranged on one side of the substrate material, the resistance of the interlayer connection resistance by the interlayer connection means is obtained by absorbing some components in the interlayer connection means. The effect of stabilizing the value and improving the reliability is exhibited.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

(Embodiment 1)
1A to 1H are process cross-sectional views illustrating a method for manufacturing a circuit forming substrate and a material for manufacturing the circuit forming substrate according to Embodiment 1 of the present invention.

  As shown in FIG. 1 (a), a substrate material 1 is prepared in which a film 2 having a thickness of 20 μm and a metal sheet 3 as a deflection preventing material are bonded to each other. The substrate material 1 is a prepreg having a thickness of 100 μm that is B-staged by impregnating a varnish mainly composed of an epoxy resin using a glass fiber woven fabric as a reinforcing material and drying. For film 2, polyethylene terephthalate (PET) having a thickness of 20 μm was used. If necessary, the film 2 may be coated with a thermosetting resin such as an epoxy resin. The metal sheet 3 was made of stainless steel having a thickness of 10 μm and a width of 1 mm.

  Various methods can be adopted as means for laminating, but a roll laminating method using a hot roll was used in the inventors' experiment. In this method, a pair of upper and lower metal or rubber-clad metal rolls heated to about 130 ° C. are prepared, and a substrate material 1 sandwiched between two films 2 and a metal sheet 3 is passed between them, thereby providing a substrate material. The resin on the surface of 1 is melted and temporarily fixed in an integrated state with the film 2 and the metal sheet 3.

  The position of the metal sheet 3 is adjusted before passing through the heat roll so that the position of the metal sheet 3 is a constant position on the basis of the outer shape of the substrate material 1.

  The metal sheet 3 is embedded in the substrate material 1 as shown in FIG. 1A by the pressure applied by the metal roll, so that the uneven shape is not a problem in the conductive paste filling process described later. .

  Thereafter, as shown in FIG. 1B, a via hole 4 having a diameter of about 200 μm was processed using a carbon dioxide laser.

  Thereafter, as shown in FIG. 1C, the conductive paste 5 was filled into the via hole 4 using a printing means (not shown) such as a squeegee. As the conductive paste 5, a copper powder having a diameter of about 1 to 5 μm kneaded with a thermosetting resin together with a curing agent was used. It is possible to add a solvent or the like to the conductive paste 5 for the purpose of adjusting the viscosity.

  Next, as shown in FIG. 1 (d), the film 2 on both sides of the substrate material 1 is peeled off to obtain the substrate material 1 in which the conductive paste 5 protrudes to the thickness of the film 2, and copper on both sides. The foil 6 is arranged.

  Next, a shape as shown in FIG. 1 (e) is obtained by carrying out a hot pressing step of heating and pressing in the vertical direction in the figure. At that time, the thermosetting resin in the substrate material 1 flows and is molded to a desired thickness, and partially flows out to the periphery.

  Next, as shown in FIG. 1 (f), after the peripheral portion of the substrate material 1 is cut and shaped to a desired size, the copper foil 6 is formed by a method such as etching to form a circuit 7. FIG. 1 (g) A double-sided circuit-formed substrate having a workpiece size as shown was obtained.

  Further, as shown in FIG. 1 (h), it was cut into a required product size to obtain a double-sided circuit-formed substrate product. The metal sheet 3 is disposed at a position where the metal sheet 3 is cut off at that time, so that it does not remain in the final product.

  When the circuit-formed substrate is manufactured by the above-described process, the handling property of the substrate material 1 after peeling the film 2 as described in the conventional example is improved by the rigidity of the metal sheet 3. That is, the substrate material 1 as a prepreg made into a B stage by impregnating and drying a varnish mainly composed of an epoxy resin using a glass fiber woven fabric as a reinforcing material is relatively soft, and the amount of deflection is maintained even if the surrounding portion is held. However, the amount of deflection is suppressed by the action of the metal sheet 3, and problems such as contact with other members of the conductive paste 5, which was a problem of the conventional example, can be avoided.

  Specifically, a cross-sectional view is shown in FIG. 2A. In order to store the substrate materials 1 after peeling the film 2 so as not to contact each other, the taper is taped with the substrate material 1 placed on the stocker 9. The structure which keeps the space | interval of the two stockers 9 with the pin 10 which it has was implement | achieved. Even if it has such a structure, if the rigidity of the board | substrate material 1 is insufficient, the board | substrate material 1 will mutually contact by bending, and the electrically conductive paste 5 will spread around a via hole. As a result of examination by the inventor, when the interval between the substrate materials 1 is 10 mm while being sandwiched between the stockers 9, that is, the thickness of the stocker 9 is about 10 mm, the thickness is 300 mm in length and 500 mm in width without the metal sheet 3. Contact occurred with the substrate material 1 of 60 μm. In order to prevent the contact, the size of the substrate material 1 must be 250 mm or less in both length and width, or the thickness of the substrate material 1 must be 100 μm or more. On the other hand, the substrate material 1 having a size of 300 mm in length and 500 mm in width and a thickness of 60 μm provided with a metal sheet 3 made of stainless steel having a thickness of 10 μm and a width of 1 mm did not cause contact. Providing grooves 8 in the metal sheet 3 as shown in FIG.

  FIG. 2B is a perspective view showing the substrate material 1 provided with the metal sheet 3. FIG. 2C shows an example in which a crosspiece 11 is provided in the stocker 9 as a deflection preventing means. When the substrate material 1 is loaded on such a stocker 9 as shown in FIG. 2D, the problem of deflection can be completely prevented by the effect of the metal sheet 3 and the support action of the crosspiece 11. As the material of the crosspiece 11, a metal plate arranged vertically may be used, or a wire such as metal or resin may be used. In FIG. 2C, the number of the crosspieces 11 is one, but it is possible to adopt a form in which a plurality of crosspieces 11 or a cross shape is crossed as necessary.

  However, the portion corresponding to the crosspiece 11 in the substrate material 1 cannot be used as an interlayer connection portion because the crosspiece 11 may come into contact with the conductive paste 5 filled in the substrate material 1. Further, the positional accuracy when placing the substrate material 1 on the stocker 9 is also important. Similarly, in the substrate material 1 to which the metal sheet 3 is attached, since the metal sheet 3 cannot be drilled, it is positioned in a facility for processing the via hole 4 with a laser or the like, or the position of the metal sheet 3 is recognized. It is effective to provide a mechanism for

  Similarly, FIG. 3A shows a cross section of the substrate material 1 loaded on the stocker 9.

  The holding pin 12 is provided at a portion of the stocker 9 that contacts the substrate material 1 to prevent the substrate material 1 from being bent. The holding pin 12 may be one that penetrates the substrate material 1, but in order to suppress the generation of fragments generated from the substrate material 1 as much as possible, it is only slightly difficult to be inserted into the substrate material 1 as shown in FIG. good.

  FIG. 3B shows an example in which an anti-slip material 13 is provided in the stocker 9 instead of the holding pin 12. The anti-slip material 13 is preferably a resin sheet having a large friction coefficient.

  In addition, as the metal sheet 3 shown in FIG. 1 is integrated with the substrate material 1, a magnetic metal sheet or ink containing the magnetic metal is disposed at a portion in contact with the substrate material stocker 9. It is also possible to give a holding function by stretching a magnetic sheet instead of the anti-slip material 13.

  In this embodiment, a metal sheet is used as an anti-bending material. However, a resin sheet or the like can be used. In particular, when a thermoplastic resin is used, the substrate material 1 and the conductive material are softened and melted when heated and pressurized. The effect that it is hard to prevent the compressive paste 5 from being compressed can be obtained.

  Further, the same effect can be obtained by adopting a configuration in which a material for manufacturing a circuit-forming substrate in which a deflection preventing material is incorporated in advance in the substrate material 1 itself and the film 2 is attached to the substrate material 1 is used. In that case, the above-mentioned means such as arranging the above-described metal sheet, metal wire, or large-diameter glass fiber as a deflection preventing material in the reinforcing material such as the glass fiber woven fabric used for the substrate material 1 is also adopted. I can do it. Further, a method of attaching a deflection preventing material to the substrate material 1 before attaching the film 2 is also possible.

  In this embodiment, the stocker is provided with a holding pin, a non-slip material, a magnetic material, a slip prevention means such as a crosspiece or a deflection prevention means. However, the stocker is not limited to the stocker for storing the substrate material. The same effect can be obtained by applying the same measures to the part where the substrate material is handled by the laminating equipment. For example, the equipment for laminating the components as shown in FIG. 1D naturally needs a stage for handling or temporarily placing the substrate material 1 from which the film 2 has been peeled off. The same effect can be obtained by applying the described configuration.

  In addition, the present invention has a special effect in the manufacture of a circuit forming substrate using the conductive paste as described above, but the substrate having a small thickness or a large size is also used in the manufacture of a circuit forming substrate not using the conductive paste. The same problem can be solved when using materials. In that case, the substrate material is not contacted with the conductive paste, but the substrate material is rubbed against other members at the time of handling, or dust is generated, or the substrate material is passed through an etching apparatus or the like to form the circuit 7 or the like. In such a case, problems such as the substrate material being caught in a roller or the like occur. The structure of the present invention effectively works against such problems, and can contribute to improvement in yield and quality in the manufacture of circuit-formed substrates.

(Embodiment 2)
4A to 4H are process cross-sectional views illustrating a method for manufacturing a circuit forming substrate and a material for manufacturing the circuit forming substrate according to Embodiment 2 of the present invention.

  As shown in FIG. 4A, a substrate material 1 is prepared in which a film 2 having a thickness of 20 μm is bonded to one side. The substrate material 1 is a prepreg having a thickness of 100 μm that is B-staged by impregnating a varnish mainly composed of an epoxy resin using a glass fiber woven fabric as a reinforcing material and drying. For film 2, polyethylene terephthalate (PET) having a thickness of 20 μm was used. If necessary, the film 2 may be coated with a thermosetting resin such as an epoxy resin. The bonding method is the same as that shown in the first embodiment. However, since the film 2 is disposed only on one side, the release property is increased so that the substrate material 1 does not adhere to the heat roll. It is preferable to take measures such as holding the release sheet and attaching the release sheet to the side where the film 2 is not present and peeling it off.

  Thereafter, as shown in FIG. 4B, a via hole 4 having a diameter of about 200 μm was processed using a carbon dioxide laser.

  Thereafter, as shown in FIG. 4C, the absorbent sheet 15 is laid under the substrate material 1, and the conductive paste 5 is filled into the via holes 4 using the squeegee 14. The conductive paste 5 is the same as that in the first embodiment. The absorbent sheet 15 has a function of absorbing or adsorbing some components in the conductive paste 5 as the interlayer connection means.

  It is effective to lightly suck from the lower side of the absorbent sheet 15 in terms of fixing the substrate material 1 and enhancing the filling property of the conductive paste 5 into the via hole 4.

  After filling, the resin component 16 in the conductive paste 5 penetrates into the absorbent sheet 15 as shown in FIG. In that case, it is preferable to continue the suction in order to maintain permeability and adhesion between the substrate material 1 and the absorbent sheet 15.

  Since the resin component 16 penetrates and is absorbed into the absorbent sheet 15, the conductive component such as the metal powder of the conductive paste 5, the thermosetting resin, the curing agent, and the solvent before the heating and pressurizing and integrating step described later. The ratio of the resin component 16 made of, for example, changes in the direction in which the ratio of the conductive component increases. Accordingly, the conductive paste 5 having a relatively high resin component 16 and a low viscosity is used in order to enhance the filling property to the via holes 4 and the handling property of the conductive paste 5 as a printing operation, but before heating and pressing. In addition, by discharging the resin component 16 from the via hole 4, it is possible to obtain a special effect that it is possible to increase the ratio of the conductive component and enhance the function, conductivity, and reliability as the interlayer connection means.

  Next, as shown in FIG. 4D, the absorbent sheet 15 is cut into approximately the same size as the substrate material 1 and processed into a state that is easy to handle.

  Further, as shown in FIG. 4 (e), the substrate material 1 is disposed on the copper foil 6 while being inverted upside down.

  Next, as shown in FIG. 4 (f), the absorbent sheet 15 is removed and the copper foil 6 is placed on the substrate material 1 and integrated by heating and pressing to obtain a shape as shown in FIG. 4 (g). When removing the absorbent sheet 15, it is preferable to remove the absorbent sheet 15 by pulling it in the shearing direction, that is, in the lateral direction in the figure, with respect to the contact portion between the interlayer connecting means and the sheet material so that the conductive paste 5 is not removed.

  In this state, the conductive paste 5 is compressed and develops an electrical interlayer connection. The absorption of the resin component 16 by the absorbent sheet 15 is effective in increasing the conductive powder ratio of the conductive paste 5 in the via hole 4.

  Next, unnecessary portions are cut to obtain a double-sided circuit forming substrate shown in FIG.

  In the present embodiment, the substrate material 1 and the absorbent sheet 15 are in close contact with each other in the state of FIG. 4D, and the rigidity is improved as compared with the case of the substrate material 1 alone, so that the handling property is improved. The adhesion between the substrate material 1 and the absorbent sheet 15 can be maintained by the viscosity of the conductive paste 5 because the number of via holes 4 per unit area is large in the actual process, but the adhesive sheet 15 has a slight adhesion. It is also effective to have sex.

  The material of the absorbent sheet 15 may be a porous resin sheet made of a resin such as polypropylene, or paper.

  It is also effective to apply a thermoplastic resin diluted with a solvent or the like in order to give the surface of such a material tackiness.

  In the inventor's experiment, good results were obtained using paper having a thickness of 50 μm.

  Moreover, after peeling the absorption sheet 15 in the state of FIG.4 (d), the method of mounting on the copper foil 6 without reversing or reversing board | substrate material is also employable.

(Embodiment 3)
5 (a) to 5 (h) are process cross-sectional views illustrating a method for manufacturing a circuit forming substrate and a material for manufacturing the circuit forming substrate according to Embodiment 3 of the present invention.

  5A to 5B are the same as those in the second embodiment.

  Next, as shown in FIG. 5C, a copper foil 6 a is laid on the lower side of the substrate material 1 and the conductive paste 5 is filled using a squeegee 14.

  By holding for a certain period of time in the state of FIG. 5C or the state of FIG. 5D, the resin component 16 diffuses on the copper foil 6a as shown in FIG. 5D. That is, it can be said that the copper foil 6a as the metal foil has a function of absorbing or adsorbing some components in the conductive paste 5 which is the interlayer connection means.

  In the inventor's experiment, the effect became remarkable by holding for 10 seconds or more. Heating at that time also has the effect of promoting the diffusion by lowering the viscosity of the resin component 16.

  Moreover, diffusion can be accelerated | stimulated like the capillary phenomenon by raising the roughness of the copper foil 6a surface. According to the inventor's verification, the effect was confirmed when the 10-point average roughness Rz was 5 μm or more, preferably 10 μm or more. Next, it is turned upside down with the copper foil 6a in close contact with the substrate material 1 and placed on the copper foil 6 as shown in FIG. The handling at that time is an easy operation since the rigidity is ensured because the copper foil 6 a is in close contact with the substrate material 1.

  In addition, it is also effective in handling and other aspects to partially bond the substrate material 1 to the copper foil 6 or 6a with a heater tool or the like as necessary.

  By holding for a certain period of time in the state of FIG. 5 (e), the resin component 16 diffuses also on the copper foil 6 as shown in FIG. 5 (f).

  In addition, as a preparatory work for the heating and pressing step described later, in the state of FIG. 5 (e), the substrate material 1 is sandwiched between mirror plates such as stainless steel and introduced into the heating and pressing device to perform heating press. Even in the form, the effect of the present invention can be obtained by providing a holding time while being sandwiched between the mirror plates. In such a case, the effect can be seen from approximately 10 minutes or more, but a remarkable effect can be obtained with a retention time of preferably 60 minutes or more.

  By heating and pressing in this state, the integral molding and the resin of the substrate material 1 are cured, and a configuration as shown in FIG. 5G is obtained, and surrounding unnecessary portions are cut, as shown in FIG. Such a double-sided substrate is obtained. Thereafter, a desired circuit is formed to obtain a double-sided circuit forming substrate.

  In such a configuration, as shown in FIG. 5H, the resin component 16 is cured around the via hole 4, that is, the interlayer connection forming portion, in a form integrated with the resin of the substrate material 1. It is also possible to obtain an effect of increasing the adhesive force between the copper foil 6 and the substrate material 1 around the via hole 4 by adjusting the composition of.

  In the verification by the inventor, it has been confirmed that by adopting, as an example, an epoxy resin modified with silicon as the resin component 16, flexibility is partially imparted and adhesion is increased. In particular, it was effective against acceleration stress such as drop impact.

  That is, when an electronic component is soldered to the copper foil 6 to form an electronic device, when a drop impact test is performed as the electronic device, a large stress is applied to the soldered electronic component and the copper foil 6 is peeled off. However, it was possible to improve the impact resistance by arranging a flexible resin under the copper foil 6 using the configuration of the present invention.

  In a circuit-formed substrate having such a configuration, the copper foil in the via hole 4 is often referred to as a pad-on-via that becomes a land when a component is mounted, and increasing the adhesive force between the substrate material 1 and the copper foil 6 is a circuit. This leads to improved reliability of the formation substrate.

  The use of the above-mentioned silicon-modified resin or the like as the substrate material 1 is often difficult to employ because it reduces the material cost and the bending rigidity of the circuit forming substrate. Even in such a case, the application of the embodiment of the present invention can improve the adhesive strength of a necessary part.

  Further, as described in the second embodiment, the effect of improving the interlayer connection quality by the conductive paste 5 due to the diffusion of the resin component 16 can also be obtained in this embodiment.

  In this embodiment, the film 2 is pasted on one side of the substrate material 1 as a starting material. However, even when the film 2 is pasted on both sides, the effect of the diffusion of the resin component 16 on the copper foil 6 ensures the holding time. It is possible to make effective.

  In that case, as shown in Embodiment 2, the structure which fills the electrically conductive paste 5 on an absorption sheet is also employable. In that case, after peeling a film, it mounts on the copper foil 6a, and the effect of this application can be exhibited by providing holding time more than fixed time.

  As an example of the material described as the substrate material, that is, the prepreg in Embodiments 1 to 3 described above, it is possible to use a normal glass fiber woven fabric or non-woven fabric impregnated with a thermosetting resin to form a B stage. Organic fibers such as aramid can be used instead of glass fibers.

  Further, it is possible to use a B stage material made of a B stage film or a resin film such as polyimide and an adhesive instead of the prepreg.

  Moreover, it is also possible to use the material which mixed the woven fabric and the nonwoven fabric, for example, the material which inserted | pinched the glass fiber nonwoven fabric between two glass fibers as a reinforcing material.

  In addition, examples of the portion of the thermosetting resin described as the substrate material or the thermosetting resin in the embodiment of the present invention include an epoxy resin, an epoxy / melamine resin, an unsaturated polyester resin, a phenol resin, Polyimide resin, cyanate resin, cyanate ester resin, naphthalene resin, urea resin, amino resin, alkyd resin, silicon resin, furan resin, polyurethane resin, aminoalkyd resin, acrylic resin , A fluororesin, a polyphenylene ether resin, a cyanate ester resin or the like alone, or a thermosetting resin composition mixed with two or more kinds or a thermosetting resin composition modified with a thermoplastic resin can be used, If necessary, a flame retardant or an inorganic filler can be added.

  Further, the present invention can be applied not only to manufacturing a double-sided circuit forming substrate but also to a multilayer circuit forming substrate as described in the conventional example.

  In addition, the conductive paste has been described as the interlayer connection means, but as the conductive paste, conductive particles such as copper powder kneaded with a thermosetting resin containing a curing agent, conductive particles and a hot press are used. Various compositions such as a polymer material having an appropriate viscosity that is sometimes discharged into the substrate material, or a kneaded solvent or the like can be used.

  In addition to the conductive paste, post-shaped conductive protrusions formed by plating or the like, or conductive particles having a relatively large particle size that are not made into a paste can be used alone as an interlayer connection means.

  The present invention can also be applied when a plating through hole or the like is used as an interlayer connection means. In other words, even when the interlayer connection means is not disposed on the substrate material before lamination, when handling is difficult because the substrate material is thin, the use of a deflection preventing material, etc. as described above is used. Is effective.

  As described above, the reliability of electrical connection between layers using interlayer connection means such as conductive paste is greatly improved regardless of the thickness and size of the substrate material, and a high-quality high-density circuit-formed substrate is provided. It can be said that industrial applicability is great.

Process sectional drawing which shows the manufacturing method of the circuit formation board | substrate in Embodiment 1 of this invention Sectional drawing and perspective view which show the manufacturing method of the circuit formation board | substrate in the embodiment Sectional drawing which shows the manufacturing method of the circuit formation board | substrate in the embodiment Process sectional drawing which shows the manufacturing method of the circuit formation board in Embodiment 2 of this invention Process sectional drawing which shows the manufacturing method of the circuit formation board | substrate in Embodiment 3 of this invention Process sectional drawing which shows the manufacturing method of the circuit formation board in a prior art example Process sectional drawing which shows the manufacturing method of the circuit formation board in a prior art example

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate material 2 Film 3 Metal sheet 4 Via hole 5 Conductive paste 6, 6a Copper foil 7 Circuit 8 Groove 9 Stocker 10 Pin 11 Crosspiece 12 Holding pin 13 Non-slip material 14 Squeegee 15 Absorbing sheet 16 Resin component

Claims (21)

A method of manufacturing a circuit-formed substrate, comprising a step of simultaneously or sequentially bonding or temporarily fixing a cover film and a deflection preventing material to a substrate material. The method for manufacturing a circuit-formed substrate according to claim 1, wherein the deflection preventing material is a metal material. 2. The method of manufacturing a circuit forming substrate according to claim 1, wherein a strength improving groove is formed in the deflection preventing material. A method of manufacturing a circuit-formed substrate, comprising: a substrate material provided with an interlayer connection means and a stocker for holding the substrate material; Circuit formation characterized in that a magnetic material is applied, bonded or temporarily bonded to a substrate material before being placed on the stocker, and a magnetic material adsorbing means is provided at a location corresponding to the position of the magnetic material of the stocker A method for manufacturing a substrate. A magnetic material adhering means is provided at a position corresponding to the position of the magnetic material in a facility for holding or transporting the substrate material in the manufacturing equipment. A method for manufacturing a circuit-formed substrate. In the process of arranging the conductive paste or the interlayer connection means mainly composed of the conductive paste on the substrate material or before the process, a sheet material that absorbs or adsorbs a partial component in the interlayer connection means on one side of the substrate material. A method for producing a circuit-formed substrate, wherein the sheet material is peeled off in the step of bonding or temporary bonding and laminating with one or more of a metal foil, a core circuit-forming substrate or a substrate material. A step of pasting a cover film on one side of the substrate material, and a step of providing a substrate material cover film before or after the step of arranging an interlayer connection means mainly composed of conductive paste or conductive paste on the substrate material; After adhering or temporarily adhering or temporarily placing a sheet material that absorbs or adsorbs some of the components in the interlayer connection means to the opposite surface that is pasted, a holding time is provided to provide the partial components in the interlayer connection means to the sheet material A method for producing a circuit-formed substrate, characterized in that, after absorption or adsorption, pressurization and heating are performed simultaneously or with a time difference, either sequentially or separately to form an integrated laminate. In the step of arranging the conductive paste or the interlayer connection means mainly composed of the conductive paste on the substrate material, or before the process, a metal foil that absorbs or adsorbs a part of the components in the interlayer connection means on one side of the substrate material. A method of manufacturing a circuit-formed substrate, comprising: laminating one or more of a metal foil, a core circuit-formed substrate, or a substrate material after bonding or temporary bonding. In the process of disposing the conductive paste or the interlayer connection means mainly composed of the conductive paste on the substrate material, or before or after the process, a part of the interlayer connection means is absorbed or adsorbed on one or both sides of the substrate material. After the metal foil is bonded or temporarily bonded or temporarily placed, a holding time is provided, and after a partial component in the interlayer connection means is absorbed or adsorbed to the metal foil, pressurization and heating are performed simultaneously or sequentially with a time difference or A method for manufacturing a circuit-formed substrate, which is performed separately and is an integrated laminate. A step of pasting a cover film on one side of the substrate material, and a step of providing a substrate material cover film before or after the step of arranging an interlayer connection means mainly composed of conductive paste or conductive paste on the substrate material; Adhering or temporarily bonding or temporarily placing a metal foil that absorbs or adsorbs some components in the interlayer connection means to the opposite surface that is pasted, and then provides a holding time to absorb some components in the interlayer connection means to the metal foil Alternatively, after adsorbing, a method for producing a circuit-formed substrate is characterized in that pressurization and heating are performed simultaneously or sequentially or separately with a time difference to obtain an integrated laminate. 2. The circuit-formed substrate according to claim 1, wherein the position of the deflection preventing material is adjusted before the step of adhering or temporarily fixing so that the position of the deflection preventing material is a constant position based on the outer shape of the substrate material. Method. The method for manufacturing a circuit-formed substrate according to claim 12, wherein the position of the deflection preventing material is arranged at a position that does not remain in the product size when the substrate material is cut into the product size. The method for manufacturing a circuit-formed substrate according to claim 1, wherein the deflection preventing material is made of a thermoplastic resin. 8. The method of manufacturing a circuit-formed substrate according to claim 7, wherein the sheet material is peeled from the substrate material by pulling in a shearing direction with respect to a contact portion between the interlayer connection means and the sheet material. The method for manufacturing a circuit-formed substrate according to claim 7 or 8, wherein the sheet material is paper. The method for manufacturing a circuit-formed substrate according to claim 7 or 8, wherein the sheet material is a porous resin sheet. 12. The method for producing a circuit forming substrate according to claim 9, wherein the average roughness of the surface of the metal foil is 5 μm or more, preferably 10 μm or more in terms of 10-point average roughness Rz. 12. The method for manufacturing a circuit forming substrate according to claim 9, wherein the conductive paste or the interlayer connecting means mainly composed of the conductive paste contains a silicon-modified epoxy resin as a resin component. A material for manufacturing a circuit-formed substrate, wherein the substrate material is provided with a deflection preventing material or a cover film and a deflection preventing material. A material for manufacturing a circuit-formed substrate, comprising a cover film on one side of the substrate material and a sheet material on the other side, wherein the sheet material can absorb liquid or fluid resin.

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