JP2005134528A - Optical fiber array, storage structure of the optical fiber array and optical fiber bundle having the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical fiber array which is less expensive than a conventional optical fiber array. <P>SOLUTION: The optical fiber array is provided with a V groove substrate 5a in which a plurality of grooves are formed on the surface from one of the substrate tips to the other substrate tip so as to be extended in a mutually parallel manner, a plurality of coated optical fibers 1 having coated sections 1b and coating removed portions 1a, and a cover substrate 5b which holds the coating removed portions 1a of the plurality of coated optical fibers 1 with the V groove substrate 5a. The tip side portions of the coating removed portions 1a are combined by first adhesive whose viscosity is equal to or less than 0.8 Pa s. Between the base tip side portions of the coating removed portions 1a and between the coated optical fibers 1 and the both substrates are combined by second adhesive whose Young's modulus after being cured is equal to or greater than 2000 MPa and the thermal expanding coefficient is equal to or less than 40x10<SP>-6</SP>/°C and the external is covered by a third joint section made of third adhesive whose viscosity is equal to or greater than 100 Pa s and the Young's modulus after being cured is equal to or less than 1.8 MPa. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an optical fiber array, an optical fiber array housing structure, and an optical fiber bundle including them.

  In recent years, optical fiber arrays in which optical fiber core wires are arranged with high accuracy have been widely used regardless of communication fields and non-communication fields.

  FIG. 9 is a perspective view of a conventional optical fiber array 30a disclosed in Patent Literature 1 and Patent Literature 2. As shown in FIG. In FIG. 9, the adhesive layer for fixing the optical fiber core wire is omitted. FIG. 10 is a schematic cross-sectional view of the optical fiber array 30a in the fiber axis direction.

  The optical fiber array 30a includes a V-groove substrate 6a, a lid substrate 6b that is attached to the surface of the V-groove substrate 6a, and an optical fiber core wire 1 that is sandwiched between the V-groove substrate 6a and the lid substrate 6b. And adhesive layers 15a and 15b for adhering them.

  The V-groove substrate 6a has an upper V-groove forming portion A having a plurality of V-grooves formed from one end to the other end so as to extend in parallel with each other, and a flat surface (lower stage). And a plane portion B.

  The lid substrate 6b is provided so as to cover the upper V groove forming portion A of the V groove substrate 6a.

  The optical fiber core wire 1 has a coating made of resin on the periphery of an optical fiber. The coating portion 1b remains coated, and the coating portion from which the coating portion 1b at the end of the fiber is removed. The removal part 1a is comprised.

  The front end side portion of the covering portion removal portion 1a of the optical fiber core wire 1 is accommodated in the V groove on the V groove substrate 6a, and is formed between the upper V groove forming portion A of the V groove substrate 6a and the lid substrate 6b. It is sandwiched between them and fixed between the substrates by an adhesive layer 15a.

  On the other hand, the base end side portion of the covering portion removal portion 1a and the covering portion 1b of the optical fiber core wire 1 are fixed to the V-groove substrate 6a and the lid substrate 6b by the adhesive layer 15b.

  FIG. 11 is a schematic cross-sectional view of the conventional optical fiber array 30b disclosed in Patent Document 3 in the fiber axis direction.

  The optical fiber array 30b has three types of adhesive layers, a first adhesive layer 15a, a second adhesive layer 15c, and a third adhesive layer 15d.

  The first adhesive layer 15a is made of a first adhesive having a viscosity of 10 Pa · s or less and a Young's modulus after curing of 500 MPa or more, and includes an upper V groove forming portion A and a lid substrate 6b of the V groove substrate 6a. Is glued. Thereby, the front end side portion of the covering portion removal portion 1a of the optical fiber core wire 1 is fixed between the upper V groove forming portion A of the V groove substrate 6a and the lid substrate 6b.

  The second adhesive layer 15c is made of a second adhesive having a viscosity higher than that of the first adhesive, and is provided at the rear end portion of the optical fiber array 30b. Thereby, the coating | coated part 1b of the optical fiber core wire 1 is fixed to the (lower stage) plane part B of the V-groove board | substrate 6a.

  The third adhesive layer 15d is made of a third adhesive having a smaller Young's modulus after curing than the first adhesive and covers the first adhesive layer 15a and the second adhesive so as to cover the covering portion removal portion 1a of the optical fiber core wire 1. It is provided between the adhesive layer 15c. Thereby, the base end side part of the coating | coated part removal part 1a of the optical fiber core wire 1 is fixed to the V-groove board | substrate 6a.

In the optical fiber array 30b, the first adhesive layer 15a and the second adhesive layer 15c can have sufficient resistance without stress concentration in the bonded portion against the tensile load in the fiber length direction. In addition, it is described that the third adhesive layer 15d can reduce thermal contraction of the covering portion removal portion 1a of the optical fiber core wire 1 and can reduce an increase in transmission loss.
JP 2001-343547 A Japanese Patent No. 3259715 JP 2003-215392 A

  However, as typified by Patent Documents 1, 2, and 3, the V-groove substrate 6a constituting the conventional optical fiber array has an L-shaped cross section in the fiber axis direction, and a plurality of V-grooves are formed. A two-stage structure having an upper V-groove forming portion A for disposing the covering portion removal portion 1a of the optical fiber core wire 1 and a flat surface portion B for disposing the covering portion 1b of the optical fiber core wire 1 (lower step); It has become.

  The size of the step between the upper V groove forming portion A and the (lower) flat portion B is determined by the size of the diameter of the covering portion removing portion 1a of the optical fiber core wire 1, the size of the diameter of the covering portion 1b, and the V groove. It is determined by the depth and angle of the. Therefore, the manufacture of the V-groove substrate 6a requires high-precision processing and two-step processing of the upper V-groove forming portion A and the (lower) flat surface portion B, which is complicated and expensive. There is a problem of end.

  This invention is made | formed in view of this point, The place made into the objective is providing the optical fiber array cheaper than before.

An optical fiber array of the present invention includes a groove substrate having a plurality of grooves formed on one surface from one substrate end to the other substrate end so as to extend in parallel with each other, and an optical fiber and the optical fiber, respectively. A plurality of optical fiber core wires each having a covering portion to be covered, the covering portion being removed at an end of the fiber, and a tip side portion of the covering portion removing portion being accommodated in each of the grooves of the groove substrate; A lid substrate provided so as to sandwich the plurality of optical fiber cores with the substrate, and a tip side portion of a covering portion removing portion of the plurality of optical fiber core wires And the first adhesive part made of the first adhesive that joins the groove substrate and the lid substrate, and the base end side part of the covering part removal part of the plurality of optical fiber cores, and From the second adhesive that bonds to the groove substrate and lid substrate A second adhesive part, and a third adhesive part made of a third adhesive that binds to the second adhesive part and integrates the parts covered with the covering parts of the plurality of optical fiber core wires, The first adhesive has a viscosity of 0.8 Pa · s or less, and the second adhesive has a Young's modulus after curing of 2000 MPa or more and a thermal expansion coefficient of 40 × 10 ^−6. The third adhesive has a viscosity of 100 Pa · s or more and a Young's modulus after curing of 1.8 MPa or less.

  According to said structure, it is a simple 1 step | paragraph structure which has the several groove | channel formed in the surface from one board | substrate end to the other board | substrate end so that a groove | channel board | substrate may extend in parallel mutually, A groove substrate can be manufactured at low cost.

  In addition, the first adhesive that joins the tip side portion of the coated fiber removal portion of the optical fiber core wire to the groove substrate and the lid substrate has a viscosity of 0.8 Pa · s or less, so that it is easy to apply the adhesive. become.

The second adhesive bonded to the groove substrate and the lid substrate has a Young's modulus after curing of 2000 MPa or more, while integrating the base end side portions of the covering portion removal portion of the optical fiber core wire, and Since the coefficient of thermal expansion is 40 × 10 ⁻⁶ / ° C. or less, the hardness after curing is high, so that the durability of the coated portion removal portion of the optical fiber core wire is increased, and deformation due to temperature change is small. Therefore, disconnection of the optical fiber core wire can be suppressed.

  Further, the third adhesive uniting the parts coated with the coating part of the optical fiber core wire and bonding to the second adhesive part has a viscosity of 100 Pa · s or more and the Young's modulus after curing. Is 1.8 MPa or less, and since the viscosity is high, the application of the adhesive is facilitated, the hardness after curing is low, and the elasticity is high, so that the third adhesive portion functions as a buffer material. The optical fiber core can be protected.

  As a result, the optical fiber array of the present invention is low in cost while maintaining appropriate durability.

  In the optical fiber array of the present invention, the plurality of grooves may be formed on each of an upper surface and a lower surface of the groove substrate.

  According to the above configuration, since the plurality of grooves are formed on both the upper surface and the lower surface of the groove substrate, a plurality of rows of optical fiber cores can be arranged with high accuracy.

  In addition, since the groove substrate has a simple one-stage structure having a plurality of grooves formed on both sides so that the groove substrates extend in parallel with each other, a conventionally required coating portion of the optical fiber core wire is disposed. Since the thickness of the groove substrate can be reduced as much as the lower flat portion is not provided, the optical fiber core wire disposed on the upper surface of the groove substrate and the optical fiber core wire disposed on the lower surface of the groove substrate The optical fiber core wire can be arranged at a higher density.

  In the optical fiber array of the present invention, the rear end position of the groove substrate may be behind the rear end position of the lid substrate.

  According to the above configuration, since the rear end position of the groove substrate is behind the rear end position of the lid substrate, the covering portion removal portion of the optical fiber core wire is subjected to the load from the side of the optical fiber array. Since stress is less likely to concentrate at the rear end position of the groove substrate, it is possible to suppress the bending of the optical fiber core wire.

  The optical fiber bundle of the present invention includes the optical fiber array of the present invention.

  According to the above configuration, the optical fiber array of the present invention not only has low cost and high durability, but also the optical fiber cores are arranged with high accuracy and high density. The optical fiber bundle not only has low cost and high durability, but also has the optical fiber core wires arranged with high accuracy and high density.

The optical fiber array housing structure of the present invention is an optical fiber array housing structure in which the optical fiber array of the present invention is housed in a housing, and is a fourth adhesive for joining the groove substrate and lid substrate to the housing. A fourth adhesive portion made of an agent, and a fifth adhesive portion made of a fifth adhesive for integrating the optical fiber array and the housing, wherein the fourth adhesive has a Young's modulus after curing. Is 3000 MPa or more, the coefficient of thermal expansion is 40 × 10 ⁻⁶ / ° C. or less, and the fifth adhesive has a Young's modulus after curing of 1.5 MPa or less.

According to said structure, the 4th adhesive agent which couple | bonds a groove | channel board | substrate and a lid | cover board | substrate, and a housing | casing has a Young's modulus after hardening of 3000 MPa or more, and a thermal expansion coefficient of 40 × 10 ⁻⁶ / ° C. or less. Therefore, since the hardness is high, the groove substrate, the lid substrate, and the housing can be firmly fixed, and the occurrence of deviation between them can be suppressed.

  In addition, the fifth adhesive that integrates the optical fiber array and the housing has a low Young's modulus after curing as low as 1.5 MPa and has elasticity, so the fifth adhesive portion acts as a buffer material, and light The fiber array and the optical fiber core can be protected.

  An optical fiber bundle according to the present invention includes the optical fiber array housing structure according to the present invention.

  According to the above configuration, the optical fiber array housing structure of the present invention not only has low cost and high durability, but also the optical fiber core wires are arranged with high accuracy and high density. The optical fiber bundle incorporating the housing structure is not only low cost and high in durability, but also the optical fiber core wires are arranged with high accuracy and high density.

  As described above, the optical fiber array of the present invention has a simple one-stage surface having a plurality of grooves formed from one substrate end to the other substrate end so that the groove substrates extend in parallel with each other. Due to the structure, the cost is low.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiment, and may have other configurations.

  FIG. 1 is a schematic cross-sectional view in the fiber axis direction of an optical fiber array 50 according to an embodiment of the present invention.

  The optical fiber array 50 is sandwiched between a V-groove substrate 5a as a groove substrate, a pair of lid substrates 5b attached to the upper and lower surfaces of the V-groove substrate 5a, and the V-groove substrate 5a and the lid substrate 5b. The optical fiber core wire 1 and the 1st adhesion part 10, the 2nd adhesion part 11, and the 3rd adhesion part 12 which adhere | attach between them are provided.

  The optical fiber core wire 1 has a coating made of resin on the periphery of an optical fiber. The coating portion 1b remains coated, and the coating portion from which the coating portion 1b at the end of the fiber is removed. The removal part 1a is comprised.

  The V-groove substrate 5a is made of silicon, quartz, zirconia or the like, and as shown in FIG. 2, a plurality of V-grooves extending in parallel to each other are formed on the upper and lower surfaces thereof.

  The V groove is formed by cutting the substrate into a V shape using a diamond disk or the like. If a silicon substrate is used for the V-groove substrate 5a, the V-groove can be formed with high accuracy using anisotropic etching.

  The lid substrate 5b is made of the same material as the V-groove substrate 5a, but may be made of other materials, and at least the covering portion removing portion 1a of the optical fiber core wire 1 is sandwiched between the lid substrate 5b and the V-groove substrate 5a. The rear end position of the V-groove substrate 5a is rearward of the rear end position of the lid substrate 5b. As a result, stress hardly concentrates on the rear end position of the V-groove substrate 5a of the covering portion removal portion 1a of the optical fiber core wire 1 with respect to the load from the side of the optical fiber array 50. The bending of the core wire 1 can be suppressed.

  Here, FIGS. 5 and 6 are schematic cross-sectional views showing the relationship between the rear end position of the V-groove substrate 5a and the rear end position of the lid substrate 5b.

  FIG. 5 shows the optical fiber array 40a when the rear end position of the V-groove substrate 5a and the rear end position of the lid substrate 5b 'coincide.

  In this optical fiber array 40a, stress tends to concentrate on the load a from the side of the optical fiber array at the position a of the covering portion removal portion 1a of the optical fiber core wire 1, and the optical fiber core wire 1 is positioned at the position a. There is a risk of breaking.

  FIG. 6 shows the optical fiber array 40b when the rear end position of the V-groove substrate 5a is ahead of the rear end position of the lid substrate 5b ″.

  The optical fiber array 40b has a structure in which it is difficult to apply an adhesive to the side wall portion b at the rear end of the V-groove substrate 5a.

  For the above reasons, the lid substrate 5b needs to be formed so that the rear end position of the V-groove substrate 5a is behind the rear end position of the lid substrate 5b.

  The 1st adhesion part 10 consists of the 1st adhesives, and joins the tip side part of covering part removal part 1a of optical fiber core wire 1, V groove substrate 5a, and lid substrate 5b.

The first adhesive is, for example, an epoxy resin adhesive, has a viscosity of 0.8 Pa · s or less, a Young's modulus after curing of 2000 MPa or more, and a thermal expansion coefficient of 60 × 10 ⁻⁶ / ° C. It is as follows. Thereby, since the first adhesive has a low viscosity, it is easy to apply the adhesive when manufacturing the optical fiber array.

  The second adhesive portion 11 is composed of a second adhesive, and integrates the base end side portions of the covering portion removing portion 1a of the optical fiber core wire 1 and is coupled to the V-groove substrate 5a and the lid substrate 5b. To do.

The second adhesive is, for example, an epoxy resin-based adhesive having a viscosity of 50 Pa · s or less, a Young's modulus after curing of 2000 MPa or more, and a thermal expansion coefficient of 40 × 10 ⁻⁶ / ° C. or less. is there. Thereby, since the second adhesive has a high hardness after curing, the durability of the covering portion removing portion 1a of the optical fiber core wire 1 is increased, and deformation due to a temperature change is small. 1 disconnection can be suppressed.

  The third adhesive portion 12 is composed of a third adhesive, and integrates the portions covered by the covering portion 1 b of the optical fiber core wire 1 and also bonds to the second adhesive portion 11.

This third adhesive is, for example, an epoxy resin-based adhesive having a viscosity of 100 Pa · s or more, a Young's modulus after curing of 1.8 MPa or less, and a thermal expansion coefficient of 1.4 × 10 ^−4. / ° C or less. Accordingly, since the third adhesive has a high viscosity, the application work of the adhesive is facilitated, and the hardness after curing is low and has elasticity, so that the third adhesive portion 12 functions as a cushioning material. The optical fiber core wire 1 can be protected.

  The optical fiber array 50 of the present invention is low in cost while maintaining appropriate durability by properly using the first adhesive, the second adhesive, and the third adhesive as described above.

  7 and 8 are schematic cross-sectional views in the fiber axis direction of conventional optical fiber arrays 30b and 30c in which a plurality of optical fiber cores 1 are arranged.

  The optical fiber array 30b includes an upper V-groove forming portion A in which a plurality of V-grooves shown in FIGS. 9 and 10 are formed and the covering portion removing portion 1a of the optical fiber core wire 1 is disposed, and an optical fiber core wire. A pair of optical fiber arrays 30a each composed of a two-stage V-groove substrate 6a having a flat surface portion B on which one covering portion 1b is disposed (lower stage) are simply overlapped with each other with an adhesive. It is made by bonding. In this case, the alignment between the upper and lower optical fiber arrays 30a needs to be highly accurate, and the positional accuracy of the optical fiber core wire 1 may be deteriorated between the upper and lower columns.

  The optical fiber array 30c also includes an upper V-groove forming portion A in which a plurality of V-grooves are formed and a covering portion removing portion 1a of the optical fiber core wire 1 is disposed, and a covering portion 1b of the optical fiber core wire 1 is disposed. A (middle stage) plane part B, and a lower stage V groove forming part C in which a plurality of V grooves are formed on the opposite side of the upper stage V groove forming part A and the covering part removing portion 1a of the optical fiber core wire 1 is disposed; Is formed of a V-groove substrate 6a ′ having a three-stage structure. In this case, the positional accuracy of the optical fiber core wire 1 is increased between the upper and lower rows, but the processing of the V-groove substrate 6a 'is complicated, and the cost of the optical fiber array 30c may be increased.

  On the other hand, the optical fiber array 50 of the present invention has a simple structure having a plurality of V grooves formed on both sides from one substrate end to the other substrate end so that the V groove substrates 5a extend in parallel with each other. It has a single-stage structure, and the positional accuracy of the optical fiber core 1 between the upper and lower rows is increased, and a conventionally required coating portion 1b of the optical fiber core 1 is disposed (middle stage). Since the flat portion B is not provided, the thickness of the V-groove substrate 5a can be reduced. Therefore, the optical fiber core wire 1 disposed on the upper surface of the V-groove substrate 5a and the lower surface of the V-groove substrate 5a are disposed. The distance from the optical fiber core 1 to be shortened is reduced, and the optical fiber core 1 can be disposed at a high density.

  Next, the manufacturing method of the optical fiber array 50 concerning embodiment of this invention is demonstrated.

  First, a plurality of optical fiber core wires 1, a V-groove substrate 5a, a pair of lid substrates 5b, and first, second, and third adhesives are prepared.

  Next, the coating portion 1b at the fiber end of the optical fiber core wire 1 is removed to form a coating removal portion 1a at the fiber end.

  Next, the coating removal portion 1a of the optical fiber core wire 1 is accommodated in each V groove on the upper surface of the V groove substrate 5a, and a plurality of optical fiber core wires 1 are arranged.

  Next, the first adhesive is applied to each V-groove and the upper surface of the V-groove substrate 5a in which the coating removal portions 1a of the plurality of optical fiber cores 1 are accommodated. Here, since the first adhesive has a low viscosity, it is easy to perform the application work, and the adhesive easily spreads throughout the V-groove.

  Next, the lid substrate 5b is applied to the portion where the first adhesive is applied.

  Next, the first adhesive is cured to form the first adhesive portion 10, and the V-groove substrate 5a, the lid substrate 5b, and the coating removal portion 1a of each optical fiber core wire 1 are fixed.

  Next, for each V groove on the lower surface of the V groove substrate 5a, the coating removal portion 1a of the optical fiber core wire 1 is fixed between the V groove substrate 5a and the lid substrate 5b by using the same method as that for the upper surface.

  Next, between the coating removal portions 1a of the optical fiber cores 1 protruding from the V-groove substrate 5a and the lid substrate 5b, and between the coating removal portion 1a and the V-groove substrate 5a and the lid substrate 5b, Pour the second adhesive.

  Next, the second adhesive is cured to form the second adhesive portion 11, and the V-groove substrate 5 a and the lid substrate 5 b and the coating removal portion 1 a of each optical fiber core wire 1 are fixed.

  Next, a third adhesive is applied so as to cover the second adhesive portion 11. Here, since the third adhesive has a high viscosity, the application work can be performed without flowing out on the surface of the second adhesive portion 11.

  Next, the third adhesive is cured to form the third adhesive portion 12.

  As described above, the optical fiber array 50 of the present invention can be manufactured.

  FIG. 3 is a schematic cross-sectional view in the fiber axis direction of the optical fiber array housing structure 60 according to the embodiment of the present invention.

  The optical fiber array housing structure 60 includes the optical fiber array 50 of the present invention, a housing 5c that houses the optical fiber array 50, and a fourth bonding portion 13 and a fifth bonding portion 14 that bond between them. ing.

  The housing 5c is made of stainless steel, copper, aluminum, or the like, and is formed so that the optical fiber array 50 is fitted therein.

  It comprises the fourth adhesive portion 13 and the fourth adhesive, and joins the V-groove substrate 5a and the lid substrate 5b to the housing 5c.

The fourth adhesive is, for example, an epoxy resin-based adhesive having a viscosity of 7 Pa · s or less, a Young's modulus after curing of 3000 MPa or more, and a thermal expansion coefficient of 40 × 10 ⁻⁶ / ° C. or less. is there. As a result, the fourth adhesive has a very high hardness after curing, and deformation due to temperature is small, so that the V-groove substrate 5a, the lid substrate 5b, and the housing 5c can be firmly fixed, and the shift therebetween. Can be suppressed.

  The fifth adhesive portion 14 is composed of a fifth adhesive, and integrates the optical fiber array 50 and the housing 5c.

The fifth adhesive is, for example, an epoxy resin-based adhesive having a viscosity of 4 Pa · s or less, a Young's modulus after curing of 1.5 MPa or less, and a thermal expansion coefficient of 2.8 × 10 ^−4. / ° C or less. Thereby, since the fifth adhesive has low hardness after curing and has elasticity, the fifth adhesive portion 14 functions as a cushioning material and can protect the optical fiber array 50 and the optical fiber core wire 1. it can.

  The optical fiber array housing structure 60 of the present invention is low in cost while maintaining appropriate durability by properly using the fourth adhesive and the fifth adhesive as described above.

  Next, the manufacturing method of the optical fiber array accommodation structure 60 concerning embodiment of this invention is demonstrated.

  First, the optical fiber array 50, the housing 5c, and the fourth and fifth adhesives are prepared.

  Next, a fourth adhesive is applied to at least one surface of the pair of lid substrates 5b constituting the optical fiber array 50.

  Next, the optical fiber array 50 is inserted into the housing 5c.

  Next, the fourth adhesive is cured to form the fourth adhesive portion 13, and the housing 5c and the lid substrate 5b of the optical fiber array 50 are fixed.

  Next, a fifth adhesive is poured between the inner wall of the housing 5 c and the optical fiber array 50.

  Next, the fifth adhesive is cured to form the fifth adhesive portion 14, and the inner wall of the housing 5c and the optical fiber array 50 are fixed.

  As described above, the optical fiber array housing structure 60 of the present invention can be manufactured.

  FIG. 4 is a schematic configuration diagram of the optical fiber bundle 100 according to the embodiment of the present invention.

  In this optical fiber bundle 100, a fiber array part 70, a branch part 80, and a connector part 90 are connected in series in order.

  The fiber array unit 70 is composed of the optical fiber array housing structure 60 of the present invention. For example, 50 optical fiber cores 1 are arrayed in two rows. The bundle of 50 optical fiber cores 1 at the rear end of the optical fiber array housing structure 60 is housed in, for example, a flexible tube made of stainless steel, and is connected to the branching portion 80 via the flexible tube. Has been.

  The branching unit 80 branches a bundle of 50 optical fiber cores 1 to each optical fiber core 1.

  For example, the connector 90 is an SMA connector attached to the end of each branched optical fiber core 1.

  In this optical fiber bundle 100, if a light source such as a semiconductor laser is attached to the terminal SMA type connector and the light source is controlled, a specific optical fiber core wire 1 arranged on the V-groove substrate 5a of the optical fiber array 50 is used. Light can be emitted.

  In such an optical fiber bundle 100, since the 50 optical fiber cores 1 are arranged with high accuracy and high density, it is possible to process the photosensitive resin on the order of several μm.

  As described above, the optical fiber array of the present invention is used as an optical element for emitting light with high precision, since a plurality of optical fiber cores are arranged with high precision. This is useful for high-precision processing machines.

It is a cross-sectional schematic diagram of the optical fiber array 50 which concerns on embodiment of this invention. It is a perspective view of the V-groove board | substrate 30 which concerns on embodiment of this invention. It is a cross-sectional schematic diagram of the optical fiber array 60 which concerns on embodiment of this invention. It is a schematic block diagram of the optical fiber bundle which concerns on embodiment of this invention. It is a cross-sectional schematic diagram of the optical fiber array 40a used as the comparative example of this invention. It is a cross-sectional schematic diagram of the optical fiber array 40b used as the comparative example of this invention. It is a perspective view of the conventional optical fiber array 30a. It is a cross-sectional schematic diagram of a conventional optical fiber array 30a. It is a cross-sectional schematic diagram of a conventional optical fiber array 30b. It is a cross-sectional schematic diagram of a conventional optical fiber array 30c. It is a cross-sectional schematic diagram of a conventional optical fiber array 30d.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical fiber core wire 1a Covering part removal part 1b Covering part 5a, 6a, 6a 'V-groove board | substrate 5b, 6b Holding board 5c Case 10 1st adhesion part 11 2nd adhesion part 12 3rd adhesion part 13 4th adhesion part 14 5th adhesion part 15a 1st adhesion layer 15b 2nd adhesion layer 15c 3rd adhesion layer 15d 4th adhesion layer 30a, 30b, 40a, 40b, 50, optical fiber array 60 Optical fiber array accommodation structure 70 Fiber arrangement part 80 Branch Part 90 connector part 100 optical fiber bundle

Claims (6)

A groove substrate having a plurality of grooves formed on the surface from one substrate end to the other substrate end so as to extend in parallel with each other;
Each of which has an optical fiber and a coating portion covering the optical fiber, the coating portion is removed at the end of the fiber, and the tip side portion of the coating portion removal portion is accommodated in each of the grooves of the groove substrate Optical fiber core wire,
A lid substrate provided so as to sandwich the plurality of optical fiber core wires with the groove substrate, and an optical fiber array comprising:
A first adhesive portion made of a first adhesive that bonds the tip side portion of the covering portion removal portion of the plurality of optical fiber core wires to the groove substrate and the lid substrate;
Integrating the base end side portions of the covering portion removal portions of the plurality of optical fiber core wires, and a second adhesive portion made of a second adhesive bonded to the groove substrate and the lid substrate;
A third adhesive portion made of a third adhesive for integrating the portions coated with the coating portions of the plurality of optical fiber core wires and bonding to the second adhesive portion;
Have
The first adhesive has a viscosity of 0.8 Pa · s or less,
The second adhesive has a Young's modulus after curing of 2000 MPa or more and a thermal expansion coefficient of 40 × 10 ⁻⁶ / ° C. or less,
The optical fiber array, wherein the third adhesive has a viscosity of 100 Pa · s or more and a Young's modulus after curing of 1.8 MPa or less. The optical fiber array of claim 1, wherein
The optical fiber array, wherein the plurality of grooves are formed on each of an upper surface and a lower surface of the groove substrate. The optical fiber array of claim 1, wherein
An optical fiber array, wherein the groove substrate has a rear end position behind a rear end position of the lid substrate.   An optical fiber bundle comprising the optical fiber array according to any one of claims 1 to 3. An optical fiber array housing structure in which the optical fiber array according to any one of claims 1 to 3 is housed in a housing,
A fourth adhesive portion made of a fourth adhesive that joins the groove substrate and the lid substrate and the housing;
A fifth adhesive portion made of a fifth adhesive for integrating the optical fiber array and the housing;
Have
The fourth adhesive has a Young's modulus after curing of 3000 MPa or more and a thermal expansion coefficient of 40 × 10 ⁻⁶ / ° C. or less,
The optical fiber array housing structure, wherein the fifth adhesive has a Young's modulus after curing of 1.5 MPa or less.   An optical fiber bundle comprising the optical fiber array housing structure according to claim 5.

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