JP2005129451A - Film-forming method, device manufacturing method, plasma display device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film-forming method capable of forming a film on a whole of the inner face of a groove with the use of a powder material with a large particle size. <P>SOLUTION: The method comprises (a) a step of lyophilically treating an inner surface of the groove 50, (b) a step of coating a binder 70 on the whole of the inner face of the groove 50 by a droplet discharge device, (c) a step of dispersing fine particles in the groove 50, (d) a step of curing the binder 70 and firmly fixing the fine particles 75 to the groove 50, and (e) a step of collecting the fine particles adhered to parts other than the groove 50. Further, by adjusting a contact angle of the binder 70 with side faces of the groove 50 in the lyophilic treatment, the binder can be made to rise in wetting along the side faces of the groove 50 at the binder coating process. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a film forming method, a device manufacturing method, a plasma display apparatus, and an electronic apparatus.

A plasma display device is known as a self-luminous image display device. FIG. 5 is an exploded perspective view of a plasma display panel (PDP). The plasma display device 500 is generally configured by a rear substrate 501 and a front substrate 502 that are disposed to face each other, and a discharge display unit 510 that includes a discharge chamber 516 formed therebetween. Address electrodes 511 are formed in stripes at predetermined intervals on the upper surface of the rear substrate 501. A partition wall 515 is formed in front of each address electrode 511, 511 in parallel with each address electrode 511. A plurality of grooves are formed by adjacent partition walls 515, and discharge chambers 516 are formed so as to correspond to these grooves. Further, a phosphor 517 is arranged from the bottom surface to the side surface of the groove.
In the plasma display device 500, the address electrode 511 and the display electrode 512 are connected to an AC power supply (not shown). Then, a discharge is generated between the address electrode 511 and the display electrode 512, and the phosphor 517 is excited to emit light in the discharge display portion 510 so that color display can be performed.

The phosphor 517 described above is formed by a printing method. Specifically, the screen on which the groove pattern is drawn is arranged on the surface of the rear substrate 501 and the phosphor dispersion liquid is applied. Thereafter, the screen is removed, and a phosphor film is formed in the groove.
Japanese Patent No. 2862674

  However, the above-described printing method has a problem that it is difficult to form a phosphor film uniformly in a fine groove portion, and it is particularly difficult to form a phosphor film on a side surface of the groove portion. . Further, even if the phosphor film is formed on the side surface of the groove, there is a problem that a part of the phosphor film is lost when the screen is removed. In this case, the phosphor film cannot be formed on the entire inner surface of the groove, and the light emission efficiency is lowered.

  A method of forming a phosphor film by applying a phosphor dispersion with a droplet discharge device is also conceivable. Note that when a film is formed using a phosphor having a small particle diameter, the luminous efficiency of the plasma display device is lowered, and therefore it is necessary to use a phosphor having a large particle diameter. However, when a phosphor having a particle size of about 0.1 μm or more is used, the viscosity of the dispersion liquid increases, which may cause clogging of nozzles in the droplet discharge device. Further, there is a possibility that the dispersion liquid adheres to the periphery of the nozzle of the droplet discharge device, and the flight of the discharged dispersion liquid may occur. In these cases, it becomes difficult to discharge a predetermined amount of the dispersion into the predetermined groove, and a desired phosphor film cannot be formed.

  Therefore, a method of fixing the phosphor powder to the inner surface of the groove with a binder material is conceivable. However, the three-dimensional printing technique described in Patent Document 1 relates to a technique for forming a three-dimensional part by supplying a liquid binder material after depositing a powder material layer. Therefore, it is difficult to apply the invention described in Patent Document 1 when forming a film along the inner surface of the groove.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a film forming method and a device manufacturing method capable of forming a powder film having a large particle diameter on the entire inner surface of the groove. And It is another object of the present invention to provide a plasma display device and electronic equipment with excellent display quality.

In order to achieve the above object, the film forming method of the present invention is a method of forming a film made of powder on the inner surface of a groove part, wherein a liquid fixing material for fixing the powder to the groove part is used as the groove part. And a step of spreading the powder onto the groove portion, and a step of hardening the fixing material to fix the powder to the groove portion.
According to this configuration, the dispersed powder is adsorbed to the fixing member applied to the inner surface of the groove. Furthermore, if the fixing material is cured and the powder is fixed to the groove portion, a film made of powder can be formed on the inner surface of the groove portion. Thereby, even when using powder with a large particle diameter, the film | membrane consisting of the powder can be formed in the inner surface of a groove part.

  In addition, it is desirable that a contact angle between the groove and the fixing material is smaller than an angle θ represented by the following formula.

ただし、ｈは前記溝部の深さであり、ρは前記固着材料の密度であり、σは前記固着材料の表面張力である。
この構成によれば、溝部に塗布された固着材料を、毛管現象によって溝部側面の上端部まで濡れ登らせることができる。これにより、溝部の内面全体に固着材料が塗布されるので、溝部の内面全体に粉体の膜を形成することができる。

Where h is the depth of the groove, ρ is the density of the fixing material, and σ is the surface tension of the fixing material.
According to this configuration, the fixing material applied to the groove can be wetted up to the upper end of the side surface of the groove by capillary action. Thereby, since the fixing material is applied to the entire inner surface of the groove portion, a powder film can be formed on the entire inner surface of the groove portion.

Further, it is desirable to have a step of performing a lyophilic treatment on the groove before the step of applying the fixing material.
According to this configuration, since the contact angle between the groove and the fixing material is reduced, the fixing material applied to the groove can be wetted up to the side of the groove by capillary action. Thereby, since the fixing material is applied to the entire inner surface of the groove portion, a powder film can be formed on the entire inner surface of the groove portion.

The fixing material is preferably applied by discharging the fixing material from a droplet discharge device.
According to this configuration, since a predetermined amount of the fixing material can be accurately discharged to a predetermined position of the groove portion, the fixing material can be applied to the entire inner surface of the groove portion. Therefore, a powder film can be formed on the entire inner surface of the groove.

Moreover, it is desirable that the viscosity of the fixing material at a temperature at which the fixing material is discharged is 50 cps or less.
According to this configuration, it is possible to prevent clogging of the nozzles in the droplet discharge device, and it is possible to stably discharge the fixing material by the droplet discharge device.

Further, it is desirable that the fixing material be discharged so as to have a velocity component in the longitudinal direction of the groove.
According to this configuration, since the discharged fixing material spreads in the longitudinal direction of the groove portion, the fixing material can be uniformly applied. Accordingly, it is possible to make the height of wetting and climbing of the fixing material on the side surface of the groove portion uniform, and the fixing material can be applied to the entire inner surface of the groove portion.

Moreover, it is desirable to have the process of collect | recovering the said powder adhering to parts other than the said groove part after the process of hardening the said fixing material.
According to this configuration, a powder film can be formed only on the inner surface of the groove. Further, if the collected powder is reused, the film formation cost can be reduced.

On the other hand, the device manufacturing method of the present invention is characterized in that a film made of powder is formed using the film forming method described above.
According to this configuration, a device can be manufactured by forming a powder film having a large particle diameter on the entire inner surface of the groove.

On the other hand, the plasma display device of the present invention is characterized in that the phosphor film is formed on the inner surface of the groove part constituting the discharge chamber by using the film forming method described above.
According to this configuration, the phosphor film can be formed on the entire inner surface of the groove portion using a phosphor having a large particle diameter, so that the light emission efficiency can be improved. Therefore, it is possible to provide a plasma display device with excellent display quality.

On the other hand, an electronic device of the present invention is manufactured using the above-described film forming method.
According to this configuration, an electronic device having excellent display quality can be provided.

  Embodiments of the present invention will be described below with reference to the drawings. In each drawing used for the following description, the scale of each member is appropriately changed to make each member a recognizable size.

[Film Formation Method]
FIG. 1 is an explanatory diagram of the steps of the film forming method according to the present embodiment. The film forming method of the present embodiment is a method of forming a film made of powder on the entire inner surface of a fine groove portion having a width of about 50 to 1000 μm and a depth of about 20 to 500 μm, for example. And (a) a step of applying the binder 70 to the entire inner surface of the groove portion 50 by the droplet discharge device, (b), a step of spraying the powder 75 in the groove portion 50, (c), and curing the binder to obtain the powder. A step of adhering to the groove portion 50, and a step of recovering powder adhering to a portion other than the groove portion 50, and (e).

(Liquid treatment process)
In the present embodiment, as shown in FIG. 1E, a film 80 made of powder is formed on the entire inner surface of the groove 50 formed on the surface of the substrate 48. Therefore, as shown in FIG. 1B, it is necessary to apply a binder 70 not only to the bottom surface of the groove portion 50 but also to the side surface of the groove portion 50. Therefore, by utilizing the capillary phenomenon, the binder 70 applied to the bottom surface of the groove is wet-climbed to the upper end of the side surface of the groove. Here, the capillary phenomenon is a phenomenon in which the water surface rises due to surface tension when a water surface contact angle is given to the inner wall of the capillary tube. Further, the contact angle is an angle formed by the liquid surface and the solid surface at the position where the free surface of the stationary liquid is in contact with the solid wall (an angle inside the liquid), and is represented by θ in FIG. The contact angle θ is an acute angle when the liquid wets the solid surface, and an obtuse angle when the liquid does not wet. Therefore, if the wettability of the groove side surface is improved to reduce the contact angle θ between the binder 70 and the groove side surface, the binder can be wetted up to the upper end of the groove side surface.

  The contact angle θ is set as follows. As shown in FIG. 2, when the binder 70 wets and climbs the side surface of the groove portion 50, the weight of the wet climbing portion 70 a and the surface tension of the binder 70 are in balance. Here, the wet climbing portion 70a refers to a portion wetted up by capillary action at the end of the groove 50 with respect to the surface of the binder 70 in the vicinity of the center of the groove 50. Therefore, if the volume of the wet climbing portion 70a per unit length in the longitudinal direction of the groove 50 is dv, the surface tension of the binder 70 per unit length is σ, the density of the binder 70 is ρ, and the gravitational acceleration is g. The following balance formula holds.

  Then, assuming that the surface of the wet climbing portion 70a is arcuate and developing the expression 2 with the depth of the groove 50 as h, the following equation is established.

If the contact angle θ between the binder 70 and the groove side surface is set so as to satisfy Formula 3, the binder can be wetted up to the upper end of the groove side surface. For example, when the groove depth h is 500 μm, the binder surface tension σ is 50 mN / m, and the binder density ρ is 1 g / cm ³ , the contact angle θ may be set to 79 °. Furthermore, if the wettability of the side surface of the groove 50 with respect to the binder 70 is improved and the contact angle θ is set smaller than Equation 3, the binder can be sufficiently wetted up to the upper end of the side surface of the groove.

And in order to set contact angle (theta) as mentioned above, as shown to Fig.1 (a), the inner surface of the groove part 50 is made lyophilic, and the wettability with respect to a binder is improved. The lyophilic treatment is performed by irradiating light 52 such as ultraviolet rays. As an example, excimer UV (10 W / cm ² ) having a wavelength of 172 nm is irradiated for about 600 seconds. As a result, the organic matter or the like adhering to the inner surface of the groove is decomposed and removed, so that the wettability with respect to the binder is improved and the binder can be wetted up to the upper end of the side surface of the groove. In addition to the light irradiation, the lyophilic treatment can be performed by organic solvent treatment, surfactant treatment, brushing, oxidation treatment, alkali treatment, O ₃ plasma treatment, or the like.

(Binder application process)
Next, as shown in FIG. 1B, a binder 70 is applied to the inner surface of the groove 50. The binder 70 is a liquid fixing material that fixes the powder to the groove 50. As the binder 70, a monomer such as a thermosetting resin or a photocurable resin can be employed. If necessary, the binder 70 is dissolved in an organic solvent or the like.

  The binder 70 is applied by discharging the binder from a droplet discharge device. FIG. 3 is a perspective view of the droplet discharge device. In FIG. 3, the X direction is the left-right direction of the base 12, the Y direction is the front-rear direction, and the Z direction is the up-down direction. The droplet discharge device 10 mainly includes an inkjet head (hereinafter simply referred to as a head) 20 and a table 46 on which a substrate 48 is placed. The operation of the droplet discharge device 10 is controlled by the control device 23.

  The table 46 on which the substrate 48 is placed can be moved and positioned in the Y direction by the first moving means 14, and can be swung and positioned in the θz direction by the motor 44. On the other hand, the head 20 can be moved and positioned in the X direction by the second moving means, and can be moved and positioned in the Z direction by the linear motor 62. The head 20 can be swung and positioned in the α, β, and γ directions by motors 64, 66, and 68, respectively. Thereby, the droplet discharge device 10 can accurately control the relative position and posture of the ink discharge surface 20P of the head 20 and the substrate 48 on the table 46.

  Here, a structural example of the head 20 will be described with reference to FIG. FIG. 4 is a side sectional view of the inkjet head. The head 20 discharges the ink 2 from the nozzle 91 by a droplet discharge method. In the present embodiment, the above-described binder is used as ink. Various known technologies such as a piezo method in which ink is ejected using a piezoelectric element as a piezoelectric element, and a method in which ink is ejected by bubbles generated by heating the ink are applied as a droplet ejection method. can do. Among them, the piezo method has an advantage that it does not affect the composition of the material because it does not apply heat to the ink. Therefore, the above-described piezo method is employed for the head 20 of FIG.

  A head body 90 of the head 20 is formed with a reservoir 95 and a plurality of ink chambers 93 branched from the reservoir 95. The reservoir 95 is a flow path for supplying ink to each ink chamber 93. A nozzle plate that constitutes an ink ejection surface is attached to the lower end surface of the head main body 90. In the nozzle plate, a plurality of nozzles 91 for discharging ink are opened corresponding to the respective ink chambers 93. An ink flow path is formed from each ink chamber 93 toward the corresponding nozzle 91. On the other hand, a diaphragm 94 is attached to the upper end surface of the head main body 90. The diaphragm 94 constitutes a wall surface of each ink chamber 93. Piezo elements 92 are provided outside the diaphragm 94 so as to correspond to the ink chambers 93. The piezo element 92 is obtained by holding a piezoelectric material such as crystal between a pair of electrodes (not shown). The pair of electrodes is connected to the drive circuit 99.

  When a voltage is applied from the drive circuit 99 to the piezo element 92, the piezo element 92 expands or contracts. When the piezo element 92 contracts and deforms, the pressure in the ink chamber 93 decreases, and the ink 2 flows from the reservoir 95 into the ink chamber 93. Further, when the piezo element 92 expands and deforms, the pressure in the ink chamber 93 increases and the ink 2 is ejected from the nozzle 91. Note that the amount of deformation of the piezo element 92 can be controlled by changing the applied voltage. Further, the deformation speed of the piezo element 92 can be controlled by changing the frequency of the applied voltage. That is, the discharge condition of the ink 2 can be controlled by controlling the voltage applied to the piezo element 92.

  The capping unit 22 shown in FIG. 3 is for capping the ink ejection surface 20P when the droplet ejection apparatus 10 is on standby to prevent the ink ejection surface 20P of the head 20 from drying. The cleaning unit 24 sucks the inside of the nozzles in order to remove clogging of the nozzles in the head 20. The cleaning unit 24 can also wipe the ink discharge surface 20P in order to remove dirt on the ink discharge surface 20P in the head 20.

  And as shown in FIG.1 (b), the binder 70 is discharged with respect to the groove part 50 from the droplet discharge apparatus mentioned above. By discharging the binder 70 using the droplet discharge device, it is possible to accurately discharge a predetermined amount of binder to a predetermined position of the groove 50. If the droplets of the binder 70 are ejected at predetermined intervals along the longitudinal direction of the groove portion 50, each droplet wets and spreads and is combined with an adjacent droplet, and the binder 70 is applied to the entire bottom surface of the groove portion 50. . Furthermore, the binder 70 applied to the bottom surface of the groove portion 50 wets and rises along the side surface of the groove portion 50 by capillary action. As a result, the binder 70 is applied to the entire inner surface of the groove 50.

  In addition, when the viscosity of the binder 70 under the temperature at which the binder is discharged is high, the nozzle 91 (see FIG. 4) in the droplet discharge device may be clogged. Therefore, it is desirable to adjust the concentration of the binder 70 so that the viscosity of the binder 70 is 50 cps or less at the temperature during discharge. According to this configuration, it is possible to prevent clogging of the nozzles in the droplet discharge device, and the binder 70 can be stably discharged by the droplet discharge device.

  Further, it is desirable to discharge the binder so as to have a velocity component in the longitudinal direction of the groove 50. For example, when a groove (not shown) extending in the Y direction in FIG. 3 is formed on the surface of the substrate 48, the head 66 is tilted in the γ direction by the motor 66 to discharge the binder. Thereby, since the discharged binder has a velocity component in the Y direction, it spreads wet along the longitudinal direction of the groove. Therefore, the binder can be uniformly applied. Along with this, it becomes possible to make the height of wetting and climbing of the binder on the side surface of the groove portion uniform, and the binder can be applied to the entire inner surface of the groove portion. Instead of ejecting the binder by tilting the head 20 in the γ direction, the substrate 48 may be placed on a stage tilted in the γ direction and the binder may be ejected in the Z direction.

(Powder application process)
Next, as shown in FIG. 1C, powder 75 is sprayed on the surface of the substrate 48 by spraying or the like. As described above, since the binder 70 is applied to the inner surface of the groove portion 50, the powder dispersed in the groove portion is adsorbed by the binder.

(Fixing process)
Next, as shown in FIG. 1D, the binder is cured. In the present embodiment, since a thermosetting resin or a photocurable resin monomer is employed as the binder, the monomer is polymerized by heating or light irradiation to cure the binder. As a result, the dispersed powder is fixed to the inner surface of the groove 50, and a powder film 80 is formed on the entire inner surface of the groove. In addition, when the organic solvent is contained in the binder, the organic solvent is evaporated simultaneously with heating and light irradiation.

(Powder recovery process)
The dispersed powder 75 is not fixed to a portion other than the inner surface of the groove portion 50 coated with a binder. Therefore, as shown in FIG. 1E, the powder adhering to the portion other than the groove 50 is collected. The powder 75 can be collected by a method of tilting the substrate 48, a method of wiping the surface of the substrate 48, a method of blowing air on the surface of the substrate 48, or the like. As described above, the film 80 made of powder can be formed on the entire inner surface of the groove 50. The collected powder 75 can be reused in the above-described powder spraying process. As a result, the powder can be used efficiently, and the film formation cost can be reduced.

  As described in detail above, in the film forming method of the present embodiment, the step of lyophilicizing the groove portion, the step of applying a binder to the entire inner surface of the groove portion by the droplet discharge device, and the powder are dispersed in the groove portion. The process includes a step, a step of curing the binder to fix the powder to the groove portion, and a step of collecting the powder adhering to a portion other than the groove portion. In general, when forming a powder film having a large particle diameter, it is difficult to discharge a dispersion liquid of the powder from a droplet discharge device. On the other hand, in the film forming method of the present embodiment, the dispersed powder is adsorbed to the binder applied to the inner surface of the groove. Furthermore, if the binder is cured and the powder is fixed to the groove, a film made of powder can be formed on the inner surface of the groove. Thereby, even when using powder with a large particle diameter, the film | membrane consisting of the powder can be formed in the inner surface of a groove part. In addition, since the inner surface of the groove is subjected to lyophilic treatment and the binder is wetted up to the upper end of the side surface of the groove by capillary action, the binder can be applied to the entire inner surface of the groove. Thereby, a powder film can be formed on the entire inner surface of the groove.

[Plasma display device]
The film forming method described above can be used for manufacturing a plasma display device. First, the configuration of the plasma display device will be described with reference to FIG.
FIG. 5 is an exploded perspective view of a three-electrode AC plasma display panel, and reference numeral 500 denotes a plasma display device. The plasma display device 500 is generally configured by a rear substrate 501 and a front substrate 502 that are arranged to face each other, and a discharge display unit 510 formed therebetween. The discharge display unit 510 includes a plurality of discharge chambers 516, and among the plurality of discharge chambers 516, three of the red discharge chamber 516 (R), the green discharge chamber 516 (G), and the blue discharge chamber 516 (B). Two discharge chambers 516 are paired to form one pixel.

  Address electrodes 511 are formed in stripes at predetermined intervals on the upper surface of the rear substrate 501. Further, a dielectric layer 519 is formed so as to cover each address electrode 511 and the upper surface of the back substrate 501. Further, a partition wall 515 is formed in parallel with each address electrode 511 and located on the upper surface of the dielectric layer 519 between the address electrodes 511 and 511. A partition perpendicular to the address electrode 511 is also formed at a predetermined position in the longitudinal direction of each address electrode 511 (not shown). A plurality of grooves are formed by the barrier ribs 515 adjacent to both sides of the address electrode 511 in the width direction and the barrier ribs formed in the orthogonal direction of the address electrode 511, and a discharge chamber 516 is formed corresponding to the groove portions. Yes. The width of each groove is about 100 μm, and the height of each groove is about 50 μm.

  In general, sand blasting is often used to form the partition 515. In this case, first, the constituent material of the partition 515 is thickly coated on the upper surface of the dielectric layer 519. Next, a dry film is laminated on the surface, exposed and developed, and patterned. And the partition 515 is formed with the said groove part by spraying an abrasive | polishing agent.

A phosphor 517 is disposed on the side and bottom surfaces of the groove section defined by the partition 515. The phosphor 517 emits red, green, or blue fluorescence. The red phosphor 517 (R) disposed in the red discharge chamber 516 (R) is made of a material such as Y _0.65 Gd _0.35 BO ₃ : Eu. The green phosphor 517 (G) disposed in the green discharge chamber 516 (G) is made of a material such as BaAl ₁₂ O ₁₉ . The blue phosphor 517 (B) disposed in the blue discharge chamber 516 (B) is made of a material such as BaMgAl ₁₄ O ₂₃ .

On the other hand, on the front substrate 502 side, striped display electrodes 512 are formed in a direction orthogonal to the previous address electrodes 511. Two display electrodes 512 are arranged for each discharge chamber 516, one functioning as a scan sustaining electrode and the other functioning as a common sustaining electrode. Each display electrode 512 is made of a transparent conductive material such as ITO, and a bus electrode 512a made of metal is formed to supplement the high resistance ITO. Further, a dielectric layer 513 is formed so as to cover them, and a protective film 514 made of MgO or the like is further formed.
Then, the back substrate 501 and the front substrate 502 described above are bonded together, and a rare gas is sealed in each discharge chamber 516, so that the plasma display device 500 is formed.

  In the plasma display device 500 described above, the address electrodes 511 and the display electrodes 512 are connected to an AC power supply (not shown). A discharge is generated between the address electrode 511 and the display electrode 512, and the phosphor 517 is excited to emit light in the discharge display portion 510, so that a color image can be displayed. The discharge is maintained by a surface discharge by a pair of display electrodes (scanning sustaining electrode and common sustaining electrode) 512 on the front substrate 502. In the plasma display device 500 described above, since the phosphor 517 is arranged on the back substrate 501 side, the absorption loss in which the emitted light is absorbed by the phosphor itself is reduced, and the light extraction efficiency is increased.

[Device manufacturing method]
In the plasma display device 500 described above, a method for arranging the phosphor 517 in the groove section partitioned by the partition 515 will be described.

First, lyophilic processing is performed by irradiating light such as ultraviolet rays to the groove section defined by the partition 515 (lyophilic processing step). Specifically, the contact angle between a binder described later and the side surface of the partition wall 515 is set to be smaller than θ in Equation 3.
Next, a binder is discharged to the groove by a droplet discharge device (binder application step). As the binder, for example, an acrylic thermosetting resin monomer is employed. If the droplets of the binder are ejected at predetermined intervals along the longitudinal direction of the groove, each droplet wets and spreads and is combined with an adjacent droplet, and the binder is applied to the entire bottom surface of the groove. Furthermore, the binder applied to the bottom surface of the groove portion wets and climbs along the side surface of the partition wall 515 by capillary action. Thereby, a binder is apply | coated to the whole inner surface of the said groove part.

Next, powder of the phosphor 517 is sprayed on the surface of the groove (powder spraying step). As described above, since the binder is applied to the groove portion, the powder dispersed in the groove portion is adsorbed by the binder.
Next, the binder is cured, and the dispersed powder is fixed to the groove (fixing step). As described above, since the monomer of the thermosetting resin is employed as the binder, the monomer is polymerized by heating to cure the binder. As a result, the dispersed powder is fixed to the inner surface of the groove, and a powder film is formed on the entire inner surface of the groove.
Next, the powder adhering to the portion other than the groove is recovered (powder recovery step). The powder is collected by a method of tilting the back substrate 501 or the like. The collected powder can be reused in the above-described powder spraying process.

  By repeating the steps described above, a red phosphor 517 (R), a green phosphor 517 (G), and a blue phosphor 517 (B) are sequentially formed. As described above, the phosphor 517 is disposed in the groove section defined by the partition 515, and the discharge chamber 516 is formed.

  In the device forming method described above, the phosphor of the plasma display apparatus is arranged using the film forming method of the present embodiment. In general, when a film is formed using a phosphor having a small particle diameter, the luminous efficiency of the plasma display device is lowered. Therefore, it is necessary to use a phosphor having a large particle diameter. Even in this case, according to the device forming method of the present embodiment, the phosphor film having a large particle size can be formed on the entire inner surface of the groove section defined by the partition walls, so that the luminous efficiency of the plasma display device is improved. It becomes possible to make it. Therefore, it is possible to provide a plasma display device with excellent display quality.

  Note that a sandblast method is generally used to form the groove in the plasma display device. This is because according to the sandblasting method, fine irregularities are formed on the inner surface of the groove, and thus the adhesion of the phosphor film formed by the screen printing method can be improved. However, in this embodiment, since the phosphor film can be formed without using the screen printing method, it is not necessary to use the sandblast method for forming the groove. Therefore, the groove can be formed by machining or the like, and the manufacturing cost can be reduced.

  In the above, the plasma display apparatus manufacturing method has been described as an example of the device manufacturing method. However, it is also possible to manufacture devices other than the plasma display apparatus using the above-described film forming method. For example, it is possible to form a phosphor layer of EL (electroluminescent display) using the above-described film forming method, and to form a phosphor film on the anode electrode of FED (field emission display). Is also possible.

[Electronics]
Next, an electronic apparatus manufactured using the film forming method of the present embodiment will be described with reference to FIG. FIG. 6 is a perspective view of the mobile phone. In FIG. 6, reference numeral 1000 denotes a mobile phone, and reference numeral 1001 denotes a display unit. In the cellular phone 1000, a device manufactured by using the film forming method of this embodiment is employed in the display unit 1001. Therefore, the mobile phone 1000 having excellent display quality can be provided at a low cost.

  The technical scope of the present invention is not limited to the above-described embodiments, and includes various modifications made to the above-described embodiments without departing from the spirit of the present invention. That is, the specific materials and configurations described in the embodiments are merely examples, and can be changed as appropriate. For example, the case where the phosphor film is formed by spraying phosphor powder has been described above as an example, but the present invention is also applied to the case where the functional film is formed by spraying powder other than the phosphor. It is possible to apply.

It is explanatory drawing of the process of the film | membrane formation method which concerns on embodiment. It is explanatory drawing of the setting method of a contact angle. It is a perspective view of a droplet discharge device. It is side surface sectional drawing of an inkjet head. It is a disassembled perspective view of a 3 electrode AC type plasma display panel. It is a perspective view of a mobile phone.

Explanation of symbols

  50 grooves 70 binder 75 powder

Claims (10)

A method of forming a film made of powder on the inner surface of the groove,
Applying a liquid fixing material for fixing the powder to the groove part on the inner surface of the groove part;
Sprinkling the powder in the groove,
Curing the fixing material and fixing the powder to the groove;
A film forming method characterized by comprising: The film forming method according to claim 1, wherein a contact angle between the groove and the fixing material is smaller than an angle θ represented by the following formula.

Where h is the depth of the groove, ρ is the density of the fixing material, and σ is the surface tension of the fixing material. 3. The film forming method according to claim 1, further comprising a step of applying a lyophilic treatment to the groove before the step of applying the fixing material. The film forming method according to claim 1, wherein the fixing material is applied by discharging the fixing material from a droplet discharge device. The film forming method according to claim 4, wherein a viscosity of the fixing material at a temperature at which the fixing material is discharged is 50 cps or less. The film forming method according to claim 4, wherein the fixing material is discharged so as to have a velocity component in a longitudinal direction of the groove. The film forming method according to claim 1, further comprising a step of recovering the powder adhering to a portion other than the groove after the step of curing the fixing material. A device manufacturing method, wherein a film made of powder is formed using the film forming method according to claim 1. 8. A plasma display device, wherein a phosphor film is formed on an inner surface of a groove part constituting a discharge chamber by using the film forming method according to claim 1. An electronic apparatus manufactured using the film forming method according to claim 1.

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