JP2005122915A - Electric connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric connector not generating erroneous operation caused by the interference of an electromagnetic wave generated at one end of an electric junction to the other end and capable of effectively restraining electromagnetic noise. <P>SOLUTION: The electric connector has base materials 1 containing an electromagnetic noise suppressing body 3 and a plurality of conductive terminals 10 penetrating and held in XY direction of the base materials elastically contacting lands 21 of mounting base plates 20 facing each other. The pair of mounting base plates 20 are electrically connected by interposing and compressing the plurality of conductive terminals 10 between them. Since the electromagnetic noise suppressing body 3 of the base materials 1 exerts a shielding function of shielding the electromagnetic noise generated from the mounting base plates 20 and a CPU, the electromagnetic wave generated from at least one of the mounting base plate 20 and the CPU does not interfere with the other corresponding thereto and bring about the erroneous operation. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electrical connector that electrically connects a mounting board of an electric / electronic device and a CPU, and electrically connects the mounting boards.

A conventional electrical connector is not shown, but is an insulating substrate interposed between mounting substrates of opposing electronic devices, and a plurality of conductive connectors that are arranged in a row and supported by the substrates and contact lands of each mounting substrate. It consists of and. Then, the plurality of conductive connectors are compressed to electrically connect the opposing mounting boards (see Patent Document 1 and Patent Document 2).
JP 2003-243578 A JP 2001-351708 A

  Although the conventional electrical connector is configured as described above, it does not have any shielding function for shielding electromagnetic wave noise generated from the mounting board or the CPU, so that electromagnetic waves generated from at least one of the mounting board and the CPU are not generated. There is a big problem of causing a malfunction by interfering with the other opposite. In particular, as the frequency increases, the possibility of becoming an antenna even with a short circuit is not limited, so countermeasures against electromagnetic wave noise are important.

  The present invention has been made in view of the above, and provides an electrical connector capable of effectively suppressing electromagnetic noise without causing electromagnetic waves generated from one of the electrical joints to interfere with the other and causing malfunction. The purpose is to do.

In the present invention, in order to solve the above-mentioned problem, it is interposed between a plurality of electrical joints and transmits a plurality of signals between them,
It is characterized by comprising a base material including an electromagnetic wave noise suppression body and a plurality of conductive connectors provided on the base material for electrically connecting a plurality of electrical joints.

In addition, it is preferable that an electromagnetic wave noise suppression body is provided with the suppression layer which consists of a ferromagnetic physically vapor-deposited on the organic polymer layer, and the power loss value in 1 GHz is 0.3-0.9.
Moreover, a base material and a suppression layer can be laminated | stacked (stacked so that a layer may be made), and can be compounded.

  Here, the electrical joints in the claims include at least various mounting boards (circuit boards, printed boards, etc.), CPUs, microprocessors, semiconductor packages, electronic components, and the like. The base material does not particularly ask for the presence or absence of flexibility or elasticity, and may contain sheets or films of other properties in a laminated state as long as it contains an electromagnetic wave noise suppressor.

  A plurality of conductive connectors are included in the plurality of conductive connectors. Each conductive connector can be appropriately formed in a columnar shape, a prismatic shape, a truncated cone shape, a truncated pyramid shape, or a combination thereof. The ferromagnetic material preferably has a mass of 0.5 to 200 nm per unit area. Furthermore, the suppression layer preferably has a thickness in the range of 0.03 to 20 μm.

  According to the present invention, there is an effect that electromagnetic waves generated from one of the electrical joints can interfere with the other and cause no malfunction, and electromagnetic noise can be effectively suppressed.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, an electrical connector according to the present embodiment includes a thin base material 1 having a substantially plate-shaped cross section, and an XY of the base material 1. A plurality of conductive connectors 10 arranged in a direction and supported by penetrating, and elastically contacting a land 21 which is a conductive contact of a mounting board 20 constituting an electronic device (for example, a personal computer, a mobile phone, an information terminal device). It is interposed between the mounting boards 20 and 20.

  The base material 1 is formed into a flexible planar rectangle using, for example, a polyimide film, and a plurality of through holes 2 for the conductive connector 10 are perforated in the X and Y directions. contains. As shown in FIG. 2, the electromagnetic wave noise suppression body 3 includes a suppression layer 6 made of a ferromagnetic material 5 physically deposited on a thin organic polymer surface layer 4. 1 is laminated through a film as a support to form a composite.

  Examples of the organic polymer used for the organic polymer surface layer 4 include polyolefin resins, polyamide resins, polyester resins, polyether resins, polyketone resins, polyimide resins, polyurethane resins, polysiloxane resins, and phenols. Non-diene rubbers such as diene rubbers such as polyurethane resins, epoxy resins, acrylic resins, natural rubber, isopretan rubber, butadiene rubber and styrene butadiene rubber, urethane rubber and silicone rubber.

  These may be either thermoplastic or thermosetting, or an uncured product thereof. The organic polymer may be a modified product such as the above-mentioned resin or rubber, a mixture, or a copolymer.

  The ferromagnetic material 5 serving as the suppression layer 6 is made of a metal-based soft magnetic material, an oxide-based soft magnetic material, a nitride-based soft magnetic material, or the like. These may be used alone or in combination of two or more. As the metal-based soft magnetic material, iron or an iron alloy is generally used, and specific iron alloys include Fe—Ni, Fe—Co, Fe—Cr, Fe—Si, Fe—Al, and Fe—Cr—. Si, Fe—Cr—Al, Fe—Al—Si, and Fe—Pt alloys are used.

  In addition to iron and iron alloys, cobalt, nickel, or alloys thereof can be used as the metallic soft magnetic material. In particular, nickel is preferable because it has resistance to oxidation when used alone.

As the oxide-based soft magnetic material, ferrite is optimal. _{Specifically, MnFe 2 O 4, CoFe 2} O 4, NiFe 2 O 4, ZnFe 2 O 4, MgFe 2 O 4, Fe 3 O 4, Cu-Zn- ferrite, Ni-Zn- ferrite, Mn-Zn - _{ferrite, Ba 2 Co 2 Fe 12 O} 22, Ba 2 Ni 2 Fe 12 O 22, Ba 2 Zn 2 Fe 12 O 22, Ba 2 Mn 2 Fe 12 O 22, Ba 2 Mg 2 Fe 12 O 22, Ba 2 Cu ₂ Fe ₁₂ O ₂₂ and Ba ₃ Co ₂ Fe ₂₃ O ₄₁ can be used. These ferrites may be used alone or in combination of two or more.

As the nitride soft magnetic material, Fe ₂ N, Fe ₃ N, Fe ₄ N, and Fe ₁₆ N ₂ are used. These nitride-based soft magnetic materials are optimal for use because of their high magnetic permeability and high corrosion resistance.

  Each of the plurality of conductive connectors 10 is formed in a substantially hexagonal shape with an elastic cross section using a predetermined conductive elastomer, and is fitted and supported in the through hole 2 of the substrate 1. By being compressed to the above, the lands 21 and 21 of the pair of mounting boards 20 and 20 are electrically connected to each other. The conductive elastomer is produced by blending conductive particles with an insulating elastomer.

  As the insulating elastomer, various elastomers that have fluidity before curing and have a crosslinked structure by curing (a general term for those having rubber-like elasticity near normal temperature) are used. Specific examples include silicone rubber, fluorine rubber, polyurethane rubber, polybutadiene rubber, chloroprene rubber, polyester rubber, and natural rubber. In addition, these independent and open-cell foams are also applicable. Among these, silicone rubbers that are excellent in electrical insulation, heat resistance, compression set, workability, etc. are optimal.

  Examples of the conductive particles include spherical, powdery and flaky types. Specifically, simple metals such as gold, silver, copper, platinum, palladium, nickel, and aluminum, particles made of these alloys, resins such as phenol resins, epoxy resins, silicone resins, urethane resins, carbon, ceramics, silica Examples thereof include particles whose surface is coated with the above metal by a method such as plating, vapor deposition, sputtering, etc. using an inorganic material such as the core as a core.

  Next, the electromagnetic wave noise suppression body 3 will be described in detail with reference to the schematic diagram of FIG. 2. The electromagnetic wave noise suppression body 3 includes a ferromagnetic material 5 physically deposited on the organic polymer surface layer 4. In the range of 0.03 to 20 μm from the molecular surface layer 4, the atoms of the ferromagnetic material 5 partially sink and disperse three-dimensionally, and the suppression layer 6 that does not form a homogeneous film has a power loss value at 1 GHz of 0.3. A range of ˜0.9 is preferred.

This point will be described in detail. Generally, when the ferromagnetic material 5 is deposited only on the hard organic polymer surface layer 4, a continuous layer of the ferromagnetic material 5 is formed as the deposition amount increases, and the electromagnetic wave It becomes easy to reflect.
On the other hand, when the atoms of the ferromagnetic material 5 are dispersed in the soft organic polymer surface layer 4 and the suppression layer 6 having a thickness of 0.03 to 20 μm is formed, the ferromagnetic material dispersed in the organic polymer. The body 5 does not form a continuous layer, and does not reflect or transmit electromagnetic waves.

The thickness of the suppression layer 6 is the depth at which the ferromagnetic material 5 penetrates into the organic polymer surface layer 4, and depends on the material of the organic polymer surface layer 4, the mass of the ferromagnetic material 5, the physical vapor deposition conditions, and the like. However, if it is 0.03 micrometer or more, sufficient electromagnetic wave suppression effect can be acquired.
However, in the case of a thickness exceeding 20 μm, an improvement in the suppression effect cannot be expected, the vapor deposition operation is delayed as the mass increases, and an advanced device that increases the particle energy by physical vapor deposition is required. This increases the cost and is not preferable.

Further, when the ferromagnetic material 5 has a micron level as in the prior art, a large amount of high-density ferromagnetic material 5 is used in order to obtain a large transmittance, and a thick and heavy electromagnetic noise suppression sheet is used. Although it is necessary to use it, it is known that when the ferromagnetic material 5 has a nanometer level size, the magnetic permeability increases and the absorption band widens.
Therefore, if the ferromagnetic material 5 is made into nanometer level ultrafine particles, it is not necessary to use a large amount of high-density ferromagnetic material 5 or a thick and heavy electromagnetic wave noise suppression sheet in order to obtain a large transmittance. .

  Next, the power loss value will be explained. Although it is not theoretically clear, by depositing a soft magnetic material with a small mass, quantum effects such as nano-granularity, material-specific magnetic anisotropy, shape magnetic anisotropy, Alternatively, since the anisotropy due to the external magnetic field is related, the power loss value that is an index of the electromagnetic wave noise suppression effect can be set to a large value. Here, the power loss coefficient is obtained by the following equation, takes a value of 0 to 1, and the change in the transmission characteristics S11 and S21 can be measured as shown in FIG.

Power loss value (Ploss / Pin) = 1− (| Γ | ² + | T | ² )
S11 = 20log | Γ |
S21 = 20log | T |

  The power loss value is a comprehensive index of the reflection / transmission characteristics of the suppression function, but the reflection attenuation amount and transmission attenuation amount must be practically effective values, and the effect can be expected to be −3 dB or less. , Preferably −6 dB or less, more preferably −10 dB or less.

  In order for the electromagnetic wave noise suppression body 3 to have a large power loss value, it is necessary for the ultrafine particles of the ferromagnetic material 5 to enter the inside of the organic polymer surface layer 4 during physical vapor deposition. The elastic modulus needs to be low. If the shear modulus of the organic polymer is low, when the ferromagnetic material 5 is physically deposited on the organic polymer surface layer 4, atoms of the ferromagnetic material 5 enter the organic polymer surface layer 4, This is because the organic polymer is deformed by colliding with the molecule, causing flow and motion, and is easily dispersed over the 0.03 to 20 μm layer of the organic polymer surface layer 4.

  FIG. 3 is a laser microscope image showing a surface state of the organic polymer surface layer 4 on which the ferromagnetic material 5 is deposited, and irregularities are seen on the surface. FIG. 4 is an image obtained by measuring the cross-sectional shape, and the height of the protrusion is about 6 μm. FIG. 5 is a laser microscope image showing the surface state of the ferromagnetic material 5 before vapor deposition. The surface is flat and the average surface roughness is 0.05 μm. From these, it can be seen that the organic polymer is deformed or flows due to the deposition of the ferromagnetic material 5.

From the above, it is preferable that the organic polymer has a shear modulus of 1 × 10 ³ to 1 × 10 ⁷ (Pa), more preferably 1 × 10 ³ to 1 × 10 ⁶ (Pa) during physical vapor deposition. More preferably, the range of 1 × 10 ³ to 1 × 10 ⁵ (Pa) is good. In order to obtain a predetermined shear modulus, the organic polymer can be heated to 100 to 300 ° C., for example, if necessary at the time of physical vapor deposition, but it must be heated to a temperature that does not cause decomposition or evaporation. is there. When physical vapor deposition is performed at room temperature, it is not particularly necessary to heat. Examples of the organic polymer to be physically vapor-deposited at normal temperature include elastic bodies having a rubber hardness of about 50 ° to 60 ° (JIS-A).

  Further, gas permeability is an index that indicates the size of the molecular space in which atoms of the ferromagnetic substance 5 that has been turned into plasma or ionized easily enter. Originally, argon gas or krypton gas, which is equal to the size of the ferromagnetic element, is convenient for confirming the transmittance, but it is not general for measuring the gas transmittance, so for example, carbon dioxide permeability data Can be substituted.

Organic polymers having a high carbon dioxide permeability at room temperature include polyphenylene oxides of 1 × 10 ⁻⁹ [cm ² (STP) (cm × sec × cmHg) ⁻¹ ] or more, polymethylpentene, nylon 11, high Polybutadiene, polyisoprene, styrene butadiene rubber, silicone rubber, etc. with a mixture or copolymer with rubber components such as impact polystyrene, 1 × 10 ⁻⁸ [cm ² (STP) (cm × sec × cmHg) ⁻¹ ] or more can give. Among these, rubbers such as silicone rubber are optimal from the viewpoint of shear modulus.

In addition, from the viewpoint of preventing oxidation of the ultrafine particles in the ferromagnetic material 5, those having low oxygen permeability are preferable, and polyethylene of 1 × 10 ⁻¹⁰ [cm ² (STP) (cm × sec × cmHg) ⁻¹ ] or less, Polytrifluorochloroethylene, polymethyl methacrylate, and the like, and polyethylene terephthalate, polyacrylonitrile, and the like of 1 × 10 ⁻¹² [cm ² (STP) (cm × sec × cmHg) ⁻¹ ] or less can be mentioned.

  Also, silane coupling agents, titanate coupling agents, nonionic surfactants, polar resin oligomers, etc., so that the atomized ferromagnetic or ionized ferromagnetic material 5 may partially react with the organic polymer and be stabilized. In addition to preventing oxidation, formation of a homogeneous film due to atomic aggregation can be prevented, and reflection characteristics can be improved.

In addition, reinforcing fillers, flame retardants, antioxidants, antioxidants, colorants, thixotropic improvers, plasticizers, lubricants, heat improvers, and the like can be added as appropriate.
However, it should be noted that when a hard material is mixed, atoms of the ferromagnetic material 5 may collide with the hard material and may not be sufficiently diffused.

  The organic polymer surface layer 4 preferably has a thickness of about 1 to 200 μm. This organic polymer film is thin by itself, has a low shear modulus in the operating temperature range, and when handling is difficult, a support for supporting the organic polymer can be provided separately. This support may be made of the same material as the organic polymer surface layer 4, but is a metal foil, a flexible ceramic foil, etc., which has higher rigidity and higher shear modulus than the organic polymer of the organic polymer surface layer 4. Is good. The support has a thickness of 50 μm or less, preferably 25 μm or less.

  A thick support having peelability may be attached and the support may be peeled off at the end of handling.

  When a metallic soft magnetic material made of iron, cobalt, nickel, an alloy thereof, or the like is used as the ferromagnetic material 5, if the metallic soft magnetic material is deposited so as to aggregate to form a homogeneous film, the metal Since the specific resistance of the system soft magnetic material is small, an eddy current is generated, the electromagnetic wave absorption effect is reduced, and a reflection function is produced. For this reason, electromagnetic waves from the electronic circuit or electronic component cannot be absorbed and reflected, which may adversely affect the electronic circuit or electronic component.

Therefore, when the ferromagnetic material 5 is physically vapor-deposited on the organic polymer surface layer 4, it is preferable not to form a homogeneous ferromagnetic material film. The surface resistance (DC resistance) of the film is preferably about 1 × 10 ¹ to 1 × 10 ¹⁰ Ω / □.

  The element of the ferromagnetic material 5 that has been brought into the atomic state by physical vapor deposition is approximately several ohms strong size, but the organic polymer, unlike metals and ceramics, has voids between molecules, and has been blown away. It is considered that the atoms of the magnetic body 5 penetrate into the voids and form minute clusters or very thin thin film particles. For this reason, it does not form a continuous thin film by being deposited on a single plane, and is dispersed three-dimensionally. Therefore, when the amount of vapor deposition is small, the ultrafine particles tend to be in a state that does not exhibit good conduction independently. .

  When the ultrafine particles of the ferromagnetic material 5 can penetrate deeply into the organic polymer surface layer 4, even if the amount of deposition is large, it is easily dispersed and does not become a homogeneous film. Processing time can be saved, and a large power loss coefficient can be obtained.

  The physical vapor deposition method (PVD) refers to various film forming methods. In this film forming method, a thin film forming material is vaporized inside a vacuum vessel and deposited on a substrate set in the vicinity to form a thin film. It is. When physical vapor deposition is classified according to vaporization method of thin film material, it is classified into evaporation system and sputtering system.

  Examples of the evaporation system include EB deposition and ion plating, and examples of the sputtering system include high-frequency sputtering, magnetron sputtering, and counter target type magnetron sputtering.

  In EB vapor deposition, the energy of evaporated particles is as small as 1 eV, so that the substrate is less damaged, the film tends to become porous, and the film strength tends to be insufficient, but the specific resistance of the ferromagnetic film increases. have. In ion plating, ions of argon gas and evaporated particles are accelerated and collide with the substrate, so that a film having higher energy and stronger adhesion than EB deposition can be obtained. When the oxide-based ferromagnetic material 5 is formed, a reactive gas such as oxygen must be introduced, and it is difficult to control the film quality. On the other hand, by increasing the bias voltage, the atomic ferromagnet 5 is increased to 1 keV. Fine particles can be accelerated.

  In the sputtering type high frequency sputtering, an insulating target can be used, and when a bias is applied, the energy can be increased up to several hundred eV. In addition, magnetron sputtering is characterized in that a strong plasma is generated under the influence of a magnetic field, so that the growth rate is fast, but the utilization efficiency of the target is poor. When a bias is applied, the energy can be increased up to several hundred eV.

  Opposing target type magnetron sputtering is a method in which a substrate is set outside an opposing target, plasma is generated between the opposing targets, and a predetermined thin film is formed without causing plasma damage. According to this method, a composition similar to the dense target composition can be generated without resputtering the thin film on the substrate, and usually has a high energy of 8 eV or more.

  A typical organic covalent bond energy is about 4 eV. Specifically, for example, the bond energies of C—C, C—H, Si—O, and Si—C are 3.6, 4.3, and 4. 6 and 3.3 eV.

  On the other hand, bias ion plating, bias magnetron sputtering and counter target type magnetron sputtering have high energy, break some chemical bonds and collide. Unevenness of 5 μm or more is formed on the surface of the molecular surface layer, for example. And the atom of the ferromagnetic material 5 penetrate | invades from the organic polymer surface layer 4 to about 0.03-100 micrometers, and can form the layer which has an electromagnetic wave absorption function.

  This is presumed to be because the atoms of the ferromagnetic material 5 having high energy collide with the organic polymer surface layer 4 to cause local mixing action between the atoms of the ferromagnetic material 5 and the organic polymer. Thus, if the fine particles of the ferromagnetic material 5 having a particle energy of 5 eV or more are deposited on the organic polymer surface layer 4, a large amount of the ferromagnetic material 5 can be dispersed at a time. That is, since the mass of the ferromagnetic material 5 can be gained by a single vapor deposition, an absorber having a large transmittance can be easily obtained.

  The vapor deposition mass of the ferromagnetic material 5 is 0.5 to 200 nm or less, preferably 100 nm or less, more preferably 50 nm or less in terms of the film thickness converted value of the single ferromagnetic material. This is because when the thickness is less than 0.5 nm, the electromagnetic wave suppression effect cannot be expected. On the contrary, when the thickness exceeds 200 nm, the inclusion capacity of the organic polymer surface layer 4 is reached, and the film cannot be dispersed and deposited, resulting in a continuous film having uniform conductivity. The vapor deposition mass of the ferromagnetic material 5 can be obtained by measuring the thickness deposited on a hard substrate such as glass or silicon.

  The deposited ferromagnetic material 5 is dispersed in the electromagnetic wave noise suppressing body 3, and the electromagnetic wave noise suppressing body 3 becomes thicker than the film thickness converted value of the single ferromagnetic material. As described above, this measurement can be calculated from an SEM image of a cross section, or can be analyzed by ESCA analysis or the like for analyzing a compound released while performing plasma etching for each thin layer.

  When the vapor deposition mass is reduced, the electromagnetic wave noise suppression effect is reduced, so that the total mass of the ferromagnetic material 5 occupying the electromagnetic wave noise suppression body 3 can be increased by overlapping a plurality of suppression layers 6. The total mass is preferably about 10 to 500 nm in terms of a total film thickness conversion value, although it depends on the required suppression level. The thickness of the suppression layer 6 can be the sum of the stacked layers. The number of stacked layers is not particularly limited, but the total thickness including the organic polymer surface layer 4 is preferably about 20 to 200 μm.

  According to the above configuration, the electromagnetic wave noise suppression body 3 of the base material 1 exhibits a shielding function for shielding electromagnetic wave noise generated from the mounting substrate 20 and the CPU, so that the electromagnetic waves generated from at least one of the mounting substrate 20 and the CPU are relative to each other. It does not interfere with the other and cause malfunction. Therefore, there is very little possibility that the circuit becomes an antenna regardless of the level of the frequency, and an extremely effective electromagnetic noise countermeasure can be taken. Furthermore, it is possible to obtain an electromagnetic wave suppressor having a large power loss coefficient, excellent electromagnetic wave absorption characteristics, small size, light weight, and robustness.

  In addition, the mass of the ferromagnetic material 5 and the thickness of the suppression layer 6 in the said embodiment can be changed suitably. For example, reflection can be suppressed by gradually increasing the mass of the ferromagnetic material 5 of the suppression layer 6 from the electronic component side so as to be inclined. Further, the ferromagnetic material 5 can be divided to achieve insulation.

Hereinafter, examples of the electrical connector according to the present invention will be described together with comparative examples.
The electromagnetic wave noise suppression bodies shown in Examples 1 to 3 and Comparative Examples were respectively prepared, and the surface resistance, surface observation, the thickness of the electromagnetic wave noise suppression body, and the electromagnetic wave absorption characteristics were measured.
Surface resistance: Directly measured under a measurement voltage of 10 V using Diainstruments MCP-T600.
Measurement was performed by the flow four-terminal method, and the average value of five measurement points was indicated.

Surface observation: The surface was observed at a magnification of 4000 times with a Keyence laser microscope VK-9500.
I decided to see.
Electromagnetic noise suppressor thickness: JEOL scanning electron microscope (SEM) JEM-2100F
Used, cross-sectional electron micrograph of the electromagnetic wave noise suppressor (magnification 5)
(0000 times)).

Electromagnetic wave absorption characteristics: Using an electromagnetic wave absorption material measuring device for near-field made by Keycom, using the S-parameter method
Measuring S21 (transmission attenuation) and S11 (reflection attenuation) according to
did. Network analyzer is an Anritsu vector network
Using an analyzer 37247C, a matrix having an impedance of 50Ω.
The test fixture on the ICR trip line includes a Keycom T
F-3A was used (see FIG. 10).

Example 1
First, a 20 μm-thick silicone rubber as an organic polymer is provided on a 12 μm-thick polyethylene terephthalate film (normal shear modulus 3.8 × 10 ⁹ (Pa)), which is a support, on this silicone rubber, The ferromagnetic material was sputtered by facing target type magnetron sputtering method while keeping the substrate temperature at room temperature and applying a slightly negative voltage so as to have a particle energy of 8 eV.

The properties of silicone rubber are: shear modulus at normal temperature 1 × 10 ⁷ (Pa), carbon dioxide permeability at normal temperature 2.2 × 10 ⁻⁷ [cm ² (STP) (cm × sec × cmHg) ⁻¹ ], wet Silica-containing. The ferromagnetic material was an Fe—Ni-based soft magnetic metal having a thickness of 30 nm in terms of film thickness.

  Next, the surface resistance of the ferromagnetic material was measured by a direct current four-terminal method, adjusted to a predetermined size, and an electromagnetic wave noise suppression body having a total thickness of 32 μm was obtained. Once the electromagnetic wave noise suppressor is obtained, the surface is observed before and after sputtering, and a portion of the obtained sample is sliced with a microtome, and an ion beam polisher is applied to the cross section, the thickness of the suppression layer is measured, and electromagnetic wave absorption Characteristics were measured.

  The results are summarized in Table 1, the surface observation results are shown in the figure, the cross-sectional observation of the suppression layer is shown in the figure, and the power loss characteristics of 0.05 to 3 GHz are shown in FIG.

Example 2
First, a 6 μm thick polyimide film (normal shear modulus 3.8 × 10 ⁹ (Pa)) as a support is coated with an acrylic adhesive having a thickness of 25 μm as an organic polymer (trade name 1604N, manufactured by Soken Chemical). On the acrylic adhesive material, the ferromagnetic material is sputtered by bias magnetron sputtering to maintain the substrate temperature at room temperature and adjust the bias voltage so as to have a particle energy of 10 eV. The total thickness is 72 μm. An electromagnetic noise suppressor was obtained.

The properties of the acrylic adhesive material were normal temperature shear modulus 6 × 10 ⁴ (Pa), normal temperature carbon dioxide permeability 2 × 10 ⁻⁷ [cm ² (STP) (cm × sec × cmHg) ⁻¹ ]. . The ferromagnetic material was an Fe—Ni-based soft magnetic metal having a thickness of 30 nm in terms of film thickness. The other parts were the same as in Example 1.
The results are summarized in Table 1 and the power loss characteristics of 0.05 to 3 GHz are shown in FIG.

Example 3
A polyacrylonitrile sheet having a thickness of 70 μm is provided as an organic polymer, and a ferromagnetic material is maintained on the polyacrylonitrile sheet by a counter target magnetron sputtering method so that the substrate temperature is maintained at 160 ° C. and particle energy is 100 eV. Sputtering was performed by adjusting the bias voltage to obtain an electromagnetic wave noise suppressor having a total thickness of 100 μm.

The properties of the polyacrylonitrile sheet are as follows: room temperature shear modulus 1.7 × 10 ⁹ (Pa), 160 ° C. shear modulus 1.5 × 10 ⁶ (Pa), room temperature carbon dioxide permeability 5.3 × 10 ^{− 8} [cm ² (STP) (cm × sec × cmHg) ⁻¹ ] and oxygen gas permeability at room temperature 2.8 × 10 ⁻¹⁵ [cm ² (STP) (cm × sec × cmHg) ⁻¹ ]. The ferromagnetic material was Ni metal having a thickness of 50 nm in terms of film thickness. The other parts were the same as in Example 2.
The results are summarized in Table 1 and the power loss characteristics of 0.05 to 3 GHz are shown in FIG.

Comparative Example 94 parts by mass of a flat Fe-Ni soft magnetic metal having a non-conductive film oxidized on its surface, 5 parts by mass of a polyurethane resin, 1 part by mass of an isocyanate compound as a curing agent, a solvent (1 of cyclohexanone and toluene : 1 mixture) The paste to which 30 parts by mass was added was applied by a bar coating method so that the thickness after drying was 0.51 mm to form a film. The Fe—Ni soft magnetic metal had an average particle size of 15 μm and an aspect ratio of 65.

Next, the film was sufficiently dried, vacuum heated and pressed, and cured at 85 ° C. for 24 hours to produce an electromagnetic wave noise suppressor having a film thickness of 0.5 mm. The other parts were the same as in the example.
The results are summarized in Table 1 and the power loss characteristics of 0.05 to 3 GHz are shown in FIG.

  As is clear from Table 1, the power loss value at 1 GHz was 0.3 or more in Examples 1 to 3, and less than 0.1 in the comparative example. According to the examples, it has been found that the suppression effect in the quasi-microwave band is high. Moreover, the suppression layer was very thin, and the power loss value with respect to the thickness of the suppression layer was about 4 orders of magnitude larger than that of the comparative example.

  Moreover, although the power loss value of 3 GHz was about 0.8 in Examples 1-3, it was less than 0.8 in the comparative example. Furthermore, in Examples 1-3, it was a flexible thin thin suppression layer, but in the comparative example, it was a thick, heavy and fragile suppression layer.

It is explanatory drawing which shows embodiment of the electrical connector which concerns on this invention. It is a schematic diagram which shows the state by which the ferromagnetic body was vapor-deposited physically on the organic polymer surface layer in embodiment of the electrical connector which concerns on this invention. It is a laser microscope image which shows the surface state of the organic polymer surface layer in which the ferromagnetic body was vapor-deposited, and one side is 73.5 micrometers. It is the laser microscope image which measured the cross-sectional shape of the organic polymer surface layer in which the ferromagnetic body was vapor-deposited. It is the laser microscope image which measured the cross-sectional shape of the organic polymer surface layer before vapor deposition of a ferromagnetic material. It is a graph which shows the power loss characteristic of the frequency of 0.05-3 GHz of the electromagnetic wave noise suppression body in Example 1 of the electrical connector which concerns on this invention. It is a graph which shows the power loss characteristic of the frequency of 0.05-3 GHz of the electromagnetic wave noise suppression body in Example 2 of the electrical connector which concerns on this invention. It is a graph which shows the power loss characteristic of the frequency of 0.05-3 GHz of the electromagnetic wave noise suppression body in Example 3 of the electrical connector which concerns on this invention. It is a graph which shows the power loss characteristic of the frequency of 0.05-3 GHz of the electromagnetic wave noise suppression body in the comparative example of the electrical connector which concerns on this invention. It is a perspective view which shows the measurement system of a transmission characteristic.

Explanation of symbols

1 Base Material 3 Electromagnetic Wave Noise Suppressor 4 Organic Polymer Surface Layer (Organic Polymer Layer)
5 Ferromagnetic material 6 Suppression layer 10 Conductive connector 20 Mounting substrate (electrical joint)

Claims (3)

An electrical connector interposed between a plurality of electrical joints and transmitting a plurality of signals therebetween,
An electrical connector comprising: a base material including an electromagnetic noise suppressor; and a plurality of conductive connectors provided on the base material to electrically connect a plurality of electrical joints.   The electrical connector according to claim 1, wherein the electromagnetic wave noise suppressor includes a suppression layer made of a ferromagnetic material physically vapor-deposited on an organic polymer layer, and a power loss value at 1 GHz is in a range of 0.3 to 0.9. .   The electrical connector according to claim 2, wherein the base material and the suppression layer are laminated to form a composite.

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