TW201628263A - Magneto-dielectric substrate - Google Patents

Abstract

A magneto-dielectric substrate includes a first dielectric layer, a second dielectric layer spaced apart from the first dielectric layer, and at least one magnetic reinforcing layer disposed between and in intimate contact with the first dielectric layer and the second dielectric layer.

Description

Magnetic-dielectric substrate [Priority statement]

The present application claims priority to U.S. Provisional Patent Application Serial No. No. No. No. No. No. No. No. No.

In summary, the present invention relates to a magnetic-dielectric substrate, and more particularly to a metal clad circuit material using a magnetic-dielectric substrate, and more particularly to a An antenna of a metal clad circuit laminate, the metal clad circuit material using a magnetic-dielectric substrate.

Newer design and manufacturing technologies have driven smaller and smaller electronic components, such as inductors, electronic circuits, electronic packages, modules and housings, and UHF (UHF) on electronic integrated circuit chips. , VHF (UHF), and microwave antennas. The reduction in antenna size is particularly problematic, and the antenna size has not been reduced to the extent comparable to other electronic components. The use of magnetic-dielectric materials as substrates is one approach that has been taken to reduce the size of electronic components. Specifically, ferrite, Ferroelectric and multiferroic have been extensively studied as functional materials with enhanced microwave properties. However, such materials are not entirely satisfactory because they do not provide the desired bandwidth or the desired mechanical properties for a given application.

Accordingly, there is still a need in the industry for magnetic-dielectric substrates having low dielectric and magnetic losses, low power consumption, low biasing electric fields or magnetic fields, and improved mechanical properties. This would be a greater advantage if the materials could be easily processed and integrated using existing manufacturing processes.

An embodiment of the invention includes a magnetic-dielectric substrate having a first dielectric layer, a second dielectric layer spaced apart from the first dielectric layer, and At least one magnetic reinforcing layer is disposed between the first dielectric layer and the second dielectric layer and in close contact with the first dielectric layer and the second dielectric layer.

The above features, advantages and other features and advantages will be apparent from the description and appended claims.

10‧‧‧Magnetic-dielectric substrate/substrate

20‧‧‧Electrical conductor/conductive ground plane/ground plane

30‧‧‧Electrical Conductors / Conductive Components / Patches

32‧‧‧In-line and in-plane conductive discontinuities

34‧‧‧ thickness

40‧‧‧ signal line

50‧‧‧Double-clad circuit material/copper clad laminate

60‧‧‧Antenna

100‧‧‧First dielectric layer

102, 202‧‧ ‧

104, 204‧‧‧ Partial impregnation

106, 206‧‧‧ outer surface

108‧‧‧First thickness

200‧‧‧Second dielectric layer

208‧‧‧second thickness

300‧‧‧Magnetic reinforcement/magnetic layer

302‧‧‧ side

304‧‧‧ opposite

400‧‧‧fiber magnetic layer

500‧‧‧Polymer or nanofiber

502‧‧‧ magnetic particles

510‧‧‧Continuous polymer layer

512‧‧‧Magnetic Nanoparticles

610‧‧‧First magnetic layer

612‧‧‧First magnetic layer thickness

620‧‧‧Second magnetic layer

622‧‧‧Second magnetic layer thickness

630‧‧‧Dielectric strengthening layer

632‧‧‧ Strengthening layer thickness

1000‧‧‧Details

Referring to the exemplary non-limiting drawings in which like elements are numbered in a similar manner: FIG. 1 is a cross-sectional view of a magnetic-dielectric substrate having a magnetic layer, according to an embodiment; The figure shows a magnetic-mediated using the first figure according to an embodiment. FIG. 3 is a cross-sectional view of a metal clad circuit laminate having a patterned patch according to a second embodiment; FIG. 4A is a first view; A detailed view of a portion of the drawing, in which the cross-line detail is omitted for clarity, an expanded view of one embodiment of the magnetic layer according to an embodiment is illustrated; and FIG. 4B is an alternate detail view of a portion of FIG. The cross-sectional detail is omitted for clarity, and an expanded view of one of the magnetic layers according to an embodiment is shown; FIG. 4C is an alternative detail view of a portion of the first figure, wherein Referring to the omitted cross-line detail, an expanded view of one of the magnetic layers according to an embodiment is shown; FIG. 4D is an alternate detail view of a portion of the first figure, in which the cross-line detail is omitted for clarity. FIG. 4E is an exploded view showing an alternative embodiment of the magnetic layer according to an embodiment; FIG. 4E is an alternate detail view of a portion of the first embodiment, wherein the cross-line detail is omitted for clarity, and the root is shown. One embodiment of an embodiment of the magnetic layer replaces the expanded view of the embodiment; FIG. 5 is a cross-sectional view of a portion of the metal clad circuit laminate of FIGS. 2 and 4C according to an embodiment, wherein The cross-line detail is omitted for clarity; FIG. 6A is an isometric view of an antenna according to an embodiment; 6B is a side view of the antenna according to FIG. 6A according to an embodiment; FIG. 6C is a top view of the antenna according to FIG. 6A according to an embodiment; and FIG. 7 is a view on the H field plane (H- Beam width at field plane, which illustrates the performance advantages of an embodiment; Figure 8 shows the comparison beamwidth at the E-field plane, which illustrates an implementation The performance advantage of the aspect; and Figure 9 illustrates the comparison of the impedance bandwidth and the gain bandwidth, which illustrates the performance advantages of an implementation aspect.

Described herein are magnetic-dielectric substrates and electronic devices comprising such substrates, such as circuit materials and antennas, wherein the magnetic-dielectric substrates comprise a magnetic reinforcement layer disposed in a dielectric material. The use of a magnetic reinforcing layer in the substrate unexpectedly provides a combination of excellent magnetic-electronic properties and excellent mechanical properties. The substrates can be further processed by methods that can be easily integrated into existing electronic device manufacturing methods.

As shown and described in the various figures and accompanying text, a magnetic-dielectric substrate has a magnetic reinforcement layer disposed within a dielectric layer in intimate contact with the dielectric layer. Generally, the magnetic reinforcing layer is disposed on the center of the dielectric layer and has a structure for providing structural reinforcement of the first and second dielectric layers. In one embodiment, a conductive layer is additionally disposed on one side of the magnetic-dielectric substrate To provide a single cladding circuit material that can be configured for use with a variety of electronic devices. For example, the conductive layer can be patterned to provide a circuit. In another embodiment, the magnetic-dielectric substrate is sandwiched between a conductive ground layer (ground plane) and a conductive element (patch) to provide a double clad layer. a circuit material, wherein a signal line (eg, a coaxial cable or a feeder strip) is disposed in signal communication with the patch to form an improved bandwidth The basic structure of the miniaturized high frequency antenna.

The single cladding circuit material can be formed by: forming a magnetic layer; laminating or laminating the first dielectric layer and the second dielectric layer onto the magnetic layer; and adhering or laminating a conductive layer to a first dielectric layer or a second dielectric layer. The double clad circuit material can be formed by: forming a magnetic layer; casting or laminating the first dielectric layer and the second dielectric layer onto the magnetic layer; and simultaneously or sequentially placing a first conductive element and a second conductive The component is applied to the first dielectric layer and the second dielectric layer.

FIG. 1 illustrates an embodiment of a magnetic-dielectric substrate 10 having a first dielectric layer 100 uniformly spaced from the first dielectric layer 100 and a second The dielectric layer 200 and the magnetic enhancement layer 300 are disposed between the first dielectric layer 100 and the second dielectric layer 200 and are in close contact with the first dielectric layer and the second dielectric layer. An additional dielectric layer (generally described by reference numeral 300) may be present as needed to provide the substrate with the desired properties.

Although the magnetic enhancement layer 300 is depicted by a wavy line having a "line thickness" in FIG. 1, it should be understood from the disclosure herein that the description is for general description purposes and is not intended to limit the embodiments disclosed herein. range. For example, in In one embodiment, the first dielectric layer 100, the second dielectric layer 200, and the magnetic reinforcement layer 300 may each be a continuous plane in structure, or the magnetic reinforcement layer 300 may be allowed to pass through the reinforcement layer 300. The woven or non-woven fibrous material having a void in contact between the first dielectric layer 100 and the second dielectric layer 200, or the magnetic reinforcing layer 300 may be an impregnated magnetic woven material having a polymer. Therefore, in an embodiment, the first dielectric layer 100 is structurally continuous in-plane continuous, and the second dielectric layer 200 is continuous in a superficial plane. And the magnetic reinforcement layer 300 is at least partially structurally continuous in a superficial plane. As used herein, the term at least partially in the superficially planar upper continuous system includes both a solid layer and a fibrous layer (eg, a woven or nonwoven layer) that may have a macroscopic void. When the magnetic reinforcement layer 300 is a solid layer, the first dielectric layer 100 is completely separated from the second dielectric layer 200. When the magnetic reinforcing layer is in the form of a woven or nonwoven fiber, the terms "first dielectric layer 100" and "second dielectric layer 200" refer to the regions on each side of the magnetic reinforcing layer 300 and are not The various embodiments are limited to two separate layers. In one embodiment, the magnetic reinforcement layer 300 has material properties including in-plane magnetic anisotropy. FIG. 1 depicts detail 1000, which is described below with reference to FIGS. 4A, 4B, 4C, 4D, and 4E.

The magnetic reinforcement layer 300 comprises a combination of a magnetic material and a reinforcing material, as explained in further detail below. The first dielectric layer 100 and the second dielectric layer 200 comprise a polymeric dielectric composition, as further described below.

The magnetic-dielectric substrate 10 can be used to fabricate a variety of electronic devices. In one embodiment, a single cladding circuit material comprises a magnetic-dielectric substrate 10 and a A layer of conductive metal on one side of substrate 10 (as further described below). Patterning the conductive layer (as explained in further detail below) provides a circuit.

2 shows the magnetic-dielectric substrate 10 of FIG. 1 sandwiched between electrical conductors 20 and 30 to form a double clad circuit material 50. In one embodiment, electrical conductors 20 and 30 are used as a conductive ground plane 20, and a conductive element 30, as will be discussed in more detail below.

Figure 3 illustrates a double clad circuit material 50 having conductive elements 30 patterned by etching, milling, or any other suitable method, as discussed in more detail below. As used herein, the term "patterning" includes a configuration in which the conductive element 30 has an in-line and in-plane conductive discontinuity 32.

The fibers may comprise a magnetic material, such as a hexagonal ferrite magnetic material. The hexagonal ferrite magnetic material may comprise Sr, Ba, Co, Ni, Zn, V, Mn, or a combination comprising at least one of the foregoing, particularly Ba and Co. The magnetic material may comprise a ferromagnetic material such as a ferrite, a ferrite alloy, cobalt, a cobalt alloy, iron, an iron alloy, nickel, a nickel alloy, or a combination comprising at least one of the foregoing magnetic materials. The magnetic material may comprise hexagonal ferrite, magnetite (Fe ₃ O ₄ ), and MFe ₂ O ₄ , wherein M comprises at least one of Co, Ni, Zn, V, and Mn, particularly Co, Ni, and Mn. The magnetic material may comprise a metal iron oxide of the formula M _x Fe _y O _z , for example, MFe ₁₂ O ₁₉ , Fe ₃ O ₄ , MFe ₂₄ O ₄₁ , or MFe ₂ O ₄ , wherein the M system is Sr, Ba, Co, Ni, Zn, V, and Mn; particularly Co, Ni, and Mn; or a combination comprising at least one of the foregoing. As is known in the art, a hexagonal ferrite system has a hexagonal structure of magnetic iron oxide, which may include Al, Ba, Bi, Co, Ni, Ir, Mn, Mg, Mo, Nb, Nd, Sr, V. , Zn, Zr, or a combination comprising one or more of the foregoing. Different types of hexagonal ferrites include, but are not limited to, M-type ferrites, such as BaFe ₁₂ O ₁₉ (BaM or barium ferrite), SrFe ₁₂ O ₁₉ (SrM or barium ferrite), and cobalt- Titanium substituted M ferrite, Sr- or BaFe _12-2 x Co x Ti x O ₁₉ (CoTiM); Z-type ferrite (Ba ₃ Me ₂ Fe ₂₄ O ₄₁ ), such as Ba ₃ Co ₂ Fe ₂₄ O ₄₁ (Co ₂ Z); Y-type ferrite (Ba ₂ Me ₂ Fe ₁₂ O ₂₂ ), such as Ba ₂ Co ₂ Fe ₁₂ O ₂₂ (Co ₂ Y) or Mg ₂ Y; W-type ferrite (BaMe ₂ Fe ₁₆ O ₂₇ ), for example BaCo ₂ Fe ₁₆ O ₂₇ (Co ₂ W); X-type ferrite (Ba ₂ Me ₂ Fe ₂₈ O ₄₆ ), for example Ba ₂ Co ₂ Fe ₂₈ O ₄₆ (Co ₂ X); And a U-type ferrite (Ba ₄ Me ₂ Fe ₃₆ O ₆₀ ), for example, Ba ₄ Co ₂ Fe ₃₆ O ₆₀ (Co ₂ U), wherein in the above formula, Me is a +2 ion, and Ba may be substituted by Sr. The specific hexagonal ferrite further comprises Ba and Co, optionally with one or more other divalent cations (substituted or doped). The magnetic material may comprise ferromagnetic cobalt carbide (eg, Co ₂ C and Co ₃ C phases), for example, samarium cobalt Z-type hexagonal ferrite (Co ₂ Z ferrite). The magnetic material may be present in the form of one or both of fibers and particles.

In one embodiment, and with reference to detail 1000 in FIG. 4A, the magnetic reinforcement layer 300 is a fiber magnetic layer 400. In this embodiment, the plurality of fibers are a magnetic material, such as described above. The fibers may include ferrite fibers, ferrite alloy fibers, cobalt fibers, cobalt alloy fibers, iron fibers, iron alloy fibers, nickel fibers, and nickel alloy fibers. In one embodiment, the fibers are hexagonal ferrite fibers, magnetite (Fe ₃ O ₄ ) fibers, or MFe ₂ O ₄ fibers, wherein the M system is at least Co, Ni, Zn, V, or Mn. In particular, at least one of Co, Ni, or Mn. In any of the magnetic materials used herein, a paramagnetic element (e.g., platinum, aluminum, and oxygen) or a lanthanide may be present.

The fibers may be twisted, twisted, knit, braided or the like. The fibers may have a diameter in the micrometer or nanometer range, such as from 2 nanometers (nm) to 10 micrometers, or from 2 nanometers to 500 nanometers, or from 500 nanometers to 5 micrometers. In one embodiment, the fibers have an average fiber diameter of from 50 nanometers to 10 micrometers, or from 50 nanometers to less than or equal to 900 nanometers, particularly from 20 nanometers to 250 nanometers, in terms of fiber length.

The fibrous magnetic layer 400 can be in the form of a cloth containing the fibers. The fabric can be woven or non-woven, such as a felt. The fabric may comprise only magnetic fibers or a combination of magnetic and non-magnetic fibers (e.g., glass fibers, or polymeric magnetic fibers, as described below), provided that the magnetic fibers are effective to provide the desired properties. presence. In a particular embodiment, the fibrous magnetic layer 400 is a fabric such as a ferrite or ferrite alloy fabric, a cobalt or cobalt alloy fabric, an iron or iron alloy fabric, or a nickel or nickel alloy fabric. The thermally stable fiber reinforcement reduces shrinkage of the magnetic-dielectric substrate in the plane of the substrate upon curing. In addition, the use of fabric reinforcement results in a relatively high mechanical strength of the substrate. Such substrates are easier to handle by methods in commercial applications (e.g., lamination, including roll-to-roll lamination).

In an embodiment, and referring to detail 1000 in FIG. 4B, the magnetic layer 300 is a polymer having magnetic particles dispersed therein (eg, liquid crystal polymer, polyether sulfimine, polyether ketone, polyfluorene, Polyether oxime, polycarbonate, polyester, etc.). In this embodiment, the magnetic layer may be a fabric as described above, comprising a polymer fiber or nanofiber 500 having magnetic particles 502 dispersed therein, or a continuous dispersion of magnetic nanoparticles 512 therein. Polymer layer 510, for example, as described below Figure 4D is explained in more detail.

The above magnetic material may be in the form of a magnetic particle. The magnetic particles may comprise one or both of magnetic nanoparticles and micron sized particles. The size of the magnetic particles is not particularly limited and may have a D ₅₀ value (by mass) of from 10 nm to 10 μm, particularly from 100 nm to 5 μm, more particularly from 1 μm to 5 μm. The magnetic nanoparticles may have 1 nm to 900 nm, particularly 1 to 100 nm, more in particular 5 to ₅₀ nm to 10 nm value of D (by mass). Magnetic particles (micro-particle) can have from 1 to 10 microns, particularly 2 microns to 5 microns D ₅₀ values (by mass). The magnetic particles may be irregular or regular, such as spherical, oval, polygonal flake, and the like. The magnetic particles may comprise ferromagnetic particles such as ferrite, ferrite alloy, cobalt, cobalt alloy, iron, iron alloy, nickel, nickel alloy, or a combination comprising at least one of the foregoing magnetic materials. In a specific embodiment, the magnetic particles comprise hexagonal ferrite, magnetite (Fe ₃ O ₄ ), and MFe ₂ O ₄ , wherein M comprises at least one of Co, Ni, Zn, V, and Mn. Especially Co, Ni, and Mn. The magnetic particles may be surface treated to aid dispersion in the polymer, for example by a surfactant such as oleylamine oleic acid or the like. The magnetic particles may be more coated with other materials such as yttrium oxide or silver.

In another embodiment, and referring to the detail 1000 in FIG. 4C, the magnetic layer 300 is composed of a first magnetic layer 610, a second magnetic layer 620, and a dielectric reinforcement layer 630. The second magnetic layer 620 is, for example, evenly spaced apart from the first magnetic layer 610. The dielectric strengthening layer 630 is disposed between the first magnetic layer 610 and the second magnetic layer 620 and with the first magnetic layer 610 and the second magnetic layer. 620 is in close contact. As used herein, evenly spaced apart means the first dielectric layer and the second The distance between the dielectric layers is constant throughout the substrate, for example, the distance between the locations may vary within 5% of the average pitch value, or within 1%. The dielectric strengthening layer 630 can be a glass, fiberglass fabric, a reinforced polymer layer, a fiber reinforced polymer layer, or any other dielectric layer having structural integrity suitable for the purposes disclosed herein. In one embodiment, each of the first magnetic layer 610 and the second magnetic layer 620 is derived from a thin film ferrite.

In one embodiment, the dielectric strengthening layer 630 is a fiber as described in FIG. 4C, and the first magnetic layer 610 and the second magnetic layer 620 are coated with individual fibers or fabrics. The fiber dielectric reinforcing layer may comprise a nonwoven or woven fabric of fibers, a thermally stable web, such as glass fibers (eg, E, S, and D glass fibers), high temperature polymeric fibers (eg, polyether sulfimine, polyfluorene). Polyetherketone, polyester, or liquid crystal polymer fibers, such as VECTRAN ^(TM ) available from Kuraray, or a combination comprising at least one of the foregoing. The continuous or fiber dielectric strengthening layer 630 can be applied by methods known in the art (e.g., chemical vapor deposition, electron beam deposition, etc.).

In an embodiment, and referring to detail 1000 in FIG. 4D, the first dielectric layer 100 is disposed in direct contact with one side 302 of the magnetic layer 300 and forms a layer 102 on the side, and the second dielectric Layer 200 is disposed in direct contact with opposite side 304 of magnetic layer 300 and forms a layer 202 on the opposite side. The layers 102, 202 can be formed in the following cases: the magnetic layer 300 is made from a solid, cured, or non-impregnable magnetic material, and the first dielectric layer 100 and the second dielectric layer 200 are self-flowable Distributed on the magnetic layer 300 (before curing), or on the magnetic layer 300, and chemically, thermally or mechanically bonded to the magnetic layer 300 (if thermoset, before fully cured) Flowable thermoplastic or thermoset after curing Made from a polymer.

In one embodiment, and referring to detail 1000 in FIG. 4E, the first dielectric layer 100 is partially impregnate 104 to one side 302 of the magnetic layer 300, and the second dielectric layer 200 is magnetically paired. The opposite side 304 of layer 300 is partially impregnated 204. The partial impregnations 104, 204 can be formed in the following cases: for example, the magnetic layer 300 is made from an impregnable material (such as the fiber magnetic layer 400 described above), and the first dielectric layer 100 and the second dielectric layer 200 are Made from a flowable thermoplastic or thermoset polymer that is flowably distributed over the magnetic layer 300 (if thermoset, prior to curing).

Referring now to FIG. 5, there is shown a portion of a magnetic-dielectric substrate 10 similar to that depicted in FIG. 4C but having a conductive ground layer 20 disposed on the first dielectric layer. An outer surface 106 of the electrical layer 100 and a conductive element 30 are disposed on an outer surface 206 of the second dielectric layer 200, wherein the conductive element 30 is spaced apart from the conductive ground layer 20. In one embodiment, the conductive ground layer 20 and the conductive element 30 are made from a conductive metal such as copper, and the magnetic-dielectric substrate 10, the conductive ground layer 20, and the conductive element 30 can be collectively fabricated into one. The laminate is also referred to as a "copper clad circuit laminate" 50. In one embodiment, a signal line 40 (eg, which may be a coaxial cable, a feed strip, or a micro-strip central signal conductor) is configured. Signal communication is with the conductive element 30. In an embodiment in which the coaxial cable is provided with a ground sheath disposed about a central signal line, the ground sheath is configured to have electrical ground communication with the conductive ground plane 20.

To provide a magnetic-dielectric substrate having certain and desirable electro-magnetic properties 10. A copper clad circuit laminate 50, an assembly of copper clad laminates 50 having certain dimensions relative to each other, which will now be described with reference to Figure 5, but may also be suitable for use in several other figures provided herein. Other embodiments shown.

In one embodiment, the first dielectric layer 100 has a first thickness 108 and the second dielectric layer 200 has a second thickness 208 that is substantially equal in thickness to the first thickness 108. By forming a magnetic-dielectric substrate 10 having a first dielectric layer 100 and a second dielectric layer 200 having substantially equal thicknesses, the magnetic layer 300 will be disposed in the center of the laminate and utilize this magnetic - A dielectric cladding substrate 50 produced by the dielectric substrate 10 will collect a resulting magnetic field plane originating from the patch 30 and the ground plane 20 in the central region of the magnetic-dielectric substrate 10. The established electric field (described further below) has been found to produce improved signal bandwidths (described further below) that are superior to prior art devices. However, although the magnetic layer 300, 610, 620 is preferably at the center of the magnetic-dielectric substrate 10, since the center position will have the highest concentration of the patch antenna magnetic field, it should be understood that the layers can be applied to this document. The way to reveal the purpose is to place it anywhere inside the patch. Moreover, an embodiment may include a configuration in which the magnetic layers are designed to have a structure that strictly follows one of the magnetic field pattern structures, wherein discontinuities in the magnetic layers will be used to suppress propagation modes in the antenna design ( Propagating mode).

In one embodiment, the first magnetic layer 610 has a first magnetic layer thickness 612, the second magnetic layer 620 has a second magnetic layer thickness 622, and the dielectric strengthening layer 630 has a reinforcing layer thickness 632. In one embodiment, the ratio of the enhancement layer thickness 632 to the first magnetic layer thickness 612 is equal to or greater than 25, and the ratio of the reinforcement layer thickness 632 to the second magnetic layer thickness 622 is equal to or greater than 25.

Although reference may be made herein to a single magnetic layer, or by a first The magnetic layer 610 and the second magnetic layer 620 constitute one magnetic layer 300, but it should be understood that the number of layers forming the magnetic layer 300 is not limited to only one or two layers, but may be suitable for the purposes disclosed herein. Any number of layers.

An example thickness of the above thickness in accordance with the above ratio is: a first thickness 108 of the first dielectric layer 100 is 0.25 mm; a second thickness 208 of the second dielectric layer 200 is 0.25 mm; a thickness of the dielectric layer of the dielectric strengthening layer 630 632 is 0.25 mm; the first magnetic layer 610 has a first magnetic layer thickness 612 of 10 microns; and the second magnetic layer 620 has a second magnetic layer thickness 622 of 10 microns.

In one embodiment, the conductive element 30 has a thickness 34 of 40 microns.

Referring now to Figures 5, 6A, 6B and 6C, a copper clad laminate 50 (magnetic-dielectric substrate 10, conductive ground layer 20, for use as an antenna 60) is depicted. And various views of the conductive element 30). In one embodiment, the first dielectric layer 100 has an outer dimension (eg, 68 mm x 88 mm) defining a first footprint, and the second dielectric layer 200 has a defined size. Substantially equal to the outer dimension of the second footprint of the first footprint (eg, 68 mm x 88 mm), the magnetic layer 300 has a third footprint defining a third footprint substantially equal to the first footprint and the second footprint The outer dimension (e.g., 68 mm x 88 mm), the conductive ground layer 20 has an outer dimension (e.g., 68 mm x 88 mm) defining a fourth footprint substantially equal to the first footprint, and the conductive element 30 has An outer dimension (e.g., 34 mm x 44 mm) defining a fifth footprint that is smaller than the second footprint is defined. In an embodiment, and referring to the coverage area mentioned above, the ratio of the area of the fifth coverage area (conductive element 30) to the area of the second coverage area (second dielectric layer 200) is equal to or less than 0.3. And in another embodiment The middle is equal to or less than 0.25. In one embodiment, the fifth footprint of the conductive element 30 is disposed on the center of the second footprint of the second dielectric layer 200.

In one embodiment, the conductive elements 30 of the copper clad laminate 50 are patterned (see, for example, Figure 3) to produce the desired shape for use as an antenna.

The dielectric materials used in the dielectric layer are selected to provide the desired electrical and mechanical properties, and typically comprise a thermoplastic or thermoset polymer matrix and a dielectric filler. The dielectric layer may comprise from 30% to 99% by volume (vol%) of polymer matrix, and from 0% to 70% by volume, in particular from 1% to 70% by volume, more particularly 5 vol% to 50 vol% filler. The polymer and filler are selected to provide a dielectric layer having a dielectric constant of less than 3.5 at 10 GHz and a dissipation factor of less than 0.006, particularly less than or equal to 0.0035. The loss factor can be measured by the IPC-TM-650 X-band strip line method or by the Split Resonator method.

The dielectric layer comprises a low polarity, low dielectric constant, and low loss polymer which may be thermoset or thermoplastic. The polymer may comprise 1,2-polybutadiene (PBD), polyisoprene, polybutadiene-polyisoprene copolymer, polyetherimine ( Polyetherimide, PEI), fluoropolymers such as polytetrafluoroethylene (PTFE), polyamidene, polyetheretherketone (PEEK), polyamidoximine, poly(p-butyric acid) Polyethylene terephthalate (PET), polyethylene naphthalate, polycyclohexylene terephthalate, polyphenylene Ether), those based on allylated polyphenylene ether, or a combination comprising at least one of the foregoing. Combinations of low polarity and higher polarity may also be used, non-limiting examples including epoxy and poly(phenylene ether), epoxy and poly(etherimine), cyanate and poly(phenylene ether), and 1, 2-polybutadiene and polyethylene.

Fluoropolymers include fluorinated homopolymers (eg, PTFE and polychlorotrifluoroethylene (PCTFE)), and fluorinated copolymers (eg, tetrachloroethylene or chlorotrifluoroethylene and monomers ( For example, a copolymer of hexafluoropropylene and perfluoroalkylvinylethers, vinylidene fluoride, vinyl fluoride, ethylene, or a combination comprising at least one of the foregoing. The fluoropolymer may comprise a combination of at least one of the different fluoropolymers.

The polymer matrix can comprise thermoset polybutadiene and/or polyisoprene. As used herein, the term "thermosetting polybutadiene and/or polyisoprene" includes homopolymers and copolymers comprising units derived from butadiene, isoprene, or mixtures thereof. Units derived from other copolymerizable monomers may also be present in the polymer, for example, in the form of a graft. Exemplary copolymerizable monomers include, but are not limited to, vinylaromatic monomers such as substituted and unsubstituted monovinyl aromatic monomers such as styrene, 3-methylstyrene, 3,5-diethylstyrene, 4-n-propylstyrene, α-methylstyrene, α-methylvinyltoluene, p-hydroxystyrene, p-methoxystyrene, α-chloride Styrene, α-bromostyrene, dichlorostyrene, dibromostyrene, tetrachlorostyrene, etc.; and substituted and unsubstituted divinyl aromatic monomers, such as divinylbenzene, divinyl Toluene, etc. Combinations comprising at least one of the foregoing copolymerizable monomers can also be used. Exemplary thermoset polybutadiene and/or Polyisoprene includes, but is not limited to, butadiene homopolymer, isoprene homopolymer, butadiene-vinyl aromatic copolymer (eg, butadiene-styrene), isoprene a vinyl aromatic copolymer (for example, an isoprene-styrene copolymer) or the like.

Thermosetting polybutadiene and/or polyisoprene may also be modified. For example, the polymer can be hydroxyl-terminated, terminated with methacrylate, terminated with a carboxylic acid ester, and the like. Post-reactive polymers such as epoxy, maleic anhydride, or urethane modified polymers of butadiene or isoprene polymers can also be used. The polymer may also be crosslinked, for example, by a divinyl aromatic compound such as divinylbenzene, for example, polybutadiene-styrene crosslinked with divinylbenzene. Exemplary polymers are broadly classified by their manufacturers as "polybutadiene", for example, Nippon Soda Corporation (Tokyo, Japan) and Cray Valley Hydrocarbon Specialty Chemicals. ) (Exton, PA). Mixtures of polymers can also be used, for example, a mixture of a polybutadiene homopolymer and a poly(butadiene-isoprene) copolymer. Combinations comprising syndiotactic polybutadiene can also be used.

The thermosetting polybutadiene and/or polyisoprene may be liquid or solid at room temperature. The liquid polymer can have a number average molecular weight (Mn) greater than or equal to 5,000 grams per mole (g/mol). The liquid polymer can have an Mn of less than 5,000 grams per mole, particularly from 1,000 grams per mole to 3,000 grams per mole. Thermosetting polybutadiene and/or polyisoprene having at least 90% by weight of 1,2 addition can exhibit upon curing due to a large amount of pendent vinyl which can be used for crosslinking Larger crosslink density.

Based on total polymer matrix composition, polybutadiene and/or polyisoprene The diene may be present in the polymer composition in an amount of up to 100% by weight, in particular up to 75% by weight, relative to the total polymer matrix composition, more particularly from 10% to 70% by weight, even more particularly 20% by weight % to 60% by weight or 70% by weight.

Other polymers that can be co-cured with thermoset polybutadiene and/or polyisoprene can be added for specific properties or process modifications. For example, to improve the dielectric strength and mechanical properties of dielectric substrate materials over time, lower molecular weight ethylene-propylene elastomers can be used in the system. The ethylene-propylene elastomer system used herein is a copolymer, terpolymer, or other polymer mainly comprising ethylene and propylene. The ethylene-propylene elastomer can be further classified as an EPM copolymer (i.e., a copolymer of ethylene and a propylene monomer) or an EPDM terpolymer (i.e., a terpolymer of an ethylene, propylene, and diene monomer). ). Specifically, the ethylene-propylene-diene terpolymer rubber has a saturated main chain with an unsaturation which can be used for simple crosslinking outside the main chain. A liquid ethylene-propylene-diene terpolymer rubber in which the diene is dicyclopentadiene can be used.

The ethylene-propylene rubber may have a molecular weight of less than 10,000 g/viscosity average molecular weight (Mv). Ethylene - propylene rubber may comprise Mv of 7,200 g / mole of ethylene - propylene rubber, which is based from the Baton Rouge, Louisiana Lion copolymer (Lion Copolymer, Baton Rouge, LA ) under the trade name TRILENE ^TM CP80 available; Mv of 7,000 g / mole of the liquid ethylene - propylene - dicyclopentadiene terpolymer rubber, which is based tradename from Lion copolymer TRILENE ^TM 65 is commercially available; Mv and 7,500 g / mole of the liquid ethylene - propylene - ethylidene norbornene (ethylidene norbornene) terpolymer based tradename from Lion copolymer TRILENE ^TM 67 is commercially available.

Ethylene-propylene rubber can effectively maintain the stability of the substrate material over time, especially the dielectric strength and mechanical properties. Typically, such amounts are up to 20% by weight, particularly from 4% to 20% by weight, more particularly from 6% to 12% by weight, relative to the total weight of the polymer matrix composition.

Another type of co-curable polymer is an elastomer containing unsaturated polybutadiene or an elastomer containing unsaturated polyisoprene. This component may be a primary 1,3-addition butadiene or isoprene with an ethylenically unsaturated monomer (eg, a vinyl aromatic compound such as styrene or alpha-methyl styrene; acrylate) Or a random or block copolymer of a methacrylate such as methyl methacrylate; or acrylonitrile. The elastomer may be a solid, thermoplastic elastomer comprising a linear or graft-type block copolymer having a polybutadiene or polyisoprene block and one derived from A thermoplastic block of a monovinyl aromatic monomer such as styrene or alpha-methylstyrene. Block copolymers of this type include styrene-butadiene-styrene triblock copolymers, for example, they are manufactured by Dexco Polymers, Houston, TX. under the trade name VECTOR 8508M ^TM are available, from Houston, Texas Eni chemical elastomer America (Enichem elastomers America, Houston, TX ) is commercially available under the trade name SOL-T-6302 ^TM's, getting from here from Dai Nasuo other elastomer (Dynasol elastomers) tradename available by CALPRENE ^TM 401; and styrene - butadiene diblock copolymer mixture containing styrene and butadiene, and the diblock and triblock Copolymers, for example, are commercially available from Kraton Polymers (Houston, TX) under the tradename KRATON D1118. KRATON D1118 is a copolymer containing mixed diblock/triblock styrene and butadiene containing 33% by weight of styrene.

The polybutadiene-containing elastomer or the polyisoprene-containing elastomer may further comprise a second block copolymer similar to the above, but a polybutadiene or polyisoprene block system. By hydrogenation, a polyethylene block (in the case of polybutadiene) or an ethylene-propylene copolymer block (in the case of polyisoprene) is formed. When used in combination with the above copolymers, a material having higher toughness can be produced. An exemplary second block copolymer of this type is KRATON GX1855 (available from Kraton Polymers), which is believed to be a styrene-high 1,2-butadiene-styrene block copolymer and styrene-( A mixture of ethylene-propylene)-styrene block copolymers.

The elastomer containing unsaturated polybutadiene or the elastomer component containing unsaturated polyisoprene may be from 2% by weight to 60% by weight, particularly 5% by weight, based on the total weight of the polymer matrix composition. An amount of 50% by weight, more specifically 10% by weight to 40% by weight or 50% by weight, is present in the polymer matrix composition.

Other co-curable polymers that may be added for specific properties and processing modifications include, but are not limited to, homopolymers or copolymers of ethylene, such as polyethylene and ethylene oxide copolymers; Rubber; norbornene polymer, such as polydicyclopentadiene; hydrogenated styrene-isoprene-styrene copolymer and butadiene-acrylonitrile copolymer; unsaturated polyester. The amount of such copolymers is typically less than 50% by weight of the total polymer in the polymer matrix composition.

Free radical curable monomers can also be added for specific properties and processing modifications, for example to increase the crosslink density after curing of the system. Exemplary monomers which may be suitable crosslinking agents include, for example, di-, tri- or higher ethylenically unsaturated monomers such as divinylbenzene, triallyl cyanurate, diallyl phthalate and multifunctional acrylate monomers (e.g., available from SARTOMER ^TM polymer of Newtown Square, Pennsylvania, United states of沙多瑪(Sartomer USA, Newtown Square, PA )), or combinations thereof, which are commercially available system . The crosslinking agent may be present in the polymer matrix composition in an amount of up to 20% by weight, particularly from 1% to 15% by weight, based on the total weight of the total polymer in the polymer matrix composition.

A curing agent can be added to the polymer matrix composition to accelerate the curing reaction of the polyene having an olefinic reactive site. The curing agent may comprise an organic peroxide, for example, dicumyl peroxide, t-butyl perbenzoate, 2,5-dimethyl-2,5-di ( Tertiary butylperoxy)hexane, α,α-di-bis(t-butyl peroxy)diisopropylbenzene, 2, 5-dimethyl-2,5-di(tertiarybutylperoxy)hexyne-3, or a combination comprising at least one of the foregoing. A carbon-carbon initiator can be used, for example, 2,3-dimethyl-2,3-diphenylbutane. The curing agent or initiator may be used singly or in combination. The amount of curing agent may range from 1.5% to 10% by weight, based on the total weight of the polymer in the polymer matrix composition.

In some embodiments, the polybutadiene or polyisoprene polymer is functionalized with a carboxyl group. Functionalization can be achieved using polyfunctional compounds having two in the molecule: (i) a carbon-carbon double bond or a carbon-carbon triple bond, and (ii) a carboxyl group (including a carboxylic acid, anhydride, guanamine, ester, or At least one of acid halides. A specific carboxy carboxylic acid or ester. Examples of polyfunctional compounds which may provide a carboxylic acid functional group include maleic acid, maleic anhydride, fumaric acid, and citric acid. In particular, adducts of polybutadiene and maleic anhydride can be used in the thermosetting composition. Suitable maleated polybutadiene polymers are, for example, from Cray Valley under the tradenames RICON 130MA8, RICON 130MA13, RICON 130MA20, RICON 131MA5, RICON 131MA10, RICON 131MA17, RICON 131MA20, and RICON 156MA17 were purchased. Suitable maleated polybutadiene-styrene copolymers are commercially available, for example, from Sartomer under the tradename RICON 184MA6. RICON 184MA6 is an adduct of butadiene-styrene copolymer with maleic anhydride having a styrene content of 17% to 27% by weight and an Mn of 9,900 g/mole.

The relative amounts of the various polymers (e.g., polybutadiene or polyisoprene polymers and other polymers) in the polymer matrix composition may depend on the particular conductive metal layer, circuit material, and copper cladding used. The expected properties of laminates, and similar considerations. For example, the use of poly(strandyl ether) can provide increased bond strength to a conductive metal layer (eg, copper). The use of polybutadiene or polyisoprene polymers can increase the high temperature resistance of laminates, for example, when such polymers are functionalized with carboxyl groups. The use of an elastomeric block copolymer can be used to make the components of the polymeric matrix material compatible. The determination of the appropriate amount of each component can be carried out without undue experimentation, depending on the desired properties of a particular application.

The at least one dielectric layer can further comprise a particulate dielectric filler selected to adjust the dielectric constant, loss factor, coefficient of thermal expansion, and other properties of the dielectric layer. The dielectric filler may comprise, for example, titanium dioxide (rutile and anatase), barium titanate, barium titanate, cerium oxide (including molten amorphous cerium oxide), silicon carbide, apatite, Ba ₂ Ti ₉ O ₂₀ , Solid glass spheres, synthetic glass or ceramic hollow spheres, quartz, boron nitride, aluminum nitride, tantalum carbide, tantalum oxide, aluminum oxide, aluminum oxide trihydrate, magnesium oxide, mica, talc, nanoclay, Magnesium hydroxide, or a combination comprising at least one of the foregoing. A single primary filler, or a combination of secondary fillers can be used to provide the desired balance of properties.

If desired, the filler may be surface treated with a ruthenium containing coating (e.g., an organofunctional alkoxy silane coupling agent). A zirconate or titanate coupling agent can be used. These coupling agents improve the dispersion of the filler in the polymer matrix and reduce the water absorption of the final composite circuit substrate. The filler component may comprise from 5 to 50% by volume of microspheres and from 70 to 30% by volume of molten amorphous cerium oxide as a secondary filler, based on the weight of the filler.

The dielectric layer may also optionally contain a flame retardant which is useful for rendering the layer flame resistant. These flame retardants can be halogenated or unhalogenated. The flame retardant may be present in the dielectric layer in an amount of from 0% by volume to 30% by volume based on the volume of the dielectric layer.

In one embodiment, the flame retardant is inorganic and is present in the form of particles. An exemplary inorganic flame retardant is a metal hydrate having, for example, 1 nm to 500 nm, preferably 1 nm to 200 nm, or 5 nm to 200 nm, Or a volume average particle diameter of from 10 nm to 200 nm; or, the volume average particle diameter is from 500 nm to 15 μm, for example from 1 μm to 5 μm. The metal hydrate is a hydrate of a metal such as Mg, Ca, Al, Fe, Zn, Ba, Cu, Ni, or a combination comprising at least one of the foregoing. Hydrates of Mg, Al, or Ca are particularly preferred, such as aluminum hydroxide, magnesium hydroxide, calcium hydroxide, iron hydroxide, zinc hydroxide, copper hydroxide, and nickel hydroxide; and hydrates of calcium aluminate. , gypsum dihydrate, zinc borate and barium metaborate. A composition of such a hydrate can be used, for example, a hydrate containing Mg and one or more of Ca, Al, Fe, Zn, Ba, Cu, and Ni. A preferred complex metal hydrate has the formula MgMx.(OH) _y wherein M is Ca, Al, Fe, Zn, Ba, Cu or Ni, x is from 0.1 to 10, and y is from 2 to 32. The flame retardant particles can be coated or otherwise treated to improve dispersion and other properties.

Alternatively, or in addition to the inorganic flame retardant, an organic flame retardant can be used. Examples of the organic flame retardant include melamine cyanurate, fine particle size melamine polyphosphate, various other phosphorus-containing compounds (for example, an aromatic phosphonite, diphosphorane). Acid esters, phosphonates, and phosphates, specific polysilsesquioxanes, oxoxanes, and halogenated compounds (eg, hexachloroendomethylenetetrahydrophthalic acid (HET acid) ), tetrabromodecanoic acid and dibromo neopentyl glycol). A flame retardant (e.g., a bromine-containing flame retardant) may be present in an amount from 20 phr (parts per hundred resin) to 60 phr, particularly from 30 phr to 45 phr. Examples of brominated flame retardants include Saytex BT93W (ethylene bistetrabromoimide), Saytex 120 (tetradecyldiphenoxybenzene), and Saytex 102 (decabromodiphenyl oxide). The flame retardant can be used in combination with a synergist, for example, a halogenated flame retardant can be used in combination with a synergist (such as antimony trioxide), and a phosphorus-containing flame retardant can be combined with a nitrogen-containing compound ( For example, melamine is used in combination.

Useful conductive layers for forming circuit materials include, for example, stainless steel, copper, gold, silver, aluminum, zinc, tin, lead, transition metals, and alloys comprising at least one of the foregoing. The thickness of the conductive layer is not particularly limited, and there is no limitation on the shape, size, or texture of the surface of the conductive layer. The conductive layer may have a thickness of from 3 micrometers to 200 micrometers, particularly from 9 micrometers to 180 micrometers. When two or more conductive layers are present, the thicknesses of the two layers may be the same or different. In an exemplary embodiment, the conductive layer is a copper layer. Suitable conductive layers include a thin layer of conductive metal, such as the copper foil currently used in forming circuits, such as electrodeposited copper foil. The copper foil may have a root mean square (RMS) roughness of less than or equal to 2 microns, particularly less than or equal to 0.7 microns, The roughness was measured using a white light interferometry using a Veeco instrument WYCO optical profiler. Various materials and articles used herein (including magnetic reinforcing layers, dielectric layers, magnetic-dielectric substrates, circuit materials, and electronic devices incorporating such circuit materials) can be formed by methods generally known in the art.

The conductive layer can be formed by placing the conductive layer in the mold prior to molding, by laminating the conductive layer on the magnetic-dielectric substrate, by direct laser structuring, or by An adhesive layer adheres the conductive layer to the substrate for application. For example, a laminated substrate may comprise a desired polyfluorocarbon film between the conductive layer and the magnetic-dielectric substrate, and a polyfluorocarbon film and conductive A layer of microglass-reinforced fluorocarbon polymer between the layers. The microglass-reinforced layer of fluorocarbon polymer increases the adhesion of the conductive layer to the magnetic-dielectric substrate. The microglass may be present in an amount from 4% to 30% by weight, based on the total weight of the layer. The microglass may have a longest length scale of less than or equal to 900 microns, particularly less than or equal to 500 microns. The microglass can be of the microglass type sold by Johns-Manville Corporation of Denver, Colorado. The polyfluorocarbon film comprises a fluoropolymer (for example, polytetrafluoroethylene (PTFE), a fluorinated ethylene-propylene copolymer (for example, Teflon FEP), and a copolymer having a tetrachloroethylene main chain and a perfluorinated alkoxy side chain. (eg Teflon PFA)).

The conductive layer can be applied by direct direct structuring of the laser. Here, the magnetic-dielectric substrate may comprise a laser direct structuring additive, using a laser for irradiating the surface of the substrate to form a track of a laser direct structuring additive, and a conductive metal Applied to the trajectory. Laser direct structuring additive may comprise a metal oxide Particles such as titanium oxide and copper chromium oxide. The laser direct structuring additive may comprise a spinel-based inorganic metal oxide particle, such as spinel copper. The metal oxide can be applied, for example, to a composition comprising tin and antimony (e.g., from 50% to 99% by weight tin and from 1% to 50% by weight, based on the total weight of the coating). The laser direct structuring additive may comprise from 2 parts to 20 parts of the additive based on 100 parts of the respective composition. Radiation can be performed using a YAG laser having a wavelength of 1064 nm at a power output of 10 watts, a frequency of 80 kHz, and a rate of 3 meters per second. The conductive metal can be applied using an electroplating process in an electroless plating bath containing, for example, copper.

Alternatively, the conductive layer can be applied by applying the conductive layer in an adhesive manner. In one embodiment, the conductive layer is a circuit (a metallization layer of another circuit), such as a flexible circuit. For example, an adhesive layer can be disposed between one or both of the (etc.) conductive layers and the substrate. The adhesive layer may comprise a poly(aryl ether); and a carboxyl functionalized polybutadiene or polyisoprene polymer comprising butadiene, isoprene, or butadiene and isoprene a unit, and 0% by weight to less than or equal to 50% by weight of the co-curable monomer unit; wherein the composition of the adhesive layer is different from the composition of the substrate layer. The adhesive layer may be present in an amount from 2 g/m 3 to 15 g/m 3 . The poly(arylene ether) may comprise a carboxyl functional poly(strandyl ether). The poly(alkylene ether) may be a reaction product of a poly(aryl ether) and a cyclic anhydride, or a reaction product of a poly(aryl ether) and maleic anhydride. The carboxyl functionalized polybutadiene or polyisoprene polymer can be a carboxyl functionalized butadiene-styrene copolymer. The carboxyl functionalized polybutadiene or polyisoprene polymer can be the reaction product of a polybutadiene or polyisoprene polymer with a cyclic anhydride. The carboxyl functionalized polybutadiene or polyisoprene polymer can be a maleated polybutadiene-styrene or a maleated polyisoprene-styrene copolymer. In the case where the specific material and the form of the circuit material permit, the known in the art can be used. Other methods are used to apply a conductive layer, such as electrodeposition, chemical vapor deposition, lamination, and the like.

Where the magnetic reinforcement layer comprises a dielectric reinforcement, the magnetic reinforcement layer can be by, for example, chemical vapor deposition, electron beam deposition, lamination, dip coating, spray coating, reverse roll coating, knife-over-roll ), knife-over-plate, metering rod coating, flow coating, etc., coating the magnetic layer on the dielectric reinforcement layer (eg, using a giant continuous magnetic layer or utilizing magnetic properties) Formed by particles). The magnetic layer can be applied to the dielectric reinforcement layer as a solution comprising a magnetic layer or a precursor thereof and a suitable solvent. The magnetic layers can be applied to both sides of the dielectric reinforcing layer in the same or different manner. The thickness of the first magnetic layer and the second magnetic layer may be independently from 1 micrometer to 5 micrometers. Alternatively, in the case of dielectric reinforcing layer fibers, the fibers may be impregnated into the magnetic layer by the above method.

In another embodiment, the magnetic particles can be added to the dielectric reinforcement layer during formation of the dielectric reinforcement layer. For example, a molten or dissolved liquid mixture comprising a dielectric reinforcing layer and magnetic particles can be spun into fibers to form a magnetic reinforcing layer.

The dielectric layer can be formed by direct casting onto the magnetic layer or can produce a dielectric layer that can be laminated to the magnetic layer. The dielectric layer can be produced based on the selected polymer. For example, when the polymer comprises a fluoropolymer (e.g., PTFE), the polymer can be mixed with a first carrier liquid. The mixture may comprise a dispersion of the polymer particles in the first carrier liquid (ie, an emulsion), a liquid droplet of the polymer, or a dispersion of the monomer or oligomeric precursor of the polymer in the first carrier liquid. A solution of the liquid, or polymer, in the first carrier liquid. If the polymer is a liquid, the first carrier liquid may not be needed.

The choice of the first carrier liquid, if any, can be based on the particular polymer (polymeric) and the form of the polymer to be introduced into the dielectric layer. If it is desired to introduce the polymer in solution, the solution for the particular polymer is selected as the carrier liquid. For example, N-methylpyrrolidone (NMP) can be a suitable loading for a solution of polyimine. Liquid. If it is desired to introduce the polymer as a dispersion, the carrier liquid may comprise a liquid in which the polymer is insoluble, for example, water may be a suitable carrier liquid for the dispersion of PTFE particles and may be used for polyamines. A suitable carrier liquid for the emulsion of acid or emulsion of butadiene monomer.

The dielectric filler component can optionally be dispersed in a second carrier liquid or mixed with the first carrier liquid (or liquid polymer without the use of the first carrier). The second carrier liquid can be the same liquid as the first carrier liquid or can be a liquid miscible with the first carrier liquid other than the first carrier liquid. For example, if the first carrier fluid system is water, the second carrier fluid can comprise water or alcohol. The second carrier liquid can comprise water.

The filler dispersion may comprise a surfactant in an amount effective to modify the surface tension of the second carrier liquid to enable the second carrier liquid to wet the borosilicate microspheres. Exemplary surfactant compounds include ionic surfactants and nonionic surfactants. TRITON X-100 ^(TM) has been found to be an exemplary surfactant for aqueous dispersion dispersions. The filler dispersion may comprise from 10% to 70% by volume of filler and from 0.1% to 10% by volume of surfactant, wherein the remainder comprises a second carrier liquid.

The combination of the polymer and the first carrier liquid and the filler dispersion in the second carrier liquid can be combined to form a casting mixture. In one embodiment, the casting mixture comprises 10% to 60% by volume of the combined polymer and filler and A first and a second carrier liquid of a combination of 40% by volume to 90% by volume. The relative amounts of polymer and filler components in the casting mixture can be selected to provide the desired amount in the final composition as described below.

The viscosity of the casting mixture can be adjusted by the addition of a viscosity modifier selected based on its compatibility in a particular carrier liquid or mixture of carrier liquids to delay the hollow sphere filler self-mediated. Separation (i.e., sedimentation or flotation) of the electrical composite material and provides a dielectric composite material having a viscosity compatible with conventional laminating equipment. Exemplary viscosity modifiers suitable for use in aqueous casting mixtures include, for example, polyacrylic compounds, vegetable gums, and cellulosic compounds. Specific examples of suitable viscosity modifiers include polyacrylic acid, methyl cellulose, polyethylene oxide, guar gum, locust bean gum, sodium carboxymethyl cellulose, alginic acid. Sodium, and gum tragacanth. The viscosity of the viscosity-adjusted casting mixture can be further increased (ie, exceeds the minimum viscosity) based on the application by application to adapt the dielectric composite to the selected lamination technique. In one embodiment, the viscosity-adjusted casting mixture can exhibit a viscosity of from 10 centipoise (cp) to 100,000 centipoise at room temperature; specifically from 100 centipoise to 10,000 centipoise.

Alternatively, the viscosity modifier can be omitted if the viscosity of the carrier liquid is sufficient to provide a casting mixture that does not separate during the period of interest. In particular, in the case of very small particles (e.g., particles having an equivalent spherical diameter of less than 0.1 micron), the use of a viscosity modifier may not be necessary.

A layer of the viscosity-adjusted casting mixture can be cast onto the magnetic layer or can be dip coated. Casting can be by, for example, dip coating, flow coating, reverse roll This is achieved by coating, on-roller scraper, on-board scraper, metering bar coating, and the like.

The carrier liquid and processing aid (ie, surfactant and viscosity modifier) can be removed, for example, by evaporation and/or by thermal decomposition from the cast layer to consolidate the polymer and the filler comprising the microspheres. Dielectric layer.

The layers of polymer matrix material and filler component may be further heated to modify the physical properties of the layer, for example, sintering a thermoplastic material or curing and/or post-curing a thermoset material.

In another method, a PTFE composite dielectric layer can be made by a paste extrusion and calendaring process.

In yet another embodiment, the dielectric layer can be cast and then partially cured ("B stage"). These B-staged layers can be stored and subsequently used, for example, in a layering process.

The magnetic-dielectric substrate can be formed by the above method. For example, the dielectric layer can be directly cast onto the magnetic reinforcement layer, or the magnetic reinforcement layer can be coated with a solution or mixture comprising a dielectric polymer matrix composition, a dielectric filler, and optionally an additive, such as Dip coating, spray coating, reverse roll coating, roll top scraper, plate scraper, metering bar coating, flow coating, and the like. Alternatively, in the lamination process, a magnetic reinforcement layer is placed between the first dielectric layer and the second dielectric layer and laminated under heat and pressure. In the case of a magnetic reinforcing layer fiber, the dielectric layer flows into the fiber magnetic reinforcing layer and impregnates the fiber magnetic reinforcing layer. As described in additional detail below, an adhesive layer can be placed between the fiber magnetic reinforcement layer and the first dielectric layer and the second dielectric layer.

A single cladding circuit material can be adhered or laminated to the conductive layer by A dielectric layer or a second dielectric layer is formed. The double clad circuit material can be formed by casting or laminating a first dielectric layer and a second dielectric layer onto the magnetic layer; and simultaneously or sequentially applying a first conductive element and a second conductive element to a first dielectric layer and a second dielectric layer.

In a specific embodiment, the circuit material can be placed on one or both of the coated or uncoated conductive layers by a need to place the first dielectric layer and the second dielectric layer and the magnetic layer. Between (an adhesive layer may be disposed between the at least one conductive layer and the at least one dielectric substrate layer) to form a layer forming process of the layered structure. Alternatively, if a fiber magnetic reinforcing layer is used, the conductive layer may directly contact the dielectric substrate layer or the optional adhesive layer, in particular, there is no intermediate layer, wherein the optional adhesive layer may be less than or equal to the first and second A thickness of 10% of the total thickness of the overall dielectric layer. The layered structure can then be placed in a press (e.g., a vacuum press) at a pressure and temperature for a period of time suitable for bonding the layers and forming a laminate. Lamination and curing can be a one-step process (eg, using a vacuum press), or can be a multi-step process. In a single-step process for PTFE, the layered structure can be placed in a press to achieve lamination pressure (eg, 150 psi to 400 psi) and heated to lamination Temperature (for example, 260 ° C to 390 ° C). The lamination temperature and pressure are maintained through the desired soak time (i.e., 20 minutes), then cooled (while still under pressure) to less than or equal to 150 °C.

The adhesive layer may be disposed between one or both of the (etc.) conductive layers and the dielectric layer. The adhesive layer may comprise a poly(aryl ether); and a carboxyl functionalized polybutadiene or polyisoprene polymer comprising butadiene, isoprene, or butadiene and The isoprene unit, and 0 to less than or equal to 50% by weight of the co-curable monomer unit; wherein the composition of the adhesive layer is different from the composition of the dielectric substrate layer. The adhesive layer may be present in an amount from 2 g/m 3 to 15 g/m 3 . The poly(alkylene ether) may comprise a carboxy-functional poly(strandyl ether). The poly(alkylene ether) may be a reaction product of a poly(aryl ether) and a cyclic anhydride, or a reaction product of a poly(aryl ether) and maleic anhydride. The carboxyl functionalized polybutadiene or polyisoprene polymer can be a carboxyl functionalized butadiene-styrene copolymer. The carboxyl functionalized polybutadiene or polyisoprene polymer can be the reaction product of a polybutadiene or polyisoprene polymer with a cyclic anhydride. The carboxyl functionalized polybutadiene or polyisoprene polymer can be a maleated polybutadiene-styrene or a maleated polyisoprene-styrene copolymer.

In one embodiment, a multi-step process suitable for use in a thermoset material such as polybutadiene and/or polyisoprene may comprise a peroxide curing step at 150 ° C to 200 ° C and partially cured The stack can then be subjected to a high energy electron beam radiation cure (E-beam cure) or a high temperature cure step under an inert atmosphere. The use of two-stage curing imparts an abnormally high degree of crosslinking to the resulting laminate. The temperature used in the second stage may range from 250 ° C to 300 ° C, or the decomposition temperature of the polymer. This high temperature curing can be carried out in an oven, but can also be carried out in a press, i.e., as a continuation of the initial lamination and curing steps. The particular lamination temperature and pressure will depend on the particular adhesive composition and substrate composition and can be readily determined by those skilled in the art without undue experimentation.

With respect to the foregoing, and with reference to Figures 7 through 8, it has been discovered that an antenna employing the magnetic-dielectric substrate 10 disclosed herein is adapted to provide an antenna 60 capable of transmitting a 1 GHz signal in the H field plane with at least 122 The beam width of the beam is radiated into the free space to And capable of radiating a 1 GHz signal into the free space with a beamwidth of at least 116 degrees in the E field plane and having a peak gain of -6.97 dB, as compared to the ratio, there is no magnetic-dielectric base disclosed herein. The antenna of the material 10 is 92 degrees, 102 degrees, and -1.62 dB, respectively. Referring to Figure 9, it has been found that the impedance and 3dB gain-to-bandwidth ratio of the antennas mentioned above are 5 to 6 times higher than similar antennas not according to an embodiment. 7 through 9 illustrate the use of a copper clad circuit laminate 50 having a magnetic-dielectric substrate 10 as disclosed herein with respect to a copper clad circuit laminate that does not have the magnetic-dielectric substrate 10 disclosed herein. The increased beamwidth and bandwidth of the antenna.

The antenna 60 (see FIGS. 6A, 6B, and 6C) capable of providing one of the beam widths and bandwidths illustrated in FIGS. 7-9 is a magnetic-dielectric substrate 10 illustrated in FIGS. 4C and 5, wherein : 200 system of the first dielectric layer 100 and the second dielectric layer having a dielectric constant of 3.55 from the tangent of 0.0027 and tan (loss tangent) of RO4000 ^TM (Rogers (Rogers) Corporation) laminates prepared, and both All are 0.25 mm thick; the magnetic layer 300 has a glass dielectric strengthening layer 630 having a dielectric constant of 5.5 and a loss tangent of less than 0.001, wherein the thickness is 0.25 mm; the magnetic layer 300 has a self-permeability of 50 and a loss angle. The first magnetic layer 100 and the second magnetic layer 620 are etched to a thickness of 0.05, and both are 10 micrometers thick; and the conductive member 30 is made of 40 micrometers thick copper.

Although certain embodiments of the magnetic-dielectric substrate 10 and the antenna 60 have been described with reference to certain values of the thickness and permeability of the magnetic layers 300, 610, 620, it should be understood that some of these values are only Exemplary values, and other values of individual thicknesses and magnetic permeability consistent with the objectives of the invention disclosed herein may be employed. In addition, although an antenna having a certain size and material properties and specifically selected to resonate at 1 GHz has been described herein. 60, however, it should be understood that the scope of the invention is not limited thereto, and antennas having different sizes to resonate at different frequencies while being suitable for the purposes disclosed herein are also contemplated.

The circuit assembly can be used in electronic devices for various applications (such as electric power applications, data storage, and microwave communication), such as inductors on electronic integrated circuit chips, electronic circuits, electronic packages, modules and housings, converters, and UHF, VHF, and microwave antennas. The circuit assembly can be used in applications where an external DC magnetic field is applied. In addition, the (etc.) magnetic layer can be used in all antenna designs that exceed the frequency range of 100 megahertz (MHz) to 800 megahertz with excellent results (size and bandwidth). Moreover, the application of an external magnetic field "tunes" the magnetic permeability of the (and other) magnetic layers, as well as the patch resonant frequency.

As used herein, "layer" includes planar films, sheets, and the like as well as other three-dimensional non-planar forms. The layers may further be giant or continuous. The use of the term "a, an" does not denote a limitation of quantity, but rather means that there is at least one of the referenced items. The ranges disclosed herein are inclusive of the listed endpoints and can be independently combined. "Combination" encompasses blends, mixtures, alloys, reaction products, and the like. Furthermore, "including a combination of at least one of the above" means that the list includes the individual elements, the combination of the two or more elements of the list, and the combination of at least one element of the list and the unspecified similar element. The terms "first", "second" and the like do not denote any order, quantity, or importance, but are used to distinguish the elements. As used herein, the term "substantially equal" means that the two values being compared are ±10% from each other, particularly ±5% to each other, more particularly ±1% from each other. "or" means "and / or".

As disclosed, some embodiments of the present invention can include wherein when a 1 GHz signal is communicated to a conductive element via a signal line, the magnetic-dielectric substrate is configured and capable Enough to radiate a 1 GHz signal into the free space in the H field plane with a beamwidth of at least 122 degrees, and to be able to radiate a 1 GHz signal into the free space with a beamwidth of at least 116 degrees in the E field plane .

The invention is further illustrated by the following embodiments:

Embodiment 1. A magnetic-dielectric substrate comprising: a first dielectric layer; a second dielectric layer spaced apart from the first dielectric layer; and at least one magnetic enhancement layer disposed on the first A dielectric layer and the second dielectric layer are in intimate contact with the first dielectric layer and the second dielectric layer.

The magnetic-dielectric substrate according to the first aspect, wherein the magnetic reinforcing layer comprises fibers, wherein the fibers are ferrite fibers, ferrite alloy fibers, cobalt fibers, cobalt alloys. Fiber, iron fiber, iron alloy fiber, nickel fiber, nickel alloy fiber, containing granular ferrite, granular ferrite alloy, granular cobalt, granular cobalt alloy, granular iron, granular iron alloy, granular nickel, a particulate nickel alloy, or a polymer fiber comprising a combination of at least one of the foregoing, preferably hexagonal ferrite, magnetite, or MFe ₂ O ₄ , wherein the M system is Co, Ni, Zn, V, or At least one of Mn.

The magnetic-dielectric substrate of embodiment 1, wherein the magnetic reinforcing layer comprises a polymer or a glass fiber coated with a ferrite, a ferrite alloy, cobalt, a combination of at least one of a cobalt alloy, iron, an iron alloy, nickel, a nickel alloy, or a magnetic material comprising the above, or a combination comprising at least one of the fibers, preferably the fibers are coated with a hexagonal iron Oxygen, magnetite, or MFe ₂ O ₄ , wherein the M system is at least one of Co, Ni, Zn, V, or Mn.

The magnetic-dielectric substrate according to the first aspect, wherein the magnetic reinforcing layer comprises a polymer fiber, and the polymer fiber comprises a granular ferrite, a ferrite alloy, a cobalt, a cobalt alloy. a combination of at least one of iron, iron alloy, nickel, nickel alloy, or a magnetic material comprising the above, preferably comprising hexagonal ferrite, magnetite, or MFe ₂ O ₄ , wherein the M system is Co, Ni, Zn At least one of V, V, or Mn.

The magnetic-dielectric substrate of any one or more of embodiments 1 to 4, wherein: the first dielectric layer and the second dielectric layer each independently comprise 1, 2 - polybutadiene, polyisoprene, polybutadiene-polyisoprene copolymer, polyetherimide, fluoropolymers such as polytetrafluoroethylene, polyimine, polyetheretherketone , polyamidoximine, polyethylene terephthalate, polyethylene naphthalate, poly(p-diethyl phthalate), polyphenylene ether, allylated polyphenylene ether or one containing at least the above A combination of one.

The magnetic-dielectric substrate of any one or more of the embodiments 1 to 5, wherein the first dielectric layer and the second dielectric layer each independently comprise polybutan Alkene and/or polyisoprene; one of the ethylene-propylene liquid rubbers as desired, which has a molecular weight of less than or equal to 50,000 g/g by gel permeation chromatography based on polycarbonate standards. The weight average molecular weight of the moir; one of the dielectric fillers as needed; and one of the flame retardants as needed.

The magnetic-dielectric substrate of any one of aspects 1 to 6, wherein: the first dielectric layer completely impregnates one side of the magnetic reinforcement layer; and the second dielectric layer The electrical layer is completely impregnated on the opposite side of the magnetic reinforcing layer.

The magnetic-dielectric substrate according to any one of the preceding embodiments, wherein the magnetic reinforcing layer comprises: a first magnetic layer; a second magnetic a layer randomly spaced apart from the first magnetic layer; and a dielectric strengthening layer disposed between the first magnetic layer and the second magnetic layer and in close contact with the first magnetic layer and the second magnetic layer contact.

The magnetic-dielectric substrate of embodiment 8, wherein the first magnetic layer and the second magnetic layer each comprise a thin film ferrite.

The magnetic-dielectric substrate of embodiment 8, wherein: the first magnetic layer has a first magnetic layer thickness; the second magnetic layer has a second magnetic layer thickness; the dielectric The reinforcing layer has a reinforcing layer thickness; the ratio of the thickness of the reinforcing layer to the thickness of the first magnetic layer is equal to or greater than 25; and the ratio of the thickness of the reinforcing layer to the thickness of the second magnetic layer is equal to or greater than 25.

The magnetic-dielectric substrate according to any one of the preceding aspects, wherein: the first dielectric layer has a first thickness; and the second dielectric layer has a thickness substantially A second thickness equal to the first thickness.

The magnetic-dielectric substrate of any of the above-described embodiments, wherein: the first dielectric layer has a first thickness; and the second dielectric layer has a thickness substantially A second thickness equal to the first thickness.

The magnetic-dielectric substrate of any one or more of embodiment 1 or 6 to 12, wherein: the first dielectric layer is structurally continuous in a superficial plane; And the second dielectric layer is structurally continuous in a superficial plane.

The magnetic-dielectric substrate of any one of the preceding embodiments, wherein the magnetic reinforcing layer is at least partially structurally continuous in a superficial plane.

The magnetic-dielectric substrate according to any one of the preceding aspects, wherein the magnetic reinforcing layer has in-plane magnetic anisotropy.

The magnetic-dielectric substrate of any of the above-described embodiments, wherein: the first dielectric layer has an outer dimension defining a first footprint; the second dielectric layer Having an outer dimension defining a second coverage area substantially equal to the first coverage area; and the magnetic reinforcement layer has a third coverage defining a size substantially equal to the first coverage area and the second coverage area The outer dimensions of the area.

The magnetic-dielectric substrate according to any one of the preceding aspects, wherein the first dielectric layer, the second dielectric layer, and the magnetic reinforcing layer are each structurally flat.

The magnetic-dielectric substrate according to any one of the preceding aspects, further comprising: a conductive ground layer disposed on an outer surface of the first dielectric layer; and a conductive element And disposed on an outer surface of the second dielectric layer, the conductive element is spaced apart from the conductive ground layer.

The magnetic-dielectric substrate of embodiment 18, wherein: the first dielectric layer has an outer dimension defining a first footprint; the second dielectric layer has a defined The size is substantially equal to an outer dimension of the second coverage area of the first coverage area; the magnetic reinforcement layer has an outer dimension defining a third coverage area substantially equal in size to the first coverage area and the second coverage area; The conductive ground layer has an outer dimension defining a fourth footprint that is substantially equal to the first footprint; and the conductive element has an outer dimension that defines a fifth footprint that is smaller than the second footprint.

The magnetic-dielectric substrate of embodiment 19, wherein the ratio of the area of the fifth coverage area to the area of the second coverage area is equal to or less than 0.3.

The magnetic-dielectric substrate of embodiment 20, wherein the conductive element is disposed on a center of the second dielectric layer.

The magnetic-dielectric substrate of any one of embodiments 18 to 21, further comprising: a signal line disposed in signal communication with the conductive element.

The magnetic-dielectric substrate of embodiment 22, wherein: the signal line comprises a coaxial cable having a central signal conductor disposed in signal communication with the conductive element, and a set A grounding sheath that communicates electrically with the conductive ground plane.

The magnetic-dielectric substrate of any one of embodiments 22 to 23, wherein the conductive element is patterned to form in-line and in-plane conductive discontinuities.

The magnetic-dielectric substrate of embodiment 24, wherein: when a 1 GHz signal is communicated to the conductive element via the signal line, the magnetic-dielectric substrate is configured and The 1 GHz signal can be radiated into the free space in the H field plane with a beamwidth of at least 122 degrees, and the 1 GHz signal can be radiated into the free space in the E field plane with a beamwidth of at least 116 degrees.

The magnetic-dielectric substrate of any one of the preceding embodiments, wherein the second dielectric layer is evenly spaced from the first dielectric layer.

Embodiment 27. The method of any one of embodiments 22 to 24 a magnetic-dielectric substrate, wherein: the conductive ground layer and the conductive element are a laminate forming a copper clad circuit laminate; and, when a 1 GHz signal is communicated to the conductive element via the signal line, The magnetic-dielectric substrate is configured and capable of radiating a 1 GHz signal into the free space in a H field plane with a beamwidth of at least 122 degrees, and capable of having a 1 GHz signal in the E field plane of at least 116 The beamwidth of the degree is radiated into the free space.

Although certain combinations of features of the antenna have been set forth herein, it is understood that some combinations are for illustrative purposes only and may be explicitly or equivalently, individually or in combination with any other feature disclosed herein to Any combination or combination of any of these features may be employed in any combination. Any and all such combinations are encompassed herein and are considered to be within the scope of the invention.

Although the present invention has been described with reference to the exemplary embodiments thereof, it is understood that those skilled in the art can make various changes and may substitute the equivalents thereof without departing from the scope of the invention. In addition, many modifications may be made to the teachings of the invention to adapt to a particular situation or material without departing from the scope of the invention. Therefore, the invention is not intended to be limited to the specific embodiments of the inventions disclosed herein. Rather, the present invention has been described by way of illustration and description, and in the

10‧‧‧Magnetic-dielectric substrate/substrate

100‧‧‧First dielectric layer

200‧‧‧Second dielectric layer

300‧‧‧Magnetic reinforcement/magnetic layer

1000‧‧‧Details

Claims (29)

A magnetic-dielectric substrate comprising: a first dielectric layer; a second dielectric layer spaced apart from the first dielectric layer; and at least one magnetic reinforcing layer disposed on the first A dielectric layer and the second dielectric layer are in intimate contact with the first dielectric layer and the second dielectric layer. The magnetic-dielectric substrate according to claim 1, wherein the magnetic reinforcing layer comprises fibers, wherein the fibers are ferrite fibers, ferrite alloy fibers, cobalt fibers, cobalt alloy fibers, iron. Fiber, ferroalloy fiber, nickel fiber, nickel alloy fiber, containing particulate ferrite, granular ferrite alloy, granular cobalt, granular cobalt alloy, granular iron, granular iron alloy, granular nickel Or a polymeric fiber of a particulate nickel alloy, or a combination comprising at least one of the foregoing. The magnetic-dielectric substrate according to claim 2, wherein the magnetic reinforcing layer comprises hexaferrite fibers, magnetite fibers, or MFe ₂ O ₄ fibers, wherein the M system is Co, Ni, At least one of Zn, V, or Mn. The magnetic-dielectric substrate according to claim 1, wherein the magnetic reinforcing layer comprises a ferrite, a ferrite alloy, a cobalt, a cobalt alloy, an iron, an iron alloy, a nickel, a nickel alloy, or the like. A polymer or glass fiber combined with at least one of the magnetic materials, or a combination comprising at least one of the foregoing fibers. The magnetic-dielectric substrate according to claim 4, wherein the magnetic reinforcing layer comprises a polymer or glass fiber coated with hexagonal ferrite, magnetite, or MFe ₂ O ₄ , wherein the M system is Co. At least one of Ni, Zn, V, or Mn. The magnetic-dielectric substrate according to claim 1, wherein the magnetic reinforcing layer comprises a particulate ferrite, a ferrite alloy, cobalt, a cobalt alloy, iron, an iron alloy, nickel, a nickel alloy, or the like A polymer fiber combined with at least one of the magnetic materials. The magnetic-dielectric substrate according to claim 6, wherein the polymer fiber comprises hexagonal ferrite, magnetite, or MFe ₂ O ₄ , wherein the M system is Co, Ni, Zn, V, or Mn. At least one of them. The magnetic-dielectric substrate according to any one of claims 1 to 7, wherein the first dielectric layer and the second dielectric layer each independently comprise 1,2-polybutadiene, polyisotopic Pentadiene, polybutadiene-polyisoprene copolymer, polyetherimine, fluoropolymer, polyimide, polyetheretherketone, polyamidoximine, polypair Polyethylene terephthalate, polyethylene naphthalate, polycyclohexylene terephthalate, polyphenylene ether, allylated polyphenylene ether (allylated polyphenylene ether) or a combination comprising at least one of the foregoing. The magnetic-dielectric substrate according to any one of claims 1 to 7, wherein the first dielectric layer and the second dielectric layer each independently comprise polybutadiene and/or polyisoprene Ethylene; ethylene-propylene liquid (ethylene-propylene liquid) Rubber), the ethylene-propylene liquid rubber has a weight average molecular weight of less than or equal to 50,000 g/mole as measured by gel permeation chromatography based on a polycarbonate standard; one of the dielectric fillers as needed; One of the flame retardants. The magnetic-dielectric substrate according to any one of claims 1 to 7, wherein: the first dielectric layer is impregnate one side of the magnetic reinforcing layer; and the second dielectric layer is The opposite side of the magnetic reinforcing layer is completely impregnated. The magnetic-dielectric substrate according to any one of claims 1 to 7, wherein the magnetic reinforcing layer comprises: a first magnetic layer; and a second magnetic layer uniformly spaced apart from the first magnetic layer; And a dielectric reinforcement layer disposed between the first magnetic layer and the second magnetic layer and in close contact with the first magnetic layer and the second magnetic layer. The magnetic-dielectric substrate of claim 11, wherein the first magnetic layer and the second magnetic layer each comprise a thin film ferrite. The magnetic-dielectric substrate of claim 11, wherein: the first magnetic layer has a first magnetic layer thickness; the second magnetic layer has a second magnetic layer thickness; the dielectric strengthening layer has a strengthening layer thickness; The ratio of the thickness of the reinforcing layer to the thickness of the first magnetic layer is equal to or greater than 25; and the ratio of the thickness of the reinforcing layer to the thickness of the second magnetic layer is equal to or greater than 25. The magnetic-dielectric substrate of any one of claims 1 to 7, wherein: the first dielectric layer has a first thickness; and the second dielectric layer has a thickness substantially equal to the first thickness Two thicknesses. The magnetic-dielectric substrate of any one of claims 1 to 7, wherein: the first dielectric layer is structurally in-plane continuous; and the second The dielectric layer is structurally continuous in a superficial plane. The magnetic-dielectric substrate of any one of claims 1 to 7, wherein the magnetic reinforcing layer is at least partially structurally continuous in a superficial plane. The magnetic-dielectric substrate according to any one of claims 1 to 7, wherein the magnetic reinforcing layer has an in-plane magnetic anisotropy. The magnetic-dielectric substrate of any one of claims 1 to 7, wherein: the first dielectric layer has an outer dimension defining a first footprint; the second The dielectric layer has an outer dimension defining a second footprint that is substantially equal to the first footprint; and the magnetic enhancement layer has a dimension that is substantially equal to the first overlay The outer dimensions of the zone and the third footprint of the second footprint. The magnetic-dielectric substrate of any one of claims 1 to 7, wherein the first dielectric layer, the second dielectric layer, and the magnetic reinforcement layer are each structurally planar. The magnetic-dielectric substrate according to any one of claims 1 to 7, further comprising: a conductive ground layer disposed on an outer surface of the first dielectric layer; and a conductive And an element disposed on an outer surface of the second dielectric layer, the conductive element being spaced apart from the conductive ground layer. The magnetic-dielectric substrate of claim 20, wherein: the first dielectric layer has an outer dimension defining a first footprint; the second dielectric layer has a defined size substantially equal to the first overlay An outer dimension of the second footprint of the region; the magnetic enhancement layer having an outer dimension defining a third footprint substantially equal to the first footprint and the second footprint; the conductive ground layer defining a size substantial An outer dimension equal to a fourth footprint of the first footprint; and the conductive element has an outer dimension defining a fifth footprint that is smaller than the second footprint. The magnetic-dielectric substrate of claim 21, wherein the ratio of the area of the fifth footprint to the area of the second footprint is equal to or less than 0.3. The magnetic-dielectric substrate of claim 22, wherein the conductive element is disposed on a center of the second dielectric layer. The magnetic-dielectric substrate of claim 20, further comprising: a signal line disposed in signal communication with the conductive element. The magnetic-dielectric substrate of claim 24, wherein the signal line comprises a coaxial cable having a central signal conductor disposed in signal communication with the conductive element, And a ground sheath that is in electrical communication with the conductive ground plane. A magnetic-dielectric substrate according to any of the preceding claims, wherein the conductive element is patterned to form in-line and in-plane conductive discontinuities. The magnetic-dielectric substrate of claim 26, wherein when a 1 GHz signal is communicated to the conductive element via the signal line, the magnetic-dielectric substrate is configured and capable of The 1 GHz signal is radiated into the free space with a beam width of at least 122 degrees in the H-field plane, and the 1 GHz signal can be placed in the E-field ( The E-field plane radiates into the free space with a beamwidth of at least 116 degrees. The magnetic-dielectric substrate of any one of claims 1 to 7, wherein the second dielectric layer is evenly spaced from the first dielectric layer. The magnetic-dielectric substrate of claim 24, wherein: the conductive ground layer and the conductive element are a laminate forming a copper clad circuit laminate; and when a 1 GHz When the signal is communicated to the conductive element via the signal line, the magnetic-dielectric substrate is configured and capable of radiating the 1 GHz signal to free space in a H field plane with a beamwidth of at least 122 degrees, and capable of The 1 GHz signal is radiated into the free space in an E field plane with a beamwidth of at least 116 degrees.