JP2005109362A - 処理液、並びに該処理液を用いた基板処理方法及び基板処理装置 - Google Patents
処理液、並びに該処理液を用いた基板処理方法及び基板処理装置 Download PDFInfo
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- JP2005109362A JP2005109362A JP2003343875A JP2003343875A JP2005109362A JP 2005109362 A JP2005109362 A JP 2005109362A JP 2003343875 A JP2003343875 A JP 2003343875A JP 2003343875 A JP2003343875 A JP 2003343875A JP 2005109362 A JP2005109362 A JP 2005109362A
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- Prior art keywords
- substrate
- processing
- polishing
- dielectric constant
- liquid
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- 239000007788 liquid Substances 0.000 title claims abstract description 182
- 239000000758 substrate Substances 0.000 title claims abstract description 181
- 238000012545 processing Methods 0.000 title claims abstract description 162
- 238000003672 processing method Methods 0.000 title claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 81
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000000126 substance Substances 0.000 claims abstract description 31
- 125000001165 hydrophobic group Chemical group 0.000 claims abstract description 6
- 238000005498 polishing Methods 0.000 claims description 121
- 238000000034 method Methods 0.000 claims description 37
- 238000007747 plating Methods 0.000 claims description 34
- 239000000243 solution Substances 0.000 claims description 27
- 238000001035 drying Methods 0.000 claims description 25
- 238000012805 post-processing Methods 0.000 claims description 12
- 238000007781 pre-processing Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 150000007524 organic acids Chemical class 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000003595 mist Substances 0.000 claims description 3
- 239000012487 rinsing solution Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 168
- 235000012431 wafers Nutrition 0.000 description 165
- 238000004140 cleaning Methods 0.000 description 128
- 239000008367 deionised water Substances 0.000 description 32
- 229910021641 deionized water Inorganic materials 0.000 description 32
- 239000010949 copper Substances 0.000 description 25
- 229910052802 copper Inorganic materials 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- 238000007772 electroless plating Methods 0.000 description 11
- 239000010410 layer Substances 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- 239000011229 interlayer Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 230000005661 hydrophobic surface Effects 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910020674 Co—B Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- XTUSEBKMEQERQV-UHFFFAOYSA-N propan-2-ol;hydrate Chemical compound O.CC(C)O XTUSEBKMEQERQV-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003343875A JP2005109362A (ja) | 2003-10-01 | 2003-10-01 | 処理液、並びに該処理液を用いた基板処理方法及び基板処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003343875A JP2005109362A (ja) | 2003-10-01 | 2003-10-01 | 処理液、並びに該処理液を用いた基板処理方法及び基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005109362A true JP2005109362A (ja) | 2005-04-21 |
| JP2005109362A5 JP2005109362A5 (enExample) | 2006-11-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003343875A Pending JP2005109362A (ja) | 2003-10-01 | 2003-10-01 | 処理液、並びに該処理液を用いた基板処理方法及び基板処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005109362A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007332445A (ja) * | 2006-06-16 | 2007-12-27 | Ebara Corp | 無電解めっき方法及び無電解めっき装置 |
| JP2008038215A (ja) * | 2006-08-08 | 2008-02-21 | Ebara Corp | 基板処理方法及び基板処理装置 |
-
2003
- 2003-10-01 JP JP2003343875A patent/JP2005109362A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007332445A (ja) * | 2006-06-16 | 2007-12-27 | Ebara Corp | 無電解めっき方法及び無電解めっき装置 |
| JP2008038215A (ja) * | 2006-08-08 | 2008-02-21 | Ebara Corp | 基板処理方法及び基板処理装置 |
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