JP2005101369A - Package for housing optical semiconductor element and optical semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for housing optical semiconductor element that can secure the parallelism of the light receiving surface of an optical semiconductor element to a light-transmissive lid body. <P>SOLUTION: The package 3 for housing the optical semiconductor element 4 is provided with a lead frame 1 composed of a long plate member 1a provided with broad flat sections 1d for mounting the optical semiconductor element 4 at both ends and a plurality of through holes 1e formed at portions other than the flat sections 1d, hung leads 1f respectively extended outward from both end faces of the plate member 1a, a plurality of leads 1b extended outward at intervals from the side face of the plate member 1a, and a frame 1c coupled with the outer ends of the leads 1f and leads 1b. The package 3 is also provided with an insulating substrate 2 having a recessed section 3a for housing the optical semiconductor element 4 on its top surface. In the recessed section 3a, the plate member 1a is placed on the bottom face of the section 3a so that the flat sections 1d of the member 1a may be positioned at both ends of the bottom face, and the hung leads 1f and leads 1b are installed so that the leads 1f and 1b may be led out from the inside of the recessed section 3a through the recessed section 3a. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an optical semiconductor element housing package for housing an optical semiconductor element such as a line sensor, and an optical semiconductor device in which the optical semiconductor element is housed in the optical semiconductor element housing package.

  2. Description of the Related Art Conventionally, an optical semiconductor element housing package (hereinafter also simply referred to as a package) for accommodating an optical semiconductor element such as a line sensor is generally formed with a mounting portion on which a flat optical semiconductor element is mounted on an upper surface. A long plate-like plate member, a suspension lead extending outward from both end faces of the plate member, a plurality of leads extending outward from the side surface of the plate member, and a suspension lead and the outside of the plurality of leads A lead frame composed of a frame with the ends joined together and a recess for accommodating the optical semiconductor element are formed on the upper surface, the plate member is placed on the bottom surface of the recess, and the suspension lead and the lead are from the inside of the recess. And an insulating base installed so as to be led out through the recess.

  Then, the optical semiconductor element is mounted on the plate member of the lead frame and is bonded and fixed via a resin adhesive, solder, etc., and the electrode of the optical semiconductor element is exposed in the recess via a bonding wire or the like. A container made of an insulating base, a lead frame, and a lid, which is electrically connected to the inner end portion of the lead, and then a light-transmitting lid is bonded to the upper surface around the recess of the insulating base. By sealing hermetically inside, an optical semiconductor device is completed.

  In this optical semiconductor device, the lead is individually separated by cutting and removing the frame, and the outer end of the lead is electrically and mechanically connected to a predetermined position such as a wiring conductor of the external electric circuit board via solder or the like. By connecting, the optical semiconductor device is mounted on the external electric circuit board. When the frame is cut and removed, the portion of the suspension lead that is outside the recess is also cut and removed.

  Then, external light is received by the light receiving surface formed on the upper surface of the optical semiconductor element through the translucent lid, and the received light is converted into an electrical signal by the optical semiconductor element, via the lead. Thus, an electric signal is supplied to the external electric circuit.

  In such an optical semiconductor device, it is an important issue to dissipate heat generated by the operation of the optical semiconductor element to the outside. That is, in the case of a package having a resin insulating substrate, the distortion of the insulating substrate due to heat when the optical semiconductor element is mounted on the plate member is large, and the plate on which the optical semiconductor element is mounted due to the distortion of the insulating substrate There is a problem that the member is deformed and the optical semiconductor element is inclined. In particular, when the optical semiconductor element has an elongated shape such as a line sensor, deformation in the long side direction frequently occurs, and the deformation tends to be very large.

  In addition, since the optical semiconductor element such as a line sensor has a long and narrow rectangular shape, if the mounting position of the lead frame on the plate member is slightly shifted, the optical semiconductor element is inclined and the parallelism with the translucent lid is increased. As a result, the external light cannot be accurately received on the light receiving surface, a large error occurs in detection by the line sensor, and a normal electric signal cannot be output.

In order to deal with such a problem, for example, Patent Documents 1 and 2 propose a cavity case (package) for a solid-state imaging device in which a planar shape of an island (plate member) is corrugated. According to these, even if the island is corrugated, even if distortion occurs in the insulating substrate, the corrugated portion of the island can be expanded and contracted to absorb the strain, and the island is deformed and tilted. This can be effectively prevented.
JP-A-7-161954 Japanese Patent No. 3186729

  However, in the conventional cavity case for a solid-state imaging device, the expansion and contraction of the insulating base can be absorbed by the corrugated portion of the island, but the insulating base is deformed into a concave shape in the long side direction by heat, etc. There was still a problem that could not be prevented sufficiently.

  For this reason, it is difficult to effectively prevent the inclination of the optical semiconductor element in the longitudinal direction, particularly when the solid-state imaging element (optical semiconductor element) has an elongated shape, and the light-receiving surface of the optical semiconductor element is translucent. There is a risk that accurate light reception may be hindered by tilting with respect to the lid.

  The present invention has been completed in view of the above-described conventional problems, and an object of the present invention is to heat a lead frame including a plate member and an insulating substrate in a process of mounting and fixing the optical semiconductor element on the plate member of the package. The parallelism of the light receiving surface of the optical semiconductor element with respect to the translucent lid even if the insulating substrate is deformed due to the thermal stress caused by the difference in thermal expansion coefficient between the insulating substrate and the lead frame. It is possible to provide an optical semiconductor element housing package and an optical semiconductor device that can ensure accurate external light on the light receiving surface of the optical semiconductor element.

  The optical semiconductor element storage package of the present invention is a long plate-like plate in which wide flat portions on which optical semiconductor elements are placed are provided at both ends, and a plurality of through holes are formed in portions other than the flat portions. A member, a suspension lead extending outward from both end faces of the plate member, a plurality of leads extending outward from the side surface of the plate member, and an outer end of the suspension lead and the outside of the plurality of leads A lead frame composed of a frame in which the ends of the optical semiconductor element are joined together, and a concave portion for accommodating the optical semiconductor element is formed on the top surface, the plate member is on the bottom surface of the concave portion, and the flat portion is on the bottom surface of the concave portion. An insulating base that is placed so as to be positioned at both ends and is installed so that the suspension lead and the lead are led out from the inside of the recess through the recess. It is an butterfly.

  Also, the optical semiconductor element housing package of the present invention is preferably characterized in that the plurality of through-holes are arranged so as to be aligned in the longitudinal direction of the plate member.

  The optical semiconductor device of the present invention is mounted on the optical semiconductor element housing package of each configuration of the present invention and the mounting portion of the plate member, and the electrode is electrically connected to the lead. It comprises an optical semiconductor element and a translucent lid attached to the upper surface of the insulating base so as to close the recess.

  According to the optical semiconductor element storage package of the present invention, since a plurality of through holes are formed in the plate member, even if deformation occurs in the insulating base, a portion of the plate member in which the through holes are formed The deformation of the plate member can be absorbed and the plate member can be effectively prevented from being deformed and tilted.

  Also, wide flat portions on which the optical semiconductor elements are placed are provided at both ends of the long plate-like plate member, and the plate members are placed in the concave portions so that the flat portions are located at both ends of the bottom surface of the concave portion. Therefore, even if the insulating substrate is warped and deformed, the optical semiconductor element is placed on the flat portions at both ends of the concave part that is not easily affected by the deformation. It is possible to receive external light accurately by leveling.

  In the optical semiconductor element housing package of the present invention, preferably, the plurality of through holes are arranged so as to be aligned in the longitudinal direction of the plate member, so that the distortion of the long plate-like plate member is increased. Through-holes for effectively absorbing and preventing the strain are arranged along the easy longitudinal direction, so that the deformation of the plate member can be prevented more effectively, and the optical semiconductor element can receive light. Accuracy and long-term reliability can be further improved.

  Further, an optical semiconductor device of the present invention includes an optical semiconductor element housing package having each configuration of the present invention, an optical semiconductor element mounted on a mounting portion of a plate member, and an electrode electrically connected to a lead. Since the upper surface of the insulating base is provided with a translucent lid attached so as to close the concave portion, the light is prevented from being deformed in the long side direction of the package due to distortion caused by thermal stress. The problem that the semiconductor element is inclined can be prevented. As a result, the optical semiconductor element can be accommodated and placed without inclining in the recess, and the optical semiconductor element having excellent light receiving accuracy and long-term reliability can be provided.

  A semiconductor element housing package and a semiconductor device according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an example of an embodiment of a package and an optical semiconductor device according to the present invention, where 1 is a lead frame and 2 is an insulating substrate. The lead frame 1 and the insulating base 2 mainly constitute a package 3. Further, an optical semiconductor device is configured by accommodating the optical semiconductor element 4 in the package 3.

  The lead frame 1 of the present invention is a long plate-like plate in which wide flat portions 1d on which optical semiconductor elements 4 are placed are provided at both ends, and a plurality of through holes 1e are formed in portions other than the flat portions 1d. Member 1a, suspension leads 1f extending outward from both end surfaces of the plate member 1a, a plurality of leads 1b extending outward from the side surfaces of the plate member 1a, an outer end and a plurality of suspension leads 1f The frame 1c is formed by collectively connecting the outer ends of the leads 1b.

  The lead frame 1 is made of a metal such as an iron-nickel-cobalt alloy, an iron-nickel alloy, or a copper alloy, and the plate member 1a, the lead 1b, the frame 1c, the flat portion 1d, and the suspension lead 1f are formed of the same material. For example, when the plate member 1a, the lead 1b, the frame 1c, the flat portion 1d, and the suspension lead 1f are made of an iron-nickel-cobalt alloy, the lead frame 1 is punched or etched into an iron-nickel-cobalt alloy plate. By performing this metal processing, it can be formed into a predetermined shape.

  The insulating base 2 is made of resin, and has a recess for accommodating the optical semiconductor element 4 on the upper surface. The lead frame 1 is placed on the insulating base 2 such that the plate member 1a is positioned on the bottom surface of the recess 3a and the flat portions 1d are positioned on both ends of the bottom surface of the recess 3a. The package 3 is configured by installing the suspension lead 1f so as to penetrate the recess 3a from the inside of the recess 3a and be led out to the outside.

  The insulating substrate 2 is formed of a resin material such as an epoxy resin, a glass epoxy resin, or polyimide. For example, when the insulating substrate 1 is made of an epoxy resin, the insulating substrate 1 is formed by molding by a transfer molding method, an injection molding method, or the like using a mold that can mold an uncured epoxy resin into the shape of the predetermined insulating substrate 1. The In this case, the flat substrate portion and the square frame portion may be separately formed, and then the recess may be formed by joining the frame portion to the outer peripheral portion of the upper surface of the substrate portion. You may shape | mold integrally using the metal mold | die in which a recessed part is integrally formed in a part.

  In order to make the lead 1b and the suspension lead 1f penetrate the concave portion 3a from the inside of the concave portion 3a, for example, the plate-like portion 1a is positioned at a portion to be the concave portion 3a of the insulating base 1, and the concave portion 3a is surrounded. The lead 1b and the suspension lead 1f are positioned so as to penetrate from the inside to the outside of the frame-shaped part, and the lead frame 1 is set in a mold for forming the insulating base 2, and then in the mold A method such as a method of filling and molding an uncured resin to be the insulating substrate 1 can be used.

  In this case, the lead 1b needs to pass through the recess 3a, and since the outer end portion is connected to an electric circuit or the like of the external electric circuit board, the lead 1b extends outward from the side surface of the plate member 1a. Has been attached. With this configuration, a large number of leads 1b can be formed while ensuring electrical insulation between adjacent leads 1b, and alignment when connecting the outer end portion of the lead 1b to an external electric circuit board or the like. Becomes easier. Further, for example, when the lead 1b penetrates the recess 3a by positioning and joining the lead 1b so as to penetrate between the substrate portion and the frame portion, the lead 1b is easily positioned. be able to. In addition, since the lead 1b penetrates at a portion where the bonding area between the substrate portion and the frame portion is large, it is possible to effectively prevent the strength of the insulating base 2 from deteriorating due to the presence of the lead 1b.

  The lead 1b of the lead frame 1 is electrically connected to the electrode of the optical semiconductor element 4 accommodated in the recess 3a via a bonding wire 5 or the like, and functions to connect the optical semiconductor element 4 to an external electric circuit. The shape of the lead 1b is a rod shape (long plate shape, rectangular parallelepiped shape) having a square cross section because it is easy to form.

  The frame 1c of the lead frame 1 is connected to the outer ends of the plurality of leads 1b in a lump so that the lead 1b bends in error during handling until the lead 1b is connected to an external electric circuit. In other words, the package 3 (optical semiconductor device) can be easily handled.

  In this package 3, the plate member 1 a of the lead frame 1 is a long plate shape suitable for securing a space for placing an elongated rectangular optical semiconductor element 4 such as a line sensor. The semiconductor element 4 is located and bonded to the optical semiconductor element 4 through resin or the like as necessary.

  Hanging leads 1f are formed so as to extend outward from both end faces of the plate-like portion 1a. The suspension lead 1f is coupled to the frame 1c at the outer end opposite to the plate-shaped portion 1a, whereby the plate-shaped portion 1a is coupled to the frame 1c via the suspension lead 1f. In this way, the plate-like portion 1a, the lead 1b, the suspension lead 1f, etc. are formed by joining the plate-like portion 1a to the frame 1c via the suspension lead 1f and forming the lead frame 1 by joining the lead 1b to the frame 1c. Can be handled easily when set in a mold for forming the insulating substrate 1, and the productivity of the package 3 can be improved.

  In the package 3 of the present invention, the plate member 1a is provided with wide flat portions 1d at both ends. The optical semiconductor element 4 is placed on the upper surface of the flat portion 1d. The flat portion 1d is wide in order to stably place the optical semiconductor element 4 without tilting. In this case, the width of the flat portion 1d is preferably 1.5 to 3 times the width of the plate member 1a. If it is 3 times or more, the package 3 tends to be reduced in size, and if it is less than 1.5 times, it is difficult to stably place the optical semiconductor element 4.

  The flat portion 1d is placed so as to be positioned at both ends of the bottom surface of the recess 3a of the insulating base 1. This is because when the insulating substrate 1 is deformed along the concave shape from the central portion, the light receiving surface of the optical semiconductor element 4 is made horizontal with respect to the translucent lid without being affected by the deformation, and is incident from the outside. This is because the incoming light is accurately received by the light receiving portion on the upper surface (light receiving surface) of the optical semiconductor element 4.

  Then, both ends of the optical semiconductor element 4 are placed on the flat portions 1d located at both ends of the bottom surface of the recess 3a, and the electrodes of the optical semiconductor element 4 are electrically connected via bonding wires 5 or the like, The optical semiconductor device is configured by sealing the recess 3a with a translucent lid (not shown).

  In the plate member 1a of the present invention, a plurality of through holes 1e are formed at portions other than the flat portion 1d. With this configuration, even if the insulating base 1 is distorted by heat, the distortion can be effectively absorbed by the expansion and contraction of the plate member 1a around the through hole 1e, and the deformation of the plate member 1a is effective. Therefore, the light receiving accuracy and long-term reliability of the optical semiconductor element 4 and the optical semiconductor device can be made excellent.

  In this case, it is preferable that the through holes 1e are arranged so as to be aligned in the longitudinal direction of the plate member 1a. Thereby, the through-holes 1e for effectively absorbing and preventing the distortion are arranged side by side along the longitudinal direction in which the distortion of the long plate-like plate member 1a is likely to increase, and the effect is further improved. In particular, the deformation of the plate member 1a can be prevented, and the light receiving accuracy and long-term reliability of the optical semiconductor element 4 and the optical semiconductor device can be further improved.

  The through hole 1e preferably has a diameter of 30 to 70% of the width of the plate member 1a. If the diameter of the through-hole 1e is less than 30% of the width of the plate member 1a, the plate member (island part) 1a may be distorted due to expansion and contraction of the resin insulating base 2 due to heat. There is a tendency that the mechanical strength of 1a deteriorates and is easily bent and deformed, and it becomes difficult to place the optical semiconductor element 4.

  Moreover, it is preferable that the through-hole 1e sets the adjacent space | interval to the range of 0.2-0.7 mm. If the adjacent interval is less than 0.2 mm, the mechanical strength of the plate member 1a tends to deteriorate and tends to bend or deform, and if it exceeds 0.7 mm, the plate member is stretched due to expansion and contraction of the insulating base 2 made of resin. 1a tends to be distorted.

  The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

(A) is a top view which shows the example of embodiment of the optical semiconductor element accommodation package of this invention, (b) is sectional drawing of the optical semiconductor element accommodation package of (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Lead frame 2 ... Insulating base | substrate 3 ... Package for optical semiconductor element accommodation 4 ... Optical semiconductor element

Claims (3)

A long plate-like plate member in which a wide flat portion on which the optical semiconductor element is placed is provided at both ends and a plurality of through holes are formed in portions other than the flat portion, respectively, from the both end surfaces of the plate member. A suspension lead extending from the side of the plate member, and a plurality of leads extending outward from the side surface of the plate member, and a frame in which the outer ends of the suspension leads and the outer ends of the plurality of leads are joined together. And a recess for accommodating the optical semiconductor element is formed on the top surface, and the plate member is placed on the bottom surface of the recess so that the flat portions are positioned at both ends of the bottom surface of the recess. And a package for housing an optical semiconductor element, wherein the suspension lead and an insulating base installed so that the lead penetrates the recess from the inside of the recess and is led out to the outside. 2. The optical semiconductor element housing package according to claim 1, wherein the plurality of through holes are arranged so as to be aligned in the longitudinal direction of the plate member. The optical semiconductor element housing package according to claim 1 or 2, and a long-plate-shaped optical semiconductor element in which both ends in the longitudinal direction are placed on the flat portion and electrodes are electrically connected to the leads. And a translucent lid attached to the upper surface of the insulating base so as to close the concave portion.

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