JP2005101167A5 - - Google Patents
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- Publication number
- JP2005101167A5 JP2005101167A5 JP2003331492A JP2003331492A JP2005101167A5 JP 2005101167 A5 JP2005101167 A5 JP 2005101167A5 JP 2003331492 A JP2003331492 A JP 2003331492A JP 2003331492 A JP2003331492 A JP 2003331492A JP 2005101167 A5 JP2005101167 A5 JP 2005101167A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003331492A JP3685196B2 (ja) | 2003-09-24 | 2003-09-24 | 配線基板、半導体装置及びその製造方法並びに電子機器 |
| US10/948,075 US7262496B2 (en) | 2003-09-24 | 2004-09-23 | Wiring base with wiring extending inside and outside of a mounting region |
| US11/879,993 US7547580B2 (en) | 2003-09-24 | 2007-07-19 | Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003331492A JP3685196B2 (ja) | 2003-09-24 | 2003-09-24 | 配線基板、半導体装置及びその製造方法並びに電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005101167A JP2005101167A (ja) | 2005-04-14 |
| JP2005101167A5 true JP2005101167A5 (ja) | 2005-07-07 |
| JP3685196B2 JP3685196B2 (ja) | 2005-08-17 |
Family
ID=34460144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003331492A Expired - Fee Related JP3685196B2 (ja) | 2003-09-24 | 2003-09-24 | 配線基板、半導体装置及びその製造方法並びに電子機器 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US7262496B2 (ja) |
| JP (1) | JP3685196B2 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4287882B2 (ja) * | 2007-01-22 | 2009-07-01 | シャープ株式会社 | フレキシブル基板及び半導体装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2518569B2 (ja) | 1991-09-19 | 1996-07-24 | 三菱電機株式会社 | 半導体装置 |
| JP3779789B2 (ja) * | 1997-01-31 | 2006-05-31 | 株式会社ルネサステクノロジ | 半導体装置およびその製造方法 |
| JP2000340934A (ja) | 1999-05-27 | 2000-12-08 | Matsushita Electric Ind Co Ltd | 半導体装置の装着方法 |
| US6278264B1 (en) * | 2000-02-04 | 2001-08-21 | Volterra Semiconductor Corporation | Flip-chip switching regulator |
| JP2001237265A (ja) | 2000-02-22 | 2001-08-31 | Sanyo Electric Co Ltd | 電気装置の接続に用いる基板 |
| JP2001284413A (ja) | 2000-04-03 | 2001-10-12 | Fujitsu Ltd | 半導体装置及び半導体装置用基板 |
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2003
- 2003-09-24 JP JP2003331492A patent/JP3685196B2/ja not_active Expired - Fee Related
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2004
- 2004-09-23 US US10/948,075 patent/US7262496B2/en not_active Expired - Fee Related
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2007
- 2007-07-19 US US11/879,993 patent/US7547580B2/en not_active Expired - Fee Related