JP2005099762A - Optical component supporting substrate, method of manufacturing the same, optical component supporting substrate with optical component, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical component supporting substrate on which reliable positioning is performed without the deviation of an optical axis, and the transmission loss of light is small. <P>SOLUTION: The optical component supporting substrate 10 is provided with a substrate 11, a metal filling part 57 and a guide member 44 for positioning. The guide member 44 for positioning is engaged with a recessed part 36 for positioning which an optical wave guide 31 has, the optical waveguide 31 being an optical component having an optical transmission function. The substrate 11 has a first recessed part 56 opened at a main face side 12. The metal filling part 57 is filled in the first recessed part 56. The metal filling part 57 has a second recessed part 46 having a smaller diameter than that of the first recessed part 56 and is open at the main face side 12. The guide member 44 for positioning is supported by being engaged with the second recessed part 46. The optical waveguide 31 and the substrate 11 are positioned by engaging the the guide member 44 for positioning with the recessed part 36 for positioning of the optical waveguide 31. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an optical component supporting substrate and a manufacturing method thereof, an optical component supporting substrate with an optical component, and a manufacturing method thereof.

  In recent years, with the development of information communication technology represented by the Internet and the dramatic improvement in the processing speed of information processing apparatuses, there is an increasing need for transmitting and receiving large-capacity data such as images. An information transmission speed of 10 Gbps or higher is desirable to exchange such a large amount of data freely through an information communication facility, and great expectations are placed on optical communication technology as a technology that can realize such a high-speed communication environment. On the other hand, signals can be transmitted at high speeds even on signal transmission paths at relatively short distances, such as connections between wiring boards in equipment, connections between semiconductor chips in wiring boards, connections within semiconductor chips, etc. It has been desired in recent years. For this reason, it is considered that it is ideal to shift from a conventional metal cable or metal wiring to optical transmission using an optical fiber or an optical waveguide.

Here, a wiring board that mounts an optical element and performs optical communication between the optical element and an optical fiber or an optical waveguide has been conventionally proposed (for example, see Patent Documents 1 and 2). In Patent Documents 1 and 2, the external board and the wiring board can be arranged at predetermined positions by the self-alignment action when the external board on which the optical element is mounted is connected to the wiring board with solder bumps and reflowed. This technique is disclosed. Moreover, as a means for connecting optical fibers, an instrument called an optical fiber connector has been conventionally proposed (for example, see Non-Patent Document 1).
JP 2002-236228 A JP-A-8-250542 Fujikura Technical Review No. 97 October 1999

  However, in the techniques of Patent Documents 1 and 2 described above, alignment (optical axis alignment) between the external substrate on which the optical element is mounted and the wiring substrate is merely performed by solder reflow. For this reason, the alignment accuracy is not sufficient, and an optical axis shift is likely to occur between the optical element and the optical waveguide, which in turn tends to cause a light transmission loss. Therefore, it is considered that this method cannot sufficiently cope with the higher speed and higher density expected in the future. Further, when the wiring substrate is a resin substrate, the heat dissipation of the optical element and its operation circuit is deteriorated, and as a result, the emission wavelength may be shifted. Therefore, in this case, stable operating characteristics cannot be obtained.

  If the wiring board is a ceramic wiring board, the problem of heat dissipation is solved to some extent, but the workability is poor, and therefore there is a risk of increasing the cost.

  In addition, it is conceivable to apply the optical fiber connector described in Non-Technical Document 1 to the connection between the wiring board and the optical fiber, but the optical fiber connector itself is a resin molded product and therefore has poor heat dissipation. Therefore, in this case, there is a possibility that the emission wavelength is shifted as a result of the deterioration of the heat dissipation of the optical element and its operation circuit.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an optical component supporting substrate, a method of manufacturing the same, and an optical component supporting substrate that can be reliably aligned without optical axis misalignment and have a small light transmission loss. An object is to provide an optical component supporting substrate with components and a manufacturing method thereof.

  And as means for solving the above-mentioned problems, the substrate has a main surface and has a first recess opening at least on the main surface side, and the first recess is filled with a smaller diameter than the first recess. And a metal filling portion having a second recess opening at least on the main surface side, and being supported by being fitted into the second recess, and a part of the metal protrusion protrudes on the main surface side of the substrate to transmit light. There is provided an optical component support substrate comprising an alignment guide member that can be fitted into an alignment recess of an optical component having at least one of a function, a light collecting function, and a light reflection function . In this problem solving means, the member “optical component” is a member formed separately from the optical component support substrate, and is an object to be aligned with the optical component support substrate, and is not an essential component.

  Further, as another means for solving the above-mentioned problem, among the substrate having a main surface and having a first recess opening at least on the main surface side, and among the light transmission function, the light collecting function, and the light reflecting function, And an optical component having an alignment recess, and a metal filling portion having a second recess that is filled in the first recess and has a smaller diameter than the first recess and opens at least on the main surface side. And a guide member for alignment which is supported by being fitted into the second recess, and a part of which protrudes on the main surface side of the substrate and fits into the alignment recess of the optical component There is provided an optical component supporting substrate with an optical component.

  Therefore, according to these inventions, the alignment guide member supported by the substrate via the metal filling portion fits into the alignment recess of the optical component, thereby more positively and with high accuracy. The optical axis is aligned. Therefore, it is possible to realize an optical component supporting substrate that has a small light transmission loss and can sufficiently cope with high speed and high density. Moreover, in the case of the present invention in which the metal filling portion is provided at the place where the second recess is formed, for example, there are the following advantages compared to the case where the resin filling portion is provided at the place. That is, even if a high temperature of several hundred degrees Celsius is encountered, since the metal is not thermally deformed as much as the resin, it is possible to avoid the deterioration of the position accuracy and the shape of the second recess. Therefore, the alignment guide member can be reliably supported with high positional accuracy. This also contributes to a reduction in light transmission loss.

  As the substrate constituting the optical component supporting substrate, for example, a resin substrate, a ceramic substrate, a glass substrate, or a metal substrate can be used, and a ceramic substrate is particularly preferable. When a ceramic substrate having a higher thermal conductivity than that of the resin substrate is used, the generated heat is efficiently dissipated. Therefore, the shift of the emission wavelength due to the deterioration of the heat dissipation property can be avoided, and an optical component supporting substrate excellent in operational stability and reliability can be realized. Preferable examples of such ceramic substrates include substrates made of alumina, aluminum nitride, silicon nitride, boron nitride, beryllia, mullite, low-temperature fired ceramics, and the like. Among these, it is preferable to select a low-temperature fired ceramic substrate typified by a glass ceramic substrate.

  Moreover, as a suitable example of a resin substrate, the board | substrate which consists of EP resin (epoxy resin), PI resin (polyimide resin), BT resin (bismaleimide-triazine resin), PPE resin (polyphenylene ether resin) etc. is mentioned, for example. Can do. In addition, a substrate made of a composite material of these resins and organic fibers such as glass fibers (glass woven fabric or glass nonwoven fabric) or polyamide fibers may be used. Preferable examples of the metal substrate include a copper substrate, a substrate made of a copper alloy, a substrate made of a single metal other than copper, and a substrate made of an alloy other than copper.

  Such a substrate is preferably a wiring substrate including an insulating layer and a conductor portion. The conductor portion may be formed on the substrate surface or may be formed inside the substrate. In order to achieve interlayer connection between these conductor portions, via hole conductors may be formed inside the substrate. In addition, for the conductor part and via hole conductor, for example, a conductive metal paste made of gold (Au), silver (Ag), copper (Cu), platinum (Pt), tungsten (W), molybdenum (Mo), etc. is printed. Or it is formed by filling. And an electric signal flows through such a conductor part. In addition to such a wiring board, for example, it is allowed to use a build-up wiring board provided with a build-up layer formed by alternately laminating resin insulating layers and conductor layers on the board.

  In particular, when the substrate is a low-temperature fired ceramic substrate, it preferably has a conductor portion made of silver (Ag) or copper (Cu), which is a low melting point metal. This is because the conductor portion formed using this type of metal has a low resistance, so that the use thereof makes it easy to achieve high performance of the optical component supporting substrate. In addition, this kind of metal can be fired simultaneously with the ceramic even at a relatively low temperature.

  Although the shape of the said board | substrate is not specifically limited, It is good to have at least 1 main surface, for example, it is suitable to use a flat board | substrate. The substrate has a first recess opening at least on the main surface side. The first recess may be a non-through hole that opens only on the main surface side (that is, has one opening), and also opens on the surface side opposite to the main surface (that is, has two openings). ) A through hole may be used. The size, shape, and the like of the first recess are not particularly limited as long as the metal filling portion described later can be formed and the alignment guide member can be supported.

  The metal filling portion is located in the first concave portion, and specifically, is located so as to be in contact with the inner side surface in the first concave portion. The metal filling portion has a second recess having a smaller diameter than the first recess and opening at least on the main surface side. Therefore, the second recess may be a non-through hole that opens only on the main surface side (that is, has one opening), and also opens on the surface side opposite to the main surface (that is, the opening portion is open). It may be a through hole. The size, shape, and the like of the second recess are not particularly limited as long as the alignment guide member described later can be supported. In addition, the center line of the first recess and the center line of the second recess do not necessarily match.

  Here, the second recess is preferably a precision machined hole. This is because, if the hole is a precision machined hole, the alignment guide member serving as a reference for optical axis alignment can be supported at the correct position.

  The material for forming the metal filling portion is not particularly limited, and any metal material can be selected in consideration of workability, cost, heat resistance, heat dissipation, and the like. Examples of suitable metals include, for example, gold (Au), silver (Ag), copper (Cu), platinum (Pt), nickel (Ni), titanium (Ti), iron (Fe), magnesium (Mg), Tin (Sn), lead (Pb), aluminum (Al), cobalt (Co), tungsten (W), molybdenum (Mo), and the like can be given. Of course, these alloys (for example, iron / nickel alloy) may be used. In addition, the presence or absence of conductivity does not matter.

  When a low-temperature fired ceramic substrate having a conductor portion made of copper or silver is selected as the substrate, the metal filling portion is preferably made of the same metal material as that of the conductor portion, that is, made of copper or silver. If the metal used for the conductor part and the metal filling part is of the same type, it becomes possible to form the metal filling part together with the formation of the conductor part, and it becomes easy to achieve improvement in productivity and reduction in manufacturing cost. It is. In addition, it is convenient to use copper or silver, which is a relatively inexpensive metal material, to achieve cost reduction. In addition, if copper or silver is used, it is relatively easy to form the second recess.

  Suitable methods for filling the metal filling portion in the first recess include printing of metal paste using a printing device, dispensing of metal paste using a dispensing device, and plating.

  The alignment guide member constituting the optical component support substrate has a structure that can be fitted into the alignment recess of the optical component. The alignment guide member is supported by the substrate through the metal filling portion by being fitted into the second recess. In such a support state, a part of the alignment guide member protrudes on the main surface side of the substrate. Here, the shape of the alignment guide member is not particularly limited, but, for example, a pin-shaped member (guide pin) is preferable, and a material that is hard to some extent is preferable. Such guide pins are preferably fitted into precision machined holes. Also, the diameter of the alignment guide member (particularly the diameter of the portion protruding on the main surface side of the substrate) is substantially the same as that of the alignment recess so that it can be fitted with the alignment recess of the optical component. Preferably there is. The number of the alignment guide members is not particularly limited. However, from the viewpoint of improving alignment accuracy and fixing strength, it is preferable that the number of alignment guide members is more than one.

  In the case where the alignment guide member is a guide pin, the end portion of the guide pin preferably has a flat surface perpendicular to the axial direction. Such a flat surface has an advantage that, for example, when the image of the end portion of the guide pin is recognized and used as a reference for alignment, image recognition can be easily performed. However, it is preferable to chamfer the outer edge of the end portion of the guide pin. And if it is this structure, it can be made easy to fit a guide pin with respect to the alignment recessed part of an optical component.

  The optical component support substrate of the present invention may include an optical element to be optically coupled to the optical component. However, in the present invention, the optical element is an arbitrary component. For example, one or more optical elements are mounted on the main surface of the substrate. As the mounting method, for example, a method such as wire bonding or flip chip bonding, a method using an anisotropic conductive material, or the like can be employed. As an optical element (that is, light emitting element) having a light emitting portion, for example, a light emitting diode (LED), a semiconductor laser diode (LD), a surface emitting laser (Vertical Cavity Surface Emitting Laser; VCSEL), etc. Can be mentioned. These light emitting elements have a function of converting an inputted electric signal into an optical signal and then emitting the optical signal from a light emitting unit toward a predetermined portion. On the other hand, examples of the optical element having a light receiving portion (that is, a light receiving element) include a pin photodiode (pin PD) and an avalanche photodiode (APD). These light receiving elements have a function of causing an optical signal to be incident on the light receiving unit, converting the incident optical signal into an electric signal, and outputting the electric signal. The optical element may have both a light emitting part and a light receiving part. Suitable materials used for the optical element include, for example, Si, Ge, InGaAs, GaAsP, GaAlAs and the like. Such an optical element (particularly a light emitting element) is operated by an operation circuit. The optical element and the operation circuit are electrically connected through a conductor portion formed on the substrate, for example.

  The optical element may be directly mounted on the substrate, or may be indirectly mounted via a support separate from the substrate. As a suitable example of the structure in which the optical element is directly mounted, for example, a structure in which the optical element is directly mounted on the inner bottom surface of the cavity provided in the substrate can be exemplified. However, when mounting indirectly, the support is provided with an alignment hole in which the alignment guide member can be fitted, and fixed to the substrate while performing alignment using the alignment hole. It is preferable to aim for.

  The optical component aligned with the optical component support substrate of the present invention has at least one of a light transmission function, a light collecting function, and a light reflecting function. As a specific example, examples of the optical component having an optical transmission function include an optical waveguide and an optical fiber. In addition, the base material which supports an optical waveguide also corresponds to the optical component which has an optical transmission function. An optical component including an optical fiber and an optical fiber connector that supports the optical fiber also corresponds to an optical component having an optical transmission function. Examples of the optical component having a condensing function include a lens component represented by a microlens array. As an optical component having a light reflection function, for example, there is an optical path conversion component. In addition, it can be said that the optical fiber connector in which the optical path changing part is formed is an optical component having a light reflecting function. It can be said that the optical waveguide in which the optical path conversion unit is formed is an optical component having an optical transmission function and an optical reflection function. Note that only one optical component may be supported on the optical component support substrate of the present invention, or two or more optical components may be supported.

  The optical waveguide refers to a plate-like or film-like member having a core serving as an optical path through which an optical signal propagates and a clad surrounding the core. For example, an organic optical waveguide made of a polymer material, quartz glass, There are inorganic optical waveguides made of compound semiconductors and the like. As the polymer material, a photosensitive resin, a thermosetting resin, a thermoplastic resin, or the like can be selected. Specifically, a polyimide resin such as a fluorinated polyimide, an epoxy resin, a UV curable epoxy resin, a PMMA ( Polymethyl methacrylate), acrylic resins such as deuterated PMMA, deuterated fluorinated PMMA, polyolefin resins, and the like are suitable.

  The optical fiber connector is essentially a means for connecting the optical fiber portions, but here, it is used as a means for connecting the optical fiber side and the substrate side. Such an optical fiber connector may be a single-core optical fiber connector or a multi-fiber optical fiber connector. The optical fiber connector may have an additional function of reflecting light and converting an optical path, for example, in addition to the original function of connecting to the substrate side.

  Further, as another means for solving the above-mentioned problem, a substrate having a main surface and having a first recess opening at least on the main surface side, and filling the first recess, the first recess A metal filling portion having a second recess having a smaller diameter and opening at least on the main surface side, and being supported by being fitted to the second recess, and a part thereof protrudes on the main surface side of the substrate. And an alignment guide member that can be fitted to an alignment recess of an optical component having at least one of a light transmission function, a light collecting function, and a light reflection function. A first drilling step of forming the first recess in the substrate by drilling, a metal filling portion forming step of filling the metal into the first recess to form the metal filling portion, Metal filling After the forming step, a second drilling step for forming the second concave portion in the metal filling portion by drilling, and a guide member attaching step for fitting and supporting the alignment guide member in the second concave portion And a method of manufacturing an optical component supporting substrate. In this problem solving means, the member “optical component” is a member that is formed separately from the optical component support substrate and is an object to be aligned with the optical component support substrate. is not.

  According to the manufacturing method of the present invention, the optical component supporting substrate having the above-described configuration can be manufactured easily and reliably at a low cost.

  Further, as another means for solving the above-mentioned problem, among the substrate having a main surface and having a first recess opening at least on the main surface side, and among the light transmission function, the light collecting function, and the light reflecting function, And an optical component having an alignment recess, and a metal filling portion having a second recess that is filled in the first recess and has a smaller diameter than the first recess and opens at least on the main surface side. And a guide member for alignment which is supported by being fitted into the second recess, and a part of which protrudes on the main surface side of the substrate and fits into the alignment recess of the optical component In the method of manufacturing an optical component supporting substrate with an optical component, the first drilling step of forming the first recess in the substrate by drilling, and filling the metal in the first recess with the metal Metal filling part A metal filling portion forming step to be formed; a second drilling step of forming the second recess in the metal filling portion by performing hole processing after the metal filling portion forming step; and the position in the second recess. After the guide member mounting step for fitting and supporting the alignment guide member and after the guide member mounting step, the alignment guide member is fitted into the alignment recess, thereby aligning the optical component. And a supporting and fixing step of supporting and fixing the optical component to the substrate while performing the manufacturing method of the optical component supporting substrate with an optical component.

  And according to this invention, the optical component supporting substrate with an optical component which has the said structure can be manufactured easily and reliably, and also at low cost.

  Hereinafter, the manufacturing method of the optical component supporting substrate having the above-described configuration will be described along the steps.

  For the optical component, it is preferable that the alignment recess is formed in advance by performing an alignment recess forming step. Here, a well-known technique can be adopted as a hole processing method in the alignment recess forming step, and specific examples include drilling, punching, etching, and laser processing. However, from the viewpoint of low cost, mechanical processing such as drilling or punching is preferable. Moreover, it is more preferable that the hole processing performed here is a precision hole processing using a precision drill etc., for example. This is because if the alignment recess is formed by such a processing method, the optical axis can be aligned with high accuracy. The alignment recess may be a through hole that opens on both the front and back surfaces of the optical component, or may be a non-through hole that opens only on the back surface side. Moreover, you may finely adjust the hole diameter of a positioning recessed part by performing a finishing process as needed after a positioning recessed part formation process.

  In the first drilling step, the first recess is formed in the substrate by drilling. Here, a well-known technique can be adopted as the hole drilling method in the first drilling step, and specific examples include drilling, punching, and laser processing. However, from the viewpoint of low cost, mechanical processing such as drilling or punching is preferable, and punching is particularly preferable.

  In particular, when the substrate is a low-temperature fired ceramic substrate having a conductor portion made of copper or silver, it is preferable to form the first recess by drilling a ceramic unsintered body. The reason for drilling the unsintered ceramic material is as follows. That is, since ceramic materials have the property of becoming extremely hard when completely sintered, processing becomes difficult and processing costs increase. On the other hand, it is because drilling a ceramic material in a green state that is not so hard can be performed relatively easily and at low cost.

  In the metal filling portion forming step, the metal filling portion is formed by filling the first recess with metal. Examples of the method of filling the metal include printing of a metal paste using a printing apparatus, dispensing of a metal paste using a dispensing apparatus, and plating.

  Particularly when the substrate is a low-temperature fired ceramic substrate having a conductor portion made of copper or silver, a conductor portion forming step of forming the conductor portion in the ceramic green body after the first drilling step; It is preferable to perform a metal filling portion forming step of filling the first recess with metal to form the metal filling portion. In addition, whichever part formation process and metal filling part formation process may be implemented first, you may implement simultaneously. Since the number of steps can be reduced when the conductor portion forming step and the metal filling portion forming step are simultaneously performed, the productivity can be improved.

  When the substrate is a low-temperature fired ceramic substrate having a conductor portion made of copper or silver, after the conductor portion forming step and the metal filling portion forming step, further sintering the ceramic unsintered body, It is preferable to perform a firing step to obtain the low-temperature fired ceramic substrate. Through this step, not only the ceramic is sintered, but also the conductor portion and the metal filling portion are sintered at the same time. The firing temperature, firing time, and the like are appropriately set according to the type of the selected low-temperature fired ceramic.

  In the second drilling step, after the metal filling portion forming step (after the firing step in the case of performing the firing step), the second recess is formed in the metal filling portion by performing hole processing. As a method of drilling in the second drilling step, a well-known technique can be adopted. In this case, it is desirable to perform precision drilling. This is because if the second concave portion is formed by such a processing method, the alignment guide member serving as a reference for optical axis alignment can be supported at a desired correct position. Specific methods for precision hole drilling include drilling, punching, and laser processing. In consideration of cost and the like, drilling using a precision drill is most preferable. In addition, you may make it perform said grinding | polishing process after a 2nd drilling process, In this case, the burr | flash etc. which were generated by the 2nd drilling process can be removed reliably. You may finely adjust a hole diameter by performing a finishing process as needed after a 2nd drilling process.

  In the guide member attaching step, the positioning guide member is fitted and supported in the second recess. As a result, at least a part of the alignment guide member protrudes on the main surface side of the substrate.

  In the supporting and fixing step, after the guide member attaching step, the alignment guide member is fitted into the alignment recess of the optical component. As a result, it is possible to support and fix the optical component to the substrate while aligning the optical axes of the optical component and the optical element. And according to the manufacturing method of this invention which implements the above process, a desired optical component supporting substrate with an optical component can be manufactured easily and reliably at low cost.

  In the case of an optical component support board having an optical element or an optical component support board with an optical component, for example, the component mounting process is performed before the support fixing process, and the optical element is mounted on the main surface side of the substrate. It is good to do. In this case, it is preferable to perform alignment with reference to an alignment guide member supported and fixed to the substrate. More specifically, it is preferable to mount the optical element on the main surface side of the substrate while recognizing an image of a flat surface at the tip of the alignment guide member and performing alignment based on the image. If no optical element is mounted on the substrate, such a mounting step can be omitted.

[First Embodiment]

  1 to 9 show an optical component supporting substrate 10 with an optical waveguide (optical component supporting substrate with an optical component) according to a first embodiment of the present invention.

  As shown in FIG. 1, an optical component supporting substrate 10 with an optical waveguide according to this embodiment includes a VCSEL 14 (optical element), a glass ceramic substrate 11 (substrate), guide pins 44 (alignment guide members), and the like. ing.

  A glass ceramic substrate 11, which is a kind of low-temperature fired ceramic substrate, is a substantially rectangular plate member having an upper surface 12 (main surface) and a lower surface 13. Such a glass ceramic substrate 11 is a so-called multilayer wiring board composed of a plurality of ceramic layers 21 to 25 and includes a metal wiring layer 26 (conductor portion). For example, a plurality of connection pads 29 for mounting various electronic components are formed on a part of the metal wiring layer 26 located on the upper surface 12 (main surface). The metal wiring layer 26 is also formed on the inner layer of the glass ceramic substrate 11. The glass ceramic substrate 11 also includes a via-hole conductor 27, and the metal wiring layers 26 of different layers are connected to each other through via-hole conductors 27 (conductor portions). A plurality of connection terminals 28 are provided on the lower surface 13 of the glass ceramic substrate 11. In the present embodiment, the metal wiring layer 26, the via-hole conductor 27, and the connection pad 29 are all made of copper (Cu).

  As shown in FIGS. 1 and 2, a rectangular cavity 41 is formed at a substantially central portion of the upper surface 12 of the glass ceramic substrate 11. On the inner bottom surface of the cavity 41, a VCSEL 14 which is a kind of optical element (light emitting element) is mounted with the light emitting surface facing upward. The VCSEL 14 has a plurality of (here, four) light emitting units 15 arranged in a line in the light emitting surface. Accordingly, these light emitting portions 15 emit laser light having a predetermined wavelength in a direction orthogonal to the upper surface 12 of the glass ceramic substrate 11 (that is, the upward direction in FIG. 1). A plurality of terminals (not shown) of the VCSEL 14 are respectively joined on connection pads 29 provided on the inner bottom surface 42 of the cavity 41. Note that a light receiving element such as a photodiode may be mounted instead of the light emitting element such as the VCSEL 14.

  An operation circuit IC 16 (so-called driver IC) for driving the VCSEL 14 is disposed in the vicinity of the VCSEL 14 on the inner bottom surface of the cavity 41. A plurality of terminals (not shown) of the operating circuit IC 16 are respectively joined to connection pads 29 provided on the inner bottom surface of the cavity 41. Therefore, the VCSEL 14 and the operating circuit IC 16 are electrically connected via the metal wiring layer 26 and the like.

  As shown in FIGS. 1 and 2, first concave portions 56 are provided at four locations on the outer peripheral portion of the optical component supporting substrate 10 with an optical waveguide. The first recess 56 is circular and has an equal cross-sectional shape, and is a non-through hole that opens only on the upper surface 12 of the glass ceramic substrate 11. In the case of this embodiment, the diameter of the 1st recessed part 56 is set so that it may become about 1.0 mm-2.0 mm.

  A copper filling portion 57 (metal filling portion) is provided inside the first recessed portion 56, and a pin support hole 46 (second recessed portion) is provided substantially at the center of the copper filling portion 57. . It may be understood that a dummy via-hole conductor is provided inside the first recess 56, and a pin support hole 46 is provided at substantially the center of the dummy via-hole conductor. The pin support hole 46 is circular and has an equal cross-sectional shape, and is opened only on the upper surface 12 of the glass ceramic substrate 11. In the case of this embodiment, the diameter of the pin support hole 46 is smaller than the first recess 56 and is set to about 0.7 mm.

  Inside the four pin support holes 46, a guide pin 44 (positioning guide member) made of stainless steel and having a circular cross section is fitted and supported with one end protruding toward the upper surface 12 side. These guide pins 44 are provided with flat surfaces perpendicular to the axial direction at both ends. The outer edge of the end portion of the guide pin 44 is chamfered. Specifically, in this embodiment, a guide pin “CNF125A-21” (diameter 0.699 mm) defined in JIS C 5981 is used.

  As shown in FIG. 1, a film-like optical waveguide 31 (optical component) is disposed on the upper surface 12 (main surface) side of the glass ceramic substrate 11. A base material 32 constituting the optical waveguide 31 has a core 33 and a clad 34 surrounding the core 33 from above and below. The core 33 substantially becomes an optical path through which the optical signal propagates. In the case of the present embodiment, the core 33 and the clad 34 are formed of transparent polymer materials having different refractive indexes, specifically, PMMA (polymethyl methacrylate) having different refractive indexes. The number of cores 33 serving as an optical path is four, the same as the number of light emitting portions 15, and they are formed so as to extend linearly and in parallel.

  A V-shaped groove 35 that opens on the upper surface of the optical waveguide 31 is formed at a predetermined location in the optical waveguide 31. The tip of the V-shaped groove 35 extends to a certain depth of the core 33. The inner surface of the V-shaped groove 35 is an inclined surface having an angle of about 45 ° with respect to the upper surface 12 of the glass ceramic substrate 11, and a thin film 37 made of a metal capable of totally reflecting light is deposited on the inclined surface. ing. As a result, an optical path changing mirror that reflects light at an angle of 90 ° is configured. Circular alignment holes 36 are formed through the four corners of the optical waveguide 31. These alignment holes 36 have a diameter of about 0.7 mm corresponding to the size of the guide pins 44. And each guide pin 44 which protrudes in the glass-ceramic board | substrate 11 side is fitted by each alignment hole 36 which the optical waveguide 31 has. As a result, the optical waveguide 31 is fixed in an aligned state on the upper surface 12 (main surface) of the glass ceramic substrate 11. Here, “fixed in an aligned state” specifically means that the optical axis of each light emitting section 15 of the VCSEL 14 and the optical axis of each core 33 of the optical waveguide 31 are aligned, and the VCSEL 14 and the optical waveguide 31 are It means that the optical waveguide 31 is supported and fixed in an optically coupled state.

  A general operation of the optical component supporting substrate 10 with the optical waveguide configured as described above will be briefly described.

  The VCSEL 14 becomes operable by supplying power from the glass ceramic substrate 11 side. When an electrical signal is output from the operating circuit IC 16 on the glass ceramic substrate 11 to the VCSEL 14, the VCSEL 14 converts the input electrical signal into an optical signal (laser light), and then directs the optical signal upward to form a light emitting unit. 15 is emitted. An optical signal incident from the lower surface of the optical waveguide 31 changes its traveling direction by 90 ° in the optical path conversion mirror, and proceeds in the core 33 toward the light receiving side (not shown).

  Next, the manufacturing method of the optical component supporting substrate 10 with an optical waveguide having the above-described configuration will be described.

  First, the glass ceramic substrate 11 is produced by the following procedure.

  A raw material slurry is prepared by uniformly mixing and kneading ceramic powder, an organic binder, a solvent, a plasticizer, and the like, and the raw material slurry is used to form a sheet by a doctor blade device, thereby obtaining green sheets 61 and 62 having a predetermined thickness. , 63, 64, 65 are formed (see FIG. 3). A predetermined portion of the green sheets 61 to 65 is punched to form the via hole 30, the cavity hole 68, and the first recess 56.

  At this stage, since the ceramic is still unsintered, drilling can be performed relatively easily and at low cost. In the first drilling step, the inner diameter of the first recess 56 at the time of passing through the firing process is such that the inner diameter (about 0.7 mm) of the pin support hole 46 (second recess) and the diameter of the guide pin 44 (about 0.7 mm). Is set to be larger than that, and drilling is performed. Specifically, the hole processing of the first recess 56 is performed by setting the thickness to about 1.2 mm to 2.4 mm. The reason is that the ceramic shrinks through the firing process, and accordingly, the first concave portion 56 is also reduced in diameter and misaligned. Therefore, it is necessary to make the first concave portion 56 larger by taking this into account. Because there is.

  Then, the via hole conductor 30 is filled with the via hole conductor copper paste 69 using the paste printing apparatus, and at the same time, the copper paste 69 is filled into the first recess 56 (see FIG. 4). Also, a copper paste 69 is printed on the surfaces of the green sheets 62 and 63, thereby forming a print layer that will later become the metal wiring layer 26 and the like. And these green sheets 61-65 are laminated | stacked and integrated by pressing and it is set as a green sheet laminated body. Next, after performing a drying process, a degreasing process, etc. according to a well-known method, a baking process is performed at the temperature of about 700 degreeC-1000 degreeC which can further sinter a ceramic. As a result, the green sheet laminate (ceramic unsintered body) is sintered to form a glass ceramic substrate 11 having a cavity 41 as shown in FIG. At this point, the ceramic hardens and shrinks, and at the same time, the copper paste 69 also sinters and hardens. However, the copper filling portion 57 made of the sintered copper paste 69 has a lower hardness than the glass ceramic substrate 11. Therefore, the machining for the copper filling portion 57 is less difficult than the machining for the glass ceramic substrate 11. In other words, the copper filling portion 57 is superior in workability compared to the glass ceramic substrate 11. Note that the connection terminals 28 may be formed after the firing step.

  On the other hand, the optical waveguide 31 is formed by sequentially laminating the clad 34 and the core 33 according to a conventionally known method, and then performing precision hole processing using a precision drill to form alignment holes 36 at predetermined four locations. (Positioning recess forming step). Further, by performing V-groove processing and sputtering on the portion, an optical path conversion mirror made of the metal thin film 37 is formed. When forming the optical path conversion mirror, it is preferable to use the position of the alignment hole 36 as a reference, whereby the alignment accuracy can be further improved. Therefore, the optical path changing portion forming step is preferably performed after the alignment recess forming step.

  In the subsequent second drilling step, the pin support hole 46 (second concave portion) is formed in the copper filling portion 57 by performing precision drilling using the precision drill 49 (see FIG. 6). According to such a processing method, the guide pin 44 serving as a reference at the time of optical axis alignment can be a pin support hole 46 that can be supported at a desired correct position. Further, as described above, since the copper filling portion 57 is a portion excellent in workability, the pin support hole 46 can be formed and processed relatively easily. Further, finishing is performed by a known method, and the hole diameter of the pin support hole 46 is finely adjusted to be 0.700 mm. Specifically, the accuracy required for processing at this time is ± 0.001 mm.

  In the subsequent guide member support step, one end side of the guide pin 44 is fitted and supported in the pin support hole 46 (see FIG. 7). As a result, a part of the guide pin 44 protrudes from the upper surface 12 of the glass ceramic substrate 11.

  In the subsequent mounting process, solder is supplied to the connection pads 29 on the inner bottom surface of the cavity 41 in advance. Then, the VCSEL 14 and the operation circuit IC 16 are aligned with the connection pad 29 above the inner bottom surface of the cavity 41. At that time, the upper flat surface of one or a plurality of guide pins 44 that are already in the standing support state is imaged by an imaging means such as a CCD camera, and image processing is performed based on the imaging data so that the flat surface is a circular region. Recognize images. Then, the image-recognized circular area is set as a reference (more specifically, for example, the center of the circular area is the origin), and the position of the VCSEL 14 and the operation circuit IC 16 in the XY direction is finely adjusted (FIG. 8). reference). When the positions of the VCSEL 14 and the operation circuit IC 16 are determined, they are lowered, pressed against the inner bottom surface of the cavity 41, and temporarily fixed. In this state, solder reflow is performed, and the terminals of the VCSEL 14 and the operation circuit IC 16 are soldered to the connection pads 29. In addition, according to this method, the positional accuracy of the VCSEL 14 and the like in the XY directions can be reliably improved.

  In the subsequent supporting and fixing step, each guide pin 44 protruding from the upper surface 12 of the glass ceramic substrate 11 is fitted into each alignment hole 36 in the optical waveguide 31 (see FIG. 9). As a result, it is possible to support and fix the optical waveguide 31 to the glass ceramic substrate 11 while aligning the optical axes of the optical waveguide 31 and the VCSEL 14. And the optical component support substrate 10 with an optical waveguide of this embodiment is completed as mentioned above.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In this embodiment, the optical waveguide 31 is supported and fixed to the glass ceramic substrate 11 while achieving optical axis alignment with the fitting relationship between the guide pin 44 and the alignment hole 36. Therefore, the optical axis is more positively and accurately aligned as compared with the conventional passive optical axis alignment that relies only on the self-alignment action during reflow. Therefore, it is possible to realize the optical component supporting substrate 10 with an optical waveguide that has a small light transmission loss and can sufficiently cope with high speed and high density.

  (2) In the present embodiment, the glass ceramic substrate 11 having a higher thermal conductivity than the resin substrate is used. Therefore, the heat generated by the VCSEL 14 and the operation circuit IC 16 is efficiently dissipated. Therefore, the shift of the emission wavelength due to the deterioration of the heat dissipation property is avoided, and the optical component supporting substrate 10 with an optical waveguide excellent in operational stability and reliability can be realized.

  (3) Further, in the case of the present embodiment in which the copper filling portion 57 is provided at a location where the pin support hole 46 which is the second recess is formed, for example, the following advantages compared with the case where the resin filling portion is provided at the location. There is. That is, compared with the resin material, copper not only has excellent heat resistance, but also has a relatively small coefficient of thermal expansion. Therefore, even when a high temperature of several hundred degrees Celsius is encountered, the copper filling portion 57 does not deform as much as the resin filling portion. Therefore, it is possible to avoid the deterioration of the positional accuracy and the shape of the pin support hole 46, and to reliably support the guide pin 44 with high positional accuracy. This surely contributes to reduction of light transmission loss.

(4) Moreover, according to the manufacturing method of this embodiment, the desired optical component supporting substrate 10 with an optical waveguide can be manufactured easily and reliably at low cost.
[Second Embodiment]

  Next, an optical component supporting substrate 110 with an optical waveguide (optical component supporting substrate with an optical component) according to a second embodiment embodying the present invention will be described with reference to FIGS.

  As shown in FIG. 10, the optical component supporting substrate 110 with an optical waveguide of this embodiment includes a VCSEL 14 (optical element), a photodiode 17 (optical element) having a light receiving unit 18, a resin substrate 111 (substrate), a guide pin. 44 (positioning guide member) and the like.

  The resin substrate 111 used in the present embodiment is a plate member having a substantially rectangular shape in plan view having an upper surface 12 (main surface) and a lower surface 13, and build-up layers on both surface layers of the core substrate 112 (core portion). This is a so-called build-up wiring board having 113 and 114. The core portion 112 has a structure in which a glass cloth as a base material is impregnated with an epoxy resin. Instead of the epoxy resin, for example, a resin impregnated with polyimide resin, bismaleimide-triazine resin, polyphenylene ether resin or the like may be used.

  The build-up layer 113 on the upper surface side layer is constituted by a resin insulating layer 121 and a metal conductor layer 122. The resin insulating layer 121 formed on the upper surface of the core of the core substrate 112 has a thickness of about 30 μm and is made of, for example, a resin-resin composite material in which continuous porous PTFE is impregnated with an epoxy resin. A metal conductor layer 122 made of copper plating is patterned on the surface of the resin insulating layer 121.

  The build-up layer 114 on the lower surface layer is composed of resin insulating layers 131 and 133 and metal conductor layers 132 and 134. The first resin insulating layer 131 formed on the lower surface of the core of the core substrate 112 has a thickness of about 30 μm, and is made of, for example, a resin-resin composite material obtained by impregnating continuous porous PTFE with an epoxy resin. A metal conductor layer 132 made of copper plating is patterned on the surface of the first resin insulating layer 131. On the first resin insulation layer 131, a second resin insulation layer 133 made of the same material and having a thickness of about 30 μm is formed. A metal conductor layer 134 made of copper plating is patterned on the surface of the second resin insulating layer 133.

  Through holes 115 for internal conduction that penetrate the core upper surface and the core lower surface are formed at a plurality of locations on the core substrate 112. These through-hole portions 115 are filled with the build-up layers 113 and 114, and the openings are not exposed on the surface of the resin substrate 111. These through-hole portions 115 have a structure in which a through-hole plating portion 117 is provided on the inner wall surface of the through-hole forming hole 116. In the case of this embodiment, the through-hole plating part 117 consists of copper plating, and the deposition thickness is set to about 20 μm. The through-hole portion 115 is filled with a filler 118 that is a cured body of a paste in which an epoxy resin is used as a base and a curing agent and a filler are added thereto. These through-hole portions 115 serve to electrically connect the conductor of the buildup layer 113 on the upper surface layer and the conductor of the buildup layer 114 on the lower surface layer.

  A via hole portion 138 having a structure in which copper plating is deposited in a via recess is formed at a predetermined position of the resin insulating layer 121 of the buildup layer 113. A plurality of solder bumps 139 are provided immediately above the via hole portions 138. The VCSEL 14 and the photodiode 17 are soldered to the upper surface 12 side of the resin substrate 111 through these solder bumps 139. Note that a portion where the solder bump 139 is not formed on the upper surface of the resin substrate 111 is covered with a solder resist 137.

  The resin substrate 111 of the present embodiment has pin-supporting through-hole portions 155 at a plurality of spaced locations. The through-hole portion 155 has a structure in which a through-hole plating portion 157 (metal filling portion) made of copper plating is deposited on the inner wall surface of the through-hole forming hole 156 (first concave portion). The through-hole forming hole 156 has a diameter of about 0.75 mm to 0.85 mm, and is opened on the upper surface 12 and the lower surface 13 of the resin substrate 111. A plating portion center hole 146 (second recess) that opens at the upper surface 12 and the lower surface 13 is formed in the substantially central portion of the through-hole plating portion 157. In the case of the present embodiment, the diameter of the plated portion central hole 146 is smaller than the through hole forming hole 156 and is set to about 0.7 mm. And in these through hole portions 155 for supporting pins, a guide pin 44 (alignment guide member) made of stainless steel having a circular cross section is fitted and supported with one end protruding toward the upper surface 12 side. Has been. The protruding portions of these guide pins 44 are fitted into alignment holes 36 (alignment recesses) of the film-shaped optical waveguide 31 (optical component). As a result, the optical waveguide 31 is fixed in an aligned state on the upper surface 12 of the resin substrate 111.

  Next, a method for manufacturing the optical component supporting substrate 110 with an optical waveguide having the above configuration will be described.

  First, a resin substrate 111 manufactured by a conventionally known method is prepared.

  As a specific example, first, copper foil etching, electroless copper plating, or the like is performed using a copper clad laminate as a starting material to form a core substrate 112 having metal conductor layers 122 and 132 and through-hole portions 115. Next, build-up layers 113 and 114 are laminated on the surface layer of the core substrate 112, and a solder resist 137 is further formed. And solder bump 139 is provided by apply | coating a solder paste to the via-hole part 138, and reflowing (refer FIG. 11).

  Next, a hole 156 for forming a through hole is formed by drilling the resin substrate 111 using a drill (first drilling step, see FIG. 12). At this time, the through-hole forming hole 156 is provided to avoid a place where the via hole portion 138 is present. In the case of the present embodiment, since the resin substrate 111 made of a material that is basically not as hard as ceramic, such as glass, resin, metal, or the like, is used as the object to be processed, drilling can be performed relatively easily and at low cost. . Note that the first drilling step may be performed by laser processing.

  Next, electroless copper plating is performed on the resin substrate 111 according to a conventionally known method to form a through hole plating portion 157 having a thickness of about 10 μm to 50 μm on the inner wall surface of the through hole forming hole 156 (through hole plating). Part formation step, see FIG. If the plating thickness is less than 10 μm, it is not preferable because most or all of the through-hole plating portion 157 may be scraped off when drilling in the next second drilling step. Moreover, when it is going to make plating thickness larger than 50 micrometers, plating time will become long and productivity may fall.

  Next, a precision drilling process is performed on the resin substrate 111 at a location corresponding to the pin-supporting through-hole portion 155, and a part on the inner peripheral surface side of the through-hole plating portion 157 is scraped off, thereby obtaining a central portion of the plating portion. Hole 146 is formed (second drilling step, see FIG. 14). At this time, in this embodiment, the place where the glass cloth does not exist and only the copper plating exists is used as the processing object. Therefore, compared with the case where the portion where the glass cloth is present is used as the processing object, the precision hole processing can be performed relatively easily, with high accuracy, and at low cost. And according to such a processing method, the plating part center hole 146 which can support the guide pin 44 used as the reference | standard at the time of optical axis alignment in the correct position desired can be obtained. Further, finish processing is performed by a conventionally known method, and fine adjustment is performed so that the hole diameter of the plated portion central hole 146 becomes 0.700 mm. Specifically, the accuracy required for processing at this time is ± 0.001 mm.

  Next, the one end side of the guide pin 44 is fitted and supported in the plated portion central hole 146 (guide member attaching step). As a result, a part of the guide pin 44 protrudes from the upper surface 12 of the resin substrate 111. Thereafter, if the mounting process and the support fixing process described in the first embodiment are performed, the optical axis alignment between the optical waveguide 31 and the VCSEL 14 and the optical axis alignment between the optical waveguide 31 and the photodiode 17 are performed together. Thus, the optical waveguide 31 can be supported and fixed to the resin substrate 111.

  In the optical component supporting substrate 110 with an optical waveguide completed through the above procedure, the optical waveguide 31 is supported and fixed to the resin substrate 111 while achieving optical axis alignment with the fitting relationship between the guide pin 44 and the alignment hole 36. It has a configuration. Therefore, the optical axis is more positively and accurately aligned as compared with the conventional passive optical axis alignment that relies only on the self-alignment action during reflow. Therefore, it is possible to realize the optical component supporting substrate 110 with an optical waveguide that has a small light transmission loss and can sufficiently cope with high speed and high density. Further, according to the manufacturing method of the present embodiment, the optical component supporting substrate 110 with an optical waveguide shown in FIG. 10 can be manufactured easily and reliably at low cost.

  In addition, you may change embodiment of this invention as follows.

  The number and shape of the guide pins 44 can be arbitrarily changed without departing from the spirit of the present invention.

  -Finishing may be omitted as long as a sufficiently accurate hole can be formed only by precision drilling in the second drilling step.

  In the above embodiment, the optical waveguide 31 is used as an optical component having an optical transmission function and an optical reflection function. However, an optical component having an optical transmission function such as an optical fiber connector may be used instead. . Furthermore, instead of the optical waveguide 31, an optical component having a light collecting function such as a microlens array may be used.

  -In the said 1st Embodiment, the copper filling part 57 was formed with respect to the glass-ceramic board | substrate 11 which has a conductor part which consists of copper. However, when the glass ceramic substrate 11 has a conductor portion made of, for example, silver, a silver filling portion may be formed instead of the copper filling portion 57. This is because silver, like copper, is a metal that can be co-fired with glass ceramic.

  Next, in addition to the technical ideas described in the claims, a part of the technical ideas grasped by the embodiment described above will be listed below.

  (1) A low-temperature fired ceramic substrate having a main surface and having at least a first recess opening on the main surface side and having a conductor portion made of copper or silver, and the same as the conductor portion in the first recess A metal filling portion that is filled with a metal material and has a second recess having a smaller diameter than the first recess and opening at least on the main surface side, a core and a clad surrounding the core, and an alignment recess And a guide member for alignment that is supported by being fitted to the second concave portion, a part of which protrudes on the main surface side of the substrate and can be fitted to the positioning concave portion. And at least one of a light emitting portion and a light receiving portion, and an optical element to be optically coupled to the optical waveguide is mounted on the main surface side of the low-temperature fired ceramic substrate. Waveguide with optical component support board.

  (2) A substrate having a main surface and having a dummy via hole hole opened at least on the main surface side, a dummy via hole conductor filled in the dummy via hole, and the dummy via hole conductor for the dummy via hole The guide member support recess having a smaller diameter than the hole and opening at least on the main surface side is supported by being fitted into the guide member support recess, and a part of the guide member support recess is supported on the main surface side of the substrate. An optical component comprising: an alignment guide member that protrudes and can be fitted into an alignment recess of an optical component having at least one of a light transmission function, a light collecting function, and a light reflection function Support substrate.

  (3) A resin substrate having a main surface and having a through-hole forming hole opened at least on the main surface side, and filled in the through-hole forming hole, and having a diameter smaller than that of the through-hole forming hole and at least A through-hole plating part having a plating part central hole that opens on the main surface side, and is supported by being fitted to the plating part central hole, a part of which protrudes on the main surface side of the resin substrate, An optical component support substrate comprising: an alignment guide member that can be fitted into an alignment recess of an optical component having at least one of a light transmission function, a light collecting function, and a light reflection function .

  (4) The method for manufacturing an optical component supporting substrate according to (3), wherein a first drilling step of forming the through hole forming hole in the resin substrate by drilling, and the through hole A through-hole plating portion forming step of forming copper plating in the forming hole to form the through-hole plating portion, and after the through-hole plating portion forming step, the plating is performed on the through-hole plating portion by performing hole processing. A manufacturing method of an optical component supporting substrate, comprising: a second drilling step for forming a central hole in the portion; and a guide member attaching step for fitting and supporting the alignment guide member in the central hole in the plating portion.

1 is a schematic sectional view showing an optical component supporting substrate with an optical waveguide according to a first embodiment embodying the present invention. The schematic plan view which shows the said optical component support substrate. The schematic sectional drawing which shows the green sheet after the 1st drilling process in the manufacture process of the optical component supporting substrate with an optical waveguide of 1st Embodiment. In the said manufacture process, the schematic sectional drawing which shows the green sheet after a conductor part formation process and a metal filling part formation process. The schematic sectional drawing which shows the glass-ceramic board | substrate obtained through the baking process in the said manufacture process. The schematic sectional drawing which shows a mode at the time of forming a pin support hole in a copper filling part in the said manufacture process. The schematic sectional drawing which shows a mode at the time of making a pin support hole support a guide pin in the said manufacture process. FIG. 3 is a schematic cross-sectional view showing a state when a VCSEL or the like is mounted in the manufacturing process. FIG. 3 is a schematic cross-sectional view showing a state in which the optical waveguide is supported and fixed while the glass ceramic substrate and the optical waveguide are aligned in the manufacturing process. The schematic sectional drawing which shows the optical component supporting substrate with an optical waveguide of 2nd Embodiment which actualized this invention. The schematic sectional drawing which shows the resin substrate before the 1st drilling process in the manufacture process of the optical component supporting substrate with an optical waveguide of 2nd Embodiment. FIG. 3 is a schematic cross-sectional view showing a resin substrate during a first drilling step in the manufacturing process. The schematic sectional drawing which shows the resin substrate after a through-hole plating part formation process in the said manufacture process. In the said manufacture process, the schematic sectional drawing which shows a mode at the time of forming a plating part center hole in a through-hole plating part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,110 ... Optical component support substrate with an optical waveguide as an optical component support substrate with an optical component 11 ... Glass ceramic substrate as a substrate 12 ... Upper surface of the substrate as a main surface 14 ... VCSEL as an optical element
DESCRIPTION OF SYMBOLS 15 ... Light-emitting part 17 ... Photodiode as an optical element 18 ... Light-receiving part 26 ... Metal wiring layer as a conductor part 27 ... Via-hole conductor as a conductor part 29 ... Connection pad as a conductor part 31 ... Optical waveguide as an optical component 36 Alignment hole 41 as alignment recess 41 Cavity 44 Guide pin as alignment guide member 46 Pin support hole as second recess 56 First recess 57 Copper filling portion 111 as metal filling portion 111 Resin substrate as substrate 146... Plated portion central hole as second recess 156. Through hole forming hole as first recess 157. Through hole plated portion as metal filling portion

Claims (8)

A substrate having a main surface and having a first recess opening at least on the main surface side;
A metal filling portion having a second recess filled in the first recess and having a smaller diameter than the first recess and opening at least on the main surface side;
An optical component that is supported by being fitted into the second recess, a part of which protrudes on the main surface side of the substrate, and has at least one of a light transmission function, a light collecting function, and a light reflecting function. An optical component supporting substrate comprising: an alignment guide member that can be fitted into an alignment recess of the optical component support.   The optical component support substrate according to claim 1, wherein the second recess is a precision processing hole, and the alignment guide member is a guide pin fitted in the precision processing hole.   3. The optical component supporting substrate according to claim 1, wherein the substrate is a low-temperature fired ceramic substrate having a conductor portion made of copper or silver, and the metal filling portion is made of the same metal material as the conductor portion. .   4. An optical element having at least one of a light emitting unit and a light receiving unit and mounted to be optically coupled to the optical component is mounted on a main surface side of the substrate. The optical component support substrate according to any one of the preceding claims. A substrate having a main surface and having a first recess opened at least on the main surface side, and a second recess filled in the first recess and having a smaller diameter than the first recess and opening at least on the main surface side And a metal filling part having the above structure, and being supported by being fitted into the second recess, part of which protrudes on the main surface side of the substrate, and includes a light transmission function, a light collecting function, and a light reflecting function. In an optical component supporting substrate manufacturing method comprising: an alignment guide member that can be fitted into an alignment recess of an optical component having at least one;
A first drilling step of forming the first recess in the substrate by drilling;
A metal filling portion forming step of filling the first recess with metal to form the metal filling portion;
After the metal filling portion forming step, a second drilling step of forming the second recess in the metal filling portion by drilling;
And a guide member attaching step of fitting and supporting the alignment guide member in the second recess. A low-temperature fired ceramic substrate having a main surface, having a first recess that opens at least on the main surface side, and having a conductor made of copper or silver; and filling the first recess, from the first recess Is supported by being fitted in the second recess, and a metal filling portion having a second recess having a small diameter and opening at least on the main surface side, and part of the substrate protrudes on the main surface side of the substrate, In a method of manufacturing an optical component support substrate comprising: an alignment guide member that can be fitted to an alignment recess of an optical component having at least one of a light transmission function, a light collecting function, and a light reflection function.
A first drilling step of forming the first recess in the ceramic green body by drilling;
After the first drilling step, a conductor portion forming step for forming the conductor portion in the ceramic green body,
After the first drilling step, a metal filling portion forming step of filling the first recess with metal to form the metal filling portion;
After the conductor part forming step and the metal filling part forming step, the ceramic unsintered body is sintered to form the low-temperature fired ceramic substrate, and
After the firing step, a second drilling step of forming the second recess by drilling the metal filling portion;
And a guide member mounting step of supporting the alignment guide member in the second recess. A substrate having a main surface and having a first recess opening at least on the main surface side;
An optical component having at least one of a light transmission function, a light collecting function, and a light reflection function, and having an alignment recess;
A metal filling portion having a second recess filled in the first recess and having a smaller diameter than the first recess and opening at least on the main surface side;
An alignment guide member that is supported by being fitted into the second recess, a part of which protrudes on the main surface side of the substrate, and that fits into the alignment recess of the optical component. An optical component supporting substrate with an optical component, comprising: An optical component having a main surface and at least one of a light transmission function, a light condensing function, and a light reflection function, and a positioning concave portion, and a substrate having a first recess opening at least on the main surface side. And a metal filling portion having a second recess filled in the first recess, having a smaller diameter than the first recess and opening at least on the main surface side, and supported by being fitted into the second recess. In the method of manufacturing an optical component supporting substrate with an optical component, a part of the substrate protrudes on the main surface side of the substrate, and an alignment guide member fitted to an alignment recess of the optical component is provided.
A first drilling step of forming the first recess in the substrate by drilling;
A metal filling portion forming step of filling the first recess with metal to form the metal filling portion;
After the metal filling portion forming step, a second drilling step of forming the second recess in the metal filling portion by drilling;
A guide member attaching step of fitting and supporting the alignment guide member in the second recess;
After the guide member attaching step, a support fixing step of supporting and fixing the optical component to the substrate while aligning the optical component by fitting the alignment guide member to the alignment recess. The manufacturing method of the optical component support substrate with an optical component characterized by including these.

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