JP2005098565A - Floor heating system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To evenly transmit the heat to floor plates by preventing local overheating of the floor plates. <P>SOLUTION: This floor heating system is provided with a floor bedding material 40, an elastic base material 29 provided on the floor bedding material 40, an electric heater wire (heating means) 20 attached to a surface of the base material 29 or an electric heater wire (heating means) 20 embedded in the base material, small joists (plate members) 36 provided on the base material 29 and arranged at positions not overlapped with the heater wire 20, and floor plates 31 placed on the small joists 36. The floor plates 31 and the base material 29 comprising the heater wire are formed to be brought in contact with each other, and a heat contraction sheet (separating means) 12 for separating the floor plates 31 from the base material 29 comprising the heater wire when the floor plates 31 are overheated by the heater wire is provided in a surface of the base material 29 or inside thereof. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a floor heating apparatus that heats a space on a floor board by heating the floor board.

As a conventional floor heating apparatus, for example, one having a flexible base material, a heater sheet laminated on the base material, and a small joist laminated on the heater sheet is known. (Patent Document 1). The heater sheet is fixed to one side of a sheet-like material having permeability with the heater wires meandering at intervals, and has a wide interval portion where the intervals between the heater wires are wide. The heater wire is provided so as to be positioned on the substrate side of the sheet-like material, and the small heater having a width dimension smaller than the wide-spaced portion is provided on the opposite side of the sheet-like material on the non-heater wire side. The joists are laminated and integrated.
JP 2003-166720 A

  However, the conventional floor heating apparatus is formed so that the heater wire contacts the floor plate as much as possible in order to efficiently transfer the heat generated by the heater wire to the floor plate. However, when things with good heat insulation, such as cushions or futons, are placed on the floorboard, these things have good heat insulation. Higher than the temperature of.

  When a material with good heat insulation is placed on the floor board, the temperature of the floor board underneath it may become higher than necessary (overheating), and the one with good heat insulation and the floor board underneath will be discolored. Or the floor board portion may dry out, causing cracks, warping, and the like. For this reason, local overheating of the floorboard must be avoided. In order to avoid overheating of the floor board, a heat sensitive wire is provided along the electric heater wire or a plurality of thermostats are provided.

  However, in the case of heat sensitive lines, even if the temperature rises locally (overheating) as a result of placing a good heat retaining material on the floorboard, it cannot be distinguished from the case where the temperature rises as a whole, There is a possibility that a local temperature rise is judged as an overall temperature rise. In addition, the resistance value of the heat sensitive wire increases due to overheating of the floor board under good heat insulation, resulting in a decrease in the current value of the heater circuit as a whole, lowering the temperature of the floor board under good heat insulation and overheating. There was an inconvenience that the temperature was lowered to an appropriate temperature.

  Further, in the case of a thermostat, it is stipulated that one or more thermostats should be provided in a certain area according to electrical technical standards related to an electric heating board, an electric heating sheet, and an electric heating mat. However, when the number of thermostats increases, installation becomes complicated and it is not economical. For this reason, there are a limited number of thermostats. In this case, since the plurality of thermostats are connected in series, when the temperature of the overheated portion of the thermostat is lowered and the temperature is lowered, other portions of the appropriate temperature that is not overheated are also lowered. Furthermore, when a location without a thermostat is overheated, the overheating at this location is not eliminated and the temperature may remain elevated.

  An object of the present invention is to prevent local overheating of the floor board and to transmit heat to the floor board uniformly.

  In order to solve the above-described problems, the present invention provides a floor base material, a base material having elasticity provided on the floor base material, a heat generating means attached to the surface of the base material, or the base material. A heat generating means to be embedded; a plate provided on the base material and disposed at a position not overlapping with the heat generating means; and a floor plate placed on the plate material, the floor plate and the heat generating means When the temperature of the floor board is overheated by the heat generating means, the separating means for separating the floor board and the base material including the heat generating means is formed on the surface or inside of the base material. It is characterized by being provided in.

  By doing so, the floor board and the base material including the heat generating means are formed so as to come into contact with each other. Therefore, the heat generated by the heat generating means is mainly transferred to the floor board by heat conduction. When a floor covering, such as a cushion or futon, is placed on top of the floorboard, and the floorboard underneath these warmth is heated above a certain temperature, the base plate includes the floorboard and heat generation means by the pulling means. Are separated and brought into non-contact, so that the amount of heat transferred from the base material including the heat generating means to the floor board is reduced. Since the amount of heat transferred is reduced, the temperature of the floor board is lowered and overheating is eliminated. Since overheating is eliminated, discoloration of the heat insulating material itself and the floor board can be avoided, and drying, warping, and cracking of the floor board portion under the heat insulating material can be avoided.

  On the other hand, when the temperature of the overheated floor board decreases and falls below a predetermined temperature, the separating means returns to the original state, the floor board and the base material including the heating means come into contact, and the heat generated by the heating means again The floor board is heated mainly by heat conduction. In this way, the temperature of the floor board under the one having good heat retention is controlled.

  In addition, since the base material has elasticity, the base material itself including the heat generating means is pressed against and brought into contact with the floor plate to improve the adhesion between the base material itself and the floor plate, so that heat transfer by heat conduction is improved. Furthermore, since the base material has elasticity, it serves as a cushioning material and protects the heat generating means from damage.

  Furthermore, the plate material is provided on the base material and disposed at a position that does not overlap the heat generating means, so that the plate material does not damage the heat generating means such as deformation and scratches. Furthermore, the distance between the floor board and the floor base material is formed by the plate material and the compressed base material so that an optimum height is formed so that the heating means and the base material that presses the floor board are positioned. Demonstrate the function.

  Further, it is preferable to provide a heat dispersion means for dispersing the heat generated by the heat generation means and transferring the heat uniformly to the floor board between the base member including the heat generation means and the separating means. By providing the heat dispersion means, local overheating of the floorboard is prevented. Moreover, the floor heating apparatus of the present invention is further preferable by using a thermostat in combination with the configuration of the above-described invention, and prevents local overheating of the floor board and transmits heat to the floor board uniformly.

  Next, each requirement constituting the present invention will be described in more detail. The floor heating apparatus of the present invention heats a floor board using energy such as electricity, gas, solar heat or oil, and heats the upper space of the floor board.

  The separating means is not particularly limited as long as it separates the floor board and the base material including the heat generating means when the floor board is overheated to form a gap or a space between the floor board and the base material. For example, a heat-shrinkable sheet that extends due to overheating of the floor plate and separates the base material from the floor plate, a shape memory material such as a sheet shape, a strip shape, a flat plate shape, a wire shape, a coil spring shape, a bimetal or a cushion material. The position where the separating means is provided is not particularly limited, but is provided on the surface of the base material, the inside of the base material, the back surface of the base material, or the like.

  The heat generating means generates heat using energy such as electricity, gas, solar heat or petroleum, and is not particularly limited, but it is convenient to use an electric heater wire. The heat generating means may be provided in a meandering manner on the surface of the substrate or inside the substrate. The heat generating means itself is, for example, an electric heater wire, a hot water pipe, a hot refrigerant pipe, or the like. A heat sensitive wire (sensor wire) may be provided near the heat generating means. By providing a heat sensitive wire, the temperature of the floor board is controlled and overheating is prevented.

  The heat dispersion means is not particularly limited as long as it has flexibility and good thermal conductivity. However, the heat dispersion means may have a sheet shape, a plate shape, a net shape, a lattice shape, or the like, for example, flexible between two sheets. It may be a three-layer laminated sheet stuck with a metal thin plate or metal foil having heat conductivity and heat conductivity. The laminated sheet is preferably provided in contact with the surface of the base material including the heating means. Further, the two sheets forming the laminated sheet are preferably formed of a nonwoven fabric such as spunbond, a net, paper, and the like and provided with heat resistance to some extent. The laminated sheet is formed by preparing two of the above-mentioned sheets, sandwiching a copper foil or aluminum foil having thermal conductivity and flexibility between the two sheets, and bonding them with an adhesive.

  For example, vinyl acetate, vinyl acetate / acrylic, ethylene / vinyl acetate can be used as an adhesive to bond heat-generating means and heat-dispersing means to a base material, or to bond two sheets and foil in a laminated sheet. Use acrylic, ethylene, urethane, etc.

  The base material is a non-woven fabric, a net-like sheet, paper, a perforated sheet, etc., having a certain thickness and elasticity, and a meandering circuit of heat generating means is provided on the surface or inside thereof.

  The floor board is disposed on the board material so that the seam of the floor board is located, and is fixed to the floor base material via the heat dispersion means and the base material. As the material of the floor board, for example, a plywood board, a wood fiber board (MDF, etc.), a wood chipboard board, a single board laminated board or the like, or a soft or hard synthetic resin board can be used. The thickness is selected from, for example, 6 to 20 mm, and is provided so that the seam is positioned on the plate material when stretched on the floor base material.

  The floor base material supports the load applied to the floor board via the board material, but the material is made of wood such as plywood, wood board, wood fiber board (MDF, etc.), wood chipboard, single board laminated board, etc. can do. The thickness of the floor base material is selected from a range of 9 to 30 mm, for example, and is preferably thicker than the floor board.

  It is preferable to provide a heat insulating material such as polystyrene foam under the floor base material. By providing a heat insulating material, the amount of heat released from the floor of the heat energy generated by the heat generating means is reduced and the heating efficiency is improved.

  The plate material is fixed on the base material or the heat dispersion means at a position that does not overlap the heat generation means, but the shape thereof is not particularly limited. As the plate material, an elongated or strip-shaped plate is generally used. The material of the board is wood, such as plywood, wood board, wood fiber board (MDF, etc.), wood-cut piece board, single board laminated board, etc., synthetic resin series, metal board such as iron, copper, aluminum alloy, etc. It can also be used with materials.

  Further, by providing the plate material on the heat dispersion means, the position where the plate material is fixed with a nail or a wood screw can be clearly understood, and the heating means is not damaged by the nail or the wood screw. Furthermore, since the seam of the floor board is stretched so as to be positioned on the board material, the seam portion of the floor board is not deformed such as bending or jumping up, and a floor surface without unevenness can be provided.

  ADVANTAGE OF THE INVENTION According to this invention, the local overheating of a floor board can be prevented and heat can be uniformly transmitted to a floor board.

    Hereinafter, an embodiment of a floor heating apparatus according to the present invention will be described in detail with reference to the drawings. 1 to 10, the same or equivalent parts are denoted by the same reference numerals.

  FIG. 4 is a perspective view of the floor heating apparatus of the first embodiment. The floor heating apparatus 1 of the present invention heats a floor board using electric energy and heats the upper space of the floor board. That is, the floor heating apparatus 1 includes a floor plate 31 and a heater mat 3 that heats the floor plate 31 using electric energy. The heater mat 3 is provided with a connection box 9 and is connected to the controller 5 via a first cable 6, a second cable 7 and an intermediate connector 8 connecting these two cables. The controller 5 controls the temperature of the heater mat 3. A power cord 4 is connected to the controller 5. The power cord 4 is provided with a plug 10.

  The power cord 4 and the plug 10 may be used while being connected to the controller 5 as they are. However, the power cord 4 and the plug 10 are temporarily used for a current test of the heater mat 3 and the power test is performed. When the operation is completed, the power cord 4 and the plug 10 may be removed, and the controller 5 and the power source may be fully connected.

  As the material of the floor board 31, for example, a plywood, a wood fiber board (MDF or the like), a wood chip board, a single board laminated board or the like, or a soft or hard synthetic resin board is used. In the case of a wooden system, the surface of the floorboard is generally a decorative surface. The thickness of the floor board 31 is selected, for example, 9 mm. The floor board 31 is arranged so that the joint 30 is positioned on the small joist (sheet material) 36. Further, on the heater mat 3, a plurality of small joists (plate members) 36 are arranged and fixed in a staggered manner in parallel with each other at an appropriate interval.

  FIG. 1 is a cross-sectional view of an essential part showing a first embodiment of the floor heating apparatus according to the present invention, and shows a cross section taken along line AA in FIG. The floor heating apparatus 1 is disposed on a floor base material 40, a heater mat 3 provided on the floor base material 40, and provided on the heater mat 3 so as not to overlap the heater wire 20 and the heat sensitive wire 22. And a floor board 31 placed on the small radish 36.

  The heater mat 3 is provided on the floor base material 40 and is provided so as to be substantially in surface contact with the floor board 31. The heater mat 3 includes a base material 29 having elasticity, an electric heater wire 20 attached to the surface of the base material 29 or an electric heater wire 20 embedded in the base material 29, and a surface of the base material 29. And a laminated sheet (heat dispersion means) 24 for dispersing the heat generated by the heater wire 20. The heater wire 20 is provided in a meandering manner on the surface or inside of the base material 29 and is disposed so as not to overlap the small joists 36.

  Further, the heater mat 3 has a heat shrinkable sheet (detaching means) 12 provided on the surface of the laminated sheet 24. When the floor board 31 is heated more than necessary by the heater wire 20 (referred to as “overheating”), the heat shrinkable sheet 12 pulls the floor board 31 and the base material 29 including the heater wire 20 apart from each other. An air layer space is formed between the mat 3 and the mat 3. Therefore, the base material, the heater wire, the laminated sheet 24 and the heat shrinkable sheet 12 are formed so as to be in close contact with each other, and the heater mat 3 itself is formed so as to be in close contact with the floor plate 31. The base material 29 is formed of a nonwoven fabric and has elasticity. Reference numeral 22 denotes a heat sensitive wire.

  The floor base material 40 supports the load applied to the floor board 31 through the small joists 36 and the heater mat 3. As the material of the floor base material 40, for example, a wood system such as a plywood, a wood board, a wood fiber board (MDF or the like) is used. As the thickness of the floor base material 40, for example, a thickness of 15 mm is used. Further, a heat insulating material such as polystyrene foam may be provided between the joists that support the floor base material.

  The small radish 36 has an elongated shape or a strip shape. As the material of the small joist 36, a wood system such as a plywood, a wood board, a wood fiber board (MDF, etc.), a wood chipboard, and a single board laminated board can be used. Further, the small joists 36 are arranged so as not to overlap the heater wires 20 and the heat sensitive wires 22, and are fixed to the floor base material 40 with wood screws (screws) 38 through the heat shrinkable sheet 12, the laminated sheet 24 and the base material 29. The In this case, since the base material 29 has elasticity, the base material 29 located under the small joists 36 is compressed, and the heater mat 3 between the small joists 36 is in surface contact with the floor board 31. Formed. A male fruit 33 and a female fruit 34 are formed at the joint 32 position of the floor board 31. The floor board 31 is fixed to the floor base material 40 with nails 37 through the small joists 36 and the heater mat 3.

  FIG. 2 is a plan view showing the arrangement of the heater wires 20 and the heat sensitive wires 22 of the heater mat 3 in the first embodiment. Although the heater mat 3 of the Example shown here is what abutted the heater mats 3a and 3b of the opposite right and left sides, it is not limited to this. The heater wire 20 is provided in a meandering manner on the surface of the substrate 29 or inside thereof. Further, a heat sensitive wire (sensor wire) 22 is provided along the heater wire 20 in the vicinity thereof. Further, as described above, the small joist 36 is disposed outside the heater wire 20 so as not to overlap the heater wire 20 and the heat sensitive wire 22.

  FIG. 3 is an enlarged cross-sectional view of a laminated sheet used for the heater mat 3 in the first embodiment. In the laminated sheet 24, an aluminum foil (thin plate) 25 having thermal conductivity and flexibility is sandwiched between two sheets 26 and 27 formed of a nonwoven fabric such as spunbond, and adhered with an adhesive. Examples of the adhesive (synthetic resin) for attaching the aluminum foil 25 between the two sheets 26 and 27 include vinyl acetate, vinyl acetate / acrylic, ethylene / vinyl acetate, acrylic / ethylene, urethane, and the like. It is.

  The floor heating apparatus 1 according to the first embodiment having the above structure operates as follows. That is, in FIG. 1, the floor plate 31 and the heater mat 3 are formed so as to be in surface contact with each other, so that the heat generated in the heater wire 20 is transferred to the floor plate 31 mainly by heat conduction. When the heat generated in the heater wire 20 is transferred to the floor board 31, the temperature of the floor board 31 rises, so that the space on the floor board is heated.

  FIG. 5 is a cross-sectional view of a main part in a state in which the heat shrinkable sheet 12 is heat shrunk in the floor heating apparatus of the first embodiment. When a floor covering 31 is placed on a floor board 31 having a good heat retaining property such as a cushion or a futon, and the floor board 31 under the warm insulating material 43 is heated above a certain temperature, the heat shrinkable sheet 12 is heated by heat. The floor plate 31 and the heater mat 3 are pulled apart by contraction and deformation. Since the floor plate 31 and the heater mat 3 are separated from each other, a gap (space) 44 is formed between them so that they are not in contact with each other.

  When the floor plate 31 and the heater mat 3 are separated from each other, a gap or space is formed between the floor plate 31 and the heater mat 3, so that the amount of heat transferred from the heater mat 3 side to the floor plate 31 by heat conduction is almost eliminated. Since there is almost no heat transfer due to heat conduction, the temperature of the floor plate 31 under the heat retaining material 43 is lowered and overheating is eliminated. Since overheating is eliminated, discoloration of the well-preserving material 43 and the floor plate 31 thereunder is avoided, and drying, cracking, warping, etc. of the portion of the floor plate 31 do not occur.

  On the contrary, when the temperature of the overheated floor board 31 falls and becomes lower than a predetermined temperature, the heat shrinkable sheet 12 returns to the state before the heat shrinkage, and the floor board 31 and the heater mat 3 come into contact with each other. When the floor plate 31 and the heater mat 3 come into contact with each other, heat is transferred again by heat conduction, so that the temperature of the floor plate rises. In this way, the temperature of the floor board on which the heat retaining material 43 is placed is controlled to be constant.

  Further, since the heater mat 3 (or the base material 29) has elasticity, the heater mat 3 itself contacts the floor plate, the floor plate 31 and the heater mat 3 are in close contact with each other, and heat transfer by heat conduction is improved. Furthermore, since the heater mat 3 has elasticity, it functions as a buffer material and protects the heater wire 20 and the heat sensitive wire 22 from damage.

  Further, as shown in FIGS. 1 and 5, the small joists 36 are arranged on the heater mat 3 so as not to overlap with the heater wire 20 and the heat sensitive wire 22, so that the floor board 31 and the floor base material 40 are arranged. In between, the small joist 36 and the compressed heater mat 3 cause the heater mat 3 to press the floor plate 31, and when the floor plate 31 overheats, the heat shrinkable sheet 12 contracts so that a gap 44 is generated. Height is formed.

  Moreover, the floor board 31 is heated uniformly by providing the laminated sheet 12. Furthermore, by providing a heat insulating material on the lower side of the floor base material 40, the amount of heat released from the floor of the heat energy generated in the heater wire 20 is reduced, and the heating efficiency is improved.

  Further, since the small joist 36 is provided on the heater mat 3, it can be confirmed when the floor board 31 is stretched, and the position where the small joist 36 is fixed when it is fixed with a nail, a wood screw or the like is clearly known, and The nail or the wood screw does not damage the heater wire 20 or the heat sensitive wire 22. Further, since the floor plate seam 32 is stretched so as to be positioned on the small joist 36, the seam portion of the floor plate 31 is not deformed such as bending or jumping up, and a floor surface without unevenness is provided. Can do.

  FIG. 6 is a cross-sectional view of an essential part showing a second embodiment of the floor heating apparatus according to the present invention. The floor heating apparatus 1 of the second embodiment is a case where a shape memory sheet (separating means) 14 is used instead of the heat shrinkable sheet 12 in the floor heating apparatus of the first embodiment shown in FIGS. The shape memory sheet 14 is bent into a bellows shape by heat when the floor plate 31 is overheated beyond a certain temperature. In the second embodiment, the bending direction is bent along the longitudinal direction of the small joist 36 as shown in the figure, but the present invention is not limited to this, and the bending may be performed in a direction perpendicular to the longitudinal direction of the small joist 36.

  When the shape memory sheet 14 is bent and the floor plate 31 and the heater mat 3 are separated from each other, and the gap or space 44 between the floor plate 31 and the heater mat 3 becomes large, the heat generated in the heater wire 20 is transferred to the floor plate 31. Since it becomes difficult to do, the temperature of the floor board 31 falls and overheating is eliminated. On the other hand, when the temperature of the overheated floor board 31 decreases and falls below a predetermined temperature, the shape memory sheet 14 returns to its original state, the contact area between the floor board 31 and the heater mat 3 increases, and the amount of heat transfer due to heat conduction. Will increase. When the amount of heat transfer increases, the temperature of the floor board 31 rises, so that the temperature of the floor board 31 is controlled to be constant.

  By using the shape memory sheet 14, the floor plate 31 and the heater mat 3 can be relatively separated from each other, and the bent vertex of the heater mat 3 is in contact with the floor plate 31, so that part of the heat is transmitted. By doing so, it is possible to prevent the temperature of the floor board from being lowered excessively and to stabilize the temperature control of the floor board 31. The other structures and operations in the second embodiment shown in FIG. 6 are the same as those in the first embodiment shown in FIGS.

  FIG. 7 is a cross-sectional view of an essential part showing a third embodiment of the floor heating apparatus according to the present invention. FIG. 8 is a cross-sectional view of a main part in a state where the bimetal 16 is deformed in the floor heating apparatus of the third embodiment. The floor heating apparatus 1 according to the third embodiment is a case where a bimetal (separating means) 16 is used on a laminated sheet 24. The shape of the bimetal 16 is not limited to the plate shape shown in FIG. 7, but may be an appropriate shape such as a belt shape, a wire shape, a coil spring shape, or a column shape. The direction in which the bimetal 16 is placed is a direction along the longitudinal direction of the small joists 36 or a direction perpendicular thereto, and the position and number of the bimetal 16 are appropriate positions and numbers where the temperature of the floor board 31 is stabilized.

  As shown in FIG. 8, the bimetal 16 pulls the floor plate 31 and the heater mat 3 apart when the floor plate 31 is overheated beyond a certain temperature and its shape deforms into a concave shape on the upper surface due to heat. A gap or space 44 is formed between the floor plate 31 and the heater mat 3. Since a gap or space 44 is formed between the floor plate 31 and the heater mat 3, the heat generated in the heater wire 20 is not easily transmitted to the floor plate 31. Therefore, the temperature of the floor board 31 falls and overheating is eliminated. On the other hand, when the temperature of the overheated floor board 31 falls below a predetermined temperature, the bimetal 16 returns to its original shape as shown in FIG. 7, so that the contact area between the floor board 31 and the heater mat 3 increases. The amount of heat due to heat conduction from the heater mat 3 side to the floor plate 31 side increases, and the temperature of the floor plate 31 rises. In this way, the temperature of the floor board 31 is controlled to be constant.

  By setting the plate thickness of the bimetal 16 to an appropriate size, the force for separating the floor plate 31 and the heater mat 3 can be increased. Therefore, the bimetal 16 and the heater can be separated even if the heater mat 3 is relatively hard. Since a part of the mat 3 is in contact with the floor board 31, a part of heat can be transmitted, and the temperature control of the floor board 31 is also stabilized. The other structures and operations in the third embodiment shown in FIGS. 7 and 8 are the same as those in the first embodiment shown in FIGS.

  FIG. 9 is a cross-sectional view of an essential part showing a fourth embodiment of the floor heating apparatus according to the present invention. FIG. 10 is a cross-sectional view of a main part in a state where the cushion material 18 is contracted in the floor heating apparatus of the fourth embodiment. The floor heating apparatus 1 of the fourth embodiment is a case where a plate-shaped cushion material (detaching means) 18 is embedded below the base material 29. The shape of the cushion material 18 is a plate shape, and the position and the number of the cushion material 18 are appropriate as the temperature of the floor plate 31 is stabilized.

  As shown in FIG. 10, when the floor board 31 overheats over a certain temperature, the cushion material 18 contracts at least in the thickness direction due to heat. When the cushion material 18 contracts, the thickness of the heater mat 3 decreases, so that the heater mat 3 is separated from the floor plate 31, and a gap or space is formed between the floor plate 31 and the heater mat 3. If a gap or space 44 is formed between the floor plate 31 and the heater mat 3, the heat generated in the heater wire 20 becomes difficult to be transmitted to the floor plate 31 due to heat conduction, so the temperature of the floor plate 31 is lowered and overheating is eliminated.

  On the other hand, when the temperature of the overheated floor board 31 falls below a predetermined temperature, the cushion material 18 expands and its thickness increases and returns to the original state as shown in FIG. , The amount of heat due to heat conduction from the heater mat 3 side to the floor plate 31 side increases, and the temperature of the floor plate 31 rises. In this way, the temperature of the floor board 31 is controlled to be constant.

  By using the cushion material 18, a large area of the heater mat 3 can be separated from the floor plate 31, so that the effect of reducing heat transfer is large even in a relatively small separation gap or space 44. The other structures and operations in the fourth embodiment shown in FIGS. 9 and 10 are the same as those in the first embodiment shown in FIGS.

  The present invention has been described in detail with reference to the illustrated embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made without departing from the spirit of the present invention. It goes without saying that various modifications can be made.

  The floor heating apparatus of the present invention can be used for heating a room of an apartment house or an individual house, or for a business room such as an office, a barber shop, or a beauty salon.

It is principal part sectional drawing which shows 1st Example of the floor heating apparatus which concerns on this invention. It is a top view which shows arrangement | positioning of the heater wire and heat sensitive wire of the heater mat in 1st Example. It is an expanded sectional view of the lamination sheet used for the heater mat in the 1st example. It is a perspective view of the floor heating apparatus of the 1st example. It is principal part sectional drawing of the state which the heat-shrink sheet shrunk in the floor heating apparatus of 1st Example. It is principal part sectional drawing which shows 2nd Example of the floor heating apparatus which concerns on this invention. It is principal part sectional drawing which shows 3rd Example of the floor heating apparatus which concerns on this invention. It is principal part sectional drawing of the state in which the bimetal deform | transformed in the floor heating apparatus of 3rd Example. It is principal part sectional drawing which shows 4th Example of the floor heating apparatus which concerns on this invention. It is principal part sectional drawing of the state which the cushion material contracted in the floor heating apparatus of 4th Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Floor heating apparatus 3, 3a, 3b Heater mat 12 Heat-shrink sheet (detaching means)
14 Shape memory sheet (detaching means)
16 Bimetal (detaching means)
18 Cushion material (detaching means)
20 Heater wire (heating means)
22 heat sensitive wire 24 laminated sheet (heat dispersion means)
29 Base material 31 Floor board 36 Kokoneta (board material)
40 Floor material 44 Clearance or space

Claims (1)

  A floor base material, an elastic base material provided on the floor base material, a heat generating means attached to the surface of the base material or a heat generating means embedded in the base material, And a floor plate placed on the plate material, the floor plate and the base material including the heat generating means are formed so as to come into contact with each other. A floor heating apparatus in which a separating means for separating the floor board and the base material including the heat generating means is provided on the surface or inside of the base material when the temperature of the floor board is overheated by the heat generating means.

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