JP2005097704A - 摺動部材 - Google Patents
摺動部材 Download PDFInfo
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- JP2005097704A JP2005097704A JP2003335452A JP2003335452A JP2005097704A JP 2005097704 A JP2005097704 A JP 2005097704A JP 2003335452 A JP2003335452 A JP 2003335452A JP 2003335452 A JP2003335452 A JP 2003335452A JP 2005097704 A JP2005097704 A JP 2005097704A
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- surface layer
- layer
- lining layer
- alloy
- sliding
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- Sliding-Contact Bearings (AREA)
- Powder Metallurgy (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
【解決手段】 摺動部材1は,金属製基板2と,その基板2上に設けられた金属製ライニング層3と,そのライニング層3上に電気メッキ法により形成されて,相手部材4との摺動面5を持つ金属製表面層6とを備えている。ライニング層3はCu,Al,Cu合金およびAl合金から選択される一種よりなる。表面層6はSnよりなり,且つライニング層3から成長した複数の柱状晶7を有する。
【選択図】 図2
Description
厚さ2.5mmの冷間圧延鋼板(JIS SPCC)およびCu−6wt%Sn合金粉末を用意し,次のような方法で,基板2とライニング層3とよりなる,断面半円弧状をなす2つの積層体を得た。即ち,冷間圧延鋼板上にCu−6wt%Sn合金よりなる多孔質焼結層を形成する工程と,多孔質焼結層に圧延加工を施して真密度化する工程と,切断加工を行って,冷間圧延鋼板よりなる基板2と高密度焼結体よりなるライニング層3とを備えた2つの素材を得る工程と,各素材に冷間にて曲げ加工を施す工程とを行った。
2………基板
3………ライニング層
4………相手部材
5………摺動面
6………表面層
7………柱状晶
Claims (1)
- 金属製基板(2)と,その基板(2)上に設けられた金属製ライニング層(3)と,そのライニング層(3)上に電気メッキ法により形成されて,相手部材(4)との摺動面(5)を持つ金属製表面層(6)とを備え,前記ライニング層(3)はCu,Al,Cu合金およびAl合金から選択される一種よりなり,前記表面層(6)はSnよりなり,且つ前記ライニング層(3)から成長した複数の柱状晶(7)を有することを特徴とする摺動部材。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003335452A JP4104517B2 (ja) | 2003-09-26 | 2003-09-26 | 摺動部材 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2003335452A JP4104517B2 (ja) | 2003-09-26 | 2003-09-26 | 摺動部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005097704A true JP2005097704A (ja) | 2005-04-14 |
JP4104517B2 JP4104517B2 (ja) | 2008-06-18 |
Family
ID=34462827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003335452A Expired - Fee Related JP4104517B2 (ja) | 2003-09-26 | 2003-09-26 | 摺動部材 |
Country Status (1)
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JP (1) | JP4104517B2 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7629058B2 (en) * | 2005-03-25 | 2009-12-08 | Daiso Metal Company, Ltd. | Sliding member |
WO2011102059A1 (ja) * | 2010-02-19 | 2011-08-25 | 住友電気工業株式会社 | 金属積層構造体および金属積層構造体の製造方法 |
JP2013249533A (ja) * | 2012-06-01 | 2013-12-12 | Sulzer Metco Ag | 亜鉛不含噴霧粉末、銅含有溶射層、および銅含有溶射層を製造する方法 |
US9199433B2 (en) | 2009-06-30 | 2015-12-01 | Sumitomo Electric Industries, Ltd. | Metal laminated structure and method for producing the metal laminated structure |
WO2015186621A1 (ja) * | 2014-06-02 | 2015-12-10 | 大豊工業株式会社 | 摺動部材およびすべり軸受 |
US20170350031A1 (en) * | 2016-06-02 | 2017-12-07 | Mahle International Gmbh | Sliding component and method |
-
2003
- 2003-09-26 JP JP2003335452A patent/JP4104517B2/ja not_active Expired - Fee Related
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7629058B2 (en) * | 2005-03-25 | 2009-12-08 | Daiso Metal Company, Ltd. | Sliding member |
US9199433B2 (en) | 2009-06-30 | 2015-12-01 | Sumitomo Electric Industries, Ltd. | Metal laminated structure and method for producing the metal laminated structure |
WO2011102059A1 (ja) * | 2010-02-19 | 2011-08-25 | 住友電気工業株式会社 | 金属積層構造体および金属積層構造体の製造方法 |
JP2011171564A (ja) * | 2010-02-19 | 2011-09-01 | Sumitomo Electric Ind Ltd | 金属積層構造体および金属積層構造体の製造方法 |
US8993121B2 (en) | 2010-02-19 | 2015-03-31 | Sumitomo Electric Industries, Ltd. | Metal laminated structure and method for producing the same |
JP2013249533A (ja) * | 2012-06-01 | 2013-12-12 | Sulzer Metco Ag | 亜鉛不含噴霧粉末、銅含有溶射層、および銅含有溶射層を製造する方法 |
JP2013249536A (ja) * | 2012-06-01 | 2013-12-12 | Sulzer Metco Ag | 軸受部品及び溶射法 |
US9885382B2 (en) | 2012-06-01 | 2018-02-06 | Oerlikon Metco Ag, Wohlen | Zinc-free spray powder, copper-containing thermal spray layer, as well as method of manufacturing a copper-containing thermal spray layer |
WO2015186621A1 (ja) * | 2014-06-02 | 2015-12-10 | 大豊工業株式会社 | 摺動部材およびすべり軸受 |
US20170350031A1 (en) * | 2016-06-02 | 2017-12-07 | Mahle International Gmbh | Sliding component and method |
EP3252191B1 (en) * | 2016-06-02 | 2020-05-06 | Mahle International GmbH | Sliding component and method |
Also Published As
Publication number | Publication date |
---|---|
JP4104517B2 (ja) | 2008-06-18 |
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