JP2005096025A - Base for rotary saw, and rotary saw using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a base of slit shape and a rotary saw capable of preventing the deviation of the base and effectively performing a noise preventing function while minimizing a lowering of strength of the base having a diameter of 200 mm or more and provided with slits to have the noise preventing function. <P>SOLUTION: A stress applying layer is formed at the radial center part of the base continuously or intermittently in a circumferential direction, and slits are provided on the outer peripheral side of the stress applying layer. The slits are formed of first slits and second slits each formed of a zigzag kerf with the swing width longer than the groove spacing from the outer peripheral side toward the inner peripheral side and having an elongate tongue piece formed by the zigzag kerf. The second slit is provided on the inner peripheral side of the first slit, and the kerf on the outermost peripheral side of the second slit is formed at the tongue piece on the innermost peripheral side of the first slit. The noise preventing effect is thereby enhanced even if the size of the slits is small. These slits are filled with a resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a rotary saw substrate for processing metal materials, wood-based materials, and the like, and a rotary saw using the substrate, and can effectively suppress vibration, vibration and noise of the substrate being cut. In addition, the present invention relates to a substrate that is hard to be deformed and highly durable and a rotary saw.

  Conventionally, a rotary saw in which a chip such as a polycrystalline diamond sintered body is provided on the periphery of a disk-shaped substrate is used for cutting a metal material or a wood-based material. When cutting with this rotary saw, noise is generated mainly due to the vibration of the substrate, and depending on the situation, there is a problem that a crack occurs from the bottom of the blade between the chips provided on the outer periphery of the substrate, causing the substrate to break. For this reason, it is desired to suppress the vibration of the substrate in order to improve the working environment and safety. Further, for the purpose of improving the yield of cutting material and reducing the amount of chips discharged, the thickness of the rotary saw is decreasing, and the thickness of the substrate is decreasing accordingly.

As what can suppress the vibration of the board | substrate currently performed conventionally, there exists what formed the slit and formed the slit in the board | substrate, for example, as shown in FIG. A long and narrow tongue is formed by providing zigzag kerfs whose swinging width is longer than the groove interval, and the tongue is adjacent to the tip of the tongue as shown in FIG. Some have contact portions 2c so as to be in partial surface contact with one base (see, for example, Patent Document 1).
In order to enhance the effect of suppressing vibration, the slits are made as long as possible by increasing the length of the kerfs, increasing the area of the slits, or increasing the number of slits.
Japanese Patent Laid-Open No. 63-1501

  In Patent Document 1, the contact of the tongue piece is partially made into weak surface contact, and the vibration energy is suppressed and attenuated by friction of this portion, and it is restored even if a large deviation occurs in the substrate. is there. This has the effect of effectively preventing noise due to weak surface contact, but in order to form this weak surface contact, the tongue piece is deformed by using the high heat of the high energy beam when forming the kerf. Therefore, advanced technology is required to control the surface contact state and always form a slit with a high noise prevention effect.

  On the other hand, when the diameter of the substrate is increased or the thickness is reduced, there is a problem that the substrate is likely to be shaken as it is used. In particular, in a dry cutting without using a cutting fluid in a saw using a substrate having a diameter of 200 mm or more, heat generated at the cutting edge portion is transferred to the substrate and expands, which is promoted. In order to improve the rigidity of the substrate, it is conceivable to use Mo, W, or cemented carbide as the substrate material. However, as the diameter becomes particularly large, the processing is not easy and the cost is very high. The substrate is used. In the case of a steel substrate, in order to prevent the problem of the above-described deflection, it is necessary to adjust the tension (set up) by forming a stress applying layer near the center of the radius of the substrate. The tension adjustment of the substrate means that the inner peripheral side of the substrate is extended with a rolling roll or hit with a hammer to give a stress in the direction of expanding the inner peripheral side, and this force causes a tensile stress in the peripheral direction on the outer peripheral portion. Is to grant. By doing in this way, the outer peripheral side provided with the cutting edge chip | tip will be pulled, and the shake | fluctuation at the time of a cutting | disconnection is suppressed. In order to increase the effect of suppressing vibrations in a substrate with such tension adjustment, if you try to increase the outer dimension of the slit, part of the slit will reach near the center of the radius of the substrate, maintaining the tension. It will not be done. For this reason, there arises a problem that even if the vibration of the substrate can be suppressed, the vibration cannot be suppressed.

  In view of the above, the present invention proposes a rotating saw substrate and a rotating saw that can effectively suppress vibrations even if the slits are made small, can adjust the tension, and can suppress the deflection of the substrate.

The rotary saw substrate of the present invention is a rotary saw substrate having a diameter of 200 mm or more in which a plurality of slits are provided in a disk-shaped substrate,
In the central portion of the substrate radius of the substrate, a stress applying layer is formed continuously or intermittently in the circumferential direction,
The slit is a combination of the first slit and the second slit provided on the outer peripheral side of the stress applying layer of the substrate,
The first slit and the second slit are formed by zigzag kerfs whose swing width is longer than the groove interval from the outer peripheral side to the inner peripheral side of the substrate, and are formed by the zigzag kerfs. With an elongated tongue
The second slit is provided on the inner circumferential side of the first slit, and a kerf on the outermost circumferential side of the second slit is formed on a tongue on the innermost circumferential side of the first slit, The first slit and the second slit are filled with resin.

  Preferably, the center axis of the swing width of the zigzag kerf coincides with the radial direction of the substrate or is within 45 ° with respect to the radial direction of the central portion of the slit.

  Preferably, a pair of slits combining the first slit and the second slit are formed at equal intervals in the circumferential direction of the base metal.

  The rotary saw of the present invention is characterized in that a cutting edge chip made of a hard material is joined to the outer periphery of the substrate. Examples of the hard material include cemented carbide, polycrystalline diamond, single crystal diamond, or CBN sintered body.

  The rotary saw substrate and rotary saw of the present invention can effectively suppress vibration and noise of the substrate even if the size of the entire slit is small. Further, since the area of the entire slit can be reduced, the slit can be formed on the outer peripheral side from the central portion of the substrate radius, and a stress applying layer can be provided in the vicinity of the central portion of the substrate radius. Therefore, tension can be adjusted, so that vibration during cutting can be suppressed and deformation of the substrate can also be prevented.

  Examples of the rotary saw substrate of the present invention are shown in FIGS. The substrate 1 is made of a thin disk-shaped base metal, and a blade base 5 for joining cutting edge chips is provided on the outer periphery. A blade bottom 6 is formed between the blades 5 so that heat is not diffused to the adjacent blades 5 when the chip is brazed to the blades 5. In the vicinity of the central portion of the substrate radius of the substrate 1, a pressure layer 8 (stress applying layer) is provided continuously or intermittently in the circumferential direction. A rolling roll may be used to form this layer continuously. On the other hand, a method of hitting with a hammer may be used to form an intermittent shape. A portion that is pressed by a rolling roll or a hammer is locally formed into a work-hardened layer, and the thickness of the pressure layer 8 is slightly thinner than the other portions. Since the portion of the pressure layer 8 extends, the circumferential length is slightly increased. As a result, the outer peripheral side of the substrate 1 is stretched, and even if the outer peripheral side of the substrate 1 slightly expands due to heat generated during cutting, vibration is suppressed.

  A plurality of pairs of slits 2 that are a combination of the first slits 2 a and the second slits 2 b are provided on the outer peripheral side of the pressure layer 8 of the substrate 1, and are provided at equal intervals in the circumferential direction of the substrate 1. . An enlarged view of the slit 2 is shown in FIG. These slits 2 are formed by zigzag kerfs whose swing width w is longer than the kerf interval h, and are formed in a zigzag shape from the outer peripheral side to the inner peripheral side of the substrate 1. By forming a zigzag groove, elongated tongues 3 are formed between the grooves.

  The tongue 3 on the innermost circumferential side of the first slit 2a is formed with a kerf on the outermost circumferential side of the second slit 2b. By doing so, the first slit 2a and the second slit 2b are overlapped so as to mesh with each other, and the sum of the shear strain amount is increased and vibration can be attenuated over a wide range of frequencies. The effect of suppressing the complex vibration that sometimes occurs is born.

  The center axis p of the swing width w of the zigzag kerf formed by the pair of slits 2 coincides with the radial direction of the substrate 1 as shown in FIG. 1, or passes through the central part o of the slit 2 as shown in FIG. The slit 2 is formed so as to be within 45 ° with respect to the radius line r. By doing so, vibration generated in the chip portion and transmitted toward the center of the substrate 1 can be effectively attenuated by the slit 2.

  In the substrate of the present invention, since the stress applying layer is provided in the vicinity of the central portion of the substrate radius, the slit 2 must be provided on the outer peripheral side, and the length l of the slit 2 is subject to size restrictions. become. For example, when the central axis p coincides with the radial direction of the substrate 1, the length l can only be a maximum of about ½ of the radius of the substrate 1, but the size of the slit (swing width w X length l) may be increased as much as possible.

The first slit 2a and the second slit 2b are filled with resin. By filling the resin, the tongue piece 3 and the resin are brought into a surface contact state, and vibration energy generated in the vicinity of the slit 2 is converted into heat energy and attenuated. This resin is preferably a thermosetting resin made of any one of phenol, polyimide, epoxy, or silicon. This is low-cost and easy to work, and by using these thermosetting resins, the deterioration and peeling of the resin due to heat is prevented and the damping effect is sustained. This is to facilitate filling. In addition, diamond, CBN, SiC, alumina, SiO ₂ or the like can be used as an auxiliary agent in the resin, but it is preferable to contain any one or more of SiC, alumina, and SiO ₂ . Thereby, distortion energy can be efficiently converted into thermal energy at a relatively low cost to enhance the vibration damping effect. Further, it can be used by filling rubber or the like in addition to the resin.

  A cutting edge chip made of cemented carbide, polycrystalline diamond, single crystal diamond, CBN sintered body or the like can be joined to the outer periphery of the rotating saw substrate as described above to provide a rotating saw with a high noise prevention effect. The material of the substrate is not particularly limited, but this is the case for steel substrates that are prone to shake, particularly for substrates that need to be stressed by providing a stress-imparting layer, such as those with a large diameter or thin thickness. The invention works effectively.

  As Example 1, the present invention and a conventional rotary saw were manufactured and analyzed by CAE in order to compare the amount of shear strain due to the difference in slit shape. As a common specification of the test products, a substrate 1 made of SKS5 was used, a blade 5 and a blade bottom 6 having a predetermined shape were formed on the outer peripheral portion, and an outer peripheral slit 4 and a slit 2 were formed by a laser beam. The outer peripheral slit 4 was formed so as to go from the blade bottom 6 toward the center of the substrate 1, and the width of the kerf was 0.1 to 0.3 mm and the length was 5 mm, and four were formed at equal intervals. The slit 2 was filled with an epoxy resin mixed with SiC abrasive grains. Table 1 shows the specifications that differ for each test product. Test samples 1 to 4 are rotary saw substrates of the present invention, and test samples 5 and 6 are conventional rotary saw substrates.

  The test product 1 used a substrate 1 having a diameter of 300 mm and a thickness of 2 mm, and a pressure layer 8 was formed by applying a rolling roll in the circumferential direction to the central portion in the radial direction of the substrate 1. Further, five pairs of slits composed of slits 2 a and 2 b were formed at equal intervals on the outer peripheral side of the pressure layer 8. The slit 2a has a zigzag cut groove formed by laser so that the swing width w is 40 mm at maximum, the groove interval (tongue piece width) is 8 mm, and the number of tongue pieces is four. A slit 2b was formed in the same manner on the inner peripheral side of the slit 2a. The slit on the outermost peripheral side of the slit 2b is provided in a part of the tongue on the innermost peripheral side of the slit 2a, and overlaps so that the slit 2a and the slit 2b are engaged with each other. These slits 2a and 2b All of the end portions were formed with circular holes having a diameter larger than the kerf width so that the kerf would not break and spread. The inclination of the slit 2 was 0 degree, that is, the central axis p at the swing width w of the zigzag cut groove was made to coincide with the radial line r at the central portion o of the slit 2.

  As shown in Table 1, the test products 2 to 4 were different from the test product 1 in that the diameter, thickness, kerf swing width w, tongue piece width, number of tongue pieces, and slit inclination were different. The test product 5 has the same specifications as the test product 1 except for the shape of the slit 2, and the slit 2 is formed by one continuous kerf. The test product 6 has a larger number of tongue pieces than the slit 2 of the test product 5 to increase the area of the slit 2, and since the slit 2 is larger, the inner side of the substrate 1 than the central portion in the radial direction. Since the kerf is formed so that the pressure layer 8 cannot be formed, tension adjustment is not performed. A sintered diamond chip having a predetermined size was brazed to the blade base 5 of the substrate 1 manufactured as described above to obtain test products 1 to 6.

  Using these test products, the amount of shear strain was analyzed by CAE. As a result, when the amount of shear strain is expressed as an index, when the test product 1 is 1, the test product 2 is 1, the test product 3 is 1.2, the test product 4 is 8, the test product 5 is 0.8, Product 6 was 0.9, and it was found that when compared with a test product having the same diameter and thickness, the product of the present invention has a large amount of shear strain and tends to have a higher noise prevention effect.

  As Example 2, in order to compare the attenuation state of the substrate, the above test products 1 to 6 were used and the impact test was performed. In the test method, with the central part of the substrate fixed, the central part of the slit of the substrate was hit with an iron pendulum, and the initial waveform immediately after hitting and the waveform when 0.2 s passed were measured at once, The logarithmic decay ability value of 10 Log10A / C was calculated and compared. As a result, when the attenuation rate is expressed by an index, when the test product 1 is 1.25, the test product 2 is 1.2, the test product 3 is 1.5, the test product 4 is 10, and the test product 5 is 1. 0 and test sample 6 are 1.1, which is a result almost proportional to the shear strain amount of Example 1. When compared with test products of the same diameter and thickness, the present invention has a high attenuation rate and noise prevention. It turned out that the effect tends to become high.

  As Example 3, in order to confirm the strength of the substrate, the above-mentioned test products 1 to 6 were used and the strength test of the substrate was performed. The test method was performed by measuring the amount of deflection when a load was applied to the end portion of the substrate while the central portion of the substrate was fixed. As a result, when the amount of deflection is expressed by an index, when the test product 1 is 1, the test product 2 is 1, the test product 3 is 0.7, the test product 4 is 0.27, the test product 5 is 1.15, The test product 6 was 1.4, and it was found that when compared with test products having the same diameter and thickness, the product of the present invention had a small amount of deflection and high substrate strength.

As Example 4, the above-mentioned test products 1 to 6 were used, and the cast aluminum material was cut to perform a test for comparing actual noise values, checking the state of vibration, and the durability of the substrate. The test method is to attach a test product to a vertical machining center, perform grooving with a rotational speed of 2400 min ⁻¹ , a feed rate of 360 mm / min (feed amount of 0.019 mm per blade) and a cut depth of 30 mm, and from the cut part A noise meter was installed at a position of 0.1 m, and the noise value during cutting was measured. In addition, the substrate deflection was measured by comparing the displacement amount per rotation using an eddy current displacement meter. Further, regarding the durability of the substrate, the deformation state of the substrate in the static state is confirmed every time 500 cuts are cut, and the difference appears after the 3000 cuts, so the deformation amount after the 3000 cuts is measured. A comparison was made. The results are shown in Table 2.

  From this test result, it was found that the rotary saw of the present invention has a low noise value and is superior to the conventional test product 5 having the same size with a slit shape. In addition, the conventional slit shape with a larger slit seemed to have the same noise level, but the results were actually high. This is probably because the vibration of the substrate was increased because the pressure layer was not provided, and the noise value was increased as a result. The test products 3 and 4 having different diameters and thicknesses were tested for reference, and cannot be directly compared with other test products.

  INDUSTRIAL APPLICABILITY The present invention can be used for a rotary saw substrate for processing a metal material, a wood-based material, and the like and a rotary saw using the substrate, and can be used particularly in a field where noise during cutting becomes a problem.

It is the partial side view which showed the example of the board | substrate for rotary saws of this invention. It is the partial side view which showed another example of the board | substrate for rotary saws of this invention. It is the partial side view which showed the example which formed the stress provision layer in the board | substrate for rotary saws in which the conventional slit was formed. It is the figure which showed the example of the board | substrate for the conventional rotary saw, (a) is a partial side view, (b) is the figure which expanded a part of slit. It is the enlarged view which showed the example of the slit of the board | substrate for rotary saws of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Slit 2a 1st slit 2b 2nd slit 2c Tongue piece contact part 3 Tongue piece 4 Peripheral slit 5 Blade base 6 Blade bottom 7 Mounting hole 8 Pressure layer (stress application layer)
w Slit swing width p Slit center axis o Slit center r Radius

Claims (4)

A rotary saw substrate having a diameter of 200 mm or more in which a plurality of slits are provided in a disk-shaped substrate,
In the central portion of the substrate radius of the substrate, a stress applying layer is formed continuously or intermittently in the circumferential direction,
The slit is a combination of the first slit and the second slit provided on the outer peripheral side of the stress applying layer of the substrate,
The first slit and the second slit are formed by a zigzag cut groove whose swing width is longer than a cut groove interval from the outer peripheral side to the inner peripheral side of the substrate, and is formed by the zigzag cut groove. An elongated tongue piece,
The second slit is provided on the inner peripheral side of the first slit, and a kerf on the outermost peripheral side of the second slit is formed on a tongue piece on the innermost peripheral side of the first slit. A substrate for a rotary saw, wherein the slit and the second slit are filled with resin.   The center axis of the swing width of the zigzag kerf coincides with the radial direction of the substrate or is within 45 ° with respect to the radial direction at the center of the slit. Substrate for rotary saw.   The rotary saw substrate according to claim 1 or 2, wherein a pair of slits formed by combining the first slits and the second slits are formed at equal intervals in the circumferential direction of the base metal.   A rotary saw having a cutting edge chip made of a hard material joined to the outer periphery of the substrate according to any one of claims 1 to 5.

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