JP2005091874A - Electrooptical device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrooptical device in which breakage of wiring, etc. on a substrate by filler is prevented by adjusting particle size of the filler to be added to an adhesive agent in the electrooptical device which seals moisture, etc. by mounting a sealing member of glass and metal on the substrate on which an element part is formed via the adhesive agent and electronic equipment. <P>SOLUTION: In the electrooptical device which has the substrate 20 equipped with the element part and has the sealing member 206 facing the substrate 20 and seals between the substrate 20 and the sealing member 206 by arranging resin 205 in which inorganic filler 212 and a gap member 211 are mixed, the particle size of the inorganic filler is made to be smaller than the particle diameter. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electro-optical device, a manufacturing method thereof, and an electronic apparatus including the electro-optical device.

In the field of electro-optical devices, improvement in durability against oxygen, moisture, and the like is a problem. For example, in an organic electroluminescence (hereinafter abbreviated as “organic EL”) display device which is an example of the electro-optical device, an electro-optical material (organic EL material, hole injection injection material, Non-light-emitting region called dark spot occurs due to deterioration of electron injection material, etc.) due to oxygen, moisture, etc., or decrease in conductivity due to oxygen, moisture, etc. of the cathode, and the lifetime of the light-emitting element is shortened There is.
In order to solve such a problem, a glass or metal sealing member that does not allow oxygen or moisture to pass through is bonded to the substrate on which the organic EL display device is formed with an adhesive provided on the periphery or the entire surface. Then, a method of shielding from oxygen, moisture, etc. is adopted. A gap (Gap) material and an inorganic filler (Filler) are added to this adhesive. The gap material defines the gap height between the sealing member and the substrate, while the filler is moisture that permeates the adhesive component. As a result, it has the role of delaying the entry of moisture.
JP 2000-1000055 A

  However, conventionally, the particle size of the filler added to the adhesive is often not controlled. In particular, when a filler having a particle size larger than the particle size of the gap material is present, when the sealing member is pressed against the substrate when the sealing member is attached to the substrate, the filler in the adhesive causes the substrate to adhere to the substrate or the substrate. The internal wiring, pixel partition walls, electrodes, sealing film, etc. are damaged, causing problems such as disconnection and short circuit.

  The present invention has been made in view of the above-described circumstances. In an electro-optical device in which moisture or the like is sealed by attaching a glass or metal sealing member to a substrate on which an element portion is formed via an adhesive. It is an object of the present invention to provide an electro-optical device and an electronic apparatus that prevent damage to wiring on a substrate, pixel partition walls, electrodes, sealing films, and the like by adjusting the particle size of the filler added to the agent.

The electro-optical device, the electro-optical device manufacturing method, and the electronic apparatus according to the present invention employ the following means in order to solve the above problems.
1st invention has the board | substrate provided with the element part, and the sealing member which opposes a board | substrate, arrange | positions resin which mix | blended the inorganic filler and the gap material between the board | substrate and the sealing member, In the electro-optical device that seals between the substrate and the sealing member, the particle size of the inorganic filler is made smaller than the particle size of the gap material. According to this invention, since the particle size of the inorganic filler is formed smaller than the particle size of the gap material, the inorganic filler is formed on the substrate when both are pressed to fix the sealing member to the substrate. It is possible to prevent the damaged metal wiring or the like from being damaged. That is, a gap material larger than the inorganic filler is interposed between the substrate and the sealing member, and the distance between the two is kept constant. Thereby, the inorganic filler is not pressed against the sealing member, and the wiring formed on the substrate is not damaged. And the inorganic filler added in resin becomes obstructions, such as a water | moisture content and oxygen which permeate | transmit the inside of resin, and extends the distance of the permeation | transmission path | routes, such as a water | moisture content. As a result, the time for moisture and the like to permeate the resin becomes longer, and as a result, moisture and the like hardly enter between the sealing member and the substrate.
In addition, when the gap material is a soft material mainly composed of a polymer, even if the gap material is in direct contact with the substrate, the wiring, pixel partition walls, electrodes, and sealing film existing on the surface on the substrate side may be damaged. In addition, the distance from the sealing member can be kept approximately constant. Therefore, a vivid image can be displayed for a long time as an electro-optical device having excellent durability.

  2nd invention has the board | substrate provided with the element part, and the sealing member which opposes a board | substrate, arrange | positions resin which mix | blended the inorganic filler and the gap material between the board | substrate and the sealing member, In the electro-optical device that seals between the substrate and the sealing member, the inorganic filler is made of a layered clay compound, and the thickness thereof is made smaller than the particle size of the inorganic filler. According to the present invention, when both are pressed to fix the sealing member to the substrate, the inorganic filler does not damage the metal wiring formed on the substrate, and the gap between the substrate and the sealing member. It arrange | positions so that it may overlap in general from the characteristic of material. Further, since the volume can be increased as compared with the granular filler, the path of moisture, oxygen, etc. that permeates through the resin can be further extended. Thereby, the permeation time of moisture and the like is further increased, and moisture and the like hardly enter between the sealing member and the substrate.

Further, in the case where the resin is disposed between the element part and the sealing member so as to cover at least a part of the element part, the element part formed on the substrate is shielded from moisture or the like to prevent deterioration. Can do.
In addition, in the case where a sealing film is provided above at least a part of the element portion and the resin is disposed between the sealing film and the sealing member so as to cover substantially the entire surface of the sealing film, together with the sealing film In addition to shielding moisture from entering and preventing deterioration, the light emitting layer and the sealing film can be protected from mechanical shocks from the outside.
The element portion includes an electro-optic element portion, a drive circuit portion, and a wiring portion, and is disposed between the drive circuit portion or the wiring portion and the sealing member so that the resin covers at least a part of the drive circuit portion or the wiring portion. In such a case, the drive circuit unit or the wiring unit is not damaged, and the electro-optical element unit is sealed, so that a vivid image can be displayed for a long time as an electro-optical device having excellent durability. it can.

  According to a third aspect of the present invention, an electronic apparatus includes the electro-optical device according to the first or second aspect. According to the present invention, it is possible to prevent deterioration by sealing the element portion or the like from moisture or the like without damaging the wiring or the like formed on the substrate. In addition, the sealing film formed on the substrate can be protected. Therefore, an electronic device that can display a vivid image for a long time can be obtained.

Embodiments of an electro-optical device and an electronic apparatus according to the invention will be described below with reference to the drawings.
As an electro-optical device, an EL display device using an electroluminescent material as an example of an electro-optical material, in particular, an organic electroluminescence (EL) material will be described.
FIG. 1 is a diagram showing a wiring structure of the EL display device 1. The EL display device 1 is an active matrix EL display device using a thin film transistor (hereinafter abbreviated as TFT) as a switching element.

As shown in FIG. 1, the EL display device (electro-optical device) 1 includes a plurality of scanning lines 101, a plurality of signal lines 102 extending in a direction perpendicular to each scanning line 101, and each signal line 102. And a plurality of power supply lines 103 extending in parallel with each other, and a pixel region X is provided in the vicinity of each intersection of the scanning line 101 and the signal line 102.
A data line driving circuit 100 including a shift register, a level shifter, a video line, and an analog switch is connected to the signal line 102. Further, a scanning line driving circuit 80 including a shift register and a level shifter is connected to the scanning line 101.

  Further, in each pixel region X, a switching TFT 112 to which a scanning signal is supplied to the gate electrode via the scanning line 101 and a pixel signal shared from the signal line 102 via the switching TFT 112 are held. A capacitor 113, a driving TFT 123 to which a pixel signal held by the holding capacitor 113 is supplied to the gate electrode, and driving from the power line 103 when electrically connected to the power line 103 through the driving TFT 123 A pixel electrode (electrode) 23 into which current flows and a functional layer 110 sandwiched between the pixel electrode 23 and the cathode (electrode) 50 are provided. The pixel electrode 23, the cathode 50, and the functional layer 110 constitute a light emitting element (organic EL element).

  According to the EL display device 1, when the scanning line 101 is driven and the switching TFT 112 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor 113, and according to the state of the holding capacitor 113. The on / off state of the driving TFT 123 is determined. Then, current flows from the power supply line 103 to the pixel electrode 23 through the channel of the driving TFT 123, and further current flows to the cathode 50 through the functional layer 110. The functional layer 110 emits light according to the amount of current flowing through it.

Next, a specific configuration of the EL display device 1 will be described with reference to FIGS.
As shown in FIG. 2, the EL display device 1 includes a pixel electrode in which a substrate 20 having electrical insulation and pixel electrodes connected to switching TFTs (not shown) are arranged in a matrix on the substrate 20. An area (not shown), a power line (not shown) arranged around the pixel electrode area and connected to each pixel electrode, and a pixel portion 3 having a substantially rectangular shape in plan view located at least on the pixel electrode area (In the dashed-dotted line frame in FIG. 2).
In the present invention, the substrate 20 and the switching TFT and various circuits formed on the substrate 20 as will be described later, and an interlayer insulating film are referred to as a base. (Indicated by reference numeral 200 in FIGS. 3 and 4)

The pixel unit 3 includes a real display area 4 in the center (inside the two-dot chain line in FIG. 2) and a dummy area 5 (area between the one-dot chain line and the two-dot chain line) arranged around the real display area 4. It is divided into.
In the actual display area 4, display areas R, G, and B each having a pixel electrode are arranged in a matrix so as to be separated from each other in the AB direction and the CD direction.
Further, scanning line drive circuits 80 and 80 are arranged on both sides of the actual display area 4 in FIG. These scanning line drive circuits 80 and 80 are arranged below the dummy region 5.

  Further, an inspection circuit 90 is arranged above the actual display area 4 in FIG. The inspection circuit 90 is a circuit for inspecting the operating state of the EL display device 1 and includes, for example, inspection information output means (not shown) for outputting the inspection result to the outside, and is displayed during manufacture or at the time of shipment. The apparatus is configured to be able to inspect the quality and defect of the apparatus. The inspection circuit 90 is also disposed below the dummy area 5.

  The scanning line driving circuit 80 and the inspection circuit 90 are applied with a driving voltage from a predetermined power supply unit via the driving voltage conducting unit 310 (see FIG. 3) and the driving voltage conducting unit 340 (see FIG. 4). Composed. Further, the drive control signal and drive voltage to the scanning line drive circuit 80 and the inspection circuit 90 are supplied from a predetermined main driver for controlling the operation of the EL display device 1 and the drive control signal conduction unit 320 (see FIG. 3) and Transmission and application are performed via the drive voltage conduction unit 350 (see FIG. 4). The drive control signal in this case is a command signal from a main driver or the like related to control when the scanning line drive circuit 80 and the inspection circuit 90 output signals.

In the EL display device 1, as shown in FIGS. 3 and 4, a large number of light emitting elements (organic EL elements) each including a pixel electrode 23, a light emitting layer 60, and a cathode 50 are formed on a substrate 200.
The light emitting layer 60 is typically a light emitting layer (electroluminescence layer), and includes a carrier injection layer or a carrier transport layer such as a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer. Is. Furthermore, a hole blocking layer (hole blocking layer) and an electron blocking layer (electron blocking layer) may be provided.

  In the case of a so-called top emission type EL display device, the substrate 20 constituting the base body 200 is configured to extract emitted light from the sealing member 206 side that is the opposite side of the substrate 20. Either can be used. Examples of opaque substrates include ceramics such as alumina, metal sheets such as stainless steel that have been subjected to insulation treatment such as surface oxidation, thermosetting resins and thermoplastic resins, and films thereof (plastic films). It is done.

  In the case of a so-called bottom emission type EL display device, since the emitted light is extracted from the substrate 20 side, a transparent or semi-transparent substrate 20 is employed. For example, glass, quartz, resin (plastic, plastic film) and the like can be mentioned, and a glass substrate is particularly preferably used.

A circuit unit 11 including a driving TFT 123 for driving the pixel electrode 23 and the like is formed on the substrate 20, and a large number of light emitting elements (organic EL elements) are provided thereon. As shown in FIG. 5, the light emitting element includes a pixel electrode 23 that functions as an anode, a hole transport layer 70 that injects / transports holes from the pixel electrode 23, and an organic EL that is one of electro-optic materials. The light-emitting layer 60 including the substance and the cathode 50 are sequentially formed.
Based on such a configuration, the light emitting element emits light by combining holes injected from the hole transport layer 70 and electrons from the cathode 50 in the light emitting layer 60.

Since the pixel electrode 23 is a top emission type in this embodiment, it does not need to be transparent, and is therefore formed of an appropriate conductive material.
As a material for forming the hole transport layer 70, for example, a polythiophene derivative, a polypyrrole derivative, or a doped body thereof is used. Specifically, a dispersion of 3,4-polyethylenediosithiophene / polystyrene sulfonic acid (PEDOT / PSS) or the like is used.

As a material for forming the light emitting layer 60, a known light emitting material capable of emitting fluorescence or phosphorescence can be used. Specifically, polyfluorene derivative (PF), polyparaphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP), polyvinyl carbazole (PVK), polythiophene derivative, polymethylphenylsilane (PMPS) And the like are preferably used.
In addition, these polymer materials include polymer materials such as perylene dyes, coumarin dyes, rhodamine dyes, rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, and quinacridone. It can also be used by doping a low molecular weight material such as.
In addition, it replaces with the polymeric material mentioned above, a conventionally well-known low molecular material can also be used.
In addition, an electron injection layer may be formed on the light emitting layer 60 as necessary.

In the present embodiment, the hole transport layer 70 and the light emitting layer 60 are composed of the lyophilic control layer 25 and the organic bank layer 221 formed in a lattice shape on the substrate 200 as shown in FIGS. The hole transport layer 70 and the light emitting layer 60 surrounded by the element layer are element layers constituting a single light emitting element (organic EL element).
Note that the angle θ of each wall surface of the opening 221a of the organic bank layer 221 with respect to the surface of the base body 200 is 110 degrees or more and 170 degrees or less (see FIG. 5). The reason for this angle is to facilitate the arrangement of the light emitting layer 60 in the opening 221a when the light emitting layer 60 is formed by a wet process.

As shown in FIGS. 3 to 5, the cathode 50 has a larger area than the total area of the actual display region 4 and the dummy region 5, and is formed so as to cover each, and the light emitting layer 60 and the organic bank layer 221. These are formed on the substrate 200 so as to cover the upper surface of the substrate and the wall surface forming the outer portion of the organic bank layer 221. The cathode 50 is connected to the cathode wiring 202 formed on the outer periphery of the substrate 200 outside the organic bank layer 221 as shown in FIG. A flexible substrate 203 is connected to the cathode wiring 202, whereby the cathode 50 is connected to a driving IC (driving circuit) (not shown) on the flexible substrate 203 via the cathode wiring 202.
In the present invention, a driving circuit unit including a pixel circuit arranged in a pixel region such as a switching TFT, a data line driving circuit 100, a scanning line driving circuit 80, an inspection circuit 90, and the like, a scanning line 101, and a signal line 102 A wiring portion composed of the power supply line 103, the cathode wiring 202, and the like, and an electro-optic element portion composed of an electro-optic element such as an organic EL element are referred to as an element portion.

  As a material for forming the cathode 50, for example, in the case of a top emission type, a transparent conductive material is used. As the transparent conductive material, ITO (Indium Tin Oxide: Indium Tin Oxide) is suitable, but other than this, for example, an indium oxide / zinc oxide based amorphous transparent conductive film (Indium Zinc Oxide: IZO / I-Zet) O) (registered trademark) or the like can be used. Further, a metal material such as calcium or aluminum which is translucent but has a high electron injection effect can be used as a thin film. In the present embodiment, ITO is used.

  A sealing film 30 may be formed on the upper layer portion of the cathode 50. The sealing film 30 is a layer provided not only to block oxygen and moisture in the air but also to prevent the cathode 50 from being corroded by an adhesive component or the like during the manufacturing process. For example, it is formed as a single layer or multiple layers of ITO or silicon compound. Further, an intermediate layer made of an organic material for the purpose of flatness may be formed to prevent defects in the inorganic compound layer. By covering the cathode 50 with the sealing film 30, it is possible to block oxygen and moisture invading from the atmosphere for a long period of time and to prevent the cathode 50 from being altered. The sealing film 30 is formed to a thickness of about 10 nm to 300 nm up to the insulating layer 284 on the outer peripheral portion of the substrate 200.

A pixel circuit unit 11 is provided below the light emitting element as shown in FIG. The pixel circuit unit 11 is formed on the substrate 20 and constitutes the base body 200. That is, a base protective layer 281 mainly composed of SiO ₂ is formed on the surface of the substrate 20, and a silicon layer 241 is formed thereon. A gate insulating layer 282 mainly composed of SiO ₂ and / or SiN is formed on the surface of the silicon layer 241.

In addition, a region of the silicon layer 241 that overlaps with the gate electrode 242 with the gate insulating layer 282 interposed therebetween is a channel region 241a. The gate electrode 242 is a part of the scanning line 101 (not shown). On the other hand, a first interlayer insulating layer 283 mainly composed of SiO ₂ is formed on the surface of the gate insulating layer 282 that covers the silicon layer 241 and on which the gate electrode 242 is formed.

  Further, in the silicon layer 241, a low concentration source region 241b and a high concentration source region 241S are provided on the source side of the channel region 241a, while a low concentration drain region 241c and a high concentration drain are provided on the drain side of the channel region 241a. The region 241D is provided to form a so-called LDD (Light Doped Drain) structure. Among these, the high-concentration source region 241S is connected to the source electrode 243 through a contact hole 243a that opens over the gate insulating layer 282 and the first interlayer insulating layer 283. The source electrode 243 is configured as a part of the above-described power supply line 103 (see FIG. 1 and extends in the direction perpendicular to the paper surface at the position of the source electrode 243 in FIG. 5). On the other hand, the high-concentration drain region 241D is connected to the drain electrode 244 made of the same layer as the source electrode 243 through a contact hole 244a that opens through the gate insulating layer 282 and the first interlayer insulating layer 283.

The upper layer of the first interlayer insulating layer 283 on which the source electrode 243 and the drain electrode 244 are formed is covered with a second interlayer insulating layer 284 mainly composed of, for example, an acrylic resin component. The second interlayer insulating layer 284 can be made of a material other than an acrylic insulating film, such as SiN or SiO ₂ . A pixel electrode 23 made of ITO is formed on the surface of the second interlayer insulating layer 284 and is connected to the drain electrode 244 through a contact hole 23 a provided in the second interlayer insulating layer 284. That is, the pixel electrode 23 is connected to the high concentration drain region 241D of the silicon layer 241 through the drain electrode 244.

  Note that TFTs (driving circuit TFTs) included in the scanning line driving circuit 80 and the inspection circuit 90, that is, N-channel type or P-channel type TFTs constituting an inverter included in the shift register among these driving circuits, for example. The structure is the same as that of the driving TFT 123 except that it is not connected to the pixel electrode 23.

On the surface of the second interlayer insulating layer 284 on which the pixel electrode 23 is formed, the pixel electrode 23, the lyophilic control layer 25 and the organic bank layer 221 described above are provided. The lyophilic control layer 25 is mainly made of a lyophilic material such as SiO ₂ , and the organic bank layer 221 is made of acrylic or polyimide. Then, on the pixel electrode 23, the hole transport layer 70 and the light emitting layer 60 are formed inside the opening 25 a provided in the lyophilic control layer 25 and the opening 221 a surrounded by the organic bank layer 221. Are stacked in this order. In addition, “lyophilic” of the lyophilic control layer 25 in this embodiment means that the lyophilic property is higher than at least materials such as acrylic and polyimide constituting the organic bank layer 221. .
The layers up to the second interlayer insulating layer 284 on the substrate 20 described above constitute the circuit unit 11.

  Here, in the EL display device 1 of the present embodiment, each light emitting layer 60 is formed so that the light emission wavelength bands correspond to the three primary colors of light in order to perform color display. For example, as the light emitting layer 60, a red light emitting layer 60R whose light emission wavelength band corresponds to red, a green light emitting layer 60G corresponding to green, and a blue organic EL layer 60B corresponding to blue, respectively, are displayed. , G, and B, one pixel that performs color display is configured with the display regions R, G, and B. Further, a BM (black matrix) (not shown) in which metallic chromium is formed by sputtering or the like is formed between the organic bank layer 221 and the lyophilic control layer 25 at the boundary of each color display region.

Also, as shown in FIGS. 3 and 4, a sealing member 206 is disposed on the substrate 200 on which a large number of light emitting elements (organic EL elements) are formed so as to cover them. The sealing member 206 is disposed on the insulating layer 284 on the outer peripheral portion of the base 200 via an adhesive layer 205 disposed so as to surround a large number of light emitting elements.
The sealing member 206 is a plate having gas barrier properties and further having at least one of functions such as pressure resistance, wear resistance, external light antireflection, and ultraviolet blocking properties. Specifically, it is formed of a polymer layer (plastic film), a DLC (diamond-like carbon) layer, glass or the like.
Further, a desiccant (not shown) made of an oxide metal material such as calcium oxide or barium oxide may be provided on the inner surface of the sealing member 206. The desiccant may be formed by pasting sheets processed into a sheet or by partially applying a liquid paste. Furthermore, by forming a recess or the like in which these desiccants are provided in the sealing member 206, the sealing member 206 can be isolated without contacting the light emitting element. By these, moisture that has entered during the process or a slight amount of moisture that has entered from the adhesive layer can be adsorbed to prevent deterioration of the light emitting element.
Further, in the EL display device of this example, the sealing member 206 needs to be translucent when the top emission type is used, but this is not necessary when the bottom emission type is used. Considering the above, a metal or the like may be used.

The adhesive layer 205 fixes the sealing member 206 at a predetermined height from the base body 200 and prevents intrusion of moisture or the like from the outside. For example, a resin such as urethane, acrylic, epoxy, or polyolefin resin Is formed of an adhesive made of a material that is softer than the sealing member 206 and has a low glass transition point. Note that a silane coupling agent or alkoxysilane may be added to such an adhesive. By doing so, the adhesion between the formed adhesive layer 205 and the substrate 200 becomes better.
In addition, a gap material 211 and a filler 212 are added to the adhesive layer 205. The gap material 211 has a function of fixing the sealing member 206 at a predetermined height from the base body 200, while the filler 212 has a function of preventing entry of moisture and the like from the outside.

FIG. 6A is a diagram schematically showing the gap material 211 and the filler 212 added in the adhesive layer 205.
The gap material 211 is made of a polymer material, for example, a sphere or cylinder formed of a relatively soft material such as polyester, PMMA (polymethyl methacrylate), ethylene vinyl acetate copolymer, acrylate resin, polyolefin, silicone resin, or the like. Shaped fine particles. The particle diameter of the gap material 211 is 2 to 100 μm, more preferably 5 to 10 μm. Note that the variation in the particle diameter of the gap material 211 is about 1 μm or less. The gap material 211 is added to the adhesive layer 205 by about 1 to several percent by weight in terms of solid content.
Accordingly, when the sealing member 206 is pressed against the base body 200 in order to fix the sealing member 206 to the base body 200, the gap material 211 is interposed between the base body 200 and the sealing member 206, and the particles of the gap material 211 The distance between the base 200 and the sealing member 206 is defined by the diameter. Further, since the gap material 211 is formed of a soft material, when the sealing member 206 is pressed against the base body 200, the wiring, electrodes, sealing film, organic bank, etc. formed on the base body 200 are damaged. It is prevented.

The filler 212 is made of fine particles formed of an inorganic material such as silica or alumina. The reason why it is formed of an inorganic material is to prevent moisture and the like from passing therethrough. Further, the particle size of the filler 212 is formed smaller than the particle size of the gap material 211. It is desirable that it is smaller than the minimum particle diameter of the gap material 211 at the maximum. For example, it is formed to have a particle size of about 10 nm to 1000 nm. The filler 212 is added to the adhesive layer 205 in a weight ratio of 10 to 70%, more preferably about 20 to 50%.
As described above, when the filler 212 is added into the adhesive layer 205, when a gas such as moisture or oxygen passes through the adhesive layer 205, the filler 212 becomes an obstacle, and the transmission path of moisture or the like meanders. The distance gets longer. Therefore, the time for moisture to permeate through the adhesive layer 205 is lengthened, and as a result, a sealing effect that moisture hardly enters between the sealing member 206 and the base body 200 occurs.
Further, since the particle diameter of the filler 212 is formed smaller than the particle diameter of the gap material 211, the filler 212 damages the wiring formed on the base body 200 when the sealing member 206 is pressed against the base body 200. It is prevented. That is, since the gap material 211 is interposed between the base body 200 and the sealing member 206, the hard filler 212 is not pressed against the sealing member 206 to damage the wiring and the like formed on the base body 200. .

Further, a filler 213 made of a layered clay compound may be used instead of the granular filler 212. FIG. 6B is a diagram schematically showing the gap material 211 and the filler 213 added in the adhesive layer 205.
Examples of the layered clay compound include mica, smectite, vermiculite, montmorillonite, and both natural products and chemical products can be used. The shape of the filler 213 made of a layered clay compound is such that the aspect ratio is 10 to 1 or more and the thickness is smaller than the particle diameter of the gap material 211. Similar to the filler 212, the addition ratio of the filler 213 is about 10 to 70%, more preferably about 20 to 50% by weight.
When the layered filler 213 is added into the adhesive layer 205, the path of moisture or the like that permeates the adhesive layer 205 becomes longer than when the granular filler 212 is added. Therefore, there is an effect that it becomes more difficult for moisture to enter.
Further, since the thickness of the filler 213 is smaller than the particle diameter of the gap material 211, the filler 212 is formed on the base body 200 when the sealing member 206 is pressed against the base body 200, similarly to the filler 212. Damage to wiring and the like is prevented. That is, since the filler 213 naturally has a property of moving so as to overlap between the base 200 and the sealing member 206, the wiring formed on the base 200 by the hard filler 213 being pressed against the sealing member 206, etc. Will not damage.

Next, an example in which the arrangement location of the sealing member 206 is changed will be described. FIG. 7 is a diagram showing the EL display device 2 in which the sealing member 206 is disposed on the cathode 50.
In the EL display device 2, the sealing film 30 is formed on the cathode 50, and the sealing member 206 is fixed thereon via an adhesive layer 205. The same components as those of the EL display device 1 are denoted by the same reference numerals.
As shown in FIG. 7, a sealing film 30 is provided so as to cover the cathode 50. The sealing film 30 is for preventing oxygen and moisture from entering inside thereof, thereby preventing the entry of oxygen and moisture into the cathode 50 and the light emitting layer 60. The deterioration of the light emitting layer 60 is suppressed.
The sealing film 30 is composed of, for example, a single layer or a multilayer containing at least an inorganic compound, and preferably uses a high-density plasma film forming method represented by ECR plasma sputtering, ECR plasma CVD, ICP-CVD, or a plasma gun system. Thus, a layer of silicon compound, that is, silicon nitride, silicon oxynitride, silicon oxide, or the like is formed. However, other than silicon compounds, for example, alumina, tantalum oxide, titanium oxide, and other ceramics may be used. If the sealing film 30 is formed of an inorganic compound in this way, the adhesion between the sealing film 30 and a part of the cathode 50 is improved, particularly when the cathode 50 is formed of ITO. The film 30 becomes a dense layer having no defects, and the barrier property against oxygen and moisture becomes better.

  In addition, the sealing film 30 may have a multilayer structure in which the inorganic compound layer is provided via an intermediate layer made of an organic material for improving the complete coverage of the inorganic compound layer. For example, an inorganic compound may be formed by a high-density plasma film forming method on a planarized surface by applying an organic polymer material diluted in an organic solvent by a WET process, followed by drying and curing. In this way, the thick sealing film 30 can be formed without causing the inorganic compound to crack, and the stress generated in the uneven shape of the organic bank layer can be relaxed, or the pinhole-like defects generated by particles or the like Can be coated.

Further, the thickness of the sealing film 30 is preferably 100 nm or more and 5000 nm or less. If the thickness is less than 100 nm, defects in the film or variations in film thickness may occur due to particles or surface roughness, resulting in partial formation of through holes, which may impair gas barrier properties. This is because exceeding the range may cause cracking due to stress or distortion due to external stress or the like.
For example, in the case of the top emission type, the gas barrier layer 30 needs to have translucency. Therefore, by appropriately adjusting the material and the film thickness, in this embodiment, the light transmittance in the visible light region is set to, for example, 80% or more.

Further, a sealing member 206 is disposed on the upper side of the gas barrier layer 30 via an adhesive layer 205. The adhesive layer 205 is disposed between the gas barrier layer 30 and the sealing member 206 without a gap. As in FIGS. 3 and 4, a gap material 211 and a filler 212 are added to the adhesive layer 205. Furthermore, in the case of a top emission structure, scattering due to emitted light can be prevented by making the refractive index of the gap material having a large particle size and the adhesive have the same or similar refractive index.
Thus, by disposing the sealing member 206 on the upper side of the gas barrier layer 30, the gas barrier layer 30 can be protected from a mechanical impact from the outside. Furthermore, the distance between the gas barrier layer 30 and the sealing member 206 can be made constant, and entry of moisture and the like is prevented by the sealing member 206 and the adhesive layer 205.

  In the above-described embodiment, the top emission type EL display devices 1 and 2 have been described as examples. However, the present invention is not limited to this, and the bottom emission type also emits emitted light on both sides. Applicable to types.

Further, in the case of a bottom emission type or a type that emits emitted light on both sides, the switching TFT 112 and the driving TFT 123 formed on the base 200 are not directly under the light emitting element, but the lyophilic control layer 25 and It is preferable to increase the aperture ratio by forming the organic bank layer 221 directly below.
In the EL display device 1, the first electrode in the present invention functions as an anode and the second electrode functions as a cathode, but these are reversed to make the first electrode a cathode and the second electrode an anode. It may be configured to function as each. However, in that case, the formation positions of the light emitting layer 60 and the hole transport layer 70 need to be switched.

  In this embodiment, an example in which the EL display devices 1 and 2 are applied to the electro-optical device has been described. However, the present invention is not limited to this, and the second electrode is basically provided outside the substrate. Any electro-optical device can be applied as long as it is a device.

Next, the electronic apparatus of the present invention will be described. The electronic apparatus has the above-described EL display device (electro-optical device) 1 as a display unit, and specifically, the one shown in FIG.
FIG. 8A is a perspective view showing an example of a mobile phone. In FIG. 8A, a mobile phone 1000 includes a display unit 1001 using the EL display device 1 described above.
FIG. 8B is a perspective view showing an example of a wristwatch type electronic device. In FIG. 8B, a timepiece 1100 includes a display unit 1101 using the EL display device 1 described above.
FIG. 8C is a perspective view showing an example of a portable information processing apparatus such as a word processor or a personal computer. In FIG. 8C, the information processing apparatus 1200 includes an input unit 1201 such as a keyboard, a display unit 1202 using the EL display device 1 described above, and an information processing apparatus main body (housing) 1203.
Each of the electronic devices shown in FIGS. 8A to 8C includes the display units 1001, 1101, and 1202 each including the EL display device (electro-optical device) 1 described above. The life of the light emitting element of the display device is extended.

The figure which shows the wiring structure of EL display apparatus Schematic diagram showing the structure of an EL display device Sectional drawing which follows the AB line of FIG. Sectional drawing which follows the CD line of FIG. 3 is an enlarged cross-sectional view of the main part of FIG. Expanded sectional view showing the adhesive layer Schematic diagram showing a modification of the EL display device Illustration showing electronic devices

Explanation of symbols

1, 2 display device (electro-optical device), 20 substrate, 30 sealing film, 205 adhesive layer (resin), 206 sealing member, 211 gap material, 212 inorganic filler, 1000 mobile phone (electronic device), 1100 watch ( Electronic device), 1200 Information processing device (electronic device), 1001, 1101, 1202 Display unit (electro-optical device)

Claims (7)

A substrate having an element portion; and a sealing member facing the substrate; a resin in which an inorganic filler and a gap material are blended between the substrate and the sealing member; In the electro-optical device for sealing between the sealing member,
An electro-optical device, wherein a particle size of the inorganic filler is smaller than a particle size of the gap material.   The electro-optical device according to claim 1, wherein the gap material is a soft material mainly composed of a polymer. A substrate having an element portion; and a sealing member facing the substrate; a resin in which an inorganic filler and a gap material are blended between the substrate and the sealing member; In the electro-optical device for sealing between the sealing member,
An electro-optical device, wherein the inorganic filler is made of a layered clay compound, and the thickness thereof is smaller than the particle size of the inorganic filler.   The electro-optical device according to claim 1, wherein the resin is disposed between the element portion and the sealing member so as to cover at least a part of the element portion. Having a sealing film above at least a part of the element portion;
The electro-optical device according to claim 1, wherein the resin is disposed between the sealing film and the sealing member so as to cover substantially the entire surface of the sealing film. The element unit includes an electro-optic element unit, a drive circuit unit, and a wiring unit.
The said resin is arrange | positioned between this drive circuit part or this wiring part, and the said sealing member so that at least one part of this drive circuit part or this wiring part may be covered. Electro-optic device. An electronic apparatus comprising the electro-optical device according to any one of claims 1 to 6.

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