JP2005086073A - Method for manufacturing ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently manufacture a highly reliable ceramic electronic component in a short time, wherein the ceramic electronic component is capable of efficiently evaporating and removing moisture in a short time and preventing the rejection phenomenon of conductive paste in the case of formation of an external electrode, after the application of the conductive paste and the baking thereof, and preventing crawling of solder upon mounting, due to the sticking and absorption of plating liquid when the external electrode is plated. <P>SOLUTION: First, a ceramic element 12 is formed to manufacture a laminated ceramic capacitor 10. External electrodes 18a, 18b, first plating films 20a, 20b and second plating films 20a, 20b are formed on the ceramic element 12. Then, the temperature of the ceramic element 12 is raised, in a state wherein an inert gas such as N<SB>2</SB>or Ar is introduced into the atmosphere around the ceramic element 12, and then the pressure of the atmosphere is reduced and heat treatment is carried out. Then, after an inert gas is introduced into the atmosphere, the temperature of the ceramic element 12 is lowered to evaporate and remove the moisture of the plating liquid from the ceramic element 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a ceramic electronic component, and more particularly, to a ceramic electronic component such as a multilayer ceramic capacitor after undergoing a process such as a wet barrel polishing process or a wet plating process that causes adhesion or adsorption of moisture to a ceramic element. The present invention relates to a method for manufacturing a ceramic electronic component.

Conventionally, in a method for manufacturing a ceramic electronic component, for example, wet plating treatment for plating an external electrode on a ceramic element or wet barrel polishing treatment after firing a ceramic element, etc., adhesion and adsorption of moisture to the ceramic element. In order to remove the water after the treatment to cause a drying, a drying step was included.
The removal of moisture by this drying step is removal of the plating solution after the wet plating treatment, and removal of water used as a buffer material in the case of the wet barrel polishing treatment.
If the moisture is not removed sufficiently, in the case of the wet plating process, when the plating solution adhering or adsorbing to the ceramic element and the external electrode is mounted on the circuit board by a method such as reflow soldering, Rapid evaporation due to heat causes solder rupture (burst), which may cause a short circuit between adjacent electronic components. In addition, in the case of wet barrel polishing, there is a problem that the water adhering to or adsorbing to the ceramic element causes the external electrode paste to be repelled by water in the subsequent external electrode forming step. Even if the external electrode paste is not repelled, if the external electrode paste is baked in a state where the moisture is contained in the ceramic element, the heat causes the water to rapidly evaporate, causing a rupture (rupture) in the external electrode. Problems arise.
In such a drying process, there is a method of heating a ceramic element under reduced pressure in order to efficiently remove moisture (see Patent Document 1).
According to this method, since the degree of vacuum is increased and heating is performed under reduced pressure, moisture is easily removed compared to heating and drying under atmospheric pressure, and moisture is reliably and efficiently removed. It becomes possible. For this reason, solder paste at the time of mounting due to adhesion or adsorption of plating solution when plating on external electrodes, or conductive paste due to adhesion or adsorption of moisture when applying wet barrel polishing to ceramic elements are applied and baked. When the external electrode is formed by this method, it becomes possible to prevent the repelling phenomenon that the conductive paste hardly adheres to the ceramic, and the external electrode from fusing. As a result, it is possible to efficiently manufacture a highly reliable ceramic electronic component.

JP 2001-68372 A

  However, in the above-described conventional technology, since the ceramic element is heated under reduced pressure in order to remove moisture from the ceramic element, it takes a long time to raise the temperature to the set temperature. Therefore, in the above-described conventional technology, it takes a long time to manufacture a ceramic electronic component.

  Therefore, the main object of the present invention is to remove the conductive paste in the case where the external electrode is formed by evaporating and removing water from the ceramic element efficiently and in a short time, and applying and baking the conductive paste. It is possible to prevent solder fouling during mounting due to adhesion and adsorption of plating solution when plating on electrodes, and it is possible to manufacture highly reliable ceramic electronic components efficiently and in a short time A method of manufacturing a ceramic electronic component is provided.

  The method for manufacturing a ceramic electronic component according to the present invention is a method of heating a ceramic element under reduced pressure after performing treatment that causes adhesion and adsorption of moisture on a ceramic element formed by firing a ceramic molded body. In a method of manufacturing a ceramic electronic component having a step of removing moisture from a ceramic element, the step of removing moisture from the ceramic element is a temperature rising stage until reaching a set temperature for heating the ceramic element, and holding the set temperature It consists of a step and a temperature lowering step that lowers the set temperature to room temperature. The temperature rising step or temperature lowering step is performed in a state where the degree of vacuum is lower than the holding step and an inert gas is put in the atmosphere around the ceramic element. A method for manufacturing a ceramic electronic component.

  In the method for manufacturing a ceramic electronic component according to the present invention, the process of removing moisture from the ceramic element after the treatment that causes adhesion and adsorption of moisture to the ceramic element reaches a set temperature for heating the ceramic element. Temperature rising stage, holding stage for maintaining the set temperature, and temperature falling stage for lowering the set temperature to room temperature. The temperature rising stage or the temperature lowering stage has a lower degree of vacuum than the holding stage and is not suitable for the atmosphere around the ceramic element. Since it is performed in a state in which the active gas is added, moisture can be reliably and efficiently removed from the ceramic element. In this case, the temperature of the ceramic element can be raised. Therefore, when forming the external electrode by the method of applying and baking the conductive paste, the conductive paste is difficult to stick to the ceramic element, and the adhesion or adsorption of the plating solution when plating the external electrode Soldering can be prevented. As a result, a highly reliable ceramic electronic component can be efficiently manufactured.

  In the method for manufacturing a ceramic electronic component according to the present invention, the step of removing moisture from the ceramic element includes a temperature rising stage until reaching a set temperature for heating the ceramic element, a holding stage for holding the set temperature, and a set temperature. The temperature rising stage or the temperature lowering stage is performed in a state where the degree of vacuum is lower than that of the holding stage and an inert gas is put in the atmosphere around the ceramic element. Compared to the case where the temperature of the ceramic element is raised and lowered after the atmosphere is depressurized, the temperature of the ceramic element can be raised and lowered in a short time. As a result, according to the method for manufacturing a ceramic electronic component according to the present invention, moisture can be removed from the ceramic element by evaporating in a short time, and the ceramic electronic component can be manufactured in a short time.

  In the method for manufacturing a ceramic electronic component according to the present invention, the process in which moisture adheres and is adsorbed is, for example, a wet barrel polishing process in which a ceramic element is put in a barrel and polished in the presence of water. In the wet barrel polishing process, moisture adheres to or is adsorbed to the ceramic element. In the method of manufacturing a ceramic electronic component according to the present invention, the ceramic element is filled with an inert gas in the atmosphere around the ceramic element. The temperature of the ceramic element is reduced, the atmosphere is reduced, and then the inert gas is added to the atmosphere to lower the temperature of the ceramic element, so that moisture can be reliably and efficiently removed from the ceramic element in a short time. Therefore, it becomes possible to manufacture a highly reliable ceramic electronic component efficiently and in a short time.

  Further, in the method for manufacturing a ceramic electronic component according to the present invention, the process in which moisture adheres and is adsorbed is, for example, a wet plating process in which, after an external electrode is formed on a ceramic element, a plating film is formed on the surface of the external electrode It is. In the wet plating process in which a plating film is formed on the surface of the external electrode formed on the ceramic element by a wet plating method, the plating solution adheres to or adheres to the ceramic element. In the manufacturing method, by heating the ceramic element in a state where an inert gas is put in the atmosphere around the ceramic element, depressurizing the atmosphere, and then putting the inert gas into the atmosphere to lower the temperature of the ceramic element. Thus, it is possible to reliably and efficiently remove moisture contained in the plating solution from the ceramic element in a short time. As a result, when a ceramic electronic component is mounted on a circuit board or the like by a method such as reflow soldering, the solder is separated (exploded) due to the evaporation of moisture derived from the plating solution and the adjacent electronic component. It becomes possible to prevent the occurrence of a short circuit, and a highly reliable ceramic electronic component can be manufactured efficiently and in a short time.

  In the method for manufacturing a ceramic electronic component according to the present invention, the ceramic element is, for example, a multilayer ceramic element having a multilayer structure in which a plurality of layers of internal electrodes are provided via a ceramic layer. A laminated ceramic element having a laminated structure in which a plurality of internal electrodes are provided via a ceramic layer is likely to cause moisture adsorption and its harmful effect. Can be efficiently removed in a short time, and the occurrence of defects due to moisture adsorption can be efficiently prevented. Therefore, it can be said that the present invention is more meaningful when applied to a method of manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor or a multilayer varistor.

  Furthermore, in the method of manufacturing a ceramic electronic component according to the present invention, when the ceramic element is a multilayer ceramic element having an internal electrode provided therein, the step of removing moisture from the ceramic element is the adhesion and adsorption of moisture. This is performed before the moisture reaches the effective portion of the internal electrode after the treatment to cause the water. In this case, the effective portion of the internal electrode is, for example, a portion where the internal electrodes overlap to form a capacitance in the case of a multilayer ceramic capacitor. According to the method of the present invention, moisture adhering to or adsorbing to a ceramic element or external electrode can be removed efficiently and reliably.

  According to the present invention, when the external electrode is formed by evaporating and removing water from the ceramic element efficiently and in a short time, and applying and baking the conductive paste, plating of the external electrode It is possible to prevent solder fraying during mounting due to adhesion or adsorption of the plating solution when applied, and it becomes possible to manufacture highly reliable ceramic electronic components efficiently and in a short time.

  The above-mentioned object, other objects, features, and advantages of the present invention will become more apparent from the following description of the best mode for carrying out the invention with reference to the drawings.

  FIG. 1 is an illustrative view showing one example of a multilayer ceramic capacitor to which the present invention is applied. A multilayer ceramic capacitor 10 shown in FIG. 1 includes a rectangular parallelepiped ceramic element 12. The ceramic element 12 includes a number of ceramic layers 14 made of a dielectric. These ceramic layers 14 are laminated. Internal electrodes 16 a and 16 b using Ni are alternately formed between the ceramic layers 14. In this case, the internal electrode 16 a is formed with one end extending to one end of the ceramic element 12, and the internal electrode 16 b is formed with one end extending to the other end of the ceramic element 12. The internal electrodes 16 a and 16 b are formed so that the intermediate portion and the other end portion overlap with each other with the ceramic layer 14 interposed therebetween. Therefore, the ceramic element 12 is a multilayer ceramic element having a multilayer structure in which a plurality of internal electrodes 16a and 16b are provided via the ceramic layer 14 therein.

  An external electrode 18a using Cu is formed on one end face of the ceramic element 12 so as to be connected to the internal electrode 16a. Similarly, an external electrode 18b using Cu is formed on the other end surface of the ceramic element 12 so as to be connected to the internal electrode 16b.

  Further, first plating films 20a and 20b using Ni are formed on the surfaces of the external electrodes 18a and 18b, respectively, in order to prevent solder erosion. Furthermore, second plating films 22a and 22b using Sn for improving solderability are formed on the surfaces of the first plating films 20a and 20b, respectively.

  Next, a method for manufacturing the multilayer ceramic capacitor 10 shown in FIG. 1 will be described.

(Experimental example 1)
In order to manufacture the multilayer ceramic capacitor 10 shown in FIG. 1, first, the ceramic element 12 is formed by a normal method. That is, a large number of dielectric ceramic green sheets are formed. On one main surface of a predetermined one of the dielectric ceramic green sheets, an internal electrode material layer using Ni is printed to form an internal electrode material layer. These dielectric ceramic green sheets are laminated, pressure-bonded, and cut into a ceramic molded body having a predetermined size. Then, by firing the ceramic molded body, the ceramic element 12 having the internal electrodes 16a and 16b between the multiple ceramic layers 14 is formed.

  Then, external electrodes 18a and 18b are formed on both side surfaces of the ceramic element 12 by applying and baking an electrode paste containing Cu, respectively.

  Then, the first plating films 20a and 20b are respectively formed on the surfaces of the external electrodes 18a and 18b by plating Ni in a plating solution.

  Then, second plating films 22a and 22b are formed on the surfaces of the first plating films 20a and 20b by plating Sn in a plating solution, respectively.

  The ceramic element 12 on which the first plating films 20a and 20b and the second plating films 22a and 22b are formed adheres and adsorbs moisture in the plating solution. By heating the ceramic element 12, the ceramic element Evaporate and remove moisture from 12. Thereby, the multilayer ceramic capacitor 10 is manufactured.

In order to evaporate and remove moisture from the ceramic element 12 as described above, the ceramic element 12 is subjected to heat treatment under the conditions shown in Sample Nos. 1 to 4 in Table 1.
That is, in the sample numbers 1 to 4, first, the atmosphere around the ceramic element 12 (atmosphere in the oven for heat treatment) is raised from room temperature (25 ° C.) to a set temperature (150 ° C.), and the ceramic element 12 is Heat treatment.
In this case, in sample number 1, the ceramic element 12 is heated (temperature rising stage) in a state where the atmosphere (air) around the ceramic element 12 is reduced (under reduced pressure).
In sample number 2, the ceramic element 12 is heated without depressurizing the atmosphere (air) around the ceramic element 12 (temperature rising stage).
In Sample Nos. 3 and 4, in the temperature raising stage, the inert gas (N ₂ , Ar) shown in Table 1 is put in the atmosphere around the ceramic element 12 and then the ceramic element 12 is heated (temperature rise). Stage).
In Sample Nos. 2 to 4, the ceramic element 12 reaches the set temperature (150 ° C.), and at the same time, the atmosphere is reduced to a vacuum degree of 133 (Pa), and the ceramic element 12 is processed at the set temperature (150 ° C.). Heat treatment is performed for 1 hour as a time (holding stage).
Then, in the sample numbers 1 to 4, the cooled air is put in a state where the atmosphere is reduced, and the ceramic element 12 is cooled from the set temperature (150 ° C.) to the room temperature (temperature decreasing stage).
As described above, moisture is removed from the ceramic element 12 by evaporation.

  The monolithic ceramic capacitor 10 manufactured under the above conditions was evaluated for the occurrence rate of repelling phenomenon and solderability, and the results are shown in Table 1. Table 1 shows the rate of occurrence of internal defects after 10000 monolithic ceramic capacitors 10 were immersed in water for about 1 day and heat treated at 600 ° C. Table 1 shows the evaluation results with 230 ° C. eutectic solder for solderability. Further, in Table 1, the time required for the atmosphere around the ceramic element 12 to reach the set temperature (150 ° C.) from room temperature is shown as the set temperature arrival time (time).

From the results shown in Table 1, in sample number 1, since the ceramic element 12 is heated under reduced pressure of the atmosphere, it takes a long time to reach the set temperature (set temperature arrival time), and temperature variations are likely to occur. It can be seen that the occurrence rate of the repelling phenomenon is also bad. As for the temperature uniformity, the radiation from the heater of the oven for heat treatment and the heat transfer through the gas in the oven are estimated, but in sample No. 1, the atmosphere is decompressed and only the radiation is estimated. It is presumed that the temperature variation tends to occur and the time for raising the temperature until the set temperature is reached is long.
On the other hand, in Sample No. 2, the temperature of the ceramic element 12 is increased in the atmosphere of air, so that the temperature increase time is shortened. However, due to the oxidation of the plating films (particularly, the second plating films 22a and 22b) Deterioration is confirmed.
On the other hand, in Sample Nos. 3 and 4 within the scope of the present invention using an atmosphere containing an inert gas (N ₂ , Ar), the heating time is short and the solderability is deteriorated due to oxidation. I understand that there is no.

(Experimental example 2)
In Experimental Example 2, similarly to Experimental Example 1, the ceramic element 12 is formed, and the external electrodes 18a and 18b, the first plating films 20a and 20b, and the second plating films 22a and 22b are formed.

  Also in Experimental Example 2, the ceramic element 12 is heated to evaporate and remove moisture from the ceramic element 12. Thereby, the multilayer ceramic capacitor 10 is manufactured.

In Experimental Example 2, in order to evaporate and remove moisture from the ceramic element 12 as described above, the ceramic element 12 is subjected to heat treatment under the conditions shown in sample numbers 5 to 8 in Table 2.
First, in Sample No. 5, the ceramic element 12 is heat-treated under exactly the same conditions as Sample No. 1 in Experimental Example 1.
In Sample No. 6, the same conditions as in the temperature raising stage and holding stage in Sample No. 3 of Experimental Example 1 were set, and the temperature was reduced from the set temperature (150 ° C.) to room temperature in the oven for heat treatment ( The air at a temperature not higher than room temperature is continuously sent to the atmosphere around the ceramic element 12 to lower the temperature.
Further, in Sample No. 7, the same conditions as those in the temperature raising stage and the holding stage in Sample No. 3 of Experimental Example 1 are set, and the temperature is lowered from the set temperature (150 ° C.) to room temperature in the oven for heat treatment ( The temperature is lowered by continuously sending N ₂ at a temperature below room temperature to the atmosphere around the ceramic element 12.
In Sample No. 8, the same conditions as those for the temperature raising stage and the holding stage in Sample No. 3 of Experimental Example 1 were set, and the temperature was lowered from the set temperature (150 ° C.) to room temperature in the oven for heat treatment ( The atmosphere around the ceramic element 12) Continue to send to lower the temperature.
As described above, moisture is removed from the ceramic element 12 by evaporation.

  About the multilayer ceramic capacitor 10 manufactured on the above-mentioned conditions, the occurrence rate of repelling phenomenon and solderability were evaluated in the same manner as in Experimental Example 1, and the results are shown in Table 2. Further, Table 2 shows the time until the ceramic element 12 reaches the room temperature (25 ° C.) from the set temperature (150 ° C.) as the room temperature arrival time (hour).

From the results shown in Table 2, in Sample No. 5, the temperature of the ceramic element 12 is lowered under reduced pressure of the atmosphere (air), so the time until it reaches room temperature (room temperature arrival time) is long, and the occurrence rate of the repelling phenomenon is also high. I know it ’s bad.
On the other hand, in Sample No. 6, since air is continuously sent to the atmosphere to lower the temperature of the ceramic element 12, the temperature rise time is shortened, but soldering is performed due to oxidation of the plating films (particularly the second plating films 22a and 22b). Degradation is confirmed.
On the other hand, in sample numbers 7 and 8 within the scope of the present invention in which the inert gas (N ₂ , Ar) is continuously sent to the atmosphere, the temperature lowering time is short, and there is no deterioration in solderability due to oxidation. I understand.

In each experimental example described above, the removal of moisture after the wet plating process for plating the external electrode on the ceramic element has been described. However, the present invention is applicable to the removal of moisture after the wet barrel polishing process of the ceramic element. However, similar results can be obtained.
That is, when the present invention is applied to both removal of water after wet barrel polishing and removal of plating solution after wet plating, the processing time can be shortened in two steps. When viewed as a whole, the manufacturing time can be greatly reduced.

(Experimental example 3)
Next, after the wet plating process, which is a process that causes the adhesion and adsorption of moisture, the insulation resistance failure of the ceramic electronic component when the moisture was removed after a while was examined, and the results are shown in Table 3.
As the ceramic electronic component, a multilayer ceramic capacitor in which a Ni internal electrode is provided in a ceramic element mainly composed of CaZrO ₃ and an external electrode made of Cu is formed is used. The outer dimensions of the multilayer ceramic capacitor are length 2.0 mm × width 1.25 mm × thickness 1.25 mm, and the end face thickness of the external electrode is 80 μm. Insulation resistance failure is a failure of a multilayer ceramic capacitor of less than 10 ¹¹ Ω.

From the results shown in Table 3, it can be seen that after the wet plating process, it is preferable to remove the water in a short time without taking time.
In addition, after dissolving the fluorescent solution in the plating solution used for plating and immersing it for the time required for plating, the plate is left for the same time as the sample numbers 9 to 13 in Table 3, and then the cross section of the ceramic electronic component is viewed. The infiltration was investigated.
As a result, it was found that the external electrode passed through in 24 hours and reached the effective portion of the internal electrode in the ceramic element. That is, it is considered that the defective insulation resistance of Sample Nos. 12 and 13 in Table 3 is due to the fact that the plating solution reaching the effective portion of the internal electrode cannot be removed.

(Experimental example 4)
Further, after the wet barrel polishing process, which is a process in which moisture adheres and is adsorbed, the structural defect defects of the ceramic electronic component when the moisture is removed after a period of time are examined, and the results are shown in Table 4.
The same ceramic electronic component as in Experimental Example 3 was used except that no external electrode was formed. The distance between the end face of the ceramic element and the internal electrode in the length direction is 200 μm, the distance between the side face of the ceramic element and the internal electrode in the width direction is 250 μm, and the distance between the upper and lower surfaces of the ceramic element and the internal electrode in the thickness direction. The interval is 200 μm. Regarding the structural defect defect, the ceramic element was barrel-polished and then heat-treated at 860 ° C. which is the external electrode baking temperature, and then the structural defect was detected by an ultrasonic flaw detector.

From the results shown in Table 4, it can be seen that after the wet barrel polishing treatment, it is preferable to remove the water in a short time without taking time.
Further, after dissolving the fluorescent solution in water used for the wet barrel polishing process and performing wet barrel polishing, the sample is left for the same time as the sample numbers 14 to 19 in Table 4, and the plating solution is observed by looking at the cross section of the ceramic electronic component. The invasion of was investigated.
As a result, water infiltrates from the vicinity of the end face of the ceramic element in 24 hours and reaches the effective portion of the internal electrode in the ceramic element, and water intrudes from near the upper and lower face of the ceramic element in 24 hours. It was found that water invaded from the vicinity of the side surface of the ceramic element and reached the effective part of the internal electrode in the ceramic element in 30 hours. The reason why the intrusion from the side surface of the ceramic element took more time than the intrusion from the end surface and the upper and lower surfaces of the ceramic element is that it was larger by 50 μm. Accordingly, it is considered that the structural defect defects of Sample Nos. 17 to 19 in Table 4 are due to the fact that the moisture that has reached the effective portion of the internal electrode cannot be removed.

As described above, from the results of Experimental Example 3 and Experimental Example 4, when moisture is removed after the treatment that causes the adhesion or adsorption of moisture to the ceramic element, the moisture reaches the effective portion of the internal electrode. Obviously it is necessary to do before.
The time to reach the effective portion of the internal electrode varies depending on the external electrode and the distance between the internal electrode and the surface of the ceramic element. For example, the ceramic electronic component is downsized to reduce the thickness of the external electrode, the internal electrode and the ceramic element. When the distance from the surface becomes small, it is necessary to remove the moisture in a shorter time after the treatment that causes the adhesion or adsorption of moisture to the ceramic element.

In each of the above experimental examples, N ₂ and Ar are put as an inert gas in the atmosphere around the ceramic element. In the present invention, another inert gas is put into the atmosphere around the ceramic element. In this way, the same effect can be obtained.

  In each of the above experimental examples, Ni is used for the internal electrodes 16a and 16b, Cu is used for the external electrodes 18a and 18b, Ni is used for the first plating films 20a and 20b, and the second plating film. Although Sn is used for 22a and 22b, other materials may be used for them in the present invention. For example, a base metal other than Cu may be used for the external electrode.

  Furthermore, in each of the above experimental examples, the manufacturing method of the multilayer ceramic capacitor has been described as an example. However, in addition to the multilayer ceramic capacitor, the present invention includes an internal electrode such as a multilayer ceramic varistor, multilayer ceramic inductor, multilayer ceramic thermistor, and connection to the internal electrode. The present invention can be applied to various multilayer ceramic electronic component manufacturing methods having external electrodes.

  Furthermore, in each of the above experimental examples, a plurality of internal electrodes are used. However, in a multilayer ceramic capacitor, a multilayer ceramic varistor, and a multilayer ceramic thermistor, two or more internal electrodes may be used. One or more internal electrodes may be used.

  In addition, the present invention is not limited to the above experimental examples in other respects as well. The drying conditions such as the degree of vacuum, temperature, and time, the type of ceramic constituting the ceramic element, the internal electrode and the external electrode Various applications and modifications can be made within the scope of the invention.

It is an illustration figure which shows an example of the multilayer ceramic capacitor to which this invention is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Multilayer ceramic capacitor 12 Ceramic element 14 Ceramic layer 16a, 16b Internal electrode 18a, 18b External electrode 20a, 20b 1st plating film 22a, 22b 2nd plating film

Claims (5)

A process of removing moisture from the ceramic element by heating the ceramic element under reduced pressure after performing treatment that causes adhesion and adsorption of moisture on the ceramic element obtained by firing the ceramic molded body In the method of manufacturing a ceramic electronic component,
The step of removing moisture from the ceramic element includes a temperature rising stage until reaching a set temperature for heating the ceramic element, a holding stage for holding the set temperature, and a temperature lowering stage for lowering the set temperature to room temperature. The method of manufacturing a ceramic electronic component, wherein the step or the temperature lowering step is performed in a state where the degree of vacuum is lower than that of the holding step and an inert gas is put in an atmosphere around the ceramic element.   2. The method of manufacturing a ceramic electronic component according to claim 1, wherein the treatment that causes the adhesion and adsorption of moisture is a wet barrel polishing treatment in which the ceramic element is put in a barrel and polished in the presence of water. 3. .   2. The process according to claim 1, wherein the treatment that causes the adhesion and adsorption of moisture is a wet plating process in which a plating film is formed on a surface of the external electrode after the external electrode is formed on the ceramic element. Manufacturing method of ceramic electronic components.   4. The ceramic element according to claim 1, wherein the ceramic element is a laminated ceramic element having a laminated structure in which a plurality of internal electrodes are provided via a ceramic layer. 5. Manufacturing method of ceramic electronic components.   5. The method according to claim 4, wherein the step of removing moisture from the ceramic element is performed before the moisture reaches an effective portion of the internal electrode after the treatment that causes adhesion and adsorption of the moisture is performed. Manufacturing method of ceramic electronic components.

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