JP2005079055A - Manufacturing device of connection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a connection device capable of properly three-dimensionally forming a contact with a simple method as compared with, in particular, a conventional one. <P>SOLUTION: In this application, the contacts are formed by using a so-called LIGA process. In the application, by using a substrate 30 with a plurality recessed line parts 31 formed on a surface, and by using the LIGA process, the contacts are plated and formed on the substrate. Thereby, the application can obviate the need of a forming process for individually forming each contact into a three-dimensional shape after forming the contact like a conventional one. By using the LIGA process, form patterns 32a of the contacts are accurately formed on a resist layer 32 even if the thickness of the resist layer 32 is large or uneven, whereby each contact is formed into a predetermined shape. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a connection device that is an IC socket to which, for example, an IC (integrated circuit) or the like is mounted, and in particular, a contact mounted in the connection device can be easily and appropriately three-dimensionally formed. The present invention relates to a method for manufacturing a connecting device.

  The semiconductor inspection apparatus described in Patent Document 1 electrically temporarily connects a semiconductor to an external circuit board or the like. A large number of spherical contacts arranged in a lattice shape or a matrix shape are provided on the back side of the semiconductor, and a large number of concave portions are provided on an insulating substrate opposite to the spherical contacts, and spiral contacts are provided in the concave portions. Opposed.

When the back side of the semiconductor is pressed toward the insulating substrate, the spiral contact contacts the outer surface of the spherical contact so that the spiral contact wraps spirally. The electrical connection between the two is ensured.
JP 2002-175859 A

  By the way, in Patent Document 1, referring to FIG. 2 and the like published in the patent gazette, the spiral contact 2 is formed in a plane and is not subjected to solid forming. However, it is preferable that the spiral contactor 2 is three-dimensionally formed to some extent because the electrical connection with the spherical connection terminal 7 can be made good and reliable.

  For example, FIG. 17 is a process diagram for explaining a conventional three-dimensional forming method.

  Reference numeral 50 shown in FIG. 17A denotes a substrate. A plurality of spiral contacts 51 are formed on the substrate 50. The right view shown in FIG. 17A is a plan view, and the hatched portion shows the spiral contact 51.

  17B, after positioning the guide frame 52 so that the hole 52a provided in the guide frame 52 just faces each spiral contact 51, the guide frame 52 is positioned between the spiral contacts 51. Paste to. The left view of FIG. 17B shows the planar shape of the guide frame 52.

  Next, in the step of FIG. 17C, the substrate 50 is removed using a method such as etching. Each spiral contact 51 is connected by the guide frame 52.

  Next, in the process of FIG. 17D, the spiral contact 51 is bonded and fixed to the base 53 in which the recess 53a is formed just at the position facing the spiral contact 51 using a conductive adhesive 54 or the like.

In step 17E, the spiral contact 51 is three-dimensionally formed.
In the step of FIG. 17E, the protrusion adjusting member 70 is passed through the recess 53a from below, and the contact piece 51a for each turn of each spiral contact 51 is protruded upward.

  However, in the process shown in FIG. 17E, the protrusion adjusting member 70 must be prepared separately and a solid forming process must be provided.

  Further, when adjusting the protrusion amount of the contact piece 51a by the separately prepared protrusion adjusting member 70, it is difficult to adjust all the spiral contact elements 51 to the same protrusion amount. Tends to fall apart.

  Accordingly, the present invention is to solve the above-described conventional problems, and in particular, to provide a method for manufacturing a connecting device capable of appropriately three-dimensionally forming a contact by a simpler method than in the past. It is said.

The present invention has a base and a plurality of contacts provided on the base, and a plurality of external connection portions of the electronic component contact with the contacts, respectively.
(A) forming a substrate having a plurality of convex strips or concave strips formed on the surface;
(B) forming a resist layer on the surface of the substrate and the convex strip or the concave strip;
(C) irradiating the resist layer with X-rays to form a predetermined pattern of the contact on the resist layer;
(D) The contact is plated in the predetermined pattern, and the contact formed by plating on the convex strip or the concave strip is three-dimensionally formed;
(E) removing the resist layer;
(F) removing the substrate and bonding the plurality of contacts to the base;
It is characterized by having.

  In the present invention, the contact is formed using a so-called LIGA (Lithographie Galvanofomung Abfomung) process.

  By the way, in the present invention, a substrate having a plurality of convex strips or concave strips formed on the surface as in the step (a) is used, and the LIGA process is used on the substrate after the step (b). Then, the three-dimensional contact is plated.

  Therefore, in the present invention, unlike the conventional method, after forming the contact, there is no need to form the contact separately in a three-dimensional shape, and the process can be simplified.

  Moreover, by using the LIGA process, even if the resist layer in step (b) is thick or not uniform, the shape pattern of the contact can be formed on the resist layer with high accuracy. Therefore, it is possible to form the contact in a predetermined shape.

  In the present invention, it is preferable that, in the step (b), the resist layer is formed with a thickness of 50 μm or more and 100 μm or less and a maximum patterning aspect ratio of 1 or more.

  In the present invention, as in the step (a), a plurality of convex strips or concave strips are formed from the surface of the substrate. For this reason, when the resist layer in the step (b) is formed with a thin film thickness by, for example, spin coating or the like, the resist layer is not effectively placed on the convex strip or the like, and on the convex strip or the like. In order to make it difficult to form a contact shape pattern, the lower limit of the film thickness of the resist layer was set to 50 μm.

  Further, in the present invention, since the LIGA process is used, even if the X-ray in the step (c) has such a thick resist thickness, the shape pattern of the contact can be accurately formed on the resist layer. Is possible. If the resist layer becomes too thick, for example, the X-ray irradiation time must be lengthened, resulting in no practical irradiation cost and a significant reduction in development yield. The upper limit was 100 μm.

  In addition, in order to form a fine pattern with a large plating film thickness by a combination of photolithography technology and plating technology, it is necessary to make the groove width between resist layers fine, and a high aspect ratio is required. Therefore, the maximum aspect ratio of patterning is set to 1 or more.

  In the present invention, in the step (b), it is preferable that after the resist layer is formed, the surface of the resist layer is planarized. By performing this flattening process, there is no resist portion having an extremely thick film thickness, and the contact property with the X-ray mask is improved, so that the shape pattern of the contact is formed with high accuracy in the entire region of the resist layer. I can do it.

  Moreover, in this invention, before removing the said board | substrate at the said (f) process, it is preferable to connect between the edge parts of the said adjacent contactor with a joining member, and to remove the said board | substrate after that.

  In the present invention, the contact is preferably formed in a spiral shape, and at this time, the contact is preferably three-dimensionally shaped so as to protrude or dent toward the center. This makes it possible to reliably contact the external connection portion with the contact regardless of the shape of the external connection portion (the counterpart side) of the electronic component.

  If the manufacturing method of a contact in the present invention is used, it is not necessary to form a solid forming process after forming the contact in a planar manner as in the prior art, and the formation of the contact can be performed at the same time as a three-dimensional forming, thus simplifying the process. Can be achieved.

  Particularly in the present invention, since the contact is three-dimensionally formed using a LIGA process, the contact can be formed with high accuracy.

  In addition, since a plurality of contacts can be three-dimensionally formed at the same time using a plurality of concave strips or convex strips formed on the substrate, the amount of depression or protrusion of each contact can be easily and appropriately uniformized. it can.

  1 is a perspective view showing an inspection apparatus used in a test for confirming the operation of an electronic component, and FIG. 2 is a sectional view taken along line 2-2 of FIG. is there.

  As shown in FIG. 1, the inspection apparatus 10 includes a base 11 and a lid 12 that is rotatably supported via a hinge 13 provided on one edge of the base 11. ing. The base 11 and the lid body 12 are formed of an insulating resin material or the like, and a loading region 11A that is concave in the Z2 direction is formed at the center of the base 11. An electronic component 1 such as a semiconductor can be mounted in the loading area 11A. A locked portion 14 is formed on the other edge of the base 11.

  As shown in FIG. 2, this inspection apparatus 10 is an inspection object in which a large number of spherical contacts (external connection parts) 1a are arranged in a matrix (lattice or grid) on the lower surface of the electronic component 1. It is what.

  As shown in FIG. 2, the loading area 11 </ b> A has a predetermined diameter, and a plurality of recesses (through holes) 11 a penetrating from the front surface of the loading area 11 </ b> A to the back surface of the base 11 have a spherical shape of the electronic component 1. It is provided corresponding to the contact 1a.

  A plurality of spiral contacts 20 in which the contacts are formed in a spiral shape are provided on the upper surface of the recess 11a (the surface of the loading region 11A).

  FIG. 3 is a perspective view of the spiral contact 20. As shown in FIG. 3, a plurality of the spiral contacts 20 are formed on the base 11 with predetermined intervals in the X direction and the Y direction shown in the figure.

  As shown in FIG. 3, each spiral contact 20 has a base 21 fixed to the edge of the open end above the recess 11a, and the winding start end 22 of the spiral contact 20 is provided on the base 21 side. It has been. A winding end 23 extending spirally from the winding start end 22 is positioned at the center of the recess 11a.

  A conductive portion (not shown) is formed on the inner wall surface of the concave portion 11a, and the upper end of the conductive portion and the base portion 21 of the spiral contactor 20 are connected by a conductive adhesive or the like. The opening end below the recess 11a is closed by a connection terminal 18 connected to the conducting portion.

  As shown in FIG. 2, a printed circuit board 29 having a plurality of wiring patterns and other circuit components is provided below the base 11, and the base 11 is fixed on the printed board 29. . On the surface of the printed circuit board 29, there are provided counter electrodes 28 facing the connection terminals 18 provided on the bottom surface of the base 11, and each of the connection terminals 18 comes into contact with each of the counter electrodes 28. The electronic component 1 and the printed circuit board 29 are electrically connected via the inspection device 10.

  On the other hand, at the center position of the inner surface of the lid 12 of the inspection apparatus 10, a convex pressing portion 12a that presses the electronic component 1 downward in the figure is provided so as to face the loading area 11A. Further, a lock portion 15 is formed at a position on the opposite side to the hinge portion 13.

  Between the inner surface of the lid body 12 and the pressing portion 12a, a biasing member made of a coil spring or the like that biases the pressing portion 12a away from the inner surface of the lid body 12 is provided (not shown). . Accordingly, when the electronic component 1 is mounted in the recess 11a and the lid 12 is closed and locked, the electronic component 1 can be elastically pressed in the direction approaching the surface of the loading region 11A (Z2 direction). ing.

  The size of the loading area 11A of the base 11 is substantially the same as the outer shape of the electronic component 1, and when the electronic component 1 is mounted on the loading area 11A and the lid 12 is locked, the electronic component 1 side Each spherical contact 1a and each spiral contact 20 on the inspection apparatus 10 side can be positioned accurately in correspondence with each other.

  When the lock part 15 of the lid 12 is locked to the locked part 14 of the base 11, the electronic component 1 is pressed downward in the figure by the pressing part 12 a, so that each spherical contact 1 a becomes each spiral contact 20. Is pushed downward in the recess 11a (downward in the figure). At the same time, the outer shape of the spiral contact 20 is deformed so as to be expanded from the winding end 23 toward the winding start end 22 (outward from the center of the spiral), and is wound so as to embrace the outer surface of the spherical contact 1a. Each spherical contact 1a and each spiral contact 20 are connected.

  FIG. 4 is a partially enlarged cross-sectional view of the spiral contact 20 shown in FIG.

  As shown in FIG. 3 and FIG. 4, the contact piece 20a for each turn constituting the spiral contact 20 is obliquely upward (Z1 direction in the drawing) from the winding start end 22 to the winding end 23 direction like a spiral staircase. ) Incline toward. Therefore, in FIGS. 3 and 4, each spiral contact 20 is configured as a mountain-shaped three-dimensional shape with its winding end 23 protruding highest.

  Unlike FIGS. 3 and 4, each contact piece 20 a constituting the spiral contact 20 has the winding start end 22 as shown in FIG. 5 (FIG. 5 is a partially enlarged sectional view of the spiral contact 20). To a winding end 23 direction, and may be three-dimensionally molded into a valley shape that gradually dents downward (Z2 direction in the drawing).

  Below, the method of the three-dimensional shaping | molding of the spiral contactor 20 shown in FIG. 3 thru | or FIG. 5 is demonstrated. First, a method for forming the spiral contact 20 three-dimensionally formed into a valley shape shown in FIG. 5 will be described below.

  Reference numeral 30 shown in FIG. 6 is a substrate. As shown in FIG. 6, a plurality of concave strips 31 are provided on the surface 30a of the substrate 30 (in FIG. 6, the reference numerals are given to only two concave strips, and the reference to other concave strips is omitted). Is formed. As shown in FIG. 6, the convex strips 31 are regularly formed with predetermined intervals in the width direction (X direction in the drawing) and the length direction (Y direction in the drawing) of the substrate 30.

  In the present invention, the substrate 30 shown in FIG. 6 is formed by electroforming or forging. Thereby, the plurality of concave strips 31 can be easily and uniformly formed on the substrate 30 shown in FIG.

  Moreover, as shown in FIG. 6, it is preferable to form the said recessed strip part 31 by a cone shape. If the concave strip 31 is formed in a conical shape, the valley-shaped spiral contact 20 as described with reference to FIG. 5 can be formed easily and appropriately.

  FIG. 7 is a partial enlarged cross-sectional view in which only a part of the substrate 30 shown in FIG. 6 is enlarged. As shown in FIG. 7, a resist layer 32 is formed over the surface 30 a of the substrate 30 and the concave strip portion 31.

  Here, the resist layer 32 can be formed by spin coating, spray coating, or the like, but the resist layer 32 may be formed by electrodeposition. In the spin coating or spray coating, when there is a recessed portion in the substrate 30 as shown in FIG. 7, the resist layer 32 cannot be formed with a uniform film thickness.

  On the other hand, in the electrodeposition, the resist layer 32 is easily formed to have a uniform thickness. However, in order to form a resist by electrodeposition, it is necessary to use an electrodeposition resist as the resist layer and to perform electrodeposition of the resist layer using equipment similar to plating. Therefore, there are concerns about the complexity and cost of the manufacturing process.

  Further, according to electrodeposition, the resist layer can be formed with a uniform film thickness even with a thin film thickness (for example, several tens of μm). However, in the present invention, the spiral contact 20 is formed using a LIGA process as described later. Since the plating is formed, the spiral contact 20 can be pattern-formed with high accuracy even when the resist layer is formed with a thickness of several hundreds of μm and the thickness of the resist layer is not uniform.

  Therefore, in the step of FIG. 7, the resist layer 32 is formed by, for example, spin coating or spray coating. At this time, the resist layer 32 is formed to have a thickness of about several hundred μm, and the surface 30 a of the substrate 30 and the concave strip portion 31 are appropriately covered with the resist layer 32.

  Further, as shown in FIG. 7, the surface of the resist layer 32 may be ground to the position indicated by the alternate long and short dash line, and the surface of the resist layer 32 may be planarized. For the planarization process, for example, a grinding process using a CMP technique is used.

  By planarizing the surface of the resist layer 32, a portion where the film thickness of the resist layer 32 becomes extremely thick can be eliminated, and the resist layer 32 can be contained within a predetermined range.

  In the present invention, the thickness of the resist layer 32 is preferably in the range of 50 μm to 100 μm. However, the planarization process on the resist layer 32 is not necessarily a necessary process. When the resist layer 32 shown in FIG. 7 is formed, if the thickness of the resist layer is already within the range of 50 μm to 100 μm, the planarization process may not be performed.

  Next, in the step of FIG. 8, X-ray lithography corresponding to one step of a LIGA (Lithographie Galvanofomung Abfomung) process is performed.

  As shown in FIG. 8, a mask 33 is disposed on the resist layer 32. The mask 33 has an X-ray transmission region (region through which X-rays) 33a and an X-ray absorption region (region through which X-rays do not pass) 33b. The planar shape of the X-ray transmission region 33a is the spiral. This matches the planar shape of the contact 20.

  The material of the X-ray transmission region 33a is beryllium, for example, and the X-ray absorption region 33b is provided with a layer made of an X-ray absorption material such as Au or W on the surface and the lower surface thereof, or the X-ray absorption region 33b. The entire absorption region 33b is formed of Au, W, or the like.

  In the X-ray lithography in the step of FIG. 8, it is preferable to use X-rays generated from a synchrotron radiation (SR) optical device having high straightness.

  When the synchrotron radiation X-ray passes through the X-ray transmission region 33a of the mask 33 and is irradiated onto the resist layer 32, the polymer chain is broken in the irradiated resist layer 32. , The molecular weight is reduced. The portion irradiated with X-rays is dissolved by the developer, and a pattern 32 a having the same shape as the spiral contact 20 is formed on the resist layer 32.

  In the present invention, the reason why the shape pattern 32a of the spiral contact 20 is formed on the resist layer 32 by using X-ray lithography is that the shape pattern 32a can be formed with high accuracy and easily.

  For example, in the UV photolithography technique, the resist layer 32 needs to be thin and uniform. This is because of the light source wavelength and the depth of focus. If the resist layer 32 becomes too thick, the resist layer 32 is not effectively exposed to the lower surface side. If it is a film thickness, the depth of focus differs at each location, and thus there is a problem that a highly accurate pattern cannot be formed.

  The above-described problem is conspicuous if the substrate surface is not a flattened surface, such as a plurality of concave strips 31 formed on the surface 30a of the substrate 30 as in the present invention. Therefore, in the present invention, if a method such as UV photolithography, in which a precise pattern cannot be formed unless the resist layer 32 is formed with high precision, it is difficult to form a spiral contact of a predetermined shape and the manufacturing process becomes complicated. Problems occur.

  On the other hand, if X-ray lithography by the LIGA process is used, even if the resist layer 32 has a thick film thickness or is not uniform, the resist layer 32 is irradiated with synchrotron radiation X-ray having high intensity. In addition, the pattern 32a can be formed with high accuracy.

  As described above, in the present invention, the resist layer 32 is formed in the range of 50 μm to 100 μm. If the resist layer 32 becomes too thick, for example, the X-ray irradiation time must be lengthened. As a result, the irradiation cost is not practical and the development yield is greatly reduced. Is set to 100 μm.

  Further, in order to form a fine pattern with a thick plating film thickness by a combination of photolithography technology and plating technology, it is necessary to make the groove width between the resist layers 32 fine, and a high aspect ratio (B / A) is required. Here, as shown in FIG. 8, the aspect ratio is defined as B / A where B is divided by A when the film thickness of the resist layer 32 is expressed by dimension B and the minimum space width of the resist pattern is expressed by dimension A. . In the present invention, the maximum patterning aspect ratio is 1 or more.

  In the next step shown in FIG. 9, a metal layer 34 constituting the spiral contact 20 is formed by plating in the pattern 32a. The metal layer 34 is, for example, a single layer made of any one of Cu, Au, Ag, Pd, Ni, or Ni—X (where X is one or more of P, W, Mn, Ti, and Be), Or it forms with the multilayered structure selected 2 or more types. When the metal layer 34 has a multilayer structure, a conductive member selected from Cu, Au, Ag or Pd having excellent conductivity, and Ni or Ni-X having excellent spring properties (where X is , P, W, Mn, Ti, or Be) is preferably a laminated structure with an auxiliary elastic member selected from any one of them.

  When the substrate 30 is a conductive substrate for plating the metal layer 34, the metal layer 34 can be directly plated on the substrate 30, but the substrate 30 is conductive. If the substrate is not a conductive substrate, it is necessary to provide a plating base layer made of a conductive material on the substrate 30 before forming the resist layer 32 in the step of FIG.

After the contactor 51 is formed as in the conventional step of FIG. 17E by plating the metal layer 34 on the concave strip 31 provided in advance on the surface 30a of the substrate 30 as in the step of FIG. Even if solid forming is not performed, the metal layer 34 can be formed into a three-dimensional shape at the same time as the plating. Therefore, in the present invention, the conventional process of FIG. 17E can be deleted.
Then, the resist layer 32 is removed.

  By the way, the metal layer 34 constitutes a plurality of spiral contacts 20, and in the state in which the metal layer 34 is formed by plating in the step of FIG. It is in a state that is not connected at all. For this reason, when the substrate 30 is removed, the spiral contacts 20 are separated. Therefore, before the substrate 30 is removed, the base 21 (see FIG. 3) of each spiral contact 20 is removed as shown in FIG. It is preferable that a guide frame (joining member) 36 formed of polyimide or the like is pasted between the base portions 21 and the base frame 21 is connected by the guide frame 36.

  After the contacts 20 made of the metal layer 34 are connected by the guide frame 36, the substrate 30 is removed.

  In the step of FIG. 11, a recess 11a is formed at a position just facing the spiral contact 20, and the inner wall surface 11a1 of the recess 11a is plated, for example, and the base 21 of the spiral contact 20 faces. The base 11 on which the anisotropic conductive adhesive 46 is applied between the peripheral edge above the concave portion 11a and the adjacent peripheral edges is used, and the base 21 of the spiral contact 20 is attached to the base 11 in the anisotropic direction. Adhesive fixing is performed through a conductive conductive adhesive 46.

  The process shown in FIGS. 12 to 16 is a manufacturing method in which the spiral contactor 20 is three-dimensionally formed into a mountain shape.

  As shown in FIG. 12, a convex strip 41 is formed on the surface 40 a of the substrate 40. Similar to the concave strip 31 shown in FIG. 6, a plurality of the convex strips 41 are formed at predetermined intervals in the width direction (X direction) and the length direction (Y direction in the drawing) of the substrate 40. .

  In the step of FIG. 12, a resist layer 42 is formed on the surface 40a of the substrate 40 and the convex strip 41 by, for example, spin coating. The film thickness of the resist layer 42 is not less than 50 μm and not more than 100 μm. In addition, as shown in FIG. 12, the surface of the resist layer 42 may be scraped to the alternate long and short dash line to perform a flattening process. For the planarization, a grinding method using a CMP technique is used.

  As described in the process of FIG. 7, this planarization process is not necessarily a necessary process. However, in the form in which a plurality of convex strips 41 are formed from the surface 40a of the substrate 40, the film thickness of the resist layer 42 on the upper surface of the convex strip 41 tends to be thin, and Therefore, the resist layer 42 tends to be thick as a whole.

  For this reason, the film thickness of the resist layer 42 is likely to be uneven, and the contact property with the X-ray mask is poor.

  The step of FIG. 13 is the same as the step of FIG. That is, the shape pattern 42a of the spiral contact 20 is formed on the resist layer 42 by X-ray lithography. At this time, the maximum aspect ratio of patterning is formed to be 1 or more. The definition of the aspect ratio is the same as in FIG. 8, so please refer to that.

  The step of FIG. 14 is the same as the step of FIG. That is, the metal layer 43 constituting the spiral contact 20 is formed by plating in the shape pattern 42a.

The process in FIG. 15 is the same as the process in FIG. That is, a guide frame (joining member) 36 made of polyimide or the like is attached between the base portions 21 of the spiral contacts 20, and the base portions 21 are connected by the guide frame 36.
Thereafter, the substrate 30 is removed.

  In the step of FIG. 16, as in the step of FIG. 11, the concave portion 11 a is formed just at the position facing the spiral contact 20, and the inner wall surface 11 a 1 of the concave portion 11 a is plated, for example, and the spiral contact 20 The base 11 on which the anisotropic conductive adhesive 46 is applied between the peripheral edge on the upper side of the concave portion 11a and the adjacent peripheral edge facing the base 21 is used, and the spiral contact 20 is attached to the base 11. The base 21 is bonded and fixed via the anisotropic conductive adhesive 46.

  In the above description, the manufacturing method of the spiral contact 20 which is three-dimensionally formed in a spiral shape from the winding start end 22 to the winding end 23 shown in FIGS. 3 to 5 has been described. It is not limited to the spiral shape.

  If the manufacturing method of the spiral contactor 20 according to the present invention is used, the three-dimensional forming process performed after the spiral contactor 20 is formed planarly is not required as in the prior art. It can be molded and the process can be simplified.

  In particular, in the present invention, since the spiral contact 20 is three-dimensionally formed using the LIGA process, the spiral contact 20 can be formed with high accuracy.

  In the manufacturing method described above, since the plurality of spiral contacts 20 can be simultaneously three-dimensionally formed using the plurality of concave strips 31 or the convex strips 41 formed on the substrates 30 and 40, each spiral contact 20 The amount of dents or protrusions can be made uniform easily and appropriately.

  7 to 10, the spiral contact 20 is formed as a three-dimensionally shaped valley, but when the contact 20 is turned upside down, the contact 20 has a mountain shape as in FIG. 4. Therefore, as shown in FIGS. 3 and 4, when forming the mountain-shaped spiral contact 20 that gradually protrudes upward from the winding start end 22 to the winding end end 23, in the steps of FIGS. Of course, the spiral contact 20 may be formed and turned upside down to be used as the mountain-shaped spiral contact 20.

The perspective view which shows the test | inspection apparatus used for the test for confirming operation | movement of an electronic component, 1 is a cross-sectional view taken along line 2-2 of FIG. An enlarged perspective view showing the shape of the spiral contact in the present invention, The partial expanded sectional view of the spiral contactor cut | disconnected from 4-4 line shown in FIG. The partial expanded sectional view of the spiral contactor of the form different from FIG. The perspective view of the board | substrate used for manufacture of the contactor of this invention, 1 process figure which shows the manufacturing method of the contactor in this invention, FIG. 7 is a process diagram to be performed next to FIG. 8 is a process diagram performed next to FIG. FIG. 9 is a process diagram performed next to FIG. FIG. 10 is a process diagram performed next to FIG. 7 is a process diagram for explaining a manufacturing method different from the processes in FIGS. FIG. 12 is a process diagram performed next to FIG. FIG. 13 is a process diagram performed next to FIG. FIG. 14 is a process diagram to be performed next to FIG. FIG. 15 is a process diagram that is performed next to FIG. A series of process diagrams for showing a conventional method of manufacturing a connection device,

Explanation of symbols

1 Electronic component 1a Spherical contact (external connection)
DESCRIPTION OF SYMBOLS 10 Connection apparatus 11 Base 20 Spiral contact 20a Contact piece 21 Base 22 Winding start end 23 Winding end 30, 40 Substrate 31 Concave strip 32, 42 Resist layer 33 Mask 32a, 42a Pattern 34 Metal layer 36 Guide frame 41 Convex type Section

Claims (6)

In a manufacturing method of a connection device having a base and a plurality of contacts provided on the base, wherein a plurality of external connection portions of electronic components are in contact with the contacts, respectively.
(A) forming a substrate having a plurality of convex strips or concave strips formed on the surface;
(B) forming a resist layer on the surface of the substrate and the convex strip or the concave strip;
(C) irradiating the resist layer with X-rays to form a predetermined pattern of the contact on the resist layer;
(D) The contact is plated in the predetermined pattern, and the contact formed by plating on the convex strip or the concave strip is three-dimensionally formed;
(E) removing the resist layer;
(F) removing the substrate and bonding the plurality of contacts to the base;
A method for manufacturing a connection device, comprising:   2. The method of manufacturing a connection device according to claim 1, wherein in the step (b), the film thickness of the resist layer is 50 μm or more and 100 μm or less and the maximum patterning aspect ratio is 1 or more.   3. The method for manufacturing a connection device according to claim 1, wherein, in the step (b), after the resist layer is formed, the surface of the resist layer is planarized.   The connection according to any one of claims 1 to 3, wherein, in the step (f), before the substrate is removed, the end portions of the adjacent contacts are connected by a joining member, and then the substrate is removed. Device manufacturing method.   The method of manufacturing a connection device according to claim 1, wherein the contact is formed in a spiral shape.   The method of manufacturing a connection device according to claim 5, wherein the contact is three-dimensionally molded so as to protrude or dent toward the center.

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