JP2005075367A - Packaging body for epoxy resin molding material for sealing semiconductor and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a packaged epoxy resin molding material from absorbing moisture, to facilitate taking out and handling of the molding material when molding is performed after returning it to a normal temperature, and to decrease inferiority of molding, inferiority of continuity and cracking at high temperature of a semiconductor device sealed by using this molding material. <P>SOLUTION: A packaging body comprises a packaging bag made of a plastic film for packaging which is made into a bag by sealing processing, and the epoxy resin molding material for sealing the semiconductor stored in the packaging bag. In this packaging body for the epoxy resin molding material for sealing the semiconductor, at least one of a notch and a ripple cut is formed from an end part of the packaging bag toward a sealing region for bag manufacturing, or in the sealing region. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a packaging body of an epoxy resin molding material for semiconductor encapsulation, and particularly a packaging body that facilitates handling of the epoxy resin molding material and prevents moisture absorption, and a semiconductor device sealed using the packaging body It is about.

  Resin sealing using a thermosetting resin has become widespread for the purpose of protecting semiconductor elements such as transistors, capacitors, ICs, and LSIs from the external environment. In particular, a transfer molding method using an epoxy resin as a sealing resin is excellent in economic efficiency, has high productivity and is suitable for mass production, and has become the mainstream of resin sealing.

  The manufacturing method of the epoxy resin molding material for semiconductor sealing used for resin sealing is powdery such as epoxy resin, curing agent, inorganic filler, mold release agent, flame retardant aid, curing accelerator and colorant. A predetermined amount of various raw materials are weighed, mixed using a Henschel mixer or a Redige mixer, etc., then kneaded by a heating roll, continuous kneader or extruder, cooled into a sheet, and pulverized to obtain a so-called powdery powder. Further, the powder is generally formed into a product by tableting into a cylindrical epoxy resin molding material tablet (hereinafter referred to as a tablet) having a weight and size according to a customer's request (for example, non-patent document). 1).

  The epoxy resin molding material produced in this way is put into a metal can or cardboard box with a bag made of plastic film for packaging such as polyethylene, and a predetermined amount of powder or tablet is put into it. The bag is sealed by a method such as vinyl tape or adhesive, heat sealing, etc., and a desiccant for preventing moisture absorption of the epoxy resin molding material, a label for identifying the product, and the like are packaged. After this, the life of the epoxy resin molding material, that is, by leaving the epoxy resin molding material for semiconductor encapsulation at room temperature, the curing reaction is prevented from proceeding slowly to prevent deterioration of various properties such as fluidity and curability. Therefore, it is generally stored in a low temperature warehouse or the like of 5 ° C. or lower, and is handled while maintaining a low temperature state during transportation.

After being delivered to the customer, the epoxy resin molding material for semiconductor encapsulation shipped according to the customer's requirements is delivered from the low-temperature warehouse according to the time of use, and left in the work room for a predetermined time. After the temperature is raised to room temperature, the polyethylene bag or the like is opened and taken out and supplied to a molding machine to be used for molding a semiconductor package.
"Powder compression molding technology" Chapter 5 5.2 Compression molding in the field of electronic materials Pages 231 to 235 Nikkan Kogyo Shimbun 1998

  Here, the process of raising the temperature from the low temperature state during storage / transport to the same level as the room temperature is called so-called room temperature return. The surface of the polyethylene bag or the like may reach the dew point of the ambient air, and condensation may occur on the surface of the polyethylene bag or the like. At this time, if the polyethylene bag is torn, it leads to moisture absorption of the packaged tablet or powder. Since the absorbed tablet is exposed to a high temperature of 200 ° C. or higher in the molding process, the absorbed moisture becomes water vapor, which causes fatal characteristic deterioration such as package destruction. Even if the polyethylene bag or the like is not torn, if the moisture permeability of the packaging film is large, the packaged tablet may absorb moisture, which will affect the semiconductor package.

Also, when taking out the tablet after returning to normal temperature from the packaged polyethylene bag, manually remove the rubber band or vinyl tape that was closing the bag and open it, or use an adhesive or heat-sealed sealing bag. It is necessary to make an incision using a scissors or a cutter knife. However, there is a risk that a piece of rubber band, vinyl tape, or a polyethylene bag that has been cut off will be mixed into the tablet, or that a bag or cutter knife may spill. There are major problems such as the inclusion of foreign matters such as rubber bands causing the operation of the molding machine to stop and the defective molding of the semiconductor package, and the inclusion of metallic foreign matters causes the conduction failure of the semiconductor package.
Therefore, an object of the present invention is to provide a package that prevents moisture absorption of the packaged epoxy resin molding material for semiconductor encapsulation and facilitates taking out and handling of tablets after returning to room temperature.

The package of the epoxy resin molding material for semiconductor encapsulation of the present invention is made to solve the above-mentioned problems, and is a packaging bag made of plastic film for packaging made by a sealing process, and the packaging bag. A packaging body made of an epoxy resin molding material for semiconductor sealing housed in the packaging bag, from the end of the packaging bag toward the sealing area for bag making, or in the sealing area, at least notch and wave cut One is formed.
And it is preferable that the epoxy resin molding material for semiconductor sealing is a tablet shape or a granular material shape.
The packaging plastic film is preferably a single layer or a laminate, and at least one layer is preferably made of high-density polyethylene.
Furthermore, it is preferable that the packaging plastic film is a stretched film, and the stretch directionality and the direction of notch or wave cut are matched.

  The semiconductor device of the present invention is characterized in that the element is sealed with an epoxy resin molding material for semiconductor sealing obtained by opening the package of the present invention.

  The package of the present invention prevents moisture absorption to the packaged epoxy resin molding material for semiconductor encapsulation, and facilitates taking out and handling of the molding material during molding after returning to room temperature. In addition, the semiconductor device of the present invention sealed with this molding material reduces mold defects, poor conduction, and cracks at high temperatures.

The present invention is described in detail below.
FIG. 1 is a schematic diagram showing an example of an embodiment of the package of the present invention, and FIG. 2 is a schematic diagram showing an example of a conventional package. As shown in FIG. 2, conventionally, as a packaging bag made of packaging plastic film, a predetermined amount of tablet 2 made of an epoxy resin molding material for semiconductor sealing is placed in a packaging plastic bag 1 made of polyethylene or other packaging plastic film. After throwing in, it was sealed with rubber band 3, vinyl tape or heat seal. In the present invention, as shown in FIG. 1, as a packaging bag, a part of one side of a seal region 4 subjected to a sealing process when a packaging plastic film is made has an I notch 11 or a V notch, or a wave pattern. The plastic bag 1 for packaging which gave the location which becomes a cut | interruption, such as a cut, is used. Either notch or wave cut may be used in combination. As a result, the packaging plastic bag 1 can be easily broken manually. As a result, it is not necessary to open the conventional rubber band 3 or vinyl tape by manually removing it, or to cut and open the bag by using a bag or a cutter knife. In addition, the time required for opening the bag can be significantly reduced.

In FIG. 1, the notch 11 is formed in a seal region on the side that becomes the bottom when the tablet 2 of the packaging plastic bag 1 (packaging bag) is stored. You may form in the edge of an upper end. In addition, when a long cylindrical plastic film for packaging is continuously stored and sealed, and then cut into individual packaging bodies, notches and corrugated cuts are formed instead of normal straight lines. It may be set in a curved shape as described. Further, in FIG. 1, the seal region 4 is only the upper and lower ends of the packaging bag, but there may be a bag-making seal region vertically in order to form a rectangular packaging plastic film into a cylindrical shape.
Further, the notch or corrugated cut is formed from the end portion toward the sealing region when the sealing region 4 does not include the end portion of the packaging bag, and may or may not include the inside of the sealing region. It is preferable to include it for ease.

On the other hand, the low-density polyethylene bag that has been conventionally used for packaging an epoxy resin for semiconductor encapsulation has not always been effective in preventing moisture absorption of the epoxy resin molding material. According to the literature, the moisture permeability of low-density polyethylene is 16 to 22 g / m ² · day, but the moisture permeability of high-density polyethylene is 5 to 10 g / m ² · day, which is higher than that of low-density polyethylene film. It can be seen that the humidity is 1/2 to 1/3. Therefore, in the present invention, the packaging plastic film is preferably a single layer or a laminate, and at least one layer is preferably made of high-density polyethylene having a low moisture permeability.

  In addition, plastic films such as high-density polyethylene can be stretched to improve film properties. For example, mechanical strength is improved 2 to 3 times, impact resistance is 30 to 40 times, and moisture resistance is improved 2 times. It becomes possible to give directionality by stretching. By aligning the direction of the notch or wave cut so as to match this directionality, the bag can be opened more easily.

The packaging plastic film used in the present invention is not particularly limited, and a general plastic film can be used as a single layer or a laminate depending on the application. The most common plastic film for packaging is a polyethylene film, and a high-density polyethylene film is particularly preferred from the viewpoint of the above-mentioned characteristics. From the viewpoint of moisture permeability, strength, heat sealability, etc., it is preferable to select one having a thickness of about 0.05 to 0.3 mm.
From the viewpoint of preventing moisture absorption, the amount of moisture permeation of the film itself can be reduced by selecting a plastic film such as stretched polypropylene, nylon or polyethylene terephthalate, which is effective for preventing moisture absorption of the epoxy resin molding material.
In order to further prevent moisture absorption, it is possible to use a film laminated with aluminum or a polyethylene film subjected to a shirrer. In general, films with low moisture permeability such as polyester are often expensive. Especially, a multilayer film using a material such as polyethylene as the surface layer can be economical and prevent moisture absorption, and heat sealing is also possible. There is an advantage to become.

  Multi-layer packaging plastic film including high-density polyethylene film layer can be produced by co-extrusion with materials such as low-density polyethylene, medium-density polyethylene, linear low-density polyethylene, polypropylene, nylon, etc. What is necessary is just to use the packaging bag made from the plastic film for packaging which consists of these according to a use or cost.

  The heat sealing method is generally used for the sealing process for making a plastic film into a packaging bag, but in addition, an impulse sealing method, an ultrasonic sealing method, etc. can also be used, and it is appropriately selected depending on the material of the film. it can. Although the seal region 4 shown in the drawing is linear, it may be basically linear or planar, and is generally sealed in a wide linear shape of about 2 to 5 mm.

  The epoxy resin molding material for semiconductor encapsulation housed in the package of the present invention is a powdered material, such as powder, kneaded various powdered raw materials, cooled and pulverized, granular material with less fine powder, Or any of the tablet shape formed by tableting this may be sufficient, and the shape, weight, etc. are not ask | required.

The packaging material of the present invention as described above is stored, transported, returned to room temperature, and then opened and taken out. The epoxy resin molding material for semiconductor encapsulation is low in hygroscopicity and contains no foreign matter. By sealing the semiconductor element using this, a semiconductor device free from high temperature cracks, poor conduction, and poor mold can be obtained.
That is, the semiconductor device of the present invention is characterized in that an element is sealed with an epoxy resin molding material for semiconductor sealing obtained by opening the package of the present invention.
As a type of semiconductor device to which the package of the present invention can be applied, for example, a semiconductor element is fixed on a lead frame, and a terminal part and a lead part of an element such as a bonding pad are connected by wire bonding or bump, and then a transfer mold or the like General resin-sealed ICs such as DIP, QFP, SOP, SOJ, TSOP, TQFP, or BGA, CSP, COB modules, hybrid ICs, etc. encapsulated with the above, and elements mounted on these electronic components Examples include active elements such as semiconductor chips, transistors, diodes, and thyristors, and passive elements such as capacitors, resistors, and coils. As the sealing method, the transfer mold method is the most common, but methods such as injection molding, compression molding, and casting may be used.

  Hereinafter, the present invention will be described in detail using examples. A packaging bag made of a plastic film for packaging (hereinafter referred to as a packaging plastic bag) made of a low density polyethylene film (film thickness 0.12 mm) was used to package an epoxy resin for semiconductor encapsulation. This packaging plastic bag used was an I notch on one side of the sealed side opposite to the bag opening (see FIG. 1). A predetermined amount of an epoxy resin tablet for semiconductor sealing was weighed and charged, and the bag opening was sealed by heat sealing. Separately, the packaging plastic bag was sealed in the same manner except that a temperature and humidity meter was used instead of the tablet, and the change in temperature and humidity in the bag was measured.

  Co-extrusion was performed using high-density polyethylene as a core material and both sides thereof being sandwiched between low-density polyethylene, and further stretched to produce a plastic bag for packaging having a film thickness of 0.08 mm. The packaging plastic bag has a low-density polyethylene film thickness on the outside of the bag, a high-density polyethylene film thickness on the center, and an inner low-density polyethylene film thickness of about 0.024 mm, 0.032 mm, and 0.024 mm, respectively. I is notched. Using this packaging plastic bag, packaging of epoxy resin for semiconductor sealing was carried out. As in Example 1, a predetermined amount of the tablet was weighed and charged, and a sample in which the bag opening was sealed by heat sealing and a sample in which a thermohygrometer was sealed instead of the tablet were prepared.

  In the same way as above, high-density polyethylene is cored and both sides are sandwiched by low-density polyethylene, and coextrusion is performed. Further, a plastic bag for packaging with a film thickness of 0.06 mm is produced, and an epoxy resin for semiconductor encapsulation Packaging was carried out. This packaging plastic bag has a low density polyethylene film thickness on the outside of the bag, a high density polyethylene film thickness on the center, and an inner low density polyethylene film thickness of about 0.018 mm, 0.024 mm, and 0.018 mm, respectively. V notch was applied. Using this packaging plastic bag, packaging of epoxy resin for semiconductor sealing was carried out. In the same manner as in Example 1, a predetermined amount of a tablet was weighed and charged, and a sample sealed with heat sealing and a sample sealed with a thermohygrometer instead of the tablet were prepared.

  Co-extrusion was performed using high-density polyethylene as a core material and both sides thereof being sandwiched between low-density polyethylene, and further stretched to produce a plastic bag for packaging having a film thickness of 0.07 mm. The packaging plastic bag has a low density polyethylene film thickness on the outside of the bag, a high density polyethylene film thickness on the center, and an inner low density polyethylene film thickness of about 0.023 mm, 0.024 mm, and 0.023 mm, respectively. It has a notch. Using this packaging plastic bag, packaging of epoxy resin for semiconductor sealing was carried out. In the same manner as in Example 1, a predetermined amount of the tablet was weighed and put in, and a sample in which the bag opening was heat sealed and sealed, and a sample in which a thermohygrometer was sealed instead of the tablet were prepared.

A plastic bag for packaging having a film thickness of 0.06 mm was produced by coextrusion with low density polyethylene as the center and nylon on the outside and high density polyethylene on the inside and further stretching. This packaging plastic bag has a nylon film thickness on the outside of the bag, a central low-density polyethylene film thickness, and an inner high-density polyethylene film thickness of about 0.015 mm, 0.010 mm, and 0.035 mm, respectively. It is a thing that puts. Using this packaging plastic bag, packaging of epoxy resin for semiconductor sealing was carried out. Similarly to Example 1, a predetermined amount of the tablet was weighed and charged, and a sample in which the bag opening was sealed by heat sealing and a sample in which a thermo-hygrometer was sealed instead of the tablet were prepared.
(Comparative Example 1)

The packaging of the epoxy resin for semiconductor sealing was carried out using a plastic bag for packaging made of a low density polyethylene film (film thickness 0.06 mm). A predetermined amount of an epoxy resin molding material tablet was weighed and charged, and a sample was produced in which the bag opening was sealed with a rubber band (see FIG. 2). Separately, a thermo-hygrometer was put in place of the tablet to prepare a sealed sample.
(Comparative Example 2)

The packaging of the epoxy resin for semiconductor sealing was carried out using a plastic bag for packaging made of a low density polyethylene film (film thickness 0.06 mm). A predetermined amount of the tablet was weighed and charged, and a sample was produced in which the bag opening was wrapped with vinyl tape and sealed. Separately, a thermo-hygrometer was put in place of the tablet to prepare a sealed sample.
After each sample produced in Examples 1-5 and Comparative Examples 1-2 as described above was stored in a warehouse at 5 ° C. for 24 hours, a constant temperature and humidity chamber (room temperature 30 ° C., (Humidity 70% RH) for 48 hours. Thereafter, the sample was opened manually without using cutters, the time required for opening the bag was measured, and the humidity in the bag at the time of opening the sample bag was checked. The evaluation results are summarized in Table 1. The example can greatly reduce the time required for opening the bag compared to the comparative example, and the plastic bag for packaging using high-density polyethylene can prevent an increase in humidity in the bag. confirmed.

It is a schematic diagram which shows an example of embodiment of the package of this invention. It is a schematic diagram which shows an example of the conventional package.

Explanation of symbols

1 Plastic bag for packaging 11 I notch 2 Tablet 3 Rubber band 4 Sealing area

Claims (6)

  A packaging body made of a packaging plastic film packaging bag made by a sealing process and a semiconductor sealing epoxy resin molding material contained in the packaging bag, from the end of the packaging bag A package of an epoxy resin molding material for semiconductor sealing, wherein a notch is formed toward or in the seal region.   A packaging body made of a packaging plastic film packaging bag made by a sealing process and a semiconductor sealing epoxy resin molding material contained in the packaging bag, from the end of the packaging bag A package of an epoxy resin molding material for semiconductor sealing, wherein a wave cut is formed toward or in the seal region.   The packaging body of the epoxy resin molding material for semiconductor sealing according to claim 1 or 2, wherein the epoxy resin molding material for semiconductor sealing is in a tablet shape or a granular material shape.   The package of the epoxy resin molding material for semiconductor sealing according to any one of claims 1 to 3, wherein the packaging plastic film is a single layer or a laminate, and at least one layer is made of high-density polyethylene.   The packaging of the epoxy resin molding material for semiconductor sealing according to any one of claims 1 to 4, wherein the plastic film for packaging is a stretched film, and the stretch directionality and the direction of notch or wave cut are matched. body.   A semiconductor device, wherein an element is sealed with an epoxy resin molding material for semiconductor sealing obtained by opening the package according to claim 1.

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