JP2005072441A - Pallet device for soldering - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive pallet device for soldering capable of carrying out the attachment / detachment of a retaining tool by simple work in a short time. <P>SOLUTION: The pallet device 1 for soldering a plurality of lead components 3 to a printed circuit board 2 is provided with a plurality of arm members 6 for pressing the plurality of lead components 3 to the printed circuit board 2, and a support member 7 bridged over the printed circuit board 2 and for supporting the plurality of arm embers 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a soldering pallet device for soldering a plurality of lead parts to a printed circuit board.

  As shown in FIGS. 6 and 7, the conventional soldering pallet device 51 has a pallet 53 on which a printed circuit board 52 is placed and fixed. On the pallet 53, a plurality of holding jigs 55 are provided for individually pressing a plurality of lead components 54 arranged on the printed circuit board 52 during soldering.

  The holding jig 55 includes a column portion 56 erected on the pallet 53 on the side of the mounting position of the lead component 54, and a holding portion 57 that extends from the column portion 56 to the lead component 54 and presses from above. It consists of

  In the soldering pallet device 51 having the above-described configuration, the soldering pallet method in which the soldering bath in which the solder is melted is held in a state where the lead component 54 is held by the holding jig 55 so as not to be lifted, or is melted. Soldering is performed by a flow soldering method in which solder is jetted and sprayed.

JP-A-6-252545

  The soldering pallet device 51 is often used when the printed circuit board 52 is mass-produced, and the printed circuit board 52 is frequently replaced. Therefore, it is necessary to frequently attach and detach the holding jig 55 each time the printed circuit board 52 is replaced.

  However, in the above-described soldering pallet device 51, since the individual holding jigs 55 are provided for each of the plurality of lead parts 54, a great number of holding jigs 55 must be attached and detached each time the printed circuit board 52 is replaced. There was a problem that much labor and time were required.

  Further, since the plurality of holding jigs 55 are provided with joint portions (not shown) for height adjustment and horizontal position adjustment, joints corresponding to the number of lead parts 52 must be provided. In other words, the cost increased and the device became expensive.

  Therefore, the present invention has been devised to solve the above-described problems, and an object of the present invention is to provide an inexpensive soldering pallet apparatus that can attach and detach the holding jig in a short time with a simple operation. .

  In order to achieve the above object, the present invention provides a soldering pallet apparatus for soldering a plurality of lead parts to a printed board, a plurality of arm members for pressing the plurality of lead parts against the printed board, and the print And a support member that spans the substrate and supports the plurality of arm members.

  And what the said several arm member was attached to the said support member so that movement was possible is preferable.

  Further, it is preferable that an urging member for urging the lead component toward the printed circuit board is provided at the tip of the arm member.

  Furthermore, it is preferable that the arm member is rotatably attached to the support member.

  Further, it is preferable that the arm member is formed to be stretchable.

  Furthermore, it is preferable to provide an engagement member for engaging the lead component at the tip of the arm member.

  According to the present invention, since the plurality of arm members that hold down the printed circuit board are integrally supported by the support member, the attachment and detachment can be performed collectively, and the detachment work can be simplified and the time can be shortened. Excellent effects such as. In addition, the number of joints for height adjustment and horizontal position adjustment can be reduced, so that cost reduction is achieved.

  Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  As shown in FIGS. 1 and 2, the soldering pallet apparatus 1 according to the present embodiment includes a plurality of lead parts (electronic lead parts) 3 such as connectors and switches that are flow soldered or dip soldered to a printed circuit board 2. Used to fix with. The soldering pallet apparatus 1 has a pallet 5 having fixing holes 4 for fixing the printed circuit board 2. The fixing hole 4 is formed to have the same area and thickness as the printed board 2.

  By the way, the soldering pallet device 1 includes a plurality of arm members 6 that press the plurality of lead components 3 against the printed circuit board 2, and a support member 7 that spans the printed circuit board 2 and supports the plurality of arm members 6. It is characterized by that. The arm member 6 and the support member 7 constitute a pressing jig 10.

  The support member 7 is formed in a gate shape, and includes a pair of leg portions 8 standing on the pallet 5 on both sides of the printed circuit board 2 and a horizontal portion 9 connected between the leg portions 8. Yes. A height adjusting mechanism (not shown) for adjusting the height of the horizontal portion 9 is provided at a joint portion between the leg portion 8 and the horizontal portion 9. An arm member 6 is slidably attached to the horizontal portion 9 along its longitudinal direction.

  The arm member 6 extends in a direction perpendicular to the longitudinal direction of the support member 7, and is formed by bending downward at the upper position of the lead component 3. When the mounting position of the lead component 3 is positioned on both sides of the support member 7, one arm member 6 is formed in a straight line shape in plan view and supports the side portion of the mounting position of the lead component 3. The other arm member 6 ′ is fixed to the member 7, and is formed in an L shape in plan view. The other arm member 6 ′ is fixed to the support member 7 at a position shifted from the mounting position of the lead component 3, and moves upward toward the mounting position of the lead component 3. And bent.

  The shape of the arm member 6 is formed in advance according to the mounting position of the lead component 3 of the printed circuit board 2 to be mass-produced, and is set by sliding to a desired position with respect to the support member 7. .

  A biasing member 11 that biases the lead component 3 toward the printed circuit board 2 is provided at the distal end of the arm member 6. The urging member 11 includes a contact portion 12 that contacts the upper surface of the lead component 3, and a spring member (not shown) such as a leaf spring interposed between the contact portion 12 and the distal end portion of the arm member 6. It consists of The spring member is formed of a metal spring and biases the contact portion 12 downward. The spring member is not limited to a metal spring, and may be made of other materials such as a rubber material, a plastic material, or a ceramic material.

  At the tip of the arm member 6, an engagement member 18 for engaging the lead component 3 is provided. The engaging member 18 is constituted by a screwing member such as a screw, and the screwing member is screwed into a screw hole (not shown) formed in the lead component 3. As a result, the lead component 3 can be fixed to the tip of the arm member 6.

  In the figure, 14 denotes an IC, 15 denotes a chip capacitor, 16 denotes a chip resistor, and 17 denotes a hollow portion formed below the mounting position of the lead component 3.

  Next, the operation of the soldering pallet apparatus 1 having the above configuration will be described.

  According to the above configuration, since the plurality of arm members 6 that hold down the printed circuit board 2 are integrally supported by the support member 7, the holding jig 10 can be formed integrally, and the attaching and detaching operations are summarized. Can be done. As a result, the attachment / detachment operation performed each time the printed circuit board 2 is replaced may be performed only once. Compared with the attachment / detachment operation of the holding jig 55 which has conventionally been performed the same number of times as the lead component 54, the work is reduced. Is greatly reduced. Therefore, simplification of attachment / detachment work and a significant time reduction are achieved.

  In addition, since the arm member 6 is slidably attached to the single support member 7, the number of height adjustment joints conventionally provided in the individual holding jigs 55 is greatly reduced. At the same time, the joint for adjusting the horizontal position can be eliminated, the simplification of the soldering pallet apparatus is achieved, and the cost of the entire apparatus is greatly reduced.

  Furthermore, in the above embodiment, since the biasing member 11 is provided at the tip of the arm member 6, the lead component 3 can be reliably pressed against the printed circuit board 2. Therefore, it is possible to reliably prevent the lead component 3 from being soldered in a floating state at the time of soldering, and it is possible to perform high-precision soldering without the lead component 3 being lifted. Further, since the urging member 11 is provided, it is not necessary to lower the support member 7 to the last height, so that it is possible to prevent an excessive pressing force from being applied to the lead component 3 and to prevent the lead component 3 from being damaged. .

  FIG. 3 is a plan view showing a second preferred embodiment of the soldering pallet apparatus according to the present invention.

  The soldering pallet device 21 of the present embodiment is characterized in that the arm member 26 and the support member 7 are formed to cross in a cross shape. In addition, since it is the same as that of the soldering pallet apparatus 1 of FIG. 1 about another structure, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  That is, when the mounting position of the lead component 3 is on both sides of the support member 7, the arm member 26 extends horizontally from the support member 7 to above the mounting position on both sides, and the lead component 3 extends from both ends thereof. Each is extended downward to the mounting position.

  As a result, the arm member 26 can also be used, and the number of arm members 26 with respect to the number of lead parts 3 can be reduced. Therefore, simplification and cost reduction of the apparatus are achieved.

  FIG. 4 is a plan view showing a third preferred embodiment of the soldering pallet apparatus according to the present invention.

  The soldering pallet device 31 of the present embodiment is characterized in that the arm member 36 is rotatably attached to the support member 7. In addition, since it is the same as that of the soldering pallet apparatus 1 of FIG. 1 about another structure, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  The arm member 36 is rotatably provided via a pin 33 on a sliding member 32 attached to the support member 7 so as to be slidable in the longitudinal direction, and the arm member 36 rotates around the pin 33. To do. The pin 33 is composed of, for example, a screw, and the arm member 36 is fixed at a predetermined angle by tightening the pin 33. Thus, even when the lead component 3 is attached to the opposite side of the support member 7, the pressing position can be adjusted by rotating the arm member 36, and the printed circuit board 2 having a different attachment position of the lead component 3 can be adjusted. On the other hand, the holding jig 34 including the same arm members 6 and 36 and the support member 7 can be adopted, and the versatility thereof is enhanced.

  The hanging portion at the tip of the arm member 36 may be formed to be freely rotatable.

  FIG. 5 is a plan view showing a fourth preferred embodiment of the soldering pallet apparatus according to the present invention.

  The soldering pallet apparatus 41 of the present embodiment is characterized in that the arm member 46 is formed to be extendable and contractible. In addition, since it is the same as that of the soldering pallet apparatus 1 of FIG. 1 about another structure, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  The arm member 46 is formed in a double structure, and includes an internal arm 43 and an external arm 44 that covers the outside. The inner arm 43 is slidably inserted inside the outer arm 44. By pulling out the inner arm 43 from the outer arm 44, the arm member 46 is extended, and the inner arm 43 is pushed into the outer arm 44. The arm member 46 is retracted. As a result, even when the mounting position of the lead component 3 changes, the pressing position can be adjusted by extending or contracting the arm member 46, and the same arm can be applied to the printed circuit board 2 having a different mounting position of the lead component 3. A pressing jig 45 composed of the members 6 and 46 and the support member 7 can be employed, and the versatility thereof is enhanced.

  If the telescopic arm member 46 shown in FIG. 5 is rotatably attached to the support member 7 as shown in FIG. 4, the versatility is further enhanced.

It is the top view which showed suitable 1st embodiment of the soldering pallet apparatus which concerns on this invention. It is sectional drawing which showed suitable 1st embodiment of the soldering pallet apparatus which concerns on this invention. It is the top view which showed suitable 2nd embodiment of the soldering pallet apparatus which concerns on this invention. It is the top view which showed suitable 3rd embodiment of the soldering pallet apparatus which concerns on this invention. It is the top view which showed suitable 4th embodiment of the soldering pallet apparatus which concerns on this invention. It is the top view which showed the conventional soldering pallet apparatus. It is sectional drawing which showed the conventional soldering pallet apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Soldering pallet apparatus 2 Printed circuit board 3 Lead component 6 Arm member 7 Support member 11 Energizing member 18 Engaging member 21 Soldering pallet apparatus 26 Arm member 31 Soldering pallet apparatus 36 Arm member 41 Soldering pallet apparatus 46 Arm member

Claims (6)

  In a soldering pallet device for soldering a plurality of lead parts to a printed circuit board, a plurality of arm members for pressing the plurality of lead parts against the printed circuit board, and the plurality of arm members spanned on the printed circuit board A soldering pallet device comprising a supporting member for supporting.   The soldering pallet apparatus according to claim 1, wherein the plurality of arm members are movably attached to the support member.   The soldering pallet apparatus according to claim 1, wherein a biasing member that biases the lead component toward the printed circuit board is provided at a tip of the arm member.   The soldering pallet apparatus according to claim 1, wherein the arm member is rotatably attached to the support member.   The soldering pallet apparatus according to claim 1, wherein the arm member is formed to be extendable and contractible. The soldering pallet apparatus according to any one of claims 1 to 5, wherein an engagement member for engaging the lead component is provided at a tip of the arm member.

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