KR200224474Y1 - Pincette for SMD type - Google Patents
Pincette for SMD type Download PDFInfo
- Publication number
- KR200224474Y1 KR200224474Y1 KR2020000021576U KR20000021576U KR200224474Y1 KR 200224474 Y1 KR200224474 Y1 KR 200224474Y1 KR 2020000021576 U KR2020000021576 U KR 2020000021576U KR 20000021576 U KR20000021576 U KR 20000021576U KR 200224474 Y1 KR200224474 Y1 KR 200224474Y1
- Authority
- KR
- South Korea
- Prior art keywords
- tweezers
- chip
- chip element
- soldering
- chip device
- Prior art date
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Abstract
본 고안은 SMD type인 칩소자를 손으로 직접 땜질을 할때 이 핀셋을 이용하여 칩소자를 보다 잘 잡아 주므로써 더욱 쉽게 땜질할 수 있도록 도와주는 것을 목적으로 한다.The present invention aims to help soldering more easily by holding the chip device better using this tweezers when soldering the SMD type chip device by hand.
이를 위하여 핀셋 본체(1, 2) 아랫쪽 핀셋 끝에 돌출기(1a, 1b)를 양옆에 붙혀 준다.To this end, the protrusions 1a and 1b are attached to both ends of the lower tweezers at the bottom of the tweezers body 1 and 2.
이 구성에 의해 칩소자를 잡아주면 땜질시 양옆뿐만 아니라 위에서도 눌러 줌으로써 칩소자를 잘 고정할 수 있게 해준다. 그리고 칩소자를 핀셋으로 잡을시 너무 꽉 잡으면 칩소자가 튕겨지게 되는데 이를 방지 해줄 수 있다. 이렇게 함으로써 칩소자를 땜질을 할때 쉽게 해줄 수 있다.By holding the chip element by this configuration, it is possible to fix the chip element well by pressing not only on both sides but also from above when soldering. If you hold the chip device too tightly with the tweezers, the chip device will bounce, which can prevent this. This makes it easier to solder the chip element.
Description
본 고안은 칩소자를 땜질을 위해 칩소자를 잡아주는 핀셋에 관한것으로 보다 상세히는 칩소자를 위에서도 받쳐줌으로써 칩소자를 핀셋에서 잘 고정시켜 주는 핀셋에 관한것이다.The present invention relates to a tweezers for holding a chip device for soldering the chip device, and more particularly, to a tweezers that secures the chip device in the tweezers by supporting the chip device from above.
통상 칩소자는 그 크기가 작아서 핀셋을 이용하여 PCB 기판에 땜질을 하게 되는데 이 핀셋은 양 옆에서 눌러 줌으로써 칩소자를 고정하게 되는데 이때 너무 힘을 주어 잡으면 칩소자가 튕겨 나갈 수 있게 되고 또한 이 핀셋으로 칩소자를 잡아 PCB에 놓고 땜질을 할 때 PCB 기판위에 칩소자를 잘 눌러 주게 하여 바닥에 완전히 밀착시키려고 하나 위에서 받쳐주지 않기 때문에 칩소자가 고정이 되지 않아 칩소자가 뜨게 되고 또한 인두나 납을 갖다 되면 칩소자가 잘 움직이게 되어 땜질을 하기 어렵다.In general, the chip device is small in size and soldered to the PCB substrate using tweezers. The tweezers are fixed by pressing the chip on both sides. At this time, the chip device can be bounced off with too much force. In order to hold the chip element on the PCB and solder it, press the chip element on the PCB board well so that it can be completely adhered to the floor, but the chip element is not fixed because the chip element is not fixed. When the chip element is moved well, it is difficult to solder.
본 고안의 과제는 이렇게 어떠한 이유로든 핀셋으로 칩소자를 잡을때 위에서도 고정시켜 주어 칩소자가 튕기거나 PCB에 땜질 할시 바닥에 잘 밀착시키도록 해줌으로써 종래 단순한 핀셋이 가지고 있던 문제점을 해결하고자 하는 것이다.The problem of the present invention is to solve the problem of the conventional simple tweezers by fixing it from above when the chip element is held by the tweezers for any reason so that the chip element sticks to the bottom when the chip element is bouncing or soldering to the PCB.
제1도는 본 고안의 전체적인 상태도1 is an overall state diagram of the present invention
제2도는 본 고안의 측면 상태도2 is a side view of the present invention
제3도는 본 고안이 칩소자를 잡았을시 상태도3 is a state diagram when the present invention caught the chip element
제4도는 본 고안이 칩소자를 잡았을시 잡은 부분의 확대 상태도4 is an enlarged state diagram of a portion of the present invention when the chip device is caught
*주요부호의 설명* Description of the major symbols
1 : 핀셋 본체 2 : 핀셋 본체1: tweezers body 2: tweezers body
1a: 돌출기 1b: 돌출기 1c: 칩소자1a: protrusion 1b: protrusion 1c: chip element
본 고안은 상기한 문제점을 해결하기 위해 핀셋의 아랫쪽 끝부분에 돌출기를 형성해줌으로써, 칩소자를 양옆뿐만 아니라 위에서도 받쳐주어 주어 칩소자를 핀셋으로 잡았을시 핀셋에 잘 고정시켜 준다. 이하 첨부도면에 의하여 본 고안의 구성 및 효과를 상세히 설명하면 다음과 같다.제 1도는 본 고안의 전체적인 핀셋의 상태도이다. 핀셋의 아랫쪽 끝부분 안쪽으로 조그만한 돌출기(1a, 1b)가 형성되어 있다. 제 2도는 본 고안의 핀셋의 측면 상태도이다. 여기서 1a, 1b 가 돌출되어 있어 칩소자(1c)를 위에서도 받쳐주어 이 핀셋으로 칩소자(1c)를 잡았을시 칩소자(1c)를 잘 고정시켜 준다.The present invention forms a protrusion at the lower end of the tweezers in order to solve the above problems, to support the chip device from the sides as well as from the top to secure it to the tweezers when holding the chip device in the tweezers. Hereinafter, the configuration and effects of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a state diagram of the overall tweezers of the present invention. Tiny protrusions 1a and 1b are formed inside the lower end of the tweezers. 2 is a side view of the tweezers of the present invention. Here, 1a and 1b protrude so that the chip element 1c is supported from above, and when the chip element 1c is held by the tweezers, the chip element 1c is well fixed.
제 3도는 이 핀셋으로 실제 칩소자(1c)를 잡았을때의 상태도이다. 핀셋의 몸체(1, 2)가 칩소자(1c)를 옆에서 잡아주고 돌출기(1a, 1b)가 위에서 받쳐주어 칩소자(1c)를 잘 고정시켜주게 된다. 이렇게 해서 PCB에 올려 놓게 되면 칩소자(1c)가 PCB기판에 밀리지 않고 잘 고정된다. 제 4도는 본 고안의 핀셋이 칩소자(1c)를 잡았을때 그 부분을 확대시켜 본 상태도이다. 핀셋의 몸체(1, 2)가 칩소자(1c) 양옆을 잡고 있다. 또한 핀셋에 돌출기(1a, 1b)가 형성되어 있어서 칩소자(1c)를 위에서도 고정시켜 준다. 이렇게 해줌으로써 칩소자(1c)를 PCB에 올려 놓게 될때 칩소자(1c)가 PCB기판에 밀려서 위로 올라가지 못하도록 위에서 받쳐주게 된다.3 is a state diagram when the actual chip element 1c is held by this tweezers. The body 1 and 2 of the tweezers hold the chip element 1c from the side, and the protrusions 1a and 1b support it from above to fix the chip element 1c well. When placed on the PCB in this way, the chip element 1c is well fixed without being pushed onto the PCB substrate. 4 is an enlarged state diagram when the tweezers of the present invention hold the chip element 1c. The bodies 1 and 2 of the tweezers hold both sides of the chip element 1c. In addition, the protrusions 1a and 1b are formed in the tweezers to fix the chip element 1c from above. By doing so, when the chip element 1c is placed on the PCB, the chip element 1c is supported from above to prevent the chip element 1c from being pushed up by the PCB.
상기의 핀셋구성으로 칩소자를 다루는 일을 할때, 예를 들어 PCB에 칩소자를 땜질 할때 본고안의 핀셋을 이용하여 칩소자를 위에서도 받쳐줌으로써 잘 고정시켜 땜질을 보다 쉽게 해줄수 있고, 또한 상기의 핀셋으로 칩소자를 잡을시 칩소자가 튕겨나가지 않게 해줄 수 있다.When dealing with chip elements with the tweezers configuration, for example, when soldering the chip elements to the PCB, it is possible to fix the soldering more easily by supporting the chip elements from above using the tweezers in this paper. When holding a chip device with tweezers, it can prevent the chip device from being thrown out.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020000021576U KR200224474Y1 (en) | 2000-07-28 | 2000-07-28 | Pincette for SMD type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020000021576U KR200224474Y1 (en) | 2000-07-28 | 2000-07-28 | Pincette for SMD type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR200224474Y1 true KR200224474Y1 (en) | 2001-05-15 |
Family
ID=73086626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2020000021576U KR200224474Y1 (en) | 2000-07-28 | 2000-07-28 | Pincette for SMD type |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200224474Y1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102259580B1 (en) | 2020-06-12 | 2021-06-02 | 서태민 | Pincette for picking up printed circuit board |
-
2000
- 2000-07-28 KR KR2020000021576U patent/KR200224474Y1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102259580B1 (en) | 2020-06-12 | 2021-06-02 | 서태민 | Pincette for picking up printed circuit board |
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