JP2005064440A - Manually operated wafer conveying machine - Google Patents

Manually operated wafer conveying machine Download PDF

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Publication number
JP2005064440A
JP2005064440A JP2003323746A JP2003323746A JP2005064440A JP 2005064440 A JP2005064440 A JP 2005064440A JP 2003323746 A JP2003323746 A JP 2003323746A JP 2003323746 A JP2003323746 A JP 2003323746A JP 2005064440 A JP2005064440 A JP 2005064440A
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wafer
shaft
rectilinear
conveying machine
end effector
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JP2003323746A
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Japanese (ja)
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Koichi Nemoto
弘一 根本
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Individual
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer conveying machine that stably and easily conveys a wafer in a horizontal attitude through manual operation and restrains particles from sticking on the wafer and is short and small in occupation space. <P>SOLUTION: Provided is an end effector which supports the outer periphery of the wafer in the horizontal attitude in point contact or linear contact or clamps the outer periphery. The end effector is fitted to a rectilinear shaft, and the rectilinear shaft, an elevation shaft, and a rotary shaft can manually be operated to convey the wafer through manual operation. The elevation shaft is fitted to the rotary shaft to avoid interferring with the movement of the rectilinear shaft and the movement of the rotary shaft, thereby lowering height of the whole conveying machine. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

発明の詳細な説明Detailed Description of the Invention

本発明は半導体製造で使用されるウェーハの搬送に関するものである。  The present invention relates to the transfer of wafers used in semiconductor manufacturing.

図1で示すようにウェーハキャリア2からウェーハ1を手動操作で取出し、もしくは挿入するにはウェーハ1が垂直になるようウェーハキャリア2を置き、真空ピンセット3を用いてウェーハ1を吸着し操作する。この方法は搬送が不安定で、細心の注意と高度の熟練を要する。大口径化するウェーハ1ではますます困難になるという問題点があった。さらに真空の吸引力で真空ピンセット3とウェーハ面が一定の面積で密接し、パーティクル(異物微粒子)がウェーハ1に付着するという問題点があった。  As shown in FIG. 1, in order to manually remove or insert the wafer 1 from the wafer carrier 2, the wafer carrier 2 is placed so that the wafer 1 is vertical, and the wafer 1 is sucked and operated using the vacuum tweezers 3. This method is unstable in conveyance and requires great care and high skill. There is a problem that the wafer 1 having a larger diameter becomes more and more difficult. Further, there is a problem that the vacuum tweezers 3 and the wafer surface are in close contact with each other by a vacuum suction force, and particles (foreign particles) adhere to the wafer 1.

図2で示すように従来の搬送機はウェーハ1を載せるエンドエフェクター4を従来の直進軸5に取付け、従来の直進軸5、従来の回転軸6、および従来の昇降軸7を動作させ搬送する。従来の直進軸5と従来の回転軸6は一体となって従来の昇降軸7に搭載される。ウェーハ1搬送時に従来の直進軸5と従来の回転軸6の動きが従来の昇降軸7とが干渉しないように高さ方向で干渉を回避する。このため搬送機の高さが高くなり、占有空間が大きいという問題点があった。  As shown in FIG. 2, in the conventional transfer machine, an end effector 4 on which a wafer 1 is placed is attached to a conventional linear shaft 5, and the conventional linear shaft 5, the conventional rotary shaft 6, and the conventional lift shaft 7 are operated and transferred. . The conventional linear shaft 5 and the conventional rotary shaft 6 are integrally mounted on the conventional lift shaft 7. Interference is avoided in the height direction so that the movement of the conventional linear shaft 5 and the conventional rotary shaft 6 does not interfere with the conventional lift shaft 7 when the wafer 1 is conveyed. For this reason, there is a problem that the height of the transport device becomes high and the occupied space is large.

発明が解決しようとする課題Problems to be solved by the invention

本発明は手動操作でウェーハ1を水平姿勢で安定かつ容易に搬送でき、パーティクルがウェーハ1に付着することを抑え、かつまた高さが低く占有空間が小さいウェーハ搬送機を提供することを目的とする。  SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer transfer machine capable of stably and easily transporting a wafer 1 in a horizontal posture by manual operation, preventing particles from adhering to the wafer 1, and having a small height and a small occupied space. To do.

課題を解決するための手段Means for solving the problem

上記目的を達成するため、本発明の請求項1はウェーハを水平姿勢でかつウェーハの外周を点接触または線接触で支持するか、またはウェーハの外周を点接触または線接触でクランプするエンドエフェクターを備える。エンドエフェクターは直進軸に取付け、各直進軸、昇降軸、回転軸は手動で操作でき、ウェーハが水平となるよう置かれたウェーハキャリアからウェーハを取出し、もしくは挿入することを特徴とする。  In order to achieve the above object, claim 1 of the present invention provides an end effector that supports a wafer in a horizontal posture and supports the outer periphery of the wafer by point contact or line contact, or clamps the outer periphery of the wafer by point contact or line contact. Prepare. The end effector is attached to a rectilinear axis, and each rectilinear axis, elevating axis, and rotation axis can be manually operated, and the wafer is taken out or inserted from a wafer carrier placed so that the wafer is horizontal.

本発明の請求項2は請求項1の昇降軸を回転軸に取付け、回転軸の回転中心から一定半径の円周上を旋回することで、昇降軸の動きが直進軸の動きおよび回転軸の動きとの干渉を回避し、搬送機全体の高さを低くすることを特徴とする。  According to the second aspect of the present invention, the lifting shaft of the first aspect is attached to the rotating shaft, and the lifting shaft moves on the circumference of a certain radius from the rotation center of the rotating shaft, so that the movement of the lifting shaft is the movement of the straight shaft and the rotating shaft. It is characterized by avoiding interference with movement and reducing the overall height of the transporting machine.

本発明の請求項3は請求項2の各直進軸、昇降軸、回転軸の一部の軸または全部の軸を自動化することを特徴とする。  A third aspect of the present invention is characterized by automating a part or all of the straight axes, the lifting and lowering axes, and the rotating shaft of the second aspect.

実施の形態を図に基づいて説明する。図3はエンドエフェクター4のウェーハ1と接触する部分を傾斜させ、ウェーハ1の外周を点接触または線接触でウェーハ1を水平姿勢で支持するエンドエフェクター4を示している。図4はウェーハ1の外周を点接触または線接触でウェーハ1をクランプするエンドエフェクター4を示している。  Embodiments will be described with reference to the drawings. FIG. 3 shows the end effector 4 that supports the wafer 1 in a horizontal posture by tilting the portion of the end effector 4 that makes contact with the wafer 1 and performing point contact or line contact on the outer periphery of the wafer 1. FIG. 4 shows an end effector 4 that clamps the wafer 1 by point contact or line contact on the outer periphery of the wafer 1.

図5a)b)は本発明のウェーハ搬送機のエンドエフェクター4を取付けた直進軸8の動きを示している。図5a)は直進軸8の最後退位置を示し、図5b)は直進軸8の前進した状態を示している。直進軸8の動きは昇降軸9と干渉していない。  FIGS. 5 a) and b) show the movement of the rectilinear shaft 8 to which the end effector 4 of the wafer transfer machine of the present invention is attached. 5a) shows the last retracted position of the rectilinear shaft 8, and FIG. 5b) shows a state where the rectilinear shaft 8 has advanced. The movement of the rectilinear shaft 8 does not interfere with the lifting shaft 9.

図6a)b)は本発明のウェーハ搬送機の昇降軸9の動きを示している。図6a)は昇降軸9の最下降位置を示し、図6b)は昇降軸9の上昇した状態を示している。昇降軸9は回転軸10上に取付けていることを示している。  FIGS. 6a) and b) show the movement of the lifting shaft 9 of the wafer transfer machine of the present invention. 6A) shows the lowest lowered position of the lifting shaft 9, and FIG. 6B) shows a state where the lifting shaft 9 is raised. The lifting shaft 9 is attached to the rotating shaft 10.

図7a)b)は本発明のウェーハ搬送機の回転軸10の回転状態を示している。回転軸10はベース板11に取付けられ、回転軸10の回転により直進軸8の進行方向(ウェーハ1の搬送方向)を変えることができる。昇降軸9は回転軸10の回転中心から一定半径の円周上を旋回し、図7a)b)の状態から直進軸8を動かしても直進軸8の動きと昇降軸9とは干渉しない。  FIGS. 7a) and 7b) show the rotation state of the rotary shaft 10 of the wafer transfer machine of the present invention. The rotating shaft 10 is attached to the base plate 11, and the traveling direction of the rectilinear shaft 8 (the conveyance direction of the wafer 1) can be changed by the rotation of the rotating shaft 10. The elevating shaft 9 revolves on the circumference of a certain radius from the rotation center of the rotating shaft 10, and even if the rectilinear shaft 8 is moved from the state shown in FIGS.

図5a)b)、図6a)b)、図7a)b)の動きを適切な順序で動かし、ウェーハ1が水平となるよう置かれたウェーハキャリア2からウェーハ1を取出し、もしくは挿入することができる。  5a) b), 6a) b), 7a) b) can be moved in the proper order to remove or insert wafer 1 from wafer carrier 2 placed so that wafer 1 is horizontal. it can.

発明の効果The invention's effect

以上述べたように本発明により手動操作でウェーハを水平姿勢で安定かつ容易に搬送でき、ウェーハとエンドエフェクターの接触面積を小さくし、パーティクルがウェーハに付着することを抑えることができる。  As described above, according to the present invention, the wafer can be transported stably and easily in a horizontal posture by manual operation, the contact area between the wafer and the end effector can be reduced, and particles can be prevented from adhering to the wafer.

また、ウェーハ搬送機の昇降軸を回転軸に載せることにより、ウェーハ搬送機全体の高さを低くすることができ、占有空間が少なくなる。  Further, by placing the lifting / lowering shaft of the wafer transfer device on the rotation shaft, the overall height of the wafer transfer device can be reduced and the occupied space is reduced.

従来の手動操作によるウェーハ搬送の方法を示す斜視図である。It is a perspective view which shows the method of the wafer conveyance by the conventional manual operation. 従来の搬送機を示す斜視図である。It is a perspective view which shows the conventional conveying machine. ウェーハを支持する方法を示す概略断面図である。It is a schematic sectional drawing which shows the method of supporting a wafer. ウェーハをクランプする方法を示す概略断面図である。It is a schematic sectional drawing which shows the method of clamping a wafer. 本発明のウェーハ搬送機の直進軸の動きを示す平面図である。It is a top view which shows the motion of the rectilinear axis of the wafer conveyance machine of this invention. 本発明のウェーハ搬送機の昇降軸の動きを示す正面図である。It is a front view which shows the motion of the raising / lowering axis | shaft of the wafer conveyance machine of this invention. 本発明のウェーハ搬送機の回転軸の動きを示す平面図である。It is a top view which shows a motion of the rotating shaft of the wafer conveyance machine of this invention.

符号の説明Explanation of symbols

1 ウェーハ
2 ウェーハキャリア
3 真空ピンセット
4 エンドエフェクター
5 従来の直進軸
6 従来の回転軸
7 従来の昇降軸
8 直進軸
9 昇降軸
10 回転軸
11 ベース板
DESCRIPTION OF SYMBOLS 1 Wafer 2 Wafer carrier 3 Vacuum tweezers 4 End effector 5 Conventional linear shaft 6 Conventional rotary shaft 7 Conventional lift shaft 8 Linear shaft 9 Lift shaft 10 Rotary shaft 11 Base plate

Claims (3)

手動操作でウェーハを水平姿勢で搬送することを特徴としたウェーハ搬送機。  A wafer transfer machine characterized by transferring wafers in a horizontal position by manual operation. 請求項1のウェーハ搬送機において昇降軸を回転軸上に配置することを特徴としたウェーハ搬送機。  2. A wafer transfer machine according to claim 1, wherein the elevating shaft is disposed on the rotation axis. 請求項2のウェーハ搬送機において一部または全部の動作を自動化することを特徴としたウェーハ搬送機。  3. A wafer transfer machine according to claim 2, wherein part or all of the operations are automated.
JP2003323746A 2003-08-12 2003-08-12 Manually operated wafer conveying machine Pending JP2005064440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003323746A JP2005064440A (en) 2003-08-12 2003-08-12 Manually operated wafer conveying machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003323746A JP2005064440A (en) 2003-08-12 2003-08-12 Manually operated wafer conveying machine

Publications (1)

Publication Number Publication Date
JP2005064440A true JP2005064440A (en) 2005-03-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003323746A Pending JP2005064440A (en) 2003-08-12 2003-08-12 Manually operated wafer conveying machine

Country Status (1)

Country Link
JP (1) JP2005064440A (en)

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