JP2005057081A - Power element cooling apparatus - Google Patents
Power element cooling apparatus Download PDFInfo
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- JP2005057081A JP2005057081A JP2003286856A JP2003286856A JP2005057081A JP 2005057081 A JP2005057081 A JP 2005057081A JP 2003286856 A JP2003286856 A JP 2003286856A JP 2003286856 A JP2003286856 A JP 2003286856A JP 2005057081 A JP2005057081 A JP 2005057081A
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- Prior art keywords
- power element
- heat sink
- heat
- heat dissipation
- pressure adjusting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本発明は、パワートランジスタやパワーＭＯＳ ＦＥＴなどのパワー素子から発生する熱を良好に放熱する機能を備えたパワー素子の冷却装置に関する。 The present invention relates to a cooling device for a power element having a function of satisfactorily radiating heat generated from a power element such as a power transistor or a power MOS FET.
従来のパワー素子冷却装置を図２に示す。図において、１はユニットに設けられたヒートシンク、２はヒートシンクに固定された基板、３は基板２に実装されたパワー素子、５は圧力調整ネジ、６は基板２をヒートシンク１に固定する固定ネジ、８はネジ穴を有する冷却フィンである。これらの構成で、パワー素子３の背面に冷却フィン８を圧力調整ネジ５で固定して、パワー素子３の放熱を冷却フィン８で行っていた(例えば、特許文献１参照)。
また、組立てはパワー素子３の背面に冷却フィン８を圧力調整ネジ５で止めた後に基板２を固定ネジ６でヒートシンク１に固定していた。この際、冷却フィン８をパワー素子３に一本の圧力調整ネジ５で固定するため冷却フィン８の回り止め防止として両手作業もしくは治具固定による作業が発生していた。このようにパワー素子３と冷却フィン８の位置合わせが困難であったため組立てが容易ではなかった。
In the assembly, the cooling fin 8 is fixed to the back surface of the power element 3 with the pressure adjusting screw 5 and then the substrate 2 is fixed to the heat sink 1 with the fixing screw 6. At this time, since the cooling fin 8 is fixed to the power element 3 with a single pressure adjusting screw 5, a two-hand operation or a jig fixing operation has occurred to prevent the cooling fin 8 from rotating. Thus, since it was difficult to align the power element 3 and the cooling fin 8, the assembly was not easy.
しかしながら、従来のパワー素子冷却装置は、発熱量の大きいパワー素子を冷却フィンのみで放熱しようとした場合、多大なスペースを必要とする問題があった。また、パワー素子側からネジ締めをするため、パワー素子の近辺に部品を配置できないという問題もあった。さらに、従来の組立てはパワー素子背面に冷却フィンをネジ止めした後に基板実装していた。この際、冷却フィンをパワー素子に一本のネジで固定するため冷却フィンの回り止め防止として両手作業もしくは治具固定による作業が発生していた。このようにパワー素子と冷却フィンの位置合せが困難であったため組立てが容易でなかった。
そこで、本発明はこのような問題点に鑑みてなされたものであり、省スペースで放熱効果が大きくパワー素子近辺の部品配置を可能とし、また、冷却装置の組立てが容易なパワー素子冷却装置を提供することを目的とする。
However, the conventional power element cooling apparatus has a problem in that a large space is required when a power element having a large heat generation is radiated only by the cooling fin. Further, since the screws are tightened from the power element side, there is a problem that the parts cannot be arranged in the vicinity of the power element. Further, in the conventional assembly, the cooling fins are screwed to the back of the power element and then mounted on the board. At this time, since the cooling fin is fixed to the power element with a single screw, work by both hands or jig fixing has occurred to prevent the cooling fin from rotating. As described above, since it is difficult to align the power element and the cooling fin, assembly is not easy.
Therefore, the present invention has been made in view of such problems, and a power element cooling device that is space-saving, has a large heat dissipation effect, enables component placement near the power element, and is easy to assemble the cooling device. The purpose is to provide.
上記問題を解決するため、本発明は、次のように構成したものである。
請求項1に記載の発明は、ユニットに設けられたヒートシンクと、前記ヒートシンクに固定された基板と、前記基板上に取り付けられたパワー素子とを備えたパワー素子冷却装置において、前記パワー素子の放熱面と前記ヒートシンク間に密着して設けられた放熱シートと、前記パワー素子と前記放熱シートを前記ヒートシンクに所定の圧力にて固定しネジ穴を有するＬ字金具と、前記Ｌ字金具のネジ穴を用いて前記加圧力を調整する圧力調整ネジとを備えたものである。
また、請求項２に記載の発明は、前記放熱シートを、シリコン製のゴムとするものである。
また、請求項３に記載の発明は、前記圧力調整ネジの取付け穴を前記ヒートシンクの背面に設けたものである。
In order to solve the above problems, the present invention is configured as follows.
The invention according to claim 1 is a power element cooling apparatus including a heat sink provided in a unit, a substrate fixed to the heat sink, and a power element mounted on the substrate. A heat-dissipating sheet provided in close contact between a surface and the heat sink, an L-shaped metal fitting having a screw hole for fixing the power element and the heat-dissipating sheet to the heat sink at a predetermined pressure, and a screw hole of the L-shaped metal fitting And a pressure adjusting screw for adjusting the pressing force.
Moreover, invention of Claim 2 makes the said heat radiation sheet the rubber | gum made from silicon | silicone.
According to a third aspect of the present invention, a mounting hole for the pressure adjusting screw is provided on the back surface of the heat sink.
請求項１に記載の発明によれば、放熱シートがパワー素子の放熱面とヒートシンクの間に密着しているので、パワー素子の熱がヒートシンクに伝わり、ヒートシンク全面が放熱面となり大きな冷却効果を得ることができる。また、Ｌ字金具と圧力調整ネジを用いて締付けるので各部品の回り止めができ、本装置の組立てを容易にすることができる。
また、請求項２に記載の発明によれば、放熱シートをシリコン製のゴムとしたので、パワー素子の熱を効率よくヒートシンクに伝えることができ、さらに、基板とヒートシンクの取付け誤差を吸収できるので、圧力調整ネジの締付けによるパワー素子へのストレスを軽減することができる。
また、請求項３に記載の発明によれば、圧力調整ネジの取付け穴をヒートシンクの背面に設け圧力調整ネジをヒートシンク側から締付けているので、組立てを容易にするとともに、パワー素子近辺に部品配置することができ省スペースとすることができる。
According to the first aspect of the present invention, since the heat dissipation sheet is in close contact between the heat dissipation surface of the power element and the heat sink, the heat of the power element is transmitted to the heat sink, and the entire heat sink becomes the heat dissipation surface, thereby obtaining a large cooling effect. be able to. Further, since the L-shaped metal fitting and the pressure adjusting screw are used for tightening, each part can be prevented from rotating, and the assembly of the present apparatus can be facilitated.
Further, according to the invention described in claim 2, since the heat radiation sheet is made of silicon rubber, the heat of the power element can be efficiently transmitted to the heat sink, and further, the mounting error between the substrate and the heat sink can be absorbed. The stress on the power element due to the tightening of the pressure adjusting screw can be reduced.
According to the third aspect of the present invention, since the mounting hole for the pressure adjusting screw is provided on the back surface of the heat sink and the pressure adjusting screw is tightened from the heat sink side, the assembly is facilitated and the parts are arranged near the power element. Can save space.
以下、本発明の実施の形態を図に基づいて説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
図１は、本発明の実施例を示すパワー素子冷却装置の側断面図である。
同一部品には同一符号を付してその説明を省略する。本発明の特徴は、Ｌ字金具と放熱シートを備えたことにある。図において、４はＬ字金具、５は圧力調整ネジ、６は固定ネジ、７は放熱シートである。Ｌ字金具４は、パワー素子３と放熱シート７をヒートシンク１に所定の圧力にて固定しネジ穴を有する。圧力調整ネジ５は、Ｌ字金具４のネジ穴を用いて加圧力を調整するものである。放熱シート７は、パワー素子３の放熱面とヒートシンク１の間に密着させ、パワー素子３の熱をヒートシンク１に放熱させる。
本発明の組立ては、パワー素子３とヒートシンク１の間に放熱シート７を挟み、Ｌ字金具４をパワー素子３に取付けヒートシンク１背面より圧力調整ネジ５で止め、各部品を固定する。したがって、従来のようなパワー素子３と冷却フィン８の位置合わせの困難さがなくなった。また、Ｌ字金具４の回転方向に対してヒートシンク１および、パワー素子３とＬ字金具４がそれぞれ面接触しているためＬ字金具４の回り止めとなり、従来に比べ容易に組立をすることができる。また、圧力調整ネジ５をヒートシンク１側から締付ける構成のため、パワー素子３近辺の部品配置が可能となる。
つぎに動作について述べる。
パワー素子３が通電されて熱が発生すると、発生した熱は放熱シート７を介してヒートシンク１に伝わり放熱される。ヒートシンク１全体が放熱面となり大きな冷却効果を得られる。また、放熱シート７は、ゴム製であるためパワー素子３の熱をヒートシンク１に伝えるとともに基板２とヒートシンク１の取付け誤差を吸収するので、圧力調整ネジ５の締付けによるパワー素子３へのストレスを軽減する。さらにＬ字金具４は、ヒートシンク１と接触側の横寸法に調整代を持たせるため短めとし、ネジ穴を用いてヒートシンク１背面の圧力調整ネジ５の締付けを調整することにより、パワー素子３と放熱シート７の締付け寸法Ａを変え、放熱シート７の圧縮量を変化させ、熱伝導率を自由に調整することができる。
FIG. 1 is a side cross-sectional view of a power element cooling apparatus showing an embodiment of the present invention.
The same parts are denoted by the same reference numerals and description thereof is omitted. The feature of the present invention is that an L-shaped metal fitting and a heat radiation sheet are provided. In the figure, 4 is an L-shaped metal fitting, 5 is a pressure adjusting screw, 6 is a fixing screw, and 7 is a heat dissipation sheet. The L-shaped metal fitting 4 has a screw hole for fixing the power element 3 and the heat dissipation sheet 7 to the heat sink 1 with a predetermined pressure. The pressure adjusting screw 5 adjusts the applied pressure using the screw hole of the L-shaped metal fitting 4. The heat dissipating sheet 7 is closely attached between the heat dissipating surface of the power element 3 and the heat sink 1 to dissipate the heat of the power element 3 to the heat sink 1.
In the assembly of the present invention, the heat radiating sheet 7 is sandwiched between the power element 3 and the heat sink 1, the L-shaped metal fitting 4 is attached to the power element 3, and is fastened with the pressure adjusting screw 5 from the back of the heat sink 1, and each component is fixed. Therefore, the conventional difficulty in aligning the power element 3 and the cooling fin 8 is eliminated. Further, since the heat sink 1 and the power element 3 and the L-shaped bracket 4 are in surface contact with each other in the rotation direction of the L-shaped bracket 4, the L-shaped bracket 4 is prevented from rotating, and can be easily assembled as compared with the conventional case. Can do. Further, since the pressure adjusting screw 5 is tightened from the heat sink 1 side, it is possible to arrange components near the power element 3.
Next, the operation will be described.
When the power element 3 is energized to generate heat, the generated heat is transferred to the heat sink 1 through the heat dissipation sheet 7 and radiated. The entire heat sink 1 becomes a heat radiating surface, and a large cooling effect can be obtained. Further, since the heat radiating sheet 7 is made of rubber, it transfers the heat of the power element 3 to the heat sink 1 and absorbs mounting errors between the substrate 2 and the heat sink 1, so that stress on the power element 3 due to tightening of the pressure adjusting screw 5 is reduced. Reduce. Further, the L-shaped metal fitting 4 is shortened in order to give an adjustment margin to the lateral dimension of the heat sink 1 and the contact side, and by adjusting the tightening of the pressure adjusting screw 5 on the back surface of the heat sink 1 using the screw hole, The thermal conductivity can be freely adjusted by changing the tightening dimension A of the heat radiation sheet 7 and changing the compression amount of the heat radiation sheet 7.
１ ヒートシンク
２ 基板
３ パワー素子
４ Ｌ字金具
５ 圧力調整ネジ
６ 固定ネジ
７ 放熱シート
８ 冷却フィン
DESCRIPTION OF SYMBOLS 1 Heat sink 2 Board | substrate 3 Power element 4 L-shaped metal fitting 5 Pressure adjusting screw 6 Fixing screw 7 Heat radiation sheet 8 Cooling fin
Claims (3)
前記パワー素子の放熱面と前記ヒートシンク間に密着して設けられた放熱シートと、前記パワー素子と前記放熱シートを前記ヒートシンクに所定の圧力にて固定しネジ穴を有するＬ字金具と、前記Ｌ字金具のネジ穴を用いて前記加圧力を調整する圧力調整ネジとを備えたことを特徴とするパワー素子冷却装置。 In a power element cooling apparatus comprising a heat sink provided in a unit, a substrate fixed to the heat sink, and a power element attached on the substrate,
A heat-dissipating sheet provided in intimate contact between the heat-dissipating surface of the power element and the heat sink; an L-shaped bracket having a screw hole in which the power element and the heat-dissipating sheet are fixed to the heat sink at a predetermined pressure; A power element cooling device, comprising: a pressure adjusting screw for adjusting the pressurizing force using a screw hole of a metal fitting.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003286856A JP2005057081A (en) | 2003-08-05 | 2003-08-05 | Power element cooling apparatus |
| PCT/JP2004/010468 WO2005013658A1 (en) | 2003-08-05 | 2004-07-23 | Power element cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003286856A JP2005057081A (en) | 2003-08-05 | 2003-08-05 | Power element cooling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2005057081A true JP2005057081A (en) | 2005-03-03 |
Family
ID=34113981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003286856A Pending JP2005057081A (en) | 2003-08-05 | 2003-08-05 | Power element cooling apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2005057081A (en) |
| WO (1) | WO2005013658A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11063495B2 (en) | 2019-07-01 | 2021-07-13 | Nidec Motor Corporation | Heatsink clamp for multiple electronic components |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61129344U (en) * | 1985-02-01 | 1986-08-13 | ||
| JPS6424850U (en) * | 1987-08-06 | 1989-02-10 | ||
| JP3686315B2 (en) * | 2000-07-18 | 2005-08-24 | 富士通アクセス株式会社 | Electronic component fixing structure |
-
2003
- 2003-08-05 JP JP2003286856A patent/JP2005057081A/en active Pending
-
2004
- 2004-07-23 WO PCT/JP2004/010468 patent/WO2005013658A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11063495B2 (en) | 2019-07-01 | 2021-07-13 | Nidec Motor Corporation | Heatsink clamp for multiple electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2005013658A1 (en) | 2005-02-10 |
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