JP2005056834A - Method for manufacturing display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a display panel with high characteristics and uniformity by suppressing gas generation caused by residue and bubbles of a binder component from a frit glass during encapsulating process of two substrates. <P>SOLUTION: A frit glass paste is applied to a back surface substrate (step S1), dried (step S2), and then heated in an atmospheric environment to a temperature higher than a temperature at which the binder component burns/decomposes and disappears and lower than a temperature at which the frit glass is softened, so that the binder in the paste is eliminated while the frit glass is not softened (step S3). Then the glass paste is heated in a vacuum environment to a temperature at which the frit glass is soften, or higher, allowing the glass paste to burn (step S4). The back surface substrate and a front surface substrate are overlapped through the frit glass and are encapsulated by heating (step S5). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a display panel produced by arranging two substrates parallel to each other and sealing the substrates, and more particularly, a plasma display panel (PDP), field emission, and the like. The present invention relates to a method for manufacturing a display panel such as a display device (FED: Field Emission Display) and a fluorescent display tube (VFD: Vacuum Fluorescent Display).

  Conventionally, a display panel in which two substrates are sealed using frit glass has been developed. Such display panels include a plasma display panel (PDP), a field emission display (FED), a fluorescent display tube (VFD), and the like. Hereinafter, a manufacturing method of this display panel will be described by taking a plasma display panel as an example.

  A plasma display panel is a display that causes a phosphor to excite and emit light by ultraviolet rays generated by gas discharge to perform display operation. First, the basic structure and manufacturing method of a plasma display panel will be described by taking a reflective AC surface discharge type as an example.

  FIG. 11 is a partial cross-sectional view showing one discharge cell of a reflective AC surface discharge color plasma display panel. As shown in FIG. 11, in this PDP, the rear substrate 1 and the front substrate 17 are arranged in parallel to each other, and the rear substrate 1 and the front substrate 17 are provided between them and in the peripheral region thereof. It is sealed with frit glass (not shown). A discharge gas is sealed in the sealed space. This sealing space is partitioned into a plurality of discharge spaces 14 by partition walls 2 formed in a lattice shape, a stripe shape, or a honeycomb shape. In addition, at least a part of the area where the partition wall 2 is provided is a display area for displaying an image.

  Hereinafter, the detailed configuration of the PDP will be described along the manufacturing process. FIG. 12 is a flowchart showing the conventional PDP manufacturing method, FIG. 13 is a plan view showing a frit glass paste application process in the PDP manufacturing method, and FIG. It is a graph which shows temperature profile in each process, taking temperature. First, a plurality of transparent electrodes 15 extending in one direction are formed on a surface on the display surface side of the PDP, on the surface of the front substrate 17 made of a transparent glass plate that faces the back substrate 1. In FIG. 11, the extending direction of the transparent electrode 15 is a direction perpendicular to the paper surface.

The transparent electrode 15 is formed of tin oxide (SnO ₂ ), indium tin oxide (ITO), or the like, and the bus electrode 16 is formed on the transparent electrode 15 in order to reduce the resistance. The bus electrode 16 is formed of a metal thick film made of silver or the like, a multilayer thin film such as (chrome / copper / chromium) or (chrome / aluminum), or a metal thin film such as an aluminum thin film. When the bus electrode 16 is formed of a thick silver film, some black pigment may be mixed in order to improve contrast. In many cases, a silver thick film containing a large amount of black pigment is disposed between the thick silver film and the transparent electrode, so that the silver film has a two-layer structure.

  A pair of surface discharge electrodes is constituted by two sets of transparent electrodes 15 and bus electrodes 16 adjacent to each other. Further, a pair of surface discharge electrode pairs pass through one discharge cell, and a pulsed AC voltage is applied between two transparent electrodes 15 constituting the surface discharge electrode pair, Display discharge is obtained.

  Next, the surface discharge electrodes, that is, the transparent electrode 15 and the bus electrode 16 are covered with the transparent dielectric layer 13. Usually, the transparent dielectric layer 13 is formed by applying a thick film paste mainly composed of low melting point lead glass on a substrate, and heating and baking to a temperature equal to or higher than the softening temperature of the low melting point lead glass. The film thickness of the transparent dielectric layer 13 is about 10 to 40 μm.

  Next, a protective layer (not shown) is formed so as to cover the transparent dielectric layer 13. Usually, the protective layer is a thin film made of MgO formed by vapor deposition or sputtering. The film thickness is about 0.5 to 2 μm. The role of this protective layer is to reduce the discharge start voltage and prevent the surface of the transparent dielectric layer 13 from being sputtered by the discharge.

  On the other hand, a plurality of data electrodes 10 for writing display data are formed on the back substrate 1 in parallel with each other. The direction in which the data electrode 10 extends is a direction orthogonal to the direction in which the surface discharge electrodes (the transparent electrode 15 and the bus electrode 16) extend when the rear substrate 1 is superimposed on the front substrate 17, and the arrangement interval of the data electrodes 10 Is an interval at which one data electrode 10 passes through each discharge cell. The data electrode 10 is a metal thick film made of silver or the like, a metal multilayer thin film such as (chrome / copper / chromium) or (chrome / aluminum), or a metal thin film such as an aluminum thin film.

  A thick film paste in which low melting point lead glass and a white pigment are mixed is applied and baked so as to cover the data electrode 10 to form a white dielectric layer 11 covering the data electrode 10. The white pigment is mixed in order to increase the reflectance of the white dielectric layer 11 and improve the luminance and luminous efficiency, and titanium oxide powder or alumina powder is usually used. The white dielectric layer 11 may not be provided.

  Next, the partition walls 2 are formed on the white dielectric layer 11. The material of the partition wall 2 is a mixture of low melting point lead glass and aggregate made of alumina or the like. A plurality of discharge spaces 14 are formed by the barrier ribs 2. The discharge space 14 is a discharge cell that discharges independently inside. As an example of the dimensions of the partition wall 2, when the trio pitch is 0.81 mm, the partition wall has a width of about 50 μm, a height of about 120 μm, and a high aspect ratio. The shape viewed from the display surface side is a lattice shape, a stripe shape, a honeycomb shape, or the like. The partition walls 2 are usually formed by sandblasting.

  Next, for each discharge space 14, the phosphor layer 12 corresponding to the emission color of each cell is applied to the upper surface of the white dielectric layer 11 and the side surfaces of the barrier ribs 2 by screen printing. By forming the phosphor layer 12 also on the side surfaces of the partition walls 2, the application area of the phosphor can be increased and high luminance can be obtained.

  Next, as shown in step S101 of FIG. 12 and FIG. 13, in order to attach the front substrate 17 and the rear substrate 1 together and to hermetically seal them, the surface of the rear substrate 1 on the side facing the front substrate 17 is placed. A frit glass paste 7 is applied around the area where the partition walls 2 are formed. For applying the paste 7, a dispenser or a screen printing method is usually used. The frit glass paste 7 is a mixture of low melting point lead glass powder, binder and solvent. As the binder, acrylic resin, ethyl cellulose resin or nitrocellulose resin is generally used. The frit glass paste may be applied to the front substrate 17 side, or may be applied to both the front substrate 1 and the rear substrate 17.

  Next, as shown in step S102 of FIG. 12, the back substrate 1 is heated to a temperature of about 100 to 250 ° C., and the frit glass paste 7 applied to the surface of the back substrate 1 is dried. Thereby, a solvent is vaporized and removed among the low melting point lead glass powder, the binder, and the solvent contained in the frit glass paste 7.

  Next, as shown in step S103 of FIG. 12 and FIG. 14, the dried frit glass paste 7 is heated to a temperature at which the frit glass softens to some extent or slightly higher, for example, a temperature of 380 to 550 ° C. Bake. Thereby, the binder component in the frit glass paste disappears by burning and decomposition, and the glass component is softened.

  Next, as shown in step S <b> 104 of FIG. 12, a sealing process is performed in which the rear substrate 1 and the front substrate 17 are bonded to each other in the atmosphere and hermetically sealed. In this sealing step, first, the front substrate 17 and the rear substrate 1 are overlapped with the frit glass paste 7 interposed therebetween. Then, the peripheral portions of the two superposed substrates are sandwiched with a jig and fixed by applying pressure. Next, as shown in FIG. 14, the two fixed substrates are heated to a temperature slightly higher than the temperature at which the frit glass softens. This heating is performed at atmospheric pressure (in air). Thereby, the back substrate 1 and the front substrate 17 are attached to each other, and a panel composed of two substrates is manufactured.

  Next, after this sealing step, an exhaust pipe (not shown) is connected to the panel and fixed with frit glass. The space in the panel is evacuated through this exhaust pipe. Thereafter, a dischargeable gas, for example, a mixed gas of Ne and Xe or a mixed gas of He, Ne, and Xe is sealed in the space at a pressure of about 50 kPa to 70 kPa. Thereby, a PDP as shown in FIG. 11 is manufactured.

  However, in this conventional PDP manufacturing method, combustion and decomposition of the binder component in the frit glass paste and softening of the glass component occur almost simultaneously in the frit baking step shown in step S103 of FIG. For this reason, after baking the frit glass paste, the binder component residue and bubbles are mixed in the frit glass. As a result, in the sealing step shown in step S104 of FIG. 12, when the frit glass is crushed by the two substrates, gas is generated from the residual binder components and bubbles remaining in the frit glass. Thereby, the inside of a panel is contaminated and the characteristic of a panel and the uniformity in a panel will be reduced. In some cases, the residue of the binder component and bubbles remaining in the frit glass after firing become defects, which causes panel leakage.

  Further, a protrusion is provided when the frit glass paste is applied, and a gap is secured between the front substrate 17 and the back substrate 1 until the frit glass is softened in the sealing step, and moisture adsorbed on the substrate surface and Technologies that make it easier to remove organic components have been developed. FIG. 15A is a plan view showing a frit glass paste application process in this conventional PDP manufacturing method, and FIG. 15B is a sectional view taken along line C-C ′ shown in FIG. As shown in FIGS. 15A and 15B, in this conventional manufacturing method, a frit glass paste 7 is applied on the back substrate 1, dried, and then dried on the frit glass paste 7. The frit glass paste is applied again to the part and dried to provide the frit protrusion 8. A plurality of frit protrusions 8 are formed at a predetermined interval, for example, an interval of about 10 cm, in the direction in which the frit glass paste 7 extends. In this way, the frit protrusion 8 is formed by applying the frit glass paste twice and applying it repeatedly. The film thickness of the frit glass paste 7 after firing is usually about 100 to 400 μm, and the height of the frit protrusion 8 is usually about 50 to 300 μm.

  Thus, by providing the projections on the frit glass, it becomes easy to remove moisture and organic components adsorbed on the substrate surface in the sealing step. However, in this technique, when the frit glass is crushed, the frit protrusions 8 are also crushed and the gap between the front substrate 17 and the rear substrate 1 is also closed, so that the binder component is crushed when the frit glass is crushed. It is difficult to exhaust the gas generated from the residue and bubbles out of the panel.

  Moreover, in order to exhaust | emit efficiently the gas generated from this residue and a bubble, it is also considered to perform sealing in the vacuum atmosphere pressure-reduced rather than atmospheric pressure. However, in this case, the frit is vigorously foamed by the residue of the binder component and the bubbles in the frit glass, and irregularities are formed on the surface of the frit glass, resulting in panel leakage.

  For this reason, a technique has been proposed in which the baking process of the frit glass paste is performed in two stages: a heating process in a vacuum atmosphere and a heating process in a gas atmosphere (see, for example, Patent Document 1). In the method described in Patent Document 1, after applying a frit glass paste, the paste is heated to a temperature of 400 to 500 ° C. in a vacuum atmosphere to melt and foam the paste. Remove bubbles. Next, while heating in the same temperature range, dry nitrogen is injected into the atmosphere to form a gas atmosphere, and foaming is stopped while the paste is kept in a molten state. Thereby, the surface of the paste becomes smooth. Then, the paste is cooled and solidified, the back substrate and the front substrate are temporarily fixed and fixed, inspected, and then heated and sealed at a temperature of 450 ° C. in a gas atmosphere. Thereafter, a discharge gas is sealed in the panel to manufacture a PDP.

JP 2000-315457 A

  However, the conventional techniques described above have the following problems. In the technique described in Patent Document 1, after a frit glass paste is applied on the back substrate, it is heated to a temperature equal to or higher than the softening temperature of the frit glass in a vacuum atmosphere. As a result, although the solvent component and bubbles in the frit glass paste can be removed, the binder component cannot be burned and decomposed in a vacuum, and the binder component remains in the frit glass. Further, the binder component does not burn even in dry nitrogen. For this reason, in the subsequent sealing step, gas is generated from the binder component, contaminates the inside of the panel, and deteriorates the characteristics and uniformity of the panel.

  The present invention has been made in view of such a problem, and in a manufacturing method of a display panel formed by sealing two substrates, the residue of the binder component and bubbles from the frit glass in the sealing step. An object of the present invention is to provide a method for manufacturing a display panel that suppresses generation of gas due to this and has high characteristics and uniformity.

  The display panel manufacturing method according to the present invention is a display panel manufacturing method in which two substrates are sealed with frit glass, and a binder and bubbles are substantially formed in a region surrounding the display region on the surface of at least one of the substrates. The step of depositing the frit glass not included in the substrate, the one substrate and the other substrate are overlapped via the frit glass, and heated to a temperature equal to or higher than the softening temperature of the frit glass in a vacuum atmosphere. And a step of sealing two substrates.

  In the present invention, since the frit glass substantially free of binder and bubbles is deposited on the surface of the substrate, the frit glass is heated to a temperature equal to or higher than its softening temperature in a vacuum atmosphere and sealed. However, the frit glass does not foam. For this reason, contamination and leakage in the display panel can be prevented. Note that the vacuum atmosphere refers to an atmosphere whose pressure is lower than atmospheric pressure.

  Another display panel manufacturing method according to the present invention is a display panel manufacturing method in which two substrates are sealed with frit glass. At least one of the substrates has a frit glass and a binder in a region surrounding the display region. And an application step of applying a frit glass paste, and heating the substrate on which the frit glass paste is applied to a first temperature that is equal to or higher than a temperature at which the binder burns or decomposes and lower than a softening temperature of the frit glass. The binder removal step of removing the binder from the frit glass paste, and the substrate coated with the frit glass paste from which the binder has been removed to a second temperature that is equal to or higher than the softening temperature of the frit glass in a vacuum atmosphere. A baking step of baking the frit glass by heating, and this baking A sealing process in which a substrate coated with frit glass and the other substrate are overlapped with each other through the fired frit glass and heated to a temperature equal to or higher than the softening temperature of the frit glass to seal the two substrates. And a process.

  In the present invention, since the binder is removed from the frit glass paste in the debinding step, the binder residue and bubbles are not mixed in the frit glass in the firing step, and the gas is removed from the frit glass in the sealing step. Will not pollute the display panel and cause leaks.

  Further, the debinding step includes a first heating step for heating the substrate coated with the frit glass paste to the first temperature, and a first soaking step for maintaining the first temperature. The first temperature is preferably 300 ° C. or higher and lower than 400 ° C., and the first temperature is more preferably 320 to 380 ° C.

  Further, the baking step includes a second heating step of heating the substrate coated with the frit glass paste from which the binder has been removed to the second temperature, and a second soaking which maintains the second temperature. And a second cooling step for cooling from the second temperature. The firing step is preferably performed in an atmosphere having a pressure of 80 kPa or less, and in an atmosphere having a pressure of 20 kPa or less. More preferably.

  Still another display panel manufacturing method according to the present invention is a display panel manufacturing method in which two substrates are sealed with frit glass. In the display panel manufacturing method, at least one surface of the substrate is surrounded by a frit glass. A coating step of applying a frit glass paste containing no binder, and heating the substrate coated with the frit glass paste to a firing temperature equal to or higher than a softening temperature of the frit glass in a vacuum atmosphere; A baking step, a substrate on which the baked frit glass is adhered, and the other substrate are overlapped via the baked frit glass and heated to a temperature equal to or higher than the softening temperature of the frit glass. And a sealing step for sealing a single substrate.

  In the present invention, since the frit glass paste containing no binder is applied in the coating process, the binder residue and bubbles are not mixed in the frit glass in the baking process, and gas is released from the frit glass in the sealing process. As a result, the display panel is not contaminated or leaked. Further, there is no need to provide a step of removing the binder from the frit glass paste.

  Still another display panel manufacturing method according to the present invention is a display panel manufacturing method in which two substrates are sealed with frit glass. In the display panel manufacturing method, at least one surface of the substrate is surrounded by a frit glass. An arrangement step of arranging a frit glass member that contains substantially no binder and air bubbles, and a substrate on which the frit glass member is arranged and the other substrate are overlapped with each other through the frit glass member. And a sealing step of sealing the two substrates by heating to a temperature equal to or higher than the softening temperature.

  In the present invention, by disposing a frit glass member that does not contain a binder and bubbles on the substrate in the disposing step, gas is not released from the frit glass in the sealing step, and contamination and leakage in the display panel are prevented. Can be prevented. Further, the step of removing the binder from the frit glass and the step of baking the frit glass are not necessary.

  Moreover, you may have the guide formation process which forms the guide for positioning the said frit glass member on the surface of said one board | substrate before the said arrangement | positioning process. Accordingly, the frit glass member can be easily positioned in the arranging step, and the arranged frit glass member is not displaced in the sealing step. Further, the guide forming step is the same as the step of forming a partition for partitioning a plurality of display cells in the display region on the surface of the one substrate, and the guide can be formed simultaneously with the partition. . Thereby, it is not necessary to provide a dedicated process for forming the guide.

  Still another display panel manufacturing method according to the present invention is a display panel manufacturing method in which two substrates are sealed with frit glass. In the display panel manufacturing method, at least one surface of the substrate is surrounded by a frit glass. An application step of applying the frit glass paste, and a reduced-pressure baking in which the substrate on which the frit glass paste is applied is heated to a temperature equal to or higher than the softening temperature of the frit glass in an atmosphere having a pressure of 80 kPa or less. A step and a substrate on which the baked frit glass is adhered to the other substrate through the baked frit glass, and a temperature equal to or higher than the softening temperature of the frit glass in an atmosphere having a pressure of 80 kPa or less. And a reduced-pressure sealing step for sealing the two substrates by heating.

  Further, at this time, the frit glass paste contains a binder, and the substrate coated with the frit glass paste is at a temperature higher than the temperature at which the binder burns or decomposes between the coating step and the reduced-pressure firing step. And a binder removal step of removing the binder from the frit glass paste by heating to a temperature lower than the softening temperature of the frit glass.

  The display panel may be a plasma display panel, a field emission display device, or a fluorescent display tube.

  According to the present invention, since the frit glass substantially free of binder and bubbles is attached to the surface of the substrate, the binder component residue and gas due to the bubbles are generated from the frit glass in the sealing process. Is suppressed, and a display panel with high characteristics and uniformity can be manufactured.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings. In the following embodiments, a case where a plasma display panel is manufactured as a display panel will be described as an example. However, a case where a display panel other than a PDP such as a field emission display and a fluorescent display tube is manufactured is also shown below. This is the same as the embodiment.

  First, a first embodiment of the present invention will be described. FIG. 1 is a flowchart showing a method of manufacturing a PDP according to the present embodiment, and FIG. 2 is a graph showing temperature profiles in respective steps, with time on the horizontal axis and temperature on the vertical axis. Further, the configuration of the PDP manufactured by the method of manufacturing the PDP according to the present embodiment is the same as that of the conventional PDP shown in FIG.

  In this embodiment, the process performed before the process of apply | coating a frit glass paste is the same as that of the above-mentioned conventional manufacturing method. That is, as shown in FIG. 11, the data electrode 10, the white dielectric layer 11, the barrier ribs 2, and the phosphor layer 12 are formed on the surface of the rear substrate 1 facing the front substrate 17 by a method similar to the conventional method, A transparent electrode 15, a bus electrode 16, a transparent dielectric layer 13, and a protective layer (not shown) are formed on the surface of the front substrate 17 facing the back substrate 1.

Next, as shown in step S1 of FIG. 1, a frit glass paste 7 (see FIG. 13) is applied around the region where the partition walls 2 are formed on the surface of the back substrate 1 by a dispenser method or a screen printing method. A part of the region where the partition wall 2 is formed becomes a PDP display region. The components of the frit glass paste 7 are the same as those of the conventional frit glass paste, and are a mixture of a low melting point lead glass powder, a binder and a solvent. For example, as the low melting point lead glass, PbO.B ₂ O ₃ and It contains 87% by mass of PbTiO ₃ , 3% by mass of acrylic as a binder, and 10% by mass of terpineol as a solvent. In addition to the PbO.B ₂ O ₃ and PbTiO ₃ , various compositions can be considered as the low melting point glass, but the softening temperature is usually about 380 to 480 ° C. Moreover, as a binder, ethyl cellulose, nitrocellulose, etc. other than an acrylic are suitable in this embodiment. Further, the solvent is not limited to terpineol.

  Next, as shown in step S <b> 2 of FIG. 1, a “frit paste drying” process for drying the frit glass paste 7 is performed. That is, the back substrate 1 to which the frit glass paste 7 is applied is heated to a temperature at which the solvent component in the frit glass paste is vaporized, for example, a temperature of about 100 to 250 ° C. in the air atmosphere. Hold for about 30 to 30 minutes and then cool. As a result, the solvent component is removed from the frit glass paste, and the frit glass paste 7 is fixed on the back substrate 1 by the binder. The process up to this step is the same as the conventional PDP manufacturing method.

  Next, as shown in step S <b> 3 of FIG. 1, a “binder removal firing” step is performed. That is, as shown in FIG. 2, the dried frit glass paste is heated to a temperature that is equal to or higher than the temperature at which the binder component burns and decomposes and disappears in the atmosphere, and lower than the temperature at which the frit glass softens. Specifically, when acrylic is used as the binder, the acrylic decomposes at about 300 ° C. Therefore, when the softening temperature of the frit glass is 400 ° C., the heating temperature range in the “debinder baking” step is 300 ° C. or more and 400 ° C. Less than. The actual work is preferably performed in the range of 320 to 380 ° C. in view of the process margin. Then, the frit glass paste is kept in this temperature range for a certain time. It is preferable that the holding time (keep time) be as long as possible because the binder removal effect is increased, but a practical process time of about 15 minutes to 2 hours is appropriate. Even when a binder other than acrylic, for example, ethyl cellulose or nitrocellulose, is used, the temperature range of the “debinder firing” step can be determined in the same manner as when acrylic is used. Then, as described above, the frit glass paste is cooled after being heated. Note that the atmosphere in which the binder removal firing step is performed is not limited to the air atmosphere, but in the case where the binder is a material that burns and disappears, the atmosphere needs to contain oxygen.

  Since the frit glass is not softened in this debinder firing step, the burned / decomposed binder can be easily discharged out of the frit glass paste through the gaps between the frit glass particles. In this step, the binder component is substantially removed from the frit glass paste, but since the frit glass has not been softened, the frit glass particles are sintered at the contact portion leaving a gap between the particles. It will be in the state. The diameter of the frit glass particles is, for example, about several μm to several tens of μm.

  Next, as shown in step S4 of FIG. As shown in FIG. 2, in this reduced-pressure firing step, the frit glass paste 7 is heated to a temperature equal to or slightly higher than the temperature at which the frit glass in the frit glass paste softens in a vacuum atmosphere at a pressure lower than the atmospheric pressure. Heat to a high temperature, for example, 400 ° C. or higher, hold for a predetermined time, and then cool. In addition, although this decompression baking process has a certain effect if it is carried out in an atmosphere depressurized from atmospheric pressure, it is preferably carried out in a vacuum atmosphere having a pressure of 80 kPa or less, and a vacuum atmosphere having a pressure of 20 kPa or less. More preferably, it is carried out in the middle. However, it is not necessarily performed in a high vacuum atmosphere. In the debinding baking shown in step S3 of FIG. 2, the frit glass paste may be transferred to the reduced pressure baking shown in step S4 without being cooled after being heated and held.

  After the above-described debinding process, a slight amount of gas generated by combustion and decomposition of air and binder remains in the gaps between the adjacent frit glass particles. For this reason, when the frit glass is fired at a temperature equal to or higher than the softening temperature in the atmospheric pressure after the debinding step as described above, the air and gas between the particles are trapped in the softened frit glass. It becomes a bubble. This causes a problem in a later sealing process. That is, if sealing is performed at atmospheric pressure, the panel will be contaminated. Further, when sealing is performed in a vacuum, the frit is foamed violently, causing panel leakage.

  On the other hand, when the frit is fired in a vacuum atmosphere whose pressure is lower than atmospheric pressure as in the present embodiment, the air generated between the frit glass particles causing bubbles and the gas generated by the combustion and decomposition of the binder are generated. The frit glass is softened while being discharged from the frit. For this reason, there is substantially no bubble in the frit glass. Residue of the binder component has already been removed in the “debinder baking” step of the previous step. Of course, there is no strict residue, but it is possible to prevent gas from being generated from the residue and contaminating the panel or leaking due to foaming in the subsequent sealing process. Become. This state is defined as a state containing substantially no binder component and bubbles. When this is expressed by specific numerical values, it shows a state where there are almost no bubbles larger than 20 μm in diameter inside the frit.

  Next, as shown in step S5 of FIG. 1, a “sealing” step is performed. As described above, this step is performed both in an air atmosphere and in a vacuum atmosphere. In the present embodiment, the sealing step is performed in a vacuum atmosphere. That is, the rear substrate 1 and the front substrate 17 are overlapped, and the peripheral portions of the two overlapped substrates are temporarily fixed with a jig or the like to assemble the panel. In this state, it is heated to a temperature that is the same as or slightly higher than the temperature at which the frit glass softens in a vacuum atmosphere. This temperature is set to 400 to 480 ° C., for example. As a result, the frit glass is melted, and the back substrate 1 and the front substrate 17 are connected via the frit glass. Then, as shown in FIG. 2, after the frit glass reaches the maximum heating temperature, for example, 400 to 480 ° C., it is gradually cooled. In this cooling step, when the pressure in the atmosphere is restored from the vacuum state to almost atmospheric pressure, frit foaming can be more reliably suppressed, and panel leakage can be more reliably prevented. This is considered to be because the gap formed slightly in the softened frit can be crushed by the return pressure to make the frit uniform. This return pressure is performed using an inert gas such as dry air, dry nitrogen, or argon.

  The subsequent steps are the same as those in the conventional method for manufacturing a PDP. That is, an exhaust pipe (not shown) is connected to the panel and fixed with frit glass. The space in the panel is evacuated through this exhaust pipe. Thereafter, a dischargeable gas, for example, a mixed gas of Ne and Xe or a mixed gas of He, Ne, and Xe is sealed in the space at a pressure of about 50 kPa to 70 kPa. Thereby, a PDP as shown in FIG. 11 is manufactured.

  In the present embodiment, only the binder component is combusted and decomposed without softening the frit glass in the debinding process shown in step S3 of FIG. That is, since the binder component is burned and decomposed in a state where gaps are formed between the particles of the frit glass, the residue and bubbles of the binder component are not trapped in the frit glass, and the residue and bubbles are removed from the frit glass paste. Can be efficiently removed. In the conventional PDP manufacturing method shown in FIG. 14, this debinder firing step is not provided, and after applying and drying the frit glass paste, the “frit firing” step is performed immediately at atmospheric pressure, The “sealing process” is performed.

  Thus, in this embodiment, since the binder component is removed from the paste in the binder removal step, the air present between the frit glass particles in the reduced-pressure firing step shown in step S4 of FIG. The frit glass can be softened and fired while removing the gas generated by the combustion and decomposition of the binder component. As a result, the frit glass after firing can be made substantially free of bubbles and binder residues. Thereby, in the sealing step shown in step S5 of FIG. 1, the gas generated from the bubbles and the residue in the frit glass does not contaminate the inside of the panel and deteriorate the characteristics of the panel. In addition, the occurrence of leakage due to frit foaming can be prevented. For this reason, a high-quality PDP can be manufactured at a high yield and at a low cost.

  In the present embodiment, since sealing in a vacuum atmosphere is possible, moisture adsorbed on the substrate surface can be efficiently removed, and the inside of the panel can be cleaned extremely highly. it can. As a result, the uniformity of the panel, the panel characteristics after being left for a long time, and the reliability such as image sticking are remarkably improved. For example, in the case of a 42-inch VGA class plasma display panel, in the PDP manufactured by the conventional method, the variation in the discharge sustaining voltage is about 20 V, but in the PDP manufactured by the method of this embodiment, the discharge The variation of the sustain voltage was 5V or less.

  In addition, the trapezoidal temperature profile shown in FIG. 2 is an example, and is not limited to this profile. In FIG. 2, the profiles of the “vacuum firing” process and the “sealing” process are shown in the same shape, but they do not have to be the same and are usually different from each other.

  Next, a modification of this embodiment will be described. FIG. 3 is a flowchart showing a method for manufacturing a PDP according to this modification. As shown in step S6 of FIG. 3, in the present modification, the sealing step is performed in an air atmosphere. The other steps in this modification are the same as those in the first embodiment. In the present embodiment, in the sealing step, the back substrate 1 and the front substrate 17 are overlapped and temporarily fixed, and heated to a temperature that is the same as or slightly higher than the temperature at which the frit glass softens in the air atmosphere. This temperature is set to 400 to 480 ° C., for example. As a result, the frit glass is melted and the back substrate 1 and the front substrate 17 are connected to each other.

  In this modification, sealing is performed at atmospheric pressure, but the frit glass formed on the substrate is substantially free of bubbles and binder component residues, so the frit glass is softened in the sealing process. Even so, no gas is generated from the frit glass, and the inside of the panel is not contaminated. Moreover, the manufacturing cost of PDP can be reduced by performing a sealing process in air | atmosphere. The effects of the present modification other than those described above are the same as those of the first embodiment.

  Next, a second embodiment of the present invention will be described. FIG. 4 is a flowchart showing the method for manufacturing the PDP according to the present embodiment. In this embodiment, a binder-free paste that does not contain a binder component from the beginning is used as the frit glass paste. The composition of this binder-free paste is obtained by removing the binder component from the frit glass paste used in the first embodiment. In addition, the step before the step of applying the frit glass paste (binder free paste) in the present embodiment is the same as that in the first embodiment.

  After the phosphor layer 12 and the like are formed on the back substrate 1 by the same method as in the first embodiment, a binder is formed on the surface of the back substrate 1 (see FIG. 11) as shown in step S11 of FIG. Apply free paste. Since this binder-free paste does not contain a binder component, the debinding step as shown in the first embodiment is unnecessary. After the binder-free frit paste is applied to the substrate, as shown in step S12, “binder-free paste” It is possible to perform the “frit paste drying” process and immediately perform the “reduced pressure baking” process shown in step S13 of FIG. Thereafter, as shown in step S14 of FIG. 4, the sealing step is performed in a vacuum atmosphere or an air atmosphere. The conditions for each step shown in FIG. 4 are the same as those in the first embodiment. Further, the steps after the sealing step are the same as those in the first embodiment.

  In this embodiment, since a binder-free paste is used as the frit glass paste, the coating property is low, and the paste is easily peeled off from the substrate after coating and drying. Therefore, care must be taken when working. However, the present embodiment has a great advantage that the debinding baking process can be omitted as compared with the first embodiment described above. The effects of the present embodiment other than those described above are the same as those of the first embodiment described above.

  In the first and second embodiments described above, the frit glass is baked while being almost completely melted, and then an assembly and sealing process is performed. It is also possible to complete the frit firing at the stage where the gap remains between the particles and then perform the assembly / sealing process. However, in this case, it is necessary that the gaps between the particles are almost in communication with each other, and this gap is also in communication with the outside of the frit. If the gap communicates with the outside of the frit, the air and gas existing between the particles can be exhausted to the outside of the frit through the gap. Thereby, even when sealing is performed in a vacuum atmosphere, the generation of bubbles can be significantly suppressed.

  Next, a third embodiment of the present invention will be described. FIG. 5 is a flowchart showing a method for manufacturing a PDP according to the present embodiment, and FIGS. 6A and 6B are plan views showing the method for manufacturing the PDP in the order of steps. In the present embodiment, instead of applying paste-like frit glass on the substrate and performing drying, debinding, and firing as in the first embodiment, a predetermined shape such as a rod shape or a sheet shape is used in advance. A frit glass member shaped into a shape is placed on the substrate.

  That is, as shown in FIG. 6A, the data electrode 10 (see FIG. 11) and the white dielectric layer 11 (see FIG. 11) are formed on the back substrate 1 by the same method as in the first embodiment. The barrier ribs 2 and the phosphor layer 12 (see FIG. 11) are formed, and the transparent electrode 15 (see FIG. 11), the bus electrode 16 (see FIG. 11), and the transparent dielectric layer 13 are formed on the front substrate 17 (see FIG. 11). (See FIG. 11) and a protective layer (not shown) are formed.

  On the other hand, as shown in FIG. 6B, four rod-shaped shaped frit glass members 3 are produced. A method for producing the shaped frit glass member 3 may be the same as a generally known method for producing a glass rod, a glass tube, or the like.

  Next, as shown in step S21 in FIG. 5, in the “shaped frit placement” step, four shaped frit glass members 3 shaped in a bar shape in advance are used to form the partition walls 2 on the surface of the back substrate 1. It is arranged in a rectangular frame around the area. The composition of the shaped frit glass member 3 is the same as that of the glass component in the frit glass paste described in the first embodiment, but the major difference is that the frit glass is not powdery, but is a rod or sheet. This is the point that has been shaped. Therefore, in the present embodiment, the process of forming the frit glass on the substrate is only the “shaped frit placement” process shown in step S21, and the “frit paste drying” process is unnecessary. Further, since the shaped frit glass member 3 does not contain a binder component, the “debinder firing” step is not necessary.

  Next, as shown in step S22 of FIG. 5, a “sealing” step is performed. The conditions for the sealing step are the same as those for the sealing step in the first embodiment described above or its modification. That is, the sealing step may be performed in an air atmosphere or in a vacuum atmosphere. Other methods in the present embodiment are the same as those in the first embodiment described above.

  In this embodiment, since the shaped frit glass member 3 is substantially free of binder components and bubbles, it can be sealed well both in vacuum and in the air. Thus, the same effects as those of the first and second embodiments described above that the uniformity and reliability of the panel are high can be obtained. In particular, the point that this embodiment is superior to the first and second embodiments described above is that the paste application process and the drying process are not required, and the process can be greatly shortened, and the frit application process. If the cross-sectional shape is managed in the manufacturing stage of the shaped frit glass member 3, the frit film thickness is stable and troublesome frit. For example, it is not necessary to manage the film thickness at the time of application and the viscosity management of the frit paste. Thus, in the present embodiment, a high-quality PDP can be manufactured with a high yield and low cost.

  In this embodiment, as shown in FIG. 6B, four rod-shaped shaped frit glass members 3 are arranged so as to form a rectangular frame around the partition 2 formation region. However, the present invention is not limited to this. For example, five or more shorter shaped frit glass members may be arranged. Further, there may be a slight gap between the adjacent shaped frit glass members 3 or they may be in contact with each other. Further, the arrangement method of the shaped frit glass member is not limited to the frame shape, and may be L-shaped or U-shaped, and the shaped frit glass member having a rectangular frame shape may be shaped and arranged in advance integrally. Good. Furthermore, the length of the shaped frit glass member may be shorter, for example, a block shape or a ball shape. Furthermore, the cross-sectional shape of the shaped frit glass member may be arbitrary, may be a rod-shaped glass member having a circular cross-sectional shape, may be a rod-shaped glass member having a quadrangular cross-sectional shape, and has a thin cross-sectional shape. A sheet-like glass member may be sufficient and a cross-sectional shape may be a triangle or an ellipse.

  Further, as described in the second embodiment, the shaped frit glass member is sintered between the frit glass particles, and the gap between the particles is substantially communicated with each other and communicated with the outside of the frit member. The same effect can be obtained even when the sintered body is used.

  Next, a fourth embodiment of the present invention will be described. FIGS. 7A and 7B are plan views showing the method of manufacturing the PDP according to this embodiment in the order of steps. This embodiment forms a guide for positioning the shaped frit glass member on the back substrate before placing the shaped frit glass member on the back substrate, as compared to the third embodiment described above. The point is different. Other methods in the present embodiment are the same as those in the third embodiment described above.

  That is, as shown in FIG. 7A, after forming the white dielectric layer 11 (see FIG. 11) on the surface of the back substrate 1, in the step of forming the partition wall 2, the frit glass member shaped in the later step is formed. A frame-shaped guide 4 is formed in a double manner so as to surround a region where 3 is to be arranged. The guide 4 is formed simultaneously with the partition wall 2. Next, the phosphor layer 12 (see FIG. 11) is formed. Next, as shown in FIG. 7B, the shaped frit glass member 3 is disposed in the region between the two guides 4. Subsequent steps are the same as those in the third embodiment.

  In the present embodiment, the guide 4 is formed on the back substrate 1 so that the shaped frit glass member 3 can be positioned more easily and accurately. In addition, in the sealing process, the back substrate 1 and the front substrate are connected to each other. When assembling a panel by overlapping, it is possible to prevent the position of the shaped frit glass member 3 from shifting. Moreover, by forming the guide 4 in the same process as the partition wall 2, it is not necessary to provide a dedicated process for forming the guide 4, and the number of processes does not increase. The effects of the present embodiment other than those described above are the same as those of the third embodiment described above.

  The guide 4 is not limited to a continuous shape as shown in FIG. 7B, and may be any shape that facilitates the positioning of the shaped frit glass member 3, and may be, for example, a dotted line. .

  Next, a fifth embodiment of the present invention will be described. FIGS. 8A and 8B are plan views showing the manufacturing method of the PDP according to this embodiment in the order of steps, and FIG. 9A is a partial plan view showing the steps shown in FIG. (B) is sectional drawing by the AA 'line shown to (a). As described in the prior art shown in FIGS. 15 (a) and 15 (b), a method of forming protrusions on the frit glass is known to remove moisture adsorbed on the substrate surface during sealing. Yes. This embodiment is an example which implement | achieves this projection part using the shaped frit glass member. This embodiment is different from the fourth embodiment described above in that a ladder-shaped guide is formed as a guide for the shaped frit glass member.

  In the present embodiment, as shown in FIG. 8A, a ladder-shaped guide 5 is formed simultaneously with the formation of the partition walls 2 on the rear substrate 1 after the white dielectric layer 11 (see FIG. 11) is formed. . As shown in FIG. 8A and FIG. 9A, the shape of the ladder-shaped guide 5 includes two pieces extending along the edge of the back substrate 1 so as to surround the region where the partition wall 2 is formed. It is comprised from the frame-shaped frame-shaped part 5a and the several connection part 5b which connects these two frame-shaped parts 5a. Thereafter, the phosphor layer 12 is formed on the white dielectric layer 11 and on the side surfaces of the barrier ribs 2.

  Next, as shown in FIG. 8B and FIGS. 9A and 9B, the region between the two frame-like portions 5a on the surface of the back substrate 1 is straddled across the connecting portion 5b. The shaped frit glass member 3 is disposed. At this time, the portion of the shaped frit glass member 3 located on the connecting portion 5b is lifted from the back substrate 1 by the connecting portion 5b, and a gap is formed between the back substrate 1 and the shaped frit glass member 3. . The method other than the above in this embodiment is the same as that in the above-described fourth embodiment.

  In the present embodiment, since a gap is formed between the shaped frit glass member 3 and the back substrate 1, moisture and the like adsorbed on the substrate surface can be efficiently exhausted in the sealing step. . Further, in the method of providing the frit paste protrusion 8 when applying the frit glass paste 7 as in the conventional method for manufacturing the PDP shown in FIGS. 15A and 15B, the application of the frit glass paste is performed. There is a disadvantage that the process needs to be repeated twice and the number of processes increases. On the other hand, in this embodiment, since the ladder-shaped guide 5 is formed in the process of forming the partition wall 2, the number of processes does not increase. The effects of the present embodiment other than those described above are the same as those of the fourth embodiment described above.

  In this embodiment, the shape of the guide is a ladder. However, the present invention is not limited to this, and a portion where the shaped frit glass member 3 is lifted from the substrate, that is, a structure serving as a protrusion on the substrate is provided. It may be formed. For example, the protrusion-like structure does not necessarily have to be connected to the portion (frame-like portion 5a) that performs the function of the guide, such as on the connecting portion 5b of the ladder-like guide 5, and may be an independent pattern such as a dot shape. Good.

  Next, a sixth embodiment of the present invention will be described. FIG. 10A is a plan view showing the method for manufacturing the PDP according to this embodiment, and FIG. 10B is a cross-sectional view taken along line B-B ′ shown in FIG. As shown in FIGS. 10A and 10B, in this embodiment, the shaped frit protrusion 6 is projected so as to protrude in a direction intersecting the longitudinal direction of the shaped frit glass member 3, for example, a direction orthogonal thereto. Form. When the shaped frit glass member 3 is disposed on the back substrate 1, the protrusion 6 is disposed so as to stand in a direction perpendicular to the surface of the back substrate 1. Other methods in the present embodiment are the same as those in the third embodiment described above.

  In the present embodiment, by forming the shaped frit projection 6 on the shaped frit glass member 3, in the sealing process, the projection 6 has a gap between the shaped frit glass member 3 and the front substrate. Form. As a result, in the sealing step, moisture adsorbed on the substrate surface can be efficiently exhausted. The effects of the present embodiment other than those described above are the same as those of the third embodiment described above.

  In the present embodiment, a guide for positioning the shaped frit glass member 3 may be provided as in the fourth embodiment. In this case, it is not necessary to form a protrusion for lifting the shaped frit glass member 3 in the guide, unlike the ladder guide shown in the fifth embodiment. In the present embodiment, the shaped frit protrusion 6 is formed so as to protrude in one direction orthogonal to the longitudinal direction of the shaped frit glass member 3, and the shaped frit glass member 3 is disposed on the substrate. Sometimes, the protrusions 6 are arranged so as to stand upright in a direction perpendicular to the substrate surface, but the present invention is not limited to this. For example, the same effect can be obtained by partially increasing the width of the shaped frit glass member 3.

  Next, a seventh embodiment of the present invention will be described. In this embodiment, in each of the above-described embodiments, when sealing is performed in a vacuum atmosphere, the frit glass for fixing the exhaust pipe connected to the panel to exhaust the gas in the panel is shaped frit glass. It is an example which forms with a member. Conventionally, the frit glass for fixing the exhaust pipe to the panel is formed by applying a frit glass paste or using a shaping material obtained by hardening the frit glass with a binder. However, since the frit glass formed in this manner contains a binder, when sealing is performed in a vacuum atmosphere, the frit glass foams and leaks in the panel.

  In order to prevent this, a shaped frit glass that does not substantially contain a binder component may be used. The shaped frit glass can be shaped by the following method, for example. That is, frit glass is mixed with a binder such as acrylic and a solvent, and the mixture is kneaded and put into a mold and shaped. Next, it is heated to a temperature at which the frit glass is sintered. At this time, the sintering conditions are adjusted so that the gaps between the sintered frit glass particles are substantially communicated with each other and with the outside. In addition to this method, there is also a method of firing at a temperature at which the binder burns and decomposes at atmospheric pressure, and then firing in a vacuum atmosphere. Since frit glass has a low softening temperature, shaping is easy. Thereby, even if it seals in a vacuum atmosphere, it can prevent more reliably that a leak arises in a panel.

  In each of the above-described embodiments, the example in which the frit glass is formed on the back substrate has been shown. However, the frit glass may be formed on the front substrate, and may be formed on both the front substrate and the back substrate. May be. Also in these cases, the method of forming the frit glass is the same as that in each of the embodiments described above.

  Further, in the present embodiment, an example of manufacturing an AC surface discharge type reflective plasma display panel as a display panel has been shown, but the present invention is not limited to this, and can be applied to plasma display panels of other systems. Needless to say. Of course, the present invention can also be applied to a display panel including a process of sealing two substrates with frit glass, such as a field emission display (FED) and a fluorescent display tube (VFD).

  The present invention can be suitably used for manufacturing a plasma display panel, a field emission display (FED), a fluorescent display tube (VFD) and the like.

It is a flowchart figure which shows the manufacturing method of PDP which concerns on the 1st Embodiment of this invention. It is a graph which shows temperature profile of each process in this embodiment, taking time on the horizontal axis and taking temperature on the vertical axis. It is a flowchart figure which shows the manufacturing method of PDP which concerns on the modification of this embodiment. It is a flowchart figure which shows the manufacturing method of PDP which concerns on the 2nd Embodiment of this invention. It is a flowchart figure which shows the manufacturing method of PDP which concerns on the 3rd Embodiment of this invention. (A) And (b) is a top view which shows the manufacturing method of this PDP in order of a process. (A) And (b) is a top view which shows the manufacturing method of PDP which concerns on the 4th Embodiment of this invention in order of a process. (A) And (b) is a top view which shows the manufacturing method of PDP which concerns on the 5th Embodiment of this invention in order of a process. (A) is a partial top view which shows the process shown in FIG.8 (b), (b) is sectional drawing by the A-A 'line | wire shown to (a). (A) is a top view which shows the manufacturing method of PDP which concerns on the 6th Embodiment of this invention, (b) is sectional drawing by the B-B 'line | wire shown to (a). It is a fragmentary sectional view showing one discharge cell of a reflection type AC surface discharge color plasma display panel. It is a flowchart figure which shows the manufacturing method of the conventional PDP. It is a top view which shows the application | coating process of the frit glass paste in the manufacturing method of this conventional PDP. It is a graph which shows the temperature profile in each process in the manufacturing method of the conventional PDP, taking time on a horizontal axis and taking temperature on a vertical axis. (A) is a top view which shows the application | coating process of the frit glass paste in the manufacturing method of the other conventional PDP, (b) is sectional drawing by the C-C 'line | wire shown to (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1; Back substrate 2; Partition 3; Shaped frit glass member 4; Guide 5; Ladder-shaped guide 5a; Frame-shaped part 5b; Connection part 6; Shaped frit projection part 7; Frit glass paste 8; Data electrode 11; white dielectric layer 12; phosphor layer 13; transparent dielectric layer 14; discharge space 15; transparent electrode 16; bus electrode 17;

Claims (31)

In the method for manufacturing a display panel in which two substrates are sealed with frit glass, a step of depositing frit glass substantially free of binder and bubbles in a region surrounding the display region on the surface of at least one of the substrates; A step of stacking the one substrate and the other substrate through the frit glass, and heating the frit glass to a temperature equal to or higher than a softening temperature of the frit glass in a vacuum atmosphere to seal the two substrates; A method for producing a display panel, comprising: In a method for manufacturing a display panel in which two substrates are sealed with frit glass, an application step of applying a frit glass paste containing frit glass and a binder to a region surrounding the display region on the surface of at least one of the substrates; A binder that removes the binder from the frit glass paste by heating the substrate coated with the frit glass paste to a first temperature that is equal to or higher than a temperature at which the binder burns or decomposes and lower than a softening temperature of the frit glass. A baking step of baking the frit glass by heating the substrate coated with the frit glass paste from which the binder has been removed to a second temperature that is equal to or higher than the softening temperature of the frit glass in a vacuum atmosphere; The substrate on which this baked frit glass is deposited and the other front A sealing step of stacking the substrates on the sintered frit glass and heating the frit glass to a temperature equal to or higher than a softening temperature of the frit glass to seal the two substrates. Panel manufacturing method. The debinding step includes a first heating step for heating the substrate coated with the frit glass paste to the first temperature, and a first soaking step for maintaining the first temperature. The manufacturing method of the display panel of Claim 2 characterized by these. The method for manufacturing a display panel according to claim 2, wherein the first temperature is set to be 300 ° C. or higher and lower than 400 ° C. 5. 5. The method of manufacturing a display panel according to claim 4, wherein the first temperature is set to 320 to 380.degree. 4. The method for manufacturing a display panel according to claim 3, wherein the holding time in the first soaking step is 15 minutes to 2 hours. The method for manufacturing a display panel according to claim 2, wherein the debinding step is performed in the atmosphere. The baking step includes a second heating step of heating the substrate coated with the frit glass paste from which the binder has been removed to the second temperature, and a second soaking step of maintaining the second temperature. A method for manufacturing a display panel according to any one of claims 2 to 7, further comprising a second cooling step of cooling from the second temperature. The method for manufacturing a display panel according to claim 2, wherein the second temperature is 400 ° C. or higher. The method for manufacturing a display panel according to claim 2, wherein the firing step is performed in an atmosphere having a pressure of 80 kPa or less. The method for manufacturing a display panel according to claim 10, wherein the firing step is performed in an atmosphere having a pressure of 20 kPa or less. In a method of manufacturing a display panel in which two substrates are sealed with frit glass, an application step of applying a frit glass paste that includes frit glass and does not include a binder in a region surrounding the display region on the surface of at least one of the substrates; A baking step of baking the frit glass by heating the substrate coated with the frit glass paste in a vacuum atmosphere to a baking temperature equal to or higher than the softening temperature of the frit glass, and the baking of the frit glass A sealing step of stacking the substrate and the other substrate through the fired frit glass and heating the substrate to a temperature equal to or higher than a softening temperature of the frit glass to seal the two substrates. A display panel manufacturing method characterized by the above. The said baking process has a heating process which heats the board | substrate with which the frit glass paste which does not contain the said binder was apply | coated to the said baking temperature, and a soaking | uniform-heating process hold | maintained at this baking temperature. The manufacturing method of the display panel of description. The method for manufacturing a display panel according to claim 12 or 13, wherein the firing temperature is 400 ° C or higher. The method for manufacturing a display panel according to claim 12, wherein the firing step is performed in an atmosphere having a pressure of 80 kPa or less. The method for manufacturing a display panel according to claim 15, wherein the firing step is performed in an atmosphere having a pressure of 20 kPa or less. The sintered frit glass is composed of a plurality of sintered particles leaving a gap between each other, and the gap between the particles communicates with each other and communicates with the outside of the frit glass. The manufacturing method of the display panel of any one of Claims 2 thru | or 16. In the method of manufacturing a display panel in which two substrates are sealed with frit glass, a frit glass member containing frit glass in a region surrounding the display region on the surface of at least one of the substrates and substantially free of binder and bubbles. An arrangement step of arranging, the substrate on which the frit glass member is arranged, and the other substrate are overlapped via the frit glass member, and heated to a temperature equal to or higher than the softening temperature of the frit glass, and the two substrates And a sealing process for sealing the display panel. 19. The method of manufacturing a display panel according to claim 18, wherein the frit glass member is formed by baking frit glass paste containing frit glass, a binder, and a solvent. 20. The method for manufacturing a display panel according to claim 18, wherein the frit glass member has a bar shape or a sheet shape. 21. The guide forming process according to claim 18, further comprising a guide forming process for forming a guide for positioning the frit glass member on a surface of the one substrate before the arranging process. Manufacturing method of display panel. The guide forming step is the same as a step of forming a partition for partitioning a plurality of display cells in a display region on the surface of the one substrate, and the guide is formed simultaneously with the partition. The manufacturing method of the display panel of Claim 21. A part of the guide is formed in a region where the frit glass is to be arranged in the guide forming step, and the frit glass member is disposed when the frit glass member is arranged on the one substrate in the arranging step. 23. The method for manufacturing a display panel according to claim 21, wherein a part of the guide is separated from the one substrate by a part of the guide. The frit glass member has a main body extending in one direction and a protrusion protruding from the main body in a direction intersecting the one direction. In the arranging step, the protrusion is formed from the surface of the substrate. The method for manufacturing a display panel according to any one of claims 18 to 22, wherein the frit glass member is disposed so as to stand upright. The method for manufacturing a display panel according to any one of claims 2 to 24, wherein the sealing step is performed in an atmospheric pressure. 25. The method of manufacturing a display panel according to claim 2, wherein the sealing step is performed in a vacuum atmosphere whose pressure is lower than atmospheric pressure. The sealing step includes a vacuum heating step in which the two substrates are heated to a temperature equal to or higher than the softening temperature of the frit glass in a vacuum atmosphere, and a return pressure cooling in which the two substrates are cooled from the temperature while returning. The method of manufacturing a display panel according to claim 26, further comprising: a process. A step of connecting an exhaust pipe to the sealed panel made of two sheets through a sintered body of frit glass substantially free of a binder, and a step of exhausting the inside of the panel through the exhaust pipe; The method of manufacturing a display panel according to claim 1, wherein In a method for manufacturing a display panel in which two substrates are sealed with frit glass, an application step of applying a frit glass paste containing frit glass to a region surrounding the display region on the surface of at least one of the substrates, and a pressure of 80 kPa A reduced-pressure firing step of firing the frit glass by heating the substrate coated with the frit glass paste in the following atmosphere to a temperature equal to or higher than the softening temperature of the frit glass, and a substrate on which the fired frit glass is deposited And the other substrate through the baked frit glass, and the pressure is reduced to seal the two substrates by heating to a temperature equal to or higher than the softening temperature of the frit glass in an atmosphere having a pressure of 80 kPa or less. A display panel manufacturing method comprising: a sealing step. The frit glass paste contains a binder, and the frit glass has a temperature equal to or higher than a temperature at which the binder burns or decomposes the substrate on which the frit glass paste is applied between the coating step and the reduced-pressure baking step. 30. The method of manufacturing a display panel according to claim 29, further comprising a binder removal step of removing the binder from the frit glass paste by heating to a temperature lower than the softening temperature of the frit glass paste. The method for manufacturing a display panel according to any one of claims 1 to 30, wherein the display panel is a plasma display panel, a field emission display device, or a fluorescent display tube.

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