JP2005052857A - Soldering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering apparatus for suppressing heat spots. <P>SOLUTION: A block-shaped heater unit 23 containing a sheath heater 46 and dissolving solder 21 contained in a soldering tank 22 is included. The solder 21 contained in the soldering tank 22 is dissolved by the block-shaped heater unit 23, so that the contact area of the heater unit 23 with the solder is made larger than that in the case that heaters are individually used so as to uniformize the surface temperature, and further, the surface shape is simplified to make the solder 21 smoothly flow in the soldering tank 22. Thus, heat spots can be suppressed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a soldering apparatus that supplies and solders a workpiece.

  2. Description of the Related Art Conventionally, as this type of soldering apparatus, a configuration is known in which a plurality of sheathed heaters for melting solder are arranged apart from each other in a vertical direction in a solder bath containing solder. These sheathed heaters are accommodated in a substantially cylindrical protective tube welded to a solder bath.

  And this soldering apparatus pressurizes the solder melt | dissolved with the sheathed heater with an electromagnetic induction pump, supplies it to a nozzle, supplies solder from this nozzle to a workpiece | work, and solders (for example, refer patent document 1). ).

More specifically, as shown in FIG. 7, a plurality of cylindrical protective tubes 3 are welded to the solder vessel 2 in which the solder 1 is accommodated, being vertically separated from each other. The sheathed heaters 4 each having a circular cross section are accommodated. Further, in the solder tank 2, there are an electromagnetic induction pump 5 for pressurizing the melted solder 1 and nozzles 7 and 8 for supplying the solder 1 pressurized by the electromagnetic induction pump 5 to the workpiece 6, respectively. Is provided.
Japanese Patent Laid-Open No. 11-104817 (page 3, FIG. 3)

  However, in the above-described soldering apparatus, when the melted solder 1 is pressurized by the electromagnetic induction pump 5 and circulates in the solder bath 2, the protective tube 3 of the sheathed heater 4 as shown by the arrow shown in FIG. Since it flows while meandering along the surface of the protective tube 3, there is a possibility that a spot D of the solder oxide, that is, dross, is formed on the back side of the protective tube 3 in the flow direction of the solder 1 and a local high-temperature portion, that is, a heat spot is generated. In addition, there is a problem that the friction loss of the solder 1 due to convection becomes relatively large.

  In addition, when the protective tube 3 is thermally deformed, there is a problem that a heat spot may be generated at the point contact portion, and a crack may occur in the welded portion of the protective tube 3 due to the heat deformation force. ing.

  This invention is made in view of such a point, and it aims at providing the soldering apparatus which suppressed the heat spot, and this invention is soldering which can suppress a deformation | transformation of a heater unit. A device is provided.

  The invention described in claim 1 is a solder bath containing solder, a heater containing a block-like heater unit for melting the solder contained in the solder bath, and the solder bath dissolved in the heater unit. This is a soldering device equipped with a nozzle for supplying the solder to the workpiece moving on the upper side, and when the heaters are individually used, for example, by melting the solder accommodated in the solder bath with a block-shaped heater unit Compared to the above, the solder contact area of the heater unit is increased to make the surface temperature uniform, and the surface shape is simplified to guide the solder to flow smoothly in the solder bath, thereby suppressing heat spots.

  According to a second aspect of the present invention, in the soldering apparatus according to the first aspect, the heater is provided in a straight line, and the heater unit is a soldering apparatus provided with a plurality of the heaters. By providing a plurality of heater units, the heater can be easily detached from the heater unit, and maintenance is facilitated.

  According to a third aspect of the present invention, in the soldering apparatus according to the first or second aspect, the heater unit includes a plurality of block bodies that receive the heater and are engaged with each other so as to face each other. A plurality of engaging recesses respectively provided in mutually facing portions, and a plurality of protrusions provided alternately with the engaging recesses and engageable with the engaging recesses of the other block bodies The plurality of block recesses that accommodate the heater are alternately provided with a plurality of engagement recesses and a plurality of protrusions that engage with the engagement recesses of the other block bodies. Therefore, the heater unit can be prevented from being deformed.

  According to a fourth aspect of the present invention, in the soldering apparatus according to the third aspect, in a state in which the plurality of block bodies are engaged with each other, the protruding portion of one of the block bodies and the engaging recess of the other block body A soldering apparatus having a gap in the opposing direction formed between the protrusions of one block body and the engagement recesses of another block body in a state where a plurality of block bodies are engaged with each other. Due to the gap in the opposing direction formed between them, for example, expansion and contraction due to thermal expansion of the block body can be absorbed, and deformation of the heater unit can be more reliably suppressed.

  According to a fifth aspect of the present invention, in the soldering apparatus according to the third or fourth aspect, at least one of the heater units is a safety in which an upper portion of the block body protrudes above a solder surface in the solder bath. When a safety heater unit is provided separately by making the upper part of at least one block of the heater unit protrude above the solder surface of the solder bath to be a safety heater unit. Compared to the above, the structure is simplified and the manufacturing cost can be suppressed.

  According to the first aspect of the present invention, the solder contact area of the heater unit is increased by, for example, using the heater individually by dissolving the solder accommodated in the solder tank by the block-shaped heater unit. The surface temperature can be made uniform, the surface shape can be simplified, and the solder can be guided so as to flow smoothly in the solder bath, thereby suppressing heat spots.

  According to the second aspect of the present invention, by providing a plurality of linear heaters in the heater unit, the heater can be easily detached from the heater unit and can be easily maintained.

  According to the invention of claim 3, by providing a plurality of engaging recesses and a plurality of protrusions engaging with these engaging recesses in a plurality of block bodies that accommodate the heater, respectively, Deviation can be prevented and deformation of the heater unit can be suppressed.

  According to invention of Claim 4, the clearance gap of the opposing direction formed between the protrusion part of one block body, and the engagement recessed part of another block body in the state which engaged the several block body mutually Thus, for example, expansion and contraction due to thermal expansion of the block body can be absorbed, and deformation of the heater unit can be more reliably suppressed.

  According to the fifth aspect of the present invention, when the safety heater unit is provided separately by projecting the upper part of at least one block body of the heater unit upward from the solder surface of the solder bath, Compared to the above, the structure is simplified and the manufacturing cost can be suppressed.

  Hereinafter, the present invention will be described in detail with reference to the embodiment shown in FIGS.

  FIG. 6 shows a soldering system. This soldering system transports a workpiece W to be soldered between a pair of endless chains inside a device cover 11 to which a ventilation duct (not shown) is connected. As a conveyance conveyor 12 is provided. The conveyor 12 is disposed in an inclined manner so as to rise in the workpiece traveling direction. Further, in the device cover 11, along the conveyor 12, there are a spray fluxer 13 as a flux application device, a plurality of preheaters 14 as preheating devices, a jet soldering device 15, and a cooling device 16. They are sequentially arranged in the workpiece conveyance direction.

  The spray fluxer 13 sprays and applies a flux to the lower surface, which is the soldering surface of the workpiece W.

  The preheater 14 is provided at least on the lower side of the conveyor 12 and preheats to a predetermined temperature before the workpiece W is soldered.

  The cooling device 16 forcibly cools the workpiece W by blowing cold air onto the workpiece W soldered by the soldering device 15.

  As shown in FIG. 1, the soldering apparatus 15 includes a solder tank 22 that contains solder 21 to be soldered to the workpiece W, and the solder tank 22 includes a plurality of block-like pieces that dissolve the solder 21. Heater units 23 and electromagnetic induction pumps 24 that pressurize the solder 21 melted in the heater units 23 are provided on one side and the other side of the soldering device 15 in the workpiece transfer direction, respectively. Yes.

  The electromagnetic induction pump 24 has a primary iron core around which an induction coil 25 is wound outside the solder tank 22, and a secondary iron core 27 is arranged in the vertical direction inside the solder tank 22 via a solder rising passage 26. Is arranged. Furthermore, a suction port 28 is opened at the lower end of the solder rising passage 26, and a discharge port 29 is opened at the upper end.

  Then, each electromagnetic induction pump 24 supplies a current out of phase such as a three-phase alternating current to the induction coil 25 to generate a moving magnetic field in the solder rising passage 26, and the electric conductivity in the solder rising passage 26. Electromotive force due to electromagnetic induction is generated in the solder 21 of the solder, and the current due to this electromotive force flows in the magnetic flux of the moving magnetic field, thereby generating upward thrust on the solder 21 in the solder rising path 26, and from the discharge port 29. Solder 21 is discharged. These electromagnetic induction pumps 24 can adjust the discharge pressure by controlling the current supplied to the induction coil 25 by a controller (not shown) as control means.

  Nozzle fitting seats 31 are respectively provided at the upper ends of the solder rising passages 26 of the electromagnetic induction pumps 24, and primary nozzles 32 and secondary nozzles 33 as nozzles are fitted into these nozzle fitting seats 31, respectively. Has been.

  The solder 21 pressurized by the pump action of each electromagnetic induction pump 24 and rising in the solder rising passage 26 is guided upward by the primary nozzle 32 and the secondary nozzle 33 and opened at the upper ends of these nozzles 32 and 33. The jets 35 and 36 are respectively jetted from the jets 35 and 36 and supplied to the workpiece W moving on the upper side.

  The primary nozzle 32 supplies the solder 21 melted by the heater unit 23 to every corner of the substrate mounting component of the workpiece W by the turbulent primary jet wave 32a jetted from the jet port 35. .

  The secondary nozzle 33 shapes the soldering portion of the workpiece W by a static planar secondary jet wave 33a jetted from the jet port 36.

  The heater unit 23 is disposed between a plurality of upper heater units 23 a disposed on both sides of the upper nozzles 32 and 33 in the solder tank 22 and the lower secondary core 27 in the solder tank 22. And a lower heater unit 23b.

  As shown in FIGS. 1 and 2, the upper heater unit 23 a has a plurality of, for example, a pair of upper block bodies 41 as elongated and substantially rectangular parallelepiped block bodies. These upper block bodies 41 are made of, for example, stainless steel having a relatively large heat capacity, and are welded in the solder bath 22 in a state in which the longitudinal direction is directed in an orthogonal direction that is a direction that intersects the workpiece traveling direction.

  Each upper block body 41 has a pair of engagement recesses 42 at one end in the longitudinal direction and a pair of protrusions 43 that can engage with the engagement recesses 42 of the other upper block bodies 41, respectively. Is provided. The pair of upper block bodies 41 are engaged with each other with the engaging recesses 42 and the protrusions 43 facing each other.

  The pair of engaging recesses 42 are cut out in a substantially rectangular shape on the upper side of one side in the width direction of the upper block body 41 and the lower side of the other side part, and one end of the upper block body 41 in the longitudinal direction. The remaining portion of each is a pair of protrusions 43. For this reason, the pair of engaging recesses 42 and the pair of protrusions 43 are provided alternately.

  Further, the engaging recess 42 includes a contact portion 42a formed in an arc shape at a portion where the tip of the protruding portion 43 of the other upper block body 41 faces. Therefore, with the pair of upper block bodies 41 engaged with each other, the tips of the protrusions 43 of one upper block body 41 come into contact with the abutting portions 42a of the engagement recesses 42 of the other upper block body 41. Thus, the entire protrusion 43 does not completely fit into the engagement recess 42, and the longitudinal direction of the upper block body 41, which is the opposing direction, between the engagement recess 42 and the protrusion 43, that is, the workpiece traveling direction A clearance 44 is formed as a gap in a direction orthogonal to the direction.

  Furthermore, the upper heater unit 23a located at the last part and the foremost part of the solder tank 22 in the workpiece traveling direction is a safety heater unit 45 in which the upper part of the upper block body 41 protrudes upward from the solder surface. These safety heater units 45 dissolve the solder 21 located on the surface of the solder bath 22 when preparing a soldering system.

  Each upper block body 41 is provided with a plurality of heater housing recesses 47 each having a circular cross section in which a linear cylindrical sheathed heater 46 serving as a heater is housed. These heater accommodating recesses 47 are linearly provided from the other end portion in the longitudinal direction of the upper block body 41 to the vicinity of the one end portion, and are spaced apart so as to be parallel to each other in the vertical direction.

  On the other hand, the lower heater unit 23b has, as shown in FIGS. 3 to 5, for example, four lower block bodies 51 as substantially rectangular parallelepiped block bodies. These lower block bodies 51 are made of, for example, stainless steel having a relatively large heat capacity, and are welded in the solder bath 22 in a state in which the longitudinal direction is directed in an orthogonal direction that is a direction intersecting the workpiece traveling direction.

  Each of the lower block bodies 51 is provided with an engaging recess 52 and a protruding portion 53 that engages with the engaging recess 52 at one end in the longitudinal direction and at an upper portion or a lower portion adjacent to the one end. It has been. The four lower block bodies 51 are engaged with each other with the engaging recesses 52 and the protrusions 53 facing each other. As a result, the side blocks 51a of the lower block bodies 51 engaged with each other are substantially flush with each other.

  Here, each engaging recess 52 is formed at one end in the longitudinal direction of the lower block body 51 by cutting out one side in the width direction in the entire vertical direction, and at the top of the lower block body 51. Alternatively, it is formed in the lower portion, on the other side portion in the width direction, and the other side portion in the width direction is cut out in the entire longitudinal direction. Then, one end portion in the longitudinal direction of the lower block body 51 and the remaining portion at the upper portion or the lower portion are the protruding portions 53, respectively. For this reason, the engagement recesses 52 and the protrusions 53 are provided alternately in the width direction of the lower block body 51.

  Further, there is a lower side between the engagement recess 52 located at the longitudinal end of one lower block body 51 and the protrusion 53 located at the longitudinal end of the other lower block body 51. In a state where the block bodies 51 are engaged with each other, a clearance 54 is formed as a gap in the direction perpendicular to the longitudinal direction of the lower block body 51, that is, the workpiece traveling direction. In addition, it is considered that the thermal expansion is not large in the vertical direction of the lower block body 51, and in order to prevent dross stagnation when the molten solder 21 flows in the vertical direction, clearance is not generated. Does not form.

  Furthermore, for example, four heater housing recesses 57 having a circular cross section in which the sheathed heater 46 is housed are provided in the lower block body 51. These heater accommodating recesses 57 are linearly provided from the other end in the longitudinal direction of the lower block body 51 to the vicinity of the one end, and are spaced apart in the vertical direction.

  A support plate 58 that supports the lower portion of the lower block body 51 is provided at the bottom of the solder tank 22.

  Next, the operation of the above embodiment will be described.

  First, when assembling the upper heater unit 23a and the safety heater unit 45, one end portions of the pair of upper block bodies 41 are opposed to each other, and the upper block bodies 41 are abutted in the longitudinal direction of the upper block bodies 41. Thus, the protrusion 43 is engaged with the engagement recess 42 to integrally form the pair of upper block bodies 41.

  Further, when assembling the lower heater unit 23b, one end and the lower portion of the other lower block body 51 are opposed to one end and the upper portion of the lower block body 51 in the longitudinal direction, respectively. The one end and the lower part of the other lower block body 51 are opposed to one end and the upper part of the lower block body 51 in the longitudinal direction, and the lower block body 51 is abutted in the longitudinal direction and the vertical direction. The projecting portion 53 is engaged with the mating recess 52, and the four lower block bodies 51 are integrally formed.

  Then, the sheathed heater 46 is housed in the heater housing recesses 47 and 57 of the block bodies 41 and 51 welded to the solder bath 22 to form the heater unit 23.

  When this heater unit 23 is driven, the heat generated by the sheathed heater 46 is transmitted to the respective block bodies 41 and 51, the temperature is made uniform over the entire surface of each heater unit 23a and 23b, and the entire solder 21 in the solder bath 22 is made uniform. Dissolved in At this time, the solder 21 on the surface of the solder bath 22 is also melted by the safety heater unit 45.

  The solder 21 melted by the heater unit 23 is given an upward thrust by the electromagnetic induction pump 24, passes through the solder rising passages 26 and the discharge ports 29, and then the jet nozzles 35 of the primary nozzle 32 and the secondary nozzle 33. , 36, respectively.

  The solder 21 overflowed from the nozzles 32 and 33 returns to the solder bath 22 again, and is sucked from the suction port 28 while smoothly flowing from the upper side to the lower side on the surface of the heater unit 23 as shown in FIG. Circulate.

  Then, the workpiece W being conveyed by the conveyor 12 is coated with a flux by a spray fluxer 13 disposed at the front stage of the soldering device 15, and preheated to a predetermined temperature by the preheater 14, that is, preheated. After the primary jet wave 32a formed by the primary nozzle 32 is supplied to every corner of the workpiece W and soldered securely, the workpiece W further conveyed by the conveyor 12 On the other hand, the solder from the primary nozzle 32 is shaped and soldered by the secondary jet wave 33a formed by the secondary nozzle 33.

  The soldered workpiece W is cooled to a predetermined temperature by blowing cold air in the cooling device 16.

  Next, effects of the above-described embodiment will be listed.

  In the above embodiment, the solder 21 accommodated in the solder bath 22 is melted by the block-shaped heater unit 23.

  As a result, for example, compared to the conventional case where the sheathed heater is housed in a cylindrical protective tube or the like and used individually, the solder contact area of the heater unit 23 is increased and the surface temperature is made uniform. The surface shape of the solder 23 is simplified and the solder 21 is guided so as to flow smoothly in the solder bath 22, the friction loss of the solder 21 with respect to the heater unit 23 can be suppressed, and the stagnation point of the solder 21 is eliminated, and the solder oxide That is, it is possible to prevent stagnation of dross and the like, and to suppress the formation of a local high heat portion, that is, a heat spot.

  Further, by providing a plurality of linear sheathed heaters 46 in each heater unit 23, these sheathed heaters 46 can be easily detached from the heater housing recesses 47 and 57 of the block bodies 41 and 51, and can be easily maintained.

  Further, by increasing the surface area which is the solder contact area of the heater unit 23, the temperature of the entire heater unit 23 becomes lower than the temperature of the sheathed heater 46 alone. It is also possible to prevent cracks and the like from occurring in the welded portion.

  Furthermore, since the block bodies 41 and 51 have a relatively large heat capacity, that is, a heat mass, the temperature stability of the heater unit 23 can be improved and the solder temperature can be kept constant.

  In the upper heater unit 23a, a pair of engaging recesses 42 and a pair of protrusions 43 that engage with the engaging recesses 42 of the other upper block body 41 are provided at one end in the longitudinal direction of the upper block body 41. By providing them alternately, it is possible to prevent the upper block bodies 41 from shifting in the vertical direction and the width direction, and to suppress deformation of the upper heater unit 23a due to heat or the like.

  Further, in the lower heater unit 23b, engagement concave portions 52 are respectively provided at one end portion and an upper portion or a lower portion in the longitudinal direction of the lower block body 51, and protrusion portions 53 are alternately provided with the engagement concave portions 52, thereby providing 4 With the two lower block bodies 51 facing each other, the engaging recess 52 and the protrusion 53 that engages with the engaging recess 52 are all shifted in the same direction, so that the lower block bodies 51 can be prevented from shifting. The deformation of the lower heater unit 23b due to heat or the like can be suppressed.

  Further, by forming the engaging recesses 42 and 52 and the protrusions 43 and 53 into simple rectangular shapes, the processing of the block bodies 41 and 51 can be made relatively easy and the productivity can be improved.

  In a state where a plurality of block bodies 41 and 51 are engaged with each other, it is formed between the protrusions 43 and 53 of one block body 41 and 51 and the engagement recesses 42 and 52 of the other block bodies 41 and 51. The clearances 44 and 54 in the opposite direction absorb the expansion and contraction due to the thermal expansion of the block bodies 41 and 51, for example, and the thermal deformation of the heater unit 23 can be more reliably suppressed.

  Further, when the lower block bodies 51 are engaged with each other, the side surfaces 51a are substantially flush with each other, so that the solder 21 flows smoothly through the side surfaces 51a of the lower block body 51 and the dross stagnates. The portion can be further reduced.

  By projecting the upper part of the upper block body 41 of the upper heater unit 23a upward from the solder surface of the solder tank 22 to form the safety heater unit 45, for example, the structure is compared with the conventional case where the safety heater unit is provided separately. The manufacturing cost can be simplified, and so-called solder erosion in which the protective tube is eroded by solder as in the conventional case in which the sheathed heater is accommodated in the protective tube can be prevented.

  In the above embodiment, the soldering device 15 may be a local soldering device.

  The engaging recesses 42 and 52 and the protrusions 43 and 53 can have various other shapes, and three or more blocks can be provided in the block bodies 41 and 51, respectively.

  Furthermore, the heater unit 23 can be configured by combining three or more block bodies 41 and 51.

  The heater of the heater unit 23 may be a single meandering shape having parallel portions, or other linear heaters connected in parallel so that the end portions of the linear heaters are parallel to each other. Either configuration is possible.

1 is a longitudinal sectional view showing an embodiment of a soldering apparatus according to the present invention. It is a disassembled perspective view which shows the heater unit of a soldering apparatus same as the above. It is a disassembled perspective view which shows the heater unit of a soldering apparatus same as the above. It is a top view which shows a heater unit same as the above. It is a side view which shows a heater unit same as the above. It is explanatory drawing which shows the soldering system provided with the soldering apparatus same as the above. It is a longitudinal cross-sectional view which shows the soldering apparatus of a prior art example.

Explanation of symbols

W Work
15 Soldering equipment
21 Solder
22 Solder bath
23 Heater unit
Primary nozzle as 32 nozzles
33 Secondary nozzle as nozzle
41 Upper block body as block body
42, 52 Engaging recess
43, 53 Protrusion
44, 54 Clearance as clearance
45 Safety heater unit as a heater unit
46 Seeds heater as heater
51 Lower block body as block body

Claims (5)

A solder bath containing solder;
A heater unit and a block heater unit for melting the solder contained in the solder bath; and
A nozzle for supplying the solder in the solder bath melted by the heater unit to the workpiece moving on the upper side. The heater is provided in a straight line,
The soldering apparatus according to claim 1, wherein the heater unit includes a plurality of the heaters. The heater unit includes a plurality of block bodies that house the heater and are engaged with each other so as to face each other.
These block bodies
A plurality of engaging recesses respectively provided in portions facing each other;
The soldering apparatus according to claim 1, further comprising a plurality of protrusions provided alternately with the engagement recesses and capable of engaging with the engagement recesses of another block body. . In a state where a plurality of the block bodies are engaged with each other, a gap in the opposing direction is formed between the protruding portion of the one block body and the engaging recess of the other block body. The soldering apparatus according to claim 3. 5. The soldering apparatus according to claim 3, wherein at least one of the heater units is a safety heater unit in which an upper portion of the block body protrudes upward from a solder surface in the solder bath.

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