JP2005039046A - Edge-holding aligner - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an edge-holding aligner that can adjust the position of a substrate in a short time by preventing a positioning section from being positioned to a region in which the aligner is in contact with the substrate. <P>SOLUTION: The angle and position of a notch 17 is discriminated based on the detected results of second notch sensors 24a and 24b and an encoder 25. A control means 38 causes holding bodies 26 and 27 to hold a wafer 19 by angularly displacing a whirling arm 22 so that the holding bodies 26 and 27 and the notch 17 may be deviated relative to each other in the peripheral direction B. Since the notch 17 is not formed in the edges touched by the holding bodies 26 and 27, a first notch sensor 23 can satisfactorily detect the notch 17. Consequently, it is not required to shift the wafer 19 from the whirling arm 22 a plurality of times due to the substrate holding positions of the holding bodies 26 and 27 as in the case of the conventional technique. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an edge holding aligner that adjusts the position of a substrate by rotating the substrate while the substrate is held in contact with the edge of the substrate.

  In a substrate formed in a disk shape such as a semiconductor wafer, a notch or orientation flat may be formed as a positioning portion on the outer peripheral portion as a mark indicating a reference position in the circumferential direction of the substrate. The notch is a portion where a recess is formed by cutting the outer periphery of the substrate into a V shape. The orientation flat is a portion where a recess is formed by cutting the outer peripheral portion of the substrate into a string shape.

  When performing a surface treatment on a substrate, for example, a gate forming process on a semiconductor wafer, each substrate is set on a processing stage in a state where the angular position of the positioning portion matches a predetermined reference angular position. Is required.

  Usually, substrates are accommodated in a plurality of cassettes side by side in the vertical direction. Each substrate accommodated in the cassette is arranged with a positioning portion in a random state. The substrate is transferred from the cassette to the aligner by the substrate transfer device. The aligner adjusts and holds the positioning portion of the conveyed substrate at a predetermined reference angular position. Next, the substrate transport device transports the substrate whose position has been adjusted by the aligner to the processing stage, whereby the angular position of the positioning portion of the substrate can coincide with the reference angular position on the processing stage. Conventionally, an edge holding aligner that supports the edge of a substrate and adjusts the position of the substrate has been disclosed (see, for example, Patent Document 1).

  In the edge holding aligner disclosed in Patent Document 1, a substrate is transferred to a rotating holding body by a robot hand. The aligner detects the position of the notch by rotating the transported substrate once by the rotation holder, and adjusts the position of the substrate by angularly displacing the substrate so that the notch position becomes a predetermined reference angle position. .

  Next, the vertical movement holding body holds the substrate whose position has been adjusted and moves it upward relative to the rotation holding body. And the board | substrate hold | maintained at the holding body for an up-and-down movement is taken out from an aligner with a robot hand.

JP 2002-151577 A

  In the edge holding aligner disclosed in Patent Document 1, the rotary holding body is in contact with the edge of the substrate to hold the substrate. Therefore, when the notch is located in the edge region in contact with the rotating holder, the notch cannot be detected satisfactorily.

  In this case, it is necessary to change the substrate held by the rotary holding body to the vertical movement holding body or the robot hand. Then, after the rotation holding body is angularly displaced, it is necessary to hold the substrate again on the rotation holding body and perform the notch position detection operation again. In such a case, there is a problem that it takes time to adjust the position of the substrate by the aligner.

  Therefore, an object of the present invention is to provide an edge holding aligner that can adjust the position of a substrate in a short time without the presence of a positioning portion at a portion where the aligner and the substrate are in contact with each other.

The present invention is an edge holding aligner that determines a positioning portion provided in advance on a part of an edge of a disk-shaped substrate and adjusts and holds the position of the substrate based on the determination result,
The base,
A swivel arm having a predetermined swivel axis, supported by the base so as to be angularly displaceable about the swivel axis, and having a holding body that holds the edge of the substrate in a state where the substrate axis and the swivel axis coincide with each other;
Swivel arm drive means for driving the swivel arm to be angularly displaced about the swivel axis;
Holding body driving means for displacing and driving the holding body in the radial direction of a virtual circle centered on the turning axis;
Positioning unit first detection means that is provided on the base, faces the moving path of the edge of the substrate, and detects the presence or absence of the positioning unit by facing the positioning unit;
Positioning unit second detection means provided on the swivel arm, facing the movement path of the edge of the substrate, and detecting the presence or absence of the positioning unit by facing the positioning unit;
Angular position detection means for detecting the angular position of the swivel arm about the swivel axis;
The turning arm driving means is controlled to angularly displace the turning arm, and the position of the positioning part is determined based on the detection results of the positioning part second detecting means and the angular position detecting means during the angular displacement period. An edge holding aligner comprising: control means for controlling the driving means to angularly displace the swivel arm so that the holding body and the positioning portion are arranged at positions displaced from each other in the circumferential direction.

  In the present invention, the control means may be configured such that the swivel arm is disposed in a deliverable position range in which the substrate can be delivered to another substrate transport apparatus in a state where the positioning unit is disposed at a predetermined reference angular position. Further, before the holding body holds the substrate, the turning arm driving means is controlled to angularly displace the turning arm.

In addition, the present invention includes a replacement body that takes out the substrate from the holding body and holds the taken-out substrate on the holding body again, and maintains the swivel arm in an angularly displaceable state with the substrate removed from the holding body. It further includes a replacement arm driving means for displacing and driving the arm and the replacement arm.

  Further, in the present invention, the control means is configured such that the swing arm is disposed in a non-interference position range where the replacement arm and the swing arm do not interfere with each other in a state where the positioning unit is disposed at a predetermined reference angular position. Before the holding body holds the substrate, the turning arm driving means is controlled to angularly displace the turning arm.

  Further, the present invention is characterized in that a plurality of holding bodies are provided, and each holding body holds the board by cooperatively holding the board from both sides in the radial direction.

  In addition, the present invention further includes a deviation detecting means for calculating the deviation of the substrate with respect to the predetermined position by detecting the positioning portion of the substrate using the positioning portion first detecting means and the positioning portion second detecting means. Features.

The present invention also provides the edge holding aligner,
A substrate transfer device for transferring the substrate to the edge holding aligner,
The substrate transport apparatus is characterized in that the position of the substrate is corrected based on the displacement of the substrate detected by the displacement detection means of the edge holding aligner.

  According to the present invention, when the substrate is arranged coaxially with the pivot axis, the pivot arm is angularly displaced before the substrate is held. At this time, the positioning portion second detection means is angularly displaced in the circumferential direction around the turning axis while facing the edge of the substrate. The control means determines the angular position of the positioning portion based on the detection results of the positioning portion second detection means and the angular position detection means. When the positioning unit exists in the edge region facing the movement path of the positioning unit second detection unit, the control unit angularly displaces the swivel arm so that the holding body and the positioning unit are displaced from each other in the circumferential direction. And a holding body contacts a part of edge where the positioning part is not formed, and hold | maintains a board | substrate. If there is no positioning part in the edge region facing the movement path of the positioning part second detection means, the control means touches a part of the edge facing the movement path of the positioning part second detection means to touch the substrate. Hold.

  In this way, after holding the substrate by bringing the holding body into contact with a part of the edge where the positioning portion is not formed, the turning arm is angularly displaced. Then, the angular position of the positioning portion is determined based on the detection results of the positioning portion first detection means and the angular position detection means during the angular displacement period. Then, the turning arm is angularly displaced so that the positioning portion is arranged at the reference angular position.

  Since the positioning portion is not formed on a part of the edge in contact with the holding body, the positioning portion first detection means can detect the positioning portion satisfactorily without being affected by the holding body. In other words, it is possible to reliably determine the angular position of the positioning portion only by displacing the turning arm by one rotation angle at most after holding the substrate on the holding body. As described above, the positioning portion exists in a region different from the edge portion in contact with the holding body, and the substrate is moved a plurality of times with respect to the swivel arm due to the substrate holding position of the holding body as in the prior art. There is no need to change. Therefore, it is not necessary to change the substrate regardless of the substrate holding position of the holder, and it is not necessary to rotate the substrate one or more times. As a result, it is possible to reduce the time spent for determining the positioning portion of the substrate and shorten the time required for the substrate position adjusting operation.

  Further, according to the present invention, when the positioning unit is present in the edge region facing the movement path of the positioning unit second detecting means, the swivel arm is arranged in the deliverable position range with the positioning unit arranged at the reference angular position. As described above, the substrate is held after the swivel arm is angularly displaced. By holding the substrate in this manner, the wafer can be delivered to the other substrate transfer device without interference between the other substrate transfer device and the swivel arm.

  In this way, it is possible to prevent the other substrate transfer apparatus and the swivel arm from interfering with each other before the positioning unit is arranged at the reference angular position. If another substrate transfer device interferes with the swivel arm, it is necessary to change the wafer and hold it again. However, by preventing the interference as in the present invention, it is possible to shorten the time required for changing the wafer and to shorten the time. The position of the wafer can be adjusted.

  According to the present invention, when the positioning arm is adjusted to the reference angular position and the swing arm and another substrate transfer device interfere with each other, the substrate is taken out of the swing arm by the holding arm and the swing arm is angularly displaced. After that, the substrate is held again by the swivel arm. This makes it possible to achieve a positional relationship in which the swivel arm and the substrate transfer device do not interfere with each other with the positioning portion disposed at the reference angular position. Thus, even when the positioning portion is at an arbitrary position on the edge of the substrate, the substrate whose position has been adjusted can be transported to the substrate transport device.

  Further, according to the present invention, when the positioning portion is present in the edge region facing the movement path of the positioning portion second detection means, the swivel arm is disposed in the non-interference position range with the positioning portion disposed at the reference angular position. As described above, the substrate is held after the swivel arm is angularly displaced. Thereby, it is possible to prevent the turning arm and the holding arm from interfering with each other before the positioning portion is arranged at a predetermined reference angular position. Therefore, it is possible to reduce the possibility of having to change the substrate held by the swivel arm.

  If the swivel arm and the transfer arm interfere with each other, the number of times that the wafer is changed increases. However, as in the present invention, by preventing interference between the transfer arm and the swivel arm, the substrate is held from the swivel arm to the transfer arm. The number of times of replacement can be reduced, and the time spent for adjusting the position of the substrate can be shortened.

  Further, according to the present invention, the holding body sandwiches and holds the substrate from both sides in the radial direction of the substrate, so that it is possible to prevent the substrate from shifting when the substrate is rotated around the turning axis by the turning arm. The alignment accuracy can be improved. In addition, the swivel arm can be angularly displaced at a higher speed than when the holding body supports the substrate from below and holds the substrate. Thereby, the alignment operation can be further performed in a short time.

  Further, according to the present invention, since the positional deviation of the substrate can be calculated by the positioning part first detecting means and the positioning part second detecting means, it can be determined that the substrate is displaced. For example, when the deviation is large, it is possible to prevent the wafer and the edge holding aligner from being damaged by outputting an abnormal state and stopping the position adjustment operation.

  Further, according to the present invention, since the substrate transfer device can correct the deviation of the substrate, it is not necessary to be taught an accurate wafer arrangement position, and the teaching time can be shortened.

  FIG. 1 is a perspective view schematically showing an edge holding aligner 20 according to an embodiment of the present invention, and FIG. 2 is a plan view showing a part of the edge holding aligner 20 omitted. For ease of understanding, the drawings may be partially omitted or simplified in the drawings shown below.

  The edge holding aligner 20 (hereinafter simply referred to as the aligner 20) determines the angular position of the notch 17 formed on the edge 16 of the semiconductor wafer 19. Then, the position of the wafer 19 is adjusted based on the determination result. The notch 17 is a positioning part for adjusting the position of the semiconductor wafer 19, and is formed with a V-shaped notch that is inserted in the thickness direction of the wafer 19.

  The wafer 19 is carried into the aligner 20 by a robot hand 18 which is another substrate transfer device. The robot hand 18 contacts the edge 16 of the wafer 19 and carries the wafer 19 in a state of being supported from below. The robot hand 18 is formed in a Y shape, for example, and supports the wafer 19 at three or more edge portions that are different in the circumferential direction B of the wafer 19. The robot hand 18 has a movable holding piece capable of displacing the wafer 19 in the radial direction A, and a fixed holding piece fixed to the robot hand 18, and the movable holding piece is pressed by pressing the wafer with the movable holding piece by a plunger. The wafer 21 is clamped by the piece and the fixed clamping piece.

  Further, when the wafer 19 is transferred from the robot hand 18, the aligner 20 adjusts the position of the wafer 19 and holds it. Then, the wafer 19 whose position has been adjusted is unloaded from the aligner 20 by the robot hand 18, and is transferred to the robot hand 18 with its position adjusted.

  The aligner 20 includes a base 21, a swing arm 22, a first notch sensor 23, second notch sensors 24 a and 24 b, and replacement arms 32 to 35. The base 21 extends along a predetermined base axis L21 and is formed in a substantially long shape. The base axis L21 extends perpendicular to the turning axis L1. For example, the base 21 is formed in a substantially quadrangular prism shape, and has a predetermined longitudinal direction X, width direction Y, and height direction Z. These directions X, Y, and Z are orthogonal to each other. Further, the base 21 is formed in a hollow shape, and an internal space 46 is formed therein.

  The swivel arm 22 extends along a predetermined arm axis L22 and is formed in a substantially long shape. The turning arm 22 is provided on the base 21, and is provided so as to be angularly displaceable around a predetermined turning axis L1. Note that the predetermined turning axis L1 extends in the vertical direction in the embodiment of the present invention, and the arm axis L22 extends perpendicularly to the turning axis L1.

  The swivel arm 22 detachably holds the wafer 19 in a state where the axis L10 of the wafer 19 and the swivel axis L1 coincide. Further, the turning arm 22 angularly displaces the held wafer 19 around the turning axis L1. Hereinafter, the radial direction of the wafer 19 held by the turning arm 22, that is, the radial direction of the virtual circle centered on the turning axis L 1 is simply referred to as a radial direction A, and the circumferential direction of the wafer 19 held by the turning arm 22. That is, the circumferential direction B of the virtual circle is simply referred to as the circumferential direction B.

  The swivel arm 22 includes a substantially elongated arm body 100 extending along the arm axis L22, and holding bodies 26 and 27 provided at both ends 100a and 100b of the arm body 100. The arm body 100 extends perpendicularly to the turning axis L1, and the turning axis L1 is inserted through the middle portion in the longitudinal direction. Therefore, when the turning arm 22 is angularly displaced about the turning axis L1, the arm axis L22 is angularly displaced about the turning axis L1.

  Each holder 26 and 27 is provided to hold the wafer 19. The holding bodies 26 and 27 are arranged symmetrically with respect to the turning axis L1 in a virtual plane perpendicular to the turning axis L1. Each holding body 26, 27 is provided so as to be displaceable in the radial direction A. Each of the holding bodies 26 and 27 can hold the wafer 19 in cooperation by pressing the edge 17 of the wafer 19 inward in the radial direction A.

  The first notch sensor 23 is provided on the base 21. When the wafer 19 is disposed coaxially with the turning axis L1, the first notch sensor 23 faces a part of the edge 16 and detects whether or not the notch 17 is formed at the facing edge part. Accordingly, the first notch sensor 23 serves as a positioning unit first detection unit.

  The second notch sensors 24 a and 24 b are provided at both end portions 100 a and 100 b of the arm body 100, respectively, and are angularly displaced together with the turning arm 22. When the wafer 19 is arranged coaxially with the turning axis L1, the second notch sensor 24 is opposed to a part of the edge 16 and detects whether or not the notch 17 is formed at the opposed edge part. Accordingly, the second notch sensors 24a and 24b serve as positioning unit second detection means. For example, the first and second notch sensors 23, 24a, and 24b are realized by light detection sensors using optical fibers.

  The second notch sensors 24a and 24b may be fixed to the holding bodies 26 and 27, respectively. In this case, the second notch sensors 24 a and 24 b can be displaced in the radial direction A together with the holding bodies 26 and 27, and the notch 19 can be detected even if the wafer 19 has a different size.

  The holding arms 32 to 35 are used to adjust the angular position of the wafer 19 with respect to the turning arm 22. The holding arms 32 to 35 hold the wafer 19 in a detachable manner. The holding arms 32 to 35 hold the wafer 19 in a state where the axis L10 of the wafer 19 and the turning axis L1 coincide with each other, and hold the wafer 19 at the same height as the case where the turning arm 22 holds the wafer 19. .

  As for the exchange arms 32-35, the one end parts 32a-35a are supported by the base 21 so that angular displacement is possible. Further, the holding arms 32 to 35 are provided so that the other end portions 32 b to 35 b can approach and separate from the wafer 19 held by the turning arm 22. Specifically, the holding arms 32 to 35 are provided so as to be angularly displaceable around predetermined angular displacement axes L2 and L3. When the holding arms 32 to 35 are angularly displaced around the angular displacement axes L2 and L3, the holding arms 32 to 35 are displaced in directions toward and away from the wafer 19 held by the holding bodies 26 and 27.

  The angular displacement axes L2 and L3 extend along a plane perpendicular to the turning axis L1. In the embodiment of the present invention, the angular displacement axes L2 and L3 extend perpendicular to the base axis L21. Two or more holding arms 32 to 35 are provided to hold the wafer 19, and in this embodiment, four holding arms 32 to 35 are provided.

  In order to hold the wafer 19, the replacement arms 32 to 35 are provided with replacement bodies 28 to 31 at the other end portions 32 b to 35 b, respectively. The holding arms 32 to 35 can hold the wafer 19 by the holding bodies 28 to 31 holding the edge 16 of the wafer 19 in cooperation with each other.

  As shown in FIG. 2, the aligner 20 includes a swing arm driving means 36 that angularly drives the swing arm 22 around the swing axis L1, and a holding body drive that drives each of the holding bodies 26 and 27 in one radial direction A. Means 40 and a replacement arm driving means 37 for angularly driving the replacement arms 32 to 35 around the angular displacement axes L2 and L3. The robot hand 18 is driven to be displaced by a robot hand driving means 39.

  FIG. 3 is an enlarged cross-sectional view of the holding body 26 when viewed from a virtual plane perpendicular to the turning axis L1. FIG. 4 is an enlarged plan view showing the holding body 26. Since the first and second holding bodies 26 and 27 have the same configuration, only one holding body 26 will be described, and description of the other holding body 27 will be omitted.

  The holding body 26 is formed with a contact piece 70 that contacts the wafer 19. The contact piece 70 includes a support portion 101 that supports the wafer 19 from one side in the thickness direction, for example, the lower side, and a protruding portion 102 that protrudes from the radial direction A outer side portion 101a of the support portion 101 in the height direction one Z1. And have. One height direction Z <b> 1 is parallel to the turning axis L <b> 1 and is a direction from the base 21 toward the turning arm 22. In the present embodiment, the height direction one Z1 is the upward direction.

  The support portion 101 is formed with an inclined surface 99 that is inclined downward as it goes inward in the radial direction A. As a result, when the wafer 19 is mounted on the support portion 101 of each of the holding bodies 26 and 27, the lower surface 13 of the edge 16 and the support portion 101 are in point contact.

  As shown in FIG. 4, the protrusion 102 is formed such that a surface 98 facing the edge 16 is curved outwardly in the radial direction A. For example, the surface 98 facing the edge 16 of the protrusion 101 has a radius of curvature that is approximately the same as the radius of the wafer 19. As a result, when the holding bodies 26 and 27 move inward in the radial direction A, the edge 16 comes into surface contact with the holding bodies 26 and 27.

  When the two holding bodies 26 and 27 move inward in the radial direction A, the edge 16 of the wafer 19 arranged coaxially with the pivot axis L1 can be cooperatively held and the wafer 19 can be held. When the two holding bodies 26 and 27 move outward in the radial direction A, the holding of the wafer 19 by the holding bodies 26 and 27 is released.

  Since the holders 26 and 27 are arranged point-symmetrically with respect to the turning axis L1, the axis L10 of the wafer 19 does not deviate from the turning axis L1 when the holders 26 and 27 come into surface contact with the edge 16, respectively. The wafer 19 can be held.

  The contact piece 70 is detachably coupled to the remaining portions of the holding bodies 26 and 27 by screw members 71 and 72 so that the position thereof can be adjusted in the radial direction A. As a result, the positions of the holding bodies 26 and 27 in the radial direction A can be finely adjusted, and the wafer 19 can be securely held coaxially with the turning axis L1.

  FIG. 5 is an enlarged cross-sectional view of the transfer arm 32 as seen from a virtual plane including the turning axis L1 and the base axis L21. Since each of the replacement arms 32 to 35 has the same configuration, only one replacement arm 32 will be described, and description of the other replacement arms 33 to 35 will be omitted.

  The holder 28 is formed with a fitting portion 97 into which the edge 16 of the wafer 19 is fitted. The fitting portion 97 is formed with a recess 93 that is recessed outward in the radial direction A when the holding arm 32 moves to a holding position for holding the wafer 19. The fitting portion 97 has fitting surfaces 95 and 96 facing the edge 16 in a state where the wafer 19 is fitted, and the fitting surfaces 95 and 96 are moved when the holding arm 32 moves to a predetermined holding position. In addition, the first inclined surface 95 and the second inclined surface 96 that are separated from each other in the height direction Z toward the outside in the radial direction A are provided. The wafer 19 is in contact with the first inclined surface 95 and the second inclined surface 96, respectively.

  The vertical position of the boundary 95 between the first inclined surface 95 and the second inclined surface 96 coincides with the vertical position in the middle of the thickness direction of the wafer 19 when the wafer 19 is held on the turning arm 22. As a result, the wafer 19 can be exchanged by the swing arm 22 and the exchange arms 32 to 35 without displacing the wafer 19 in the vertical direction.

  Such a replacement body 28 is provided at the other end 32 b of the replacement arm 32. One end 32a of the transfer arm 32 is connected to the base 21 via a bearing. The angular displacement center of the bearing is the angular displacement axis L2 of the holding arm 32. As a result, the holding arm 32 is provided to be angularly displaceable about the angular displacement axis L2.

  Further, when the exchange arm 32 is disposed at the holding position, when viewed in a virtual plane including the turning axis L1 and the base axis L21, the angular displacement axis L2, the edge 16 and the exchange body 28 of the exchange arm 32. A straight line 94 connecting the position where the two and the contact point extend in parallel with the turning axis L1. As a result, even when the transfer body 28 presses the wafer 19 inward in the radial direction A, only a force is applied to the wafer 19 in the radial direction A, and a force is applied in the thickness direction of the wafer 19. It is never done.

  Further, when the movable arm 32 is angularly displaced from the holding position and the movable body 28 is angularly displaced to the retracted position moved outward in the radial direction A, the outer side of the occupied area necessary for the angular displacement of the turning arm 22 is increased. The transfer arm 32 moves to the position. Accordingly, the transfer arm 32 moved to the retracted position does not hinder the angular displacement of the swing arm 22.

  The four interchangeable arms 32 to 34 are arranged at positions shifted from each other in the circumferential direction B. Of the four transfer arms 32 to 35, the first and fourth transfer arms 32 and 35 are arranged symmetrically with respect to the turning axis L1, and the second and third transfer arms 33 and 34 also turn. They are arranged point-symmetrically with respect to the axis L1. As a result, the wafer 19 can be held without the axis L10 of the wafer 19 deviating from the turning axis L1. The angular displacement axis L2 of the first and second interchangeable arms 32, 33 extends coaxially, and the angular displacement axis L3 of the third and fourth interchangeable arms 34, 35 extends coaxially.

  FIG. 6 is a cross-sectional view of the aligner 20 as seen from the section line S6-S6 in FIG. The turning arm 22 is angularly driven around the turning axis L1 by a servo motor 36 which is a turning arm driving means. The servo motor 36 has a built-in encoder 25 and can detect the angular position of the swivel arm 22 based on an encoder value that is a detection value of the encoder 25. Therefore, the encoder 25 serves as an angular position detection unit that detects the angular position of the swing arm 22 around the swing axis L1.

  Two arm-side detection units 103 and 104 are provided at both longitudinal ends 100a and 100b of the arm body 100, respectively. The arm side detection units 103 and 104 have a substantially C-shaped cross section in a virtual plane including the turning axis L1 and the arm axis L22, and the circumferential end portions 103a and 104a of the arm side detection units 103 and 104 are arm bodies. It is provided on the 100 side.

  The other circumferential end portions 103b and 104b of the arm side detection portions 103 and 104 extend upward from the circumferential one end portions 103a and 104a, and further curve inward in the radial direction A. When the wafer 19 is arranged coaxially with the turning axis L1, the edge 16 is arranged in the space between the circumferential one ends 103a, 104a and the circumferential other ends 103b, 104B of the arm side detection units 103, 104. The

  Each arm-side detection unit 103, 104 includes a second notch sensor 24a, 24b. The second notch sensors 24 a and 24 b include a light projecting unit 105 and a light receiving unit 106. The light projecting unit 105 is built in the other circumferential end portions 103b and 104b of the arm side detection units 103 and 104, and is parallel to the turning axis L1 toward the circumferential end portions 103a and 104a of the arm side detection units 103 and 104. Flood light. The light receiving unit 106 is built in the circumferential end portions 103 a and 104 a and receives light from the light projecting unit 105. The light projecting unit 105 and the light receiving unit 106 are realized using optical fibers, for example. By using an optical fiber, a notch can be detected with high accuracy.

  When the light projecting unit 105 and the light receiving unit 106 are realized using optical fibers, a fiber control device that controls the optical fibers is built in the arm body 100. The fiber control device includes, for example, an amplifier device 120 that amplifies light passing through the fiber. Whether the edge 16 exists between the light projecting unit 105 and the light receiving unit 106 based on the light receiving state of the light receiving unit 106 when the second notch sensors 24 a and 24 b project light from the light projecting unit 105. Can be determined.

  The amplifier device 120 is preferably provided on the outer side in the radial direction A of the arm main body 100. As a result, the change in the amount of light due to the bending of the optical fiber cable can be reduced, and the presence or absence of the notch 17 can be determined with higher accuracy.

  FIG. 7 is a cross-sectional view of the aligner 20 as seen from the section line S7-S7 in FIG. The base 21 has a base body 109 extending along the base axis L21. The base body 109 is provided with a base side detection unit 107 that protrudes upward from the one end portion 21a in the longitudinal direction X, which is one in the height direction Z1. The base side detection unit 107 is provided at a position that does not hinder the angular displacement of the turning arm 22. A bent portion 108 that bends inward in the radial direction A is formed at one end 107 a in the height direction of the base side detection unit 107. When the wafer 19 is disposed coaxially with the turning axis L 1, the edge 16 is disposed between the bent portion 108 and the base body 109. Further, between the bent portion 108 and the base body 109, the end portion in the longitudinal direction of the turning arm 22 that is angularly displaced is formed so as to be able to pass therethrough.

  The base side detection unit 107 incorporates the first notch sensor 23. The first notch sensor 23 includes a light projecting unit 110 and a light receiving unit 111. The light projecting unit 110 is built in the bent portion 108 and projects light toward the base body 109 in parallel with the turning axis L1. The light receiving unit 111 is built in the base main body 109 and receives light from the light projecting unit 110. The optical unit 110 and the light receiving unit 111 are realized using an optical fiber, for example. By using an optical fiber, a notch can be detected with high accuracy.

  When the light projecting unit 110 and the light receiving unit 111 are realized using optical fibers, a fiber control device that controls the optical fibers is built in the base body 109. The fiber control device includes an amplifier device 112, for example. The first notch sensor 23 determines whether or not the edge 16 exists between the light projecting unit 110 and the light receiving unit 111 based on the light receiving state of the light receiving unit 111 when light is projected from the light projecting unit 110. judge.

  FIG. 8 is a plan view showing a state in which the axis L10 and the turning axis L1 of the wafer 19 are arranged coaxially. FIG. 9 is a graph showing the relationship between the amount of light received by the light receiving unit 111 and the angular position of the turning arm 22. The base side detection unit 107 projects light from the light projecting unit 110 to the edge 16 of the wafer 19 in a state where the wafer 19 is disposed coaxially with the turning axis L1. When the notch 17 and the base side detection unit 107 are arranged at different positions in the circumferential direction, the light 15 projected from the light projecting unit 110 is blocked by the edge 16 and does not reach the light receiving unit 111. When the wafer 19 is angularly displaced together with the turning arm 22 so that the base side detection unit 107 and the notch 17 face each other, the light 14 projected from the light projecting unit 110 passes through the space formed by the notch 17. The light receiving unit 111 receives the light from the light projecting unit 110.

  That is, when the light receiving unit 111 receives light from the light projecting unit 110, the notch 17 is disposed at a position where the base side detection unit 110 and the notch 17 face each other. The angular position of the notch 17 can be determined by detecting the angular position of the turning arm 22 at the time of light reception by the light receiving unit 11 with the encoder 25. 8 indicates a movement path along which the light 14 from the light projecting unit 110 moves when the wafer 19 is angularly displaced. The first notch sensor 23 is arranged on the base side detection unit 107 so that part or all of the light from the light projecting unit 110 passes through the notch 17.

  The arm side detection units 103 and 104 shown in FIG. 6 are also the same, and when the light receiving unit 106 receives light from the light projecting unit 105, the arm side detection units 103 and 104 and the notch 17 face each other. , A notch 17 is arranged. Therefore, the angular position of the notch 17 can be determined by detecting the angular position of the turning arm 22 at this time.

  FIG. 10 is a block diagram showing an electrical configuration of the aligner 20. The aligner 20 further includes control means 38. As described above, the swing arm driving means 36 angularly drives the swing arm 22 around the swing axis L1. The exchange arm drive means 37 angularly drives the exchange arms 32 to 35 around predetermined angular displacement axes L2 and L3. The holding body driving means 40 drives the holding bodies 26 and 27 to move in the radial direction A.

  The encoder 25 detects the angular position of the swing arm 22 and gives the detection result to the control means 38. Further, the first notch sensor 23 and the second notch sensors 24 a and 24 b give a detection result indicating the presence or absence of the notch 17 to the control means 38. The control means 38 detects the angular position of the notch 17 based on the detection result of each notch sensor 23, 24a, 24b and the detection result of the encoder 25 so that the notch 17 moves to a predetermined reference angular position. The swing arm driving means 36, the transfer arm driving means 37 and the holding body driving means 40 are controlled. Further, the control means of the present embodiment may control the robot hand driving means 39 that drives the robot hand 18.

  The control means 38 is realized by a computer. For example, the control means 38 includes a storage means and a calculation means. The storage means stores in advance an operation program for executing an operation to be described later. And the operation | movement program memorize | stored in the memory | storage means can perform the operation | movement mentioned later, when an arithmetic unit runs. The aligner 20 has notification means for notifying that it is in an abnormal state. The notification means is realized by a speaker, a display, or the like. As a result, the operator can be notified of the abnormal state.

  FIG. 11 is a cross-sectional view specifically showing the aligner 20 in a state where the arm axis L22 and the base axis L21 are parallel to each other. The swing arm 22 may be parallel to the arm axis L22 and the base axis L21 by angular displacement about the swing axis L1.

  The base 21 incorporates a servo motor 36 and an encoder 25 which are swing arm driving means. The swivel arm 22 has a connecting portion 41 that continues from the arm body 100 to the base 21 along the swivel axis L1. The connecting portion 41 extends coaxially along the turning axis L1 and is formed in a hollow cylindrical shape. The connecting portion 41 is connected to the base 21 via a bearing 43 so as to be angularly displaceable about the turning axis L1. The power from the servo motor 36 is transmitted to the connecting portion 41 by the power transmission mechanism 42. The power transmission mechanism 42 is preferably realized by, for example, a gear group and a belt, and preferably includes a speed reduction mechanism that transmits the power of the servo motor 36 at a reduced speed.

  The internal space 45 of the connecting portion 41 communicates the internal space 44 of the arm main body 100 and the internal space 46 of the base 21. A cable for transmitting signals and power to the turning arm 22 is disposed in the inner space 44 of the turning arm 22 through the inner space 45 of the connecting portion 41 from the inner space 46 of the base 21. Thus, even if the turning arm 22 is angularly displaced, the cable connected to the turning arm 22 does not hinder the position adjustment work.

  Further, in order to prevent the cable from being twisted, the turning arm 22 is prevented from being displaced by a plurality of rotation angles. That is, angular displacement driving is performed in both circumferential directions around the turning axis L1. When the position adjustment operation of the wafer 19 is performed by angularly displacing the swing arm 22 in one circumferential direction, in the next position adjustment operation, the position adjustment operation of the wafer 19 is performed by angularly displacing the swing arm 22 in the other circumferential direction. .

  The cables that pass through the connecting portion 41 are, for example, cables that transmit notch presence / absence information signals output from the second notch detection sensors 24a and 24b, cables that transmit a driving force for driving the holding body driving means, and the like. .

  The carry arm driving means 37 is realized including an air cylinder 47, an electromagnetic valve 48, and a link mechanism 49, which are built in the base 21. The air cylinder 47 extends and contracts the piston rod 47 a when compressed air is supplied from the pump 50. A holding link member 51 is connected to the tip 52 of the piston rod 47a. The carrying link member 51 is formed in a rod shape, and one end 51a in the longitudinal direction is connected to the tip 52 of the piston rod 47a so as to be angularly displaceable.

  The other end 51b in the longitudinal direction of the transfer link member 51 is indirectly fixed to one end 32a to 35a of each transfer arm 32 to 35. In this way, the link mechanism 49 can be configured to include the tip 52 of the piston rod 47a and the replacement link member 51, and the replacement arms 32 to 35 are connected to the angular displacement axis L2 according to the expansion and contraction of the piston rod 47a. , L3 can be angularly displaced around.

  The air cylinder 47 is a return type. A piston rod 47a provided in the air cylinder 47 partially protrudes from the cylinder tube 47b, and can be extended and retracted by displacement of the piston. The air cylinder 47 can extend the piston rod by supplying air to one pressure chamber and discharging air from the other pressure chamber. The air cylinder 47 can retract the piston rod by supplying air to the other pressure chamber and discharging the air from the one pressure chamber.

  Solenoid valve 48 is, for example, a 4-port 3-position electromagnetic switching valve. The electromagnetic valve 48 switches the connection state of the air pipeline based on a command signal from the control means 38. When an exhaust command signal, a so-called exhaust command signal, is supplied from the control means to the solenoid valve 48, the solenoid valve 48 is allowed to be displaced, the supply of compressed air from the pump 50 to the air cylinder 47 is cut off, and the air The two pressure chambers of the cylinder 47 communicate with each other, and each pressure chamber communicates with the compressed air discharge path. As a result, the piston rod 47a expands and contracts due to an external force, and a displacement-permitted state in which the displacement of the piston rod 47a is permitted.

  When an extension command signal is given to the solenoid valve 48, the solenoid valve 48 is in an extension connection state, and compressed air is supplied from the pump 50 to one pressure chamber of the air cylinder 47, and compressed air is sent from the other pressure chamber. Discharged. As a result, the piston rod is extended.

  When a degeneracy command signal is given to the solenoid valve 48, the solenoid valve 48 enters a degenerative connection state, and compressed air is supplied from the pump 50 to the other pressure chamber of the air cylinder 47, and compressed air is sent from the one pressure chamber. Is discharged. As a result, the piston rod is degenerated. Thus, by controlling the connection state of the electromagnetic valve 48 by the control means 38, the expansion / contraction operation of the piston rod can be controlled.

  In addition, when a plurality of replacement arms 32 to 35 are provided as in the present embodiment, a plurality of air cylinders 47 and link mechanisms 51 may be provided according to the number of replacement arms 32 to 35. Further, each holding arm 32 to 35 is mechanically or electrically configured to operate in conjunction with each other.

  The holding bodies 26 and 27 are arranged from the arm main body 100 with a predetermined gap K3 at one side in the height direction Z1, that is, upward. Therefore, the wafer 19 held by the holding bodies 26 and 27 is held with a gap K3 between the arm body 100 and the vertical direction. The gap K3 is larger than the thickness dimension of the robot hand 18 and is set to a dimension that allows the robot hand 18 to be inserted.

  Further, the replacement bodies 28 to 31 are also arranged with a predetermined gap K <b> 3 at one side in the height direction Z <b> 1 from the arm main body 100 in the state where the wafer 19 is held. Even if the wafer 19 is transferred from the swing arm 22 to the transfer arms 32 to 35, the vertical position of the wafer 19 is not changed. As a result, the wafer 19 is not subjected to a vertical force, that is, a force in the thickness direction of the wafer 19 at the time of transfer, and damage at the time of transfer is prevented.

  FIG. 12 is a cross-sectional view of the aligner 20 of FIG. 11 as viewed from the section line S12-S12. The arm side detection units 104 and 105 are formed with insertion holes 53. The insertion hole 53 passes through the arm side detection units 104 and 105 along the moving direction of the holding bodies 26 and 27, and communicates the internal space 44 of the arm main body 100 with the space outward in the radial direction A. When the holding bodies 26 and 27 move outward in the radial direction A, the holding bodies 26 and 27 are inserted through the insertion holes 53. Accordingly, the arm side detection units 104 and 105 can make the second notch sensors 24 a and 24 b face the edge 16 without hindering the operation of the holding bodies 26 and 27.

  FIG. 13 is a cross-sectional view of the aligner 20 of FIG. 11 as viewed from the section line S13-S13. In this embodiment, the interchangeable link member 51 has an angular displacement shaft 54 extending along the angular displacement axes L2, L3. The angular displacement shaft 54 is fixed to the base 21 by a bearing 55 so as to be angularly displaceable. Then, one end of the holding arms 32 to 35 in the longitudinal direction is fixed to the angular displacement shaft 54. The holding arms 32 to 35 are formed in an L shape and bend upward from a first member 56 projecting in the width direction Y from the base 21 and an end of the first member 56 on the side opposite to the base 21. The second member 57 is included. As a result, the circumferential distance between the replacement bodies 28 and 29 of the first and second replacement arms 32 and 33 can be widened, and the wafer 19 can be stably held.

  The first exchange arm 32 and the second exchange arm 33 have the same angular displacement axis L <b> 2 and are fixed to the same angular displacement axis 54. As a result, the two holding arms 32 and 33 can be operated in conjunction with each other. Similarly, the third exchange arm 34 and the fourth exchange arm 35 have the same angular displacement axis L3 and are fixed to the same angular displacement axis. As a result, the two holding arms 34 and 35 can be operated in conjunction with each other by one air cylinder.

  FIG. 14 is a cross-sectional view showing a specific configuration of the swivel arm 22, and FIG. 15 is a cross-sectional view showing the swivel arm 22 of FIG. 14 as viewed from the section line S15-S15. FIG. 16 is a cross-sectional view showing the swing arm 22 of FIG. 14 as viewed from the section line S16-S16, and FIG. 17 is a cross-sectional view of the swivel arm S17-S17 of FIG. .

  The holding body driving means 40 is realized including an air cylinder 59, a solenoid valve 60, and a link mechanism 61, and the air cylinder 59 and the link mechanism 61 are built in the internal space 44 of the arm body 100 of the revolving arm 22. . About the structure of the air cylinder 59 and the solenoid valve 60, the structure similar to the air cylinder 47 and the solenoid valve 48 of the exchange arm drive means 37 is shown, and description is abbreviate | omitted.

  The tip of the piston rod of the air cylinder 59 of the holding body driving means 40 is connected to the first turning link member 63. The first turning link member 63 is guided by a first rail guide 64 that extends in a direction parallel to the arm axis L22. Thus, the first turning link member 63 is provided so as to be movable in a direction parallel to the arm axis L22, and is prevented from moving in other directions. The end of the first turning link member 63 opposite to the air cylinder is connected to the second turning link member 65. The 1st and 2nd turning link members 63 and 65 are connected mutually so that angular displacement is possible.

  The second swivel link member 65 extends in the width direction of the arm body 100 and is provided so as to be angularly displaceable with the position close to the swivel axis L1 as the center of angular displacement. The second turning link member 65 extends on both sides in the width direction of the arm body 100 from the center of angular displacement. Moreover, the 2nd turning link member 65 is connected with the both ends so that the 3rd turning link member 66 and the 4th turning link member 67 may be angularly displaced.

  The third turning link member 66 and the fourth turning link member 67 are connected at a position away from the angular displacement center of the second turning link member 65 by the same distance. The third turning link member 66 extends from the connection position with the second turning link member 65 toward the arm main body one end portion 100a. The fourth turning link member 67 extends from the connection position with the second turning link member 65 toward the arm main body other end portion 100b.

  The third turning link member 66 is guided by a second guide rail 68 extending in a direction parallel to the arm axis L22. Accordingly, the third turning link member 66 is provided so as to be movable in a direction perpendicular to the radial direction A, and is prevented from moving in other directions. The first holding portion 26 is fixed to the third turning link member 66 via a coupling member 75. The first holding unit 26 is disposed along the radial direction A.

  Similarly, the first holding body 27 is fixed to the fourth turning link member 67 through the coupling member 69 while being guided by the guide rail. The second holding portion 27 is also disposed at a position that coincides with the radial direction A.

  The first turning link member 63 is displaced parallel to the radial direction A by extending and contracting the piston rod of the air cylinder 59. As a result, the second turning link member 65 is angularly displaced about the angular displacement center. As shown in FIG. 16, the distance K1 from the angular displacement center to the connection position of the third turning link member 66 is equal to the distance K2 from the angular displacement center to the connection position of the fourth turning link member 67. And the 4th turning link members 66 and 67 are parallel to the radial direction A by the same displacement amount, and displace the direction oppositely. As a result, the first and second holding portions 26 and 27 fixed to the third and fourth thousandth link members 66 and 67 are displaced in directions approaching and separating from each other in the radial direction A.

  By using the second turning link member 65 in this manner, the holding portions 26 and 27 can be moved in the opposite direction by the same displacement amount by one air cylinder 59. In the present embodiment, the two holding bodies 26 and 27 are displaced in the internal space 44 of the arm main body 100 by using such a plurality of link mechanisms. However, the two holding bodies 26 are driven by belt driving. , 27 may be displaced.

  The robot arm 18 can hold the wafer 19 on the turning arm 22 by moving the holding body inward in the radial direction A in a state where the wafer 19 is disposed coaxially with the turning axis L1. Even if the robot hand 18 is retracted in this state, the wafer 19 is held by the aligner 20.

  Further, with the swing arm 22 holding the wafer 19, the holders 28 to 31 are brought into contact with the edge 16 of the wafer 19 to release the holding of the wafer 19 by the swing arm 22. It is possible to change from 22 to the transfer arms 32 to 35. Thus, in the state where the transfer arms 32 to 35 receive the wafer 19 from the turning arm 22, the turning arm 22 can be angularly displaced about the turning axis L1.

  Similarly, with the holding arms 32 to 35 holding the wafer 19, the holding bodies 26 and 27 are brought into contact with the edge 16 of the wafer 19 to release the holding of the wafer 19 by the holding arms 32 to 35. The wafer 19 can be transferred from the holding arms 32 to 35 to the turning arm 22.

  FIG. 18 is a flowchart showing a rough control operation of the control means 38, and FIG. 19 is a plan view for explaining the position adjustment operation of the aligner 20. First, the control means 38 moves the turning arm 22 to the initial position in step a0. For example, the initial position is a position where the arm axis L22 is perpendicular to the robot movement path U1 extending along the direction in which the robot hand 18 enters. Thus, even when the robot hand 18 is shaken, it is possible to prevent the robot hand 18 from being in contact with the turning arm 22 and to insert the robot hand 18 into the aligner 20 at a higher speed.

  As shown in FIG. 19A, when the wafer 19 and the turning axis L1 are coaxially arranged by the robot hand 18, the process proceeds to step a1 and the control means 38 starts the control operation.

  In step a1, as shown in FIG. 19 (2), before holding the wafer 19, the turning arm 22 is angularly displaced by a predetermined movement angle θ3. The movement angle θ3 is set as small as possible. For example, the movement angle θ3 is set to 10 degrees.

  When the turning arm 22 is displaced from the initial position by the movement angle θ3, the second notch sensors 24a and 24b are displaced in the circumferential direction B around the turning axis L1 while facing the edge 16 of the wafer 19. Then, the control means 38 determines the presence or absence of the notch 17 based on the detection results of the second notch sensors 24 a and 24 b during the angular displacement period of the swing arm 22.

  When the notch 17 is detected during the angular displacement period, the control unit 38 determines the angular position of the notch 17 based on the detection results of the second notch sensors 24 a and 24 b and the encoder 25. If the notch 17 is present in the edge region opposed during the movement of the second notch sensors 24a, 24b, the control means 38 causes the swing arm 22 to shift the holding bodies 26, 27 and the notch 17 in the circumferential direction B from each other. Is angularly displaced. When the notch 17 is not detected during the angular displacement period, the holding bodies 26 and 27 are arranged in the edge region where the second notch sensors 24a and 24b are opposed during the angular displacement period.

  For example, when the arm axis L22 is angularly displaced by 10 degrees in the circumferential direction B from the initial position during the angular displacement period, when the notch 17 is detected until the arm axis L22 is moved 5 degrees in the circumferential direction from the initial position, The arm axis L22 is arranged at a position displaced by 10 degrees in the circumferential direction B from the initial position. Further, when the notch 17 is detected after moving from the initial position to one side in the circumferential direction, the arm axis L22 is arranged at the initial position. In this way, when the notch is detected during the angular displacement of 10 degrees, the turning arm 22 is angularly displaced so that the holding bodies 26 and 27 do not face the notch 17, and the wafer is held.

  If the notch 17 is not detected during the angular displacement period, the arm axis L22 is arranged at a position that is angularly displaced by 5 degrees in the circumferential direction B from the initial position. When the turning arm 22 is angularly displaced in this way, the process proceeds to step a2.

  The circumferential distance K5 at which the revolving arm 22 moves along the edge 16 in accordance with the movement angle θ3 is the circumferential direction of both ends 96 and 97 of the edge portion where the holding bodies 26 and 27 contact as shown in FIGS. The distance is set to be as small as possible while being larger than the distance K4. By making the distance larger than the circumferential distance K4, the holding bodies 26 and 27 are arranged at positions shifted from the notch 17 in the circumferential direction B after step a2. Further, by reducing the movement angle θ3 as much as possible, the primary notch detection operation time shown in step a1 can be shortened.

  In step a2, the holding body driving means 40 is controlled to hold the wafer 19 by the holding bodies 26 and 27. When the holding of the wafer 19 is completed, the robot hand driving means 39 is informed that the holding of the wafer 19 is completed. As a result, the robot hand 18 retreats from the aligner 20. Thus, as shown in FIG. 19 (3), the control means 38 holds the wafer 19 on the holding bodies 26 and 27, and when it is confirmed that the robot hand 18 has been retracted from the aligner 20, the process proceeds to step a 3.

  In step a3, as shown in FIG. 19 (4), the turning arm 22 is displaced by one rotation angle. The control means 38 detects the notch 17 by the first notch sensor 23 during the angular displacement period of the swing arm 22. In step a3, since the notch 17 is not formed at the position held by the holding bodies 26, 27, the notch 17 can be reliably detected while the turning arm 22 is displaced by one rotation angle. Based on the detection results of the encoder 25 and the first notch sensor 23, the angular position of the notch 17 is determined, and the process proceeds to step a4.

  In step a4, the turning arm driving means 36, the holding body driving means 40 and the transfer arm driving means 37 are controlled so that the angular position of the notch 17 becomes a predetermined reference angular position, and the turning arm 22, holding body 26, 27 and the holding arms 32 to 35 are driven. As shown in FIG. 19 (5), when the position of the wafer 19 is adjusted so that the angular position of the notch 17 is positioned at the reference angular position, the robot hand driving means 39 is informed that the position adjustment of the wafer 19 is completed, and the step Go to a5. As a result, the robot hand 18 moves toward the aligner 20.

  In step a5, when it is determined that the robot hand 18 has moved to a position where the wafer 19 can be delivered, the holding body driving means 40 is controlled to release the holding of the wafer 19 by the holding bodies 26 and 27. As shown in 19 (6), the wafer 19 is delivered from the turning arm 22 to the robot hand 18, and the process proceeds to step a 6. In step a6, the control means 38 ends the control operation.

  As described above, in the embodiment of the present invention, since the notch 17 does not exist in the edge portion where the holding bodies 26 and 27 are in contact, the first notch sensor 23 is provided with the holding bodies 26 and 27. The notch 17 can be detected well without being affected. In other words, after the wafer 19 is held, the angular position of the notch 17 can be reliably determined only by displacing the turning arm 22 by one rotation angle at most.

  Thus, unlike the prior art, it is not necessary to change the wafer 19 relative to the revolving arm 22 due to the substrate holding positions of the holders 26 and 27, and it is necessary to rotate the wafer 19 one or more times. There is no. Therefore, it is possible to reduce the time required for the position detection of the notch 17 and shorten the time required for the position adjustment operation of the wafer 19.

  The turning arm 22 holds the wafer 19 by holding the holding bodies 26 and 27. As a result, there is little possibility that the wafer 19 and the swing arm 22 are displaced, and the held wafer 19 can be rotated at a higher speed than when the wafer 19 is supported from below. As a result, the position of the wafer 19 can be adjusted in a shorter time.

  In addition, it is preferable to increase the angular displacement speed of the swing arm 22 in the first notch detection process shown in step a1 than in the second notch detection process shown in step a3. The primary notch detection step does not need to detect the position of the notch 17 accurately, and it is only necessary to determine whether or not the notch 17 is present at a portion where the holding bodies 26 and 27 are in contact with each other. Thus, by increasing the angular displacement speed of the swivel arm 22 in the primary notch detection step, the position adjustment operation can be shortened without reducing the detection accuracy of the notch 17.

  Further, in the first notch detection step in step a1, the time required for the position adjustment operation of the wafer 19 can be further shortened by making the angular displacement amount of the swing arm 22 as small as possible. If the angular position of the notch 17 is determined in the primary notch detection process in step a1, the secondary notch detection process in step a3 may be omitted. As a result, the position adjustment operation of the wafer 19 can be performed in a shorter time.

  Further, in the second notch detection process shown in step a3, when the notch 17 is determined before the turning arm 22 is rotated once, the process may proceed immediately to step a4 to adjust the position of the wafer 19.

  Note that the control means 38 performs any one of the three position adjustment operations at step a4 based on the angular position of the notch 17 detected at step a3. FIG. 20 is a plan view for explaining the first position adjustment operation. If the control means 38 determines that the position is within a transferable position range in which the wafer 19 can be transferred from the revolving arm 22 to the robot hand 18 with the notch 17 disposed at the reference angular position, the control means 38 performs a first position adjustment operation.

  In the first position adjustment operation, the swing arm 22 is angularly displaced and the notch 17 is disposed at the reference angular position without using the holding arms 32 to 35. As shown in FIG. 20, when the position of the wafer 19 is adjusted, the angle θ1 between the arm axis L22 and the robot movement path U1 extending along the robot approach direction is within the robot hand non-interference angle range ω1. Perform the position adjustment operation.

  The robot movement path U1 is a path extending along a direction in which the robot hand 18 enters the aligner 20 when the robot hand 18 receives the wafer 19 from the aligner 20 on a plane perpendicular to the turning axis L1. The robot hand non-interference angle range ω1 is an angle range in which the robot hand 18 and the turning arm 22 do not interfere when the wafer 19 is delivered to the robot hand 18. For example, when the turning arm 22 is arranged on the movement path of the robot hand 18, the robot hand 18 and the turning arm 22 interfere with each other.

  When the angle θ1 between the arm axis L22 and the robot movement path U1 is within the robot hand non-interference angle range ω1 in a state where the position of the wafer 19 is adjusted, the robot hand 18 can move the turning arm 22 only by angular displacement. A wafer 19 that is aligned without interfering with 22 can be received.

  For example, the robot hand non-interference angle range ω1 is an angle range in which the angle θ1 between the robot movement path U1 and the arm axis L22 is not less than 50 degrees and not more than 130 degrees. In other words, the robot hand non-interference angle range ω1 is an angle range in which the angle between the virtual line U2 perpendicular to the robot movement path U1 and the arm axis L22 is within ± 40 degrees. In such a case, the control means 38 adjusts the position of the wafer 19 by angularly displacing the turning arm 22 without driving the holding arms 32 to 35.

  If the control means 38 determines that the wafer 19 cannot be delivered to the robot hand 18 simply by angular displacement of the turning arm 22, the control means 38 performs the second position adjustment operation or the third position adjustment operation. In the second and third position adjustment operations, the relative angular positions of the notch 17 and the turning arm 22 are adjusted using the holding arms 32 to 35.

  FIG. 21 is a plan view for explaining the second position adjustment operation. With the position of the wafer 19 adjusted, the angle θ1 between the arm axis L22 and the robot movement path U1 is not the robot hand non-interference angle range ω1, but the angle θ2 between the arm axis L22 and the base axis L21 is the transfer arm interference. If the angle range is not ω2, the second position adjustment operation is performed.

  The transfer arm interference angle range ω <b> 2 is an angle range in which the transfer arms 32 to 35 interfere with the swing arm 22 when the wafer 19 is transferred from the swing arm 22 to the transfer arms 32 to 35. For example, when the swing arm 22 exists above the transfer arms 32 to 35, the swing arm 22 and the transfer arms 32 to 35 interfere with each other.

  When the position of the wafer 19 is adjusted and the robot hand is not in the non-interference angle range ω1 and is not in the transfer arm interference angle range ω2, the angular position between the wafer 19 and the swing arm 22 is adjusted to adjust the arm axis L22 and the robot. It is necessary to keep the angle θ with the movement path U1 within the robot hand non-interference angle range ω1. For example, the interchangeable arm interference angle range ω <b> 2 is an angle range in which the angle of the arm axis L <b> 22 with respect to the base axis L <b> 21 is larger than −40 degrees and smaller than 40 degrees.

  FIG. 22 is a flowchart showing the procedure of the second position adjustment operation, and FIGS. 23 and 24 are plan views for explaining the procedure of the second position adjustment operation. First, in step b0, when the control means 38 determines that the second position adjustment operation is necessary, the process proceeds to step b1 and starts the second position adjustment operation.

  In step b1, if the notch 17 is kept at the reference angular position and there is a first angle range ω3 that is not in the robot hand non-interference angle range ω1 and is not the transfer arm interference angle range ω2, the process proceeds to step b2. If there is a second angle range ω4 that is within the holding arm interference angle range ω2 and not the robot hand non-interference angle range ω1, the process proceeds to step b8.

  That is, in the case shown in FIG. 21 (1), the process proceeds to step b2, and in the case shown in FIG. 21 (2), the process proceeds to step b9. If the robot hand non-interference angle range ω1 and the exchange arm interference angle range ω2 match, the process proceeds to step b1.

  In step b2, the turning arm 22 is angularly displaced so that the notch 17 is positioned at the reference angular position, and the process proceeds to step b3. In step b3, the transfer arm driving means 37 is controlled, the transfer arms 32 to 35 are driven to be displaced, and the wafer 19 is held by the transfer bodies 28 to 31. As a result, as shown in FIG. 23 (1), the wafer 19 is held by both the transfer arms 32 to 35 and the turning arm 22. When the holding by each of the transfer arms 32 to 35 is completed, the process proceeds to step b4.

  In step b4, the holding body driving means 40 is controlled to release the holding of the wafer 19 by the holding bodies 26 and 27. As a result, as shown in FIG. 23 (2), the swing arm 22 can be angularly displaced, and the process proceeds to step b5. In step b5, the turning arm 22 is angularly displaced so that the angle θ1 between the arm axis L22 and the robot movement path U1 falls within the robot hand non-interference angle range ω1, and the process proceeds to step b6.

  In step b6, the holder driving means 40 is controlled to hold the wafer 19 by the holders 26 and 27. Accordingly, as shown in FIG. 23 (3), the wafer 19 is held by both the transfer arms 32 to 35 and the swing arm 22. When the holding by the turning arm 22 is completed, the process proceeds to step b7.

  In step b7, the exchange arm driving means 37 is controlled to drive the exchange arms 32 to 35 in a displaced manner. Then, the holding of the wafer 19 by the replacement bodies 28 to 31 is released. As a result, as shown in FIG. 23 (4), the position of the wafer 19 can be adjusted, and the angle between the arm axis L22 and the robot movement path U1 can be within the robot hand non-interference angle range ω1. Then, the process proceeds to step b8, and the second position adjustment operation is terminated.

  In step b9, the turning arm 22 is displaced by one B1 angle in the circumferential direction so as to deviate from a predetermined first predetermined angle θ7 from the state where the notch 17 is disposed at the reference angular position. In other words, from the state shown in FIG. 24 (1) in which the notch 17 is disposed at the reference angular position, the swing arm 22 is set so that the angle θ2 between the arm axis L22 and the base axis L21 does not become the movable arm interference angle range ω2. Is shifted in the circumferential direction B1 by the first predetermined angle θ7, and the process proceeds to step b10.

  In step b10, the exchange arm driving means 37 is controlled to drive the exchange arms 32 to 35, and the wafers are held by the holders 26 and 27 and the exchange bodies 28 to 31 as shown in FIG. 19 is held, and the process proceeds to Step b11.

  In step b11, the holding body driving means 40 is controlled to release the holding of the wafer 19 by the holding bodies 26 and 27. As a result, the turning arm 22 can be angularly displaced, and the process proceeds to step b12. In step b12, as shown in FIG. 24 (3), the swivel arm 22 is angularly displaced in the other circumferential direction B2 so that the angle θ2 between the arm axis L22 and the base axis L21 does not become the movable arm interference angle range ω2. And go to step b13.

  In step b13, the holder driving means 40 is controlled to hold the wafer 19 by the holders 26 and 27, and the process proceeds to step b14. In step b14, the exchange arm driving means 37 is controlled to drive the exchange arms 32 to 35 in a displaced manner. Then, as shown in FIG. 24 (4), the holding of the wafer 19 by the transfer bodies 28 to 31 is released, and the process proceeds to step b15.

  In step b15, the turning arm 22 is angularly displaced so that the notch 17 is disposed at the reference angular position. As a result, the angle θ1 between the arm axis L22 and the robot movement path U1 can be within the robot hand non-interference angle range ω1. Then, the process proceeds to step b8, and the second position adjustment operation is terminated.

  If the notch 17 cannot be disposed at the reference angular position by one transfer, the operations of steps b8 to b13 are repeated a plurality of times while gradually shifting the notch 17 and the turning arm 22. The angle θ1 between the arm axis 22 and the robot movement path U1 can be within the robot hand non-interference angle range ω1.

  Further, when the wafer 19 can be transferred from the transfer arms 32 to 35 to the robot hand 18 such as when the base axis L21 and the robot movement path U1 are perpendicular to each other, a step is performed to shorten the position adjustment time. The operation of b6 may be omitted, and the wafer 19 may be delivered from the transfer arms 32 to 35 to the robot hand 18.

  FIG. 25 is a plan view for explaining the third position adjustment operation. Depending on the approach direction of the robot hand 18 and the position of the wafer 19, the angle θ1 between the arm axis L22 and the robot movement path U1 is not the robot hand non-interference angle range ω1 in a state where the notch 17 is arranged at the reference angle position. In addition, when the angle θ2 between the arm axis L22 and the base axis L21 is within the movable arm interference angle range ω2, the third position adjusting operation is performed. That is, when the notch 17 is disposed at the reference angular position, the swing arm 22 interferes with the robot hand 18, and in this state, the wafer 19 cannot be transferred from the swing arm 22 to the transfer arms 32 to 35. A third position adjustment operation is performed.

  FIG. 26 is a flowchart showing the procedure of the third position adjustment operation, and FIG. 27 is a plan view showing the procedure of the third position adjustment operation. First, in step c0, if the control means 38 determines that it is necessary to perform the third position adjustment operation, the control means 38 proceeds to step c1 and starts the third position adjustment operation.

  In step c1, the revolving arm 22 is angularly displaced, and when the wafer 19 is transferred from the revolving arm 22 to the replacement arms 32-35, the revolving arm 22 is moved to a position where the revolving arms 22 and the revolving arms 32-35 do not interfere with each other. Arrange and proceed to step c2. For example, the swivel arm 22 is angularly displaced from the state where the notch 17 is disposed at the reference angle position so that the position is angularly displaced by the second predetermined angle θ8.

  As shown in FIG. 25, the second predetermined angle θ8 is an angle that is equal to or larger than the angle θ9 from the arm axis L22 to the boundary of the transfer arm interference angle range ω2 in the state where the notch 17 is disposed at the reference angle position. In this way, the swivel arm 22 is angularly displaced from the position shown in FIG. 27 (1) to the position shown in FIG. 27 (2) in the other circumferential direction B2.

  In step c2, the same operations as in steps b3 and b4 described above are performed, and as shown in FIG. 27 (3), the wafer 19 is transferred from the swing arm 22 to the transfer arms 32 to 35, and the process proceeds to step c3.

  In step c3, as shown in FIG. 27 (4), the arm axis L22 and the robot movement path U2 are further separated so that the angle θ2 between the arm axis L22 and the base axis L21 does not become the movable arm interference angle range ω2. The turning arm 22 is angularly displaced in the other circumferential direction B2 so that the angle θ1 falls within the robot hand non-interference angle range ω1. More precisely, the angle θ1 between the arm axis L22 and the robot movement path U1 is arranged in the angle range ω3 displaced from the robot hand non-interference angle range ω1 to the other circumferential direction B2 by the second predetermined angle θ8, and step c4. Proceed to

  In step c4, the same operations as in steps b6 and b7 described above are performed, and as shown in FIG. 27 (5), the wafer 19 is transferred from the swing arm 22 to the transfer arms 32 to 35, and the process proceeds to step c5. In step c5, the turning arm 22 is angularly displaced in the circumferential direction B1 by the second predetermined angle θ8. As a result, the notch 17 is arranged at the reference angular position, and the angle θ1 between the arm axis L22 and the robot movement path U1 can be within the robot hand non-interference angle range ω1. Then, the process proceeds to step c6, and the third position adjustment operation is terminated.

  If the notch 17 cannot be disposed at the reference angular position by one transfer, the operations of steps c1 to c5 are repeated a plurality of times while gradually shifting the notch 18 and the turning arm 22. The angle θ1 between the arm axis L22 and the robot movement path U1 can be moved to the robot hand non-interference angle range ω1.

  Even when the swing arm 22 and the robot hand 18 interfere with each other as in the second or third position adjustment operation, the notch 17 is arranged at the reference angular position by using the holding arms 32 to 35. In this state, it is possible to achieve a positional relationship in which the turning arm 22 and the robot hand 18 do not interfere with each other. Thus, even if the notch 17 is at an arbitrary position of the edge 17, the wafer 19 whose position has been adjusted can be transferred to the robot hand 18.

  The position adjustment operation of any one of the first to third position adjustment operations is performed by the control means 38, so that the wafer 19 whose position has been adjusted regardless of the position of the notch 17 and the direction in which the robot hand 18 enters. Can be delivered to the robot hand 18. In addition, when the position of the wafer 19 can be adjusted by one transfer, the second predetermined angle θ8 is an angle from the arm axis L22 to the boundary of the transfer arm interference angle range ω2 in a state where the notch 17 is disposed at the reference angle position. The angle is equal to or greater than θ9, and is preferably as small as possible. As a result, the angular displacement amount of the turning arm 22 in step c1 and step c5 can be reduced, and the position adjustment time can be shortened.

  Further, in the above-described embodiment of the invention, when the notch 17 is detected in the first notch detection process in step a1, the swing arm 22 is held by being displaced by -5 degrees, but not -5 degrees. May be. For example, when the notch 17 is detected in the first notch detection step, the swing arm 22 is in a range where the robot hand 18 and the swing arm 22 do not interfere with each other in a state where the notch 17 is arranged at the reference angular position, that is, in the range where the delivery is possible. Alternatively, the wafer 19 may be held after the swivel arm 22 is angularly displaced in advance so that is disposed. In other words, when the wafer 19 is transferred by the transfer arms 32 to 35, the number of times the wafer 19 is changed by the transfer arms 32 to 35 based on the notch 17 and the shape of the robot hand 18 of the articulated robot that carries the wafer 19. The swivel arm 22 is angularly displaced so as to hold the wafer 19 at an angular position where the angle is reduced.

  In this case, the control means 38 stores the robot movement path U1 and the robot hand non-interference angle range ω1, and stores the angle position of the notch 17 determined in the first notch detection step and each stored information. Based on this, when the wafer 19 is delivered to the robot hand 18, the swivel arm 22 can be arranged at a deliverable position.

  Thus, it is possible to prevent the robot hand 18 and the turning arm 22 from interfering with the notch 17 disposed at the reference angular position. If the robot hand 18 and the swivel arm 22 interfere with each other, it is necessary to change the wafer 19 and hold it again, but it should be changed by holding the wafer 19 after preventing the interference as in the present invention. The situation can be reduced as much as possible, and the working time can be shortened.

  Similarly, when the notch 17 is detected in the primary notch detection process, the range in which the transfer arms 32 to 35 and the turning arm 22 do not interfere with each other in a state where the notch 17 is disposed at the reference angular position, that is, the non-interference position. The wafer 19 may be held after the swivel arm 22 is angularly displaced in advance so that the swivel arm 22 is disposed in the range. In this case, the control means 38 stores the robot movement path U1, the robot hand non-interference angle range ω1, and the transfer arm interference angle range ω2 in advance, and the angular position of the notch 17 determined in the first notch detection step; Based on the stored information, the swivel arm 22 can be arranged in advance in the non-interference position range.

  Thus, in order to place the notch 17 at the reference angular position, even if it is necessary to change the wafer 19 from the swing arm 22 to the transfer arms 32 to 35, the swing arm 22 and the transfer arms 32 to 35 Can be prevented from interfering. Further, it is possible to reduce the possibility that the wafer 19 must be transferred from the swing arm 22 to the transfer arms 32 to 35. As a result, the number of times of replacement can be further reduced, and the time required for the position adjustment operation of the wafer 19 can be further shortened.

  With the notch 17 arranged at the reference angular position as described above, the position where the swing arm 22 and the robot hand 18 do not interfere with each other, and the position where the swing arm 22 and the transfer arms 32 to 35 do not interfere with each other are maintained. In this case, it is preferable to increase the movement angle θ3 and determine the presence or absence of notches in the edge region as wide as possible before holding the edge. As a result, the number of transfers can be further reduced.

  FIG. 28 is a flowchart showing a specific operation procedure when delivering the wafer 19 to the robot hand 18, and FIG. 29 is a plan view for explaining the operation procedure when delivering.

  First, the control means 38 performs the position adjustment operation of any of the first to third fields as described above, and adjusts and holds the notch 17 at the reference angular position as shown in FIG. 29 (1) at step d0. In step d1, the delivery operation is started. In step d1, the control means 38 gives an operation start command to the robot hand drive means 39. As a result, the robot hand 18 enters between the wafer 19 and the arm main body 100 and moves to a predetermined teaching position.

  When the robot hand 18 moves to the teaching position as shown in FIG. 29 (2), a teaching position movement completion signal is given from the robot driving means 40, and the process proceeds to step d2.

  In step d2, an exhaust command signal is given to the electromagnetic valve 60 of the holding means driving means 40 to set a displacement allowable state in which the holding bodies 26 and 27 are displaced by an external force. Further, an operation start command signal is given to the robot hand driving means 39. The robot hand driving means 39 to which the operation start command signal is given uses the plunger provided in the robot hand 18 to displace the holding piece and hold the wafer 19 by holding it. When the holding of the wafer 19 by the robot hand 18 is completed, the holders 26 and 27 are moved outward in the radial direction A, the wafer 19 is delivered to the robot hand 18, and the process proceeds to step d3.

  In step d2, by setting each holding body 26, 27 to a displacement allowable state, the wafer 19 can be displaced by an external force. Thus, even when the plunger of the robot hand 18 holds the wafer 19, it is possible to prevent the wafer 19 from being damaged.

  In step d3, the turning arm 22 is angularly displaced, and as shown in FIG. 29 (3), the arm axis L22 is arranged perpendicular to the robot movement path U1, and the process proceeds to step d4. In step d4, a delivery completion command is given to the robot hand driving means 39, and as shown in FIG. 29 (4), the robot hand driving means 39 performs an operation taught in advance, and the process proceeds to step d5. In step d5, the delivery operation is terminated.

  In step d3, after the wafer 19 is transferred to the robot hand 18, the turning arm 22 is angularly displaced, and the arm axis L22 is arranged perpendicular to the robot movement path U1, whereby the wafer 19 interferes with the turning arm 22. Thus, the robot hand 18 can be detached from the aligner 20. Further, the swing arm 22 can be disposed at the initial position, and the next wafer alignment adjustment operation can be performed smoothly. The encoder 25 sets the angular position of the turning arm 22 to which power is turned on as a zero degree position, and gives the angular displacement from the zero degree position to the control means 38 as an encoder value. The control unit 38 verifies the angular position by giving a verification command signal to the turning arm driving unit 39 after the power is turned on.

  The aligner 20 is provided with a sensor for verification in order to verify the angular position. The verification sensor outputs a detection signal when the turning arm 22 is disposed at a known angular position with respect to a predetermined set angular position. The set angular position is an angular position that serves as a reference when the turning arm 22 is angularly displaced.

  The swivel arm drive means 39 is angularly displaced at a low speed in the predetermined circumferential direction B upon receipt of the test command signal. At this time, when the swing arm 22 is disposed at a known angular position with respect to the set angular position, the control means 38 receives a detection signal from the test sensor.

  When receiving the detection signal, the control means 38 acquires the angular displacement amount from the zero position of the swing arm 22 from the encoder 25, determines the deviation amount between the zero position and the set angular position, and corrects the deviation amount. Determine the correction amount. Based on the encoder value from the encoder 25 and the correction amount, the control means 38 can detect the angular displacement amount of the turning arm 22 from the reference set angular position.

  For example, the angular position of the turning arm 22 when receiving the detection signal is set as a position displaced from the set angular position by 390 degrees in the other circumferential direction, in other words, by -390 degrees angular displacement in one circumferential direction. After the verification, the control means 38 mechanically operates the swivel arm 22 within a range of ± 360 degrees from the set angle position. If the verification sensor has already output a detection signal when the power is turned on, the angular displacement is shifted to the other circumferential direction at a low speed after the predetermined angular displacement is shifted to the other circumferential direction.

  In order to further improve the accuracy, after the method described above, the turning arm 22 is angularly displaced, and the turning arm 22 detects the position from when the light receiving state of the first notch sensor 23 is changed until it is eliminated. The center position in the circumferential direction of the movement path of the turning arm 22 moved during the change period is obtained, and the center position is set as the initial position. Then, a correction value for determining the initial position is determined. That is, the position where the arm axis L22 and the base axis coincide with each other is set as the initial position.

  30 and 31 are flowcharts showing the operation procedure of the control means 38 in more detail. When the preparation for position adjustment of the wafer 19 is completed, the control means 38 proceeds to step e1 and starts the control operation.

  In step e1, the turning arm 22 is angularly displaced to the initial position. Specifically, the arm axis L22 is disposed at 90 degrees or -90 degrees with respect to the robot movement path U1. Whether the arm axis L22 is angularly displaced by 90 degrees or -90 degrees is determined by the angular position of the swivel arm 18 before the angular displacement of the arm axis L22 to the initial position. When the turning arm 22 is angularly displaced to one of the two initial positions in this way, the process proceeds to step e2. In step e1, the swivel arm 22 is not displaced by a plurality of rotation angles, and the cable continuous from the arm body 100 to the base 21 is prevented from being twisted and broken.

  In step e2, the holding body driving means 40 is controlled to move the holding bodies 26 and 27 outward in the radial direction A, respectively. That is, a space in which the wafer 19 is placed is formed, and the process proceeds to step e3. In step e3, a wafer placement command is given to the robot hand driving means 39, and the process proceeds to step e4.

  In step e4, the robot hand 18 holding the wafer 19 passes between the holding bodies and arranges the wafer 19 coaxially with the turning axis L1. The control means 38 detects that the wafer 19 is disposed coaxially with the turning axis L1, and proceeds to step e5. In step e5, the second notch sensors 24a and 24b are operated, the detection state of the light receiving unit 106 is confirmed, and the process proceeds to step e6. In step e5, the first notch sensor 23 may also be operated.

  In step e6, when the two notch sensors 24a and 24b both detect the light shielding state, it is confirmed that the wafer 19 is disposed at the normal position, and the process proceeds to step e7. Of the two second notch sensors 24a and 24b, when one notch sensor 24a detects the light shielding state and the other notch sensor 24b detects the light transmitting state, the second notch sensor indicating the light transmitting state. It is determined that the notch 17 is present at a position facing the sensor 24b, it is confirmed that the wafer 19 is placed at the normal position, and the process proceeds to step e7.

  If both notch sensors 24a and 24b indicate a light-transmitting state, the process proceeds to step e8 to notify the abnormal state using the notification means, and then proceeds to step e17. In step e17, the control means 28 ends the operation. In step e6, by using the first notch sensor 23 in addition to the second notch sensors 24a and 24b, the notch position and the wafer arrangement abnormality can be obtained more accurately.

  When it is confirmed in step e6 that the arrangement position of the wafer 19 is normal, in step e7, the swing angle 22 which is a predetermined angle range, for example, 10 degrees is angularly displaced, and the process proceeds to step e9. .

  In step e9, if the detection state of each of the second notch sensors 24a and 24b during the angular displacement period of step e7 is a light-shielding state, the region where the second notch sensor 24 faces during the angular displacement period is notched. It is determined that 17 does not exist, and the process proceeds to step e10. In step e10, the turning arm 22 is angularly displaced so that the holding bodies 26 and 27 face the edge region where the notch 17 does not exist, and the process proceeds to step e12.

  In step e9, the detection state of one second notch sensor 24a during the angular displacement period of step e7 is a light shielding state, and the detection state of the other second notch sensor 24b is a translucent state. Proceed to step e11.

  In step e11, in step e9, when the circumferential angle range of the swivel arm 22 in the translucent state is a notch-equivalent circumferential angular range, it faces the second notch sensor 24 in the translucent state. It determines with the notch 17 existing in the position to go to, and it progresses to step e10. In step e10, the turning arm 22 is angularly displaced so that the holding bodies 26 and 27 face the edge region where the notch 17 does not exist, and the process proceeds to step e12.

  In step e11, if the circumferential angle range of the swivel arm 22 in the translucent state is not the circumferential angle range corresponding to the notch, the process proceeds to step e8 to notify the abnormal state, and in step e17. Proceed to In step e17, the control means 28 ends the position adjustment operation.

  32 is a plan view showing a case where the axis L10 of the wafer 19 is displaced with respect to the turning axis L1, and FIG. 33 shows the amount of light received by the light receiving unit and the angular position of the turning arm 22 in the case of FIG. It is a graph which shows the relationship. When the arrangement position of the wafer 19 deviates from the turning axis L1, when one of the two second notch sensors 24a and 24b receives light from the light projecting unit 106, The circumferential angle range of the turning arm 22 is increased. Even when the wafer is chipped and when the size of the wafer is different, the received light amount is different from that when the wafer is normal.

  In step e12, the wafer 19 is held by the turning arm 22. Specifically, the plunger of the robot hand driving means 39 is moved away from the wafer 18 and a clamping release command is given so as to release the clamping of the wafer 19. As a result, the wafer 18 is supported from below by the robot hand 18 and can be displaced in the radial direction by an external force.

  Next, the control means 38 controls the holding body driving means 40 to move the holding bodies 26 and 27 inward in the radial direction A, and to hold the wafer 19 in cooperation with the holding bodies 26 and 27. Proceed to step e13. When the wafer 19 is held by the holding bodies 26 and 27 in a state where the holding by the robot hand 18 is released, the wafer 19 can be displaced by an external force. This can prevent the wafer 19 from being damaged when the holders 26 and 27 hold the wafer 19.

  In step e13, a robot separation command for separating the robot hand 18 from the aligner 20 is given to the robot hand driving means 39. When the robot hand 18 moves to the retracted position retracted from the aligner 20, the process proceeds to step e14. In step e14, the turning arm 22 is displaced by one rotation angle at maximum. The first notch sensor 23 is operated during the angular displacement period at this time, and the light receiving state of the light receiving unit 111 is checked together with the angular position of the turning arm 22. Thereby, the control means 38 determines the angular position of the notch 17 and proceeds to step e15.

  In step e15, based on the angular position of the notch 17 obtained in step e14, the predetermined robot movement path U1, the robot hand non-interference angle range ω1, and the exchange arm interference angle range ω2, the first described above. Any of the third position adjustment operation is performed, and the process proceeds to step e16. In step e16, the robot delivery operation shown in FIG. 30 is performed, the process proceeds to step e17, and the operation of the control means 38 is terminated in step e17.

  In the edge holding aligner 20 according to the embodiment of the present invention, two holding bodies 26 and 27 are provided in two points symmetrically with respect to the turning axis L1. As a result, the distance between the holding bodies 26 and 27 can be increased, so that the possibility of interference between the turning arm 22 and the robot hand 18 can be reduced. Accordingly, when the wafer 19 is delivered from the turning arm 22 to the robot hand 18, the range in which the wafer 19 can be delivered can be increased without changing the wafer 19 held by the turning arm 22. This can reduce the possibility that the wafer 19 whose position has been adjusted will be displaced. In addition, the structure can be simplified.

  As shown in FIG. 4, each holding body 26, 27 comes into contact with the edge 16 at both side portions 95, 96. Thereby, even with the two holding bodies 26 and 27, the wafer 19 can be stably held. Further, the holding members 26 and 27 cooperate to press the wafer 19 so that the wafer 19 can be held more reliably. As a result, even if the swivel arm 22 is angularly displaced, the wafer 19 can be prevented from being displaced. Further, when the wafer is transferred from the robot hand 18 to the turning arm 22, even if the wafer 19 is displaced with respect to the robot hand 18, the wafer 19 can be accurately arranged coaxially with the turning axis L1. .

  Further, as shown in FIGS. 19, 23, and 24, by adjusting the position of the aligner 20 so that the robot arm 18 enters from a direction substantially perpendicular to the base axis L21, the turning arm 22 is moved to the robot. In the case of an angular position that is not in the hand non-interference angle range ω1, it is possible to reduce the possibility that the angular position is in the replacement arm interference angle range ω2, and the number of replacements can be reduced.

  As shown in FIG. 5, a straight line 94 connecting the position where each of the replacement bodies 28 to 31 contacts the edge of the wafer 19 and the angular displacement axis L <b> 2 extends in parallel to the turning axis L <b> 1. In other words, the straight line 94 extends in the radial direction of the wafer 19. Each of the replacement bodies 28 to 31 receives a rotational moment around the angular displacement axis L2, L3 from the angular displacement shaft 54, and presses the edge 16 toward the turning axis L1.

  As described above, the straight line 94 that connects the angular displacement axis L2 and the replacement bodies 28 to 31 extends in parallel with the turning axis L1, so that only the force in the radial direction A is applied to the wafer 19 in the replacement bodies 28 to 31. Is given from. That is, a force in the thickness direction is not applied to the wafer 19 from the holders 23 to 31, and damage can be prevented and the wafer 19 can be reliably held.

  In the retracted state where the edge 16 is not held, the replacement bodies 28 to 31 need to be arranged at a position where the angular displacement of the turning arm 22 is allowed. For example, as a comparative example, when the replacement bodies 28 to 31 are linearly displaced along the radial direction A and come into contact with the edge 16, a long movement path is required to move to the retracted position, and the aligner Increase in size. However, in the present embodiment, the replacement bodies 28 to 31 are angularly displaced around the angular displacement axes L2 and L3, and approach and separate from the edge. As a result, the moving path of the angular displacement bodies 28 to 31 can be shortened and the aligner 20 can be downsized as compared with the case where the replacement bodies 28 to 31 move straight in the radial direction A.

  In addition, when the exchanging body 28 is simply angularly displaced, there is a possibility that a force is applied in the thickness direction of the wafer 22 to hold it, but as described above, the angular displacement axis L2 and the exchanging bodies 28 to 31 are connected. The connecting straight line 94 extends in parallel with the turning axis L1 and can prevent a force in the thickness direction from being applied to the sandwiched wafer 19.

  In the present embodiment, the holding bodies 26 and 27 are driven in conjunction with the air cylinder operated by compressed air supplied from a common pump. Since the air has compressibility, even if one of the two holding bodies 26 comes into contact with the wafer 19 first, the holding body 26 does not press the substrate extremely strongly. And since the pressure of the compressed air which operates the holding bodies 26 and 27 is equal, the force which each holding body 26 and 27 presses a board | substrate finally balances, and the wafer 19 can be hold | maintained coaxially with the turning axis L1.

  Similarly, since the holding arms 32 to 35 are also driven in conjunction with the compressed air supplied from a common pump, the same effects as those of the holding bodies 26 and 27 described above can be obtained.

  If the control means 38 can control the robot hand drive means 39, the control means 38 is determined based on the detection results of the two second notch detection means 24a, 24b and the first notch detection means 23 in step e11. However, the difference between the turning axis L1 and the axis L10 of the wafer held by the robot hand 18 may be obtained, and the teaching position of the robot hand 18 may be corrected again. As a result, even if the operator does not pinch the movement position of the robot hand 18 accurately, the pinching position is corrected and the wafer 19 can be adjusted coaxially with the turning axis L1 by the robot hand 18. Accordingly, the robot hand 18 can be taught in a short time, and convenience can be improved. In addition, mishandling of the wafer 19 can be prevented.

  The above-described embodiment of the present invention is merely an example of the present invention, and the configuration can be changed within the scope of the invention. For example, although the notch 17 is detected as the positioning portion, a positioning portion other than the notch 17 may be used. For example, even if an orientation flat formed on the wafer 19 is detected, the position of the wafer 19 can be adjusted. The edge holding aligner 20 may adjust the position of a substrate other than the wafer 19, for example, the position of a disk-shaped glass substrate.

  Further, the swing arm driving means 36, the holding arm driving means 37, and the holding body driving means 40 may not be configured as described above, and can drive the turning arm 22, the holding arms 32 to 35, and the holding bodies 26 and 27. Any other configuration may be used. For example, the exchange arm driving means 37 and the exchange arm driving means 40 are realized using an air cylinder, but may be realized using an electric motor. Further, each notch sensor 23, 24a, 24b may be realized by other than an optical fiber. Further, although the turning axis L1 extends in the vertical direction, it may extend in other directions. In this case, one of the height directions is a direction other than the vertical direction. Further, the base axis L21 and the robot movement path U1 may not be 90 degrees. The control operation of the control means 38 is an example of the present invention, and other control operations may be performed using the aligner 20 of the present invention.

It is a perspective view showing typically edge maintenance aligner 20 which is one embodiment of the present invention. FIG. 3 is a plan view showing a part of the edge holding aligner 20 with a part thereof omitted. It is sectional drawing which expands and shows the holding body 26 seeing from the virtual surface perpendicular | vertical to the turning axis L1. It is a top view which expands and shows the holding body. It is sectional drawing which expands and shows the exchange arm 32 seeing from the virtual surface containing the turning axis L1 and the base axis L21. It is sectional drawing of the aligner 20 seen from the S6-S6 cutting line of FIG. It is sectional drawing of the aligner 20 seen from the S7-S7 cutting line of FIG. It is a top view which shows the state by which the axis line L10 and the turning axis line L1 of the wafer 19 were arrange | positioned coaxially. It is a graph which shows the relationship between the light reception amount of a light-receiving part, and the angle position of a turning arm. 3 is a block diagram showing an electrical configuration of the aligner 20. FIG. It is sectional drawing which shows specifically the aligner 20 of the state in which the turning arm 22 and the base 21 were arranged up and down. It is sectional drawing which looked at the aligner 20 of FIG. 11 from the S12-S12 cut surface line. It is sectional drawing which looked at the aligner 20 of FIG. 11 from the S13-S13 cut surface line. 3 is a cross-sectional view showing a specific configuration of a swing arm 22. FIG. It is sectional drawing which shows the turning arm 22 of FIG. 14 seeing from a S15-S15 cut surface line. It is sectional drawing which shows the turning arm 22 of FIG. 14 seeing from a S16-S16 cut surface line. FIG. 15 is a cross-sectional view seen from the cutting arm line S17-S17 in FIG. 3 is a flowchart showing a rough control operation of the control means 38. FIG. 6 is a plan view for explaining the position adjustment operation of the aligner 20. It is a top view for demonstrating the 1st position adjustment operation.

It is a top view for demonstrating 2nd position adjustment operation | movement. It is a flowchart which shows the procedure of 2nd position adjustment operation | movement. It is a top view for demonstrating the procedure of 2nd position adjustment operation | movement. It is a top view for demonstrating the procedure of 2nd position adjustment operation | movement. It is a top view for demonstrating the 3rd position adjustment operation. It is a flowchart which shows the procedure of 3rd position adjustment operation | movement. It is a top view which shows the procedure of 3rd position adjustment operation | movement. It is a flowchart which shows the specific operation | movement procedure when delivering the wafer 19 to a robot hand. It is a top view for demonstrating the operation | movement procedure when delivering the wafer 19 to a robot hand. 4 is a flowchart showing the operation procedure of the control means 38 in more detail. 4 is a flowchart showing the operation procedure of the control means 38 in more detail. It is a top view which shows the case where the axis line L10 of the wafer 19 has shifted | deviated and arrange | positioned with respect to the turning axis line L1. It is a graph which shows the relationship between the light reception amount of the light-receiving part in the case of FIG. 32, and the angular position of a turning arm.

Explanation of symbols

16 Edge 17 Notch 18 Robot Hand 19 Substrate 20 Aligner 21 Base 22 Rotating Arm 23 First Notch Sensor 24a, 24b Second Notch Sensor 25 Encoder 26, 27 Holding Part 28-31 Change Part 32-35 Change Arm 36 Servo Motor 37 Transfer body drive means 38 Control means 39 Robot hand drive means 40 Holding body drive means L1 Rotating axis

Claims (7)

An edge holding aligner that determines a positioning portion provided in advance on a part of an edge of a disk-shaped substrate and adjusts and holds the position of the substrate based on the determination result,
The base,
A swivel arm having a predetermined swivel axis, supported by the base so as to be angularly displaceable about the swivel axis, and having a holding body that holds the edge of the substrate in a state where the substrate axis and the swivel axis coincide with each other;
Swivel arm drive means for driving the swivel arm to be angularly displaced about the swivel axis;
Holding body driving means for displacing and driving the holding body in the radial direction of a virtual circle centered on the turning axis;
Positioning unit first detection means that is provided on the base, faces the moving path of the edge of the substrate, and detects the presence or absence of the positioning unit by facing the positioning unit;
Positioning unit second detection means provided on the swivel arm, facing the movement path of the edge of the substrate, and detecting the presence or absence of the positioning unit by facing the positioning unit;
Angular position detection means for detecting the angular position of the swivel arm about the swivel axis;
The turning arm driving means is controlled to angularly displace the turning arm, and the position of the positioning part is determined based on the detection results of the positioning part second detecting means and the angular position detecting means during the angular displacement period. An edge holding aligner comprising: control means for controlling the driving means to angularly displace the swivel arm so that the holding body and the positioning portion are arranged at positions displaced from each other in the circumferential direction.   In the state where the positioning unit is arranged at a predetermined reference angular position, the control means is configured such that the holding body is arranged so that the swivel arm is arranged in a deliverable position range where the substrate can be delivered to another substrate transfer device. 2. The edge holding aligner according to claim 1, wherein the turning arm driving means is controlled to angularly displace the turning arm before holding. A replacement arm and a replacement arm having a replacement body for taking out the substrate from the holding body and holding the taken-out substrate again in the holding body, and maintaining the swivel arm in an angularly displaceable state with the substrate removed from the holding body The edge holding aligner according to claim 1 or 2, further comprising: a replacement arm driving means for driving the displacement of the edge holding aligner.   In the state where the positioning unit is disposed at a predetermined reference angular position, the control means is configured so that the holding body holds the substrate so that the swing arm is disposed in a non-interference position range in which the holding arm and the swing arm do not interfere with each other. The edge holding aligner according to claim 3, wherein the turning arm driving means is controlled to angularly displace the turning arm before holding.   The edge holding aligner according to any one of claims 1 to 4, wherein a plurality of holding bodies are provided, and each holding body holds the board by cooperatively holding the board from both sides in the radial direction. .   2. The apparatus according to claim 1, further comprising: a deviation detecting means for calculating a deviation of the substrate with respect to a predetermined position by detecting the positioning portion of the substrate using the first positioning unit detecting unit and the second positioning unit detecting unit. The edge holding aligner according to any one of 1 to 5. An edge retention aligner according to claim 6;
A substrate transfer device for transferring the substrate to the edge holding aligner,
The substrate transfer apparatus corrects the position of the substrate based on the substrate shift detected by the shift detection means of the edge holding aligner.

Images