JP2005039019A - Electronic apparatus device and heat dissipating method for electronic apparatus device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an electronic device apparatus which can dissipate heat via a cradle even when a casing temperature of the electronic device is raised by placing a portable small-sized electronic device on the cradle and using if for a long period of time. <P>SOLUTION: A method for heat dissipating the electronic device apparatus includes a step of dissipating heat transferred to a contact 55 of a semi-circular recess of the cradle 2 from a heat dissipating part provided on the back surface of the cradle 2 via the bottom plate 41D of a frame member 42 arranged in contact with the opening 54 of the electronic apparatus 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention has an image pickup means such as a digital camera, has a built-in heat generating member such as a recording / reproducing drive unit that records and reproduces a captured image on a recording medium, and dissipates heat from the heat generating member through a cradle. The present invention relates to an electronic device device and a heat dissipation method for the electronic device device.
[0002]
[Prior art]
Description has been made so far that a cradle to which a communication cable such as a USB (Universal Serial Bas) or IEEE1394 cable is connected is known when a digital camera is connected to a computer (CPU) or the like via a communication cable. It is disclosed in Patent Document 1.
[0003]
Some portable electronic devices such as digital cameras and handheld computers use a table-shaped docking station on which electronic devices are mounted for connection to external devices such as desktop computers. The docking station is provided with a connector for electrical connection with the electronic device and a connector used for connection with the external device, so that the connection between the electronic device and the external device can be facilitated. . Further, by omitting the connector of the electronic device main body, the electronic device can be downsized.
[0004]
Further, Patent Document 2 discloses that an AC power adapter is connected to the docking station to supply power to the electronic device via the docking station, and that some batteries in the electronic device are charged. . In the present invention, the cradle and the docking station described above will be described below as a cradle.
[Patent Document 1]
JP 2002-359761 A [FIG. 1 and paragraph number 0002]
[Patent Document 2]
JP 2002-232750 A (P2002-232750A) {FIG. 1, paragraph numbers 0001, 0002}
[0005]
[Problems to be solved by the invention]
In the portable electronic device as described in the above-mentioned prior art, when recording, reproducing operation, charging operation, etc. are performed on the cradle for a long time, the heating means (for example, CCD) in the electronic device is used. Since the heat is reduced in size, the heat released through the casing of the electronic device is limited, and thus the electronic device has a problem of high temperature.
[0006]
The present invention has been made to solve the above-mentioned problems. The problem to be solved by the present invention is to provide the cradle with a heat dissipation function to transfer heat released from the portable electronic device to the cradle. An object of the present invention is to obtain an electronic apparatus device and a heat dissipation method for the electronic apparatus device that are configured to be discharged through the cradle.
[0007]
[Means for Solving the Problems]
The electronic device device and the heat dissipation method for the electronic device device according to the present invention are configured to release heat emitted from the electronic device placed on the cradle through radiation means provided on the cradle.
[0008]
An electronic device apparatus according to the present invention is an electronic device device in which an electronic device having a heat generating means built in a casing is placed on a cradle to perform various operations, and heat generated by the heat generating means of the electronic device is casing. The heat is transmitted to the cradle through the cradle, and the heat generated from the heat generating means is released through the cradle.
[0009]
A heat dissipation method for an electronic device according to the present invention is a heat dissipation method for an electronic device that is configured to perform various operations by placing an electronic device having a heating means built in a casing on a cradle. The heat generated by the means is transmitted to the cradle through the casing, and the heat generated from the heat generating means is released through the cradle.
[0010]
According to the electronic device device and the heat dissipation method of the electronic device device of the present invention, the heat radiation of the electronic device placed on the cradle can be effectively radiated through the cradle.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the electronic device device and the heat dissipation method of the electronic device device of the present invention will be described in detail with reference to FIGS.
[0012]
As an electronic apparatus used in the present invention, a recording / reproduction drive unit (HDD, FDD, optical pickup drive unit, flash memory, etc.) for recording / reproducing a recording medium, and an electronic apparatus provided with a camera as an imaging means such as a CCD in a casing The electronic device apparatus mounted on the cradle will be described.
[0013]
FIG. 1 is a schematic perspective view showing an electronic device and a cradle mounting method according to the present invention. FIG. 2 is a bottom view of the cradle shown in FIG. 1B and a side sectional view of a contact surface between the electronic device and the cradle. 3 is an exploded view and assembly perspective view for explaining a heat radiation mechanism from the heat radiation means used in the electronic device of the present invention, and FIG. 4 is a diagram for explaining a heat radiation method from other heat radiation means used in the electronic device of the present invention. FIG. 5 is an external view of an HDD unit used in the electronic apparatus of the present invention, and FIG. 6 is a side for explaining a method for removing unwanted radiation using the heat radiation means described in FIG. FIG. 7 is a perspective view and a side view for explaining the operation of the cradle used in the electronic device of the present invention. FIG. 8 is a side view for explaining the operation of the cradle used in the electronic device of the present invention. 9 is a perspective view of the cradle. FIG. 10 is a front view showing an example of the external appearance of an electronic device used in the present invention, and FIG. 11 is an external view of the electronic device used in the present invention. FIG. 12 is a system diagram of an electronic apparatus device according to the present invention.
[0014]
10 and 11 are plan views of six surfaces of the electronic apparatus according to the present invention, and a cradle 2 (see FIG. 1B) is provided between the electronic apparatus and the computer (hereinafter referred to as CPU). Signals are sent and received.
[0015]
10 (A), 10 (B) and 11 (C) to 11 (F), reference numeral 1 denotes an electronic device having a built-in HDD unit and a camera unit 5, and image data and the like captured by the electronic device 1 are shown. A cradle 2 serving as a mounting base for transmitting and receiving is a large one formed on the upper and lower surfaces of an electronic device 1 on a semicircular recess 10 on a mounting base molded of synthetic resin or the like as shown in FIG. The electronic device device 40 (see FIG. 8A) is configured by being placed so that the semicircular portion 9 formed with a curved surface of R (approximately 10R) fits.
[0016]
10 (A), 10 (B) and 11 (A) to 11 (F), the electronic device 1 is pivotally attached to a pivot 4 disposed on the lower end side of the casing serving as the main body 3. It is comprised with the camera part 5. FIG. As shown in FIGS. 3B and 8A, the camera unit 5 can be rotated about 180 degrees with respect to the main body 3 around the pivot 4, and the lens 6 is set at a predetermined position from the front side to the rear side. can do.
[0017]
A liquid crystal display device (hereinafter referred to as LCD unit) 7 and various operation button groups 8 are disposed on the front side of the main body 3, and a touch panel unit 37 made of a transparent conductive film or the like is disposed on the panel surface of the LCD unit 7, A thin HDD unit (see FIG. 3A) 19 is disposed so as to be substantially parallel to the LCD unit 7, and an LED 12 for accessing the HDD unit 19 is disposed on the left side of the operation button group 8. The access status of the HDD unit 19 can be monitored from the outside of the main body 3.
[0018]
Further, as shown in FIG. 1C, the semicircular portion 9 of the main body 3 is fitted into the semicircular concave portion 10 of the cradle 2, whereby electrical connection is established, and the video terminal, audio terminal, USB terminal of the cradle 2 are formed. (Refer to FIG. 12) and input / output to / from the CPU, CRT and the like. The cradle 2 also has a built-in charging circuit, and can also be used as a charging device, and can be arranged inclined with respect to the mounting surface via the stand 11.
[0019]
The casing 41 constituting the main body 3 is formed in a substantially rectangular parallelepiped shape, and the panel plate 41F and the rear plate 41B are made of a material having a low thermal conductivity such as a substantially box-shaped titanium alloy or synthetic resin as shown in FIG. For example, even if the HDD unit or the like generates heat, the panel plate 41F and the rear plate 41B are not heated even if they are touched by hand.
[0020]
The left and right side plates 41L and 41R (see FIGS. 3A and 3B) of the main body 3 are substantially made of a material having a high thermal conductivity such as magnesium alloy, aluminum, duralumin and the like as shown in FIG. A frame member 42 having a cross-section in cross section is formed, and the HDD unit 19 serving as a heat generating means, the main board 43, and the like are sequentially inserted into the frame member 42 as shown in FIG. The casing 41 is configured by holding the panel plate 41F and the rear plate 41B so as to partially cover the frame member 42 while being held so as to transmit heat.
[0021]
Accordingly, the left side plate 41L of the casing 41 is exposed to the surface when the camera unit 5 is rotated about the pivot 4 as shown in FIG. 3B, and the heat of the heat generating means is exposed from the side portion of the casing 41. Is released. Of course, the heat transmitted from the right side plate 41R to the outside via the frame member 42 may be released to the outside of the main body 3.
[0022]
The right side plate 41R has an opening through which a primary battery for driving the electronic device 1 and a secondary battery for backup are inserted, and a battery lid 45 is pivotally mounted so as to be opened and closed.
[0023]
An optical system such as a lens 6 and a photoelectric conversion means such as a CCD are built in the camera unit 5, and a camera casing 46 is formed in a flat and substantially rectangular parallelepiped shape like the main body 3, and is a front plate in FIG. The rear plate is made of a titanium alloy plate, and the left and right side surfaces are made of a magnesium alloy plate.
[0024]
Further, a slide lid 47 serving as a shutter of the lens 6 of the camera unit 5 is slidable in the left-right direction in FIG. 1A between the main body 3 formed as a semicircular portion 9 and the camera unit 5. The slide lid 47 is shown in an open state in FIGS. 1 (A) and 1 (E).
[0025]
A sound collecting microphone (not shown) is provided below the slide lid 47 on the main body 3 side, and picks up ambient acoustic signals during imaging through a sound collecting hole 48 formed in the slide lid 47.
[0026]
Similar to the semicircular portion 9 at the top of the casing 41 and the camera casing 46, the slide lid 47 is formed in a convex curved shape on the upper side of the large R, and the slide lid 47 is slid rightward in FIG. In this case, an electronic device that can be regarded as a flat, substantially rectangular parallelepiped casing in which the lens 6 is covered with the slide lid 47 and the main body 3 and the camera unit 5 are integrated can be configured. In FIG. 11E, reference numeral 50 denotes a shutter button.
[0027]
Further, in the state shown in FIGS. 10A and 11F, the camera unit 5 is rotated around the pivot 4 in the front-rear direction in FIG. 10A and in the vertical direction in FIG. 11F. 3B and 8A, the main body 3 can be rotated in the range of about 180 degrees in the front-rear direction. Of course, the camera unit 5 is configured to be able to be locked to the main body 3 at a predetermined angle in a click motion.
[0028]
Further, the bottom surface of the main body 3 is pressed so that an opening 54 is formed when the panel plate 41F and the rear plate 41B constituting the casing 41 are put together as shown in FIG. 11 (F).
[0029]
Therefore, the bottom plate 41D of the frame member 52 having a large thermal conductivity described with reference to FIG. Reference numeral 52 denotes a guide board disposed on the bottom plate 41D, and a guide pin hole 53 for a guide pin is formed in the guide board 52.
[0030]
FIG. 12 is an overall system diagram of the electronic device apparatus 40 of the present invention, and the same reference numerals are given to the corresponding parts to those in FIGS.
[0031]
In the camera unit 5 of the electronic device 1, a subject image captured through the optical system of the lens 6 is projected onto an image sensor such as a CCD 13, and a video signal converted into an electrical signal by the CCD 13 and a sound collected by a microphone are collected. Signals and the like are supplied to a bus line 18 connected to a control circuit 36 constituted by a main computer via a preamplifier circuit 14, a camera and audio signal processing circuit 15 and the like.
[0032]
An HDD (recording / playback drive unit) 19, a buffer memory 21, and a memory card 23 are connected to the bus line 18 via interfaces 20, 22, and 24, and video stored in the buffer memory 21 and the HDD 19 via a control circuit 36. The video signal is displayed on the monitor LCD unit 7 via the monitor drive circuit 16 as signal and audio signal data, and a menu instruction is given by the touch panel unit 37 provided on the panel surface of the LCD unit 7. In addition, sound signals are emitted through the speaker drive circuit 27 and the speaker 28, and if necessary, the image signals, sound signals, and USB are transmitted through the image signal processing circuit 31, the sound signal processing circuit 32, and the interface 33 in the cradle 2. Output the signal to the outside.
[0033]
The cradle 2 performs AC-DC conversion of an AC external power supply 34 through a plug 35 by a power supply circuit 30 and is supplied to a power supply circuit 25 disposed in the main body 3 of the electronic apparatus 1, and serves as a voltage source for the above-described circuits. It is operating.
[0034]
A method of radiating the heat released from the HDD unit 19 of the electronic device 1 using the electronic device 1 as described above through the heat radiating means provided in the cradle 2 will be described with reference to FIGS.
[0035]
FIG. 1A is a perspective view of the above-described electronic apparatus 1 as viewed from the bottom surface side, and an opening 54 formed on the bottom surface of the casing 41 of the main body 3 allows the frame member 42 described in FIG. The bottom portion 41D is exposed.
[0036]
On the other hand, the bottom of the semicircular projection 10 formed on the mounting surface of the cradle 2 used in this example is in contact with the bottom 41D of the casing 41 on the main body 3 side, and heat from the HDD unit 19 is transferred to the frame member 42. A metallic contact portion 56 that transmits to the substrate is formed. The contact member 56 is provided with a connector 58 made up of a jack or a plug that is erected with a guide pin 57 inserted into the guide pin hole 53 of the main body 3 and is coupled to the connector 51. Reference numeral 59 will be described with reference to FIGS. 7A to 7C. The back support 59 is attached as necessary, and has a substantially U-shaped cross section. The back support 59 may be made of a metal having good thermal conductivity so that heat from the bottom plate 41D of the main body 3 is transmitted to the back support 59.
[0037]
As described above, the heat of the HDD unit 19 and the like transmitted to the contact portion 56 and the back support 59 is radiated from the heat radiating portion 60 formed on the bottom surface 61 of the cradle 2 shown in FIG. The heat radiating portion 60 is not only thermally connected to the contact portion 56 and the back support 59 described above, but the heat radiating portion 60 is provided with fins or the like as necessary. Then, forced air cooling may be used. In the case of FIG. 2A, since the rubber legs 62 are provided on the bottom 61, it is possible to promote thermal convection through a gap between the bottom 61 of the cradle 2 and the placement surface. Reference numeral 63 denotes a stand provided for tilting the cradle as will be described later.
[0038]
FIG. 2B shows a side cross section in a state where the guide pin 57 erected on the contact portion 56 disposed on the cradle 2 is inserted into the guide pin hole 57 formed in the bottom plate 41D on the main body 3 side. Such a guide pin is made of metal, and heat can be radiated more effectively by exchanging heat from the guide pin 57 as well.
[0039]
In FIG. 2C, a magnet 64 magnetized so that the opposing surfaces have different polarities is provided on the bottom surface portion 41D on the main body 3 side and the contact portion 56 on the cradle 2 side, and the contact surfaces are more closely coupled. Such joining enhancing means is arranged, and these joining enhancing means may be a combination with a guide pin as shown in FIG.
[0040]
FIG. 2 (D) shows still another configuration of the bonding enhancing means. In FIG. 2 (D), the contact surface of the contact portion 56 on the cradle 2 side and the contact surface of the bottom plate 41D of the main body 3 contact each other. The unevenness portions 66 and 67 for increasing the area are formed, and a biasing force is applied so as to press the contact portion 56 in the direction of the arrow A via the spring 68 so as to be engaged with each other. It was made to raise.
[0041]
According to each of the above-described configurations, even when the electronic device 1 is placed on the cradle 2 and used for a long time, for example, in a video conference, it is possible to perform reliable heat radiation through the cradle 2. Electronic devices can be used for a long time.
[0042]
Next, as described with reference to FIGS. 10A and 10B and FIGS. 11C to 11F, the heat generated by the heat generating means in the casing 41 of the main body 3 or the camera casing 46 is discharged outside these casings. An example of the form to be discharged will be described in detail with reference to FIGS.
[0043]
3A shows an exploded perspective view of the main body 3, and FIG. 3B shows a perspective view of the electronic device 1 in which the main body 3 is assembled and the camera unit 5 is rotated to the rear side. It is.
[0044]
In FIGS. 3A and 3B, the substantially box-shaped panel plate 41F and the rear plate 41D constituting the casing 41 are portions that are held by a user or the like, so that a titanium material having poor thermal conductivity is used. To form a predetermined shape. By selecting such a material, it is possible to prevent a low-temperature burn of the user and to have a lightweight and high-class feeling.
[0045]
A frame member 42 made of a magnesium alloy having high rigidity is formed in a substantially square shape by forging, and the frame member 42 is used as a basic skeleton, and heat generating components such as the HDD unit 19 and the main board 43 that are heat generation sources are frame members. It is fixed to the frame member 42 while dropping into the frame 42. Finally, it is fixed to the frame member by the panel plate 41F and the rear plate 41B made of rigid and lightweight titanium, and integrated to make it more rigid. An excellent casing 41 for the electronic device 1 is obtained.
[0046]
Further, since the left side plate 41L portion and the bottom surface portion 41D constituting the frame member 42 are exposed through the opening portions 70 and 54 provided in the panel plate 41F and the rear surface plate 41D constituting the casing 41, FIG. As shown in B), when the camera unit 5 is being rotated around the pivot 4 during use, the left side plate 41L is not touched. The emitted heat can be released.
[0047]
According to the above configuration, the HDD unit or the like is protected by the forged frame member 42, so that not only a structure that is strong against shock or shock when dropped is obtained, but also the assembly of the main board 43 and the like is a frame member. The assembly workability is improved because it is simply dropped into 42, and when carrying the main body, it is possible to have a structure in which the part that touches the hand does not become hot.
[0048]
Next, a method of thinning the main board 43 shown in FIG. 3A and effectively releasing the heat generated from the heat-generating component placed on the main board 43 will be described with reference to FIGS. .
[0049]
FIG. 4A is a schematic perspective view in the case of fixing the main board 43 to the frame member while dropping it into the frame of the frame member 42 forged with the magnesium alloy or the like described in FIG. 4 (B) is a side sectional view from the direction of arrow AA. Since various parts are mounted on both sides of the conventional main board 43, in order to release heat from the board that generates heat from both sides, a heat conduction sheet for absorbing irregularities on the surface of the parts of the heat source, etc. In order to conduct heat to the heat radiating plate through the paste having a good thermal conductivity, the total thickness of the substrate is equal to the height of one side mount (about 1.5 mm) to mount the components on both sides, and the casing 41 of the electronic device 1 is thick. In this example, the components 71 are gathered only on one side of the main board 43, and the other side has a high thermal conductivity, and a thin (0.3 mm) copper plate 72 is attached to the ground. It is made to be a potential. Of course, the copper plate 72 may be made to deposit a metal having a predetermined thermal conductivity.
[0050]
The copper plate 72 is formed with bent portions 73 and 74 at predetermined positions, and the bent portions 73 and 74 are fixed to the left and right side plates 41L and 41R or the bottom plate 41D of the frame member 42 to dissipate heat. Is designed to effectively dissipate heat from areas that are not touched.
[0051]
When configured as described above, the main board 43 inserted into the frame member 42 is thinned, and effective heat radiation is performed outside the casing 41 from the bottom plate 41D and the left side plate 41L of the frame member 42 exposed from the casing. In addition, the copper plate adhered or vapor-deposited on one side can function as a shield member capable of preventing unnecessary radiation emitted from the components together with heat radiation.
[0052]
Further, the heat radiation method of the HDD unit 19 described in FIG. 3 and the method of effectively preventing unnecessary radiation of components mounted on the main board 43 using the metal case of the HDD unit 19 will be described with reference to FIGS. I will explain. 5A is an external view showing one surface of the HDD unit 19 serving as a heat generation source, and FIG. 5B is an external view showing the other surface, but the HDD unit 19 is shown in FIG. In this way, after assembling each component necessary for HDD driving on the HDD driving printed circuit board 75 made of a synthetic resin material, the HDD driving printed circuit board 75 is assembled in a box-shaped aluminum casing 76. Yes. Reference numeral 77 denotes an input / output connector connected via a flexible substrate 78.
[0053]
In this example, the heat generated in the HDD unit 19 is transmitted through the frame member 42 by arranging the peripheral portion of the aluminum casing 76 of the HDD unit so as to be in contact with the frame member 42 described in FIG. It can be discharged out of the casing 41.
[0054]
Further, unnecessary radiation from both the mounted component of the HDD unit substrate 19 and the mounted component of the main substrate 43 using the copper plate 72 provided on the main substrate 43 and the aluminum casing 76 of the HDD unit 19 is shown in FIG. It can prevent by arrange | positioning. Further, unnecessary radiation of the component 71 of the main board 43 can be prevented by disposing it as shown in FIG.
[0055]
That is, in FIG. 6A, the printed circuit board 75 side of the HDD unit 19 and the copper plate 72 of the main board 43 are dropped into the frame member 42 in parallel and fixed. In this way, unnecessary radiation of components in the printed circuit board 75 of the HDD unit 19 can be prevented by the aluminum casing 76 of the HDD unit 19 and the copper plate 72 of the main board 43. Unwanted radiation from the components 71 mounted on the main board 43 can be shielded between the copper plate 72 and the metal part of the casing 41.
[0056]
In the case shown in FIG. 6B, the aluminum casing 76 of the HDD unit 19 and the component mounting surface of the main board 43 are arranged adjacent to each other. In this case, the components depend on the aluminum casing 76 and the copper plate 71. Unwanted radiation from 71 can be shielded.
[0057]
Next, the configuration and operation of the back support 59 and the stand 11 described in FIG. 1 will be described with reference to FIGS.
[0058]
In the configuration of FIG. 7A, the back support 59 is pivotally attached to the semicircular recess 10 with respect to the main body of the cradle 2 so as to be rotatable about the pivot 80. The electronic device 1 is placed on the back support 59, and the back support 59 is rotated counterclockwise as shown in FIGS. 7B to 7C so that the photographing angles of the camera unit 5 and the main body 3 can be adjusted. You can take it freely.
[0059]
8A to 8C show the camera angle of the camera unit 5 of the electronic device 1 placed on the cradle 2 using a stand pivotally attached to the back of the cradle 2 so as to be openable and closable. Is made to be able to face down.
[0060]
In a general video conference or the like, an electronic device is used on a television receiver or the like as shown in FIG. 8B. In this case, the camera angle of the camera unit 2 is the direction of arrow C as shown in FIG. 8B. It becomes upward like. Therefore, when the stand 11 is set up as shown in FIGS. 8A and 8C, the camera angle of the camera unit 2 can be adjusted substantially horizontally or downward as shown by arrows D and E. In combination with the adjustment of the back support 59 described in FIG. 7, the camera angle can be freely changed.
[0061]
9A to 9C, a detection switch 82 is provided in a part of the storage portion 83 of the stand 11 provided on the bottom surface of the cradle, and the stand 11 is changed from the state of FIG. 9B to FIG. In this case, the detection switch 82 operates and the USB streaming function is switched. The switch operation for switching from the normal function operation to the video conference function in the video conference or the like is performed on the stand 11. It can be done with one action to open.
[0062]
【The invention's effect】
According to the electronic device device and the heat dissipation method of the electronic device device of the present invention, the cradle is provided with a heat dissipation function so that heat released from the portable electronic device is transmitted to the cradle and is released through the cradle. As a result, it is possible to effectively dissipate heat through the cradle when the electronic apparatus is used for a long time.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view showing an electronic device and a method for placing the electronic device on a cradle according to the present invention.
FIG. 2 is a bottom view of the cradle shown in FIG. 1B and a side sectional view of a contact surface between the electronic device and the cradle.
FIGS. 3A and 3B are an exploded perspective view and an assembled perspective view for explaining a heat radiating mechanism from a heat radiating means used in the electronic apparatus of the present invention. FIGS.
FIGS. 4A and 4B are a schematic perspective view and a side sectional view for explaining a heat radiating method from another heat radiating means used in the electronic apparatus of the present invention. FIGS.
FIG. 5 is an external view of an HDD unit used in the electronic apparatus of the present invention.
6 is a side cross-sectional view for explaining a method for removing unwanted radiation using the heat radiation means described in FIG. 5;
FIGS. 7A and 7B are a perspective view and an operation explanatory side view for explaining a rotation mechanism of a cradle used in the electronic device apparatus of the present invention. FIGS.
FIG. 8 is a perspective view for explaining a cradle stand used in the electronic device of the present invention.
FIG. 9 is a partial side sectional view for explaining detection switches provided on the bottom surface of the cradle and the stand.
FIGS. 10A and 10B are a front view and a side view illustrating an example of an external appearance of an electronic apparatus used in the invention. FIGS.
FIGS. 11A and 11B are a rear view and a side view illustrating an example of an external appearance of an electronic apparatus used in the invention. FIGS.
FIG. 12 is a system diagram of an electronic apparatus device according to the invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Electronic device, 2 ... Cradle, 3 ... Main body, 5 ... Camera part, 7 ... LCD, 9 ... Semicircle part, 10 ... Semicircle recessed part, 42 ... Frame member, 56 Contact part, 57 Guide pin

Claims (8)

An electronic device apparatus that is configured to place various electronic devices with a heating means built in a casing on a cradle and to perform various operations.
An electronic device apparatus, wherein heat generated by the heat generating means of the electronic device is transmitted to the cradle through the casing, and heat generated from the heat generating means is released through the cradle. The electronic apparatus apparatus according to claim 1, further comprising a bonding enhancement unit that enhances a bonding state between the electronic apparatus and the cradle. 2. The electronic device apparatus according to claim 1, wherein the heat transmitted from the casing through the joining enhancing means is transmitted to the cradle side. 4. The electronic device apparatus according to claim 2, wherein the joining enhancing means is a guide pin. The electronic device apparatus according to any one of claims 2 to 4, wherein the joining enhancing means is an electric attracting means such as a magnet. 6. The electronic device apparatus according to claim 2, wherein the bonding enhancing unit is a pressing unit that mechanically applies a pressing force to the electronic device. The heat radiation of the heat generating means provided in the casing is transmitted to a metal frame member having a high thermal conductivity, and heat is transmitted to the cradle through the metal frame member. The electronic device apparatus of any one of Claim 6. An electronic device device heat dissipation method in which an electronic device having a heating means built in a casing is placed on a cradle and various operations are performed,
The heat generated by the heat generating means of the electronic device is transmitted to the cradle through the casing, and the heat generated from the heat generating means is released through the cradle, and the heat radiating method of the electronic device is characterized in that .

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