JP2005032796A - Electronic component mounting structure and electronic component mounting method - Google Patents

Electronic component mounting structure and electronic component mounting method Download PDF

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Publication number
JP2005032796A
JP2005032796A JP2003193435A JP2003193435A JP2005032796A JP 2005032796 A JP2005032796 A JP 2005032796A JP 2003193435 A JP2003193435 A JP 2003193435A JP 2003193435 A JP2003193435 A JP 2003193435A JP 2005032796 A JP2005032796 A JP 2005032796A
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Japan
Prior art keywords
electronic component
resin
substrate
electrodes
component mounting
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JP2003193435A
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Japanese (ja)
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JP3912342B2 (en
Inventor
Tadahiko Sakai
忠彦 境
Seiichi Yoshinaga
誠一 吉永
Hideki Nagafuku
秀喜 永福
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2003193435A priority Critical patent/JP3912342B2/en
Publication of JP2005032796A publication Critical patent/JP2005032796A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting structure which is capable of effectively protecting the top surface of an electronic component while the electronic component is mounted, to provide an electronic part mounting method, and to provide a resin projection forming material used for forming a resin protrusion in the electronic part mounting method. <P>SOLUTION: The electronic component mounting structure has a structure wherein an electronic component 4 is mounted on a board 2, and a gap between the electrode forming surface of the electronic component 4 and that of the board 2 is sealed up with reinforcing resin 3. The method of forming the electronic component mounting structure comprises processes of mounting the electronic component 4 on the board 2 after the reinforcing resin 3 having a thixotropy ratio of 3 or above is previously applied on the board 2, protruding the reinforcing resin 3 located outside of the electronic component 4 upward so as to set its top 3b located higher than the top surface of the electronic component 4 and located outside of the outer edge 4b of the electronic component 4, and setting the reinforcing resin 3 keeping it in a state wherein it hardly flows so as to form resin protrusions 3a which protect the top surface of the electronic component 4 while the electronic component 4 is mounted. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品を基板に実装しこの電子部品の電極形成面と基板の電極形成面との間を樹脂によって封止する電子部品実装構造および電子部品実装方法ならびにこの電子部品実装方法において樹脂突出部を形成するために用いられる樹脂突出部形成用材料に関するものである。
【０００２】
【従来の技術】
半導体素子などの電子部品を基板に実装した電子部品実装構造として、電子部品の下面と基板の上面との間に樹脂接着材を介在させて補強した構成のものが知られている（たとえば特許文献１参照）。この特許文献例では、半導体素子を基板に超音波接合により実装するに際し、あらかじめ実装位置に樹脂接着材を塗布しておき、樹脂接着材上から半導体素子を押圧して超音波接合するとともに、樹脂接着材を硬化させて半導体素子と基板との間を補強するようにしている。これにより、半導体素子と基板との接合強度が向上し、実装信頼性を向上させることができる。
【０００３】
【特許文献１】
特開平３−２４７４２号公報
【０００４】
【発明が解決しようとする課題】
ところで、半導体素子などの電子部品が実装された実装基板を作業者が取り扱う際には、作業者が実装基板の端部を把持する時の力によって、また何らかの理由で実装基板が他の固形物に打ち当てられた際の衝撃などによって、実装後の電子部品がダメージを受ける可能性がある。このため部品実装後の基板のハンドリング時には、何らかの方法で電子部品の上面側が保護されていることが望ましい。
【０００５】
しかしながら上述例に示す実装構造では、電子部品と基板との接合強度は改善されるものの、上面側については全く保護されておらず、ハンドリング時に破損を招く場合がある。そしてこの破損は、脆弱な薄型の電子部品を採用する場合に特に顕著であり、電子部品の上面を有効に保護する方策が望まれていた。
【０００６】
そこで本発明は、実装状態において電子部品の上面を有効に保護することができる電子部品実装構造および電子部品実装方法ならびにこの電子部品実装方法において樹脂突出部を形成するために用いられる樹脂突出部形成用材料を提供することを目的とする。
【０００７】
【課題を解決するための手段】
請求項１記載の電子部品実装構造は、接続用電極が複数形成された基板に電極が複数形成された電子部品を実装して前記電極を前記接続用電極に電気的に接続し、前記電子部品の電極形成面と前記基板の電極形成面との間を樹脂によって封止した電子部品実装構造であって、前記電子部品の外側において前記樹脂が前記電子部品の上面よりも上方に突出し、且つ最上部が電子部品の外縁よりも外側に位置する形状で硬化して形成された樹脂突出部を備えた。
【０００８】
請求項２記載の電子部品実装構造は、請求項１記載の電子部品実装構造であって、前記接続用電極または前記電極が導電性金属より成る突出電極である。
【０００９】
請求項３記載の電子部品実装方法は、接続用電極が複数形成された基板に電極が複数形成された電子部品を実装して前記電極を前記接続用電極に電気的に接続し、前記電子部品の電極形成面と前記基板の電極形成面との間を樹脂によって封止する電子部品実装方法であって、前記基板上の電子部品実装位置にチキソ比が２以上の樹脂を供給する樹脂供給工程と、前記電子部品を前記基板に搭載する搭載工程と、前記樹脂を硬化させる硬化工程とを含み、前記搭載工程において前記電子部品によって樹脂を前記電子部品の上面よりも上方に突出し且つ最上部が電子部品の外縁よりも外側に位置する形状に流動させ、前記硬化工程において樹脂を略前記形状を保った状態で硬化させて樹脂突出部を形成する。
【００１０】
請求項４記載の電子部品実装方法は、請求項３記載の電子部品実装方法であって、前記接続用電極または前記電極が導電性金属より成る突出電極である。
【００１１】
請求項５記載の樹脂突出部形成用材料は、接続用電極が複数形成された基板に電極が複数形成された電子部品を実装して前記電極を前記接続用電極に電気的に接続し、前記電子部品の電極形成面と前記基板の電極形成面との間を樹脂によって封止した電子部品実装構造において、前記電子部品の外側にはみ出した樹脂が前記電子部品の上面よりも上方に突出し且つ最上部が電子部品の外縁よりも外側に位置する形状で硬化した樹脂突出部を形成するために用いられる樹脂突出部形成用材料であって、樹脂主材と、前記樹脂主材を硬化させる硬化材と、充填材と、チキソ材とを含み、チキソ材を０．５〜２０ｗｔ％の範囲で含有する。
【００１２】
請求項６記載の樹脂突出部形成用材料は、請求項５記載の樹脂突出部形成用材料であって、前記チキソ材が無機の粉体である。
【００１３】
本発明によれば、搭載工程において電子部品によって樹脂を電子部品の上面よりも上方に突出し且つ最上部が電子部品の外側に位置する形状にはみ出させ、硬化工程において樹脂を略前記形状を保った状態で硬化させて樹脂突出部を形成することにより、電子部品の上面側を有効に保護することができる。
【００１４】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図１、図２は本発明の一実施の形態の電子部品実装構造の断面図、図３，図４は本発明の一実施の形態の電子部品実装方法の工程説明図、図５は本発明の一実施の形態の電子部品実装構造の断面図である。
【００１５】
まず図１を参照して電子部品実装構造１について説明する。電子部品実装構造１は接続用電極２ａが形成された基板２上に、下面に導電性金属より成る突出電極であるバンプ４ａが形成された電子部品４を実装したものである。この電子部品実装構造１においては、バンプ４ａを接続用電極２ａと電気的に接続し、電子部品４の電極形成面と基板２の電極形成面との間を熱硬化性樹脂より成る補強樹脂３によって封止した構造となっている。なお、ここでは電子部品４にバンプ４ａを設けた例を示しているが、基板２の接続用電極にバンプを設ける構成であってもよい。
【００１６】
この電子部品実装構造１において、補強樹脂３は電子部品４の外側にはみ出した形で硬化して樹脂突出部３ａを形成している。図１の拡大図に示すように、樹脂突出部３ａは電子部品４の上面よりも上方に突出し、且つ最上部３ｂが電子部品４の外縁４ｂよりも外側に位置する形状となっている。樹脂突出部３ａは、基板２に実装された後の電子部品４を保護する機能を有している。
【００１７】
すなわち図２（ａ）に示すように、基板２と固形物５が上下方向に相互に接近して打ち当てられたような場合においても、樹脂突出部３ａは電子部品４の上面よりも上方に突出した形状となっているため、固形物５からの外力は電子部品４には直接伝わらず、図２（ｂ）に示すように樹脂突出部３ａによって支持される。これにより、基板２と固定物５とが当接する際に、電子部品４の上面に外力や衝撃が作用することがなく、実装後の電子部品４を有効に保護する。
【００１８】
次に図３、図４を参照して電子部品実装構造１を形成するための電子部品実装方法について説明する。図３（ａ）において、基板２の上面には接続用電極２ａが複数形成されており、基板２の電子部品実装位置には、図３（ｂ）に示すように、補強樹脂３がディスペンサ６を用いた塗布により供給される（樹脂供給工程）。なお補強樹脂３の供給方法としては、補強樹脂３を所定厚さの膜状に成形した樹脂フィルムを基板２に貼着する方法を用いてもよい。
【００１９】
ここで補強樹脂３の材質としては、チキソ比が２以上の熱硬化性樹脂が用いられる。チキソ比は粘性流体の流れ易さを表す特性値であり、Ｅ型粘度計を使用して、０．５ｒｐｍの条件で求められた測定値を、５ｒｐｍの条件で求められた測定粘度で除した比率で定義されるものである。チキソ比が大きい程粘度が高く流動性が低い粘性流体であることを示しており、補強樹脂３に混入されるチキソ材の混入率を適切に設定することにより、チキソ比を所望の値に調整することができる。チキソ比が２以上（望ましくは３以上）の補強樹脂３を用いることにより、補強樹脂３は未硬化の状態であってもほとんど流動することなく塗布された形状を保つ。
【００２０】
このような熱硬化性樹脂としては、例えばエポキシ樹脂などの樹脂主材に、この樹脂主材を硬化させる硬化材と、樹脂や無機物のフィラー粒子などを含む充填材と、平均粒度１μｍ程度の無機の粉体より成るチキソ材を、０．５〜２０ｗｔ％の範囲で含有させたものが用いられる。硬化材としては、アミン系、カオチン系もしくはイミダゾール系の硬化材を用い、後述する熱硬化工程において、１２０℃〜２００℃の範囲で設定される温度に加熱されることにより、熱硬化反応が進行するような硬化材の配合となっている。
【００２１】
この後、図３（ｃ）に示すように、搭載ツール７によって電子部品４をバンプ４ａを下向きした姿勢で保持し、補強樹脂３が供給された基板２に対して搭載する（搭載工程）。この搭載工程において、電子部品４が下降して補強樹脂３の上面から内部へ沈み込むことにより、図３（ｄ）に示すように、基板２上面の補強樹脂３は電子部品４の下面によって押し除けられ、電子部品４の周囲から外側に向かってはみ出す。なお、搭載ツール７の外形は、電子部品４の外形よりも小さく設定されている。
【００２２】
このとき、補強樹脂３は前述のようにチキソ材を含有して粘性が大きく、したがって基板２の表面における濡れ性が低いことから、はみ出した補強樹脂３は基板２の表面に沿って外側には流動せずに、電子部品４の外縁４ｂ直近位置で上方に向かって盛り上がる形態で流動する（図３（ｄ）に示す矢印参照）。そしてバンプ４ａが接続用電極２ａに着地して搭載が完了した時点では、図４（ａ）に示すように電子部品４の外側に流動した補強樹脂３は、電子部品４の外縁４ｂの外側において、最上部３ｂが電子部品４の上面よりも上方に突出した形状の樹脂突出部３ａを形成する。
【００２３】
そして図４（ｂ）に示すように、搭載ツール７に内蔵された加熱手段によって、予め１２０℃〜２００℃の範囲で設定される加熱温度に加熱された状態の電子部品４から、補強樹脂３へ熱が伝わることによって補強樹脂３は熱硬化する。このとき、補強樹脂３としてチキソ比が２以上の流動性が低いものが用いられているため、樹脂突出部３ａは前述の突出形状をほぼ保った状態で硬化する（硬化工程）。
【００２４】
すなわち、図４（ｃ）に示すように、樹脂突出部３ａは流動による形崩れを生じることなく、最上部３ｂが電子部品４の上面よりも上方に突出した形状のまま硬化する。そして実装完了後の基板２のハンドリングや機器への組み付け作業時において、電子部品４の上面側を有効に保護する。なお、樹脂突出部３ａを完全硬化させて強度を保証するため、搭載ツール７による加熱の後に後加熱処理工程を設けることが望ましい。
【００２５】
なお、前述の例では樹脂突出部３ａの形状として電子部品４の上面側への樹脂の這い上がりが全く無い形状の例を示したが、図５に示すように、電子部品４の上面に多少の樹脂付着が生じた形状であっても、樹脂突出部３’ａの最上部３’ｂが電子部品４に外縁４ｂの外側に位置している限りにおいては、図１に示す樹脂突出部３ａと同様に、電子部品４の上面側を有効に保護することができる。
【００２６】
また上記実施の形態では、補強樹脂として熱硬化性樹脂を用いた例を示しているが、熱硬化性樹脂の替わりに熱可塑性樹脂を用いてもよい。この場合には、加熱によって溶融した補強樹脂が常温に冷却されて固化することにより硬化が行われる。この場合においても、補強樹脂としてチキソ比が２以上の熱可塑性樹脂を用いることにより、樹脂突出部の突出形状を保った状態で硬化させることができる。
【００２７】
【発明の効果】
本発明によれば、搭載工程において電子部品によって熱硬化性樹脂を電子部品の上面よりも上方に突出し、且つ最上部が電子部品の外側に位置する形状にはみ出させ、硬化工程において樹脂を略前記形状を保った状態で硬化させて樹脂突出部を形成するようにしたので、電子部品の上面側を有効に保護することができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態の電子部品実装構造の断面図
【図２】本発明の一実施の形態の電子部品実装構造の断面図
【図３】本発明の一実施の形態の電子部品実装方法の工程説明図
【図４】本発明の一実施の形態の電子部品実装方法の工程説明図
【図５】本発明の一実施の形態の電子部品実装構造の断面図
【符号の説明】
１ 電子部品実装構造
２ 基板
２ａ 接続用電極
３ 補強樹脂
３ａ 樹脂突出部
３ｂ 最上部
４ 電子部品
４ａ バンプ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting structure, an electronic component mounting method, and a resin in which the electronic component is mounted on a substrate and the gap between the electrode forming surface of the electronic component and the electrode forming surface of the substrate is sealed with resin. The present invention relates to a resin protrusion forming material used for forming the protrusion.
[0002]
[Prior art]
2. Description of the Related Art As an electronic component mounting structure in which an electronic component such as a semiconductor element is mounted on a substrate, a configuration in which a resin adhesive is interposed between the lower surface of the electronic component and the upper surface of the substrate is reinforced (for example, patent document) 1). In this patent document example, when mounting a semiconductor element on a substrate by ultrasonic bonding, a resin adhesive is applied in advance to the mounting position, and the semiconductor element is pressed from the resin adhesive to ultrasonically bond, The adhesive is cured to reinforce between the semiconductor element and the substrate. Thereby, the joint strength between the semiconductor element and the substrate is improved, and the mounting reliability can be improved.
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 3-24742 [0004]
[Problems to be solved by the invention]
By the way, when an operator handles a mounting board on which an electronic component such as a semiconductor element is mounted, the mounting board may be another solid material due to the force with which the operator grips the end of the mounting board or for some reason. The electronic component after mounting may be damaged by an impact or the like when it is hit. For this reason, it is desirable to protect the upper surface side of the electronic component by some method when handling the substrate after mounting the component.
[0005]
However, in the mounting structure shown in the above example, although the bonding strength between the electronic component and the substrate is improved, the upper surface side is not protected at all and may be damaged during handling. This breakage is particularly noticeable when a fragile thin electronic component is employed, and a method for effectively protecting the upper surface of the electronic component has been desired.
[0006]
Accordingly, the present invention provides an electronic component mounting structure and an electronic component mounting method capable of effectively protecting the upper surface of the electronic component in a mounted state, and a resin protruding portion used for forming a resin protruding portion in the electronic component mounting method. The purpose is to provide materials.
[0007]
[Means for Solving the Problems]
The electronic component mounting structure according to claim 1, wherein an electronic component having a plurality of electrodes is mounted on a substrate on which a plurality of connection electrodes are formed, and the electrodes are electrically connected to the connection electrodes. An electronic component mounting structure in which a gap between the electrode forming surface of the substrate and the electrode forming surface of the substrate is sealed with resin, and the resin protrudes above the upper surface of the electronic component outside the electronic component, and The resin protrusion part which the upper part hardened | cured in the shape located in the outer side rather than the outer edge of an electronic component was provided.
[0008]
The electronic component mounting structure according to claim 2 is the electronic component mounting structure according to claim 1, wherein the connection electrode or the electrode is a protruding electrode made of a conductive metal.
[0009]
4. The electronic component mounting method according to claim 3, wherein an electronic component having a plurality of electrodes is mounted on a substrate on which a plurality of connection electrodes are formed, and the electrodes are electrically connected to the connection electrodes. An electronic component mounting method for sealing a gap between the electrode forming surface of the substrate and the electrode forming surface of the substrate with a resin, the resin supplying step supplying a resin having a thixo ratio of 2 or more to the electronic component mounting position on the substrate A mounting step for mounting the electronic component on the substrate, and a curing step for curing the resin. In the mounting step, the electronic component projects the resin above the upper surface of the electronic component, and the uppermost portion is The resin projecting portion is formed by allowing the resin to flow in a shape located outside the outer edge of the electronic component and curing the resin while maintaining the shape in the curing step.
[0010]
The electronic component mounting method according to claim 4 is the electronic component mounting method according to claim 3, wherein the connection electrode or the electrode is a protruding electrode made of a conductive metal.
[0011]
The resin projecting portion forming material according to claim 5, wherein an electronic component having a plurality of electrodes is mounted on a substrate on which a plurality of connection electrodes are formed, and the electrodes are electrically connected to the connection electrodes. In an electronic component mounting structure in which a gap between the electrode forming surface of the electronic component and the electrode forming surface of the substrate is sealed with resin, the resin protruding outside the electronic component protrudes above the upper surface of the electronic component and is A resin protrusion forming material used for forming a resin protrusion cured in a shape in which the upper portion is positioned outside the outer edge of the electronic component, the resin main material and a curing material for curing the resin main material And a filler and a thixo material, and a thixo material is contained in 0.5-20 wt%.
[0012]
The material for forming a resin protrusion according to claim 6 is the material for forming a resin protrusion according to claim 5, wherein the thixo material is an inorganic powder.
[0013]
According to the present invention, in the mounting process, the resin protrudes upward from the top surface of the electronic component by the electronic component and protrudes into a shape in which the uppermost portion is located outside the electronic component, and the resin is substantially kept in the shape in the curing step. By curing in the state and forming the resin protrusion, the upper surface side of the electronic component can be effectively protected.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are cross-sectional views of an electronic component mounting structure according to an embodiment of the present invention, FIGS. 3 and 4 are process explanatory views of an electronic component mounting method according to an embodiment of the present invention, and FIG. It is sectional drawing of the electronic component mounting structure of one embodiment.
[0015]
First, the electronic component mounting structure 1 will be described with reference to FIG. The electronic component mounting structure 1 is obtained by mounting an electronic component 4 having a bump 4a, which is a protruding electrode made of a conductive metal, formed on a lower surface of a substrate 2 on which a connection electrode 2a is formed. In the electronic component mounting structure 1, the bump 4a is electrically connected to the connection electrode 2a, and the reinforcing resin 3 made of a thermosetting resin is provided between the electrode forming surface of the electronic component 4 and the electrode forming surface of the substrate 2. It is the structure sealed by. Although an example in which the bumps 4a are provided on the electronic component 4 is shown here, a configuration in which bumps are provided on the connection electrodes of the substrate 2 may be employed.
[0016]
In the electronic component mounting structure 1, the reinforcing resin 3 is hardened in a form that protrudes to the outside of the electronic component 4 to form a resin protrusion 3 a. As shown in the enlarged view of FIG. 1, the resin protrusion 3 a protrudes above the upper surface of the electronic component 4, and the uppermost portion 3 b is positioned outside the outer edge 4 b of the electronic component 4. The resin protrusion 3 a has a function of protecting the electronic component 4 after being mounted on the substrate 2.
[0017]
That is, as shown in FIG. 2A, even when the substrate 2 and the solid material 5 are hit against each other in the vertical direction, the resin protrusion 3a is located above the upper surface of the electronic component 4. Since it has a protruding shape, the external force from the solid material 5 is not directly transmitted to the electronic component 4 but is supported by the resin protruding portion 3a as shown in FIG. Thereby, when the board | substrate 2 and the fixed object 5 contact | abut, an external force and an impact do not act on the upper surface of the electronic component 4, and the electronic component 4 after mounting is protected effectively.
[0018]
Next, an electronic component mounting method for forming the electronic component mounting structure 1 will be described with reference to FIGS. 3A, a plurality of connection electrodes 2a are formed on the upper surface of the substrate 2. As shown in FIG. 3B, the reinforcing resin 3 is disposed at the electronic component mounting position of the substrate 2. As shown in FIG. It is supplied by coating using (resin supplying step). As a method for supplying the reinforcing resin 3, a method in which a resin film obtained by forming the reinforcing resin 3 into a film having a predetermined thickness is attached to the substrate 2 may be used.
[0019]
Here, as a material of the reinforcing resin 3, a thermosetting resin having a thixo ratio of 2 or more is used. The thixo ratio is a characteristic value representing the ease of flow of a viscous fluid. Using an E-type viscometer, the measured value obtained under the condition of 0.5 rpm was divided by the measured viscosity obtained under the condition of 5 rpm. It is defined by the ratio. The larger the thixo ratio is, the higher the viscosity is and the lower the fluidity is. The thixo ratio is adjusted to a desired value by appropriately setting the mixing ratio of the thixo material mixed in the reinforcing resin 3. can do. By using the reinforcing resin 3 having a thixo ratio of 2 or more (preferably 3 or more), the reinforcing resin 3 keeps its applied shape with almost no flow even in an uncured state.
[0020]
As such a thermosetting resin, for example, a resin main material such as an epoxy resin, a curing material for curing the resin main material, a filler containing resin or inorganic filler particles, and an inorganic material having an average particle size of about 1 μm. A thixo material made of the above powder is used in a range of 0.5 to 20 wt%. As the curing material, an amine-based, chaotic-based or imidazole-based curing material is used, and in the thermosetting process described later, the thermosetting reaction proceeds by being heated to a temperature set in the range of 120 ° C to 200 ° C. It is a composition of such a hardener.
[0021]
Thereafter, as shown in FIG. 3C, the electronic component 4 is held with the bump 4a facing downward by the mounting tool 7 and mounted on the substrate 2 supplied with the reinforcing resin 3 (mounting process). In this mounting process, the electronic component 4 descends and sinks from the upper surface of the reinforcing resin 3 to the inside, so that the reinforcing resin 3 on the upper surface of the substrate 2 is pushed by the lower surface of the electronic component 4 as shown in FIG. It is removed and protrudes outward from the periphery of the electronic component 4. The outer shape of the mounting tool 7 is set smaller than the outer shape of the electronic component 4.
[0022]
At this time, the reinforcing resin 3 contains a thixo material as described above and has a high viscosity. Therefore, since the wettability on the surface of the substrate 2 is low, the protruding reinforcing resin 3 is located outside along the surface of the substrate 2. Without flowing, it flows in a form that rises upward at a position closest to the outer edge 4b of the electronic component 4 (see the arrow shown in FIG. 3D). When the bumps 4a land on the connection electrodes 2a and the mounting is completed, the reinforcing resin 3 that has flowed to the outside of the electronic component 4 is outside the outer edge 4b of the electronic component 4 as shown in FIG. The uppermost part 3b forms a resin protruding part 3a having a shape protruding upward from the upper surface of the electronic component 4.
[0023]
Then, as shown in FIG. 4B, the reinforcing resin 3 from the electronic component 4 in a state heated to a heating temperature set in a range of 120 ° C. to 200 ° C. in advance by the heating means built in the mounting tool 7. When the heat is transmitted to the reinforcing resin 3, the reinforcing resin 3 is thermoset. At this time, since the reinforcing resin 3 having a low thixotropy ratio of 2 or less is used, the resin protruding portion 3a is cured in a state where the aforementioned protruding shape is substantially maintained (curing step).
[0024]
That is, as shown in FIG. 4C, the resin protruding portion 3 a is cured with the shape in which the uppermost portion 3 b protrudes above the upper surface of the electronic component 4 without causing deformation due to flow. Then, the upper surface side of the electronic component 4 is effectively protected during the handling of the substrate 2 after completion of the mounting and the assembling work to the equipment. In addition, it is desirable to provide a post-heat treatment process after heating with the mounting tool 7 in order to completely cure the resin protrusion 3a and ensure the strength.
[0025]
In the above-described example, the resin protruding portion 3a has a shape in which the resin does not creep up to the upper surface side of the electronic component 4. However, as shown in FIG. 1 as long as the uppermost portion 3′b of the resin protrusion 3′a is positioned outside the outer edge 4b of the electronic component 4, even if the resin adheres to the shape of the resin protrusion 3a. Similarly, the upper surface side of the electronic component 4 can be effectively protected.
[0026]
In the above embodiment, an example in which a thermosetting resin is used as the reinforcing resin is shown, but a thermoplastic resin may be used instead of the thermosetting resin. In this case, the hardening is performed by cooling and solidifying the reinforcing resin melted by heating. Even in this case, by using a thermoplastic resin having a thixo ratio of 2 or more as the reinforcing resin, it can be cured while maintaining the protruding shape of the resin protruding portion.
[0027]
【The invention's effect】
According to the present invention, the thermosetting resin protrudes upward from the upper surface of the electronic component by the electronic component in the mounting step and protrudes into a shape where the uppermost portion is located outside the electronic component, and the resin is substantially Since the resin protrusion is formed by curing in a state in which the shape is maintained, the upper surface side of the electronic component can be effectively protected.
[Brief description of the drawings]
1 is a cross-sectional view of an electronic component mounting structure according to an embodiment of the present invention; FIG. 2 is a cross-sectional view of an electronic component mounting structure according to an embodiment of the present invention; FIG. 4 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention. FIG. 5 is a cross-sectional view of an electronic component mounting structure according to an embodiment of the present invention. Explanation】
DESCRIPTION OF SYMBOLS 1 Electronic component mounting structure 2 Board | substrate 2a Connection electrode 3 Reinforcement resin 3a Resin protrusion part 3b Top part 4 Electronic component 4a Bump

Claims (6)

接続用電極が複数形成された基板に電極が複数形成された電子部品を実装して前記電極を前記接続用電極に電気的に接続し、前記電子部品の電極形成面と前記基板の電極形成面との間を樹脂によって封止した電子部品実装構造であって、前記電子部品の外側において前記樹脂が前記電子部品の上面よりも上方に突出し、且つ最上部が電子部品の外縁よりも外側に位置する形状で硬化して形成された樹脂突出部を備えたことを特徴とする電子部品実装構造。An electronic component having a plurality of electrodes is mounted on a substrate on which a plurality of connection electrodes are formed, and the electrodes are electrically connected to the connection electrodes. An electrode formation surface of the electronic component and an electrode formation surface of the substrate The electronic component mounting structure is sealed with resin, and the resin protrudes above the upper surface of the electronic component on the outside of the electronic component, and the uppermost portion is positioned outside the outer edge of the electronic component. An electronic component mounting structure comprising a resin protrusion formed by curing in a shape to be cured. 前記接続用電極または前記電極が導電性金属より成る突出電極であることを特徴とする請求項１記載の電子部品実装構造。2. The electronic component mounting structure according to claim 1, wherein the connection electrode or the electrode is a protruding electrode made of a conductive metal. 接続用電極が複数形成された基板に電極が複数形成された電子部品を実装して前記電極を前記接続用電極に電気的に接続し、前記電子部品の電極形成面と前記基板の電極形成面との間を樹脂によって封止する電子部品実装方法であって、前記基板上の電子部品実装位置にチキソ比が２以上の樹脂を供給する樹脂供給工程と、前記電子部品を前記基板に搭載する搭載工程と、前記樹脂を硬化させる硬化工程とを含み、前記搭載工程において前記電子部品によって樹脂を前記電子部品の上面よりも上方に突出し且つ最上部が電子部品の外縁よりも外側に位置する形状に流動させ、前記硬化工程において樹脂を略前記形状を保った状態で硬化させて樹脂突出部を形成することを特徴とする電子部品実装方法。An electronic component having a plurality of electrodes is mounted on a substrate on which a plurality of connection electrodes are formed, and the electrodes are electrically connected to the connection electrodes. An electrode formation surface of the electronic component and an electrode formation surface of the substrate Electronic component mounting method in which a resin is sealed between the resin and a resin supply step of supplying a resin having a thixo ratio of 2 or more to the electronic component mounting position on the substrate, and the electronic component is mounted on the substrate A shape including a mounting step and a curing step for curing the resin, wherein the resin protrudes above the upper surface of the electronic component by the electronic component in the mounting step and the uppermost portion is positioned outside the outer edge of the electronic component. And a resin protrusion is formed by curing the resin while maintaining the shape substantially in the curing step. 前記接続用電極または前記電極が導電性金属より成る突出電極であることを特徴とする請求項３記載の電子部品実装方法。4. The electronic component mounting method according to claim 3, wherein the connection electrode or the electrode is a protruding electrode made of a conductive metal. 接続用電極が複数形成された基板に電極が複数形成された電子部品を実装して前記電極を前記接続用電極に電気的に接続し、前記電子部品の電極形成面と前記基板の電極形成面との間を樹脂によって封止した電子部品実装構造において、前記電子部品の外側にはみ出した樹脂が前記電子部品の上面よりも上方に突出し且つ最上部が電子部品の外縁よりも外側に位置する形状で硬化した樹脂突出部を形成するために用いられる樹脂突出部形成用材料であって、樹脂主材と、前記樹脂主材を硬化させる硬化材と、充填材と、チキソ材とを含み、チキソ材を０．５〜２０ｗｔ％の範囲で含有することを特徴とする樹脂突出部形成用材料。An electronic component having a plurality of electrodes is mounted on a substrate on which a plurality of connection electrodes are formed, and the electrodes are electrically connected to the connection electrodes. An electrode formation surface of the electronic component and an electrode formation surface of the substrate In the electronic component mounting structure in which the space between the two and the electronic component is sealed, the shape of the resin protruding outside the electronic component protrudes above the upper surface of the electronic component and the uppermost portion is positioned outside the outer edge of the electronic component A resin protrusion forming material used for forming a resin protrusion cured with a resin, comprising: a resin main material; a curing material for curing the resin main material; a filler; and a thixo material. A material for forming a resin protrusion, comprising a material in a range of 0.5 to 20 wt%. 前記チキソ材が無機の粉体であることを特徴とする請求項５記載の樹脂突出部形成用材料。6. The resin protrusion forming material according to claim 5, wherein the thixo material is an inorganic powder.
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Publication number Priority date Publication date Assignee Title
JP2010283085A (en) * 2009-06-03 2010-12-16 Toshiba Corp Electronic apparatus
WO2012121336A1 (en) * 2011-03-09 2012-09-13 積水化学工業株式会社 Adhesive for electronic components, and manufacturing method for semiconductor chip mount
JP2013539226A (en) * 2010-09-27 2013-10-17 ザイリンクス インコーポレイテッド Corner structure for IC die
US9331047B2 (en) 2009-04-24 2016-05-03 Panasonic Intellectual Property Management Co., Ltd. Mounting method and mounting structure for semiconductor package component

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9331047B2 (en) 2009-04-24 2016-05-03 Panasonic Intellectual Property Management Co., Ltd. Mounting method and mounting structure for semiconductor package component
JP2010283085A (en) * 2009-06-03 2010-12-16 Toshiba Corp Electronic apparatus
JP4676012B2 (en) * 2009-06-03 2011-04-27 株式会社東芝 Electronics
US8072759B2 (en) 2009-06-03 2011-12-06 Kabushiki Kaisha Toshiba Electronic device
JP2013539226A (en) * 2010-09-27 2013-10-17 ザイリンクス インコーポレイテッド Corner structure for IC die
WO2012121336A1 (en) * 2011-03-09 2012-09-13 積水化学工業株式会社 Adhesive for electronic components, and manufacturing method for semiconductor chip mount
JP5176000B1 (en) * 2011-03-09 2013-04-03 積水化学工業株式会社 Adhesive for electronic parts and method for manufacturing semiconductor chip package
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US9011629B2 (en) 2011-03-09 2015-04-21 Sekisui Chemical Co., Ltd. Adhesive for electronic components, and manufacturing method for semiconductor chip mount

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