JP2005026375A - Circuit board with shield, and acceleration sensor using the same - Google Patents

Circuit board with shield, and acceleration sensor using the same Download PDF

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Publication number
JP2005026375A
JP2005026375A JP2003188785A JP2003188785A JP2005026375A JP 2005026375 A JP2005026375 A JP 2005026375A JP 2003188785 A JP2003188785 A JP 2003188785A JP 2003188785 A JP2003188785 A JP 2003188785A JP 2005026375 A JP2005026375 A JP 2005026375A
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JP
Japan
Prior art keywords
circuit board
shield case
ground layer
acceleration sensor
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003188785A
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Japanese (ja)
Inventor
Junji Matsuzaki
淳司 松崎
Yasuaki Watabe
康明 渡部
Naohiro Taniguchi
直博 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2003188785A priority Critical patent/JP2005026375A/en
Publication of JP2005026375A publication Critical patent/JP2005026375A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board with a shield which has such a structure that can be manufactured by an easier process and is smaller in size than the conventional one, and to provide an acceleration sensor using the same. <P>SOLUTION: The circuit board with a shield comprises a circuit board 1 on which electronic components are mounted, a shield case 2 which is so installed as to cover part of the circuit board 1 and the electronic component, and a ground layer 1a which is formed over the entire surface of at least part of the circuit board 1 covered by the shield case 2. The shield case 2 and the ground layer 1a are electrically connected to each other. Due to this structure, a space surrounded by the ground layer 1a and the shield case 2 is electromagnetically shielded and is not influenced by noise generated outside. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、電子部品を収納するシールドケースを備えたシールド付回路基板およびそれを用いた加速度センサに関するものである。
【0002】
【従来の技術】
一般に、加速度センサは、加速度を検出するセンサチップ(加速度センサチップ)と、センサチップの出力信号を増幅するセンサ出力増幅回路を含む周辺回路とが1枚の回路基板に実装される。センサチップの出力信号は、外部回路が入出力する信号に比べて微小であって外部で発生するノイズの影響を受け易いので、センサチップおよび周辺回路が実装された回路基板は、シールドを兼ねた金属製のキャン内に収納される(例えば特許文献1参照)。
【0003】
キャン2’は、図3に示すように、回路基板1と外部回路(図示せず)とを接続するリード5が挿通保持される板状のベース2a’と、下面開口の箱状に形成されベース2a’との間に回路基板1を収納する空間を有するキャップ2b’とを組み合わせて構成される。ベース2a’とキャップ2b’とは、ベース2a’の周縁部2c’とキャップ2b’の開口部2d’とが気密的に溶接(ハーメチックシール)されることによりキャン2’を構成する。なお、キャン2’内には、ベース2a’上に回路基板1を保持するホルダ6を備えている。
【0004】
【特許文献1】
特開2001−208767号公報(第3頁、図1)
【0005】
【発明が解決しようとする課題】
しかし、上述した構成のキャン2’では、組み立てる際にベース2a’とキャップ2b’とを気密的に溶接する作業が必要であるので、製造工程が比較的複雑であった。さらに、キャン2’は、内部に回路基板1を収納できる大きさに形成されるので、サイズが回路基板1より大きかった。
【0006】
本発明は、上記事由に鑑みて為されたものであって、必要部位のシールドを行うのは勿論のこと、従来構成に比べて製造工程が容易で且つサイズの小さいシールド付回路基板およびそれを用いた加速度センサを提供することを目的とする。
【0007】
【課題を解決するための手段】
請求項1の発明は、電子部品を実装する回路基板と、回路基板とともに電子部品を囲む形で回路基板の少なくとも一部に覆着されるシールドケースと、回路基板において少なくともシールドケースが覆着される部位に全面にわたって形成される接地層とを備え、シールドケースと接地層とが電気的に接続されていることを特徴とする。
【0008】
この発明によれば、接地層とシールドケースとに囲まれる空間が、従来構成と同様に電磁シールドされるのは勿論のこと、シールドケースが回路基板に設けた接地層に接続されるので、気密的に溶接する作業が不要であり製造工程が従来構成より簡単になる。さらに、シールドケースは、回路基板上に配置されるのでサイズを比較的自由に設計でき、従来構成より小型化できる。
【0009】
また、請求項2の発明は、請求項1記載のシールド付回路基板を用いた加速度センサであって、前記電子部品が加速度センサチップを含むことを特徴とする。
【0010】
この発明によれば、加速度センサは、従来構成に比べて製造工程が簡単になり且つ小型化できる。
【0011】
また、請求項3の発明は、請求項2の発明において、電源入力および出力端に前記シールドケースと前記接地層とに囲まれた部位へのノイズの侵入を防止するノイズ対策部品としての貫通コンデンサが付加され、ノイズ対策部品が、前記回路基板におけるシールドケースと接地層とに囲まれた部位と異なる部位に実装されることを特徴とする。
【0012】
この発明によれば、外部回路の発生するノイズは、シールドケースと接地層とに囲まれた部位の外で遮断されるので、シールドケースと接地層とに囲まれた部位には影響しない。
【0013】
【発明の実施の形態】
以下、本発明の実施形態を図面を参照して説明する。
【0014】
本実施形態のシールド付回路基板は、図1に示すように、内層に接地層1aを有する多層回路基板からなる回路基板1と、回路基板1との間に回路基板1に実装された電子部品を収納する空間を有する金属製のシールドケース2とで構成される。シールドケース2は、接続端子2aが複数個(図では4個)設けられており、各接続端子2aが回路基板1において接地層1aと接続されたスルーホール1bに夫々挿通接続されることによって、接地層1aと電気的に導通している。この構成によって、接地層1aとシールドケース2とに囲まれた部位の外部で発生するノイズは、接地層1aおよびシールドケース2によって遮断され接地層1aとシールドケース2とに囲まれた部位には影響しない。
【0015】
本実施形態では、上述したシールド付回路基板を、以下に説明するように、加速度を検出するセンサチップ(加速度センサチップ)を備えた加速度センサに用いる。加速度センサにおいて、センサチップ3が出力する信号は、外部回路(図示せず)が入出力する信号に比べて微小であって外部で発生するノイズの影響を受け易いので、図1に示すように、センサチップ3は、回路基板1における接地層1aとシールドケース2とに囲まれる部位に実装される。センサチップ3と外部回路との間に挿入される周辺回路4も、センサチップ3と同様に接地層1aとシールドケース2とに囲まれる部位に実装される。なお、周辺回路4は、図2に示すように、センサチップ3の出力信号を増幅するセンサ出力増幅回路4aと、センサチップ3の特性による出力信号のばらつきを抑制するセンサ出力調整回路4bと、加速度センサを外部回路に逆接続したり加速度センサに外部回路から過電圧が印加されたりする際に加速度センサを保護するセンサ保護回路4cとを備える。
【0016】
ところで、周辺回路4を外部回路に接続する場合には、図1に示すように、接地層1aとシールドケース2とに囲まれる部位を避けて回路基板1に設けられる接続孔1cに一端部が挿通接続されるリード(図示せず)を用いる。リードの他端部を外部回路に接続することによって、接続孔1cが外部回路に接続される。さらに、接続孔1cと周辺回路4との間には周辺回路4へのノイズの侵入を防止するノイズ保護回路が挿入される。本実施形態では、接続孔1cは、接地用と、外部回路から電源供給される電源入力用と、外部回路に信号を出力する出力用とに3個設けられており、各接続孔1cと周辺回路4との間にノイズ対策部品としての貫通コンデンサC1が夫々挿入されノイズ保護回路を構成する。この貫通コンデンサC1は、接地層1aとシールドケース2とに囲まれる部位を避けて回路基板1に実装されるので、外部回路からリードを介して周辺回路4に供給される信号におけるノイズは、回路基板1における接地層1aとシールドケース2とに囲まれる部位には影響しない。なお、図2における破線Aは、接地層1aとシールドケース2とに囲まれた部位とその他の部位との境界を示す。
【0017】
【発明の効果】
以上説明したように、本発明では、接地層とシールドケースとに囲まれる空間が、従来構成と同様に電磁シールドされるのは勿論のこと、シールドケースが回路基板に設けた接地層に接続されるので、気密的に溶接する作業が不要であり製造工程が従来構成より簡単になる。さらに、シールドケースは、回路基板上に配置されるのでサイズを比較的自由に設定でき、従来構成より小型化できる。
【図面の簡単な説明】
【図1】本発明の実施形態を示し、(a)は上面図、(b)は側面図である。
【図2】同上の加速度センサを示すブロック図である。
【図3】従来例を示し、(a)は上面図、(b)は側面図、(c)は正面断面図である。
【符号の説明】
1 回路基板
1a 接地層
2 シールドケース
3 (加速度)センサチップ
C1 貫通コンデンサ
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a shielded circuit board having a shield case for storing electronic components and an acceleration sensor using the same.
[0002]
[Prior art]
In general, in an acceleration sensor, a sensor chip (acceleration sensor chip) for detecting acceleration and a peripheral circuit including a sensor output amplification circuit for amplifying an output signal of the sensor chip are mounted on a single circuit board. The output signal of the sensor chip is very small compared to the signal input and output by the external circuit, and is easily affected by noise generated outside. Therefore, the circuit board on which the sensor chip and the peripheral circuit are mounted also serves as a shield. It is stored in a metal can (see, for example, Patent Document 1).
[0003]
As shown in FIG. 3, the can 2 ′ is formed in a plate-like base 2 a ′ through which leads 5 for connecting the circuit board 1 and an external circuit (not shown) are inserted and held, and a box-like opening on the lower surface. A cap 2b ′ having a space for housing the circuit board 1 between the base 2a ′ and a base 2a ′ is combined. The base 2a 'and the cap 2b' constitute a can 2 'by hermetically welding (hermetic sealing) the peripheral edge 2c' of the base 2a 'and the opening 2d' of the cap 2b '. In the can 2 ′, a holder 6 for holding the circuit board 1 is provided on the base 2a ′.
[0004]
[Patent Document 1]
JP 2001-208767 A (page 3, FIG. 1)
[0005]
[Problems to be solved by the invention]
However, in the can 2 ′ having the above-described configuration, since the base 2a ′ and the cap 2b ′ need to be hermetically welded when assembled, the manufacturing process is relatively complicated. Further, since the can 2 ′ is formed in a size that can accommodate the circuit board 1 therein, the size of the can 2 ′ is larger than that of the circuit board 1.
[0006]
The present invention has been made in view of the above-mentioned reasons, and of course, a shielded circuit board having a simpler manufacturing process and a smaller size compared to the conventional configuration, as well as shielding a necessary part, and a An object of the present invention is to provide an acceleration sensor used.
[0007]
[Means for Solving the Problems]
According to the first aspect of the present invention, a circuit board on which an electronic component is mounted, a shield case that covers the electronic component together with the circuit board, and is covered with at least a part of the circuit board, and at least the shield case is covered with the circuit board. And a grounding layer formed over the entire surface, and the shield case and the grounding layer are electrically connected.
[0008]
According to the present invention, since the space surrounded by the ground layer and the shield case is electromagnetically shielded as in the conventional configuration, the shield case is connected to the ground layer provided on the circuit board. Therefore, it is not necessary to perform the welding operation and the manufacturing process becomes simpler than the conventional configuration. Further, since the shield case is arranged on the circuit board, the size can be designed relatively freely, and the size can be reduced as compared with the conventional configuration.
[0009]
According to a second aspect of the present invention, there is provided an acceleration sensor using the shielded circuit board according to the first aspect, wherein the electronic component includes an acceleration sensor chip.
[0010]
According to the present invention, the acceleration sensor has a simpler manufacturing process and can be downsized as compared with the conventional configuration.
[0011]
According to a third aspect of the present invention, there is provided a feedthrough capacitor as a noise countermeasure component for preventing intrusion of noise into a portion surrounded by the shield case and the ground layer at the power input and output ends in the second aspect of the invention. Is added, and the noise countermeasure component is mounted in a portion different from the portion surrounded by the shield case and the ground layer in the circuit board.
[0012]
According to the present invention, the noise generated by the external circuit is blocked outside the portion surrounded by the shield case and the ground layer, and therefore does not affect the portion surrounded by the shield case and the ground layer.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0014]
As shown in FIG. 1, the shielded circuit board according to the present embodiment is an electronic component mounted on the circuit board 1 between the circuit board 1 and the circuit board 1, which is a multilayer circuit board having a ground layer 1 a as an inner layer. And a shield case 2 made of metal having a space for storing the battery. The shield case 2 is provided with a plurality of connection terminals 2a (four in the figure), and each connection terminal 2a is inserted and connected to a through hole 1b connected to the ground layer 1a in the circuit board 1, respectively. It is electrically connected to the ground layer 1a. With this configuration, noise generated outside the portion surrounded by the ground layer 1a and the shield case 2 is blocked by the ground layer 1a and the shield case 2 and is surrounded by the ground layer 1a and the shield case 2. It does not affect.
[0015]
In the present embodiment, the above-described shielded circuit board is used for an acceleration sensor including a sensor chip (acceleration sensor chip) for detecting acceleration, as will be described below. In the acceleration sensor, the signal output from the sensor chip 3 is smaller than a signal input / output by an external circuit (not shown) and is easily affected by noise generated outside, as shown in FIG. The sensor chip 3 is mounted on a portion of the circuit board 1 surrounded by the ground layer 1 a and the shield case 2. The peripheral circuit 4 inserted between the sensor chip 3 and the external circuit is also mounted on a portion surrounded by the ground layer 1 a and the shield case 2 in the same manner as the sensor chip 3. As shown in FIG. 2, the peripheral circuit 4 includes a sensor output amplifier circuit 4a that amplifies the output signal of the sensor chip 3, a sensor output adjustment circuit 4b that suppresses variations in the output signal due to the characteristics of the sensor chip 3, and And a sensor protection circuit 4c for protecting the acceleration sensor when the acceleration sensor is reversely connected to the external circuit or when an overvoltage is applied to the acceleration sensor from the external circuit.
[0016]
By the way, when the peripheral circuit 4 is connected to an external circuit, as shown in FIG. 1, one end portion is provided in the connection hole 1c provided in the circuit board 1 while avoiding a portion surrounded by the ground layer 1a and the shield case 2. A lead (not shown) to be inserted and connected is used. By connecting the other end of the lead to an external circuit, the connection hole 1c is connected to the external circuit. Further, a noise protection circuit for preventing noise from entering the peripheral circuit 4 is inserted between the connection hole 1 c and the peripheral circuit 4. In this embodiment, three connection holes 1c are provided for grounding, for power input supplied from an external circuit, and for output for outputting a signal to the external circuit. A feedthrough capacitor C1 as a noise countermeasure component is inserted between the circuit 4 and the noise protection circuit. Since the feedthrough capacitor C1 is mounted on the circuit board 1 while avoiding the portion surrounded by the ground layer 1a and the shield case 2, the noise in the signal supplied from the external circuit to the peripheral circuit 4 via the leads The portion of the substrate 1 surrounded by the ground layer 1a and the shield case 2 is not affected. A broken line A in FIG. 2 indicates a boundary between a portion surrounded by the ground layer 1a and the shield case 2 and other portions.
[0017]
【The invention's effect】
As described above, in the present invention, the space surrounded by the ground layer and the shield case is electromagnetically shielded as in the conventional configuration, and the shield case is connected to the ground layer provided on the circuit board. Therefore, the work of airtight welding is not required, and the manufacturing process becomes simpler than the conventional configuration. Further, since the shield case is disposed on the circuit board, the size can be set relatively freely, and the size can be reduced as compared with the conventional configuration.
[Brief description of the drawings]
FIG. 1 shows an embodiment of the present invention, wherein (a) is a top view and (b) is a side view.
FIG. 2 is a block diagram showing an acceleration sensor same as above.
3A and 3B show a conventional example, in which FIG. 3A is a top view, FIG. 3B is a side view, and FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Circuit board 1a Grounding layer 2 Shield case 3 (Acceleration) sensor chip C1 Feed-through capacitor

Claims (3)

電子部品を実装する回路基板と、回路基板とともに電子部品を囲む形で回路基板の少なくとも一部に覆着されるシールドケースと、回路基板において少なくともシールドケースが覆着される部位に全面にわたって形成される接地層とを備え、シールドケースと接地層とが電気的に接続されていることを特徴とするシールド付回路基板。A circuit board on which electronic components are mounted, a shield case that covers the electronic components together with the circuit board, and is covered over at least a part of the circuit board, and at least a portion of the circuit board that covers the shield case. A shielded circuit board, wherein the shield case and the ground layer are electrically connected. 請求項1記載のシールド付回路基板を用い、前記電子部品が加速度センサチップを含むことを特徴とするシールド付回路基板を用いた加速度センサ。An acceleration sensor using a shielded circuit board, comprising the shielded circuit board according to claim 1, wherein the electronic component includes an acceleration sensor chip. 電源入力および出力端に前記シールドケースと前記接地層とに囲まれた部位へのノイズの侵入を防止するノイズ対策部品が付加され、ノイズ対策部品は、前記回路基板におけるシールドケースと接地層とに囲まれた部位と異なる部位に実装されることを特徴とする請求項2記載のシールド付回路基板を用いた加速度センサ。Noise countermeasure parts for preventing intrusion of noise into a portion surrounded by the shield case and the ground layer are added to the power input and output terminals, and the noise countermeasure parts are connected to the shield case and the ground layer in the circuit board. The acceleration sensor using the shielded circuit board according to claim 2, wherein the acceleration sensor is mounted on a part different from the enclosed part.
JP2003188785A 2003-06-30 2003-06-30 Circuit board with shield, and acceleration sensor using the same Pending JP2005026375A (en)

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JP2003188785A JP2005026375A (en) 2003-06-30 2003-06-30 Circuit board with shield, and acceleration sensor using the same

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Publication Number Publication Date
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112212918A (en) * 2020-10-04 2021-01-12 张红宾 Sensor with good anti-interference signal effect

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112212918A (en) * 2020-10-04 2021-01-12 张红宾 Sensor with good anti-interference signal effect

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