JP2005022915A5 - - Google Patents
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- JP2005022915A5 JP2005022915A5 JP2003189578A JP2003189578A JP2005022915A5 JP 2005022915 A5 JP2005022915 A5 JP 2005022915A5 JP 2003189578 A JP2003189578 A JP 2003189578A JP 2003189578 A JP2003189578 A JP 2003189578A JP 2005022915 A5 JP2005022915 A5 JP 2005022915A5
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- spherical silica
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【特許請求の範囲】
【請求項１】 平均粒径0.1〜20μm、比表面積が30m2/g以下の球状シリカを式（Ｉ）のフェニルシラン化合物で表面処理することを特徴とする表面改質球状シリカ。
Ｓｉ（Ｐｈ）n（ＯＲ1）4-n ・・・・・（Ｉ）
（ただし、ｎは１〜３の整数、Ｐｈはアルキル基の置換基を有しても良いフェニル基、Ｒ1は炭素数１〜５のアルキル基または炭素数１〜４のアシル基）
【請求項２】 表面処理前の球状シリカの比表面積が理論値の３倍以下である請求項１記載の表面改質球状シリカ。
【請求項３】 式（Ｉ）のフェニルシラン化合物処理量が球状シリカの0.01〜10質量％である請求項１記載の表面改質球状シリカ。
【請求項４】 以下の工程を含む表面改質球状シリカの製造方法。
（１）アルカリ珪酸塩水溶液を分散相として細粒状に分散させた油中水滴型（Ｗ／Ｏ型）エマルションを調製する乳化工程
（２）油中水滴型（Ｗ／Ｏ型）エマルションを鉱酸水溶液と混合し、球状シリカゲルを凝固させる凝固工程
（３）球状シリカゲルを１０００〜１５００℃で焼成する焼成工程
（４）焼成した球状シリカを式（Ｉ）記載のフェニルシラン化合物で処理する表面処理工程
Ｓｉ（Ｐｈ）n（ＯＲ1）4-n ・・・・・（Ｉ）
（ただし、ｎは１〜３の整数、Ｐｈはアルキル基の置換基を有しても良いフェニル基、Ｒ1は炭素数１〜５のアルキル基または炭素数１〜４のアシル基）
【請求項５】 エポキシ樹脂および／またはシリコーン樹脂に、請求項１〜３いずれかに記載の表面改質球状シリカを３０〜９０質量％配合することを特徴とする封止用樹脂組成物。
【請求項６】 以下の成分を含むことを特徴とする封止用樹脂組成物。
（ａ）エポキシ樹脂および／またはシリコーン樹脂
（ｂ）式（Ｉ）記載のフェニルシラン化合物
Ｓｉ（Ｐｈ）n（ＯＲ1）4-n ・・・・・（Ｉ）
（ただし、ｎは１〜３の整数、Ｐｈはアルキル基の置換基を有しても良いフェニル基、Ｒ1は炭素数１〜５のアルキル基または炭素数１〜４のアシル基）
（ｃ）平均粒径0.1〜20μm、比表面積が30m2/g以下の球状シリカ
[Claims]
1. A surface-modified spherical silica, characterized in that a spherical silica having an average particle size of 0.1 to 20 μm and a specific surface area of 30 m 2 / g or less is surface-treated with a phenylsilane compound of formula (I).
Si (Ph) n (OR 1 ) 4-n (I)
(Where n is an integer of 1 to 3, Ph is an optionally substituted phenyl group, R 1 is an alkyl group having 1 to 5 carbon atoms or an acyl group having 1 to 4 carbon atoms)
2. The surface-modified spherical silica according to claim 1, wherein the specific surface area of the spherical silica before the surface treatment is not more than 3 times the theoretical value.
3. The surface-modified spherical silica according to claim 1, wherein the treatment amount of the phenylsilane compound of the formula (I) is 0.01 to 10% by mass of the spherical silica.
4. A process for producing a surface-modified spherical silica comprising the following steps.
(1) An emulsification step for preparing a water-in-oil type (W / O type) emulsion in which an aqueous alkali silicate solution is dispersed in the form of fine particles as a dispersed phase. Solidification step for solidifying spherical silica gel by mixing with aqueous solution (3) Firing step for firing spherical silica gel at 1000 to 1500 ° C. (4) Surface treatment step for treating the fired spherical silica with the phenylsilane compound described in formula (I) Si (Ph) n (OR 1 ) 4-n (I)
(Where n is an integer of 1 to 3, Ph is an optionally substituted phenyl group, R 1 is an alkyl group having 1 to 5 carbon atoms or an acyl group having 1 to 4 carbon atoms)
5. A sealing resin composition comprising 30 to 90% by mass of the surface-modified spherical silica according to claim 1 in an epoxy resin and / or a silicone resin.
6. A sealing resin composition comprising the following components:
(A) Epoxy resin and / or silicone resin (b) Phenylsilane compound Si (Ph) n (OR 1 ) 4-n (I) described in formula (I)
(Where n is an integer of 1 to 3, Ph is an optionally substituted phenyl group, R 1 is an alkyl group having 1 to 5 carbon atoms or an acyl group having 1 to 4 carbon atoms)
(C) Spherical silica having an average particle size of 0.1 to 20 μm and a specific surface area of 30 m 2 / g or less
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003189578A JP4428618B2 (en) | 2003-07-01 | 2003-07-01 | Surface-modified spherical silica, method for producing the same, and sealing resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003189578A JP4428618B2 (en) | 2003-07-01 | 2003-07-01 | Surface-modified spherical silica, method for producing the same, and sealing resin composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005022915A JP2005022915A (en) | 2005-01-27 |
| JP2005022915A5 true JP2005022915A5 (en) | 2006-08-10 |
| JP4428618B2 JP4428618B2 (en) | 2010-03-10 |
Family
ID=34187746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003189578A Expired - Fee Related JP4428618B2 (en) | 2003-07-01 | 2003-07-01 | Surface-modified spherical silica, method for producing the same, and sealing resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4428618B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005162846A (en) * | 2003-12-02 | 2005-06-23 | Nitto Denko Corp | Resin composition for sealing semiconductor and semiconductor device using the same |
| JP2008258429A (en) * | 2007-04-05 | 2008-10-23 | Sekisui Chem Co Ltd | Insulating film, method of manufacturing electronic component apparatus, and electronic component apparatus |
| CN102137758B (en) * | 2008-09-01 | 2014-08-06 | 积水化学工业株式会社 | Laminate and method for producing laminate |
| JP5616899B2 (en) * | 2009-10-20 | 2014-10-29 | 株式会社日本触媒 | Amorphous silica and method for producing the same |
| KR101208025B1 (en) | 2010-07-09 | 2012-12-04 | 주식회사 씰테크 | Surface functionalized silica nanofillers, plasma-resistant fluoroelastomer composition contaning the same, molded article and sealing material for semiconductor manufacturing apparatus using the same |
| KR101574085B1 (en) | 2012-11-22 | 2015-12-03 | 제일모직 주식회사 | Encapsulation material and electronic device including the same |
| JP7070646B2 (en) * | 2020-12-03 | 2022-05-18 | 堺化学工業株式会社 | Silica particle dispersion and surface-treated silica particles |
| CN112931934B (en) * | 2021-03-24 | 2022-06-21 | 湖北中烟工业有限责任公司 | Fragrance-holding and cooling additive and preparation method and application thereof |
| WO2023008290A1 (en) * | 2021-07-28 | 2023-02-02 | Ａｇｃ株式会社 | Spherical silica powder and method for producing spherical silica powder |
| CN116120777A (en) * | 2023-01-03 | 2023-05-16 | 山东科翰硅源新材料有限公司 | Preparation method of modified silica sol for water-based ink |
-
2003
- 2003-07-01 JP JP2003189578A patent/JP4428618B2/en not_active Expired - Fee Related
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