KR101574085B1 - Encapsulation material and electronic device including the same - Google Patents

Encapsulation material and electronic device including the same Download PDF

Info

Publication number
KR101574085B1
KR101574085B1 KR1020120133067A KR20120133067A KR101574085B1 KR 101574085 B1 KR101574085 B1 KR 101574085B1 KR 1020120133067 A KR1020120133067 A KR 1020120133067A KR 20120133067 A KR20120133067 A KR 20120133067A KR 101574085 B1 KR101574085 B1 KR 101574085B1
Authority
KR
South Korea
Prior art keywords
group
unsubstituted
substituted
polysiloxane
formula
Prior art date
Application number
KR1020120133067A
Other languages
Korean (ko)
Other versions
KR20140065952A (en
Inventor
우창수
고상란
김우한
김하늘
안치원
이은선
Original Assignee
제일모직 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제일모직 주식회사 filed Critical 제일모직 주식회사
Priority to KR1020120133067A priority Critical patent/KR101574085B1/en
Publication of KR20140065952A publication Critical patent/KR20140065952A/en
Application granted granted Critical
Publication of KR101574085B1 publication Critical patent/KR101574085B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(Si-H) having a silicon-bonded end at the terminal, and a silicon-bonded alkenyl group (Si-Vi) at the end of the first polysiloxane, An encapsulant comprising the second polysiloxane, and an encapsulant.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic device including an encapsulation material and an encapsulation material,

An encapsulant and the encapsulant.

BACKGROUND ART Light emitting devices such as light emitting diodes (LEDs), organic light emitting diode devices (OLED devices), and photoluminescence devices (PL devices) And various automation devices.

These light emitting devices can display an intrinsic color of a light emitting material such as blue, red, and green in a light emitting portion, and can display a white color by combining light emitting portions that display different colors.

Such a light emitting device generally includes an encapsulant of a packaging or encapsulated structure.

The sealing portion may be made of an encapsulant including a light transmitting resin through which light emitted from the light emitting portion can pass to the outside.

One embodiment provides an encapsulant that can prevent moisture and oxygen permeation to increase reliability.

Another embodiment provides an electronic device comprising the encapsulant.

According to one embodiment, a filler that is surface treated with a silane coupling agent having at least one fluorine, a first polysiloxane having silicon-bonded hydrogen (Si-H) at the end, and a silicon- And a second polysiloxane having a silyl group (Si-Vi).

The silane coupling agent may be represented by the following general formula (1).

[Chemical Formula 1]

Figure 112012096469933-pat00001

In Formula 1,

R is a substituted or unsubstituted C1 to C30 fluoroalkyl group, a substituted or unsubstituted C6 to C30 fluoroaryl group, a substituted or unsubstituted C3 to C30 fluorocycloalkyl group, a substituted or unsubstituted C3 to C30 fluoro An arylalkyl group or a combination thereof,

X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.

The silane coupling agent may be represented by the following general formula (1a) or (1b).

[Formula 1a]

Figure 112012096469933-pat00002

[Chemical Formula 1b]

Figure 112012096469933-pat00003

In the above formula (1a) or (1b)

R a to R l are each independently hydrogen or fluorine,

At least one of R a to R e and at least one of R f to R l is fluorine,

n and m are each independently 0 to 10,

X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.

The silane coupling agent may be represented by the following formula (1aa) or (1bb).

(1aa)

Figure 112012096469933-pat00004

≪ RTI ID = 0.0 &

Figure 112012096469933-pat00005

In the above general formula (1aa) or (1bb)

n and m are each independently 0 to 10,

X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.

The silane coupling agent may be included in an amount of 10 to 100 parts by weight based on 100 parts by weight of the filler.

The filler may include silica, alumina, titanium oxide, zinc oxide, or combinations thereof.

The filler surface-treated with the silane coupling agent may be contained in an amount of about 0.01 to 10% by weight based on the total amount of the sealing material.

The first polysiloxane may be represented by the following general formula (2).

(2)

(R 1 R 2 R 3 SiO 1/2) M1 (R 4 R 5 SiO 2/2) D1 (R 6 SiO 3/2) T1 (SiO 4/2) Q1

In Formula 1,

R 1 to R 6 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl group, C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, Or an unsubstituted C1 to C30 carbonyl group, a hydroxy group or a combination thereof,

At least one of R < 1 > to R < 6 >

0 &lt; D1 < 1, 0 <

M1 + D1 + T1 + Q1 = 1.

The second polysiloxane may be represented by the following general formula (2).

(2)

(R 7 R 8 R 9 SiO 1/2) M2 (R 10 R 11 SiO 2/2) D2 (R 12 SiO 3/2) T2 (SiO 4/2) Q2

In Formula 2,

R 7 to R 12 each independently represent a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl Substituted or unsubstituted C1 to C30 heteroalkyl groups, substituted or unsubstituted C2 to C30 heterocycloalkyl groups, substituted or unsubstituted C2 to C30 alkenyl groups, substituted or unsubstituted C2 to C30 alkynyl groups, A substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group or a combination thereof,

At least one of R 7 to R 12 includes a substituted or unsubstituted C2 to C30 alkenyl group,

0 &lt; M2 < 1, 0? D2 <1, 0? T2 <1, 0? Q2 <

M2 + D2 + T2 + Q2 = 1.

The first polysiloxane is included at less than about 50 weight percent of the total amount of the encapsulant and the second polysiloxane can be included at greater than about 50 weight percent of the total encapsulant.

According to another embodiment, there is provided an electronic device including an encapsulation portion obtained by curing the above encapsulation material.

Moisture and oxygen permeation can be prevented, and the reliability of the encapsulant and the electronic device including the encapsulant can be enhanced.

1 is a cross-sectional view schematically illustrating a light emitting diode according to one embodiment.

Hereinafter, exemplary embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Unless otherwise defined herein, "substituted" means that the hydrogen atom in the compound is a halogen atom (F, Br, Cl, or I), a hydroxy group, an alkoxy group, a nitro group, a cyano group, A thio group, an ester group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkenyl group, a C2 to C20 alkenyl group, A C 1 to C 30 arylalkyl group, a C 7 to C 30 arylalkyl group, a C 1 to C 30 alkoxy group, a C 1 to C 20 heteroalkyl group, a C 3 to C 20 heteroarylalkyl group, a C 3 to C 30 cycloalkyl group, a C 3 to C 15 cycloalkenyl group, C6 to C15 cycloalkynyl groups, C3 to C30 heterocycloalkyl groups, and combinations thereof.

In addition, unless otherwise defined herein, "hetero" means containing 1 to 3 heteroatoms selected from N, O, S and P.

Hereinafter, an encapsulant according to one embodiment will be described.

An encapsulant according to one embodiment comprises a filler that has been surface treated with a silane coupling agent having at least one fluorine, a first polysiloxane having silicon-bonded hydrogen (Si-H) at the end, and a silicon- And a second polysiloxane having an alkenyl group (Si-Vi).

The filler may be made of inorganic oxide and may include, for example, silica, alumina, titanium oxide, zinc oxide, or combinations thereof.

The filler is surface treated with a silane coupling agent having at least one fluorine.

The silane coupling agent may be represented by the following general formula (1).

[Chemical Formula 1]

Figure 112012096469933-pat00006

In Formula 1,

R is a substituted or unsubstituted C1 to C30 fluoroalkyl group, a substituted or unsubstituted C6 to C30 fluoroaryl group, a substituted or unsubstituted C3 to C30 fluorocycloalkyl group, a substituted or unsubstituted C3 to C30 fluoro An arylalkyl group or a combination thereof,

X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.

The silane coupling agent may modify the surface of the filler from hydrophilic to hydrophobic to increase the dispersibility of the filler. Thereby reducing the packing of the filler in the encapsulant and preventing the filler from being unevenly distributed in the encapsulant due to the difference in density with the polysiloxane which will be described later. Particularly, by including fluorine in the silane coupling agent, water permeability and oxygen permeability can be lowered, and it is possible to reduce the occurrence of deterioration such as discoloration even after a lapse of time.

The silane coupling agent may be represented, for example, by the following formula (1a) or (1b).

[Formula 1a]

Figure 112012096469933-pat00007

[Chemical Formula 1b]

Figure 112012096469933-pat00008

In the above formula (1a) or (1b)

R a to R l are each independently hydrogen or fluorine,

At least one of R a to R e and at least one of R f to R l is fluorine,

n and m are each independently 0 to 10,

X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.

The silane coupling agent may be represented by, for example, the following formula (1aa) or (1bb).

(1aa)

Figure 112012096469933-pat00009

&Lt; RTI ID = 0.0 &

Figure 112012096469933-pat00010

In the above general formula (1aa) or (1bb)

n and m are each independently 0 to 10,

X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.

The silane coupling agent may be included in an amount of about 10 to 100 parts by weight based on 100 parts by weight of the filler. By including it in the above-mentioned range, the surface modification of the filler can sufficiently proceed, effectively preventing water and oxygen permeation effectively, and ultimately, a highly reliable sealing material can be realized.

The filler surface-treated with the silane coupling agent may be contained in an amount of about 0.01 to 10% by weight based on the total amount of the sealing material. By being included in the above range, permeation of moisture and oxygen can be effectively prevented, and a highly reliable sealing material can be realized.

The first polysiloxane may be represented by the following general formula (2).

(2)

(R 1 R 2 R 3 SiO 1/2) M1 (R 4 R 5 SiO 2/2) D1 (R 6 SiO 3/2) T1 (SiO 4/2) Q1

In Formula 2,

R 1 to R 6 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl group, C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, Or an unsubstituted C1 to C30 carbonyl group, a hydroxy group or a combination thereof,

At least one of R &lt; 1 &gt; to R &lt; 6 &gt;

0 &lt; D1 < 1, 0 <

M1 + D1 + T1 + Q1 = 1.

M1, D1, T1 and Q1 are each in a molar ratio.

The first polysiloxane may have an average of at least two silicon-bonded hydrogen (Si-H) per molecule.

The first polysiloxane may be obtained by hydrolysis and condensation polymerization of at least one monomer selected from the group consisting of a monomer represented by the following formula (2a) and a monomer represented by the following formula (2b), (2c) and (2d)

(2a)

Figure 112012096469933-pat00011

(2b)

Figure 112012096469933-pat00012

[Chemical Formula 2c]

Figure 112012096469933-pat00013

(2d)

Figure 112012096469933-pat00014

In the above general formulas (2a) to (2d)

The definitions of R 1 to R 6 are as defined above,

X 4 to X 13 are each independently a C 1 to C 6 alkoxy group, a hydroxy group, a halogen group, a carboxyl group or a combination thereof.

The weight average molecular weight of the first polysiloxane may be about 100 to 30000 g / mol, and may be about 100 to 10000 g / mol.

The first polysiloxane may be included in an amount less than about 50 wt%, and preferably about 1 to 35 wt%, based on the total amount of encapsulant.

The second polysiloxane may be represented by the following general formula (3).

(3)

(R 7 R 8 R 9 SiO 1/2) M2 (R 10 R 11 SiO 2/2) D2 (R 12 SiO 3/2) T2 (SiO 4/2) Q2

In Formula 3,

R 7 to R 12 each independently represent a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl Substituted or unsubstituted C1 to C30 heteroalkyl groups, substituted or unsubstituted C2 to C30 heterocycloalkyl groups, substituted or unsubstituted C2 to C30 alkenyl groups, substituted or unsubstituted C2 to C30 alkynyl groups, A substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group or a combination thereof,

At least one of R 7 to R 12 includes a substituted or unsubstituted C2 to C30 alkenyl group,

0 &lt; M2 < 1, 0? D2 <1, 0? T2 <1, 0? Q2 <

M2 + D2 + T2 + Q2 = 1.

M2, D2, T2 and Q2 are respectively in molar ratio.

The second polysiloxane may have an average of at least two silicon-bonded alkenyl groups (Si-Vi) per molecule.

The second polysiloxane can be obtained by hydrolysis and condensation polymerization of at least one monomer selected from the group consisting of the following general formula (3a), (3b), (3c) and (3d)

[Chemical Formula 3]

Figure 112012096469933-pat00015

(3b)

Figure 112012096469933-pat00016

[Chemical Formula 3c]

Figure 112012096469933-pat00017

(3d)

Figure 112012096469933-pat00018

The definition of R 7 to R 12 is as described above,

X 14 to X 23 are each independently a C 1 to C 6 alkoxy group, a hydroxy group, a halogen group, a carboxyl group or a combination thereof.

The weight average molecular weight of the second polysiloxane may be about 100 to 30000 g / mol, and may be about 100 to 10000 g / mol.

The second polysiloxane may be included in an amount greater than about 50 weight percent, and preferably about 65 to 99 weight percent, based on the total weight of the encapsulant.

The first polysiloxane having silicon-bonded hydrogen (Si-H) positioned at the end and the second polysiloxane having the silicon-bonded alkenyl group (Si-Vi) are included together so that the degree of crosslinking and curing of the light- Can be adjusted.

The encapsulation material may further include a hydrogen sacylation catalyst.

The hydrogen silylation catalyst may facilitate the hydrogen silylation reaction of the first polysiloxane and the second polysiloxane, and may include, for example, platinum, rhodium, palladium, ruthenium, iridium or combinations thereof.

The hydrogen sacylation catalyst may be contained in an amount of about 0.1 ppm to 1000 ppm based on the total amount of the light transmitting resin composition.

The encapsulating material may further include an adhesion promoter. Examples of the adhesion promoting agent include glycidoxypropyltrimethoxysilane, vinyltriethoxysilane, and glycidoxypropyltriethoxysilane.

The encapsulation material may further include a fluorescent material.

The phosphor includes a material which is stimulated by light and emits light of a specific wavelength range by itself. The phosphor may also include a quantum dot such as a semiconductor nanocrystal in a broad sense.

The phosphor may be, for example, a blue phosphor, a green phosphor, or a red phosphor, and may be a mixture of two or more types.

The phosphor may display a color of a predetermined wavelength region by light supplied from a separate light emitting portion, and the light emitting portion may display a color of a shorter wavelength region than a color displayed by the phosphor. For example, when the phosphor displays a red color, the light emitting unit may emit blue or green light having a shorter wavelength than the red color.

Further, a white color can be displayed by combining a color emitted from the light emitting portion and a color emitted from the phosphor. For example, when the light emitting portion supplies blue light and the phosphor includes a red phosphor and a green phosphor, the electronic device may display white by combining blue, red, and green.

The encapsulant can be prepared, for example, by surface-treating the filler with the silane coupling agent and then mixing the surface-treated filler with the first polysiloxane and the second polysiloxane. In this case, the surface-treated filler can be obtained by mixing the filler and the silane coupling agent in a solvent and then heat-treating the paste at a predetermined temperature. The heat treatment temperature may be, for example, about 40 to 200 ° C.

Alternatively, the encapsulating material may be subjected to a heat treatment at a predetermined temperature after mixing the filler, the silane coupling agent, the first polysiloxane, and the second polysiloxane, and surface-treating the filler with the silane coupling agent. The heat treatment temperature may be, for example, about 40 to 200 ° C.

The encapsulating material may be cured and used as an encapsulating layer of an electronic device. The electronic device may include, for example, a light emitting diode and an organic light emitting device.

Hereinafter, a light emitting diode according to one embodiment will be described with reference to FIG. 1 as an example of an electronic device using the sealing material.

1 is a cross-sectional view schematically illustrating a light emitting diode according to one embodiment.

1, the light emitting diode includes a mold 110; A lead frame 120 disposed within the mold 110; A light emitting diode chip 140 mounted on the lead frame 120; A bonding wire 150 connecting the lead frame 120 and the light emitting diode chip 140; And an encapsulating unit 200 covering the light emitting diode chip 140.

The encapsulation portion 200 is formed by curing the encapsulation material described above and includes a resin 180 and a phosphor 190 that include a first polysiloxane, a second polysiloxane, and a surface-treated filler. However, the phosphor 190 may be omitted.

The phosphor 190 can emit light for displaying a color of a predetermined wavelength region by the light supplied from the light emitting diode chip 140, which is a light emitting portion. At this time, the light emitting diode chip 140 can display a color in a shorter wavelength region than the color displayed by the phosphor 190. For example, when the phosphor 190 displays a red color, the light emitting diode chip 140 can supply blue or green light having a shorter wavelength region than the red color.

The color emitted from the light emitting diode chip 140 and the color emitted from the phosphor 190 may be combined to display a white color. For example, when the light emitting diode chip 140 emits blue light and the phosphor 190 includes a red phosphor and a green phosphor, the light emitting diode may be a white light emitting diode that displays white by combining blue, have.

Hereinafter, embodiments of the present invention will be described in detail with reference to examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

Surface-treated Filler  Produce

Manufacturing example  One

Water, ethanol and silica (Aerosil 90, manufactured by Evonik) (filler) were mixed at a weight ratio of 5:95:10 and stirred at room temperature for 30 minutes. At this time acetic acid was used to maintain the pH at 4.5 to 5.5. Subsequently, 50 parts by weight of CF 3 (CH 2 ) 3 Si (OCH 3 ) 3 (silane coupling agent) was added to 100 parts by weight of the mixed solution, and the mixture was heated to 90 ° C. . The mixture was then placed in a vacuum atmosphere for 3 hours to remove the solvent and then cooled to room temperature. Subsequently, the resulting filler was washed with ethanol and then dried in an oven at 110 ° C for 6 hours to obtain a surface-treated filler.

Manufacturing example  2

Except that CF 3 (CF 2 ) 3 (CH 2 ) 3 Si (OCH 3 ) 3 was used as the silane coupling agent, a surface-treated filler was obtained in the same manner as in Production Example 1.

Manufacturing example  3

A surface-modified filler was obtained in the same manner as in Production Example 1 except that C 6 F 5 (CH 2 ) 3 Si (OCH 3 ) 3 was used as a silane coupling agent.

1st Polysiloxane  Produce

1 kg of a mixed solvent in which water and toluene were mixed at a weight ratio of 5: 5 was charged into a three-necked flask, and 159.39 g of diphenyldichlorosilane and 402 g of tetramethyldisiloxane were added dropwise to the monomer over 2 hours while the temperature was maintained at 23 占 폚. After completion of the dropwise addition, condensation polymerization reaction was carried out while refluxing at 90 ° C for 3 hours. After cooling to room temperature, the water layer was removed to prepare a polymer solution dissolved in toluene. The resulting polymer solution was washed with water to remove chlorine as a by-product of the reaction. Subsequently, the neutral polymer solution was distilled under reduced pressure to remove toluene to obtain a liquid polysiloxane.

The molecular weight of the obtained polysiloxane was measured using gel permeation chromatography. The molecular weight in terms of polystyrene was 350 g / mol, and the structure of the formula (2-A) was determined using H-NMR, Si- Respectively. Where Me is a methyl group, Ph is a phenyl group, Si is silicon, and H is hydrogen.

[Chemical Formula 2-A]

(Me 2 HSiO 2/2) 0.66 (Ph 2 SiO 2/2) 0.33

Second Polysiloxane  Produce

1 kg of a mixed solvent prepared by mixing water and toluene in a weight ratio of 5: 5 was charged into a three-necked flask, and while maintaining the temperature at 23 캜, 372 g of phenylmethyldimethoxysilane and 372 g of divinyltetramethyldisiloxane, H 2 O was mixed at 25 ° C. The condensation polymerization reaction was carried out while heating to reflux at 90 占 폚 for 3 hours. After cooling to room temperature, the water layer was removed to prepare a polymer solution dissolved in toluene. The resulting polymer solution was washed with water to remove chlorine as a by-product of the reaction. Subsequently, the neutral polymer solution was distilled under reduced pressure to remove toluene to obtain a liquid polysiloxane.

The molecular weight of the obtained polysiloxane was measured using gel permeation chromatography. The molecular weight in terms of polystyrene was 6000 g / mol. The structure of the compound of formula (3-A) was determined by H-NMR, Si- Respectively. Where Me is methyl, Ph is phenyl, Vi is vinyl, and Si is silicon.

[Formula 3-A]

Figure 112012096469933-pat00019

Manufacture of encapsulant

Example  One

2% by weight of the surface-treated filler obtained in Preparation Example 1, 23% by weight of the first polysiloxane represented by Formula 2-A, 75% by weight of the second polysiloxane represented by Formula 3-A, 2.0 (manufactured by Umicore) (added so that the content of Pt was 5 ppm) were mixed and defoamed in vacuo to prepare a liquid encapsulant.

Example  2

A liquid encapsulant was prepared in the same manner as in Example 1, except that the surface-treated filler obtained in Preparation Example 2 was used in place of the surface-treated filler obtained in Preparation Example 1.

Example  3

A liquid encapsulant was prepared in the same manner as in Example 1, except that the surface-treated filler obtained in Preparation Example 3 was used in place of the surface-treated filler obtained in Preparation Example 1.

Comparative Example

A liquid encapsulant was prepared in the same manner as in Example 1, except that the surface-treated silica (Aerosil 90, manufactured by Evonik) was used instead of the surface-treated filler obtained in Preparation Example 1.

Rating 1

The encapsulant according to Examples 1 to 3 and Comparative Example was measured for refractive index under the D-line (589 nm) wavelength using Abbe's refractometer.

The results are shown in Table 1.

Refractive index Example 1 1.43 Example 2 1.43 Example 3 1.43 Comparative Example 1.43

As shown in Table 1, it can be seen that the encapsulant according to Examples 1 to 3 exhibits a refractive index similar to that of the encapsulant according to the comparative example. It can be seen from this that the refractive index is not affected by the surface-treated filler.

Rating 2

The encapsulant according to Examples 1 to 3 and Comparative Example was injected into the mold. Then, the film was first cured at 80 ° C for 1 hour, and further thermally cured at 160 ° C for 1 hour to form a film-shaped encapsulation.

The water permeability was measured using a moisture permeability meter (ASTM F-1249, manufactured by MOCON), and the oxygen permeability was measured using an air permeability meter (ASTM D-3985, manufactured by MOCON).

The results are shown in Table 2.

Water permeability (gm / m 2 day) Oxygen permeability (cc / m 2 day) Example 1 6.5 300 Example 2 5.0 280 Example 3 4.5 240 Comparative Example 8.0 380

As shown in Table 2, it can be seen that the sealing materials according to Examples 1 to 3 are greatly lowered in water permeability and oxygen permeability compared with the sealing material according to the comparative example.

Rating 3

The encapsulant according to Examples 1 to 3 and Comparative Example was injected into a mold equipped with a light emitting diode chip using a syringe. Then, the resultant was thermally cured at 80 DEG C for 1 hour and at 160 DEG C for 1 hour to form an encapsulating portion.

Then, the test piece was continuously operated at a condition of 85 ° C / 85% RH (ralative humidity) and 120 mA, and then the time at which the discoloration occurred in the sealed portion was observed to confirm reliability.

The discoloration was observed using an optical microscope (magnification: 200x).

The results are shown in Table 3.

responsibility Example 1 ○ Example 2 ◎ Example 3 ◎ Comparative Example X

In Table 3, ⊚ indicates that discoloration does not occur at all within 8 weeks, ◯ indicates that discoloration occurs between 4 and 8 weeks, and X indicates discoloration within 4 weeks.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, And falls within the scope of the invention.

110: Mold 120: Lead frame
140: light emitting diode chip 150: bonding wire
180: Resin 190: Phosphor
200:

Claims (11)

A filler surface-treated with a silane coupling agent represented by the following formula (1)
A first polysiloxane having silicon-bonded hydrogen (Si-H) at its end, and
A second polysiloxane having a silicon-bonded alkenyl group (Si-Vi)
Encapsulation material containing:
[Chemical Formula 1]
Figure 112015068531665-pat00026

In Formula 1,
R is a substituted or unsubstituted C1 to C30 fluoroalkyl group, a substituted or unsubstituted C6 to C30 fluoroaryl group, a substituted or unsubstituted C3 to C30 fluorocycloalkyl group, a substituted or unsubstituted C3 to C30 fluoro An arylalkyl group or a combination thereof,
X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof.
delete The method of claim 1,
Wherein the silane coupling agent is represented by the following formula (1a) or (1b).
[Formula 1a]
Figure 112015068531665-pat00021

[Chemical Formula 1b]
Figure 112015068531665-pat00022

In the above formula (1a) or (1b)
R a to R l are each independently hydrogen or fluorine,
At least one of R a to R e and at least one of R f to R l is fluorine,
n and m are each independently 0 to 10,
X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof. The method of claim 1,
The silane coupling agent is represented by the following formula (1aa) or (1bb).
(1aa)
Figure 112015068531665-pat00023

&Lt; RTI ID = 0.0 &
Figure 112015068531665-pat00024

In the above general formula (1aa) or (1bb)
n and m are each independently 0 to 10,
X 1 , X 2, and X 3 are each independently a substituted or unsubstituted C1 to C10 alkoxy group, a hydroxy group, a halogen group, a carboxyl group, or a combination thereof. The method of claim 1,
Wherein the silane coupling agent is contained in an amount of 10 to 100 parts by weight based on 100 parts by weight of the filler. The method of claim 1,
Wherein the filler comprises silica, alumina, titanium oxide, zinc oxide or a combination thereof. The method of claim 1,
Wherein the filler surface-treated with the silane coupling agent is contained in an amount of 0.01 to 10% by weight based on the total amount of the sealing material. The method of claim 1,
Wherein the first polysiloxane is represented by the following formula (2).
(2)
(R 1 R 2 R 3 SiO 1/2) M1 (R 4 R 5 SiO 2/2) D1 (R 6 SiO 3/2) T1 (SiO 4/2) Q1
In Formula 1,
R 1 to R 6 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl group, C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C1 to C30 alkoxy group, Or an unsubstituted C1 to C30 carbonyl group, a hydroxy group or a combination thereof,
At least one of R &lt; 1 &gt; to R &lt; 6 &gt;
0 < D1 < 1, 0 &lt;
M1 + D1 + T1 + Q1 = 1.
The method of claim 1,
Wherein the second polysiloxane is represented by the following formula (3).
(3)
(R 7 R 8 R 9 SiO 1/2) M2 (R 10 R 11 SiO 2/2) D2 (R 12 SiO 3/2) T2 (SiO 4/2) Q2
In Formula 3,
R 7 to R 12 each independently represent a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 aryl Substituted or unsubstituted C1 to C30 heteroalkyl groups, substituted or unsubstituted C2 to C30 heterocycloalkyl groups, substituted or unsubstituted C2 to C30 alkenyl groups, substituted or unsubstituted C2 to C30 alkynyl groups, A substituted or unsubstituted C1 to C30 alkoxy group, a substituted or unsubstituted C1 to C30 carbonyl group, a hydroxy group or a combination thereof,
At least one of R 7 to R 12 includes a substituted or unsubstituted C2 to C30 alkenyl group,
0 &lt; M2 < 1, 0? D2 <1, 0? T2 <1, 0? Q2 <
M2 + D2 + T2 + Q2 = 1. The method of claim 1,
Wherein the first polysiloxane comprises less than 50% by weight based on the total amount of the encapsulant,
Wherein said second polysiloxane is contained in an amount greater than 50% by weight based on the total amount of said encapsulant. An electronic device comprising an encapsulant obtained by curing an encapsulant according to any one of claims 1 to 10.
KR1020120133067A 2012-11-22 2012-11-22 Encapsulation material and electronic device including the same KR101574085B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120133067A KR101574085B1 (en) 2012-11-22 2012-11-22 Encapsulation material and electronic device including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120133067A KR101574085B1 (en) 2012-11-22 2012-11-22 Encapsulation material and electronic device including the same

Publications (2)

Publication Number Publication Date
KR20140065952A KR20140065952A (en) 2014-05-30
KR101574085B1 true KR101574085B1 (en) 2015-12-03

Family

ID=50892689

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120133067A KR101574085B1 (en) 2012-11-22 2012-11-22 Encapsulation material and electronic device including the same

Country Status (1)

Country Link
KR (1) KR101574085B1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003137531A (en) 2001-11-02 2003-05-14 Mitsubishi Rayon Co Ltd Surface modified spherical silica, method of manufacturing the same and plastic resin composition for semiconductor sealing material
JP2005022915A (en) 2003-07-01 2005-01-27 Mitsubishi Rayon Co Ltd Surface-modified spherical silica, method of manufacturing the same and resin composition for sealing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003137531A (en) 2001-11-02 2003-05-14 Mitsubishi Rayon Co Ltd Surface modified spherical silica, method of manufacturing the same and plastic resin composition for semiconductor sealing material
JP2005022915A (en) 2003-07-01 2005-01-27 Mitsubishi Rayon Co Ltd Surface-modified spherical silica, method of manufacturing the same and resin composition for sealing

Also Published As

Publication number Publication date
KR20140065952A (en) 2014-05-30

Similar Documents

Publication Publication Date Title
KR20120078606A (en) Encapsulation material and electronic device including the same
KR101030019B1 (en) Transparent resin for encapsulation material and electronic device including the same
KR20120078614A (en) Transparent resin for encapsulation material and encapsulation material and electronic device including the same
KR100976461B1 (en) Transparent resin for encapsulation material and electronic device including the same
US9657174B2 (en) Siloxane monomer, encapsulant composition, encapsulant and electronic device
KR101566529B1 (en) Curable polysiloxane composition for optical device and encapsulant and optical device
KR101859393B1 (en) Thermosetting polyorganosiloxane composition, encapsulant, and optical instrument
JP6546004B2 (en) Curable composition for encapsulating an optical semiconductor and optical semiconductor device using the same
KR101574085B1 (en) Encapsulation material and electronic device including the same
KR101556274B1 (en) Composition for encapsulant and encapsulant and electronic device
KR101714715B1 (en) Composition for encapsulant and encapsulant and electronic device
KR101731376B1 (en) Silicone-based resin composition and method of preparing the same
KR101497139B1 (en) Composition for encapsulant and encapsulant and electronic device
KR101767085B1 (en) Curable organo polysiloxane composition, encapsulant, and electronic device
KR101466149B1 (en) Curable polysiloxane composition for optical device and encapsulant and optical device
KR20160002243A (en) Thermosetting polyorganosiloxane composition, encapsulant, and optical instrument
KR20140073998A (en) Encapsulation material and electronic device including the same
KR20120078300A (en) Encapsulation material and electronic device including the same
KR101486569B1 (en) Composition for encapsulant and encapsulant and electronic device
KR101739824B1 (en) Thermosetting polyorganosiloxane composition, encapsulant, and optical instrument
KR101918295B1 (en) Organopolysiloxane composition
KR20150066969A (en) Composition for encapsulant and encapsulant and electronic device
KR20140086723A (en) Composition for encapsulant and encapsulant and electronic device
KR20150047910A (en) Composition for encapsulant and encapsulant and electronic device
KR101731379B1 (en) Silicon Based Resin Composition and Method of Preparing the Same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
FPAY Annual fee payment

Payment date: 20181025

Year of fee payment: 4