JP2005016074A - Cement inorganic plate and its construction method - Google Patents

Cement inorganic plate and its construction method Download PDF

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Publication number
JP2005016074A
JP2005016074A JP2003179737A JP2003179737A JP2005016074A JP 2005016074 A JP2005016074 A JP 2005016074A JP 2003179737 A JP2003179737 A JP 2003179737A JP 2003179737 A JP2003179737 A JP 2003179737A JP 2005016074 A JP2005016074 A JP 2005016074A
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Japan
Prior art keywords
cement
based inorganic
vertical
embossed pattern
plate
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JP2003179737A
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Japanese (ja)
Inventor
Masayuki Ishihara
雅之 石原
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Nichiha Corp
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Nichiha Corp
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Priority to JP2003179737A priority Critical patent/JP2005016074A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a cement inorganic plate and its construction method having good weatherability without intrusion of rain water to the rear face by capillary action even if the thickness of a lap siding is thin and hardly causing a crack. <P>SOLUTION: In the cement inorganic plate having 4 to 8 mm in thickness with 1.2 to 1.7 of specific gravity, a horizontal groove section is provided to an upper side of the surface in the longitudinal direction of the plate and, at the same time, it is piled up and stuck on the lower side of the surface by using the cement inorganic plate having a vertical embossed pattern in the vertical direction of the plate. The cement inorganic plate is manufactured by wet paper-making, the vertical embossed pattern in the vertical direction of the plate is pushed in parallel with the paper-making direction of the wet paper-making, there are the vertical embossed pattern with a deep pattern and the vertical embossed pattern with a shallow pattern in the vertical embossed patter in the vertical direction of the plate, and the cement inorganic plate certainly has the vertical embossed pattern with the shallow pattern in at least one side in both right and left sides of the vertical embossed pattern with the deep pattern. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は主として外壁に使用されるセメント系無機質板およびその施工方法に関するものである。
【0002】
【発明の背景】
セメント系無機質板の施工として、左右または/および上下に接合の為の実部を有せず、上段板の下端部を下段板の上端部に重ねて施工する、いわゆるラップサイディング重ね貼り施工方法がある。
【0003】
【従来の技術】
このラップサイディング重ね貼り施工方法として、上段板の下端辺を下段板の溝部の上端に重ねて板の厚み感を出す施工方法がある。
【0004】
また、下段板からの毛細管現象を防ぎ、裏面への雨水の回り込みを防ぐために、上段板の裏面で下段板の上端との接触部分にシ−リングを打つことも行われている。
【0005】
【特許文献1】
実開昭59−63147号
【特許文献2】
実開昭63−23426号
【0006】
【発明が解決しようとする課題】
しかしながら、上記ラップサイディングの厚みが10mm以上ある場合には、シ−リングは充填しやすく問題はないが、板の厚みが薄いときは、シ−リングが充填しにくい。
【0007】
また、外観意匠向上のため板の表面に柄模様として、木目調などのエンボスが行われている。
しかしこのエンボス模様の形成方向によっては板にクラックが入る可能性があった。
すなわち、セメント系無機質板を湿式抄造で製造した場合、スラリ−中に含まれる補強繊維が抄造方向に対して平行に配向しやすい。
そのため、板を抄造方向に対して垂直方向に横長に採取した場合、補強繊維が配向した抄造方向に対して垂直方向の曲げ強度よりも、補強繊維が配向した抄造方向に対して平行方向の曲げ強度は若干低いこともあり、板の上下方向に縦エンボスを施すと、補強繊維が配向した方向に対して平行にエンボス荷重がかかるため、クラックが上下方向に入る可能性がある。
また、ビス打ちや釘打ちで下地材に板を取り付ける場合にも、板の長さの短い上下方向に補強繊維が配向しているので、クラックが上下方向に入る可能性がある。
本発明の課題は、ラップサイディングの厚みが薄くても、毛細管現象による雨水の裏面への回り込みがなくて軽量で耐候性がよく、また、エンボス柄を設けてもクラックの入る可能性の少ないセメント系無機質板とその施工方法を提供するものである。
【0008】
【課題を解決するための手段】
【0009】
上記の課題を解決するために本請求項1に記載の発明は、比重が1.2〜1.7であり、厚みが4〜8mmであるセメント系無機質板において、表面の上方側に板の左右方向に亘って横溝部を設けるとともに表面の下方側に板の上下方向に縦エンボス柄を設けたセメント系無機質板である。
上記の構成によれば、比重が高いので耐候性が良く、厚みが薄いので、羽重ね状に施工した時、地面に対するセメント系無機質板の傾斜角が小さくなり板表面に雨水が滞りにくいので、雨水の裏面への回り込みがない。
さらに縦エンボス柄方向と垂直の方向である板の左右方向全幅に亘って横溝部が施されているので、板の上下方向に掛かった縦エンボス荷重による縦応力を、板の左右方向に横溝部を設けることによる横応力によって緩和し分散させることが出来るので、クラックが入りにくく意匠性に富んだセメント系無機質板を得ることが出来る。
また万一、エンボスによって上下方向に微細なクラックが生じても、左右方向に亘って設けられた横溝部によって微細なクラックの増延が阻まれる。
【0010】
また、本請求項2に記載の発明は、前記セメント系無機質板は湿式抄造によって製造され、前記板の上下方向の縦エンボス柄は湿式抄造の抄造方向に対して平行に押圧されているセメント系無機質板である。
上記の構成によれば、湿式抄造による製造なので、乾式製法や注型製法と比較して設備が簡単で、生産性がよい。
【0011】
また、本請求項3に記載の発明は、前記板の上下方向の縦エンボス柄には柄の深い縦エンボス柄と柄の浅い縦エンボス柄とがあり、柄の深い縦エンボス柄の左右側の少なくとも片側には必ず柄の浅い縦エンボス柄が設けられているセメント系無機質板である。
上記の構成によれば、柄の深い縦エンボス柄荷重による部分的な縦応力を柄の浅い縦エンボス柄荷重応力で全体的に分散し緩和することで、表面にクラックを生じさせない。
【0012】
また、本請求項4に記載の発明は、下段のセメント系無機質板を横溝部にビス打ちまたは釘打ちすることで下地材に固定し、上段のセメント系無機質板を横溝部にビス打ちまたは釘打ちして下地材に固定し、かつ上段のセメント系無機質板の下端辺を下段のセメント系無機質板の横溝部を越えて配置するように施工し、以下同様に順次施工を繰り返すことを特徴とするセメント系無機質板の施工方法である。
上記の構成によれば、横溝部にビス打ちまたは釘打ちするので、ビス打ちまたは釘打ちの衝撃力が表面の縦エンボス柄には伝わらないので、クラックが入りにくく意匠性に富んだセメント系無機質板をシ−リングを施さなくても耐候性よく施工することが出来る。
【0013】
【発明の実施の形態】
以下、本発明の実施の形態を具体的に説明する。
[セメント系無機質板の原料]
本発明に使用されるセメント系無機質板とは、セメントを主成分とした水硬性の無機材料で製造され、主成分のセメントとしては、例えばポルトランドセメント、高炉スラグセメント、フライアッシュセメント、シリカセメント、アルミナセメント、白色セメント等のセメント類がある。
上記セメント類は二種以上混合使用してもよい。
また、主成分のセメント以外に木質補強材、ケイカル反応を起こす骨材、その他第三成分を混合してもよい。
木質補強材としては、例えば木質パルプ、ドライパルプ、木粉、木片、木毛、木質繊維、木質繊維束等を使用する。
上記木質補強材は二種以上混合されてもよい。
骨材としては、例えば、ケイ砂、ケイ石粉、パ−ライト、シラスバル−ン、膨張頁石、膨張粘土、焼成珪藻土、フライアッシュ、石炭ガラ等を使用する。
上記骨材は二種以上混合されてもよい。
第三成分としては、木質以外の補強材、例えば、セピオライト、ワラストナイト等の鉱物質繊維、ポリプロピレン繊維やポリエステル繊維等の合成樹脂繊維や蟻酸カルシウム、蟻酸マグネシウム、硫酸アルミニウム、硫酸マグネシウム、アルミン酸塩類、水ガラス等の硬化促進剤やロウ、ワックス、パラフィン、界面活性剤、シリコン等の防水剤や撥水剤等を混合してもよい。
【0014】
[セメント系無機質板の製造方法]
本発明においては、湿式抄造によってセメント系無機質板を製造する。
湿式抄造の場合、まず、原料を水に混合してスラリ−とし、フロ−オン方式、ハチェック方式、長網方式等でスラリ−を抄造してマットとする。
このマットは単層でも、メイキングロ−ル等に巻き取った多層でもよい。
このマットを5〜20MPaの高圧でプレスし製品寸法に切断した後硬化養生するか、またはプレスし硬化した後製品寸法に切断し養生し、さらに二次加工して製品とする。
硬化は50〜80℃で5〜10時間、養生はオ−トクレ−ブ養生を行うことが好ましい。
得られたセメント系無機質板は板の左右方向に亘って表面上方側に横溝部を有している。
この横溝部はプレス時のエンボスによって設けられてもよいし、二次加工での切削で設けられてもよい。
【0015】
セメント系無機質板表面の上下方向に縦エンボス柄を付すには、プレス時に縦エンボス柄を施したプレス型で形成するとよい。
このセメント系無機質板の外周形状は矩形であり、上下左右端辺に実加工を施していない。
【0016】
得られたセメント系無機質板は、比重が1.2〜1.7で厚みが4〜8mmである。
比重が1.2未満であると耐候性が悪くなって外壁として問題が生じ、比重が1.7より大きいとセメント系無機質板が堅くなりすぎてビス打ちや釘打ち等の施工性が悪くなるという問題が生じる。
ここでいう比重とは、105℃24時間乾燥後の絶乾比重のことをいう。
厚みが4mm未満であると耐衝撃性等が悪くなって外壁として問題が生じ、厚みが8mmより厚いとセメント系無機質板が重くなって軽量化にならない。
【0017】
横溝部の上下方向の幅は20〜50mmが好ましく、横溝部の深さはセメント系無機質板の厚みの約1/8〜1/4が好ましい。
横溝部の上下方向の幅が20mm未満だと、縦エンボス柄プレスによるクラックの発生抑止効果が小さく、また、釘を上下方向に一定間隔設けた状態で2本打つときに、釘打ちの際の衝撃が他の釘打ち部に伝わり、釘と釘との間にクラックが生じる危険性があり、50mmより大きいと、横溝部を隠すための上段のセメント系無機質板の重なり部分が大きくなって施工性が悪くなるとともに、セメント系無機質板自体のロスが多くなる。
横溝部の深さがセメント系無機質板の厚みの1/4よりも深いと、セメント系無機質板の強度劣化をまねき、1/8よりも浅いとビス頭や釘頭が表面位置から出てしまう。
横溝部の形成する位置はセメント系無機質板の上端辺から15〜25mm下の位置が好ましい。
15mm未満だとセメント系無機質板の上端辺部分で強度不具合を発生する危険性があり、25mmよりも大きいと上段のセメント系無機質板の重なり部分が大きくなって施工性が悪くなり、セメント系無機質板自体のロスも多くなる。
横溝部自体には縦エンボス柄が設けられていないことが望ましい。
【0018】
縦エンボス柄は、V字形溝やU字形溝等の柄の深い縦エンボス柄と、木目のような柄の浅い縦エンボス柄とで構成されている。
柄の深い縦エンボス柄の深さの最大は横溝部の深さよりは浅く、最小は柄の浅い縦エンボス柄の深さよりは深いことが好ましい。
また、柄の浅い縦エンボス柄の深さの最大は柄の深い縦エンボス柄の深さよりは浅く、最小は横溝部の深さの1/4よりも深いことが好ましい。
【0019】
また、横溝部よりも上方の板表面にも縦エンボス柄が施されていてもよい。
この場合、横溝部よりも下方の縦エンボス柄と同時に施すことができるので、効率がよい。
また、逆に横溝部よりも上方の板表面に横エンボス柄が施されていてもよい。
この場合、柄が横方向に施されているので、雨水が裏面に回り込みにくい。
【0020】
また、セメント系無機質板には、合わせマ−クを施してもよい。
具体的には、板の横溝部の直下の左右端辺に左右方向の位置合わせのためのマ−クを、板の上端辺中央に上下方向の位置合わせのためのマ−クを施す。
マ−クはV字、U字形状等の切り欠きでも構わないし、表面にプレス成形された線状の溝等でも構わない。
【0021】
[セメント系無機質板の施工方法]
次に、セメント系無機質板の施工方法について説明する。
本発明のセメント系無機質板は上下及び左右端辺に接合のための実を形成していない形状をしている。
まず、通常の土台水切りを施工したのち、本発明のセメント系無機質板を下地材にビス打ち又は釘打ちによって固定する。
この時、ビスまたは釘はセメント系無機質板表面の上方側に板の左右方向に亘って設けられた横溝部に打ちつける。
ビスまたは釘は板の左右端部と中央部との3箇所に打つことが好ましい。
次に、その横に次のセメント系無機質板を、左右のセメント系無機質板と位置合わせをして、シ−リングなしで左右のセメント系無機質板を突き合わせ、同様に横溝部にビス打ち又は釘打ちする。
さらにその横に、前記と同様な操作を繰り返して順次セメント系無機質板を施工して、第一段目(下段)とする。
次に、第一段目の上に第二段目(上段)としてセメント系無機質板を施工する。
まず、上段のセメント系無機質板の下端辺を下段のセメント系無機質板の横溝部を越えて重ねて配置し、その状態で上段のセメント系無機質板の横溝部にビス打ち又は釘打ちして上段のセメント系無機質板を施工する。
この場合、第二段目の板は、第一段目の板と横方向に板の左右方向全幅の半分程度ずらして施工することが好ましい。
その後は下段と同様に、左右のセメント系無機質板を位置合わせをして施工する。
それを上方向に順次繰り返してセメント系無機質板を施工する。
左右のセメント系無機質板間及び上下のセメント系無機質板間にはシ−リングを施す必要がない。
これはセメント系無機質板の厚みが薄く、羽重ね状に施工した時、地面に対する傾斜角が少ないので、セメント系無機質板の表面下端部に雨水が滞ることが少ないのと同時にセメント系無機質板の比重が高く、透水性が低いことによる。
シ−リングを施さないので、簡単に施工出来て、施工時間が短縮され、作業性が向上する。
【0022】
また、本発明のセメント系無機質板は比重が1.2〜1.7と高くかつ厚みが4〜8mmと薄く軽量化されているので、普通の外壁施工だけでなく、モルタル外壁やサイディング外壁等のリフォ−ム施工にも使用出来る。
通常の既存のモルタルのリフォ−ムでは、モルタルの上に新規リフォ−ム用の外壁材を釘やビスで打ちつけることは保持力の問題から出来ない。
したがって、まず、モルタルの上に厚さ30mm以上の胴縁をモルタルごと下地構造体に打ちつけ、その上に新規リフォ−ム用の外壁材をその胴縁に打ちつけて施工する。
新規外壁材が厚み15mmとか20mmであると外壁材の重量が重く、また、厚みがあるので、30mm以上の胴縁を取り付ける必要があった。
しかし、本発明のセメント系無機質板は厚みが薄く、軽量化されているので、既存のモルタル上に胴縁を施工する場合は18mm程度の胴縁で保持力が得られ、コストダウンになる。
【0023】
【実施例】
以下、本発明の実施例を挙げる。
【0024】
図1に本発明に使用するセメント系無機質板1を示す。
横幅は910mm、縦幅300mmの矩形状で、厚みは6mm、上端辺から18mmの所に左右方向に亘って上下幅37mmの横溝部2を有し、さらに表面には柄の深い縦エンボス柄3と柄の浅い縦エンボス柄4が施されている。
柄の深いエンボス柄3はU字形溝である。
横溝部2は図1に示すように深さ約1mmである。
また、柄の深い縦エンボス柄3は深さ約0.75mmであり、柄の浅い縦エンボス柄4は深さ約0.5mmである。
柄の深い縦エンボス柄3、柄の浅い縦エンボス柄4とは垂直方向に当たる左右方向に横溝部2が施されているので、クラックが入りにくい。
【0025】
図2にセメント系無機質板1の製造装置の一部を示す。
本製造装置は湿式抄造装置であり、ロ−ル間でテンションが掛けられた連続フェルト21上に、図示しないスラリ−タンクからフロ−ボックス20に送られてきた、原料に水を混合したスラリ−Sを流して、連続フェルト21の裏面側からサクションボックス13にて吸引脱水して単層マットMとし、メイキングロ−ル22に巻き取って所定の厚みになった時点でメイキングロ−ル22から切断剥離させ、積層マットM´とする。
このあと積層マットM´を図3に示すように、積層マットM´の抄造方向Yと垂直方向へ細長になるように積層マットM´を打ち抜く。
この時、積層マットM´は抄造方向Yに平行に補強繊維が配向している。
従って、打ち抜いた後は、セメント系無機質板1の板の幅狭の方向に対して平行に補強繊維が配向していることになる。
打ち抜きの際同時に、この積層マットM´に対して10MPaの圧力で高圧プレスする。
この際、プレス上盤には、横溝部2や柄の深い縦エンボス柄3、柄の浅い縦エンボス柄4に相当する形状が施されている。
その後、50℃6時間で硬化させ、さらに180℃6時間キ−プでオ−トクレ−ブ養生し、製品とする。
【0026】
図4にこのセメント系無機質板1の正面からの施工構造を示す。
ビス打ち又は釘打ちの位置はセメント系無機質板1の左右端辺から30mm以上内側に入った左右部分とセメント系無機質板1の略中心部分の横溝部2に打つ。
ビス打ちの場合は、横溝部2の縦幅の中央部分に打ちつける。
従って、1枚のセメント系無機質板1に3個のビス5で下地材7に留め付けることになる。
ビス5は4.2φ×22mmの平頭ビスを使用することが好ましい。
平頭ビスを使用することで、ビス5が横溝部2以外の部分よりも表面側に突出してしまうのを防ぐ。
【0027】
図5に釘打ち時の施工参考図を示す。
釘打ちの場合はビス打ちの場合と同様に横方向に三箇所釘打ちするが、この時上下に一定間隔を設けた状態で2本の釘6、6´を打つ。
この場合の間隔は18〜30mm上下に離すことが好ましい。
間隔が18mm以下であると釘打ちの際の衝撃が他の釘打ち部に伝わり、その結果、釘6と釘6´との間にクラックが生じる危険性がある。
横溝部2の上下方向の幅が20〜50mmであるので、釘6、6´を18〜30mm上下に離すことが出来る。
この時釘6、6´は上下に垂直に離しても良いし、少し左右にずらして釘打ちしてもよい。
従って、1枚のセメント系無機質板1に6個の釘で下地材7に留め付けることになる。
釘6、6´を上下に2本打つことによって、下段のセメント系無機質板1の横溝部2と上段のセメント系無機質板10の下端辺との間が若干隙間があくので、毛細管現象が起こりにくい。
釘6、6´は2.3φ×38mmのステンレスリング釘を使用することが好ましい。
左右のセメント系無機質板1の接合はシ−リングなしで、左側のセメント系無機質板1と右側のセメント系無機質板1とを合わせて位置合わせする。
そして同様に次のセメント系無機質板1を施工する。
このようにして第一段目(下段)とする。
【0028】
図6には、このセメント系無機質板の重ね貼り施工構造を示す。
下段のセメント系無機質板1の上に第二段目(上段)としてセメント系無機質板10を施工する。
まず、上段のセメント系無機質板10の下端辺を下段のセメント系無機質板1の横溝部2を越えて重ね、さらに、下段のセメント系無機質板1の上端辺中央に上段のセメント系無機質板10の左端辺を合わせて配置し、その状態で上段のセメント系無機質板10の横溝部2にビス打ち又は釘打ちして上段のセメント系無機質板10を施工する。
その後は下段と同様に、左右のセメント系無機質板10を位置合わせをして施工する。
それを上方向に順次繰り返して施工する。
左右のセメント系無機質板間及び上下のセメント系無機質板間にはシ−リングを施す必要がない。
これはセメント系無機質板の厚みが薄く、板下端部に雨水が滞ることが少ないのと同時にセメント系無機質板の比重が高く、透水性が低いことによる。
このセメント系無機質板の外壁面に対する重ね貼り傾斜角度は約4°である。
【0029】
図7には、このセメント系無機質板の他の実施例を示す。
この場合の柄の深い縦エンボス柄は木目の深溝であり、柄の浅い縦エンボス柄は木目の浅溝である。
【0030】
【発明の効果】
本請求項1に記載の発明によれば、比重が高いので耐候性が良く、厚みが薄いので、羽重ね状に施工した時、地面に対するセメント系無機質板の傾斜角が小さくなり板表面に雨水が滞りにくいので、雨水の裏面への回り込みがなく、さらに縦エンボス柄方向と垂直の方向に横溝部が施されているので、クラックが入りにくく意匠性に富んだセメント系無機質板を得ることが出来る。
【0031】
また、本請求項2に記載の発明によれば、湿式抄造による製造なので、乾式製法や注型製法と比較して設備が簡単で、生産性がよい。
【0032】
また、本請求項3に記載の発明によれば、柄の深い縦エンボス柄荷重による部分的な縦応力を柄の浅い縦エンボス柄荷重応力で全体的に分散し緩和することで、表面にクラックを生じさせない。
【0033】
また、本請求項4に記載の発明によれば、横溝部にビス打ちまたは釘打ちするので、ビス打ちまたは釘打ちの衝撃力が表面の縦エンボス柄には伝わらないので、クラックが入りにくく意匠性に富んだセメント系無機質板をシ−リングを施さなくても耐候性よく施工することが出来る。
【図面の簡単な説明】
【図1】本発明に使用するセメント系無機質板の正面図、右側面図
【図2】本発明に使用するセメント系無機質板の製造方法の一部を示す参考図
【図3】本発明に使用するセメント系無機質板の打ち抜き参考図
【図4】本発明に使用するセメント系無機質板の施工構造の正面図
【図5】本発明に使用するセメント系無機質板の釘打ち時の施工参考図
【図6】本発明に使用するセメント系無機質板の重ね貼り施工参考図
【図7】本発明に使用するセメント系無機質板の他の実施例
【符号の説明】
1、10 セメント系無機質板
2 横溝部
3 柄の深いエンボス柄
4 柄の浅いエンボス柄
5 ビス
6 釘
7 下地材
13 サクションボックス
20 フロ−ボックス
21 フェルト
22 メイキングロ−ル
S スラリ−
M 単層マット
M´ 積層マット
Y 抄造方向
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cement-based inorganic board mainly used for an outer wall and a construction method thereof.
[0002]
BACKGROUND OF THE INVENTION
There is a so-called lap siding overlaying method that does not have a real part for bonding on the left or right and / or top and bottom, and is constructed by overlaying the lower end of the upper plate on the upper end of the lower plate as the construction of the cement-based inorganic board. is there.
[0003]
[Prior art]
As this lap siding overlaid construction method, there is a construction method in which the lower end side of the upper plate is overlapped with the upper end of the groove portion of the lower plate to give a sense of thickness of the plate.
[0004]
Further, in order to prevent capillary action from the lower plate and prevent rainwater from flowing into the back surface, sealing is also performed on the contact portion of the upper plate with the upper end of the lower plate on the back surface.
[0005]
[Patent Document 1]
Japanese Utility Model Publication No.59-63147 [Patent Document 2]
Japanese Utility Model Publication No. 63-23426 [0006]
[Problems to be solved by the invention]
However, when the thickness of the lap siding is 10 mm or more, the sealing is easy to fill, and there is no problem, but when the thickness of the plate is thin, the sealing is difficult to fill.
[0007]
In addition, embossing such as wood grain is performed as a pattern on the surface of the plate for improving the appearance design.
However, depending on the direction in which this embossed pattern was formed, there was a possibility that the plate would crack.
That is, when a cement-based inorganic board is manufactured by wet papermaking, the reinforcing fibers contained in the slurry are easily oriented parallel to the papermaking direction.
Therefore, when the plate is taken horizontally in the direction perpendicular to the paper making direction, the bending strength in the direction parallel to the paper making direction in which the reinforcing fibers are oriented is larger than the bending strength in the direction perpendicular to the paper making direction in which the reinforcing fibers are oriented. The strength may be slightly low, and if vertical embossing is performed in the vertical direction of the plate, an embossing load is applied in parallel to the direction in which the reinforcing fibers are oriented, so that cracks may enter the vertical direction.
Further, when a plate is attached to the base material by screwing or nailing, since the reinforcing fibers are oriented in the vertical direction with a short plate length, there is a possibility that cracks enter the vertical direction.
The object of the present invention is to provide a cement that is light and weather-resistant with no wrap-around to the backside of rainwater due to capillary action even when the lap siding thickness is thin, and is less prone to cracking even if an embossed pattern is provided. An inorganic board and its construction method are provided.
[0008]
[Means for Solving the Problems]
[0009]
In order to solve the above problems, the invention according to claim 1 is a cement-based inorganic board having a specific gravity of 1.2 to 1.7 and a thickness of 4 to 8 mm. This is a cement-based inorganic board provided with a horizontal groove portion in the left-right direction and provided with a vertical embossed pattern in the vertical direction of the board on the lower side of the surface.
According to the above configuration, since the specific gravity is high, the weather resistance is good, and the thickness is thin, so when constructed in a lap shape, the inclination angle of the cement-based inorganic board with respect to the ground becomes small, and rainwater is unlikely to stagnate on the board surface. There is no wraparound to the back of rainwater.
Furthermore, since the horizontal groove is applied over the entire width in the left-right direction of the plate, which is the direction perpendicular to the vertical embossed pattern direction, the vertical stress due to the vertical embossing load applied in the vertical direction of the plate Since it can be relaxed and dispersed by the lateral stress due to the provision of, a cement-based inorganic board that is hard to crack and is rich in design can be obtained.
Even if fine cracks are generated in the vertical direction by embossing, the extension of the fine cracks is prevented by the lateral grooves provided in the horizontal direction.
[0010]
In the invention according to claim 2, the cement-based inorganic board is manufactured by wet papermaking, and the vertical embossed pattern in the vertical direction of the board is pressed parallel to the papermaking direction of the wet papermaking. It is an inorganic board.
According to said structure, since it is manufacture by wet papermaking, compared with a dry-type manufacturing method or a casting manufacturing method, an installation is simple and productivity is good.
[0011]
In the invention according to claim 3, the vertical embossed pattern in the vertical direction of the plate has a deep vertical embossed pattern and a shallow vertical embossed pattern on the left and right sides of the deep vertical embossed pattern. It is a cement-based inorganic board in which a vertical embossed pattern with a shallow pattern is always provided on at least one side.
According to said structure, the crack is not produced in the surface by disperse | distributing and relieving the partial longitudinal stress by the deep embossed pattern load of a deep pattern entirely by the vertical embossed pattern load stress of a shallow pattern.
[0012]
Further, in the invention according to claim 4, the lower cement-based inorganic plate is fixed to the base material by screwing or nailing the lateral groove portion, and the upper cement-based inorganic plate is screwed or nailing to the horizontal groove portion. It is fixed to the base material by striking, and it is constructed so that the lower end side of the upper cement-based inorganic board is placed beyond the lateral groove part of the lower cement-based inorganic board, and the construction is repeated sequentially in the same manner. It is the construction method of the cement-type inorganic board to do.
According to the above configuration, since the impact force of screwing or nailing is not transmitted to the vertical embossed pattern on the surface because the screwing or nailing is performed in the lateral groove portion, a cement-based inorganic material that is hard to crack and is rich in design Even if the plate is not sealed, it can be constructed with good weather resistance.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be specifically described.
[Raw material for cement-based inorganic board]
The cement-based inorganic board used in the present invention is manufactured from a hydraulic inorganic material mainly composed of cement. Examples of the main component cement include Portland cement, blast furnace slag cement, fly ash cement, silica cement, There are cements such as alumina cement and white cement.
Two or more of these cements may be used in combination.
Further, in addition to the main component cement, a wood reinforcing material, an aggregate causing a calcium reaction, and other third components may be mixed.
As the wood reinforcing material, for example, wood pulp, dry pulp, wood powder, wood pieces, wood hair, wood fibers, wood fiber bundles and the like are used.
Two or more kinds of the wood reinforcing materials may be mixed.
As the aggregate, for example, quartz sand, quartzite powder, pearlite, shirasu balloon, expanded shale, expanded clay, calcined diatomaceous earth, fly ash, coal galley and the like are used.
Two or more kinds of the aggregates may be mixed.
As the third component, reinforcing materials other than wood, for example, mineral fibers such as sepiolite and wollastonite, synthetic resin fibers such as polypropylene fiber and polyester fiber, calcium formate, magnesium formate, aluminum sulfate, magnesium sulfate, aluminate You may mix hardening accelerators, such as salts and water glass, waterproofing agents, water repellents, etc., such as wax, wax, paraffin, surfactant, and silicon.
[0014]
[Method for producing cement-based inorganic board]
In the present invention, a cement-based inorganic board is produced by wet papermaking.
In the case of wet papermaking, first, a raw material is mixed with water to form a slurry, and the slurry is made into a mat by a flow-on method, a check system, a long-mesh method, or the like.
This mat may be a single layer or a multilayer wound around a making roll or the like.
This mat is pressed at a high pressure of 5 to 20 MPa and cut into product dimensions and then cured and cured, or after pressed and cured, it is cut into product dimensions and cured, and further processed into a product.
It is preferable that curing is performed at 50 to 80 ° C. for 5 to 10 hours, and curing is performed by autoclaving.
The obtained cementitious inorganic board has a lateral groove part on the surface upper side over the left-right direction of the board.
The lateral groove portion may be provided by embossing during pressing, or may be provided by cutting in secondary processing.
[0015]
In order to attach a vertical embossed pattern in the vertical direction on the surface of the cement-based inorganic board, it may be formed with a press die provided with a vertical embossed pattern during pressing.
The outer peripheral shape of the cement-based inorganic board is rectangular, and actual processing is not performed on the upper, lower, left, and right edges.
[0016]
The obtained cementitious inorganic board has a specific gravity of 1.2 to 1.7 and a thickness of 4 to 8 mm.
If the specific gravity is less than 1.2, the weather resistance is deteriorated and a problem occurs as an outer wall. If the specific gravity is greater than 1.7, the cement-based inorganic board becomes too hard and the workability such as screwing and nailing is deteriorated. The problem arises.
Specific gravity here means the absolute dry specific gravity after drying at 105 ° C. for 24 hours.
If the thickness is less than 4 mm, impact resistance and the like are deteriorated, causing a problem as an outer wall. If the thickness is more than 8 mm, the cement-based inorganic board is heavy and does not reduce weight.
[0017]
The width in the vertical direction of the lateral groove is preferably 20 to 50 mm, and the depth of the lateral groove is preferably about 1/8 to 1/4 of the thickness of the cement-based inorganic board.
If the width of the horizontal groove in the vertical direction is less than 20 mm, the effect of suppressing the occurrence of cracks due to the vertical embossed pattern press is small, and when two nails are placed with a constant interval in the vertical direction, There is a risk that the impact will be transmitted to other nailing parts and cracks may occur between the nails, and if it is larger than 50 mm, the upper part of the cement-based inorganic board overlapped with the upper part to hide the lateral groove part. In addition to the deterioration of the properties, the loss of the cement-based inorganic board itself increases.
If the depth of the lateral groove is deeper than 1/4 of the thickness of the cement-based inorganic board, it will lead to strength deterioration of the cement-based inorganic board, and if it is shallower than 1/8, the screw head and nail head will come out of the surface position. .
The position where the lateral groove is formed is preferably 15 to 25 mm below the upper end side of the cement-based inorganic board.
If it is less than 15 mm, there is a risk of causing a strength failure at the upper edge of the cement-based inorganic board. If it is larger than 25 mm, the overlapping part of the upper cement-based inorganic board becomes large and the workability deteriorates, making the cement-based inorganic The loss of the board itself also increases.
It is desirable that the horizontal groove portion itself is not provided with a vertical embossed pattern.
[0018]
The vertical embossed pattern is composed of a deep vertical embossed pattern such as a V-shaped groove or a U-shaped groove and a shallow vertical embossed pattern like a grain.
The maximum depth of the vertical embossed pattern having a deep pattern is preferably shallower than the depth of the lateral groove, and the minimum depth is deeper than the depth of the vertical embossed pattern having a shallow pattern.
Further, it is preferable that the maximum depth of the vertical embossed pattern with a shallow pattern is shallower than the depth of the vertical embossed pattern with a deep pattern, and the minimum is deeper than 1/4 of the depth of the lateral groove portion.
[0019]
Moreover, the vertical embossing pattern may be given also to the plate surface above a horizontal groove part.
In this case, since it can be applied simultaneously with the vertical embossed pattern below the lateral groove portion, the efficiency is good.
Conversely, a horizontal embossed pattern may be provided on the plate surface above the horizontal groove.
In this case, since the handle is applied in the horizontal direction, it is difficult for rainwater to go around the back surface.
[0020]
In addition, the cement-based inorganic plate may be subjected to an alignment mark.
Specifically, a mark for alignment in the left-right direction is applied to the left and right edges directly below the lateral groove portion of the plate, and a mark for alignment in the vertical direction is applied to the center of the upper edge of the plate.
The mark may be a V-shaped, U-shaped notch, or a linear groove press-molded on the surface.
[0021]
[Construction method of cement-based inorganic board]
Next, the construction method of a cement-type inorganic board is demonstrated.
The cementitious inorganic board of the present invention has a shape in which no fruit for bonding is formed on the upper and lower and left and right edges.
First, after constructing a normal drainage, the cement-based inorganic board of the present invention is fixed to the base material by screwing or nailing.
At this time, the screw or nail is struck in a lateral groove portion provided on the upper side of the cement-based inorganic plate surface in the left-right direction of the plate.
Screws or nails are preferably struck at three locations, the left and right ends and the center of the plate.
Next, the next cement-based inorganic board is aligned with the left and right cement-based inorganic boards, and the left and right cement-based inorganic boards are abutted without sealing. Strike.
Next, the same operation as described above is repeated, and a cement-based inorganic board is sequentially constructed to form the first stage (lower stage).
Next, a cement-type inorganic board is constructed on the first stage as the second stage (upper stage).
First, place the lower edge of the upper cement-based inorganic board over the lateral groove of the lower cement-based inorganic board, and then screw or nail it into the horizontal groove of the upper cement-based inorganic board. Construction of cement-based inorganic board.
In this case, it is preferable that the second-stage plate is constructed by being shifted from the first-stage plate by about half of the full width in the left-right direction of the plate in the lateral direction.
After that, as with the lower stage, the left and right cement-based inorganic boards are aligned and installed.
The cement-based inorganic board is constructed by repeating this in the upward direction.
There is no need to seal between the left and right cement-based inorganic plates and between the upper and lower cement-based inorganic plates.
This is because the cement-based inorganic board is thin and has a small inclination angle with respect to the ground when constructed in a lap-like shape. This is because the specific gravity is high and the water permeability is low.
Since no sealing is applied, construction can be performed easily, construction time is shortened, and workability is improved.
[0022]
In addition, the cement-based inorganic board of the present invention has a high specific gravity of 1.2 to 1.7 and a thickness of 4 to 8 mm, which is thin and lightweight, so that not only ordinary outer wall construction, but also mortar outer walls, siding outer walls, etc. It can also be used for renovation work.
In a conventional existing mortar reform, it is impossible to hit an outer wall material for a new reform on the mortar with a nail or a screw because of a problem of holding power.
Therefore, first, a body edge having a thickness of 30 mm or more is struck on the ground structure together with the mortar on the mortar, and an outer wall material for new reform is struck on the body edge.
If the new outer wall material has a thickness of 15 mm or 20 mm, the weight of the outer wall material is heavy, and since there is a thickness, it is necessary to attach a trunk edge of 30 mm or more.
However, since the cement-based inorganic board of the present invention is thin and light in weight, when a barrel edge is applied on an existing mortar, a holding force is obtained with a barrel edge of about 18 mm, and the cost is reduced.
[0023]
【Example】
Examples of the present invention will be given below.
[0024]
FIG. 1 shows a cement-based inorganic board 1 used in the present invention.
It has a rectangular shape with a horizontal width of 910 mm and a vertical width of 300 mm, a thickness of 6 mm, a horizontal groove portion 2 with a vertical width of 37 mm across the left and right at 18 mm from the upper edge, and a vertical embossed pattern 3 with a deep pattern on the surface. A vertical embossed pattern 4 with a shallow pattern is applied.
The deep embossed pattern 3 is a U-shaped groove.
The lateral groove 2 has a depth of about 1 mm as shown in FIG.
Further, the vertical embossed pattern 3 having a deep pattern has a depth of about 0.75 mm, and the vertical embossed pattern 4 having a shallow pattern has a depth of about 0.5 mm.
Since the horizontal groove portion 2 is provided in the left-right direction which hits the vertical direction with the vertical embossed pattern 3 with a deep pattern and the vertical embossed pattern 4 with a shallow pattern, cracks are hardly generated.
[0025]
FIG. 2 shows a part of the manufacturing apparatus for the cement-based inorganic board 1.
This manufacturing apparatus is a wet papermaking apparatus, and a slurry in which water is mixed with raw materials sent from a slurry tank (not shown) to a flow box 20 on a continuous felt 21 tensioned between rolls. S is flown and suction dewatered from the back side of the continuous felt 21 with a suction box 13 to form a single-layer mat M. When the roll is wound around the making roll 22 and reaches a predetermined thickness, the making roll 22 Cut and peel off to obtain a laminated mat M ′.
Thereafter, as shown in FIG. 3, the laminated mat M ′ is punched out so as to be elongated in the direction perpendicular to the papermaking direction Y of the laminated mat M ′.
At this time, the laminated mat M ′ has reinforcing fibers oriented parallel to the papermaking direction Y.
Therefore, after punching, the reinforcing fibers are oriented in parallel to the narrow direction of the cement-based inorganic board 1.
Simultaneously with the punching, high pressure pressing is performed on the laminated mat M ′ at a pressure of 10 MPa.
At this time, the shape corresponding to the horizontal groove part 2, the deep vertical embossed pattern 3 with a pattern, and the vertical embossed pattern 4 with a shallow pattern is given to the press upper board.
Thereafter, it is cured at 50 ° C. for 6 hours, and further autoclaved at 180 ° C. for 6 hours to obtain a product.
[0026]
FIG. 4 shows a construction structure from the front side of the cement-based inorganic board 1.
The positions of screwing or nailing are applied to the left and right portions that are 30 mm or more inside from the left and right edges of the cement-based inorganic plate 1 and the lateral groove portion 2 at the substantially central portion of the cement-based inorganic plate 1.
In the case of screw driving, it hits the central portion of the vertical width of the lateral groove 2.
Therefore, it is fastened to the base material 7 with three screws 5 on one cement-based inorganic board 1.
The screw 5 is preferably a 4.2φ × 22 mm flat head screw.
By using the flat head screw, the screw 5 is prevented from protruding to the surface side from the portion other than the lateral groove portion 2.
[0027]
Fig. 5 shows a construction reference diagram when nailing.
In the case of nailing, nailing is performed in three places in the horizontal direction in the same manner as in the case of screwing.
In this case, the interval is preferably 18-30 mm up and down.
If the distance is 18 mm or less, the impact at the time of nailing is transmitted to other nailing portions, and as a result, there is a risk of cracks occurring between the nail 6 and the nail 6 '.
Since the horizontal groove 2 has a vertical width of 20 to 50 mm, the nails 6 and 6 ′ can be separated vertically by 18 to 30 mm.
At this time, the nails 6 and 6 ′ may be vertically separated from each other, or may be nailed while being slightly shifted from side to side.
Therefore, it is fastened to the base material 7 with six nails on one cement-based inorganic board 1.
By hitting two nails 6 and 6 'up and down, there is a slight gap between the lateral groove portion 2 of the lower cementitious inorganic plate 1 and the lower end side of the upper cementitious inorganic plate 10, so that capillary action occurs. Hateful.
The nails 6, 6 'are preferably stainless steel ring nails of 2.3φ × 38mm.
The left and right cement-based inorganic plates 1 are joined together by aligning the left-side cement-based inorganic plate 1 and the right-side cement-based inorganic plate 1 without sealing.
Similarly, the next cement-based inorganic board 1 is constructed.
In this way, the first stage (lower stage) is set.
[0028]
FIG. 6 shows the construction structure of this cement-based inorganic board overlaid.
The cement-based inorganic board 10 is constructed on the lower-stage cement-based inorganic board 1 as the second stage (upper stage).
First, the lower end side of the upper cement-based inorganic board 10 is overlapped over the lateral groove 2 of the lower cement-type inorganic board 1, and the upper cement-type inorganic board 10 is further centered on the upper end side of the lower-stage cement-based inorganic board 1. In this state, the upper cementitious inorganic board 10 is constructed by screwing or nailing it into the lateral groove 2 of the upper cementitious inorganic board 10.
Thereafter, as in the lower stage, the left and right cement-based inorganic plates 10 are aligned and applied.
Repeat it in the upward direction.
There is no need to seal between the left and right cement-based inorganic plates and between the upper and lower cement-based inorganic plates.
This is because the thickness of the cement-based inorganic board is thin and rainwater is less likely to stagnate at the lower end of the board, and at the same time the specific gravity of the cement-based inorganic board is high and the water permeability is low.
The tilt angle of the cemented inorganic board with respect to the outer wall surface is about 4 °.
[0029]
FIG. 7 shows another embodiment of the cement-based inorganic board.
In this case, the deep vertical embossed pattern of the pattern is a deep groove in the grain, and the shallow vertical embossed pattern in the pattern is a shallow groove of the grain.
[0030]
【The invention's effect】
According to the first aspect of the present invention, since the specific gravity is high, the weather resistance is good and the thickness is thin. Therefore, when constructed in a lap shape, the inclination angle of the cement-based inorganic board with respect to the ground becomes small, and rainwater is formed on the board surface. Since it does not stagnate, there is no wraparound to the back of rainwater, and the lateral groove is applied in the direction perpendicular to the vertical embossed pattern direction, so that it is possible to obtain a cement-based inorganic board that is hard to crack and is rich in design. I can do it.
[0031]
Further, according to the invention described in claim 2, since it is manufactured by wet papermaking, the equipment is simple and the productivity is good as compared with the dry manufacturing method and the casting manufacturing method.
[0032]
Further, according to the invention described in claim 3, cracks are generated on the surface by dispersing and alleviating the partial longitudinal stress due to the deep vertical embossed pattern load of the pattern with the shallow vertical embossed pattern load stress of the pattern. Does not cause.
[0033]
Further, according to the invention described in claim 4, since the screwing or nailing is performed in the lateral groove portion, the impact force of the screwing or nailing is not transmitted to the vertical embossed pattern on the surface, so that the design is difficult to crack. It is possible to construct a cement-based inorganic board rich in properties with good weather resistance without sealing.
[Brief description of the drawings]
FIG. 1 is a front view and a right side view of a cement-based inorganic board used in the present invention. FIG. 2 is a reference diagram showing a part of a method for producing a cement-based inorganic board used in the present invention. Fig. 4 Front view of the construction structure of the cement-based inorganic board used in the present invention. Fig. 5 Reference diagram of the construction when nailing the cement-based inorganic board used in the present invention. [Fig. 6] Reference drawing of the superposition of the cement-based inorganic board used in the present invention. [Fig. 7] Another embodiment of the cement-based inorganic board used in the present invention.
DESCRIPTION OF SYMBOLS 1, 10 Cement-type inorganic board 2 Horizontal groove part 3 Embossed pattern with deep pattern 4 Embossed pattern with shallow pattern 5 Screw 6 Nail 7 Base material 13 Suction box 20 Flow box 21 Felt 22 Making roll S Slurry
M Single layer mat M 'Laminated mat Y Paper making direction

Claims (4)

比重が1.2〜1.7であり、厚みが4〜8mmであるセメント系無機質板において、表面の上方側に板の左右方向に亘って横溝部を設けるとともに表面の下方側に板の上下方向に縦エンボス柄を設けたセメント系無機質板In a cement-based inorganic board having a specific gravity of 1.2 to 1.7 and a thickness of 4 to 8 mm, a lateral groove is provided on the upper side of the surface in the left-right direction of the board and the upper and lower sides of the board are provided on the lower side of the surface. Cement-based inorganic board with vertical embossed pattern in the direction 請求項1において、前記セメント系無機質板は湿式抄造によって製造され、前記板の上下方向の縦エンボス柄は湿式抄造の抄造方向に対して平行に押圧されているセメント系無機質板The cement-based inorganic board according to claim 1, wherein the cement-based inorganic board is manufactured by wet papermaking, and the vertical embossed pattern in the vertical direction of the board is pressed parallel to the papermaking direction of the wet papermaking. 請求項1または請求項2において、前記板の上下方向の縦エンボス柄には柄の深い縦エンボス柄と柄の浅い縦エンボス柄とがあり、柄の深い縦エンボス柄の左右側の少なくとも片側には必ず柄の浅い縦エンボス柄が設けられているセメント系無機質板3. The vertical embossed pattern in the vertical direction of the plate according to claim 1, wherein the vertical embossed pattern has a deep vertical embossed pattern and a shallow vertical embossed pattern, and at least one side of the left and right sides of the deep vertical embossed pattern. Is always a cement-based inorganic board with a shallow embossed pattern 請求項1または請求項2または請求項3のセメント系無機質板を用いた施工方法において、下段のセメント系無機質板を横溝部にビス打ちまたは釘打ちすることで下地材に固定し、上段のセメント系無機質板を横溝部にビス打ちまたは釘打ちして下地材に固定し、かつ上段のセメント系無機質板の下端辺を下段のセメント系無機質板の横溝部を越えて配置するように施工し、以下同様に順次施工を繰り返すことを特徴とするセメント系無機質板の施工方法The construction method using the cement-based inorganic board according to claim 1, 2 or 3, wherein the lower-stage cement-based inorganic board is fixed to the base material by screwing or nailing the lateral-groove portion, and the upper-stage cement The base inorganic plate is screwed or nailed into the lateral groove portion and fixed to the base material, and the lower end side of the upper cement-based inorganic plate is placed beyond the lateral groove portion of the lower cement-based inorganic plate, A method for constructing a cement-based inorganic board characterized by repeating construction in the same manner
JP2003179737A 2003-06-24 2003-06-24 Cement inorganic plate and its construction method Pending JP2005016074A (en)

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