JP2005011897A - Method of packaging electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging method wherein the material of a packaging layer is directly applied on the surface of an electronic device to be packaged to use the material as a package cover and an internal moisture absorption material. <P>SOLUTION: A nanometer inorganic material and a polymeric material are mixed to form an uncured packaging layer material, and then the packaging layer material is evenly applied on the electronic device to be packaged to form the packaging layer. After curing the packaging layer, a segregation layer of dense structure is generated between the inorganic material and the polymeric material to increase a humidity-prevention and air-prevention effect of the electronic device. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a kind of packaging method for an electronic device, in which a packaging layer that achieves the effect of blocking moisture and gas is directly applied to the electronic device, and the electronic device is adapted to meet the flexible design characteristics of current electronic products. Related to the packaging method.
[0002]
[Prior art]
In an era where safety is the subject, people are increasingly dependent on information products for convenience in their lives or because of problems in their living environment. Portable electronic products may get wet or exposed to moisture.
[0003]
In general, modern products are basically composed of electronic devices. Once these electronic devices are exposed to moisture, the drive voltage of the electronic devices changes rapidly at the moment they are turned on, and if this phenomenon is light, the electronic products are destroyed. However, in severe cases, it may cause a fire and damage the user, surrounding people or items. Water also oxidizes the electrical circuit of the electronic product to form a short circuit, and easily causes physical damage to the electronic device. Electronic products that do not have a waterproof function cannot recover any loss. It should be noted that the moisture concealment is strong and difficult to detect. If a short circuit occurs once the computers are connected, the motherboard may be burned out. As can be seen from this, the waterproofing problem of electronic devices is an inevitable important problem for us, and the product cannot be safe without solving this problem.
[0004]
With respect to current electronic products, the moisture-proof waterproofing of the photoelectric device package is most important because the waterproofing device is directly related to the quality and lifetime of the product. For example, organic light emitting diode (OLED) has many advantages such as self-emission, thinness, fast reaction speed, wide viewing angle, good resolution, high brightness and usable for flexible panel. -It is regarded as the next generation flat display technology of LCD, but it is currently regarded as the generalized product with the most stringent prevention of moisture in use.
[0005]
However, the low-molecular organic light-emitting material is very fragile to moisture, and has a drawback of easily generating dark spots after contact with the atmosphere. For this reason, if the package is defective, a dark spot is generated in the apparatus. This is because moisture enters the device from the metal film or the edge thereof, and the cathode in the organic EL device is made of a metal material, so that the electrode is oxidized and poor contact is formed, and this dark spot gradually increases. As a result, the effective display area of the organic EL device is reduced. Conversely, the current density in the effective display area can be increased to increase the driving voltage. Thus, if the package is good, the dark spot growth can be controlled, but if the device is exposed to the air for a long time, the dark spot will appear sooner or later. For this reason, in order to reduce the formation of dark spots, it is very important to isolate the photoelectric device from moisture and prevent water from entering the device.
[0006]
The package apparatus and method in the film forming / sealing fully automatic mass production manufacturing system of the currently known organic EL device are as follows.
[0007]
The packaging device includes a substrate having a device region, a cap that packages the device and generates a cavity on the device, and spacer particles in the device region that support the cap. Yes.
[0008]
As a method for forming a waterproof layer of an organic light-emitting device, a kind of method for manufacturing an organic EL device is provided, and the organic EL display panel includes a plurality of light-emitting regions, and the forming method provides a substrate. Thereafter, a first electrode corresponding to the light emitting region is formed on the substrate, and a strip-like photoresist layer is formed on the substrate on which the first electrode is formed so as to protrude from the substrate on which the first electrode is formed, An organic light emitting medium is deposited on the first electrode in the exposed region between the strip-shaped photoresist layers, and a plurality of first electrode regions including the organic light emitting medium are formed on the first electrode, and an effective light emitting medium layer is formed. A second electrode is formed on the first electrode, a stress relief layer is formed on the second electrode, the stress relief layer is composed of silicon oxynitride or a polymer film, and a waterproof layer is formed on the stress relief layer. Forming the waterproof layer with amorphous silicon, inorganic nitride There are compositions with an inorganic oxide, is that.
[0009]
Further, as an effective light emitting device packaging method, an organic EL device packaging method is provided, which is a method of packaging a light emitting layer in an organic EL device, and a low temperature vacuum film formation on the organic EL device. A package layer is formed by the method, and the light emitting layer is packaged.
[0010]
Furthermore, as an organic light-emitting display and its packaging method, an organic EL display packaging method is provided, which includes the following steps. That is,
(1) A step of providing a package substrate and an organic EL device to be packaged,
(2) A step of uniformly applying a single layer of package material on the entire surface of the above-described package substrate,
(3) One surface of the package substrate on which the package material is formed is aligned so as to face the one surface on which the light emitting layer of the organic EL device is formed, and then the package material is cured by applying pressure and heating to cure the package of this device. To complete the process.
[0011]
Furthermore, a method and a structure for protecting an organic EL display are provided, which is a method for manufacturing an organic EL display, and includes the following steps. That is,
Forming a first electrode layer on the substrate;
Forming an organic layer above the first electrode layer;
Forming a second electrode layer above the organic layer, forming a pixel matrix arrangement intersecting the first electrode layer on the second electrode layer, the substrate, the first electrode layer, the organic layer, and the Forming an organic EL device with the second electrode layer;
A composition in which a part of the second electrode layer is covered with a protective layer, and the electromotive force of the composition element having the minimum electromotive force among the composition elements of the protective layer has the maximum potential in the composition element of the second electrode layer The organic EL device is smaller than the electromotive force of the element, prevents the organic EL device from receiving moisture or oxygen, seals the organic EL device in an airtight case, and isolates the organic EL device from the outside air and moisture. Process.
[0012]
An EL device packaging method is also provided, which includes the following steps. That is,
Providing a glass substrate provided with a plurality of EL devices in a controlled environment of water and oxygen, and a glass cover corresponding to the glass substrate;
In an environment where water and oxygen are controlled, a frame resin is applied to a plurality of edge frame positions on the glass substrate, the edge frame positions correspond to the EL devices on a one-to-one basis, and openings are provided in the frame resins. The process of
In an environment in which water and oxygen are controlled, the frame resin is positioned between the glass cover and the glass substrate, the glass cover and the glass substrate are pressure-bonded, and the EL device is disposed between the glass cover and the glass substrate. The step of positioning in
Curing these frame resins in a controlled environment of water and oxygen,
A process of cutting the glass cover and the glass substrate according to the distribution of these EL devices in a controlled environment of water and oxygen;
In an environment in which water and oxygen are controlled, each EL device is divided by a glass cover and glass substrate cutting method to form a plurality of independent package devices. Each package device includes a device glass substrate and these EL devices. One of the frame resin and the apparatus glass cover, and forming a cavity in the apparatus glass cover, the apparatus glass substrate and one of the frame resins,
A vacuum chamber is provided, a resin groove is disposed at the bottom of the vacuum chamber, a package material is placed in the resin groove, the package device is placed in the vacuum chamber, and the opening of each package device is formed in the resin groove. Directing and preventing these packaging devices from coming into contact with the packaging material,
A process of depressurizing the vacuum chamber to deaerate the package device and the package material;
A step of immersing these package devices in a resin groove when the vacuum chamber reaches a set vacuum degree, and injecting the resin by bringing the package material into contact with the opening of each package device;
The vacuum chamber pressure is increased to a set pressure, the package material is injected through the opening of the package device, and the cavity is filled, the device package material is completely covered with the EL device, and each device package material is cured. Process.
[0013]
In addition, a packaging method for an organic EL device is provided.
Providing a transparent substrate and forming a plurality of organic EL devices on the transparent substrate, a plastic package thin plate, and forming a plurality of adhesive layers on the plastic package thin plate And a process of
Forming a plurality of hole regions on the plastic package thin plate, and forming a plastic package thin plate including the hole regions as a package can, and forming a package can including the hole region therein; and package can One side having an adhesive layer on a plastic thin plate on one side is bonded to one side having an organic EL device on the transparent substrate, and the adhesive layer is dried and cured by thermal energy or ultraviolet curing method to package A package body joining step for forming a can and completely isolating the organic EL device inside the package can from the outside;
It has.
[0014]
In summary, all of the conventional packaging methods are on an indium tin oxide (ITO) glass substrate and utilize vacuum evaporation deposition technology, and the organic light-emitting layer thin film and metal electrode (cathode) wiring thin film are continuous. After the film is formed and inspected, a package resin is applied around the package can (package cover) to provide an internal moisture absorbing material, and then the package resin is dried and cured by thermal energy or ultraviolet curing to form a package cover and a substrate. And the organic EL device is packaged in the package cover and the substrate described above, so that the package resin blocks external moisture and oxygen gas from entering the inside of the package cover, and the hygroscopic material absorbs the inside of the package cover and the substrate. The moisture and oxygen gas are absorbed, and the effect of moisture prevention oxygen prevention is achieved.
[0015]
However, the above-described packaging method using the package cover, the package resin, and the hygroscopic material can isolate the photoelectric device from the erosion of moisture. The package method having a typical package cover cannot cope with the flexible design of the product, and the lifetime of the device is affected by the concentration of the stress of the photoelectric device. Therefore, there is a need for improvements in current optoelectronic device packages.
[0016]
[Problems to be solved by the invention]
The main object of the present invention is to solve the above-mentioned drawbacks of the prior art and to eliminate the existence of the defects. That is, the present invention provides a package layer material composed of a polymer material mixed with a nanometer inorganic material. By directly applying to the surface of the electronic device to be packaged, it replaces the package cover and internal moisture absorbent in the traditional packaging system, eliminates the cost and process problems of the package resin around the package cover, After the cover is bent, stress concentration occurs in the electronic device to form peeling and rupture of the package cover, thereby solving the disadvantage that affects the life of the package.
[0017]
[Means for Solving the Problems]
The invention of claim 1 is the electronic device packaging method,
a) producing nanometer inorganic materials and polymer materials;
b) Mixing the nanometer inorganic material described above and the polymer material described above to produce an uncured package layer material (20) and controlling the viscosity of the package layer material (20) between 5000 cps (centipoise) and 50000 cps. The process of
c) providing an electronic device for packaging;
d) uniformly applying the above-described uncured package layer material (20) to a portion of the above-described electronic device package where the package is required;
e) curing the package layer material (20) described above to complete the package of the electronic device;
The electronic device packaging method is characterized by comprising the above steps.
According to a second aspect of the present invention, in the electronic device packaging method according to the first aspect, the nanometer inorganic material is any one of iron, aluminum, titanium, platinum, magnesium, silver, chromium, silicon dioxide, titanium dioxide, and zinc dioxide. The electronic device packaging method is characterized by being composed of one kind of material.
According to a third aspect of the invention, there is provided the electronic device packaging method according to the first aspect, wherein the granule size of the nanometer inorganic material is between 1 nm and 100 nm.
According to a fourth aspect of the present invention, in the electronic device packaging method according to the first aspect, the polymer material is an epoxy resin, an acrylic resin, a urethane resin, an epoxy resin / acrylic resin mixed polymer, an acrylic resin / urethane resin mixed height. The electronic device packaging method is characterized by being composed of any one of a molecule, a silicone resin, a silioxane resin, and an organic / inorganic copolymer (Organic / Inorganic).
According to a fifth aspect of the present invention, there is provided the electronic device packaging method according to the first aspect, wherein the package layer material (20) in the step b is an optimum mixing ratio of the substance after the moisture permeability test of the bare material (Bare material). The electronic device packaging method is characterized in that is selected.
According to a sixth aspect of the present invention, there is provided the electronic device packaging method according to the first aspect, wherein a chain of chemical bonds is formed between the nanometer inorganic material and the polymer material. .
According to a seventh aspect of the present invention, in the electronic device packaging method according to the first aspect of the present invention, a bond chain of Van der Waals bonds is formed between the nanometer inorganic material and the polymer material. The electronic device packaging method is characterized.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
In the electronic device packaging method of the present invention, a nanometer inorganic material and a polymer material are mixed to form an uncured package layer, which is uniformly applied to the electronic device to be packaged. An isolation layer having a dense structure is generated between the molecular materials to enhance the moisture prevention air prevention effect of the electronic device.
[0019]
【Example】
FIG. 1 is a flowchart of a packaging method according to the present invention. As shown in the figure, the packaging method for an electronic device according to the present invention includes the following steps. That is,
a) producing nanometer inorganic materials and polymer materials;
b) Mixing the above-mentioned nanometer inorganic material and the above-mentioned polymer material to produce an uncured package layer material (20), selecting the optimum mixing ratio after the moisture permeability test of the bare material (Bare material), and Controlling the viscosity of the package layer material (20) between 5000 cps (centipoise) and 50000 cps as compared to other materials;
c) providing an electronic device for packaging;
d) uniformly applying the above-described uncured package layer material (20) to a portion of the above-described electronic device package where the package is required;
e) curing the package layer material (20) described above to complete the package of the electronic device.
[0020]
The nanometer inorganic material is composed of any one of iron, aluminum, titanium, platinum, magnesium, silver, chromium, silicon dioxide, titanium dioxide, and zinc dioxide, and the granule size of the nanometer inorganic material is 1 nm to 100 nm. Between.
[0021]
The polymer material includes epoxy resin, acrylic resin, urethane resin, epoxy resin / acrylic resin mixed polymer, acrylic resin / urethane resin mixed polymer, silicone resin, silioxane resin, organic / inorganic copolymer (Organic). / Inorganic).
[0022]
In addition, a chain of chemical bonds or a chain of van der Waals bonds is formed between the nanometer inorganic material and the polymer material.
[0023]
2 and 3 are diagrams showing the implementation of the present invention. As shown, the electronic device 10 of the present invention is an organic EL device 10, and the package layer material 20 is composed of a nanometer inorganic material and a polymer material. Yes.
[0024]
The organic EL device 10 includes a substrate 11, a patterned anode conductive layer 12 and a cathode isolation layer 13 are disposed on the substrate 11, organic light emitting layers 14 and 14 ′ are further disposed, and an organic light emitting layer is further disposed. Cathode conductive layers 15, 15 ′ are formed on 14, 14 ′, and the organic light emitting layer 14 is sandwiched between the formed cathode conductive layer 15 and the anode conductive layer 12 on the substrate 11.
[0025]
Subsequently, a package layer material 20 composed of a nanometer inorganic material and a polymer material and having a viscosity controlled between 5000 cps and 50000 cps is directly applied on the organic EL device 10, and after curing of the package layer material 20, the nanometer A separation layer having a dense structure is generated between the inorganic material and the polymer material, and the moisture and air prevention effect of the organic EL device 10 is enhanced. Therefore, the present invention is effectively employed in place of the conventional package cover and the internal moisture absorbing material, and the problem of the package resin around the package cover or peeling of the package cover due to stress concentration generated in the apparatus after the conventional package cover is bent and Eliminates the problem of bursting affecting the service life of the device.
[0026]
FIG. 4 shows another embodiment of the present invention and is a liquid crystal display package display diagram. As shown in the figure, the basic components of the liquid crystal display include two transparent substrates 31, 31 ', a liquid crystal alignment device 36 including a liquid crystal layer sandwiched between the two transparent substrates 31, 31', Polarizing plates 32 and 33 disposed on the transparent substrates 31 and 31 ′, a light guide plate 34 and a backlight module 35 disposed in order on one of the polarizing plates 33. In order to protect the liquid crystal aligning device 36 between the two transparent substrates 31 and 31 ′, the package layer material 37 of the present invention is used on the outer periphery of the liquid crystal aligning device 36 between the two transparent substrates 31 and 31 ′. Thus, the relative positions of the two transparent substrates 31 and 31 ′ are fixed to each other, and the moisture and air prevention effect of the present invention is achieved.
[0027]
FIG. 5 is an example display diagram of the thin film battery package of the present invention. As shown in the figure, the thin film battery is a thin film version of a lithium battery, and its basic constituent elements are a substrate 40, a cathode 41 and an anode 42 provided in two positions and provided for external connection and conduction, A cathode layer 43 disposed on the cathode 41, a solid electrolyte 44 disposed on the cathode layer 43 and connected to the anode 42, and an anode layer 45 disposed on the electrolyte 44 and covering the anode 42; Finally, the package layer material 46 of the present invention covers the top layer. However, the cathode 41 and the anode 42 are exposed to the outside so that they can be used conveniently.
[0028]
The application areas of these small-capacity thin film batteries are power sources for memory devices, power sources for non-contact type ICs, and power sources for micro-electric devices. The feature of the above-mentioned product is that it is lightweight and thin. In general, thin film batteries have good moisture and air prevention effects, but at the expense of light design or at the expense of waterproofness to make the design light. However, by applying the packaging method of the present invention, a package that is light and compact and prevents moisture and air from being produced in the packaging process is provided.
[0029]
【The invention's effect】
In summary, the present invention uses a package layer material 20 formed by mixing a nanometer inorganic material and a polymer material, which is characterized by operating a full surface electronic device coating package, and a flexible and non-flexible organic EL device 10. On the other hand, it is used in place of the conventional package cover and the internal moisture absorbing material to reliably achieve the effect of preventing moisture and air of the electronic device, and its operation range is wide as follows.
(1) Industrial manufacturing categories in which the present invention can be operated are as follows:
1. 1. Glass substrate organic EL display, polymer organic EL display and flexible organic EL display 2. Integrated circuit package 3. Other electronic device packages 4. Inorganic EL display package Thin film EL display package6. 6. Liquid crystal display package 7. Solar battery, solar battery power generation system, amorphous thin film battery, single crystal and polycrystalline thin film battery package and high efficiency light transmissive protective layer Operation for corrosion prevention of other various industries (2) Merits of using the present invention:
1. The package effect on the device can be enhanced and its lifetime can be increased.
2. It can be applied to packages of many different types of industrial products, and its application range is wide.
3. When used in a flexible organic EL device, it can be applied to both the front and back of the device to prevent moisture and air.
4). When used in a thin film battery package, exposed cathodes or other stacks can be prevented from coming into contact with the outside environment and causing corrosion or oxidation, thereby enhancing the packaging effect of the device and increasing the lifetime.
5. The volume and thickness of the packaging device can be reduced.
6). The cost and time of the manufacturing process can be reduced.
[Brief description of the drawings]
FIG. 1 is a flowchart of a packaging method of the present invention.
FIG. 2 is a package implementation display diagram of an organic light emitting diode according to the present invention.
FIG. 3 is a package implementation display diagram of the organic light emitting diode of the present invention.
FIG. 4 is an implementation display diagram of the liquid crystal display package of the present invention.
FIG. 5 is an implementation display diagram of the thin film battery package of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Organic EL apparatus 20 Package layer material 11 Substrate 12 Anode conductive layer 13 Cathode isolation layers 14 and 14 ′ Organic light emitting layers 15 and 15 ′ Cathode conductive layers 31 and 31 ′ Transparent substrate 36 Liquid crystal alignment devices 32 and 33 Polarizing plate 34 Light guide plate 35 Backlight module 37 Package layer material 40 Substrate 41 Cathode 42 Anode 43 Cathode layer 44 Electrolyte 45 Anode layer 46 Package layer material

Claims (7)

In the electronic device packaging method,
a) producing nanometer inorganic materials and polymer materials;
b) Mixing the nanometer inorganic material described above and the polymer material described above to produce an uncured package layer material (20) and controlling the viscosity of the package layer material (20) between 5000 cps (centipoise) and 50000 cps. The process of
c) providing an electronic device for packaging;
d) uniformly applying the above-described uncured package layer material (20) to a portion of the above-described electronic device package where the package is required;
e) curing the package layer material (20) described above to complete the package of the electronic device;
An electronic device packaging method comprising the steps described above. 2. The electronic device packaging method according to claim 1, wherein the nanometer inorganic material is composed of any one of iron, aluminum, titanium, platinum, magnesium, silver, chromium, silicon dioxide, titanium dioxide, and zinc dioxide. A method for packaging an electronic device, comprising: 2. The electronic device packaging method according to claim 1, wherein the nanometer inorganic material has a granule size of 1 nm to 100 nm. The electronic device packaging method according to claim 1, wherein the polymer material is an epoxy resin, an acrylic resin, a urethane resin, an epoxy resin / acrylic resin mixed polymer, an acrylic resin / urethane resin mixed polymer, a silicone resin, or a siloxane resin. A method of packaging an electronic device, characterized in that it is composed of any one of (Silioxane) and organic / inorganic copolymer (Organic / Inorganic). 2. The method of packaging an electronic device according to claim 1, wherein an optimum mixing ratio of the substance is selected after the air permeability characteristic test of the bare material (Bare material) as the package layer material (20) in the step b. An electronic device packaging method. The electronic device packaging method according to claim 1, wherein a chain of chemical bonds is formed between the nanometer inorganic material and the polymer material. 2. The electronic device packaging method according to claim 1, wherein a bond chain of van der Waals bonds is formed between the nanometer inorganic material and the polymer material. Method.

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