JP2005005429A - Opposite vibrating flow type cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an opposite vibrating flow type cooling device in which a cooling capacity is improved. <P>SOLUTION: A vibrator 6 is arranged at a site displaced from a cooling air flow. Consequently, the vibrator 6 does not obstruct the cooling air flow passing through a heat sink 5. Accordingly, since the heat sink 5 can be supplied with the cooling air in a sufficient quantity, a temperature on the low-temperature side of a heat-transport device body 2 can be cooled sufficiently, and the cooling capacity of the opposite vibrating flow type cooling device is improved. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cooling device using a counter-vibration flow type heat transport device that heat-exchanges between adjacent flow paths by causing the fluid to vibrate in adjacent flow paths and transports heat from the high temperature side to the low temperature side. Therefore, it is effective when applied to a pseudo super heat conduction plate, a thermal switch, a thermal diode, and the like.
[0002]
[Prior art]
The counter oscillating flow type heat transport device uses a diffusion promoting effect by the oscillating flow, and its principle is as follows.
[0003]
That is, as shown in FIG. 5, consider the case where there is a liquid in the circular tube and the temperature is distributed. Now, for the sake of simplicity, let us consider a rectangular wave vibration in which the liquid vibration stays at the H point for a half cycle, immediately moves to the L point, stays there for a half cycle, and then immediately returns to the H point.
[0004]
Considering the liquid portion at point C when there is no vibration (this is called an element), when this element moves to point H due to vibration, the temperature of the circular tube wall at point H is higher than the element. Gets heat from the wall. When the element moves to the point L due to vibration, the temperature of the wall at the point L is lower than the element, so the element exhales heat to the wall.
[0005]
In other words, the heat has moved from the H point to the L point like a “flying fly” by one vibration. Such “flying” does not occur when there is no vibration, but is additionally caused by vibration. Therefore, if the frequency increases, the number of “flying jumps” that occur per unit time increases, and if the amplitude increases, the “flying jump” distance increases. (See, for example, Patent Document 1).
[0006]
[Patent Document 1]
Japanese Patent Laid-Open No. 2002-364991
[Problems to be solved by the invention]
Incidentally, FIG. 4 is an external perspective view of the counter-vibration flow type cooling device 1 that the inventors have made as a prototype based on the invention described in Patent Document 1.
[0008]
The counter oscillating flow type cooling device 1 is disposed at a substantially central portion in the longitudinal direction of the plate surface of the heat transport device body 2 and the heat transport device body 2 in which fluid is filled in the meandering flow path inside. The heat generating body 4, the heat transport device main body 2, and the heat sink 5 joined to the opposite side of the plate surface on which the heat generating body 4 is assembled, the vibration device 6 that vibrates the fluid in the heat transport device main body 2, and the like. Yes.
[0009]
However, in the prototype product shown in FIG. 4, the vibration device 6 is disposed in the cooling air passage that passes through the heat sink 5, so that the cooling air flow is obstructed by the vibration device 6, and the heating element 4 is sufficiently removed. It cannot be cooled.
[0010]
In view of the above, the present invention firstly provides a novel counter oscillating flow type cooling device that is different from the conventional one, and secondly, it aims to increase the cooling capacity of the counter oscillating flow type cooling device. .
[0011]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, in the invention according to claim 1, heat is exchanged between the adjacent flow paths (3) by causing the fluid to vibrate oppositely in the adjacent flow paths (3). Is a cooling device using a counter oscillating flow type heat transport device that transports the heat from the high temperature side to the low temperature side, the heat transport device body (2) provided with the flow path (3), and the low temperature side, A heat sink (5) that dissipates heat transported from the side and a vibration device (6) that vibrates the fluid in the flow path (3) are provided, and the vibration device (6) is supplied to the heat sink (5). It arrange | positions in the site | part which shifted | deviated from the flow of the cooling fluid, It is characterized by the above-mentioned.
[0012]
Thereby, the vibration device (6) does not hinder the flow of the cooling fluid passing through the heat sink (5).
[0013]
Accordingly, since a sufficient amount of cooling fluid can be supplied to the heat sink (5), the temperature on the low temperature side of the heat transport device body (2) can be sufficiently cooled, and Increase cooling capacity.
[0014]
In the invention according to claim 2, the heat sink (5) has a plurality of heat radiation fins (5a) formed in a plate shape, and the plate surface of the heat radiation fin (5a) It is characterized by being substantially parallel to the flow direction of the cooling fluid.
[0015]
In the invention according to claim 3, the flow path (3) includes a multi-hole tube (2a), a multi-hole tube (2a) provided with a plurality of holes (2f) penetrating from one end side to the other end side in the longitudinal direction. ) Are joined to the first plate (2b, 2c) and the first plate (2b, 2c) provided with through holes (2g) for communicating adjacent holes (2f). The second plate (2d, 2e) closes the through hole (2g).
[0016]
Incidentally, the reference numerals in parentheses of each means described above are an example showing the correspondence with the specific means described in the embodiments described later.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
In this embodiment, the present invention is applied to a cooling device for electronic components. FIG. 1 is an external perspective view of a counter oscillating flow type cooling device 1 according to this embodiment, and FIGS. It is a figure which shows the principal part of the opposing vibration flow type cooling device 1 which concerns on a form.
[0018]
In FIG. 1, a heat transport device main body 2 is a substantially strip-shaped member in which a fluid is filled in a meandering flow path 3 (see FIG. 3). A heating element 4 that forms an object, that is, a heat source, is assembled. The structure of the heat transport device body 2 will be described later.
[0019]
Incidentally, in the present embodiment, the heating element 4 is assumed to be an electronic component such as an integrated circuit for an electronic computer.
[0020]
Moreover, in order to dissipate the heat | fever transported from the heat generating body 4 which is a high temperature side to the air | atmosphere which is a low temperature side in the board surface on the opposite side to the board surface in which the heat generating body 4 was assembled | attached among the heat transport device main bodies 2. The heat sink 5 having a plurality of radiating fins 5a formed in a thin plate shape is joined, and the heat sink 5 is heated so that the plate surface of the radiating fins 5a is substantially parallel to the cooling air flow. It is joined to the transport device body 2.
[0021]
The vibration device 6 is a pump unit that vibrates the fluid in the heat transport device body 2, and this vibration device 6 is displaced from the heat sink 5 in a direction deviated from the cooling air flow, that is, in a direction orthogonal to the plate surface of the radiation fin 5a. It is arranged at the site.
[0022]
In this embodiment, water is used as the fluid filled in the flow path 3, but it is needless to say that water mixed with an additive that lowers the viscosity may be used.
[0023]
Next, the heat transport device body 2 will be described with reference to FIGS.
[0024]
The heat transport device main body 2 is formed by joining a multi-hole tube 2a made of a metal material having high thermal conductivity such as copper or aluminum and first and second plates 2b to 2e to brazing.
[0025]
Note that “brazing” refers to a technique for joining so as not to melt the base material using brazing material or solder, as described in, for example, “connection / joining technology” (Tokyo Denki University Press). . Incidentally, when joining using a filler material having a melting point of 450 ° C. or higher is called brazing, the filler material at that time is called brazing material, and when joining using a filler material having a melting point of 450 ° C. or less. Is referred to as soldering, and the filler material at that time is referred to as solder. And the multi-hole tube 2a is a flat tube formed by extrusion or drawing, and the inside thereof is from one end in the longitudinal direction. A plurality of holes 2f penetrating to the other end side are provided simultaneously with the molding.
[0026]
The first plates 2b and 2c are provided with through holes 2g for communicating adjacent holes 2f. The first plates 2b and 2c are covered with a filler material (brazing material) on both front and back surfaces. The clad material is manufactured by pressing.
[0027]
The second plates 2d and 2e close the through hole 2g, and in this embodiment, are manufactured by pressing a non-cladding material.
[0028]
Then, the multi-hole tube 2a and the first and second plates 2b to 2e are sandwiched between the second plates 2d and 2e and the multi-hole tube 2a at both longitudinal ends of the multi-hole tube 2a. By joining, the heat transport device body 2 having the meandering flow path 3 is formed.
[0029]
In the present embodiment, since the vibration device 6 is connected to the left side of the drawing, a connection pipe portion 6a for connecting the vibration device 6 and the heat transport device body 2 is joined to the second plate 2e.
[0030]
Next, a schematic operation of the counter oscillating flow type cooling device heat 1 according to the present embodiment will be described.
[0031]
When the fluid in the flow path 3 (heat transport device main body 2) is vibrated by the vibration device 6, heat is exchanged between the fluids existing in the adjacent flow paths 3, and is arranged at a substantially central portion in the longitudinal direction of the heat transport device main body 2. The heat of the generated heating element 4 is transported toward the longitudinal end portion side of the heat transport device body 2 and spreads over the entire heat transport device body 2.
[0032]
Then, the heat spread over the entire heat transport device body 2 is released into the atmosphere through the heat sink 5.
[0033]
Next, the function and effect of this embodiment will be described.
[0034]
In the present embodiment, since the vibration device 6 is arranged at a position deviated from the cooling air flow, the vibration device 6 does not hinder the cooling air flow passing through the heat sink 5.
[0035]
Therefore, since a sufficient amount of cooling air can be supplied to the heat sink 5, the temperature on the low temperature side of the heat transport device body 2 can be sufficiently cooled, and the cooling capacity of the counter oscillating flow type cooling device is enhanced. The
[0036]
(Other embodiments)
In the above-described embodiment, the multi-hole tube 2a in which a plurality of holes 2f penetrating from one end side to the other end side in the longitudinal direction is formed, and the through-hole 2g in which the through-hole 2g for connecting adjacent holes 2f is provided. The heat transport device main body 2 having the meandering flow path 3 is configured by joining the second plates 2d and 2e that close the plate, but the present invention is not limited to this, for example, etching on a metal plate Alternatively, the meandering flow path 3 may be formed.
[0037]
Moreover, the shape of the flow path 3 is not limited to the meandering shape shown in FIG.
[0038]
In addition, the present invention is characterized in that the vibration device 6 is disposed at a position deviated from the cooling air flow. For example, the vibration device 6 is disposed on the opposite side of the heat sink 5 with the heat transport device body 2 interposed therebetween. May be.
[Brief description of the drawings]
FIG. 1 is an external perspective view of a counter oscillating flow cooling device according to an embodiment of the present invention.
FIG. 2 is a diagram showing a main part of the counter oscillating flow type cooling device according to the first embodiment of the present invention.
FIG. 3 is a view showing a main part of the counter oscillating flow type cooling and feeding device according to the first embodiment of the present invention. FIG. 4 is an external perspective view of the counter oscillating flow cooling device according to the prior art.
FIG. 5 is an operation explanatory diagram of an opposed oscillating flow type heat transport device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Opposite oscillating flow type cooling device, 2 ... Heat transport device main body, 3 ... Flow path,
4 ... heating element (CPU), 5 ... heat sink, 6 ... vibration device.

Claims (3)

Cooling using a counter oscillating flow type heat transport device that exchanges heat between adjacent flow paths (3) by vibrating the fluid in adjacent flow paths (3) and transports heat from the high temperature side to the low temperature side. A device,
A heat transport device body (2) provided with the flow path (3);
A heat sink (5) provided on the low temperature side and dissipating heat transported from the high temperature side;
A vibration device (6) for vibrating the fluid in the flow path (3),
The counter oscillating flow type cooling device, wherein the vibration device (6) is disposed at a position deviated from the flow of the cooling fluid supplied to the heat sink (5). The heat sink (5) has a plurality of heat dissipating fins (5a) formed in a plate shape,
Furthermore, the plate surface of the said radiation fin (5a) is substantially parallel to the distribution direction of the said cooling fluid, The counter oscillation flow type cooling device characterized by the above-mentioned. The flow path (3) includes a multi-hole tube (2a) provided with a plurality of holes (2f) penetrating from one end side to the other end side in the longitudinal direction, and a longitudinal end portion of the multi-hole tube (2a). Joined to the first plate (2b, 2c) provided with a through hole (2g) for communicating adjacent holes (2f) and the first plate (2b, 2c), the through hole The counter-oscillating flow type cooling device according to claim 1, wherein the counter vibration flow type cooling device is configured by a second plate (2 d, 2 e) that closes (2 g).

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