JP2004521186A5 - - Google Patents

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JP2004521186A5
JP2004521186A5 JP2002520283A JP2002520283A JP2004521186A5 JP 2004521186 A5 JP2004521186 A5 JP 2004521186A5 JP 2002520283 A JP2002520283 A JP 2002520283A JP 2002520283 A JP2002520283 A JP 2002520283A JP 2004521186 A5 JP2004521186 A5 JP 2004521186A5
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workpiece
plating
mask
applying
additive
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Priority claimed from US09/740,701 external-priority patent/US6534116B2/en
Priority claimed from US09/919,788 external-priority patent/US6858121B2/en
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Priority claimed from PCT/US2001/024890 external-priority patent/WO2002015245A2/en
Publication of JP2004521186A publication Critical patent/JP2004521186A/en
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頂部とキャビティ部分を含む加工物の導電性頂部表面をめっきする方法であって、
前記加工物の前記導電性頂部表面上に少なくとも１種の添加物を含む電解液を適用し、第１の量の添加物が頂部上に吸着され、第２の量の添加物がキャビティ部分に吸着されるようになる工程、
前記頂部に外的影響を適用し、前記外的影響が前記加工物の前記頂部から前記頂部上にすでに吸着されている前記第１の量の添加物の一部を除去する工程、
前記頂部上に前記添加剤が完全に再吸着される前に前記加工物の前記導電性頂部表面をめっきし、それにより前記頂部に対してより大きいめっきを前記キャビティ部分に施す工程
を具備する方法。A method of plating a conductive top surface of a work piece including a top portion and a cavity portion, comprising:
Applying an electrolyte comprising at least one additive on the conductive top surface of the workpiece, a first amount of additive is adsorbed on the top, and a second amount of additive is applied to the cavity portion. The process of becoming adsorbed,
Applying an external influence to the top, removing a portion of the first amount of additive from which the external influence has already been adsorbed on the top;
Plating the conductive top surface of the workpiece before the additive is completely re-adsorbed on the top, thereby applying a larger plating to the cavity portion to the top. . 前記外的影響を適用する工程が、前記頂部上に吸着される前記第１の量の添加物を物理的に掃引するために前記加工物の前記導電性頂部表面上に適用される可動性マスクを用い、それによりある時間前記頂部上に吸着される前記添加物の量を減少させる請求項１記載の方法。  A movable mask wherein the step of applying the external effect is applied on the conductive top surface of the workpiece to physically sweep the first amount of additive adsorbed on the top. The method of claim 1 wherein the amount of additive adsorbed on the top for a period of time is reduced. 前記外的影響を適用する工程の前記可動性マスクが前記加工物の前記頂部と物理的接触する請求項２記載の方法。  The method of claim 2, wherein the movable mask of applying the external influence is in physical contact with the top of the workpiece. 前記可動性マスクにより前記外的影響を適用する工程が、前記外的影響にすでに供されてきた前記頂部の領域を、めっきの工程の間めっき電流が前記加工物の前記領域とアノードとの間に存在するように前記可動性マスクの開口領域と一致させる請求項３記載の方法。  The step of applying the external influence by the movable mask is a step in which the plating current is applied between the area of the workpiece and the anode during the plating process. 4. The method of claim 3, wherein the method matches the opening area of the movable mask so as to be present in the area. 前記めっき工程の間に、第１の電流密度を有する電流パルスが前記アノードと前記加工物の前記領域との間の前記可動性マスクの前記開口領域の中に形成され、前記第１の電流密度は、前記可動性マスクにより覆われる前記加工物のもう１つの領域に存在する第２の電流密度より大きい請求項４記載の方法。  During the plating step, a current pulse having a first current density is formed in the open region of the movable mask between the anode and the region of the workpiece, the first current density. 5. The method of claim 4, wherein is greater than a second current density present in another region of the workpiece covered by the movable mask. ある時間、複数の電流パルスが前記アノードと前記加工物の異なる領域との間に生成する請求項５記載の方法。  The method of claim 5, wherein over time, a plurality of current pulses are generated between the anode and different regions of the workpiece. 合計された前記複数の電流パルスが電源により提供されたＤＣ電流に等しい請求項６記載の方法。  The method of claim 6, wherein the summed current pulses are equal to a DC current provided by a power source. 前記めっき工程がめっきの間にＤＣ電力を提供する工程を含む請求項４記載の方法。  The method of claim 4, wherein the plating step includes providing DC power during plating. 前記ＤＣ電力を提供する工程が、めっき電流が実質的に一定に保たれる電流制御モードで行われる請求項８記載の方法。  The method of claim 8, wherein providing the DC power is performed in a current control mode in which the plating current is kept substantially constant. 前記ＤＣ電力を提供する工程がめっき電圧が実質的に一定に保たれる電圧制御モードで行われる請求項８記載の方法。  The method of claim 8, wherein the providing DC power is performed in a voltage control mode in which the plating voltage is kept substantially constant. 前記少なくとも１種の添加物が促進剤を含む請求項１記載の方法。  The method of claim 1, wherein the at least one additive comprises an accelerator. 前記めっき工程の間、より多くの添加物が前記頂部上よりも前記キャビティ部分上に吸着される請求項１１記載の方法。  The method of claim 11, wherein more additive is adsorbed on the cavity portion than on the top during the plating step. 前記めっき工程が、除去された前記第１の量の添加物の一部が完全に再吸着する前にのみ行われる請求項１２記載の方法。  The method of claim 12, wherein the plating step is performed only before a portion of the removed first amount of additive is completely resorbed. 前記外的影響とめっきを適用する工程が反復される請求項１２記載の方法。  The method of claim 12, wherein the step of applying external effects and plating is repeated. 前記少なくとも１種の添加物が、阻害剤と促進剤の両方を含む複数の添加物を含む請求項１記載の方法。  The method of claim 1, wherein the at least one additive comprises a plurality of additives including both an inhibitor and a promoter. 前記外的影響を適用する工程が、前記阻害剤が前記促進剤より強力な吸着特性を有する結果として、前記阻害剤より大きなパーセンテージの前記促進剤を除去する請求項１５記載の方法。  16. The method of claim 15, wherein applying the external effect removes a greater percentage of the promoter than the inhibitor as a result of the inhibitor having stronger adsorption properties than the promoter. 前記めっき工程が、除去された前記促進剤が前記頂部上に完全に再吸着する前にのみなされる請求項１６記載の方法。  The method of claim 16, wherein the plating step is only performed before the removed promoter is completely resorbed on the top. 前記外的影響およびめっきを適用する工程が反復される請求項１１記載の方法。  The method of claim 11, wherein the step of applying external effects and plating is repeated. 前記外的影響を適用する工程の後、前記阻害剤が、前記加工物の前記頂部上に前記促進剤より急速に再吸着する請求項１７記載の方法。  18. The method of claim 17, wherein after the step of applying the external influence, the inhibitor resorbs more rapidly than the promoter on the top of the workpiece. 前記めっき工程が、前記阻害剤が再吸着して後、除去された前記促進剤が前記頂部上に完全に再吸着する前になされる請求項１９記載の方法。  20. The method of claim 19, wherein the plating step is performed after the inhibitor is resorbed and before the removed promoter is completely resorbed on the top. 前記外的影響およびめっきを適用する工程が反復される請求項２０記載の方法。  21. The method of claim 20, wherein applying the external influence and plating is repeated. 前記めっき工程が、めっきの間にパルス電力を提供する工程を含む請求項１記載の方法。  The method of claim 1, wherein the plating step comprises providing pulsed power during plating. 前記めっき工程が、めっきの間にＤＣ電力を提供する工程を含む請求項１記載の方法。  The method of claim 1, wherein the plating step comprises providing DC power during plating. 前記めっき工程が、銅をめっきする請求項１記載の方法。  The method according to claim 1, wherein the plating step plating copper. 前記めっき工程が、銅合金をめっきする請求項１記載の方法。  The method according to claim 1, wherein the plating step plating a copper alloy. 前記頂部に前記外的影響を適用する工程が、前記頂部と前記キャビティ部分との間の表面抵抗の差を設ける請求項１記載の方法。  The method of claim 1, wherein applying the external influence to the top provides a difference in surface resistance between the top and the cavity portion. 前記外的影響を適用する工程が前記加工物の前記導電性頂部表面上に適用されるマスクを用い、前記マスクと前記加工物との間の相対的な動きが前記頂部上に吸着される前記第１の量の添加物の物理的な掃引を生じさせ、それによりある時間前記頂部上に吸着された前記添加物の量を減少させる請求項１記載の方法。  The step of applying the external influence uses a mask applied on the conductive top surface of the workpiece, and relative movement between the mask and the workpiece is adsorbed on the top. The method of claim 1, wherein a physical sweep of the first amount of additive occurs, thereby reducing the amount of additive adsorbed on the top for a period of time. 前記外的影響を適用する工程の前記可動性マスクが、前記加工物の前記頂部と物理的接触する請求項２７記載の方法。  28. The method of claim 27, wherein the movable mask of applying the external influence is in physical contact with the top of the workpiece. 前記可動性マスクにより前記外的影響を適用する工程が、前記外的影響にすでに供された前記頂部の領域を、前記めっき工程の間、めっき電流が前記加工物の開口領域とアノードとの間に存在するように前記可動性マスクの開口領域と一致させる請求項２７記載の方法。  The step of applying the external influence by means of the movable mask is to apply the area of the top already subjected to the external influence during the plating process, and the plating current is between the open area of the workpiece and the anode. 28. The method of claim 27, wherein the method is to coincide with an open area of the movable mask to be present in 前記添加物と前記加工物の前記表面との間の結合を緩和する働きをする前記電解質に別の添加物を加える工程をさらに含む請求項１記載の方法。  The method of claim 1, further comprising adding another additive to the electrolyte that serves to relax the bond between the additive and the surface of the workpiece. 頂部とキャビティ部分を含む加工物の導電性頂部表面をめっきする方法であって、
前記加工物の前記導電性頂部表面上に少なくとも１種の添加物を含む電解液を適用する工程、
前記少なくとも１種の添加物が前記頂部上より前記キャビティ部分上でより強くめっきされるような効果を作り出すように前記頂部に外的影響を適用する工程、
前記外的影響を適用する工程由来の効果が持続する間に前記加工物の前記導電性頂部表面をめっきする工程
を備える方法。A method of plating a conductive top surface of a work piece including a top portion and a cavity portion, comprising:
Applying an electrolyte comprising at least one additive on the conductive top surface of the workpiece;
Applying an external influence to the top so as to create an effect such that the at least one additive is more strongly plated on the cavity portion than on the top;
A method comprising plating the conductive top surface of the workpiece while an effect from the step of applying the external influence persists. 前記外的影響を適用する工程の効果が、前記キャビティ部分に対して前記頂部上に吸着される少なくとも１種の添加物の量の差を作り出す請求項３１記載の方法。  32. The method of claim 31, wherein the effect of applying the external influence creates a difference in the amount of at least one additive adsorbed on the top relative to the cavity portion. 前記外的影響を適用する工程が、前記頂部上に吸着される前記少なくとも１種の添加物の一部を物理的に掃引するために前記加工物の前記導電性頂部表面上に適用される、前記加工物に対して可動的であるマスクを用い、それによりある時間前記頂部上に吸着された前記添加物の量を減少させる請求項３１記載の方法。  Applying the external effect is applied on the conductive top surface of the workpiece to physically sweep a portion of the at least one additive adsorbed on the top; 32. The method of claim 31, wherein a mask that is movable relative to the workpiece is used, thereby reducing the amount of the additive adsorbed on the top for a period of time. 前記外的影響を適用する工程の前記マスクが前記加工物の前記頂部と物理的接触する請求項３３記載の方法。  34. The method of claim 33, wherein the mask of applying the external influence is in physical contact with the top of the workpiece. 前記マスクにより外的影響を適用する工程が、前記外的影響にすでに供された前記頂部の領域を、めっき工程の間、めっき電流が前記加工物の前記領域とアノードとの間に存在するように前記可動性マスクの開口領域と一致させる請求項３３記載の方法。  The step of applying an external influence by means of the mask causes the top area already subjected to the external influence to be present during the plating process, and a plating current is present between the area of the workpiece and the anode. 34. The method of claim 33, wherein the method matches an open area of the movable mask. めっき工程の間、第１の電流密度を有する電流パルスが前記アノードと前記加工物の前記領域との間の前記可動性マスクの前記開口領域の中に形成され、前記第１の電流密度は、前記可動性マスクにより覆われる前記加工物のもう１つの領域に存在する第２の電流密度より大きい請求項３５記載の方法。  During the plating process, a current pulse having a first current density is formed in the open region of the movable mask between the anode and the region of the workpiece, wherein the first current density is: 36. The method of claim 35, wherein the method is greater than a second current density present in another region of the workpiece covered by the movable mask. ある時間、複数の電流パルスが前記アノードと前記加工物の異なる領域との間で生成する請求項３６記載の方法。  38. The method of claim 36, wherein over a period of time, a plurality of current pulses are generated between the anode and different regions of the workpiece. 合計された前記複数の電流パルスが電源により提供されるＤＣ電流に等しい請求項３７記載の方法。  38. The method of claim 37, wherein the summed current pulses are equal to a DC current provided by a power source. 前記めっき工程が、めっきの間にＤＣ電力を提供する工程を含む請求項３５記載の方法。  36. The method of claim 35, wherein the plating step includes providing DC power during plating. 前記ＤＣ電力を提供する工程が、前記めっき電流が実質的に一定に保たれる電流制御モードで行われる請求項３９記載の方法。  40. The method of claim 39, wherein providing the DC power is performed in a current control mode in which the plating current is kept substantially constant. 前記ＤＣ電力を提供する工程が、めっき電圧が実質的に一定に保たれる電圧制御モードで行われる請求項３９記載の方法。  40. The method of claim 39, wherein providing the DC power is performed in a voltage control mode in which the plating voltage is kept substantially constant. 前記少なくとも１種の添加物が促進剤を含む請求項３１記載の方法。  32. The method of claim 31, wherein the at least one additive comprises an accelerator. 前記めっき工程の間、より多くの添加物が、前記頂部よりも前記キャビティ部分上に吸着する請求項４３記載の方法。  44. The method of claim 43, wherein more additive is adsorbed onto the cavity portion than the top during the plating step. 前記めっき工程が、前記効果が存続する間に行われる請求項４３記載の方法。  44. The method of claim 43, wherein the plating step is performed while the effect persists. 前記めっき工程が、前記効果が存続する間のみ行われる請求項４４記載の方法。  45. The method of claim 44, wherein the plating step is performed only for the duration of the effect. 前記外的影響を適用する工程の効果が、前記キャビティ部分上に吸着される前記少なくとも１種の添加物の第２の量に対する前記頂部上に吸着される少なくとも１種の添加物の第１の量との間の差を作り出すことにある請求項３４記載の方法。  The effect of applying the external influence is a first of at least one additive adsorbed on the top relative to a second amount of the at least one additive adsorbed on the cavity portion. 35. The method of claim 34, wherein the method is to create a difference between the quantities. 前記少なくとも１種の添加物が、阻害剤と促進剤の両方を含む複数の添加剤を含む請求項４６記載の方法。  47. The method of claim 46, wherein the at least one additive comprises a plurality of additives including both inhibitors and accelerators. 前記外的影響を適用する工程の後、前記阻害剤が前記促進剤より強力な吸着特性を有する結果として差が存在する請求項４７記載の方法。  48. The method of claim 47, wherein after the step of applying the external influence, a difference exists as a result of the inhibitor having stronger adsorption properties than the promoter. 前記外的影響を適用する工程の後、前記阻害剤が前記促進剤より高速の吸着動力学を有する結果として差が存在する請求項４７記載の方法。  48. The method of claim 47, wherein after the step of applying the external influence, a difference exists as a result of the inhibitor having a faster adsorption kinetics than the promoter. 前記外的影響とめっきを適用する工程が反復される請求項４４記載の方法。  45. The method of claim 44, wherein the step of applying external effects and plating is repeated. 前記外的影響を適用する工程の効果が、前記キャビティ部分に対して前記頂部上に吸着される少なくとも１種の添加物の量の差を作り出すことである請求項３１記載の方法。  32. The method of claim 31, wherein the effect of applying the external influence is to create a difference in the amount of at least one additive adsorbed on the top relative to the cavity portion. 前記少なくとも１種の添加物が、阻害剤と促進剤の両方を含む複数の添加物を含む請求項５１記載の方法。  52. The method of claim 51, wherein the at least one additive comprises a plurality of additives comprising both an inhibitor and a promoter. 前記外的影響を適用する工程の後、前記阻害剤が前記促進剤より強力な吸着特性を有する結果として差が存在する請求項５２記載の方法。  53. The method of claim 52, wherein after the step of applying the external influence, there is a difference as a result of the inhibitor having stronger adsorption properties than the promoter. 前記外的影響を適用する工程の後、前記阻害剤が前記促進剤より高速の吸着動力学を有する結果として差が存在する請求項５２記載の方法。  53. The method of claim 52, wherein after the step of applying the external effect, there is a difference as a result of the inhibitor having a faster adsorption kinetics than the promoter. 前記外的影響およびめっきを適用する工程が反復される請求項３１記載の方法。  32. The method of claim 31, wherein the step of applying external effects and plating is repeated. 前記外的影響を適用する工程がマスクを用い、前記マスクと前記加工物との間の相対的な動きが前記頂部上に吸着された前記少なくとも１種の添加物の一部の物理的掃引を引き起こし、それによりある時間前記頂部上に吸着された前記添加物の量を減少させる請求項３１記載の方法。  The step of applying the external influence uses a mask, and relative movement between the mask and the workpiece causes a physical sweep of a portion of the at least one additive adsorbed on the top. 32. The method of claim 31, wherein causing and thereby reducing the amount of the additive adsorbed on the top for a period of time. 前記外的影響を適用する工程の前記マスクが、前記加工物の前記頂部と物理的接触する請求項５６記載の方法。  57. The method of claim 56, wherein the mask of applying the external influence is in physical contact with the top of the workpiece. 前記マスクにより前記外的影響を適用する工程が、前記外的影響にすでに供された前記頂部の領域を、めっき工程の間、めっき電流が前記加工物の前記領域とアノードとの間に作り出されるように前記可動的マスクの開口領域と一致させる請求項５６記載の方法。  Applying the external influence by the mask creates the top area already subjected to the external influence during the plating process, and a plating current is created between the area of the workpiece and the anode. 57. The method of claim 56, wherein the method matches the open area of the movable mask. 前記外的影響を適用する工程の効果が、前記キャビティ部分上に吸着される少なくとも１種の添加剤の第２の量に対する前記頂部上に吸着される少なくとも１種の添加物の第１の量との間の差を作り出すことである請求項５７記載の方法。  The effect of applying the external influence is that a first amount of at least one additive adsorbed on the top relative to a second amount of at least one additive adsorbed on the cavity portion. 58. The method of claim 57, wherein the method is to create a difference between 前記少なくとも１種の添加物が阻害剤と促進剤の両方を含む複数の添加物を含む請求項５９記載の方法。  60. The method of claim 59, wherein the at least one additive comprises a plurality of additives comprising both an inhibitor and a promoter. 前記外的影響を適用する工程の後、前記阻害剤が前期促進剤より強力な吸着特性を有する結果として差が存在する請求項６０記載の方法。  61. The method of claim 60, wherein after the step of applying the external effect, there is a difference as a result of the inhibitor having stronger adsorption properties than the pre-promoter. 前記外的影響を適用する工程の後、前記阻害剤が前記促進剤より高速の吸着動力学を有する結果として差が存在する請求項６０記載の方法。  61. The method of claim 60, wherein after the step of applying the external influence, there is a difference as a result of the inhibitor having a faster adsorption kinetics than the promoter. 前記めっき工程が、めっきの間パルス電力を提供する工程を含む請求項３１記載の方法。  32. The method of claim 31, wherein the plating step includes providing pulsed power during plating. 前記めっき工程がめっきの間ＤＣ電力を提供する工程を含む請求項３１記載の方法。  32. The method of claim 31, wherein the plating step includes providing DC power during plating. 前記めっき工程が銅をめっきする請求項３１記載の方法。  32. The method of claim 31, wherein the plating step plating copper. 前記めっき工程が銅合金をめっきする請求項３１記載の方法。  32. The method of claim 31, wherein the plating step plating a copper alloy. 前記頂部に前記外的影響を適用する工程が、前記頂部と前記キャビティ部分との間に表面抵抗の差を設ける請求項３１記載の方法。  32. The method of claim 31, wherein applying the external influence to the top provides a difference in surface resistance between the top and the cavity portion. 加工物の頂部表面上に存在する電解液中に存在する導電性物質で前記加工物の導電性頂部表面をめっきするための装置であって、前記加工物の前記導電性頂部表面は頂部とキャビティ部分を含み、その上に吸着された少なくとも１種の添加物を有し、
電力が印加され得るために用いられ、それにより、前記加工物の前記頂部表面との間に電界を作り出し、そして前記頂部表面にめっきを行わせるアノード、
前記アノードと前記加工物との間の前記加工物の前記頂部表面に近接して配置され、前記加工物との間の相対的な動きにより前記加工物の前記頂部上に吸着された前記少なくとも１種の添加物の一部を物理的に掃引ことが可能であり、それにより前記頂部上に吸着された前記添加物の量を減少させ、それにより時間に前記加工物の前記頂部上にめっきされる導電性物質の量を減少させるマスクを備える装置。An apparatus for plating a conductive top surface of a workpiece with a conductive material present in an electrolyte present on the top surface of the workpiece, the conductive top surface of the workpiece comprising a top and a cavity Having at least one additive comprising a portion and adsorbed thereon,
An anode that is used to allow power to be applied, thereby creating an electric field with the top surface of the workpiece and plating the top surface;
The at least one disposed adjacent to the top surface of the workpiece between the anode and the workpiece and adsorbed on the top of the workpiece by relative movement with the workpiece. A portion of the seed additive can be physically swept, thereby reducing the amount of the additive adsorbed on the top, and thereby being plated on the top of the workpiece over time. An apparatus comprising a mask that reduces the amount of conductive material. 前記マスクが、前記加工物の頂部と物理的接触するように位置する請求項６８記載の装置。  69. The apparatus of claim 68, wherein the mask is positioned in physical contact with the top of the workpiece. 前記マスクが絶縁体で作られている請求項６８記載の装置。  69. The apparatus of claim 68, wherein the mask is made of an insulator. 前記マスクが、前記電解液およびめっき電流が電力の付与の間にマスクの開口領域に対応する前記加工物の領域を通過し得る前記開口領域を含む請求項６８記載の装置。  69. The apparatus of claim 68, wherein the mask includes the open area through which the electrolyte and plating current can pass through the area of the workpiece corresponding to the open area of the mask during application of power. めっきの間にＤＣ電力を提供するＤＣ電源をさらに含む請求項７１記載の装置。  72. The apparatus of claim 71, further comprising a DC power source that provides DC power during plating. 第１の電流密度を有する電流パルスが前記アノードと前記加工物の前記領域との間の前記可動性マスクの前記開口領域の中に生成し、前記第１の電流密度が前記可動性マスクにより覆われていない前記加工物のもう１つの領域に存在する第２の電流密度より大きい請求項７２記載の装置。  A current pulse having a first current density is generated in the open region of the movable mask between the anode and the region of the workpiece, and the first current density is covered by the movable mask. 75. The apparatus of claim 72, wherein the apparatus is greater than a second current density present in another region of the unprocessed workpiece. ある時間、複数の電流パルスが前記アノードと前記加工物の異なる領域との間に生成する請求項７３記載の装置。  74. The apparatus of claim 73, wherein over a period of time, multiple current pulses are generated between the anode and different regions of the workpiece. 前記複数の電流パルスを合計すると、ＤＣ電源により提供されるＤＣ電流に等しい請求項７４記載の装置。  75. The apparatus of claim 74, wherein the plurality of current pulses are summed equal to a DC current provided by a DC power source. 前記マスクが前記加工物の前記頂部と物理的接触するように位置する請求項７１記載の装置。  72. The apparatus of claim 71, wherein the mask is positioned in physical contact with the top of the workpiece. 前記マスクが絶縁体を含む請求項７６記載の装置。  The apparatus of claim 76, wherein the mask comprises an insulator. 前記マスクが、前記頂部上に吸着される前記添加物の前記第１の部分の量を減少させる働きをし得る研磨剤を含む請求項７７記載の装置。  78. The apparatus of claim 77, wherein the mask includes an abrasive that can serve to reduce the amount of the first portion of the additive adsorbed on the top. 前記マスクと前記加工物との間の前記相対的な動きが直線的な動きをもたらす請求項６８記載の装置。  69. The apparatus of claim 68, wherein the relative movement between the mask and the workpiece results in a linear movement. 前記マスクと前記加工物との間の前記相対的な動きが往復する直線的な動きをもたらす請求項６８記載の装置。  69. The apparatus of claim 68, wherein the relative movement between the mask and the workpiece results in a reciprocating linear movement. 前記マスクと前記加工物との間の前記相対的な動きが環状の動きをもたらす請求項６８記載の装置。  69. The apparatus of claim 68, wherein the relative movement between the mask and the workpiece results in an annular movement. 前記マスクと前記加工物との間の前記相対的な動きが往復する環状の動きをもたらす請求項６８記載の装置。  69. The apparatus of claim 68, wherein the relative movement between the mask and the workpiece results in a reciprocating annular movement. 前記マスクが絶縁体を含む請求項６８記載の装置。  69. The apparatus of claim 68, wherein the mask comprises an insulator. 前記マスクが、前記頂部上に吸着される前記添加物の前記第１の部分の量を減少させる働きをし得る研磨剤を含む請求項８３記載の装置。  84. The apparatus of claim 83, wherein the mask includes an abrasive that can serve to reduce the amount of the first portion of the additive adsorbed on the top. 前記マスクが、電力の付与の間にマスクの開口領域に対応する前記加工物のある領域に前記電解液およびおよびめっき電流を通過させ得る前記開口領域を含む請求項８４記載の装置。  85. The apparatus of claim 84, wherein the mask includes the open area through which the electrolyte and plating current can pass through an area of the workpiece corresponding to the open area of the mask during application of power. 前記マスクが前記加工物の前記頂部と物理的接触するように位置する請求項８５記載の装置。  87. The apparatus of claim 85, wherein the mask is positioned in physical contact with the top of the workpiece. 前記マスクと前記加工物との間の前記相対的な動きが直線的な動きをもたらす請求項８６記載の装置。  87. The apparatus of claim 86, wherein the relative movement between the mask and the workpiece results in a linear movement. 前記マスクと前記加工物との間の前記相対的な動きが往復する直線的な動きをもたらす請求項８６記載の装置。  87. The apparatus of claim 86, wherein the relative movement between the mask and the workpiece results in a reciprocating linear movement. 前記マスクと前記加工物との間の前記相対的な動きが環状の動きをもたらす請求項８６記載の装置。  87. The apparatus of claim 86, wherein the relative movement between the mask and the workpiece results in an annular movement. 前記マスクと前記加工物との間の前記相対的な動きが往復する環状の動きをもたらす請求項８６記載の装置。  87. The apparatus of claim 86, wherein the relative movement between the mask and the workpiece results in a reciprocating annular movement. 前記マスクが前記加工物の前記頂部と物理的接触するように位置する請求項８６記載の装置。  87. The apparatus of claim 86, wherein the mask is positioned in physical contact with the top of the workpiece. めっきの間にパルス電力を提供するパルス電源をさらに含む請求項６８記載の装置。  69. The apparatus of claim 68, further comprising a pulse power supply that provides pulsed power during plating. ＤＣ電源をさらに含む請求項６８記載の装置。  69. The apparatus of claim 68, further comprising a DC power source. 前記ＤＣ電源が、前記めっき電流が実質的に一定に保たれる電流制御モードで起動する請求項９３記載の装置。  94. The apparatus of claim 93, wherein the DC power source is activated in a current control mode in which the plating current is kept substantially constant. 前記ＤＣ電力が、めっき電圧が実質的に一定に保たれる電圧制御モードで起動する請求項９３記載の装置。  94. The apparatus of claim 93, wherein the DC power is activated in a voltage control mode in which the plating voltage is kept substantially constant. 頂部とキャビティ部分を含む加工物の導電性頂部表面をめっきする方法であって、
前記加工物の前記導電性頂部表面上にめっきを強化するために少なくとも１種の添加物を有する電解液を適用する工程、
前記加工物の前記導電性頂部表面を初期めっきする工程、
前記初期めっき工程後、少なくとも１種の添加物が前記頂部上より前記キャビティ部分でのめっきを強化するような効果を作り出すために前記頂部に外的影響を適用する工程、
前記外的影響を適用する工程由来の効果が持続する間に前記加工物の前記導電性頂部表面をめっきしつづける工程
を備える方法。A method of plating a conductive top surface of a work piece including a top portion and a cavity portion, comprising:
Applying an electrolyte solution having at least one additive to enhance plating on the conductive top surface of the workpiece;
Initial plating the conductive top surface of the workpiece;
After the initial plating step, applying an external influence on the top to create an effect such that at least one additive enhances plating in the cavity portion over the top;
A method comprising the step of continuing to plate the conductive top surface of the workpiece while the effect from the step of applying the external influence persists. 前記頂部表面を初期めっきする工程が、ある種の小さなフィーチャーのキャビティ部分が充填されるようにする請求項９６記載の方法。  99. The method of claim 96, wherein the initial plating of the top surface causes a cavity portion of certain small features to be filled. 頂部とキャビティ部分を含む加工物の導電性頂部表面をめっきする方法であって、
前記加工物の前記導電性頂部表面上に、少なくとも１種の添加物を含む電解液を適用し、前記添加物の第１の成分は前記頂部上に吸着されるようになり、前記添加物の第２の部分は、前記キャビティ部分上に吸着されるようになる工程、
前記加工物の前記頂部に対して離間関係でマスクを適用し、間接的外的影響を通して前記頂部上にすでに吸着された前記添加物の前記第１の成分の一部を前記加工物の前記頂部から除去するために前記加工物に対してマスクを動かす工程、および
前記添加物が前記頂部上に完全に再吸着する前に、かつ、前記マスクが前記加工物の前記頂部に少なくとも離間関係で維持される間に、前記加工物の前記導電性頂部表面をめっきし、それにより、前記頂部に対して前記キャビティ部分に、より大きいめっきを行う工程
を備える方法。A method of plating a conductive top surface of a work piece including a top portion and a cavity portion, comprising:
Applying an electrolyte containing at least one additive on the conductive top surface of the workpiece, the first component of the additive becomes adsorbed on the top, and The second portion becomes adsorbed onto the cavity portion;
Applying a mask in spaced relation to the top of the workpiece to remove a portion of the first component of the additive already adsorbed on the top through indirect external influences on the top of the workpiece Moving the mask relative to the workpiece to remove from the substrate, and before the additive is completely resorbed on the top, and the mask is maintained at least in spaced relation to the top of the workpiece In the meantime, the method includes the step of plating the conductive top surface of the workpiece, thereby providing greater plating of the cavity portion relative to the top. 前記適用工程が、前記加工物の前記頂部表面の．７５ｍｍの範囲で前記マスクを用いる請求項９８記載の方法。  The applying step includes: applying the top surface of the workpiece to the top surface. 99. The method of claim 98, wherein the mask is used in the range of 75 mm. 前記適用工程が、前記加工物の前記頂部表面の０．１から０．５ｍｍの範囲で前記マスクを用いる請求項９８記載の方法。  99. The method of claim 98, wherein the applying step uses the mask in the range of 0.1 to 0.5 mm of the top surface of the workpiece. 前記少なくとも１種の添加物が促進剤を含む請求項９８記載の方法。  99. The method of claim 98, wherein the at least one additive comprises an accelerator. めっき工程の間に、より多くの添加物が前記頂部より前記キャビティ部分上に吸着される請求項１０１記載の方法。  102. The method of claim 101, wherein more additive is adsorbed onto the cavity portion than the top during the plating step. 前記めっき工程が、除去された前記添加剤が完全に再吸着する前にのみ実施される請求項１０２記載の方法。  105. The method of claim 102, wherein the plating step is performed only before the removed additive is completely resorbed. 前記外的影響を適用する工程、前記マスクを除去する工程、およびめっき工程が反復される請求項１０２記載の方法。  105. The method of claim 102, wherein applying the external influence, removing the mask, and plating is repeated. 前記少なくとも１種の添加物が、阻害剤と促進剤の両方を含む複数の添加物を含む請求項９８記載の方法。  99. The method of claim 98, wherein the at least one additive comprises a plurality of additives comprising both an inhibitor and a promoter. 前記外的影響を適用する工程が、前記阻害剤が前記促進剤より強力な吸着特性を有する結果として前記阻害剤より大きなパーセンテージの前記促進剤を除去する請求項１０５記載の方法。  106. The method of claim 105, wherein applying the external effect removes a greater percentage of the promoter than the inhibitor as a result of the inhibitor having stronger adsorption properties than the promoter. 前記めっき工程が、除去された前記促進剤が前記頂部上に完全に再吸着する前にのみ実施される請求項１０６記載の方法。  107. The method of claim 106, wherein the plating step is performed only before the removed promoter is completely resorbed on the top. 前記外的影響を適用する工程、前記マスクを除去する工程、めっきする工程が反復される請求項１０７記載の方法。  108. The method of claim 107, wherein the step of applying the external effect, the step of removing the mask, and the step of plating are repeated. 前記外的影響を適用する工程の後、前記阻害剤が、前記加工物の前記頂部上に前記促進剤より急速に再吸着する請求項１０５記載の方法。  106. The method of claim 105, wherein after applying the external influence, the inhibitor resorbs more rapidly than the promoter on the top of the workpiece. 前記阻害剤が再吸着する間と後、かつ除去された前記促進剤が前記頂部上に完全に再吸着する前にめっき工程が実施される請求項１０９記載の方法。  110. The method of claim 109, wherein a plating step is performed during and after the inhibitor resorbs and before the removed promoter is completely resorbed on the top. 前記外的影響を適用する工程、およびめっき工程が反復される請求項１１０記載の方法。  111. The method of claim 110, wherein the step of applying the external influence and the plating step are repeated. 前記めっき工程が、前記加工物の前記頂部表面から前記マスクを遠く引き離す工程を含む請求項９８記載の方法。  99. The method of claim 98, wherein the plating step includes pulling the mask away from the top surface of the workpiece. 前記外的影響を適用する工程が、前記外的影響にすでに供された前記頂部の領域を、めっき工程の間、めっき電流が前記加工物の前記領域とアノードとの間に存在するようにマスクの開口領域と一致させる請求項９８記載の方法。  Applying the external effect masks the top region already subjected to the external effect such that a plating current exists between the region of the workpiece and the anode during the plating step. 99. The method of claim 98, wherein the method matches the open area of the. 前記めっき工程の間に、第１の電流密度を有する電流パルスが、前記アノードと前記加工物の前記領域との間の前記可動性マスクの前記開口領域の中に生成し、前記第１の電流密度は、前記可動性マスクにより覆われる前記加工物の別領域に存在する第２の電流密度より大きい請求項１１３記載の方法。  During the plating step, a current pulse having a first current density is generated in the open region of the movable mask between the anode and the region of the workpiece, and the first current is generated. 114. The method of claim 113, wherein the density is greater than a second current density present in another region of the workpiece covered by the movable mask. 前記めっき工程が銅をめっきする請求項９８記載の方法。  99. The method of claim 98, wherein the plating step plating copper. 前記めっき工程が銅合金をめっきする請求項９８記載の方法。  99. The method of claim 98, wherein the plating step plating a copper alloy. 前記頂部に前記外的影響を適用する工程が、前記頂部と前記キャビティ部分との間に表面抵抗の差を設ける請求項９８記載の方法。  99. The method of claim 98, wherein the step of applying the external influence on the top provides a difference in surface resistance between the top and the cavity portion. 前記電解液に、添加物と前記加工物の前記表面との間の結合を弱める働きをする別の添加物を加える工程をさらに含む請求項９８記載の方法。  99. The method of claim 98, further comprising adding to the electrolyte another additive that serves to weaken the bond between the additive and the surface of the workpiece. 電解液を用いて加工物の導電性頂部表面をめっきするための装置であって、前記加工物の前記導電性頂部表面は頂部とキャビティ部分を含み、加工物上に吸着された少なくとも１種の添加物を有し、
電力が適用され得るために用いられ、それにより前記加工物の前記頂部表面との間に電界を作り出し、前記頂部表面のめっきを行わせるアノード、および
前記加工物表面に対して離間関係で配置され、相対的な動きが前記加工物との間に起こり、一方、前記頂部上に吸着された添加物の量が減少するように前記頂部上に吸着された少なくとも１種の添加物に対して離間関係にあり、そしてそれによりめっきが起こりながら前記加工物の前記頂部上にめっきされた導電性物質の量が減少するマスク
を備える装置。An apparatus for plating a conductive top surface of a workpiece using an electrolyte, wherein the conductive top surface of the workpiece includes a top portion and a cavity portion, and is at least one kind adsorbed on the workpiece. Having additives,
An electric power is used to be applied, thereby creating an electric field with the top surface of the workpiece and causing the top surface to be plated, and spaced apart from the workpiece surface. A relative movement occurs between the workpiece and the at least one additive adsorbed on the top so that the amount of additive adsorbed on the top decreases. An apparatus comprising a mask that is in connection and thereby reduces the amount of conductive material plated on the top of the workpiece while plating occurs. 前記マスクが絶縁体で作られている請求項１１９記載の装置。  120. The apparatus of claim 119, wherein the mask is made of an insulator. 前記マスクが、前記電解質およびめっき電流が電力の適用の間前記マスクの開口領域に対応する前記加工物の領域を通過する前記開口領域を含む請求項１１９記載の装置。  120. The apparatus of claim 119, wherein the mask includes the open area through which the electrolyte and plating current pass through an area of the workpiece corresponding to the open area of the mask during application of power. 前記マスクが、前記加工物に付与される前記めっき電流に実質的に影響を与えないように形成されている請求項１２１記載の装置。  122. The apparatus of claim 121, wherein the mask is formed so as not to substantially affect the plating current applied to the workpiece. 前記加工物の面積と比較してマスク面積が５％未満である請求項１２２記載の装置。  123. The apparatus of claim 122, wherein the mask area is less than 5% compared to the area of the workpiece.
JP2002520283A 2000-08-10 2001-08-09 Plating method and apparatus for creating a difference between a top surface of a workpiece and an additive deposited on a cavity surface using external influences Pending JP2004521186A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US22473900P 2000-08-10 2000-08-10
US09/740,701 US6534116B2 (en) 2000-08-10 2000-12-18 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
US09/919,788 US6858121B2 (en) 2000-08-10 2001-07-31 Method and apparatus for filling low aspect ratio cavities with conductive material at high rate
PCT/US2001/024890 WO2002015245A2 (en) 2000-08-10 2001-08-09 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence

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