JP2004363238A - Matching type image sensor module - Google Patents

Matching type image sensor module Download PDF

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Publication number
JP2004363238A
JP2004363238A JP2003158051A JP2003158051A JP2004363238A JP 2004363238 A JP2004363238 A JP 2004363238A JP 2003158051 A JP2003158051 A JP 2003158051A JP 2003158051 A JP2003158051 A JP 2003158051A JP 2004363238 A JP2004363238 A JP 2004363238A
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Japan
Prior art keywords
substrate
image sensor
sensor module
sensing chip
image sensing
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JP2003158051A
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Japanese (ja)
Inventor
Jr-Hung Shie
志鴻 謝
Shisei Go
志成 呉
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Kingpak Technology Inc
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Kingpak Technology Inc
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Priority to JP2003158051A priority Critical patent/JP2004363238A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a matching type image sensor module having a relatively simplified structure and satisfying the requirement of a light, thin, short and small module. <P>SOLUTION: The matching type image sensor module comprises a substrate having upper and lower surfaces, a protruding edge layer having first and second surfaces with the first surface being provided on the upper surface of the substrate to form a groove together with the substrate, an image sensing chip located in the groove while being secured to the upper surface of the substrate, a plurality of electronic devices located in the groove while being mounted on the upper surface of the substrate, a plurality of wires for connecting the bonding pads of the image sensing chip electrically with the substrate, and a translucent layer covering the image sensing chip and the plurality of electronic devices with a protruding translucent part being formed at a position corresponding to the image sensing chip wherein the image sensing chip receives optical signals passed through the protruding translucent part of the translucent layer and collected. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は一種のイメージセンサモジュールの構造に係り、特に、構造が単純化され、製造が容易で、生産コストを下げることができる整合型のイメージセンサモジュールの構造に関する。
【０００２】
【従来の技術】
図１は周知のイメージセンサモジュールの構造表示図である。それは、上端面１２と下端面１４及び上端面１２から下端面１４に貫通する収容室１６を具えて該収容室１６に雌ネジ１８が形成されたレンズシート１０、雄ネジ２２が設けられてレンズシート１０の上端面１２より該収容室１６内に収容されてレンズシート１０の雌ネジ１８と螺合され、上から下に透光層区２４、非球面レンズ２６、及び赤外線フィルタレンズ２８が設けられたレンズ筒２０、及び第１面３２と第２面２４を具え、該第１面３２に透光層３６が設けられたイメージセンサ３０、以上を具えている。該イメージセンサ３０は透光層３６によりレンズ筒１０の下端面１４に接着され、並びにレンズ筒２０とレンズシート１０の螺合の深さを調整することにより、レンズ筒２０の非球面レンズ２６とイメージセンサ３０の透光層３６間の焦点距離を制御することができる。
【０００３】
図２は周知のイメージセンサモジュールの実施例図であり、その使用時には、プリント基板３７の上に複数の電子装置３８（例えばアクティブ装置及びパッシブ装置）を設置する必要がある。
【０００４】
上述の周知のイメージセンサモジュールの構造には以下のような欠点がある。
１．製造上比較的複雑であり、イメージセンサ３０を先にパッケージ完成してから、レンズシート１０及びレンズ筒２０を組み合わせてモジュールを形成し、イメージセンサ３０に非球面レンズ２６で集光後の光信号を受け取らせるが、
構造が比較的複雑であり、且つ全体寸法が比較的高く、軽薄短小の訴求を達成できない。
２．透光層３６がレンズシート１０の下端面１４に接着されるが、接着剤により透光層３６表面が汚れやすく、光信号の受信不良を形成した。
３．モジュールの組立時に、透光層３６を正確に非球面レンズ２６とアライメントさせて、接着方式で固定しなければならず、一旦アライメントさせた後に偏差があることが判明した場合、全体のモジュールを再度組み立てることができず、廃棄しなければならない。
４．使用時に他の電子装置をプリント基板上に別に設置しなければならず、製造上、比較的不便である。
【０００５】
【発明が解決しようとする課題】
以上の従来の技術の欠点を鑑み、本発明は構造が比較的単純化され、且つ軽薄短小の訴求に対応する整合型のイメージセンサモジュールを提供するものである。
【０００６】
即ち、本発明の主要な目的は、一種の整合型のイメージセンサモジュールを提供することにあり、それは、製造に便利で、生産コストを下げられるものとする。
【０００７】
本発明の別の目的は、一種の整合型のイメージセンサモジュールを提供することにあり、それは、製品寸法が小さく、軽薄短小の目的を達成できるものとする。
【０００８】
【課題を解決するための手段】
請求項１の発明は、整合型のイメージセンサモジュールにおいて、
上表面と下表面を具えた基板と、
第１表面と第２表面を具えて該第１表面が該基板の上表面の上に設けられて該基板と凹溝を形成する凸縁層と、
複数のボンディングパッドが設けられて該基板の上表面の上に固定されると共に該凹溝内に位置するイメージセンシングチップと、
該基板の上表面に設置されて該凹溝内に位置する複数の電子装置と、
該イメージセンシングチップのボンディングパッドを該基板に電気的に連接させる複数の導線と、
該イメージセンシングチップと該複数の電子装置を被覆し、該イメージセンシングチップに対応する位置に凸透光部が形成された透光層と、
を具えたことを特徴とする、整合型のイメージセンサモジュールとしている。
請求項２の発明は、請求項１記載の整合型のイメージセンサモジュールにおいて、透光層の凸透光部が円弧状とされたことを特徴とする、整合型のイメージセンサモジュールとしている。
請求項３の発明は、請求項１記載の整合型のイメージセンサモジュールにおいて、複数の電子装置がアクティブ装置及びパッシブ装置とされたことを特徴とする、整合型のイメージセンサモジュールとしている。
請求項４の発明は、請求項１記載の整合型のイメージセンサモジュールにおいて、透光層が透光ガラスとされて凸縁層の第２表面の上を被覆することを特徴とする、整合型のイメージセンサモジュールとしている。
請求項５の発明は、請求項１記載の整合型のイメージセンサモジュールにおいて、透光層が透明樹脂体とされて前記凹溝内に充填されたことを特徴とする、整合型のイメージセンサモジュールとしている。
【０００９】
【発明の実施の形態】
本発明の整合型のイメージセンサモジュールは、上表面と下表面を具えた基板、第１表面と第２表面を具えて該第１表面が該基板の上表面の上に設けられて該基板と凹溝を形成する凸縁層、該基板の上表面に固定されて該凹溝内に位置するイメージセンシングチップ、該基板の上表面に設置されて該凹溝内に位置する複数の電子装置、該イメージセンシングチップのボンディングパッドを該基板に電気的に連接させる複数の導線、該イメージセンシングチップと該複数の電子装置を被覆し、該イメージセンシングチップに対応する位置に凸透光部が形成された透光層、以上を具えている。
【００１０】
これにより、該イメージセンシングチップが該透光層の凸透光部を透過して集められた光信号を受け取る。
【００１１】
【実施例】
図３は本発明の整合型のイメージセンサモジュールの第１実施例を示す。それは、基板４０、凸縁層４２、イメージセンシングチップ４４、複数の導線４６、複数の電子装置４７及び一つの透光層４８を具えている。
【００１２】
該基板４０は上表面５０と下表面５２を具え、該上表面５０に複数の第１接点５４が形成され、下表面５２に複数の第２接点５６が形成され、該第２接点５６がプリント基板５３との電気的連接に用いられる。
【００１３】
該凸縁層４２は第１表面５８と第２表面６０を具え、第１表面５８が該基板４０の上表面５０の上に設けられ、並びに基板４０と凹溝６２を形成する。
【００１４】
該イメージセンシングチップ４４は、複数のボンディングパッド６４を具え、該イメージセンシングチップ４４は基板４０の上表面５０の上に固定され、並びに凹溝６２内に位置する。
【００１５】
該複数の導線４６は該イメージセンシングチップ４４のボンディングパッド６４を基板４０の第１接点５４に連接してイメージセンシングチップ４４の信号を基板４０に伝送するのに供される。
【００１６】
該複数の電子装置４７は、アクティブ装置或いはパッシブ装置とされ、基板４０の上表面５０の上に設けられて凹溝６２内に位置する。
【００１７】
透光層４８は透光ガラスとされ、それは凸縁層４２の第２表面６０の上を被覆し、イメージセンシングチップ４４と複数の電子装置４７を被覆し、且つそのイメージセンシングチップ４４に対応する位置に凸透光部６６が設けられ、該凸透光部６６が円弧形状を呈して集光の作用を有し、イメージセンシングチップ４４に凸透光部６６を透過し光信号を受信させる。
【００１８】
図４に示されるのは本発明の整合型のイメージセンサモジュールの第２表示図である。そのうち、透光層４８は透明樹脂体とされ、それは基板４０と凸縁層４２の形成する凹溝６２内に充填されて、イメージセンシングチップ４４及び複数の電子装置４７を被覆し、そのイメージセンシングチップ４４に対応する位置に凸透光部６６が形成され、該凸透光部６６は円弧形状とされて集光の作用を具備し、イメージセンシングチップ４４に該凸透光部６６を透過して光信号を受信させる。
【００１９】
【発明の効果】
本発明は透光層４８の凸透光部６６の設置により集光された光信号を受け取り、イメージセンサに 別にモジュールを組み合わせて使用する必要がなく、このため製品寸法を有効に縮小でき、且つ製造上、比較的便利であり、有効に生産コストを下げることができる。且つ複数の電子装置４７のパッケージを同時進行でき、製造上、便利であり、実用的である。
【００２０】
以上の実施例の説明は、本発明の実施範囲を限定するものではなく、本発明に基づきなしうる細部の修飾或いは改変は、いずれも本発明の請求範囲に属するものとする。
【図面の簡単な説明】
【図１】周知のイメージセンサモジュールの断面図である。
【図２】周知のイメージセンサモジュールの実施図である。
【図３】本発明の整合型のイメージセンサモジュールの第１実施例図である。
【図４】本発明の整合型のイメージセンサモジュールの第２実施例図である。
【符号の説明】
４０ 基板 ４２ 凸縁層
４４ イメージセンシングチップ ４６ 導線
４７ 電子装置 ４８ 透光層
５０ 上表面 ５２ 下表面
５４ 第１接点 ５６ 第２接点
５８ 第１表面 ６０ 第２表面
６２ 凹溝 ６４ ボンディングパッド
６６ 凸透光部 ５３ プリント基板[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a structure of a kind of image sensor module, and more particularly, to a structure of a matched image sensor module whose structure is simplified, which is easy to manufacture, and which can reduce production cost.
[0002]
[Prior art]
FIG. 1 is a view showing the structure of a known image sensor module. It comprises an upper end surface 12, a lower end surface 14, a housing chamber 16 penetrating from the upper end surface 12 to the lower end surface 14, a lens sheet 10 in which a female screw 18 is formed in the housing chamber 16, and a male screw 22 provided. The upper end surface 12 of the sheet 10 is accommodated in the accommodation chamber 16 and screwed into the female screw 18 of the lens sheet 10, and a light-transmitting layer section 24, an aspheric lens 26, and an infrared filter lens 28 are provided from top to bottom. And the image sensor 30 having the first surface 32 and the second surface 24, and the light transmitting layer 36 provided on the first surface 32. The image sensor 30 is adhered to the lower end surface 14 of the lens barrel 10 by a light transmitting layer 36, and by adjusting the screwing depth of the lens barrel 20 and the lens sheet 10, the aspherical lens 26 of the lens barrel 20 is The focal length between the light transmitting layers 36 of the image sensor 30 can be controlled.
[0003]
FIG. 2 is a diagram showing an example of a known image sensor module. When the image sensor module is used, a plurality of electronic devices 38 (for example, an active device and a passive device) need to be installed on a printed circuit board 37.
[0004]
The structure of the above-mentioned known image sensor module has the following disadvantages.
1. It is relatively complicated in manufacturing. After the image sensor 30 is first packaged, a module is formed by combining the lens sheet 10 and the lens barrel 20, and the optical signal after being condensed on the image sensor 30 by the aspherical lens 26. To receive
The structure is relatively complicated, the overall dimensions are relatively high, and it is not possible to achieve a light and thin appeal.
2. The light-transmitting layer 36 is adhered to the lower end surface 14 of the lens sheet 10, but the surface of the light-transmitting layer 36 is easily stained by the adhesive, and a reception failure of an optical signal is formed.
3. When assembling the module, the light-transmitting layer 36 must be accurately aligned with the aspherical lens 26 and fixed by an adhesive method. If it is found that there is a deviation after the alignment, the entire module is re-installed. Cannot be assembled and must be discarded.
4. In use, other electronic devices must be separately installed on the printed circuit board, which is relatively inconvenient in manufacturing.
[0005]
[Problems to be solved by the invention]
In view of the above-mentioned drawbacks of the prior art, the present invention provides an image sensor module of an alignment type that has a relatively simplified structure and is suitable for small, light and small applications.
[0006]
That is, a main object of the present invention is to provide a kind of matched image sensor module, which is convenient to manufacture and can reduce the production cost.
[0007]
It is another object of the present invention to provide a kind of matched image sensor module, which can achieve small, light, thin and small objects.
[0008]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a matching type image sensor module,
A substrate with upper and lower surfaces,
A convex edge layer comprising a first surface and a second surface, wherein the first surface is provided on an upper surface of the substrate to form a groove with the substrate;
An image sensing chip provided with a plurality of bonding pads and fixed on the upper surface of the substrate and located in the concave groove;
A plurality of electronic devices located on the upper surface of the substrate and located in the concave groove;
A plurality of conductive wires for electrically connecting the bonding pads of the image sensing chip to the substrate;
A light-transmitting layer that covers the image sensing chip and the plurality of electronic devices and has a convex light-transmitting portion formed at a position corresponding to the image sensing chip;
And a matching type image sensor module.
According to a second aspect of the present invention, in the matching type image sensor module according to the first aspect, the convex translucent portion of the translucent layer has an arc shape.
According to a third aspect of the present invention, there is provided the matched image sensor module according to the first embodiment, wherein the plurality of electronic devices are an active device and a passive device.
According to a fourth aspect of the present invention, in the matching type image sensor module according to the first aspect, the light transmitting layer is made of a light transmitting glass and covers the second surface of the convex layer. Image sensor module.
According to a fifth aspect of the present invention, in the alignment type image sensor module according to the first aspect, the light transmitting layer is a transparent resin body and is filled in the concave groove. And
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
A matching type image sensor module according to the present invention includes a substrate having an upper surface and a lower surface, a first surface having a first surface and a second surface, wherein the first surface is provided on the upper surface of the substrate. A convex edge layer forming a concave groove, an image sensing chip fixed to the upper surface of the substrate and located in the concave groove, a plurality of electronic devices installed on the upper surface of the substrate and located in the concave groove; A plurality of conductive wires for electrically connecting bonding pads of the image sensing chip to the substrate, the image sensing chip and the plurality of electronic devices are covered, and a convex transparent portion is formed at a position corresponding to the image sensing chip. Light-transmitting layer.
[0010]
As a result, the image sensing chip receives the optical signal collected by passing through the convex light transmitting portion of the light transmitting layer.
[0011]
【Example】
FIG. 3 shows a first embodiment of the matching type image sensor module of the present invention. It comprises a substrate 40, a ridge layer 42, an image sensing chip 44, a plurality of conducting wires 46, a plurality of electronic devices 47, and one translucent layer 48.
[0012]
The substrate 40 has an upper surface 50 and a lower surface 52, a plurality of first contacts 54 are formed on the upper surface 50, a plurality of second contacts 56 are formed on the lower surface 52, and the second contacts 56 are printed. Used for electrical connection with the substrate 53.
[0013]
The edge layer 42 has a first surface 58 and a second surface 60, the first surface 58 being provided on the upper surface 50 of the substrate 40, and forming a groove 62 with the substrate 40.
[0014]
The image sensing chip 44 includes a plurality of bonding pads 64, the image sensing chip 44 is fixed on the upper surface 50 of the substrate 40 and is located in the groove 62.
[0015]
The plurality of conductors 46 are used to connect the bonding pads 64 of the image sensing chip 44 to the first contacts 54 of the substrate 40 to transmit signals of the image sensing chip 44 to the substrate 40.
[0016]
The plurality of electronic devices 47 are active devices or passive devices, are provided on the upper surface 50 of the substrate 40, and are located in the concave grooves 62.
[0017]
The light transmitting layer 48 is made of light transmitting glass, which covers the second surface 60 of the convex layer 42, covers the image sensing chip 44 and the plurality of electronic devices 47, and corresponds to the image sensing chip 44. A convex light transmitting portion 66 is provided at a position, and the convex light transmitting portion 66 has an arc shape and has a light condensing function. The image sensing chip 44 transmits the convex light transmitting portion 66 to receive an optical signal.
[0018]
FIG. 4 is a second display diagram of the matched image sensor module of the present invention. The light-transmitting layer 48 is made of a transparent resin, and is filled in a groove 62 formed by the substrate 40 and the convex layer 42 to cover the image sensing chip 44 and the plurality of electronic devices 47. A convex translucent portion 66 is formed at a position corresponding to the chip 44, and the convex translucent portion 66 is formed in an arc shape and has a condensing function, and transmits the convex translucent portion 66 to the image sensing chip 44. To receive an optical signal.
[0019]
【The invention's effect】
The present invention receives the optical signal collected by the provision of the convex light transmitting portion 66 of the light transmitting layer 48, and does not require the use of a separate module in combination with the image sensor. Therefore, the product size can be effectively reduced, and It is relatively convenient in manufacturing and can effectively reduce the production cost. In addition, the packages of a plurality of electronic devices 47 can be processed simultaneously, which is convenient and practical in manufacturing.
[0020]
The above description of the embodiments does not limit the scope of the present invention, and any modification or alteration of details that can be made based on the present invention shall fall within the scope of the present invention.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a known image sensor module.
FIG. 2 is an implementation diagram of a known image sensor module.
FIG. 3 is a diagram showing a first embodiment of a matching type image sensor module of the present invention.
FIG. 4 is a view showing a second embodiment of the matching type image sensor module of the present invention.
[Explanation of symbols]
REFERENCE SIGNS LIST 40 substrate 42 convex layer 44 image sensing chip 46 conductive wire 47 electronic device 48 light transmitting layer 50 upper surface 52 lower surface 54 first contact 56 second contact 58 first surface 60 second surface 62 concave groove 64 bonding pad 66 convex transparent Optical part 53 Printed circuit board

Claims (5)

整合型のイメージセンサモジュールにおいて、
上表面と下表面を具えた基板と、
第１表面と第２表面を具えて該第１表面が該基板の上表面の上に設けられて該基板と凹溝を形成する凸縁層と、
複数のボンディングパッドが設けられて該基板の上表面の上に固定されると共に該凹溝内に位置するイメージセンシングチップと、
該基板の上表面に設置されて該凹溝内に位置する複数の電子装置と、
該イメージセンシングチップのボンディングパッドを該基板に電気的に連接させる複数の導線と、
該イメージセンシングチップと該複数の電子装置を被覆し、該イメージセンシングチップに対応する位置に凸透光部が形成された透光層と、
を具えたことを特徴とする、整合型のイメージセンサモジュール。In the matching type image sensor module,
A substrate with upper and lower surfaces,
A convex edge layer comprising a first surface and a second surface, wherein the first surface is provided on an upper surface of the substrate to form a groove with the substrate;
An image sensing chip provided with a plurality of bonding pads and fixed on the upper surface of the substrate and located in the concave groove;
A plurality of electronic devices located on the upper surface of the substrate and located in the concave groove;
A plurality of conductive wires for electrically connecting the bonding pads of the image sensing chip to the substrate;
A light-transmitting layer that covers the image sensing chip and the plurality of electronic devices and has a convex light-transmitting portion formed at a position corresponding to the image sensing chip;
An image sensor module of a matching type, comprising: 請求項１記載の整合型のイメージセンサモジュールにおいて、透光層の凸透光部が円弧状とされたことを特徴とする、整合型のイメージセンサモジュール。2. The matching type image sensor module according to claim 1, wherein the convex light transmitting portion of the light transmitting layer has an arc shape. 請求項１記載の整合型のイメージセンサモジュールにおいて、複数の電子装置がアクティブ装置及びパッシブ装置とされたことを特徴とする、整合型のイメージセンサモジュール。3. The matched image sensor module according to claim 1, wherein the plurality of electronic devices are an active device and a passive device. 請求項１記載の整合型のイメージセンサモジュールにおいて、透光層が透光ガラスとされて凸縁層の第２表面の上を被覆することを特徴とする、整合型のイメージセンサモジュール。2. The matched image sensor module according to claim 1, wherein the light-transmitting layer is made of a light-transmitting glass and covers the second surface of the convex layer. 請求項１記載の整合型のイメージセンサモジュールにおいて、透光層が透明樹脂体とされて前記凹溝内に充填されたことを特徴とする、整合型のイメージセンサモジュール。2. The matching type image sensor module according to claim 1, wherein the light transmitting layer is a transparent resin body and is filled in the concave groove.
JP2003158051A 2003-06-03 2003-06-03 Matching type image sensor module Pending JP2004363238A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100862486B1 (en) 2007-05-31 2008-10-08 삼성전기주식회사 Camera module package
CN100561736C (en) * 2007-05-25 2009-11-18 鸿富锦精密工业（深圳）有限公司 The imaging modules of encapsulation structure for image sensor and application thereof
KR101115181B1 (en) 2007-08-15 2012-02-24 마이크론 테크놀로지, 인크. Method and apparatus for lens alignment for optically sensitive devices and systems implementing same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01146545U (en) * 1988-03-30 1989-10-09
JPH1084509A (en) * 1996-09-06 1998-03-31 Matsushita Electron Corp Image pickup device and its manufacture
JPH10209426A (en) * 1997-01-22 1998-08-07 Toshiba Corp Optical transmission/reception semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01146545U (en) * 1988-03-30 1989-10-09
JPH1084509A (en) * 1996-09-06 1998-03-31 Matsushita Electron Corp Image pickup device and its manufacture
JPH10209426A (en) * 1997-01-22 1998-08-07 Toshiba Corp Optical transmission/reception semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100561736C (en) * 2007-05-25 2009-11-18 鸿富锦精密工业（深圳）有限公司 The imaging modules of encapsulation structure for image sensor and application thereof
KR100862486B1 (en) 2007-05-31 2008-10-08 삼성전기주식회사 Camera module package
KR101115181B1 (en) 2007-08-15 2012-02-24 마이크론 테크놀로지, 인크. Method and apparatus for lens alignment for optically sensitive devices and systems implementing same

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