JP2004356652A - Resin sealing method and semiconductor chip - Google Patents
Resin sealing method and semiconductor chip Download PDFInfo
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- JP2004356652A JP2004356652A JP2004254531A JP2004254531A JP2004356652A JP 2004356652 A JP2004356652 A JP 2004356652A JP 2004254531 A JP2004254531 A JP 2004254531A JP 2004254531 A JP2004254531 A JP 2004254531A JP 2004356652 A JP2004356652 A JP 2004356652A
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- tape
- curing furnace
- resin sealing
- resin
- semiconductor chip
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- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
本発明は、樹脂封止方法とそれを用いて製造した半導体チップに関するものである。 The present invention relates to a resin sealing method and a semiconductor chip manufactured using the same.
樹脂封止装置は、従来例えば図３に示すようにＴＣＰテープＡを送り出すローダ部Ｄと、ＴＣＰテープＡにボンディングされた半導体チップＢ（図４）に樹脂液を滴下するポッティング部Ｅと、ヒータを備えたキュア炉Ｆと、ＴＣＰテープＡを巻き取るアンローダ部Ｇから構成されている。
前記樹脂封止装置においては、ポッティング部Ｅで滴下された樹脂をキュア炉部Ｆ内で仮乾燥（本乾燥はその後の工程で行われる）するが、ＴＣＰテープＡがキュア炉Ｆ内に搬送される際に、ＴＣＰテープＡと一緒にコンタミや微細なゴミ等が入り込み、保護膜内に混入し又はリードフレーム部Ｃに付着して品質の低下を来すという問題があった。本発明は、このような従来の問題点を解決するためになされ、ＴＣＰテープの搬入に伴ってキュア炉内へ侵入してくるコンタミ等を入口付近で直ちに炉外に排出し、キュア炉内部への侵入を防止できるようにした、樹脂封止装置の排気機構を提供することを課題としたものである。また、上記した樹脂封止装置を用いた樹脂封止方法とこの樹脂封止方法で製造した半導体チップを提供すうことである。 In the resin sealing device, the resin dropped in the potting section E is temporarily dried in the curing furnace section F (the main drying is performed in a subsequent step), and the TCP tape A is conveyed into the curing furnace F. In this case, there is a problem that contaminants, fine dust and the like enter together with the TCP tape A and are mixed into the protective film or adhere to the lead frame portion C, resulting in a deterioration in quality. The present invention has been made in order to solve such a conventional problem, and contaminants and the like that enter the cure furnace with the transfer of the TCP tape are immediately discharged to the outside of the furnace near the entrance to the inside of the cure furnace. It is an object of the present invention to provide an exhaust mechanism of a resin sealing device, which can prevent the intrusion of a resin. Another object of the present invention is to provide a resin sealing method using the above resin sealing device and a semiconductor chip manufactured by the resin sealing method.
前記課題を技術的に解決するための手段として、本発明の樹脂封止方法は、テープを送り出す工程と、テープに樹脂を滴下する工程と、テープをキュア炉へ移動させて炉内ガスを上記キュア炉内の入口の近傍に設けたダクトから排気しながら樹脂を乾燥する工程と、テープを巻き取る工程からなることを特徴とする。 As a means for technically solving the above problems, the resin sealing method of the present invention includes a step of sending out a tape, a step of dropping a resin on the tape, and moving the tape to a curing furnace to reduce the gas in the furnace. The method is characterized by comprising a step of drying the resin while exhausting air from a duct provided near an entrance in a curing furnace, and a step of winding a tape.
また、本発明の半導体チップは、上記の樹脂封止方法で樹脂封止されたことを特徴とする。 Further, a semiconductor chip of the present invention is characterized in that it is resin-sealed by the above-described resin sealing method.
以上説明したように、本発明によれば、樹脂封止装置におけるキュア炉の入口近傍にダクトを設けたので、ＴＣＰテープの搬入に伴ってキュア炉に侵入してくるコンタミ等を直ちに排出し、キュア炉内部への侵入を防止することが出来、コンタミ等が保護膜内に混入し又はリードフレーム部に付着して品質低下を来す欠点を未然に防止する効果がある。 As described above, according to the present invention, since the duct is provided near the entrance of the curing furnace in the resin sealing device, the contamination and the like that enter the curing furnace with the introduction of the TCP tape are immediately discharged, It is possible to prevent intrusion into the inside of the curing furnace, and it is possible to prevent defects such as contamination or the like from being mixed in the protective film or adhering to the lead frame portion, resulting in quality deterioration.
以下、本発明の実施例を添付図面に基づいて詳説する。図１において、１はローダ部の上部に装着された送り出し用リールであり、巻き付けられたＴＣＰテープ２が無テンションで、つまり自重により垂れ下がるようにしてある。自重により垂れ下ったＴＣＰテープ２は、中間部に設けられた一対の補助ガイド３及び固定ガイド４を介して案内され、且つテープ送りローラ５によりポッティング部の樹脂滴下領域まで搬送される。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 1 denotes a delivery reel mounted on the upper portion of the loader unit, and the wound TCP tape 2 is hung without tension, that is, hangs down by its own weight. The TCP tape 2 hanging down by its own weight is guided through a pair of auxiliary guides 3 and a fixed guide 4 provided at an intermediate portion, and is conveyed by a tape feed roller 5 to a resin dropping area of a potting portion.
６はポッティング部に配設された樹脂滴下ノズルであり、前記樹脂滴下領域まで搬送されたＴＣＰテープ２の半導体チップの上に樹脂液を滴下する。 Reference numeral 6 denotes a resin dropping nozzle arranged in the potting section, which drops a resin liquid onto the semiconductor chip of the TCP tape 2 transported to the resin dropping area.
７はキュア炉8の入口近傍に設けられたダクトであり、図２に示すようにＴＣＰテープ２が入口８ａから搬入されると、そのテープと一緒に入ってきたコンタミを含むエア及びテープの表面に付着しているゴミ等を直ちにキュア炉８外に強制的に排気する。従って、キュア炉８内部へのコンタミ等の侵入を未然に防止することが出来る。 Numeral 7 is a duct provided near the entrance of the curing furnace 8, and as shown in FIG. 2, when the TCP tape 2 is carried in from the entrance 8a, the surface of the air and the tape containing the contaminants that have entered together with the tape. Immediately forcibly evacuate dust and the like adhering to the outside of the curing furnace 8. Therefore, it is possible to prevent contamination or the like from entering the inside of the curing furnace 8 beforehand.
前記キュア炉８は、内部に複数のヒータ９とファンユニット１０が配設され、これらの乾燥手段に沿ってＴＣＰテープ２を移動させることにより、前記半導体チップの上に滴下された樹脂を仮乾燥する。 The curing furnace 8 has a plurality of heaters 9 and a fan unit 10 disposed therein, and moves the TCP tape 2 along these drying means to temporarily dry the resin dropped on the semiconductor chip. I do.
又、キュア炉８には後部側からＮ２ガスを流し込むことがあるが、前記のようにダクト７が入口８ａの近傍に設けられているため、Ｎ２ガスの流れは図２に点線の矢印で示すようにＴＣＰテープの搬送路を逆走し、入口８ａ付近に至ってダクト７から外部に排出される。従って、Ｎ２ガスの流れる方向が一定となり、キュア炉８ないの温度制御を容易に行うことが出来る。 Further, N2 gas may flow into the curing furnace 8 from the rear side, but since the duct 7 is provided near the inlet 8a as described above, the flow of the N2 gas is indicated by a dotted arrow in FIG. As described above, the tape runs in the reverse direction along the TCP tape transport path, reaches the vicinity of the entrance 8a, and is discharged from the duct 7 to the outside. Accordingly, the flow direction of the N2 gas becomes constant, and the temperature control of the curing furnace 8 can be easily performed.
ＴＣＰテープの搬入に伴ってコンタミを含むエア及びＴＣＰテープに付着した微細なゴミ等がキュア炉内に侵入してきても、キュア炉の入口近傍に設けられたダクトにより入口付近で直ちに排出し、キュア炉内部への侵入を防止することが出来る。 Even if air containing contaminants and fine dust adhering to the TCP tape enter the cure furnace as the TCP tape is carried in, the air is immediately discharged near the entrance by a duct provided near the entrance of the cure furnace, and cured. Intrusion into the furnace can be prevented.
キュア炉８内で仮乾燥されたＴＣＰテープ２は、送り出しローラ１１によってアンローダ部に搬送され、テープ巻き取り用リール１２に巻き取られる。このアンローダ部は前記ローダ部とほぼ対称形になっており、中間部に一対の補助ガイド１３及び固定ガイド１４が配設され、アンローダ部に搬入されたＴＣＰテープ２は自重により垂れ下がり、補助ガイド１３を経て前記リール１２に無テンション状態で巻き取られる。 The TCP tape 2 preliminarily dried in the curing furnace 8 is conveyed to an unloader section by a delivery roller 11 and wound on a tape winding reel 12. The unloader section is substantially symmetrical with the loader section. A pair of auxiliary guides 13 and a fixed guide 14 are provided at an intermediate portion. The TCP tape 2 carried into the unloader section hangs down by its own weight, and the auxiliary guide 13 Through the reel 12 without tension.
尚、１５，１６は保護テープ用リールであり、ローダ側に設けられたリール１５はＴＣＰテープ２を送り出す際にその上面に被服されている保護テープを巻き取り、アンローダ側に設けられたリール１６は保護テープを送り出し、ＴＣＰテープ２の上面に合わせてリール１２に同時に巻き取られるようになっている。 Reference numerals 15 and 16 denote protection tape reels. The reel 15 provided on the loader side winds up the protection tape coated on the upper surface when sending out the TCP tape 2, and the reel 16 provided on the unloader side. Sends out the protective tape and winds it on the reel 12 simultaneously with the upper surface of the TCP tape 2.
１・・・リール ２・・・ＴＣＰテープ ３・・・補助ガイド ４・・・固定ガイド ５・・・テープ送りローラ ６・・・樹脂滴下ノズル ７・・・ダクト ８・・・キュア炉 ８ａ・・・入口 ９・・・ヒータ １０・・・ファンユニット １１・・・送り出しローラ １２・・・リール １３・・・補助ガイド １４・・・固定ガイド １５、１６・・・保護テープ用リール DESCRIPTION OF SYMBOLS 1 ... Reel 2 ... TCP tape 3 ... Auxiliary guide 4 ... Fixed guide 5 ... Tape feed roller 6 ... Resin dripping nozzle 7 ... Duct 8 ... Cure furnace 8a. ..Inlet 9 ... Heater 10 ... Fan unit 11 ... Sending roller 12 ... Reel 13 ... Auxiliary guide 14 ... Fixed guide 15, 16 ... Protective tape reel
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004254531A JP2004356652A (en) | 2004-09-01 | 2004-09-01 | Resin sealing method and semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004254531A JP2004356652A (en) | 2004-09-01 | 2004-09-01 | Resin sealing method and semiconductor chip |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8998695A Division JPH08264570A (en) | 1995-03-24 | 1995-03-24 | Exhaust mechanism of resin-sealed device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2004356652A true JP2004356652A (en) | 2004-12-16 |
Family
ID=34056513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004254531A Pending JP2004356652A (en) | 2004-09-01 | 2004-09-01 | Resin sealing method and semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004356652A (en) |
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2004
- 2004-09-01 JP JP2004254531A patent/JP2004356652A/en active Pending
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