JP2004356555A - Heat-receiving element and cooling device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive heat-receiving element which has corrosion resistance and high thermal efficiency and can prevent liquid from being leaked and permeated, and to provide a cooling device using the same. <P>SOLUTION: The heat-receiving element 10 fitted to a heating element, such as a semiconductor element, has a device body 1 formed by sintering and a metal pipe 2 for circulating a cooling liquid. After the metal pipe 2 is machined in a specific piping shape in advance, the device body 1 is formed by press-molding metallic powders and sintering them, and at that time, the device body 1 is shrunk so that the device body 1 is integrated with the metallic pipe. Thereby, degree of adhesion between the device body 1 and the metal pipe 2 is increased, hence improving thermal conductivity, reducing secondary machining and cutting down assembly working cost. Additionally, there are no gaps or the like between the metal pipe 2 and the device body 1, thereby preventing the cooling liquid from being leaked and permeated and increasing the corrosion resistance. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a heat receiving body and a cooling device using the same, and more particularly, to a heat receiving body used for a cooling device for cooling a heat generating body (such as a semiconductor element of an electronic device), and a cooling device using the heat receiving body About.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a liquid circulation type cooling device that cools a heating element such as an LSI or a power transistor in an electronic device is known. The liquid circulation type cooling device includes a heat receiving member arranged in contact with a heat generating portion of the heat generating member, a heat radiating member for radiating heat transmitted from the heat receiving member, and cooling between the heat radiating member and the heat receiving member. It comprises a driving means for circulating the cooling liquid and a tank for storing the cooling liquid. The heat receiver has a function of efficiently transmitting heat from the heat generator to the cooling liquid.
[0003]
In the liquid circulation type cooling device configured as described above, for example, when the electronic device operates, the heating element is energized, and the heating element in the electronic device generates heat. The heat of the heating element is conducted to the heat receiving element. A cooling liquid is supplied to the heat receiving body by a pump, and the heat receiving body is cooled by circulation of the cooling liquid, and the cooling liquid whose temperature has been raised by heat exchange flows into the heat radiation member. Since the heat radiating member is cooled by natural air or forced air by an electric fan, the heat of the cooling liquid flowing into the heat radiating member is radiated to the atmosphere.
[0004]
FIGS. 5 and 6 show a first configuration example of a conventional heat receiving body. The heat receiving body 100 has a main body 101 made of die cast. The main body 101 has a pair of connection ports 101a and 101b for connecting a pipe (not shown) from the outside, and a casing of the electronic device. Screw holes 102a, 102b, 102c, and 102d are provided for fixing to a body or a heating element via screws (not shown). Inside the main body 101, a flow channel 103 (for example, having a semicircular or square cross-sectional shape) for circulating the cooling liquid is formed. The flow channel 103 has a meandering structure a plurality of times, and both ends are connected to the connection ports 101a and 101b.
[0005]
The upper surface (front side in the drawing) of the flow channel 103 is open, and an O-ring 105 is provided around the opening 104. A lid 106 is attached to the opening 104 so as to be in contact with the O-ring 105 as shown in FIG. The lid 106 is fixed to the main body 101 by a plurality of screws 107. When the lid 106 is fixed to the opening 104, the lower surface of the lid 106 is in close contact with the upper surface of the flow channel 103, and the flow channel 103 is formed in a pipe shape. Therefore, the flow channel 103 is connected via the connection ports 101 a and 101 b. A cooling liquid can be flowed by a pump (not shown).
[0006]
FIG. 7 shows a second configuration example of a conventional heat receiving body. The heat receiving body 200 is used for a cooling device for a semiconductor element such as a CPU and an LSI, and has a metal plate 201 having a predetermined size and thickness, and a part of a tube body brazed to the metal plate 201. And a metal pipe 202 brazed by a wire 203. In this configuration, the heat transfer efficiency increases as the contact area between the metal plate 201 and the metal pipe 202 increases. Further, since the structure is simple, the reliability against liquid leakage is high, and the cost can be reduced.
[0007]
In the configuration of FIG. 7, for example, when cooling the CPU, the metal plate 201 is mounted directly or via a compound or the like such that the surface on which the metal pipe 202 is not provided contacts the heat radiation surface of the CPU. Next, when a cooling liquid is supplied to the metal pipe 202 by operating a pump (not shown), the metal plate 201 whose temperature has risen due to heat conduction from the CPU is cooled by the cooling liquid circulating in the pipe 202. Cools the CPU.
[0008]
In the above description, the heating elements are relatively small, such as a CPU, an LSI, and a power transistor. However, a cooling device that cools a large device such as a liquid-cooled cathode ray tube of a video projector has been conventionally known. . As such a cooling device, for example, a configuration in which a sealed space is formed between a projection surface of a cathode ray tube and a projection lens, and an inlet and a bellofram (pressure regulating valve) are provided so as to communicate with the sealed space is proposed. (For example, see Patent Document 1).
[Patent Document 1]
JP-A-11-40070
[Problems to be solved by the invention]
However, according to the conventional heat receiver and cooling device, in the case of the configurations shown in FIGS. 5 and 6, since the structure is sealed with the lid via the O-ring 105, moisture permeation from the O-ring 105 (for a long period of time) (A phenomenon in which the cooling liquid decreases very little at a time), liquid leakage due to variations in assembly work, leakage due to deterioration of the O-ring 105, corrosion generated in the gap between the O-rings, and the like, which may cause a problem in reliability. . Further, since screw holes for fixing the cover 106 need to be formed, the processing cost and assembling work cost are increased, and the cost is increased.
[0010]
In the case of the configuration in FIG. 7, the heat transfer surface is limited to the metal pipe 202 and the brazing portion 203 of the metal plate 201, so that there is a problem that the thermal efficiency is low.
[0011]
Therefore, an object of the present invention is to provide an inexpensive and highly heat-efficient heat receiving body that has corrosion resistance, does not cause liquid leakage or liquid permeation.
[0012]
Another object of the present invention is to provide a cooling device that has corrosion resistance, does not cause liquid leakage or liquid permeation, and can achieve high efficiency and high reliability using a low-cost, high-thermal-efficiency heat receiver. It is in.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a heat receiving body which is attached to a heating element, receives heat conducted from the heating element, and performs cooling using a cooling liquid supplied from the outside. A heat receiving surface having a heat receiving surface for receiving heat based on heat conduction from the heating element, and a main body formed by sintering so as to be in contact with the outer periphery of the pipe. Provide body.
[0014]
According to this configuration, by forming the main body by sintering, the main body contracts at the time of sintering, comes into close contact with the pipe, and the main body and the pipe are integrated, and the thermal conductivity is improved.
[0015]
Further, in order to achieve the above object, the present invention has a pipe through which a coolant flows, and a heat receiving surface for receiving heat based on heat conduction from a heating element, and is sintered so as to be in contact with the outer periphery of the pipe. A heat receiving body for conducting heat from the heat generating body to the cooling liquid circulated through the pipe, and a heat conducting from the heat receiving body to the cooling liquid. And a pair of conduits connected between the heat receiving body and the radiation unit for circulating the coolant, and provided in the middle of the pair of conduits to circulate the coolant. A cooling device comprising: a pump;
[0016]
According to this configuration, since the pipe and the main body are integrated, the heat conductivity is improved. Therefore, when the coolant is circulated between the heat receiving body and the heat radiating section by operating the pump, the heat generating body is formed. After the heat is conducted to the heat receiving body, the heat is transferred to the heat radiating section by the cooling liquid, and the heat radiating section performs heat exchange, thereby efficiently cooling the heat generating body.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 shows a heat receiver according to a first embodiment of the present invention. The heat receiving body 10 includes a main body 1 formed by sintering, and a metal tube 2 integrated with the main body 1 when the main body 1 is formed by sintering. It has a surface 1a.
[0018]
The main body 1 is made of a sintered metal powder mainly composed of copper or a copper alloy having excellent thermal conductivity, and is fixed to a case or a heating element of an electronic device in the vicinity of the corner via a screw (not shown). Screw holes 3a, 3b, 3c, 3d are provided. In addition, the main body 1 may use sintered metal powder mainly composed of other metals such as aluminum, magnesium, and iron having excellent thermal conductivity.
[0019]
The metal tube 2 is made of a metal material such as copper or stainless steel which has corrosion resistance to a cooling liquid such as an antifreeze, and the inflow portion 2a and the outflow portion 2b are separated from the pipe outlet surface 1A of the main body 1 by a predetermined length. Is protruding. The metal pipe 2 is formed in a meandering manner inside the main body 1 so as to accommodate a sufficient length of the pipe, and has a pipe laying structure in which the pipe length of the metal pipe 2 is long. Heat exchange property is improved. The metal tube 2 may be formed of other metal having excellent corrosion resistance other than stainless steel, or a metal such as a copper alloy having good heat conductivity.
[0020]
Further, in the above-described configuration, the inflow portion 2a and the outflow portion 2b of the metal tube 2 are configured to be exposed to the outside of the main body 1 from the same pipe outlet surface 1A, but the inflow portion 2a and the outflow portion 2b are connected to the main body 1. May be arranged at different locations (opposing position, orthogonal position, symmetric position, etc.).
[0021]
Next, an example of a method of manufacturing the heat receiving body 10 will be described with reference to FIGS. First, the metal pipe 2 is bent so as to form a meandering pipe laying structure as shown in FIG. Next, the metal tube 2 is placed on the recess 5 a of the lower mold 5. At this time, the metal tube 2 is placed so that the inflow portion 2a and the outflow portion 2b of the metal tube 2 are housed in the tube housing groove 5c. Next, the sintered metal powder 4 is filled in the gap between the concave portion 5 a of the lower mold 5 and the metal tube 2. Next, the mold 6 is inserted such that the convex portion 6a of the upper mold 6 fits into the concave portion 5a of the lower mold 5, and the tube holder 6b of the upper mold 6 similarly fits into the tube accommodating groove 5c of the lower mold 5. And the lower mold 5 are combined.
[0022]
Next, as shown in FIG. 3, the lower metal mold 5 and the upper metal mold 6 are pressed from above and below at a predetermined pressure to compact the sintered metal powder 4. At this time, the upper surface of the shaft portion 5b of the lower die 5 corresponding to the screw holes 3a to 3d is in contact with the lower surface of the projection 6a of the upper die 6. Next, the compacted sintered metal powder 4 is heated at a predetermined temperature and subjected to a sintering process, whereby the sintered metal powder 4 shrinks to form the main body 1 in which the metal tube 2 is integrated. . Next, the lower mold 5 and the upper mold 6 are opened, and the heat receiver 10 is taken out. Screw holes 3 a to 3 d corresponding to the shaft 5 b of the lower mold 5 are formed in the main body 1 of the heat receiving body 10.
[0023]
In the heat receiving body 10 of the first embodiment manufactured as described above, when the coolant flows from the inflow portion 2a of the metal tube 2 in a state where the temperature of the body 1 is increased, the heat of the body 1 is transferred to the coolant. To increase the temperature of the coolant. The coolant whose temperature has risen flows out of the outflow portion 2b of the metal tube 2.
[0024]
According to the heat receiving body 10 of the first embodiment described above, the following effects can be obtained.
(A) Since the main body 1 and the metal tube 2 are integrated when the main body 1 is sintered and molded, the O-ring and the lid required in the conventional configuration are not required, and the leakage of the cooling liquid and the occurrence of corrosion occur. Can be prevented. In addition, since there is no gap between the metal tube 2 and the main body 1, corrosion caused by the gap does not occur.
(B) Since the entire periphery of the metal tube 2 except for the inflow portion 2a and the outflow portion 2b is surrounded by the main body 1, the entire peripheral surface of the metal tube 2 in contact with the main body 1 becomes a heat receiving surface, and the main body 1 The received heat can be efficiently conducted to the coolant.
(C) Since sealing with a lid is not required, secondary processing such as screw hole processing and channel groove processing is not required, and assembling processing of the lid is not required.
(D) When the main body 1 is formed by sintering, the volume of the sintered metal powder 4 which is a raw material of the main body 1 is reduced, so that the degree of adhesion between the metal tube 2 and the main body 1 is improved, and as a result, Conductivity is improved.
[0025]
In the above embodiment, the main body 1 of the heat receiving body 10 is formed from sintered metal powder. However, if the material has a high thermal conductivity, the main body 1 may be formed by using a resin or the like in which a metal is mixed into a resin or the like. Good. Further, in the above-described embodiment, a circular tube is used as the metal tube 2. However, an oval, elliptical, square, or box-shaped outer tube may be used, and the inner shape is an oval or oval. , Square or the like may be used. Further, in the above-described embodiment, the metal tube has a meandering shape, but may have a spiral shape or a character shape.
[0026]
FIG. 4 shows a configuration of a cooling device using the heat receiver 10 according to the second embodiment of the present invention. In this cooling device, the heat receiver 10 is applied to a desktop personal computer (hereinafter, referred to as a “PC”) 20. The personal computer 20 includes a housing 21 (with a side panel removed), a power supply device 22 built in the housing 21, a CD (Compact Disc) -ROM drive, a DVD (Digital Video Disc) drive, and the like. An angle 23 for mounting a 5-inch standard peripheral device, an angle 24 for mounting a flexible disk drive or a 3.5-inch standard peripheral device, and a motherboard (Motherboard) that operates by receiving power supply from a power supply device 22 ) 25 and a board 26 (graphic board, capture board) attached to an AGP (Accelerated Graphics Port) slot or a PCI (Peripheral Component Interconnect) slot of the motherboard 25. Etc.).
[0027]
The motherboard 25 has a CPU mounted thereon. The heat receiving body 10 is attached to the CPU using a means such as screwing or bonding with an adhesive. A pair of piping tubes 27a and 27b are connected to the inflow portion 2a and the outflow portion 2b of the metal tube 2 of the heat receiver 10, and a liquid circulation pump 28 is inserted in the middle of the piping tube 27a. A radiator 29 is attached to the ends of the pipe tubes 27a and 27b. Further, a tank (not shown) for replenishing the coolant to the piping tubes 27a and 27b as necessary is connected to the piping tubes 27a or 27b.
[0028]
The radiator 29 has a heat radiation structure based on the same principle as that of a radiator of an automobile. The radiator 29 is configured by combining an axial fan (not shown) with the radiator 29 and attached to a panel surface of the housing 21. The pipe tubes 27a and 27b are made of a water-impermeable material that does not leak when the cooling liquid permeates. For example, a butyl rubber tube is used for applications requiring flexibility, a copper tube is used for applications requiring no flexibility, Metal tubes such as copper alloy tubes and stainless steel tubes are used.
[0029]
In FIG. 4, the liquid circulation pump 28 operates simultaneously with turning on the power of the personal computer 20 or when the CPU reaches a predetermined temperature. When the liquid circulation pump 28 operates, the coolant circulates in the path of the liquid circulation pump 28, the piping tube 27a, the heat receiving body 10, the radiator 29, the piping tube 27b, and the liquid circulation pump 28. The heat generated by the CPU is transmitted to the main body 1 of the heat receiving body 10 and further transmitted to the metal tube 2. The heat of the metal tube 2 is transferred to the coolant flowing inside, and the heated coolant is discharged from the heat receiver 10 and further carried into the radiator 29 through the pipe tube 27b. The radiator 29 radiates heat to the atmosphere, and the cooling liquid cooled by the heat radiation is supplied to the heat receiver 10 through the piping tube 27a and the liquid circulation pump 28.
[0030]
According to the above-described second embodiment, the coolant circulates between the heat receiver 10 and the radiator 29, whereby the temperature of the heat receiver 10, that is, the temperature of the CPU is maintained at a predetermined temperature or lower, and Overheating can be prevented. Since the heat receiving body 10 has a configuration in which the main body 1 and the metal tube 2 are integrated by sintering, thermal efficiency is increased, and a heat generating body such as a CPU can be efficiently cooled. Further, with the same thermal efficiency, the volume of the heat receiver 10 can be made smaller than that of the heat receiver of the conventional configuration, so that the space occupied by the heat receiver on the CPU can be reduced. Is not cramped. Further, since the heat receiving body 10 has a structure in which the main body 1 and the metal tube 2 are integrated, there is no possibility of liquid leakage or the like, and reliability and long life can be achieved.
[0031]
In the above-described second embodiment, the heat receiver 10 is provided directly on the heat generator such as the CPU. However, the heat receiver 10 having good heat conductivity generally used for mounting a radiator of a semiconductor element is used. It is also possible to attach the heat receiving body 10 via a metal (for example, a sheet-shaped metal plate is cast or forged on the contact surface with the heating element), a resin such as an adhesive sheet, or a compound such as silicon grease. is there. Thereby, the heat transfer from the heating element to the heat receiving element 10 can be enhanced.
In the second embodiment, the cooling device that circulates the cooling liquid between the heat receiver 10 and the radiator 29 has been described. However, the present invention relates to a heating device that circulates a heating medium through the heat receiver. Is also applicable.
[0032]
【The invention's effect】
As described above, according to the heat receiving body of the present invention, by forming the main body by sintering and integrating the main body and the metal pipe through which the coolant flows, the entire outer periphery of the metal pipe can be used as a heat receiving surface. In addition, since the main body shrinks when the main body is sintered, the degree of adhesion to the metal pipe increases, so that the thermal efficiency can be improved. Furthermore, leakage and permeation of the coolant can be prevented, corrosion resistance can be improved, and secondary processing can be reduced and assembly processing costs can be reduced.
[0033]
Further, according to the cooling device using the heat receiving body of the present invention, the use of the heat receiving body in which the main body is formed by sintering and the main body and the metal tube are integrated can prevent the occurrence of liquid leakage and liquid permeation. It is excellent in corrosion resistance and can reduce the cost of secondary processing and assembly processing. Further, if the heat efficiency is the same, the volume of the heat receiving body can be made smaller than that of the heat receiving body of the conventional configuration, so that a cooling device having a small size and excellent cooling performance can be obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view of a heat receiver according to a first embodiment of the present invention.
FIG. 2 is a perspective view for explaining an example of a method for manufacturing a heat receiver according to the first embodiment of the present invention.
FIG. 3 is a perspective view for explaining an example of a method for manufacturing a heat receiver according to the first embodiment of the present invention.
FIG. 4 is a perspective view illustrating a configuration of a cooling device according to a second embodiment of the present invention.
FIG. 5 is a plan view showing a first configuration example of a conventional heat receiving body.
FIG. 6 is a plan view showing a state where a lid is attached to the heat receiving body of FIG. 5;
FIG. 7 is a perspective view showing a second configuration example of a conventional heat receiving body.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Main body 1A Pipe extraction surface 2 Metal pipe 2a Inflow part 2b Outflow part 3a, 3b, 3c, 3d Screw hole part 4 Sintered metal powder 5 Lower mold 5a Concave part 5b Shaft part 5c Pipe accommodation groove 6 Upper mold 6a Convex part 6b Pipe holder 10 Heat receiving body 20 Personal computer 21 Housing 22 Power supply device 23, 24 Angle 25 Motherboard 26 Board 27 Piping tube 28 Liquid circulation pump 29 Radiator 100 Heat receiving body 101 Main body 101a, 101b Connection port 102a, 102b, 102c, 102d Screw Hole 103 Flow channel 104 Opening 105 O-ring 106 Lid 107 Screw 201 Metal plate 202 Metal pipe 203 Brazing part

Claims (6)

A heat receiver attached to a heating element, receiving heat conducted from the heating element and performing cooling using a cooling liquid supplied from the outside,
A pipe for circulating the coolant,
A heat receiving body comprising: a heat receiving surface that receives heat based on heat conduction from the heat generating body; and a main body formed by sintering so as to be in contact with an outer periphery of the pipeline. The heat receiving body according to claim 1, wherein the pipe is formed of a pipe made of stainless steel, copper, or an alloy thereof. The heat receiving body according to claim 1, wherein the main body is made of a sintered metal powder containing copper or a copper alloy as a main component. A pipe through which a coolant flows, and a main body formed by sintering so as to have a heat receiving surface for receiving heat based on heat conduction from the heating element and to be in contact with an outer periphery of the pipe; A heat receiving body that conducts heat conducted from the heating body to the coolant circulated through the pipeline,
A radiator that radiates heat that conducts heat from the heat receiver to the coolant;
A pair of conduits connected between the heat receiving body and the heat radiating unit and circulating the coolant,
A cooling device that is provided in the middle of the pair of pipes and that circulates the cooling liquid. The cooling device according to claim 4, wherein the body is formed of a material that increases thermal conductivity on a contact surface with the heating element. The cooling device according to claim 5, wherein the material that enhances the thermal conductivity is a metal material, a resin material, or a compound having a high thermal conductivity.

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