JP2004353003A - Electrolysis method and electrolysis apparatus for electroconductive treatment liquid for substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrolysis method which maintains the purity of an electrolytic solution produced when electrolyzing an electroconductive treatment liquid for treating the surface of a substrate, and besides electrolyzes the liquid in situ, and to provide an electrolysis apparatus therefor. <P>SOLUTION: The electrolysis apparatus 14 for electrolyzing the electroconductive treatment liquid for treating a substrate (A) comprises a magnet 28 for generating a magnetic field (B) having the predetermined intensity and the predetermined direction of the magnetic field, around the surface A1 to be treated of the substrate (A); and an electroconductive treatment liquid-feeding means 30 which supplies the electroconductive treatment liquid to the surface A1, and passes the electroconductive treatment liquid so as to cross in the magnetic field (B) at a predetermined flow rate along the surface A1, to thereby generate an electric field (E) in the electroconductive treatment liquid and electrolyze the electroconductive treatment liquid. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electrolysis method and an electrolysis apparatus for a conductive treatment liquid for a substrate, and more particularly, to an electrodeless in-situ electrolysis method and an electrolysis apparatus.
[0002]
[Prior art]
Conventionally, when cleaning, etching, or rinsing a semiconductor substrate using a conductive processing liquid, the conductive processing liquid is used as functional water such as ozone water, or the conductive processing liquid is electrolyzed by electrolysis. It has been used as water.
[0003]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 7-256259
A conventional method and apparatus for electrolyzing a conductive treatment liquid for a substrate is disclosed in, for example, Patent Document 1.
[0005]
The electrolysis method and apparatus include an electrolysis tank filled with a conductive processing solution to be electrolyzed, a diaphragm that divides the electrolysis tank into two spaces, and a pair of cells each immersed in the electroconductive processing solution in each space. And an electrode, wherein a predetermined applied voltage is applied between the pair of electrodes to electrolyze the electroconductive treatment liquid, thereby generating an anolyte around the positive electrode and a catholyte around the negative electrode. Things.
[0006]
For example, when a substrate is subjected to cleaning processing, an electrolytic solution to be used differs depending on impurities attached to a substrate to be cleaned.
[0007]
To explain this point, in general, the anode water has a high oxidation-reduction potential (ORP) because of its oxidizing property, whereas the cathode water has a low oxidation-reduction potential because of its reducing property. In this case, an anolyte, an anolyte in the case of an organic substance, and a catholyte in the case of particles are required, and an electrolyte having a desired pH value or an ORP value is generated, respectively. Each processing of the substrate is performed using the liquid.
[0008]
[Problems to be solved by the invention]
However, such a conventional electrolysis method and apparatus have the following technical problems.
[0009]
First, an electrolytic solution cannot be generated at a substrate processing site. More specifically, once an electrolytic solution is generated in the electrolytic bath, the electrolytic solution is fed through a conductive processing solution supply pipe that connects the electrolytic bath and the processing site, and the substrate is processed, for example, in a cleaning process. Needed to use. As described above, since the electrolytic solution generation site and the processing site are separated from each other, there arises a problem that, for example, impurities are mixed in the electrolytic solution fed from the inner wall of the conductive processing solution supply pipe with time. With the recent ultra-fine pattern, especially in the cleaning process of the substrate, the conductive processing solution used for cleaning is required to have a considerably high purity. From this point, realization of an in-situ electrolysis method is strongly desired.
[0010]
Second, since a pair of electrodes and a diaphragm are required, equipment costs are increased, and the purity of the generated electrolytic solution is reduced. The pair of electrodes immersed in the conductive processing solution dissolves into the conductive processing solution over time, thereby lowering the purity of the electrolytic solution. If such leaching is to be prevented, an expensive electrode with a predetermined coating is required. From this point, it is strongly desired to realize an electrodeless electrolysis apparatus.
[0011]
Third, such an electrolysis method and apparatus are not compatible with a single-wafer spin processing method. More specifically, as a method of processing the substrate, there are an immersion method in which the substrate is immersed in a conductive processing liquid, and a spin processing in which the conductive processing liquid is supplied to the surface of the substrate, particularly the central portion while rotating the substrate at a high speed. It is roughly divided into the method. In this regard, in the case of the spin treatment method, if a conventional electrolytic device is applied, the generated electrolytic solution is once gathered around the electrodes in the electrolytic cell, so that the electrolytic solution is directed to the substrate to be processed again. Therefore, it is necessary to electrolyze the conductive processing solution to be supplied to the substrate in advance, and to select the necessary electrolyte solution depending on the process from the anode water or the cathode water generated around each of the positive and negative electrodes. And supply it to the spin processor. As described above, it is indispensable to separately separate the electrolytic treatment of the conductive treatment liquid and the treatment of the substrate with the conductive treatment liquid, which is inferior in integration as a substrate treatment system. In this regard, it is desired to realize an electrolysis method that can be adapted to a single-wafer spin processing method.
[0012]
Fourth, it is difficult to generate an electrolyte when processing a substrate. More specifically, as described above, it is usual to generate an electrolytic solution in an electrolytic bath in advance, and to feed the electrolytic solution from the electrolytic bath when the substrate is treated with the electrolytic solution. The oxidation-reduction potential (ORP) of the solution changes over time, and it is often difficult to perform treatment with a desired electrolytic solution. In this regard, it is desired to realize a technique capable of generating an electrolyte at the time of processing a substrate without preparing and storing the electrolyte.
[0013]
Therefore, in view of the above problems, an object of the present invention is to provide an electrolysis method capable of performing in-situ electrolysis while maintaining the purity of the generated electrolytic solution when electrolyzing a conductive processing solution for treating the surface of a substrate. An electrolysis device is provided.
[0014]
An object of the present invention is to provide an electrolysis method and an electrolysis apparatus capable of electrolyzing a conductive processing solution at the time of processing a substrate when the conductive processing solution for processing the surface of the substrate is electrolyzed. .
[0015]
An object of the present invention is to provide an inexpensive electrolysis apparatus that realizes electrodeless operation when electrolyzing a conductive processing solution for processing the surface of a substrate.
[0016]
An object of the present invention is to provide an electrolysis method and an electrolysis apparatus suitable for single-wafer spin processing when electrolyzing a conductive processing solution for processing the surface of a substrate.
[0017]
[Means for Solving the Problems]
In order to achieve the above object, a method for electrolyzing a conductive treatment solution according to the present invention comprises:
In an electrolysis method of a conductive processing solution for processing a substrate,
Causing a flow of the conductive processing liquid toward the substrate;
Generating a magnetic field oriented so as to cross the flow of the conductive processing solution,
Thereby, an electric field is generated in the conductive processing liquid to electrolyze the conductive processing liquid.
[0018]
Further, the flow generating step includes supplying a conductive processing liquid toward a surface of the substrate to be processed, and flowing the conductive processing liquid along the surface.
Preferably, the step of generating a magnetic field includes the step of generating a magnetic field around the surface having a predetermined magnetic field strength at the surface.
[0019]
Further, an electrical circuit may be formed by electrically connecting the liquid surface of the conductive processing liquid supplied to the surface of the substrate to be processed and the surface of the substrate to be processed using an external lead wire. Good.
[0020]
Further, the flowing of the conductive processing liquid preferably includes a step of rotating the substrate in a substantially horizontal plane and a step of supplying the conductive processing liquid toward the center of the rotating substrate.
[0021]
In addition, the method further comprises the step of providing, on the surface to be treated of the substrate, annular regions to which the magnetic field extends and annular regions to which the magnetic field does not extend alternately concentrically around the center of the substrate and radially outward of the substrate. Good.
[0022]
In addition, during the electrolysis of the conductive processing solution, the method includes a step of adjusting the flow of the conductive processing solution and / or the magnetic field strength according to the pH value and / or the oxidation-reduction potential value of the electrolytic solution. May be.
[0023]
In order to achieve the above object, an electrolysis apparatus for a conductive treatment liquid according to the present invention includes:
In an electrolysis apparatus for electrolyzing a conductive processing solution for processing a substrate,
A magnet that produces a magnetic field around the surface of the substrate to be processed having a predetermined magnetic field strength and a predetermined magnetic field orientation on the surface to be processed;
A conductive processing liquid supplying means for supplying the conductive processing liquid toward the surface, and causing the conductive processing liquid to flow across the magnetic field at a predetermined flow rate along the surface,
Thus, an electric field is generated in the conductive processing liquid to electrolyze the conductive processing liquid.
[0024]
Further, the magnet is a coil electromagnet, and the magnetic field strength on the surface of the substrate to be processed is preferably adjusted by adjusting the current supplied to the coil.
[0025]
Further, it is preferable that the apparatus further includes substrate rotating means for rotating the substrate in a substantially horizontal plane, and the conductive processing liquid supply means supplies the conductive processing liquid toward the center of the rotating substrate.
[0026]
Furthermore, the substrate rotating means is capable of adjusting the number of rotations of the substrate, and preferably adjusting the number of rotations of the substrate to adjust a predetermined flow rate of the conductive processing liquid along the surface of the substrate to be processed. .
[0027]
[Action]
According to the present invention having the above-described configuration, by causing a flow toward the substrate in the conductive processing liquid of the substrate and traversing in the magnetic field, the flow direction of the conductive processing liquid and the direction of the magnetic field can be used for framing. According to the right-hand rule, an electric field is generated in the conductive processing liquid in the depth direction. Next, the charged particles in the conductive processing solution receive a force due to the generated electric field, move in the processing solution, generate an eddy current in the processing solution, and the generated eddy current crosses the magnetic field, thereby causing a fleming. Lorentz force is generated based on the left hand rule. The charged particles generate spiral motion by Lorentz force, and repeatedly collide with charged particles around the processing solution, thereby causing electrolysis of the processing solution and further accelerating ionization, so that the charge of the charged particles is increased. Depending on whether it is positive or negative, it moves to the liquid surface side of the processing liquid or the surface side of the substrate to be processed, and as a result, a positive and negative ion concentration distribution occurs in the processing liquid in the depth direction.
[0028]
At this point, as in the conventional electrolysis technique, in the electrode tank having a pair of electrodes and a diaphragm, the electroconductive treatment liquid is separately electrolyzed by an externally applied voltage, and then the generated electrolyte is supplied toward the substrate. Eliminating the need makes it possible to reduce the chances of contamination of the conductive processing solution with impurities, and also allows the conductive processing solution to be processed in situ at the time of processing the substrate without the need to create and store an electrolytic solution. Can be electrolyzed.
[0029]
In particular, by rotating the substrate at a high speed, the conductive processing liquid supplied toward the substrate by the action of the centrifugal force flows radially outward toward the outer peripheral edge of the substrate, and a predetermined strength is applied around the surface of the substrate to be processed. By providing such a magnetic field, it is possible to direct any desired electrolytic solution of the generated electrolytic solution to the substrate to be treated, either the cathode water or the anodic water, and to conduct the electrolysis of the conductive processing solution. And the processing of the substrate using the electrolytically conductive processing solution by the spin processing method can be integrated and integrated, and an electrolysis method suitable for the spin processing method can be realized.
[0030]
Note that, in this specification, the term “substrate treatment” is used to include a substrate cleaning treatment, a rinsing treatment, and an etching treatment, and the conductive treatment liquid is a chemical solution or a carbon dioxide gas in which an electrolyte is dissolved. It is used to include pure water and ultrapure water.
[0031]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an example of a case where the cleaning treatment of impurities adhered to the surface of the substrate is performed by a single-wafer spin treatment method will be described with reference to the drawings. This will be described in detail.
[0032]
FIG. 1 is a schematic diagram showing a processing unit according to the first embodiment of the present invention. FIG. 2 is a schematic diagram showing the electrolytic action of the first embodiment according to the present invention. FIG. 3 is a conceptual diagram showing the action of the direction of the magnetic field of the first embodiment according to the present invention.
[0033]
As shown in FIG. 1, the processing unit 10 for the substrate A is schematically constituted by a rotation holding device 12 for the substrate A and an electrolysis device 14 for a conductive processing liquid.
[0034]
As shown in FIG. 1, the rotation holding device 12 for the substrate A includes a spin chuck 16 rotatable about a substantially vertical axis X, and a driving unit 18 for driving the spin chuck 16 to rotate. The spin chuck 16 has a substantially horizontal upper surface A120 that forms a so-called chuck surface. The size of the upper surface A120 is larger than the outer diameter of the substrate A, and the outer diameter of the substrate A is, for example, 8 inches or 12 inches. is there. At least three support pins 22 are arranged on the upper surface A1 at equal angular intervals in the circumferential direction of the chuck surface, and the substrate A is held by these support pins 22.
[0035]
The drive unit 18 has a mechanism for rotating the shaft unit, and includes a motor, a pulley connected to the motor, a pulley connected to the shaft unit, and a transmission belt (not shown) for transmitting rotation between the pulleys. And The drive unit 18 rotates the shaft portion, the chuck surface, and thus the support pins 22 that support the substrate A around the rotation axis X. The rotation speed of the substrate A is determined according to the process of the substrate A, and is generally 200 to 2000 RPM in the case of the processing process and 3000 to 5000 RPM in the case of the drying process.
[0036]
The conductive treatment liquid is an acid, alkali or organic solvent or other chemical solution, pure water or deionized water, etc., and the contents of the treatment, for example, the object to be removed and cleaned is any foreign matter such as particles, polymers, metals, or an oxide film. It may be determined appropriately depending on which film, such as a nitrogen film, a deteriorated film generated by CMP, or the like.
[0037]
An annular flow path 24 is provided around the substrate A so as to surround the outer peripheral edge of the substrate A, and the conductive processing liquid supplied to the upper surface A1 of the substrate A is applied to the substrate A by centrifugal force. When the conductive processing liquid is scattered outward toward the outer peripheral edge, the conductive processing liquid is received and collected in the annular flow path 24, and can be reused in some cases.
[0038]
Next, the electrolysis apparatus 14 for electroconductive treatment liquid has an apparatus for supplying an electroconductive treatment liquid to the substrate A, and a magnet 28 disposed above the surface A1 of the substrate to be treated.
[0039]
The apparatus for supplying a conductive processing liquid to the substrate A is configured to supply the conductive processing liquid toward the center of the upper surface A1 of the substrate A, and the control valve, the flow meter, and the filter ( A processing supply nozzle 30 is provided above the substrate A via any of them (not shown).
[0040]
The outlet opening 32 of the conductive processing liquid supply nozzle 30 is positioned directly above the center of the substrate A so that the conductive processing liquid from the supply source flows inside and is supplied toward the center of the substrate. The conductive processing liquid supplied to the center of the substrate A that rotates at a high speed (for example, 200 rpm to 2000 rpm) in a substantially horizontal plane, along the surface A1 of the substrate to be processed, as shown in FIG. And scatter radially outward toward the outer peripheral edge of the substrate. The flow rate of the processing liquid is approximately several m / s to several tens m / s.
[0041]
The magnet 28 is arranged above the substrate A, has a predetermined magnetic field strength on the surface A1, and has a magnetic field having a component along the surface A1 (in the figure, a square box is indicated by two diagonal lines, A permanent magnet or an electromagnet may be used as long as it generates a magnet that indicates the direction in which it is drawn from the front to the back of the drawing). Thereby, the conductive processing liquid can flow along the surface A1 of the substrate so as to cross the magnetic field. A magnet protection disk 34 is attached to the side peripheral surface of the processing liquid supply nozzle 30, intervenes between the magnet 28 and the substrate A almost parallel to the substrate so as to cover the substrate A, and spreads in the radial direction of the substrate A, The processing liquid supplied toward the substrate A does not adversely affect the magnet. The diameter of the magnet protection disk is at least as large as the diameter of the substrate A, and the material thereof is preferably a non-magnetic material, for example, a synthetic resin.
[0042]
As the magnet, for example, a Magnegen pipe protector (trade name) of Magnegen Corporation of the United States may be used. This magnet has a magnetic flux density of 2 to 2.5 Tesla, a high performance neodymium magnet, dimensions 33 mm × 35 mm × 27 mm, weighs 300 g, and can be arranged to fit on an 8-inch or 12-inch substrate.
[0043]
The material of a member of the processing unit that comes into contact with the conductive processing liquid is selected from synthetic resins such as Teflon (registered trademark), polypropylene, PVDF, and vinyl chloride, and in some cases, stainless steel according to the conductive processing liquid to be used. Is good.
[0044]
The operation of the electrolysis apparatus having the above configuration will be described below together with the electrolysis method.
[0045]
First, the substrate A supported by the support pins 22 is rotated at a high speed by the rotation holding device 12, and a substrate that rotates at a high speed in a substantially horizontal plane from the conductive processing liquid source via the conductive processing liquid supply nozzle 30 should be processed. Supply toward surface A1. As shown in FIG. 2, the conductive treatment liquid that has reached the surface A1 scatters radially outward (arrow M) toward the outer peripheral edge of the substrate A along the surface A1 by the action of centrifugal force. This makes it possible to treat the entire surface A1 of the substrate A with the conductive treatment liquid.
[0046]
At that time, the conductive processing liquid flows so as to cross the magnetic field B provided around the surface A1 of the substrate. Therefore, as shown in FIG. 2, an electric field E is generated in the conductive processing liquid in the depth direction of the processing liquid by the Fleming's right-hand rule according to the flow direction of the conductive processing liquid and the direction of the magnetic field. Next, charged particles P in the conductive processing liquid (indicated by negative charged particles in the figure) move in the processing liquid under the force of the generated electric field E, and generate an eddy current in the processing liquid. When the generated eddy current crosses the magnetic field B, Lorentz force is generated based on Fleming's left-hand rule. The charged particles P repeatedly generate collisions with charged particles around the processing solution while causing a spiral motion by Lorentz force, thereby causing electrolysis of the processing solution and further accelerating ionization, and further increasing the charge of the charged particles. Moves to the liquid surface LS side of the processing liquid or the surface A1 side of the substrate A depending on whether is positive or negative, and as a result, a distribution of positive and negative ion concentrations occurs in the processing liquid in the depth direction.
[0047]
At this time, the flow of the conductive processing liquid has a component orthogonal to the magnetic field, unless the direction of the flow of the processing liquid and the direction of the magnetic field are parallel, so that only the magnetic field B having a predetermined magnetic field strength can be crossed. It is possible to generate an electric field E in the conductive processing liquid to perform electrolysis of the conductive processing liquid. If the magnetic field strength is the same, it is desirable that the direction of the flow of the conductive treatment liquid and the direction of the magnetic field be orthogonal.
[0048]
In determining the flow velocity of the processing liquid and the strength of the magnetic field, the kinetic energy of the charged particles in the processing liquid increases as the flow velocity increases, while the Lorentz force increases as the magnetic field strength increases in the radial direction of the substrate of the charged particles. It will act as a brake against movement in the direction. Therefore, the kinetic energy of the charged particles in the processing liquid is used as ionization energy as the residence time from when the processing liquid is supplied to the surface A1 of the substrate A to when the processing liquid passes through the outer peripheral edge of the substrate and scatters from the surface A1. It is necessary to consider the balance between the flow rate of the processing solution and the strength of the magnetic field from the viewpoint of accelerating the electrolysis of the processing solution and securing sufficient time to increase the ion concentration in the processing solution.
[0049]
By adjusting the direction of the magnetic field, it is possible to select the cathode water or the anode water to be directed to the surface A1 of the substrate to be treated. Specifically, as shown in FIG. 3, if the substrate is treated using anode water in FIG. 3 (A), it is generated only by reversing the direction of the magnetic field as shown in FIG. 3 (B). By reversing the direction of the generated electric field E, it becomes possible to direct the cathode water to the substrate.
[0050]
In addition, by monitoring the pH value and / or ORP value of the generated electrolytic solution, the intensity of the magnetic field and / or the flow rate of the conductive processing solution can be adjusted during the generation of the electrolytic solution to obtain the desired pH value. Values and / or ORP values may be achieved. In this case, the flow of the conductive processing liquid along the surface A1 of the substrate is adjusted by adjusting the magnetic field through the adjustment of the current value flowing through the coil, or by adjusting the rotation speed of the substrate, using the magnet as a coil electromagnet. , The degree of electrolysis may be adjusted.
[0051]
As described above, the electrolysis apparatus and electrolysis method of the present embodiment employ a completely different electrolysis technique from the related art, and utilize the flow generated in the conductive processing liquid instead of the externally applied voltage, so that the spinning of the substrate is performed. Applicable to the processing method, the electrolysis of the conductive processing liquid is performed integrally and integrally with the processing of the substrate surface A1 by the flow of the conductive processing liquid for processing the entire surface A1 of the rotating substrate. Is what makes it possible.
[0052]
Further, the electrolysis apparatus and the electrolysis method of the present embodiment can electrolyze (in-situ) the electroconductive processing solution at the time of processing a substrate without the need for an electrode and a diaphragm. Therefore, it is possible to reduce the equipment cost and the required space as compared with the case where separate electrolysis equipment is required.
[0053]
Further, the electrolysis apparatus and the electrolysis method of the present embodiment can direct a necessary electrolyte solution of the generated cathode water or anode water toward the surface A1 of the substrate to be treated, and as a result, the necessary It is possible to avoid reducing the amount of the conductive processing liquid or increasing the concentration of the conductive processing liquid.
[0054]
Furthermore, the electrolysis apparatus and the electrolysis method of the present embodiment can adjust the characteristics of the electrolytic solution during generation of the required electrolytic solution.
[0055]
As a modified example, in the present embodiment, the conductive processing liquid is supplied toward the center of the high-speed rotating substrate, and is described as being scattered radially outward from the center of the substrate by the action of centrifugal force. The present invention is not limited thereto, and the conductive processing liquid may be supplied to a non-rotating substrate as long as the conductive processing liquid flows across the magnetic field. In this case, an electric circuit is formed by electrically connecting the liquid surface of the conductive processing liquid supplied to the surface of the substrate to be processed and the surface of the substrate to be processed using an external lead wire. Alternatively, the electrolysis of the conductive treatment liquid may be further promoted.
[0056]
As another modification, a magnet may be additionally provided around the conductive processing liquid supply nozzle 30, particularly around the outlet outflow opening 32. Thus, the conductive processing liquid from the conductive processing liquid supply source can flow across the magnetic field in the conductive processing liquid supply nozzle 30, and the conductive processing liquid flows in the same manner as the conductive processing liquid flowing on the surface A1 of the substrate. According to Fleming's right-hand rule, an electric field is generated in the conductive processing solution, which makes it possible to electrolyze the conductive processing solution before processing the surface A1 of the substrate with the conductive processing solution. Become.
[0057]
The role may be shared with the magnetic field provided for the conductive treatment liquid flowing on the surface A1 of the substrate. That is, the magnetic field provided around the conductive processing liquid supply nozzle 30 performs an electrolysis function of the conductive processing liquid, while the magnetic field provided for the conductive processing liquid flowing on the surface A1 of the substrate is applied to the surface A1 to be processed. Only the adjustment function of selecting either the cathode water or the anode water as the electrolyte to be directed may be performed. This makes it possible to reduce the required magnetic field strength of the magnetic field provided for the conductive processing liquid flowing on the surface A1 of the substrate, as compared with the case where the conductive processing liquid also has an electrolytic function.
[0058]
Hereinafter, a second embodiment will be described with reference to the drawings. In the present embodiment, the same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted. The features of the present embodiment will be described below. FIG. 4 is a view similar to FIG. 2 of a second embodiment according to the present invention.
[0059]
The feature of this embodiment lies in the arrangement of the magnetic field. More specifically, in the first embodiment, the region to which the magnetic field reaches is continuously and radially outward from the center of the substrate in the radial direction. Is provided with a region that is not affected by a magnetic field. That is, as shown in FIG. 4, an annular magnetic field B1 is generated over a predetermined length radially outward from the vicinity of the center of the substrate, and the magnetic field B1 is separated from the magnetic field B1 by a predetermined distance d radially outward. Similarly to the above, an annular magnetic field B2 is generated. The interval d in the figure indicates a region that is not affected by a magnetic field. For example, a magnetic field B1 may be generated by disposing one magnet, and a magnetic field B2 may be generated by disposing another magnet. In this case, by adjusting the distance between the magnet and the surface A1 of the substrate A, a region to which the magnetic field does not reach may be formed.
[0060]
As described above, by alternately providing the annular region to which the magnetic field extends and the annular region to which the magnetic field does not extend concentrically with the center of the substrate radially outward of the substrate, the magnetic field does not reach as shown in FIG. In the conductive processing solution in the annular region, a carrier flow D is generated in a direction opposite to the direction of the electric field generated in the conductive processing solution in the magnetic field region, and as a result, countless circuits unstable in the conductive processing solution. Is repeatedly formed and disappears, thereby causing a current to flow in the conductive processing liquid, thereby making it possible to further promote electrolysis of the conductive processing liquid as compared with the first embodiment.
[0061]
As described above, the embodiments of the present invention have been described in detail. However, various changes and modifications can be made by those skilled in the art within the scope of the present invention described in the claims.
[0062]
For example, when electrolyzing a conductive treatment liquid for treating the lower surface of the substrate, a magnet may be disposed above the substrate, or conversely, below the substrate, as in the present embodiment.
[0063]
Further, when electrolyzing a conductive processing solution for simultaneously processing the upper and lower surfaces of the substrate, magnets are disposed above and below the substrate, and the upper and lower surfaces of the substrate are to be processed in situ. Sometimes it is also possible to electrolyze the conductive treatment liquid.
[0064]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to the electrolysis method and electrolysis apparatus of the electroconductive processing solution which processes the board | substrate of this invention, when electrolyzing the electroconductive processing solution which processes the surface of a board | substrate, while maintaining the purity of the electrolysis solution produced, simultaneously performing in-situ electrolysis It is possible to do.
[0065]
According to the method and apparatus for electrolyzing a conductive processing solution for processing a substrate of the present invention, when the electroconductive processing solution for processing the surface of the substrate is electrolyzed, the electroconductive processing solution is electrolyzed when the substrate is processed. It is possible.
[0066]
ADVANTAGE OF THE INVENTION According to the electrolysis apparatus of the electroconductive processing liquid which processes the board | substrate of this invention, when electrolyzing the electroconductive processing liquid which processes the surface of a board | substrate, it is possible to use an inexpensive apparatus which realized electrode-less.
[0067]
ADVANTAGE OF THE INVENTION According to the electrolysis apparatus of the electroconductive processing liquid which processes the board | substrate of this invention, when electrolyzing the electroconductive processing liquid which processes the surface of a board | substrate, it can be adapted to a single wafer type spin process.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing a processing unit of a first embodiment according to the present invention.
FIG. 2 is a schematic diagram showing the electrolytic action of the first embodiment according to the present invention.
FIG. 3 is a conceptual diagram illustrating an action of a direction of a magnetic field according to the first embodiment of the present invention.
FIG. 4 is a view similar to FIG. 2 of a second embodiment according to the present invention;
[Explanation of symbols]
A substrate A1 surface X axis B magnetic field E electric field L conductive processing liquid LS liquid level 10 processing unit 12 substrate rotation holding device 14 electrolysis device 16 spin chuck 18 drive unit 20 upper surface 22 support pin 23 annular flow path 28 magnet 30 conductivity Treatment liquid supply nozzle 32 Outflow opening 34 Magnet protection disk

Claims (10)

In an electrolysis method of a conductive processing solution for processing a substrate,
Causing a flow of the conductive processing liquid toward the substrate;
Generating a magnetic field oriented so as to cross the flow of the conductive processing solution,
Thus, a method of generating an electric field in the conductive processing liquid and electrolyzing the conductive processing liquid. The flow generating step includes supplying a conductive processing liquid toward a surface of the substrate to be processed, and flowing the conductive processing liquid along the surface.
The electrolysis method according to claim 1, wherein the step of generating a magnetic field includes a step of generating a magnetic field having a predetermined magnetic field strength around the surface around the surface. 3. An electric circuit is formed by electrically connecting a liquid surface of a conductive processing liquid supplied to a surface of the substrate to be processed and a surface of the substrate to be processed using an external lead wire. 3. The electrolysis method according to 1., 3. The electrolysis method according to claim 2, wherein flowing the conductive treatment liquid includes rotating the substrate in a substantially horizontal plane and supplying the conductive treatment liquid toward the center of the rotating substrate. 5. The method according to claim 4, further comprising the step of providing, on the surface to be treated of the substrate, annular regions that are affected by a magnetic field and annular regions that are not affected by a magnetic field, alternately and concentrically around the center of the substrate and radially outward of the substrate. The electrolytic method according to the above. 2. The method according to claim 1, further comprising, during electrolysis of the conductive processing solution, adjusting a flow of the conductive processing solution and / or the magnetic field strength according to a pH value and / or an oxidation-reduction potential value of the electrolytic solution. An electrolysis method according to claim 5. In an electrolysis apparatus for electrolyzing a conductive processing solution for processing a substrate,
A magnet that produces a magnetic field around the surface of the substrate to be processed having a predetermined magnetic field strength and a predetermined magnetic field orientation on the surface to be processed;
A conductive processing liquid supplying means for supplying the conductive processing liquid toward the surface, and causing the conductive processing liquid to flow across the magnetic field at a predetermined flow rate along the surface,
Thus, an electric field is generated in the conductive processing solution to electrolyze the conductive processing solution. The electrolysis apparatus according to claim 7, wherein the magnet is a coil electromagnet, and adjusts a current supplied to the coil to adjust a magnetic field intensity on a surface of the substrate to be processed. 8. The electrolytic apparatus according to claim 7, further comprising substrate rotating means for rotating the substrate in a substantially horizontal plane, wherein the conductive processing liquid supply means supplies the conductive processing liquid toward the center of the rotating substrate. 10. The substrate rotation unit according to claim 9, wherein the substrate rotation unit is capable of adjusting the rotation speed of the substrate, and adjusting the rotation speed of the substrate to adjust a predetermined flow rate of the conductive processing liquid along the surface of the substrate to be processed. Electrolysis equipment.

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