JP2004351824A - Method and apparatus for producing porous front plate honeycomb panel - Google Patents

Method and apparatus for producing porous front plate honeycomb panel Download PDF

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JP2004351824A
JP2004351824A JP2003154128A JP2003154128A JP2004351824A JP 2004351824 A JP2004351824 A JP 2004351824A JP 2003154128 A JP2003154128 A JP 2003154128A JP 2003154128 A JP2003154128 A JP 2003154128A JP 2004351824 A JP2004351824 A JP 2004351824A
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face plate
laminated
plate
adhesive
curing
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JP3753707B2 (en
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Mitsuyasu Yoda
光恭 與田
Atsushi Goto
淳 後藤
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Kawasaki Heavy Industries Ltd
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Kawasaki Heavy Industries Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing a porous face plate honeycomb panel which can suppress the closing of the pores of the face plate by an adhesive and curtail a production time and an apparatus which is used directly in the implementation of the method. <P>SOLUTION: A laminated front plate 4 in which a film-like adhesive 9 is laminated on a prepreg face plate 7 made of an uncured prepreg of reinforcing fibers impregnated with a synthetic resin is bored, and the prepreg face plate 7 of the bored front plate 4 is cured. One surface of a honeycomb core is adhered to the adhesive 9, and the laminated face plate 4 is adhered to the honeycomb core. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、複合材面板に多数の孔を設けた複合材製多孔板をハニカムコアに接着してなる多孔面板ハニカムパネルの製造方法及び当該方法の実施に直接使用する装置に関する。
【０００２】
【従来の技術】
航空機のエンジンナセル等には、軽量且つ高剛性であり、また吸音性能を有する多孔面板ハニカムパネルが用いられている。この多孔面板ハニカムパネルは、多数の孔が設けられたアルミニウム又は複合材等の面板をハニカムコアに接着した構成となっている。
【０００３】
図１９は、かかる多孔面板ハニカムパネルの従来の製造方法の一例を説明する模式図である。図１９に示す如く、従来の多孔面板ハニカムパネルの製造方法の一つには、ハニカムコア１０１の多孔面板１０２の取付面に、熱硬化性のフィルム状の接着剤１０３を積層し、この接着剤１０３のハニカムコア１０１のセル１０４の空洞を閉塞している部分を針１０５で突き刺して加熱するか、又は接着剤１０３に熱風を吹き付けることにより、接着剤１０３に孔をあけ、セル１０４の壁の部分に接着剤１０３を集中して付着させる接着剤孔あけ工程と、この状態のハニカムコア１０１の取付面に、予め多数の孔１０６を設けておいた多孔面板１０２を積層し、オートクレーブ（図示せず）内で加熱して、ハニカムコア１０１と多孔面板１０２とを接着させる接着工程とを有するものが存在する。
【０００４】
また、この他にも、次のような多孔面板ハニカムパネルの製造方法がある。図２０は、多孔面板ハニカムパネルの従来の製造方法の他の例を説明する模式図である。図２０に示す如く、この方法は、ハニカムコア１０１ではなく、多孔面板１０２に接着剤１０３を積層し、この接着剤１０３の孔１０６を閉塞している部分を針１０５で突き刺して加熱するか、又は接着剤１０３に熱風を吹き付けることにより、接着剤１０３に孔をあける接着剤孔あけ工程と、この状態の多孔面板１０２をハニカムコア１０１に積層し、オートクレーブ（図示せず）内で加熱して、ハニカムコア１０１と多孔面板１０２とを接着させる接着工程とを有するものである。
【０００５】
しかしながら、図１９に示す如き方法では、多孔面板１０２をハニカムコア１０１に密着させる際に、多孔面板１０２の表面に沿って接着剤１０３が広がって、孔１０６を接着剤１０３が塞いでしまうことがあり、また図２０に示す如き方法では、孔１０６の直径が小さい場合等に接着剤孔あけ工程において接着剤１０３に孔があかず、同様に孔１０６を接着剤１０３が塞いでしまうことがあり、これが多孔面板ハニカムパネルの吸音性能を低下させる原因となっていた。
【０００６】
そこで、ハニカムコアのセル部に溶剤タイプの接着剤を塗布した後、このハニカムコア上に、熱硬化性のフィルム状の接着剤を積層し、このフィルム状の接着剤を熱風により溶融させて当該接着剤をハニカムコアのセル部に移行させ、多孔面板と網状板との積層体をこのハニカムコアのセル部上に載置して、ハニカムコアと積層体とを加熱して接着剤を硬化さる方法が提案されている（特許文献１）。
【０００７】
この方法にあっては、溶剤タイプの接着剤をハニカムコアに塗布することにより、フィルム状の接着剤の粘着力を高めることができ、従って極薄のフィルム状の接着剤を使用することができるため、積層体をハニカムコアに密着させたときに多孔面板の孔を接着剤が塞ぎにくくすることができる。
【０００８】
【特許文献１】
特開平９−１５６０１０号公報
【０００９】
【発明が解決しようとする課題】
しかしながら、特許文献１に開示されている従来の多孔面板ハニカムパネルの製造方法にあっては、ハニカムコアと積層体とを密着させたときに、図１９に示した多孔面板ハニカムパネルの製造方法の場合に較べて少量ではあるが、積層体の表面に沿って接着剤が広がるため多孔面板の一部の孔及び網状板の一部の孔を当該接着剤が塞ぐことがあった。
【００１０】
また、特に近年においては、軽量化を主目的として、複合材製の多孔面板を用いた多孔面板ハニカムパネルが航空機に使用されることが多いが、上述した如き従来の多孔面板ハニカムパネルの製造方法では、何れも予め多孔面板を作成しておく必要があり、製造工程が多く、長い製造時間を要していた。
【００１１】
また、複合材製の多孔面板を予め作成しておく場合には、プリプレグ（複合材料成型用素材）を必要なだけ積層して面板（以下、プリプレグ面板という）を形成し、このプリプレグ面板を硬化させた後に、ドリル又はパンチによって貫通孔を設けることが多いが、ドリルによって貫通孔を設ける方法では加工に多くの時間を要するし、またパンチによって貫通孔を設ける方法では、硬化した複合材製の面板が比較的硬度が高く脆いという性質を有しているため、工具が欠けやすく、また孔の周囲にひび割れ及び欠け等が発生するという問題があった。
【００１２】
本発明は、斯かる事情に鑑みてなされたものであり、従来に比して多孔面板の孔を接着剤が塞ぐことを大幅に減少させることができ、また製造時間を大幅に短縮することができる多孔面板ハニカムパネルの製造方法及び当該方法の実施に直接使用する装置を提供することを目的とする。
【００１３】
【課題を解決するための手段】
上記課題を解決するため、本発明に係る多孔面板ハニカムパネルの製造方法は、合成樹脂を強化繊維に含浸させた未硬化のプリプレグよりなるプリプレグ面板にフィルム状の接着剤を積層した積層面板を孔あけ加工する孔あけ工程と、該孔あけ工程で孔あけ加工された積層面板のプリプレグ面板を硬化させ、また前記接着剤にハニカムコアの一面を密着させて前記積層面板を前記ハニカムコアに接着させる硬化接着工程とを有する。
【００１４】
また、本発明に係る多孔面板ハニカムパネルの製造装置は、合成樹脂を強化繊維に含浸させた未硬化のプリプレグよりなるプリプレグ面板にフィルム状の接着剤を積層した積層面板を孔あけ加工する孔あけ機と、該孔あけ機で孔あけ加工された積層面板のプリプレグ面板を硬化させ、また前記接着剤にハニカムコアの一面を密着させて前記積層面板を前記ハニカムコアに接着させる硬化接着機とを備える。
【００１５】
これにより、柔軟な未硬化のプリプレグ面板と、フィルム状の接着剤とを積層した積層面板を孔あけ加工するため、多孔面板の孔と接着剤の孔とを同時に形成することができ、従来に比して多孔面板ハニカムパネルの製造時間を大幅に短縮することができる。また、フィルム状の接着剤の孔を確実に設けることができるため、従来に比して多孔面板の孔を接着剤が塞ぐことを大幅に減少させることができる。
【００１６】
上記発明においては、前記合成樹脂及び前記接着剤を夫々熱に反応して硬化する性質を有するものとし、前記硬化接着工程では、前記積層面板を、前記接着剤側の面にハニカムコアの一面を密着させた状態で加熱して、積層面板の硬化及び積層面板とハニカムコアとの接着を略同時に行うことが好ましい。
【００１７】
この場合においては、前記硬化接着工程に先立って、前記積層面板の前記接着剤側と反対側の面に離型剤を介してプレートを重ねた状態で、前記積層面板の孔に前記合成樹脂が概ね流れ込まず、しかも前記積層面板及び前記プレートが張り付く程度の温度まで加熱する仮接着工程を更に有することが好ましい。
【００１８】
上記発明においては、前記孔あけ工程では、熱に反応して硬化する性質を有するフィルム状の接着剤をプリプレグ面板の両面に夫々積層した積層面板を孔あけ加工し、前記硬化接着工程では、前記積層面板をハニカムコアと網状板とで挟んだ状態で加熱して、積層面板の硬化、積層面板とハニカムコアとの接着及び積層面板と網状板との接着を略同時に行うこともできる。
【００１９】
この場合においては、前記硬化接着工程に先立って、前記積層面板の一面に網状板の一面を密着させ、該網状板の他面に離型剤を介してプレートを重ねた状態で、前記積層面板の孔に前記合成樹脂が概ね流れ込まず、しかも前記積層面板及び前記網状板並びに該網状板及び前記プレートが夫々張り付く程度の温度まで加熱する仮接着工程を更に有することが好ましい。
【００２０】
上記発明においては、前記合成樹脂及び前記接着剤を夫々放射線に反応して硬化する性質を有するものとし、前記硬化接着工程では、前記積層面板の前記接着剤側の面にハニカムコアの一面を密着させた状態で、前記積層面板へ放射線を照射して、積層面板の硬化及び積層面板とハニカムコアとの接着を略同時に行うことが好ましい。
【００２１】
この場合においては、前記硬化接着工程に先立って、前記積層面板の前記接着剤側と反対側の面に離型剤を介してプレートを重ねた状態で、前記積層面板の孔に前記合成樹脂が概ね流れ込まず、しかも前記積層面板及び前記プレートが張り付く程度の温度まで加熱する仮接着工程を更に有することが好ましい。
【００２２】
上記発明においては、前記孔あけ工程では、放射線に反応して硬化する性質を有するフィルム状の接着剤をプリプレグ面板の両面に夫々積層した積層面板を孔あけ加工し、前記硬化接着工程では、前記積層面板をハニカムコアと網状板とで挟んだ状態で、前記積層面板へ放射線を照射して、積層面板の硬化、積層面板とハニカムコアとの接着及び積層面板と網状板との接着を略同時に行うこともできる。
【００２３】
この場合においては、前記硬化接着工程に先立って、前記積層面板の一面に網状板の一面を密着させ、該網状板の他面に離型剤を介してプレートを重ねた状態で、前記積層面板の孔に前記合成樹脂が概ね流れ込まず、しかも前記積層面板及び前記網状板並びに該網状板及び前記プレートが夫々張り付く程度の温度まで加熱する仮接着工程を更に有することが好ましい。
【００２４】
上記発明においては、前記合成樹脂を放射線に反応して硬化する性質を有するものとし、前記接着剤を熱に反応して硬化する性質を有するものとして、前記硬化接着工程が、前記プリプレグ面板を硬化させるべく、前記積層面板に放射線を照射する放射線照射工程と、該放射線照射工程でプリプレグ面板が硬化した積層面板とハニカムコアとを接着させるべく、前記積層面板の前記接着剤側の面にハニカムコアの一面を密着させた状態で加熱する加熱工程とを有することが好ましい。
【００２５】
この場合においては、前記孔あけ工程では、熱に反応して硬化する性質を有するフィルム状の接着剤をプリプレグ面板の両面に夫々積層した積層面板を孔あけ加工し、前記加熱工程では、積層面板とハニカムコアとの接着及び積層面板と網状板との接着を略同時に行うべく、積層面板をハニカムコアと網状板とで挟んだ状態で加熱することもできるし、また前記孔あけ工程では、熱に反応して硬化する性質を有するフィルム状の第１の接着剤と、放射線に反応して硬化する性質を有するフィルム状の第２の接着剤とで前記プリプレグ面板を挟むように積層した積層面板を孔あけ加工し、前記放射線照射工程では、積層面板の硬化及び積層面板と網状板との接着を略同時に行うべく、前記積層面板の前記第２の接着剤側の面に網状板の一面を密着させた状態で前記積層面板に放射線を照射し、前記加熱工程では、前記積層面板の前記第１の接着剤側の面にハニカムコアの一面を密着させた状態で加熱することもできる。
【００２６】
上記発明においては、前記放射線を電子線とすることがより一層好ましい。
【００２７】
【発明の実施の形態】
以下、本発明の実施の形態に係る多孔面板ハニカムパネルの製造方法及びその装置について、図面を参照しながら具体的に説明する。
【００２８】
（実施の形態１）
図１は、本発明の実施の形態１に係る多孔面板ハニカムパネルの製造装置の構成の概略を示す模式図である。図１に示す如く、本実施の形態１に係る多孔面板ハニカムパネルの製造装置１は、孔あけ機２と、本発明の硬化接着機を構成するオートクレーブ３とを備えている。孔あけ機２は、パンチ２ａにより被加工物たる積層面板４の孔あけ加工を行うべく構成されており、オートクレーブ３は、孔あけ加工された積層面板４及びハニカムコア５の積層体６を加熱すべく構成されている。
【００２９】
図２は、積層面板４の形成工程を説明する模式図である。本発明の実施の形態１にて使用するプリプレグ８は、炭素繊維、ガラス繊維、アラミド繊維、ＳｉＣ繊維等の強化繊維の織布に、熱に反応して硬化する性質を有する合成樹脂（以下、熱硬化性樹脂という）を含浸させたものであり、シート状に形成されている。なお、プリプレグ８には、強化繊維を互いに交差するように織り込んだ織布に熱硬化性樹脂を含浸させたものの他、一方向へ引き揃えた強化繊維に熱硬化性樹脂を含浸させたものも使用することができる。このプリプレグ８を所要の大きさ及び形状に裁断し、所要枚数積層してプリプレグ面板７を得る。なお、プリプレグ８がプリプレグ面板７として必要な厚さのものであれば、積層せずに裁断したプリプレグ８をそのままプリプレグ面板７として使用してもよい。
【００３０】
このようにして得たプリプレグ面板７の一面に、熱に反応して硬化する性質を有するフィルム状の接着剤９を積層し、積層面板４を得る。
【００３１】
図３は、本発明の実施の形態１に係る多孔面板ハニカムパネルの製造方法の手順を説明するフローチャートである。図３に示す如く、本実施の形態１に係る多孔面板ハニカムパネルの製造方法は、緻密化工程Ｓ１１，孔あけ工程Ｓ１２，硬化接着工程Ｓ１３をこの順番で行うものとなっている。
【００３２】
図４は、本実施の形態１に係る緻密化工程Ｓ１１の概要を説明する模式図である。まず、前述のようにして得た積層面板４の両面に、夫々テフロン（Ｒ）系材料からなる離型フィルム１０が積層され、定盤１１の上面に載置される。更に積層面板４にナイロン製のバッグフィルム１２が被せられる。積層面板４の周囲には、シール材１３が配されており、このシール材１３を介してバッグフィルム１２と定盤１１との間がシールされ、これにより積層面板４がバッグフィルム１２で包まれた状態となる。
【００３３】
バッグフィルム１２には開口部１４が設けられており、この開口部１４は図示しない真空ポンプに接続されている。積層面板４を定盤１１及びバッグフィルム１２ごとオートクレーブ３内に入れ、バッグフィルム１２内を前記真空ポンプによって真空吸引しながら、プリプレグ面板７及び接着剤９が硬化しない程度の温度及び時間で加熱及び加圧する。
【００３４】
プリプレグ面板７の各層間には、プリプレグ８の積層の際にボイド（気泡）が入り込むが、緻密化工程Ｓ１１によりかかるボイドが除去されることとなる。従って、このときの加熱・加圧条件は、ボイドを効率的に除去するものであることが好ましい。これは、熱硬化性樹脂の特性にもよるが、例えば７０℃、３０分、５気圧（約５０６．６ｋＰａ）程度が好適である。
【００３５】
図５は、本実施の形態１に係る孔あけ工程Ｓ１２の概要を説明する模式図である。緻密化工程Ｓ１１が終了した後には、定盤１１、バッグフィルム１２、及び上面に取り付けられた離型フィルム１０が積層面板４から取り外される。そして、図５に示す如く、下面に離型フィルム１０を貼着した状態で、積層面板４がプラスチックシート１５上に載置され、該プラスチックシート１５ごと孔あけ機２に取り付けられる。このように、積層面板４とプラスチックシート１５との間に離型フィルム１０が挟まれた状態で、孔あけ工程Ｓ１２が実行される。
【００３６】
この孔あけ工程Ｓ１２においては、積層面板４に所要のサイズの孔１６が所要のピッチで設けられる。かかる孔１６の加工条件は、多孔面板ハニカムパネルの使用目的等に応じてある程度自由に設定することができるが、本実施の形態１に係る多孔面板ハニカムパネルの製造方法においては、例えば、直径２〜３ｍｍ、ピッチ３〜１０ｍｍとすることが好適である。
【００３７】
孔あけ工程Ｓ１２では、パンチ２ａが貫通するときに積層面板４の熱硬化性樹脂（プリプレグ面板７に含まれる合成樹脂だけでなく、接着剤９も含む）がパンチ２ａに粘着しない程度の温度まで、積層面板４が冷却される。この温度条件は、熱硬化性樹脂の特性にもよるが、例えば２５℃以下が好ましい。このように積層面板４を冷却しながら、積層面板４、離型フィルム１０及びプラスチックシート１５をパンチ２ａが貫通することによって、積層面板４に孔１６が設けられる。このとき、積層面板４は、熱硬化性樹脂が未硬化であるため柔軟であり、従って孔１６の周囲にひび割れ又は欠けが発生することが防止され、しかも孔あけ加工によるパンチ２ａの破損が可及的に防止される。
【００３８】
また、パンチ２ａの一回の孔あけ動作は、パンチ２ａが積層面板４の上方から下降して積層面板４、離型フィルム１０及びプラスチックシート１５を貫通し、その後パンチ２ａが上昇して、積層面板４の上方の位置まで復帰するという手順で行われる。このとき、熱硬化性樹脂の粘度が低い場合では、パンチ２ａが積層面板４から離反して上昇するときに、パンチ２ａに粘着した熱硬化性樹脂がパンチ２ａに引っ張られ、その結果孔１６の周囲が突出してしまうことがある。本実施の形態１においては、積層面板４を前述の如く冷却するので、熱硬化性樹脂がパンチ２ａに粘着せず、従ってパンチ２ａの復帰動作に引きずられて孔１６の周囲が上方へ突出することが可及的に防止される。
【００３９】
更に、プラスチックシート１５上に積層面板４が載せられた状態で、プラスチックシート１５ごと積層面板４の孔あけ加工が行われるので、熱硬化性樹脂が下方へ延びることがプラスチックシート１５によって防止され、従って、パンチ２ａの貫通動作に引きずられて孔１６の周囲が下方へ突出することが可及的に防止される。この結果、製造する多孔面板ハニカムパネルの品質をより一層向上させることができる。
【００４０】
なお、プラスチックシート１５を積層面板４に積層せずに、積層面板４だけを孔あけ加工してもよいし、多孔面板ハニカムパネルの使用用途によっては、前述した緻密化工程Ｓ１１を省略し、緻密化されていない状態の積層面板４を孔あけ加工してもよい。
【００４１】
図６は、本実施の形態１に係る硬化接着工程Ｓ１３の概要を説明する模式図である。孔あけ工程Ｓ１２が終了した後には、積層面板４から離型フィルム１０及びプラスチックシート１５が取り外される。そして、図６に示す如く、積層面板４の接着剤９側の面（下面）に、ハニカムコア５の一面を密着させて、積層体６を得る。この積層体６は、ハニカムコア５を下にして定盤１７上に載置され、また積層面板４の上面（プリプレグ面板７側の面）に離型フィルム１８が載置される。また、離型フィルム１８の上には、平板状のプレート１９が載置され、積層体６が定盤１７とプレート１９とで挟まれた状態とされる。
【００４２】
更に、積層体６にナイロン製のバッグフィルム２０が被せられる。積層体６の周囲には、シール材２１が配されており、このシール材２１を介してバッグフィルム２０と定盤１７との間がシールされ、これにより積層体６がバッグフィルム２０で包まれた状態となる。
【００４３】
バッグフィルム２０には開口部２２が設けられており、この開口部２２は大気中に開放されている。積層体６を定盤１７及びバッグフィルム２０ごとオートクレーブ３内に入れ、積層体６をその積層方向（下方）へ所定時間加圧しながら、プリプレグ面板７及び接着剤９の硬化温度まで加熱して、硬化接着工程Ｓ１３を実行する。
【００４４】
このときの加熱・加圧条件は、積層面板４に使用されるプリプレグ８及び接着剤９が１２０℃で硬化するタイプのものである場合には、１２０℃、１２０分、５気圧（約５０６．６ｋＰａ）程度とし、またプリプレグ８及び接着剤９が１８０℃で硬化するタイプのものである場合には、１８０℃、１２０分、５気圧（約５０６．６ｋＰａ）程度とする。なお、プリプレグ８及び接着剤９は、硬化温度が同程度のものを使用することが好ましい。
【００４５】
なお、本実施の形態１に係る硬化接着工程Ｓ１３においては、開口部２２を大気中に開放した状態で、積層体６を加圧することとしたが、開口部２２からバッグフィルム２０内の真空吸引を行いながら、積層体６を加圧するようにしてもよい。
【００４６】
また、本実施の形態１に係る多孔面板ハニカムパネルの製造方法においては、使用するハニカムコア５のセルサイズを５〜１０ｍｍとすることが好ましい。
【００４７】
プリプレグ面板７の熱硬化性樹脂及び接着剤９は、オートクレーブ３による加熱で硬化する。そして、加熱・加圧した後の積層体６をオートクレーブ３から取り出し、定盤１７、離型フィルム１８、プレート１９及びバッグフィルム２０を取り除くことにより、多孔面板ハニカムパネルが得られる。
【００４８】
以上説明した如き本実施の形態１に係る多孔面板ハニカムパネルの製造方法では、孔あけ工程Ｓ１２において、柔軟な未硬化のプリプレグ面板７と、フィルム状の接着剤９とを積層した積層面板４を孔あけ加工するため、多孔面板の孔と接着剤の孔とを同時に孔１６として形成することができ、従来の多孔面板の孔と接着剤の孔とを別個に加工する方法に比して、工程数を減少させることができ、多孔面板ハニカムパネルの製造時間を大幅に短縮することができる。また、フィルム状の接着剤９の孔を確実に設けることができるため、従来に比して多孔面板の孔を接着剤９が塞ぐことを大幅に減少させることができる。
【００４９】
また、従来では別個に行っていたプリプレグ面板７の硬化並びにハニカムコア５及び多孔面板の接着を同時に行うため、このことによっても、従来に比して製造工程数を大幅に減じ、製造時間を大幅に短縮することができる。
【００５０】
（実施の形態２）
図７は、本発明の実施の形態２に係る多孔面板ハニカムパネルの製造方法の手順を説明するフローチャートである。図７に示す如く、本実施の形態２に係る多孔面板ハニカムパネルの製造方法は、緻密化工程Ｓ２１，孔あけ工程Ｓ２２，仮接着工程Ｓ２３，硬化接着工程Ｓ２４をこの順番で行うものとなっている。なお、緻密化工程Ｓ２１及び孔あけ工程Ｓ２２は、実施の形態１に係る緻密化工程Ｓ１１及び孔あけ工程Ｓ１２と同様であるので、説明を省略する。
【００５１】
図８は、本実施の形態２に係る多孔面板ハニカムパネルの製造方法の仮接着工程Ｓ２３の概要を説明する模式図である。孔あけ工程Ｓ２２の終了後には、積層面板４から離型フィルム１０及びプラスチックシート１５が取り外される。そして、図８に示す如く、定盤２４の上面に平板状のプレート２５、離型フィルム（離型剤）２３が載置され、更にその上に、積層面板４がプリプレグ面板７側の面を下にして載置される。また、積層面板４の上には離型フィルム２３が載置され、この上からナイロン製のバッグフィルム２６が被せられる。積層面板４の周囲には、シール材２７が配されており、このシール材２７を介してバッグフィルム２６と定盤２４との間がシールされ、これにより積層面板４がバッグフィルム２６で包まれた状態となる。
【００５２】
バッグフィルム２６には開口部２８が設けられており、この開口部２８は大気中に開放されている。積層面板４を定盤２４、プレート２５及びバッグフィルム２６ごとオートクレーブ３内に入れ、熱硬化性樹脂が硬化しない程度の温度で、積層面板４、定盤２４及びプレート２５を、その積層方向へ所定時間加圧して、仮接着工程Ｓ２３を実行する。
【００５３】
かかる仮接着工程Ｓ２３では、定盤２４及びプレート２５上に載置された積層面板４がその積層方向へ加圧され、また次に説明するように積層面板４の孔１６に熱硬化性樹脂が概ね流れ込まず、しかも積層面板４が離型フィルム２３を介してプレート２５に張り付く程度の温度まで加熱されることにより、積層面板４の表面が平滑化される。
【００５４】
かかる仮接着工程Ｓ２３の加熱・加圧条件によっては、溶けた熱硬化性樹脂（プリプレグ面板７に含まれる合成樹脂だけでなく、接着剤９も含む）が積層面板４の孔１６に流れ込み、この孔１６を閉塞して、製造する多孔面板ハニカムパネルの当該孔における通気性を阻害することがある。従って、このときの加熱・加圧条件は、積層面板４の孔１６に熱硬化性樹脂が概ね流れ込まない範囲で定めることが好ましい。これは、熱硬化性樹脂の特性及び積層面板４の孔１６のサイズにもよるが、例えば３０〜５０℃、３０分、５気圧（約５０６．６ｋＰａ）程度が好適である。
【００５５】
なお、本実施の形態２に係る仮接着工程Ｓ２３においては、開口部２８を大気中に開放した状態で、積層面板４を加圧することとしたが、熱硬化性樹脂が孔１６に概ね流れ込まなければ、開口部２８からバッグフィルム２６内の真空吸引を行いながら、積層面板４を加圧するようにしてもよい。
【００５６】
仮接着工程Ｓ２３が終了した後には、オートクレーブから積層面板４が一旦取り出され、離型フィルム２３，プレート２５が積層面板４に張り付いた状態で、定盤２４及びバッグフィルム２６が積層面板４から取り外される。そして、図６に示す如く、積層面板４の接着剤９側の面（下面）に、ハニカムコア５の一面を密着させて、積層体６を得る。この積層体６は、ハニカムコア５を下にして定盤１７上に載置され、ナイロン製のバッグフィルム２０が被せられて、バッグフィルム２０と定盤１７との間がシールされ、この状態でオートクレーブ３に取り付けられる。そして、硬化接着工程Ｓ２４が実行される。なお、硬化接着工程Ｓ２４は、実施の形態１に係る硬化接着工程Ｓ１３と同様であるので、説明を省略する。
【００５７】
このような硬化接着工程Ｓ２４の終了後には、加熱・加圧した後の積層体６から離型フィルム２３及びプレート２５を取り除くこととなるが、離型フィルム２３を積層体６とプレート２５との間に介在させているため、容易に積層体６から離型フィルム２３及びプレート２５を取り外すことができる。
【００５８】
以上の如き実施の形態２に係る多孔面板ハニカムパネルの製造方法においては、孔あけ工程Ｓ２２にて積層面板４に加工する孔１６の加工条件を、多孔面板ハニカムパネルの使用目的等に応じてある程度自由に設定することができるが、例えば、直径２〜３ｍｍ、ピッチ３〜１０ｍｍとすることが好適である。また、実施の形態２に係る多孔面板ハニカムパネルの製造方法においては、使用するハニカムコア５のセルサイズを５〜３０ｍｍとすることが好ましい。
【００５９】
以上説明した如き本実施の形態２に係る多孔面板ハニカムパネルの製造方法では、実施の形態１と同様の効果を奏し、更に、仮接着工程Ｓ２３により積層面板４をプレート２５に張り付けて平滑化し、プレート２５に積層面板４を張り付けたまま、硬化接着工程Ｓ２４を行うため、多孔面板ハニカムパネルの多孔面板を平滑なものとすることができ、より一層形状品質の高い多孔面板ハニカムパネルを製造することができる。
【００６０】
（実施の形態３）
図３に示す如く、本実施の形態３に係る多孔面板ハニカムパネルの製造方法は、緻密化工程Ｓ３１，孔あけ工程Ｓ３２，硬化接着工程Ｓ３３をこの順番で行うものとなっている。
【００６１】
図９は、本実施の形態３に係る多孔面板ハニカムパネルの製造方法の緻密化工程Ｓ３１の概要を説明する模式図であり、図１０は、孔あけ工程Ｓ３２の概要を説明する模式図である。図９，１０に示す如く、本実施の形態３に係る多孔面板ハニカムパネルの製造方法においては、熱硬化性樹脂を含むプリプレグ面板７の両面に、熱硬化性のフィルム状の接着剤９を夫々積層し、積層面板２９を形成し、この積層面板２９に対して緻密化工程Ｓ３１及び孔あけ工程Ｓ３２を実行する。本実施の形態３に係る緻密化工程Ｓ３１及び孔あけ工程Ｓ３２は、積層面板２９を、プリプレグ面板７の両面に接着剤９を積層したものとすることの他は、実施の形態１に係る緻密化工程Ｓ１１及び孔あけ工程Ｓ１２の手順と同様であるので、その説明を省略する。
【００６２】
図１１は、本実施の形態３に係る多孔面板ハニカムパネルの製造方法の硬化接着工程Ｓ３３の概要を説明する模式図である。孔あけ工程Ｓ３２が終了した後には、積層面板２９から離型フィルム１０及びプラスチックシート１５が取り外される。そして、図１１に示す如く、ハニカムコア５及び網状板３０で積層面板２９を挟むように、ハニカムコア５，積層面板２９及び網状板３０を積層して積層体３１を得る。網状板３０は、積層面板２９の孔１６に比して非常に小さい孔が多数設けられたものであり、多孔面板ハニカムパネルの吸音効果を向上させるために使用される。そして、かかる積層体３１に対して、硬化接着工程Ｓ３３が実行され、これにより網状板付きの多孔面板ハニカムパネルが得られる。本実施の形態２に係る硬化接着工程Ｓ３３は、積層体３１を、積層面板２９をハニカムコア５及び網状板３０で挟んで積層したものとすることの他は、実施の形態１に係る硬化接着工程Ｓ１３の手順と同様であるので、その説明を省略する。
【００６３】
以上の如き実施の形態３に係る多孔面板ハニカムパネルの製造方法においては、孔あけ工程Ｓ３２にて積層面板２９に加工する孔１６の加工条件を、多孔面板ハニカムパネルの使用目的等に応じてある程度自由に設定することができるが、例えば、直径２〜３ｍｍ、ピッチ３〜１０ｍｍとすることが好適である。また、実施の形態６に係る多孔面板ハニカムパネルの製造方法においては、使用するハニカムコア５のセルサイズを５〜１０ｍｍとすることが好ましい。
【００６４】
これにより、従来では別個に行っていたプリプレグ面板７の孔あけ及び接着剤９の孔あけを同時に行い、また従来では別個に行っていたプリプレグ面板７の硬化並びにハニカムコア５、網状板３０及び多孔面板の接着を同時に行うため、従来に比して製造工程数を大幅に減じ、製造時間を大幅に短縮することができる。
【００６５】
（実施の形態４）
図７に示す如く、本実施の形態４に係る多孔面板ハニカムパネルの製造方法は、緻密化工程Ｓ４１，孔あけ工程Ｓ４２，仮接着工程Ｓ４３，硬化接着工程Ｓ４４をこの順番で行うものとなっている。なお、緻密化工程Ｓ４１及び孔あけ工程Ｓ４２は、実施の形態３に係る緻密化工程Ｓ３１及び孔あけ工程Ｓ３２と同様であるので、説明を省略する。
【００６６】
図１２は、本実施の形態４に係る多孔面板ハニカムパネルの製造方法の仮接着工程Ｓ４３の概要を説明する模式図である。孔あけ工程４２の終了後には、積層面板２９から離型フィルム１０及びプラスチックシート１５が取り外される。そして、図１２に示す如く、定盤２４の上面に平板状のプレート２５，離型フィルム（離型剤）２３及び網状板３０が載置され、更にその上に、積層面板２９が載置される。これにより、積層面板２９の一面（下面）に網状板３０の一面（上面）が密着し、網状板３０の他面（下面）に離型フィルム２３を介してプレート２５を重ねた状態となる。また、積層面板２９の上には離型フィルム２３が更に載置され、この上からナイロン製のバッグフィルム２６が被せられる。積層面板２９の周囲には、シール材２７が配されており、このシール材２７を介してバッグフィルム２６と定盤２４との間がシールされ、これにより積層面板２９がバッグフィルム２６で包まれた状態となる。
【００６７】
バッグフィルム２６の開口部２８は大気中に開放されている。積層面板２９を定盤２４，プレート２５，網状板３０及びバッグフィルム２６ごとオートクレーブ３内に入れ、熱硬化性樹脂が硬化しない程度の温度で、積層面板２９，網状板３０，プレート２５及び定盤２４を、その積層方向へ所定時間加圧して、仮接着工程Ｓ４３を実行する。
【００６８】
かかる仮接着工程Ｓ４３では、定盤２４及びプレート２５上に載置された網状板３０及び積層面板２９がその積層方向へ加圧され、また積層面板２９の孔１６に熱硬化性樹脂が概ね流れ込まず、しかも積層面板２９と網状板３０とが張り付き、また網状板３０が離型フィルム２３を介してプレート２５に張り付く程度の温度まで加熱されることにより、網状板３０の表面が平滑化される。
【００６９】
また、本実施の形態４に係る仮接着工程Ｓ４３の加熱・加圧条件によっては、溶けた熱硬化性樹脂が網状板３０の孔に流れ込み、この孔を閉塞して、製造する多孔面板ハニカムパネルの当該孔における通気性を阻害することがある。従って、このときの加熱・加圧条件は、積層面板２９の孔１６に熱硬化性樹脂が概ね流れ込むことがなく、また網状板３０の孔にも概ね流れ込まない範囲で定めることが好ましい。これは、熱硬化性樹脂の特性、積層面板２９の孔１６のサイズ及び網状板３０の孔のサイズにもよるが、例えば３０〜５０℃、３０分、５気圧（約５０６．６ｋＰａ）程度が好適である。
【００７０】
また、熱硬化性樹脂が積層面板２９の孔１６及び網状板３０の孔に概ね流れ込まなければ、開口部２８からバッグフィルム２６内の真空吸引を行いながら、積層面板２９及び網状板３０を加圧するようにしてもよい。
【００７１】
仮接着工程Ｓ４３が終了した後には、オートクレーブから定盤２４及びバッグフィルム２６に覆われた積層面板２９が一旦取り出される。このとき、網状板３０が積層面板２９に張り付いており、また離型フィルム２３を介してプレート２５が網状板３０に張り付いている。このように、プレート２５，離型フィルム２３，網状板３０及び積層面板２９が互いに張り付いた状態で、定盤２４及びバッグフィルム２６が積層面板２９及び網状板３０から取り外される。そして、図１１に示す如く、ハニカムコア５及び網状板３０で積層面板２９を挟むように、積層面板２９の網状板３０の接着面の反対側の面（下面）に、ハニカムコア５の一面を密着させて、積層体３１を得る。この積層体３１は、離型フィルム２３及びプレート２５が網状板３０に張り付いた状態のまま、ハニカムコア５を下にして定盤１７上に載置され、ナイロン製のバッグフィルム２０が被せられて、バッグフィルム２０と定盤１７との間がシールされ、この状態でオートクレーブ３に取り付けられる。そして、硬化接着工程Ｓ４４が実施される。なお、硬化接着工程Ｓ４４は、離型フィルム２３及びプレート２５が網状板３０に張り付いた状態である他は、実施の形態３に係る硬化接着工程Ｓ３３と同様であるので、説明を省略する。
【００７２】
このような硬化接着工程Ｓ４４の終了後には、加熱・加圧した後の積層体３１から離型フィルム２３及びプレート２５を取り除くこととなるが、離型フィルム２３を積層体３１とプレート２５との間に介在させているため、容易に積層体３１から離型フィルム２３及びプレート２５を取り外すことができる。
【００７３】
以上の如き実施の形態４に係る多孔面板ハニカムパネルの製造方法においては、孔あけ工程Ｓ４２にて積層面板２９に加工する孔１６の加工条件を、多孔面板ハニカムパネルの使用目的等に応じてある程度自由に設定することができるが、例えば、直径２〜３ｍｍ、ピッチ３〜１０ｍｍとすることが好適である。また、実施の形態４に係る多孔面板ハニカムパネルの製造方法においては、使用するハニカムコア５のセルサイズを５〜３０ｍｍとすることが好ましい。
【００７４】
以上説明した如き本実施の形態４に係る多孔面板ハニカムパネルの製造方法では、実施の形態３と同様の効果を奏し、更に、仮接着工程Ｓ４３により網状板３０をプレート２５に張り付けて積層面板２９及び網状板３０を平滑化し、網状板３０にプレート２５を張り付けたまま、硬化接着工程Ｓ２４を行うため、多孔面板ハニカムパネルの多孔面板及び網状板を平滑なものとすることができ、より一層形状品質の高い網状板付きの多孔面板ハニカムパネルを製造することができる。
【００７５】
（実施の形態５）
図１３は、本発明の実施の形態５に係る多孔面板ハニカムパネルの製造装置の構成の概略を示す模式図である。図１３に示す如く、本実施の形態５に係る多孔面板ハニカムパネルの製造装置３６は、孔あけ機２と、本発明の硬化接着機を構成する電子線照射機３７とから主として構成されている。孔あけ機２は、パンチ２ａにより被加工物たる積層面板３４の孔あけ加工を行うべく構成されており、電子線照射機３７は、孔あけ加工された積層面板３４及びハニカムコア５の積層体３８に電子線を照射すべく構成されている。
【００７６】
図３に示す如く、本実施の形態５に係る多孔面板ハニカムパネルの製造方法は、緻密化工程Ｓ５１，孔あけ工程Ｓ５２，硬化接着工程Ｓ５３をこの順番で行うものとなっている。
【００７７】
図２に示す如く、本発明の実施の形態５にて使用するプリプレグ３５は、炭素繊維、ガラス繊維、アラミド繊維、ＳｉＣ繊維等の強化繊維の織布に、電子線に反応して硬化する性質を有する合成樹脂（以下、電子線硬化性樹脂という）を含浸させたものであり、シート状に形成されている。なお、かかるプリプレグ３５には、強化繊維を互いに交差するように織り込んだ織布に電子線硬化性樹脂を含浸させたものの他、一方向へ引き揃えた強化繊維に電子線硬化性樹脂を含浸させたものも使用することができる。このようなプリプレグ３５を所要の大きさ及び形状に裁断し、所要枚数積層してプリプレグ面板３２を得る。なお、プリプレグ３５がプリプレグ面板３２として必要な厚さのものであれば、積層せずに裁断したプリプレグ３５をそのままプリプレグ面板３２として使用してもよい。
【００７８】
このようにして得たプリプレグ面板３２の一面に、電子線に反応して硬化する性質を有するフィルム状の接着剤３３を積層し、積層面板３４を得る。そして、図４及び図５に示す如く、かかる積層面板３４に対して、緻密化工程Ｓ５１及び孔あけ工程Ｓ５２を実行し、積層面板３４に孔３９を設ける。本実施の形態５に係る緻密化工程Ｓ５１及び孔あけ工程Ｓ５２は、積層面板３４を、電子線に反応して硬化する性質を有するプリプレグ面板３２及び接着剤３３を積層したものとすることの他は、実施の形態１に係る緻密化工程Ｓ１１及び孔あけ工程Ｓ１２の手順と同様であるので、その説明を省略する。
【００７９】
孔あけ工程Ｓ５２が終了した後には、積層面板３４から離型フィルム１０及びプラスチックシート１５が取り外される。そして、図６に示す如く、積層面板３４の接着剤３３側の面（下面）に、ハニカムコア５の一面を密着させて、積層体３８を得る。この積層体３８が、実施の形態１と同様の手順により定盤１７及びバッグフィルム２０にて包まれ、電子線照射機３７にセットされ、硬化接着工程Ｓ５３が実行される。
【００８０】
硬化接着工程Ｓ５３では、バッグフィルム２０の開口部２２に真空ポンプ（図示せず）が接続され、かかる真空ポンプによってバッグフィルム２０の内部が真空吸引された状態で、電子線照射機３７によって積層体３８に所定の線量（例えば、５０〜１５０ｋＧｙの表面吸収線量）の電子線が照射される。このときの照射時間は数秒である。かかる硬化接着工程Ｓ５３により、積層面板３４のプリプレグ面板３２及び接着剤３３が、電子線照射機３７から照射された電子線に反応して硬化する。そして、電子線を照射した後の積層体３８を電子線照射機３７から取り出し、定盤１７，離型フィルム１８，プレート１９及びバッグフィルム２０を取り除くことにより、多孔面板ハニカムパネルが得られる。
【００８１】
以上説明した如き本実施の形態５に係る多孔面板ハニカムパネルの製造方法では、実施の形態１と同様の効果に加えて、以下のような効果を奏する。まず、硬化接着工程Ｓ５３において、積層面板３４の温度が殆ど上昇せず、従ってこれに含まれる電子線硬化性樹脂の粘度が低下して孔３９に流れ込むことが殆どない。
よって孔３９の品質が高い多孔面板ハニカムパネルを製造することができる。
【００８２】
また、硬化接着工程Ｓ５３に数秒しか要しないため、従来の熱硬化性樹脂を使用した多孔面板ハニカムパネルの製造方法に比べて大幅に製造に要する時間を短縮することができる。
【００８３】
また、硬化接着工程Ｓ５３において積層面板３４の温度が殆ど上昇しないため、積層面板３４に熱歪みによる曲がり、そり等が殆ど発生することがなく、安定して高品質の多孔面板ハニカムパネルを製造することができる。
【００８４】
以上の如き実施の形態５に係る多孔面板ハニカムパネルの製造方法においては、孔あけ工程Ｓ５２にて積層面板３４に加工する孔３９の加工条件を、多孔面板ハニカムパネルの使用目的等に応じてある程度自由に設定することができるが、例えば、直径０．５〜３ｍｍ、ピッチ３〜１０ｍｍとすることが好適である。また、実施の形態５に係る多孔面板ハニカムパネルの製造方法においては、使用するハニカムコア５のセルサイズを５〜１０ｍｍとすることが好ましい。
【００８５】
また、硬化接着工程Ｓ５３において、電子線照射機３７の内部で積層体３８を支持するための冶具（図示せず）が高温下に晒されることがないため、この冶具を木材又は石膏等の低耐熱性の安価な材料を用いて構成することができる。
【００８６】
なお、硬化接着工程Ｓ５３に先立って、積層面板３４をオートクレーブにて３０〜５０℃の温度で３０分程度加熱しておくことも可能である。これにより、積層面板３４とハニカムコア５との接着強度をより一層向上させることが期待できる。
【００８７】
（実施の形態６）
図７に示す如く、本実施の形態６に係る多孔面板ハニカムパネルの製造方法は、緻密化工程Ｓ６１，孔あけ工程Ｓ６２，仮接着工程Ｓ６３，硬化接着工程Ｓ６４をこの順番で行うものとなっている。なお、緻密化工程Ｓ６１及び孔あけ工程Ｓ６２は、実施の形態５に係る緻密化工程Ｓ５１及び孔あけ工程Ｓ５２と同様であるので、説明を省略する。
【００８８】
また、本実施の形態６に係る多孔面板ハニカムパネルの製造方法においては、孔あけ工程Ｓ６２にて、電子線に反応して硬化する性質を有するプリプレグ面板３２及び接着剤３３を積層した積層面板３４を孔あけ加工した後、この積層面板３４に対して、実施の形態２に係る仮接着工程Ｓ６３と同様の仮接着工程Ｓ６３を実行する（図８参照）。
【００８９】
かかる仮接着工程Ｓ６３では、定盤２４及びプレート２５上に載置された積層面板３４がその積層方向へ加圧され、また積層面板３４の孔３９に電子線硬化性樹脂が概ね流れ込まず、しかも積層面板３４が離型フィルム２３を介してプレート２５に張り付く程度の温度まで加熱されることにより、積層面板３４の表面が平滑化される。
【００９０】
また、かかる仮接着工程Ｓ６３の加熱・加圧条件は、実施の形態２に係る仮接着工程Ｓ２３の加熱・加圧条件と同様に、電子線硬化性樹脂が硬化せず、また積層面板３４の孔３９に電子線硬化性樹脂が概ね流れ込まない範囲で定めることが好ましい。これは、電子線硬化性樹脂の特性及び孔３９のサイズにもよるが、例えば３０〜５０℃、３０分、５気圧（約５０６．６ｋＰａ）程度が好適である。
【００９１】
なお、本実施の形態６に係る仮接着工程Ｓ６３においては、開口部２８を大気中に開放した状態で、積層面板３４を加圧することとしたが、電子線硬化性樹脂が孔３９に概ね流れ込まなければ、開口部２８からバッグフィルム２６内の真空吸引を行いながら、積層面板３４を加圧するようにしてもよい。
【００９２】
仮接着工程Ｓ６３が終了した後には、オートクレーブから積層面板３４が取り出され、離型フィルム２３，プレート２５が積層面板３４に張り付いた状態で、定盤２４及びバッグフィルム２６が積層面板３４から取り外される。そして、図６に示す如く、積層面板３４の接着剤３３側の面（下面）に、ハニカムコア５の一面を密着させて、積層体３８を得る。この積層体３８は、ハニカムコア５を下にして定盤１７上に載置され、ナイロン製のバッグフィルム２０が被せられて、バッグフィルム２０と定盤１７との間がシールされ、この状態で電子線照射機３７に取り付けられる。そして、硬化接着工程Ｓ６４が実行される。なお、硬化接着工程Ｓ６４は、実施の形態５に係る硬化接着工程Ｓ５３と同様であるので、説明を省略する。
【００９３】
このような硬化接着工程Ｓ６４の終了後には、電子線を照射した後の積層体３８から離型フィルム２３及びプレート２５を取り除くこととなるが、離型フィルム２３を積層体６とプレート２５との間に介在させているため、容易に積層体３８から離型フィルム２３及びプレート２５を取り外すことができる。
【００９４】
以上の如き実施の形態６に係る多孔面板ハニカムパネルの製造方法においては、孔あけ工程Ｓ６２にて積層面板３４に加工する孔３９の加工条件を、多孔面板ハニカムパネルの使用目的等に応じてある程度自由に設定することができるが、例えば、直径１〜３ｍｍ、ピッチ３〜１０ｍｍとすることが好適である。また、実施の形態６に係る多孔面板ハニカムパネルの製造方法においては、使用するハニカムコア５のセルサイズを５〜３０ｍｍとすることが好ましい。
【００９５】
以上説明した如き本実施の形態６に係る多孔面板ハニカムパネルの製造方法では、実施の形態５と同様の効果を奏し、更に、仮接着工程Ｓ６３により積層面板３４をプレート２５に張り付けて平滑化し、積層面板３４にプレート２５を張り付けたまま、硬化接着工程Ｓ６４を行うため、多孔面板ハニカムパネルの多孔面板を平滑なものとすることができ、より一層形状品質の高い多孔面板ハニカムパネルを製造することができる。
【００９６】
（実施の形態７）
図３に示す如く、本実施の形態７に係る多孔面板ハニカムパネルの製造方法は、緻密化工程Ｓ７１，孔あけ工程Ｓ７２，硬化接着工程Ｓ７３をこの順番で行うものとなっている。
【００９７】
図９及び図１０に示す如く、本実施の形態７に係る多孔面板ハニカムパネルの製造方法においては、電子線硬化性樹脂を含むプリプレグ面板３２の両面に、電子線硬化性のフィルム状の接着剤３３を夫々積層し、積層面板４０を形成し、この積層面板４０に対して緻密化工程Ｓ７１及び孔あけ工程Ｓ７２を実行する。本実施の形態７に係る緻密化工程Ｓ７１及び孔あけ工程Ｓ７２は、積層面板４０を、プリプレグ面板３２の両面に接着剤３３を積層したものとすることの他は、実施の形態５に係る緻密化工程Ｓ５１及び孔あけ工程Ｓ５２の手順と同様であるので、その説明を省略する。
【００９８】
孔あけ工程Ｓ７２が終了した後には、積層面板４０から離型フィルム１０及びプラスチックシート１５が取り外される。そして、図１１に示す如く、ハニカムコア５及び網状板３０で積層面板４０を挟むように、ハニカムコア５，積層面板４０及び網状板３０を積層して積層体４１を得る。そして、かかる積層体４１に対して、硬化接着工程Ｓ７３が実行される。本実施の形態７に係る硬化接着工程Ｓ７３は、積層体４１を、積層面板４０をハニカムコア５及び網状板３０で挟んで積層したものとすることの他は、実施の形態５に係る硬化接着工程Ｓ５３の手順と同様であるので、その説明を省略する。
【００９９】
以上の如き実施の形態７に係る多孔面板ハニカムパネルの製造方法においては、孔あけ工程Ｓ７２にて積層面板４０に加工する孔の加工条件を、多孔面板ハニカムパネルの使用目的等に応じてある程度自由に設定することができるが、例えば、直径０．５〜３ｍｍ、ピッチ３〜１０ｍｍとすることが好適である。また、実施の形態７に係る多孔面板ハニカムパネルの製造方法においては、使用するハニカムコア５のセルサイズを５〜１０ｍｍとすることが好ましい。
【０１００】
これにより、本実施の形態７に係る多孔面板ハニカムパネルの製造方法においては、実施の形態５と同様の効果を奏する他、従来では別個に行っていたプリプレグ面板３２の孔あけ及び接着剤３３の孔あけを同時に行い、また従来では別個に行っていたプリプレグ面板３２の硬化並びにハニカムコア５、網状板３０及び多孔面板の接着を同時に行うため、従来に比して製造工程数を大幅に減じ、製造時間を大幅に短縮することができる。
【０１０１】
（実施の形態８）
図７に示す如く、本実施の形態８に係る多孔面板ハニカムパネルの製造方法は、緻密化工程Ｓ８１，孔あけ工程Ｓ８２，仮接着工程Ｓ８３，硬化接着工程Ｓ８４をこの順番で行うものとなっている。なお、緻密化工程Ｓ８１及び孔あけ工程Ｓ８２は、実施の形態７に係る緻密化工程Ｓ７１及び孔あけ工程Ｓ７２と同様であるので、説明を省略する。
【０１０２】
図１２に示す如く、本実施の形態８に係る多孔面板ハニカムパネルの製造方法においては、電子線硬化性樹脂を含むプリプレグ面板３２の両面に、電子線硬化性のフィルム状の接着剤３３が夫々積層された積層面板４０に対して仮接着工程Ｓ８３を実行する。本実施の形態８に係る仮接着工程Ｓ８３は、積層面板４０を、電子線硬化性のプリプレグ面板３２の両面に電子線硬化性の接着剤３３を積層したものとすることの他は、実施の形態４に係る仮接着工程Ｓ４３の手順と同様であるので、その説明を省略する。
【０１０３】
また、本実施の形態８に係る仮接着工程Ｓ８３の加熱・加圧条件は、電子線硬化性樹脂が硬化せず、積層面板４０の孔に熱硬化性樹脂が概ね流れ込むことがなく、また網状板３０の孔にも概ね流れ込まない範囲で定めることが好ましい。これは、電子線硬化性樹脂の特性、積層面板４０の孔のサイズ及び網状板３０の孔のサイズにもよるが、例えば３０〜５０℃、３０分、５気圧（約５０６．６ｋＰａ）程度が好適である。
【０１０４】
また、電子線硬化性樹脂が積層面板４０の孔及び網状板３０の孔に概ね流れ込まなければ、開口部２８からバッグフィルム２６内の真空吸引を行いながら、積層面板４０及び網状板３０を加圧するようにしてもよい。
【０１０５】
仮接着工程Ｓ８３が終了した後には、オートクレーブから定盤２４及びバッグフィルム２６に覆われた積層面板４０が取り出される。このとき、網状板３０が積層面板４０に張り付いており、また離型フィルム２３を介してプレート２５が網状板３０に張り付いている。このように、プレート２５，離型フィルム２３，網状板３０及び積層面板４０が互いに張り付いた状態で、定盤２４及びバッグフィルム２６が積層面板４０及び網状板３０から取り外される。そして、図１１に示す如く、ハニカムコア５及び網状板３０で積層面板４０を挟むように、積層面板４０の網状板３０の接着面の反対側の面（下面）に、ハニカムコア５の一面を密着させて、積層体４１を得る。この積層体４１は、離型フィルム２３及びプレート２５が網状板３０に張り付いた状態のまま、ハニカムコア５を下にして定盤１７上に載置され、ナイロン製のバッグフィルム２０が被せられて、バッグフィルム２０と定盤１７との間がシールされ、この状態で電子線照射機３７に取り付けられる。そして、硬化接着工程Ｓ８４が実施される。なお、硬化接着工程Ｓ８４は、離型フィルム２３及びプレート２５が網状板３０に張り付いた状態である他は、実施の形態７に係る硬化接着工程Ｓ７３と同様であるので、説明を省略する。
【０１０６】
このような硬化接着工程Ｓ８４の終了後には、電子線を照射した後の積層体４１から離型フィルム２３及びプレート２５を取り除くこととなるが、離型フィルム２３を積層体４１とプレート２５との間に介在させているため、容易に積層体４１から離型フィルム２３及びプレート２５を取り外すことができる。
【０１０７】
以上の如き実施の形態８に係る多孔面板ハニカムパネルの製造方法においては、孔あけ工程Ｓ８２にて積層面板４０に加工する孔の加工条件を、多孔面板ハニカムパネルの使用目的等に応じてある程度自由に設定することができるが、例えば、直径１〜３ｍｍ、ピッチ３〜１０ｍｍとすることが好適である。また、実施の形態８に係る多孔面板ハニカムパネルの製造方法においては、使用するハニカムコア５のセルサイズを５〜３０ｍｍとすることが好ましい。
【０１０８】
以上説明した如き本実施の形態８に係る多孔面板ハニカムパネルの製造方法では、実施の形態７と同様の効果を奏し、更に、仮接着工程Ｓ８３により網状板３０をプレート２５に張り付けて積層面板４０及び網状板３０を平滑化し、網状板３０にプレート２５を張り付けたまま、硬化接着工程Ｓ８４を行うため、多孔面板ハニカムパネルの多孔面板及び網状板を平滑なものとすることができ、より一層形状品質の高い網状板付きの多孔面板ハニカムパネルを製造することができる。
【０１０９】
（実施の形態９）
図１４は、本発明の実施の形態９に係る多孔面板ハニカムパネルの製造装置の構成の概略を示す模式図である。図１４に示す如く、本実施の形態９に係る多孔面板ハニカムパネルの製造装置４２は、孔あけ機２と、電子線照射機３７と、オートクレーブ３とから主として構成されている。孔あけ機２は、パンチ２ａにより被加工物たる積層面板４３の孔あけ加工を行うべく構成されており、電子線照射機３７は、孔あけ加工された積層面板４３に電子線を照射すべく構成されており、またオートクレーブ３は、積層面板４３及びハニカムコア５の積層体４４に電子線を照射すべく構成されている。また、かかる電子線照射機３７及びオートクレーブ３によって、本発明に係る硬化接着機が構成されている。
【０１１０】
図１５は、本発明の実施の形態９に係る多孔面板ハニカムパネルの製造方法の手順を説明するフローチャートである。図１５に示す如く、本実施の形態９に係る多孔面板ハニカムパネルの製造方法は、緻密化工程Ｓ９１，孔あけ工程Ｓ９２，硬化接着工程Ｓ９３をこの順番で行うものとなっており、また硬化接着工程Ｓ９３は、更に電子線照射工程（放射線照射工程）Ｓ９４及び加熱工程Ｓ９５を有している。
【０１１１】
図２に示す如く、本発明の実施の形態９に係る多孔面板ハニカムパネルの製造方法においては、実施の形態５〜８と同様に、炭素繊維、ガラス繊維、アラミド繊維、ＳｉＣ繊維等の強化繊維の織布に、電子線硬化性樹脂を含浸させたプリプレグ３５を使用する。このようなプリプレグ３５を所要の大きさ及び形状に裁断し、所要枚数積層して得たプリプレグ面板３２の一面に、熱に反応して硬化する性質を有するフィルム状の接着剤９を積層し、積層面板４３を得る。
【０１１２】
そして、図４及び図５に示す如く、かかる積層面板４３に対して、緻密化工程Ｓ９１及び孔あけ工程Ｓ９２を実行し、積層面板４３に孔４５を設ける。本実施の形態９に係る緻密化工程Ｓ９１及び孔あけ工程Ｓ９２は、積層面板４３を、電子線に反応して硬化する性質を有するプリプレグ面板３２及び熱に反応して硬化する性質を有する接着剤９を積層したものとすることの他は、実施の形態１に係る緻密化工程Ｓ１１及び孔あけ工程Ｓ１２の手順と同様であるので、その説明を省略する。
【０１１３】
次に、以下のようにして電子線照射工程Ｓ９４を実行する。図１６は、本発明の実施の形態９に係る多孔面板ハニカムパネルの製造方法の電子線照射工程Ｓ９４の概要を説明する模式図である。孔あけ工程Ｓ９２が終了した後には、積層面板４３から離型フィルム１０及びプラスチックシート１５が取り外される。この積層面板４３の両面に、夫々テフロン（Ｒ）系材料からなる離型フィルム４６が積層され、定盤４７の上面に載置される。更に積層面板４３にナイロン製のバッグフィルム４８が被せられる。積層面板４３の周囲には、シール材４９が配されており、このシール材４９を介してバッグフィルム４８と定盤４７との間がシールされ、これにより積層面板４３がバッグフィルム４８で包まれた状態となる。
【０１１４】
バッグフィルム４８には開口部５０が設けられており、この開口部５０は図示しない真空ポンプに接続されている。積層面板４３を定盤４７及びバッグフィルム４８ごと電子線照射機３７にセットし、バッグフィルム４８内を前記真空ポンプによって真空吸引しながら、積層面板４３に所定の線量（例えば、５０〜１５０ｋＧｙの表面吸収線量）の電子線を照射する。このときの照射時間は数秒である。かかる電子線照射工程Ｓ９４により、積層面板４３のプリプレグ面板３２が電子線照射機３７から照射された電子線に反応して硬化する。ここで、接着剤９は電子線に反応せず、柔軟なまま（未硬化）となっている。そして、電子線を照射した後の積層面板４３を電子線照射機３７から取り出し、定盤４７，離型フィルム４６及びバッグフィルム４８を取り除く。
【０１１５】
次に、以下のようにして加熱工程Ｓ９５を実行する。図６に示す如く、実施の形態１に係る硬化接着工程Ｓ１３を実行する場合と同様に、積層面板４３の接着剤９側の面（下面）に、ハニカムコア５の一面を密着させて、積層体５１を得る。この積層体５１は、ハニカムコア５を下にして定盤１７上に載置され、ナイロン製のバッグフィルム２０が被せられて、バッグフィルム２０と定盤１７との間がシールされ、この状態でオートクレーブ３に取り付けられる。そして、加熱工程Ｓ９５が実行される。
【０１１６】
このときの加熱・加圧条件は、積層面板４３に使用される接着剤９が１２０℃で硬化するタイプのものである場合には、１２０℃、１２０分、５気圧（約５０６．６ｋＰａ）程度とし、また接着剤９が１８０℃で硬化するタイプのものである場合には、１８０℃、１２０分、５気圧（約５０６．６ｋＰａ）程度とする。
【０１１７】
なお、本実施の形態９に係る加熱工程Ｓ９５においては、図６に示す如く、開口部２２が大気中に開放された状態で積層体５１が加圧されることとなる。これは、１００℃以上の高温でバッグフィルム２０内を真空吸引すると、接着剤９の接着強度が低下する場合があることによる。
【０１１８】
接着剤９は、オートクレーブ３による加熱で硬化し、これによって積層面板４３にハニカムコア５が接着される。そして、加熱・加圧した後の積層体５１をオートクレーブ３から取り出し、定盤１７、離型フィルム１８、プレート１９及びバッグフィルム２０を取り除くことにより、多孔面板ハニカムパネルが得られる。
【０１１９】
以上説明した如き本実施の形態９に係る多孔面板ハニカムパネルの製造方法では、孔あけ工程Ｓ９２において、柔軟な未硬化のプリプレグ面板３２と、フィルム状の接着剤９とを積層した積層面板４３を孔あけ加工するため、多孔面板の孔と接着剤の孔とを同時に孔４５として形成することができ、従来の多孔面板の孔と接着剤の孔とを別個に加工する方法に比して、工程数を減少させることができ、多孔面板ハニカムパネルの製造時間を大幅に短縮することができる。また、フィルム状の接着剤９の孔を確実に設けることができるため、従来に比して多孔面板の孔を接着剤９が塞ぐことを大幅に減少させることができる。
【０１２０】
更に、電子線照射工程Ｓ９４で積層面板４３に対して電子線を照射することにより、プリプレグ面板３２が定盤４７の平面に沿って平面状とされたまま硬化させるため、加熱工程Ｓ９５において加熱した場合であっても、積層面板４３に熱歪みによる曲がり、そり等が発生せず、平坦な多孔面板を有する多孔面板ハニカムパネルを製造することが可能となる。
【０１２１】
（実施の形態１０）
図１５に示す如く、本実施の形態１０に係る多孔面板ハニカムパネルの製造方法は、緻密化工程Ｓ１０１，孔あけ工程Ｓ１０２，硬化接着工程Ｓ１０３をこの順番で行うものとなっており、また硬化接着工程Ｓ１０３は、更に電子線照射工程（放射線照射工程）Ｓ１０４及び加熱工程Ｓ１０５を有している。
【０１２２】
図９，１０に示す如く、本実施の形態１０に係る多孔面板ハニカムパネルの製造方法においては、電子線硬化性樹脂を含むプリプレグ面板３２の両面に、熱硬化性のフィルム状の接着剤９を夫々積層し、積層面板５２を形成し、この積層面板５２に対して緻密化工程Ｓ１０１及び孔あけ工程Ｓ１０２を実行する。本実施の形態１０に係る緻密化工程Ｓ１０１及び孔あけ工程Ｓ１０２は、積層面板５２を、プリプレグ面板３２の両面に接着剤９を積層したものとすることの他は、実施の形態３に係る緻密化工程Ｓ３１及び孔あけ工程Ｓ３２の手順と同様であるので、その説明を省略する。
【０１２３】
図１７は、本発明の実施の形態１０に係る多孔面板ハニカムパネルの製造方法の電子線照射工程Ｓ１０４の概要を説明する模式図である。孔あけ工程Ｓ１０２が終了した後には、積層面板５２から離型フィルム１０及びプラスチックシート１５が取り外される。そして、図１７に示す如く、定盤５３の上面に離型フィルム（離型剤）５４及び網状板３０が載置され、更にその上に、積層面板５２が載置される。これにより、積層面板５２の一面（下面）に網状板３０の一面（上面）が密着した状態となる。また、積層面板５２の上には離型フィルム５４が更に載置され、この上からナイロン製のバッグフィルム５５が被せられる。積層面板５２の周囲には、シール材５６が配されており、このシール材５６を介してバッグフィルム５５と定盤５３との間がシールされ、これにより積層面板５２がバッグフィルム５５で包まれた状態となる。
【０１２４】
バッグフィルム５５には開口部６４が設けられており、この開口部６４は図示しない真空ポンプに接続されている。積層面板５２及び網状板３０を定盤５３及びバッグフィルム５５ごと電子線照射機３７にセットし、バッグフィルム５５内を前記真空ポンプによって真空吸引しながら、積層面板５２に所定の線量（例えば、５０〜１５０ｋＧｙの表面吸収線量）の電子線を数秒間照射する。
【０１２５】
かかる電子線照射工程Ｓ１０４により、積層面板５２のプリプレグ面板３２が電子線照射機３７から照射された電子線に反応して硬化する。ここで、接着剤９は電子線に反応せず、柔軟なまま（未硬化）となっている。また、かかる電子線照射工程Ｓ１０４においては、積層面板５２及び網状板３０を定盤５３上に載置した状態でプリプレグ面板３２を硬化させるため、平坦な積層面板５２を得ることができる。
【０１２６】
図１８は、本発明の実施の形態１０に係る多孔面板ハニカムパネルの製造方法の加熱工程Ｓ１０５の概要を説明する模式図である。電子線照射工程Ｓ１０４が終了した後には、電子線照射機３７から定盤５３及びバッグフィルム５５に覆われた積層面板５２が取り出される。このとき、網状板３０が積層面板５２に密着している。このような網状板３０及び積層面板５２から、定盤５３，離型フィルム５４及びバッグフィルム５５が取り外される。そして、図１８に示す如く、ハニカムコア５及び網状板３０で積層面板５２を挟むように、積層面板５２の網状板３０の接着面の反対側の面（下面）に、ハニカムコア５の一面を密着させて、積層体５７を得る。この積層体５７は、ハニカムコア５を下にして定盤５８上に載置され、また網状板３０の上に離型フィルム５９が載置され、更にこの上からナイロン製のバッグフィルム６０が被せられる。積層体５７の周囲には、シール材６１が配されており、これによりバッグフィルム６０と定盤５８との間がシールされ、この状態でオートクレーブ３に取り付けられる。そして、加熱工程Ｓ１０５が実行される。なお、加熱工程Ｓ１０５は、加熱対象を、積層面板５２を網状板３０及びハニカムコア５で挟むように積層した積層体５７とする他は、実施の形態９に係る加熱工程Ｓ９５と同様であるので、説明を省略する。
【０１２７】
この加熱工程Ｓ１０５によって、積層体５７が加熱され、積層面板５２の両面の接着剤９が硬化することとなる。これにより、積層面板５２に網状板３０及びハニカムコア５が夫々接着される。そして、加熱・加圧した後の積層体５７をオートクレーブ３から取り出し、定盤５８，離型フィルム５９及びバッグフィルム６０を取り除くことにより、網状板付きの多孔面板ハニカムパネルが得られる。
【０１２８】
これにより、本実施の形態１０に係る多孔面板ハニカムパネルの製造方法においては、実施の形態９と同様の効果を奏して、網状板付きの多孔面板ハニカムパネルを製造することができる。
【０１２９】
（実施の形態１１）
図１５に示す如く、本実施の形態１１に係る多孔面板ハニカムパネルの製造方法は、緻密化工程Ｓ１１１，孔あけ工程Ｓ１１２，硬化接着工程Ｓ１１３をこの順番で行うものとなっており、また硬化接着工程Ｓ１１３は、更に電子線照射工程（放射線照射工程）Ｓ１１４及び加熱工程Ｓ１１５を有している。
【０１３０】
図９，１０に示す如く、本実施の形態１１に係る多孔面板ハニカムパネルの製造方法においては、電子線硬化性樹脂を含むプリプレグ面板３２の一面に熱硬化性のフィルム状の接着剤９を、他面に電子線硬化性のフィルム状の接着剤３３を夫々積層し、積層面板６２を形成し、この積層面板６２に対して緻密化工程Ｓ１１１及び孔あけ工程Ｓ１１２を実行する。本実施の形態１１に係る緻密化工程Ｓ１１１及び孔あけ工程Ｓ１１２は、積層面板６２を、プリプレグ面板３２の一面に接着剤９を積層し、他面に接着剤３３を積層したものとすることの他は、実施の形態３に係る緻密化工程Ｓ３１及び孔あけ工程Ｓ３２の手順と同様であるので、その説明を省略する。
【０１３１】
孔あけ工程Ｓ１１２が終了した後には、積層面板６２から離型フィルム１０及びプラスチックシート１５が取り外される。そして、図１７に示す如く、積層面板６２の電子線硬化性の接着剤３３側の面に網状板３０を密着させ、この積層面板６２及び網状板３０に対して電子線照射工程Ｓ１１４を実行する。本実施の形態１１に係る電子線照射工程Ｓ１１４は、積層面板６２を、電子線硬化性のプリプレグ面板３２の一面に熱硬化性の接着剤９を積層し、他面に電子線硬化性の接着剤３３を積層したものとし、またかかる積層面板６２の接着剤３３側の面に網状板３０を密着させたものを電子線の照射対象とすることの他は、実施の形態１０に係る電子線照射工程Ｓ１０４の手順と同様であるので、その説明を省略する。
【０１３２】
このような電子線照射工程Ｓ１１４により、積層面板６２のプリプレグ面板３２及び接着剤３３が硬化し、積層面板６２に網状板３０が接着される。ここで、接着剤９は電子線に反応せず、柔軟なまま（未硬化）となっている。そして、電子線を照射した後の積層面板６２を電子線照射機３７から取り出し、定盤５３，離型フィルム５４及びバッグフィルム５５を取り除く。更に、図１８に示す如く、ハニカムコア５及び網状板３０で積層面板６２を挟むように、積層面板６２の熱硬化性の接着剤９側の面（下面）、即ち網状板３０の接着面の反対側の面に、ハニカムコア５の一面を密着させて、積層体６３を得る。かかる積層体６３が、実施の形態１０に係る加熱工程Ｓ１０５における積層体５７と同様の状態でオートクレーブ３にセットされ、加熱工程Ｓ１１５が実行される。なお、加熱工程Ｓ１１５は、加熱対象を、積層面板６２を網状板３０及びハニカムコア５で挟むように積層した積層体６３とする他は、実施の形態９に係る加熱工程Ｓ９５と同様であるので、説明を省略する。
【０１３３】
この加熱工程Ｓ１１５によって、積層体６３が加熱され、積層面板６２の接着剤９が硬化することとなる。これにより、積層面板６２にハニカムコア５が接着される。そして、加熱・加圧した後の積層体６３をオートクレーブ３から取り出し、定盤５８，離型フィルム５９及びバッグフィルム６０を取り除くことにより、網状板付きの多孔面板ハニカムパネルが得られる。
【０１３４】
これにより、本実施の形態１１に係る多孔面板ハニカムパネルの製造方法においては、実施の形態９と同様の効果を奏して、網状板付きの多孔面板ハニカムパネルを製造することができる。
【０１３５】
以上の如き実施の形態９〜１１に係る多孔面板ハニカムパネルの製造方法においては、孔あけ工程Ｓ９２，Ｓ１０２，Ｓ１１２にて積層面板４３，５２，６２に加工する孔４５の加工条件を、多孔面板ハニカムパネルの使用目的等に応じてある程度自由に設定することができるが、例えば、直径０．５〜３ｍｍ、ピッチ３〜１０ｍｍとすることが好適である。また、実施の形態９〜１１に係る多孔面板ハニカムパネルの製造方法においては、使用するハニカムコア５のセルサイズを５〜３０ｍｍとすることが好ましい。
【０１３６】
なお、実施の形態５〜１１においては、強化繊維に電子線硬化性樹脂を含浸させたプリプレグ３５及び／又は電子線に反応して硬化する性質を有するフィルム状の接着剤３３を使用し、電子線照射機３７によって前記プリプレグ３５からなるプリプレグ面板３２及び接着剤３３を硬化させる方法に着いて述べたが、これに限定されるものではなく、強化繊維に電子線以外の放射線（例えば、紫外線、Ｘ線等）に反応して硬化する合成樹脂を含浸させたプリプレグ及び／又は当該放射線に反応して硬化する接着剤を使用し、放射線によって前記プリプレグからなるプリプレグ面板及び接着剤を硬化させてもよい。
【０１３７】
【発明の効果】
本発明に係る多孔面板ハニカムパネルの製造方法及びその装置による場合は、柔軟な未硬化のプリプレグ面板と、フィルム状の接着剤とを積層した積層面板を孔あけ加工するため、多孔面板の孔と接着剤の孔とを同時に形成することができ、従来に比して多孔面板ハニカムパネルの製造時間を大幅に短縮することができる。また、フィルム状の接着剤の孔を確実に設けることができるため、従来に比して多孔面板の孔を接着剤が塞ぐことを大幅に減少させることができる。
【図面の簡単な説明】
【図１】本発明の実施の形態１に係る多孔面板ハニカムパネルの製造装置の構成の概略を示す模式図である。
【図２】本発明の実施の形態１（５，９）に係る積層面板の形成工程を説明する模式図である。
【図３】本発明の実施の形態１（３，５，７）に係る多孔面板ハニカムパネルの製造方法の手順を説明するフローチャートである。
【図４】本発明の実施の形態１（５，９）に係る多孔面板ハニカムパネルの製造方法の緻密化工程の概要を説明する模式図である。
【図５】本発明の実施の形態１（５，９）に係る多孔面板ハニカムパネルの製造方法の孔あけ工程の概要を説明する模式図である。
【図６】本発明の実施の形態１（２，５，６，９）に係る多孔面板ハニカムパネルの製造方法の硬化接着工程の概要を説明する模式図である。
【図７】本発明の実施の形態２（４，６，８）に係る多孔面板ハニカムパネルの製造方法の手順を説明するフローチャートである。
【図８】本発明の実施の形態２（６）に係る多孔面板ハニカムパネルの製造方法の仮接着工程の概要を説明する模式図である。
【図９】本発明の実施の形態３（７，１０，１１）に係る多孔面板ハニカムパネルの製造方法の緻密化工程の概要を説明する模式図である。
【図１０】本発明の実施の形態３（７，１０，１１）に係る多孔面板ハニカムパネルの製造方法の孔あけ工程の概要を説明する模式図である。
【図１１】本発明の実施の形態３（４，７，８）に係る多孔面板ハニカムパネルの製造方法の硬化接着工程の概要を説明する模式図である。
【図１２】本発明の実施の形態４（８）に係る多孔面板ハニカムパネルの製造方法の仮接着工程の概要を説明する模式図である。
【図１３】本発明の実施の形態５に係る多孔面板ハニカムパネルの製造装置の構成の概略を示す模式図である。
【図１４】本発明の実施の形態９に係る多孔面板ハニカムパネルの製造装置の構成の概略を示す模式図である。
【図１５】本発明の実施の形態９（１０，１１）に係る多孔面板ハニカムパネルの製造方法の手順を説明するフローチャートである。
【図１６】本発明の実施の形態９に係る多孔面板ハニカムパネルの製造方法の電子線照射工程の概要を説明する模式図である。
【図１７】本発明の実施の形態１０（１１）に係る多孔面板ハニカムパネルの製造方法の電子線照射工程の概要を説明する模式図である。
【図１８】本発明の実施の形態１０（１１）に係る多孔面板ハニカムパネルの製造方法の加熱工程の概要を説明する模式図である。
【図１９】多孔面板ハニカムパネルの従来の製造方法の一例を説明する模式図である。
【図２０】多孔面板ハニカムパネルの従来の製造方法の他の例を説明する模式図である。
【符号の説明】
１，３６，４２ 多孔面板ハニカムパネルの製造装置
２ 孔あけ機
２ａ パンチ
３ オートクレーブ
４，２９，３４，４０，４３，５２，６２ 積層面板
５ ハニカムコア
６，３１，３８，４１，４４，５１，５７，６３ 積層体
７，３２ プリプレグ面板
８，３５ プリプレグ
９，３３ 接着剤
１０，１８，２３，４６，５４，５９ 離型フィルム（離型剤）
１１，１７，２４，４７，５３，５８ 定盤
１２，２０，２６，４８，５５，６０ バッグフィルム
１５ プラスチックシート
１６，３９，４５ 孔
１９，２５ プレート
３０ 網状板
３７ 電子線照射機
Ｓ１１，Ｓ２１，Ｓ３１，Ｓ４１，Ｓ５１，Ｓ６１，Ｓ７１，Ｓ８１，Ｓ９１，Ｓ１０１，Ｓ１１１ 緻密化工程
Ｓ１２，Ｓ２２，Ｓ３２，Ｓ４２，Ｓ５２，Ｓ６２，Ｓ７２，Ｓ８２，Ｓ９２，Ｓ１０２，Ｓ１１２ 孔あけ工程
Ｓ１３，Ｓ２４，Ｓ３３，Ｓ４４，Ｓ５３，Ｓ６４，Ｓ７３，Ｓ８４，Ｓ９３，Ｓ１０３，Ｓ１１３ 硬化接着工程
Ｓ２３，Ｓ４３，Ｓ６３，Ｓ８３ 仮接着工程
Ｓ９４，Ｓ１０４，Ｓ１１４ 電子線照射工程
Ｓ９５，Ｓ１０５，Ｓ１１５ 加熱工程[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a porous face plate honeycomb panel in which a composite material perforated plate having a large number of holes formed in a composite material face plate is bonded to a honeycomb core, and an apparatus directly used for performing the method.
[0002]
[Prior art]
2. Description of the Related Art A porous face plate honeycomb panel that is lightweight, highly rigid, and has sound absorbing performance is used for an engine nacelle of an aircraft or the like. This perforated face plate honeycomb panel has a structure in which a face plate made of aluminum or a composite material provided with a large number of holes is bonded to a honeycomb core.
[0003]
FIG. 19 is a schematic diagram illustrating an example of a conventional method for manufacturing such a perforated face plate honeycomb panel. As shown in FIG. 19, one of the conventional methods for manufacturing a perforated face plate honeycomb panel is to laminate a thermosetting film-like adhesive 103 on a mounting surface of a perforated face plate 102 of a honeycomb core 101, A portion of the honeycomb core 103 that closes the cavity of the cell 104 of the honeycomb core 103 is pierced with a needle 105 and heated, or hot air is blown onto the adhesive 103 to make a hole in the adhesive 103 and to form a hole in the wall of the cell 104. An adhesive hole making step of concentrating the adhesive 103 on the portion, and a porous face plate 102 provided with a large number of holes 106 in advance on the mounting surface of the honeycomb core 101 in this state, and an autoclave (not shown). Some of them have a bonding step in which the honeycomb core 101 and the porous face plate 102 are bonded by heating the honeycomb core 101 and the porous face plate 102.
[0004]
In addition, there is a method for manufacturing a porous face plate honeycomb panel as described below. FIG. 20 is a schematic diagram illustrating another example of a conventional method for manufacturing a porous face plate honeycomb panel. As shown in FIG. 20, in this method, the adhesive 103 is laminated on the porous face plate 102 instead of the honeycomb core 101, and the portion of the adhesive 103 that closes the hole 106 is pierced with a needle 105 and heated. Alternatively, a hot air is blown onto the adhesive 103 to form an adhesive hole in the adhesive 103, and the porous face plate 102 in this state is laminated on the honeycomb core 101 and heated in an autoclave (not shown). And a bonding step of bonding the honeycomb core 101 and the porous face plate 102.
[0005]
However, in the method shown in FIG. 19, when the porous face plate 102 is brought into close contact with the honeycomb core 101, the adhesive 103 spreads along the surface of the porous face plate 102, and the adhesive 106 may block the holes 106. In the method shown in FIG. 20, when the diameter of the hole 106 is small or the like, the adhesive 103 may not be formed in the adhesive hole forming step, and the hole 106 may be similarly closed by the adhesive 103. This has been the cause of the deterioration of the sound absorption performance of the porous face plate honeycomb panel.
[0006]
Therefore, after applying a solvent type adhesive to the cell portion of the honeycomb core, a thermosetting film-like adhesive is laminated on the honeycomb core, and the film-like adhesive is melted by hot air to form a film. The adhesive is transferred to the cell portion of the honeycomb core, the laminate of the porous face plate and the mesh plate is placed on the cell portion of the honeycomb core, and the honeycomb core and the laminate are heated to cure the adhesive. A method has been proposed (Patent Document 1).
[0007]
In this method, by applying a solvent-type adhesive to the honeycomb core, the adhesive force of the film-like adhesive can be increased, and therefore, an extremely thin film-like adhesive can be used. Therefore, it is possible to make it difficult for the adhesive to close the holes of the porous face plate when the laminate is brought into close contact with the honeycomb core.
[0008]
[Patent Document 1]
JP-A-9-156010
[0009]
[Problems to be solved by the invention]
However, in the conventional method for manufacturing a perforated face plate honeycomb panel disclosed in Patent Document 1, when the honeycomb core and the laminate are brought into close contact with each other, the method for manufacturing a perforated face plate honeycomb panel shown in FIG. Since the adhesive spreads along the surface of the laminate, though small in comparison to the case, the adhesive sometimes closed some holes of the porous face plate and some holes of the mesh plate.
[0010]
In recent years, in particular, in recent years, a porous face plate honeycomb panel using a composite porous face plate has been often used in aircraft for the main purpose of weight reduction, but a conventional method for manufacturing a conventional porous face plate honeycomb panel as described above. In each case, it is necessary to prepare a porous face plate in advance, which requires many manufacturing steps and requires a long manufacturing time.
[0011]
When a composite face plate is prepared in advance, a prepreg (material for molding a composite material) is laminated as necessary to form a face plate (hereinafter referred to as a prepreg face plate), and the prepreg face plate is cured. After that, a through hole is often provided by a drill or a punch, but a method of providing a through hole by a drill requires a lot of processing time, and a method of providing a through hole by a punch requires a hardened composite material. Since the face plate has the property of relatively high hardness and brittleness, there is a problem that the tool is easily chipped, and cracks and chips are generated around the holes.
[0012]
The present invention has been made in view of such circumstances, and it is possible to significantly reduce the possibility that the adhesive blocks the holes of the porous face plate as compared with the related art, and to significantly reduce the manufacturing time. It is an object of the present invention to provide a method for manufacturing a perforated face plate honeycomb panel which can be used and an apparatus directly used for implementing the method.
[0013]
[Means for Solving the Problems]
In order to solve the above problems, a method for manufacturing a perforated face plate honeycomb panel according to the present invention is a method for manufacturing a perforated face plate obtained by laminating a film-like adhesive on a prepreg face plate made of an uncured prepreg impregnated with a synthetic resin in a reinforcing fiber. A perforating step of perforating, and curing the prepreg face plate of the laminated face plate perforated in the perforating step, and bonding one side of the honeycomb core to the adhesive to adhere the laminated face plate to the honeycomb core. Curing and bonding.
[0014]
Further, the apparatus for manufacturing a perforated face plate honeycomb panel according to the present invention is characterized in that a perforating process is performed for perforating a laminated face plate obtained by laminating a film-like adhesive on a prepreg face plate made of an uncured prepreg impregnated with a synthetic resin in a reinforcing fiber. And a curing bonding machine that cures the prepreg face plate of the laminated face plate that has been perforated by the perforating machine, and adheres one surface of the honeycomb core to the adhesive to adhere the laminated face plate to the honeycomb core. Prepare.
[0015]
In this way, it is possible to simultaneously form the holes of the porous face plate and the holes of the adhesive, since a laminated face plate obtained by laminating a flexible uncured prepreg face plate and a film-like adhesive is formed. In comparison, the manufacturing time of the perforated face plate honeycomb panel can be greatly reduced. In addition, since the film-shaped adhesive holes can be reliably provided, it is possible to greatly reduce the possibility that the adhesive blocks the holes of the porous face plate as compared with the related art.
[0016]
In the above invention, it is assumed that the synthetic resin and the adhesive have a property of being cured by reacting to heat, respectively, and in the curing bonding step, the laminated face plate is formed by bonding one surface of a honeycomb core to the surface of the adhesive. It is preferable to heat the laminated face plate and to adhere the laminated face plate and the honeycomb core substantially simultaneously by heating in a state of being in close contact.
[0017]
In this case, prior to the curing and bonding step, the synthetic resin is inserted into the holes of the laminated face plate in a state where a plate is stacked on a surface of the laminated face plate opposite to the adhesive side via a release agent. It is preferable that the method further includes a temporary bonding step of heating the laminate face plate and the plate to a temperature at which the laminate face plate and the plate are not adhered to each other.
[0018]
In the above invention, in the perforating step, a laminated face plate obtained by laminating a film-like adhesive having a property of curing in response to heat on both surfaces of the prepreg face plate is perforated, and in the cured bonding step, By heating the laminated face plate in a state sandwiched between the honeycomb core and the mesh plate, curing of the laminated face plate, adhesion between the laminated face plate and the honeycomb core, and adhesion between the laminated face plate and the mesh plate can be performed substantially simultaneously.
[0019]
In this case, prior to the curing and bonding step, one surface of the mesh plate is brought into close contact with one surface of the laminate face plate, and the plate is stacked on the other surface of the mesh plate via a release agent. Preferably, the method further includes a temporary bonding step of heating the synthetic resin to a temperature at which the synthetic resin does not substantially flow into the hole, and a temperature at which the laminated face plate, the mesh plate, and the mesh plate and the plate adhere to each other.
[0020]
In the above invention, the synthetic resin and the adhesive each have a property of being cured in response to radiation, and in the curing bonding step, one surface of the honeycomb core is adhered to the surface of the laminated face plate on the adhesive side. In this state, it is preferable that the laminated face plate is irradiated with radiation to cure the laminated face plate and bond the laminated face plate and the honeycomb core substantially simultaneously.
[0021]
In this case, prior to the curing and bonding step, the synthetic resin is inserted into the holes of the laminated face plate in a state where a plate is stacked on a surface of the laminated face plate opposite to the adhesive side via a release agent. It is preferable that the method further includes a temporary bonding step of heating the laminate face plate and the plate to a temperature at which the laminate face plate and the plate are not adhered to each other.
[0022]
In the above invention, in the perforating step, a laminated face plate in which a film-like adhesive having a property of curing in response to radiation is laminated on both surfaces of the prepreg face plate, respectively, is perforated, and in the cured bonding step, In a state where the laminated face plate is sandwiched between the honeycomb core and the mesh plate, the laminated face plate is irradiated with radiation to cure the laminated face plate, bond the laminated face plate to the honeycomb core, and bond the laminated face plate to the mesh plate substantially simultaneously. You can do it too.
[0023]
In this case, prior to the curing and bonding step, one surface of the mesh plate is brought into close contact with one surface of the laminate face plate, and the plate is stacked on the other surface of the mesh plate via a release agent. Preferably, the method further includes a temporary bonding step of heating the synthetic resin to a temperature at which the synthetic resin does not substantially flow into the hole, and a temperature at which the laminated face plate, the mesh plate, and the mesh plate and the plate adhere to each other.
[0024]
In the above invention, the synthetic resin has a property of being cured in response to radiation, and the adhesive has a property of being cured in response to heat, and the curing and bonding step cures the prepreg face plate. A radiation irradiating step of irradiating the laminated face plate with radiation, and a honeycomb core on the surface of the laminated face plate on the adhesive side in order to bond the laminated face plate with the prepreg face plate cured in the radiation irradiating step to the honeycomb core. And a heating step of heating in a state where one surface is in close contact.
[0025]
In this case, in the perforating step, a laminated face plate in which a film-like adhesive having a property of being cured in response to heat is laminated on both surfaces of the prepreg face plate, respectively, and the heating step is performed. In order to perform bonding of the laminated face plate and the mesh plate almost simultaneously with the honeycomb core and the laminated face plate and the mesh plate, the laminated face plate can be heated while being sandwiched between the honeycomb core and the mesh plate. A laminated face plate laminated so as to sandwich the prepreg face plate between a film-shaped first adhesive having a property of curing in response to a radiation and a film-shaped second adhesive having a property of curing in response to a radiation In the radiation irradiation step, one surface of the mesh plate is attached to the surface of the laminate face plate on the side of the second adhesive in order to substantially simultaneously cure the laminate face plate and bond the laminate face plate and the mesh plate. Dense Is the radiation was irradiated on the laminated surface plates in a state were the heating step can also be heated while being in close contact with one surface of the honeycomb core to the surface of the first adhesive side of the laminated surface plates.
[0026]
In the above invention, it is more preferable that the radiation is an electron beam.
[0027]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a method and an apparatus for manufacturing a porous face plate honeycomb panel according to an embodiment of the present invention will be specifically described with reference to the drawings.
[0028]
(Embodiment 1)
FIG. 1 is a schematic view showing an outline of a configuration of a manufacturing apparatus of a porous face plate honeycomb panel according to Embodiment 1 of the present invention. As shown in FIG. 1, an apparatus 1 for manufacturing a porous face plate honeycomb panel according to the first embodiment includes a perforator 2 and an autoclave 3 constituting a curing and bonding machine of the present invention. The drilling machine 2 is configured to punch a laminated face plate 4 as a workpiece by a punch 2a, and the autoclave 3 heats a laminated body 4 of the laminated face plate 4 and the honeycomb core 5 that have been drilled. It is configured to
[0029]
FIG. 2 is a schematic diagram illustrating a process of forming the laminated face plate 4. The prepreg 8 used in Embodiment 1 of the present invention is a synthetic resin (hereinafter, referred to as a synthetic resin having a property of being cured by reacting with heat) on a woven fabric of reinforcing fibers such as carbon fiber, glass fiber, aramid fiber, and SiC fiber. Thermosetting resin), and is formed in a sheet shape. The prepreg 8 may be made of a woven fabric in which reinforcing fibers are woven so as to intersect with each other and impregnated with a thermosetting resin, or a prepreg in which reinforcing fibers aligned in one direction are impregnated with a thermosetting resin. Can be used. The prepreg 8 is cut into a required size and shape, and a required number of sheets are laminated to obtain a prepreg face plate 7. If the prepreg 8 has a thickness necessary for the prepreg face plate 7, the prepreg 8 cut without being laminated may be used as the prepreg face plate 7.
[0030]
On one surface of the prepreg face plate 7 thus obtained, a film-like adhesive 9 having a property of being cured by reacting with heat is laminated to obtain a laminated face plate 4.
[0031]
FIG. 3 is a flowchart illustrating a procedure of a method for manufacturing a perforated face plate honeycomb panel according to Embodiment 1 of the present invention. As shown in FIG. 3, in the method for manufacturing a porous face plate honeycomb panel according to the first embodiment, a densification step S11, a hole forming step S12, and a curing and bonding step S13 are performed in this order.
[0032]
FIG. 4 is a schematic diagram illustrating an outline of the densification step S11 according to the first embodiment. First, release films 10 each made of a Teflon (R) -based material are laminated on both surfaces of the laminated face plate 4 obtained as described above, and placed on the upper surface of the surface plate 11. Further, the laminated face plate 4 is covered with a nylon bag film 12. A sealing material 13 is provided around the laminated face plate 4, and the space between the bag film 12 and the surface plate 11 is sealed via the sealing material 13, whereby the laminated face plate 4 is wrapped by the bag film 12. State.
[0033]
An opening 14 is provided in the bag film 12, and the opening 14 is connected to a vacuum pump (not shown). The laminated face plate 4 is put into the autoclave 3 together with the platen 11 and the bag film 12, and while the vacuum inside the bag film 12 is suctioned by the vacuum pump, the prepreg face plate 7 and the adhesive 9 are heated and heated at such a temperature and time as not to cure. Apply pressure.
[0034]
Although voids (bubbles) enter between the respective layers of the prepreg face plate 7 when the prepreg 8 is laminated, such voids are removed by the densification step S11. Therefore, it is preferable that the heating and pressurizing conditions at this time are such that voids are efficiently removed. Although it depends on the properties of the thermosetting resin, for example, 70 ° C., 30 minutes, and about 5 atm (about 506.6 kPa) are preferable.
[0035]
FIG. 5 is a schematic diagram for explaining the outline of the drilling step S12 according to the first embodiment. After the densification step S11 is completed, the platen 11, the bag film 12, and the release film 10 attached to the upper surface are removed from the laminated face plate 4. Then, as shown in FIG. 5, the laminated face plate 4 is placed on the plastic sheet 15 with the release film 10 adhered to the lower surface, and the plastic sheet 15 is attached to the punching machine 2 together with the plastic sheet 15. In this manner, in the state where the release film 10 is sandwiched between the laminated face plate 4 and the plastic sheet 15, the perforating step S12 is performed.
[0036]
In the hole making step S12, holes 16 of a required size are provided in the laminated face plate 4 at a required pitch. The processing conditions for the holes 16 can be set to some extent freely according to the purpose of use of the porous faced honeycomb panel, and the like. In the method for manufacturing a porous faced honeycomb panel according to the first embodiment, for example, the diameter 2 It is preferable that the pitch is 3 mm and the pitch is 3 to 10 mm.
[0037]
In the perforating step S12, the temperature of the thermosetting resin (including not only the synthetic resin contained in the prepreg face plate 7 but also the adhesive 9) of the laminated face plate 4 does not stick to the punch 2a when the punch 2a penetrates. Then, the laminated face plate 4 is cooled. The temperature condition depends on the characteristics of the thermosetting resin, but is preferably, for example, 25 ° C. or less. The holes 16 are provided in the laminated face plate 4 by the punch 2a penetrating the laminated face plate 4, the release film 10 and the plastic sheet 15 while cooling the laminated face plate 4 in this manner. At this time, the laminated face plate 4 is flexible because the thermosetting resin is not cured, so that cracks or chips around the holes 16 are prevented from occurring, and the punch 2a can be damaged by the drilling process. As much as possible.
[0038]
In addition, one punching operation of the punch 2a is such that the punch 2a descends from above the laminated face plate 4 and penetrates the laminated face plate 4, the release film 10 and the plastic sheet 15, and then the punch 2a rises, It is performed in a procedure of returning to a position above the face plate 4. At this time, when the viscosity of the thermosetting resin is low, when the punch 2a rises away from the laminated face plate 4, the thermosetting resin adhered to the punch 2a is pulled by the punch 2a. The surroundings may protrude. In the first embodiment, since the laminated face plate 4 is cooled as described above, the thermosetting resin does not adhere to the punch 2a, and therefore, the periphery of the hole 16 projects upward due to the return operation of the punch 2a. Is prevented as much as possible.
[0039]
Further, in the state where the laminated face plate 4 is placed on the plastic sheet 15, the perforating process of the laminated face plate 4 is performed together with the plastic sheet 15, so that the thermosetting resin is prevented from extending downward by the plastic sheet 15, Therefore, it is possible to prevent the periphery of the hole 16 from protruding downward due to the punching operation of the punch 2a. As a result, the quality of the porous face plate honeycomb panel to be manufactured can be further improved.
[0040]
The laminated sheet 4 may be perforated without laminating the plastic sheet 15 on the laminated face plate 4. Depending on the use of the porous face plate honeycomb panel, the above-described densification step S11 may be omitted, and The laminated face plate 4 in an unformed state may be drilled.
[0041]
FIG. 6 is a schematic diagram for explaining the outline of the curing bonding step S13 according to the first embodiment. After the perforating step S12 is completed, the release film 10 and the plastic sheet 15 are removed from the laminated face plate 4. Then, as shown in FIG. 6, one surface of the honeycomb core 5 is brought into close contact with the surface (lower surface) of the laminated face plate 4 on the side of the adhesive 9 to obtain the laminated body 6. The laminate 6 is placed on the platen 17 with the honeycomb core 5 facing down, and the release film 18 is placed on the upper surface of the laminated face plate 4 (the surface on the prepreg face plate 7 side). A flat plate 19 is placed on the release film 18, and the laminate 6 is sandwiched between the platen 17 and the plate 19.
[0042]
Further, the laminated body 6 is covered with a nylon bag film 20. A seal member 21 is disposed around the laminate 6, and the space between the bag film 20 and the platen 17 is sealed via the seal member 21, whereby the laminate 6 is wrapped by the bag film 20. State.
[0043]
An opening 22 is provided in the bag film 20, and the opening 22 is open to the atmosphere. The laminate 6 is put into the autoclave 3 together with the platen 17 and the bag film 20, and the laminate 6 is heated to the curing temperature of the prepreg face plate 7 and the adhesive 9 while pressing the laminate 6 in the laminating direction (downward) for a predetermined time, A curing bonding step S13 is performed.
[0044]
The heating and pressing conditions at this time are 120 ° C. for 120 minutes and 5 atm (about 506.degree.) When the prepreg 8 and the adhesive 9 used for the laminated face plate 4 are of a type that cures at 120 ° C. 6 kPa), and when the prepreg 8 and the adhesive 9 are of a type that can be cured at 180 ° C., the pressure is set to 180 ° C., 120 minutes, and 5 atm (about 506.6 kPa). Preferably, the prepreg 8 and the adhesive 9 have the same curing temperature.
[0045]
In the curing and bonding step S13 according to the first embodiment, the laminate 6 is pressurized while the opening 22 is open to the atmosphere, but the vacuum suction from the bag film 20 through the opening 22 is performed. May be performed while the laminate 6 is being pressed.
[0046]
In the method for manufacturing a porous face plate honeycomb panel according to Embodiment 1, the cell size of the honeycomb core 5 to be used is preferably 5 to 10 mm.
[0047]
The thermosetting resin and the adhesive 9 of the prepreg face plate 7 are cured by heating by the autoclave 3. Then, the laminate 6 after heating and pressurization is taken out of the autoclave 3, and the platen 17, the release film 18, the plate 19, and the bag film 20 are removed to obtain a porous face plate honeycomb panel.
[0048]
In the method for manufacturing a perforated face plate honeycomb panel according to Embodiment 1 as described above, in the perforating step S12, the laminated face plate 4 in which the flexible uncured prepreg face plate 7 and the film-like adhesive 9 are laminated is used. Because of the perforating process, the hole of the perforated face plate and the hole of the adhesive can be formed at the same time as the hole 16, as compared with the conventional method of separately processing the hole of the perforated face plate and the hole of the adhesive, The number of steps can be reduced, and the manufacturing time of the perforated face plate honeycomb panel can be greatly reduced. Moreover, since the holes for the adhesive 9 in the form of a film can be reliably provided, it is possible to greatly reduce the possibility that the adhesive 9 blocks the holes of the porous face plate as compared with the related art.
[0049]
In addition, since the curing of the prepreg face plate 7 and the bonding of the honeycomb core 5 and the porous face plate, which were conventionally performed separately, are simultaneously performed, this also greatly reduces the number of manufacturing steps and the manufacturing time as compared with the conventional case. Can be shortened.
[0050]
(Embodiment 2)
FIG. 7 is a flowchart illustrating a procedure of a method for manufacturing a perforated face plate honeycomb panel according to Embodiment 2 of the present invention. As shown in FIG. 7, in the method for manufacturing a porous face plate honeycomb panel according to the second embodiment, a densification step S21, a hole forming step S22, a temporary bonding step S23, and a curing bonding step S24 are performed in this order. I have. Note that the densification step S21 and the perforation step S22 are the same as the densification step S11 and the perforation step S12 according to the first embodiment, and a description thereof will be omitted.
[0051]
FIG. 8 is a schematic diagram illustrating an outline of the temporary bonding step S23 of the method for manufacturing a porous face plate honeycomb panel according to the second embodiment. After the perforation step S22 is completed, the release film 10 and the plastic sheet 15 are removed from the laminated face plate 4. Then, as shown in FIG. 8, a flat plate 25 and a release film (release agent) 23 are placed on the upper surface of the surface plate 24, and the laminated face plate 4 is further placed on the prepreg face plate 7 side. It is placed down. A release film 23 is placed on the laminated face plate 4, and a nylon bag film 26 is put on the release film 23. A sealing material 27 is provided around the laminated face plate 4, and the space between the bag film 26 and the platen 24 is sealed via the sealing material 27, whereby the laminated face plate 4 is wrapped by the bag film 26. State.
[0052]
An opening 28 is provided in the bag film 26, and the opening 28 is open to the atmosphere. The laminated face plate 4, the plate 25, and the bag film 26 are put into the autoclave 3 together with the platen 24, the plate 25, and the bag film 26. Pressurize for a time to execute the temporary bonding step S23.
[0053]
In the temporary bonding step S23, the laminated face plate 4 placed on the surface plate 24 and the plate 25 is pressed in the laminating direction, and a thermosetting resin is filled in the holes 16 of the laminated face plate 4 as described below. The surface of the laminated face plate 4 is smoothed by substantially not flowing into it and being heated to a temperature at which the laminated face plate 4 is stuck to the plate 25 via the release film 23.
[0054]
Depending on the heating and pressing conditions in the temporary bonding step S23, the melted thermosetting resin (including not only the synthetic resin contained in the prepreg face plate 7 but also the adhesive 9) flows into the holes 16 of the laminated face plate 4, and The hole 16 may be closed, thereby impairing air permeability in the hole of the porous face plate honeycomb panel to be manufactured. Therefore, it is preferable that the heating / pressing conditions at this time are determined within a range where the thermosetting resin does not substantially flow into the holes 16 of the laminated face plate 4. This depends on the characteristics of the thermosetting resin and the size of the holes 16 in the laminated face plate 4, but is preferably, for example, about 30 to 50 ° C. for 30 minutes and about 5 atm (about 506.6 kPa).
[0055]
In the temporary bonding step S23 according to the second embodiment, the laminated face plate 4 is pressurized in a state where the opening 28 is open to the atmosphere, but the thermosetting resin should not flow into the hole 16 substantially. For example, the laminated face plate 4 may be pressurized while performing vacuum suction in the bag film 26 from the opening 28.
[0056]
After the temporary bonding step S23 is completed, the laminated face plate 4 is once removed from the autoclave, and the platen 24 and the bag film 26 are removed from the laminated face plate 4 in a state where the release film 23 and the plate 25 are stuck to the laminated face plate 4. Removed. Then, as shown in FIG. 6, one surface of the honeycomb core 5 is brought into close contact with the surface (lower surface) of the laminated face plate 4 on the side of the adhesive 9 to obtain the laminated body 6. The laminate 6 is placed on the platen 17 with the honeycomb core 5 facing down, covered with a nylon bag film 20, and the space between the bag film 20 and the platen 17 is sealed. It is attached to the autoclave 3. Then, a curing bonding step S24 is performed. Note that the hardening and bonding step S24 is the same as the hardening and bonding step S13 according to the first embodiment, and a description thereof will not be repeated.
[0057]
After the completion of the curing and bonding step S24, the release film 23 and the plate 25 are removed from the laminated body 6 after being heated and pressed. Since it is interposed therebetween, the release film 23 and the plate 25 can be easily removed from the laminate 6.
[0058]
In the method for manufacturing a perforated face plate honeycomb panel according to Embodiment 2 as described above, the processing conditions of the holes 16 to be formed in the laminated face plate 4 in the perforating step S22 are adjusted to some extent according to the purpose of use of the perforated face plate honeycomb panel. Although it can be set freely, for example, it is preferable that the diameter is 2 to 3 mm and the pitch is 3 to 10 mm. In the method for manufacturing a porous face plate honeycomb panel according to Embodiment 2, it is preferable that the cell size of the honeycomb core 5 to be used is 5 to 30 mm.
[0059]
In the method for manufacturing a perforated face plate honeycomb panel according to the second embodiment as described above, the same effect as that of the first embodiment is obtained, and further, the laminated face plate 4 is attached to the plate 25 and smoothed by the temporary bonding step S23. Since the curing and bonding step S24 is performed while the laminated face plate 4 is stuck to the plate 25, the perforated face plate of the perforated face panel can be made smooth, and a perforated face panel honeycomb panel having higher shape quality can be manufactured. Can be.
[0060]
(Embodiment 3)
As shown in FIG. 3, in the method for manufacturing a porous face plate honeycomb panel according to the third embodiment, a densification step S31, a hole forming step S32, and a curing and bonding step S33 are performed in this order.
[0061]
FIG. 9 is a schematic diagram for explaining the outline of the densification step S31 of the method for manufacturing a perforated face plate honeycomb panel according to the third embodiment, and FIG. 10 is a schematic diagram for explaining the outline of the hole making step S32. . As shown in FIGS. 9 and 10, in the method of manufacturing a porous face plate honeycomb panel according to the third embodiment, a thermosetting film-like adhesive 9 is applied to both surfaces of a prepreg face plate 7 containing a thermosetting resin. The laminated face plate 29 is formed by stacking, and a densification step S31 and a hole making step S32 are performed on the laminated face plate 29. The densification step S31 and the perforating step S32 according to the third embodiment are similar to the densification steps according to the first embodiment except that the laminated face plate 29 is obtained by laminating the adhesive 9 on both surfaces of the prepreg face plate 7. Since the procedure is the same as that of the forming step S11 and the hole forming step S12, the description is omitted.
[0062]
FIG. 11 is a schematic diagram for explaining the outline of the curing bonding step S33 of the method for manufacturing a porous face plate honeycomb panel according to the third embodiment. After the perforating step S32 is completed, the release film 10 and the plastic sheet 15 are removed from the laminated face plate 29. Then, as shown in FIG. 11, the honeycomb core 5 and the mesh plate 30 are stacked so that the honeycomb core 5 and the mesh plate 30 sandwich the multilayer face plate 29 to obtain a stacked body 31. The mesh plate 30 is provided with a number of holes that are very small compared to the holes 16 of the laminated face plate 29, and is used to improve the sound absorbing effect of the perforated face plate honeycomb panel. Then, a curing and bonding step S33 is performed on the laminate 31 to obtain a porous face plate honeycomb panel with a net-like plate. The curing and bonding step S33 according to the second embodiment is different from the curing and bonding according to the first embodiment except that the laminate 31 is formed by laminating the laminated face plate 29 between the honeycomb core 5 and the mesh plate 30. Since the procedure is the same as that in step S13, the description thereof is omitted.
[0063]
In the method for manufacturing a perforated face plate honeycomb panel according to the third embodiment as described above, the processing conditions of the holes 16 to be formed in the laminated face plate 29 in the perforating step S32 are adjusted to some extent according to the purpose of use of the perforated face plate honeycomb panel. Although it can be set freely, for example, it is preferable that the diameter is 2 to 3 mm and the pitch is 3 to 10 mm. In the method for manufacturing a perforated face plate honeycomb panel according to Embodiment 6, it is preferable that the cell size of the honeycomb core 5 to be used is 5 to 10 mm.
[0064]
In this manner, the prepreg face plate 7 and the adhesive 9 are drilled simultaneously, which were conventionally performed separately, and the prepreg face plate 7 was hardened, and the honeycomb core 5, the mesh plate 30, and the porosity were conventionally performed separately. Since the face plates are bonded at the same time, the number of manufacturing steps can be greatly reduced as compared with the related art, and the manufacturing time can be greatly reduced.
[0065]
(Embodiment 4)
As shown in FIG. 7, the method for manufacturing a porous face plate honeycomb panel according to Embodiment 4 includes a densification step S41, a hole forming step S42, a temporary bonding step S43, and a curing bonding step S44 in this order. I have. Note that the densification step S41 and the perforation step S42 are the same as the densification step S31 and the perforation step S32 according to the third embodiment, and a description thereof will be omitted.
[0066]
FIG. 12 is a schematic diagram illustrating an outline of the temporary bonding step S43 of the method for manufacturing a porous face plate honeycomb panel according to the fourth embodiment. After the perforating step 42 is completed, the release film 10 and the plastic sheet 15 are removed from the laminated face plate 29. Then, as shown in FIG. 12, a flat plate 25, a release film (release agent) 23 and a mesh plate 30 are placed on the upper surface of the surface plate 24, and a laminated face plate 29 is further placed thereon. You. Thereby, one surface (upper surface) of the mesh plate 30 is in close contact with one surface (lower surface) of the laminated face plate 29, and the plate 25 is placed on the other surface (lower surface) of the mesh plate 30 via the release film 23. A release film 23 is further placed on the laminated face plate 29, and a nylon bag film 26 is put on the release film 23. A sealing material 27 is provided around the laminated face plate 29, and the space between the bag film 26 and the surface plate 24 is sealed via the sealing material 27, whereby the laminated face plate 29 is wrapped with the bag film 26. State.
[0067]
The opening 28 of the bag film 26 is open to the atmosphere. The laminated face plate 29, the plate 25, the mesh plate 30, and the bag film 26 are put into the autoclave 3, and the laminated face plate 29, the mesh plate 30, the plate 25, and the platen are set at a temperature at which the thermosetting resin is not cured. 24 is pressed in the laminating direction for a predetermined time to execute a temporary bonding step S43.
[0068]
In the temporary bonding step S43, the mesh plate 30 and the laminated face plate 29 placed on the surface plate 24 and the plate 25 are pressed in the laminating direction, and the thermosetting resin flows into the holes 16 of the laminated face plate 29 substantially. In addition, the surface of the mesh plate 30 is smoothed by heating the laminate face plate 29 and the mesh plate 30 to a temperature at which the mesh plate 30 sticks to the plate 25 via the release film 23. .
[0069]
Also, depending on the heating and pressing conditions in the temporary bonding step S43 according to the fourth embodiment, the melted thermosetting resin flows into the holes of the mesh plate 30 and closes the holes to form the porous face plate honeycomb panel to be manufactured. May impair the air permeability in the hole. Therefore, it is preferable that the heating and pressurizing conditions at this time are determined so that the thermosetting resin does not substantially flow into the holes 16 of the laminated face plate 29 and does not substantially flow into the holes of the mesh plate 30. This depends on the properties of the thermosetting resin, the size of the holes 16 in the laminated face plate 29 and the size of the holes in the mesh plate 30, but for example, 30 to 50 ° C., 30 minutes, and about 5 atm (about 506.6 kPa). It is suitable.
[0070]
If the thermosetting resin does not substantially flow into the holes 16 of the laminated face plate 29 and the holes of the mesh plate 30, the laminated face plate 29 and the mesh plate 30 are pressurized while performing vacuum suction in the bag film 26 from the opening 28. You may do so.
[0071]
After the temporary bonding step S43 is completed, the laminated face plate 29 covered with the surface plate 24 and the bag film 26 is once taken out of the autoclave. At this time, the mesh plate 30 is attached to the laminated face plate 29, and the plate 25 is attached to the mesh plate 30 via the release film 23. In this manner, the platen 24 and the bag film 26 are removed from the laminated face plate 29 and the mesh plate 30, with the plate 25, the release film 23, the mesh plate 30, and the laminated face plate 29 stuck to each other. Then, as shown in FIG. 11, one surface of the honeycomb core 5 is placed on the surface (lower surface) of the laminated face plate 29 opposite to the bonding surface of the mesh plate 30 so that the laminated face plate 29 is sandwiched between the honeycomb core 5 and the mesh plate 30. The laminated body 31 is obtained by being closely attached. The laminate 31 is placed on the platen 17 with the honeycomb core 5 facing down while the release film 23 and the plate 25 are stuck to the mesh plate 30, and covered with the nylon bag film 20. Thus, the space between the bag film 20 and the platen 17 is sealed, and the bag film 20 is attached to the autoclave 3 in this state. Then, a curing bonding step S44 is performed. The hardening and bonding step S44 is the same as the hardening and bonding step S33 according to the third embodiment, except that the release film 23 and the plate 25 are attached to the mesh plate 30, and a description thereof will be omitted.
[0072]
After the completion of the curing and bonding step S44, the release film 23 and the plate 25 are removed from the laminated body 31 after being heated and pressurized. Since it is interposed therebetween, the release film 23 and the plate 25 can be easily removed from the laminate 31.
[0073]
In the method for manufacturing a perforated face plate honeycomb panel according to the fourth embodiment as described above, the processing conditions for the holes 16 to be formed in the laminated face plate 29 in the perforating step S42 are adjusted to some extent in accordance with the purpose of use of the perforated face plate honeycomb panel. Although it can be set freely, for example, it is preferable that the diameter is 2 to 3 mm and the pitch is 3 to 10 mm. In the method for manufacturing a porous face plate honeycomb panel according to Embodiment 4, it is preferable that the cell size of honeycomb core 5 used is 5 to 30 mm.
[0074]
In the method for manufacturing a perforated face plate honeycomb panel according to the fourth embodiment as described above, the same effect as that of the third embodiment is obtained. Further, the mesh plate 30 is attached to the plate 25 by the temporary bonding step S43, and the laminated face plate 29 is formed. In addition, the curing and bonding step S24 is performed while the plate 25 is adhered to the mesh plate 30 while the plate 25 is adhered to the mesh plate 30. Therefore, the porous face plate and the mesh plate of the porous face honeycomb panel can be smoothed, and the shape is further improved A perforated face plate honeycomb panel with a high quality mesh plate can be manufactured.
[0075]
(Embodiment 5)
FIG. 13 is a schematic diagram illustrating an outline of a configuration of a manufacturing apparatus for a perforated face plate honeycomb panel according to Embodiment 5 of the present invention. As shown in FIG. 13, the porous face plate honeycomb panel manufacturing apparatus 36 according to the fifth embodiment mainly includes a puncher 2 and an electron beam irradiator 37 constituting a curing and bonding machine of the present invention. . The perforator 2 is configured to perforate the laminated face plate 34 as a workpiece by the punch 2a, and the electron beam irradiator 37 is configured to perform a perforated laminated face plate 34 and a laminate of the honeycomb core 5. 38 is configured to irradiate an electron beam.
[0076]
As shown in FIG. 3, in the method for manufacturing a porous face plate honeycomb panel according to the fifth embodiment, a densification step S51, a hole forming step S52, and a curing and bonding step S53 are performed in this order.
[0077]
As shown in FIG. 2, the prepreg 35 used in the fifth embodiment of the present invention has a property of hardening in response to an electron beam on a woven fabric of a reinforcing fiber such as carbon fiber, glass fiber, aramid fiber, and SiC fiber. And is impregnated with a synthetic resin having the following formula (hereinafter referred to as an electron beam-curable resin), and is formed in a sheet shape. The prepreg 35 may be obtained by impregnating an electron beam-curable resin into a woven fabric in which reinforcing fibers are woven so as to cross each other, or impregnating an electron beam-curable resin into unidirectionally aligned reinforcing fibers. Can also be used. Such a prepreg 35 is cut into a required size and shape, and a required number of the prepregs are laminated to obtain a prepreg face plate 32. If the prepreg 35 has a thickness necessary for the prepreg face plate 32, the prepreg 35 cut without being laminated may be used as the prepreg face plate 32.
[0078]
On one surface of the prepreg face plate 32 thus obtained, a film adhesive 33 having a property of being cured in response to an electron beam is laminated to obtain a laminated face plate 34. Then, as shown in FIGS. 4 and 5, a densification step S51 and a hole making step S52 are performed on the laminated face plate 34, and holes 39 are provided in the laminated face plate 34. The densification step S51 and the perforation step S52 according to the fifth embodiment are different from the lamination face plate 34 in that the prepreg face plate 32 and the adhesive 33 having the property of being cured in response to an electron beam are laminated. Is the same as the procedure of the densification step S11 and the perforation step S12 according to the first embodiment, and a description thereof will be omitted.
[0079]
After the perforating step S52 is completed, the release film 10 and the plastic sheet 15 are removed from the laminated face plate 34. Then, as shown in FIG. 6, one surface of the honeycomb core 5 is brought into close contact with the surface (lower surface) of the laminated face plate 34 on the side of the adhesive 33 to obtain a laminated body 38. The laminate 38 is wrapped with the platen 17 and the bag film 20 in the same procedure as in the first embodiment, set on the electron beam irradiator 37, and the curing and bonding step S53 is performed.
[0080]
In the curing and bonding step S53, a vacuum pump (not shown) is connected to the opening 22 of the bag film 20, and the electron beam irradiator 37 applies the vacuum to the inside of the bag film 20 in a state where the vacuum pump suctions the inside of the bag film 20. An electron beam of a predetermined dose (for example, a surface absorption dose of 50 to 150 kGy) is irradiated to 38. The irradiation time at this time is several seconds. In the curing and bonding step S53, the prepreg face plate 32 and the adhesive 33 of the laminated face plate 34 are cured by reacting to the electron beam irradiated from the electron beam irradiator 37. Then, the laminated body 38 after the irradiation with the electron beam is taken out of the electron beam irradiator 37, and the platen 17, the release film 18, the plate 19 and the bag film 20 are removed to obtain a perforated face plate honeycomb panel.
[0081]
The method for manufacturing a perforated face plate honeycomb panel according to the fifth embodiment as described above has the following effects in addition to the same effects as in the first embodiment. First, in the hardening and bonding step S53, the temperature of the laminated face plate 34 hardly rises, and therefore, the viscosity of the electron beam-curable resin contained therein hardly decreases and hardly flows into the holes 39.
Therefore, a porous face plate honeycomb panel with high quality of the holes 39 can be manufactured.
[0082]
Further, since only a few seconds are required for the curing and bonding step S53, the time required for production can be significantly reduced as compared with the conventional method for producing a porous face plate honeycomb panel using a thermosetting resin.
[0083]
Further, since the temperature of the laminated face plate 34 hardly rises in the curing and bonding step S53, the laminated face plate 34 is hardly bent or warped due to thermal distortion, and a high quality porous face plate honeycomb panel is stably manufactured. be able to.
[0084]
In the method for manufacturing a perforated face plate honeycomb panel according to Embodiment 5 as described above, the processing conditions for the holes 39 to be formed in the laminated face plate 34 in the perforating step S52 are determined to some extent according to the intended use of the perforated face plate honeycomb panel. Although it can be set freely, for example, it is preferable that the diameter is 0.5 to 3 mm and the pitch is 3 to 10 mm. In the method for manufacturing a porous face plate honeycomb panel according to the fifth embodiment, it is preferable that the cell size of the honeycomb core 5 to be used is 5 to 10 mm.
[0085]
In the curing and bonding step S53, a jig (not shown) for supporting the laminate 38 inside the electron beam irradiator 37 is not exposed to a high temperature. It can be configured using a heat-resistant and inexpensive material.
[0086]
Prior to the curing and bonding step S53, the laminated face plate 34 may be heated in an autoclave at a temperature of 30 to 50 ° C. for about 30 minutes. Thereby, it can be expected that the adhesive strength between the laminated face plate 34 and the honeycomb core 5 is further improved.
[0087]
(Embodiment 6)
As shown in FIG. 7, the method for manufacturing a porous face plate honeycomb panel according to the sixth embodiment includes a densification step S61, a drilling step S62, a temporary bonding step S63, and a curing bonding step S64 in this order. I have. Note that the densification step S61 and the perforation step S62 are the same as the densification step S51 and the perforation step S52 according to the fifth embodiment, and a description thereof will be omitted.
[0088]
In the method for manufacturing a porous face plate honeycomb panel according to the sixth embodiment, in the perforating step S62, a laminated face plate 34 in which a prepreg face plate 32 having a property of being cured in response to an electron beam and an adhesive 33 are laminated. Then, a temporary bonding step S63 similar to the temporary bonding step S63 according to the second embodiment is performed on the laminated face plate 34 (see FIG. 8).
[0089]
In the temporary bonding step S63, the laminated face plate 34 placed on the surface plate 24 and the plate 25 is pressed in the laminating direction, and the electron beam curable resin does not substantially flow into the holes 39 of the laminated face plate 34, and The surface of the laminated face plate 34 is smoothed by being heated to a temperature at which the laminated face plate 34 sticks to the plate 25 via the release film 23.
[0090]
The heating and pressing conditions in the temporary bonding step S63 are the same as the heating and pressing conditions in the temporary bonding step S23 according to the second embodiment. It is preferable that the distance be set within a range where the electron beam curable resin does not substantially flow into the holes 39. This depends on the characteristics of the electron beam curable resin and the size of the holes 39, but is preferably, for example, about 30 to 50 ° C. for about 30 minutes and 5 atm (about 506.6 kPa).
[0091]
In the temporary bonding step S63 according to the sixth embodiment, the laminated face plate 34 is pressurized while the opening 28 is open to the atmosphere, but the electron beam curable resin generally flows into the holes 39. Otherwise, the laminated face plate 34 may be pressurized while performing vacuum suction in the bag film 26 from the opening 28.
[0092]
After the temporary bonding step S63, the laminated face plate 34 is taken out of the autoclave, and the platen 24 and the bag film 26 are removed from the laminated face plate 34 with the release film 23 and the plate 25 stuck to the laminated face plate 34. It is. Then, as shown in FIG. 6, one surface of the honeycomb core 5 is brought into close contact with the surface (lower surface) of the laminated face plate 34 on the side of the adhesive 33 to obtain a laminated body 38. The laminate 38 is placed on the platen 17 with the honeycomb core 5 facing down, covered with a nylon bag film 20, and the space between the bag film 20 and the platen 17 is sealed. It is attached to the electron beam irradiator 37. Then, a curing bonding step S64 is performed. Note that the hardening and bonding step S64 is the same as the hardening and bonding step S53 according to the fifth embodiment, and a description thereof will not be repeated.
[0093]
After the completion of the curing and bonding step S64, the release film 23 and the plate 25 are removed from the laminate 38 after the irradiation with the electron beam. Since it is interposed therebetween, the release film 23 and the plate 25 can be easily removed from the laminate 38.
[0094]
In the method for manufacturing a perforated face plate honeycomb panel according to the sixth embodiment as described above, the processing conditions of the holes 39 to be formed in the laminated face plate 34 in the perforating step S62 are adjusted to some extent according to the purpose of use of the perforated face plate honeycomb panel. Although it can be set freely, for example, it is preferable that the diameter is 1 to 3 mm and the pitch is 3 to 10 mm. In the method for manufacturing a porous face plate honeycomb panel according to Embodiment 6, it is preferable that the cell size of the honeycomb core 5 to be used is 5 to 30 mm.
[0095]
In the method for manufacturing a perforated face plate honeycomb panel according to the sixth embodiment as described above, the same effect as that of the fifth embodiment is obtained, and further, the laminated face plate 34 is attached to the plate 25 and smoothed by the temporary bonding step S63. Since the curing and bonding step S64 is performed while the plate 25 is stuck to the laminated face plate 34, the porous face plate of the porous face plate honeycomb panel can be made smooth, and a porous face plate honeycomb panel having higher shape quality can be manufactured. Can be.
[0096]
(Embodiment 7)
As shown in FIG. 3, in the method for manufacturing a porous face plate honeycomb panel according to the seventh embodiment, a densification step S71, a hole forming step S72, and a curing and bonding step S73 are performed in this order.
[0097]
As shown in FIGS. 9 and 10, in the method for manufacturing a porous face plate honeycomb panel according to the seventh embodiment, an electron beam-curable film-like adhesive is applied to both surfaces of a prepreg face plate 32 containing an electron beam-curable resin. 33 are respectively laminated to form a laminated face plate 40, and a densification step S71 and a hole making step S72 are performed on the laminated face plate 40. The densification step S71 and the perforation step S72 according to the seventh embodiment are similar to the densification steps according to the fifth embodiment except that the laminated face plate 40 is obtained by laminating the adhesive 33 on both surfaces of the prepreg face plate 32. Since the procedure is the same as that of the forming step S51 and the hole forming step S52, the description is omitted.
[0098]
After the perforating step S72 is completed, the release film 10 and the plastic sheet 15 are removed from the laminated face plate 40. Then, as shown in FIG. 11, the honeycomb core 5, the laminated face plate 40, and the mesh plate 30 are laminated so that the laminated face plate 40 is sandwiched between the honeycomb core 5 and the mesh plate 30, thereby obtaining a laminated body 41. Then, a curing and bonding step S73 is performed on the laminate 41. The curing bonding step S73 according to the seventh embodiment includes a curing bonding according to the fifth embodiment, except that the laminated body 41 is formed by laminating the laminated face plate 40 between the honeycomb core 5 and the mesh plate 30. Since the procedure is the same as that in step S53, the description thereof is omitted.
[0099]
In the method for manufacturing a perforated face plate honeycomb panel according to the seventh embodiment as described above, the processing conditions of the holes to be formed in the laminated face plate 40 in the perforating step S72 are set to some extent depending on the purpose of use of the perforated face plate honeycomb panel. However, for example, the diameter is preferably 0.5 to 3 mm and the pitch is preferably 3 to 10 mm. In the method for manufacturing a porous face plate honeycomb panel according to Embodiment 7, it is preferable that the cell size of the honeycomb core 5 to be used is 5 to 10 mm.
[0100]
Thus, in the method for manufacturing a perforated face plate honeycomb panel according to the seventh embodiment, in addition to the same effects as in the fifth embodiment, the perforating of the prepreg face plate 32 and the bonding of the adhesive 33 are conventionally performed separately. Drilling is performed simultaneously, and curing of the prepreg face plate 32 and bonding of the honeycomb core 5, the reticulated plate 30 and the porous face plate, which are conventionally performed separately, are performed at the same time. Manufacturing time can be greatly reduced.
[0101]
(Embodiment 8)
As shown in FIG. 7, the method for manufacturing a porous face plate honeycomb panel according to Embodiment 8 includes a densification step S81, a hole forming step S82, a temporary bonding step S83, and a curing bonding step S84 in this order. I have. Note that the densification step S81 and the perforation step S82 are the same as the densification step S71 and the perforation step S72 according to the seventh embodiment, and a description thereof will be omitted.
[0102]
As shown in FIG. 12, in the method for manufacturing a porous face plate honeycomb panel according to the eighth embodiment, an electron beam curable film-like adhesive 33 is provided on both surfaces of a prepreg face plate 32 containing an electron beam curable resin. The temporary bonding step S83 is performed on the stacked face plates 40. The temporary bonding step S83 according to the eighth embodiment is performed in the same manner as the laminated faceplate 40 except that the electron beam-curable adhesive 33 is laminated on both surfaces of the electron beam-curable prepreg faceplate 32. Since the procedure is the same as that of the temporary bonding step S43 according to the fourth embodiment, the description thereof is omitted.
[0103]
The heating and pressing conditions in the temporary bonding step S83 according to the eighth embodiment are such that the electron beam-curable resin is not cured, the thermosetting resin does not substantially flow into the holes of the laminated face plate 40, and It is preferable that the distance is set within a range that does not substantially flow into the hole of the plate 30. This depends on the characteristics of the electron beam curable resin, the size of the holes in the laminated face plate 40, and the size of the holes in the mesh plate 30, but for example, 30 to 50 ° C., 30 minutes, and about 5 atm (about 506.6 kPa). It is suitable.
[0104]
If the electron beam curable resin does not substantially flow into the holes of the laminated face plate 40 and the holes of the mesh plate 30, the laminated face plate 40 and the mesh plate 30 are pressurized while performing vacuum suction in the bag film 26 from the opening 28. You may do so.
[0105]
After the completion of the temporary bonding step S83, the laminated face plate 40 covered with the surface plate 24 and the bag film 26 is taken out of the autoclave. At this time, the mesh plate 30 is attached to the laminated face plate 40, and the plate 25 is attached to the mesh plate 30 via the release film 23. In this manner, the platen 24 and the bag film 26 are removed from the laminated face plate 40 and the mesh plate 30 with the plate 25, the release film 23, the mesh plate 30, and the laminated face plate 40 stuck to each other. Then, as shown in FIG. 11, one surface of the honeycomb core 5 is placed on the surface (lower surface) of the laminated face plate 40 opposite to the bonding surface of the mesh plate 30 so that the laminated face plate 40 is sandwiched between the honeycomb core 5 and the mesh plate 30. The laminated body 41 is obtained by closely contacting. The laminate 41 is placed on the platen 17 with the honeycomb core 5 facing down while the release film 23 and the plate 25 are stuck to the mesh plate 30, and covered with the nylon bag film 20. Then, the space between the bag film 20 and the surface plate 17 is sealed, and in this state, it is attached to the electron beam irradiator 37. Then, a curing bonding step S84 is performed. The hardening and bonding step S84 is the same as the hardening and bonding step S73 according to the seventh embodiment, except that the release film 23 and the plate 25 are attached to the mesh plate 30, and a description thereof will be omitted.
[0106]
After the completion of the curing and bonding step S84, the release film 23 and the plate 25 are removed from the laminate 41 after the irradiation with the electron beam. Since it is interposed therebetween, the release film 23 and the plate 25 can be easily removed from the laminate 41.
[0107]
In the method for manufacturing a perforated face plate honeycomb panel according to the eighth embodiment as described above, the processing conditions of the holes to be formed in the laminated face plate 40 in the perforating step S82 are set to some extent depending on the purpose of use of the perforated face plate honeycomb panel. However, for example, it is preferable that the diameter is 1 to 3 mm and the pitch is 3 to 10 mm. In the method for manufacturing a porous face plate honeycomb panel according to Embodiment 8, it is preferable that the cell size of the honeycomb core 5 to be used is 5 to 30 mm.
[0108]
In the method for manufacturing a perforated face plate honeycomb panel according to the eighth embodiment as described above, the same effect as that of the seventh embodiment is obtained, and the mesh plate 30 is attached to the plate 25 by the temporary bonding step S83 to form the laminated face plate 40. In addition, the curing and bonding step S84 is performed while the plate 25 is adhered to the mesh plate 30 while the plate 30 is adhered to the mesh plate 30, so that the porous face plate and the mesh plate of the porous face honeycomb panel can be smoothed, and the shape is further improved. A perforated face plate honeycomb panel with a high quality mesh plate can be manufactured.
[0109]
(Embodiment 9)
FIG. 14 is a schematic diagram illustrating a schematic configuration of a manufacturing apparatus for a perforated face plate honeycomb panel according to Embodiment 9 of the present invention. As shown in FIG. 14, the manufacturing apparatus 42 of the perforated face plate honeycomb panel according to the ninth embodiment mainly includes the punch 2, the electron beam irradiator 37, and the autoclave 3. The perforator 2 is configured to perforate the laminated face plate 43 as a workpiece by the punch 2a, and the electron beam irradiator 37 irradiates the perforated laminated face plate 43 with an electron beam. The autoclave 3 is configured to irradiate the laminated face plate 43 and the laminated body 44 of the honeycomb core 5 with an electron beam. The electron beam irradiator 37 and the autoclave 3 constitute a curing and bonding machine according to the present invention.
[0110]
FIG. 15 is a flowchart illustrating a procedure of a method for manufacturing a perforated face plate honeycomb panel according to Embodiment 9 of the present invention. As shown in FIG. 15, the method for manufacturing a porous face plate honeycomb panel according to the ninth embodiment includes a densification step S91, a hole forming step S92, and a curing bonding step S93, which are performed in this order. Step S93 further includes an electron beam irradiation step (radiation irradiation step) S94 and a heating step S95.
[0111]
As shown in FIG. 2, in the method for manufacturing a porous face plate honeycomb panel according to Embodiment 9 of the present invention, as in Embodiments 5 to 8, reinforcing fibers such as carbon fiber, glass fiber, aramid fiber, and SiC fiber. A prepreg 35 impregnated with an electron beam curable resin is used for the woven fabric. Such a prepreg 35 is cut into a required size and shape, and a film-like adhesive 9 having a property of being cured in response to heat is laminated on one surface of a prepreg face plate 32 obtained by laminating a required number of sheets. The laminated face plate 43 is obtained.
[0112]
Then, as shown in FIGS. 4 and 5, a densification step S91 and a hole making step S92 are performed on the laminated face plate 43, and holes 45 are provided in the laminated face plate 43. The densifying step S91 and the perforating step S92 according to the ninth embodiment include the steps of forming the laminated face plate 43 into a prepreg face plate 32 having a property of curing in response to an electron beam and an adhesive having a property of curing in response to heat. Except for the lamination of No. 9, the procedure is the same as that of the densification step S11 and the perforation step S12 according to the first embodiment, and a description thereof will be omitted.
[0113]
Next, the electron beam irradiation step S94 is performed as follows. FIG. 16 is a schematic diagram illustrating an outline of an electron beam irradiation step S94 of the method for manufacturing a perforated face plate honeycomb panel according to Embodiment 9 of the present invention. After the perforating step S92 is completed, the release film 10 and the plastic sheet 15 are removed from the laminated face plate 43. A release film 46 made of a Teflon (R) -based material is laminated on both surfaces of the laminated face plate 43, and is placed on the upper surface of the surface plate 47. Further, a nylon bag film 48 is put on the laminated face plate 43. A sealing material 49 is provided around the laminated face plate 43, and the space between the bag film 48 and the surface plate 47 is sealed via the sealing material 49, whereby the laminated face plate 43 is wrapped by the bag film 48. State.
[0114]
The bag film 48 has an opening 50, which is connected to a vacuum pump (not shown). The laminated face plate 43 is set on the electron beam irradiator 37 together with the surface plate 47 and the bag film 48, and a predetermined dose (for example, a surface of 50 to 150 kGy is applied to the laminated face plate 43 while the inside of the bag film 48 is evacuated by the vacuum pump. (Absorbed dose). The irradiation time at this time is several seconds. By the electron beam irradiation step S94, the prepreg face plate 32 of the laminated face plate 43 is cured by reacting to the electron beam irradiated from the electron beam irradiation machine 37. Here, the adhesive 9 does not react to the electron beam and remains flexible (uncured). Then, the laminated face plate 43 irradiated with the electron beam is taken out of the electron beam irradiator 37, and the platen 47, the release film 46 and the bag film 48 are removed.
[0115]
Next, the heating step S95 is performed as follows. As shown in FIG. 6, similarly to the case where the hardening and bonding step S <b> 13 according to the first embodiment is performed, one surface of the honeycomb core 5 is brought into close contact with the surface (lower surface) of the laminated face plate 43 on the side of the adhesive 9 and laminated. Obtain body 51. The laminated body 51 is placed on the platen 17 with the honeycomb core 5 facing down, covered with a nylon bag film 20, and the space between the bag film 20 and the platen 17 is sealed. It is attached to the autoclave 3. Then, the heating step S95 is performed.
[0116]
The heating and pressurizing conditions at this time are as follows: if the adhesive 9 used for the laminated face plate 43 is of a type that cures at 120 ° C., 120 ° C., 120 minutes, 5 atm (about 506.6 kPa) When the adhesive 9 is of a type that cures at 180 ° C., the pressure is set at 180 ° C. for 120 minutes and at about 5 atm (about 506.6 kPa).
[0117]
In the heating step S95 according to the ninth embodiment, as shown in FIG. 6, the laminate 51 is pressurized while the opening 22 is open to the atmosphere. This is because if the inside of the bag film 20 is vacuum-sucked at a high temperature of 100 ° C. or more, the adhesive strength of the adhesive 9 may be reduced.
[0118]
The adhesive 9 is cured by heating by the autoclave 3, whereby the honeycomb core 5 is bonded to the laminated face plate 43. Then, the laminated body 51 after being heated and pressed is taken out of the autoclave 3, and the platen 17, the release film 18, the plate 19, and the bag film 20 are removed to obtain a perforated face plate honeycomb panel.
[0119]
In the method for manufacturing a perforated face plate honeycomb panel according to Embodiment 9 as described above, in the perforating step S92, the laminated face plate 43 in which the flexible uncured prepreg face plate 32 and the film-like adhesive 9 are laminated is formed. Because of the perforating process, the hole of the perforated face plate and the hole of the adhesive can be simultaneously formed as the hole 45. The number of steps can be reduced, and the manufacturing time of the perforated face plate honeycomb panel can be greatly reduced. Moreover, since the holes for the adhesive 9 in the form of a film can be reliably provided, it is possible to greatly reduce the possibility that the adhesive 9 blocks the holes of the porous face plate as compared with the related art.
[0120]
Further, by irradiating the laminated face plate 43 with an electron beam in the electron beam irradiation step S94, the prepreg face plate 32 is cured in a flat state along the plane of the surface plate 47, so that it is heated in the heating step S95. Even in this case, it is possible to manufacture a porous face plate honeycomb panel having a flat porous face plate without bending or warping of the laminated face plate 43 due to thermal strain.
[0121]
(Embodiment 10)
As shown in FIG. 15, in the method for manufacturing a porous face plate honeycomb panel according to the tenth embodiment, a densification step S101, a hole forming step S102, and a curing bonding step S103 are performed in this order. Step S103 further includes an electron beam irradiation step (radiation irradiation step) S104 and a heating step S105.
[0122]
As shown in FIGS. 9 and 10, in the method for manufacturing a porous face plate honeycomb panel according to the tenth embodiment, a thermosetting film-like adhesive 9 is applied to both surfaces of a prepreg face plate 32 containing an electron beam curable resin. Each is laminated to form a laminated face plate 52, and a densification step S101 and a hole making step S102 are performed on the laminated face plate 52. The densification step S101 and the perforation step S102 according to the tenth embodiment are the same as the densification according to the third embodiment except that the laminated face plate 52 is obtained by laminating the adhesive 9 on both surfaces of the prepreg face plate 32. Since the procedure is the same as that of the forming step S31 and the hole forming step S32, the description is omitted.
[0123]
FIG. 17 is a schematic diagram illustrating an outline of an electron beam irradiation step S104 of the method for manufacturing a perforated face plate honeycomb panel according to Embodiment 10 of the present invention. After the perforating step S102 is completed, the release film 10 and the plastic sheet 15 are removed from the laminated face plate 52. Then, as shown in FIG. 17, the release film (release agent) 54 and the mesh plate 30 are placed on the upper surface of the surface plate 53, and the laminated face plate 52 is further placed thereon. Thus, one surface (upper surface) of the mesh plate 30 is in close contact with one surface (lower surface) of the laminated face plate 52. Further, a release film 54 is further placed on the laminated face plate 52, and a nylon bag film 55 is put thereon. A sealing material 56 is disposed around the laminated face plate 52, and the space between the bag film 55 and the surface plate 53 is sealed via the sealing material 56, whereby the laminated face plate 52 is wrapped by the bag film 55. State.
[0124]
The bag film 55 is provided with an opening 64, and the opening 64 is connected to a vacuum pump (not shown). The laminated face plate 52 and the mesh plate 30 are set together with the surface plate 53 and the bag film 55 on the electron beam irradiator 37, and a predetermined dose (for example, 50 An electron beam of 秒 間 150 kGy (surface absorbed dose) is irradiated for several seconds.
[0125]
In the electron beam irradiation step S104, the prepreg face plate 32 of the laminated face plate 52 is cured in response to the electron beam irradiated from the electron beam irradiation device 37. Here, the adhesive 9 does not react to the electron beam and remains flexible (uncured). In the electron beam irradiation step S104, the prepreg face plate 32 is cured while the laminated face plate 52 and the mesh plate 30 are placed on the surface plate 53, so that a flat laminated face plate 52 can be obtained.
[0126]
FIG. 18 is a schematic diagram illustrating an outline of the heating step S105 of the method for manufacturing a perforated face plate honeycomb panel according to Embodiment 10 of the present invention. After the electron beam irradiation step S104 is completed, the platen 53 and the laminated face plate 52 covered with the bag film 55 are taken out of the electron beam irradiation machine 37. At this time, the mesh plate 30 is in close contact with the laminated face plate 52. The platen 53, the release film 54, and the bag film 55 are removed from the mesh plate 30 and the laminated face plate 52. Then, as shown in FIG. 18, one surface of the honeycomb core 5 is placed on the surface (lower surface) of the laminated face plate 52 opposite to the bonding surface of the mesh plate 30 so as to sandwich the laminated face plate 52 between the honeycomb core 5 and the mesh plate 30. The laminated body 57 is obtained by being closely attached. The laminate 57 is placed on the platen 58 with the honeycomb core 5 facing down, a release film 59 is placed on the mesh plate 30, and a nylon bag film 60 is further placed on the release film 59. Can be A seal member 61 is provided around the laminate 57, whereby the space between the bag film 60 and the platen 58 is sealed, and is attached to the autoclave 3 in this state. Then, the heating step S105 is performed. The heating step S105 is the same as the heating step S95 according to the ninth embodiment except that the object to be heated is a laminate 57 in which the laminated face plate 52 is laminated so as to be sandwiched between the mesh plate 30 and the honeycomb core 5. The description is omitted.
[0127]
In the heating step S105, the laminate 57 is heated, and the adhesives 9 on both surfaces of the laminated face plate 52 are cured. As a result, the mesh plate 30 and the honeycomb core 5 are bonded to the laminated face plate 52, respectively. Then, the laminated body 57 after the heating and pressurization is taken out of the autoclave 3, and the platen 58, the release film 59 and the bag film 60 are removed, whereby a perforated face plate honeycomb panel with a mesh plate is obtained.
[0128]
Thereby, in the method for manufacturing a perforated face plate honeycomb panel according to the tenth embodiment, the same effect as in the ninth embodiment can be obtained, and a perforated face plate honeycomb panel with a net-like plate can be manufactured.
[0129]
(Embodiment 11)
As shown in FIG. 15, in the method for manufacturing a porous face plate honeycomb panel according to the eleventh embodiment, a densification step S111, a hole forming step S112, and a curing bonding step S113 are performed in this order. Step S113 further includes an electron beam irradiation step (radiation irradiation step) S114 and a heating step S115.
[0130]
As shown in FIGS. 9 and 10, in the method for manufacturing a porous face plate honeycomb panel according to the eleventh embodiment, a thermosetting film-like adhesive 9 is applied to one surface of a prepreg face plate 32 containing an electron beam curable resin. An adhesive 33 in the form of an electron beam curable film is laminated on the other surface to form a laminated face plate 62, and a densification step S111 and a hole making step S112 are performed on the laminated face plate 62. In the densification step S111 and the perforation step S112 according to the eleventh embodiment, the laminated face plate 62 is formed by laminating the adhesive 9 on one surface of the prepreg face plate 32 and laminating the adhesive 33 on the other surface. The other steps are the same as those in the densification step S31 and the perforation step S32 according to the third embodiment, and a description thereof will be omitted.
[0131]
After the perforating step S112 is completed, the release film 10 and the plastic sheet 15 are removed from the laminated face plate 62. Then, as shown in FIG. 17, the mesh plate 30 is brought into close contact with the surface of the laminated face plate 62 on the side of the electron beam-curable adhesive 33, and the electron beam irradiation step S114 is performed on the laminated face plate 62 and the mesh plate 30. . In the electron beam irradiation step S114 according to the eleventh embodiment, the laminated face plate 62 is formed by laminating a thermosetting adhesive 9 on one surface of an electron beam-curable prepreg face plate 32 and bonding the electron beam curable adhesive on the other surface. The electron beam according to the tenth embodiment, except that the agent 33 is laminated, and the reticulated plate 30 in close contact with the surface of the laminated face plate 62 on the side of the adhesive 33 is targeted for electron beam irradiation. Since the procedure is the same as that of the irradiation step S104, the description is omitted.
[0132]
By such an electron beam irradiation step S114, the prepreg face plate 32 and the adhesive 33 of the laminated face plate 62 are cured, and the mesh plate 30 is bonded to the laminated face plate 62. Here, the adhesive 9 does not react to the electron beam and remains flexible (uncured). Then, the laminated face plate 62 after the irradiation with the electron beam is taken out of the electron beam irradiator 37, and the platen 53, the release film 54 and the bag film 55 are removed. Further, as shown in FIG. 18, the surface (lower surface) of the laminated face plate 62 on the thermosetting adhesive 9 side, that is, the bonding surface of the reticulated plate 30 is sandwiched between the honeycomb core 5 and the mesh plate 30 so as to sandwich the laminated face plate 62 therebetween. One surface of the honeycomb core 5 is brought into close contact with the opposite surface to obtain a laminate 63. The stacked body 63 is set in the autoclave 3 in the same state as the stacked body 57 in the heating step S105 according to Embodiment 10, and the heating step S115 is performed. The heating step S115 is the same as the heating step S95 according to the ninth embodiment except that the object to be heated is a laminate 63 in which the laminated face plate 62 is laminated so as to be sandwiched between the mesh plate 30 and the honeycomb core 5. The description is omitted.
[0133]
In the heating step S115, the laminated body 63 is heated, and the adhesive 9 of the laminated face plate 62 is cured. Thereby, the honeycomb core 5 is bonded to the laminated face plate 62. Then, the laminated body 63 after the heating and pressurization is taken out of the autoclave 3, and the platen 58, the release film 59 and the bag film 60 are removed to obtain a perforated face plate honeycomb panel with a net-like plate.
[0134]
Thereby, in the method for manufacturing a perforated face plate honeycomb panel according to the eleventh embodiment, the same effect as in the ninth embodiment can be obtained, and a perforated face plate honeycomb panel with a mesh plate can be manufactured.
[0135]
In the method for manufacturing a perforated face plate honeycomb panel according to the ninth to eleventh embodiments as described above, the processing conditions for the holes 45 to be formed in the laminated face plates 43, 52, and 62 in the perforating steps S92, S102, and S112 are as follows. Although it can be freely set to some extent according to the purpose of use of the honeycomb panel, it is preferable that the diameter is 0.5 to 3 mm and the pitch is 3 to 10 mm, for example. In the method for manufacturing a porous face plate honeycomb panel according to Embodiments 9 to 11, it is preferable that the cell size of the honeycomb core 5 to be used is 5 to 30 mm.
[0136]
In Embodiments 5 to 11, a prepreg 35 in which reinforcing fibers are impregnated with an electron beam-curable resin and / or a film-like adhesive 33 having a property of curing in response to an electron beam are used. Although the method of curing the prepreg face plate 32 and the adhesive 33 made of the prepreg 35 by the beam irradiation device 37 has been described, the present invention is not limited to this, and radiation other than electron beams (for example, ultraviolet light, Prepreg impregnated with a synthetic resin that cures in response to X-rays and / or an adhesive that cures in response to the radiation is used, and the prepreg face plate and the adhesive made of the prepreg are cured by the radiation. Good.
[0137]
【The invention's effect】
In the case of the method and apparatus for manufacturing a porous face plate honeycomb panel according to the present invention, a flexible uncured prepreg face plate and a laminated face plate obtained by laminating a film-like adhesive are punched, and the holes of the porous face plate are formed. The holes of the adhesive can be formed at the same time, and the manufacturing time of the porous faced honeycomb panel can be greatly reduced as compared with the related art. In addition, since the film-shaped adhesive holes can be reliably provided, it is possible to greatly reduce the possibility that the adhesive blocks the holes of the porous face plate as compared with the related art.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing an outline of a configuration of an apparatus for manufacturing a porous face plate honeycomb panel according to Embodiment 1 of the present invention.
FIG. 2 is a schematic diagram illustrating a step of forming a laminated face plate according to Embodiment 1 (5, 9) of the present invention.
FIG. 3 is a flowchart illustrating a procedure of a method for manufacturing a porous face plate honeycomb panel according to Embodiment 1 (3, 5, 7) of the present invention.
FIG. 4 is a schematic diagram illustrating an outline of a densification process of a method for manufacturing a porous face plate honeycomb panel according to Embodiment 1 (5, 9) of the present invention.
FIG. 5 is a schematic diagram for explaining an outline of a hole making step of the method for manufacturing a porous face plate honeycomb panel according to Embodiment 1 (5, 9) of the present invention.
FIG. 6 is a schematic diagram for explaining an outline of a curing bonding step of a method for manufacturing a porous face plate honeycomb panel according to Embodiment 1 (2, 5, 6, 9) of the present invention.
FIG. 7 is a flowchart illustrating a procedure of a method for manufacturing a perforated face plate honeycomb panel according to Embodiment 2 (4, 6, 8) of the present invention.
FIG. 8 is a schematic diagram illustrating an outline of a temporary bonding step in a method for manufacturing a porous face plate honeycomb panel according to Embodiment 2 (6) of the present invention.
FIG. 9 is a schematic diagram illustrating an outline of a densification process of a method for manufacturing a porous face plate honeycomb panel according to Embodiment 3 (7, 10, 11) of the present invention.
FIG. 10 is a schematic diagram illustrating an outline of a hole making step of a method for manufacturing a perforated face plate honeycomb panel according to Embodiment 3 (7, 10, 11) of the present invention.
FIG. 11 is a schematic diagram illustrating an outline of a curing and bonding step in a method for manufacturing a porous face plate honeycomb panel according to Embodiment 3 (4, 7, 8) of the present invention.
FIG. 12 is a schematic diagram illustrating an outline of a temporary bonding step of a method for manufacturing a perforated face plate honeycomb panel according to Embodiment 4 (8) of the present invention.
FIG. 13 is a schematic diagram showing an outline of a configuration of an apparatus for manufacturing a porous face plate honeycomb panel according to Embodiment 5 of the present invention.
FIG. 14 is a schematic diagram schematically showing a configuration of a manufacturing apparatus for a perforated face plate honeycomb panel according to Embodiment 9 of the present invention.
FIG. 15 is a flowchart illustrating a procedure of a method for manufacturing a perforated face plate honeycomb panel according to Embodiment 9 (10, 11) of the present invention.
FIG. 16 is a schematic diagram illustrating an outline of an electron beam irradiation step in a method for manufacturing a perforated face plate honeycomb panel according to Embodiment 9 of the present invention.
FIG. 17 is a schematic diagram illustrating an outline of an electron beam irradiation step in the method for manufacturing a porous face plate honeycomb panel according to Embodiment 10 (11) of the present invention.
FIG. 18 is a schematic diagram illustrating an outline of a heating step of a method for manufacturing a porous face plate honeycomb panel according to Embodiment 10 (11) of the present invention.
FIG. 19 is a schematic diagram illustrating an example of a conventional method for manufacturing a perforated face plate honeycomb panel.
FIG. 20 is a schematic diagram illustrating another example of a conventional method for manufacturing a porous face plate honeycomb panel.
[Explanation of symbols]
1,36,42 Perforated face plate honeycomb panel manufacturing equipment
2 drilling machine
2a Punch
3 Autoclave
4,29,34,40,43,52,62 Laminated face plate
5 Honeycomb core
6,31,38,41,44,51,57,63 laminated body
7,32 prepreg face plate
8,35 prepreg
9,33 adhesive
10, 18, 23, 46, 54, 59 Release film (release agent)
11, 17, 24, 47, 53, 58 surface plate
12,20,26,48,55,60 Bag film
15 Plastic sheet
16,39,45 holes
19,25 plate
30 mesh plate
37 Electron beam irradiation machine
S11, S21, S31, S41, S51, S61, S71, S81, S91, S101, S111 Densification step
S12, S22, S32, S42, S52, S62, S72, S82, S92, S102, S112 Drilling process
S13, S24, S33, S44, S53, S64, S73, S84, S93, S103, S113 Curing bonding process
S23, S43, S63, S83 Temporary bonding step
S94, S104, S114 Electron beam irradiation process
S95, S105, S115 heating process

Claims (14)

合成樹脂を強化繊維に含浸させた未硬化のプリプレグよりなるプリプレグ面板にフィルム状の接着剤を積層した積層面板を孔あけ加工する孔あけ工程と、
該孔あけ工程で孔あけ加工された積層面板のプリプレグ面板を硬化させ、また前記接着剤にハニカムコアの一面を密着させて前記積層面板を前記ハニカムコアに接着させる硬化接着工程とを有する多孔面板ハニカムパネルの製造方法。A perforation step of perforating a laminated face plate obtained by laminating a film-like adhesive on a prepreg face plate made of an uncured prepreg in which a synthetic resin is impregnated into reinforcing fibers,
Curing the prepreg face plate of the laminated face plate that has been perforated in the perforating step, and bonding the laminated face plate to the honeycomb core by adhering one surface of the honeycomb core to the adhesive. A method for manufacturing a honeycomb panel. 前記合成樹脂及び前記接着剤は、夫々熱に反応して硬化する性質を有し、
前記硬化接着工程では、前記積層面板を、前記接着剤側の面にハニカムコアの一面を密着させた状態で加熱して、積層面板の硬化及び積層面板とハニカムコアとの接着を略同時に行う請求項１に記載の多孔面板ハニカムパネルの製造方法。The synthetic resin and the adhesive each have a property of curing in response to heat,
In the curing and bonding step, the laminated face plate is heated in a state where one surface of the honeycomb core is in close contact with the surface on the side of the adhesive, and curing of the laminated face plate and bonding of the laminated face plate and the honeycomb core are performed substantially simultaneously. Item 4. The method for producing a porous face plate honeycomb panel according to Item 1. 前記硬化接着工程に先立って、前記積層面板の前記接着剤側と反対側の面に離型剤を介してプレートを重ねた状態で、前記積層面板の孔に前記合成樹脂が概ね流れ込まず、しかも前記積層面板及び前記プレートが張り付く程度の温度まで加熱する仮接着工程を更に有する請求項２に記載の多孔面板ハニカムパネルの製造方法。Prior to the curing bonding step, in a state where the plates are stacked via a release agent on the surface of the laminated face plate opposite to the adhesive side, the synthetic resin does not generally flow into the holes of the laminated face plate, and The method for producing a porous face plate honeycomb panel according to claim 2, further comprising a temporary bonding step of heating the laminate face plate and the plate to a temperature at which the plates are stuck. 前記孔あけ工程では、熱に反応して硬化する性質を有するフィルム状の接着剤をプリプレグ面板の両面に夫々積層した積層面板を孔あけ加工し、
前記硬化接着工程では、前記積層面板をハニカムコアと網状板とで挟んだ状態で加熱して、積層面板の硬化、積層面板とハニカムコアとの接着及び積層面板と網状板との接着を略同時に行う請求項２に記載の多孔面板ハニカムパネルの製造方法。In the perforating step, a laminated face plate in which a film adhesive having a property of curing in response to heat is laminated on both surfaces of the prepreg face plate,
In the curing and bonding step, the laminated face plate is heated while being sandwiched between the honeycomb core and the mesh plate, and curing of the laminated face plate, adhesion between the laminated face plate and the honeycomb core, and adhesion between the laminated face plate and the mesh plate are substantially simultaneously performed. A method for producing a porous face plate honeycomb panel according to claim 2, which is performed. 前記硬化接着工程に先立って、前記積層面板の一面に網状板の一面を密着させ、該網状板の他面に離型剤を介してプレートを重ねた状態で、前記積層面板の孔に前記合成樹脂が概ね流れ込まず、しかも前記積層面板及び前記網状板並びに該網状板及び前記プレートが夫々張り付く程度の温度まで加熱する仮接着工程を更に有する請求項４に記載の多孔面板ハニカムパネルの製造方法。Prior to the curing and bonding step, one surface of the mesh plate is brought into close contact with one surface of the laminated face plate, and the plate is stacked on the other surface of the mesh plate with a release agent therebetween, and the composition is formed in the hole of the laminated face plate. 5. The method of manufacturing a porous face plate honeycomb panel according to claim 4, further comprising a temporary bonding step of heating the resin to a temperature at which the resin does not substantially flow into the laminate face plate, the mesh plate, and the mesh plate and the plate. 前記合成樹脂及び前記接着剤は、夫々放射線に反応して硬化する性質を有し、
前記硬化接着工程では、前記積層面板の前記接着剤側の面にハニカムコアの一面を密着させた状態で、前記積層面板へ放射線を照射して、積層面板の硬化及び積層面板とハニカムコアとの接着を略同時に行う請求項１に記載の多孔面板ハニカムパネルの製造方法。The synthetic resin and the adhesive each have a property of curing in response to radiation,
In the curing and bonding step, in a state where one surface of the honeycomb core is in close contact with the surface of the laminated face plate on the side of the adhesive, the laminated face plate is irradiated with radiation to cure the laminated face plate and to form the laminate face plate and the honeycomb core. The method for manufacturing a porous face plate honeycomb panel according to claim 1, wherein the bonding is performed substantially simultaneously. 前記硬化接着工程に先立って、前記積層面板の前記接着剤側と反対側の面に離型剤を介してプレートを重ねた状態で、前記積層面板の孔に前記合成樹脂が概ね流れ込まず、しかも前記積層面板及び前記プレートが張り付く程度の温度まで加熱する仮接着工程を更に有する請求項６に記載の多孔面板ハニカムパネルの製造方法。Prior to the curing bonding step, in a state where the plates are stacked via a release agent on the surface of the laminated face plate opposite to the adhesive side, the synthetic resin does not generally flow into the holes of the laminated face plate, and The method for manufacturing a porous face plate honeycomb panel according to claim 6, further comprising a temporary bonding step of heating the laminate face plate and the plate to a temperature at which the plate is stuck. 前記孔あけ工程では、放射線に反応して硬化する性質を有するフィルム状の接着剤をプリプレグ面板の両面に夫々積層した積層面板を孔あけ加工し、
前記硬化接着工程では、前記積層面板をハニカムコアと網状板とで挟んだ状態で、前記積層面板へ放射線を照射して、積層面板の硬化、積層面板とハニカムコアとの接着及び積層面板と網状板との接着を略同時に行う請求項６に記載の多孔面板ハニカムパネルの製造方法。In the perforating step, a laminated face plate in which a film-like adhesive having a property of curing in response to radiation is laminated on both surfaces of the prepreg face plate, respectively,
In the curing bonding step, in a state where the laminated face plate is sandwiched between a honeycomb core and a mesh plate, the laminated face plate is irradiated with radiation to cure the laminated face plate, bond the laminated face plate to the honeycomb core, and laminate the face plate to the mesh. The method for manufacturing a porous face plate honeycomb panel according to claim 6, wherein the bonding with the plate is performed substantially simultaneously. 前記硬化接着工程に先立って、前記積層面板の一面に網状板の一面を密着させ、該網状板の他面に離型剤を介してプレートを重ねた状態で、前記積層面板の孔に前記合成樹脂が概ね流れ込まず、しかも前記積層面板及び前記網状板並びに該網状板及び前記プレートが夫々張り付く程度の温度まで加熱する仮接着工程を更に有する請求項８に記載の多孔面板ハニカムパネルの製造方法。Prior to the curing and bonding step, one surface of the mesh plate is brought into close contact with one surface of the laminated face plate, and the plate is stacked on the other surface of the mesh plate with a release agent therebetween, and the composition is formed in the hole of the laminated face plate. The method for manufacturing a porous face plate honeycomb panel according to claim 8, further comprising a temporary bonding step of heating the resin to a temperature at which the resin does not substantially flow in and the laminated face plate and the mesh plate and the mesh plate and the plate adhere to each other. 前記合成樹脂は、放射線に反応して硬化する性質を有し、前記接着剤は、熱に反応して硬化する性質を有し、
前記硬化接着工程は、前記プリプレグ面板を硬化させるべく、前記積層面板に放射線を照射する放射線照射工程と、該放射線照射工程でプリプレグ面板が硬化した積層面板とハニカムコアとを接着させるべく、前記積層面板の前記接着剤側の面にハニカムコアの一面を密着させた状態で加熱する加熱工程とを有する請求項１に記載の多孔面板ハニカムパネルの製造方法。The synthetic resin has a property of curing in response to radiation, the adhesive has a property of curing in response to heat,
The curing and bonding step is a step of irradiating the laminated face plate with radiation in order to cure the prepreg face plate, and the step of bonding the laminated core and the honeycomb core in which the prepreg face plate is cured in the radiation irradiation step. The method for manufacturing a porous face plate honeycomb panel according to claim 1, further comprising: a heating step of heating the one surface of the honeycomb core in a state in which one surface of the honeycomb core is in close contact with the surface of the face plate on the adhesive side. 前記孔あけ工程では、熱に反応して硬化する性質を有するフィルム状の接着剤をプリプレグ面板の両面に夫々積層した積層面板を孔あけ加工し、
前記加熱工程では、積層面板とハニカムコアとの接着及び積層面板と網状板との接着を略同時に行うべく、積層面板をハニカムコアと網状板とで挟んだ状態で加熱する請求項１０に記載の多孔面板ハニカムパネルの製造方法。In the perforating step, a laminated face plate in which a film adhesive having a property of curing in response to heat is laminated on both surfaces of the prepreg face plate,
The method according to claim 10, wherein, in the heating step, the laminated face plate is heated while being sandwiched between the honeycomb core and the reticulated plate so that the bonding between the laminated face plate and the honeycomb core and the bonding between the laminated face plate and the mesh plate are performed substantially simultaneously. A method for manufacturing a porous face plate honeycomb panel. 前記孔あけ工程では、熱に反応して硬化する性質を有するフィルム状の第１の接着剤と、放射線に反応して硬化する性質を有するフィルム状の第２の接着剤とで前記プリプレグ面板を挟むように積層した積層面板を孔あけ加工し、
前記放射線照射工程では、積層面板の硬化及び積層面板と網状板との接着を略同時に行うべく、前記積層面板の前記第２の接着剤側の面に網状板の一面を密着させた状態で前記積層面板に放射線を照射し、
前記加熱工程では、前記積層面板の前記第１の接着剤側の面にハニカムコアの一面を密着させた状態で加熱する請求項１０に記載の多孔面板ハニカムパネルの製造方法。In the perforating step, the prepreg face plate is coated with a film-like first adhesive having a property of curing in response to heat and a film-like second adhesive having a property of curing in response to radiation. Drilling the laminated face plate laminated so as to sandwich it,
In the radiation irradiation step, the hardening of the laminated face plate and the bonding of the laminated face plate and the mesh plate are performed substantially simultaneously, and the one surface of the mesh plate is brought into close contact with the surface of the laminated face plate on the second adhesive side. Irradiate the laminated face plate,
The method for manufacturing a perforated face plate honeycomb panel according to claim 10, wherein in the heating step, heating is performed in a state where one surface of the honeycomb core is in close contact with the surface of the laminated face plate on the first adhesive side. 前記放射線は、電子線である請求項６乃至１２の何れかに記載の多孔面板ハニカムパネルの製造方法。The method for manufacturing a porous face plate honeycomb panel according to any one of claims 6 to 12, wherein the radiation is an electron beam. 合成樹脂を強化繊維に含浸させた未硬化のプリプレグよりなるプリプレグ面板にフィルム状の接着剤を積層した積層面板を孔あけ加工する孔あけ機と、
該孔あけ機で孔あけ加工された積層面板のプリプレグ面板を硬化させ、また前記接着剤にハニカムコアの一面を密着させて前記積層面板を前記ハニカムコアに接着させる硬化接着機とを備える多孔面板ハニカムパネルの製造装置。A punching machine for punching a laminated faceplate obtained by laminating a film-like adhesive on a prepreg faceplate made of an uncured prepreg impregnated with a synthetic resin in a reinforcing fiber,
A perforated face plate comprising: a cured adhesive machine for curing a prepreg face plate of a laminated face plate perforated by the perforating machine, and for adhering one surface of a honeycomb core to the adhesive to adhere the laminated face plate to the honeycomb core. Honeycomb panel manufacturing equipment.
JP2003154128A 2003-05-30 2003-05-30 Method for manufacturing perforated face honeycomb panel Expired - Fee Related JP3753707B2 (en)

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