JP2004330716A - Molding method of polyphenylene sulfide and mold - Google Patents
Molding method of polyphenylene sulfide and mold Download PDFInfo
- Publication number
- JP2004330716A JP2004330716A JP2003132330A JP2003132330A JP2004330716A JP 2004330716 A JP2004330716 A JP 2004330716A JP 2003132330 A JP2003132330 A JP 2003132330A JP 2003132330 A JP2003132330 A JP 2003132330A JP 2004330716 A JP2004330716 A JP 2004330716A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- temperature
- molding
- polyphenylene sulfide
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
Description
【0001】
【発明の属する技術分野】
本発明は、ポリフェニレンサルファイドの成形方法及び成形用金型に関し、詳しくは、成形品の表面の外観確保、結晶化度の均質化と共に、バリ発生を抑制する成形方法及び成形用金型に関する。
【0002】
【従来の技術】
ポリフェニレンサルファイド(PPS)は、融点約290℃、ガラス転移温度約88℃の耐熱性樹脂であり、連続使用温度は、フィルムでは170℃以上、ガラス繊維や炭酸カルシウムなどが配合された成形品では約240℃に達する。
PPSは、耐熱性が高く、流動性が良く、成形収縮率が小さいことから、薄肉成形、精密成形に適し、電気・電子部品、自動車部品、精密機械部品などに使用されている。しかし、PPSには成形時にバリが発生し易いという問題がある。
【0003】
一般にPPS成形時のバリ対策として、金型合わせ面の精度アップによる隙間を低減する方法や、金型温度を結晶化の進まない40〜100℃の低温として成形する方法等が用いられる。
金型合わせ面の隙間を低減することには制限があり、近年のバリ抑制要求への対応が難しい。
また、金型温度を上記結晶化の進まない低温として成形することは、バリ発生を劇的におさえ、極めて有効な手段ではあるが、成形品表面外観の悪化や成形品が環境温度に曝されたときの表面外観変化、寸法変化等の問題があり、外観を重要視する分野への適用が困難であった。
【0004】
特開平1−93209号公報には、結晶性樹脂材料を使用して、雄金型又は雌金型のうち、一方を結晶化度の再結晶点温度よりも低く、他方を再結晶点温度よりも高くしてケースを作成し、同様にして対となるケースを作成し、両ケースの低温成形面側の間に電子部品を支持したフレームを挟み、両ケースを融着して、電子部品を含む筐体の成形方法が開示されている。(例えば特許文献1参照。)。しかし、ポリフェニレンサルファイドの再結晶点温度(Tg)は80℃であり、従来は、一方を80℃よりも低く、他方を80〜100℃、高くとも120℃程度で成形しており、このような温度では、結晶化度がまだ変化を続けている段階にある。
特開平8−80553号公報には、キャビティ端部に入れ子が設けられ、入れ子が局部冷却されることにより、ポリプロピレンやABS樹脂の成形時に、バリやガス焼けが発生しない射出成形金型が開示されている(例えば特許文献2参照。)。
しかし、従来の技術では、PPSを使用して成形品の表面の外観を良好にすること、表面の結晶化度の均質化を図ることと、バリ発生を抑えることを、同時に達成することは困難であった。
【0005】
【特許文献1】
特開平1−93209号公報(請求項2、および第3頁左下欄下から6行〜右下欄5行)
【特許文献2】
特開平8−80553号公報(請求項1、段落番号0010、および図1)
【0006】
【発明が解決しようとする課題】
本発明の目的は、PPS射出成形品の外観を確保し、表面の結晶化度を均質にすると共に、金型パーティングライン(PLと略すこともある)等のバリ発生を抑制する成形法及び成形用金型を提供することである。
【0007】
【課題を解決するための手段】
本発明者らは、ポリフェニレンサルファイドを射出成形する際に、意匠面となる成形品表面の金型表面温度を125℃以上とし、裏側の金型表面温度を110℃以下にし、さらに射出タイミングと型温変化のタイミングの調整を行うことによって、意匠面の外観および成形品の均一な結晶化度を確保するとともに、バリの発生を劇的に抑制できることを見出し、本発明を完成するに至った。
【0008】
すなわち本発明の第1は、成形品の意匠面側(表側)の金型表面温度を125℃以上、裏側の金型表面温度を110℃以下に、それぞれ維持して、ポリフェニレンサルファイドの充填開始から充填終了までを行う成形方法を提供する。
本発明の第2は、型締めと射出の同時複合動作を行なうことを特徴とする本発明の第1に記載の成形方法を提供する。
本発明の第3は、成形品が孔が設けられていてもよい板状である本発明の第1又は2に記載の成形方法を提供する。
本発明の第4は、ポリフェニレンサルファイド成形品(1)の意匠面側(表側)を成形する金型(11)、及び該金型(11)の表面温度を125℃以上にするための温度調節手段(2)、並びに、成形品(1)の裏側を成形する金型(12)、及び該裏側の金型の表面温度を110℃以下にするための温度調節手段(3)からなる成形金型を提供する。
本発明の第5は、金型キャビティの周囲に断熱構造(7)を有する本発明の第4に記載の成形金型を提供する。
【0009】
【発明の実施の形態】
以下、本発明を図を使用して説明する。
図1は、本発明を示すPPS製の平板状成形品1の一例であり、図2はその射出成形金型の要部断面図である。
図1において、成形終了時では、スプルーおよびランナー1’が付いた状態で型から突き出されるが、製品としてはこの部分は削除される。
図2の例では、高温側の意匠面(例えば固定側)を形成する金型11と低温側の裏面(例えば可動側)を形成する金型12を、それぞれ独立に温度調節できるように、金型内にそれぞれ高温側温度調節手段2および低温側温度調節手段3が設けられ、両金型のパーティングライン13の直近にそれぞれ高温側温度測定手段4および低温側温度測定手段5が設けられている。
高温側温度調節手段2としては、ヒーター、熱媒などが挙げられ、加熱効率が良いので棒ヒーターが好ましい。
低温側温度調節手段3としては、水、油、スチーム等の熱媒、ヒーターなどが挙げられ、冷却効率が良く、金型温度が均一になるので水が好ましい。
温度測定手段としては、熱電対、赤外線温度計などが挙げられる。
温度測定手段で検出された温度は、例えば、比例・積分制御等ができる電子回路を介して温度調節手段にフィードバックすることにより、金型を所定の温度に維持し易くなる。
金型の周囲を断熱材で囲う等して、金型に断熱構造を設けてもよい。このような断熱構造とすることにより、金型の熱伝導率を低下させたり、熱容量を小さくできるので、金型の温度変化を小さくすることができる。なお、図2では、2個所にバリ長さ測定用ギャップ(幅5mm、深さ20μm)6を設けてある。
【0010】
図3は、押しボタン用の孔を有する携帯電話の筐体面を模して作成された成形品の一例であり、図4はその金型の要部断面図である。
図4の例では、孔を設けるために高温側金型11に突起が設けられ、突起の先端面は低温側金型12のキャビティ面に突き当てられる(本発明では該先端面を突き当て面という)。図4の例では、バリ長さ測定用ギャップは設けていないが、比較的バリ抑制の困難な突き当て面のバリ改善効果を評価することができる。
【0011】
成形品の裏面を形成させるための低温側の金型表面温度は、110℃以下、好ましくは80〜110℃であり、さらに好ましくは100〜110℃である。低温側の金型表面温度が、上記温度範囲超であるとバリ発生が著しくなって好ましくない。
成形品の表面を形成させるための高温側の金型表面温度は、ポリフェニレンサルファイドの均一な結晶化を完了して外観を良くするためには、125℃以上、好ましくは125〜150℃であり、さらに好ましくは125〜130℃である。高温側の金型表面温度が、上記温度範囲未満であると結晶化が不十分であったり、結晶化度の均一化が低かったり、寸法精度に悪影響を与え、熱処理等による意匠面側の外観が悪くなって好ましくない。
【0012】
樹脂の充填のタイミングは、図5に示すように、両金型表面温度の変化を測定しながら調整される。図5では、例えば、意匠面側の高温側金型表面温度は150℃に、裏面側の低温側金型表面温度は100℃に設定され、型締めを行う。両金型の接触と共に両金型の温度は変化し始め、低温側金型表面温度は上昇し、高温側金型表面温度は低下する。
樹脂の充填開始は、両金型表面温度が上記設定温度に到達すれば、型締め完了直後であっても、型締め完了前1秒以内、好ましくは0.3秒以内であってもよい。樹脂の充填中においても、両金型の温度は上記と同様な変化を続ける。
本発明では、充填のタイミングは、型締め後充填を開始してもよいが、型締めと射出の同時複合動作を行なうことによって、より正確な温度コントロールを可能とする。同時複合動作とは、型締め完了前に射出工程を開始し、充填完了前に型締めを完了することをいう。樹脂の充填タイミングをこのようにコントロールすることによって、より正確な金型温度差を維持できる。
樹脂の充填終了後、必要に応じて保圧充填を行った後、冷却工程に入る。冷却工程では、さらに上記と同様な変化を続けるが、型開きして成形品を取り出す時点では、それぞれの温度でほぼ一定になる。
【0013】
本発明の成形方法では、充填終了時点まで、意匠面側の金型表面温度を120℃超、好ましくは125℃以上、裏側の金型表面温度を110℃以下、好ましくは100℃以下に保つ。
また、充填終了時点まで、金型パーティングライン及び必要に応じて設けられる金型内突当て面の表面温度の差を10〜30℃に保つ。
【0014】
本発明で使用するPPSの種類、分子量、溶融粘度などには特に制限はなく、直鎖型、架橋型、半架橋型などの重合方法により得られたものが使用できる。
PPSには、樹脂添加剤、充填剤、強化繊維などが配合されてもよい。
【0015】
本発明において、成形方法としては、射出成形、押出成形、フープ成形、ブロー成形、圧縮成形、射出圧縮成形、注型成形等が挙げられる。
【0016】
本発明により得られる成形品は、好ましくは板状であり、成形品の厚みは0.1〜20mm、好ましくは0.1〜2mmである。成形品には、押しボタン用や表示用の孔や窓等(孔と代表して言う)が設けられていてもよく、特に携帯電話、携帯情報端末などの筐体に用いられる。
【0017】
【実施例】
以下、実施例により本発明を具体的に説明するが、本発明はこれらに限定されるものではない。
なお、本実施例では、万能投影機を使用しバリ長さを測定した。また、意匠面外観の評価として、中心線平均表面粗さRa(JIS B0601に基づく)、及び結晶化度の均質化の目安としてアニール(100℃×2時間)前後の寸法変化を測定した。
【0018】
[実施例1]
PPSとしてフォートロンTM1140A1(ポリプラスチックス(株)製)を使用して、図2に示す構造の金型を用いて射出成形品を得た。
【0019】
[比較例1]
金型温度設定を固定側、可動側ともに150℃(ヒーター温調)とした以外は実施例1と同様に成形した。
【0020】
[比較例2]
金型温度設定を固定側、可動側ともに100℃(水温調)とした以外は実施例1と同様に成形した。
上記試験結果を纏めて表1に示す。
【0021】
【表1】
【0022】
【発明の効果】
本発明によれば、意匠面の表面外観を良くすること、寸法精度に影響を与える結晶化度が均一にできること、及びバリが抑制されることが同時に解決される。
【図面の簡単な説明】
【図1】(a)本発明に係る成形品の一例の上面図である。
(b)本発明に係る成形品の一例の断面図である。
【図2】(a)本発明に係る金型の一例の縦断面図である。
(b)本発明に係る金型の一例のPL面断面図である。
【図3】(a)本発明に係る孔あき成形品の一例の上面図である。
(b)本発明に係る孔あき成形品の一例の断面図である。
【図4】(a)本発明に係る金型の一例の縦断面図である。
(b)本発明に係る金型の一例のPL面断面図である。
【図5】本発明の成形方法に係る金型温度と成形タイミングの一例を示すグラフである。
【符号の説明】
1 成形品
1’スプルーおよびランナー
2 (高温側)温度調節手段
3 (低温側)温度調節手段
4 (高温側)温度測定手段
5 (低温側)温度測定手段
6 バリ測定用ギャップ
9 孔
10 金型キャビティ
11 意匠面側(表側)金型
12 裏側金型
13 金型パーティングライン(PL)[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a molding method and a molding die for polyphenylene sulfide, and more particularly, to a molding method and a molding die for suppressing appearance of burrs while securing the appearance of the surface of a molded product, homogenizing the crystallinity.
[0002]
[Prior art]
Polyphenylene sulfide (PPS) is a heat-resistant resin with a melting point of about 290 ° C and a glass transition temperature of about 88 ° C. The continuous use temperature is 170 ° C or higher for films, and about 170 ° C for molded products containing glass fiber or calcium carbonate. Reaches 240 ° C.
PPS is suitable for thin-wall molding and precision molding because of its high heat resistance, good fluidity, and small molding shrinkage, and is used for electric / electronic parts, automobile parts, precision machine parts, and the like. However, PPS has a problem that burrs are easily generated during molding.
[0003]
In general, as a countermeasure against burrs at the time of PPS molding, a method of reducing a gap by increasing accuracy of a mold mating surface, a method of forming a mold at a low temperature of 40 to 100 ° C. at which crystallization does not proceed, and the like are used.
There is a limit in reducing the gap between the mold mating surfaces, and it is difficult to respond to recent burr suppression requirements.
Molding the mold at a low temperature at which the crystallization does not proceed is a very effective means of dramatically suppressing the occurrence of burrs, but it deteriorates the surface appearance of the molded product and exposes the molded product to the environmental temperature. However, there are problems such as a change in surface appearance and dimensional change upon application, and it has been difficult to apply the present invention to a field where appearance is regarded as important.
[0004]
Japanese Patent Application Laid-Open No. 1-93209 discloses that, using a crystalline resin material, one of a male mold and a female mold is lower than the recrystallization point temperature of crystallinity, and the other is lower than the recrystallization point temperature. Also raise the case, create a paired case in the same way, sandwich the frame supporting the electronic components between the low-temperature molding side of both cases, fuse the two cases, A method of forming a housing including the same is disclosed. (For example, see Patent Document 1). However, the recrystallization point temperature (Tg) of polyphenylene sulfide is 80 ° C., and conventionally, one is formed at a temperature lower than 80 ° C. and the other at 80 to 100 ° C., at most at about 120 ° C. At temperature, the degree of crystallinity is still changing.
JP-A-8-80553 discloses an injection mold in which a nest is provided at an end of a cavity and the nest is locally cooled so that burrs and gas burns do not occur when molding polypropylene or ABS resin. (For example, see Patent Document 2).
However, it is difficult with the conventional technology to simultaneously achieve the use of PPS to improve the appearance of the surface of a molded article, achieve uniform surface crystallinity, and suppress the occurrence of burrs. Met.
[0005]
[Patent Document 1]
JP-A-1-93209 (Claim 2 and page 3,
[Patent Document 2]
JP-A-8-80553 (Claim 1, paragraph number 0010, and FIG. 1)
[0006]
[Problems to be solved by the invention]
An object of the present invention is to provide a molding method which ensures the appearance of a PPS injection molded article, makes the surface crystallinity uniform, and suppresses the occurrence of burrs such as a mold parting line (which may be abbreviated as PL). It is to provide a molding die.
[0007]
[Means for Solving the Problems]
The present inventors, when injection-molding polyphenylene sulfide, set the mold surface temperature of the molded product surface to be a design surface to 125 ° C. or more, the mold surface temperature of the back side to 110 ° C. or less, and further set the injection timing and mold By adjusting the timing of the temperature change, it has been found that the appearance of the design surface and the uniform crystallinity of the molded product can be ensured, and the occurrence of burrs can be drastically suppressed, and the present invention has been completed.
[0008]
That is, the first aspect of the present invention is to maintain the mold surface temperature on the design side (front side) of the molded product at 125 ° C. or higher and the mold surface temperature on the back side at 110 ° C. or lower, respectively, from the start of polyphenylene sulfide filling. Provided is a molding method for performing up to the end of filling.
According to a second aspect of the present invention, there is provided the molding method according to the first aspect of the present invention, wherein a simultaneous combined operation of mold clamping and injection is performed.
According to a third aspect of the present invention, there is provided the molding method according to the first or second aspect of the present invention, wherein the molded article has a plate shape which may be provided with a hole.
A fourth aspect of the present invention is a mold (11) for molding the design surface side (front side) of the polyphenylene sulfide molded article (1), and temperature control for adjusting the surface temperature of the mold (11) to 125 ° C. or higher. Means (2), a mold (12) for molding the back side of the molded article (1), and a temperature control means (3) for controlling the surface temperature of the mold on the back side to 110 ° C. or lower. Provide a type.
A fifth aspect of the present invention provides a molding die according to the fourth aspect of the present invention, which has a heat insulating structure (7) around a mold cavity.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described with reference to the drawings.
FIG. 1 is an example of a plate-shaped molded product 1 made of PPS showing the present invention, and FIG. 2 is a sectional view of a main part of an injection molding die.
In FIG. 1, at the end of molding, the product is protruded from the mold with the sprue and the runner 1 'attached, but this part is deleted as a product.
In the example of FIG. 2, the
Examples of the high temperature side temperature control means 2 include a heater and a heating medium, and a rod heater is preferable because of high heating efficiency.
Examples of the low-temperature-side temperature control means 3 include a heat medium such as water, oil, and steam, a heater, and the like. Water is preferable because the cooling efficiency is high and the mold temperature is uniform.
Examples of the temperature measuring means include a thermocouple and an infrared thermometer.
The temperature detected by the temperature measuring means is fed back to the temperature adjusting means via an electronic circuit capable of, for example, proportional / integral control, so that the mold can be easily maintained at a predetermined temperature.
The mold may be provided with a heat insulating structure, for example, by surrounding the mold with a heat insulating material. With such a heat insulating structure, the thermal conductivity of the mold can be reduced or the heat capacity can be reduced, so that the temperature change of the mold can be reduced. In FIG. 2, gaps for measuring burr length (
[0010]
FIG. 3 is an example of a molded product created by imitating a housing surface of a mobile phone having a hole for a push button, and FIG. 4 is a sectional view of a main part of the mold.
In the example of FIG. 4, a projection is provided on the high-
[0011]
The mold surface temperature on the low temperature side for forming the back surface of the molded product is 110 ° C. or lower, preferably 80 to 110 ° C., and more preferably 100 to 110 ° C. If the mold surface temperature on the low temperature side exceeds the above-mentioned temperature range, burrs are remarkably generated, which is not preferable.
The mold surface temperature on the high temperature side for forming the surface of the molded product is 125 ° C. or more, preferably 125 to 150 ° C., in order to complete uniform crystallization of polyphenylene sulfide and improve the appearance. More preferably, it is 125 to 130 ° C. If the mold surface temperature on the high temperature side is less than the above temperature range, crystallization is insufficient, uniformity of crystallinity is low, or dimensional accuracy is adversely affected, and the appearance of the design side due to heat treatment or the like Is bad and is not preferred.
[0012]
As shown in FIG. 5, the timing of filling the resin is adjusted while measuring changes in both mold surface temperatures. In FIG. 5, for example, the surface temperature of the high-side mold on the design side is set to 150 ° C., and the surface temperature of the low-side mold on the back side is set to 100 ° C., and the mold is clamped. With the contact between the two dies, the temperatures of the two dies begin to change, the surface temperature of the low-side mold increases, and the surface temperature of the high-side mold decreases.
The resin filling may be started immediately after the mold clamping is completed or within one second before the mold clamping is completed, preferably within 0.3 second, as long as the surface temperatures of both molds reach the set temperature. Even during the filling of the resin, the temperatures of both molds continue to change in the same manner as described above.
In the present invention, the filling may be started after the mold is clamped, but more precise temperature control is enabled by performing the simultaneous combined operation of the mold clamping and the injection. The simultaneous composite operation means that the injection process is started before the completion of the mold clamping, and the mold clamping is completed before the completion of the filling. By controlling the resin charging timing in this way, a more accurate mold temperature difference can be maintained.
After the filling of the resin is completed, if necessary, pressure-holding filling is performed, and then a cooling process is started. In the cooling step, the same change as above is continued, but when the mold is opened and the molded product is taken out, the temperature becomes almost constant at each temperature.
[0013]
In the molding method of the present invention, the mold surface temperature on the design side is maintained at more than 120 ° C., preferably 125 ° C. or more, and the mold surface temperature on the back side is maintained at 110 ° C. or less, preferably 100 ° C. or less until the filling is completed.
Until the filling is completed, the difference between the surface temperature of the mold parting line and the surface temperature of the abutment surface in the mold provided as needed is maintained at 10 to 30 ° C.
[0014]
The type, molecular weight, melt viscosity and the like of the PPS used in the present invention are not particularly limited, and those obtained by a polymerization method such as a linear type, a cross-linked type, and a semi-cross-linked type can be used.
The PPS may be blended with a resin additive, a filler, a reinforcing fiber, and the like.
[0015]
In the present invention, examples of the molding method include injection molding, extrusion molding, hoop molding, blow molding, compression molding, injection compression molding, cast molding, and the like.
[0016]
The molded product obtained by the present invention is preferably plate-shaped, and the thickness of the molded product is 0.1 to 20 mm, preferably 0.1 to 2 mm. The molded article may be provided with holes or windows for push buttons or display (typically referred to as holes), and is particularly used for housings of mobile phones, personal digital assistants, and the like.
[0017]
【Example】
Hereinafter, the present invention will be described specifically with reference to Examples, but the present invention is not limited thereto.
In this example, the burr length was measured using a universal projector. In addition, as an evaluation of the design surface appearance, a center line average surface roughness Ra (based on JIS B0601) and a dimensional change before and after annealing (100 ° C. × 2 hours) were measured as a measure of homogenization of crystallinity.
[0018]
[Example 1]
An injection-molded product was obtained using Fortron TM 1140A1 (manufactured by Polyplastics Co., Ltd.) as a PPS and a mold having the structure shown in FIG.
[0019]
[Comparative Example 1]
Molding was performed in the same manner as in Example 1 except that the mold temperature was set to 150 ° C. (heater temperature control) on both the fixed side and the movable side.
[0020]
[Comparative Example 2]
Molding was performed in the same manner as in Example 1 except that the mold temperature was set to 100 ° C. (water temperature control) on both the fixed side and the movable side.
Table 1 summarizes the above test results.
[0021]
[Table 1]
[0022]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the improvement of the surface appearance of a design surface, the uniformity of crystallinity which affects dimensional accuracy, and the suppression of burrs are simultaneously solved.
[Brief description of the drawings]
FIG. 1A is a top view of an example of a molded product according to the present invention.
(B) It is sectional drawing of an example of the molded article which concerns on this invention.
FIG. 2A is a longitudinal sectional view of an example of a mold according to the present invention.
(B) It is a PL sectional view of an example of a metallic mold concerning the present invention.
FIG. 3A is a top view of an example of a perforated molded product according to the present invention.
(B) It is sectional drawing of an example of the perforated molded product which concerns on this invention.
FIG. 4 (a) is a longitudinal sectional view of an example of a mold according to the present invention.
(B) It is a PL sectional view of an example of a metallic mold concerning the present invention.
FIG. 5 is a graph showing an example of mold temperature and molding timing according to the molding method of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Molded product 1 'Sprue and runner 2 (High temperature side) Temperature control means 3 (Low temperature side) Temperature control means 4 (High temperature side) Temperature measurement means 5 (Low temperature side) Temperature measurement means 6 Burr measurement gap 9
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003132330A JP4137692B2 (en) | 2003-05-09 | 2003-05-09 | Polyphenylene sulfide molding method and molding die |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003132330A JP4137692B2 (en) | 2003-05-09 | 2003-05-09 | Polyphenylene sulfide molding method and molding die |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004330716A true JP2004330716A (en) | 2004-11-25 |
JP4137692B2 JP4137692B2 (en) | 2008-08-20 |
Family
ID=33507235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003132330A Expired - Fee Related JP4137692B2 (en) | 2003-05-09 | 2003-05-09 | Polyphenylene sulfide molding method and molding die |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4137692B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007072686A1 (en) * | 2005-12-22 | 2007-06-28 | Honda Motor Co., Ltd. | Molding method and molding apparatus |
JP2015074111A (en) * | 2013-10-07 | 2015-04-20 | 株式会社松井製作所 | Mold cooling system and method |
-
2003
- 2003-05-09 JP JP2003132330A patent/JP4137692B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007072686A1 (en) * | 2005-12-22 | 2007-06-28 | Honda Motor Co., Ltd. | Molding method and molding apparatus |
JP2015074111A (en) * | 2013-10-07 | 2015-04-20 | 株式会社松井製作所 | Mold cooling system and method |
Also Published As
Publication number | Publication date |
---|---|
JP4137692B2 (en) | 2008-08-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4137692B2 (en) | Polyphenylene sulfide molding method and molding die | |
JP3867966B2 (en) | OPTICAL ELEMENT, MOLD FOR MOLDING, AND METHOD FOR PRODUCING OPTICAL ELEMENT | |
JP2011056753A (en) | Method for producing injection molded product | |
JP4057385B2 (en) | Molding method of plastic molded product and injection mold | |
JP2000127175A (en) | Molding machine | |
JP2537231B2 (en) | Plastic lens molding method | |
JP4097954B2 (en) | Optical element, optical element molding die, and optical element molding method | |
JP4869990B2 (en) | Injection mold and injection molding method using the same | |
JP4255045B2 (en) | Manufacturing method of molded products | |
CN108883559B (en) | Injection molding die, injection molding method, and molded article | |
JP3648364B2 (en) | Resin molding equipment | |
JP5103768B2 (en) | Optical lens injection mold | |
JP3698779B2 (en) | Optical reflection mirror injection molding method and molding die | |
JP2003191302A (en) | Resin molding method, die used for the same and molded product by the same | |
JP4200225B2 (en) | Injection molding method by gate-step heating | |
JP2003089136A (en) | Molding method for plastic molded article and mold therefor | |
JP2002086517A (en) | Method for manufacturing plastic molded product and mold therefor | |
ATE448930T1 (en) | TEMPERATURE-DEPENDENT DEFORMATION | |
JP3571173B2 (en) | Plastic molding method and molding apparatus | |
WO2019235031A1 (en) | Molded item manufacturing method | |
JP2008238687A (en) | Mold device, injection molding method, and optical element | |
JP2784164B2 (en) | Plastic moldings | |
JP2006297742A (en) | Resin molding mold and resin molding method | |
JP2020069772A (en) | Injection molding method | |
JP2005035196A (en) | Method, mold and equipment for injection molding |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20050819 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060201 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20071016 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071030 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071226 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080603 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080604 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110613 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110613 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120613 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120613 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130613 Year of fee payment: 5 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |