JP2004323945A - Die for injection molding, plating method, and plating tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plating method capable of obtaining a die for injection molding having a satisfactory molded face free from roughness and further having a long service life in a plating method for a die for injection molding comprising a stock consisting essentially of beryllium copper. <P>SOLUTION: The plating method is the treatment of applying plating, e.g., to the surface of a die for injection molding consisting of beryllium copper as the stock. In the method, successively to degreasing treatment 1, electrolytic activation treatment 2 is performed, then, nickel strike plating treatment 3 and mat nickel plating treatment 4 are performed, further, amorphous electroless nickel plating treatment 5 and passivation treatment 6 are performed, and finally, posttreatment 7 such as water washing treatment, pure hot water washing and drying is performed. By the plating treatment, the die for injection molding free from surface roughness, reduced in the change of dimensions and having a long die life can be obtained. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an injection-molding mold that has been subjected to plating using a material containing beryllium copper, a plating method for the injection-molding mold, and a plating jig (a plating jig holding jig). ).
[0002]
[Prior art]
Conventionally, beryllium copper has been applied as a material of a synthetic resin injection mold, and the mold has been subjected to injection molding in a state of being cured by heat treatment. However, with only the above heat treatment, the surface of the mold is easily corroded, and the life of the mold is shortened.
[0003]
Thus, it is conceivable to process beryllium copper as a mold, harden it by heat treatment, and then apply plating, for example, nickel plating, to prevent corrosion of the mold surface.
[0004]
The conventional nickel plating process for the beryllium copper mold,
(1) Degreasing treatment step (2) Surface acid activation treatment step (3) Nickel plating treatment step (4) The treatment is performed in the order of water washing, pure hot water washing and drying.
[0005]
In the degreasing treatment, degreasing with an organic solvent and degreasing with an alkaline solution are performed. In the above-mentioned surface acid activation treatment, the surface is lightly activated with dilute hydrochloric acid or dilute sulfuric acid, and chemically polished using a mixed solution of nitric acid, phosphoric acid, acetic acid, etc. to remove the scale and the passivation film on the surface. I do. In the nickel plating process, an electroplating process and an electroless plating process are performed.
[0006]
In addition, the work of the unprocessed mold in the above-described conventional plating process is supported in a state as shown in the diagram of the conventional electroplating process in FIG. 7 or the diagram of the conventional electroless plating process in FIG. Is done. FIG. 6 is a perspective view of a workpiece of an unprocessed mold to be subjected to the conventional plating process.
[0007]
In the case of plating the work 101 having the through hole 101a shown in FIG. 6, in the electroplating shown in FIG. 7, the plating bath 102 in which the + electrodes 104 and 105 are arranged is filled with the plating solution 103. The work 101 is immersed between the + electrodes 104 and 105 in a state where the work 101 is held by the work support 106 with the through hole 101a kept horizontal. In this work holding state, since the through-hole 101a faces both electrodes and is along the direction of the current, good plating including the through-hole 101a is performed.
[0008]
On the other hand, in the above-described electroless plating process shown in FIG. 8, the workpiece 21 which is an unprocessed mold is replaced with a workpiece support 116 so that the through hole 101a is kept vertical, and a plating tank filled with a plating solution 113 is provided. Immerse in 112. Plating is performed in this immersion state. In this work holding state, since the through-hole 101a is held vertically, the generated gas easily escapes upward, and good plating is performed including the through-hole 101a.
[0009]
Japanese Patent Application Laid-Open No. 2001-73164 discloses a conventional proposal for a chrome plating method for a surface of a mold or the like. In this plating treatment, a chromium plating is applied to the surface of the metal substrate, and then the metal substrate is heated in an oxidizing atmosphere to form a chromium oxide passivation film on the chromium plating surface. This plating process can be used for rubber molding dies and injection molded parts.
[0010]
[Problems to be solved by the invention]
However, when a beryllium copper injection mold is treated by the above-described conventional nickel plating, the surface is chemically polished with an acid mixed solution in the acid activation treatment step, so that the surface of the mold is dissolved and the dimensions are reduced. Change. There is also a problem that the surface of the mold is roughened by the acid mixed solution. In addition, the mold surface is liable to be corroded by crystal grain boundaries, has a short life in injection molding, and has a problem that a sufficient number of shots cannot always be obtained.
[0011]
Further, in the conventional workpiece support applied to the above-described conventional nickel plating, the workpiece is an unprocessed mold in the case of the electroplating shown in FIG. 7 and the case of the electroless plating shown in FIG. Since the holding postures of the workpieces are different, a dedicated work support for each plating process is required, and further, work for replacing the work is required, which is troublesome.
[0012]
The present invention has been made in order to solve the above-described problems, and in an injection molding die made of a material mainly composed of beryllium copper, by performing an appropriate plating process, a good molding surface without rough surface is obtained. Provided is an injection mold that can be obtained and has a long service life, provides a plating method thereof, and further provides a plating jig that can easily switch a holding position of an untreated mold in the plating process. The purpose is to do.
[0013]
[Means for Solving the Problems]
An injection mold according to claim 1 of the present invention is a mold for injection molding comprising a material mainly composed of beryllium copper, wherein nickel strike plating, matte nickel plating, amorphous electroless nickel plating, and chromate A coating is applied.
[0014]
The plating method according to claim 2 of the present invention is a plating method applied to an injection mold made of a material mainly composed of beryllium copper, wherein nickel strike plating, matte nickel plating, amorphous The electroless nickel plating treatment and the passivation treatment with a chromate film are plating methods applied to an injection mold made of a material mainly containing beryllium copper.
[0015]
According to a third aspect of the present invention, in the plating method according to the second aspect, an electrolytic activation process using hydrochloric acid is performed before the nickel strike plating process.
[0016]
A plating method according to a fourth aspect of the present invention is the plating method according to the third aspect, wherein a degreasing treatment is performed before the electrolytic activation treatment.
[0017]
In a plating method according to a fifth aspect of the present invention, in the plating method according to the fourth aspect, the degreasing treatment includes a degreasing treatment with an organic solvent, a degreasing treatment with an alkali bath, and an electrolytic degreasing treatment with sodium hydroxide. Including.
[0018]
The plating method according to claim 6 of the present invention is the plating method according to claim 5, wherein the solution of sodium hydroxide in the electrolytic degreasing treatment has a solution concentration of 20 g / l to 100 g / l.
[0019]
The plating method according to claim 7 of the present invention is the plating method according to claim 2, wherein the nickel strike plating treatment has a solution concentration of hydrochloric acid in a range of 30 ml / l to 200 ml / l and nickel chloride of 100 g / l. Solution concentrations range from 1 to 400 g / l.
[0020]
The plating method according to claim 8 of the present invention is the plating method according to claim 2, wherein the acidity of the solution of the amorphous electroless nickel plating is in the range of pH 2.5 to pH 4.5.
[0021]
A plating jig according to a ninth aspect of the present invention is the plating jig for supporting a component to be plated, wherein the orientation of the component is a first orientation and a second orientation different from the first orientation. There is a posture changing means for supporting the posture changeably.
[0022]
A plating jig according to a tenth aspect of the present invention is the plating jig according to the ninth aspect, further comprising a beam portion for fixing and supporting the component, one end of the beam portion is hinged, and the beam portion is provided. The orientation of the component can be changed by rotating the hinge with respect to the hinge.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of an untreated injection molding die according to the first embodiment of the present invention.
[0024]
The injection molding die 21 of the present embodiment is a die using a beryllium copper material (hereinafter referred to as beryllium copper), has a through hole 21a, and has a through hole 21b for holding during plating. It is provided in parallel with 21a. Then, the surface of the injection molding die (work which is a non-plated die) 21 is subjected to a plating process by a plating process step of FIG. 2 described later.
[0025]
A plating method according to a second embodiment of the present invention for plating the injection molding die 1 will be described with reference to FIG. 2 showing a plating step.
This plating process is a process for plating the surface of the injection molding die 21 or the like made of beryllium copper as a material, and is performed in accordance with the plating process sequence shown in FIG. That is, the electrolytic activation process 2 is performed after the degreasing process 1, the nickel strike plating process 3 and the matte nickel plating process 4 are performed, and the amorphous electroless nickel plating process 5 A activating process 6 is performed, and finally, a post-process 7 such as a water washing process, a pure hot water washing, and drying is performed.
[0026]
In the degreasing treatment 1, the degreasing with an organic solvent and the degreasing with an alkali solution are performed in the same manner as in the case of the conventional plating, and then, unlike the conventional case, electrolytic degreasing is performed. This electrolytic degreasing is performed by using a sodium hydroxide-based solution having a solution concentration of 80 g / l (permissible range: 20 to 100 g / l) as a plating solution, for example, a commercially available bath cleaner 160 (manufactured by Meltex Co., Ltd.), and the solution temperature is 55 ° C (allowable range: 40 to 70 ° C), and a negative electrolytic treatment at a current density of 5 A / dm ² (allowable range: 1 to 20 A / dm ² ) for 1 minute (allowable range: 10 sec to 5 min) Is In this electrolytic degreasing, the surface is activated because hydrogen gas is generated. Further, the effect is increased by increasing the concentration of the plating solution (the conventional ordinary concentration is 30 to 50 g / l).
[0027]
In the electrolytic activation treatment 2, hydrochloric acid having a concentration by volume of 10% (permissible range of 5 to 50%) is used as a plating solution, the liquid temperature is maintained at a normal temperature (permissible range of 5 to 35 ° C.), and the current density is 5A. The negative electrolytic treatment is performed for 1 min 30 sec (permissible range 10 sec to 5 min) at / dm ² (permissible range 1 to 20 A / dm ² ). In the electrolytic activation treatment 2, a synergistic effect of the surface activation by the generated hydrogen gas and hydrochloric acid is exerted. In addition, since the plating solution is in a negative electrolysis state and the plating solution is a thin acid, there is no elution of the substrate, and the surface of the mold is hardly roughened.
[0028]
In the nickel strike plating process 3, a plating solution mixed with hydrochloric acid having a solution concentration of 50 ml / l (allowable range of 30 to 200 ml / l) and nickel chloride solution having a solution concentration of 300 g / l (allowable range of 100 to 400 ml / l) as a plating solution using, maintaining the liquid temperature to a state of normal temperature (tolerance 5 to 40 ° C), current density 3.5A / dm ² (tolerance 1 to 20A / dm ²⁾ between the time 1min (tolerance 15sec~ Electroplating for 10 min) is performed. In the nickel strike plating process 3, a base coat having good adhesion is performed for plating while activating the base surface with hydrochloric acid (the same effect as that of plating on a normal stainless steel material). Furthermore, the concentration of hydrochloric acid is reduced (conventional ordinary hydrochloric acid concentration is 125 ml / l), and the concentration of nickel chloride solution is increased (conventional ordinary nickel chloride solution is 250 g / l) to prevent roughening of the substrate. ing.
[0029]
In the matte nickel plating treatment 4, a nickel sulfate solution having a concentration of 250 g / l (permissible range: 150 to 400 g / l), a nickel chloride solution having a concentration of 45 g / l (permissible range: 30 to 100 g / l), A mixed plating solution of a boric acid solution of 30 g / l (acceptable range of 20 to 70 g / l) and an additive (primary brightener) having a concentration of 5 ml / l (acceptable range of 1 to 30 ml / l) is used. Electroplating is performed at a current density of 3 A / dm ² (allowable range of 1 to 20 A / dm ² ) for 1 minute (allowable range of 15 sec to 5 min) while maintaining the temperature at 50 ° C. (allowable range of 45 to 60 ° C.). . In this matte nickel plating process 4, a good plated surface can be obtained due to the pinhole filling effect in the nickel strike plating process 3.
[0030]
In the amorphous electroless nickel plating treatment 5, as the amorphous electroless nickel plating solution, for example, a mixture of a commercially available Top Nicolon NAC (manufactured by Okuno Pharmaceutical Co., Ltd.) with the A agent having a concentration of 80 ml / l and the B agent having a concentration of 200 ml / l is used. Using a liquid, the pH is adjusted to be 3.5 to 4.5 (permissible range: pH 2.5 to 4.5) (the pH is adjusted with an ammonia liquid). The work 21 which is a die coated with matte nickel plating is immersed in the plating solution maintained at a liquid temperature of 83 ° C. (permissible range of 75 to 95 ° C.) for 1 hour 30 min (permissible range of 30 min to 5 h). Perform electroless plating. In the amorphous electroless plating process 5, a film thickness of 5 to 6 μm is formed. Since amorphous is amorphous, it does not have crystal grain boundaries unlike ordinary metals. Corrosion of the metal starts from the crystal grain boundaries. However, since the surface subjected to the amorphous electroless nickel plating treatment has no crystal grain boundaries, corrosion hardly occurs and corrosion resistance is improved.
[0031]
In the passivation treatment 6, a chromic anhydride solution having a concentration of 1 g / l (permissible range: 0.5 to 100 g / l) was used, and the anhydrous solution at a liquid temperature of 70 ° C (permissible range: 50 to 90 ° C) was used. A work 21 which is a mold having been subjected to an amorphous electroless nickel plating treatment is immersed in a chromic acid solution for a time of 10 min (permissible range: 1 to 30 min) to perform a passivation treatment. By this treatment, an extremely thin chromate film is formed on the surface, the surface is passivated, and the corrosion resistance is improved.
[0032]
By performing the plating treatment of the present embodiment from the above-described degreasing treatment 1 to the passivation treatment 6, the beryllium copper material having a good molded surface without rough surface, small dimensional change, and long mold life is obtained. An injection mold is obtained.
Note that the above-described allowable ranges of the liquid concentration, the liquid temperature, the pH value, the current density, the processing time, and the like indicate the ranges in which acceptable results were actually obtained when plating was performed.
[0033]
The above-described electrolytic degreasing and electrolytic activation treatment 2, nickel strike plating treatment 3, and matte nickel plating treatment 4 are steps of electroplating treatment (including electrolytic degreasing treatment). The passivation process 6 is a step of electroless plating (including passivation performed by immersion in a solution). Therefore, in the plating process of the present embodiment, the through-hole 21a is provided in the workpiece 21 (FIG. 1) which is an unprocessed mold, and in order to obtain a good surface treatment, the through-hole 21a and the non-processed metal mold are used. It is necessary to hold the work 21 in a different posture between when the electrolytic plating process is performed. That is, when the work 21 has a through-hole or the like, during the electroplating process (including the electrolytic degreasing process), the work 21 is held in a posture facing the both electrode portions with the through-hole or the like horizontal. In the electroless plating process, the work 21 is held so that the through holes are kept in the vertical direction. When the work 21 has a groove or the like instead of the through hole, the direction of the groove or the like is treated in the same manner as the above-described direction of the through hole, and the holding posture of the work is determined.
[0034]
In order to hold the workpiece 21 which is an unprocessed mold (part to be plated) in the above-described state when performing the plating process, a plating jig (plating process) according to the third embodiment of the present invention shown in FIGS. The work holding jig is used.
FIG. 3 is a front view of the work holder, and shows the work holding state during electroplating and the work holding state during electroless plating in two-dot chain lines. FIG. 4 is a view in the direction of arrow A in FIG. 3 in a state of holding the workpiece during the electroplating process. FIG. 5 is an exploded perspective view of the lower work holding portion of the work holding tool as viewed from the direction B in FIG. 4, and simultaneously shows the work holding state during the electroplating process and the electroless plating process by a two-dot chain line. Indicated by
[0035]
3 to 5, the Hx or Hy direction (perpendicular to Hx) and the V direction indicate the horizontal direction and the vertical direction when the work holder is immersed in the plating bath, respectively.
[0036]
The work holder 30 is made of a conductive material, and is electrically connected to a negative electrode. The upper work holder 33 is disposed above the lower part of the suspender 31, and is disposed below the lower part. And a lower work holding portion 34 that can hold the two unprocessed dies 21 in different postures during the plating process. That is, according to the work holder 30, when the process is switched between the electroplating process and the electroless plating process, a single work is held without removing the mold 21 only by replacing the posture holding plate described later. The holding posture can be changed by a tool.
[0037]
The hanging bracket 31 of the work holder 30 is made of a stainless steel plate, has a hook 31a for supporting the work holder on the upper part, and upper and lower work holders 33 and 34 are assembled on the lower part. . Note that a portion between the hook portion 31a and the upper work holding portion 33 is bent in a crank shape, and a reinforcing plate 32 is welded to the bent portion.
[0038]
The upper work holding unit 33 and the lower work holding unit 34 have the same configuration, but when switching the work posture at the time of the process switching, avoid interference with each other and avoid air bubbles during electroless plating. The upper work holding portion 33 and the lower work holding portion 34 are arranged so as to be displaced by at least the thickness of the work in the Hx direction so as not to be delayed.
[0039]
The upper work holding part 33 has a fixed block 41, a fixed block 42, and a shaft support block 43 that are fixed to the hanging metal member 31 in order from above to below, and further, a hinge pin (hinge) is attached to the shaft support block 43. A) a work supporting plate 44 of posture changing means (beam portion) rotatably supported via 48; a posture holding plate 45 of posture changing means rotatably supported by the work supporting plate 44; 46, 47 and a work fixing screw 71 are provided. FIG. 4 shows the posture state of the work 21 during the electroplating process.
[0040]
The lower work holding portion 34 has a fixed block 51, a fixed block 52, and a support block 53, which are fixed to the suspension fitting 31 in order from above to below, and further, a hinge pin (hinge) is attached to the support block 53. A) a work supporting plate 54 of a posture changing means (beam portion) rotatably supported via 58; a posture holding plate 55 of a posture changing means rotatably supported by the work supporting plate 54; 56, 57, a work fixing screw 72, and the like.
[0041]
Since the upper work holding unit 33 and the lower work holding unit 34 have the same configuration, the detailed structure of the lower work holding unit 34 will be described below with reference to FIG.
[0042]
One end of the work support plate 54 is rotatably supported by the support block 53 via a hinge pin 58 inserted into the support hole 54a, and the other end of the work support plate 54 is screwed into the screw hole 54b. The posture holding plate 55 is rotatably connected to a shaft support hole 55a provided at one end of the posture holding plate 55 with the spacer 60 interposed therebetween. A retaining ring 61 for retaining the pin is fitted to the outside of the pivot pin 59. The work support plate 54 is provided with a work mounting hole 54c on a convex portion formed by being bent at a right angle in the Hx direction near the shaft support hole 54b. The work 21 is fixed to the work support plate 54 by inserting the work fixing screw 72 into the work mounting hole 54c and screwing it to the work 21.
[0043]
One end of the posture holding plate 55 is rotatably supported by the work support plate 54, and a notch 55b is provided at the other end. The notch 55b can be switched and locked to the fixed block 51 or 52 by a thumb screw 56 or 57 screwed to the screw portions 51a and 52a. By switching the locking position of the attitude holding plate 55, the work support plate 54 rotates about the hinge pin 58, and the support plate 54 can be switched and held between a state along the V direction and a state along the Hy direction.
[0044]
In the upper work holding portion 33 as well as the lower work holding portion 34, the work support plate 44 rotatably supported by the hanging bracket 31 rotates around the hinge pin 48 by switching the locking position of the posture holding plate 45, and V The state can be switched between the state along the direction and the state along the Hy direction.
[0045]
When performing the series of plating processes shown in FIG. 2 using the work holder 31 having the above-described configuration, first, the two unprocessed dies 21 are transferred to the work support plates 44 and 54 of the work support 30. Is attached to the base with screws 71 and 72.
[0046]
The work 21 attached to the work support 30 is immersed in a plating solution of a plating tank at the time of plating, and the posture of the work 21 depends on whether the plating at that time is electroplating or electroless plating. Is switched.
[0047]
That is, in the electroplating process including the electrolytic activation process from the electrolytic activation process 2 to the matte nickel plating process 4 through the nickel strike plating process 3 (FIG. 2), the notch and the position holding of the position holding plate 45 are performed. The notch 55b of the plate 55 is locked and fixed to the screw shafts of the thumb screws 47 and 57 screwed to the fixing blocks 42 and 52, respectively, and the two workpieces 21 are provided with the through holes 21a in FIG. The posture (first posture) along the indicated Hy direction is maintained. With this holding posture, the through-hole 21a faces the + electrodes 104 and 105 and coincides with the current direction, so that a good plating layer is generated or a good surface electrolytic activation is performed.
[0048]
In the electroless process between the amorphous electroless nickel plating process 5 and the passivation process 6 (FIG. 2), the notch of the position holding plate 45 and the notch 55b of the position holding plate 55 are fixed to the fixing block 41, respectively. , 51 are switched to and fixed to the screw shafts of the thumb screws 46 and 56 screwed to the two workpieces 21 so that the through-holes 21a of the two workpieces 21 are in the posture (second posture) along the V direction shown in FIG. Switch. In this holding posture, the gas generated in the through-hole becomes easy to escape because the through-hole 21a extends in the vertical direction, and a good plating layer or a passivation film is generated.
[0049]
If the work 21 which is an unprocessed mold is mounted using the work support 30 of the present embodiment described above to perform the electroplating process and the electroless plating process, the work 21 can be replaced with a single work support 30. , It is possible to easily switch to a position suitable for electroplating or electroless plating without removing the workpiece from the work support, thereby reducing the number of steps required for plating.
[0050]
In addition, the plating holding jig (plating jig) of the present invention includes a hanging metal member 31 made of a conductive material and a work made of a conductive material, and the work to be plated is screwed, or the like. A spring or the like can be inserted and held in the work hole, one end of which is made of a conductive material, and the other end of the work holding arm is made of a conductive material. The other end of the posture holding plate is provided at two different positions with respect to the hanging metal member 31 so as to switch the posture of the work. A plurality of locking portions that lock at a position (note that the position holding plate may be held and locked by a spring member or the like instead of the thumb screws 56 and 57 as an example of the locking portion). Is also good.
[0051]
In the work support 30 of the third embodiment, the posture of the work 21 is switched with respect to the direction of the through hole 21a. The posture of the workpiece may be switched. In the present embodiment, the angle of the posture to be switched is 90 °, but may be an angle other than 90 °.
[0052]
【The invention's effect】
As described above, according to the present invention, in an injection molding die made of a material mainly composed of beryllium copper, a good molded surface without rough surface can be obtained by performing an appropriate plating treatment, and the life is long. An injection mold and a plating method thereof can be provided, and further, a plating jig capable of easily switching a holding posture of a work in a plating process can be provided.
[Brief description of the drawings]
FIG. 1 is a perspective view of an injection molding die according to a first embodiment of the present invention.
FIG. 2 is a plating process diagram in a plating method according to a second embodiment of the present invention.
FIG. 3 is a front view of a work holder which is a plating jig according to a third embodiment of the present invention.
FIG. 4 is a view of the work holder of FIG.
FIG. 5 is a perspective view of a lower work holding portion of the work holding tool of FIG. 3 when viewed from a direction B.
FIG. 6 is a perspective view of a workpiece of an unprocessed mold provided for a conventional plating process.
FIG. 7 is a view showing a state of a conventional electroplating process.
FIG. 8 is a diagram showing a state of a conventional electroless plating process.
[Explanation of symbols]
3 Nickel strike plating treatment 4 Matte nickel plating treatment 5 Amorphous electroless nickel plating treatment 6 Passivation treatment 21 Work (injection molding die)
44, 54: Work support plate (beam, posture changing means)
45, 55 ... posture holding plate (posture changing means)
48, 58 ... hinge pin (hinge)

Claims (10)

In an injection mold made of beryllium copper-based material,
Nickel strike plating,
Matte nickel plating,
Amorphous electroless nickel plating,
Chromate film,
A metal mold for injection molding characterized by having been subjected to. In a plating method applied to an injection mold made of a material mainly composed of beryllium copper,
Nickel strike plating,
Matte nickel plating,
Amorphous electroless nickel plating,
Passivation treatment by chromate film,
Is applied to an injection mold made of a material mainly composed of beryllium copper. 3. The plating method according to claim 2, wherein an electrolytic activation treatment with hydrochloric acid is performed before the nickel strike plating treatment. The plating method according to claim 3, wherein a degreasing treatment is performed before the electrolytic activation treatment. The plating method according to claim 4, wherein the degreasing treatment includes a degreasing treatment with an organic solvent, a degreasing treatment with an alkaline bath, and an electrolytic degreasing treatment with sodium hydroxide. The plating method according to claim 5, wherein the sodium hydroxide solution in the electrolytic degreasing treatment has a solution concentration in a range of 20 g / l to 100 g / l. 3. The nickel strike plating process according to claim 2, wherein hydrochloric acid has a solution concentration in a range of 30 ml / l to 200 ml / l, and nickel chloride has a solution concentration in a range of 100 g / l to 400 g / l. Plating method. The plating method according to claim 2, wherein the acidity of the solution for the amorphous electroless nickel plating is in the range of pH 2.5 to pH 4.5. In plating jigs for supporting parts to be plated,
A plating jig, comprising: posture changing means for supporting a posture of the component so as to be changeable between a first posture and a second posture different from the first posture. 10. The device according to claim 9, further comprising a beam portion for fixedly supporting the component, wherein one end of the beam portion is hingedly supported, and the posture of the component can be changed by rotation of the beam portion with respect to the hinge. Jig for plating.

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