KR101770651B1 - Method of Manufacturing a electroplating pipe - Google Patents

Method of Manufacturing a electroplating pipe Download PDF

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Publication number
KR101770651B1
KR101770651B1 KR1020160021373A KR20160021373A KR101770651B1 KR 101770651 B1 KR101770651 B1 KR 101770651B1 KR 1020160021373 A KR1020160021373 A KR 1020160021373A KR 20160021373 A KR20160021373 A KR 20160021373A KR 101770651 B1 KR101770651 B1 KR 101770651B1
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South Korea
Prior art keywords
plating
steel pipe
weight
plating layer
parts
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KR1020160021373A
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Korean (ko)
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이효종
김동규
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리녹스 주식회사
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/06—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of tubes or metal hoses; Combined procedures for making tubes, e.g. for making multi-wall tubes
    • B21C37/30—Finishing tubes, e.g. sizing, burnishing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L9/00—Rigid pipes
    • F16L9/02—Rigid pipes of metal

Abstract

The present invention relates to a method of manufacturing a steel pipe and, more specifically, relates to a method of manufacturing a steel pipe in which a plating layer is formed on a steel pipe; mechanical forming is performed thereon to minimize a rate of occurrence of defects on the plating layer; and a dense and uniform fine structure formed to improve corrosion resistance. The method of manufacturing the steel pipe provided with a plating layer comprises: a first step of plating a steel pipe to form a plating layer; a second step of reducing a sectional area of the plated steel pipe through a mechanical process; and a third step of performing heat treatment on the steel pipe. According to the method of manufacturing the steel pipe with another plating layer, it is possible to form a stable plating layer on the steel pipe. In addition, it is possible to prevent a mechanical defect (pinhole, crack, pit, and the like) formed on the plating layer. Additionally, it is possible to improve mechanical properties such as strength, toughness, and corrosion resistance by enhancing the bond between the steel pipe and the plating layer.

Description

도금층이 형성된 강관의 제조방법{Method of Manufacturing a electroplating pipe}BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method for manufacturing a steel pipe having a plated layer,

본 발명은 강관의 제조에 관한 것으로, 더욱 상세하게는 강관에 도금층을 형성 후, 이에 기계적 성형을 실시하여 도금층에 형성되는 결함발생률을 최소화 하고, 치밀하고 균일한 미세조직을 형성하여, 내식성 및 강도가 향상된 강관의 제조방법에 관한 것이다.More particularly, the present invention relates to a method for manufacturing a steel pipe, and more particularly, to a method for manufacturing a steel pipe, which comprises forming a plating layer on a steel pipe and mechanically molding the same to minimize a defect occurrence rate formed in the plating layer and forming a dense and uniform microstructure, To a method of manufacturing an improved steel pipe.

일반적으로 강관은 소재의 특성상 부식에 취약한 문제점이 있었다. 이를 해결하기 위해, 도금을 실시하여 내식성을 향상시키는 방법이 다양하게 제안되어 있으나, 일반적으로 도금을 실시한 강관은, 도금층에 핀홀(pin hole), 크랙(crack), 피트(pit) 등의 기계적 결함이 다수 발생되어, 오히려 내식성이 취약해지는 경우가 빈번하게 발생하고, 상기 도금층이 조대한 주상정 조직으로 성장하여 강도 및 표면의 경도를 낮추는 등의 문제점이 발생되었다.Generally, the steel pipe has a problem in that it is vulnerable to corrosion due to the nature of the material. In order to solve this problem, various methods for improving the corrosion resistance by plating have been proposed. However, in general, a plated steel pipe is subjected to mechanical defects such as pin holes, cracks, pits, And the corrosion resistance is frequently deteriorated, and the plating layer grows into coarse columnar ordered structure to lower the strength and the hardness of the surface.

이와 관련하여, 종래의 기술을 살펴보면, 인발로 알루미늄피복을 일체로 구성한 건축자재 및 그 제조방법이 대한민국 등록특허 제10-1048749호에 개시되고 있으나, 이는 금속재파이프의 부식성을 향상시키기 위해, 알루미늄을 피복을 실시 시, 인발을 실시하고 있으나 상기와 같은 방법으로 금속재파이프의 외부를 피복 시, 완전한 접착이 되지 않아 박리가 일어날 수 있는 문제점이 있다.In this connection, in the related art, a building material and a method of manufacturing the same, wherein an aluminum coating is integrally formed by drawing, are disclosed in Korean Patent No. 10-1048749. However, in order to improve the corrosion resistance of a metal pipe, However, when the outer surface of the metal pipe is coated by the above-described method, there is a problem that peeling may occur due to not being completely bonded.

대한민국 등록특허 제10-1048749호 (2011.07.06)Korean Patent No. 10-1048749 (Jul. 2011)

따라서, 본 발명은 상기한 바와 같은 종래 기술의 문제점을 해결하기 위해 안출된 것으로, 강관의 도금층에 형성되는 기계적 결함(핀홀, 크랙, 피트 등)을 방지할 수 있는 제조방법을 제공하는데 그 목적이 있다.SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a manufacturing method capable of preventing mechanical defects (pinholes, cracks, pits, etc.) formed in a plating layer of a steel pipe have.

또한, 본 발명은 강관과 도금층의 결합을 강화하여 기계적 특성이 우수하지 못한 강관의 강도, 인성, 내식성 등을 향상시키는 방법을 제공하는데 또 다른 목적이 있다.Another object of the present invention is to provide a method for enhancing the strength, toughness, corrosion resistance and the like of a steel pipe having poor mechanical properties by strengthening the bonding between the steel pipe and the plating layer.

본 발명이 해결하고자 하는 과제들은 이상에서 언급한 과제로 제한되지 않으며, 여기에 언급되지 않은 본 발명이 해결하고자 하는 또 다른 과제들은 아래의 기재로부터 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에게 명확하게 이해될 수 있을 것이다.The problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems to be solved by the present invention, which are not mentioned here, As will be appreciated by those skilled in the art.

본 발명에 따른 도금층이 형성된 강관의 제조방법은 강관에 도금을 실시하여 도금층을 형성하는 제 1 단계, 도금된 상기 강관을 기계적 가공을 통해 단면적을 감소시키는 제 2 단계, 가공된 상기 강관을 열처리 하는 제 3 단계를 포함하여 구성된다.A method of manufacturing a steel pipe having a plated layer according to the present invention includes a first step of plating a steel pipe to form a plated layer, a second step of reducing the cross-sectional area of the plated steel pipe through mechanical processing, And a third step.

본 발명에 따른 도금층이 형성된 강관의 제조방법은, 강관에 안정적인 도금층을 형성할 수 있는 효과가 있다.The method of manufacturing a steel pipe with a plating layer according to the present invention has the effect of forming a stable plating layer on a steel pipe.

또한, 도금층에 형성된 기계적 결함(핀홀, 크랙, 피트 등)을 방지할 수 있는 효과가 있다.Further, it is possible to prevent mechanical defects (pinholes, cracks, pits, etc.) formed on the plating layer.

또한, 강관과 도금층의 결합을 강화하여 강관의 강도, 인성 등의 기계적 특성 및 내식성을 향상시킬 수 있는 효과가 있다.In addition, there is an effect that the bonding between the steel pipe and the plating layer is strengthened, thereby improving the mechanical properties such as strength and toughness of the steel pipe and corrosion resistance.

도 1은 본 발명에 따른 도금층이 형성된 강관의 제조방법의 순서도이다.
도 2는 본 발명에 따른 도금층이 형성된 강관의 제조방법 중 제 1 단계를 구체화 한 순서도이다.
도 3은 본 발명에 따라 강관에 도금을 실시한 상태를 나타낸 모식도이다.
도 4는 본 발명에 따라 도금층이 형성된 강관에 인발가공을 통해 성형한 상태를 나타낸 모식도이다.
도 5는 기계적 결함이 형성된 도금층이 본 발명에 따른 도금층이 형성된 강관의 제조방법에 의해 미세하고 균일한 미세조직을 나태내는 형상을 도식화 한 모식도이다.
도 6은 기계적 결함이 형성된 도금층이 본 발명에 따른 도금층이 형성된 강관의 제조방법에 의해 미세하고 균일한 미세조직을 나타내는 것을 SEM(주자 전자 현미경)을 통해 관찰한 것이다.1 is a flowchart of a method of manufacturing a steel pipe having a plating layer according to the present invention.
2 is a flowchart showing a first step of a method of manufacturing a steel pipe having a plating layer according to the present invention.
3 is a schematic view showing a state in which a steel pipe is plated according to the present invention.
Fig. 4 is a schematic view showing a state in which a steel pipe having a plating layer formed according to the present invention is formed through drawing.
FIG. 5 is a schematic diagram showing a shape in which a plating layer on which mechanical defects are formed is formed into a fine and uniform microstructure by a method of manufacturing a steel pipe with a plating layer according to the present invention.
Fig. 6 is a SEM (Scanning Electron Microscope) showing a fine and uniform microstructure of a coating layer on which a mechanical defect has been formed by a method of producing a steel pipe with a plating layer according to the present invention.

이상과 같은 본 발명에 대한 해결하고자 하는 과제, 과제의 해결수단, 발명의 효과를 포함한 구체적인 사항들은 다음에 기재할 실시예 및 도면들에 포함되어 있다. 본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 첨부되는 도면과 함께 상세하게 후술되어 있는 실시예들을 참조하면 명확해질 것이다.The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings.

첨부된 도면을 참조하여 본 발명을 보다 상세히 설명하기로 한다.The present invention will be described in more detail with reference to the accompanying drawings.

본 발명에 따른 도금층이 형성된 강관의 제조방법은, 도 1에 도시된 바와 같이, 강관(10)에 도금을 실시하여 도금층을 형성하는 제 1 단계(S10), 도금된 상기 강관(10)을 기계적 가공을 통해 단면적을 감소시키는 제 2 단계(S20), 가공된 상기 강관(10)을 열처리 하는 제 3 단계(S30)를 포함하여 구성된다.1, a method of manufacturing a steel pipe with a plating layer according to the present invention includes a first step (S10) of forming a plating layer by plating a steel pipe 10, a step A second step (S20) of reducing the cross-sectional area through processing, and a third step (S30) of heat-treating the processed steel pipe (10).

먼저, 상기 제 1 단계(S10)는, 도 3에 도시된 바와 같이, 강관(10)에 도금을 실시하여 도금층(20)을 형성한다.First, in the first step (S10), as shown in FIG. 3, the steel pipe 10 is plated to form a plating layer 20.

구체적으로, 상기 강관(10)은, 탄소강, 합금강 등 강으로 제조된 모든 관이 사용 가능하고, 각형, 원형 모두 사용 가능하다.Specifically, the steel pipe 10 may be any pipe manufactured from steel such as carbon steel or alloy steel, and may be used in both square and circular forms.

상기 강관(10)에 도금을 실시할 때, 하기의 제 2 단계(S20)에서 소성 가공 시, 상기 도금층(20)이 박리되지 않고 안정적인 도금층(20)이 형성되도록 실시하는 것이 바람직하다.It is preferable that a stable plating layer 20 is formed without peeling off the plating layer 20 at the time of plastic working in the second step S20 described below when the steel pipe 10 is plated.

이를 위해, 상기 제 1 단계(S10)에서는, 도 2에 도시된 바와 같이, 스트라이크 도금을 실시하는 제 1-1 단계(S11), 상기 스트라이크 도금 위에 1차 도금을 실시하는 제 1-2 단계(S12), 상기 1차 도금 위에 2차 도금을 실시하는 제 1-3 단계(S13)를 포함하여 구성된다.For this, in the first step (S10), as shown in FIG. 2, a first step (S11) of performing strike plating, a first step (1-2) of performing first plating on the strike plating S12), and a 1-3 step (S13) of performing a secondary plating on the primary plating.

구체적으로, 상기 제 1-1 단계(S11)의 스트라이크 도금은, 상기 강관(10)에 형성된 도금층(20)이 박리되지 않도록 하기 위해 초벌 도금을 실시하는 단계로서, 강관(10)의 산화피막을 환원제거하면서 전착되어 도금의 밀착성을 높일 수 있다. Strike plating in the step 1-1 of the first step is a step of primer plating to prevent the plating layer 20 formed on the steel pipe 10 from being peeled off. It is electrodeposited while reducing and removing, so that the adhesion of the plating can be enhanced.

상기 스트라이크 도금을 실시 시에는, 구리, 금, 은, 니켈 중 어느 하나이상의 금속원소로 실시될 수 있는데, 보다 바람직하게는 니켈(Ni) 스트라이크 도금을 실시한다.The strike plating may be performed with any one or more metal elements selected from among copper, gold, silver, and nickel, and more preferably nickel (Ni) strike plating is performed.

상기 니켈(Ni) 스트라이크 도금을 실시할 때에는, 증류수 1 중량부에 대하여, NiCl2 0.235~0.245 중량부, HCl 0.075~0.085 중량부를 포함하는 전해액을 이용하여, 전류밀도 300~600mA/cm2 에서 10~120초 동안 전착도금을 실시한다.When subjected to the nickel (Ni) strike plating, with respect to distilled water 1 part by weight, NiCl 2 0.235 ~ 0.245 parts by weight, HCl 0.075 ~ using the electrolyte solution containing 0.085 parts by weight, at a current density of 300 ~ 600mA / cm 2 10 ≪ / RTI > for 120 seconds.

다음으로, 상기 제 1-2 단계(S12)의 1차 도금은, 상기 스트라이크 도금 위에 본도금을 실시하는 단계로서, 상기 스트라이크 도금 실시 후, 아연, 크롬, 니켈 중 어느 하나이상의 금속원소로 도금할 수 있다.Next, the first plating of the first step (S12) is a step of performing the main plating on the strike plating, and after the strike plating is performed, plating is performed using any one or more of metal elements of zinc, chromium and nickel .

보다 바람직하게는 니켈(Ni) 도금을 실시하는 것이 유리하다.It is more preferable to perform nickel (Ni) plating.

상기 니켈(Ni) 도금을 실시할 때에는, 증류수 1 중량부에 대하여, Boric acid 0.030~0.032 중량부, Nickel sulfate, 0.185~0.195 중량부, Saccharin 0.0003~0.0005 중량부를 포함하는 전해액을 이용하여, 전류밀도 55~65mA/cm2 에서 25~35분 동안 전착도금을 실시한다.When nickel (Ni) plating is carried out, an electrolytic solution containing 0.030 to 0.032 parts by weight of boric acid, 0.185 to 0.195 parts by weight of nickel sulfate, and 0.0003 to 0.0005 parts by weight of saccharin is added to 1 part by weight of distilled water, Electrodeposition plating is performed at 55 to 65 mA / cm 2 for 25 to 35 minutes.

다음으로, 상기 제 1-3 단계(S13)의 2차 도금은, 상기 1차 도금 위에 실시하는 2차 도금으로서, 필요에 따라, 내식성, 생체적합성 등 원하는 기계적 특성에 맞는 금속재로 도금이 가능하다.Next, the secondary plating in the step 1-3 (S13) is a secondary plating performed on the primary plating and, if necessary, can be plated with a metal material meeting the desired mechanical properties such as corrosion resistance, biocompatibility .

상기 2차 도금은, 구리, 금, 은, 니켈, 크롬, 아연 중 어느 하나 이상의 금속원소로 도금할 수 있고, 보다 바람직하게는 구리(Cu) 도금을 실시하는 것이 바람직하다. It is preferable that the secondary plating is plated with any one or more metal elements of copper, gold, silver, nickel, chromium and zinc, more preferably copper (Cu) plating.

상기 구리(Cu) 도금 시에는, 증류수 1 중량부에 대하여, Copper sulfate(CuSO4) 0.065~0.075 중량부, Sulfuric acid(H2SO4), 0.175~0.185 중량부, HCl 0.00001~0.00010 중량부를 포함하는 전해액을 이용하여, 전류밀도 25~35mA/cm2 에서 25~35분 동안 전착도금을 실시한다.(CuSO 4 ), sulfuric acid (H 2 SO 4 ), 0.175-0.185 parts by weight and 0.00001-0.00010 parts by weight of HCl are added to 1 part by weight of distilled water at the time of copper (Cu) plating. Electrodeposition plating is performed at a current density of 25 to 35 mA / cm 2 for 25 to 35 minutes.

다음으로, 상기 제 2 단계(S20)는, 도금된 상기 강관(10)을 기계적 가공을 통해 단면적을 감소시킨다.Next, in the second step S20, the plated steel pipe 10 is mechanically reduced to reduce the cross-sectional area.

이때, 도금층(20)이 형성된 상기 강관(10)을 도 4에 도시된 바와 같이, 단면감소율 65~75%로 가공하는데, 이는 상기 도금층(20)이 형성하고 있는 조대한 주상정의 미세조직을 깨뜨려 하기의 열처리 과정를 통해 재결정이 용이하게 하고, 상기 도금층(20)에 형성되어 있는 핀홀(pin hole), 피트(pit), 크랙(crack) 등의 기계적 결함을 제거하기 위함이다.At this time, as shown in FIG. 4, the steel pipe 10 in which the plating layer 20 is formed is processed to have a sectional reduction rate of 65 to 75%, which breaks the coarse columnar microstructure formed by the plating layer 20 The recrystallization is facilitated through the following heat treatment process and mechanical defects such as pin holes, pits, and cracks formed in the plating layer 20 are removed.

구체적으로, 상기 가공 시, 인발, 압출, 압연, 필거 가공 중 어느 하나의 방법으로 가공을 실시한다. More specifically, the processing is performed by any one of the methods of drawing, drawing, extruding, rolling, and stamping.

이때, 상기 인발, 압출, 압연 가공을 실시할 때에는, 2~4pass에 걸쳐 단면적 감소율 65~75%로 가공을 실시한다.At this time, when drawing, extruding or rolling, the machining is carried out at a reduction rate of the cross sectional area of 65 to 75% over 2 to 4 pass.

이는, 상기 가공을 실시할 때, 2pass 미만으로 상기 가공을 실시하면, 목표로 한 단면적 감소율을 달성할 수 없어 상기 가공을 통한 기계적 결함 제거 등의 효과를 기대할 수 없거나 무리한 단면적 감소로 인해 강관(10) 및 도금층(20)의 파괴, 크랙 등의 결함이 더 발생할 수 있고, 4pass를 초과하여 가공을 실시하면, 이미 요구하는 가공률을 달성할 수 있어 필요이상의 공정이 시행될 수 있으므로 상기한 조건으로 가공을 실시하는 것이 바람직하다.This is because, when the machining is performed at less than 2 pass, the target sectional area reduction rate can not be achieved, and the effect of removing mechanical defects through the machining can not be expected, or the steel pipe 10 And cracks in the plating layer 20 may occur more frequently. If the machining is performed in excess of 4 pass, the required machining rate can be achieved, and more than necessary processes can be carried out. It is preferable to carry out processing.

또한, 상기 단면적 감소율이 65% 미만이 되면, 상기한 바와 같이, 기계적 결함 제거효과가 미흡하고, 하기의 열처리 단계에서 재결정을 위한 결정립 분쇄효과가 미비해지고, 상기 단면적 감소율이 75%를 초과하게 되면, 이미 충분한 가공효과가 달성되어 불필요한 공정이 시행되므로 상기한 바와 같은 조건으로 가공을 실시하는 것이 바람직하다.If the reduction ratio of the cross-sectional area is less than 65%, as described above, the effect of removing mechanical defects is insufficient and the effect of crushing the crystal grains for recrystallization becomes insufficient in the following heat treatment step. When the cross-sectional area reduction rate exceeds 75% , A sufficient processing effect is already achieved and an unnecessary process is carried out. Therefore, it is preferable to perform the processing under the above-described conditions.

또한, 상기 필거 가공을 실시할 때에는, 1pass에 걸쳐 단면적 감소율 65~75%로 가공을 실시한다. 이는, 상기 필거가공의 특성상 1pass에 높은 단면적 감소율을 달성할 수 있으므로, 상기 필거 가공 시에는 1pass에 목표로한 65~75%의 단면적 감소율을 달성하는 공정이 보다 효율적이다.In addition, when the above-mentioned peeling is carried out, processing is carried out at a reduction rate of a cross-sectional area of 65 to 75% over 1 pass. This is because the high cross-sectional area reduction ratio can be attained in 1 pass due to the characteristics of the above-mentioned filing, and therefore, the process of achieving the sectional area reduction ratio of 65 to 75% aimed at 1 pass at the time of the peeling processing is more efficient.

다음으로, 상기 제 3 단계(S30)는, 가공된 상기 강관(10)을 열처리 한다.Next, the third step (S30) heat-treats the processed steel pipe 10.

구체적으로, 상기 열처리는, 상기 도금층(20)을 형성하는 금속재의 재결정화 온도범위에서 열처리를 실시한다.Specifically, the heat treatment is performed in the range of the recrystallization temperature of the metal material forming the plating layer 20.

상기 열처리를 통해, 도 5 및 도 6에 도시된 바와 같이, 상기 도금층(20) 미세조직이 재결정화 되어 균일하고 미세한 등축정의 조직을 나타내어 강도, 경도, 인성과 같은 기계적 특성이 향상되고, 피트(pit), 핀홀(pin hole), 크랙(crack) 등의 기계적 결함이 소멸되어 내식성이 크게 향상될 수 있다.5 and 6, the microstructure of the plating layer 20 is recrystallized to exhibit uniform and fine equiaxed texture to improve mechanical properties such as strength, hardness and toughness, pit, pin hole, crack, etc. can be eliminated and the corrosion resistance can be greatly improved.

일반적으로, 상기 도금층(20)은 조대한 주상정 조직을 가지고 핀홀(pinhole), 크랙(crack), 피트(pit) 등의 기계적 결함 다수 존재하는 상태이나, 상기 제 1 단계(S10) 내지 상기 제 3 단계(S30)를 통해 형성된 상기 도금층(20)은 균일하고 미세한 등축정의 미세조직을 가지고, 핀홀(pin hole), 크랙(crack), 피트(pit) 등의 기계적 결함이 대부분 사라져 기계적 특성이 매우 우수한 도금층(20)을 형성할 수 있다. 이에 따라 내식성이 크게 향상된 강관(10)을 비교적 저렴한 비용으로 제조가능하다.Generally, the plating layer 20 has a coarse columnar structure and a large number of mechanical defects such as pinholes, cracks, pits, etc., The plating layer 20 formed through the third step S30 has uniform and fine equiaxed microstructure and most of the mechanical defects such as pin holes, cracks, and pits disappear, An excellent plating layer 20 can be formed. Accordingly, the steel pipe 10 with greatly improved corrosion resistance can be manufactured at a relatively low cost.

이와 같이, 상술한 본 발명의 기술적 구성은 본 발명이 속하는 기술분야의 당업자가 본 발명의 그 기술적 사상이나 필수적 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다.As described above, it is to be understood that the technical structure of the present invention can be embodied in other specific forms without departing from the spirit and essential characteristics of the present invention.

그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적인 것이 아닌 것으로서 이해되어야 하고, 본 발명의 범위는 상기 상세한 설명보다는 후술하는 특허청구범위에 의하여 나타나며, 특허청구범위의 의미 및 범위 그리고 그 등가 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.Therefore, it should be understood that the above-described embodiments are to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than the foregoing description, All changes or modifications that come within the scope of the equivalent concept are to be construed as being included within the scope of the present invention.

S10 : 제 1 단계(강관 도금 단계)
S20 : 제 2 단계(강관 가공 단계)
S30 : 제 3 단계(강관 열처리 단계)
S11 : 제 1-1 단계(스트라이크 도금 단계)
S12 : 제 1-2 단계(1차 도금 단계)
S13 : 제 1-3 단계(2차 도금 단계)
10 : 강관 20 : 도금층S10: First step (steel pipe plating step)
S20: Step 2 (steel pipe processing step)
S30: Third step (steel pipe heat treatment step)
S11: Step 1-1 (Strike plating step)
S12: Step 1-2 (primary plating step)
S13: Step 1-3 (secondary plating step)
10: steel pipe 20: plated layer

Claims (9)

강관에 도금을 실시하여 주상정 조직을 가지는 도금층을 형성하는 제 1 단계;
도금된 상기 강관을 기계적 가공을 통해 단면적을 감소시키는 제 2 단계;
가공된 상기 강관을 열처리하여 등축정의 미세조직을 가지는 도금층이 형성되는 제 3 단계;를 포함하고,
상기 제 2 단계에서는,
필거 가공 방법으로 1pass에 걸쳐 강관 전체 단면적에 대해 70%의 감소율로 가공을 실시하고,
상기 제 1 단계에서는,
스트라이크 도금을 실시하는 제 1-1 단계;
상기 스트라이크 도금 위에 1차 도금을 실시하는 제 1-2 단계;
상기 1차 도금 위에 2차 도금을 실시하는 제 1-3 단계;를 포함하고,
상기 제 1-1 단계는, 니켈(Ni) 스트라이크 도금을 실시하고,
상기 제 1-2 단계는, 니켈(Ni) 본도금을 실시하고,
상기 제 1-3 단계는, 구리(Cu) 도금을 실시하는 것을 특징으로 하고,
상기 제 1-1 단계는,
증류수 1 중량부에 대하여, NiCl2 0.240 중량부, HCl 0.080 중량부를 포함하는 전해액을 이용하여, 전류밀도 500mA/cm2 에서 60초 동안 전착도금을 실시하고,
상기 1-2 단계는,
증류수 1 중량부에 대하여, Boric acid 0.031 중량부, Nickel sulfate, 0.190 중량부, Saccharin 0.0004 중량부를 포함하는 전해액을 이용하여, 전류밀도 60mA/cm2 에서 30분 동안 전착도금을 실시하고,
상기 1-3 단계는,
증류수 1 중량부에 대하여, Copper sulfate(CuSO4) 0.070 중량부, Sulfuric acid(H2SO4), 0.180 중량부, HCl 0.00005 중량부를 포함하는 전해액을 이용하여, 전류밀도 30mA/cm2 에서 30분 동안 전착도금을 실시하고,
상기 제 3 단계에서는,
상기 도금층을 형성하는 금속재의 재결정화 온도범위에서 열처리를 실시하는 것을 특징으로 하는 도금층이 형성된 강관의 제조방법.

A first step of plating a steel pipe to form a plated layer having a main phase structure;
A second step of reducing the cross-sectional area of the plated steel pipe through mechanical processing;
And a third step of heat treating the processed steel pipe to form a plating layer having an equiaxed microstructure,
In the second step,
The processing was performed at a reduction ratio of 70% with respect to the entire cross-sectional area of the steel pipe over 1 pass by the pilling method,
In the first step,
A first step of performing strike plating;
A first step of performing first plating on the strike plating;
And a third step of performing second plating on the first plating,
In the step 1-1, nickel (Ni) strike plating is performed,
In the step 1-2, nickel (Ni)
In the step 1-3, copper (Cu) plating is performed,
In the step 1-1,
Electrodeposition plating was performed for 60 seconds at an electric current density of 500 mA / cm 2 using an electrolytic solution containing 0.240 parts by weight of NiCl 2 and 0.080 parts by weight of HCl per 1 part by weight of distilled water,
In the 1-2 step,
Electrodeposition plating was performed for 30 minutes at an electric current density of 60 mA / cm 2 using an electrolytic solution containing 0.031 parts by weight of boric acid, 0.190 parts by weight of nickel sulfate, and 0.0004 parts by weight of saccharin per 1 part by weight of distilled water,
In the step 1-3,
The electrolytic solution containing 0.070 parts by weight of copper sulfate (CuSO 4 ), 0.180 parts by weight of sulfuric acid (H 2 SO 4 ), and 0.00005 parts by weight of HCl was added to 1 part by weight of distilled water at a current density of 30 mA / cm 2 for 30 minutes Lt; RTI ID = 0.0 > electroplated <
In the third step,
Wherein the heat treatment is performed in a range of a recrystallization temperature of the metal material forming the plating layer.

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102067080B1 (en) * 2018-11-30 2020-01-16 리녹스 주식회사 Steel pipe manufacturing method using pullout molding

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004323945A (en) * 2003-04-25 2004-11-18 Olympus Corp Die for injection molding, plating method, and plating tool
JP2010530928A (en) * 2007-06-22 2010-09-16 マクダーミッド インコーポレーテッド Acid copper electroplating bath composition
KR101342116B1 (en) * 2012-07-04 2013-12-18 고려제강 주식회사 Steel wire for spring with ni-cu plating and method for manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004323945A (en) * 2003-04-25 2004-11-18 Olympus Corp Die for injection molding, plating method, and plating tool
JP2010530928A (en) * 2007-06-22 2010-09-16 マクダーミッド インコーポレーテッド Acid copper electroplating bath composition
KR101342116B1 (en) * 2012-07-04 2013-12-18 고려제강 주식회사 Steel wire for spring with ni-cu plating and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102067080B1 (en) * 2018-11-30 2020-01-16 리녹스 주식회사 Steel pipe manufacturing method using pullout molding

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GRNT Written decision to grant
R401 Registration of restoration