JP2004319625A - Method and apparatus for developing treatment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make the pattern dimension of a line width uniform, and to reduce the amount of the consumption of a developing solution. <P>SOLUTION: A wafer W and a liquid film forming planar plate 20 are made opposite to each other in parallel with a predetermined gap 30 (liquid film forming region), and a developing solution is supplied into the gap from a plurality of small holes 41 while moving a tubular nozzle 40 having the small holes 41 at least formed along an axial direction from one end side of the gap 30 to the other side thereof, thereby filling the developing solution D in the gap 30 to form a liquid film of the developing solution D on the surface of the wafer W to perform developing treatment. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a developing method and a developing apparatus for developing a surface of a substrate by supplying a developing solution to a substrate such as a semiconductor wafer, a glass substrate for an FPD (flat panel display) or a photomask substrate (reticle). is there.
[0002]
[Prior art]
In general, in a semiconductor device manufacturing process, for example, a resist solution is applied to a surface of a semiconductor wafer or a glass substrate for FPD (hereinafter, referred to as a wafer, etc.), and a circuit pattern is reduced by using an exposure apparatus such as a stepper to reduce the resist. A photolithography technique is used in which a film is exposed and a developing solution is applied (supplied) to the exposed wafer surface to perform a developing process.
[0003]
In the development processing step, a spray method of spraying a developing solution onto a resist on a surface of a wafer or the like and a paddle method of applying a developing solution on a surface of a wafer or the like are generally known. As another method, a pair of wafers or the like to be developed are opposed to each other with a predetermined gap, and the gap is filled with a developing solution by using a capillary phenomenon, and a liquid film of the developing solution is formed on the surface of the wafer or the like. Is also known (for example, see Patent Document 1).
[0004]
[Patent Document 1]
JP-A-6-244097 (Claims, paragraph number 0011, FIG. 3)
[0005]
[Problems to be solved by the invention]
However, the spray method consumes a large amount of the developing solution, and it is difficult to spray (supply) the developing solution uniformly on the surface of a wafer or the like. Therefore, there is a problem that pattern dimensions such as a line width become non-uniform. Was.
[0006]
The paddle method does not cause a problem such as spray development, but since the liquid film surface of the developer is an open free surface, the liquid surface is wavy, and accordingly, the resist contact surface ( The reaction surface also moves, resulting in a problem that pattern dimensions such as line width become non-uniform. Further, even in the paddle system, there is a problem that it is difficult to uniformly and uniformly pour the developer on the surface of the wafer or the like.
[0007]
On the other hand, in the developing method described in JP-A-6-244097, the consumption of the developing solution can be reduced as compared with the spray method and the paddle method. There is a problem that the pattern size such as the line width becomes non-uniform because the developer supplied to the surface of the substrate flows.
[0008]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a developing method and a developing apparatus capable of achieving uniform pattern dimensions such as line width and reducing the consumption of a developing solution. It is assumed that.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, a development processing method of the present invention has a plurality of small holes extending at least along an axial direction by facing a substrate to be processed and a flat plate for forming a liquid film with a predetermined gap in parallel with each other. The developer is supplied into the gap from the small hole while moving the tubular developer supply nozzle from one end of the gap to the other end, thereby filling the gap with the developer and covering the gap. A liquid film of a developing solution is formed on the surface of the processing substrate (claim 1).
[0010]
In the developing method of the present invention, the developer supply nozzle may have any form as long as it has a tubular shape having at least a plurality of small holes along the axial direction. Alternatively, a plurality of small holes may be formed in a plurality of rows at appropriate intervals. In this case, the developer may be supplied to the developer supply nozzle at one end of the tubular member, but is preferably supplied from both ends. When the developer is supplied from both ends of the tubular member in this manner, when the small holes are formed at equal intervals, the opening area of the small holes is gradually increased from the end to the center. Is more preferred. Further, when the opening areas of the small holes are the same, it is better to gradually reduce the distance from the end to the center. Further, the developer supply nozzle can be formed of a porous tubular member having a large number of small holes all around.
[0011]
In the developing method of the present invention, the developing solution may be supplied from small holes of each of the developing solution supply nozzles while a plurality of the developer supply nozzles are moved into the gap at intervals. Item 2).
[0012]
Further, a turbulence of the supplied developer may be suppressed by a blade piece protruding rearward in the moving direction of the developer supply nozzle. The shape of the wing piece may be arbitrary, but it is preferable that the wing piece has a tapered shape narrowing toward the tip. It is also possible to use two developer supply nozzles having wings protruding therefrom. In this case, two developer supply nozzles projecting the wing pieces are arranged side by side at intervals in a direction intersecting the moving direction, and the developer is supplied from the small holes of each developer supply nozzle while moving in the gap. It is better to supply (claim 4).
[0013]
Further, the developer supply nozzle may be rotated in the circumferential direction of the nozzle while moving. In this case, the rotation direction of the nozzle may be arbitrary, but it is preferable to rotate the nozzle toward the substrate to be processed.
[0014]
Further, a substrate to be processed may be used as the liquid film forming flat plate.
[0015]
Further, a development processing apparatus according to the present invention embodies the development processing method according to claim 1, wherein a mounting table on which a substrate to be processed is mounted is disposed opposite to the mounting table. A liquid film forming flat plate that forms a predetermined gap between the substrate to be processed mounted on the mounting table, a tubular developer supply nozzle having at least a plurality of small holes extending in the axial direction, and the developer supply nozzle Nozzle moving means for moving the gap from one side end to the other side end of the gap (claim 7).
[0016]
In the development processing apparatus of the present invention, as described above, the developer supply nozzle may have any form as long as it has a tubular shape having at least a plurality of small holes along the axial direction. A plurality of small holes may be formed in one or more rows along the axial direction at appropriate intervals. In this case, the developer may be supplied to the developer supply nozzle at one end of the tubular member, but is preferably supplied from both ends. When the developer is supplied from both ends of the tubular member in this manner, when the small holes are formed at equal intervals, the opening area of the small holes is gradually increased from the end to the center. Is more preferred. Further, when the opening areas of the small holes are the same, it is better to gradually reduce the distance from the end to the center. Further, the developer supply nozzle can be formed of a porous tubular member having a large number of small holes all around.
[0017]
Further, in the developing apparatus according to the present invention, the developing solution supply nozzle may be formed by a plurality of nozzles which move in the gap at intervals.
[0018]
Further, the developer supply nozzle may be provided with a blade piece protruding rearward in the moving direction of the nozzle. In this case, the shape of the wing piece may be arbitrary, but it is preferable that the wing piece has a tapered shape narrowing toward the tip. It is also possible to use two developer supply nozzles having wings protruding therefrom. In this case, two developer supply nozzles projecting the wing pieces are arranged side by side at intervals in a direction intersecting the moving direction, and the developer is supplied from the small holes of each developer supply nozzle while moving in the gap. It is better to supply (claim 10).
[0019]
Further, the developer supply nozzle may be formed so as to be movable and rotatable in the same direction. In this case, the rotation direction of the nozzle may be arbitrary, but it is preferable to rotate the nozzle toward the substrate to be processed.
[0020]
Further, a substrate to be processed may be used in place of the liquid film forming flat plate.
[0021]
According to the first and seventh aspects of the present invention, the substrate to be processed and the flat plate for forming a liquid film are opposed to each other with a predetermined gap in parallel with each other, so that the liquid of the developer supplied to the surface of the substrate to be processed is provided. A region for forming a film can be secured. Then, while moving the tubular developer supply nozzle having a plurality of small holes along at least the axial direction from one side end of the gap (liquid film forming region) to the other side end, the developer is supplied from the small hole into the gap. By supplying the developer, from the start to the end of the development, the movement of the developer is kept extremely static, and a liquid film of the developer is formed on the surface of the substrate to be processed while the gap is filled with the developer. To develop. Therefore, the pattern dimensions such as the line width can be made uniform by making the plane uniform. Further, since the liquid film of the developing solution can be formed uniformly without being affected by the hydrophobicity of the resist, the uniformity of the pattern dimensions such as the line width can be improved. Further, the amount of the developing solution is sufficient for a thin gap (liquid film forming region) set at a predetermined interval, so that the amount of the developing solution can be reduced.
[0022]
According to the second and eighth aspects of the present invention, the developer is supplied from the small holes of each developer supply nozzle while moving the plurality of developer supply nozzles into the gap at intervals. A plurality of nozzles can be moved while supplying (discharging) the developing solution as slowly as possible from the small holes, so that the movement of the developing solution during development is kept more static and the uniformity of the pattern such as line width is improved. Can be achieved. Further, since a plurality of nozzles are simultaneously moved, the development processing speed can be increased.
[0023]
According to the third and ninth aspects of the present invention, the developing solution being developed is suppressed by suppressing the turbulent flow of the supplied developing solution by the blade piece projecting rearward in the moving direction of the developing solution supply nozzle. Can be kept more static, so that the uniformity of the pattern such as the line width can be further improved.
[0024]
According to the fourth and tenth aspects of the present invention, two developer supply nozzles projecting from the blades are arranged side by side in the direction intersecting the moving direction at intervals, and each developer is moved while moving in the gap. By supplying the developing solution from the small hole of the supply nozzle, air is released from the space provided between both nozzles, and the movement of the developing solution on both sides of the substrate to be processed and the liquid film forming flat plate side is evenly balanced. Therefore, the uniformity of the pattern such as the line width can be further improved.
[0025]
According to the fifth and eleventh aspects of the invention, by rotating the developer supply nozzle in the circumferential direction of the nozzle while moving, the influence of the passage of the developer supply nozzle, that is, the cavity of the developer immediately after the nozzle has passed Since the influence of the portion can be suppressed, it is possible to further improve the uniformity of the pattern such as the line width in addition to the first and second aspects of the invention.
[0026]
According to the sixth and twelfth aspects of the present invention, by using a substrate to be processed as a flat plate for forming a liquid film, development processing of two substrates can be performed simultaneously in one step. In addition to the fifth aspect, the processing efficiency can be further improved.
[0027]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In this embodiment, a case will be described in which a developing apparatus according to the present invention is applied to a developing process of a semiconductor wafer (hereinafter, referred to as a wafer).
[0028]
◎ First embodiment
FIG. 1 is a schematic plan view showing an example of a developing apparatus according to the present invention, FIG. 2 is a schematic side view of the developing apparatus, and FIG. 3 is a schematic plan view showing another embodiment of a mounting table according to the present invention ( a) and a schematic side view (b), FIG. 4 is an enlarged sectional view of a main part showing a developing process of a first embodiment of the developing method of the present invention, and FIG. 5 is a developing solution supply nozzle of the first embodiment. It is principal part sectional drawing which shows an example.
[0029]
The developing apparatus includes a mounting table 10 on which a wafer W to be processed is mounted, and which holds the wafer W by suction by a vacuum apparatus V shown in FIG. 3, and a liquid film disposed above the mounting table 10. And a forming flat plate 20. The mounting table 10 may have any size as long as the mounting table 10 can be kept horizontal. For example, it may be approximately the same size as the wafer W, or may be smaller than the wafer W in order to reduce the contact area. Alternatively, as shown in FIG. 3, the mounting portion 10b may have a shape extending in three radial directions. In FIG. 3, reference numeral 10a is a suction hole. In this case, the wafer W mounted on the mounting table 10 and the flat plate 20 for forming a liquid film are disposed to face each other in parallel with a predetermined gap 30 therebetween. A film formation region is formed. The size of the gap 30 (liquid film forming region) varies depending on the type of the developing solution, the thickness of the liquid film to be formed, and the like, but is set to about 2 to 5 mm. This interval may be any size as long as it can pass the developing nozzle 40 described later.
[0030]
The mounting table 10 is provided with three support pins 11 for transferring the wafer W to and from a wafer transfer arm (not shown) so as to be able to move up and down. These support pins 11 slidably penetrate through holes (not shown) provided in the mounting table 10, as shown in FIGS. 1 and 2, or as shown in FIG. It is provided beside the table 10. The lower ends of the support pins 11 protruding downward from the mounting table 10 are erected on the support member 12, and each of the support pins 11 is mounted on the mounting table 10 by an elevating means such as an elevating cylinder 13 connected to the support member 12. It is formed so that it can appear and disappear on the mounting surface. The liquid film forming flat plate 20 is connected to an elevating mechanism 21 composed of, for example, a ball screw. The elevating mechanism 21 is driven to move forward and backward with respect to the mounting table 10. Is adjusted. In this case, the lifting mechanism 21 and the liquid film forming flat plate 20 may be rotatably connected.
[0031]
Further, the development processing apparatus includes a tubular developer supply nozzle 40 having at least a plurality of small holes 41 extending along the axial direction (hereinafter, referred to as a development nozzle 40). The developing nozzle 40 is movably mounted on a pair of guide rails 50 provided on both sides of the mounting table 10 and is connected to a moving / elevating mechanism 60 (moving / elevating means) serving as a nozzle moving means. The gap 30 (liquid film forming region) is formed so as to be vertically movable and horizontally movable so as to move from one end to the other end of the gap 30 (liquid film forming region).
[0032]
In this case, as shown in FIG. 4, the developing nozzle 40 is, for example, along the axial direction of a tubular member 42 of, for example, stainless steel or epoxy resin having an outer diameter of about 1 to 4 mm and an inner diameter of about 0.5 to 3.5 mm. A plurality of small holes 41 formed at intervals are provided. A developer storage tank 44 as a developer supply source is connected to both ends of a hollow portion 42 a of the tubular member 42 via a supply pipe 43. I have. A part of the supply pipe 43 is formed of a tube having a length that allows the moving range of the developing nozzle 40. Further, an opening / closing means such as an air operation valve 45 and a pressure feeding means such as a pump 46 which can adjust the flow rate of the developer are provided in the supply pipe 43. The opening area of the small hole 41 is gradually increased from the end of the tubular member 42 toward the center. By gradually increasing the opening area of the small hole 41 from the end to the center of the tubular member 42 in this manner, the developer supplied into the hollow portion 42a of the tubular member 42 from both end sides can be reduced. It is possible to uniformly discharge (supply) from the holes 41. The opening diameter and interval of the small holes 41 are appropriately set according to the size of the wafer W, the type of the developing solution, and the like.
[0033]
Here, a case has been described in which a plurality of small holes 41 are provided at equal intervals, and the opening area of the small holes 41 is gradually increased from the end side of the tubular member 42 toward the center side. The opening area may be the same, and the interval may be gradually reduced from the end to the center of the tubular member 42. Further, the small holes 41 may be provided in a plurality of rows of the tubular member 42, for example, as shown in FIG. 7, in two rows on the lower end side and the upper end side of the tubular member 42, or may be provided in an arbitrary plurality of rows. It may be provided. As shown in FIG. 8, the developing nozzle 40A may be formed of a porous tubular member 42A having a large number of small holes 41 all around. As described above, by forming the developing nozzle 40A with the porous tubular member 42A having a large number of small holes 41 on the entire circumference, the developer can be uniformly discharged (supplied) from the entire circumference of the developing nozzle 40. it can. In these cases, the pressure of the developer may be adjusted by the pump 46.
[0034]
The guide rail 50 has a first rinsing nozzle 71, a developing solution suction nozzle 73, and a second rinsing nozzle 72 formed in a tubular shape similarly to the developing nozzle 40, in addition to the developing nozzle 40. And a drying nozzle 74 are mounted slidably and vertically. In this case, similarly to the developing nozzle 40, the first and second rinse nozzles 71 and 72 are provided with a plurality of nozzle holes (not shown) along the axial direction of the tubular member. Each of the developer suction nozzle 73 and the drying nozzle 74 is provided with a slit-shaped suction hole extending along the axial direction of the tubular member, and a drying gas (eg, air) injection hole (not shown). The first rinsing nozzle 71, the developing solution suction nozzle 73, the second rinsing nozzle 72, and the drying nozzle 74 are also connected to the moving / elevating mechanism 60 so as to be vertically movably movable. The gap 30 is formed so as to be movable in a horizontal direction so as to move from one side end to the other side end. A nozzle cleaning bath 75 is provided at a standby position (home position) of the nozzles 40, 71 to 74. The rinsing nozzles 71 and 72, the developer suction nozzle 73, and the drying nozzle 74 may have different diameters, and the gaps 30 during use may be different.
[0035]
Next, the developing method of the present invention will be described with reference to FIGS. First, when a wafer transfer arm (not shown) holds the wafer W and enters the developing device, the support pins 11 move up to receive the wafer W. The wafer transfer arm that has delivered the wafer W retreats from the inside of the developing device. When the support pins 11 that have received the wafer W are lowered and the wafer W is mounted on the mounting table 10, the vacuum apparatus V is driven to hold the wafer W by suction. Thereafter, the liquid film forming flat plate 20 is moved (elevated) vertically by the elevating mechanism 21 to correspond to the film thickness of the developing solution formed on the surface of the wafer W mounted on the mounting table 10 (liquid accumulation). The gap 30 (liquid film formation region) is set by adjusting the distance so as to be the same as the distance. In this state, as shown in FIGS. 4 and 6A and 6B, the developing nozzle 40 is moved from one end of the gap 30 (the liquid film forming area) to the other end while moving the small nozzle. When the developer D is discharged (supplied) from the space 41 into the gap 30 (liquid film forming area), the developer D is filled in the gap 30 (liquid film forming area) and the liquid film of the developer D is formed on the surface of the wafer W. Is formed. At this time, the moving speed of the developing nozzle 40 is, for example, 50 to 150 mm / sec, and the discharge amount (supply amount) of the developing solution is, for example, 5 to 50 ml / sec.
[0036]
Accordingly, the movement of the developing solution D during the development is kept extremely static from the start to the end of the developing process, and the developing solution D is filled on the surface of the wafer W in a state in which the gap 30 (liquid film forming region) is filled with the developing solution D. A liquid film of D can be formed. Thereby, the liquid film of the developer D can be formed uniformly without being affected by the hydrophobicity of the resist R. In addition, since only the developer corresponding to the thin gap 30 (the liquid film forming region) is sufficient, the consumption of the developer can be reduced.
[0037]
In the above description, the development process by moving the development nozzle 40 has been described. However, after the development nozzle 40 is moved from one end to the other end of the gap 30 (liquid film formation region), a predetermined While moving the first rinsing nozzle 71 similarly after a certain time, a rinsing liquid, for example, pure water is discharged (supplied) from a rinsing liquid supply source (not shown) to stop the dissolution reaction between the developing liquid and the resist. While moving the suction nozzle 73 in the same manner, the dissolution product generated by reacting with the developing solution by the suction action of the suction means (not shown) is sucked. Thereafter, a rinsing liquid, for example, pure water is discharged (supplied) from a rinsing liquid supply source (not shown) while moving the second rinsing nozzle 72 in the same manner, and a rinsing process is performed. Finally, while moving the drying nozzle 74 in the same manner, a dry gas (not shown), for example, a dry gas is blown from a supply source of purified air to blow off a rinse liquid adhering to the wafer W to dry. The rinsing process and the drying process may be performed by reciprocating the second rinsing nozzle 72 and the drying nozzle 74 respectively.
[0038]
After performing the developing, rinsing, and drying processes as described above, the developing nozzle 40, the first rinsing nozzle 71, the developer suction nozzle 73, the second rinsing nozzle 72, and the drying nozzle 74 return to the home position. . Thereafter, the suction state of the mounting table 10 is released, the support pins 11 are raised, and the wafer W is delivered to the wafer transfer arm (not shown) which enters the developing device, and the wafer W is unloaded. Thereafter, the same operation as described above is repeated to perform the development processing on the wafer W.
[0039]
◎ Second embodiment
FIG. 9 is an enlarged sectional view of a main part showing a development processing state of the second embodiment of the development processing method of the present invention.
[0040]
In the second embodiment, the plurality of developing nozzles 40, for example, two, are moved into the gap 30 (liquid film forming region) at intervals L in the moving direction of the developing nozzle 40, and the small holes 41 of each developing nozzle 40 are moved. This is a case in which the developer D is supplied from.
[0041]
As described above, the developer D is supplied from the small holes 41 of each of the developing nozzles 40 while the plurality of, for example, two developing nozzles 40 are moved into the gap 30 (liquid film forming region) at intervals L in the moving direction. Accordingly, the developing solution is discharged (supplied) from the small holes 41 of each developing nozzle 40 as slowly as possible in comparison with the case where the developing solution is discharged (supplied) from the small holes 41 of the single developing nozzle 40 as in the first embodiment. The two developing nozzles 40 can be moved while moving. Therefore, the movement of the developing solution D during the development can be kept more static, and the uniformity of the pattern such as the line width can be improved. Further, since the plurality of developing nozzles 40 are simultaneously moved, the developing processing speed can be increased.
[0042]
In the second embodiment, the developing nozzle 40 may be replaced with a porous developing nozzle 40A. In the second embodiment, the other parts are the same as those in the first embodiment.
[0043]
◎ Third embodiment
FIG. 10 is an enlarged sectional view of a main part showing a developing process of a third embodiment of the developing method of the present invention (a) and a perspective view (b) showing a developing nozzle 40B in the third embodiment.
[0044]
In the third embodiment, a wing 80 is provided on the rear side in the movement direction of the developing nozzle 40B to suppress the turbulent flow of the developer D discharged (supplied) from the small hole 41 of the developing nozzle 40B. In this case, the movement of the developing solution during development is kept more static. In this case, the blade piece 80 is formed integrally with the tubular member 42B of the developing nozzle 40B, and has a tapered surface 81 that is narrower toward the tip (rear side in the moving direction).
[0045]
When the developing nozzle 40B formed as described above is moved from one end side to the other end side of the gap 30 (liquid film forming region) in the same manner as in the first embodiment to perform the developing process, the leading end (movement) Wing 80 having a tapered surface 81 narrowing toward the rear (in the rearward direction), the turbulent flow of the developer D can be rectified and suppressed, and the movement of the developer D during development is kept more static. Therefore, the uniformity of the pattern such as the line width can be further improved.
[0046]
In the third embodiment, the other parts are the same as those of the first embodiment.
[0047]
◎ Fourth embodiment
FIG. 11 is an enlarged sectional view of a main part showing a developing process according to a fourth embodiment of the developing method of the present invention.
[0048]
In the fourth embodiment, two developing nozzles 40C each having a wing piece 80A projecting therefrom are arranged side by side at an interval L1 in a direction intersecting with the moving direction, and the other developing nozzles are arranged from one end side of the gap 30 (liquid film forming region). The developer is discharged (supplied) from the small holes 41 of the respective developing nozzles 40C while moving toward the end side to fill the gap 30 (liquid film forming region) with the developer to form a liquid film on the surface of the wafer W. This is the case. In the fourth embodiment, the wing 80A of each developing nozzle 40C is formed integrally with the tubular member 42C, and extends horizontally from the lower end or upper end of the tubular member 42C to the rear in the moving direction. It is formed in a substantially triangular cross section having an inclined surface 83 connecting an upper end or a lower end and a tip of a horizontal plane 82.
[0049]
In this manner, two developing nozzles 40C projecting the wing pieces 80A are arranged in parallel in the direction intersecting with the moving direction at an interval L1, and from one end side of the gap 30 (liquid film forming area) to the other end side. By discharging (supplying) the developing solution from the small holes 41 of each developing nozzle 40C while moving toward the side, the air A escapes from the interval L1 provided between the developing nozzles 40C, and the wafer W side and the liquid film formation are performed. The movement of the developer D on both sides of the flat plate 20 can be balanced evenly. Therefore, the uniformity of the pattern such as the line width can be further improved.
[0050]
In the fourth embodiment, the other parts are the same as those of the first embodiment.
[0051]
◎ Fifth embodiment
FIG. 12 is an enlarged sectional view of a main part showing a developing process according to a fifth embodiment of the developing method of the present invention.
[0052]
The fifth embodiment is a case where the developing nozzle 40D is rotated in the circumferential direction of the developing nozzle 40D while moving. In this case, it is preferable that the developing nozzle 40D is provided with a plurality of small holes 41 in a plurality of rows along the axial direction, for example, three or more rows. Further, it is preferable that the rotation direction of the developing nozzle 40D is set toward the wafer W. The reason is that the developing solution discharged (supplied) from the small holes 41 with the rotation of the developing nozzle 40D can be positively supplied to the wafer W. In this way, by rotating the developing nozzle 40 in the circumferential direction (rotating toward the wafer W) while moving the developing nozzle 40, the developing solution discharged (supplied) from the small holes 41 of the developing nozzle 40D is moved to the surface of the wafer W. To form a liquid film. Further, since the influence of the passage of the developing nozzle 40D, that is, the influence of the cavity of the developer D immediately after the passage of the developing nozzle 40D can be suppressed, the uniformity of the pattern such as the line width can be further improved. it can.
[0053]
In the fifth embodiment, a porous developing nozzle A may be used instead of the developing nozzle 40D. In the fifth embodiment, the other parts are the same as those in the first embodiment.
[0054]
◎ Sixth embodiment
FIG. 13 is an enlarged sectional view of a main part showing a sixth embodiment of the development processing method of the present invention.
[0055]
The sixth embodiment is a case where two wafers W can be developed simultaneously in one process. That is, a gap 30 (liquid film formation area) is formed by using the wafer W instead of the liquid film formation flat plate 20 to face the two wafers W in parallel to each other, and forming the gap 30 (liquid film formation area). The developing solution is discharged (supplied) from the small hole 41 while moving the developing nozzle, for example, the developing nozzle 40C of the fourth embodiment, from one end side to the other end side of the gap) (the liquid film forming region). This is a case where the developer D is filled to form a liquid film on the surfaces of both wafers W.
[0056]
Therefore, according to the sixth embodiment, the development processing of two wafers W can be performed simultaneously in one step, so that the processing efficiency can be further improved. In this case, two developing nozzles 40C projecting the wing pieces 80A are arranged side by side at an interval L1 in a direction intersecting with the moving direction, and from one end side of the gap 30 (liquid film forming region) to the other end side. By discharging (supplying) the developing solution from the small holes 41 of each developing nozzle 40C while moving the developing nozzle 40C, the air A escapes from the space L1 provided between the developing nozzles 40C, and the wafer W side and the liquid film forming Since the movement of the developer D on both sides of the flat plate 20 can be evenly balanced, the uniformity of the pattern such as the line width can be further improved.
[0057]
In the above description, a case has been described where two developing nozzles 40C projecting the wing pieces 80A are arranged side by side at an interval L1 in a direction intersecting the moving direction, but the other developing nozzles 40, 40A, and 40B are arranged in parallel. May be used. Further, in the sixth embodiment, the other parts are the same as those of the first embodiment.
[0058]
◎ Other embodiments
(1) In the above embodiment, the case where the mounting table 10 is fixed and does not rotate has been described. However, the mounting table 10 is connected to the rotation shaft of the motor M as shown by a two-dot chain line in FIG. The mounting table 10 and the wafer W may be rotated in the horizontal direction simultaneously with the movement of the developing nozzles 40, 40A, 40B, 40C, and 40D. When the rotation is used in this manner, preferably, when the developing nozzles 40 and 40A to 40D are moved from one end of the gap 30 to the other end to discharge (supply) the developer, the developing nozzle 40, 40A to 40D is mounted. It is preferable to rotate the mounting table 10 and the wafer W during the subsequent cleaning processing and drying processing without rotating the mounting table 10 and the wafer W. For example, as shown in FIG. 14, after performing the developing / coating process without rotating the mounting table 10 and the wafer W, the liquid film forming flat plate 20 is moved and raised to a height where the cleaning nozzle (rinse nozzle) 72A enters. (FIG. 14A). Next, after lowering the liquid film forming flat plate 20 to secure the gap 30 through which the rinse nozzle 72A moves, the rinse nozzle 72A is moved from one side end of the gap 30 to the center to discharge the rinse liquid, for example, pure water. At the same time as (supply), the mounting table 10 and the wafer W are rotated (see FIGS. 14B and 14C). Thereafter, the discharge (supply) of the pure water from the rinsing nozzle 72A is stopped, and after or at the same time as the rinsing nozzle 72A returns to the home position, the mounting table 10 and the wafer W are rotated at a high speed, and The attached pure water is shaken off and dried (FIG. 14D).
[0059]
(2) In the above embodiment, the case where the substrate to be processed is the wafer W has been described. However, it goes without saying that development processing can be similarly performed on other substrates such as a glass substrate for FPD and a mask substrate (reticle). When developing a square plate to be processed such as a glass substrate for FPD or a mask substrate, for example, a mask substrate (reticle) RE, as shown in FIG. It is necessary to perform processing using a rectangular (square) liquid film forming flat plate 20A and a rectangular (square) mounting table 10A. Further, by using the liquid film forming flat plate 20A and the mounting table 10A, development processing can be performed regardless of the shape of the substrate to be processed.
[0060]
【The invention's effect】
As described above, according to the present invention, since the configuration is as described above, the following effects can be obtained.
[0061]
1) According to the first and seventh aspects of the present invention, one side end to the other side end of a gap (liquid film forming region) formed by a substrate to be processed and a flat plate for forming a liquid film, which are disposed to face each other in parallel. By moving the developing solution supply nozzle having a plurality of small holes along the axial direction toward the direction, supplying the developing solution from the small holes into the gap, the movement of the developing solution during the development from the start to the end of the development, The developing solution can be formed by forming a liquid film of the developing solution on the surface of the substrate to be processed in a state where the gap is filled with the developing solution while being kept extremely static. Therefore, the in-plane uniformity can be achieved without being affected by the hydrophobicity of the resist, and the uniformity of pattern dimensions such as line width can be improved. Further, since the amount of the developer used is only the amount of the thin gap (liquid film forming region) set at a predetermined interval, the amount of the developer can be reduced.
[0062]
2) According to the second and eighth aspects of the present invention, the developer is supplied from the small holes of each developer supply nozzle while moving the plurality of developer supply nozzles into the gap at intervals. Since the plurality of nozzles can be moved while supplying (discharging) the developing solution as slowly as possible from the small holes of the nozzles, the movement of the developing solution during development can be further statically maintained in addition to the above 1). The uniformity of the pattern such as the width can be improved. Further, since a plurality of nozzles are simultaneously moved, the development processing speed can be increased.
[0063]
3) According to the third and ninth aspects of the invention, the turbulence of the supplied developing solution is suppressed by the wing pieces projecting rearward in the moving direction of the developing solution supply nozzle, so that the developing solution is not developed. Since the movement of the developer can be kept more static, the uniformity of the pattern such as the line width can be further improved in addition to the above 1).
[0064]
4) According to the fourth and tenth aspects of the present invention, two developer supply nozzles projecting from the wing pieces are arranged side by side in the direction intersecting with the moving direction and are arranged side by side. By supplying the developing solution from the small hole of the developing solution supply nozzle, air is released from the space provided between the nozzles, and the movement of the developing solution on both sides of the substrate to be processed and the liquid film forming flat plate side is equalized. Therefore, in addition to the above 1) and 3), the uniformity of the pattern such as the line width can be further improved.
[0065]
5) According to the fifth and eleventh aspects, the developer supply nozzle is rotated in the circumferential direction of the nozzle while moving, so that the developer supply nozzle passes through, that is, the developer immediately after the nozzle passes. In this case, the influence of the hollow portion can be suppressed, and in addition to the above 1), the uniformity of the pattern such as the line width can be further improved.
[0066]
6) According to the sixth and twelfth aspects of the present invention, the development processing of two substrates can be simultaneously performed in one step by using the substrate to be used for the liquid film forming flat plate, so that further processing can be performed. Efficiency can be improved.
[Brief description of the drawings]
FIG. 1 is a schematic plan view showing an example of a developing apparatus according to the present invention.
FIG. 2 is a schematic side view of the developing device.
FIG. 3 is a schematic plan view (a) and a schematic side view (b) showing another embodiment of the mounting table according to the present invention.
FIG. 4 is an enlarged sectional view of a main part showing a developing process of the first embodiment of the developing method of the present invention.
FIG. 5 is a schematic sectional view showing a developing nozzle of the first embodiment.
FIG. 6 is a schematic perspective view illustrating a developing process according to the first embodiment.
FIG. 7 is an enlarged sectional view of a main part showing a developing process of another embodiment of the developing nozzle of the first embodiment.
FIGS. 8A and 8B are an enlarged sectional view of a main part and a perspective view of a developing nozzle of a developing nozzle according to another embodiment of the first embodiment, showing a developing process of another embodiment.
FIG. 9 is an enlarged sectional view of a main part showing a developing process according to a second embodiment of the developing method of the present invention.
FIGS. 10A and 10B are an enlarged sectional view of a main part showing a developing process of a third embodiment of the developing method of the present invention, and a perspective view of a developing nozzle thereof.
FIG. 11 is an enlarged sectional view of a main part showing a developing process according to a fourth embodiment of the developing method of the present invention.
FIG. 12 is an enlarged sectional view of a main part showing a developing process according to a fifth embodiment of the developing method of the present invention.
FIG. 13 is an enlarged sectional view showing a main part of a developing process according to a sixth embodiment of the present invention.
FIG. 14 is an explanatory diagram showing an example of a seventh embodiment of the developing method according to the present invention, and washing and drying processing.
FIG. 15 is a schematic plan view (a) and a schematic side view (b) showing another embodiment of the mounting table and the liquid film forming flat plate according to the present invention.
[Explanation of symbols]
10,10A mounting table
20,20A Flat plate for liquid film formation
30 gap (liquid film formation area)
40, 40A-40D Developing nozzle (developing solution supply nozzle)
41 small hole
60 Moving / elevating mechanism (moving / elevating means, nozzle moving means)
80,80A Wing piece
W Semiconductor wafer (substrate to be processed)
D developer
L Interval of developing nozzle 40
L1 Interval of developing nozzle 40C
RE reticle (substrate to be processed)

Claims (12)

The substrate to be processed and the flat plate for forming a liquid film are opposed to each other with a predetermined gap in parallel with each other, and a tubular developer supply nozzle having at least a plurality of small holes extending in the axial direction is placed at one end of the gap from the other end. By supplying the developer into the gap from the small hole while moving toward the side end, the gap is filled with the developer and a liquid film of the developer is formed on the surface of the substrate to be processed. Characteristic development processing method. The development processing method according to claim 1,
A developing method comprising supplying a developing solution from a small hole of each developing solution supply nozzle while moving a plurality of the developing solution supply nozzles into the gap at intervals. The development processing method according to claim 1,
A developing method, wherein turbulence of the supplied developer is suppressed by a blade piece protruding rearward in the moving direction of the developer supply nozzle. The development processing method according to claim 3,
Two developer supply nozzles projecting the wing pieces are arranged side by side at intervals in a direction intersecting the moving direction, and the developer is supplied from the small holes of each developer supply nozzle while moving in the gap. And a developing method. The development processing method according to claim 1 or 2,
A developing method comprising: rotating the developer supply nozzle in the circumferential direction of the nozzle while moving the nozzle. The developing method according to any one of claims 1 to 5,
A developing method, wherein the flat plate for forming a liquid film is a substrate to be processed. A mounting table for mounting the substrate to be processed,
A liquid film forming flat plate that is disposed to face above the mounting table and forms a predetermined gap between the processing target substrate mounted on the mounting table,
A tubular developer supply nozzle having a plurality of small holes along at least the axial direction,
A developing means for moving the developing solution supply nozzle from one side end to the other side end of the gap. The developing device according to claim 7,
The development processing apparatus according to claim 1, wherein the developer supply nozzles are a plurality of nozzles that move in a gap at intervals. The developing device according to claim 7,
The developing solution supply nozzle is characterized in that a blade piece protrudes rearward in the moving direction of the nozzle. The development processing apparatus according to claim 9,
2. A developing apparatus, comprising two developer supply nozzles provided with the wings protruding therefrom at intervals in a direction intersecting the direction of movement of the nozzles. The developing device according to claim 7, wherein
A developing apparatus wherein the developer supply nozzle is formed so as to be movable and rotatable in the same direction. The developing device according to claim 7,
A development processing apparatus, wherein the flat plate for forming a liquid film is a substrate to be processed.

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