JP2004311385A - Rod member, sealing material using this, sheet sealing material, board for sealing, sealing configuration, mounter and manufacturing method of these - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounter for an organic EL apparatus and the like that is superior in shielding properties of oxygen and moisture and having a functional element mounted on which is excellent in durability and reliability. <P>SOLUTION: A rod member having an elastically deformable core member in a rod form and a metal layer for covering at least part of the core member and adhesive agent are used to structure a sealing member. The mounter with the functional element such as the organic EL element and the like sealed between boards is obtained by bounding the boards with the sealing member. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明によって提供される実装体は、ダークスポットの発生及びその成長が抑制され、上記ダークスポット面積比の条件を満足するものであり、この点は従来に見られない卓越した特徴である。
【０１３２】
本発明の実装体において初期防湿特性及び初期接着力、加熱加湿後の防湿特性及び接着性の保持が発現する理由は必ずしも明らかではないが、以下のように考えられる。
【０１３３】
すなわち、金属層２で被覆した芯材１を基板５と対向基板６との間に挟んで圧接することにより金属層２が基板５及び対向基板６と密着した時、金属が流動又は融解するようなエネルギーが加えられることによって、流動・融解した金属が基板及び対向基板の表面に沿って変形するため、金属層２と基板５及び対向基板６との間に隙間のない更に密な接触が形成され、優れた防湿性が発現する。この点に関して、基板接合時に弾性変形し常態において元に戻ろうとするスプリング効果を発揮可能な弾性を有する芯材１と基板５及び対向基板６との間に金属層２が介在することが重要であり、芯材１を金属層２で覆う又は囲む構造が有効である。また、流動化し易い低融点金属で金属層２を形成することが極めて有効である。尚、芯材１の弾性によるスプリング効果は実装体の対衝撃性緩和にも有効である。
【０１３４】
更に、金属層２及び芯材１が基板５及び対向基板６に圧接した状態で接着層３による接合が形成されると、接着層３の硬化収縮及び弾性変形した芯材１のスプリングバックによって金属層２の両端部が基板５及び対向基板６に押圧され、金属層２と基板５及び対向基板６との密着が保持される。接着層３は、芯材１のスプリング作用による応力、熱応力、加湿時に発生する応力に対応しながら接合を維持し、封止材の防湿性を維持する。この結果、長期の加熱加湿試験後も安定した防湿性と接着性とが発現される。この点に関しては、ポリマーを主成分とする樹脂組成物が応力耐性に優れているので、環境変化に適応性を有する接合を形成する接着剤として応力耐性を有する樹脂組成物を用いることに意味がある。また、接着層３の流動性は、基板５及び保護基板６の接着を確実に行う上で重要であり、特に封止材に一体化した場合、金属層２と基板５及び対向基板６との間に残存することなく金属層２を速やかに基板５及び対向基板６と密着させるために重要である。この点に関して、基板上に配置した封止材を、一旦、剥離処理した加圧板などを用いて軽く基板に押圧しながら樹脂の軟化温度に加熱して金属層が露出するようにし、この後、対抗基板を対面させて芯材の弾性変形に必要な加圧及び樹脂の硬化処理を行うと効果的である。
【０１３５】
尚 トップエミッション方式をとる必要がない場合 実装体の製造時に乾燥剤を組み込むことで ＥＬ素子実装体の信頼性及び耐久性を更に向上させることができる。
【０１３６】
又、本発明に従って得られる実装体は、湿分及び酸素だけでなく、他の物質についても非常に遮断性が高く、様々な成分の出入りを遮断することができるので、ＬＣＤ素子、有機ＥＬ素子、無機ＥＬ素子等のディスプレイ表示素子や太陽電池素子等以外に、半導体や化学的安定性が高くない物質を用いて形成される種々の機能素子の実装体に適用することができる。
【０１３７】
［シート状封止材］
基板間に封止される機能素子が非常に薄い場合、使用する条部材は、上述の実施形態で説明した条部材より細いものの方が有益となる。また、封止体の小型化のためにもより細い条部材が有利であり、表示装置の実用化においては表示エリアを大きく確保できる点から、太さが７ｍｍ以下、特に２ｍｍ以下の条部材の有用性が高い。このような細い条部材の場合、条部材１３及び接着層を基板上に配置する作業を容易にするためには、例えば図２６〜図３４に示すような、条部材１３と樹脂接着剤１４とが剥離性基材６上で一体化されたシート状の封止材が有効である。
【０１３８】
以下に、シート状封止材の実施形態について説明する。
【０１３９】
特に有用なシート状封止材において、芯材１は前述の実施形態のものより細く、具体的には、芯材１の線径（幅）は、０．０１ｍｍ以上７ｍｍ未満のものが好適に使用され、０．０３ｍｍ以上５ｍｍ以下がより好ましく、０．０７ｍｍ以上１ｍｍ以下が最も好ましい。線径が０．０１ｍｍより小さいと、金属層２及び基板に与える弾性圧及び押圧面積が小さくなるため、基板との密着性及び遮蔽性が低下する。線径が７ｍｍを超えるものは、小型の実装体の製造におけるニーズが低いので、シート状封止材としての必要性はさほど高くない。
【０１４０】
芯材１は、押圧力に対して弾性変形可能な材質で条状に形成されたものであればよく、実用的には０．０１ＧＰａ以上の圧力で弾性変形するものであれば特に制約はない。具体的には、室温での圧縮弾性率が０．３ＧＰａ以上２０ＧＰａ以下のプラスチック製ワイヤが好適に使用でき、圧縮弾性率が０．５ＧＰａ以上１０ＧＰａ以下がより好ましく、１．０ＧＰａ以上７．０ＧＰａ以下が最も好ましい。圧縮弾性率が０．３ＧＰａより小さいと加圧時の変形量が大き過ぎて加湿時の防湿性が不十分になる。又、圧縮弾性率が２０ＧＰａより大きいと、加圧時の変形量が小さいため接合後に低融点金属層を基板及び対向基板に押圧する応力が小さく、防湿性が低下する。
【０１４１】
芯材１の素材の具体例としては、例えば、ポリエチレン、６−ナイロン、ポリビニルアルコール、アラミドモノフィラメント、ポリエチレンテレフタレート、ポリスチレン、ポリプロピレン、ＰＡＮ、ポリ塩化ビニル、ポリフェニレンサルファイドなどがあげられる。あるいは、これらの材料を複数含む複合物等を用いることもできる。また、芯材１は金属製であってもよく、例えば、銅、金、白金、チタン等やこれらを含有する合金が挙げられる。
【０１４２】
条部材１３が細い場合、金属層２の形成により高い精密さを必要とするので、芯材１の金属層２に対する親和性が低いと層形成の精密さが低下し、芯材１と金属層２との密着性も低下する。密着性が低いと、金属層２の遊離又は剥離が生じ易く、僅かな遊離又は剥離が封止材の遮蔽性に大きく影響する。従って、芯材がプラスチック製の場合、金属層２を設ける前に、芯材１の表面にプラズマ処理、コロナ放電処理またはプライマ−処理（易接着処理）のいずれかの処理を施して、芯材１と金属層２との密着性を高めることが好ましい。
【０１４３】
芯材１の表面をプライマー処理する場合のプライマーとしては、熱硬化性樹脂を好適に使用することができ、例えば、フェノール樹脂、メラミン樹脂、エポキシ樹脂、キシレン樹脂などが適用可能である。エポキシ樹脂としては、ビスフェノールＡ型エポキシ樹脂やビスフェノールＦ型エポキシ樹脂、テトラヒドロキシフェニルメタン型エポキシ樹脂、ノボラック型エポキシ樹脂、レゾルシン型エポキシ樹脂、ポリアルコール・ポリグリコール型エポキシ樹脂、ポリオレフィン型エポキシ樹脂、脂環式エポキシ樹脂やハロゲン化ビスフェノール型エポキシ樹脂などが挙げられる。また、エポキシアクリレート、ウレタンアクリレート、ポリエーテルアクリレート、ポリエステルアクリレートなども使用できる。特に、ウレタンアクリレート及びエポキシアクリレートは、芯材への密着性が優れており、エポキシアクリレートとしては、１、６−ヘキサンジオールジグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、アリルアルコールジグリシジルエーテル、レゾルシノールジグリシジルエーテル、アジピン酸ジグリシジルエステル、フタル酸ジグリシジルエステル、ポリエチレングリコールジグリシジルエーテル、トリメチロールプロパントリグリシジルエーテル、グリセリントリグリシジルエーテル、ペンタエリスリトールテトラグリシジルエーテル、ソルビトールテトラグリシジルエーテル等の（メタ）アクリル酸付加物が挙げられる。エポキシアクリレートなどのように分子内に水酸基を有するポリマーは芯材及び金属層への密着性向上に有効である。
【０１４４】
上記のポリマーは、必要に応じて、２種以上共重合して、又は、２種類以上を混合して、プライマーとして使用してもよい。尚、後述する樹脂接着剤１４と同様の樹脂組成物をプライマーとして使用可能である。
【０１４５】
プライマーは、通常、汎用溶剤に溶解させて使用するが、無溶剤のまま使用することもできる。溶剤としては、アセトン、ジエチルケトン、メチルアミルケトン、シクロヘキ サノン等のケトン系溶剤、トルエン、キシレン等の芳香族系溶剤、メチルセロソルブ、メチルセロソルブアセタート、エチルセロソルブアセタート等のセロソルブ系溶剤、乳酸エチル、酢酸ブチル、酢酸イソアミル、プロピレングリコールメチルエーテルアセテート、プロピレングリコールエチルエーテルアセテート、ピルビン酸メチル、ピルビン酸エチル、ピルビン酸プロピル等のエステル系溶剤、メタノール、エタノール、プロパノール、プロピレングリコールメチルエーテル、プロピレングリコールエチルエーテル、プロピレングリコールプロピルエーテル等のアルコール系溶剤などが挙げられ、必要に応じて、単独又は２種類以上組み合わせて用いることができる。
【０１４６】
プライマーには、必要に応じて、カップリング剤、接着力を向上させるための粘着付与剤、粘着性を調整するための可塑剤等の添加剤等を添加しても良い。カップリング剤としては、γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、Ｎ−フェニル−γ−アミノプロピルトリメトキシシラン、Ｎ−β−（Ｎ−ビニルベンジルアミノエチル）−γ−アミノプロピルトリメトキシシラン、ヘキサメチルシラザンなどのアミノ基を有するシランカップリング剤、γ−グリシドキシプロピルトリメトキシシラン、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシランなどのエポキシ基を有するシランカップリング剤、γ−メルカプトプロピルトリメトキシシランなどのメルカプト基を有するシランカップリング剤、および、γ−クロロプロピルトリメトキシシランなどのハロゲン基を有するシランカップリング剤等のシランカップリング剤、テトラ（２，２−ジアリルオキシメチル−１−ブチル）ビス（ジトリデシル）ホスファイトチタネート、イソプロピルジメタクリルイソステアロイルチタネート、イソプロピルジアクリルイソステアロイルチタネート、イソプロピルトリイソステアロイルチタネート、ビス（ジオクチルパイロホスフェート）オキシアセテートチタネート、ビス（ジオクチルパイロホスフェート）エチレンチタネート、イソプロピルトリドデシルベンゼンスルホニルチタネート、イソプロピルトリクミルフェニルチタネート等のチタネート系カップリング剤、アセトアルコキシアルミニウムジイソプロピレート等のアルミニウム系カップリング剤およびアセチルアセトン・ジルコニウム錯体等のジルコニウム系カップリング剤等がある。
【０１４７】
粘着付与剤としては、ジシクロペンタジェン樹脂、ロジン、変性ロジン、テルペン樹脂、キシレン樹脂、テルペン−フェノール樹脂、アルキルフェノール樹脂、クマロン−インデン樹脂等があり、必要に応じて単独あるいは２種以上組み合わせて用いることができる。また、プラスチック芯材との密着性を向上させるために、エポキシシラン、アミノシラン、アクリルシランなどの汎用のシランカップリング剤を使うことができる。
【０１４８】
可塑剤としては、例えば、ジオクチルフタレート等が代表的である。
【０１４９】
プライマーに使用する熱硬化性樹脂には、必要に応じて硬化剤（架橋剤）を添加してもよく、硬化剤としては、トリエチレンテトラミン、キシレンジアミン、ジアミノジフェニルメタンなどのアミン類、無水フタル酸、無水マレイン酸、無水ドデシルコハク酸、無水ピロメリット酸、無水ベンゾフェノンテトラカルボン酸などの酸無水物、ジアミノジフェニルスルホン、トリス（ジメチルアミノメチル）フェノール、ポリアミド樹脂、ジシアンジアミド、アルキル置換イミダゾール、多官能イソシアネート化合物などが挙げられる。硬化剤は、単独で用いても、あるいは、２種以上混合して用いてもよい。硬化剤の添加量は、上記ポリマー１００重量部に対して０．１重量部以上５０重量部以下、好ましくは１重量部以上３０重量部以下の範囲で選択するのがよい。硬化剤の添加量が０．１重量部未満であると硬化が不十分となり、５０重量部を超えると過剰架橋となり、接着性に悪影響を与える場合がある。
【０１５０】
条部材１３の金属層２の厚みは１μｍ以上５ｍｍ以下の範囲において好適に使用することができ、３μｍ以上１ｍｍ以下が好ましく、５μｍ以上０．５ｍｍ以下が最も好ましい。厚みが１μｍより小さくても５ｍｍより大きくても防湿信頼性が低下する。
【０１５１】
図１８又は図２５のように条部材１３が上下に重なり合う封止形態では、基板と金属層２との間に隙間が生じ易いので、この点を考慮すると、金属層２の厚さが５μｍ以上であることが好ましい。５μｍ未満であると、４ＭＰａ以上で押圧しても隙間が生じるようになり、２ＭＰａ以上での押圧によって金属層の剥離を生じる。５μｍ以上３０μｍ以下の厚さの金属層２の場合、１〜４ＭＰａの押圧によって基板との間に隙間を生じることなく良好に封止することが可能であり、より好ましくは１０μｍ以上３０μｍ以下とする。更に、使用する金属によるコスト及び製造時間の短縮を考慮すると、１０μｍ以上２０μｍ以下が最適である。
【０１５２】
金属層２を形成する金属は、融点が約８０℃以上のあらゆる金属が好適に使用可能であり、単独金属又は各種の共晶合金あるいは非共晶合金が使用できる。融点が８０℃よりも低いと、温度上昇によって防湿信頼性が容易に低下するため、好ましくない。但し、使用可能な金属の融点の下限は、実装体を用いた実用製品に求められる耐熱温度の目標値によって変動する。封止材による基板の接合時に金属層２が溶融すると、金属層の形状が基板表面の微少な凹凸にも対応でき、密着性が向上する。又、金属による接合が形成されれば、樹脂接着剤の接合を補助することができる。このような観点から、基板及び素子の耐熱限界温度より融点が低い低融点金属、つまり、融点が２５０℃以下の金属が適正であり、９０℃以上２２０℃以下が好ましく、１００℃以上２００℃以下がより好ましい。融点が２５０℃以上であると、溶融接着時に高温を必要とし、機能素子に高温による悪影響が生じるため、上記の目的を果たせなくなる。使用可能な低融点金属の具体例は、前述の実装体の第１の実施形態において記載しているので、ここでは省略する。最適な金属として、錫及びインジウムを含有する融点が１００℃以上１５０℃以下程度の合金が挙げられ、錫／インジウム（４８／５２）共晶合金の融点は１１７℃である。錫／インジウム合金に亜鉛を添加すると、金属層２のガラスに対する密着性が向上する。
【０１５３】
金属層２は、電解めっき、無電解めっき、融着めっき等の方法によって芯材１の表面に形成することができる。例えば、芯材１にシーダ処理を施した後、無電解銅めっき又は無電解ニッケルめっき等を施して導電層を設け、しかる後に電解メッキによって上記した金属の被膜を形成することによって、めっき法により好適に金属層２が設けられる。融着法では、例えば、上記の金属を溶融して芯材に直接融着することによって金属層２を形成できる。
【０１５４】
但し、融着めっきは、５μｍ以上の厚さのめっきを均一に形成することが難しく、電解めっきでは５〜３０μｍの厚さの均一なめっきを形成することが容易である。又、無電解めっきは厚い膜を形成するのに時間がかかる。従って、製造効率及び精密さを考慮すると電解めっきが好ましいが、プラスチックの芯材には直接適用することができない。プラスチックの芯材に電解めっきを施すには、図３５（ａ）に示すように、まず導電層１７を形成し、この後に電解めっきを施して所望の厚さの金属層２を得る。導電層１７の組成は、導電性を有するものであればいかなるものでも良く、金属に限られないが、無電解めっきで膜形成が可能な銅、ニッケル等が一般的であり、コストの面では銅が好ましい。無電解めっきによる導電層１７の厚さは、必要な導電性を得る点、及び、コストや製造時間の低減の点から、０．０５μｍ以上５０μｍ以下の範囲が好適であり、０．２μｍ以上１０μｍ以下が好ましく、０．５μｍ以上３μｍ以下が最も好ましい。無電解銅めっき膜は欠陥を有し易く脆いので、更に電解めっきを行って導電層１７の密着性、延性を向上させることが望ましい。このような条部材１３’を用いて基板を封止接合した実装体の一例を図３５（ｂ）に示す。導電層１７は、その材質及び物性によって、芯材１の一部として作用する場合も、金属層２として作用する場合もある。
【０１５５】
金属層２を均一な膜厚で形成するには電解めっき法が特に適している。錫／インジウム共晶合金の金属層２を電解めっき法で形成する場合、例えば、錫／インジウム共晶合金用電解めっき液（石原薬品社製）中に、導電層を形成したプラスチック製の芯材または金属製の芯材を浸漬して、電流密度が０．０５Ａ／ｃｍ^２以上０．５Ａ／ｃｍ^２以下となるように通電することによって、均一な膜厚で錫／インジウム共晶合金が積層される。電流密度が０．０５Ａ／ｃｍ^２未満では、錫のみのめっき膜になり易く、錫／インジウム共晶合金が得られない。電流密度が０．５Ａ／ｃｍ^２を超えると、合金が急激に析出して膜厚が不均一になる。
【０１５６】
上述のような条部材を用いて構成される本発明のシート状封止材の実施形態を以下に説明する。
【０１５７】
［シート状封止材の第１の実施形態］
この実施形態のシート状封止材では、図２６（ａ）〜（ｆ）に示すように、条部材１３がフィルム状の樹脂接着剤１４に埋設され、表面に離型処理を施した基材１６によって支持されている。従って、基板の封止材を配置する位置に樹脂接着剤１４の上面を付着させて基材１６を剥離除去すれば、条部材１３及び樹脂接着剤１４からなる封止材が基板上に正確且つ簡便に配置することができる。この図では、樹脂接着剤１４中に複数の条部材１３が並列しているが、図１のような単数の条部材１３での封止の場合には、１本の条状の樹脂接着剤１４のフィルムに条部材１３を１本のみ埋設するか、または、図２６の封止材を条部材１３に沿って適宜裁断して使用する。あるいは、図２６の封止材の複数の条部材１３を各々個別に利用できるように、条部材に１３に並行したミシン目及び切り溝を基材１６及び樹脂接着剤１４に設けて分割できるようにしてもよい。図２７（ａ）は、図２６（ａ）のタイプのシート状封止材（但し、条部材の断面形状は異なる）から１つの条部材１３を使用するために条部材に沿って分割したシート状封止材を示し、図２７（ｂ）は２つの条部材１３を分割した例である。また、図２７（ｃ）は、１対の条部材１３が隣接するように樹脂接着剤１４に埋設し、２本単位で分割使用するようしたシート状封止材の例を示す。
【０１５８】
樹脂接着剤１４のフィルムの厚さは、１μｍ以上１ｍｍ以下であることが好ましく、更に好ましくは３μｍ以上５００μｍ以下、最も好ましくは５μｍ以上３００μｍ以下である。１μｍ未満は厚さの制御が困難な上、接着力の低下が大きい。また厚みが１ｍｍを超えると平滑な表面のフィルムが得られ難いため、やはり充分な接着性が得られない。
【０１５９】
図２６の（ａ）及び（ｆ）では、条部材１３の外径と樹脂接着剤１４の厚さとが同じであり、（ｂ），（ｄ）及び（ｅ）では条部材１３の外径より樹脂接着剤１４の厚さの方が大きく、（ｄ）では条部材１３の外径より樹脂接着剤１４の厚さが小さい。条部材１３の外径と樹脂接着剤１４の厚さとが同じであると、基板に封止材を貼着した時に樹脂接着剤１４及び条部材１３の両方が基板に当接するので、樹脂接着剤が基板を接合した時に金属層２と基板とが好適に密着する。
【０１６０】
上記のようなシート状封止材を基板に貼着して基材１６を剥し、被着体間つまり対向する基板の間に挟んで加熱圧着すると、条部材と被着体と間に樹脂接着剤１４がある場合は押し出されて金属層２が樹脂接着剤１４から露出し、図１のように被着体表面つまり基板表面に当接する。この時、金属層２が溶融するようなエネルギーを加えると、融解した金属が両サイドの被着体表面の微細な凹凸に適応して密着性が増す。更に、金属層２と被着体との接合が形成されれば、樹脂接着剤の接合を補助する役割を果たす。金属による接合は、熱応力や加湿時に発生する応力に対して接着力を維持できないが、ポリマーを主成分とする樹脂組成物は応力適応性に優れており、金属と樹脂組成物との併用により、応力の分散・吸収によって被着体との接合が破壊され難くなる。
【０１６１】
本発明では、芯材１の弾性圧縮を利用して、加圧により弾性変形した芯材の元に戻ろうとするいわゆるスプリング効果を金属層に作用させて被着体に圧接することにより、接合後の実装体は、加熱及び／加湿を被っても優れた防湿特性を保持できる。樹脂組成物が硬化する際に生じる収縮も芯材１のスプリング効果に寄与する。
【０１６２】
樹脂接着剤１４は、基板と対向基板とを接合するための接着剤として作用する樹脂組成物であればよく、接合形成に加熱を要する樹脂（熱可塑性樹脂、熱硬化性樹脂）及び加熱が不要の樹脂（放射線硬化樹脂等）のいずれも使用可能である。熱による素子の劣化を避けるために、素子が２００℃を超える温度に加熱されることを伴わない樹脂組成物であること（軟化温度及び硬化（架橋）温度が２００℃以下であること）、通常の雰囲気での取り扱いの点から樹脂組成物の軟化温度が３０℃以上２００℃以下、好ましくは５０℃以上１８０℃以下、より好ましくは６０℃以上１５０℃以下となること、及び、実装体における接着性が高温時に低下しないように、熱硬化性樹脂又は放射線硬化樹脂を使用することが好ましく、これらは、前述の接着層４の樹脂組成物の場合と同様である。
【０１６３】
シート状封止材としての要件としては、常温において硬化前の樹脂組成物が、基材上で形状を維持可能な程度の保形性を有することが好ましい。このよな点をふまえて、いかに樹脂接着剤１４として使用する樹脂組成物について具体的に記載する。
【０１６４】
熱硬化性樹脂を使用する場合、保存安定性、耐熱性及び封止する機能素子の熱劣化防止の点から、硬化温度が５０℃以上２００℃以下、好ましくは１８０℃以下、より好ましくは７０℃以上１５０℃以下とすることは前述の接着層４の樹脂組成物の場合と同様である。熱硬化樹脂は、硬化温度より低い温度においても硬化は進行し、加熱温度と樹脂の硬化温度との差が大きいほど硬化速度は遅くなる。樹脂の硬化に必要な温度が高い場合は、局所加熱方式によって素子の加熱を避けることが可能である。
【０１６５】
樹脂組成物が熱硬化性樹脂である場合の具体例としては、フェノール樹脂、メラミン樹脂、エポキシ樹脂、キシレン樹脂のような樹脂などが適用可能である。その他にもビスフェノールＡ型エポキシ樹脂やビスフェノールＦ型エポキシ樹脂、テトラヒドロキシフェニルメタン型エポキシ樹脂、ノボラック型エポキシ樹脂、レゾルシン型エポキシ樹脂、ポリアルコール・ポリグリコール型エポキシ樹脂、ポリオレフィン型エポキシ樹脂、脂環式やハロゲン化ビスフェノールなどのエポキシ樹脂を使用することができる。
【０１６６】
又、エポキシ樹脂以外の熱硬化性樹脂及び熱可塑性樹脂の例として、天然ゴム、ポリイソプレン、ポリ−１、２−ブタジエン、ポリイソブテン、ポリブテン、ポリ−２−ヘプチル−１、３−ブタジエン、ポリ−２−ｔ−ブチル−１、３−ブタジエン、ポリ−１、３−ブタジエンなどの（ジ）エン類、ポリオキシエチレン、ポリオキシプロピレン、ポリビニルエチルエーテル、ポリビニルヘキシルエーテル、ポリビニルブチルエーテルなどのポリエーテル類、ポリビニルアセテート、ポリビニルプロピオネートなどのポリエステル類、ポリウレタン、エチルセルロース、ポリ塩化ビニル、ポリアクリロニトリル、ポリメタクリロニトリル、ポリスルホン、ポリスルフィド、フェノキシ樹脂などを挙げられる。その他にも、エチレン酢酸ビニル共重合体、エチレン−酢酸ビニル共重合体変性物、ポリエチレン、エチレン−プロピレン共重合体、エチレン−アクリル酸共重合体、エチレン−アクリル酸エステル共重合体、エチレン−アクリル酸塩共重合体、アクリル酸エステル系ゴム、ポリイソブチレン、アタクチックポリプロピレン、ポリビニルブチラール、アクリロニトリル−ブタジエン共重合体、スチレン−ブタジエンブロック共重合体、スチレン−イソプレンブロック共重合体、エチレンセルロース、ポリアミド、シリコン系ゴム、ポリクロロプレン等の合成ゴム類、ポリビニルエーテルなどが適用可能であり、単独あるいは２種以上併用して用いられる。アクリル樹脂としては以下に示すものが挙げられる。ポリエチルアクリレート、ポリブチルアクリレート、ポリ−２−エチルヘキシルアクリレート、ポリ−ｔ−ブチルアクリレート、ポリ−３−エトキシプロピルアクリレート、ポリオキシカルボニルテトラメタクリレート、ポリメチルアクリレート、ポリイソプロピルメタクリレート、ポリドデシルメタクリレート、ポリテトラデシルメタクリレート、ポリ−ｎ−プロピルメタクリレート、ポリ−３，３，５−トリメチルシクロヘキシルメタクリレート、ポリエチルメタクリレート、ポリ−２−ニトロ−２−メチルプロピルメタクリレート、ポリ−１，１−ジエチルプロピルメタクリレート、ポリメチルメタクリレートなどのポリ（メタ）アクリル酸エステル、又はこれらの共重合体を使用することができる。また、エポキシアクリレート、ウレタンアクリレート、ポリエーテルアクリレート、ポリエステルアクリレートなども使用できる。特にウレタンアクリレート、エポキシアクリレートは被着体への密着性の点で優れており、エポキシアクリレートとしては、１，６−ヘキサンジオールジグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、アリルアルコールジグリシジルエーテル、レゾルシノールジグリシジルエーテル、アジピン酸ジグリシジルエステル、フタル酸ジグリシジルエステル、ポリエチレングリコールジグリシジルエーテル、トリメチロールプロパントリグリシジルエーテル、グリセリントリグリシジルエーテル、ペンタエリスリトールテトラグリシジルエーテル、ソルビトールテトラグリシジルエーテル等の（メタ）アクリル酸付加物が挙げられる。
【０１６７】
必要に応じて、上記樹脂の２種以上を共重合したもの、あるいは、２種類以上をブレンドしたものを使用することも可能である。エポキシアクリレートなどのように分子内に水酸基を有するポリマーは支持体への密着性向上に有効である。又、接合を形成した樹脂接着剤１４がゴム弾性を有すると、芯材によるスプリングバックの応力に対する適応性が高く樹脂接着剤１４の接着破壊が更に抑制される。この点については、硬化した樹脂組成物の弾性率が０．００５ＧＰａ以上３０ＧＰａ以下であるものが好ましく、より好ましくは０．１ＧＰａ以上１０ＧＰａ以下、最も好ましくは０．５ＧＰａ以上７．０ＧＰａ以下となる。
【０１６８】
熱硬化性樹脂を利用する場合、硬化剤（架橋剤）として、トリエチレンテトラミン、キシレンジアミン、ジアミノジフェニルメタンなどのアミン類、無水フタル酸、無水マレイン酸、無水ドデシルコハク酸、無水ピロメリット酸、無水ベンゾフェノンテトラカルボン酸などの酸無水物、ジアミノジフェニルスルホン、トリス（ジメチルアミノメチル）フェノール、ポリアミド樹脂、ジシアンジアミド、アルキル置換イミダゾール、多官能イソシアネート化合物などを使うことができる。硬化剤は、単独で用いても２種以上を混合して用いてもよい。また、使用しなくてもよい。
【０１６９】
硬化剤の添加量は、上記樹脂１００重量部に対して０．１〜５０重量部、好ましくは１〜３０重量部の範囲で選択するのがよい。硬化剤（架橋剤）の添加量が０．１重量部未満であると、硬化が不十分となり、５０重量部を超えると、架橋過剰になり、接着性に悪影響を与える場合がある。
【０１７０】
樹脂接着剤１４として、α線、β線、γ線、中性子線、Ｘ線や加速電子線、紫外線等の放射線を照射することで硬化する放射線硬化樹脂も使用可能である。紫外線硬化型樹脂としては、例えば、以下に例示するようなラジカル（共）重合体（Ａ）、少なくとも一つのラジカル重合性基を有するラジカル重合性単量体（Ｂ）及び光重合開始剤が混合されたラジカル重合性樹脂接着剤がある。
【０１７１】
上記ラジカル（共）重合体（Ａ）は、少なくとも一つのラジカル重合性基を有するラジカル重合性単量体を用いてラジカル重合開始剤により反応させて調製することができ、このラジカル重合性単量体としては、ブタジエン、イソプレン及び２−クロロブタジエン等のジオレフィン系単量体； メチル（メタ）アクリレート、エチル（メタ）アクリレート、ｎ−ブチル（メタ）アクリレート、イソブチル（メタ）アクリレート、ｔ−ブチル（メタ）アクリレート、２−エチルヘキシル（メタ）アクリレート、ラウリル（メタ）アクリレート、ステアリル（メタ）アクリレート、シクロヘキシル（メタ）アクリレート、イソボルニル（メタ）アクリレート、ベンジル（メタ）アクリレート、ジメチルアミノエチル（メタ）アクリレート、グリシジル（メタ）アクリレート、２，３−ジブロモプロピル（メタ）アクリレート、トリブロモフェニル（メタ）アクリレート、トリフルオロエチル（メタ）アクリレート、テトラフルオロプロピル（メタ）アクリレート、オクタフルオロペンチル（メタ）アクリレート、パーフロロオクチルエチル（メタ）アクリレート、トリメチルシロキシエチル（メタ）アクリレート、１，３−ブチレングリコールジ（メタ）アクリレート、１，６−ヘキサンジオールジ（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート等の（メタ）アクリレート類； スチレン、クロロスチレン、α−メチルスチレン、ジメチルスチレン、ｔ−ブチルスチレン、ジビニルベンゼン、酢酸ビニル、Ｎ−ビニルピロリドン等のビニル化合物類； （メタ）アクリルアミド、Ｎ−メチル（メタ）アクリルアミド、Ｎ，Ｎ−ジメチル（メタ）アクリルアミド、Ｎ，Ｎ−ジエチル（メタ）アクリルアミド、Ｎ，Ｎ−ジメチルアミノプロピル（メタ）アクリルアミド、Ｎ−イソプロピル（メタ）アクリルアミド、Ｎ−メチロール（メタ）アクリルアミド、ダイアセトン（メタ）アクリルアミド、Ｎ，Ｎ−メチレンビス（メタ）アクリルアミド等の（メタ）アクリルアミド類； Ｎ−フェニルマレイミド、Ｎ−ラウリルマレイミド等のマレイミド類； （メタ）アクリロニトリル、マレイン酸アルキルモノエステル、フマル酸アルキルモノエステル、イタコン酸アルキルモノエステル、（メタ）アクリル酸、無水（メタ）アクリル酸、クロトン酸、イソクロトン酸、ビニル酢酸、チグリン酸、オレイン酸、ソルビン酸、リノール酸、マレイン酸、無水マレイン酸、フマル酸、シトラコン酸、テトラコン酸、イタコン酸、無水イタコン酸、アシッドホスホオキシエチル（メタ）アクリレート、３−クロロ−２−アシッドホスホオキシプロピル（メタ）アクリレート、アシッドホスホオキシプロピル（メタ）アクリレート、アシッドホスホオキシポリエチレングリコールモノ（メタ）アクリレート、アシッドホスホオキシプロピレングリコールモノ（メタ）アクリレート、２−（メタ）アクリルアミド−２−メチルプロパンスルホン酸、スチレンスルホン酸、スルホプロピル（メタ）アクリレート、２−（メタ）アクリロイルオキシナフタレン−２−スルホン酸、２−（メタ）アクリロイルオキシベンゼンスルホン酸等の酸基または酸無水物基を有する単量体等がある。
【０１７２】
ラジカル重合開始剤としては、過酸化水素、過硫酸カリウムや過硫酸アンモニウム等の無機過酸化物、ｔ−ブチルヒドロパーオキサイド、過酸化ｔ−ジブチル、クメンヒドロパーオキサイド、過酸化アセチル、過酸化ベンゾイル及び過酸化ラウロイル等の有機過酸化物； 及び、アゾビスイソブチロニトリル、アゾビス−２，４−ジメチルバレロニトリル、アゾビスシクロヘキサンカルボニトリル、アゾビスイソ酪酸メチル、アゾビスイソブチルアミジン塩酸塩及びアゾビスシアノ吉草酸等のアゾ化合物等がある。無機過酸化物及び有機過酸化物に対しては、エチルアミン、トリエタノールアミン及びジメチルアニリン等のアミン、ポリアミン、２価鉄塩化合物、アンモニア、トリエチルアルミニウム、トリエチルほう素、ジエチル亜鉛等の有機金属化合物、亜硫酸ナトリウム、亜硫酸水素ナトリウム、ナフテン酸コバルト、スルフィン酸、メルカプタン等の適切な還元剤を併用しても良い。更に、ラジカル（共）重合体を作る際に用いるラジカル重合開始剤として、紫外線や可視光線の照射により重合開始ラジカルが発生する光重合開始剤を用いても良い。あるいは、ラジカル重合開始剤を用いずに、電子線、エックス線やプラズマ等の高エネルギー線を照射して重合開始ラジカルを発生させてもよい。
【０１７３】
ラジカル重合開始剤として、有機過酸化物及び／又はアゾ化合物を用いて製造すると、ラジカル（共）重合体を含んだラジカル重合性樹脂接着剤の光重合性が高くなる。とりわけ、２，２−ジメチル置換アルキル（アシル）オキシラジカルを発生させる有機過酸化物を用いて製造したラジカル（共）重合体を含んだ樹脂接着剤は、低紫外線照射量で高度に架橋するため、好ましい。２，２−ジメチル置換アルキル（アシル）オキシラジカルとして、ｔ−ブトキシラジカル、ｔ−ヘキシルオキシラジカル及びクメンオキシラジカル等が特に有効である。２，２−ジメチル置換アルキル（アシル）オキシラジカルを発生させる有機過酸化物としては、例えば、ｔ−ブチルパーオキシピバレート、ｔ−ブチルパーオキシネオデカノエート、ｔ−ブチルパーオキシ２−エチルヘキサノエート、ｔ−ブチルパーオキシ３，５，５，−トリメチルヘキサノエート、ｔ−ブチルパーオキシラウレート、ｔ−ブチルパーオキシベンゾエート、ジｔ−ブチルパーオキシイソフタレート、ｔ−ブチルパーオキシマレイックアシド、ｔ−ブチルパーオキシイソプロピルカーボネート、ｔ−ブチルパーオキシネオヘキサノエート等のｔ−ブチルパーオキシエステル化合物； ｔ−ヘキシルパーオキシネオドデカノエート、ｔ−ヘキシルパーオキシピバレート、ｔ−ヘキシルパーオキシネオヘキサノエート等のｔ−ヘキシルパーオキシエステル化合物； クミルパーオキシオクトエート、クミルパーオキシネオデカノエート、クミルパーオキシネオヘキサノエート等のクミルパーオキシエステル化合物； １，１−ビス（ｔ−ブチルパーオキシ）３，３，５−トリメチルシクロヘキサン、１，１−ビス（ｔ−ブチルパーオキシ）シクロヘキサン、２，２−ビス（ｔ−ブチルパーオキシ）オクタン等のパーオキシケタール化合物； ｔ−ブチルハイドロパーオキサイド、クメンハイドロパーオキサイド、ｐ−メンタンハイドロパーオキサイド等のハイドロパーオキサイド化合物； ジｔ−ブチルパーオキサイド、ｔ−ブチルクミルパーオキサイド、ジクミルパーオキサイド等のジアルキルパーオキサイド化合物等がある。
【０１７４】
上記ラジカル重合性単量体（Ｂ）は、少なくとも１つのラジカル重合性基と１以上の官能基数とを有する化合物であればよい。反応性が高く好ましい化合物として、（メタ）アクリル化合物、（メタ）アクリルアミド化合物及びビニルエーテル化合物が挙げられる。具体的には、例えば、（メタ）アクリルアミド、（メタ）アクリル酸、メチル（メタ）アクリレート、エチル（メタ）アクリレート、ブチル（メタ）アクリレート、ヘキシル（メタ）アクリレート、２−エチルヘキシル（メタ）アクリレート、ドデシル（メタ）アクリレート、ラウリル（メタ）アクリレート、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、グリシジル（メタ）アクリレート、テトラヒドロフルフリル（メタ）アクリレート、シクロヘキシル（メタ）アクリレート、ベンジル（メタ）アクリレート、イソボルニル（メタ）アクリレート、Ｎ−メチルマレイミド、Ｎ−フェニルマレイミド、ジエチレングリコールジ（メタ）アクリレート、ネオペンチルグリコールジ（メタ）アクリレート、１，６−ヘキサンジ（メタ）アクリレート、ビスフェノールＡジオキシジエチレングリコールジ（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート、ペンタエリスリトールトリ（メタ）アクリレート、１，４−ブタンジオールジ（メタ）アクリレート、Ｎ−ビニルピロリドン、ウレタン（メタ）アクリレート、ポリエステル（メタ）アクリレート、エポキシ（メタ）アクリレート、ポリブタジエン（メタ）アクリレート、シリコーン（メタ）アクリレート、ポリエーテル（メタ）アクリレート、メラミン（メタ）アクリレート、フォスファゼン（メタ）アクリレート、アクリル共重合体へ（メタ）アクリロイル基を導入したもの、等の（メタ）アクリル化合物； ポリブタジエンや不飽和ポリエステル化合物等の主鎖及び側鎖に不飽和結合を有する化合物、アリル基、ビニル基、ビニルエーテル基、マレイミド基、（メタ）アクリルアミド基等のラジカル重合性２重結合を有する化合物等がある。これらの一種または二種以上の混合物を用いることができる。ラジカル重合性樹脂接着剤の紫外線硬化性を高くし、塗膜の性能を向上させるために、官能基数が２以上のラジカル重合性単量体を１種以上用いることができる。
【０１７５】
官能基として鎖状エーテル基に隣接するメチン基及び／又はメチレン基を有するラジカル重合性単量体の具体的例を挙げると、例えば、ジエチレングリコールモノ（メタ）アクリレート、トリエチレングリコールモノ（メタ）アクリレート、ノナエチレングリコールモノ（メタ）アクリレート、ポリエチレングリコールモノ（メタ）アクリレート（ポリエチレングリコール鎖数：３０）、メトキシエチレングリコール（メタ）アクリレート、メトキシジエチレングリコール（メタ）アクリレート、メトキシトリエチレングリコール（メタ）アクリレート、メトキシノナエチレングリコール（メタ）アクリレート、メトキシポリエチレングリコール（メタ）アクリレート（ポリエチレングリコール鎖数：３０）、３−メトキシブチル（メタ）アクリレート、エトキシジエチレン（メタ）アクリレート、ブトキシエチル（メタ）アクリレート、２−エチルヘキシルエチル（メタ）アクリレート、２−エチルヘキシルジエチレングリコール（メタ）アクリレート、フェノキシエチレングリコール（メタ）アクリレート、フェノキシジエチレングリコール（メタ）アクリレート、ノニルフェノキシエチレングリコール（メタ）アクリレート、ノニルフェノキシテトラエチレングリコール（メタ）アクリレート、トリシクロ〔５，２，１，０^２，６〕デカニルオキシエチル（メタ）アクリレート、イソボニルオキシエチル（メタ）アクリレート、シクロヘキシルオキシエチル（メタ）アクリレート、メトキシトリプロピレングリコール（メタ）アクリレート等のアルキルオキシポリアルキレングリコール（メタ）アクリレート類及びアリルオキシポリアルキレングリコール（メタ）アクリレート類； Ｎ−ｎ−ブトキシメチル（メタ）アクリルアミド、Ｎ−イソブトキシメチル（メタ）アクリルアミド、Ｎ−メトキシエチル（メタ）アクリルアミド等のＮ−アルコキシアルキル（メタ）アクリルアミド類等が挙げられる。
【０１７６】
また、官能基として環状エーテル基に隣接するメチン基及び／又はメチレン基を有するラジカル重合性単量体としては、例えば、テトラヒドロフルフリル（メタ）アクリレート、テトラヒドロフルフリルアルコールのモノε−カプロラクトン付加物の（メタ）アクリレート、テトラヒドロフルフリルアルコールのジε−カプロラクトン付加物の（メタ）アクリレート、テトラヒドロフルフリルアルコールのモノβ−メチル−δ−バレロラクトン付加物の（メタ）アクリレート、テトラヒドロフルフリルアルコールのジβ−メチル−δ−バレロラクトン付加物の（メタ）アクリレート、テトラヒドロフルフリルオキシエチル（メタ）アクリレート、テトラヒドロフルフリルオキシジエチレングリコール（メタ）アクリレート、テトラヒドロフルフリルオキシテトラエチレングリコール（メタ）アクリレート、テトラヒドロフルフリルオキシプロピル（メタ）アクリレート、テトラヒドロフルフリルオキシジプロピレングリコール（メタ）アクリレート、テトラヒドロフルフリルオキシトリプロピレングリコール（メタ）アクリレート、テトラヒドロフルフリルアルコールの２−イソシアネートエチル（メタ）アクリレート付加物、２−テトラヒドロフロニック酸のグリシジル（メタ）アクリレート反応物、テトラヒドロフルフリル（メタ）アクリルアミド、テトラヒドロフルフリルオキシメチル（メタ）アクリルアミド等のテトラヒドロフラン環を有する（メタ）アクリレート類及びテトラヒドロフラン環を有する（メタ）アクリルアミド類；テトラヒドロピラン−２−メタノール（メタ）アクリレート、テトラヒドロピラン−２−メタノールのモノε−カプロラクトン付加物の（メタ）アクリレート、テトラヒドロピラン−２−メタノールのジε−カプロラクトン付加物の（メタ）アクリレート、テトラヒドロピラン−２−メタノールのモノβ−メチル−δ−バレロラクトン付加物の（メタ）アクリレート、テトラヒドロピラン−２−メタノールのジβ−メチル−δ−バレロラクトン付加物の（メタ）アクリレート、テトラヒドロピラン−２−メタノールオキシエチル（メタ）アクリレート、テトラヒドロピラン−２−メタノールオキシジエチレングリコール（メタ）アクリレート、テトラヒドロピラン−２−メタノールオキシテトラエチレングリコール（メタ）アクリレート、テトラヒドロピラン−２−メタノールオキシプロピル（メタ）アクリレート、テトラヒドロピラン−２−メタノールオキシジプロピレングリコール（メタ）アクリレート、テトラヒドロピラン−２−メタノールオキシトリプロピレングリコール（メタ）アクリレート、テトラヒドロピラン−２−メタノールの２−イソシアネートエチル（メタ）アクリレート付加物、テトラヒドロピラン−２−メタノールのエピクロルヒドリン付加体の（メタ）アクリル酸反応物、テトラヒドロピラン−２−メタノール（メタ）アクリルアミド、テトラヒドロピラン−２−メタノールオキシメチル（メタ）アクリルアミド等のテトラヒドロピラン環を有する（メタ）アクリレート類及びテトラヒドロピラン環を有する（メタ）アクリルアミド類； ２，２−ジメチル−３−オキシプロパナールとエチレングリコールの縮合体の（メタ）アクリレート、２，２−ジメチル−３−オキシプロパナールとエチレングリコールの縮合体のモノε−カプロラクトン付加物の（メタ）アクリレート、２，２−ジメチル−３−オキシプロパナールとエチレングリコールの縮合体のモノβ−メチル−δ−バレロラクトン付加物の（メタ）アクリレート、２，２−ジメチル−３−オキシプロパナールとエチレングリコールの縮合体のエピクロールヒドリン付加体の（メタ）アクリル酸反応物、２，２−ジメチル−３−オキシプロパナールとエチレングリコールの縮合体の２−イソシアネートエチル（メタ）アクリレート付加物、２，２−ジメチル−３−オキシプロパナールとプロピレングリコールの縮合体の（メタ）アクリレート、２，２−ジメチル−３−オキシプロパナールとプロピレングリコールの縮合体のモノε−カプロラクトン付加物の（メタ）アクリレート、２，２−ジメチル−３−オキシプロパナールとプロピレングリコールの縮合体のエピクロールヒドリン付加体の（メタ）アクリル酸反応物、２，２−ジメチル−３−オキシプロパナールとプロピレングリコールの縮合体の２−イソシアネートエチル（メタ）アクリレート付加物、２，２−ジメチル−３−オキシプロパナールとネオペンチルグリコールの縮合体の（メタ）アクリレート、２，２−ジメチル−３−オキシプロパナールとネオペンチルグリコールの縮合体のモノε−カプロラクトン付加物の（メタ）アクリレート、２，２−ジメチル−３−オキシプロパナールとネオペンチルグリコールの縮合体のエピクロールヒドリン付加体の（メタ）アクリル酸反応物、２，２−ジメチル−３−オキシプロパナールとネオペンチルグリコールの縮合体の２−イソシアネートエチル（メタ）アクリレート付加物、グリセロールフォルマール（メタ）アクリレート、グリセロールフォルマールのモノε−カプロラクトン付加物の（メタ）アクリレート、グリセロールフォルマールのモノβ−メチル−δ−バレロラクトン付加物の（メタ）アクリレート、グリセロールフォルマールのエピクロールヒドリン付加体の（メタ）アクリル酸反応物、グリセロールフォルマールの２−イソシアネートエチル（メタ）アクリレート付加物等のジオキソラン環を有する（メタ）アクリレート類等が挙げられる。
【０１７７】
また、官能基として水酸基に隣接するメチン基及び／又はメチレン基を有するラジカル重合性単量体としては、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、２−ヒドロキシブチル（メタ）アクリレート、４−ヒドロキシブチル（メタ）アクリレート、グリセロールモノ（メタ）アクリレート、３−クロロ−２−ヒドロキシプロピル（メタ）アクリレート、２−ヒドロキシ−３−フェノキシプロピル（メタ）アクリレート、２−ヒドロキシ−３−ラウロキシプロピル（メタ）アクリレート、２−（メタ）アクリロイルオキシエチル−２−ヒドロキシプロピルフタレート、ジプロピレングリコールモノ（メタ）アクリレート等の水酸基を有する（メタ）アクリレート類が挙げられる。
【０１７８】
官能基としてカーバメート基に隣接するメチン基及び／又はメチレン基を有するラジカル重合性単量体としては、２−イソシアネートエチル（メタ）アクリレートのイソプロピルアルコール付加物、２−イソシアネートエチル（メタ）アクリレートのｎ−ブチルアルコール付加物、ｎ−ブチルイソシアナートの２−ヒドロキシエチル（メタ）アクリレート付加物、フェニルイソシアネートの２−ヒドロキシプロピル（メタ）アクリレート付加物、オクタデシルイソシアネートの２−ヒドロキシエチル（メタ）アクリレート付加物等のカ−バメート基を有する（メタ）アクリレート類； ３−イソプロペニル−α，α−ジメチルベンジルイソシアネートのイソプロピルアルコール付加物、３−イソプロペニル−α，α−ジメチルベンジルイソシアネートのｎ−ブチルアルコール付加物等のカ−バメート基を有するビニル化合物類等が挙げられる。
【０１７９】
光重合開始剤としては、ジエトキシアセトフェノン、２−ヒドロキシ−２−メチル−１−フェニルプロパン−１−オン、ベンジルジメチルケタール、１−（４−イソプロピルフェニル）ー２−ヒドロキシ−２−メチルプロパン−１−オン、４−（２−ヒドロキシエトキシ）フェニル−（２−ヒドロキシ−２−プロピル）ケトン、１−ヒドロキシシクロハキシル−フェニルケトン、２−メチル−２−モルホリノ（４ーチオメチルフェニル）プロパン−１−オン、２−ベンジル−２−ジメチルアミノ−１−（４−モルホリノフェニル）−ブタノン等のアセトフェノン系化合物、ベンゾイン、ベンゾインイソプロピルエーテル、ベンゾインイソブチルエーテル等のベンゾイン系化合物； ２，４，６−トリメチルベンゾイルジフェニルホスフィンオキサイド等のアシルホスフィンオキサイド系化合物、ベンジル、メチルフェニルグリオキシエステル； ベンゾフェノン、ο−ベンゾイル安息香酸メチル、４−フェニルベンゾフェノン、４，４’−ジクロロベンゾフェノン、ヒドロキシベンゾフェノン、４−ベンゾイル−４’−メチル−ジフェニルサルファイド、アクリル化ベンゾフェノン、３，３’，４，４’−テトラ（ｔ−ブチルパーオキシカルボニル）ベンゾフェノン、３，３’−ジメチル−４−メトキシベンゾフェノン等のベンゾフェノン系化合物； ２−イソプロピルチオキサントン、２，４−ジメチルチオキサントン、２，４−ジエチルチオキサントン、２，４−ジクロロチオキサントン等のチオキサントン系化合物； ミヒラーケトン、４，４’−ジエチルアミノベンゾフェノン等のアミノベンゾフェノン系化合物； １０−ブチル−２−クロロアクリドン、２−エチルアンスラキノン、９，１０−フェナンスレンキノン、カンファーキノン等が挙げられる。
【０１８０】
ラジカル重合性樹脂接着剤の紫外線硬化に関して、重合は光重合開始剤だけでもおこるが、より効率的に重合をさせるために、更に光増感剤を併用することが好ましい。かかる増感剤としては、トリエタノールアミン、メチルジエタノールアミン、トリイソプロパノールアミン、４−ジメチルアミノ安息香酸メチル、４−ジメチルアミノ安息香酸エチル、４−ジメチルアミノ安息香酸イソアミル、安息香酸（２−ジメチルアミノ）エチル、４−ジメチルアミノ安息香酸（ｎ−ブトキシ）エチル、４−ジメチルアミノ安息香酸２−エチルヘキシル等のアミン類がある。
【０１８１】
更に、必要に応じて、非反応性オリゴマー、顔料、染料、無機充填剤、有機充填剤、重合禁止剤、消泡剤、レベリング剤、可塑剤、カップリング等の密着向上剤等を添加しても良い。無機充填剤及び有機充填剤は、一般的に、強度、クッション性、滑り性等の機械的特性の向上のために用いる。
【０１８２】
上記の添加物に特に制限はないが、有機顔料、無機顔料及び染料については、溶解性に優れる油解性染料が特に適している。
【０１８３】
無機充填剤としては、二酸化珪素、酸化珪素、炭酸カルシウム、珪酸カルシウム、炭酸マグネシウム、酸化マグネシウム、酸化カルシウム、タルク、カオリンクレー、焼成クレー、酸化亜鉛、硫酸亜鉛、水酸化アルミニウム、酸化アルミニウム、ガラス、雲母、硫酸バリウム、アルミナホワイト、ゼオライト、シリカバルーン、ガラスバルーンなどがある。無機充填剤に、シランカップリング剤、チタネート系カップリング剤、アルミニウム系カップリング剤及びジルコネート系カップリング剤等を添加、反応させる等の方法により、ハロゲン基、エポキシ基、アミノ基、水酸基、チオール基及びアミド基等の官能基を持たせてもかまわない。
【０１８４】
有機充填剤としては、ベンゾグアナミン樹脂、メラミン樹脂、ベンゾグアナミン・メラミン樹脂、尿素樹脂、シリコーン樹脂、低密度ポリエチレン、高密度ポリエチレン、ポリオレフィン樹脂、エチレン・アクリル酸共重合体、ポリスチレン、架橋ポリスチレン、ポリジビニルベンゼン、スチレン・ジビニルベンゼン共重合体、アクリル共重合体、架橋アクリル樹脂、ポリメチルメタクリレート樹脂、塩化ビニリデン樹脂、フッ素樹脂、ナイロン１２、ナイロン１１、ナイロン６／６６、フェノール樹脂、エポキシ樹脂、ウレタン樹脂、ポリイミド樹脂等がある。有機充填剤は、ハロゲン基、エポキシ基、アミノ基、水酸基、チオール基及びアミド基等の官能基を有していてもかまわない。
【０１８５】
カップリング剤としては、γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、Ｎ−フェニル−γ−アミノプロピルトリメトキシシラン、Ｎ−β−（Ｎ−ビニルベンジルアミノエチル）−γ−アミノプロピルトリメトキシシラン、ヘキサメチルシラザンなどのアミノ基を有するシランカップリング剤、γ−グリシドキシプロピルトリメトキシシラン、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシランなどのエポキシ基を有するシランカップリング剤、γ−メルカプトプロピルトリメトキシシランなどのメルカプト基を有するシランカップリング剤、およびγ−クロロプロピルトリメトキシシランなどのハロゲン基を有するシランカップリング剤等のシランカップリング剤、テトラ（２，２−ジアリルオキシメチル−１−ブチル）ビス（ジトリデシル）ホスファイトチタネート、イソプロピルジメタクリルイソステアロイルチタネート、イソプロピルジアクリルイソステアロイルチタネート、イソプロピルトリイソステアロイルチタネート、ビス（ジオクチルパイロホスフェート）オキシアセテートチタネート、ビス（ジオクチルパイロホスフェート）エチレンチタネート、イソプロピルトリドデシルベンゼンスルホニルチタネート、イソプロピルトリクミルフェニルチタネート等のチタネート系カップリング剤、アセトアルコキシアルミニウムジイソプロピレート等のアルミニウム系カップリング剤およびアセチルアセトン・ジルコニウム錯体等のジルコニウム系カップリング剤等がある。
【０１８６】
ラジカル重合性樹脂接着剤に照射する光は、波長１８０ｎｍ〜９００ｎｍの紫外線又は可視光線が好ましい。光発生源としては、超高圧水銀ランプ、高圧水銀ランプ、低圧水銀ランプ、メタルハライドランプ、ケミカルランプ、ブラックライトランプ、水銀−キセノンランプ、ショートアーク灯、ヘリウム・カドミニウムレーザー、アルゴンレーザー、太陽光等がある。とりわけ、２５４ｎｍ、３１３ｎｍ、３６５ｎｍ、４０５ｎｍの波長の光が、このラジカル重合性樹脂接着剤の架橋に有効である。１００ｍＪ／ｃｍ^２〜１０Ｊ／ｃｍ^２の光照射量で高度に架橋することができる。なお、光照射量は、例えば、工業用ＵＶチェッカーＵＶＲ−Ｔ３７（株式会社トプコン製）によって測定できる。
【０１８７】
なお、上記ラジカル重合性樹脂接着剤は、光重合開始剤を含まなくても紫外線によって硬化する。又、光以外の高エネルギー線によって架橋させても差し支えない。高エネルギー線としては、電子線、Ｘ線、α線、β線、γ線のような電磁放射線等がある。
【０１８８】
また、カチオン硬化タイプの紫外線硬化型エポキシ樹脂接着剤は、主たる硬化剤として紫外線等の光照射による光分解でルイス酸触媒を放出するルイス酸塩型硬化剤を含み、光照射により発生されたルイス酸が触媒となって主成分であるエポキシ樹脂がエポキシ、ビニルエーテル等の樹脂を用いたカチオン重合型の反応機構により重合し、硬化するタイプの接着剤である。この主成分であるエポキシ樹脂としては、エポキシ化オレフィン樹脂、脂環式エポキシ樹脂、ノボラックエポキシ樹脂等が挙げられる。また、上記硬化剤としては、芳香族ジアゾニウムのルイス酸塩、ジアリルヨードニウムのルイス酸塩、トリアリルスルホニウムのルイス酸塩、トリアリルセレニウムのルイス酸塩等が挙げられる。これらのうちでは、ジアリルヨードニウムのルイス酸塩が好ましい。
【０１８９】
樹脂接着剤１４として、熱可塑性エラストマーを使うことも可能である。その例としては、スチレン−ブタジエンブロックコポリマーをはじめ、スチレン−ブタジエン−スチレン、スチレン−イソプレン−スチレン、スチレン−ブタジエン−エチレン−スチレン、アクリロニトリル−ブタジエン−スチレンなどが挙げられる。
【０１９０】
熱可塑性エラストマーのソフトセグメント成分としては、１，３−ブタジエン、イソプレン、２，３−ジメチル−１，３−ブタジエン、１，３−ペンタジエン、２−メチル−３−エチル−１，３−ブタジエン、３−メチル−１，３−ペンタジエン、２−エチル−１，３−ペンタジエン、１，３−ヘキサジエン、２−メチル−１，３−ヘキサジエン、１，３−ヘプタジエン、３−メチル−１，３−ヘプタジエン、１，３−オクタジエン、３，４−ジメチル−１，３−ヘキサジエンなどを挙げることが出来るが、特に１，３−ブタジエン、イソプレンなどが好適である。また、これらの共役ジエンと共重合可能なビニル単量体としてはエチレンなどを挙げることが出来る。これらの単量体は、上記共役ジエンの重合速度を低下させない範囲で共重合することができる。実用的見地からは、これらのビニル単量体の量は、共役ジエンの重量の１／１０以下であることが好ましい。
【０１９１】
熱可塑性エラストマーのハードセグメント成分としては、スチレンのほかｏ−メチルスチレン、ｍ−メチルスチレン、ｐ−メチルスチレン、２，４−ジメチルスチレン、エチルスチレン、ｐ−ｔｅｒｔ−ブチルスチレンなどの核アルキル置換スチレン、モノクロルスチレン、ジクロルスチレン、ジブロムスチレン、トリブロムスチレンなどの核ハロゲン置換スチレン、α−メチルスチレン、α−メチル−ｐ−メチルスチレンなどのα−アルキル置換スチレンなどを指すが、代表的なものとしては、スチレン単独あるいはその一部をスチレン以外の上記ビニル芳香族単量体で置き換えた単量体混合物がある。ここで言う上記不飽和ニトリル単量体とは、アクリロニトリル、メタクリロニトリルなどであるが、代表的なものはアクリロニトリルである。
上記ソフトセグメント成分とハードセグメント成分の重量比に特に制約はなく、目的に応じ調整される。
【０１９２】
また、熱可塑性エラストマーの分子量に特に制約は無く、常用の１，０００〜５００，０００であれば良い。好ましい分子量の範囲は５，０００〜１００，０００である。
【０１９３】
樹脂接着剤１４には、必要に応じて、乾燥剤（吸湿剤）の他に、分散剤、チクソトロピー性付与剤、消泡剤、レベリング剤、希釈剤、可塑化剤、酸化防止剤、金属不活性化剤、カップリング剤や充填剤などの添加剤を配合してもよい。特に、乾燥剤は、実装体に用いられるガラスにもともと吸着している微量の水分や樹脂中に含まれる水分を捕獲吸収して有機ＥＬ素子の寿命をさらに向上させるのに有効である。このような乾燥剤の例として、例えば、酸化カルシウム（ＣａＯ）、酸化バリウム（ＢａＯ）、酸化マグネシウム（ＭｇＯ）等のアルカリ土類金属酸化物； 硫酸リチウム（Ｌｉ_２ＳＯ_４）、硫酸ナトリウム（Ｎａ_２ＳＯ_４）、硫酸カルシウム（ＣａＳＯ_４）、硫酸マグネシウム（ＭｇＳＯ_４）、硫酸コバルト（ＣｏＳＯ_４）、硫酸ガリウム（Ｇａ_２（ＳＯ_４）_３）、硫酸チタン（Ｔｉ（ＳＯ_４）_２）、硫酸ニッケル（ＮｉＳＯ_４）等の硫酸塩が挙げられる。乾燥剤の含有量は、その種類等に応じて適宜設定すれば良いが、通常、樹脂接着剤の樹脂成分１００重量部に対して乾燥剤１重量部以上８０重量部以下程度とすれば良い。好ましくは乾燥剤５重量部以上７０重量部以下程度、最も好ましくは乾燥剤１０重量部以上５０重量部以下程度とすれば良い。
【０１９４】
また、樹脂接着剤１４の接着力を向上させるために粘着付与剤を加えてもよく、例えば、ジシクロペンタジェン樹脂、ロジン、変性ロジン、テルペン樹脂、キシレン樹脂、テルペン−フェノール樹脂、アルキルフェノール樹脂、クマロン−インデン樹脂等が使用でき、これらを必要に応じて単独あるいは２種以上併用して用いる。また、エポキシシラン、アミノシラン、アクリルシランなどの汎用のシランカップリング剤を使用すると、ガラスとの密着性を向上させることができる。
【０１９５】
また、粘着性調整剤として、例えば、ジオクチルフタレートをはじめとする各種可塑剤類等を使用してもよい。
【０１９６】
上記のような樹脂接着剤は、通常、汎用の溶剤に溶解させて成形に用いるが、無溶剤のまま使用することもできる。金属分散剤などと共に攪拌・混合して使用してもよい。成形する際に使用する溶剤として、例えば、アセトン、ジエチルケトン、メチルアミルケトン、シクロヘキ サノン等のケトン系溶剤、トルエン、キシレン等の芳香族系溶剤、メチルセロソルブ、メチルセロソルブアセタート、エチルセロソルブアセタート等のセロソルブ系溶剤、乳酸エチル、酢酸ブチル、酢酸イソアミル、プロピレングリコールメチルエーテルアセテート、プロピレングリコールエチルエーテルアセテート、ピルビン酸メチル、ピルビン酸エチル、ピルビン酸プロピル等のエステル系溶剤、メタノール、エタノール、プロパノール、プロピレングリコールメチルエーテル、プロピレングリコールエチルエーテル、プロピレングリコールプロピルエーテル等のアルコール系溶剤などが挙げられ、必要に応じて単独又は２種類以上組み合わせて用いることができる。
【０１９７】
樹脂接着剤１４を支持する基材１６の材質としては、例えば、ポリスチレン樹脂、アクリル樹脂、ポリメチルメタクリレート樹脂、ポリカーボネート樹脂、ポリ塩化ビニル樹脂、ポリ塩化ビニリデン樹脂、ポリエチレン樹脂、ポリプロピレン樹脂、ポリアミド樹脂、ポリアミドイミド樹脂、ポリエーテルイミド樹脂、ポリエーテルケトン樹脂、ポリアリレート樹脂、ポリアセタール樹脂、ポリブチレンテレフタレート樹脂、ポリエチレンテレフタレート樹脂などの熱可塑性ポリエステル樹脂、酢酸セルロース樹脂、フッ素樹脂、ポリスルホン樹脂、ポリエーテルスルホン樹脂、ポリメチルペンテン樹脂、ポリウレタン樹脂、フタル酸ジアリル樹脂などの熱可塑性樹脂又は熱硬化性樹脂からなるフィルムを挙げることができる。
【０１９８】
基材１６は、厚みが１０μｍ以上１ｍｍ以下のものが適正である。１０μｍ未満又は１ｍｍ以上では、取り扱いが難しくなる。２０μｍ以上５００μｍ以下が更に好ましく、３０μｍ以上２００μｍ以下が最も好ましい。
【０１９９】
基材１６は、少なくとも樹脂接着剤１４を支持する面が離型性を有していればよく、基材表面をシリコーンのような剥離剤で離型処理をしたものや、ポリエチレン、ポリプロピレン、ＰＥＴ等のような離型性を有する材料で基材自体を形成した剥離シートが利用可能である。離型性の基材１６上に配置された条部材１３及び樹脂接着剤１４を、別の離型性を有する基材で被覆することによって、樹脂接着剤が保護される。基材１６の両面が離型性を有すると、樹脂接着剤１４及び条部材１３が基材１６上に支持されたシート状封止材をロール上に巻き取って保存することができる。これらの場合、２つの離型性面の離型性の程度に差があることが必要である。つまり、樹脂接着剤フィルムが形成される基材面の表面張力が、背面または他方の基材の表面の表面張力よりも大きくなければならない。離型処理の程度は、濡れ指数液（和光純薬（株）製）を用いて簡易的に測定することができ、濡れ指数で５ｄｙｎ／ｃｍ以上の差があることが望ましい。この差が５ｄｙｎ／ｃｍ未満では、ロール状に巻き取ったシート状封止材を使用時に引き出すと樹脂接着剤が基材の背面に転写することがある。
【０２００】
［シート状封止材の第２の実施形態］
この実施形態のシート状封止材では、条部材１３は、図２８（ａ）に示すように、表面に離型処理を施した基材１６によって支持されるフィルム状の樹脂接着剤１４の上に載設される。このシート状封止材の利点は、製造が容易であることであり、樹脂接着剤１４として軟らかい樹脂を用いれば、基板に貼着する際にシート状封止材を基板に対して軽く押圧することにより、条部材１３が樹脂接着剤１４のフィルムに埋め込まれる。
【０２０１】
このようなシート状封止材は、離型処理を施した基材１６上に、ロールコート法、印刷法、スピンコート法等の薄膜形成技術を用いて樹脂接着剤１４のフィルムを形成し、その上に条部材１３を配置することによって製造される。条部材１３をフィルム上に配置する際に織機等を用いると、複数の条部材を平行に並べて同時に送り出すことができる。離型処理した別の基材を介して、あるいは、ロールラミネータ等を用いて、条部材をフィルムに押圧することによって条部材はフィルム上に固着する。
【０２０２】
［シート状封止材の第３の実施形態］
この実施形態のシート状封止材では、表面に離型処理を施した基材１６によって支持されるフィルム状の樹脂接着剤１４は、図２８（ｂ），（ｃ），（ｄ）に示すように、条部材１３に対応した形状つまり同じ幅のスリットを有し、条部材１３はスリット内に内接配置されて基材１６上に直接支持される。このシート状封止材の利点は、スリットがフィルムを貫通することにより、封止材を被着体（基板）に貼着した時に条部材１３と被着体との間に樹脂接着剤１４が存在しないため、金属層２と被着体とが確実に当接し金属層２が被着体に密着する確度が高いことである。
【０２０３】
このようなシート状封止材は、ロールコート法、印刷法、スピンコート法等の薄膜形成技術及びマスク等の成形器材を用いて、スリットを有する樹脂接着剤１４の層を、離型処理した基材１６上に形成し、スリット内に条部材１３を配置することによって製造される。条部材１３をスリット内に配置する際に、織機等を用いると複数の条部材１３を平行に並べて同時に送り出すことが容易である。スリットから外れている条部材がある場合には、離型処理した別の基材を介して、あるいは、ロールラミネータ等を用いて、条部材を押圧しスリット内に適正に納めることができる。
【０２０４】
［シート状封止材の変形例］
シート状封止材において、条部材１３は、図２６（ｆ）のように直線上に配置されるものに限定されず、基板の封止形態に応じて条部材１３の配置形状を適宜変えることができる。例えば、離型処理した基材１６上に、円環、楕円環、多角環等のような幾何学的に閉じた形状の樹脂接着剤１４のフィルムを設け、これに対応した環状に条部材１３を配置して、条部材１３を図２６のようにフィルム内に埋設したり、図２８（ａ）のようにフィルム上に載置することができる（図３２参照）。また、大きさが異なる同心環状のスリットを有する樹脂接着剤フィルムを形成して、対応する同心環状の条部材をスリットに配置すると、図２８（ｂ）〜（ｄ）のように条部材及び樹脂接着剤フィルムが交互に並ぶように構成される。封止は、幾何学的に閉じた形状で行われるので、末端を有する条部材を用いて封止する際には条部材のつなぎ目の遮蔽性が問題になる。従って、封止形状に合わせて、条部材１３を幾何学的に閉じた形状に予め成形すると、条部材のつなぎ目における透湿の問題を無くすことができ、有利である。環状の条部材は、芯材１を環状に成形して同様に金属層２を形成することにより製造できる。
【０２０５】
［シート状封止材の製造方法］
上述の第１〜３の実施形態を例としてシート状封止材の製造方法を説明する。
【０２０６】
まず、図２（ａ）に示すような線径１μｍ以上５ｍｍ以下の条状の芯材１の表面を、プラスチック製の場合にはコロナ処理、プラズマ処理、易接着コート（プライマー）処理などの表面処理を施し、電解めっき、無電解めっき、融着めっき法等を利用して、芯材１の外周に低融点金属で厚さ１μｍ〜５ｍｍの金属層２を形成して条部材１３を得る。めっき方法では、例えば、芯材にシーダ処理を施し、無電解銅又は無電解ニッケルめっきを施した後に、低融点金属の電解めっきを行うことによりに良好に金属の被覆ができる。融着法では、融解した低融点金属を直接条部材上に融着する。
【０２０７】
次に、ロールコート法、印刷法あるいはスピンコート法などの被膜形成技術を用いて、離型性を有する基材もしくは離型処理した基材１６上に、図２９（ａ）に示すように、樹脂接着剤のフィルムを形成する。あるいは、マスクなどを介して樹脂接着剤１４をコーティングすることにより、図２９（ｂ）に示すように、所定のスリットを有する形状に樹脂接着剤１４のフィルムを形成して基材表面が曝される部分を残す。樹脂接着剤の粘度は、樹脂接着剤フィルムの所望の厚さに応じて適宜調節され、樹脂接着剤が溶媒を含む組成物の場合は溶媒の添加量によって、樹脂接着剤が無溶媒系の場合は希釈モノマーの使用量などによって調節できる。
【０２０８】
最後に、図２８（ａ）に示すように作製した樹脂接着剤フィルム上に条部材１３を配置する。あるいは、図２８（ｂ）〜（ｄ）に示すように条部材１３を樹脂接着剤フィルムのスリット内に配置する。この際、条部材を一本づつ順次配置しても、織機等を用いて複数の条部材を平行に並べて同時に配置してもよい。配置された条部材１３は、別の離型処理基材を介して、或いは、ロールラミネータ等により直接、樹脂接着剤に圧着することによりフィルム上又はスリット内に固定される。フィルム上の条部材１３への圧力を増すことによって、条部材１３は、図２６（ａ）〜（ｃ），（ｅ）のようにフィルム中に埋設される。条部材１３を樹脂接着剤内に埋設した後に更に樹脂接着剤フィルムを積層すれば図２６（ｄ）のシート条封止材が得られる。条部材１３の位置は、上下２層に分けて成膜した樹脂接着剤フィルムを用いれば正確に制御できる。
【０２０９】
複数の条部材を平行に配置したシート状封止材は、条部材１３の軸方向に沿って適宜裁断することにより、図２７（ａ）〜（ｃ）に示すように、必要数の条部材１３を含んだ封止材が作成される。
【０２１０】
［実装体の製造］
シート状封止材を用いて、機能素子を基板間に封止した実装体を製造するプロセスを図３０（ａ）〜（ｅ）を参照して以下に説明する。ここでは、上述の第１の実施形態に係るシート状封止材を用い、図１に要部断面図として示されるＥＬ表示装置を製造する例を示すが、本発明はこれに限られるものではない。
【０２１１】
基板５及び対向基板（表示素子保護基板）６は、有機ＥＬ素子の発光層からの発光に対して高い透過性を与える電気絶縁性物質からなっているもの（「透光性基板」と称する）又は電気絶縁性の非透光性基板を用いる。トップエミッション方式では、対向基板６に透光性基板を用い、基板５は透光性基板及び不透光性基板のいずれでもよい。ボトムエミッション方式では、基板５に透光性基板を用い、対向基板５には透光性基板及び不透光性基板のいずれでもよい。透光性材料には、透明又は半透明なガラス、ＰＥＴ、ポリカーボネート、非晶型ポリオレフィンなどが挙げられる。不透光性材料にはステンレス鋼などがある。基板５及び対向基板６は、これらの材料を薄膜に成形した可撓性を有するでもよい。但し、封止材を用いて封着する際に係る圧力や熱に対して耐圧性、耐熱性を有する必要がある。
【０２１２】
まず、図３０（ａ）に示すように、基板５の片面上にＡｌ−Ｌｉ合金等からなる下部電極（陰極）７が形成され、この上に、図３０（ｂ）のように、オキサジアゾール誘導体やトリアゾール誘導体等からなる電子輸送層８、発光層９、ＴＰＤ等からなる正孔輸送層１０及び上部電極（陽極）１１を抵抗加熱蒸着法やイオンビームスパッタ法等の薄膜形成方法により積層して有機ＥＬ素子１２が構成される。これを表示素子基板と称する。更に、下部電極７上の表示素子が搭載されていないエリアの封止材で封着する位置に絶縁膜１５が形成される。絶縁膜１５は、窒化ケイ素（ＳｉＮ）、酸化ケイ素（ＳｉＯ_２）又はＳｉＮＯなどを蒸着やスパッタなどの方法により形成する。この絶縁膜１５は、金属層を有し導電性である本発明の封止材によって下部電極７がショートするのを防止するために設けられ、電極の腐食防止等の効果も有する。絶縁膜１５の厚さは、１０ｎｍ〜１００μｍの範囲で形成すればよく、１００ｎｍ〜１０μｍが最も適している。有機ＥＬ素子１２の層構造は上記のものに限定されず、表示素子として機能するものであればよく、前述の実装体の第１の実施形態において記載した（１）〜（４）の層構造が挙げられる。
【０２１３】
尚、図３０はトップエミッション方式の実装を示し、上部電極１１は透明電極であるが、ボトムエミッション方式の場合は、有機ＥＬ素子１２の積層順序が逆になり、下部電極７が透明電極となる。同様に、素子を構成する各層の材料も特に限定されるものではなく、表示素子が得られさえすれば種々の材料を使用することができる。
【０２１４】
次に、図３０（ｃ）に示すように、対向基板（保護基板）６を基板５と向かい合わせた時に有機ＥＬ素子１２を囲むように、対向基板５の絶縁膜１５と対応する位置にシート状封止材Ｓを貼り付けて基材１６を剥離除去する。樹脂接着剤１４の貼着に必要ならば、シート状封止材を加温又は加圧する。
【０２１５】
更に、図３０（ｄ）に示すように、対向基板（保護基板）６を基板５と向かい合わせて、露出した樹脂接着剤１４を絶縁膜１５に貼着する。この作業を乾燥窒素で置換したグローブボックス中で行うと、空気中の水分や酸素を２枚の基板間に閉じ込めることがないため、有機ＥＬ素子１２の寿命の点から好ましい。
【０２１６】
図３０（ｄ）の樹脂接着剤１４の軟化に必要ならば加熱し、図３０（ｅ）に示すように、対向基板６を基板５に抗して相対的に加圧して金属層２を基板５の絶縁膜１５及び対向基板６に接触させ、芯材１を弾性圧縮させる。加圧圧力は１０ｋＰａ〜５０ＭＰａが好適である。この状態で、樹脂接着剤１４を流動状態から硬化させて接合を形成する。樹脂接着剤の硬化は、熱硬化性樹脂を用いた場合や架橋剤による硬化の場合は加熱、放射線硬化樹脂の場合は放射線照射が適用される。この結果、芯材１のスペーサとしての機能により基板５と対向基板６との間に保持される空間に有機ＥＬ素子１２が封止されたＥＬ表示装置としての実装体が得られる。この状態において、弾性圧縮状態の芯材１が元の形状に戻ろうとする力が働き、そのスプリング効果によって、金属層２が基板及び対向基板に押圧され密着する。又、樹脂接着剤の硬化収縮によってもスプリング効果が生じる。
【０２１７】
樹脂接着剤１４の硬化によって接合が形成される前に、金属層２が熱により軟化又は溶融すると、金属層２の界面が被着体（基板）表面の微細な凹凸にも適合し、透湿防止性が高まる。
【０２１８】
シート状封止材は、図３０（ｃ）のように対向基板６に貼着する代わりに、前述の実施形態と同様に基板５の絶縁膜１５に封止材を貼着して図３０（ｄ）のように組み立ててもよい。
【０２１９】
図３０（ｂ）のように基板５上にフィルム状封止材を貼り付けるときの代表的な封止材の配置形状を図３１（ａ）〜（ｄ）に示す。図３１（ａ）は、４片のシート状封止材Ｓａ〜ｄを四角形の有機ＥＬ素子１２の各辺に沿って基板周縁部に配置する配置形状の平面図で、封止材は４点で交差する。図３１（ｂ）は、１片のシート状封止材Ｓが四角形の有機ＥＬ素子１２の４辺に沿って基板周縁部１周する配置形状を示し、封止材は１点のみで交差する。図３１（ｃ）では、１片のシート状封止材Ｓが四角形の有機ＥＬ素子１２の４辺に沿って基板周縁部を１周し、封止材は交差することなく両末端が重なる。図３１（ｄ）は、４片のシート状封止材Ｓａ〜ｄを四角形の有機ＥＬ素子１２の各辺に沿って基板周縁部に配置するが、２片Ｓｂ，ｄの両末端は他の２片Ｓａ，ｃにＴ字状に当接し、交わらない。
【０２２０】
シート状封止材は、素子を外気から完全に遮断するように配置されればよいので、配置形状は上記の例に限られない。又、基板上に形成された表示素子を封止材で囲んで封止可能なものであれば、基板の形状はどの様な形状でもよい。
【０２２１】
図３２は、封止材の封止確度を高めるために、幾何学的に閉じた形状にシート状封止材を成形した例を示し、この例のシート状封止材Ｓ’は、四角形の素子を囲むように四角環状に成形される。
【０２２２】
図３３は、図３０（ａ）〜（ｅ）において有機ＥＬ素子の代わりに無機ＥＬ素子２０を形成し、ＥＬ表示装置を製造する例を示す。図３３（ａ）において図３０（ａ）と同様に下部電極７を設けた基板５は、図３３（ｂ）において、絶縁膜２１、発光層２２、絶縁膜２３及び電極（Ａｌ）２４を積層して無機ＥＬ素子２０を設け、封止する部分に絶縁膜１５を設ける。シート状封止材で封止する図３３（ｃ）〜（ｅ）の工程は、図３０（ｃ）〜（ｅ）の工程と同様であるので説明は省略する。
【０２２３】
図３４は、図３０（ａ）〜（ｅ）において有機ＥＬ素子の代わりに太陽電池素子３０を形成した封止体を製造する例を示す。図３４（ａ）において図３０（ａ）と同様に下部電極７を設けた基板５は、図３４（ｂ）において、太陽電池素子３０及び電荷輸送層３１を積層し、封止する部分に絶縁膜１５を設ける。シート状封止材で封止する図３４（ｃ）〜（ｅ）の工程は、図３０（ｃ）〜（ｅ）の工程と同様である。
【０２２４】
【実施例】
以下、実施例を参照して、本発明を説明する。但し、本実施例は、発明を限定するものではない。
【０２２５】
先ず、以下に示す記載に従って実装体を作製し、下記の評価方法によって、得られた実装体を評価した。評価結果を表１〜２２に示す。尚、実装体の作製に用いた材料の物性は下記の測定方法に従って得た。
【０２２６】
［測定方法及び評価方法］
（１）プラスチックワイヤの圧縮弾性率
プラスチックワイヤの圧縮弾性率は、ＪＩＳ Ｋ−７１６１に基づき、各プラスチックワイヤを融点以上で加熱・加圧してフィルム化し、ダンベルで所定形状に打ち抜いた後、（株）オリエンテック製、テンシロン／ＵＴＭ−４−１００を使って測定した。
【０２２７】
（２）プラスチックワイヤ、金属ワイヤ及び金属管ワイヤの平均線径、金属管ワイヤの肉厚
注形用エポキシ樹脂（エピコート８２８／トリエチレンテトラミン＝１０／１）中に金属被覆プラスチックワイヤ、金属ワイヤなどの芯材を投入して硬化させた後、ワイヤの部分が露出するまで注形樹脂の表面を研磨し、走査型電子顕微鏡（（株）日立製作所製、Ｓ−４７００）で観察した。画像処理によって線径を算出し、各サンプルについて１０点の値をとってその平均値を平均線径とした。
【０２２８】
（３）金属の融点
ホットプレート上にサンプルを乗せ、５℃／分の昇温速度で加熱しながら、光学顕微鏡（オリンパス社製、ＢＨ−２）により倍率１００倍で観察した。固体金属が１００％液状化したときの温度を融点とした。
【０２２９】
（４）金属層の厚さ
平均線径の測定と同様に、注形用エポキシ樹脂中に金属被覆した芯材を投入して硬化させた後、芯材部分が露出するまで注形樹脂の表面を研磨し、走査型電子顕微鏡（（株）日立製作所製、Ｓ−４７００）で観察した。画像処理によって金属層の厚さを算出し、１０点の値をとってその平均値を計算した。芯材が金属ワイヤの場合も同様にして、硬化樹脂中の芯材の断面を走査型電子顕微鏡で観察することにより測定した。その際、最外層の低融点金属層の厚さを金属層の厚さとした。
【０２３０】
（５）プラスチックワイヤ、金属ワイヤ、金属管の被覆率
平均線径の測定と同様に、注形用エポキシ樹脂中に金属被覆芯材を投入して硬化させた後、芯材部分が露出するまで注形樹脂の表面を研磨し、走査型電子顕微鏡（（株）日立製作所製、Ｓ−４７００）で観察した。画像処理により、金属によるワイヤの被覆率を算出し、１０点の値の平均値をとった。
【０２３１】
（６）樹脂組成物の軟化温度
ＪＩＳ Ｋ−７２０６に基づいて樹脂組成物のビカット軟化温度を測定した。
【０２３２】
（７）ＭＩ
ＪＩＳ Ｋ−７２１０に基づいて、手動切り取り法により、測定温度１２５℃、試験荷重３．２Ｎで樹脂組成物のＭＩを測定した。
【０２３３】
（８）樹脂組成物の硬化温度
示差熱走査熱量計（パーキン・エルマー社製、ＤＳＣ−２）を使って、５℃／分の昇温速度で熱量測定を行い、発熱ピーク時の温度を硬化温度とした。
【０２３４】
（９）樹脂組成物の塗布厚
（株）ピーコック社製の厚みゲージ（ＰＤＳ−２）を使い、５点の値の平均値をとった。
【０２３５】
（１０）透湿度
ＪＩＳ Ｋ−７１２９（感湿センサ法）に準拠して、０．７ｍｍ厚のソーダガラス２枚の間を封止材で封止し、サンプルの封止材内外に湿度差を設け、室温における封止材内外の水蒸気量の変化を感湿センサで測定した。２４ｈの間に高湿側から低湿側に移動した水蒸気の量を定量することによって透湿度を算出した。
【０２３６】
（１１）接着力
各実施例及び比較例の条件に従って、０．７ｍｍ厚のソーダガラス２枚の間を封止材で封止し、レオメータ（不動工業（株）製、ＮＲＭ−３００２Ｄ−Ｈ）を使って、剥離速度５０ｍｍ／分におけるせん断の接着強度を測定した。
【０２３７】
（１２）ダークスポット面積比
ＣＣＤカメラを備えた光学顕微鏡（オリンパス社製、ＢＨ−２）で、倍率８００倍で有機ＥＬ素子発光面を観察した。得られた画像を画像処理により二値化することによってダークスポット面積比を測定した。
【０２３８】
（実験Ａ１） まず、表１に示す条件でサンプルを作成した。すなわち、ポリスチレンペレットＳＤ１２０（旭化成工業（株）製、弾性率１．８ＧＰａ）を融点以上に加熱溶融した後、徐冷してゲル状の球晶を得た。この集積物を圧縮成形して得られた厚さ５ｍｍのシートを直径１ｍｍのダイを通して超延伸し、平均線径１ｍｍ、長さ０．１ｍのポリスチレン製のプラスチックワイヤを得た。得られたポリスチレンワイヤ上に、塩化パラジウムによるシーダ処理を施した後、無電解ニッケルめっき液中でニッケル層を０．２μｍ析出させた。その後、常法により、Ｉｎ／Ｃｄ＝７４／２６の共晶はんだのめっき浴中で、はんだ被覆層の厚さが１００μｍになるまで電解めっきを施した。このようにして得られたはんだ被覆ポリスチレンワイヤを、２５ｍｍ×１００ｍｍのソーダガラスの周辺に配置し、８０℃に加熱溶融したエポキシ樹脂組成物（（株）アルファ技研製、アルテコ３５００、変性エポキシ樹脂／変性ポリアミン＝１００／５０）を、ディスペンサーにて樹脂厚の対ワイヤ径比が１００％（＝１．０ｍｍ）になるようにはんだ被覆ポリスチレンワイヤの両側に塗布した。樹脂の軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のガラスを向かい合わせにして貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して樹脂を硬化し、接着力測定用のサンプルとした。一方、１００ｍｍ×１００ｍｍのソーダガラス上の４辺にはんだ被覆ポリスチレンワイヤを配置し、樹脂層及びはんだ被覆ポリスチレンワイヤの幅の合計が２ｍｍになるようにはんだ被覆ポリスチレンワイヤの両側に樹脂厚が１．０ｍｍの該エポキシ樹脂組成物を塗布した。その後、樹脂の軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のソーダガラスを貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して樹脂を硬化し、透湿度測定用のサンプルとした。そして、表１に示す条件のもと、評価試験を行い、表１に示す結果を得た。
【０２３９】
（実験ａ１） 表４に示す条件でサンプルを作成した。すなわち、実験Ａ１で使用したポリスチレンワイヤの線径を７ｍｍのものを使用した以外は、すべて実験Ａ１と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして、表４に示す条件のもと、評価試験を行い、表４に示す結果を得た。この実験ａ１を実験例Ａ１と対比すると、実験ａ１では透湿度が高くなり、プラスチックワイヤの線径は１．０ｍｍの方が７．０ｍｍより適していることが分かる。
【０２４０】
（実験Ａ２） 表１に示す条件でサンプルを作成した。つまり、実験Ａ１で使用したポリスチレンペレットの代わりに、ポリエチレン（製鉄化学（株）製、フロービーズＣＬ１２００７、平均粒径１．０ｍｍ）を使い、実験Ａ１と同様に、超延伸法により、平均線径２．０ｍｍ、長さ０．１ｍのポリエチレン製のプラスチックワイヤを得た。得られたワイヤ上に、塩化パラジウムによるシーダ処理を施した後、無電解ニッケルめっき液中で、ニッケル層を０．２μｍ析出させた。その後、常法により、Ｐｂ／Ｓｎ＝５／９５（融点１８３℃）の共晶はんだのめっき浴中で、はんだ被覆ワイヤの直径が３．０ｍｍになるまで電解めっきを施した。樹脂として７０℃に加熱溶融したアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２Ｇ）を用い、ソーダガラス上に配置する樹脂厚の対ワイヤ径比を１２５％（＝２．５ｍｍ）とし、樹脂の硬化は実験Ａ１の硬化温度での加熱に代えて１．０Ｊ／ｃｍ^２のＵＶ照射によって行い、それ以外は実験Ａ１と同様にして、接着力測定用のサンプル及び透湿度測定用のサンプルを作製した。そして、表１に示す条件のもと、評価試験を行い、表１に示す結果を得た。
【０２４１】
（実験ａ２） 表４に示す条件でサンプルを作成した。すなわち、実験Ａ２で使用したポリエチレンワイヤに代えて、圧縮弾性率が０．１ＧＰａで線径が１．０ｍｍのポリエチレンワイヤを使用し 樹脂塗布厚の対ワイヤ径比を１００％とした以外はすべて実験Ａ２と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして、表４に示す条件のもと、評価試験を行い、表４に示す結果を得た。この実験ａ２を実験Ａ２と対比すると、実験ａ２では透湿度が高くなり、芯材の圧縮弾性率は０．５ＧＰａの方が０．１０Ｇｐａより適していることが分かる。
【０２４２】
（実験Ａ３） 表１に示す条件でサンプルを作成した。つまり、実験Ａ１で使用したポリスチレンペレットの代わりに、ＰＭＭＡペレット（三菱レーヨン（株）製、アクリルペレットＩＲＤ−５０、平均粒径５．０ｍｍ）を用いて平均線径５．０ｍｍ、長さ０．１ｍのＰＭＭＡ製のプラスチックワイヤを作製し、被覆金属としてＩｎ／Ｃｄの代わりに共晶はんだＴＩ／Ｎａ＝９３．７／６．３（融点２３８℃）を用い、共晶はんだを金属の融着によりワイヤ上に被覆し、ダイヤモンドダイスによりはんだ被覆厚が３．０ｍｍになるように調節した。更に、樹脂組成物としてエポキシ樹脂に代えてフェノール樹脂（住友ベークライト（株）製フェノール樹脂ＰＭ−８２００）を使用し、ソーダガラス上に配置する樹脂厚の対ワイヤ径比は１５０％（＝７．５ｍｍ）として、実験Ａ１と同様に、軟化温度及び１２０℃での加熱加圧を経て、実験Ａ１と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして表１に示す条件のもと、評価試験を行い、表１に示す結果を得た。
【０２４３】
（実験ａ３） 表４に示す条件でサンプルを作成した。すなわち、実験Ａ３で使用した被覆金属をＰｂ１００％のものに代えたこと以外はすべて実験Ａ３と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして、表４に示す条件のもと、評価試験を行い、表４に示す結果を得た。この実験ａ３を実験Ａ３と対比すると、実験ａ３では透湿度が高くなり、被覆金属の組成は、ＴＩ／ＮＡ＝９３．７／６．３ の方が鉛（Ｐｂ）１００％よりも適していることが分かる。
【０２４４】
（実験Ａ４） 表１に示す条件でサンプルを作成した。つまり、実験Ａ１で使用したポリスチレンペレットの代わりに６６ナイロンのペレット（東レ（株）製、アラミンＣＭ３００７、平均粒径０．５ｍｍ）を用いて平均線径０．５ｍｍのワイヤを作製し、被覆金属としてＩｎ／Ｃｄの代わりに共晶はんだＳｎ３５／Ｉｎ４５／Ｂｉ_２Ｏ（融点９８℃）を用いて、金属の融着により共晶はんだをワイヤ上に被覆し、ダイヤモンドダイスによりはんだ被覆厚が１．０ｍｍになるように調節した。更に、樹脂組成物としてエポキシ樹脂に代えてメラミン樹脂（日立化成工業（株）製メラン５２３）を使用し、ソーダガラス上に配置する樹脂厚の対ワイヤ径比は１００％（＝０．５ｍｍ）として、実験Ａ１と同様に、軟化温度及び１２０℃での加熱加圧を経て接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１に示す条件のもと、評価試験を行い、表１に示す結果を得た。
【０２４５】
（実験ａ４） 表４に示す条件でサンプルを作成した。すなわち、実験Ａ４で使用した金属の厚さを７ｍｍとした以外は、すべて実験Ａ４と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして、表４に示す条件のもと、評価試験を行い、表４に示す結果を得た。この実験ａ４を実験Ａ４と対比すると、実験ａ４では接着力が低くなり、金属の厚さは１．０ｍｍの方が７．０ｍｍよりも適していることが分かる。
【０２４６】
（実験Ａ５） 表１に示す条件でサンプルを作成した。つまり、実験Ａ１で使用したポリスチレンペレットの代わりにポリエステルのペレット（東レ（株）製、シベラスＬ２０４Ｇ３５、平均粒径０．３ｍｍ）を用いて線径１０ｍｍのワイヤを作製し、Ｉｎ／Ｃｄの代わりに共晶はんだＳｎ／Ｉｎ＝４８／５２（融点１１７℃）を０．０５ｍｍ厚に被覆した。樹脂組成物としてエポキシ樹脂に代えてキシレン／アクリル樹脂＝８０／２０（キシレン樹脂：三菱瓦斯化学（株）製、ニカノールＨＰ−１００、アクリル樹脂：帝国化学産業（株）製、ＨＴＲ−８６０Ｐ−３）を使用し、ソーダガラス上に配置する樹脂厚の対ワイヤ径比は８０％（＝８ｍｍ）になるようにして、実験Ａ１と同様に、軟化温度及び１２０℃での加熱加圧を経て、実験Ａ１と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１に示す条件のもと、評価試験を行い、表１に示す結果を得た。
【０２４７】
（実験ａ５） 表４に示す条件でサンプルを作成した。すなわち、実験Ａ５で使用した低融点金属によるプラスチックワイヤの被覆率を４０％とした以外は、すべて実験Ａ５と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして表４に示す条件のもと、評価試験を行い、表４に示す結果を得た。この実験ａ５を実験Ａ５と対比すると、実験ａ５では透湿度が高くなり、金属によるプラスチックワイヤの被覆率は９９％の方が４０％よりも適していることが分かる。
【０２４８】
（実験Ａ６） 表１に示す条件でサンプルを作成した。つまり、実験Ａ１で使用したポリスチレンペレットの代わりにポリプロピレンのペレット（住友化学（株）製、ノーブレンＨ５０１、平均粒径０．０３ｍｍ）を用いて線径０．５ｍｍのワイヤを作製し、Ｉｎ／Ｃｄの代わりに共晶はんだＢｉ／Ｃｄ＝６０／４０（融点１４４℃）を被覆し、更に樹脂組成物として、エポキシ樹脂に代えてポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ））を使用して、ソーダガラス上に配置する樹脂厚の対ワイヤ径比は１００％（＝０．５ｍｍ）になるようにして、実験Ａ１と同様に、軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１に示す条件のもと、評価試験を行い、表１に示す結果を得た。
【０２４９】
（実験ａ６） 表４に示す条件でサンプルを作成した。すなわち、実験Ａ６で使用したプラスチックワイヤの線径を０．０３ｍｍとした以外は、すべて実験Ａ６と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして図１５に示す条件のもと、特性試験を行い、図１５に示す結果を得た。この実験ａ６を実験Ａ６と対比すると、実験ａ６では透湿度が高くなり、プラスチックワイヤの線径としては０．５ｍｍの方が０．０３ｍｍよりも適していることが分かる。
【０２５０】
（実験Ａ７） 表１に示す条件でサンプルを作成した。つまり、実験Ａ１で使用したポリスチレンペレットの代わりにポリ塩化ビニルのペレット（東ソー（株）製、リューロンペースト７７２、平均粒径０．０５ｍｍ）を用いて線径１ｍｍのワイヤを作製し、Ｉｎ／Ｃｄの代わりに共晶はんだＰｂ／Ｓｎ＝５／９５（融点１８３℃）を被覆し、更に樹脂組成物としてエポキシ樹脂に代えてアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２）を使用し、ソーダガラス上に配置する樹脂厚の対ワイヤ径比は１００％（＝１．０ｍｍ）として、樹脂の硬化は実験Ａ１の加熱に代えて２．４Ｊ／ｃｍ^２のＵＶ照射によって行い、それ以外は実験Ａ１と同様に接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１に示す条件のもと、評価試験を行い、表１に示す結果を得た。
【０２５１】
（実験ａ７） 表４に示す条件でサンプルを作成した。すなわち、実験Ａ７で使用した基板に樹脂を塗布する樹脂厚の対ワイヤ径比を５００％（＝５．０ｍｍ）とした以外はすべて実験Ａ７と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして表４に示す条件のもと、評価試験を行い、表４に示す結果を得た。この実験ａ７を実験Ａ７と対比すると、実験ａ７では透湿度が高くなり、基板に樹脂を塗布する厚みは、１．０ｍｍの方が５．０ｍｍよりも適していることが分かる。
【０２５２】
（実験Ａ８） 表１に示す条件でサンプルを作成した。つまり、実験Ａ１で使用したポリスチレンペレットの代わりに６ナイロンのペレット（東レ（株）製、アラミンＣＭ１００７、平均粒径０．５ｍｍ）を用いて線径０．２ｍｍのワイヤを作製し、Ｉｎ／Ｃｄの代わりに共晶はんだＩｎ／Ｚｎ＝９７．２／２．８（融点１４４℃）を被覆した。ソーダガラス上に配置する樹脂厚の対ワイヤ径比は１００％（＝２００μｍ）として、それ以外は実験Ａ１と同様にして、軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１に示す条件のもと、評価試験を行い、表１に示す結果を得た。
【０２５３】
（実験ａ８） 表４に示す条件でサンプルを作成した。すなわち、実験Ａ８で使用した樹脂組成物を硬化する温度を２１５℃とした以外はすべて実験Ａ８と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして表４に示す条件のもと、評価試験を行い、表４に示す結果を得た。この実験ａ８を実験Ａ８と対比すると、実験ａ８ではＥＬ素子が黒色に変色してしまうという異常が見られ、ＥＬ素子が酸化、腐食化してしまったことが分かった。従って、樹脂組成物の硬化温度は、１２０℃の方が２１５℃より適していることが分かる。
【０２５４】
（実験Ａ９） 表１に示す条件でサンプルを作成した。つまり、実験Ａ１で使用したポリスチレンペレットの代わりに６ナイロンのペレット（東レ（株）製、アラミンＣＭ１００７、平均粒径０．５ｍｍ）を用いて線径０．２ｍｍのワイヤを作製し、Ｉｎ／Ｃｄの代わりに共晶はんだＳｎ／Ｉｎ＝４８／６２（融点１１７℃）を被覆して条部材を得た。ソーダガラス上に実験Ａ１と同様のエポキシ樹脂を０．２ｍｍの樹脂厚で塗布した後に、樹脂の上に条部材を載せ、それ以外は実験Ａ１と同様にして、軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１に示す条件のもと、評価試験を行い、表１に示す結果を得た。
【０２５５】
（実験Ｂ１） 表２に示す条件でサンプルを作成した。つまり、金属銅のインゴットを１１００℃で融解し、水を貯めた回転ドラムの内側にノズルから融液を噴出させた。固化した銅繊維を遠心力によってドラムの内側に巻いて、線径１．５ｍｍ、長さ１ｍの銅ワイヤを作製した。得られた銅ワイヤ上に、常法により、Ｉｎ／Ｃｄ＝７４／２６の共晶はんだのめっき浴中で、はんだ被覆ワイヤの直径が１．２ｍｍになるまで電解めっきを施した。このようにして得られたはんだ被覆銅ワイヤを２５ｍｍ×１００ｍｍのソーダガラスの周部に配置し、８０℃に加熱溶融したエポキシ樹脂組成物（（株）アルファ技研製、アルテコ３５００、変性エポキシ樹脂／変性ポリアミン＝１００／５０）を、はんだ被覆銅ワイヤの両側の基板上に樹脂厚の対ワイヤ径比が１５０％（＝１．５ｍｍ）になるようにディスペンサーにて塗布した。樹脂の軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のガラスが向かい合わせになるようにして貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して樹脂を硬化し、接着力測定用のサンプルとした。一方、１００ｍｍ×１００ｍｍのソーダガラス上の４辺にはんだ被覆銅ワイヤを配置し、樹脂層とはんだ被覆銅ワイヤの幅の合計が２ｍｍ幅になるように該エポキシ樹脂組成物を１．０ｍｍの樹脂厚ではんだ被覆銅ワイヤの両側に塗布した。その後、軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のソーダガラスを貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して樹脂を硬化し、透湿度測定用のサンプルとした。そして、表２に示す条件のもと、評価試験を行い、表２に示す結果を得た。
【０２５６】
（実験ｂ１） 表５に示す条件でサンプルを作成した。すなわち、実験Ｂ１で使用した銅線の代わりに線径が０．０１ｍｍの銅線を使用し、樹脂厚の対ワイヤ径比を１００％（＝０．０１ｍｍ）とした以外は、すべて実験Ｂ１と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして、表５に示す条件のもと、評価試験を行い、表５に示す結果を得た。この実験ｂ１を実験Ｂ１と対比すると、実験ｂ１では透湿度が高くなるとともに、接着力も弱くなり、金属ワイヤの線径としては、１．０ｍｍの方が０．０１ｍｍよりも適していることが分かる。
【０２５７】
（実験Ｂ２） 表２に示す条件でサンプルを作成した。つまり、実験Ｂ１で使用した金属銅の代わりにステンレスを使って、実験Ｂ１と同様にして平均線径０．５ｍｍ、長さ１．０ｍのステンレスワイヤを得た。得られたワイヤ上に、常法により、Ｐｂ／Ｓｎ＝５／９５（融点１８３℃）の共晶はんだのめっき浴中で、はんだ被覆ワイヤの直径が１．５ｍｍになるまで電解めっきを施した。樹脂として７０℃に加熱溶融したアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２Ｇ）を用い、ソーダガラス上に配置する樹脂厚の対ワイヤ径比を２００％（＝１ｍｍ）とし、樹脂の硬化を実験Ａ１の加熱に代えて１．０Ｊ／ｃｍ^２のＵＶ照射によって行い、それ以外は実験Ｂ１と同様にして、接着力測定用のサンプル及び透湿度測定用のサンプルを作製した。そして、表２に示す条件のもと、評価試験を行い、表２に示す結果を得た。
【０２５８】
（実験ｂ２） 表５に示す条件でサンプルを作成した。すなわち、実験Ｂ２で使用した共晶はんだの組成をＰｂ１００％とした以外はすべて実験Ｂ２と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして表５に示す条件のもと、評価試験を行い、表５に示す結果を得た。この実験ｂ２を実験Ｂ２と対比すると、実験ｂ２では透湿度が高くなり、被覆金属の組成としてはＰｂ／Ｓｎ＝５／９５の方がＰｂ１００％よりも適していることが分かる。
【０２５９】
（実験Ｂ３） 表２に示す条件でサンプルを作成した。つまり、実験Ｂ１で使用した金属銅の代わりに鉄を使って、実験Ｂ１と同様にして平均線径１０ｍｍ、長さ１．０ｍの鉄線を得た。得られたワイヤ上に、共晶はんだＢｉ／Ｉｎ＝６７／３３（融点１０９℃）を用いて、被覆したワイヤの直径が１６ｍｍになるように共晶はんだを融着した。はんだ被覆鉄線を２５ｍｍ×１００ｍｍのソーダガラスの周辺に配置し、７０℃に加熱溶融したフェノール樹脂（住友ベークライト（株）製フェノール樹脂ＰＭ−８２００）を、はんだ被覆鉄線の両側に樹脂厚の対ワイヤ径比が１００％（＝１０ｍｍ）となるように塗布した。以下、実験Ｂ１と同様にして、樹脂の軟化温度及び１２０℃での加熱加圧を経て、接着力測定用のサンプル及び透湿度測定用のサンプルを作製した。そして、表２に示す条件のもと、評価試験を行い、表２に示す結果を得た。
【０２６０】
（実験ｂ３） 表５に示す条件でサンプルを作成した。すなわち、実験Ｂ３で使用した低融点金属の金属層の厚さを７．０ｍｍとした以外はすべて実験Ｂ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作成した。そして、表５に示す条件のもと、評価試験を行い、表５に示す結果を得た。この実験ｂ３を実験Ｂ３と対比すると、実験ｂ３では透湿度が高くなってしまい、被覆金属層の厚さとしては３．０ｍｍの方が７．０ｍｍよりも適していることが分かる。
【０２６１】
（実験Ｂ４） 表２に示す条件でサンプルを作成した。つまり、実験Ｂ１で使用した金属銅の代わりにアルミを使い、実験Ｂ１と同様にして、平均線径１．０ｍｍ、長さ１．０ｍのアルミワイヤを得た。得られたワイヤ上に、共晶はんだＳｎ３５／Ｉｎ４５／Ｂｉ_２Ｏ（融点９８℃）を用いて、被覆したワイヤの直径が３．０ｍｍになるように共晶はんだを融着した。７０℃に加熱溶融したメラミン樹脂（日立化成工業（株）製メラン５２３）を、ソーダガラス上に配置する樹脂厚の対ワイヤ径比を１００％（＝１．０ｍｍ）とし、以下、実験Ｂ１と同様にして、樹脂の軟化温度及び１２０℃での加熱加圧を経て、接着力測定用のサンプル及び透湿度測定用のサンプルを作製した。そして、表２に示す条件のもと、評価試験を行い、表２に示す結果を得た。
【０２６２】
（実験ｂ４） 表５に示す条件でサンプルを作成した。すなわち、実験Ｂ４で使用した金属被覆したアルミワイヤの被覆率を４０％とした以外はすべて実験Ｂ４と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表５に示す条件のもと、評価試験を行い、表５に示す結果を得た。この実験ｂ４を実験Ｂ４と対比すると、実験ｂ４では透湿度が高くなり、金属によるアルミワイヤ被覆率は、１００％の方が４０％よりも適していることが分かる。
【０２６３】
（実験Ｂ５） 表２に示す条件でサンプルを作成した。つまり、実験Ｂ１で使用した金属銅の代わりにニッケルを使い、実験Ｂ１と同様にして平均線径１．０ｍｍ、長さ１．０ｍのニッケルワイヤを得た。得られたワイヤ上に、共晶はんだＳｎ／Ｉｎ＝４８／５２（融点１１７℃）を被覆し、更に樹脂組成物として、キシレン／アクリル樹脂＝８０／２０（キシレン樹脂：三菱瓦斯化学（株）製、ニカノールＨＰ−１００、アクリル樹脂：帝国化学産業（株）製、ＨＴＲ−８６０Ｐ−３）を使用した。ソーダガラス上に配置する樹脂厚の対ワイヤ径比は１００％（＝１．０ｍｍ）になるようにして、実験１１と同様に、樹脂の軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表２に示す条件のもと、評価試験を行い、表２に示す結果を得た。
【０２６４】
（実験ｂ５） 表５に示す条件でサンプルを作成した。すなわち、実験Ｂ５で使用した金属ワイヤを線径１０ｍｍの鉛に代え、樹脂厚を１０ｍｍとした以外はすべて実験Ｂ５と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表５に示す条件のもと、評価試験を行い、表５に示す結果を得た。この実験ｂ５を実験Ｂ５と対比すると、実験ｂ５ではワイヤ線が断線するなどの異常が発見された。従って、金属ワイヤの種類及び線径としては、ニッケルで線径１．０ｍｍのもの方が鉛で線径１０ｍｍのものよりも適していることが分かる。
【０２６５】
（実験Ｂ６） 表２に示す条件でサンプルを作成した。つまり、実験Ｂ１で使用した金属銅の代わりにステンレスを使い、実験Ｂ１と同様にして平均線径０．５ｍｍ、長さ１．０ｍのステンレスワイヤを得た。得られたワイヤ上に、共晶はんだＢｉ／Ｃｄ＝６０／４０（融点１４４℃）を被覆した。更に、樹脂組成物として、ポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ））を使用した。ソーダガラス上に配置する樹脂厚の対ワイヤ径比は１００％（＝０．５ｍｍ）になるようにして、実験Ｂ１と同様に、樹脂の軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表２に示す条件のもと、評価試験を行い、表２に示す結果を得た。
【０２６６】
（実験ｂ６） 表５に示す条件でサンプルを作成した。すなわち、実験Ｂ１で使用した金属ワイヤを線径３０ｍｍの銅線、樹脂厚を３０ｍｍとした以外は、すべて実験Ｂ１と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして、表５に示す条件のもと、評価試験を行い、表５に示す結果を得た。この実験ｂ６を実験Ｂ１と対比すると、実験ｂ６では透湿度が高くなり、金属ワイヤの線径は、線径１．０ｍｍのものの方が線径３０．０ｍｍのものよりも適していることが分かる。
【０２６７】
（実験Ｂ７） 表２に示す条件でサンプルを作成した。つまり、実験Ｂ１で使用した金属銅の代わりにステンレスを使い、実験Ｂ１と同様にして平均線径０．５ｍｍ、長さ１．０ｍのステンレスワイヤを得た。得られたワイヤ上に、共晶はんだＰｂ／Ｓｎ＝５／９５（融点１８３℃）を被覆し、更に樹脂組成物として、アクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２）を使用した。ソーダガラス上に配置する樹脂厚の対ワイヤ径比は１４０％（＝０．７ｍｍ）とし、樹脂の硬化は実験Ｂ１の加熱に代えて２．４Ｊ／ｃｍ^２のＵＶ照射により行い、それ以外は実験Ｂ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして表２に示す条件のもと、評価試験を行い、表２に示す結果を得た。
【０２６８】
（実験ｂ７） 表５に示す条件でサンプルを作成した。すなわち、実験Ｂ３で使用した被覆金属層の厚さを０．０００５ｍｍとした以外はすべて実験Ｂ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして表５に示す条件のもと、評価試験を行い、表５に示す結果を得た。この実験ｂ７を実験Ｂ３と対比すると、実験ｂ７では透湿度が高くなり、被覆金属層の厚さは０．３ｍｍの方が０．０００５ｍｍよりも適していることが分かる。
【０２６９】
（実験Ｂ８） 表２に示す条件でサンプルを作成した。つまり、実験Ｂ１で使用した金属銅の代わりにステンレスを使い、実験Ｂ１と同様にして平均線径０．５ｍｍ、長さ１．０ｍのステンレスワイヤを得た。得られたワイヤ上に、共晶はんだＩｎ／Ｚｎ＝９７．２／２．８（融点１４４℃）を被覆し、樹脂組成物として、実験Ｂ１と同じエポキシ樹脂を使用し、ソーダガラスに配置する樹脂厚の対ワイヤ径比は１００％（＝０．５ｍｍ）になるようにして、実験Ｂ１と同様に、樹脂の軟化温度及び１２０℃での加熱加圧を経て接着用サンプル及び透湿度測定用サンプルを作製した。そして、表２に示す条件のもと、評価試験を行い、表２に示す結果を得た。
【０２７０】
（実験ｂ８） 表５に示す条件でサンプルを作成した。すなわち、実験Ｂ８で使用した樹脂組成物を硬化する温度を２１５℃とした以外はすべて実験Ｂ８と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表５に示す条件のもと、評価試験を行い、表５に示す結果を得た。この実験ｂ８を実験Ｂ８と対比すると、実験ｂ８ではＥＬ素子が黒色に変色してしまうという異常が見られ、ＥＬ素子が酸化、腐食化してしまったことが分かった。従って、樹脂組成物の硬化温度は、１２０℃の方が２１５℃より適していることが分かる。
【０２７１】
（実験Ｃ１） 表３に示す条件でサンプルを作成した。つまり、実験Ｂ１と同様にして、金属銅のインゴットを１１００℃で融解し、水を貯めた回転ドラムの内側にノズルから融液を噴出させた。ただし、ノズル口の断面形状を円環状とすることにより、芯材として、実験Ｂ１の銅線の代わりに、中空構造の銅ワイヤが得られた。次に、固化した中空銅ワイヤ（銅管線）を遠心力によってドラムの内側に巻いて、線径１ｍｍ、肉厚０．１ｍｍ、長さ１ｍの銅管線を作製した。得られた銅管線上に、実験Ｂ１と同様にして、Ｉｎ／Ｃｄ＝７４／２６の共晶はんだのめっき浴中で、はんだ被覆銅管線の直径が１．２ｍｍになるまで電解めっきを施した。このようにして得られたはんだ被覆銅管線を、２５ｍｍ×１００ｍｍのソーダガラスの周部に配置し、８０℃に加熱溶融したエポキシ樹脂組成物（（株）アルファ技研製、アルテコ３５００、変性エポキシ樹脂／変性ポリアミン＝１００／５０）を、はんだ被覆銅管線の両側に樹脂厚の対ワイヤ径比が１００％（＝１．０ｍｍ）になるようにディスペンサーにて塗布した。樹脂の軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のガラスが向かい合わせになるようにして貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して樹脂を硬化し、接着力測定用のサンプルとした。一方、１００ｍｍ×１００ｍｍのソーダガラス上の４辺にはんだ被覆銅管線を配置し、該エポキシ樹脂組成物を、樹脂層とはんだ被覆銅管線の幅の合計が２ｍｍ幅になるようにはんだ被覆銅管線の両側の基板上に１．０ｍｍの樹脂厚で塗布した。その後、８０℃、１Ｍｐａで１０分間加熱加圧した後、もう１枚のソーダガラスを貼り合わせ、１００℃、３Ｍｐａで６０分間加熱加圧して透湿度測定用のサンプルとした。そして、表３に示す条件のもと、評価試験を行い、表３に示す結果を得た。
【０２７２】
（実験ｃ１） 表６に示す条件でサンプルを作成した。すなわち、実験Ｃ１で使用した銅線の線径を０．０４ｍｍ、肉厚を０．０１ｍｍに変更した以外はすべて実験Ｃ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表６に示す条件のもと、評価試験を行い、表６に示す結果を得た。この実験ｃ１を実験Ｃ１と対比すると、実験ｃ１では透湿度が高くなり、接着力も弱くなり、金属管の線径が１．０ｍｍで肉厚が０．１ｍｍの方が線径が０．０４ｍｍで肉厚が０．０１ｍｍよりも適していることが分かる。
【０２７３】
（実験Ｃ２） 表３に示す条件でサンプルを作成した。つまり、実験Ｃ１で使用した金属銅の代わりにステンレスを使い、実験Ｃ１と同様にして平均線径０．５ｍｍ、管の肉厚０．０５ｍｍ、長さ１．０ｍのステンレス管ワイヤを得た。得られたワイヤ上に、常法により、Ｐｂ／Ｓｎ＝５／９５（融点１８３℃）の共晶はんだのめっき浴中で、はんだ被覆管ワイヤの直径が１．５ｍｍになるまで電解めっきを施した。このようにして得られたワイヤをソーダガラスの周部に配置し、７０℃に加熱溶融したアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２Ｇ）の樹脂厚の対ワイヤ径比が１００％（＝０．５ｍｍ）となるようにワイヤの両側に塗布し、樹脂の硬化は、実験Ｃ１の加熱に代えて１．０Ｊ／ｃｍ^２のＵＶ照射により行い、それ以外は実験Ｃ１と同様にして、接着力測定用のサンプル及び透湿度測定用のサンプルを作製した。そして、表３に示す条件のもと、評価試験を行い、表３に示す結果を得た。
【０２７４】
（実験ｃ２） 表６に示す条件でサンプルを作成した。すなわち、実験Ｃ２で使用した共晶はんだの組成をＰｂ１００％に変更した以外はすべて実験Ｃ２と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表６に示す条件のもと、評価試験を行い、表６に示す結果を得た。この実験ｃ２を実験Ｃ２と対比すると、実験ｃ２では透湿度が高くなり、被覆金属の組成はＰｂ／Ｓｎ＝５／９５の方がＰｂ１００％よりも適していることが分かる。
【０２７５】
（実験Ｃ３） 表３に示す条件でサンプルを作成した。つまり、実験Ｃ１で使用した金属銅の代わりに鉄を使い、実験Ｃ１と同様にして平均線径１０ｍｍ、管の肉厚０．５ｍｍ、長さ１．０ｍの鉄管線を得た。得られた鉄管線に共晶はんだＢｉ／Ｉｎ＝６７／３３（融点１０９℃）を融着して、管線の直径が１６ｍｍになるように共晶はんだを被覆した。樹脂として、７０℃に加熱溶融したフェノール樹脂（住友ベークライト（株）製フェノール樹脂ＰＭ−８２００）を使用し、基板上に配置する樹脂厚を１０ｍｍとしたこと以外は実験Ｃ１と同様にして、樹脂の軟化温度及び１２０℃での加熱加圧を経て、接着力測定用のサンプル及び透湿度測定用のサンプルを作製した。そして、表３に示す条件のもと、評価試験を行い、表３に示す結果を得た。
【０２７６】
（実験ｃ３） 表６に示す条件でサンプルを作成した。すなわち、実験Ｃ３で使用した低融点金属の金属層の厚さを７．０ｍｍに変更した以外はすべて実験Ｃ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表６に示す条件のもと、評価試験を行い、表６に示す結果を得た。この実験ｃ３を実験Ｃ３と対比すると、実験ｃ３では透湿度が高くなり、低融点金属の金属層の厚さは、３．０ｍｍの方が７．０ｍｍよりも適していることが分かる。
【０２７７】
（実験Ｃ４） 表３に示す条件でサンプルを作成した。つまり、実験Ｃ１で使用した金属銅の代わりにアルミを使い、実験Ｃ１と同様にして、平均線径１．０ｍｍ、管の肉厚０．２ｍｍ、長さ１．０ｍのアルミ管ワイヤを得た。得られた管ワイヤに、共晶はんだＳｎ３５／Ｉｎ４５／Ｂｉ_２Ｏ（融点９８℃）を融着して、管ワイヤの直径が３．０ｍｍになるように共晶はんだで被覆した。樹脂として、７０℃に加熱溶融したメラミン樹脂（日立化成工業（株）製メラン５２３）を用い、基板上に配置される樹脂厚の対ワイヤ径比を１００％（＝１．０ｍｍ）とした以外は実験Ｃ１と同様にして、軟化温度及び１２０℃での加熱加圧を経て、接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表３に示す条件のもと、評価試験を行い、表３に示す結果を得た。
【０２７８】
（実験ｃ４） 表６に示す条件でサンプルを作成した。すなわち、実験Ｃ４で使用した金属被覆アルミ管ワイヤの被覆率を４０％とした以外はすべて実験Ｃ４と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表６に示す条件のもと、評価試験を行い、表６に示す結果を得た。この実験ｃ４を実験Ｃ４と対比すると、実験ｃ４では透湿度が高くなり、金属によるアルミ管ワイヤの被覆率は１００％の方が４０％よりも適していることが分かる。
【０２７９】
（実験Ｃ５） 表３に示す条件でサンプルを作成した。つまり、実験Ｃ１で使用した金属銅の代わりにニッケルを使い、実験Ｃ１と同様にして平均線径１．０ｍｍ、管の肉厚０．１ｍｍ、長さ１．０ｍのニッケル管ワイヤを得た。得られた管ワイヤを、共晶はんだＳｎ／Ｉｎ＝４８／５２（融点１１７℃）で被覆し、樹脂組成物として、キシレン／アクリル樹脂＝８０／２０（キシレン樹脂：三菱瓦斯化学（株）製、ニカノールＨＰ−１００、アクリル樹脂：帝国化学産業（株）製、ＨＴＲ−８６０Ｐ−３）を用いて樹脂厚の対ワイヤ径比が１００％（＝１．０ｍｍ）になるようにワイヤ両側の基板上に配置し、実験Ｃ１と同様に、軟化温度及び１２０℃での加熱加圧を経て接着用サンプル及び透湿度測定用サンプルを作製した。そして、表３に示す条件のもと、評価試験を行い、表３に示す結果を得た。
【０２８０】
（実験ｃ５） 表６に示す条件でサンプルを作成した。すなわち、実験Ｃ５で使用した金属管ワイヤを線径１０ｍｍの鉛管ワイヤとした以外はすべて実験Ｃ５と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表６に示す条件のもと、評価試験を行い、表６に示す結果を得た。この実験ｃ５を実験Ｃ５と対比すると、実験ｃ５ではワイヤ線が断線するなどの異常が発見された。従って、金属管ワイヤの種類及び線径としては、ニッケルで線径が１．０ｍｍのもの方が鉛で線径１０ｍｍのものよりも適していることが分かる。
【０２８１】
（実験Ｃ６） 表３に示す条件でサンプルを作成した。つまり、実験Ｃ１で使用した金属銅の代わりにステンレスを使い、実験Ｃ１と同様にして平均線径０．５ｍｍ、管の肉厚０．１ｍｍ、長さ１．０ｍのステンレス管ワイヤを得た。得られた管ワイヤを共晶はんだＢｉ／Ｃｄ＝６０／４０（融点１４４℃）で被覆して、樹脂組成物として、ポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ））を用いて、ソーダガラス上に配置する樹脂厚の対ワイヤ径比が１００％（＝０．５ｍｍ）になるようにして、実験Ｃ１と同様に、軟化温度及び１２０℃での加熱加圧を経て接着用サンプル及び透湿度測定用サンプルを作製した。そして、表３に示す条件のもと、評価試験を行い、表３に示す結果を得た。
【０２８２】
（実験ｃ６） 表６に示す条件でサンプルを作成した。すなわち、実験Ｃ１で使用した管状銅線の肉厚を０．００５ｍｍとしたこと以外はすべて実験Ｃ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表６に示す条件のもと、評価試験を行い、表６に示す結果を得た。この実験ｃ６を実験Ｃ１と対比すると、実験ｃ６では透湿度が高くなってしまい、金属ワイヤ管の肉厚は、肉厚０．１ｍｍのものの方が肉厚が０．００５ｍｍのものよりも適していることが分かる。
【０２８３】
（実験Ｃ７） 表３に示す条件でサンプルを作成した。つまり、実験Ｃ１で使用した金属銅の代わりにステンレスを使い、実験Ｃ１と同様にして平均線径０．５ｍｍ、管の肉厚０．１ｍｍ、長さ１．０ｍのステンレス管ワイヤを得た。得られた管ワイヤを、共晶はんだＰｂ／Ｓｎ＝５／９５（融点１８３℃）で被覆して、樹脂組成物として、アクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２）を用いて樹脂厚の対ワイヤ径比が１４０％（＝０．７ｍｍ）となるようにワイヤ両側の基板上に配置した。樹脂の硬化は、実験Ｃ１の加熱に代えて２．４Ｊ／ｃｍ^２のＵＶ照射により行い、それ以外は実験Ｃ１と同様に、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表３に示す条件のもと、評価試験を行い、表３に示す結果を得た。
【０２８４】
（実験ｃ７） 表６に示す条件でサンプルを作成した。すなわち、実験Ｃ３で使用した被覆金属層を電解めっきで０．０００５ｍｍの厚さに形成した以外はすべて実験Ｃ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表６に示す条件のもと、評価試験を行い、表６に示す結果を得た。この実験ｃ７を実験Ｃ３と対比すると、実験ｃ７では透湿度が高くなり、被覆金属層の厚さは、０．３ｍｍの方が０．０００５ｍｍよりも適していることが分かる。
【０２８５】
（実験Ｃ８） 表３に示す条件でサンプルを作成した。つまり、実験Ｃ１で使用した金属銅の代わりにステンレスを使い、実験Ｃ１と同様にして平均線径０．５ｍｍ、管の肉厚０．１ｍｍ、長さ１．０ｍのステンレス管ワイヤを得た。得られた管ワイヤを、共晶はんだＩｎ／Ｚｎ＝９７．２／２．８（融点１４４℃）で被覆して、樹脂組成物として実験Ｃ１と同じエポキシ樹脂を使用して樹脂厚の対ワイヤ径比が１００％（＝０．５ｍｍ）になるようにワイヤの両側の基板上に配置して、実験Ｃ１と同様に、軟化温度及び１２０℃での加熱加圧を経て接着用サンプル及び透湿度測定用サンプルを作製した。そして、表３に示す条件のもと、評価試験を行い、表３に示す結果を得た。
【０２８６】
（実験ｃ８） 表６に示す条件でサンプルを作成した。すなわち、実験Ｃ８で使用した樹脂組成物を硬化する温度を２１５℃とした以外はすべて実験Ｃ８と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表６に示す条件のもと、評価試験を行い、表６に示す結果を得た。この実験ｃ８を実験Ｃ８と対比すると、実験ｃ８ではＥＬ素子が黒色に変色してしまうという異常が見られ、ＥＬ素子が酸化、腐食化してしまったことが分かった。従って、樹脂組成物の硬化温度は、１２０℃の方が２１５℃より適していることが分かる。
【０２８７】
【表１】

【表２】

【表３】

【表４】

【表５】

【表６】

（実験Ｄ１） 表７に示す条件でサンプルを作成した。すなわち、ポリスチレンペレットＳＤ１２０（旭化成工業（株）製、弾性率１．８ＧＰａ）を融点以上に加熱溶融した後、徐冷してゲル状の球晶を得た。この集積物を圧縮成形して得られた厚さ５ｍｍのシートを直径１ｍｍのダイを通して超延伸し、平均線径１ｍｍ、長さ０．１ｍのポリスチレン製のプラスチックワイヤを得た。得られたポリスチレンワイヤに、塩化パラジウムによるシーダ処理を施した後、無電解ニッケルめっき液中で、ニッケル層を０．２μｍ析出させた。その後、常法により、Ｉｎ／Ｃｄ＝７４／２６の共晶はんだのめっき浴中で、はんだ被覆ワイヤの直径が１２００μｍになるまで電解めっきを施した。このようにして得られたはんだ被覆ポリスチレンワイヤを、８０℃に加熱溶融したエポキシ樹脂組成物（（株）アルファ技研製、アルテコ３５００、変性エポキシ樹脂／変性ポリアミン＝１００／５０）中に浸漬し、樹脂厚が１０μｍになるまでワイヤ上に溶着させて封止材を得た。得られた封止材を、２５ｍｍ×１００ｍｍのソーダガラスの周部に貼り付け、樹脂の軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のガラスを向かい合わせにして貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して樹脂を硬化し、接着力測定用サンプルとした。一方、封止材を、１００ｍｍ×１００ｍｍのソーダガラス上の４辺に貼り付けた。その後、軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のソーダガラスを貼り合わせ、１２０℃、３Ｍｐａで６０分間加熱加圧して樹脂を硬化し、透湿度測定用サンプルとした。そして、表７に示す条件のもと、評価試験を行い、表７に示す結果を得た。
【０２８８】
（実験ｄ１） 表１０に示す条件でサンプルを作成した。すなわち、実験Ｄ１で使用したポリスチレンワイヤの線径を７ｍｍのものに変更した以外は、すべて実験Ｄ１と同様にして接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１０に示す条件のもと、評価試験を行い、表１０に示す結果を得た。この実験ｄ１を実験Ｄ１と対比すると、実験ｄ１では透湿度が高く、プラスチックワイヤの線径は、０．１ｍｍの方が７ｍｍより適していることが分かる。
【０２８９】
（実験Ｄ２） 表７に示す条件でサンプルを作成した。つまり、実験Ｄ１で使用したポリスチレンペレットの代わりに、ポリエチレン（製鉄化学（株）製、フロービーズＣＬ１２００７、平均粒径１．０ｍｍ）を使い、実験Ｄ１と同様に超延伸法により、平均線径２．０ｍｍ、長さ０．１ｍのポリエチレン製のプラスチックワイヤを得た。得られたワイヤに、塩化パラジウムによるシーダ処理を施した後、無電解ニッケルめっき液中で、ニッケル層を０．２μｍ析出させた。その後、常法により、Ｐｂ／Ｓｎ＝５／９５（融点１８３℃）の共晶はんだのめっき浴中で、はんだ被覆ワイヤの直径が３ｍｍになるまで電解めっきを施した。このようにして得られたはんだ被覆ポリエチレンワイヤを、７０℃に加熱溶融したアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２Ｇ）中に浸漬し、樹脂厚が２５μｍになるまでワイヤ上に溶着させて封止材を得た。以下、実験Ｄ１と同様にして、封止材をソーダガラス上に配置し、樹脂の硬化は実験Ｄ１の加熱に代えて１．０Ｊ／ｃｍ^２のＵＶ照射により行い、それ以外は実験Ｄ１と同様にして、接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表７に示す条件のもと、評価試験を行い、表７に示す結果を得た。
【０２９０】
（実験ｄ２） 表１０に示す条件でサンプルを作成した。すなわち、実験Ｄ２で使用したポリエチレンワイヤを圧縮弾性率が０．１ＧＰａのものに変更した以外はすべて実験Ｄ２と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１０に示す条件のもと、評価試験を行い、表１０に示す結果を得た。この実験ｄ２を実験Ｄ２と対比すると、実験ｄ２では透湿度が高かった。圧縮弾性率は、０．５ＧＰａの方が０．１０Ｇｐａより適していることが分かる。
【０２９１】
（実験Ｄ３） 表７に示す条件でサンプルを作成した。つまり、実験Ｄ１で使用したポリスチレンペレットの代わりにＰＭＭＡペレット（三菱レーヨン（株）製、アクリルペレットＩＲＤ−５０、平均粒径５．０ｍｍ）を用いて線径５ｍｍの芯材とし、被覆金属として、Ｉｎ／Ｃｄの代わりに共晶はんだＴＩ／Ｎａ＝９３．７／６．３（融点２３８℃）を用い、金属の融着によりワイヤ上に被覆し、ダイヤモンドダイスにより樹脂厚が５０μｍになるように調節した。更に樹脂組成物として、エポキシ樹脂に代えてフェノール樹脂（住友ベークライト（株）製フェノール樹脂ＰＭ−８２００）を使用して封止材を得、その他については実験Ｄ１と同様にして、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表７に示す条件のもと、評価試験を行い、表７に示す結果を得た。
【０２９２】
（実験ｄ３） 表１０に示す条件でサンプルを作成した。すなわち、実験Ｄ３で使用した被覆金属をＰｂ１００％のものに変更した以外はすべて実験Ｄ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１０に示す条件のもと、評価試験を行い、表１０に示す結果を得た。この実験ｄ３を実験Ｄ３と対比すると、実験ｄ３では透湿度が高かった。被覆金属の組成としては、ＴＩ／ＮＡ＝９３．７／６．３の方が鉛（Ｐｂ）１００％よりも適していることが分かる。
【０２９３】
（実験Ｄ４） 表７に示す条件でサンプルを作成した。つまり、実験Ｄ１で使用したポリスチレンペレットの代わりに６６ナイロンのペレット（東レ（株）製、アラミンＣＭ３００７、平均粒径０．５ｍｍ）を用いて線径０．５ｍｍの芯材とし、被覆金属として、Ｉｎ／Ｃｄの代わりに共晶はんだＳｎ３５／Ｉｎ４５／Ｂｉ_２Ｏ（融点９８℃）を用い、金属の融着によりワイヤ上に被覆し、ダイヤモンドダイスにより樹脂厚が５μｍになるように調節した。更に、樹脂組成物として、エポキシ樹脂に代えてメラミン樹脂（日立化成工業（株）製メラン５２３）を使用して封止材を得た。その他については実験Ｄ１と同様にして、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表７に示す条件のもと、評価試験を行い、表７に示す結果を得た。
【０２９４】
（実験ｄ４） 表１０に示す条件でサンプルを作成した。すなわち、実験Ｄ４で使用した被覆金属の厚さを７ｍｍに変更した以外はすべて実験Ｄ４と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１０に示す条件のもと、評価試験を行い、表１０に示す結果を得た。この実験ｄ４を実験Ｄ４と対比すると、実験ｄ４では接着力が低く、取り扱い時に基板が剥離した。被覆金属の厚さとしては１．０ｍｍの方が７．０ｍｍよりも適していることが分かる。
【０２９５】
（実験Ｄ５） 表７に示す条件でサンプルを作成した。つまり、実験Ｄ１で使用したポリスチレンペレットの代わりにポリエステルのペレット（東レ（株）製、シベラスＬ２０４Ｇ３５、平均粒径０．３ｍｍ）を用いて線径１０ｍｍの芯材とし、被覆金属としてＩｎ／Ｃｄの代わりに共晶はんだＳｎ／Ｉｎ＝４８／５２（融点１１７℃）を用いて０．０５ｍｍ厚で被覆した。更に、樹脂組成物として、エポキシ樹脂に代えてキシレン／アクリル樹脂＝８０／２０（キシレン樹脂：三菱瓦斯化学（株）製、ニカノールＨＰ−１００、アクリル樹脂：帝国化学産業（株）製、ＨＴＲ−８６０Ｐ−３）を使用し、樹脂厚は２０μｍになるようにして封止材を作製し、実験Ｄ１と同様に、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表７に示す条件のもと、評価試験を行い、表７に示す結果を得た。
【０２９６】
（実験ｄ５） 表１０に示す条件でサンプルを作成した。すなわち、実験Ｄ５で使用した金属被覆プラスチックワイヤの被覆率を４０％とした以外はすべて実験Ｄ５と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１０に示す条件のもと、評価試験を行い、表１０に示す結果を得た。この実験ｄ５を実験Ｄ５と対比すると、実験ｄ５では透湿度が高かった。金属によるプラスチックワイヤの被覆率は９９％の方が４０％よりも適していることが分かる。
【０２９７】
（実験Ｄ６） 表７に示す条件でサンプルを作成した。つまり、実験Ｄ１で使用したポリスチレンペレットの代わりにポリプロピレンのペレット（住友化学（株）製、ノーブレンＨ５０１、平均粒径０．０３ｍｍ）を用いて線径０．５ｍｍの芯材とし、被覆金属としてＩｎ／Ｃｄの代わりに共晶はんだＢｉ／Ｃｄ＝６０／４０（融点１４４℃）を用いて０．０１５ｍｍ厚で被覆した。更に、樹脂組成物として、エポキシ樹脂に代えてポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ））を使用し、樹脂厚は２０μｍになるようにして封止材を作製し、実験Ｄ１と同様に、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表７に示す条件のもと、評価試験を行い、表７に示す結果を得た。
【０２９８】
（実験ｄ６） 表１０に示す条件でサンプルを作成した。すなわち、実験Ｄ６で使用したプラスチックワイヤを線径が０．０３ｍｍのものに変更した以外は、すべて実験Ｄ６と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１０に示す条件のもと、評価試験を行い、表１０に示す結果を得た。この実験ｄ６を実験Ｄ６と対比すると、実験ｄ６では透湿度が高かった。プラスチックワイヤの線径は０．５ｍｍの方が０．０３ｍｍよりも適していることが分かる。
【０２９９】
（実験Ｄ７） 表７に示す条件でサンプルを作成した。つまり、実験Ｄ１で使用したポリスチレンペレットの代わりにポリ塩化ビニルのペレット（東ソー（株）製、リューロンペースト７７２、平均粒径０．０５ｍｍ）を用いて線径１０ｍｍの芯材とし、被覆金属としてＩｎ／Ｃｄの代わりに共晶はんだＰｂ／Ｓｎ＝５／９５（融点１８３℃）を用いて０．３ｍｍ厚に被覆し、更に、樹脂組成物として、エポキシ樹脂に代えてアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２）を使用し、樹脂厚は２０μｍになるようにして封止材を作製した。樹脂の硬化は実験１の加熱に代えて２．４Ｊ／ｃｍ^２のＵＶ照射により行い、それ以外は実験Ｄ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表７に示す条件のもと、評価試験を行い、表７に示す結果を得た。
【０３００】
（実験ｄ７） 表１０に示す条件でサンプルを作成した。すなわち、実験Ｄ７で使用した金属被覆プラスチックワイヤに樹脂を塗布する厚みを１．５ｍｍに変更した以外はすべて実験Ｄ７と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１０に示す条件のもと、評価試験を行い、表１０に示す結果を得た。この実験ｄ７を実験Ｄ７と対比すると、実験ｄ７では透湿度が高かった。低融点金属被覆プラスチックワイヤに塗布する樹脂の厚みは、０．０２ｍｍの方が１．５ｍｍよりも適していることが分かる。
【０３０１】
（実験Ｄ８） 表７に示す条件でサンプルを作成した。つまり、実験Ｄ１で使用したポリスチレンペレットの代わりに６ナイロンのペレット（東レ（株）製、アラミンＣＭ１００７、平均粒径０．５ｍｍ）を用いて線径０．２ｍｍの芯材とし、被覆金属としてＩｎ／Ｃｄの代わりに共晶はんだＩｎ／Ｚｎ＝９７．２／２．８（融点１４４℃）を使用して０．５ｍｍ厚に被覆した。更に、樹脂厚が２０μｍとなるようにエポキシ樹脂を被覆して封止材を作製し、実験Ｄ１と同様に、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表７に示す条件のもと、評価試験を行い、表７に示す結果を得た。
【０３０２】
（実験ｄ８） 表１０に示す条件でサンプルを作成した。すなわち、実験Ｄ８で使用した樹脂組成物を硬化する温度を２１５℃とした以外はすべて実験Ｄ８と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１０に示す条件のもと、評価試験を行い、表１０に示す結果を得た。この実験ｄ８を実験Ｄ８と対比すると、実験ｄ８ではＥＬ素子が黒色に変色する異常が見られ、ＥＬ素子が酸化、腐食化してしまったことが分かった。従って、樹脂組成物を硬化する温度は、１２０℃の方が２１５℃より適していることが分かる。
【０３０３】
（実験Ｅ１） 表８に示す条件でサンプルを作成した。つまり、金属銅のインゴットを１１００℃で融解し、水を貯めた回転ドラムの内側にノズルから融液を噴出させた。固化した銅繊維を遠心力によってドラムの内側に巻いて、線径１ｍｍ、長さ１ｍの銅ワイヤを作製した。得られた銅ワイヤ上に、常法により、Ｉｎ／Ｃｄ＝７４／２６の共晶はんだのめっき浴中で、はんだ被覆ワイヤの直径が１．２ｍｍになるまで電解めっきを施した。このようにして得られたはんだ被覆銅ワイヤを、８０℃に加熱溶融したエポキシ樹脂組成物（（株）アルファ技研製、アルテコ３５００、変性エポキシ樹脂／変性ポリアミン＝１００／５０）中に浸漬し、樹脂厚が１０μｍになるまでワイヤ上に溶着させて封止材を得た。得られた封止材を、２５ｍｍ×１００ｍｍのソーダガラスの周部に貼り付け、樹脂の軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のガラスを向かい合わせにして貼り合わせ、１２０℃、３Ｍｐａで６０分間加熱加圧して樹脂を硬化し、接着力測定用サンプルとした。一方、封止材を１００ｍｍ×１００ｍｍのソーダガラス上の４辺に貼り付けた。その後、軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のソーダガラスを貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して樹脂を硬化し、透湿度測定用サンプルとした。そして、表８に示す条件のもと、評価試験を行い、表８に示す結果を得た。
【０３０４】
（実験ｅ１） 表１１に示す条件でサンプルを作成した。すなわち、実験Ｅ１で使用した銅線の線径を０．０１ｍｍのものに変更した以外はすべて実験Ｅ１１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１１に示す条件のもと、評価試験を行い、表１１に示す結果を得た。この実験ｅ１を実験Ｅ１と対比すると、実験ｅ１では透湿度が高くなるとともに、接着力も弱くなった。金属ワイヤの線径は、１．０ｍｍの方が０．０１ｍｍよりも適していることが分かる。
【０３０５】
（実験Ｅ２） 表８に示す条件でサンプルを作成した。つまり、実験Ｅ１で使用した金属銅の代わりにステンレスを用いて、実験１１と同様の方法で平均線径０．５ｍｍ、長さ１．０ｍのステンレスワイヤを得た。得られたワイヤ上に、常法により、Ｐｂ／Ｓｎ＝５／９５（融点１８３℃）の共晶はんだのめっき浴中で、はんだ被覆ワイヤの直径が１．５ｍｍになるまで電解めっきを施した。このようにして得られたはんだ被覆ステンレスワイヤを、７０℃に加熱溶融したアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２Ｇ）中に浸漬して樹脂厚が２５μｍになるまでワイヤ上に溶着させ、封止材を得た。封止材を実験Ｅ１と同様にソーダガラス上に配置し、樹脂の硬化は、実験１１の加熱に代えて１．０Ｊ／ｃｍ^２のＵＶ照射により行い、それ以外は実験Ｅ１と同様にして、接着力測定用サンプル及び透湿度測定用のサンプルを作製した。そして、表８に示す条件のもと、評価試験を行い、表８に示す結果を得た。
【０３０６】
（実験ｅ２） 表１１に示す条件でサンプルを作成した。すなわち、実験Ｅ２で使用した共晶はんだの組成をＰｂ１００％に変更した以外はすべて実験Ｅ２と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１０に示す条件のもと、評価試験を行い、表１０に示す結果を得た。この実験ｅ２を実験Ｅ２と対比すると、実験ｅ２では透湿度が高かった。被覆金属の組成としてはＰｂ／Ｓｎ＝５／９５の方がＰｂ１００％よりも適していることが分かる。
【０３０７】
（実験Ｅ３） 表Ｅ２に示す条件でサンプルを作成した。つまり、実験Ｅ１で使用した金属銅の代わりに鉄を用いて、実験Ｅ１と同様の方法で平均線径１０ｍｍ、長さ１．０ｍの鉄線を得た。得られたワイヤに、共晶はんだＢｉ／Ｉｎ＝６７／３３（融点１０９℃）を融着してワイヤの直径が１６ｍｍになるように共晶はんだで被覆した。次に、はんだ被覆鉄線を、７０℃に加熱溶融したフェノール樹脂（住友ベークライト（株）製フェノール樹脂ＰＭ−８２００）中に浸漬し、樹脂をワイヤ上に溶着させた。樹脂の溶着厚はダイヤモンドダイスにより５０μｍになるように調節した。以下、実験Ｅ１と同様にして、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表８に示す条件のもと、評価試験を行い、表８に示す結果を得た。
【０３０８】
（実験ｅ３） 表１１に示す条件でサンプルを作成した。すなわち、実験Ｅ３で使用した被覆金属層の厚さを７．０ｍｍとした以外はすべて実験Ｅ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作成した。そして、表１０に示す条件のもと、評価試験を行い、表１０に示す結果を得た。この実験ｅ３を実験Ｅ３と対比すると、実験ｅ３では透湿度が高かった。被覆金属層の厚さは、３．０ｍｍの方が７．０ｍｍよりも適していることが分かる。
【０３０９】
（実験Ｅ４） 表８に示す条件でサンプルを作成した。つまり、実験Ｅ１で使用した金属銅の代わりにアルミを使い、実験Ｅ１と同様の方法で平均線径１．０ｍｍ、長さ１．０ｍのアルミワイヤを得た。得られたワイヤに共晶はんだＳｎ３５／Ｉｎ４５／Ｂｉ_２Ｏ（融点９８℃）を融着してワイヤの直径が３．０ｍｍになるように共晶はんだで被覆した。次に、はんだ被覆アルミワイヤを、７０℃に加熱溶融したメラミン樹脂（日立化成工業（株）製メラン５２３）中に浸漬し、樹脂厚が５μｍになるまでワイヤ上に溶着させ、封止材を得た。以下、実験Ｅ１と同様にして、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表８に示す条件のもと、評価試験を行い、表８に示す結果を得た。
【０３１０】
（実験ｅ４） 表１１に示す条件でサンプルを作成した。すなわち、実験Ｅ４で使用した金属被覆アルミワイヤの被覆率を４０％とした以外はすべて実験Ｅ４と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１１に示す条件のもと、評価試験を行い、表１１に示す結果を得た。この実験ｅ４を実験Ｅ４と対比すると、実験ｅ４では透湿度が高かった。はんだによるアルミワイヤの被覆率は、１００％の方が４０％よりも適していることが分かる。
【０３１１】
（実験Ｅ５） 表８に示す条件でサンプルを作成した。つまり、実験Ｅ１で使用した金属銅の代わりにニッケルを使い、実験Ｅ１と同様にして平均線径１．０ｍｍ、長さ１．０ｍのニッケルワイヤを得た。被覆金属として、共晶はんだＳｎ／Ｉｎ＝４８／５２（融点１１７℃）を、樹脂組成物として、キシレン／アクリル樹脂＝８０／２０（キシレン樹脂：三菱瓦斯化学（株）製、ニカノールＨＰ−１００、アクリル樹脂：帝国化学産業（株）製、ＨＴＲ−８６０Ｐ−３）を使用し、樹脂厚は２０μｍになるようにして、得られたワイヤを被覆した。実験Ｅ１と同様に、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表８に示す条件のもと、評価試験を行い、表８に示す結果を得た。
【０３１２】
（実験ｅ５） 表１１に示す条件でサンプルを作成した。すなわち、実験Ｅ５で使用した金属ワイヤを線径１０ｍｍの鉛とした以外はすべて実験Ｅ５と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１１に示す条件のもと、評価試験を行い、表１１に示す結果を得た。この実験ｅ５を実験Ｅ５と対比すると、実験ｅ５ではワイヤ線が断線するなどの異常が発見された。従って、金属ワイヤの種類及び線径は、線径１．０ｍｍのニッケル線の方が線径１０ｍｍの鉛線よりも適していることが分かる。
【０３１３】
（実験Ｅ６） 表８に示す条件でサンプルを作成した。つまり、実験Ｅ１で使用した金属銅の代わりにステンレスを使い、実験Ｅ１と同様にして平均線径０．５ ｍｍ、長さ１．０ｍのニッケルワイヤを得た。共晶はんだＢｉ／Ｃｄ＝６０／４０（融点１４４℃）を０．０１５ｍｍ厚に被覆し、樹脂組成物として、ポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ））を使用して、樹脂厚は２０μｍになるようにして被覆し、封止材を得た。更に、実験Ｅ１と同様にして、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表８に示す条件のもと、評価試験を行い、表８に示す結果を得た。
【０３１４】
（実験ｅ６） 表１１に示す条件でサンプルを作成した。すなわち、実験Ｅ１で使用した金属ワイヤを線径３０ｍｍの銅線に変更した以外はすべて実験Ｅ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１１に示す条件のもと、評価試験を行い、表１１に示す結果を得た。この実験ｅ６を実験Ｅ１と対比すると、実験ｅ６では透湿度が高かった。金属ワイヤの線径は、線径１．０ｍｍのものの方が線径３０．０ｍｍのものよりも適していることが分かる。
【０３１５】
（実験Ｅ７） 表８に示す条件でサンプルを作成した。つまり、実験Ｅ１で使用した金属銅の代わりにステンレスを使い、実験Ｅ１と同様にして平均線径０．５ｍｍ、長さ１．０ｍのニッケルワイヤを得た。共晶はんだＰｂ／Ｓｎ＝５／９５（融点１８３℃）を得られたワイヤに被覆し、樹脂組成物としてアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２）を使用し、樹脂厚は２０μｍとなるように被覆して、封止材を得た。実験Ｅ１と同様に封止材をソーダガラス上に配置し、樹脂の硬化は実験Ｅ１の加熱に代えて２．４Ｊ／ｃｍ^２のＵＶ照射により行い、それ以外は実験Ｅ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表８に示す条件のもと、評価試験を行い、表８に示す結果を得た。
【０３１６】
（実験ｅ７） 表１１に示す条件でサンプルを作成した。すなわち、実験Ｅ３で使用した被覆金属層の厚さを０．０００５ｍｍとした以外はすべて実験Ｅ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１１に示す条件のもと、評価試験を行い、表１１に示す結果を得た。この実験ｅ７を実験Ｅ３と対比すると、実験ｅ７では透湿度が高かった。被覆金属層の厚さは、０．３ｍｍの方が０．０００５ｍｍよりも適していることが分かる。
【０３１７】
（実験Ｅ８） 表８に示す条件でサンプルを作成した。つまり、実験Ｅ１で使用した金属銅の代わりにステンレスを使い、実験Ｅ１と同様にして平均線径０．５ｍｍ、長さ１．０ｍのニッケルワイヤを得た。共晶はんだＩｎ／Ｚｎ＝９７．２／２．８（融点１４４℃）をワイヤに被覆し、樹脂組成物として実験Ｅ１と同じエポキシ樹脂を使用し、樹脂厚は２０μｍになるように、得られたワイヤに被覆し、封止材を得た。更に、実験Ｅ１と同様に、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表８に示す条件のもと、評価試験を行い、表８に示す結果を得た。
【０３１８】
（実験ｅ８） 表１１に示す条件でサンプルを作成した。すなわち、実験Ｅ８で使用した樹脂組成物の硬化温度を２１５℃とした以外はすべて実験Ｅ８と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１１に示す条件のもと、評価試験を行い、表１１に示す結果を得た。この実験ｅ８を実験Ｅ８と対比すると、実験ｅ８ではＥＬ素子が黒色に変色するという異常が見られ、ＥＬ素子が酸化、腐食化してしたことが分かった。従って、樹脂組成物を硬化する温度は、１２０℃の方が２１５℃より適していることが分かる。
【０３１９】
（実験Ｆ１） 表９に示す条件でサンプルを作成した。つまり、実験Ｆ１と同様にして、金属銅のインゴットを１１００℃で融解し、水を貯めた回転ドラムの内側にノズルから融液を噴出させた。ただし、ノズル孔の断面形状を円環状として、中空の銅線が得られた。次に、固化した中空銅ワイヤ（銅管線）を遠心力によってドラムの内側に巻いて、線径１ｍｍ、管の肉厚０．１ｍｍ、長さ１ｍの銅管線を作製した。得られた銅管線に、実験１と同様にして、Ｉｎ／Ｃｄ＝７４／２６の共晶はんだのめっき浴中で、はんだ被覆銅管線の直径が１．２ｍｍになるまで電解めっきを施した。このようにして得られたはんだ被覆銅管線を、８０℃に加熱溶融したエポキシ樹脂組成物（（株）アルファ技研製、アルテコ３５００、変性エポキシ樹脂／変性ポリアミン＝１００／５０）中に浸漬し、樹脂厚が１０μｍになるまでワイヤ上に溶着させ、封止材を得た。得られた封止材を、２５ｍｍ×１００ｍｍのソーダガラスの周辺に貼り付け、樹脂の軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のガラスが向かい合わせになるようにして貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して接着力測定用サンプルとした。一方、封止材を１００ｍｍ×１００ｍｍのソーダガラス上の４辺に貼り付けた。その後、軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のソーダガラスを貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して透湿度測定用のサンプルとした。そして、表９に示す条件のもと、評価試験を行い、表９に示す結果を得た。
【０３２０】
（実験ｆ１） 表１２に示す条件でサンプルを作成した。すなわち、実験Ｆ１で使用した銅線の線径を０．０４ｍｍのものを使用した以外は、すべて実験Ｆ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして表１２に示す条件のもと、評価試験を行い、表１２に示す結果を得た。この実験ｆ１を実験Ｆ１と対比すると、実験ｆ１では透湿度が高くなるとともに、接着力も弱かった。金属管ワイヤの線径は、１．０ｍｍで肉厚が０．１ｍｍの方が線径が０．０４ｍｍで肉厚が０．０１ｍｍよりも適していることが分かる。
【０３２１】
（実験Ｆ２） 表９に示す条件でサンプルを作成した。つまり、実験Ｆ１で使用した金属銅の代わりにステンレスを使い、実験Ｆ２と同様にして、平均線径０．５ｍｍ、管の肉厚０．０５ｍｍ、長さ１．０ｍのステンレス管ワイヤを得た。得られたワイヤに、常法により、Ｐｂ／Ｓｎ＝５／９５（融点１８３℃）の共晶はんだのめっき浴中で、はんだ被覆管ワイヤの直径が１．５ｍｍになるまで電解めっきを施した。このようにして得られたはんだ被覆ステンレス管ワイヤを、７０℃に加熱溶融したアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２Ｇ）中に浸漬し、樹脂厚が２５μｍになるまでワイヤ上に溶着させ、封止材を得た。更に、実験Ｆ１と同様にして封止材をソーダガラス上に配置して、樹脂の硬化は実験Ｆ１の加熱に代えて１．０Ｊ／ｃｍ^２のＵＶ照射により行い、それ以外は実験Ｆ１と同様にして、接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表９に示す条件のもと、評価試験を行い、表９に示す結果を得た。
【０３２２】
（実験ｆ２） 表１２に示す条件でサンプルを作成した。すなわち、実験Ｆ２で使用した共晶はんだに代えてＰｂ１００％とした以外はすべて実験Ｆ２と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１２に示す条件のもと、評価試験を行い、表１２に示す結果を得た。この実験ｆ２を実験Ｆ２と対比すると、実験ｆ２では透湿度が高かった。被覆金属の組成はＰｂ／Ｓｎ＝５／９５の方がＰｂ１００％よりも適していることが分かる。
【０３２３】
（実験Ｆ３） 表９に示す条件でサンプルを作成した。つまり、実験Ｆ１で使用した金属銅の代わりに鉄を使い、実験Ｆ１と同様にして平均線径１０ｍｍ、管の肉厚０．５ｍｍ、長さ１．０ｍの鉄管線を得た。得られた鉄管線に共晶はんだＢｉ／Ｉｎ＝６７／３３（融点１０９℃）を融着し、被覆管線の直径が１６ｍｍになるように共晶はんだで被覆した。次に、はんだ被覆鉄管線を、７０℃に加熱溶融したフェノール樹脂（住友ベークライト（株）製フェノール樹脂ＰＭ−８２００）中に浸漬し、樹脂を鉄管線上に溶着させた。樹脂の溶着厚は、ダイヤモンドダイスにより５μｍになるように調節した。以下、実験Ｆ１と同様にして、ソーダガラス上での樹脂の軟化温度及び１２０℃での加熱加圧を経て、接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表９に示す条件のもと、評価試験を行い、表９に示す結果を得た。
【０３２４】
（実験ｆ３） 表１２に示す条件でサンプルを作成した。すなわち、実験Ｆ３で使用した金属被覆管線の金属層の厚さを７．０ｍｍとした以外はすべて実験Ｆ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１２に示す条件のもと、評価試験を行い、表１２に示す結果を得た。この実験ｆ３を実験Ｆ３と対比すると、実験ｆ３では透湿度が高かった。被覆金属層の厚さは、３．０ｍｍの方が７．０ｍｍよりも適していることが分かる。
【０３２５】
（実験Ｆ４） 表９に示す条件でサンプルを作成した。つまり、実験Ｆ１で使用した金属銅の代わりにアルミを使い、実験Ｆ１と同様にして平均線径１．０ｍｍ、管の肉厚０．２ｍｍ、長さ１．０ｍのアルミ管ワイヤを得た。得られた管ワイヤに、共晶はんだＳｎ３５／Ｉｎ４５／Ｂｉ_２Ｏ（融点９８℃）を融着して被覆管ワイヤの直径が３．０ｍｍになるように共晶はんだで被覆した。次に、はんだ被覆アルミ管ワイヤを、７０℃に加熱溶融したメラミン樹脂（日立化成工業（株）製メラン５２３）中に浸漬し、樹脂厚が０．２ｍｍになるまで管ワイヤ上に溶着させ、封止材を得た。以下、実験Ｆ１と同様にして、ソーダガラス上での樹脂の軟化温度及び１２０℃での加熱加圧を経て、接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表９に示す条件のもと、評価試験を行い、表９に示す結果を得た。
【０３２６】
（実験ｆ４） 表１２に示す条件でサンプルを作成した。すなわち、実験Ｆ４で使用した金属によるアルミ管ワイヤの被覆率を４０％とした以外はすべて実験Ｆ４と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１２に示す条件のもと、評価試験を行い、表１２に示す結果を得た。この実験ｆ４を実験Ｆ４と対比すると、実験ｆ４では透湿度が高かった。被覆金属による金属管ワイヤの被覆率は１００％の方が４０％よりも適していることが分かる。
【０３２７】
（実験Ｆ５） 表９に示す条件でサンプルを作成した。つまり、実験Ｆ１で使用した金属銅の代わりにニッケルを使い、実験Ｆ１と同様にして平均線径１．０ｍｍ、管の肉厚０．１ｍｍ、長さ１．０ｍのニッケル管ワイヤを得た。得られた管ワイヤを、共晶はんだＳｎ／Ｉｎ＝４８／５２（融点１１７℃）で被覆し、更に樹脂組成物として、キシレン／アクリル樹脂＝８０／２０（キシレン樹脂：三菱瓦斯化学（株）製、ニカノールＨＰ−１００、アクリル樹脂：帝国化学産業（株）製、ＨＴＲ−８６０Ｐ−３）を使用して、樹脂厚が２０μｍになるように被覆して封止材を得た。実験Ｆ１と同様に、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表９に示す条件のもと、評価試験を行い、表９に示す結果を得た。
【０３２８】
（実験ｆ５） 表１２に示す条件でサンプルを作成した。すなわち、実験Ｆ５で使用した金属管ワイヤを線径１０ｍｍの鉛管ワイヤとした以外はすべて実験Ｆ５と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１２に示す条件のもと、評価試験を行い、表１２に示す結果を得た。この実験ｆ５を実験Ｆ５と対比すると、実験ｆ５ではワイヤ線が断線するなどの異常が発見された。従って、金属管ワイヤの種類及び線径は、ニッケル製の線径が１．０ｍｍのもの方が鉛製の線径１０ｍｍのものよりも適していることが分かる。
【０３２９】
（実験Ｆ６） 表９に示す条件でサンプルを作成した。つまり、実験Ｆ１で使用した金属銅の代わりにステンレスを使い、実験Ｆ１と同様にして平均線径０．５ｍｍ、管の肉厚０．１ｍｍ、長さ１．０ｍのステンレス管ワイヤを得た。得られた管ワイヤに、共晶はんだＢｉ／Ｃｄ＝６０／４０（融点１４４℃）を被覆し、更に樹脂組成物として、ポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ））を使用して樹脂厚が２０μｍになるように被覆して封止材を得た。実験Ｆ１と同様に、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表９に示す条件のもと、評価試験を行い、表９に示す結果を得た。
【０３３０】
（実験ｆ６） 表１２に示す条件でサンプルを作成した。すなわち、実験Ｆ１で使用した金属管ワイヤを肉厚が０．００５ｍｍの銅線に変更した以外はすべて実験Ｆ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１０に示す条件のもと、評価試験を行い、表１０に示す結果を得た。この実験ｆ６を実験Ｆ１と対比すると、実験ｆ６では透湿度が高かった。金属ワイヤ管の種類及びその線径としては、ステンレス製の線径０．１ｍｍのものの方が銅製の線径が０．００５ｍｍのものよりも適していることが分かる。
【０３３１】
（実験Ｆ７） 表９に示す条件でサンプルを作成した。つまり、実験Ｆ１で使用した金属銅の代わりにステンレスを使い、実験Ｆ１と同様にして平均線径０．５ｍｍ、管の肉厚０．１ｍｍ、長さ１．０ｍのステンレス管ワイヤを得た。得られた管ワイヤに、共晶はんだＰｂ／Ｓｎ＝５／９５（融点１８３℃）を被覆し、更に樹脂組成物として、アクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２）を使用して樹脂厚は２０μｍとなるよう被覆して封止材を得た。実験Ｆ１と同様に封止材をソーダガラス上に配置し、樹脂の硬化は実験Ｆ１の加熱に代えて２．４Ｊ／ｃｍ^２のＵＶ照射により行い、それ以外は実験２１と同様に、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表９に示す条件のもと、評価試験を行い、表９に示す結果を得た。
【０３３２】
（実験ｆ７） 表１２に示す条件でサンプルを作成した。すなわち、実験Ｆ３で使用した被覆金属層を電解めっきで０．０００５ｍｍの厚さとした以外はすべて実験Ｆ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１２に示す条件のもと、評価試験を行い、表１２に示す結果を得た。この実験ｆ７を実験Ｆ３と対比すると、実験ｆ７では透湿度が高かった。被覆金属層の厚さは、０．３ｍｍの方が０．０００５ｍｍよりも適していることが分かる。
【０３３３】
（実験Ｆ８） 表９に示す条件でサンプルを作成した。つまり、実験Ｆ１で使用した金属銅の代わりにステンレスを使い、実験Ｆ１と同様にして平均線径０．５ｍｍ、管の肉厚０．１ｍｍ、長さ１．０ｍのステンレス管ワイヤを得た。得られた管ワイヤに、共晶はんだＩｎ／Ｚｎ＝９７．２／２．８（融点１４４℃）を被覆し、樹脂組成物として、実験Ｆ１と同じエポキシ樹脂を使用して樹脂厚が０．２ｍｍになるように被覆して封止材を得た。実験Ｆ１と同様に、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表９に示す条件のもと、評価試験を行い、表９に示す結果を得た。
【０３３４】
（実験ｆ８） 表１２に示す条件でサンプルを作成した。すなわち、実験Ｆ８で使用した樹脂組成物を硬化する温度を２１５℃とした以外はすべて実験Ｆ８と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１２に示す条件のもと、評価試験を行い、表１２に示す結果を得た。この実験ｆ８を実験Ｆ８と対比すると、実験ｆ８ではＥＬ素子が黒色に変色するという異常が見られ、ＥＬ素子が酸化、腐食化したことが分かった。従って、樹脂組成物の硬化温度は、１２０℃の方が２１５℃より適していることが分かる。
【０３３５】
【表７】

【表８】

【表９】

【表１０】

【表１１】

【表１２】

（実験Ｇ１） 表１３に示す条件でサンプルを作成した。すなわち、ポリスチレンペレットＳＤ１２０（旭化成工業（株）製、弾性率１．８ＧＰａ）を融点以上に加熱溶融した後、徐冷してゲル状の球晶を得た。この集積物を圧縮成形して得られた厚さ５ｍｍのシートを直径１ｍｍのダイを通して超延伸し、平均線径１ｍｍ、長さ０．１ｍのポリスチレン製のプラスチックワイヤを得た。得られたポリスチレンワイヤに、塩化パラジウムによるシーダ処理を施した後、無電解ニッケルめっき液中でニッケル層を０．２μｍ析出させた。その後、常法により、Ｉｎ／Ｃｄ＝７４／２６の共晶はんだのめっき浴中で、はんだ被覆ワイヤの直径が２００μｍになるまで電解めっきを施した。このようにして得られた、はんだ被覆ポリスチレンワイヤを、８０℃に加熱溶融したエポキシ樹脂組成物（（株）アルファ技研製、アルテコ３５００、変性エポキシ樹脂／変性ポリアミン＝１００／５０）中に浸漬し、樹脂厚が１０μｍになるまでワイヤ上に溶着させた。樹脂及びはんだで被覆したポリスチレンワイヤ二本を平行に接触配置し、８０℃に加熱して融着し、封止材とした。得られた封止材を、２５ｍｍ×１００ｍｍのソーダガラスの周部に貼り付け、樹脂の軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のガラスを向かい合わせににして貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して樹脂を硬化し、接着力測定用サンプルとした。一方、封止材を、１００ｍｍ×１００ｍｍのソーダガラス上の４辺に貼り付けた。その後、軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のソーダガラスを貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して樹脂を硬化し、透湿度測定用サンプルとした。そして、表１３に示す条件のもと、評価試験を行い、表１３に示す結果を得た。
【０３３６】
（実験ｇ１） 表１６に示す条件でサンプルを作成した。すなわち、実験Ｇ１で使用したポリスチレンワイヤの線径を７ｍｍに変更した以外はすべて実験Ｇ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１６に示す条件のもと、評価試験を行い、表１６に示す結果を得た。この実験ｇ１を実験例Ｇ１と対比すると、実験ｇ１では透湿度が高くなり、プラスチックワイヤの線径は０．１ｍｍの方が０．７ｍｍより適していることが分かる。
【０３３７】
（実験Ｇ２） 表１３に示す条件でサンプルを作成した。つまり、実験Ｇ１で使用したポリスチレンペレットの代わりにポリエチレン（製鉄化学（株）製、フロービーズＣＬ１２００７、平均粒径１．０ｍｍ）を用いて実験Ｇ１と同様に超延伸法により平均線径２．０ｍｍ、長さ０．１ｍのポリエチレン製のプラスチックワイヤを得た。得られたワイヤに、塩化パラジウムによるシーダ処理を施した後、無電解ニッケルめっき液中でニッケル層を０．２μｍ析出させた。その後、常法により、Ｐｂ／Ｓｎ＝５／９５（融点１８３℃）の共晶はんだのめっき浴中で、はんだ被覆ワイヤの直径が０．７ｍｍになるまで電解めっきを施した。このようにして得られた、はんだ被覆ポリエチレンワイヤを、７０℃に加熱溶融したアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２Ｇ）中に浸漬し、樹脂厚が２５μｍになるまでワイヤ上に溶着させた。アクリル樹脂及びはんだで被覆したポリエチレンワイヤ二本を平行に接触配置し、７０℃に加熱して融着し、封止材を得た。更に、実験Ｇ１と同様に封止材をソーダガラス上に配置し、硬化は実験Ｇ１の加熱に代えて１．０Ｊ／ｃｍ^２のＵＶ照射によって行い、それ以外は実験Ｇ１と同様にして、接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表１３に示す条件のもと、評価試験を行い、表１３３に示す結果を得た。
【０３３８】
（実験ｇ２） 表１６に示す条件でサンプルを作成した。すなわち、実験Ｇ２で使用したポリエチレンワイヤを圧縮弾性率が０．１ＧＰａのものに変更した以外はすべて実験Ｇ２と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１６に示す条件のもと、評価試験を行い、表１６に示す結果を得た。この実験ｇ２を実験Ｇ２と対比すると、実験ｇ２では透湿度が高くなっり、圧縮弾性率は０．５ＧＰａの方が０．１０Ｇｐａより適していることが分かる。
【０３３９】
（実験Ｇ３） 表１３に示す条件でサンプルを作成した。つまり、実験Ｇ１で使用したポリスチレンペレットの代わりにＰＭＭＡペレット（三菱レーヨン（株）製、アクリルペレットＩＲＤ−５０、平均粒径５．０ｍｍ）を用いて線径５ｍｍのワイヤを作製し、被覆金属として、Ｉｎ／Ｃｄの代わりに共晶はんだＴＩ／Ｎａ＝９３．７／６．３（融点２３８℃）を用い、更に樹脂組成物として、エポキシ樹脂に代えてフェノール樹脂（住友ベークライト（株）製フェノール樹脂ＰＭ−８２００）を使用し、共晶はんだは金属の融着によりワイヤ上に被覆し、ダイヤモンドダイスにより樹脂厚が５０μｍになるように被覆量を調節して被覆した。その他については実験１と同様にして、封止材を作製し、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１３に示す条件のもと、評価試験を行い、表１３に示す結果を得た。
【０３４０】
（実験ｇ３） 表１６に示す条件でサンプルを作成した。すなわち、実験Ｇ３で使用した被覆金属の組成をＰｂ１００％に変更した以外はすべて実験Ｇ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１６に示す条件のもと、評価試験を行い、表１６に示す結果を得た。この実験ｇ３を実験Ｇ３と対比すると、実験ｇ３では透湿度が高くなり、被覆金属の組成はＴＩ／ＮＡ＝９３．７／６．３ の方が鉛（Ｐｂ）が１００％よりも適していることが分かる。
【０３４１】
（実験Ｇ４） 表１３に示す条件でサンプルを作成した。つまり、実験Ｇ１で使用したポリスチレンペレットの代わりに６６ナイロンのペレット（東レ（株）製、アラミンＣＭ３００７、平均粒径０．５ｍｍ）を用いて線径０．５ｍｍのワイヤを作製し、、被覆金属として、Ｉｎ／Ｃｄの代わりに共晶はんだＳｎ３５／Ｉｎ４５／Ｂｉ_２Ｏ（融点９８℃）を用いて金属の融着により共晶はんだでワイヤを被覆し、更に樹脂組成物として、エポキシ樹脂に代えてメラミン樹脂（日立化成工業（株）製メラン５２３）を使用し、ダイヤモンドダイスにより樹脂厚が５μｍになるように被覆量を調節して被覆した。その他は実験Ｇ１と同様にして、封止材を作製し、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１３に示す条件のもと、評価試験を行い、表１３に示す結果を得た。
【０３４２】
（実験ｇ４） 表１６に示す条件でサンプルを作成した。すなわち、実験Ｇ４で使用した被覆金属の厚さを７ｍｍとした以外はすべて実験Ｇ４と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１６に示す条件のもと、評価試験を行い、表１６に示す結果を得た。この実験ｇ４を実験Ｇ４と対比すると、実験ｇ４では接着力が低くなり、被覆金属の厚さは１．０ｍｍの方が７．０ｍｍよりも適していることが分かる。
【０３４３】
（実験Ｇ５） 表１３に示す条件でサンプルを作成した。つまり、実験Ｇ１で使用したポリスチレンペレットの代わりにポリエステルのペレット（東レ（株）製、シベラスＬ２０４Ｇ３５、平均粒径０．３ｍｍ）を用いて線径１０ｍｍのワイヤを作製し、被覆金属として、Ｉｎ／Ｃｄの代わりに共晶はんだＳｎ／Ｉｎ＝４８／５２（融点１１７℃）を用い、更に樹脂組成物として、エポキシ樹脂に代えてキシレン／アクリル樹脂＝８０／２０（キシレン樹脂：三菱瓦斯化学（株）製、ニカノールＨＰ−１００、アクリル樹脂：帝国化学産業（株）製、ＨＴＲ−８６０Ｐ−３）を使用し、樹脂厚は２０μｍになるようにしてはんだ及び樹脂で被覆した。その他は実験Ｇ１と同様にして、封止材を作製し、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１３に示す条件のもと、評価試験を行い、表１３に示す結果を得た。
【０３４４】
（実験ｇ５） 表１６に示す条件でサンプルを作成した。すなわち、実験Ｇ５で使用したプラスチックワイヤの金属による被覆率を４０％とした以外はすべて実験Ｇ５と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１６に示す条件のもと、評価試験を行い、表１６に示す結果を得た。この実験ｇ５を実験Ｇ５と対比すると、実験ｇ５では透湿度が高くなり、金属によるプラスチックワイヤの被覆率は９９％の方が４０％よりも適していることが分かる。
【０３４５】
（実験Ｇ６） 表１３に示す条件でサンプルを作成した。つまり、実験Ｇ１で使用したポリスチレンペレットの代わりにポリプロピレンのペレット（住友化学（株）製、ノーブレンＨ５０１、平均粒径０．０３ｍｍ）を用いて線径０．５ｍｍのワイヤを作製し、被覆金属として、Ｉｎ／Ｃｄの代わりに共晶はんだＢｉ／Ｃｄ＝６０／４０（融点１４４℃）を用い、更に樹脂組成物として、エポキシ樹脂に代えてポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ））を使用し、樹脂厚は２０μｍになるようにして、はんだ及び樹脂で被ワイヤを覆した。その他については実験Ｇ１と同様にして、封止材を作製し、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１３に示す条件のもと、評価試験を行い、表１３に示す結果を得た。
【０３４６】
（実験ｇ６） 表１６に示す条件でサンプルを作成した。すなわち、実験Ｇ６で使用したプラスチックワイヤを線径が０．０３ｍｍのものに変更した以外はすべて実験Ｇ６と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１６に示す条件のもと、評価試験を行い、表１６に示す結果を得た。この実験ｇ６を実験Ｇ６と対比すると、実験ｇ６では透湿度が高くなってしまい、プラスチックワイヤの線径は０．５ｍｍの方が０．０３ｍｍよりも適していることが分かる。
【０３４７】
（実験Ｇ７） 表１３に示す条件でサンプルを作成した。つまり、実験Ｇ１で使用したポリスチレンペレットの代わりにポリ塩化ビニルのペレット（東ソー（株）製、リューロンペースト７７２、平均粒径０．０５ｍｍ）を用いて線径１０ｍｍのワイヤを作製し、被覆金属として、Ｉｎ／Ｃｄの代わりに共晶はんだＰｂ／Ｓｎ＝５／９５（融点１８３℃）を用い、更に樹脂組成物として、エポキシ樹脂に代えてアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２）を使用し、樹脂厚は２０μｍとなるようにしてはんだ及び樹脂で被覆した。その他については実験Ｇ１と同様にして、封止材を作製した。封止材をソーダガラス上に配置し、樹脂の硬化は実験Ｇ１の加熱に代えて２．４Ｊ／ｃｍ^２のＵＶ照射により行い、それ以外は実験Ｇ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１３に示す条件のもと、評価試験を行い、表１３に示す結果を得た。
【０３４８】
（実験ｇ７） 表１６に示す条件でサンプルを作成した。すなわち、実験Ｇ７で使用した金属被覆プラスチックワイヤに塗布する樹脂の厚みを１．５ｍｍとした以外はすべて実験Ｇ７と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１６に示す条件のもと、評価試験を行い、表１６に示す結果を得た。この実験ｇ７を実験Ｇ７と対比すると、実験ｇ７では透湿度が高くなり、金属被覆プラスチックワイヤに塗布する樹脂の厚みは、０．０２ｍｍの方が１．５ｍｍよりも適していることが分かる。
【０３４９】
（実験Ｇ８） 表１３に示す条件でサンプルを作成した。つまり、実験Ｇ１で使用したポリスチレンペレットの代わりに６ナイロンのペレット（東レ（株）製、アラミンＣＭ１００７、平均粒径０．５ｍｍ）を用いて線径０．２ｍｍのワイヤを作製し、被覆金属として、Ｉｎ／Ｃｄの代わりに共晶はんだＩｎ／Ｚｎ＝９７．２／２．８（融点１４４℃）を使用し、樹脂厚は２０μｍとして、実験Ｇ１と同様に封止材を得た。封止材をソーダガラス上に配置し、軟化温度及び１２０℃での加熱加圧を経て接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１３に示す条件のもと、評価試験を行い、表１３に示す結果を得た。
【０３５０】
（実験ｇ８） 表１６に示す条件でサンプルを作成した。すなわち、実験Ｇ８で使用した樹脂組成物を硬化する温度を２１５℃とした以外はすべて実験Ｇ８と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１６に示す条件のもと、評価試験を行い、表１６に示す結果を得た。この実験ｇ８を実験Ｇ８と対比すると、実験ｇ８ではＥＬ素子が黒色に変色するという異常が見られ、ＥＬ素子が酸化、腐食化したことが分かった。従って、樹脂組成物の硬化温度は、１２０℃の方が２１５℃より適していることが分かる。
【０３５１】
（実験Ｈ１） 表１４に示す条件でサンプルを作成した。つまり、金属銅のインゴットを１１００℃で融解し、水を貯めた回転ドラムの内側にノズルから融液を噴出させた。固化した銅繊維を遠心力によってドラムの内側に巻いて、線径１ｍｍ、長さ１ｍの銅ワイヤを作製した。得られた銅ワイヤに、常法により、Ｉｎ／Ｃｄ＝７４／２６の共晶はんだのめっき浴中で、はんだ被覆ワイヤの直径が１．２ｍｍになるまで電解めっきを施した。このようにして得られたはんだ被覆銅ワイヤを、８０℃に加熱溶融したエポキシ樹脂組成物（（株）アルファ技研製、アルテコ３５００、変性エポキシ樹脂／変性ポリアミン＝１００／５０）中に浸漬し、樹脂厚が１０μｍになるまでワイヤ上に溶着させた。エポキシ樹脂及びはんだで被覆した銅ワイヤ二本を平行に接触配置し、８０℃に加熱して融着して封止材を得た。得られた封止材を、２５ｍｍ×１００ｍｍのソーダガラスの周部に貼り付け、樹脂の軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のガラスを向かい合わせにして貼り合わせ、１２０℃、３Ｍｐａで６０分間加熱加圧して樹脂を硬化させ、接着力測定用サンプルとした。一方、封止材を１００ｍｍ×１００ｍｍのソーダガラス上の４辺に貼り付けた。その後、軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のソーダガラスを貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して樹脂を硬化し、透湿度測定用サンプルとした。そして、表１４に示す条件のもと、評価試験を行い、表１４に示す結果を得た。
【０３５２】
（実験ｈ１） 表１７に示す条件でサンプルを作成した。すなわち、実験Ｈ１で使用した銅線を線径が０．０１ｍｍのものに変更した以外はすべて実験Ｈ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１７に示す条件のもと、評価試験を行い、表１７に示す結果を得た。この実験ｈ１を実験Ｈ１と対比すると、実験ｈ１では透湿度が高くなるとともに、接着力も弱くなり、金属ワイヤの線径は、１．０ｍｍの方が０．０１ｍｍよりも適していることが分かる。
【０３５３】
（実験Ｈ２） 表１４に示す条件でサンプルを作成した。つまり、実験Ｈ１で使用した金属銅の代わりにステンレスを使い、実験Ｈ１と同様にして、平均線径０．５ｍｍ、長さ１．０ｍのステンレスワイヤを得た。得られたワイヤに、常法により、Ｐｂ／Ｓｎ＝５／９５（融点１８３℃）の共晶はんだのめっき浴中で、はんだ被覆ワイヤの直径が１．５ｍｍになるまで電解めっきを施した。このようにして得られたはんだ被覆ステンレスワイヤを、７０℃に加熱溶融したアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２Ｇ）中に浸漬し、樹脂厚が２５μｍになるまでワイヤ上に溶着させた。アクリル樹脂及びはんだで被覆したステンレスワイヤ二本を平行に接触配置し、７０℃に加熱溶融して融着し、封止材を得た。封止材を実験Ｈ１と同様にソーダガラス上に配置し、樹脂の硬化は実験Ｈ１の加熱に代えて１．０Ｊ／ｃｍ^２のＵＶ照射により行い、実験Ｈ１と同様にして、接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表１４に示す条件のもと、評価試験を行い、表１４に示す結果を得た。
【０３５４】
（実験ｈ２） 表１７に示す条件でサンプルを作成した。すなわち、実験Ｈ２で使用した共晶はんだをＰｂ１００％に変更した以外はすべて実験Ｈ２と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１６に示す条件のもと、評価試験を行い、表１６に示す結果を得た。この実験ｈ２を実験Ｈ２と対比すると、実験ｈ２では透湿度が高くなり、被覆金属の組成はＰｂ／Ｓｎ＝５／９５の方がＰｂ１００％よりも適していることが分かる。
【０３５５】
（実験Ｈ３） 表１４に示す条件でサンプルを作成した。つまり、実験Ｈ１で使用した金属銅の代わりに鉄を使い、実験Ｈ１と同様にして平均線径１０ｍｍ、長さ１．０ｍの鉄線を得た。得られたワイヤに、共晶はんだＢｉ／Ｉｎ＝６７／３３（融点１０９℃）を融着してワイヤの直径が１６ｍｍになるように共晶はんだで被覆した。次に、はんだ被覆鉄線を、７０℃に加熱溶融したフェノール樹脂（住友ベークライト（株）製フェノール樹脂ＰＭ−８２００）中に浸漬し、樹脂をワイヤ上に溶着させた。樹脂の溶着量は、ダイヤモンドダイスにより５μｍになるように調節した。以下、実験Ｈ１と同様にして、被覆ワイヤ２本から封止材を作製し、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表１４に示す条件のもと、評価試験を行い、表１４に示す結果を得た。
【０３５６】
（実験ｈ３） 表１７に示す条件でサンプルを作成した。すなわち、実験Ｈ３で使用した被覆金属層の厚さを７．０ｍｍとした以外はすべて実験Ｈ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作成した。そして、表１６に示す条件のもと、評価試験を行い、表１６に示す結果を得た。この実験ｈ３を実験Ｈ３と対比すると、実験ｈ３では透湿度が高くなり、被覆金属層の厚さは３．０ｍｍの方が７．０ｍｍよりも適していることが分かる。
【０３５７】
（実験Ｈ４） 表１４に示す条件でサンプルを作成した。つまり、実験Ｈ１で使用した金属銅の代わりにアルミを使い、実験Ｈ１と同様にして平均線径１．０ｍｍ、長さ１．０ｍのアルミワイヤを得た。得られたワイヤに、共晶はんだＳｎ３５／Ｉｎ４５／Ｂｉ_２Ｏ（融点９８℃）を融着し、被覆したワイヤの直径が３．０ｍｍになるように共晶はんだで被覆した。次に、はんだ被覆アルミワイヤを、７０℃に加熱溶融したメラミン樹脂（日立化成工業（株）製メラン５２３）中に浸漬し、樹脂厚が２０μｍになるまでワイヤ上に溶着させた。以下、実験Ｈ１と同様にして、被覆ワイヤ２本から封止材を作製し、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表１４に示す条件のもと、評価試験を行い、表１４に示す結果を得た。
【０３５８】
（実験ｈ４） 表１７に示す条件でサンプルを作成した。すなわち、実験Ｈ４で使用した被覆金属によるアルミワイヤの被覆率を４０％とした以外はすべて実験１４と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１７に示す条件のもと、評価試験を行い、表１７に示す結果を得た。この実験ｈ４を実験Ｈ４と対比すると、実験ｈ４では透湿度が高くなり、金属によるアルミワイヤの被覆率は１００％の方が４０％よりも適していることが分かる。
【０３５９】
（実験Ｈ５） 表１４に示す条件でサンプルを作成した。つまり、実験Ｈ１で使用した金属銅の代わりにニッケルを使い、実験Ｈ１と同様にして平均線径１．０ｍｍ、長さ１．０ｍのニッケルワイヤを得た。得られたワイヤに、共晶はんだＳｎ／Ｉｎ＝４８／５２（融点１１７℃）を被覆し、更に樹脂組成物として、キシレン／アクリル樹脂＝８０／２０（キシレン樹脂：三菱瓦斯化学（株）製、ニカノールＨＰ−１００、アクリル樹脂：帝国化学産業（株）製、ＨＴＲ−８６０Ｐ−３）を使用して、樹脂厚が２０μｍになるように被覆した。更に、実験Ｈ１と同様にして、被覆ワイヤ２本から封止材を作製し、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１４に示す条件のもと、評価試験を行い、表１４に示す結果を得た。
【０３６０】
（実験ｈ５） 表１７に示す条件でサンプルを作成した。すなわち、実験Ｈ５で使用した金属ワイヤを線径１０ｍｍの鉛ワイヤに変更した以外はすべて実験Ｈ５と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１７に示す条件のもと、評価試験を行い、表１７に示す結果を得た。この実験ｈ５を実験Ｈ５と対比すると、実験ｈ５ではワイヤ線が断線するなどの異常が発見された。従って、金属ワイヤの種類及び線径は、ニッケル製の線径１．０ｍｍのものの方が鉛製の線径１０ｍｍのものよりも適していることが分かる。
【０３６１】
（実験Ｈ６） 表１４に示す条件でサンプルを作成した。つまり、実験Ｈ１で使用した金属銅の代わりにステンレスを使い、実験Ｈ１と同様にして平均線径０．５ｍｍ、長さ１．０ｍのニッケルワイヤを得た。得られたワイヤに、共晶はんだＢｉ／Ｃｄ＝６０／４０（融点１４４℃）を被覆し、更に樹脂組成物として、ポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ））を使用して、樹脂厚が２０μｍになるように被覆した。更に、実験Ｈ１と同様にして、被覆ワイヤ２本から封止材を作製し、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１４に示す条件のもと、評価試験を行い、表１４に示す結果を得た。
【０３６２】
（実験ｈ６） 表１７に示す条件でサンプルを作成した。すなわち、実験Ｈ６で使用した金属ワイヤを線径３０ｍｍの銅線に変更した以外はすべて実験Ｈ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１７に示す条件のもと、評価試験を行い、表１７に示す結果を得た。この実験ｈ６を実験Ｈ１と対比すると、実験ｈ６では透湿度が高くなり、金属ワイヤの線径は、線径１．０ｍｍのものの方が線径３０．０ｍｍのものよりも適していることが分かる。
【０３６３】
（実験Ｈ７） 表１４に示す条件でサンプルを作成した。つまり、実験Ｈ１で使用した金属銅の代わりにステンレスを使い、実験Ｈ１と同様にして平均線径０．５ｍｍ、長さ１．０ｍのニッケルワイヤを得た。得られたワイヤに、共晶はんだＰｂ／Ｓｎ＝５／９５（融点１８３℃）を被覆し、更に樹脂組成物として、アクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２）を使用し、樹脂厚が２０μｍとなるように被覆した。更に、実験Ｈ１と同様に被覆ワイヤ２本から封止材を作製してソーダガラス上に配置し、樹脂の硬化は実験１１の加熱に代えて２．４Ｊ／ｃｍ^２のＵＶ照射により行い、その他については実験Ｈ１と同様に、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１４に示す条件のもと、評価試験を行い、表１４に示す結果を得た。
【０３６４】
（実験ｈ７） 表１７に示す条件でサンプルを作成した。すなわち、実験Ｈ７で使用した被覆金属層の厚さを０．０００５ｍｍとした以外はすべて実験Ｈ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１７に示す条件のもと、評価試験を行い、表１７に示す結果を得た。この実験ｈ７を実験Ｈ７と対比すると、実験ｈ７では透湿度が高くなり、被覆金属層の厚さは、０．３ｍｍの方が０．０００５ｍｍよりも適していることが分かる。
【０３６５】
（実験Ｈ８） 表１４に示す条件でサンプルを作成した。つまり、実験Ｈ１で使用した金属銅の代わりにステンレスを使い、実験Ｈ１と同様にして平均線径０．５ｍｍ、長さ１．０ｍのニッケルワイヤを得た。得られたワイヤに、共晶はんだＩｎ／Ｚｎ＝９７．２／２．８（融点１４４℃）を被覆し、樹脂組成物として、実験１と同じエポキシ樹脂を使用し、樹脂厚が２０μｍになるように被覆した。以下、実験Ｈ１と同様にして、被覆ワイヤ２本から封止材を得て、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１４に示す条件のもと、評価試験を行い、表１４に示す結果を得た。
【０３６６】
（実験ｈ８） 表１７に示す条件でサンプルを作成した。すなわち、実験Ｈ８で使用した樹脂組成物を硬化する温度を２１５℃とした以外はすべて実験Ｈ８と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１７に示す条件のもと、評価試験を行い、表１７に示す結果を得た。この実験ｈ８を実験Ｈ８と対比すると、実験ｈ８ではＥＬ素子が黒色に変色するという異常が見られ、ＥＬ素子が酸化、腐食化したことが分かった。従って、樹脂組成物の硬化温度は、１２０℃の方が２１５℃より適していることが分かる。
【０３６７】
（実験Ｉ１） 表１５に示す条件でサンプルを作成した。つまり、実験Ｇ１と同様にして金属銅のインゴットを１１００℃で融解し、水を貯めた回転ドラムの内側にノズルから融液を噴出させた。ただし、ノズルの断面形状を円環状とすることにより、中空構造の銅管線が作製された。固化した中空銅ワイヤ（銅管線）を遠心力によってドラムの内側に巻いて、線径１ｍｍ、管の肉厚０．１ｍｍ、長さ１ｍの銅管線を得た。得られた銅管線に、実験Ｇ１と同様にして、Ｉｎ／Ｃｄ＝７４／２６の共晶はんだのめっき浴中で、はんだ被覆銅管線の直径が１．２ｍｍになるまで電解めっきを施した。このようにして得られたはんだ被覆銅管線を、８０℃に加熱溶融したエポキシ樹脂組成物（（株）アルファ技研製、アルテコ３５００、変性エポキシ樹脂／変性ポリアミン＝１００／５０）中に浸漬し、樹脂厚が１０μｍになるまでワイヤ上に溶着させた。エポキシ樹脂及びはんだで被覆した銅管線二本を平行に接触配置し、８０℃に加熱溶融して融着して封止材を得た。得られた封止材を、２５ｍｍ×１００ｍｍのソーダガラスの周部に貼り付け、樹脂の軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のガラスを向かい合わせにして貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して樹脂を硬化し、接着力測定用サンプルとした。一方、封止材を、１００ｍｍ×１００ｍｍのソーダガラス上の４辺に貼り付けた。その後、軟化温度（８０℃）、１Ｍｐａで１０分間加熱加圧した後、もう１枚のソーダガラスを貼り合わせ、１２０℃、３Ｍｐａで１０分間加熱加圧して樹脂を硬化し、透湿度測定用サンプルとした。そして、表１５に示す条件のもと、評価試験を行い、表１５に示す結果を得た。
【０３６８】
（実験ｉ１） 表１８に示す条件でサンプルを作成した。すなわち、実験Ｉ１で使用した銅線を線径が０．０４ｍｍのものに変更した以外はすべて実験Ｉ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１８に示す条件のもと、評価試験を行い、表１８に示す結果を得た。この実験ｉ１を実験Ｉ１と対比すると、実験ｉ１では透湿度が高くなるとともに、接着力も弱くなり、金属管ワイヤの線径は、１．０ｍｍの方が０．０４ｍｍよりも適していることが分かる。
【０３６９】
（実験Ｉ２） 表１５に示す条件でサンプルを作成した。つまり、実験Ｉ１で使用した金属銅の代わりにステンレスを使い、実験Ｉ２と同様にして平均線径０．５ｍｍ、管の肉厚０．０５ｍｍ、長さ１．０ｍのステンレス管ワイヤを得た。得られたワイヤに、常法により、Ｐｂ／Ｓｎ＝５／９５（融点１８３℃）の共晶はんだのめっき浴中で、はんだ被覆管ワイヤの直径が１．５ｍｍになるまで電解めっきを施した。このようにして得られたはんだ被覆ステンレス管ワイヤを、７０℃に加熱溶融したアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２Ｇ）中に浸漬し、樹脂厚が２５μｍになるまでワイヤ上に溶着させた。アクリル樹脂及びはんだで被覆したステンレス管ワイヤ二本を平行に接触配置し、７０℃に加熱して融着して封止材を得た。実験Ｉ１と同様に封止材をソーダガラス上に配置し、樹脂の硬化は実験Ｉ１の加熱に代えて１．０Ｊ／ｃｍ^２のＵＶ照射により行い、それ以外は実験Ｉ１と同様にして、接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表１５に示す条件のもと、評価試験を行い、表１５に示す結果を得た。
【０３７０】
（実験ｉ２） 表１８に示す条件でサンプルを作成した。すなわち、実験Ｉ２で使用した被覆金属の組成をＰｂ１００％とした以外はすべて実験Ｉ２と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１８に示す条件のもと、評価試験を行い、表１８に示す結果を得た。この実験ｉ２を実験Ｉ２と対比すると、実験ｉ２では透湿度が高くなり、被覆金属の組成はＰｂ／Ｓｎ＝５／９５の方がＰｂ１００％よりも適していることが分かる。
【０３７１】
（実験Ｉ３） 表１５に示す条件でサンプルを作成した。つまり、実験Ｉ１で使用した金属銅の代わりに鉄を使い、実験Ｉ１と同様にして平均線径１０ｍｍ、管の肉厚０．５ｍｍ、長さ１．０ｍの鉄管線を得た。得られた鉄管線に、共晶はんだＢｉ／Ｉｎ＝６７／３３（融点１０９℃）を融着して、被覆した管線の直径が１６ｍｍになるように共晶はんだで被覆した。次に、はんだ被覆鉄管線を、７０℃に加熱溶融したフェノール樹脂（住友ベークライト（株）製フェノール樹脂ＰＭ−８２００）中に浸漬し、樹脂を鉄管線上に溶着させ、樹脂の溶着量はダイヤモンドダイスにより５μｍになるように調節した。被覆ワイヤ２本を融着して封止材を得た。以下、実験Ｉ１と同様にして、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着力測定用のサンプル及び透湿度測定用のサンプルを作製した。そして、表１５に示す条件のもと、評価試験を行い、表１５に示す結果を得た。
【０３７２】
（実験ｉ３） 表１８に示す条件でサンプルを作成した。すなわち、実験Ｉ３で使用した被覆金属層の厚さを７．０ｍｍとした以外はすべて実験Ｉ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１８に示す条件のもと、評価試験を行い、表１８に示す結果を得た。この実験ｉ３を実験Ｉ３と対比すると、実験ｉ３では透湿度が高くなり、被覆金属層の厚さは、３．０ｍｍの方が７．０ｍｍよりも適していることが分かる。
【０３７３】
（実験Ｉ４） 表１５に示す条件でサンプルを作成した。つまり、実験Ｉ１で使用した金属銅の代わりにアルミを使い、実験Ｉ１と同様にして平均線径１．０ｍｍ、管の肉厚０．２ｍｍ、長さ１．０ｍのアルミ管ワイヤを得た。得られた管ワイヤに、共晶はんだＳｎ３５／Ｉｎ４５／Ｂｉ_２Ｏ（融点９８℃）を融着して被覆した管ワイヤの直径が３．０ｍｍになるように共晶はんだで被覆した。次に、はんだ被覆アルミ管ワイヤを、７０℃に加熱溶融したメラミン樹脂（日立化成工業（株）製メラン５２３）中に浸漬し、樹脂厚が２０μｍになるまで管ワイヤ上に溶着させた。以下、実験Ｉ１と同様にして、被覆ワイヤ２本から封止材を作製し、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着力測定用サンプル及び透湿度測定用サンプルを作製した。そして、表１５に示す条件のもと、評価試験を行い、表１５に示す結果を得た。
【０３７４】
（実験ｉ４） 表１８に示す条件でサンプルを作成した。すなわち、実験Ｉ４で使用した金属被覆アルミ管ワイヤの被覆率を４０％とした以外はすべて実験Ｉ４と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１８に示す条件のもと、評価試験を行い、表１８に示す結果を得た。この実験ｉ４を実験Ｉ４と対比すると、実験ｉ４では透湿度が高くなり、金属による金属管ワイヤの被覆率は１００％の方が４０％よりも適していることが分かる。
【０３７５】
（実験Ｉ５） 表１５に示す条件でサンプルを作成した。つまり、実験Ｉ１で使用した金属銅の代わりにニッケルを使い、実験Ｉ１と同様にして平均線径１．０ｍｍ、管の肉厚０．１ｍｍ、長さ１．０ｍのニッケル管ワイヤを得た。得られた管ワイヤに、共晶はんだＳｎ／Ｉｎ＝４８／５２（融点１１７℃）を被覆し、更に樹脂組成物として、キシレン／アクリル樹脂＝８０／２０（キシレン樹脂：三菱瓦斯化学（株）製、ニカノールＨＰ−１００、アクリル樹脂：帝国化学産業（株）製、ＨＴＲ−８６０Ｐ−３）を使用して、樹脂厚が２０μｍになるように被覆した。以下、実験Ｉ１と同様に、被覆ワイヤ２本から封止材を作製し、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１５に示す条件のもと、評価試験を行い、表１５に示す結果を得た。
【０３７６】
（実験ｉ５） 表１８に示す条件でサンプルを作成した。すなわち、実験Ｉ５で使用した金属管ワイヤを線径１０ｍｍの鉛管に変更した以外はすべて実験Ｉ５と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１８に示す条件のもと、評価試験を行い、表１８に示す結果を得た。この実験ｉ５を実験Ｉ５と対比すると、実験ｉ５ではワイヤ線が断線するなどの異常が発見された。従って、金属ワイヤ管の種類及び線径は、ニッケル製の線径が１．０ｍｍのもの方が鉛製の線径が１０ｍｍのものよりも適していることが分かる。
【０３７７】
（実験Ｉ６） 表１５に示す条件でサンプルを作成した。つまり、実験Ｉ１で使用した金属銅の代わりにステンレスを使い、実験Ｉ１と同様にして平均線径０．５ｍｍ、管の肉厚０．１ｍｍ、長さ１．０ｍのステンレス管ワイヤを得た。得られた管ワイヤに、共晶はんだＢｉ／Ｃｄ＝６０／４０（融点１４４℃）を被覆し、更に樹脂組成物として、ポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ））を使用して、樹脂厚が２０μｍになるように被覆した。以下、実験Ｉ１と同様にして、被覆ワイヤ２本から封止材を作製し、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１５に示す条件のもと、評価試験を行い、表１５に示す結果を得た。
【０３７８】
（実験ｉ６） 表１８に示す条件でサンプルを作成した。すなわち、実験Ｉ１で使用した金属管ワイヤを肉厚が０．００５ｍｍの銅管線とした以外はすべて実験Ｉ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１６に示す条件のもと、評価試験を行い、表１６に示す結果を得た。この実験ｉ６を実験Ｉ１と対比すると、実験ｉ６では透湿度が高くなり、金属ワイヤ管の種類及びその線径は、ステンレス製の線径０．１ｍｍのものの方が銅製の線径が０．００５ｍｍのものよりも適していることが分かる。
【０３７９】
（実験Ｉ７） 表１５に示す条件でサンプルを作成した。つまり、実験Ｉ１で使用した金属銅の代わりにステンレスを使い、実験Ｉ１と同様にして平均線径０．５ｍｍ、管の肉厚０．１ｍｍ、長さ１．０ｍのステンレス管ワイヤを得た。得られた管ワイヤに、共晶はんだＰｂ／Ｓｎ＝５／９５（融点１８３℃）を被覆し、更に樹脂組成物として、アクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２）を使用し、樹脂厚が２０μｍとなるように被覆した。実験Ｉ１と同様に、被覆ワイヤ２本から封止材を作製してソーダガラス上に配置し、樹脂の硬化は実験Ｉ１の加熱に代えて２．４Ｊ／ｃｍ^２のＵＶ照射により行い、それ以外は実験Ｉ１と同様に、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表Ｉ３に示す条件のもと、評価試験を行い、表Ｉ３に示す結果を得た。
【０３８０】
（実験ｉ７） 表１８に示す条件でサンプルを作成した。すなわち、実験Ｉ３で使用した被覆金属層を電解めっきで０．０００５ｍｍの厚さとした以外はすべて実験Ｉ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１８に示す条件のもと、評価試験を行い、表１８に示す結果を得た。この実験ｉ７を実験Ｉ３と対比すると、実験ｉ７では透湿度が高くなり、被覆金属層の厚さは、０．３ｍｍの方が０．０００５ｍｍよりも適していることが分かる。
【０３８１】
（実験Ｉ８） 表１５に示す条件でサンプルを作成した。つまり、実験Ｉ１で使用した金属銅の代わりにステンレスを使い、実験Ｉ１と同様にして平均線径０．５ｍｍ、管の肉厚０．１ｍｍ、長さ１．０ｍのステンレス管ワイヤを得た。得られた管ワイヤに、共晶はんだＩｎ／Ｚｎ＝９７．２／２．８（融点１４４℃）を被覆し、樹脂組成物として、実験Ｉ１と同じエポキシ樹脂を使用し、樹脂厚は２０μｍになるように被覆した。実験Ｉ１と同様に、被覆ワイヤ２本から封止材を作製し、ソーダガラス上での軟化温度及び１２０℃での加熱加圧を経て、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１５に示す条件のもと、評価試験を行い、表１５に示す結果を得た。
【０３８２】
（実験ｉ８） 表１８に示す条件でサンプルを作成した。すなわち、実験Ｉ８で使用した樹脂組成物を硬化する温度を２１５℃とした以外はすべて実験Ｉ８と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。そして、表１８に示す条件のもと、評価試験を行い、表１８に示す結果を得た。この実験ｉ８を実験Ｉ８と対比すると、実験ｉ８ではＥＬ素子が黒色に変色するという異常が見られ、ＥＬ素子が酸化、腐食化してしたことが分かった。従って、樹脂組成物の硬化温度は、１２０℃の方が２１５℃より適していることが分かる。
【０３８３】
【表１３】

【表１４】

【表１５】

【表１６】

【表１７】

【表１８】

（実験Ｊ１） 芯材としてナイロンモノフィラメント（東レ（株）製、平均線径０．１ｍｍ、弾性率４．０ＧＰａ）を振動搬送しながら、プラズマ処理機により１ＫＷのプラズマ処理を１０ｍ／分の速度で表面に施した。表面処理したナイロンモノフィラメントに塩化パラジウムによるシーダ処理を施した後、無電解銅めっき液中で０．２μｍ銅を析出させて、常法によりＳｎ／Ｉｎ＝４８／５２共晶はんだ（融点１１７℃）のめっき浴中で、はんだ被覆モノフィラメントの直径が１６０μｍ（被覆厚さ３０μｍ）になるまで電解めっきを施した。はんだの被覆率は９９％以上であった。
【０３８４】
エポキシ樹脂組成物（（株）アルファ技研製、アルテコ３５００、変性エポキシ樹脂／変性ポリアミン＝１００／５０）１００重量部に対して、４−メチル−２−エチルイミダゾール４重量部、乾燥剤である酸化バリウム（和光純薬（株）製）を１０重量部添加し、アプリケータを使用してＰＥＴフィルム（東洋紡（株）製、Ａ−４１００、フィルム厚７５μｍ）上に膜厚が１００μｍになるように塗布してエポキシ樹脂フィルムを形成した。このフィルム上に前述のはんだ被覆ナイロンモノフィラメントを配置して図２６（ｃ）のように埋設してシート状シール材を得た。
【０３８５】
得られたシート状シール材を、２５ｍｍ×１００ｍｍのソーダガラスの４辺に沿って外周部にフィルム幅が２ｍｍになるように貼り付け、８０℃（樹脂の軟化温度）、１ＭＰａで１０分間加熱加圧し、上面のＰＥＴフィルムを剥離除去した。次に、露出したエポキシ樹脂に、もう１枚のガラスを向かい合わせになるようにして貼り合わせ、１２０℃、３ＭＰａで６０分間加熱加圧して樹脂を硬化し、接着力測定用のサンプルとした。一方、１００ｍｍ×１００ｍｍのソーダガラス２枚を用い、ＪＩＳ Ｋ−７１２９に従って、ガラスの４辺に沿って外周部にフィルム幅が２ｍｍになるように封止材を貼り付けて前述と同様の温度及び圧力条件でガラスどうしを接合して透湿度測定用のサンプルとした。
【０３８６】
表１９に示す条件のもと、評価試験を行い、表１９に示す結果を得た。
【０３８７】
（実験ｊ１） 使用したナイロンモノフィラメントの線径を７ｍｍに変更したこと以外はすべて実験Ｊ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製し、評価試験を行って、表２０に示す結果を得た。
【０３８８】
この実験Ｊ１と実験ｊ１との比較は、モノフィラメントの線径の違いが透湿度及び接着力に及ぼす影響を示す。透湿度は、モノフィラメントの線径が大きくなると、初期の値も、温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値も、共に上昇した。接着力は、線径が大きくなると、初期の値も、温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値も共に上昇した。つまり、モノフィラメントの線径が大きくなると、接着力は増すが、透湿度も増すので、モノフィラメントの線径が大きい場合はＥＬ表示装置の長期安定性に問題がある。
【０３８９】
（実験Ｊ２） 実験Ｊ１の手順を以下のように変更して表１９の条件でサンプルを作製した。即ち、実験Ｊ１で使用したナイロンモノフィラメントの代わりにＰＥＴモノフィラメント（東レ（株）製、ポリエステルモノフィラメント、平均線径０．８ｍｍ、弾性率１０ＧＰａ）を用い、また被覆金属として、Ｓｎ／Ｉｎの代わりに共晶はんだＳｎ／Ｂｉ＝４３／５７（融点１３９℃）を用いてはんだ被覆モノフィラメントの直径が８２０μｍ（被覆厚さ１０μｍ）になるまで電解めっきを施した。はんだの被覆率は９９％以上であった。
【０３９０】
更に、樹脂接着剤として、エポキシ樹脂の代わりにアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２Ｇ）を使用し、酸化バリウム（和光純薬（株）製）を１０重量部添加して、アプリケータを用いてＰＥＴフィルム（東洋紡（株）製、Ａ−４１００、フィルム厚７５μｍ）上に膜厚が８２０μｍになるように塗布してアクリル樹脂のフィルムを得た。得られた樹脂フィルム上に、前述のはんだ被覆ＰＥＴモノフィラメントを配置して埋設し、図２６（ｂ）のてシート状シール材を得た。
【０３９１】
実験Ｊ１と同様にしてシール材をソーダガラス上に貼付し、樹脂の硬化は、実験Ｊ１と同様の加圧条件で１．０Ｊ／ｃｍ^２のＵＶ照射により行い、この時１５０℃の加熱を併せて行って、接着用サンプル及び透湿度測定用サンプルを作製した。評価試験を行って、表１９に示す結果を得た。
【０３９２】
（実験ｊ２） 使用したＰＥＴモノフィラメントに代えて、平均線径が０．８ｍｍ、弾性率が０．１ＧＰａのポリエチレンモノフィラメント（東レ（株）製、ポリエチレンモノフィラメント）を使用したこと以外はすべて実験Ｊ２と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。
【０３９３】
実験Ｊ２と実験ｊ２との比較は、モノフィラメントの材質及び弾性率の違いが透湿度及び接着力に及ぼす影響を示す。透湿度は、弾性率が低下すると、初期の値も、温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値も、共に低下した。接着力は、弾性率が増加しても、初期の値も温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値も変化しなかった。つまり、モノフィラメントの弾性率が低下すると、接着力は変わらないが透湿度は増してしまうので、モノフィラメントの弾性率が小さい場合はＥＬ表示装置の長期安定性に問題がある。
【０３９４】
（実験Ｊ３） 実験Ｊ１の手順を以下のように変更して表１９の条件でサンプルを作製した。即ち、実験Ｊ１で使用したナイロンモノフィラメントの代わりにポリプロピレンモノフィラメント（萩原工業（株）製、マルフレン、平均線径０．２ｍｍ、弾性率５．５ＧＰａ）を用い、被覆金属として、Ｓｎ／Ｉｎの代わりに共晶はんだＢｉ／Ｃｄ＝６０／４０（融点１４４℃）を用いて、はんだ被覆モノフィラメントの直径が２４０μｍ（被覆厚さ２０μｍ）になるまで電解めっきを施した。はんだの被覆率は９９％以上であった。
【０３９５】
更に、樹脂接着剤として、エポキシ樹脂に代えてポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ）を使用し、乾燥剤である酸化カルシウム（和光純薬（株）製）を２０重量部添加し、基材としてＰＥＴの代わりにポリプロピレンフィルム（日立化成工業（株）製、Ｋ８−４０）を使用して、上述の樹脂接着剤を基材に塗布して、膜厚が２００μｍのポリエステル樹脂フィルムを形成した。得られた樹脂フィルム上に、前述のはんだ被覆ポリプロピレンモノフィラメントを配置して埋設し、図２６（ｃ）のシート状シール材を得た。
【０３９６】
実験Ｊ１と同様にしてシール材をソーダガラス上に貼付し、樹脂の硬化は、実験Ｊ１と同様の加圧条件で加熱温度を１５０℃に変えて行って、接着用サンプル及び透湿度測定用サンプルを作製した。評価試験を行って、表１９に示す結果を得た。
【０３９７】
（実験ｊ３） 被覆金属としてＰｂ１００％を使用したこと以外はすべて実験Ｊ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。
【０３９８】
実験Ｊ３と実験ｊ３との比較は、金属の違いが透湿度及び接着力に及ぼす影響を示す。被覆金属がＰｂであると、接着力は、初期の値も、温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値もあまり変化しなかったが、透湿度は、いずれの値も上昇した。Ｐｂはかなり軟らかく変形し易い金属であるため、封止前の被覆金属表面の傷や凹凸等に因って接合した基板との間に隙間を生じ、透湿度が上昇したものと考えられる。しかし、このような隙間は、封止時に金属を溶融させることによって解決される。Ｐｂは融点が高いが、融点が低い金属であれば、この問題は封止時の加熱によって容易に解決される。
【０３９９】
（実験Ｊ４） 実験Ｊ１の手順を以下のように変更して表１９の条件でサンプルを作製した。即ち、ナイロンモノフィラメントの代わりにポリフェニレンサルファイドモノフィラメント（東レ（株）製、平均線径０．５ｍｍ、弾性率３．５ＧＰａ）を用い、被覆金属として、Ｓｎ／Ｉｎの代わりに共晶はんだＡｇ／Ｉｎ＝１０／９０（融点２０４℃）を用いて、はんだ被覆モノフィラメントの直径が５１０μｍ（被覆厚さ５μｍ）になるまで電解めっきを施した。但し、モノフィラメントはプラズマ処理を実施せずにめっきした。はんだの被覆率は９９％以上であった。
【０４００】
更に、樹脂接着剤として、エポキシ樹脂に代えてＳＢＳゴム（シェルジャパン（株）製クレイトンＤ−１１０１ＣＵ）を使用し、乾燥剤である酸化カルシウム（和光純薬（株）製）を１５重量部添加した。また、基材としてＰＥＴフィルムの代わりにポリカーボネートのシート（帝人化成（株）製、パンライトＬ−１２５０、１３５℃及び２０ｋｇｆ／ｃｍ^２でプレスして厚さ５５０μｍに調整）を用い、実験Ｊ１と同様に樹脂接着剤を基材に塗布して厚さ５５０μのフィルムを形成し、前述のはんだ被覆モノフィラメントを配置して埋設し、図２６（ｅ）のシート状シール材を得た。
【０４０１】
実験Ｊ１と同様にしてシール材をソーダガラス上に配置し１００℃に加熱して貼付し、樹脂の硬化は、実験Ｊ１と同様の加圧条件で加熱温度を２１０℃に変えて行って、接着用サンプル及び透湿度測定用サンプルを作製した。評価試験を行って、表１９に示す結果を得た。
【０４０２】
（実験ｊ４） 被覆金属の厚さを７ｍｍに変えたこと以外はすべて実験Ｊ４と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。
【０４０３】
実験Ｊ４と実験ｊ４との比較は、被覆金属の厚さの違いが透湿度及び接着力に及ぼす影響を示す。透湿度は、被覆金属の層の厚さが増しても、初期の値も、温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値も共に変化しなかった。接着力は、被覆金属の層の厚さが増すと、初期の値も、温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値も激減した。つまり、被覆金属の層の厚さが増すと透湿度は変化しないが接着力が激減するので、金属層が厚い場合はＥＬ表示装置の長期安定性に問題がある。
【０４０４】
（実験Ｊ５） 実験Ｊ１の手順を以下のように変更して表１９の条件でサンプルを作製した。即ち、ナイロンモノフィラメントの代わりに、ＰＥＴモノフィラメント（東レ（株）製、ポリエステルモノフィラメント、平均線径０．１ｍｍ、弾性率１０Ｇｐａ）を用い、また低融点金属として、Ｓｎ／Ｉｎの代わりに共晶はんだＢｉ／Ｐｂ＝５６．５／４３．５（融点１２５℃）を用いて、はんだ被覆モノフィラメントの直径が１１０μｍ（被覆厚さ５μｍ）になるまで電解めっきを施した。はんだの被覆率は９９％以上であった。
【０４０５】
更に、樹脂接着剤として、エポキシ樹脂に代えてキシレン／アクリル樹脂＝８０／２０（キシレン樹脂：三菱瓦斯化学（株）製、ニカノールＨＰ−１００、アクリル樹脂：帝国化学産業（株）製、ＨＴＲ−８６０Ｐ−３）を使用し、乾燥剤である酸化カルシウム（和光純薬（株）製）を２０重量部添加して、基材としてＰＥＴの代わりにポリイミドフィルム（東レ・デュポン（株）製、カプトン１００Ｈ）を用いて、実験Ｊ１と同様に樹脂接着剤を基材に塗布して膜厚が２００μｍのキシレン／アクリル樹脂フィルムを形成した。得られたフィルム上に、前述のはんだ被覆ＰＥＴモノフィラメントを配置して埋設し、図２６（ｄ）のシート状シール材を得た。
【０４０６】
実験Ｊ１と同様にしてシール材をソーダガラス上に貼付し、樹脂の硬化は、実験Ｊ１と同様の加圧条件で加熱温度を１４０℃に変えて行って、接着用サンプル及び透湿度測定用サンプルを作製した。評価試験を行って、表１９に示す結果を得た。
【０４０７】
（実験ｊ５） 金属による芯材の被覆率を４０％としたこと以外はすべて実験Ｊ５と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。
【０４０８】
実験Ｊ５と実験ｊ５との比較は、金属による芯材の被覆率の違いが透湿度及び接着力に及ぼす影響を示す。透湿度は、金属による芯材の被覆率が減少すると、初期の値も、温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値も、共に激増した。接着力は、金属による芯材の被覆率が減少しても、初期の値も、温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値も変化しなかった。つまり、芯材の被覆率が減少すると透湿度は激増するので、金属による芯材の被覆率が低い場合はＥＬ表示装置の長期安定性に問題がある。
【０４０９】
（実験Ｊ６） 実験Ｊ１の手順を以下のように変更して表１９の条件でサンプルを作製した。即ち、ナイロンモノフィラメントの代わりに、ポリプロピレンモノフィラメント（萩原工業（株）製、マルフレン、平均線径０．２ｍｍ、弾性率５．５ＧＰａ）を用い、被覆金属として、Ｓｎ／Ｉｎの代わりに共晶はんだＢｉ／Ｓｎ／Ｚｎ＝５６／４０／４（１３０℃）を用いて、はんだ被覆モノフィラメントの直径が２１０μｍ（被覆厚さ５μｍ）になるまで融着めっきを施した。はんだの被覆率は９９％以上であった。
【０４１０】
更に、樹脂接着剤として、エポキシ樹脂に代えてポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ）を使用し、乾燥剤である酸化カルシウム（和光純薬（株）製）を２０重量部添加して、実験Ｊ１と同様にして樹脂接着剤を基材に塗布して膜厚が２１０μｍのキシレン／アクリル樹脂フィルムを得た。但し、基材としてはＰＥＴの代わりにポリプロピレンフィルム（日立化成工業（株）製、Ｋ８−４０）を使用した。得られたフィルム上に前述のはんだ被覆ポリプロピレンモノフィラメントを配置して埋設し、図２６（ａ）のシート状シール材を得た。
【０４１１】
実験Ｊ１と同様にしてシール材をソーダガラス上に貼付し、樹脂の硬化は、実験Ｊ１と同様の加圧条件で加熱温度を１４０℃に変えて行って、接着用サンプル及び透湿度測定用サンプルを作製した。評価試験を行って、表１９に示す結果を得た。
【０４１２】
（実験ｊ６） 樹脂接着剤を硬化する加熱温度を１４０℃から２５０℃に変更したこと以外はすべて実験Ｊ６と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。
【０４１３】
実験Ｊ６と実験ｊ６との比較は、樹脂接着剤の硬化温度の違いがＥＬ素子の外観に及ぼす影響を示す。加熱温度が２５０℃まで上昇すると、ダークスポットが発生して外観が劣化し、表示素子としての品質が低下した。従って、樹脂接着剤の硬化に必要な加熱温度が高すぎる場合はＥＬ表示装置の外観、品質を低下させる。
【０４１４】
（実験Ｊ７） 実験Ｊ１の手順を以下のように変更して表１９の条件でサンプルを作製した。即ち、ナイロンモノフィラメントの代わりに、ポリ塩化ビニルモノフィラメント（東ソー（株）製、リューロンペースト７７２、平均線径０．５ｍｍ、弾性率３．８ＧＰａ）を用い、被覆金属として、Ｓｎ／Ｉｎの代わりに共晶はんだＰｂ／Ｓｎ＝５／９５（融点１８３℃）を用いて、はんだ被覆モノフィラメントの直径が５１０μｍ（被覆厚さ５μｍ）になるまで融着めっきを施した。はんだの被覆率は９９％以上であった。
【０４１５】
更に、樹脂接着剤として、エポキシ樹脂に代えてアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２）を使用し、乾燥剤である酸化バリウム（和光純薬（株）製）を５重量部添加して、実験Ｊ１と同様にして樹脂接着剤を基材に塗布して、膜厚が４００μｍのアクリル樹脂フィルムを得た。但し、基材としてはＰＥＴの代わりにポリエチレンフィルム（日立化成工業（株）製、ＣＡ−６０）を使用した。得られた樹脂フィルム上に、前述のはんだ被覆ポリ塩化ビニルモノフィラメントを配置して埋設し、図２６（ｃ）のシート状シール材を得た。
【０４１６】
実験Ｊ１と同様にしてシール材をソーダガラス上に貼付し、樹脂の硬化は、実験Ｊ１と同様の加圧条件で２．４Ｊ／ｃｍ^２のＵＶ照射により行い、この時２００℃の加熱を併せて行って、接着用サンプル及び透湿度測定用サンプルを作製した。評価試験を行って、表１９に示す結果を得た。
【０４１７】
（実験ｊ７） 樹脂接着剤の基材上への塗布厚を１．５ｍｍとしたこと以外はすべて実験Ｊ７と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。
【０４１８】
実験Ｊ７と実験ｊ７との比較は、樹脂接着剤フィルムの厚さの違いが透湿度及び接着力に及ぼす影響を示す。透湿度は、樹脂接着剤フィルムが厚くなると、初期の値も、温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値も、共に増加した。接着力は、樹脂接着剤フィルムが厚くなると、初期の値も、温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値も変化しなかった。つまり、防湿接着層の膜厚が厚くなると、接着力は変化しないが透湿度は増加するので、樹脂接着剤フィルムが厚い場合はＥＬ表示装置の長期安定性に問題がある。
【０４１９】
（実験Ｊ８） 実験Ｊ１の手順を以下のように変更して表１９の条件でサンプルを作製した。即ち、ナイロンモノフィラメントにプラズマ処理を施さず、はんだ被覆モノフィラメントの直径が１１０μｍ（厚さ５μｍ）になるように融着めっきによってはんだを施したこと以外は実験Ｊ１と同様にして、はんだ被覆モノフィラメントを得た。はんだの被覆率は９９％以上であった。
【０４２０】
更に、樹脂接着剤として、エポキシ樹脂に代えて、ＵＶ硬化カチオン重合樹脂組成物［エピコート１００１／エピコート８２８（以上、ビスフェノール型エポキシ樹脂、油化シェル（株）／ニポール１０３２（ニトリルゴム、日本ゼオン（株）製）／ヒタノール２４００（アルキルフェノール、日立化成工業（株）製）／トリフェニルスルホニウム塩系硬化剤（トリフェニルスルホニウムヘキサフロロアンチモネート、旭電化（株）製）／酸化バリウム＝５０／２０／２０／１０／４／１０の配合比の樹脂組成物］を用い、マイクロシリンジを使ってＰＥＴフィルム（東洋紡（株）製、Ａ−４１００、フィルム厚７５μｍ）上に、膜厚が１２０μｍ、幅が２ｍｍになるように塗布して樹脂フィルムを形成した。この樹脂フィルム上に、上記はんだ被覆ナイロンモノフィラメントを配置して埋設し、図２６（ｂ）のシート状シール材を得た。
【０４２１】
実験Ｊ１と同様にしてシール材をソーダガラス上に貼付し、樹脂の硬化は、実験Ｊ１と同様の加圧条件で６Ｊ／ｃｍ^２のＵＶ照射により行い、この時１２０℃の加熱を併せて行って、接着用サンプル及び透湿度測定用サンプルを作製した。評価試験を行って、表１９に示す結果を得た。
【０４２２】
（実験ｊ８） 樹脂接着剤の基材上への塗布厚を０．５μｍとしたこと以外はすべて実験Ｊ８と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。
【０４２３】
実験Ｊ８と実験ｊ８との比較は、樹脂接着剤フィルムの厚さの違いが透湿度及び接着力に及ぼす影響を示す。透湿度は、樹脂接着剤の膜厚が小さくなると、初期の値も、温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値も、共に低下した。接着力は、樹脂接着剤の膜厚が小さくなると、初期の値も、温度が６０℃、湿度が９０％で１０００Ｈ放置した後の値も、低下した。つまり、樹脂接着剤の膜厚が小さくなると接着力は低下し、透湿度は増加するので、樹脂接着剤の膜厚が小さい場合はＥＬ表示装置の長期安定性に問題がある。
【０４２４】
【表１９】

【表２０】

（実験Ｋ１） 芯材としてナイロンモノフィラメント（東レ（株）製、平均線径０．１ｍｍ、弾性率４．０ＧＰａ）を振動搬送しながら、プラズマ処理機により１ＫＷのプラズマ処理を１０ｍ／分の速度で表面に施した。エポキシ樹脂組成物（（株）アルファ技研製、アルテコ３５００、変性エポキシ樹脂／変性ポリアミン＝１００／５０）１００重量部に対して多官能性イソシアネート化合物（日本ポリウレタン（株）製、コロネートＬ）を５重量部添加して作製したプライマーの１０％ＭＥＫ溶液に、プラズマ処理したナイロンモノフィラメントを１分間浸漬し、１２０℃で１０分間乾燥硬化させることによってプライマー処理を施した。その後、常法によりＳｎ／Ｉｎ＝４８／５２共晶はんだ（融点１１７℃）のめっき浴中で、はんだ被覆モノフィラメントの直径が１６０μｍ（被覆厚さ３０μｍ）になるまで電解めっきを施した。はんだの被覆率は９９％以上であった。
【０４２５】
エポキシ樹脂組成物（（株）アルファ技研製、アルテコ３５００、変性エポキシ樹脂／変性ポリアミン＝１００／５０）１００重量部に対して、４−メチル−２−エチルイミダゾール４重量部、乾燥剤である酸化バリウム（和光純薬（株）製）１０重量部を添加し、アプリケータを使用してＰＥＴフィルム（東洋紡（株）製、Ａ−４１００、フィルム厚７５μｍ）上に膜厚が１００μｍになるように塗布してエポキシ樹脂フィルムを形成した。このフィルム上に前述のはんだ被覆ナイロンモノフィラメントを配置して図２６（ｃ）のように埋設してシート状シール材を得た。
【０４２６】
得られたシート状シール材を、２５ｍｍ×１００ｍｍのソーダガラスの４辺に沿って外周部にフィルム幅が２ｍｍになるように貼り付け、８０℃（樹脂の軟化温度）、１ＭＰａで１０分間加熱加圧し、上面のＰＥＴフィルムを剥離除去した。次に、露出したエポキシ樹脂に、もう１枚のガラスを向かい合わせになるようにして貼り合わせ、１２０℃、３ＭＰａで６０分間加熱加圧して樹脂を硬化し、接着力測定用のサンプルとした。一方、１００ｍｍ×１００ｍｍのソーダガラス２枚を用い、ＪＩＳ Ｋ−７１２９に従って、ガラスの４辺に沿って外周部にフィルム幅が２ｍｍになるように封止材を貼り付けて前述と同様の温度及び圧力条件でガラスどうしを接合して透湿度測定用のサンプルとした。
【０４２７】
表２１に示す条件のもと、評価試験を行い、表２１に示す結果を得た。
【０４２８】
（実験ｋ１） はんだによるナイロンモノフィラメントの被覆率が４０％になるように電解めっきを行ったこと以外はすべて実験Ｋ１と同様にして、接着用サンプル及び透湿度測定用サンプルを作製し、評価試験を行って、表２２に示す結果を得た。
【０４２９】
この実験Ｋ１と実験ｋ１との比較は、はんだによる被覆率の違いが透湿度及び接着力に及ぼす影響を示す。透湿度は、はんだによる被覆率が小さくなると、初期の値も、温度が８０℃、湿度が９０％で１０００時間放置した後の値も、共に上昇した。接着力は、被覆率が小さくなっても、初期の値も、温度が８０℃、湿度が９０％で１０００時間放置した後の値も変化しなかった。つまり、はんだによる被覆率が低下する場合、透湿度が増すので、ＥＬ表示装置の長期安定性に問題がある。
【０４３０】
（実験Ｋ２） 実験Ｋ１の手順を以下のように変更して表２１の条件でサンプルを作製した。即ち、実験Ｋ１で使用したナイロンモノフィラメントの代わりにＰＥＴモノフィラメント（東レ（株）製、ポリエステルモノフィラメント、平均線径０．１ｍｍ、弾性率１０ＧＰａ）を用い、プライマーをアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２Ｇ）に変更してＰＥＴモノフィラメントに塗布し、１．０Ｊ／ｃｍ^２のＵＶ照射によりアクリル樹脂を硬化させた。このモノフィラメントに、被覆金属として、Ｓｎ／Ｉｎの代わりに共晶はんだＳｎ／Ｂｉ＝４３／５７（融点１３９℃）を用いてはんだ被覆モノフィラメントの直径が１２０μｍ（被覆厚さ１０μｍ）になるまで電解めっきを施した。はんだの被覆率は９９％以上であった。
【０４３１】
更に、樹脂接着剤として、エポキシ樹脂の代わりにアクリル樹脂（日立化成工業（株）製、防湿絶縁材料ＴＦ−３３４８−１５Ｆ２Ｇ）を使用し、酸化バリウム（和光純薬（株）製）を１０重量部添加して、アプリケータを用いてＰＥＴフィルム（東洋紡（株）製、Ａ−４１００、フィルム厚７５μｍ）上に膜厚が１２０μｍになるように塗布してアクリル樹脂のフィルムを得た。得られた樹脂フィルム上に、前述のはんだ被覆ＰＥＴモノフィラメントを配置して埋設し、図２６（ａ）のシート状シール材を得た。
【０４３２】
実験Ｋ１と同様にしてシール材をソーダガラス上に貼付し、樹脂の硬化は、実験Ｋ１と同様の加圧条件で１．０Ｊ／ｃｍ^２のＵＶ照射により行い、この時１５０℃の加熱を併せて行って、接着用サンプル及び透湿度測定用サンプルを作製した。評価試験を行って、表２１に示す結果を得た。
【０４３３】
（実験ｋ２） プラズマ処理及びプライマー処理のいずれも実施しなかったこと以外はすべて実験Ｋ２と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。
【０４３４】
実験Ｋ２と実験ｋ２との比較は、モノフィラメントのプラズマ及びプライマーによる表面処理の有無が透湿度及び接着力に及ぼす影響を示す。実験ｋ２において、透湿度は、表面処理を施さないと、温度が８０℃、湿度が９０％で１０００Ｈ放置した後の値が低下した（但し、温度が６０℃の場合は、１０００時間放置後も変化しなかった）。接着力は、表面処理を施さなくても、初期の値も温度が８０℃、湿度が９０％で１０００時間放置した後の値も変化しなかった。つまり、プラズマ又はプライマーによる表面処理がない場合は、接着力は変わらないが透湿度は増してしまうので、ＥＬ表示装置の厳しい条件下での長期安定性に問題がある。
【０４３５】
（実験Ｋ３） 実験Ｋ１の手順を以下のように変更して表２１の条件でサンプルを作製した。即ち、実験Ｋ１で使用したナイロンモノフィラメントの代わりにポリプロピレンモノフィラメント（萩原工業（株）製、マルフレン、平均線径０．２ｍｍ、弾性率５．５ＧＰａ）を用い、プライマーをポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ）に変更して、プラズマ処理を行わずに、ポリプロピレンモノフィラメントをプライマーの１０％ＭＥＫ溶液に１分間浸漬して１２０℃で１０分間乾燥硬化させることによってプライマー処理を施した。その後、被覆金属として、Ｓｎ／Ｉｎの代わりに共晶はんだＢｉ／Ｃｄ＝６０／４０（融点１４４℃）を用いて、はんだ被覆モノフィラメントの直径が２４０μｍ（被覆厚さ２０μｍ）になるまで電解めっきを施した。はんだの被覆率は９９％以上であった。
【０４３６】
更に、樹脂接着剤として、エポキシ樹脂に代えてポリエステル樹脂／架橋剤＝１００／２（ポリエステル樹脂：東洋紡（株）製、バイロンＶＧ７００、架橋剤：日本ポリウレタン（株）製、コロネートＬ）を使用し、乾燥剤である酸化カルシウム（和光純薬（株）製）を２０重量部添加し、基材としてＰＥＴの代わりにポリプロピレンフィルム（日立化成工業（株）製、Ｋ８−４０）を使用して、上述の樹脂接着剤を基材に塗布して、膜厚が２００μｍのポリエステル樹脂フィルムを形成した。得られた樹脂フィルム上に、前述のはんだ被覆ポリプロピレンモノフィラメントを配置して埋設し、図２６（ｃ）のシート状シール材を得た。
【０４３７】
実験Ｋ１と同様にして、シール材をソーダガラス上に貼付し、樹脂の硬化は、実験Ｋ１と同様の加圧条件で加熱温度を１５０℃に変えて行って、接着用サンプル及び透湿度測定用サンプルを作製した。評価試験を行って、表２１に示す結果を得た。
【０４３８】
（実験ｋ３） プライマー処理を行わなかったこと以外はすべて実験Ｋ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。
【０４３９】
実験Ｋ３と実験ｋ３との比較は、プライマー処理の有無が透湿度及び接着力に及ぼす影響を示す。接着力は、プライマ処理を行わなくても、初期の値も、温度が８０℃、湿度が９０％で１０００時間放置した後の値もあまり変化しなかったが、透湿度は、１０００時間後の値が上昇した（但し、温度を６０℃とした場合は、１０００時間後も値は変わらなかった。つまり、プライマーによる表面処理がない場合は、接着力は変わらないが透湿度は増してしまうので、ＥＬ表示装置の厳しい条件下での長期安定性に問題がある。
【０４４０】
（実験Ｋ４） プライマー処理を行わなずに、プラズマ処理機による１ＫＷのプラズマ処理を１０ｍ／分の速度で芯材表面に施したこと以外はすべて実験Ｋ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。
【０４４１】
評価試験の結果は、８０℃、湿度９０％で１０００時間放置した後の透湿度の値が僅かに上昇したが、温度が６０℃では１０００時間放置後でも透湿度及び接着力のいずれの項目についても良好な値が得られた。
【０４４２】
（実験Ｋ５） プライマー処理を行わなずに、コロナ処理機による５ＫＷのプコロナ放電処理を２０ｍ／分の速度で芯材表面に施したこと以外はすべて実験Ｋ３と同様にして、接着用サンプル及び透湿度測定用サンプルを作製した。
【０４４３】
評価試験の結果は、８０℃、湿度９０％で１０００時間放置した後の透湿度の値が僅かに上昇したが、温度が６０℃では１０００時間放置後でも透湿度及び接着力のいずれの項目についても良好な値が得られた。
【０４４４】
【表２１】

【表２２】

（実験Ｌ１） 直径１００μｍのナイロンファイバーをイソプロピルアルコールに浸漬して脱脂した後、表面にプラズマ処理を施した。更に、塩化パラジウムによるシーダ処理を施した後、無電解銅めっき液（ＣＵＳＴ２０００、日立化成工業社製）中に液温２５℃で１０分間浸漬して０．２μｍの銅を析出させた。この時の銅めっき膜は脆く、剥離し易かった。更に、電解銅めっき液中で、電流密度が０．００３Ａ／ｃｍ^２になるように電流値を調整して液温２５℃で５分間電解銅めっきを施した。これを蒸留水中で洗浄した後、乾燥機を用いて１２０℃で１０分間乾燥した。めっき被覆ファイバーの直径は１６０μｍ（被覆厚さ３０μｍ、はんだの被覆率は９９％以上）であり、銅めっき膜は、剥離を生じない強度を有していた。更に、この銅めっき被膜ファイバーは、Ｓｎ／Ｉｎ＝４８／５２共晶はんだの電解めっき液（石原薬品社製）を用いて、電流密度０．２５Ａ／ｃｍ^２になるように電流値を調整して液温２５℃で１０分間Ｓｎ／Ｉｎ共晶合金電解めっきを施した。その結果、膜厚１５±１μｍの良好なＳｎ／Ｉｎ共晶合金被覆が形成され、Ｓｎ／Ｉｎ合金めっきの膜厚の均一性は非常に高かった。
【０４４５】
（実験Ｌ２） 直径１００μｍの軟銅線をイソプロピルアルコールに浸漬して１０分間脱脂した後、Ｓｎ／Ｉｎ＝４８／５２共晶はんだの電解めっき液（石原薬品社製）を用いて、電流密度０．３Ａ／ｃｍ^２になるように電流値を調整して液温２５℃で１０分間Ｓｎ／Ｉｎ共晶合金電解めっきを施した。その結果、膜厚２０±１μｍの良好なＳｎ／Ｉｎ共晶合金被覆が形成され、Ｓｎ／Ｉｎ合金めっきの膜厚の均一性は非常に高かった。
【０４４６】
【発明の効果】
本発明によれば、初期及び長時間加熱加湿後の防湿性に優れ、且つ、基板と対向基板との接合の密着性が良好な封止を実現できる封止材及び封止構成体を提供することができる。
【０４４７】
また、本発明によれば、接着機能及び防湿機能に優れた封止構成体を用いて基板と対向基板とを封止するので、搭載される機能素子の耐久性や信頼性が改善され、防湿性及び耐酸化性に優れた長寿命の実装体を提供することができる。
【０４４８】
また、機能素子や基板を損傷しない温度範囲で基板と対向基板とを強固に接合でき、スペーサの機能を有し、作業性に優れるシート状封止材を提供することができる。
【図面の簡単な説明】
【図１】本発明の第１の実施の形態に係る実装体の基板接合前の基板に垂直な断面図（ａ）、基板接合後の実装体を示す基板に垂直な断面図（ｂ）、及び、図１（ａ），（ｂ）の実装体の封止材の配置を説明するための基板に平行な概略構成図（ｃ）である。
【図２】第１の実施形態における封止材の条部材の製造工程の一例を説明するための斜断図（ａ），（ｂ）である。
【図３】第１の実施形態における封止材の条部材の製造工程の他の例を説明するための斜断図（ａ），（ｂ）である。
【図４】第１の実施形態における封止材の条部材の製造工程の他の例を説明するための斜断図（ａ），（ｂ）である。
【図５】第１の実施形態における封止材の芯材の断面図（ａ），（ｂ），（ｃ），（ｄ）である。
【図６】第１の実施形態における封止構成体の配置状態の例を示し、（ｂ），（ｃ），（ｄ），（ｅ）は基板に平行な概略構成図、（ａ）は、図６（ｂ），（ｃ），（ｄ），（ｅ）のＡ−Ａ’線断面図である。
【図７】第１の実施形態における実装体の製造方法を説明する製造工程の模式図（ａ）〜（ｆ）である。
【図８】第１の実施形態における実装体の製造方法の他の例を説明する製造工程の模式図（ａ）〜（ｃ）である。
【図９】第１の実施形態に係る実装体の製造における加圧下での封止構成体を表す要部断面図である。
【図１０】図６（ｂ）の封止構成体の配置での実装体の製造過程を説明するための、図６（ｂ）のＢ−Ｂ’線方向から見た要部の断面図であり、（ａ）は接合前、（ｂ）は接合後を示す。
【図１１】封止構成体の応用例を示す、基板に垂直な断面図（ａ）〜（ｇ）である。
【図１２】本発明の第２の実施の形態に係る実装体の基板接合前の基板に垂直な断面図（ａ）、基板接合後の実装体を示す基板に垂直な断面図（ｂ）、及び、図１２（ａ），（ｂ）の実装体の封止材の配置を説明するための基板に平行な概略構成図（ｃ）である。
【図１３】第２の実施形態における封止材の例を説明するための斜断図（ａ），（ｂ），（ｃ）である。
【図１４】第２の実施形態における封止材の断面図（ａ）〜（ｆ）である。
【図１５】第２の実施形態における実装体の製造方法を説明する製造工程の模式図（ａ）〜（ｅ）である。
【図１６】第２の実施形態における封止構成体の配置状態の例を示し、（ｂ），（ｃ），（ｄ），（ｅ）は基板に平行な概略構成図、（ａ）は、図１６（ｂ），（ｃ），（ｄ），（ｅ）のＡ−Ａ’線断面図である。
【図１７】第２の実施形態に係る実装体の製造における加圧下での封止構成体を表す要部断面図である。
【図１８】図１６（ｂ）の封止構成体の配置での実装体の製造過程を説明するための、図６（ｂ）のＢ−Ｂ’線方向から見た要部の断面図であり、（ａ）は接合前、（ｂ）は接合後を示す。
【図１９】本発明の第３の実施の形態に係る実装体の基板接合前の基板に垂直な断面図（ａ）、基板接合後の実装体を示す基板に垂直な断面図（ｂ）、及び、図１９（ａ），（ｂ）の実装体の封止材の配置を説明するための基板に平行な概略構成図（ｃ）である。
【図２０】第３の実施形態における封止材の例を説明するための斜断図（ａ），（ｂ），（ｃ）である。
【図２１】第３の実施形態における封止材の断面図（ａ）〜（ｈ）である。
【図２２】第３の実施形態における実装体の製造方法を説明する製造工程の模式図（ａ）〜（ｅ）である。
【図２３】第３の実施形態における封止構成体の配置状態の例を示し、（ｂ），（ｃ），（ｄ），（ｅ）は基板に平行な概略構成図、（ａ）は、図２３（ｂ），（ｃ），（ｄ），（ｅ）のＡ−Ａ’線断面図である。
【図２４】第３の実施形態に係る実装体の製造における加圧下での封止構成体を表す要部断面図である。
【図２５】図２３（ｂ）の封止構成体の配置での実装体の製造過程を説明するための、図２３（ｂ）のＢ−Ｂ’線方向から見た要部の断面図であり、（ａ）は接合前、（ｂ）は接合後を示す。
【図２６】本発明に係るシート状封止材の第１の実施形態における変形を示す断面図（ａ）〜（ｅ）、及び、図２６（ａ）のシート状封止材の斜視透視図（ｆ）である。
【図２７】本発明に係るシート状封止材の第１の実施形態における他の変形例を示す断面図（ａ）〜（ｃ）である。
【図２８】本発明に係るシート状封止材の第２の実施形態を示す断面図（ａ）〜（ｄ）である。
【図２９】本発明に係るシート状封止材の製造方法を説明するための各工程における断面図（ａ），（ｂ）である。
【図３０】本発明に係るシート状封止材を用いた実装体の製造方法の一実施形態としてＥＬ表示装置の製造方法を説明するための各工程における断面図（ａ）〜（ｅ）であり、図３０（ｃ）は、図３１のＡ−Ａ’線矢視断面図である。
【図３１】シート状封止材の配置の変形例を示すための、図３０（ｃ）における基板の平面図（ａ）〜（ｄ）である。
【図３２】本発明に係るシート状封止材の他の実施形態を説明するための、基板の平面図である。
【図３３】本発明に係るシート状封止材を用いた実装体の製造方法の他の実施形態として無機ＥＬ素子によるＥＬ表示装置の製造方法を説明するための各工程における断面図（ａ）〜（ｅ）である。
【図３４】本発明に係るシート状封止材を用いた実装体の製造方法の他の実施形態として太陽電池素子を封止した実装体の製造方法を説明するための各工程における断面図（ａ）〜（ｅ）である。
【図３５】本発明に係る封止材の条部材の変形例及びそれを用いた実装体を示す条部材の斜断図（ａ）及び実装体の基板に垂直な断面図（ｂ）である。
【符号の説明】
１ 芯材、 １ａ プラスチックワイヤ、 １ｂ 金属ワイヤ
１ｃ 金属管線、 ２ 金属層、 ３，３’，３” 接着層
４ａ〜４ｄ，４ａ’〜４ｄ’，４ａ”〜４ｄ” 封止材
５ 基板、 ６ 対向基板、 ７ 下部電極、 ８ 電子輸送層
９ 発光層、 １０ 正孔輸送層、 １１ 上部電極
１２ 有機ＥＬ素子、 １３ 条部材、 １４ 樹脂接着剤
１５ 絶縁膜、 １６ 基材、 １７ 導電層
２０ 無機ＥＬ素子、 ２１，２３ 絶縁層、 ２２ 発光層
２４ 電極（Ａｌ）、 ３０ 太陽電池素子、 ３１ 電荷輸送層[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a strip member used for sealing a substrate on which various functional elements such as a display element such as an LCD element, an organic EL element and an inorganic EL element and a solar cell element are mounted, and a moisture-proof seal using the same. The present invention relates to a material, a sealing substrate, a sealing structure, a sealing body and a mounting body sealed using the same, and a manufacturing method thereof.
[0002]
[Prior art]
Display elements of light-emitting devices such as liquid crystal displays, organic EL displays, and inorganic EL displays, and functional elements such as dye-sensitized solar cell elements are generally chemically unstable. It is known that the reaction with oxygen causes corrosion and oxidation, which causes the above-mentioned deterioration of the functional element over time. For example, in the case of an organic EL element, when the organic EL element comes into contact with oxygen or moisture, oxidation of the element constituting material is accelerated by the oxygen or moisture, the element is deteriorated, and a non-light emitting portion called a dark spot is generated. Therefore, in order to extend the life of these devices, it is desirable to seal the devices so that oxygen and moisture do not enter the devices as much as possible.
[0003]
Conventionally, various types have been proposed as having this sealing function, and one of them is a paste-like sealing material. However, when a paste-like sealing material is used, it is difficult to apply the sealing material uniformly on the substrate, and the surface of the sealing material becomes uneven, so that the element may come into contact with the outside air through the unevenness of the sealing material. there were. Therefore, in the light emitting device, a desiccant has been used together with the sealant in order to prevent oxidation of the electrode material and corrosion due to moisture.
[0004]
In this case, the sealing material is used in a bottom emission method, and a desiccant which is a solid of a white powder such as barium oxide or calcium oxide and blocks light is held by a fixing tape on a side of the counter substrate facing the element. Deploy.
[0005]
[Patent Document 1]
Japanese Patent Publication No. 11-510647
[0006]
[Problems to be solved by the invention]
However, in recent years, the conventional bottom emission method has been changed to a top emission method for the purpose of improving the emission intensity and luminance. Since the top emission method has a structure in which light is extracted from the counter substrate side, a conventionally used desiccant cannot be used as before. However, if only the paste-like sealing agent is used, the entrance of the outside air is allowed due to the unevenness of the sealing material.
[0007]
On the other hand, as a joining material having another sealing function, a low melting point metal such as solder is used (for example, see Patent Document 1). In this case, at the beginning of the adhesion, it is sufficiently adhered to the substrate and the opposing substrate, and the adhesion is good. Thus, there is a problem that the element is exposed to the outside air and causes oxidation and corrosion. Further, when a glass substrate is used as the material of the counter substrate, good adhesion between the solder and the glass substrate cannot be expected originally.
[0008]
Therefore, there is a need for an alternative to the conventional sealing material, which has a high barrier property against oxygen and moisture and has a durability in bonding. There is also a need for a sealing material that can join a substrate and a counter substrate (a functional element substrate and a functional element protection substrate) at a relatively low temperature so that the functional element is not damaged by overheating.
[0009]
The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to use the present invention for sealing a substrate and a counter substrate instead of using a combined sealant and desiccant. , A sealing member, a moisture-proof sealing material, a sheet-like sealing material, and a sealing substrate using the same, which have an adhesive function and a moisture-proof function and can realize a sealing joint with improved shielding properties. It is an object of the present invention to provide a sealing structure, a sealing body, a mounting body, and a manufacturing method thereof.
[0010]
Another object of the present invention is to provide a long-life functional element package having high reliability and durability in which a functional element is shielded from the outside air by using a sealing material having an adhesive function and a moisture-proof function integrally. It is in.
[0011]
It is another object of the present invention to provide a sealing material capable of forming a bond between a substrate and an opposing substrate firmly at a relatively low temperature, having excellent barrier properties against oxygen and moisture, and having excellent durability. Aim.
[0012]
Another object of the present invention is to provide a moisture-proof sealing material which is excellent in workability at the time of use and can easily perform a sealing operation, and a method for producing the same.
[0013]
It is another object of the present invention to provide a package having a long-term stability and a method for manufacturing the same.
[0014]
[Means for Solving the Problems]
According to one aspect of the present invention, the strip member has a strip-shaped core material that can be elastically deformed, and a metal layer that covers at least a part of the core material.
[0015]
According to another aspect of the present invention, the sealing strip member for enhancing the shielding property of the joining by the resin adhesive is a strip-shaped metal material, and an elastically deformable strip-shaped core incorporated in the metal material. Material.
[0016]
Further, according to one aspect of the present invention, a method for manufacturing a strip member includes a step of preparing an elastically deformable strip-shaped core material and a step of providing a metal layer covering at least a part of the core material. .
[0017]
Further, according to one aspect of the present invention, the sealing material is a strip member having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material; It has an adhesive layer attached.
[0018]
According to another aspect of the present invention, the sealing member includes a plurality of strip members each having a resiliently deformable strip-shaped core material and a metal layer covering at least a part of the core material, and being arranged in parallel; And a resin layer connecting the plurality of strip members.
[0019]
According to one aspect of the present invention, a method of manufacturing a sealing material includes a step of preparing an elastically deformable strip-shaped core material and a step of forming a metal layer covering at least a part of the core material. A step of forming a member; and a step of forming an adhesive layer covering at least a part of the periphery of the strip member.
[0020]
Further, according to one embodiment of the present invention, the sheet-shaped sealing material includes a base material having a releasable surface; an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material. And an adhesive supported on the releasable surface of the substrate together with the strip member.
[0021]
According to another aspect of the present invention, the sheet-shaped sealing material includes a substrate having a releasable surface; a strip-shaped core having elasticity; and a metal layer covering at least a part of the core. A plurality of strip members arranged in parallel with each other; and an adhesive supported together with the plurality of strip members on the release surface of the substrate.
[0022]
Further, according to one aspect of the present invention, a method of manufacturing a sheet-shaped sealing material includes a step of preparing a strip member in which at least a part of an elastically deformable strip-shaped core material is covered by a metal layer; Preparing a substrate having a surface, a step of disposing a resin adhesive on the releasable surface of the substrate, and a step of disposing the strip member on the releasable surface of the substrate. .
[0023]
According to one embodiment of the present invention, the sealing substrate includes a base material having a release surface; an elastically deformable strip-shaped core material, and a metal layer covering at least a part of the core material. A sheet-like sealing material having a strip member; and a resin adhesive supported on the releasable surface of the substrate together with the strip member, and the resin adhesive of the sheet-like sealing material is adhered. Substrate.
[0024]
According to another aspect of the present invention, a sealing substrate comprises: a substrate; a substrate disposed on the substrate and having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material. A member; a resin adhesive disposed on the substrate together with the strip member; and a substrate having a releasable surface and covering the resin adhesive with the releasable surface.
[0025]
Further, according to one aspect of the present invention, a sealing member is disposed on a substrate, and has an elastically deformable strip-shaped core material and a metal member covering at least a part of the core material; And a sealing structure for sealingly bonding the substrate to another substrate, the sealing structure including an adhesive disposed on the substrate together with the strip member.
[0026]
According to one aspect of the present invention, a method of manufacturing a sealing structure includes a step of preparing a strip member having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material. And a step of arranging the strip member and the adhesive on the substrate. A method for producing a sealing structure for sealingly joining the substrate to another substrate.
[0027]
According to another aspect of the present invention, a method of manufacturing a sealing structure includes a plurality of strip members each having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material. Preparing, and arranging the plurality of strip members and the adhesive on the substrate, having a step of positioning the adhesive between the plurality of strip members arranged in parallel, the substrate and another substrate This is a method for manufacturing a sealing structure for sealing and joining.
[0028]
According to another aspect of the present invention, the sealing structure is a sealing structure provided on the substrate to seal and bond the substrate and the counter substrate, wherein the strip-shaped moisture-proof layer, An adhesive layer for bonding the substrate to the counter substrate; and an elastic layer capable of pressing the moisture-proof layer to the substrate and the counter substrate by elastic deformation when the substrate is bonded to the counter substrate.
[0029]
According to another aspect of the present invention, a method of manufacturing a sealing structure includes a step-shaped moisture-proof layer, and the moisture-proof layer is arranged in parallel with the moisture-proof layer. And a step of providing an elastic layer capable of being pressed against the counter substrate on the substrate, and a step of providing an adhesive layer on the substrate for bonding the substrate to the counter substrate. This is a method for manufacturing a sealing structure for sealing and joining.
[0030]
Further, according to one embodiment of the present invention, the sealing body includes a substrate and a counter substrate facing the substrate; an adhesive bonding the substrate and the counter substrate; and an elastically deformed strip-shaped core material. Covering at least a portion of the core material, and having a metal layer pressed against both the substrate and the counter substrate by the elastically deformed core material, and shielding a space between the substrate and the counter substrate. It has a strip member.
[0031]
According to another aspect of the present invention, a sealing body includes a substrate and a counter substrate facing the substrate; an adhesive bonding the substrate and the counter substrate; and a space between the substrate and the counter substrate. A strip-shaped metal layer to be shielded; and a strip-shaped core material that elastically deforms between the substrate and the counter substrate to press the metal layer against both the substrate and the counter substrate.
[0032]
According to another aspect of the present invention, the sealing body includes a substrate and an opposing substrate facing the substrate; an adhesive layer joining the substrate and the opposing substrate; and a space between the substrate and the opposing substrate. A strip-shaped moisture-proof layer for shielding; and an elastic layer elastically deforming between the substrate and the counter substrate to press the moisture-proof layer against both the substrate and the counter substrate.
[0033]
Further, according to one aspect of the present invention, the mounted body includes a substrate and an opposing substrate facing the substrate; an adhesive for joining the substrate and the opposing substrate; an elastically deformed strip-shaped core material; A strip member that covers at least a part of the material and has a metal layer pressed against both the substrate and the counter substrate by the elastically deformed core material, and shields a space between the substrate and the counter substrate; And a functional element provided in the space between the substrate and the counter substrate.
[0034]
According to another aspect of the present invention, a mounting body includes a substrate and an opposing substrate facing the substrate; an adhesive bonding the substrate and the opposing substrate; shielding a space between the substrate and the opposing substrate. A strip-shaped metal layer; a strip-shaped core material that elastically deforms between the substrate and the counter substrate to press the metal layer against both the substrate and the counter substrate; and the substrate and the counter substrate. And a functional element provided in the space between them.
[0035]
According to another aspect of the present invention, a mounting body includes a substrate and an opposing substrate facing the substrate; an adhesive layer joining the substrate and the opposing substrate; shielding a space between the substrate and the opposing substrate. An elastic layer that elastically deforms between the substrate and the opposite substrate to press the moisture-proof layer against both the substrate and the opposite substrate; and between the substrate and the opposite substrate. And a functional element provided in the space.
[0036]
According to one aspect of the present invention, a method of manufacturing a package includes a step of preparing a substrate provided with a functional element, and covering an elastically deformable strip-shaped core material and at least a part of the core material. A step of disposing a strip member having a metal layer on the substrate so as to surround the functional element; a step of disposing an adhesive on the substrate so as to be in parallel with the strip member; Bonding the substrate and the counter substrate with the adhesive while pressing the substrates.
[0037]
According to another aspect of the present invention, a method of manufacturing a package includes a step of preparing a substrate on which a functional element is provided, a step of forming an elastically deformable strip-shaped core material and a metal covering at least a part of the core material. Arranging a strip member having a layer on the counter substrate so as to surround the functional element when the substrate and the counter substrate face each other, and applying an adhesive on the counter substrate so as to be parallel to the strip member. And bonding the substrate and the opposing substrate with the adhesive while pressing the substrate against the strip member.
[0038]
According to another aspect of the present invention, a method of manufacturing a package includes a step of preparing a substrate on which a functional element is provided, a step of forming an elastically deformable strip-shaped core material and a metal covering at least a part of the core material. A step of preparing the counter substrate provided so as to surround the functional element when the substrate and the counter substrate face each other, Bonding the substrate and the counter substrate with the adhesive while pressing the strip member against the substrate.
[0039]
According to another aspect of the present invention, a method of manufacturing a package includes a step of preparing a substrate provided with a functional element, a step-shaped moisture-proof layer, and a substrate and a counter substrate, which are arranged in parallel with the moisture-proof layer. Providing an elastic layer capable of pressing the moisture-proof layer to the substrate and the counter substrate by elastic deformation when bonded to the substrate so as to surround the functional element, and an adhesive layer parallel to the moisture-proof layer. A step of providing the substrate and the opposing substrate with the adhesive while pressing the opposing substrate against the elastic layer.
[0040]
According to another aspect of the present invention, a method of manufacturing a package includes a step of preparing a substrate provided with a functional element, a step-shaped moisture-proof layer, and a substrate and a counter substrate, which are arranged in parallel with the moisture-proof layer. An elastic layer capable of pressing the moisture-proof layer to the substrate and the counter substrate by elastic deformation when bonded, and an adhesive layer parallel to the moisture-proof layer, the functional element when the substrate and the counter substrate face each other. And a step of bonding the substrate and the opposing substrate by the adhesive layer while pressing the substrate against the elastic layer.
[0041]
According to another aspect of the present invention, a method for manufacturing a package includes a step of preparing a substrate provided with a functional element, a strip-shaped metal layer, and a substrate and a counter substrate arranged in parallel with the metal. When the metal layer can be pressed against the substrate and the counter substrate by elastic deformation at the time of bonding, a strip-shaped elastic core material, and an adhesive arranged in parallel with the metal layer, when the substrate and the counter substrate face each other. A step of preparing the counter substrate provided so as to surround the functional element; and a step of bonding the substrate and the counter substrate with the adhesive while pressing the substrate against the elastic core material.
[0042]
According to another aspect of the present invention, a method of manufacturing a package includes a step of preparing a substrate on which a functional element is provided, a step of forming an elastically deformable strip-shaped core material and a metal covering at least a part of the core material. Arranging a sealing structure in which a plurality of strip members each having a layer are arranged in parallel via an adhesive layer on the substrate so as to surround the functional element; and pressing a counter substrate against the strip member. Bonding the substrate and the counter substrate with the adhesive layer.
[0043]
According to another aspect of the present invention, a method of manufacturing a package includes a step of preparing a substrate on which a functional element is provided, a step of separating a strip member having an elastic strip-shaped core material covered with a metal layer, The adhesive of the sheet-like sealing material so as to surround the functional element with a sheet-like sealing material having a substrate having a moldable surface and an adhesive supported on the release surface together with the strip member. Bonding the substrate to the substrate, peeling the base material from the adhesive, and bonding the substrate and the counter substrate with the adhesive while pressing the counter substrate against the strip member on the substrate. And a method for manufacturing a mounted body.
[0044]
According to another aspect of the present invention, the mounting body is a substrate and a counter substrate facing the substrate;
An adhesive layer that joins the substrate and the counter substrate; a strip-shaped moisture-proof layer that is pressed against both the substrate and the counter substrate to shield a space between the substrate and the counter substrate; It has a functional element provided in the space between the opposing substrate.
[0045]
According to another aspect of the present invention, the mounting body is a substrate and a counter substrate bonded to the substrate; a strip-shaped metal layer for shielding a space between the substrate and the counter substrate; A strip-shaped core material that elastically deforms between the substrate and the counter substrate to press the moisture-proof layer against both the substrate and the counter substrate; and is provided in the space between the substrate and the counter substrate. It has a functional element.
[0046]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description of the drawings, elements having the same equipment and members are denoted by the same reference numerals. Each drawing is an illustration showing a characteristic portion for easy understanding, and is not an actual size diagram.
[0047]
When a display element such as a liquid crystal display or an organic EL display is disposed between substrates and sealed, moisture-proof properties for protecting the display element from moisture are required for the sealing material. It is also necessary to have stress resistance such that the joint can withstand the resulting stress strain. Generally, there is a metal bonding material typified by a resin adhesive or a solder used as a sealing material, but the resin adhesive is relatively adaptable to external stress, and stress distortion occurs. Also, although the peeling of the bonding hardly occurs, the moisture easily permeates. On the other hand, the metal bonding material has a high moisture shielding ability, but has low adaptability to external stress, and is liable to cause peeling and material destruction when bonding members with temperature changes. Therefore, in any case, it is not enough to seal the display element by itself.
[0048]
Therefore, as a sealing material for joining the substrate and the counter substrate, it is conceivable to use a metal member for preventing moisture permeation and a resin adhesive in combination. In practice, it is difficult to take advantage of both. The reason is that a gap is easily formed between the resin-bonded substrate and the counter substrate and the metal member, and the moisture-proof property is impaired by a small gap.
[0049]
Therefore, in the present invention, in the sealing of the substrate, the sealing using a strip-shaped (meaning elongated and continuous state, the shape is not limited and may be, for example, hollow) and the resin adhesive is used in combination. In order to improve the shielding property of the metal member constituting the moisture permeation preventing layer in the joined state where the resin adhesive is cured, a pressing force acts between the substrate and the counter substrate and the metal member. To increase the closeness between the substrates. The pressing force for bringing the metal member and the substrate into close contact with each other in the joined state can utilize the contraction force accompanying the curing of the adhesive, and this can cure the resin adhesive in a state where the metal member and the substrate are in contact with each other. You can get it. In such a bonding state, the metal member comes into close contact with the substrate due to the contraction force of the resin adhesive. However, in order to prevent a gap caused by slight irregularities on the surfaces of the substrate and the metal member, a larger pressing force is required. For this purpose, it is effective to press the metal member against the substrate during the curing of the resin adhesive to bring the metal member into pressure contact, and to cure the resin adhesive while closing the gap between the substrate and the metal member. In this joint state, the springback of the metal member elastically deformed by the pressure contributes to the close contact between the metal member and the substrate.
[0050]
At this time, if the elastic limit or melting point of the metal member is low, plastic deformation due to pressing force at the time of joining or softening flow / melting due to heating for softening / hardening the resin adhesive occurs. These work effectively for closing the gap, but depending on the working conditions, the flow of the material may impair the shielding property or cause a defective product due to the displacement of the substrate, and the spring effect cannot be obtained. In such a case, when a core material having a high elastic limit or a high melting point is used by incorporating it into a metal member, the elastic layer constituted by the core material acts as a spacer to support the opposing substrate, thereby preventing misalignment and the like. The blocking property of the gap due to the flow further enhances the shielding property of the moisture-permeable preventing layer. In addition, when the moisture-permeable layer is interposed between the elastic layer and the substrate and the counter substrate, the spring action due to the elasticity of the core acts on the interposed moisture-permeable layer to bring the substrate and the opposing substrate into close contact with each other. At this time, if the metal member is melted and adhered to the substrate, there is an effect of assisting the joining by the resin adhesive, but the adhesion between the metal member and the substrate is not essential.
[0051]
The sealing structure having the adhesive layer, the moisture-permeable layer and the elastic layer described above and having a high shielding property of the moisture-permeable layer has a core material for forming the elastic layer, a metal material for forming the moisture-permeable layer, and an adhesive layer. It is obtained by a sealing material made of a resin adhesive to be formed, and the mode of the sealing material is as follows. ) Combining a strip member in which a strip-shaped metal material and a strip-shaped core material are integrated with a resin adhesive at the time of use 3) Sealing in which a strip-shaped metal material, a strip-shaped core material and a resin adhesive are integrated Using stop materials.
[0052]
Hereinafter, an embodiment of a sealing material and a mounted body in which a substrate is bonded using the sealing material will be described.
[0053]
[First Embodiment]
(Mounted body)
FIGS. 1A and 1B show an embodiment of the mounting body of the present invention, in particular, mounting of an organic EL element. FIG. 1A shows a mounting body before forming a substrate junction, FIG. Shows a sectional view parallel to the substrate of the mounting body. This mounting body surrounds the substrate 5, the opposing substrate 6 facing the substrate 5, the organic EL element 12 interposed between the substrate 5 and the opposing substrate 6, and the organic EL element 12. And a sealing structure composed of four strip-shaped sealing materials 4a to 4d arranged on the peripheral portion of the substrate 5.
[0054]
Each of the sealing members 4a to 4d used in the sealing structure in this embodiment is a combination of two members, that is, a strip member including a core member 1 and a metal layer 2 covering the outer periphery of the core member 1. 13 and a combination of the strip-shaped adhesive layers 3 arranged in parallel on the inside and outside of the strip member, and are appropriately arranged at a sealing position on the substrate to form a sealed structure. The metal layer 2 is formed of a low-melting-point metal, and the core material 1 is formed of a material that is elastically deformable and has a higher elastic limit than the metal layer 2. The bonding layer 3 has a function of bonding the substrate 5 and the counter substrate 6, and presses the counter substrate 6 toward the substrate 5 against the strip member as shown in FIGS. 1 (a) and 1 (b). When the substrate 5 and the opposing substrate 6 are adhered to each other by the adhesive layer 3, the metal layer 2 blocks the outside air, and protects the organic EL element 12 interposed between the substrate 5 and the opposing substrate 6 from oxidation and corrosion. A sealing function is exhibited.
[0055]
(Sealing material)
The strip members 13 of the sealing members 4a to 4d used for manufacturing the mounting body are composed of the core material 1 and the metal layer 2, and are specifically shown in FIGS. Such a core material 1 is different.
[0056]
The core material 1 only needs to be a core material that can be physically elastically deformed by a pressing force, and specifically, can be formed by a plastic wire 1a, a metal wire 1b, or a metal tube wire 1c. FIGS. 2 to 4 show examples of strip members using these core materials 1a to 1c. The wire diameter of the core material 1 is set such that the elastic compression of the core material 1 and the deformation of the metal layer 2 are performed so that the distance between the substrate 5 and the opposing substrate 6 becomes larger than the height of the organic EL element 12 in a state where the substrates are joined. It is determined appropriately in consideration of the situation. In these figures, the core material 1 is described as having a circular cross-sectional shape, but the core material and the strip member do not necessarily have to be circular in cross-section, and the cross-section of the core material is as shown in FIG. May be a triangular strip member, or as shown in FIGS. 5C and 5D, the cross section of the core 1 may be a polygonal strip member. However, if the surface of the strip member comes into line contact with the substrate and the counter substrate with a continuous curved surface at the portion where the strip member contacts the substrate and the counter substrate, the adhesion between the strip member and the substrate and the counter substrate due to pressing, that is, the shielding property, is reduced. In this respect, it is advantageous in this respect that the core and the strip have a circular, elliptical or partially arcuate cross-sectional shape. Considering the ease of manufacture of the sealing material and the ease of handling in the sealing operation, those having a circular cross section are preferable. In the following description, a circular cross section will be described, but in the case of another shape, the “wire diameter” may be understood as “line width (thickness)”.
[0057]
When the core material 1 is a plastic wire 1a, it may be a plastic wire elastically deformable with respect to a pressing force, and practically, there is no particular limitation as long as it is elastically deformed at a pressure of 0.01 GPa or more. . Specifically, those having a compression elastic modulus of 0.3 GPa or more and 20 GPa or less at room temperature are preferable. If the compression modulus is less than 0.3 GPa, the amount of deformation at the time of pressurization is too large, and the moisture resistance at the time of humidification becomes insufficient. On the other hand, if the compression modulus is larger than 20 GPa, the amount of deformation during pressurization is small, so that the stress for pressing the low melting point metal layer against the substrate and the counter substrate after bonding is small, and the moisture resistance is reduced. More preferably, the compression modulus is 0.5 GPa or more and 10 GPa or less, and most preferably 1.0 GPa or more and 7.0 GPa or less. When a resin adhesive which requires heating for bonding the substrates is used as the adhesive layer 3, it is necessary that the adhesive can be elastically deformed in a heated state. It is preferable to use one having the above-mentioned compression elastic modulus in the above range.
[0058]
Further, the wire diameter of the plastic wire 1a differs depending on the functional element sealed in the mounting body. In the case of FIG. 1, the wire diameter is preferably 0.05 mm or more and 20 mm or less. When the wire diameter is smaller than 0.05 mm, the elastic pressure and the pressing area applied to the metal layer 2 and the substrate become small, and the shielding property is reduced. On the other hand, when the wire diameter is larger than 20 mm, the dimension of the strip member becomes too large, and an excessively large dimensional difference from the adhesive layer 3 easily causes poor adhesion and lowers the moisture resistance. More preferably, the wire diameter of the plastic wire 1a is 0.1 mm or more and 10 mm or less, and most preferably 0.3 mm or more and 5 mm or less. Specific examples of the material of the plastic wire 1a include polyethylene, 6-nylon, polyvinyl alcohol, aramid fiber, polyethylene terephthalate, polystyrene, polypropylene, PAN, polyvinyl chloride, polyphenylene sulfide, and the like. Alternatively, a composite or the like containing a plurality of these materials can be used.
[0059]
When the core material 1 is the metal wire 1b, any material having a higher elastic limit than the metal layer 2 may be used, and a material having a compression elastic modulus of 10 GPa or more and 300 GPa or less is preferable. It is preferably from 50 GPa to 200 GPa. If the compression modulus exceeds 300 GPa, the core material is less likely to be deformed, voids are generated, and the moisture-proof reliability is reduced. If the compression modulus is less than 10 GPa, the deformation of the core material becomes excessive and the effect as an elastic body is not sufficiently exhibited, so that the moisture-proof reliability is reduced. Since the elastic limit of the metal depends on the material and the heat treatment, it can be appropriately selected in consideration of the heat treatment history. The wire diameter of the metal wire 1b can be 0.05 mm or more and 20 mm or less. When the wire diameter is smaller than 0.05 mm, the elastic pressure and the pressing area applied to the metal layer 2 and the substrate become small, and the shielding property is reduced. On the other hand, when the wire diameter is larger than 20 mm, the dimension of the strip member becomes too large, and an excessively large dimensional difference from the adhesive layer 3 easily causes poor adhesion and lowers the moisture resistance. Preferably, the wire diameter of the metal wire 1b is 0.1 mm or more and 10 mm or less, and most preferably 0.3 mm or more and 5 mm or less. Specific examples of the material of the metal wire 1b include, for example, copper, stainless steel, iron, aluminum, nickel and the like. Further, an alloy material such as a cobalt alloy, an iron alloy, and a nickel alloy may be used, and a fiber composite material in which such a metal material is combined with a fiber material may be used. The fibers to be composited include metal fibers such as steel fibers, aluminum alloy fibers, and titanium alloy fibers, as well as non-metal fibers such as boron fibers, alumina fibers, SiC fibers, glass fibers, carbon fibers, Kevlar fibers, and PBT fibers. Is mentioned.
[0060]
An advantage of using a tubular wire as the core material 1 is that the wire can be given an appropriate elasticity by adjusting the thickness of the tubular wire, and restrictions due to physical properties such as hardness and elasticity of the material itself can be reduced. The tubular core 1 is also advantageous when the strip members need to be partially plastically deformed, such as when a plurality of strip members need to be compressed in order to intersect.
[0061]
When the core material 1 is a metal tube wire 1c, a wire having a wire diameter of 0.05 mm or more and 20 mm or less and a wall thickness of 10 μm or more and 1 mm or less can be used. When the wire diameter is smaller than 0.05 mm, the elastic pressure and the pressing area applied to the metal layer 2 and the substrate become small, and the shielding property is reduced. On the other hand, if the wire diameter is larger than 20 mm, the dimension of the strip member becomes too large, the dimensional difference from the adhesive layer 3 becomes excessive, and the moisture resistance is reduced due to poor adhesion. On the other hand, when the wall thickness of the tube is smaller than 10 μm, it is easily plastically deformed at the time of pressurization, and it is difficult to obtain an improvement in moisture resistance by springback. On the other hand, if the thickness of the tube is more than 1 mm, the advantage of using a tubular wire cannot be obtained, and it is difficult for the tube to elastically deform when pressurized. More preferably, the thickness of the metal tube wire 1c is 20 μm or more and 0.5 mm or less, and most preferably 30 μm or more and 0.3 mm or less. Examples of the material of the metal tube wire 1c include copper, stainless steel, iron, aluminum, nickel and the like. Further, an alloy material such as a cobalt alloy, an iron alloy, and a nickel alloy may be used, and a fiber composite material obtained by compounding such a metal material with a fiber material may be used. The fibers to be composited include metal fibers such as steel fibers, aluminum alloy fibers, and titanium alloy fibers, as well as non-metal fibers such as boron fibers, alumina fibers, SiC fibers, glass fibers, carbon fibers, Kevlar fibers, and PBT fibers. Is mentioned.
[0062]
Note that it is also possible to use a plastic tube wire as the core material 1, and the advantages of the above-described tubular wire can be obtained.
[0063]
The metal layer 2 is for tightly connecting to the substrate 5 and the counter substrate 6 to shield moisture, and in this sense, any metal can be used as the material as long as it has a thickness capable of suppressing moisture transmission. . In this embodiment, a low-melting-point metal having a melting point in the range of 80 to 250 ° C. is used, and has an effect of increasing a shielding property by filling a small gap between the substrate 5 and the counter substrate 6 by melting by low-temperature heating. . Further, when the metal layer 2 adheres to the substrate, the bonding by the adhesive layer 3 is assisted. If the melting point of the metal is lower than 50 ° C., the moisture-proof reliability of the package at high temperatures is undesirably reduced. If the melting point is 250 ° C. or higher, the temperature becomes high enough to adversely affect the element when fluidized to fill a slight gap with the substrate. In this regard, the melting point is more preferably 100 ° C. or more and 220 ° C. or less, and most preferably 120 ° C. or more and 200 ° C. or less. The thickness of the metal layer 2 can be used in the range of 1 μm to 5 mm. If this value is smaller than 1 μm or larger than 5 mm, the moisture-proof reliability of the package is reduced. More preferably, the thickness of the metal layer 2 is 3 μm or more and 1 mm or less, and most preferably 5 μm or more and 0.5 mm or less. As the low melting point metal used for the metal layer 2, various eutectic alloys, non-eutectic low melting point alloys, or single metals can be used. Even with a high melting point metal having a melting point of 250 ° C. or higher, alloys and oxides of metals such as Sb (630 ° C.), Bi (271 ° C.), Pb (327 ° C.), and Zn (420 ° C.) The melting point is lower than usual. For example, Pb 88.9% / Sn 11.1% (melting point 250 ° C.), and similar expressions below, Pb 82.6 / Cd 17.4 (248 ° C.) Pb 85 / Au 15 (215 ° C.), Tl 93.7 / Na 6 0.3 (238 ° C), Tl92 / As8 (220 ° C), Tl99.4 / L: 0.6 (211 ° C), Tl2.9 / Cd17.1 (203 ° C), Tl97 / Mg3 (203 ° C), Tl80 / Sb20 (195 ° C), T152.5 / Bi47.5 (188 ° C), T196.5 / K3.5 (173 ° C), T173 / Au27 (131 ° C), Bi97 / Na3 (218 ° C), Bi76.5 /23.5Tl (198 ° C), Bi60 / Cd40 (144 ° C), Bi57 / Sn43 (139 ° C), Bi56.5 / Pb43.5 (125 ° C), Sn (232 ° C), Sn6 0.7 / Cd32.3 (177 ° C), Sn56.5 / Tl43.5 (170 ° C), In97.2 / Zn2.8 (144 ° C), In74 / Cd26 (123 ° C), Bi57 / Pb11 / Sn42 (135) ° C), Bi56 / Sn40 / Zn4 (130 ° C), Bi53.9 / Sn25.9 / Cd20.2 (103 ° C), Sn48 / In52 (117 ° C) In (157 ° C), Ag5 / Pb15 / In80 (149 ° C) ), Pb38 / Sn62 (183 ° C), Pb47 / Sn50 / Sb3 (186 ° C), Pb50 / In50 (180 ° C), Pb50 / Sn50 (183 ° C), Pb10 / Sn90 (183 ° C) Au3.5 / Pb96.5 (221 ° C), Pb5 / Sn95 (183 ° C), Ag10 / In90 (204 ° C), Pb60 / Sn40 (183 ° C), n95 / Sb5 (232 ℃), Bi67 / In33 (109 ℃), Sn35 / In45 / Bi ₂ O (98 ° C.) is an example of the low melting point metal. Such a metal layer 2 is formed on a part or the entire outer surface of the plastic wire 1a, the metal wire 1b or the metal tube wire 1c serving as the core material 1, and has a low melting point metal-coated plastic wire shown in FIG. The low melting point metal coated metal wire shown in FIG. 3 (b) and the low melting point metal coated metal tube wire shown in FIG. 4 (b) are obtained. In the joined state, it becomes a strip-shaped metal layer that is in close contact with the substrate 5 and the counter substrate 6. The greater the coverage of the core material 1 by the metal layer 2, the better the moisture-proof property is, and it is suitable to cover the core material 1 so that the coverage (calculated for the outer periphery in the longitudinal section) is 50% or more, and more preferably. Is at least 90%, most preferably at least 99%.
[0064]
When the core 1 is a metal wire, it is possible to omit the metal layer 2 and use only the metal core 1 as a strip member. It is preferable to use materials suitable for the roles of the material 1 and the metal layer 2, respectively.
[0065]
The adhesive layer 3 is made of a resin composition that functions as an adhesive for joining the substrate and the counter substrate. When a resin (thermoplastic resin, thermosetting resin) that requires heating to form a bond is used as the resin composition, the device is not heated to 200 ° C. or higher to avoid deterioration of the device due to heat. It must be resin. That is, the softening temperature and the curing (crosslinking) temperature need to be 200 ° C. or less. In addition, when the softening temperature is 30 ° C or less, tackiness is expressed in a normal atmosphere and handling becomes difficult, so the softening temperature of the resin composition is 30 ° C or more and 200 ° C or less, preferably 50 ° C or more and 180 ° C or less, More preferably, the temperature is 70 ° C or more and 150 ° C or less. Usually, a resin composition containing a thermoplastic resin as a main component is not preferable for a substrate mounted body accompanied by a temperature change because the adhesiveness at a high temperature is reduced. Considering this, it is preferable to use a thermosetting resin or a radiation-curable resin as the resin composition. However, even if it is a thermoplastic resin, a composition meeting the above conditions can be formed by complexing with another resin or a crosslinking component.
[0066]
When a thermosetting resin is used, the curing temperature is 50 ° C. or higher and 200 ° C. or lower, preferably 180 ° C. or lower, more preferably 70 ° C. or higher and 150 ° C. or lower. If the curing temperature is lower than 50 ° C., the storage stability is poor. In addition, a composition having a low curing temperature tends to have low heat resistance, and thus has insufficient adhesiveness at high temperatures. On the other hand, when the curing temperature is higher than 200 ° C., heating during curing causes thermal degradation of the display element. Curing of the resin proceeds even at a temperature lower than the curing temperature, and the greater the difference between the heating temperature and the curing temperature of the resin, the slower the curing speed. When the temperature required for curing the adhesive layer 3 is high, it is desirable to adopt a local heating method that can avoid heating the display element.
[0067]
Further, when bonding the substrate 5 and the opposing substrate 6, the resin composition needs to flow quickly by pressurization and / or heating and adhere to the substrate and the opposing substrate, so that the metal layer and the core material (core material) Is not completely covered by the metal layer). Therefore, those having MI (melt index) indicating the fluidity of the resin in the range of 0.2 to 200 are preferable. If the MI is smaller than 0.2, the fluidity is insufficient, and the moisture-proof property is reduced. On the other hand, if the MI is larger than 200, the fluidity is too high, and it is difficult to adhere to the strip member. MI is more preferably in the range of 1.0 to 150, and most preferably in the range of 2.0 to 100.
[0068]
When the resin composition of the adhesive layer 3 is a radiation-curable resin, a resin that can be cured by radiation such as α-rays, β-rays, γ-rays, neutron rays, X-rays, accelerated electron beams, and ultraviolet rays can be used. A prepolymer having an unsaturated double bond in the molecule is preferable, and a polymer obtained by a transesterification reaction with (meth) acrylic acid or a reaction with (meth) acrylic isocyanate on a polyoxyalkylene-type polymer, Polymers obtained by reacting alkylene glycolic acid with glycidyl (meth) acrylate and polymers obtained by reacting polyoxyalkylene glycol with epichlorohydrin are used. More specifically, (meth) acrylic acid adduct of polyethylene glycol or polypropylene glycol, (meth) acrylic isocyanate adduct of polyethylene glycol or polypropylene glycol, glycidyl (meth) acrylate adduct of polyethylene glycol acid or polypropylene glycol acid, polyethylene Glycol monoglycidyl ether and (meth) acrylic acid adduct of polyethylene glycol diglycidyl ether are exemplified. As a group to be introduced into the molecule, an acryloyl group and a methacryloyl group have good reactivity and good results can be obtained.
[0069]
Further, as a specific example when the resin composition of the adhesive layer 3 is a thermosetting resin, a phenol resin, a melamine resin, an epoxy resin, a xylene resin, or the like can be applied. Epoxy resins include bisphenol A epoxy resin, bisphenol F epoxy resin, tetrahydroxyphenylmethane epoxy resin, novolak epoxy resin, resorcinol epoxy resin, polyalcohol / polyglycol epoxy resin, polyolefin epoxy resin, and fat A cyclic epoxy resin, a halogenated bisphenol-type epoxy resin, or the like can be used. Other than the epoxy resin, natural rubber, polyisoprene, poly-1,2-butadiene, polyisobutene, polybutene, poly-2-heptyl-1,3-butadiene, poly-2-t-butyl-1,3-butadiene, (Di) enes such as poly-1,3-butadiene; polyethers such as polyoxyethylene, polyoxypropylene, polyvinyl ethyl ether, polyvinyl hexyl ether and polyvinyl butyl ether; polyesters such as polyvinyl acetate and polyvinyl propionate. , Polyurethane, ethylcellulose, polyvinyl chloride, polyacrylonitrile, polymethacrylonitrile, polysulfone, polysulfide, and phenoxy resin. In addition, ethylene-vinyl acetate copolymer, modified ethylene-vinyl acetate copolymer, polyethylene, ethylene-propylene copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic ester copolymer, ethylene-acrylic acid Salt copolymer, acrylate rubber, polyisobutylene, atactic polypropylene, polyvinyl butyral, acrylonitrile-butadiene copolymer, styrene-butadiene block copolymer, styrene-isoprene block copolymer, ethylene cellulose, polyamide, silicon A series rubber, synthetic rubbers such as polychloroprene, polyvinyl ether, and the like are applicable, and may be used alone or in combination of two or more. Examples of the acrylic resin include the following. Polyethyl acrylate, polybutyl acrylate, poly-2-ethylhexyl acrylate, poly-t-butyl acrylate, poly-3-ethoxypropyl acrylate, polyoxycarbonyl tetramethacrylate, polymethyl acrylate, polyisopropyl methacrylate, polydodecyl methacrylate, polytetra Decyl methacrylate, poly-n-propyl methacrylate, poly-3,3,5-trimethylcyclohexyl methacrylate, polyethyl methacrylate, poly-2-nitro-2-methylpropyl methacrylate, poly-1,1-diethylpropyl methacrylate, polymethyl Poly (meth) acrylates such as methacrylate or copolymers thereof can be used. Further, epoxy acrylate, urethane acrylate, polyether acrylate, polyester acrylate and the like can also be used. In particular, urethane acrylate and epoxy acrylate are excellent in adhesion to an adherend. Examples of epoxy acrylate include 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether, and resorcinol. (Meth) acrylic such as diglycidyl ether, diglycidyl adipate, diglycidyl phthalate, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether Acid adducts. Polymers having a hydroxyl group in the molecule, such as epoxy acrylate, are effective in improving the adhesion to the support.
[0070]
If necessary, two or more of these polymers may be copolymerized, or two or more of them may be used as a blend. These can be used by dissolving them in a general-purpose solvent or stirring and mixing with a metal dispersant or the like without a solvent.
[0071]
In the resin composition used in the present invention, if necessary, in addition to the dispersant, a thixotropic agent, an antifoaming agent, a leveling agent, a diluent, a plasticizer, an antioxidant, and a metal deactivator. Further, additives such as a coupling agent and a filler may be blended. Further, as a tackifier for improving the adhesive force, there are dicyclopentadiene resin, rosin, modified rosin, terpene resin, xylene resin, terpene-phenol resin, alkylphenol resin, cumarone-indene resin and the like. If necessary, they may be used alone or in combination of two or more. Representative examples of the tackifier include various plasticizers such as dioctyl phthalate.
[0072]
On the other hand, as a curing agent that provides an appropriate crosslinking property when using a thermosetting resin, amines such as triethylenetetramine, xylenediamine, diaminodiphenylmethane, phthalic anhydride, maleic anhydride, dodecylsuccinic anhydride, and anhydride Acid anhydrides such as pyromellitic acid and benzophenonetetracarboxylic anhydride, diaminodiphenylsulfone, tris (dimethylaminomethyl) phenol, polyamide resins, dicyandiamide, and alkyl-substituted imidazole can be used. These may be used alone or as a mixture of two or more. Also, it is not necessary to use it. The addition amount of these curing agents (crosslinking agents) can be selected in the range of 0.1 to 50 parts by weight, preferably 1 to 30 parts by weight, based on 100 parts by weight of the polymer. If this amount is less than 0.1 part by weight, curing will be insufficient, and if it exceeds 50 parts by weight, excessive crosslinking will occur, which may adversely affect the adhesiveness. In the present invention, "parts by weight" is a notation used when the weight of a compounding agent such as a solvent or an additive is indicated as a number of parts with respect to 100 parts of the resin.
[0073]
Solvents used for molding these resin compositions include ketone solvents such as acetone, diethyl ketone, methyl amyl ketone and cyclohexanone, aromatic solvents such as toluene and xylene, methyl cellosolve, methyl cellosolve acetate. , Ethylcellosolve solvents such as ethyl cellosolve acetate, ethyl lactate, butyl acetate, isoamyl acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, methyl pyruvate, ester solvents such as ethyl pyruvate, propyl pyruvate, methanol Alcoholic solvents such as ethanol, propanol, propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol propyl ether, etc., alone or as needed. More than one kind can be used in combination. These solvents may or may not be used.
[0074]
When forming the adhesive layer 3 (the layer of the resin composition) on the substrate 5 or the counter substrate 6, while appropriately adjusting the viscosity of the resin composition with the organic solvent as described above, a known dispenser method or screen printing method is used. By using such a technique, the adhesive layer 3 having a desired thickness can be formed. The thickness (dimension in the height direction perpendicular to the substrate) is preferably 20% or more and 400% or less of the diameter of the core material 1, more preferably 50% or more and 200% or less of the diameter of the core material 1. Preferably, the diameter is 70% or more and 150% or less of the diameter of the core material 1. If the thickness of the adhesive layer 3 is too thin as compared with the core material 1, the adhesion between the substrate 5 and the counter substrate 6 tends to be insufficient, which is not preferable. On the other hand, if the thickness of the adhesive layer 3 is too large, the resin will enter between the contact interfaces between the metal layer 2 and the substrate 5 or the counter substrate 6 and the moisture-proof property of the mounted body will be reduced, which is not preferable.
[0075]
(Method of manufacturing strip members)
The strip member is manufactured, for example, as follows. First, as shown in FIGS. 2 (a), 3 (a), and 4 (a), a plastic wire 1a, a metal wire 1b, and a metal tube wire 1c to be the deformable core material 1 are prepared. Then, as shown in FIGS. 2 (b), 3 (b), and 4 (b), a metal layer 2 is provided outside the core material 1. As a method of forming the metal layer 2 on the core material 1, any known method may be used, but it can be effectively formed by using a plating method. In order to uniformly form a metal layer having a thickness of 5 μm or more, an electrolytic plating method is suitable. For example, when the core material 1 is a plastic wire 1a, the core material made of the plastic wire 1a is subjected to a seeder treatment, and then subjected to electroless copper or electroless nickel plating to form a conductive layer. The coating can be performed by plating, and the metal layer 2 is formed. When the core material 1 is the metal wire 1b, the metal wire 1b can be directly plated with electroless copper or electroless nickel, and then the coating of the metal layer 2 can be formed by electrolytic plating. Even when the core material 1 is the metal tube wire 1c, the metal tube wire 1c is directly subjected to electroless copper or electroless nickel plating, and then the metal layer 2 can be coated by electrolytic plating. Alternatively, it is also possible to use a fusion method in which the molten low melting point metal is directly fused on the plastic wire 1a, the metal wire 1b, and the metal tube wire 1c. At this time, if the outer surface of the plastic wire 1a, the metal wire 1b, or the metal tube wire 1c is subjected to a surface treatment such as a corona treatment, a plasma treatment, and an easy-adhesion coat (primer) treatment, the adhesion to the metal layer 2 is improved. In addition, peeling of the metal layer 2 from the core material 1 due to stress strain caused by a temperature change or the like is suppressed. The plasma treatment and the corona discharge treatment improve the adhesion with the metal layer 2 by providing a chemically active polar group such as a hydroxyl group or a carboxylic acid group to the surface of the core material 1. In the primer treatment, the affinity with the metal layer 2 is increased by applying a primer having the same polar group, and the adhesion is improved. As the primer, for example, a resin composition for forming the adhesive layer 4 or an analog thereof can be used. Further, it is preferable to treat the surface of the metal layer 2 with a silane coupling agent or the like, because the affinity between the metal layer 2 and the adhesive layer 4 is improved.
[0076]
(Application and deformation of sealing material)
The above-described sealing material can be applied and modified, and the core material 1 of the strip member and the metal layer 2 can be used as a separate body and combined with the core material 1 and the metal strip material. In this case, one or more metal strips can be combined with one core 1. The sealing structure in this case will be described later as a usage mode of the sealing material in the following method for manufacturing a package.
[0077]
The core material 1 as a spacer does not need to have a constant wire diameter, and may have a narrow portion or a bead shape. However, in order to make the metal layer adhere to the substrate, the height above the substrate is required. Must be constant. In other words, the line width may not be constant in the lateral direction (the direction parallel to the substrate) of the core material 1 arranged on the substrate.
[0078]
(Method of manufacturing the mounting body)
The substrate 5 and the opposing substrate 6 are made of an electrically insulating substance that gives high transmittance to light emitted from the light emitting layer (hereinafter, referred to as a “light transmitting substrate”) or an electrically insulating non-light transmitting material. A conductive substrate is used. In the top emission method in which the opposing substrate 6 side is a light extraction surface as shown in FIGS. 1 (a) and 1 (b) and FIGS. 7 (b), (c), (d) and (e), the opposing substrate 6 A light-transmitting substrate may be used, and the substrate 5 may be a light-transmitting substrate or a non-light-transmitting substrate. In the case of a bottom emission method in which light is extracted from the substrate 5 side, a transparent substrate may be used for the substrate 5 and either a transparent substrate or a non-transparent substrate may be used for the counter substrate 6. Regardless of which of these is used, the permeable substrate and the non-permeable substrate must have pressure resistance and heat resistance against pressure and heat applied to the surface when sealing with a sealing material. There is.
[0079]
As the organic EL element 12, a known organic EL element may be used, or another functional element may be used. Specific examples of the layer structure of the organic EL element include, for example, those laminated as shown in the following (1) to (4) from the substrate 5 side.
[0080]
(1) Lower electrode 7, light emitting layer 9, upper electrode (transparent electrode) 11
(2) Lower electrode 7, electron transport layer 8, light emitting layer 9, upper electrode (transparent electrode) 11
(3) Lower electrode 7, light emitting layer 9, hole transport layer 10, upper electrode (transparent electrode) 11
(4) Lower electrode 7, electron transport layer 8, light emitting layer 9, hole transport layer 10, upper electrode (transparent electrode) 11
Note that the above configuration is used when light is extracted from the upper electrode 11 side as shown in FIGS. 1 (a), (b), 7 (b), (c), (d), (e). This shows a top emission method. In the case of a bottom emission method in which light is extracted from the substrate 5 side, the order of lamination on the substrate 5 is reversed, and in that case, a transparent electrode is used as the lower electrode 7.
[0081]
The manufacture of the mounted body can be performed, for example, as follows.
[0082]
(I) First, as shown in FIG. 7 (a), a lower electrode 7 functioning as a conductor layer is provided on a substrate 5 (FIG. 7 (a)), and an organic layer is formed thereon as shown in FIG. 7 (b). The EL element 12 is disposed, and an insulating film 15 is provided in a region where the organic EL element 12 is not disposed. This insulating film 15 is made of silicon nitride (SiN), silicon oxide (SiO ₂ ) Or SiNO is formed by a method such as vapor deposition or sputtering.
[0083]
The insulating film 15 is provided for preventing corrosion of the electrode and for preventing short-circuit between the conductive strip member and the lower electrode. As shown in FIGS. It is provided on the lower electrode 7 at a position below the member 4. The thickness of the insulating film 15 can be formed in a range of 10 nm to 10 μm, but is most preferably 100 nm to 1 μm.
[0084]
(II) Next, the core material 1 (the plastic wire 1a, the metal wire 1b, and the metal tube 1c shown in FIGS. 2A, 3A, and 4A) and the metal layer 2 or the core material A strip member 13 obtained by covering 1 with a metal layer 2 and an adhesive layer 3 are prepared.
[0085]
(III) For example, the core material 1 and the metal layer 2 are arranged on the substrate 5 or the counter substrate 6 so as to surround the organic EL element 12 with the sealing materials 4a to 4d as shown in FIGS. I do. When the strip member 13 in which the metal layer 2 is coated on the core member 1 is used, as shown in FIG. 7C, the strip member 13 is placed on the substrate 5 on which the insulating film 15 is laid or on the opposing substrate 6 at a corresponding position. The strip member 13 is arranged. When the core material 1 and the metal layer 2 are separate bodies, for example, as shown in FIG. 8A, the pair of metal layers 2 are arranged in parallel on the substrate 5 on which the insulating film 15 is laid. And surrounds the organic EL element 12. Alternatively, the metal layer 2 may be arranged at a corresponding position on the counter substrate 6. After that, as shown in FIG. 8B, the core material 1 is arranged on the metal layer 2 in parallel.
[0086]
(IV) Further, as shown in FIGS. 7 (d) and 8 (c), an adhesive layer 3 made of a resin composition is provided in parallel with the core material 1 and the metal layer 2 to form a sealing structure. Create The adhesive layer 3 may be formed by a known dispenser, screen printing, spraying, or a resin molded product may be arranged. When applying the resin by the spray method, a spray system including a spray gun and a resin pressurized tank can be used. As the spray gun, a gravity type, a suction type, a pressure feeding type, or the like can be used, and a nozzle diameter of 1.0 to 8.0 mmφ is appropriate. The amount of air used at that time depends on the viscosity of the resin, but can be used at 50 to 600 l / min. In a so-called airless system that does not use air, a cold spray, a hot spray, a two-liquid spray, an electrostatic airless spray, a hydro air spray, or the like can be used.
[0087]
The sealing structure may be arranged in any manner as long as it is arranged so that the sealing of the organic EL element 12 is sufficiently achieved. For example, as shown in FIGS. 6B and 6E, four sealing members 4a, 4b, 4c, and 4d can be arranged along four sides of the substrate 5, respectively. Alternatively, as shown in FIGS. 6C and 6D, one sealing material 4a is arranged around each side of the substrate 5, and both ends of the sealing material 4a are arranged as shown in FIG. As shown in the drawing, the crossing may be performed at one point, or the both ends of the sealing material 4a may be closely attached as shown in FIG. Further, although not shown, the sealing member may be surrounded by double, triple or more layers to form a sealing structure.
[0088]
FIG. 11 shows an application example of the arrangement of the sealing structure. In FIGS. 11A and 11B, the adhesive layer 3 is disposed only on one side of the core 1 covered with the metal layer 2. FIGS. 11C and 11D show examples in which the core 1 and the metal layer 2 are separate bodies, and the core 1, the low-melting metal layer 2, and the adhesive layer 3 are arranged in parallel. In FIG. 11E, the core material 1 is overlaid on the metal layer 2, and the adhesive layers 3 are arranged on both sides (or one side). FIG. 11F shows an example in which a plurality of cores 1, a metal layer 2, and an adhesive layer 3 are arranged. From the viewpoint of making the core 1 function as an elastic layer for bringing the metal layer into close contact with the substrate and the counter substrate, it is desirable that at least one core 1 and the low melting point metal layer 2 are adjacent to each other. In the sealing structure shown in FIG. 11G, the adhesive layer 3 is disposed below the core 1 covered with the metal layer 2. When the resin of the adhesive layer 3 is in a softened state, the lower resin is moved by pressing the core material. Thus, the resin may be below the core material 1. Since it may be either before or after the arrangement on the upper side, the application amount can be additionally adjusted as needed.
[0089]
(V) Further, as shown in FIG. 7E, the counter substrate 6 is arranged.
[0090]
(VI) Thereafter, the substrates are joined by the adhesive layer 3 while pressing the counter substrate 6 against the substrate 5 in a direction (D5 or D6 shown in FIG. 9). At that time, the core material 1 and the low-melting metal layer 2 constituting the sealing structure are deformed as shown in FIG. When the adhesive layer 3 is cured from a fluid state, a bond is formed. For this reason, in the case of a thermosetting resin or in the case of curing with a crosslinking agent, heating is applied, and in the case of a radiation-curable resin, irradiation of radiation is applied. The pressurization pressure is preferably from 10 kPa to 50 MPa, preferably from 100 kPa to 20 MPa, and more preferably from 500 kPa to 10 MPa.
[0091]
The curing of the adhesive layer by heating is performed at a temperature near the curing temperature of the resin composition, and when the heating temperature is lower than the curing temperature, the heating time is lengthened. Not only the heat curing of the resin composition but also the heat treatment is performed so that the display element is not exposed to a high temperature of about 150 ° C. or more for a long time. The temperature to which the element is exposed is preferably 120 ° C. or less, more preferably 100 ° C. or less.
[0092]
The preferred ranges of the above-mentioned heating and pressurizing are the same in the following embodiments.
[0093]
When the radiation curing method is used, active energy rays such as α-rays, β-rays, γ-rays, neutron rays, X-rays, accelerated electron beams, and ultraviolet rays can be used. In the case of an electron beam, the irradiation dose is usually used in the range of 0.1 to 100 Mrad, but preferably 1 to 20 Mrad. 0.01 to 10 J / cm for UV ² 0.1 to 6 J / cm ² Is particularly preferred.
[0094]
The adhesive layer 3 constituting the sealing structure is plastically deformed by pressure (and heating) and quickly flows in the directions of D7, D8, D9, and D10. The metal layer 2 contacts the insulating film 15 and the counter substrate 6. At this time, the core material 1 is elastically deformed, and when the adhesive layer is hardened in this state, forces in the directions D1 and D2 tend to return the core material 1 to the original shape, which generates a spring effect, and the metal layer 1 2 is pressed against and closely attached to the substrate and the opposing substrate. Further, a spring effect is also generated by the curing shrinkage of the adhesive layer.
[0095]
When a part of the sealing material 4 is crossed as shown in FIGS. 6B and 6C, as shown in FIG. It will be raised compared to. In this case, as shown in FIG. 10 (b), another portion is added to the crossed portion so that the sealing structure has the same height h between the non-crossed portion and the crossed portion. Apply higher pressure than.
[0096]
[Second embodiment]
Hereinafter, other embodiments of a sealing material and a mounted body in which a substrate is bonded using the sealing material will be described. In this embodiment, a sealing member is provided using a sealing material in which the above-mentioned strip member and the adhesive layer 3 are integrated.
[0097]
(Mounted body)
FIG. 12 shows an organic EL element mounted body in which substrates are joined by using a strip member in which the core material 1, the metal layer 2, and the adhesive layer 3 are integrated as sealing materials 4a 'to 4d'. () Shows a mounted body before formation of a substrate bond, (b) shows a mounted body after formation of a substrate bond, and (c) shows a cross-sectional view of the mounted body parallel to the substrate. This mounting body surrounds the substrate 5, the opposing substrate 6 facing the substrate 5, the organic EL element 12 interposed between the substrate 5 and the opposing substrate 6, and the organic EL element 12. And a sealing structure composed of four sealing materials disposed on the peripheral portion of the substrate 5.
[0098]
In this embodiment, each of the sealing materials 4 a ′ to 4 d ′ used for the sealing structure includes a core 1, a metal layer 2 covering the outer periphery of the core 1, and an outer periphery of the metal layer 2. This is a strip member made of an adhesive layer 3 'to be covered, and is appropriately arranged on a substrate so as to surround the organic EL element 12 as shown in FIG. The metal layer 2 is formed of a low-melting-point metal, and the core material 1 is formed of a material that is elastically deformable and has a higher elastic limit than the metal layer 2. The bonding layer 3 'has a function of bonding the substrate 5 and the opposing substrate 6, and as shown in FIGS. 12A and 12B, the opposing substrate 6 is The substrate 5 and the opposing substrate 6 are joined together by the adhesive layer 3 'while pressing. As a result, as shown in FIG. 12B, the obtained package is essentially the same as the package of FIG. 1B in the first embodiment.
[0099]
(Sealing material)
Each of the sealing materials 4a 'to 4d' used for manufacturing the above-mentioned mounting body is composed of a core material 1, a metal layer 2, and an adhesive layer 3 '. Is easy. As an example of a usable sealing material, specifically, as shown in FIGS. 13A to 13C, a material using a plastic wire 1 a, a metal wire 1 b, or a metal tube wire 1 c as a core material 1 is used. No.
[0100]
Since the core material 1 and the metal layer 2 of the sealing material are the same as in the case of the above-described first embodiment, the description is omitted. In FIG. 13, the core material 1 is described as having a circular cross section, but is not limited to a circular shape. FIGS. 14B, 14C, 14D, and 14F show examples in which the cross-sectional shapes of the core material and the sealing material are polygonal.
[0101]
The adhesive layer 3 'of the sealing material can be made of the same resin composition as in the case of the first embodiment. The thickness is preferably 1 μm or more and 10 mm or less. If it is less than 1 μm, it is difficult to control the thickness, and the adhesive strength is greatly reduced. On the other hand, if the thickness is 10 mm or more, a smooth adhesive surface cannot be obtained, so that sufficient adhesiveness cannot be obtained. More preferably, the thickness of the adhesive layer is 3 μm or more and 5 mm or less, and most preferably 5 μm or more and 1 mm or less.
[0102]
However, depending on the fluidity of the resin composition, the following structural deformation may be effective.
[0103]
Since the adhesive layer 3 ′ covers the metal layer 2, if the resin composition does not flow well during the joining of the substrates and remains between the metal layer 2 and the substrate 5 and the opposing substrate 6, the substrate 5 and the opposing substrate 6 Is not completely shielded by the metal layer 2, so that moisture infiltrates into the inside of the package via the residual resin composition. In such a case, when the bonding layer 3 ′ is bonded to the substrate 5 and the counter substrate 6, it is necessary that the metal layer 2 is exposed and can be in contact with the substrate 5 and the counter substrate 6. As an example of an effective sealing material for avoiding this problem, a material in which a portion of the adhesive layer 3 ′ facing the substrate 5 and the counter substrate 6 is thinned or not provided is used. In (f), the top and bottom of the metal layer 2 are completely exposed from the adhesive layer 3 '. In such a case, as shown in FIGS. 14 (e) and (f), the adhesive layer 3 ′ and the substrate 5 and the counter substrate 6 It is preferable to have a gap D3 between them. 14 (e) and (f), when pressure is applied in the direction of D5 and / or D6 as shown in FIG. 17 after the sealing material is interposed between the substrate 5 and the counter substrate 6. , The metal layer 2 comes into direct contact with the substrate 5 and the counter substrate 6, and the adhesive layer 3 'does not remain between the metal layer 2 and the substrate 5 and the counter substrate 6. Furthermore, due to the presence of the gap D3, the core material 1 is easily elastically deformed so as to be compressed in the vertical direction and expanded in the horizontal direction. The gap D3 needs to have such a size that the adhesive layer 3 'easily comes into contact with the substrate 5 and the opposing substrate 6 to exert an adhesive function when the core material 1 is elastically deformed.
[0104]
(Method of manufacturing sealing material)
As the sealing material, a metal layer 2 is provided outside the core material 1 and an adhesive layer 3 '(a layer of a resin composition) is formed outside the core material 1 in accordance with the method of manufacturing the strip member 13 in the first embodiment described above. . At this time, the viscosity of the composition is appropriately adjusted with an organic solvent as described in the first embodiment, and an adhesive layer having a desired thickness is formed using a surface coating technique such as a known dipping method. Can be done. For example, the strip member in which the core material 1 is covered with the metal layer 2 is covered by being immersed in a molten resin to be a material of the adhesive layer 3 ′ or by wiping with a spray. When the resin is coated by a spray method, a spray system including a spray gun and a resin pressurized tank can be used. As the spray gun, a gravity type, a suction type, a pressure feeding type, or the like can be used, and a nozzle diameter of 1.0 to 8.0 mmφ is appropriate. The amount of air used at that time depends on the viscosity of the resin, but can be used at 50 to 600 l / min. In a so-called airless system that does not use air, a cold spray, a hot spray, a two-liquid spray, an electrostatic airless spray, a hydro air spray, or the like can be used.
[0105]
In order to form a sealing material as shown in FIGS. 14E and 14F, the entire outside of the metal layer 2 is covered with the adhesive layer 3 'as described above, and then one of the adhesive layers 3' is formed. You only have to cut off the part.
[0106]
(Method of manufacturing the mounting body)
The manufacturing method of the mounted body is as follows.
[0107]
(I) First, similarly to (I) of the first embodiment, the lower electrode 7 is provided on the substrate 5 (FIG. 15A), the organic EL element 12 is arranged, and the organic EL element 12 is arranged. An insulating film 15 is provided in a region where there is not (FIG. 15B).
[0108]
(II) Next, a sealing material composed of the core material 1 (plastic wire 1a, metal wire 1b or metal tube 1c), metal layer 2 and adhesive layer 3 'is prepared.
[0109]
(III) The sealing materials 4a 'to 4d' are arranged on the substrate 5 or the counter substrate 6 so as to surround the organic EL element 12 (FIG. 15C). The sealing material may be arranged in any manner as long as the sealing of the organic EL element 12 is sufficiently achieved. For example, similarly to the first embodiment, FIG. To (e) can be adopted, and the arrangement shown in FIG. 15 is the same as that shown in FIG. 16 (b).
[0110]
(IV) Further, as shown in FIG. 15D, the counter substrate 6 is arranged.
[0111]
(V) Thereafter, the substrates are joined by the adhesive layer 3 'while pressing the opposing substrate 6 against the substrate 5 (D5 or D6 shown in FIG. 17). As shown in FIG. 17, the adhesive layer 3 'is plastically deformed by pressure (and heating) and quickly flows in the directions of D7, D8, D9, and D10. The metal layer 2 is exposed from the adhesive layer 3 ′ and contacts the insulating film 15 and the counter substrate 6. At this time, the core material 1 is elastically deformed, and the bonding is formed by the adhesive layer 3 ′ being cured from the fluid state. For this reason, in the case of a thermosetting resin or a curing by a crosslinking agent, heating and radiation curing are performed. In the case of resin, irradiation of radiation is applied. When the adhesive layer 3 'is cured, forces in the directions D1 and D2, which cause the core material 1 to return to the original shape, act to generate a spring effect, and press the metal layer 2 against the substrate and the opposing substrate to bring them into close contact. Further, a spring effect is also generated by the curing shrinkage of the adhesive layer.
[0112]
When a part of the sealing material is crossed as shown in FIGS. 16B and 16C, the sealing material is raised as shown in FIG. As shown in FIG. 18 (b), a higher pressure is applied to the crossed portion than to the other portions so that the sealing structure has the same height h between the crossed portion and the crossed portion.
[0113]
[Third Embodiment]
In this embodiment, a sealing material in which a plurality of the strip members of the first embodiment are integrated with an adhesive layer 3 is used.
[0114]
(Mounted body)
FIG. 19 shows an organic EL element mounted body in which substrates are joined using at least two or more core materials 1 covered with a metal layer 2 and sealing members 4a "to 4d" integrated with an adhesive layer 3 as sealing members 4a "to 4d". (A) shows a mounted body before formation of a substrate bond, (b) shows a mounted body after formation of a substrate bond, and (c) shows a cross-sectional view of the mounted body parallel to the substrate. This mounting body surrounds the substrate 5, the opposing substrate 6 facing the substrate 5, the organic EL element 12 interposed between the substrate 5 and the opposing substrate 6, and the organic EL element 12. And a sealing structure composed of four sealing materials disposed on the peripheral portion of the substrate 5.
[0115]
In this embodiment, each of the sealing materials 4 a ″ to 4 d ″ used for the sealing structure includes a plurality of cores 1, a metal layer 2 covering the outer periphery of each core 1, and It is a strip-shaped member composed of an adhesive layer 3 ″ that covers the outer periphery and integrates a plurality of core materials 1, and is appropriately arranged on a substrate so as to surround the organic EL element 12 as shown in FIG. The metal layer 2 is formed of a low melting point metal, and the core 1 is formed of an elastically deformable material having a higher elastic limit than the metal layer 2. The adhesive layer 3 ″ is formed of a substrate 5 19 (a) and 19 (b), the adhesive layer 3 ″ is pressed while the opposing substrate 6 is pressed against the substrate 5 against the sealing material, as shown in FIGS. The substrate 5 and the opposing substrate 6 are adhered to each other as a result, and as a result, as shown in FIG. Definitive becomes 12 those strengthen the mounting body sealing of the (b).
[0116]
(Sealing material)
The sealing material 4a "to 4d" of the sealing structure used for manufacturing the above-mentioned mounting body is composed of at least two or more core materials 1, the metal layer 2, and the adhesive layer 3 ". As an example, specifically, as shown in FIGS.20 (a) to (c), there is a case where a plastic wire 1a, a metal wire 1b or a metal tube wire 1c is used as the core material 1. FIGS. Uses two core materials 1 covered with a metal layer 2, but may use three or more core materials as shown in FIG. 21 (e), in which case the core materials 1 are parallel to each other. And integrated.
[0117]
Since the core material 1 and the metal layer 2 of the sealing material are the same as in the case of the above-described first embodiment, the description is omitted. 20 and 21 (a), the core material 1 is described as having a circular cross section, but is not limited to a circular shape. 21B, 21C, and 21D show examples in which the cross-sectional shapes of the core material and the sealing material are polygonal.
[0118]
The adhesive layer 3 ″ of the sealing material can be made of the same resin composition as in the first and second embodiments. The thickness is preferably 1 μm or more and 10 mm or less. If it is less than 1 μm. It is difficult to control the thickness, the adhesive strength is largely reduced, and if the thickness is more than 10 mm, a smooth adhesive surface cannot be obtained, so that sufficient adhesiveness cannot be obtained. The thickness is 3 μm or more and 5 mm or less, most preferably 5 μm or more and 1 mm or less.
[0119]
As described in the second embodiment, depending on the fluidity of the resin composition, structural deformation such that the portion of the adhesive layer 3 ″ facing the substrate 5 and the opposing substrate 6 is thinned or not provided is caused. 21 (f), (g) and (h), the top and bottom of the metal layer 2 are completely exposed from the adhesive layer 3 ″. In such a case, as shown in FIGS. 21 (g) and 21 (h), the adhesive layer 3 ″ and the substrate 5 and the opposing substrate 6 are placed in a state where the sealing material is disposed between and in contact with the substrate 5 and the opposing substrate 6. 21 (g), (g), and (h), the sealing material is interposed between the substrate 5 and the counter substrate 6 in FIG. When pressure is applied in the direction of D5 and / or D6 as shown in FIG. 5, the metal layer 2 comes into direct contact with the substrate 5 and the counter substrate 6, and the adhesive layer 3 ″ is formed between the metal layer 2 and the substrate 5 and the counter substrate 6. Does not remain. Further, due to the gap D3, the core 1 is easily elastically deformed so as to be compressed in the vertical direction and expanded in the horizontal direction. The gap D3 needs to have such a size that when the core material 1 is elastically deformed, the adhesive layer 3 ″ easily comes into contact with the substrate 5 and the opposing substrate 6 to exert an adhesive function.
[0120]
(Method of manufacturing sealing material)
As the sealing material, a metal layer 2 is provided outside the core material 1 and an adhesive layer 3 ′ (a layer of a resin composition) is formed outside the core material 1 in accordance with the manufacturing method of the sealing material in the second embodiment described above. Then, a plurality of sealing materials are manufactured. By fusing these together and bonding the adhesive layer 3 ′, a sealing material in which the plurality of core materials 1 and the metal layers 2 are integrated by the adhesive layer 3 ″ is obtained. The resin composition has fluidity. When the fluidity has been lost, fusion can be performed by heating.
[0121]
In order to form a sealing material as shown in FIGS. 21 (f), (g) and (h), the entire outside of the metal layer 2 is covered with the adhesive layer 3 'as described above, and then the adhesive layer is formed. What is necessary is just to remove a part of 3 '.
[0122]
(Method of manufacturing the mounting body)
As described below, the mounting body can be manufactured according to a manufacturing method similar to that of the second embodiment instead of the sealing material shown in FIG. 20 or 21.
[0123]
(I) First, similarly to (I) of the first embodiment, the lower electrode 7 is provided on the substrate 5 (FIG. 22A), the organic EL element 12 is arranged, and the organic EL element 12 is arranged. The insulating film 15 is provided in a region where there is not (FIG. 22B).
[0124]
(II) Next, a sealing material composed of the core material 1 (plastic wire 1a, metal wire 1b or metal tube 1c), metal layer 2 and adhesive layer 3 ″ is prepared.
[0125]
(III) The sealing materials 4a ″ to 4d ″ are arranged on the substrate 5 or the counter substrate 6 so as to surround the organic EL element 12 (FIG. 22C). The sealing material may be arranged in any manner as long as the sealing of the organic EL element 12 is sufficiently achieved. For example, similarly to the first embodiment, FIG. To (e) can be adopted, and the arrangement shown in FIG. 22 is the same as that shown in FIG.
[0126]
(IV) Further, as shown in FIG. 22D, the counter substrate 6 is arranged.
[0127]
(V) Thereafter, the substrates are joined by the adhesive layer 3 ″ while pressing the opposing substrate 6 against the substrate 5 (D5 or D6 shown in FIG. 24). As shown in (1), it is plastically deformed by pressurization (and heating) and quickly flows in the directions of D7, D8, D9 and D10. The metal layer 2 is exposed from the adhesive layer 3 ″ and abuts on the insulating film 15 and the counter substrate 6. At this time, the core material 1 is elastically deformed, and the adhesive layer 3 ″ is cured from a fluid state to form a bond. For this purpose, heating is applied in the case of a thermosetting resin or curing with a crosslinking agent, and irradiation of radiation is applied in the case of a radiation-curable resin. When the adhesive layer 3 ″ cures, forces in the directions D1 and D2, which cause the core material 1 to return to the original shape, act to generate a spring effect, thereby pressing the metal layer 2 against the substrate and the opposing substrate to bring them into close contact. The spring effect also occurs due to the curing shrinkage of the adhesive layer.
[0128]
When a part of the sealing material is crossed as shown in FIGS. 23 (b) and 23 (c), the sealing material rises as shown in FIG. As shown in FIG. 25 (b), a higher pressure is applied to the crossed portion than to the other portions so that the sealing structure has the same height h between the crossed portion and the crossed portion.
[0129]
[Characteristics of mounting body]
As described above, the mounting body of the present invention obtained by arranging the sealing material on the substrate 5 so as to surround the organic EL element 12 and joining while pressing the substrate has excellent moisture-proof properties of the organic EL element. .
[0130]
In the use of the mounted body, if the moisture resistance is low, a dark spot (non-light emitting surface) is generated on the display element. When the dark spot area ratio is defined as the following equation, the practicality of the mounting body is as follows: the dark spot area ratio to the light emitting area of the device after an acceleration test at 60 ° C., 90% relative humidity and 1000 hours is 10% or less. And more preferably 2% or less.
[0131]

The mounting body provided by the present invention suppresses the generation and growth of dark spots and satisfies the condition of the dark spot area ratio, which is an outstanding feature not seen in the past.
[0132]
The reason why the initial moisture-proof property and the initial adhesive strength, the moisture-proof property after heating and humidification, and the retention of the adhesive property are exhibited in the package of the present invention is not necessarily clear, but is considered as follows.
[0133]
That is, when the core material 1 covered with the metal layer 2 is pressed between the substrate 5 and the counter substrate 6 so that the metal flows or melts when the metal layer 2 comes into close contact with the substrate 5 and the counter substrate 6. By applying a large amount of energy, the flowed and molten metal is deformed along the surfaces of the substrate and the opposing substrate, so that a more intimate contact with no gap between the metal layer 2 and the substrate 5 or the opposing substrate 6 is formed. And excellent moisture resistance is exhibited. In this regard, it is important that the metal layer 2 be interposed between the substrate 5 and the opposing substrate 6 which have elasticity capable of exhibiting a spring effect of elastically deforming at the time of joining the substrates and returning to the normal state. The structure in which the core material 1 is covered or surrounded by the metal layer 2 is effective. It is extremely effective to form the metal layer 2 with a low-melting metal that easily flows. The spring effect due to the elasticity of the core 1 is also effective in reducing the impact resistance of the mounted body.
[0134]
Further, when the bonding by the adhesive layer 3 is formed in a state where the metal layer 2 and the core material 1 are pressed against the substrate 5 and the counter substrate 6, the metal shrinks by curing of the adhesive layer 3 and the springback of the elastically deformed core material 1 causes the metal. Both ends of the layer 2 are pressed by the substrate 5 and the counter substrate 6, and the close contact between the metal layer 2 and the substrate 5 and the counter substrate 6 is maintained. The adhesive layer 3 maintains the bonding while maintaining the stress caused by the spring action of the core 1, the thermal stress, and the stress generated at the time of humidification, and maintains the moisture-proof property of the sealing material. As a result, stable moistureproofness and adhesiveness are exhibited even after a long-term heating and humidifying test. In this regard, since a resin composition containing a polymer as a main component is excellent in stress resistance, it is meaningful to use a resin composition having stress resistance as an adhesive for forming a bond having adaptability to environmental changes. is there. Further, the fluidity of the adhesive layer 3 is important for ensuring the adhesion between the substrate 5 and the protective substrate 6, and particularly, when integrated with the sealing material, the fluidity between the metal layer 2 and the substrate 5 and the opposing substrate 6. It is important to quickly bring the metal layer 2 into close contact with the substrate 5 and the counter substrate 6 without remaining between them. In this regard, the sealing material disposed on the substrate is heated to the softening temperature of the resin while being lightly pressed against the substrate using a pressure-treated plate that has been subjected to a peeling process, so that the metal layer is exposed. It is effective to face the opposing substrate and apply pressure and resin curing treatment required for elastic deformation of the core material.
[0135]
In the case where it is not necessary to use the top emission method, the reliability and durability of the EL element mounted body can be further improved by incorporating a desiccant at the time of manufacturing the mounted body.
[0136]
In addition, the package obtained according to the present invention has a very high barrier property not only for moisture and oxygen but also for other substances, and can block the entry and exit of various components. In addition to a display element such as an inorganic EL element, a solar cell element, and the like, the present invention can be applied to a package of various functional elements formed using a semiconductor or a substance having low chemical stability.
[0137]
[Sheet-shaped sealing material]
When the functional element sealed between the substrates is very thin, it is more beneficial to use a thinner member than that described in the above embodiment. Further, a thinner strip member is advantageous for downsizing the sealing body, and in practical use of a display device, a large display area can be ensured. High usefulness. In the case of such a thin strip member, in order to facilitate the operation of arranging the strip member 13 and the adhesive layer on the substrate, for example, as shown in FIGS. Is effective in a sheet-like sealing material integrated on the peelable substrate 6.
[0138]
Hereinafter, embodiments of the sheet-shaped sealing material will be described.
[0139]
In a particularly useful sheet-like sealing material, the core material 1 is thinner than that of the above-described embodiment. Specifically, the core material 1 preferably has a wire diameter (width) of 0.01 mm or more and less than 7 mm. It is used, more preferably 0.03 mm or more and 5 mm or less, and most preferably 0.07 mm or more and 1 mm or less. When the wire diameter is smaller than 0.01 mm, the elastic pressure and the pressing area applied to the metal layer 2 and the substrate become small, so that the adhesion to the substrate and the shielding property are reduced. Those having a wire diameter of more than 7 mm have a low need in the manufacture of a small-sized mounting body, so that the necessity as a sheet-shaped sealing material is not so high.
[0140]
The core material 1 may be formed in a strip shape with a material that can be elastically deformed by a pressing force, and is not particularly limited as long as it is elastically deformed at a pressure of 0.01 GPa or more. . Specifically, a plastic wire having a compression modulus at room temperature of 0.3 GPa or more and 20 GPa or less can be suitably used, and a compression modulus of 0.5 GPa or more and 10 GPa or less is more preferable, and 1.0 GPa or more and 7.0 GPa or less. Is most preferred. If the compression modulus is less than 0.3 GPa, the amount of deformation at the time of pressurization is too large, and the moisture resistance at the time of humidification becomes insufficient. On the other hand, if the compression modulus is larger than 20 GPa, the amount of deformation during pressurization is small, so that the stress for pressing the low melting point metal layer against the substrate and the counter substrate after bonding is small, and the moisture resistance is reduced.
[0141]
Specific examples of the material of the core material 1 include, for example, polyethylene, 6-nylon, polyvinyl alcohol, aramid monofilament, polyethylene terephthalate, polystyrene, polypropylene, PAN, polyvinyl chloride, polyphenylene sulfide, and the like. Alternatively, a composite or the like containing a plurality of these materials can be used. Further, the core material 1 may be made of metal, and examples thereof include copper, gold, platinum, titanium and the like and alloys containing these.
[0142]
When the strip member 13 is thin, higher precision is required for the formation of the metal layer 2. Therefore, if the affinity of the core material 1 for the metal layer 2 is low, the precision of the layer formation decreases, and the core material 1 and the metal layer 2 also decreases. If the adhesion is low, the metal layer 2 is easily released or peeled off, and the slight release or peeling greatly affects the shielding property of the sealing material. Therefore, when the core material is made of plastic, the surface of the core material 1 is subjected to any of plasma treatment, corona discharge treatment, or primer treatment (easy adhesion treatment) before the metal layer 2 is provided. It is preferable to increase the adhesion between the metal layer 1 and the metal layer 2.
[0143]
As a primer when the surface of the core material 1 is subjected to a primer treatment, a thermosetting resin can be suitably used, and for example, a phenol resin, a melamine resin, an epoxy resin, a xylene resin, or the like can be used. Epoxy resins include bisphenol A epoxy resin, bisphenol F epoxy resin, tetrahydroxyphenylmethane epoxy resin, novolak epoxy resin, resorcinol epoxy resin, polyalcohol / polyglycol epoxy resin, polyolefin epoxy resin, and fat Examples thereof include a cyclic epoxy resin and a halogenated bisphenol type epoxy resin. Further, epoxy acrylate, urethane acrylate, polyether acrylate, polyester acrylate and the like can also be used. In particular, urethane acrylate and epoxy acrylate have excellent adhesion to the core material. Examples of epoxy acrylate include 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether, and resorcinol diacrylate. (Meth) acrylic acid such as glycidyl ether, diglycidyl adipate, diglycidyl phthalate, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, and sorbitol tetraglycidyl ether Adducts. A polymer having a hydroxyl group in the molecule, such as epoxy acrylate, is effective for improving the adhesion to the core material and the metal layer.
[0144]
The above-mentioned polymer may be used as a primer by copolymerizing two or more kinds or mixing two or more kinds as necessary. In addition, the same resin composition as the resin adhesive 14 described later can be used as a primer.
[0145]
The primer is usually used by dissolving it in a general-purpose solvent, but may be used without a solvent. Solvents include ketone solvents such as acetone, diethyl ketone, methyl amyl ketone and cyclohexanone, aromatic solvents such as toluene and xylene, cellosolve solvents such as methyl cellosolve, methyl cellosolve acetate, ethyl cellosolve acetate, and lactic acid. Ethyl, butyl acetate, isoamyl acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, methyl pyruvate, ester solvents such as ethyl pyruvate, propyl pyruvate, methanol, ethanol, propanol, propylene glycol methyl ether, propylene glycol Examples include alcoholic solvents such as ethyl ether and propylene glycol propyl ether, and if necessary, used alone or in combination of two or more. Can be.
[0146]
The primer may optionally contain additives such as a coupling agent, a tackifier for improving the adhesive strength, and a plasticizer for adjusting the tackiness. As coupling agents, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N-β- (N-vinylbenzylaminoethyl) -γ-amino Silane coupling agents having an amino group such as propyltrimethoxysilane and hexamethylsilazane; silanes having an epoxy group such as γ-glycidoxypropyltrimethoxysilane and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane A coupling agent, a silane coupling agent having a mercapto group such as γ-mercaptopropyltrimethoxysilane, and a silane coupling agent such as a silane coupling agent having a halogen group such as γ-chloropropyltrimethoxysilane; 2,2-dia Loxymethyl-1-butyl) bis (ditridecyl) phosphite titanate, isopropyldimethacrylisostearoyl titanate, isopropyldiacrylisostearoyl titanate, isopropyltriisostearoyl titanate, bis (dioctylpyrophosphate) oxyacetate titanate, bis (dioctylpyrophosphate) Titanate coupling agents such as ethylene titanate, isopropyltridodecylbenzenesulfonyl titanate, isopropyltricumylphenyl titanate, aluminum coupling agents such as acetoalkoxyaluminum diisopropylate, and zirconium coupling agents such as acetylacetone / zirconium complex. is there.
[0147]
Examples of the tackifier include dicyclopentadiene resin, rosin, modified rosin, terpene resin, xylene resin, terpene-phenol resin, alkylphenol resin, coumarone-indene resin, and the like, if necessary, alone or in combination of two or more. Can be used. In addition, a general-purpose silane coupling agent such as epoxy silane, amino silane, or acryl silane can be used to improve the adhesion to the plastic core material.
[0148]
Typical examples of the plasticizer include dioctyl phthalate.
[0149]
A curing agent (crosslinking agent) may be added to the thermosetting resin used for the primer, if necessary. Examples of the curing agent include amines such as triethylenetetramine, xylenediamine, diaminodiphenylmethane, and phthalic anhydride. Acid anhydrides such as maleic anhydride, dodecyl succinic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, diaminodiphenyl sulfone, tris (dimethylaminomethyl) phenol, polyamide resin, dicyandiamide, alkyl-substituted imidazole, polyfunctional isocyanate And the like. The curing agents may be used alone or in combination of two or more. The amount of the curing agent to be added is 0.1 to 50 parts by weight, preferably 1 to 30 parts by weight, based on 100 parts by weight of the polymer. If the amount of the curing agent is less than 0.1 part by weight, the curing is insufficient, and if it exceeds 50 parts by weight, excessive crosslinking may occur, which may adversely affect the adhesiveness.
[0150]
The thickness of the metal layer 2 of the strip member 13 can be suitably used in a range of 1 μm or more and 5 mm or less, preferably 3 μm or more and 1 mm or less, and most preferably 5 μm or more and 0.5 mm or less. If the thickness is smaller than 1 μm or larger than 5 mm, the moisture-proof reliability decreases.
[0151]
In the sealing mode in which the strip members 13 are vertically overlapped as shown in FIG. 18 or FIG. 25, a gap is easily formed between the substrate and the metal layer 2, and in consideration of this point, the thickness of the metal layer 2 is 5 μm or more. It is preferable that If it is less than 5 μm, a gap will be formed even when pressed at 4 MPa or more, and the metal layer will be peeled off by pressing at 2 MPa or more. In the case of the metal layer 2 having a thickness of 5 μm or more and 30 μm or less, it is possible to seal well without generating a gap between the substrate and the substrate by pressing at 1 to 4 MPa, more preferably 10 μm or more and 30 μm or less. . Further, considering the cost and the reduction of the manufacturing time due to the metal used, 10 μm or more and 20 μm or less are optimal.
[0152]
As the metal forming the metal layer 2, any metal having a melting point of about 80 ° C. or more can be suitably used, and a single metal or various eutectic alloys or non-eutectic alloys can be used. If the melting point is lower than 80 ° C., the moisture-proof reliability is easily lowered due to the temperature rise, which is not preferable. However, the lower limit of the melting point of the usable metal varies depending on the target value of the heat-resistant temperature required for a practical product using the mounted body. When the metal layer 2 is melted at the time of joining the substrates with the sealing material, the shape of the metal layer can cope with minute irregularities on the substrate surface, and the adhesion is improved. In addition, if the bonding by metal is formed, the bonding of the resin adhesive can be assisted. From such a viewpoint, a low melting point metal having a melting point lower than the heat-resistant limit temperature of the substrate and the element, that is, a metal having a melting point of 250 ° C or less is appropriate, preferably 90 ° C or more and 220 ° C or less, and 100 ° C or more and 200 ° C or less. Is more preferred. When the melting point is 250 ° C. or higher, a high temperature is required at the time of fusion bonding, and the high temperature adversely affects the functional element, so that the above object cannot be achieved. Specific examples of the low-melting point metal that can be used have been described in the first embodiment of the above-described mounting body, and thus are omitted here. As an optimal metal, an alloy containing tin and indium and having a melting point of about 100 ° C. or more and 150 ° C. or less can be mentioned, and the melting point of a tin / indium (48/52) eutectic alloy is 117 ° C. When zinc is added to the tin / indium alloy, the adhesion of the metal layer 2 to glass is improved.
[0153]
The metal layer 2 can be formed on the surface of the core material 1 by a method such as electrolytic plating, electroless plating, and fusion plating. For example, after performing a seeder treatment on the core material 1, an electroless copper plating or an electroless nickel plating or the like is applied to provide a conductive layer, and thereafter, a film of the above-described metal is formed by electrolytic plating. Preferably, a metal layer 2 is provided. In the fusion method, for example, the metal layer 2 can be formed by melting the above metal and directly fusing it to the core material.
[0154]
However, it is difficult to uniformly form a plating having a thickness of 5 μm or more in the fusion plating, and it is easy to form a uniform plating having a thickness of 5 to 30 μm in the electrolytic plating. In addition, electroless plating takes time to form a thick film. Therefore, electrolytic plating is preferable in consideration of manufacturing efficiency and precision, but cannot be directly applied to a plastic core material. In order to apply electrolytic plating to a plastic core material, as shown in FIG. 35A, first, a conductive layer 17 is formed, and thereafter, electrolytic plating is applied to obtain a metal layer 2 having a desired thickness. The composition of the conductive layer 17 may be any as long as it has conductivity, and is not limited to metal. Copper, nickel, and the like, which can form a film by electroless plating, are generally used. Copper is preferred. The thickness of the conductive layer 17 by electroless plating is preferably 0.05 μm or more and 50 μm or less, and 0.2 μm or more and 10 μm or less, from the viewpoint of obtaining necessary conductivity and reducing cost and manufacturing time. Or less, most preferably 0.5 μm or more and 3 μm or less. Since the electroless copper plating film easily has a defect and is brittle, it is desirable to further perform electrolytic plating to improve the adhesion and ductility of the conductive layer 17. FIG. 35B shows an example of a mounted body in which a substrate is sealed and bonded using such a strip member 13 ′. The conductive layer 17 may function as a part of the core material 1 or may function as the metal layer 2 depending on its material and physical properties.
[0155]
Electroplating is particularly suitable for forming the metal layer 2 with a uniform film thickness. When the metal layer 2 of the tin / indium eutectic alloy is formed by electrolytic plating, for example, a plastic core material having a conductive layer formed in an electrolytic plating solution for tin / indium eutectic alloy (manufactured by Ishihara Chemical Co., Ltd.) Alternatively, a metal core is immersed and the current density is 0.05 A / cm. ² 0.5A / cm or more ² By energizing as follows, the tin / indium eutectic alloy is laminated with a uniform thickness. Current density is 0.05 A / cm ² If it is less than 30, a tin-only plating film tends to be formed, and a tin / indium eutectic alloy cannot be obtained. Current density 0.5A / cm ² If it exceeds, the alloy is rapidly precipitated and the film thickness becomes uneven.
[0156]
An embodiment of the sheet-like sealing material of the present invention constituted by using the above-described strip member will be described below.
[0157]
[First Embodiment of Sheet-shaped Sealing Material]
In the sheet-like sealing material of this embodiment, as shown in FIGS. 26A to 26F, a base member in which the strip member 13 is embedded in a film-like resin adhesive 14 and the surface of which is subjected to a release treatment. 16 supported. Therefore, if the upper surface of the resin adhesive 14 is adhered to the position where the sealing material of the substrate is disposed and the base material 16 is peeled off, the sealing material composed of the strip member 13 and the resin adhesive 14 can be accurately and accurately placed on the substrate. It can be easily arranged. In this figure, a plurality of strip members 13 are arranged in parallel in the resin adhesive 14, but in the case of sealing with a single strip member 13 as shown in FIG. Only one strip member 13 is embedded in the film 14 or the sealing material shown in FIG. Alternatively, a perforation and a kerf parallel to 13 may be provided in the base member 16 and the resin adhesive 14 so that the plurality of strip members 13 of the sealing material in FIG. It may be. FIG. 27A shows a sheet obtained by dividing a sheet-like sealing material of the type shown in FIG. 26A (however, the cross-sectional shape of the strip member is different) so as to use one strip member 13 along the strip member. FIG. 27B shows an example in which two strip members 13 are divided. FIG. 27C shows an example of a sheet-like sealing material in which a pair of strip members 13 is embedded in the resin adhesive 14 so as to be adjacent to each other and divided and used in units of two.
[0158]
The film thickness of the resin adhesive 14 is preferably 1 μm or more and 1 mm or less, more preferably 3 μm or more and 500 μm or less, and most preferably 5 μm or more and 300 μm or less. If it is less than 1 μm, it is difficult to control the thickness, and the adhesive strength is greatly reduced. On the other hand, if the thickness exceeds 1 mm, it is difficult to obtain a film having a smooth surface, so that sufficient adhesiveness cannot be obtained.
[0159]
In (a) and (f) of FIG. 26, the outer diameter of the strip member 13 and the thickness of the resin adhesive 14 are the same, and in (b), (d), and (e), the outer diameter of the The thickness of the resin adhesive 14 is larger, and the thickness of the resin adhesive 14 is smaller than the outer diameter of the strip member 13 in (d). When the outer diameter of the strip member 13 and the thickness of the resin adhesive 14 are the same, both the resin adhesive 14 and the strip member 13 contact the substrate when the sealing material is attached to the substrate. When the substrate is bonded to the substrate, the metal layer 2 and the substrate come into close contact with each other.
[0160]
When the sheet-like sealing material as described above is adhered to the substrate, the base material 16 is peeled off, and then heated and pressure-bonded between the adherends, that is, between the opposing substrates, to form a resin bond between the strip member and the adherend. When the agent 14 is present, it is extruded and the metal layer 2 is exposed from the resin adhesive 14, and comes into contact with the surface of the adherend, that is, the surface of the substrate, as shown in FIG. At this time, when energy is applied so that the metal layer 2 is melted, the melted metal adapts to fine irregularities on the surface of the adherend on both sides to increase the adhesion. Further, if the bonding between the metal layer 2 and the adherend is formed, it plays a role of assisting the bonding of the resin adhesive. Bonding with metal cannot maintain adhesive strength against thermal stress or stress generated during humidification, but resin composition containing polymer as a main component has excellent stress adaptability. In addition, the joint with the adherend is less likely to be broken by the dispersion and absorption of stress.
[0161]
In the present invention, the elastic compression of the core material 1 is used to apply a so-called spring effect to return to the core material elastically deformed by pressurization to the metal layer and press-contact the adherend, so that the post-joining is performed. Can maintain excellent moisture-proof properties even when subjected to heating and / or humidification. Shrinkage that occurs when the resin composition cures also contributes to the spring effect of the core material 1.
[0162]
The resin adhesive 14 may be any resin composition that acts as an adhesive for joining the substrate and the opposing substrate, and requires a resin (thermoplastic resin, thermosetting resin) that requires heating to form a bond and does not require heating. Any of the above resins (e.g., radiation-curable resin) can be used. In order to avoid deterioration of the element due to heat, the element is a resin composition that is not accompanied by heating to a temperature exceeding 200 ° C. (softening temperature and curing (crosslinking) temperature are 200 ° C. or less), usually The softening temperature of the resin composition is from 30 ° C. to 200 ° C., preferably from 50 ° C. to 180 ° C., more preferably from 60 ° C. to 150 ° C. from the point of handling in an atmosphere of It is preferable to use a thermosetting resin or a radiation-curable resin so that the property does not decrease at a high temperature, and these are the same as in the case of the resin composition of the adhesive layer 4 described above.
[0163]
As a requirement for the sheet-shaped sealing material, it is preferable that the resin composition before curing at room temperature has a shape-retaining property that can maintain the shape on the base material. Taking these points into account, the resin composition used as the resin adhesive 14 will be specifically described.
[0164]
When a thermosetting resin is used, the curing temperature is 50 ° C. or more and 200 ° C. or less, preferably 180 ° C. or less, more preferably 70 ° C., from the viewpoint of storage stability, heat resistance, and prevention of thermal deterioration of the functional element to be sealed. The temperature of 150 ° C. or lower is the same as in the case of the resin composition of the adhesive layer 4 described above. Curing of a thermosetting resin proceeds even at a temperature lower than the curing temperature, and the curing speed becomes slower as the difference between the heating temperature and the curing temperature of the resin increases. When the temperature required for curing the resin is high, it is possible to avoid heating the element by the local heating method.
[0165]
As a specific example when the resin composition is a thermosetting resin, a resin such as a phenol resin, a melamine resin, an epoxy resin, and a xylene resin can be applied. In addition, bisphenol A type epoxy resin, bisphenol F type epoxy resin, tetrahydroxyphenylmethane type epoxy resin, novolak type epoxy resin, resorcinol type epoxy resin, polyalcohol / polyglycol type epoxy resin, polyolefin type epoxy resin, alicyclic type Or an epoxy resin such as halogenated bisphenol.
[0166]
Examples of thermosetting resins and thermoplastic resins other than epoxy resins include natural rubber, polyisoprene, poly-1,2-butadiene, polyisobutene, polybutene, poly-2-heptyl-1,3-butadiene and poly- (Di) enes such as 2-t-butyl-1,3-butadiene, poly-1,3-butadiene, and polyethers such as polyoxyethylene, polyoxypropylene, polyvinyl ethyl ether, polyvinyl hexyl ether, and polyvinyl butyl ether And polyesters such as polyvinyl acetate and polyvinyl propionate, polyurethane, ethyl cellulose, polyvinyl chloride, polyacrylonitrile, polymethacrylonitrile, polysulfone, polysulfide, and phenoxy resin. In addition, ethylene-vinyl acetate copolymer, modified ethylene-vinyl acetate copolymer, polyethylene, ethylene-propylene copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic ester copolymer, ethylene-acryl Acid salt copolymer, acrylate rubber, polyisobutylene, atactic polypropylene, polyvinyl butyral, acrylonitrile-butadiene copolymer, styrene-butadiene block copolymer, styrene-isoprene block copolymer, ethylene cellulose, polyamide, Silicone rubber, synthetic rubbers such as polychloroprene, polyvinyl ether, and the like are applicable, and may be used alone or in combination of two or more. Examples of the acrylic resin include the following. Polyethyl acrylate, polybutyl acrylate, poly-2-ethylhexyl acrylate, poly-t-butyl acrylate, poly-3-ethoxypropyl acrylate, polyoxycarbonyltetramethacrylate, polymethylacrylate, polyisopropylmethacrylate, polydodecylmethacrylate, polytetra Decyl methacrylate, poly-n-propyl methacrylate, poly-3,3,5-trimethylcyclohexyl methacrylate, polyethyl methacrylate, poly-2-nitro-2-methylpropyl methacrylate, poly-1,1-diethylpropyl methacrylate, polymethyl Poly (meth) acrylates such as methacrylate or copolymers thereof can be used. Further, epoxy acrylate, urethane acrylate, polyether acrylate, polyester acrylate and the like can also be used. In particular, urethane acrylate and epoxy acrylate are excellent in adhesion to an adherend. Examples of epoxy acrylate include 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether, and resorcinol. (Meth) acrylic such as diglycidyl ether, diglycidyl adipate, diglycidyl phthalate, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether, etc. Acid adducts.
[0167]
If necessary, it is also possible to use a resin obtained by copolymerizing two or more of the above resins, or a blend of two or more of the above resins. Polymers having a hydroxyl group in the molecule, such as epoxy acrylate, are effective in improving the adhesion to the support. In addition, when the resin adhesive 14 having the joints has rubber elasticity, the adaptability to the stress of springback due to the core material is high, and the adhesive breakage of the resin adhesive 14 is further suppressed. In this regard, the cured resin composition preferably has an elastic modulus of 0.005 GPa or more and 30 GPa or less, more preferably 0.1 GPa or more and 10 GPa or less, and most preferably 0.5 GPa or more and 7.0 GPa or less.
[0168]
When a thermosetting resin is used, as a curing agent (crosslinking agent), amines such as triethylenetetramine, xylenediamine, diaminodiphenylmethane, phthalic anhydride, maleic anhydride, dodecylsuccinic anhydride, pyromellitic anhydride, and pyromellitic anhydride, Acid anhydrides such as benzophenonetetracarboxylic acid, diaminodiphenylsulfone, tris (dimethylaminomethyl) phenol, polyamide resins, dicyandiamide, alkyl-substituted imidazole, and polyfunctional isocyanate compounds can be used. The curing agents may be used alone or as a mixture of two or more. Also, it is not necessary to use it.
[0169]
The amount of the curing agent to be added is selected in the range of 0.1 to 50 parts by weight, preferably 1 to 30 parts by weight, based on 100 parts by weight of the resin. If the amount of the curing agent (crosslinking agent) is less than 0.1 part by weight, curing will be insufficient, and if it exceeds 50 parts by weight, crosslinking will be excessive and adversely affect adhesiveness.
[0170]
As the resin adhesive 14, a radiation-curable resin that is cured by irradiating radiation such as α-ray, β-ray, γ-ray, neutron beam, X-ray, accelerated electron beam, and ultraviolet ray can also be used. As the UV-curable resin, for example, a radical (co) polymer (A), a radical polymerizable monomer (B) having at least one radical polymerizable group, and a photopolymerization initiator as exemplified below are mixed. Radical polymerizable resin adhesives.
[0171]
The radical (co) polymer (A) can be prepared by reacting a radical polymerizable monomer having at least one radical polymerizable group with a radical polymerization initiator. As a body, diolefin monomers such as butadiene, isoprene, and 2-chlorobutadiene; methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, and t-butyl (Meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, benzyl (meth) acrylate, dimethylaminoethyl (meth) acrylate , Glish (Meth) acrylate, 2,3-dibromopropyl (meth) acrylate, tribromophenyl (meth) acrylate, trifluoroethyl (meth) acrylate, tetrafluoropropyl (meth) acrylate, octafluoropentyl (meth) acrylate, Such as fluorooctylethyl (meth) acrylate, trimethylsiloxyethyl (meth) acrylate, 1,3-butylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, and trimethylolpropane tri (meth) acrylate (Meth) acrylates; vinyl compounds such as styrene, chlorostyrene, α-methylstyrene, dimethylstyrene, t-butylstyrene, divinylbenzene, vinyl acetate, and N-vinylpyrrolidone; Acrylamide, N-methyl (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N, N-diethyl (meth) acrylamide, N, N-dimethylaminopropyl (meth) acrylamide, N-isopropyl (meth) acrylamide, (Meth) acrylamides such as N-methylol (meth) acrylamide, diacetone (meth) acrylamide, N, N-methylenebis (meth) acrylamide; maleimides such as N-phenylmaleimide and N-laurylmaleimide; (meth) acrylonitrile , Maleic acid alkyl monoester, fumaric acid alkyl monoester, itaconic acid alkyl monoester, (meth) acrylic acid, (meth) acrylic anhydride, crotonic acid, isocrotonic acid, vinyl acetic acid, tiglic acid, oleic acid, sol Acid, linoleic acid, maleic acid, maleic anhydride, fumaric acid, citraconic acid, tetraconic acid, itaconic acid, itaconic anhydride, acid phosphooxyethyl (meth) acrylate, 3-chloro-2-acid phosphooxypropyl (meth ) Acrylate, acid phosphooxypropyl (meth) acrylate, acid phosphooxypolyethylene glycol mono (meth) acrylate, acid phosphooxypropylene glycol mono (meth) acrylate, 2- (meth) acrylamide-2-methylpropanesulfonic acid, styrene sulfone Monomers having an acid group or an acid anhydride group such as an acid, sulfopropyl (meth) acrylate, 2- (meth) acryloyloxynaphthalene-2-sulfonic acid, and 2- (meth) acryloyloxybenzenesulfonic acid. There are bodies.
[0172]
Examples of the radical polymerization initiator include hydrogen peroxide, inorganic peroxides such as potassium persulfate and ammonium persulfate, t-butyl hydroperoxide, t-dibutyl peroxide, cumene hydroperoxide, acetyl peroxide, benzoyl peroxide and Organic peroxides such as lauroyl peroxide; and azobisisobutyronitrile, azobis-2,4-dimethylvaleronitrile, azobiscyclohexanecarbonitrile, methyl azobisisobutyrate, azobisisobutylamidine hydrochloride and azobiscyanovaleric acid Azo compounds and the like. For inorganic peroxides and organic peroxides, amines such as ethylamine, triethanolamine and dimethylaniline, polyamines, divalent iron salt compounds, ammonia, organometallic compounds such as triethylaluminum, triethylboron and diethylzinc , Sodium sulfite, sodium bisulfite, cobalt naphthenate, sulfinic acid, mercaptan and the like may be used in combination. Further, as a radical polymerization initiator used for producing a radical (co) polymer, a photopolymerization initiator that generates a polymerization initiation radical by irradiation with ultraviolet light or visible light may be used. Alternatively, a polymerization initiation radical may be generated by irradiating a high energy beam such as an electron beam, an X-ray, or plasma without using a radical polymerization initiator.
[0173]
When produced using an organic peroxide and / or an azo compound as the radical polymerization initiator, the photopolymerizability of the radically polymerizable resin adhesive containing a radical (co) polymer is increased. In particular, a resin adhesive containing a radical (co) polymer produced using an organic peroxide that generates a 2,2-dimethyl-substituted alkyl (acyl) oxy radical is highly crosslinked at a low UV irradiation dose. ,preferable. As the 2,2-dimethyl-substituted alkyl (acyl) oxy radical, a t-butoxy radical, a t-hexyloxy radical, a cumeneoxy radical and the like are particularly effective. Examples of the organic peroxide that generates a 2,2-dimethyl-substituted alkyl (acyl) oxy radical include t-butyl peroxypivalate, t-butyl peroxy neodecanoate, and t-butyl peroxy 2-ethyl. Hexanoate, t-butylperoxy 3,5,5-trimethylhexanoate, t-butylperoxylaurate, t-butylperoxybenzoate, di-t-butylperoxyisophthalate, t-butylperoxy T-butyl peroxyester compounds such as maleic acid, t-butyl peroxyisopropyl carbonate, t-butyl peroxyneohexanoate; t-hexylperoxyneododecanoate, t-hexylperoxypivalate, t T-hexyl such as -hexylperoxyneohexanoate Cumyl peroxy ester compounds such as cumyl peroxy octoate, cumyl peroxy neodecanoate and cumyl peroxy neohexanoate; 1,1-bis (t-butylperoxy) 3,3 Peroxyketal compounds such as 5-trimethylcyclohexane, 1,1-bis (t-butylperoxy) cyclohexane, 2,2-bis (t-butylperoxy) octane; t-butyl hydroperoxide, cumene hydroperoxide And hydroperoxide compounds such as p-menthane hydroperoxide; dialkyl peroxide compounds such as di-t-butyl peroxide, t-butylcumyl peroxide and dicumyl peroxide.
[0174]
The radical polymerizable monomer (B) may be a compound having at least one radical polymerizable group and one or more functional groups. Preferred compounds having high reactivity include (meth) acrylic compounds, (meth) acrylamide compounds and vinyl ether compounds. Specifically, for example, (meth) acrylamide, (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, Dodecyl (meth) acrylate, lauryl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, cyclohexyl (meth) acrylate, Benzyl (meth) acrylate, isobornyl (meth) acrylate, N-methylmaleimide, N-phenylmaleimide, diethylene glycol di (meth) acrylate, neopentyl glycol di (meth) ac Rate, 1,6-hexanedi (meth) acrylate, bisphenol A dioxydiethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, 1,4-butanediol di (meth) Acrylate, N-vinylpyrrolidone, urethane (meth) acrylate, polyester (meth) acrylate, epoxy (meth) acrylate, polybutadiene (meth) acrylate, silicone (meth) acrylate, polyether (meth) acrylate, melamine (meth) acrylate, (Meth) acrylic compounds such as phosphazene (meth) acrylate and acrylic copolymers with (meth) acryloyl groups introduced; polybutadiene and unsaturated polyester compounds The main chain and a compound having an unsaturated bond in the side chain of an allyl group, a vinyl group, vinyl ether group, a maleimide group, a compound having a radical polymerizable double bond such as (meth) acrylamide group. One or a mixture of two or more of these can be used. One or more radical polymerizable monomers having two or more functional groups can be used to enhance the ultraviolet curability of the radical polymerizable resin adhesive and improve the performance of the coating film.
[0175]
Specific examples of the radical polymerizable monomer having a methine group and / or a methylene group adjacent to a chain ether group as a functional group include, for example, diethylene glycol mono (meth) acrylate and triethylene glycol mono (meth) acrylate , Nonaethylene glycol mono (meth) acrylate, polyethylene glycol mono (meth) acrylate (polyethylene glycol chain number: 30), methoxyethylene glycol (meth) acrylate, methoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate, Methoxy nona ethylene glycol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate (polyethylene glycol chain number: 30), 3-methoxybutyl (meth) a Relate, ethoxydiethylene (meth) acrylate, butoxyethyl (meth) acrylate, 2-ethylhexylethyl (meth) acrylate, 2-ethylhexyldiethylene glycol (meth) acrylate, phenoxyethylene glycol (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, nonyl Phenoxyethylene glycol (meth) acrylate, nonylphenoxytetraethylene glycol (meth) acrylate, tricyclo [5,2,1,0 ^2,6 Alkyloxypolyalkylene glycol (meth) acrylates such as decanyloxyethyl (meth) acrylate, isobonyloxyethyl (meth) acrylate, cyclohexyloxyethyl (meth) acrylate, and methoxytripropylene glycol (meth) acrylate; and allyloxy Polyalkylene glycol (meth) acrylates; N-alkoxyalkyl (meth) acrylamides such as Nn-butoxymethyl (meth) acrylamide, N-isobutoxymethyl (meth) acrylamide, and N-methoxyethyl (meth) acrylamide Is mentioned.
[0176]
Examples of the radical polymerizable monomer having a methine group and / or a methylene group adjacent to a cyclic ether group as a functional group include, for example, tetrahydrofurfuryl (meth) acrylate and monoε-caprolactone adduct of tetrahydrofurfuryl alcohol. (Meth) acrylate, (meth) acrylate of diε-caprolactone adduct of tetrahydrofurfuryl alcohol, (meth) acrylate of mono β-methyl-δ-valerolactone adduct of tetrahydrofurfuryl alcohol, and (meth) acrylate of tetrahydrofurfuryl alcohol (Β-methyl-δ-valerolactone adduct (meth) acrylate, tetrahydrofurfuryloxyethyl (meth) acrylate, tetrahydrofurfuryloxydiethylene glycol (meth) acrylate, tetrahydrofurfury Oxytetraethylene glycol (meth) acrylate, tetrahydrofurfuryloxypropyl (meth) acrylate, tetrahydrofurfuryloxydipropylene glycol (meth) acrylate, tetrahydrofurfuryloxy tripropylene glycol (meth) acrylate, 2- of tetrahydrofurfuryl alcohol (Meth) having a tetrahydrofuran ring such as isocyanate ethyl (meth) acrylate adduct, glycidyl (meth) acrylate reactant of 2-tetrahydrofuronic acid, tetrahydrofurfuryl (meth) acrylamide, tetrahydrofurfuryloxymethyl (meth) acrylamide, etc. Acrylates and (meth) acrylamides having a tetrahydrofuran ring; tetrahydropyran-2-methanol (meth Acrylate, (meth) acrylate of mono-ε-caprolactone adduct of tetrahydropyran-2-methanol, (meth) acrylate of diε-caprolactone adduct of tetrahydropyran-2-methanol, mono β- of tetrahydropyran-2-methanol (Meth) acrylate of methyl-δ-valerolactone adduct, (meth) acrylate of diβ-methyl-δ-valerolactone adduct of tetrahydropyran-2-methanol, tetrahydropyran-2-methanoloxyethyl (meth) acrylate , Tetrahydropyran-2-methanoloxydiethylene glycol (meth) acrylate, tetrahydropyran-2-methanoloxytetraethylene glycol (meth) acrylate, tetrahydropyran-2-methanoloxypropyl (Meth) acrylate, tetrahydropyran-2-methanoloxydipropylene glycol (meth) acrylate, tetrahydropyran-2-methanoloxytripropylene glycol (meth) acrylate, 2-isocyanatoethyl (meth) acrylate of tetrahydropyran-2-methanol Tetrahydropyran ring such as adduct, (meth) acrylic acid reactant of epichlorohydrin adduct of tetrahydropyran-2-methanol, tetrahydropyran-2-methanol (meth) acrylamide, tetrahydropyran-2-methanoloxymethyl (meth) acrylamide (Meth) acrylates having the formula (1) and (meth) acrylamides having a tetrahydropyran ring; 2,2-dimethyl-3-oxypropanal and ethylene glycol (Meth) acrylate of a condensate of (2), (meth) acrylate of mono-ε-caprolactone adduct of a condensate of 2,2-dimethyl-3-oxypropanal and ethylene glycol, 2,2-dimethyl-3-oxypropanal (Meth) acrylate of a mono-β-methyl-δ-valerolactone adduct of ethylene glycol and a condensate of ethylene glycol, and an epichlorohydrin adduct of a condensate of 2,2-dimethyl-3-oxypropanal and ethylene glycol ( (Meth) acrylic acid reactant, 2-isocyanatoethyl (meth) acrylate adduct of condensate of 2,2-dimethyl-3-oxypropanal and ethylene glycol, 2,2-dimethyl-3-oxypropanal and propylene glycol (Meth) acrylate of a condensate of 2,2-dimethyl-3-oxypropanal (Meth) acrylate of monoε-caprolactone adduct of condensate of propylene glycol, and (meth) acrylic acid reactant of epichlorhydrin adduct of condensate of 2,2-dimethyl-3-oxypropanal and propylene glycol 2-isocyanatoethyl (meth) acrylate adduct of a condensate of 2,2-dimethyl-3-oxypropanal and propylene glycol, and (-of a condensate of 2,2-dimethyl-3-oxypropanal and neopentyl glycol (Meth) acrylate, (meth) acrylate of monoε-caprolactone adduct of condensate of 2,2-dimethyl-3-oxypropanal and neopentyl glycol, 2,2-dimethyl-3-oxypropanal and neopentyl glycol (Meth) a of the epichlorohydrin adduct of the condensate of Lylic acid reactant, 2-isocyanatoethyl (meth) acrylate adduct of condensate of 2,2-dimethyl-3-oxypropanal and neopentyl glycol, glycerol formal (meth) acrylate, mono ε- of glycerol formal (Meth) acrylate of caprolactone adduct, (meth) acrylate of mono-β-methyl-δ-valerolactone adduct of glycerol formal, (meth) acrylic acid reactant of epichlorohydrin adduct of glycerol formal, glycerol Examples include (meth) acrylates having a dioxolane ring, such as 2-isocyanatoethyl (meth) acrylate adduct of formal.
[0177]
Examples of the radical polymerizable monomer having a methine group and / or a methylene group adjacent to a hydroxyl group as a functional group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl ( (Meth) acrylate, 4-hydroxybutyl (meth) acrylate, glycerol mono (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2-hydroxy- Examples thereof include (meth) acrylates having a hydroxyl group such as 3-lauroxypropyl (meth) acrylate, 2- (meth) acryloyloxyethyl-2-hydroxypropyl phthalate, and dipropylene glycol mono (meth) acrylate.
[0178]
Examples of the radical polymerizable monomer having a methine group and / or a methylene group adjacent to a carbamate group as a functional group include isopropyl alcohol adduct of 2-isocyanateethyl (meth) acrylate and n of 2-isocyanateethyl (meth) acrylate -Butyl alcohol adduct, 2-hydroxyethyl (meth) acrylate adduct of n-butyl isocyanate, 2-hydroxypropyl (meth) acrylate adduct of phenyl isocyanate, 2-hydroxyethyl (meth) acrylate adduct of octadecyl isocyanate (Meth) acrylates having a carbamate group such as isopropyl alcohol adduct of 3-isopropenyl-α, α-dimethylbenzyl isocyanate and 3-isopropenyl-α, α-dimethylbenzyl isocyanate Mosquitoes, such bets n- butyl alcohol adduct - vinyl compounds such as having Bameto group.
[0179]
As a photopolymerization initiator, diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethylketal, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropane- 1-one, 4- (2-hydroxyethoxy) phenyl- (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexyl-phenylketone, 2-methyl-2-morpholino (4-thiomethylphenyl) propane Acetophenone compounds such as -1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone, benzoin compounds such as benzoin, benzoin isopropyl ether and benzoin isobutyl ether; -Trimethylbenzoyldiphenylphosphine oxo Acylphosphine oxide compounds such as side, benzyl, methylphenylglyoxyester; benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4,4'-dichlorobenzophenone, hydroxybenzophenone, 4-benzoyl-4'-methyl Benzophenone-based compounds such as diphenyl sulfide, acrylated benzophenone, 3,3 ′, 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, and 3,3′-dimethyl-4-methoxybenzophenone; 2-isopropylthioxanthone Thioxanthone compounds such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone and 2,4-dichlorothioxanthone; amino acids such as Michler's ketone and 4,4'-diethylaminobenzophenone Benzophenone-based compounds; 10-butyl-2-chloro acridone, 2-ethyl anthraquinone, 9,10-phenanthrenequinone, camphorquinone, and the like.
[0180]
Regarding the ultraviolet curing of the radical polymerizable resin adhesive, the polymerization is carried out only with a photopolymerization initiator, but it is preferable to use a photosensitizer in combination for more efficient polymerization. Examples of such a sensitizer include triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, and benzoic acid (2-dimethylamino). There are amines such as ethyl, ethyl (n-butoxy) 4-dimethylaminobenzoate and 2-ethylhexyl 4-dimethylaminobenzoate.
[0181]
Further, if necessary, a non-reactive oligomer, a pigment, a dye, an inorganic filler, an organic filler, a polymerization inhibitor, a defoaming agent, a leveling agent, a plasticizer, and an adhesion improver such as a coupling are added. Is also good. Inorganic fillers and organic fillers are generally used to improve mechanical properties such as strength, cushioning, and slipperiness.
[0182]
Although the above additives are not particularly limited, oil-disintegrating dyes having excellent solubility are particularly suitable for organic pigments, inorganic pigments and dyes.
[0183]
As the inorganic filler, silicon dioxide, silicon oxide, calcium carbonate, calcium silicate, magnesium carbonate, magnesium oxide, calcium oxide, talc, kaolin clay, calcined clay, zinc oxide, zinc sulfate, aluminum hydroxide, aluminum oxide, glass, Mica, barium sulfate, alumina white, zeolite, silica balloon, glass balloon and the like. A halogen group, an epoxy group, an amino group, a hydroxyl group, a thiol group, a silane coupling agent, a titanate-based coupling agent, an aluminum-based coupling agent, a zirconate-based coupling agent, and the like are added to and reacted with the inorganic filler. It may have a functional group such as a group and an amide group.
[0184]
Organic fillers include benzoguanamine resin, melamine resin, benzoguanamine / melamine resin, urea resin, silicone resin, low density polyethylene, high density polyethylene, polyolefin resin, ethylene / acrylic acid copolymer, polystyrene, cross-linked polystyrene, polydivinylbenzene , Styrene-divinylbenzene copolymer, acrylic copolymer, cross-linked acrylic resin, polymethyl methacrylate resin, vinylidene chloride resin, fluorine resin, nylon 12, nylon 11, nylon 6/66, phenol resin, epoxy resin, urethane resin, There are polyimide resins and the like. The organic filler may have a functional group such as a halogen group, an epoxy group, an amino group, a hydroxyl group, a thiol group, and an amide group.
[0185]
As coupling agents, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N-β- (N-vinylbenzylaminoethyl) -γ-amino Silane coupling agents having an amino group such as propyltrimethoxysilane and hexamethylsilazane; silanes having an epoxy group such as γ-glycidoxypropyltrimethoxysilane and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane Silane coupling agents such as coupling agents, silane coupling agents having a mercapto group such as γ-mercaptopropyltrimethoxysilane, and silane coupling agents such as silane coupling agents having a halogen group such as γ-chloropropyltrimethoxysilane; , 2-Diari Oxymethyl-1-butyl) bis (ditridecyl) phosphite titanate, isopropyldimethacrylisostearoyl titanate, isopropyldiacrylisostearoyl titanate, isopropyltriisostearoyl titanate, bis (dioctylpyrophosphate) oxyacetate titanate, bis (dioctylpyrophosphate) ) Titanate-based coupling agents such as ethylene titanate, isopropyltridodecylbenzenesulfonyl titanate, isopropyltricumylphenyl titanate, aluminum-based coupling agents such as acetoalkoxyaluminum diisopropylate, and zirconium-based coupling agents such as acetylacetone / zirconium complex. There is.
[0186]
Light for irradiating the radical polymerizable resin adhesive is preferably ultraviolet light or visible light having a wavelength of 180 nm to 900 nm. Light sources include ultra-high pressure mercury lamps, high pressure mercury lamps, low pressure mercury lamps, metal halide lamps, chemical lamps, black light lamps, mercury-xenon lamps, short arc lamps, helium / cadmium lasers, argon lasers, sunlight is there. In particular, light having wavelengths of 254 nm, 313 nm, 365 nm, and 405 nm is effective for crosslinking the radical polymerizable resin adhesive. 100mJ / cm ² -10 J / cm ² Can be highly crosslinked with a light irradiation amount of The light irradiation amount can be measured by, for example, an industrial UV checker UVR-T37 (manufactured by Topcon Corporation).
[0187]
The radical polymerizable resin adhesive is cured by ultraviolet rays without containing a photopolymerization initiator. Further, crosslinking may be performed by a high energy ray other than light. Examples of high energy rays include electromagnetic radiation such as electron beams, X-rays, α-rays, β-rays, and γ-rays.
[0188]
The cationically curable UV-curable epoxy resin adhesive contains a Lewis acid salt-type curing agent that releases a Lewis acid catalyst by photodecomposition by irradiation with light such as ultraviolet rays as a main curing agent. The epoxy resin is a type of adhesive in which an epoxy resin as a main component is polymerized and cured by a cationic polymerization type reaction mechanism using a resin such as epoxy or vinyl ether using an acid as a catalyst. Epoxy resins that are the main component include epoxidized olefin resins, alicyclic epoxy resins, and novolak epoxy resins. Examples of the curing agent include Lewis acid salts of aromatic diazonium, Lewis acid salts of diallyliodonium, Lewis acid salts of triallylsulfonium, Lewis acid salts of triallyl selenium, and the like. Of these, Lewis acid salts of diallyliodonium are preferred.
[0189]
It is also possible to use a thermoplastic elastomer as the resin adhesive 14. Examples thereof include styrene-butadiene block copolymer, styrene-butadiene-styrene, styrene-isoprene-styrene, styrene-butadiene-ethylene-styrene, acrylonitrile-butadiene-styrene and the like.
[0190]
Examples of the soft segment component of the thermoplastic elastomer include 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 2-methyl-3-ethyl-1,3-butadiene, 3-methyl-1,3-pentadiene, 2-ethyl-1,3-pentadiene, 1,3-hexadiene, 2-methyl-1,3-hexadiene, 1,3-heptadiene, 3-methyl-1,3- Heptadiene, 1,3-octadiene, 3,4-dimethyl-1,3-hexadiene and the like can be mentioned, and 1,3-butadiene and isoprene are particularly preferable. Examples of the vinyl monomer copolymerizable with these conjugated dienes include ethylene. These monomers can be copolymerized within a range that does not decrease the polymerization rate of the conjugated diene. From a practical standpoint, the amount of these vinyl monomers is preferably 1/10 or less of the weight of the conjugated diene.
[0191]
Examples of the hard segment component of the thermoplastic elastomer include, in addition to styrene, nuclear alkyl-substituted styrenes such as o-methylstyrene, m-methylstyrene, p-methylstyrene, 2,4-dimethylstyrene, ethylstyrene, and p-tert-butylstyrene. Represents a halogen-substituted styrene such as monochlorostyrene, dichlorostyrene, dibromostyrene, and tribromostyrene, α-methylstyrene, α-alkyl-substituted styrene such as α-methyl-p-methylstyrene, and the like. Examples include styrene alone or a monomer mixture in which a part of the styrene is replaced with the above-mentioned vinyl aromatic monomer other than styrene. The unsaturated nitrile monomer mentioned here is acrylonitrile, methacrylonitrile, etc., and a typical one is acrylonitrile.
The weight ratio between the soft segment component and the hard segment component is not particularly limited, and is adjusted according to the purpose.
[0192]
The molecular weight of the thermoplastic elastomer is not particularly limited, and may be 1,000 to 500,000 for ordinary use. The preferred molecular weight range is from 5,000 to 100,000.
[0193]
The resin adhesive 14 may include a dispersant, a thixotropic agent, an antifoaming agent, a leveling agent, a diluent, a plasticizer, an antioxidant, a metal Activators, additives such as coupling agents and fillers may be blended. In particular, the desiccant is effective in capturing and absorbing a small amount of moisture originally adsorbed on the glass used for the mounting body and the moisture contained in the resin to further improve the life of the organic EL element. Examples of such a desiccant include alkaline earth metal oxides such as calcium oxide (CaO), barium oxide (BaO), and magnesium oxide (MgO); lithium sulfate (Li) ₂ SO ₄ ), Sodium sulfate (Na ₂ SO ₄ ), Calcium sulfate (CaSO ₄ ), Magnesium sulfate (MgSO4) ₄ ), Cobalt sulfate (CoSO ₄ ), Gallium sulfate (Ga ₂ (SO ₄ ) ₃ ), Titanium sulfate (Ti (SO ₄ ) ₂ ), Nickel sulfate (NiSO ₄ ) And the like. The content of the desiccant may be appropriately set according to the type and the like, but usually, the desiccant may be about 1 part by weight to 80 parts by weight based on 100 parts by weight of the resin component of the resin adhesive. Preferably, the drying agent is about 5 to 70 parts by weight, and most preferably, the drying agent is about 10 to 50 parts by weight.
[0194]
Further, a tackifier may be added to improve the adhesive strength of the resin adhesive 14, for example, dicyclopentadiene resin, rosin, modified rosin, terpene resin, xylene resin, terpene-phenol resin, alkylphenol resin, Coumarone-indene resins and the like can be used, and these may be used alone or in combination of two or more as necessary. When a general-purpose silane coupling agent such as epoxy silane, amino silane, or acrylic silane is used, the adhesion to glass can be improved.
[0195]
Further, as the tackifier, for example, various plasticizers such as dioctyl phthalate may be used.
[0196]
The resin adhesive as described above is usually dissolved in a general-purpose solvent and used for molding, but can be used without a solvent. You may mix and use with a metal dispersing agent etc. Examples of the solvent used for molding include ketone solvents such as acetone, diethyl ketone, methyl amyl ketone and cyclohexanone, aromatic solvents such as toluene and xylene, methyl cellosolve, methyl cellosolve acetate, and ethyl cellosolve acetate. Cellosolve solvents such as ethyl lactate, butyl acetate, isoamyl acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, ester solvents such as methyl pyruvate, ethyl pyruvate, propyl pyruvate, methanol, ethanol, propanol, Alcohol solvents such as propylene glycol methyl ether, propylene glycol ethyl ether, and propylene glycol propyl ether; and the like. They can be used in combination.
[0197]
Examples of the material of the base material 16 that supports the resin adhesive 14 include, for example, polystyrene resin, acrylic resin, polymethyl methacrylate resin, polycarbonate resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyethylene resin, polypropylene resin, polyamide resin, Polyamide imide resin, polyether imide resin, polyether ketone resin, polyarylate resin, polyacetal resin, polybutylene terephthalate resin, thermoplastic polyester resin such as polyethylene terephthalate resin, cellulose acetate resin, fluorine resin, polysulfone resin, polyether sulfone resin And a film made of a thermoplastic resin or a thermosetting resin such as polymethylpentene resin, polyurethane resin and diallyl phthalate resin.
[0198]
It is appropriate that the substrate 16 has a thickness of 10 μm or more and 1 mm or less. If it is less than 10 μm or 1 mm or more, handling becomes difficult. 20 μm or more and 500 μm or less are more preferable, and 30 μm or more and 200 μm or less are most preferable.
[0199]
The base material 16 only needs to have a release property on at least the surface supporting the resin adhesive 14, and the base material surface is subjected to a release treatment with a release agent such as silicone, polyethylene, polypropylene, PET, or the like. A release sheet in which the base material itself is formed from a material having a releasability such as that described above can be used. The resin adhesive is protected by coating the strip member 13 and the resin adhesive 14 arranged on the release substrate 16 with another release substrate. When both surfaces of the base material 16 have releasability, the sheet-like sealing material in which the resin adhesive 14 and the strip member 13 are supported on the base material 16 can be wound up on a roll and stored. In these cases, it is necessary that there is a difference in the degree of releasability between the two releasable surfaces. That is, the surface tension of the substrate surface on which the resin adhesive film is formed must be greater than the surface tension of the back surface or the surface of the other substrate. The degree of the release treatment can be easily measured using a wetting index liquid (manufactured by Wako Pure Chemical Industries, Ltd.), and it is preferable that the difference in the wetting index is 5 dyn / cm or more. If the difference is less than 5 dyn / cm, the resin adhesive may be transferred to the back surface of the base material when the sheet-like sealing material wound up in a roll is pulled out during use.
[0200]
[Second embodiment of sheet-shaped sealing material]
In the sheet-like sealing material of this embodiment, as shown in FIG. 28A, the strip member 13 is on the film-like resin adhesive 14 supported by the base material 16 whose surface has been subjected to the release treatment. It is mounted on. The advantage of this sheet-shaped sealing material is that it is easy to manufacture, and if a soft resin is used as the resin adhesive 14, the sheet-shaped sealing material is lightly pressed against the substrate when it is attached to the substrate. Thereby, the strip member 13 is embedded in the film of the resin adhesive 14.
[0201]
Such a sheet-like sealing material forms a film of the resin adhesive 14 on the base material 16 subjected to the release treatment by using a thin film forming technique such as a roll coating method, a printing method, and a spin coating method. It is manufactured by arranging the strip member 13 thereon. If a loom or the like is used when arranging the strip members 13 on the film, a plurality of strip members can be sent out side by side in parallel. The strip member is fixed to the film by pressing the strip member against the film via another release-treated base material or using a roll laminator or the like.
[0202]
[Third Embodiment of Sheet-shaped Sealing Material]
In the sheet-like sealing material of this embodiment, the film-like resin adhesive 14 supported by the base material 16 whose surface has been subjected to the release treatment is shown in FIGS. 28 (b), (c) and (d). Thus, the slit member 13 has a shape corresponding to the stripe member 13, that is, a slit having the same width, and the stripe member 13 is inscribed in the slit and directly supported on the base material 16. The advantage of this sheet-shaped sealing material is that the slit penetrates the film, so that when the sealing material is attached to the adherend (substrate), the resin adhesive 14 is provided between the strip member 13 and the adherend. Since the metal layer 2 does not exist, the metal layer 2 and the adherend are surely in contact with each other, and the accuracy of the metal layer 2 being in close contact with the adherend is high.
[0203]
Such a sheet-like sealing material was subjected to a release treatment of a layer of the resin adhesive 14 having slits using a thin-film forming technique such as a roll coating method, a printing method, a spin coating method, and a molding device such as a mask. It is manufactured by forming on the base material 16 and arranging the strip member 13 in the slit. If a loom or the like is used when arranging the strip members 13 in the slit, it is easy to arrange the plurality of strip members 13 in parallel and send them out simultaneously. In the case where there is a strip member that is out of the slit, the strip member can be properly placed in the slit by pressing the strip member through another release-treated base material or using a roll laminator or the like.
[0204]
[Modified example of sheet-shaped sealing material]
In the sheet-like sealing material, the strip members 13 are not limited to those arranged on a straight line as shown in FIG. 26 (f), and the arrangement shape of the strip members 13 may be appropriately changed according to the sealing state of the substrate. Can be. For example, a film of a resin adhesive 14 having a geometrically closed shape such as an annular ring, an elliptical ring, or a polygonal ring is provided on the base material 16 subjected to the release treatment, and the strip member 13 is formed in a ring shape corresponding to this. And the strip member 13 can be embedded in the film as shown in FIG. 26, or placed on the film as shown in FIG. 28A (see FIG. 32). Further, when a resin adhesive film having concentric annular slits having different sizes is formed, and the corresponding concentric annular strip members are arranged in the slits, as shown in FIGS. It is configured such that the adhesive films are alternately arranged. Since the sealing is performed in a geometrically closed shape, when the sealing is performed using the strip member having the end, the shielding property of the joint between the strip members becomes a problem. Therefore, if the strip member 13 is preliminarily formed into a geometrically closed shape in accordance with the sealing shape, the problem of moisture permeability at the joint between the strip members can be advantageously eliminated. The annular member can be manufactured by forming the core material 1 into an annular shape and similarly forming the metal layer 2.
[0205]
[Production method of sheet-shaped sealing material]
A method for manufacturing a sheet-shaped sealing material will be described using the first to third embodiments as examples.
[0206]
First, as shown in FIG. 2 (a), the surface of the strip-shaped core material 1 having a wire diameter of 1 μm or more and 5 mm or less is subjected to a corona treatment, a plasma treatment, an easy-adhesion coating (primer) treatment or the like in the case of plastic. A metal layer 2 having a low melting point metal and a thickness of 1 μm to 5 mm is formed on the outer periphery of the core material 1 by using an electrolytic plating, an electroless plating, a fusion plating method, or the like to obtain a strip member 13. In the plating method, for example, a metal can be satisfactorily coated by subjecting a core material to a seeder treatment, electroless copper or electroless nickel plating, and then electroplating a low-melting metal. In the fusion method, the molten low melting point metal is directly fused on the strip member.
[0207]
Next, using a film forming technique such as a roll coating method, a printing method, or a spin coating method, on a substrate having release properties or a release-treated substrate 16, as shown in FIG. Form a film of resin adhesive. Alternatively, by coating the resin adhesive 14 via a mask or the like, a film of the resin adhesive 14 is formed in a shape having a predetermined slit as shown in FIG. Leave the part that The viscosity of the resin adhesive is appropriately adjusted according to the desired thickness of the resin adhesive film, and when the resin adhesive is a composition containing a solvent, depending on the amount of the solvent added, when the resin adhesive is a solventless system. Can be adjusted by the amount of the diluent monomer used.
[0208]
Finally, the strip member 13 is arranged on the resin adhesive film manufactured as shown in FIG. Alternatively, as shown in FIGS. 28B to 28D, the strip member 13 is arranged in the slit of the resin adhesive film. At this time, the strip members may be sequentially arranged one by one, or a plurality of strip members may be arranged in parallel using a loom or the like and arranged at the same time. The arranged strip member 13 is fixed on the film or in the slit by press-bonding to the resin adhesive via another release processing base material or directly by a roll laminator or the like. By increasing the pressure on the strip member 13 on the film, the strip member 13 is embedded in the film as shown in FIGS. 26 (a) to (c) and (e). If the resin adhesive film is further laminated after embedding the strip member 13 in the resin adhesive, the sheet strip sealing material of FIG. 26D is obtained. The position of the strip member 13 can be accurately controlled by using a resin adhesive film formed into two layers, upper and lower.
[0209]
As shown in FIGS. 27A to 27C, the sheet-shaped sealing material in which a plurality of strip members are arranged in parallel is appropriately cut along the axial direction of the strip members 13, so that a necessary number of strip members are provided. 13 is produced.
[0210]
[Manufacture of mounted body]
A process for manufacturing a package in which a functional element is sealed between substrates using a sheet-shaped sealing material will be described below with reference to FIGS. Here, an example of manufacturing an EL display device shown as a cross-sectional view of a main part in FIG. 1 using the sheet-shaped sealing material according to the above-described first embodiment will be described, but the present invention is not limited to this. Absent.
[0211]
The substrate 5 and the counter substrate (display element protection substrate) 6 are made of an electrically insulating material that gives high transmittance to light emitted from the light emitting layer of the organic EL element (referred to as a “translucent substrate”). Alternatively, a non-light-transmitting substrate which is electrically insulating is used. In the top emission method, a light-transmitting substrate is used as the opposing substrate 6, and the substrate 5 may be either a light-transmitting substrate or an opaque substrate. In the bottom emission method, a light-transmitting substrate is used as the substrate 5, and the opposing substrate 5 may be either a light-transmitting substrate or a light-impermeable substrate. Translucent materials include transparent or translucent glass, PET, polycarbonate, amorphous polyolefin, and the like. Opaque materials include stainless steel. The substrate 5 and the counter substrate 6 may have flexibility in which these materials are formed into a thin film. However, it is necessary to have pressure resistance and heat resistance against pressure and heat involved in sealing using a sealing material.
[0212]
First, as shown in FIG. 30A, a lower electrode (cathode) 7 made of an Al—Li alloy or the like is formed on one surface of a substrate 5, and an oxadioxide is formed thereon as shown in FIG. An electron transport layer 8 composed of an azole derivative or a triazole derivative, a light emitting layer 9, a hole transport layer 10 composed of a TPD or the like, and an upper electrode (anode) 11 are laminated by a thin film forming method such as a resistance heating evaporation method or an ion beam sputtering method. Thus, the organic EL element 12 is configured. This is called a display element substrate. Further, an insulating film 15 is formed at a position on the lower electrode 7 where the display element is not mounted and sealed with a sealing material. The insulating film 15 is made of silicon nitride (SiN), silicon oxide (SiO ₂ ) Or SiNO is formed by a method such as vapor deposition or sputtering. The insulating film 15 is provided for preventing the lower electrode 7 from being short-circuited by the conductive sealing material having a metal layer of the present invention, and also has an effect of preventing corrosion of the electrode. The thickness of the insulating film 15 may be in the range of 10 nm to 100 μm, and 100 nm to 10 μm is most suitable. The layer structure of the organic EL element 12 is not limited to the above, but may be any as long as it functions as a display element, and the layer structures (1) to (4) described in the first embodiment of the above-described mounting body. Is mentioned.
[0213]
Note that FIG. 30 shows a top emission type mounting, in which the upper electrode 11 is a transparent electrode, but in the case of a bottom emission type, the stacking order of the organic EL elements 12 is reversed, and the lower electrode 7 becomes a transparent electrode. . Similarly, the material of each layer constituting the element is not particularly limited, and various materials can be used as long as a display element can be obtained.
[0214]
Next, as shown in FIG. 30C, a sheet is placed at a position corresponding to the insulating film 15 of the opposing substrate 5 so as to surround the organic EL element 12 when the opposing substrate (protective substrate) 6 faces the substrate 5. The base material 16 is peeled and removed by attaching the sealing material S. If necessary for applying the resin adhesive 14, the sheet-shaped sealing material is heated or pressurized.
[0215]
Further, as shown in FIG. 30D, the opposing substrate (protective substrate) 6 faces the substrate 5, and the exposed resin adhesive 14 is attached to the insulating film 15. When this operation is performed in a glove box replaced with dry nitrogen, moisture and oxygen in the air are not trapped between the two substrates, which is preferable in terms of the life of the organic EL element 12.
[0216]
If necessary for softening the resin adhesive 14 in FIG. 30 (d), heat is applied, and as shown in FIG. 30 (e), the opposing substrate 6 is relatively pressed against the substrate 5 to apply the metal layer 2 to the substrate. 5, the core material 1 is elastically compressed. The pressurizing pressure is preferably from 10 kPa to 50 MPa. In this state, the resin adhesive 14 is cured from the flowing state to form a bond. In the case of using a thermosetting resin or in the case of using a crosslinking agent, the resin adhesive is cured by heating, and in the case of a radiation-curable resin, radiation is applied. As a result, a package as an EL display device in which the organic EL element 12 is sealed in a space held between the substrate 5 and the counter substrate 6 by the function of the core 1 as a spacer is obtained. In this state, a force is exerted on the core material 1 in the elastically compressed state to return to the original shape, and the metal layer 2 is pressed against and adheres to the substrate and the counter substrate by the spring effect. A spring effect also occurs due to shrinkage of the resin adhesive upon curing.
[0219]
If the metal layer 2 is softened or melted by heat before the bond is formed by the curing of the resin adhesive 14, the interface of the metal layer 2 conforms to fine irregularities on the surface of the adherend (substrate), and the moisture permeability Prevention is enhanced.
[0218]
The sheet-shaped sealing material is attached to the insulating film 15 of the substrate 5 in the same manner as in the above-described embodiment, instead of being attached to the counter substrate 6 as shown in FIG. It may be assembled as in d).
[0219]
FIGS. 31A to 31D show arrangement shapes of typical sealing materials when a film-like sealing material is attached on the substrate 5 as shown in FIG. FIG. 31A is a plan view of an arrangement shape in which four pieces of sheet-like sealing materials Sa to d are arranged on the periphery of the substrate along each side of the rectangular organic EL element 12, and four sealing materials are used. Cross at FIG. 31 (b) shows an arrangement in which one sheet-like sealing material S makes one round of the peripheral portion of the substrate along the four sides of the rectangular organic EL element 12, and the sealing materials intersect at only one point. . In FIG. 31 (c), one piece of the sheet-shaped sealing material S makes one round around the peripheral edge of the substrate along the four sides of the rectangular organic EL element 12, and both ends of the sealing material overlap without intersecting. In FIG. 31 (d), four pieces of sheet-shaped sealing materials Sa to d are arranged on the periphery of the substrate along each side of the rectangular organic EL element 12, but both ends of the two pieces Sb and d are the other ends. The two pieces Sa and c are abutted in a T-shape and do not intersect.
[0220]
Since the sheet-shaped sealing material may be arranged so as to completely shield the element from the outside air, the arrangement shape is not limited to the above example. The substrate may have any shape as long as the display element formed on the substrate can be sealed by enclosing the display element with a sealing material.
[0221]
FIG. 32 shows an example in which a sheet-like sealing material is formed into a geometrically closed shape in order to increase the sealing accuracy of the sealing material. In this example, the sheet-like sealing material S ′ has a rectangular shape. A rectangular ring is formed so as to surround the element.
[0222]
FIG. 33 shows an example in which an inorganic EL element 20 is formed instead of the organic EL element in FIGS. 30A to 30E to manufacture an EL display device. 33A, the substrate 5 on which the lower electrode 7 is provided as in FIG. 30A is obtained by laminating the insulating film 21, the light emitting layer 22, the insulating film 23, and the electrode (Al) 24 in FIG. Then, the inorganic EL element 20 is provided, and the insulating film 15 is provided in a portion to be sealed. The steps of FIGS. 33C to 33E for sealing with the sheet-shaped sealing material are the same as the steps of FIGS.
[0223]
FIG. 34 shows an example of manufacturing a sealed body in which the solar cell element 30 is formed instead of the organic EL element in FIGS. 30 (a) to 30 (e). In FIG. 34A, the substrate 5 provided with the lower electrode 7 in the same manner as in FIG. 30A is obtained by stacking the solar cell element 30 and the charge transport layer 31 in FIG. A film 15 is provided. The steps of FIGS. 34 (c) to (e) for sealing with a sheet-shaped sealing material are the same as the steps of FIGS. 30 (c) to (e).
[0224]
【Example】
Hereinafter, the present invention will be described with reference to examples. However, the present embodiment does not limit the invention.
[0225]
First, a mounted body was prepared according to the following description, and the obtained mounted body was evaluated by the following evaluation method. The evaluation results are shown in Tables 1 to 22. In addition, the physical properties of the material used for manufacturing the mounted body were obtained according to the following measurement methods.
[0226]
[Measurement method and evaluation method]
(1) Compression modulus of plastic wire
The compression elastic modulus of the plastic wire is based on JIS K-7161. Each plastic wire is heated and pressed at a temperature equal to or higher than the melting point to form a film, punched into a predetermined shape with a dumbbell, and manufactured by Orientec Co., Ltd., Tensilon / UTM-. It was measured using 4-100.
[0227]
(2) Average wire diameter of plastic wire, metal wire and metal tube wire, thickness of metal tube wire
A core material such as a metal-coated plastic wire or a metal wire is put into an epoxy resin for casting (Epicoat 828 / triethylenetetramine = 10/1) and cured, and then the resin is cast until the wire portion is exposed. The surface was polished and observed with a scanning electron microscope (S-4700, manufactured by Hitachi, Ltd.). The wire diameter was calculated by image processing, ten values were taken for each sample, and the average was taken as the average wire diameter.
[0228]
(3) Melting point of metal
The sample was placed on a hot plate and observed with an optical microscope (BH-2, manufactured by Olympus Corporation) at a magnification of 100 while heating at a heating rate of 5 ° C./min. The temperature at which 100% of the solid metal was liquefied was defined as the melting point.
[0229]
(4) Thickness of metal layer
Similar to the measurement of the average wire diameter, after the core material coated with metal is poured into the epoxy resin for casting and cured, the surface of the cast resin is polished until the core material portion is exposed, and the scanning electron microscope is used. (S-4700, manufactured by Hitachi, Ltd.). The thickness of the metal layer was calculated by image processing, and the average value was calculated by taking values at 10 points. Similarly, when the core material was a metal wire, the measurement was performed by observing the cross section of the core material in the cured resin with a scanning electron microscope. At that time, the thickness of the outermost low melting point metal layer was determined as the thickness of the metal layer.
[0230]
(5) Coverage of plastic wire, metal wire and metal tube
Similar to the measurement of the average wire diameter, after the metal-coated core material is poured into the casting epoxy resin and cured, the surface of the casting resin is polished until the core material portion is exposed, and a scanning electron microscope ( (S-4700, manufactured by Hitachi, Ltd.). The coverage of the wire with the metal was calculated by image processing, and the average value of the values at 10 points was obtained.
[0231]
(6) Softening temperature of resin composition
The Vicat softening temperature of the resin composition was measured based on JIS K-7206.
[0232]
(7) MI
Based on JIS K-7210, MI of the resin composition was measured by a manual cutting method at a measurement temperature of 125 ° C. and a test load of 3.2 N.
[0233]
(8) Curing temperature of resin composition
Using a differential scanning calorimeter (DSC-2, manufactured by Perkin-Elmer Co., Ltd.), the calorimetry was performed at a heating rate of 5 ° C./min, and the temperature at the peak of the heat generation was defined as the curing temperature.
[0234]
(9) Application thickness of resin composition
Using a thickness gauge (PDS-2) manufactured by Peacock Co., Ltd., the average value of the five values was taken.
[0235]
(10) Moisture permeability
In accordance with JIS K-7129 (humidity sensor method), two 0.7 mm-thick soda glasses are sealed with a sealing material, a humidity difference is provided inside and outside the sealing material of the sample, and sealing at room temperature is performed. The change in the amount of water vapor inside and outside the stopper was measured by a humidity sensor. The moisture permeability was calculated by quantifying the amount of water vapor that moved from the high humidity side to the low humidity side during 24 hours.
[0236]
(11) Adhesive strength
According to the conditions of each Example and Comparative Example, a space between two 0.7 mm thick soda glasses was sealed with a sealing material, and peeled off using a rheometer (NRM-3002D-H, manufactured by Fudo Kogyo Co., Ltd.). The shear bond strength at a speed of 50 mm / min was measured.
[0237]
(12) Dark spot area ratio
The light emitting surface of the organic EL element was observed at a magnification of 800 times with an optical microscope (BH-2, manufactured by Olympus Corporation) equipped with a CCD camera. The dark spot area ratio was measured by binarizing the obtained image by image processing.
[0238]
(Experiment A1) First, a sample was prepared under the conditions shown in Table 1. That is, a polystyrene pellet SD120 (manufactured by Asahi Kasei Kogyo Co., Ltd., elastic modulus: 1.8 GPa) was heated and melted to a melting point or higher, and then gradually cooled to obtain a gel-like spherulite. A sheet having a thickness of 5 mm obtained by compression-molding the aggregate was super-stretched through a die having a diameter of 1 mm to obtain a polystyrene plastic wire having an average wire diameter of 1 mm and a length of 0.1 m. After subjecting the obtained polystyrene wire to a seeder treatment with palladium chloride, a nickel layer of 0.2 μm was deposited in an electroless nickel plating solution. Thereafter, electrolytic plating was performed by a conventional method in a eutectic solder plating bath of In / Cd = 74/26 until the thickness of the solder coating layer became 100 μm. The solder-coated polystyrene wire thus obtained was placed around a 25 mm × 100 mm soda glass, and heated and melted at 80 ° C. by an epoxy resin composition (Alteco 3500, Arteco 3500, modified epoxy resin / (Modified polyamine = 100/50) was applied to both sides of the solder-coated polystyrene wire with a dispenser so that the ratio of the resin thickness to the wire diameter became 100% (= 1.0 mm). After softening temperature of resin (80 ° C), heat and pressure at 1 Mpa for 10 minutes, another glass is bonded face to face, and heat and pressure at 120 ° C, 3 Mpa for 10 minutes to harden the resin and bond strength A sample for measurement was used. On the other hand, solder-coated polystyrene wires were arranged on four sides on a 100 mm × 100 mm soda glass, and the resin thickness was 1.times. On both sides of the solder-coated polystyrene wires so that the total width of the resin layer and the solder-coated polystyrene wires was 2 mm. 0 mm of the epoxy resin composition was applied. Thereafter, the resin was heated and pressed at a softening temperature (80 ° C.) of 1 Mpa for 10 minutes, then another piece of soda glass was bonded, and the resin was heated and pressed at a temperature of 120 ° C. and 3 Mpa for 10 minutes to cure the resin and to measure the moisture permeability. For use as samples. Then, an evaluation test was performed under the conditions shown in Table 1, and the results shown in Table 1 were obtained.
[0239]
(Experiment a1) A sample was prepared under the conditions shown in Table 4. That is, except that the polystyrene wire used in Experiment A1 had a wire diameter of 7 mm, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment A1. Then, an evaluation test was performed under the conditions shown in Table 4, and the results shown in Table 4 were obtained. When this experiment a1 is compared with the experiment example A1, it can be seen that the moisture permeability is high in the experiment a1, and the wire diameter of the plastic wire of 1.0 mm is more suitable than 7.0 mm.
[0240]
(Experiment A2) A sample was prepared under the conditions shown in Table 1. That is, in place of the polystyrene pellets used in Experiment A1, polyethylene (manufactured by Iron and Steel Chemical Co., Ltd., Flowbeads CL12007, average particle size: 1.0 mm) was used, and the average wire diameter was determined by the super-stretching method as in Experiment A1. A polyethylene plastic wire having a length of 2.0 mm and a length of 0.1 m was obtained. After subjecting the obtained wire to a seeder treatment with palladium chloride, a nickel layer of 0.2 μm was deposited in an electroless nickel plating solution. Thereafter, electrolytic plating was performed by a conventional method in a eutectic solder plating bath of Pb / Sn = 5/95 (melting point: 183 ° C.) until the diameter of the solder-coated wire became 3.0 mm. Acrylic resin (Hitachi Chemical Industries, Ltd., TF-3348-15F2G, manufactured by Hitachi Chemical Co., Ltd.) heated and melted at 70 ° C. was used as the resin, and the ratio of the resin thickness to the wire diameter of the resin disposed on soda glass was 125% (= 2). .5 mm), and the resin was cured by 1.0 J / cm instead of heating at the curing temperature in Experiment A1. ² The irradiation was performed in the same manner as in Experiment A1 to prepare a sample for measuring the adhesive force and a sample for measuring the moisture permeability. Then, an evaluation test was performed under the conditions shown in Table 1, and the results shown in Table 1 were obtained.
[0241]
(Experiment a2) A sample was prepared under the conditions shown in Table 4. That is, all the experiments were conducted except that the polyethylene wire having a compression modulus of 0.1 GPa and a wire diameter of 1.0 mm was used instead of the polyethylene wire used in the experiment A2, and the ratio of the resin coating thickness to the wire diameter was 100%. A sample for adhesion and a sample for moisture permeability measurement were prepared in the same manner as in A2. Then, an evaluation test was performed under the conditions shown in Table 4, and the results shown in Table 4 were obtained. When this experiment a2 is compared with experiment A2, it can be seen that in experiment a2, the moisture permeability is high, and that the compression modulus of the core material is more suitable for 0.5 GPa than for 0.10 Gpa.
[0242]
(Experiment A3) A sample was prepared under the conditions shown in Table 1. That is, instead of the polystyrene pellets used in Experiment A1, PMMA pellets (manufactured by Mitsubishi Rayon Co., Ltd., acrylic pellets IRD-50, average particle size 5.0 mm) were used, and the average wire diameter was 5.0 mm and the length was 0.1 mm. A 1-m plastic wire made of PMMA was prepared, and eutectic solder TI / Na = 93.7 / 6.3 (melting point: 238 ° C.) was used instead of In / Cd as the coating metal, and the eutectic solder was fused to the metal. To adjust the solder coating thickness to 3.0 mm with a diamond die. Further, a phenolic resin (phenolic resin PM-8200 manufactured by Sumitomo Bakelite Co., Ltd.) is used instead of the epoxy resin as the resin composition, and the ratio of the thickness of the resin disposed on the soda glass to the wire diameter is 150% (= 7. 5 mm), a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment A1, after heating and pressing at a softening temperature and 120 ° C. as in Experiment A1. Then, an evaluation test was performed under the conditions shown in Table 1, and the results shown in Table 1 were obtained.
[0243]
(Experiment a3) A sample was prepared under the conditions shown in Table 4. That is, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment A3 except that the coating metal used in Experiment A3 was changed to Pb 100%. Then, an evaluation test was performed under the conditions shown in Table 4, and the results shown in Table 4 were obtained. When the experiment a3 is compared with the experiment A3, in the experiment a3, the moisture permeability is high, and the composition of the coating metal is more suitable when the TI / NA is 93.7 / 6.3 than when the lead (Pb) is 100%. You can see that.
[0244]
(Experiment A4) A sample was prepared under the conditions shown in Table 1. That is, a wire having an average wire diameter of 0.5 mm was prepared using 66 nylon pellets (Alamine CM3007, manufactured by Toray Industries, Inc., average particle size 0.5 mm) instead of the polystyrene pellets used in Experiment A1, and the coated metal was coated. Eutectic solder Sn35 / In45 / Bi instead of In / Cd ₂ The eutectic solder was coated on the wire by fusing a metal using O (melting point 98 ° C.), and the thickness of the solder coating was adjusted to 1.0 mm using a diamond die. Further, a melamine resin (Melan 523 manufactured by Hitachi Chemical Co., Ltd.) was used instead of the epoxy resin as the resin composition, and the ratio of the thickness of the resin disposed on the soda glass to the wire diameter was 100% (= 0.5 mm). In the same manner as in Experiment A1, a bonding sample and a moisture permeability measurement sample were prepared through heating and pressing at a softening temperature and 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 1, and the results shown in Table 1 were obtained.
[0245]
(Experiment a4) A sample was prepared under the conditions shown in Table 4. That is, except that the thickness of the metal used in Experiment A4 was changed to 7 mm, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment A4. Then, an evaluation test was performed under the conditions shown in Table 4, and the results shown in Table 4 were obtained. When this experiment a4 is compared with experiment A4, it can be seen that the adhesive force is low in experiment a4, and that a metal thickness of 1.0 mm is more suitable than 7.0 mm.
[0246]
(Experiment A5) A sample was prepared under the conditions shown in Table 1. That is, instead of the polystyrene pellets used in Experiment A1, a 10 mm-diameter wire was produced using polyester pellets (Siveras L204G35, average particle size 0.3 mm, manufactured by Toray Industries, Inc.), and instead of In / Cd. Eutectic solder Sn / In = 48/52 (melting point 117 ° C.) was coated to a thickness of 0.05 mm. As the resin composition, xylene / acrylic resin = 80/20 instead of epoxy resin (xylene resin: Nikonol HP-100, manufactured by Mitsubishi Gas Chemical Co., Ltd., acrylic resin: HTR-860P-3, manufactured by Teikoku Chemical Industry Co., Ltd.) ), So that the ratio of the resin thickness to the wire diameter arranged on the soda glass is 80% (= 8 mm), and after the softening temperature and the heating and pressing at 120 ° C., as in Experiment A1, A sample for adhesion and a sample for moisture permeability measurement were prepared in the same manner as in Experiment A1. Then, an evaluation test was performed under the conditions shown in Table 1, and the results shown in Table 1 were obtained.
[0247]
(Experiment a5) A sample was prepared under the conditions shown in Table 4. That is, an adhesion sample and a moisture permeability measurement sample were produced in the same manner as in Experiment A5 except that the coverage of the plastic wire with the low melting point metal used in Experiment A5 was set to 40%. Then, an evaluation test was performed under the conditions shown in Table 4, and the results shown in Table 4 were obtained. When this experiment a5 is compared with experiment A5, it can be seen that the moisture permeability is high in experiment a5, and that the coverage of the plastic wire with the metal of 99% is more suitable than 40%.
[0248]
(Experiment A6) A sample was prepared under the conditions shown in Table 1. That is, instead of the polystyrene pellets used in Experiment A1, a wire having a wire diameter of 0.5 mm was prepared using polypropylene pellets (Noblen H501, manufactured by Sumitomo Chemical Co., Ltd., average particle size 0.03 mm), and In / Cd Is replaced by a eutectic solder Bi / Cd = 60/40 (melting point: 144 ° C.), and as a resin composition, polyester resin / crosslinking agent = 100/2 instead of epoxy resin (polyester resin: Toyobo Co., Ltd.) Manufactured by Byron VG700, cross-linking agent: Nippon Polyurethane Co., Ltd., Coronate L), so that the ratio of the resin thickness to the wire diameter arranged on the soda glass is 100% (= 0.5 mm). Then, in the same manner as in Experiment A1, a sample for bonding and a sample for measuring moisture permeability were produced through heating and pressing at a softening temperature and 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 1, and the results shown in Table 1 were obtained.
[0249]
(Experiment a6) A sample was prepared under the conditions shown in Table 4. That is, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment A6 except that the wire diameter of the plastic wire used in Experiment A6 was changed to 0.03 mm. Then, a characteristic test was performed under the conditions shown in FIG. 15, and the results shown in FIG. 15 were obtained. When this experiment a6 is compared with experiment A6, it can be seen that moisture permeability is high in experiment a6, and 0.5 mm is more suitable as the plastic wire diameter than 0.03 mm.
[0250]
(Experiment A7) A sample was prepared under the conditions shown in Table 1. That is, instead of the polystyrene pellets used in Experiment A1, polyvinyl chloride pellets (Ryuron paste 772, manufactured by Tosoh Corporation, average particle size 0.05 mm) were used to produce a wire having a wire diameter of 1 mm, and the In / Eutectic solder Pb / Sn = 5/95 (melting point: 183 ° C.) is coated instead of Cd, and an acrylic resin (moisture-proof insulating material TF-3348, manufactured by Hitachi Chemical Co., Ltd.) is used instead of an epoxy resin as a resin composition. -15F2), the ratio of resin thickness to wire diameter on the soda glass is 100% (= 1.0 mm), and curing of the resin is 2.4 J / cm instead of heating in experiment A1. ² The irradiation was performed by UV irradiation, and a sample for adhesion and a sample for moisture permeability measurement were prepared in the same manner as in Experiment A1. Then, an evaluation test was performed under the conditions shown in Table 1, and the results shown in Table 1 were obtained.
[0251]
(Experiment a7) A sample was prepared under the conditions shown in Table 4. That is, except that the ratio of the resin thickness to the wire used to apply the resin to the substrate used in Experiment A7 to the wire diameter was set to 500% (= 5.0 mm), the bonding sample and the moisture permeability measurement sample were all the same as in Experiment A7. Produced. Then, an evaluation test was performed under the conditions shown in Table 4, and the results shown in Table 4 were obtained. When this experiment a7 is compared with experiment A7, it can be seen that moisture permeability is high in experiment a7, and that the thickness of the resin applied to the substrate is 1.0 mm is more suitable than 5.0 mm.
[0252]
(Experiment A8) A sample was prepared under the conditions shown in Table 1. That is, instead of the polystyrene pellets used in Experiment A1, 6-nylon pellets (Alamine CM1007, manufactured by Toray Industries, Inc., average particle size: 0.5 mm) were used to prepare a wire having a wire diameter of 0.2 mm, and In / Cd Instead of eutectic solder In / Zn = 97.2 / 2.8 (melting point: 144 ° C.). The ratio of the resin thickness to the wire diameter on the soda glass was assumed to be 100% (= 200 μm), and the other conditions were the same as in Experiment A1, except for the softening temperature and the heating and pressing at 120 ° C. A sample for humidity measurement was prepared. Then, an evaluation test was performed under the conditions shown in Table 1, and the results shown in Table 1 were obtained.
[0253]
(Experiment a8) A sample was prepared under the conditions shown in Table 4. That is, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment A8, except that the temperature at which the resin composition used in Experiment A8 was cured was set to 215 ° C. Then, an evaluation test was performed under the conditions shown in Table 4, and the results shown in Table 4 were obtained. When this experiment a8 is compared with experiment A8, in experiment a8, an abnormality that the EL element was changed to black was observed, and it was found that the EL element was oxidized and corroded. Therefore, it is understood that the curing temperature of the resin composition is more preferably 120 ° C. than 215 ° C.
[0254]
(Experiment A9) A sample was prepared under the conditions shown in Table 1. That is, instead of the polystyrene pellets used in Experiment A1, 6-nylon pellets (Alamine CM1007, manufactured by Toray Industries, Inc., average particle size: 0.5 mm) were used to prepare a wire having a wire diameter of 0.2 mm, and In / Cd Was replaced with eutectic solder Sn / In = 48/62 (melting point 117 ° C.) to obtain a strip member. After applying the same epoxy resin as in Experiment A1 with a resin thickness of 0.2 mm on soda glass, a strip member is placed on the resin, and otherwise the same as in Experiment A1, the softening temperature and heating at 120 ° C. After pressing, a sample for adhesion and a sample for moisture permeability measurement were prepared. Then, an evaluation test was performed under the conditions shown in Table 1, and the results shown in Table 1 were obtained.
[0255]
(Experiment B1) A sample was prepared under the conditions shown in Table 2. That is, the metallic copper ingot was melted at 1100 ° C., and the melt was jetted from the nozzle into the inside of the rotating drum storing water. The solidified copper fiber was wound inside the drum by centrifugal force to produce a copper wire having a wire diameter of 1.5 mm and a length of 1 m. Electrolytic plating was performed on the obtained copper wire by a conventional method in a eutectic solder plating bath of In / Cd = 74/26 until the diameter of the solder-coated wire became 1.2 mm. The solder-coated copper wire thus obtained was placed around a 25 mm × 100 mm soda glass, and heated and melted at 80 ° C. by an epoxy resin composition (Alteco 3500, manufactured by Alpha Giken, modified epoxy resin / (Modified polyamine = 100/50) was applied to the substrate on both sides of the solder-coated copper wire with a dispenser so that the ratio of the resin thickness to the wire diameter became 150% (= 1.5 mm). After softening temperature (80 ° C) of resin and heating and pressing at 1 Mpa for 10 minutes, another glass is bonded so that it faces each other, and the resin is hardened by heating and pressing at 120 ° C and 3 Mpa for 10 minutes. And a sample for measuring adhesive strength. On the other hand, solder-coated copper wires are arranged on four sides of a 100 mm × 100 mm soda glass, and the epoxy resin composition is applied to a 1.0 mm resin so that the total width of the resin layer and the solder-coated copper wires becomes 2 mm. Thick and coated on both sides of the solder coated copper wire. Then, after heating and pressing at a softening temperature (80 ° C.) and 1 Mpa for 10 minutes, another piece of soda glass is bonded, and the resin is cured by heating and pressing at 120 ° C. and 3 Mpa for 10 minutes to cure the resin. Samples were used. Then, an evaluation test was performed under the conditions shown in Table 2, and the results shown in Table 2 were obtained.
[0256]
(Experiment b1) A sample was prepared under the conditions shown in Table 5. That is, except that the copper wire having a wire diameter of 0.01 mm was used instead of the copper wire used in the experiment B1, and the ratio of the resin thickness to the wire diameter was set to 100% (= 0.01 mm), all of the experiment B1 was performed. Similarly, a sample for adhesion and a sample for moisture permeability measurement were prepared. Then, an evaluation test was performed under the conditions shown in Table 5, and the results shown in Table 5 were obtained. When this experiment b1 is compared with experiment B1, in experiment b1, the moisture permeability is increased and the adhesive strength is also weakened. It can be seen that 1.0 mm is more suitable as the wire diameter of the metal wire than 0.01 mm. .
[0257]
(Experiment B2) A sample was prepared under the conditions shown in Table 2. That is, a stainless wire having an average wire diameter of 0.5 mm and a length of 1.0 m was obtained in the same manner as in Experiment B1, except that stainless steel was used instead of the metal copper used in Experiment B1. Electrolytic plating was performed on the obtained wire in a eutectic solder plating bath of Pb / Sn = 5/95 (melting point: 183 ° C.) until the diameter of the solder-coated wire became 1.5 mm by a conventional method. . Acrylic resin heated and melted at 70 ° C. (Hitachi Chemical Industry Co., Ltd., moisture-proof insulating material TF-3348-15F2G) was used as the resin, and the ratio of the resin thickness to the wire diameter of the resin disposed on the soda glass was 200% (= 1 mm). ), And the curing of the resin is changed to 1.0 J / cm in place of the heating in Experiment A1. ² , And a sample for measuring the adhesive force and a sample for measuring the moisture permeability were prepared in the same manner as in Experiment B1. Then, an evaluation test was performed under the conditions shown in Table 2, and the results shown in Table 2 were obtained.
[0258]
(Experiment b2) A sample was prepared under the conditions shown in Table 5. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment B2 except that the composition of the eutectic solder used in Experiment B2 was changed to 100% of Pb. Then, an evaluation test was performed under the conditions shown in Table 5, and the results shown in Table 5 were obtained. When this experiment b2 is compared with the experiment B2, it is understood that the moisture permeability is high in the experiment b2, and that the composition of the coating metal is more suitable for Pb / Sn = 5/95 than for Pb 100%.
[0259]
(Experiment B3) A sample was prepared under the conditions shown in Table 2. That is, an iron wire having an average wire diameter of 10 mm and a length of 1.0 m was obtained in the same manner as in Experiment B1, except that iron was used instead of the metallic copper used in Experiment B1. The eutectic solder was fused onto the obtained wire using a eutectic solder Bi / In = 67/33 (melting point 109 ° C.) so that the diameter of the coated wire became 16 mm. A solder-coated iron wire was placed around a 25 mm × 100 mm soda glass, and a phenol resin (Sumitomo Bakelite Co., Ltd. phenolic resin PM-8200) heated and melted at 70 ° C. was coated on both sides of the solder-coated iron wire with a pair of wires having a resin thickness. The coating was performed so that the diameter ratio became 100% (= 10 mm). Hereinafter, in the same manner as in Experiment B1, a sample for measuring the adhesive force and a sample for measuring the moisture permeability were prepared through the softening temperature of the resin and the heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 2, and the results shown in Table 2 were obtained.
[0260]
(Experiment b3) A sample was prepared under the conditions shown in Table 5. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment B3 except that the thickness of the low melting point metal layer used in Experiment B3 was changed to 7.0 mm. Then, an evaluation test was performed under the conditions shown in Table 5, and the results shown in Table 5 were obtained. When this experiment b3 is compared with the experiment B3, it is found that the moisture permeability is high in the experiment b3, and that the thickness of the covering metal layer is more suitable for 3.0 mm than for 7.0 mm.
[0261]
(Experiment B4) A sample was prepared under the conditions shown in Table 2. That is, an aluminum wire having an average wire diameter of 1.0 mm and a length of 1.0 m was obtained in the same manner as in Experiment B1, except that aluminum was used instead of the metal copper used in Experiment B1. Eutectic solder Sn35 / In45 / Bi on the obtained wire ₂ The eutectic solder was fused using O (melting point 98 ° C.) so that the diameter of the coated wire was 3.0 mm. Melamine resin (Melan 523, manufactured by Hitachi Chemical Co., Ltd.) heated and melted at 70 ° C. was placed on soda glass, and the ratio of resin thickness to wire diameter was set to 100% (= 1.0 mm). Similarly, a sample for measuring the adhesive force and a sample for measuring the moisture permeability were prepared through the softening temperature of the resin and the heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 2, and the results shown in Table 2 were obtained.
[0262]
(Experiment b4) A sample was prepared under the conditions shown in Table 5. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment B4 except that the coverage of the metal-coated aluminum wire used in Experiment B4 was changed to 40%. Then, an evaluation test was performed under the conditions shown in Table 5, and the results shown in Table 5 were obtained. When this experiment b4 is compared with the experiment B4, it is understood that the moisture permeability is high in the experiment b4, and that the coverage of the aluminum wire with the metal of 100% is more suitable than that of 40%.
[0263]
(Experiment B5) A sample was prepared under the conditions shown in Table 2. That is, nickel was used instead of metallic copper used in Experiment B1, and a nickel wire having an average wire diameter of 1.0 mm and a length of 1.0 m was obtained in the same manner as in Experiment B1. The obtained wire is coated with eutectic solder Sn / In = 48/52 (melting point 117 ° C.), and as a resin composition, xylene / acrylic resin = 80/20 (xylene resin: Mitsubishi Gas Chemical Co., Ltd.) Manufactured by Nicanol HP-100, acrylic resin: HTR-860P-3 manufactured by Teikoku Chemical Industry Co., Ltd.). The resin was placed on the soda glass so that the ratio of the thickness of the resin to the wire diameter was 100% (= 1.0 mm). And a sample for moisture permeability measurement were prepared. Then, an evaluation test was performed under the conditions shown in Table 2, and the results shown in Table 2 were obtained.
[0264]
(Experiment b5) A sample was prepared under the conditions shown in Table 5. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment B5 except that the metal wire used in Experiment B5 was replaced with lead having a wire diameter of 10 mm and the resin thickness was changed to 10 mm. Then, an evaluation test was performed under the conditions shown in Table 5, and the results shown in Table 5 were obtained. When this experiment b5 is compared with the experiment B5, in the experiment b5, an abnormality such as a broken wire was found. Accordingly, it can be seen that the type and diameter of the metal wire are more suitable for a nickel wire having a wire diameter of 1.0 mm than a lead wire having a wire diameter of 10 mm.
[0265]
(Experiment B6) A sample was prepared under the conditions shown in Table 2. That is, stainless steel was used instead of the metallic copper used in Experiment B1, and a stainless wire having an average wire diameter of 0.5 mm and a length of 1.0 m was obtained in the same manner as in Experiment B1. Eutectic solder Bi / Cd = 60/40 (melting point: 144 ° C.) was coated on the obtained wire. Further, as the resin composition, polyester resin / crosslinking agent = 100/2 (polyester resin: manufactured by Toyobo Co., Ltd., Byron VG700, crosslinking agent: Nippon Polyurethane Co., Ltd., Coronate L) was used. Adhesion was performed through the softening temperature of the resin and the heating and pressing at 120 ° C. in the same manner as in Experiment B1 so that the ratio of the resin thickness to the wire diameter arranged on the soda glass was 100% (= 0.5 mm). And a sample for moisture permeability measurement were prepared. Then, an evaluation test was performed under the conditions shown in Table 2, and the results shown in Table 2 were obtained.
[0266]
(Experiment b6) A sample was prepared under the conditions shown in Table 5. That is, a bonding sample and a moisture permeability measurement sample were produced in the same manner as in Experiment B1, except that the metal wire used in Experiment B1 was a copper wire having a wire diameter of 30 mm and the resin thickness was 30 mm. Then, an evaluation test was performed under the conditions shown in Table 5, and the results shown in Table 5 were obtained. When this experiment b6 is compared with the experiment B1, it is understood that the moisture permeability is high in the experiment b6, and the wire diameter of the metal wire is more suitable for the wire diameter of 1.0 mm than for the wire diameter of 30.0 mm. .
[0267]
(Experiment B7) A sample was prepared under the conditions shown in Table 2. That is, stainless steel was used instead of the metallic copper used in Experiment B1, and a stainless wire having an average wire diameter of 0.5 mm and a length of 1.0 m was obtained in the same manner as in Experiment B1. The obtained wire is coated with eutectic solder Pb / Sn = 5/95 (melting point: 183 ° C.), and an acrylic resin (a moisture-proof insulating material TF-3348- manufactured by Hitachi Chemical Co., Ltd.) is used as a resin composition. 15F2) was used. The ratio of the resin thickness to the wire diameter on the soda glass was 140% (= 0.7 mm), and the curing of the resin was 2.4 J / cm instead of the heating in Experiment B1. ² , And a sample for adhesion and a sample for moisture permeability measurement were prepared in the same manner as in Experiment B1. Then, an evaluation test was performed under the conditions shown in Table 2, and the results shown in Table 2 were obtained.
[0268]
(Experiment b7) A sample was prepared under the conditions shown in Table 5. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment B3 except that the thickness of the coating metal layer used in Experiment B3 was changed to 0.0005 mm. Then, an evaluation test was performed under the conditions shown in Table 5, and the results shown in Table 5 were obtained. When this experiment b7 is compared with experiment B3, it can be seen that in experiment b7, the moisture permeability is high, and that the thickness of the coating metal layer is 0.3 mm is more suitable than 0.0005 mm.
[0269]
(Experiment B8) A sample was prepared under the conditions shown in Table 2. That is, stainless steel was used instead of the metallic copper used in Experiment B1, and a stainless wire having an average wire diameter of 0.5 mm and a length of 1.0 m was obtained in the same manner as in Experiment B1. The obtained wire is coated with eutectic solder In / Zn = 97.2 / 2.8 (melting point: 144 ° C.), and the same epoxy resin as in Experiment B1 is used as a resin composition, and is placed on soda glass. The ratio of the resin thickness to the wire diameter was set to 100% (= 0.5 mm), and the sample for bonding and the measurement of moisture permeability were passed through the softening temperature of the resin and the heating and pressing at 120 ° C. as in Experiment B1. A sample was prepared. Then, an evaluation test was performed under the conditions shown in Table 2, and the results shown in Table 2 were obtained.
[0270]
(Experiment b8) A sample was prepared under the conditions shown in Table 5. That is, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment B8 except that the temperature at which the resin composition used in Experiment B8 was cured was set to 215 ° C. Then, an evaluation test was performed under the conditions shown in Table 5, and the results shown in Table 5 were obtained. When this experiment b8 is compared with experiment B8, in experiment b8, an abnormality was observed in which the EL element turned black, and it was found that the EL element was oxidized and corroded. Therefore, it is understood that the curing temperature of the resin composition is more preferably 120 ° C. than 215 ° C.
[0271]
(Experiment C1) A sample was prepared under the conditions shown in Table 3. That is, in the same manner as in Experiment B1, the metallic copper ingot was melted at 1100 ° C., and the melt was ejected from the nozzle into the inside of the rotating drum storing water. However, by making the cross-sectional shape of the nozzle opening circular, a copper wire having a hollow structure was obtained as the core material instead of the copper wire of Experiment B1. Next, the solidified hollow copper wire (copper wire) was wound around the inside of the drum by centrifugal force to produce a copper wire having a wire diameter of 1 mm, a wall thickness of 0.1 mm, and a length of 1 m. Electrolytic plating was performed on the obtained copper tube in a eutectic solder plating bath of In / Cd = 74/26 until the diameter of the solder-coated copper tube became 1.2 mm in the same manner as in Experiment B1. did. The solder-coated copper tube wire thus obtained was placed around a 25 mm × 100 mm soda glass, and heated and melted at 80 ° C. by an epoxy resin composition (Alteco 3500, manufactured by Alpha Giken, modified epoxy resin). Resin / modified polyamine = 100/50) was applied to both sides of the solder-coated copper tube with a dispenser so that the ratio of resin thickness to wire diameter was 100% (= 1.0 mm). After softening temperature (80 ° C) of resin and heating and pressing at 1 Mpa for 10 minutes, another glass is bonded so that it faces each other, and the resin is hardened by heating and pressing at 120 ° C and 3 Mpa for 10 minutes. And a sample for measuring adhesive strength. On the other hand, solder-coated copper tubes are arranged on four sides of a 100 mm × 100 mm soda glass, and the epoxy resin composition is solder-coated so that the total width of the resin layer and the solder-coated copper tubes becomes 2 mm. It was applied on the substrates on both sides of the copper tube with a resin thickness of 1.0 mm. Then, after heating and pressing at 80 ° C. and 1 Mpa for 10 minutes, another piece of soda glass was bonded and heated and pressed at 100 ° C. and 3 Mpa for 60 minutes to obtain a sample for moisture permeability measurement. Then, an evaluation test was performed under the conditions shown in Table 3, and the results shown in Table 3 were obtained.
[0272]
(Experiment c1) A sample was prepared under the conditions shown in Table 6. That is, except that the wire diameter of the copper wire used in Experiment C1 was changed to 0.04 mm and the wall thickness was changed to 0.01 mm, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment C1. Then, an evaluation test was performed under the conditions shown in Table 6, and the results shown in Table 6 were obtained. When the experiment c1 is compared with the experiment C1, in the experiment c1, the moisture permeability is high, the adhesive strength is weak, and the wire diameter of the metal tube having a wire diameter of 1.0 mm and the wall thickness of 0.1 mm is 0.04 mm. It can be seen that the thickness is more suitable than 0.01 mm.
[0273]
(Experiment C2) A sample was prepared under the conditions shown in Table 3. That is, stainless steel was used in the same manner as in Experiment C1, except that stainless steel was used instead of the metallic copper used in Experiment C1, and a stainless steel wire having an average wire diameter of 0.5 mm, a wall thickness of 0.05 mm, and a length of 1.0 m was obtained. Electrolytic plating was performed on the obtained wire by a conventional method in a eutectic solder plating bath of Pb / Sn = 5/95 (melting point: 183 ° C.) until the diameter of the solder-coated tube wire became 1.5 mm. did. The wire thus obtained was placed around the periphery of soda glass, and heated to 70 ° C. and melted with an acrylic resin (Hitachi Chemical Industries, Ltd., moisture-proof insulating material TF-3348-15F2G). It was applied to both sides of the wire so that the diameter ratio became 100% (= 0.5 mm), and the curing of the resin was changed to 1.0 J / cm instead of the heating in Experiment C1. ² , And a sample for measuring the adhesive force and a sample for measuring the moisture permeability were prepared in the same manner as in Experiment C1. Then, an evaluation test was performed under the conditions shown in Table 3, and the results shown in Table 3 were obtained.
[0274]
(Experiment c2) A sample was prepared under the conditions shown in Table 6. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment C2 except that the composition of the eutectic solder used in Experiment C2 was changed to Pb 100%. Then, an evaluation test was performed under the conditions shown in Table 6, and the results shown in Table 6 were obtained. When this experiment c2 is compared with experiment C2, it can be seen that the moisture permeability is high in experiment c2, and that the composition of the coating metal is more suitable for Pb / Sn = 5/95 than for Pb 100%.
[0275]
(Experiment C3) A sample was prepared under the conditions shown in Table 3. That is, iron was used instead of the metallic copper used in the experiment C1, and an iron tube wire having an average wire diameter of 10 mm, a wall thickness of 0.5 mm, and a length of 1.0 m was obtained in the same manner as the experiment C1. Eutectic solder Bi / In = 67/33 (melting point 109 ° C.) was fused to the obtained iron tube, and the eutectic solder was coated so that the diameter of the tube became 16 mm. A phenol resin heated and melted at 70 ° C. (Phenol resin PM-8200 manufactured by Sumitomo Bakelite Co., Ltd.) was used as the resin, and the resin was placed in the same manner as in Experiment C1 except that the thickness of the resin disposed on the substrate was 10 mm. After passing through a softening temperature of 120 ° C. and heating and pressing at 120 ° C., a sample for measuring an adhesive force and a sample for measuring a moisture permeability were prepared. Then, an evaluation test was performed under the conditions shown in Table 3, and the results shown in Table 3 were obtained.
[0276]
(Experiment c3) A sample was prepared under the conditions shown in Table 6. That is, except that the thickness of the metal layer of the low melting point metal used in Experiment C3 was changed to 7.0 mm, a sample for adhesion and a sample for moisture permeability measurement were produced in the same manner as in Experiment C3. Then, an evaluation test was performed under the conditions shown in Table 6, and the results shown in Table 6 were obtained. When the experiment c3 is compared with the experiment C3, it is found that the moisture permeability is high in the experiment c3, and that the thickness of the metal layer of the low melting point metal is more suitable for 3.0 mm than for 7.0 mm.
[0277]
(Experiment C4) A sample was prepared under the conditions shown in Table 3. That is, an aluminum tube wire having an average wire diameter of 1.0 mm, a pipe wall thickness of 0.2 mm, and a length of 1.0 m was obtained in the same manner as in Experiment C1, except that aluminum was used instead of the metal copper used in Experiment C1. . Eutectic solder Sn35 / In45 / Bi was added to the obtained tube wire. ₂ O (melting point 98 ° C.) was fused and covered with a eutectic solder so that the diameter of the tube wire was 3.0 mm. Melamine resin heated and melted at 70 ° C. (Melan 523 manufactured by Hitachi Chemical Co., Ltd.) was used as the resin, and the ratio of the thickness of the resin disposed on the substrate to the wire diameter was set to 100% (= 1.0 mm). In the same manner as in Experiment C1, a sample for measuring an adhesive force and a sample for measuring a moisture permeability were prepared through heating and pressing at a softening temperature and 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 3, and the results shown in Table 3 were obtained.
[0278]
(Experiment c4) A sample was prepared under the conditions shown in Table 6. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment C4 except that the coverage of the metal-coated aluminum tube wire used in Experiment C4 was changed to 40%. Then, an evaluation test was performed under the conditions shown in Table 6, and the results shown in Table 6 were obtained. When this experiment c4 is compared with the experiment C4, it is understood that the moisture permeability is high in the experiment c4, and that the coverage of the aluminum tube wire with the metal of 100% is more suitable than 40%.
[0279]
(Experiment C5) A sample was prepared under the conditions shown in Table 3. That is, a nickel tube wire having an average wire diameter of 1.0 mm, a wall thickness of 0.1 mm, and a length of 1.0 m was obtained in the same manner as in Experiment C1, except that nickel was used instead of the metallic copper used in Experiment C1. The obtained tube wire is covered with eutectic solder Sn / In = 48/52 (melting point 117 ° C.), and as a resin composition, xylene / acrylic resin = 80/20 (xylene resin: manufactured by Mitsubishi Gas Chemical Co., Ltd.) , Nicanol HP-100, acrylic resin: HTR-860P-3, manufactured by Teikoku Chemical Industry Co., Ltd.) Substrates on both sides of the wire such that the ratio of the resin thickness to the wire diameter becomes 100% (= 1.0 mm). The sample for adhesion and the sample for moisture permeability measurement were produced by being placed on the upper side and subjecting to heating and pressing at a softening temperature and 120 ° C. as in Experiment C1. Then, an evaluation test was performed under the conditions shown in Table 3, and the results shown in Table 3 were obtained.
[0280]
(Experiment c5) A sample was prepared under the conditions shown in Table 6. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment C5 except that the metal tube wire used in Experiment C5 was a lead tube wire having a wire diameter of 10 mm. Then, an evaluation test was performed under the conditions shown in Table 6, and the results shown in Table 6 were obtained. When the experiment c5 is compared with the experiment C5, in the experiment c5, an abnormality such as a broken wire was found. Therefore, it can be seen that the type and wire diameter of the metal tube wire are more suitable for a nickel wire having a wire diameter of 1.0 mm than a lead wire having a wire diameter of 10 mm.
[0281]
(Experiment C6) A sample was prepared under the conditions shown in Table 3. That is, stainless steel was used instead of metallic copper used in Experiment C1, and a stainless steel wire having an average wire diameter of 0.5 mm, a wall thickness of 0.1 mm, and a length of 1.0 m was obtained in the same manner as in Experiment C1. The obtained tube wire is coated with eutectic solder Bi / Cd = 60/40 (melting point 144 ° C.), and as a resin composition, polyester resin / crosslinking agent = 100/2 (polyester resin: manufactured by Toyobo Co., Ltd.) Experiments were performed using Byron VG700, a cross-linking agent: Nippon Polyurethane Co., Ltd., Coronate L)) so that the ratio of the thickness of the resin disposed on the soda glass to the wire diameter became 100% (= 0.5 mm). Similarly to C1, a sample for bonding and a sample for measuring moisture permeability were prepared through heating and pressing at a softening temperature and 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 3, and the results shown in Table 3 were obtained.
[0282]
(Experiment c6) A sample was prepared under the conditions shown in Table 6. That is, except that the thickness of the tubular copper wire used in the experiment C1 was 0.005 mm, a sample for adhesion and a sample for moisture permeability measurement were produced in the same manner as in the experiment C1. Then, an evaluation test was performed under the conditions shown in Table 6, and the results shown in Table 6 were obtained. When this experiment c6 is compared with the experiment C1, the moisture permeability becomes high in the experiment c6, and the wall thickness of the metal wire tube is more suitable for the metal wire tube having the wall thickness of 0.1 mm than the wall thickness of the metal wire tube being 0.005 mm. I understand that there is.
[0283]
(Experiment C7) A sample was prepared under the conditions shown in Table 3. That is, stainless steel was used instead of metallic copper used in Experiment C1, and a stainless steel wire having an average wire diameter of 0.5 mm, a wall thickness of 0.1 mm, and a length of 1.0 m was obtained in the same manner as in Experiment C1. The obtained tube wire is coated with eutectic solder Pb / Sn = 5/95 (melting point: 183 ° C.), and as a resin composition, an acrylic resin (manufactured by Hitachi Chemical Co., Ltd., moisture-proof insulating material TF-3348-) Using 15F2), the wires were arranged on the substrate on both sides of the wires such that the ratio of the resin thickness to the wire diameter became 140% (= 0.7 mm). The curing of the resin was 2.4 J / cm instead of heating in experiment C1. ² Was performed by UV irradiation, and otherwise the same as in Experiment C1, an adhesive sample and a moisture permeability measurement sample were prepared. Then, an evaluation test was performed under the conditions shown in Table 3, and the results shown in Table 3 were obtained.
[0284]
(Experiment c7) A sample was prepared under the conditions shown in Table 6. That is, except that the coating metal layer used in Experiment C3 was formed to a thickness of 0.0005 mm by electrolytic plating, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment C3. Then, an evaluation test was performed under the conditions shown in Table 6, and the results shown in Table 6 were obtained. When the experiment c7 is compared with the experiment C3, it is found that the moisture permeability is high in the experiment c7, and that the thickness of the coating metal layer is more suitable for 0.3 mm than for 0.0005 mm.
[0285]
(Experiment C8) A sample was prepared under the conditions shown in Table 3. That is, stainless steel was used instead of metallic copper used in Experiment C1, and a stainless steel wire having an average wire diameter of 0.5 mm, a wall thickness of 0.1 mm, and a length of 1.0 m was obtained in the same manner as in Experiment C1. The obtained tube wire was coated with eutectic solder In / Zn = 97.2 / 2.8 (melting point: 144 ° C.), and the same epoxy resin as in Experiment C1 was used as a resin composition, and the resin thickness was reduced to the wire length. The sample was placed on the substrate on both sides of the wire so that the diameter ratio became 100% (= 0.5 mm). A measurement sample was prepared. Then, an evaluation test was performed under the conditions shown in Table 3, and the results shown in Table 3 were obtained.
[0286]
(Experiment c8) A sample was prepared under the conditions shown in Table 6. That is, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment C8 except that the temperature at which the resin composition used in Experiment C8 was cured was set to 215 ° C. Then, an evaluation test was performed under the conditions shown in Table 6, and the results shown in Table 6 were obtained. When the experiment c8 is compared with the experiment C8, in the experiment c8, an abnormality was observed in which the EL element turned black, and it was found that the EL element was oxidized and corroded. Therefore, it is understood that the curing temperature of the resin composition is more preferably 120 ° C. than 215 ° C.
[0287]
[Table 1]

[Table 2]

[Table 3]

[Table 4]

[Table 5]

[Table 6]

(Experiment D1) A sample was prepared under the conditions shown in Table 7. That is, a polystyrene pellet SD120 (manufactured by Asahi Kasei Kogyo Co., Ltd., elastic modulus: 1.8 GPa) was heated and melted to a melting point or higher, and then gradually cooled to obtain a gel-like spherulite. A sheet having a thickness of 5 mm obtained by compression-molding the aggregate was super-stretched through a die having a diameter of 1 mm to obtain a polystyrene plastic wire having an average wire diameter of 1 mm and a length of 0.1 m. After subjecting the obtained polystyrene wire to a seeder treatment with palladium chloride, a nickel layer of 0.2 μm was deposited in an electroless nickel plating solution. Thereafter, electrolytic plating was performed by a conventional method in a eutectic solder plating bath of In / Cd = 74/26 until the diameter of the solder-coated wire became 1200 μm. The solder-coated polystyrene wire thus obtained was immersed in an epoxy resin composition (Alteco 3500, manufactured by Alpha Giken, modified epoxy resin / modified polyamine = 100/50) melted by heating at 80 ° C. The sealing material was obtained by welding on the wire until the resin thickness became 10 μm. The obtained sealing material was stuck on the periphery of a 25 mm × 100 mm soda glass, heated and pressed at 1 Mpa for 10 minutes at a softening temperature of the resin (80 ° C.), and then another glass was faced. The resin was bonded by heating and pressing at 120 ° C. and 3 Mpa for 10 minutes to cure the resin, thereby obtaining a sample for measuring adhesive strength. On the other hand, sealing materials were stuck on four sides of a 100 mm × 100 mm soda glass. Then, after softening temperature (80 ° C.), heating and pressing at 1 Mpa for 10 minutes, another piece of soda glass is bonded, and the resin is cured by heating and pressing at 120 ° C., 3 Mpa for 60 minutes, and a sample for moisture permeability measurement And Then, an evaluation test was performed under the conditions shown in Table 7, and the results shown in Table 7 were obtained.
[0288]
(Experiment d1) A sample was prepared under the conditions shown in Table 10. That is, except that the wire diameter of the polystyrene wire used in Experiment D1 was changed to 7 mm, an adhesion sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment D1. Then, an evaluation test was performed under the conditions shown in Table 10, and the results shown in Table 10 were obtained. When this experiment d1 is compared with experiment D1, it can be seen that moisture permeability is high in experiment d1, and that the wire diameter of the plastic wire is 0.1 mm is more suitable than 7 mm.
[0289]
(Experiment D2) A sample was prepared under the conditions shown in Table 7. That is, instead of the polystyrene pellets used in Experiment D1, polyethylene (manufactured by Iron and Steel Chemical Co., Ltd., Flowbeads CL12007, average particle size 1.0 mm) was used, and the average wire diameter was 2 A polyethylene plastic wire having a length of 0.0 mm and a length of 0.1 m was obtained. After subjecting the obtained wire to a seeder treatment with palladium chloride, a 0.2 μm nickel layer was deposited in an electroless nickel plating solution. Thereafter, electrolytic plating was performed by a conventional method in a eutectic solder plating bath of Pb / Sn = 5/95 (melting point: 183 ° C.) until the diameter of the solder-coated wire became 3 mm. The solder-coated polyethylene wire thus obtained is immersed in an acrylic resin (manufactured by Hitachi Chemical Co., Ltd., moisture-proof insulating material TF-3348-15F2G) heated and melted at 70 ° C., so that the resin thickness becomes 25 μm. Until the sealing material was obtained. Thereafter, in the same manner as in Experiment D1, the sealing material was placed on soda glass, and the curing of the resin was changed to 1.0 J / cm instead of the heating in Experiment D1. ² Was carried out by UV irradiation, and otherwise the same procedure as in Experiment D1 was carried out to prepare a sample for measuring adhesive strength and a sample for measuring moisture permeability. Then, an evaluation test was performed under the conditions shown in Table 7, and the results shown in Table 7 were obtained.
[0290]
(Experiment d2) A sample was prepared under the conditions shown in Table 10. That is, except that the polyethylene wire used in Experiment D2 was changed to one having a compression modulus of 0.1 GPa, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment D2. Then, an evaluation test was performed under the conditions shown in Table 10, and the results shown in Table 10 were obtained. When the experiment d2 was compared with the experiment D2, the moisture permeability was high in the experiment d2. It can be seen that the compression modulus of 0.5 GPa is more suitable than 0.10 Gpa.
[0291]
(Experiment D3) A sample was prepared under the conditions shown in Table 7. In other words, instead of the polystyrene pellets used in Experiment D1, PMMA pellets (manufactured by Mitsubishi Rayon Co., Ltd., acrylic pellets IRD-50, average particle size 5.0 mm) were used as core materials with a wire diameter of 5 mm, and as coating metals, Using eutectic solder TI / Na = 93.7 / 6.3 (melting point: 238 ° C.) instead of In / Cd, coating on the wire by fusing metal, and using a diamond die to make the resin thickness 50 μm. Adjusted. Further, as a resin composition, a sealing material was obtained by using a phenol resin (Phenol resin PM-8200 manufactured by Sumitomo Bakelite Co., Ltd.) instead of the epoxy resin. After heating and pressurizing at 120 ° C., a sample for adhesion and a sample for moisture permeability measurement were prepared. Then, an evaluation test was performed under the conditions shown in Table 7, and the results shown in Table 7 were obtained.
[0292]
(Experiment d3) A sample was prepared under the conditions shown in Table 10. That is, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment D3 except that the coating metal used in Experiment D3 was changed to Pb 100%. Then, an evaluation test was performed under the conditions shown in Table 10, and the results shown in Table 10 were obtained. When the experiment d3 was compared with the experiment D3, the moisture permeability was high in the experiment d3. It can be seen that TI / NA = 93.7 / 6.3 is more suitable for the composition of the coating metal than lead (Pb) 100%.
[0293]
(Experiment D4) A sample was prepared under the conditions shown in Table 7. In other words, instead of the polystyrene pellets used in Experiment D1, 66 nylon pellets (Alamine CM3007, manufactured by Toray Industries, Inc., average particle size 0.5 mm) were used as a core material having a wire diameter of 0.5 mm, and as a coating metal, Eutectic solder Sn35 / In45 / Bi instead of In / Cd ₂ Using O (melting point 98 ° C.), the wire was coated by fusion of a metal, and the thickness of the resin was adjusted to 5 μm with a diamond die. Further, a sealing material was obtained by using a melamine resin (Melan 523 manufactured by Hitachi Chemical Co., Ltd.) instead of the epoxy resin as the resin composition. In other respects, in the same manner as in Experiment D1, a sample for bonding and a sample for measuring moisture permeability were produced through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 7, and the results shown in Table 7 were obtained.
[0294]
(Experiment d4) A sample was prepared under the conditions shown in Table 10. That is, except that the thickness of the coated metal used in Experiment D4 was changed to 7 mm, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment D4. Then, an evaluation test was performed under the conditions shown in Table 10, and the results shown in Table 10 were obtained. When this experiment d4 is compared with experiment D4, in experiment d4, the adhesive strength was low, and the substrate was peeled during handling. It can be seen that 1.0 mm is more suitable for the thickness of the coating metal than 7.0 mm.
[0295]
(Experiment D5) A sample was prepared under the conditions shown in Table 7. That is, instead of the polystyrene pellets used in Experiment D1, polyester pellets (Siveras L204G35, manufactured by Toray Industries, Inc., average particle diameter 0.3 mm) were used as core materials having a wire diameter of 10 mm, and In / Cd was used as a coating metal. Instead, a eutectic solder Sn / In = 48/52 (melting point: 117 ° C.) was used to cover with a thickness of 0.05 mm. Further, as the resin composition, xylene / acrylic resin = 80/20 (xylene resin: Nikonol HP-100 manufactured by Mitsubishi Gas Chemical Co., Ltd.), acrylic resin: HTR- manufactured by Teikoku Chemical Industry Co., Ltd. Using 860P-3), a sealing material was prepared so that the resin thickness was 20 μm, and as in Experiment D1, the sealing material was subjected to softening temperature on soda glass and heating and pressing at 120 ° C. for bonding. A sample and a sample for measuring moisture permeability were prepared. Then, an evaluation test was performed under the conditions shown in Table 7, and the results shown in Table 7 were obtained.
[0296]
(Experiment d5) A sample was prepared under the conditions shown in Table 10. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment D5 except that the coverage of the metal-coated plastic wire used in Experiment D5 was changed to 40%. Then, an evaluation test was performed under the conditions shown in Table 10, and the results shown in Table 10 were obtained. When the experiment d5 was compared with the experiment D5, the moisture permeability was high in the experiment d5. It can be seen that 99% is more suitable for covering the plastic wire with metal than 40%.
[0297]
(Experiment D6) A sample was prepared under the conditions shown in Table 7. That is, instead of the polystyrene pellets used in Experiment D1, polypropylene pellets (Noblen H501, manufactured by Sumitomo Chemical Co., Ltd., average particle size 0.03 mm) were used as a core material having a wire diameter of 0.5 mm, and In as a coating metal. A eutectic solder Bi / Cd = 60/40 (melting point: 144 ° C.) was used instead of / Cd to cover the surface with a thickness of 0.015 mm. Further, instead of the epoxy resin, a polyester resin / crosslinking agent = 100/2 (polyester resin: manufactured by Toyobo Co., Byron VG700, crosslinker: Nippon Polyurethane Co., Ltd., Coronate L) is used as the resin composition. Then, a sealing material was prepared so that the resin thickness became 20 μm, and after the softening temperature on soda glass and the heating and pressing at 120 ° C., as in Experiment D1, a sample for bonding and a sample for measuring moisture permeability were formed. A sample was prepared. Then, an evaluation test was performed under the conditions shown in Table 7, and the results shown in Table 7 were obtained.
[0298]
(Experiment d6) A sample was prepared under the conditions shown in Table 10. That is, except that the plastic wire used in Experiment D6 was changed to a wire having a wire diameter of 0.03 mm, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment D6. Then, an evaluation test was performed under the conditions shown in Table 10, and the results shown in Table 10 were obtained. When the experiment d6 was compared with the experiment D6, the moisture permeability was high in the experiment d6. It turns out that the wire diameter of the plastic wire is more suitable for 0.5 mm than for 0.03 mm.
[0299]
(Experiment D7) A sample was prepared under the conditions shown in Table 7. That is, instead of the polystyrene pellets used in the experiment D1, polyvinyl chloride pellets (Ryuron paste 772, manufactured by Tosoh Corporation, average particle size: 0.05 mm) were used as a core material having a wire diameter of 10 mm, and as a coating metal. A eutectic solder Pb / Sn = 5/95 (melting point: 183 ° C.) is used instead of In / Cd to cover to a thickness of 0.3 mm, and as a resin composition, an acrylic resin (Hitachi Chemical Industry A sealing material was produced using a moisture-proof insulating material (TF-3348-15F2, manufactured by Co., Ltd.) so that the resin thickness was 20 μm. The curing of the resin is 2.4 J / cm instead of heating in Experiment 1. ² , And a sample for adhesion and a sample for moisture permeability measurement were prepared in the same manner as in Experiment D1. Then, an evaluation test was performed under the conditions shown in Table 7, and the results shown in Table 7 were obtained.
[0300]
(Experiment d7) A sample was prepared under the conditions shown in Table 10. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment D7, except that the thickness of the resin applied to the metal-coated plastic wire used in Experiment D7 was changed to 1.5 mm. Then, an evaluation test was performed under the conditions shown in Table 10, and the results shown in Table 10 were obtained. When the experiment d7 was compared with the experiment D7, the moisture permeability was high in the experiment d7. It can be seen that the thickness of the resin applied to the low melting point metal-coated plastic wire is more preferably 0.02 mm than 1.5 mm.
[0301]
(Experiment D8) A sample was prepared under the conditions shown in Table 7. That is, instead of the polystyrene pellets used in Experiment D1, 6-nylon pellets (Alamine CM1007, manufactured by Toray Industries, Inc., average particle size: 0.5 mm) were used as core materials having a wire diameter of 0.2 mm, and In as a coating metal. Eutectic solder In / Zn = 97.2 / 2.8 (melting point: 144 ° C.) was used instead of / Cd to coat the coating to a thickness of 0.5 mm. Furthermore, an epoxy resin was coated so that the resin thickness became 20 μm to prepare a sealing material. As in Experiment D1, the sample for bonding was passed through a softening temperature on soda glass and heating and pressing at 120 ° C. And a sample for moisture permeability measurement was prepared. Then, an evaluation test was performed under the conditions shown in Table 7, and the results shown in Table 7 were obtained.
[0302]
(Experiment d8) A sample was prepared under the conditions shown in Table 10. That is, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment D8 except that the temperature at which the resin composition used in Experiment D8 was cured was set at 215 ° C. Then, an evaluation test was performed under the conditions shown in Table 10, and the results shown in Table 10 were obtained. When this experiment d8 is compared with experiment D8, in experiment d8, an abnormality in which the EL element turned black was observed, and it was found that the EL element was oxidized and corroded. Accordingly, it is understood that the temperature at which the resin composition is cured is more preferably 120 ° C than 215 ° C.
[0303]
(Experiment E1) A sample was prepared under the conditions shown in Table 8. That is, the metallic copper ingot was melted at 1100 ° C., and the melt was jetted from the nozzle into the inside of the rotating drum storing water. The solidified copper fiber was wound inside the drum by centrifugal force to produce a copper wire having a wire diameter of 1 mm and a length of 1 m. Electrolytic plating was performed on the obtained copper wire by a conventional method in a eutectic solder plating bath of In / Cd = 74/26 until the diameter of the solder-coated wire became 1.2 mm. The solder-coated copper wire thus obtained was immersed in an epoxy resin composition (Alteko 3500, manufactured by Alpha Giken, modified epoxy resin / modified polyamine = 100/50) melted by heating at 80 ° C. The sealing material was obtained by welding on the wire until the resin thickness became 10 μm. The obtained sealing material was stuck on the periphery of a 25 mm × 100 mm soda glass, heated and pressed at a resin softening temperature (80 ° C.) and 1 Mpa for 10 minutes, and then another glass was faced. The sample was bonded and heated and pressed at 120 ° C. and 3 MPa for 60 minutes to cure the resin, thereby obtaining a sample for measuring adhesive strength. On the other hand, sealing materials were stuck on four sides of a 100 mm × 100 mm soda glass. Thereafter, after softening temperature (80 ° C.), heating and pressing at 1 Mpa for 10 minutes, another piece of soda glass is bonded, and the resin is cured by heating and pressing at 120 ° C., 3 Mpa for 10 minutes, and a sample for moisture permeability measurement And Then, an evaluation test was performed under the conditions shown in Table 8, and the results shown in Table 8 were obtained.
[0304]
(Experiment e1) A sample was prepared under the conditions shown in Table 11. That is, except that the wire diameter of the copper wire used in the experiment E1 was changed to 0.01 mm, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in the experiment E11. Then, an evaluation test was performed under the conditions shown in Table 11, and the results shown in Table 11 were obtained. When this experiment e1 was compared with experiment E1, in experiment e1, the moisture permeability was high and the adhesive strength was also weak. It can be seen that a wire diameter of the metal wire of 1.0 mm is more suitable than 0.01 mm.
[0305]
(Experiment E2) A sample was prepared under the conditions shown in Table 8. That is, a stainless wire having an average wire diameter of 0.5 mm and a length of 1.0 m was obtained in the same manner as in Experiment 11, except that stainless steel was used instead of the metal copper used in Experiment E1. Electrolytic plating was performed on the obtained wire in a eutectic solder plating bath of Pb / Sn = 5/95 (melting point: 183 ° C.) until the diameter of the solder-coated wire became 1.5 mm by a conventional method. . The solder-coated stainless wire thus obtained is immersed in an acrylic resin (Hitachi Chemical Industries, Ltd., moisture-proof insulating material TF-3348-15F2G) heated and melted at 70 ° C., so that the resin thickness becomes 25 μm. Until the sealing material was obtained. The sealing material was placed on soda glass in the same manner as in Experiment E1, and the curing of the resin was changed to 1.0 J / cm instead of the heating in Experiment 11. ² , And a sample for measuring the adhesive force and a sample for measuring the moisture permeability were prepared in the same manner as in Experiment E1. Then, an evaluation test was performed under the conditions shown in Table 8, and the results shown in Table 8 were obtained.
[0306]
(Experiment e2) A sample was prepared under the conditions shown in Table 11. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment E2 except that the composition of the eutectic solder used in Experiment E2 was changed to Pb 100%. Then, an evaluation test was performed under the conditions shown in Table 10, and the results shown in Table 10 were obtained. When the experiment e2 was compared with the experiment E2, the moisture permeability was high in the experiment e2. It can be seen that Pb / Sn = 5/95 is more suitable for the composition of the coating metal than Pb 100%.
[0307]
(Experiment E3) A sample was prepared under the conditions shown in Table E2. That is, an iron wire having an average wire diameter of 10 mm and a length of 1.0 m was obtained in the same manner as in Experiment E1, except that iron was used instead of the metallic copper used in Experiment E1. Eutectic solder Bi / In = 67/33 (melting point 109 ° C.) was fused to the obtained wire and covered with the eutectic solder so that the wire diameter became 16 mm. Next, the solder-coated iron wire was immersed in a phenol resin (phenol resin PM-8200 manufactured by Sumitomo Bakelite Co., Ltd.) heated and melted at 70 ° C., and the resin was welded onto the wire. The welding thickness of the resin was adjusted to be 50 μm with a diamond die. Thereafter, in the same manner as in the experiment E1, a sample for measuring an adhesive force and a sample for measuring a moisture permeability were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 8, and the results shown in Table 8 were obtained.
[0308]
(Experiment e3) A sample was prepared under the conditions shown in Table 11. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment E3 except that the thickness of the coating metal layer used in Experiment E3 was changed to 7.0 mm. Then, an evaluation test was performed under the conditions shown in Table 10, and the results shown in Table 10 were obtained. When the experiment e3 was compared with the experiment E3, the moisture permeability was high in the experiment e3. It turns out that the thickness of the coating metal layer is more suitable for 3.0 mm than for 7.0 mm.
[0309]
(Experiment E4) A sample was prepared under the conditions shown in Table 8. That is, aluminum was used in place of the metallic copper used in Experiment E1, and an aluminum wire having an average wire diameter of 1.0 mm and a length of 1.0 m was obtained in the same manner as in Experiment E1. Eutectic solder Sn35 / In45 / Bi is applied to the obtained wire. ₂ O (melting point: 98 ° C.) was fused and covered with a eutectic solder so that the diameter of the wire became 3.0 mm. Next, the solder-coated aluminum wire is immersed in a melamine resin (Melan 523 manufactured by Hitachi Chemical Co., Ltd.) heated and melted at 70 ° C., and is welded on the wire until the resin thickness becomes 5 μm. Obtained. Thereafter, in the same manner as in the experiment E1, a sample for measuring an adhesive force and a sample for measuring a moisture permeability were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 8, and the results shown in Table 8 were obtained.
[0310]
(Experiment e4) A sample was prepared under the conditions shown in Table 11. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment E4 except that the coverage of the metal-coated aluminum wire used in Experiment E4 was changed to 40%. Then, an evaluation test was performed under the conditions shown in Table 11, and the results shown in Table 11 were obtained. When the experiment e4 was compared with the experiment E4, the moisture permeability was high in the experiment e4. It can be seen that the coverage of the aluminum wire with the solder is 100% more suitable than 40%.
[0311]
(Experiment E5) A sample was prepared under the conditions shown in Table 8. That is, a nickel wire having an average wire diameter of 1.0 mm and a length of 1.0 m was obtained in the same manner as in Experiment E1, except that nickel was used instead of the metallic copper used in Experiment E1. Eutectic solder Sn / In = 48/52 (melting point 117 ° C.) as the coating metal, and xylene / acrylic resin = 80/20 (xylene resin: Nicanol HP-100, manufactured by Mitsubishi Gas Chemical Co., Ltd.) as the resin composition Acrylic resin: HTR-860P-3 manufactured by Teikoku Chemical Industry Co., Ltd. was used, and the obtained wire was coated so that the resin thickness became 20 μm. In the same manner as in Experiment E1, a sample for bonding and a sample for measuring moisture permeability were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 8, and the results shown in Table 8 were obtained.
[0312]
(Experiment e5) A sample was prepared under the conditions shown in Table 11. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment E5 except that the metal wire used in Experiment E5 was changed to lead having a wire diameter of 10 mm. Then, an evaluation test was performed under the conditions shown in Table 11, and the results shown in Table 11 were obtained. When the experiment e5 is compared with the experiment E5, in the experiment e5, an abnormality such as a broken wire was found. Accordingly, it can be seen that the type and diameter of the metal wire are more suitable for a nickel wire having a wire diameter of 1.0 mm than for a lead wire having a wire diameter of 10 mm.
[0313]
(Experiment E6) A sample was prepared under the conditions shown in Table 8. That is, a nickel wire having an average wire diameter of 0.5 mm and a length of 1.0 m was obtained in the same manner as in Experiment E1, except that stainless steel was used instead of the metallic copper used in Experiment E1. Eutectic solder Bi / Cd = 60/40 (melting point 144 ° C.) is coated to a thickness of 0.015 mm, and as a resin composition, polyester resin / crosslinking agent = 100/2 (polyester resin: manufactured by Toyobo Co., Ltd., Byron VG700) , A cross-linking agent: Nippon Polyurethane Co., Ltd., Coronate L)) so as to have a resin thickness of 20 μm to obtain a sealing material. Further, in the same manner as in Experiment E1, a sample for bonding and a sample for measuring moisture permeability were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 8, and the results shown in Table 8 were obtained.
[0314]
(Experiment e6) A sample was prepared under the conditions shown in Table 11. That is, except that the metal wire used in the experiment E1 was changed to a copper wire having a wire diameter of 30 mm, a bonding sample and a moisture permeability measurement sample were produced in the same manner as in the experiment E1. Then, an evaluation test was performed under the conditions shown in Table 11, and the results shown in Table 11 were obtained. When the experiment e6 was compared with the experiment E1, the moisture permeability was high in the experiment e6. It can be seen that the wire diameter of the metal wire of 1.0 mm is more suitable than the wire diameter of 30.0 mm.
[0315]
(Experiment E7) A sample was prepared under the conditions shown in Table 8. That is, a nickel wire having an average wire diameter of 0.5 mm and a length of 1.0 m was obtained in the same manner as in Experiment E1, except that stainless steel was used instead of the metal copper used in Experiment E1. Eutectic solder Pb / Sn = 5/95 (melting point: 183 ° C.) is coated on the obtained wire, and acrylic resin (moisture-proof insulating material TF-3348-15F2 manufactured by Hitachi Chemical Co., Ltd.) is used as a resin composition. Then, coating was performed so that the resin thickness became 20 μm to obtain a sealing material. The sealing material was placed on soda glass in the same manner as in Experiment E1, and the curing of the resin was changed to 2.4 J / cm instead of heating in Experiment E1. ² , And a sample for adhesion and a sample for moisture permeability measurement were prepared in the same manner as in Experiment E1. Then, an evaluation test was performed under the conditions shown in Table 8, and the results shown in Table 8 were obtained.
[0316]
(Experiment e7) A sample was prepared under the conditions shown in Table 11. That is, an adhesive sample and a moisture permeability measurement sample were produced in the same manner as in Experiment E3 except that the thickness of the coating metal layer used in Experiment E3 was changed to 0.0005 mm. Then, an evaluation test was performed under the conditions shown in Table 11, and the results shown in Table 11 were obtained. When the experiment e7 was compared with the experiment E3, the moisture permeability was high in the experiment e7. It can be seen that 0.3 mm is more suitable for the thickness of the coating metal layer than 0.0005 mm.
[0317]
(Experiment E8) A sample was prepared under the conditions shown in Table 8. That is, a nickel wire having an average wire diameter of 0.5 mm and a length of 1.0 m was obtained in the same manner as in Experiment E1, except that stainless steel was used instead of the metal copper used in Experiment E1. Eutectic solder In / Zn = 97.2 / 2.8 (melting point: 144 ° C) was coated on the wire, and the same epoxy resin as that used in Experiment E1 was used as the resin composition. The resin thickness was 20 µm. The wire was coated to obtain a sealing material. Further, in the same manner as in Experiment E1, a sample for bonding and a sample for measuring moisture permeability were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 8, and the results shown in Table 8 were obtained.
[0318]
(Experiment e8) A sample was prepared under the conditions shown in Table 11. That is, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment E8 except that the curing temperature of the resin composition used in Experiment E8 was set to 215 ° C. Then, an evaluation test was performed under the conditions shown in Table 11, and the results shown in Table 11 were obtained. When the experiment e8 is compared with the experiment E8, in the experiment e8, an abnormality was observed in which the EL element turned black, and it was found that the EL element was oxidized and corroded. Accordingly, it is understood that the temperature at which the resin composition is cured is more preferably 120 ° C than 215 ° C.
[0319]
(Experiment F1) A sample was prepared under the conditions shown in Table 9. That is, in the same manner as in Experiment F1, the metal copper ingot was melted at 1100 ° C., and the melt was jetted from the nozzle into the inside of the rotating drum storing water. However, a hollow copper wire was obtained with a circular cross section of the nozzle hole. Next, the solidified hollow copper wire (copper tube wire) was wound around the inside of the drum by centrifugal force to produce a copper tube wire having a wire diameter of 1 mm, a wall thickness of 0.1 mm, and a length of 1 m. The obtained copper tube was subjected to electrolytic plating in the same manner as in Experiment 1 in a eutectic solder plating bath of In / Cd = 74/26 until the diameter of the solder-coated copper tube became 1.2 mm. did. The solder-coated copper tube wire thus obtained is immersed in an epoxy resin composition (Alteco 3500, manufactured by Alpha Giken, modified epoxy resin / modified polyamine = 100/50) heated and melted at 80 ° C. Then, the resin was welded on the wire until the resin thickness became 10 μm to obtain a sealing material. The obtained sealing material is stuck on the periphery of a 25 mm × 100 mm soda glass, and heated and pressed at 1 Mpa for 10 minutes at a softening temperature of the resin (80 ° C.), so that another glass faces each other. Then, it was heated and pressed at 120 ° C. and 3 Mpa for 10 minutes to obtain a sample for measuring adhesive strength. On the other hand, sealing materials were stuck on four sides of a 100 mm × 100 mm soda glass. Then, after heating and pressurizing at a softening temperature (80 ° C.) and 1 Mpa for 10 minutes, another piece of soda glass was bonded and heated and pressed at 120 ° C. and 3 Mpa for 10 minutes to obtain a sample for moisture permeability measurement. Then, an evaluation test was performed under the conditions shown in Table 9, and the results shown in Table 9 were obtained.
[0320]
(Experiment f1) A sample was prepared under the conditions shown in Table 12. That is, except that the copper wire used in Experiment F1 had a wire diameter of 0.04 mm, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment F1. Then, an evaluation test was performed under the conditions shown in Table 12, and the results shown in Table 12 were obtained. When the experiment f1 was compared with the experiment F1, in the experiment f1, the moisture permeability was high and the adhesive strength was weak. It can be seen that the wire diameter of the metal tube wire is 1.0 mm and the wall thickness of 0.1 mm is more suitable than the wire diameter of 0.04 mm and the wall thickness of 0.01 mm.
[0321]
(Experiment F2) A sample was prepared under the conditions shown in Table 9. That is, a stainless steel wire having an average wire diameter of 0.5 mm, a pipe wall thickness of 0.05 mm, and a length of 1.0 m was obtained in the same manner as in Experiment F2, except that stainless steel was used instead of the metal copper used in Experiment F1. . The obtained wire was subjected to electrolytic plating by a conventional method in a plating bath of a eutectic solder of Pb / Sn = 5/95 (melting point: 183 ° C.) until the diameter of the solder-coated tube wire became 1.5 mm. . The solder-coated stainless steel tube wire thus obtained is immersed in an acrylic resin (manufactured by Hitachi Chemical Co., Ltd., moisture-proof insulating material TF-3348-15F2G) heated and melted at 70 ° C., so that the resin thickness becomes 25 μm. The sealing material was obtained by welding on the wire until it became as thin as possible. Further, the sealing material was placed on soda glass in the same manner as in Experiment F1, and the curing of the resin was changed to 1.0 J / cm instead of heating in Experiment F1. ² Was performed, and a sample for measuring an adhesive force and a sample for measuring a moisture permeability were prepared in the same manner as in Experiment F1. Then, an evaluation test was performed under the conditions shown in Table 9, and the results shown in Table 9 were obtained.
[0322]
(Experiment f2) A sample was prepared under the conditions shown in Table 12. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment F2 except that 100% of Pb was used instead of the eutectic solder used in Experiment F2. Then, an evaluation test was performed under the conditions shown in Table 12, and the results shown in Table 12 were obtained. When the experiment f2 was compared with the experiment F2, the moisture permeability was high in the experiment f2. It can be seen that the composition of the coating metal is more suitable for Pb / Sn = 5/95 than for Pb 100%.
[0323]
(Experiment F3) A sample was prepared under the conditions shown in Table 9. In other words, iron was used instead of the metallic copper used in Experiment F1, and an iron tube wire having an average wire diameter of 10 mm, a wall thickness of 0.5 mm, and a length of 1.0 m was obtained in the same manner as in Experiment F1. Eutectic solder Bi / In = 67/33 (melting point 109 ° C.) was fused to the obtained iron tube, and the iron tube was covered with the eutectic solder so that the diameter of the coated tube became 16 mm. Next, the solder-coated iron tube was immersed in a phenol resin (phenol resin PM-8200 manufactured by Sumitomo Bakelite Co., Ltd.) heated and melted at 70 ° C., and the resin was welded onto the iron tube. The weld thickness of the resin was adjusted to 5 μm with a diamond die. Thereafter, in the same manner as in Experiment F1, a sample for measuring an adhesive force and a sample for measuring a moisture permeability were produced through a softening temperature of resin on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 9, and the results shown in Table 9 were obtained.
[0324]
(Experiment f3) A sample was prepared under the conditions shown in Table 12. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment F3 except that the thickness of the metal layer of the metal-coated tube used in Experiment F3 was changed to 7.0 mm. Then, an evaluation test was performed under the conditions shown in Table 12, and the results shown in Table 12 were obtained. When the experiment f3 was compared with the experiment F3, the moisture permeability was high in the experiment f3. It turns out that the thickness of the coating metal layer is more suitable for 3.0 mm than for 7.0 mm.
[0325]
(Experiment F4) A sample was prepared under the conditions shown in Table 9. In other words, aluminum was used instead of the metal copper used in Experiment F1, and an aluminum pipe wire having an average wire diameter of 1.0 mm, a wall thickness of 0.2 mm, and a length of 1.0 m was obtained in the same manner as in Experiment F1. Eutectic solder Sn35 / In45 / Bi was added to the obtained tube wire. ₂ O (melting point: 98 ° C.) was fused and coated with a eutectic solder so that the diameter of the coated tube wire was 3.0 mm. Next, the solder-coated aluminum tube wire is immersed in a melamine resin (Melan 523 manufactured by Hitachi Chemical Co., Ltd.) heated and melted at 70 ° C., and is welded on the tube wire until the resin thickness becomes 0.2 mm. A sealing material was obtained. Thereafter, in the same manner as in Experiment F1, a sample for measuring an adhesive force and a sample for measuring a moisture permeability were produced through a softening temperature of resin on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 9, and the results shown in Table 9 were obtained.
[0326]
(Experiment f4) A sample was prepared under the conditions shown in Table 12. That is, an adhesion sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment F4, except that the coverage of the aluminum pipe wire with the metal used in Experiment F4 was changed to 40%. Then, an evaluation test was performed under the conditions shown in Table 12, and the results shown in Table 12 were obtained. When the experiment f4 was compared with the experiment F4, the moisture permeability was high in the experiment f4. It can be seen that the coverage of the metal tube wire with the coating metal is more suitable at 100% than at 40%.
[0327]
(Experiment F5) A sample was prepared under the conditions shown in Table 9. That is, a nickel tube wire having an average wire diameter of 1.0 mm, a wall thickness of 0.1 mm, and a length of 1.0 m was obtained in the same manner as in Experiment F1, except that nickel was used instead of the metallic copper used in Experiment F1. The obtained tube wire is coated with eutectic solder Sn / In = 48/52 (melting point 117 ° C.), and as a resin composition, xylene / acrylic resin = 80/20 (xylene resin: Mitsubishi Gas Chemical Co., Ltd.) Manufactured by Nikonol HP-100, acrylic resin: HTR-860P-3 manufactured by Teikoku Chemical Industry Co., Ltd.) to obtain a sealing material by coating so as to have a resin thickness of 20 μm. In the same manner as in Experiment F1, a sample for bonding and a sample for measuring moisture permeability were produced through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 9, and the results shown in Table 9 were obtained.
[0328]
(Experiment f5) A sample was prepared under the conditions shown in Table 12. That is, except that the metal tube wire used in Experiment F5 was a lead tube wire having a wire diameter of 10 mm, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment F5. Then, an evaluation test was performed under the conditions shown in Table 12, and the results shown in Table 12 were obtained. When the experiment f5 is compared with the experiment F5, in the experiment f5, an abnormality such as a broken wire was found. Therefore, it can be seen that the type and wire diameter of the metal tube wire are more suitable for a nickel wire diameter of 1.0 mm than for a lead wire diameter of 10 mm.
[0329]
(Experiment F6) A sample was prepared under the conditions shown in Table 9. That is, stainless steel was used instead of metallic copper used in Experiment F1, and a stainless steel wire having an average wire diameter of 0.5 mm, a wall thickness of 0.1 mm, and a length of 1.0 m was obtained in the same manner as in Experiment F1. The obtained tube wire is coated with eutectic solder Bi / Cd = 60/40 (melting point: 144 ° C.), and as a resin composition, polyester resin / crosslinking agent = 100/2 (polyester resin: manufactured by Toyobo Co., Ltd.) , Byron VG700, crosslinking agent: Coronate L, manufactured by Nippon Polyurethane Co., Ltd.) to obtain a sealing material by coating so as to have a resin thickness of 20 μm. In the same manner as in Experiment F1, a sample for bonding and a sample for measuring moisture permeability were produced through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 9, and the results shown in Table 9 were obtained.
[0330]
(Experiment f6) A sample was prepared under the conditions shown in Table 12. That is, except that the metal tube wire used in Experiment F1 was changed to a copper wire having a thickness of 0.005 mm, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment F1. Then, an evaluation test was performed under the conditions shown in Table 10, and the results shown in Table 10 were obtained. When the experiment f6 was compared with the experiment F1, the moisture permeability was high in the experiment f6. It can be seen that a stainless steel wire diameter of 0.1 mm is more suitable than a copper wire diameter of 0.005 mm as the type and the wire diameter of the metal wire tube.
[0331]
(Experiment F7) A sample was prepared under the conditions shown in Table 9. That is, stainless steel was used instead of metallic copper used in Experiment F1, and a stainless steel wire having an average wire diameter of 0.5 mm, a wall thickness of 0.1 mm, and a length of 1.0 m was obtained in the same manner as in Experiment F1. The obtained tube wire was coated with eutectic solder Pb / Sn = 5/95 (melting point: 183 ° C.), and further, as a resin composition, an acrylic resin (manufactured by Hitachi Chemical Co., Ltd., moisture-proof insulating material TF-3348-). Using 15F2), a sealing material was obtained by coating so that the resin thickness became 20 μm. The sealing material was placed on soda glass as in Experiment F1, and the curing of the resin was changed to 2.4 J / cm instead of heating in Experiment F1. ² , And a sample for adhesion and a sample for moisture permeability measurement were prepared in the same manner as in Experiment 21. Then, an evaluation test was performed under the conditions shown in Table 9, and the results shown in Table 9 were obtained.
[0332]
(Experiment f7) A sample was prepared under the conditions shown in Table 12. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment F3, except that the coating metal layer used in Experiment F3 was made 0.0005 mm thick by electrolytic plating. Then, an evaluation test was performed under the conditions shown in Table 12, and the results shown in Table 12 were obtained. When the experiment f7 was compared with the experiment F3, the moisture permeability was high in the experiment f7. It can be seen that 0.3 mm is more suitable for the thickness of the coating metal layer than 0.0005 mm.
[0333]
(Experiment F8) A sample was prepared under the conditions shown in Table 9. That is, stainless steel was used instead of metallic copper used in Experiment F1, and a stainless steel wire having an average wire diameter of 0.5 mm, a wall thickness of 0.1 mm, and a length of 1.0 m was obtained in the same manner as in Experiment F1. The obtained tube wire was coated with eutectic solder In / Zn = 97.2 / 2.8 (melting point: 144 ° C.), and the same epoxy resin as in Experiment F1 was used as the resin composition to obtain a resin thickness of 0.1 mm. The sealing material was obtained by coating to a thickness of 2 mm. In the same manner as in Experiment F1, a sample for bonding and a sample for measuring moisture permeability were produced through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 9, and the results shown in Table 9 were obtained.
[0334]
(Experiment f8) A sample was prepared under the conditions shown in Table 12. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment F8 except that the temperature at which the resin composition used in Experiment F8 was cured was set at 215 ° C. Then, an evaluation test was performed under the conditions shown in Table 12, and the results shown in Table 12 were obtained. When this experiment f8 is compared with experiment F8, in experiment f8, an abnormality was observed in which the EL element turned black, and it was found that the EL element was oxidized and corroded. Therefore, it is understood that the curing temperature of the resin composition is more preferably 120 ° C. than 215 ° C.
[0335]
[Table 7]

[Table 8]

[Table 9]

[Table 10]

[Table 11]

[Table 12]

(Experiment G1) A sample was prepared under the conditions shown in Table 13. That is, a polystyrene pellet SD120 (manufactured by Asahi Kasei Kogyo Co., Ltd., elastic modulus: 1.8 GPa) was heated and melted to a melting point or higher, and then gradually cooled to obtain a gel-like spherulite. A sheet having a thickness of 5 mm obtained by compression-molding the aggregate was super-stretched through a die having a diameter of 1 mm to obtain a polystyrene plastic wire having an average wire diameter of 1 mm and a length of 0.1 m. After subjecting the obtained polystyrene wire to a seeder treatment with palladium chloride, a nickel layer of 0.2 μm was deposited in an electroless nickel plating solution. Thereafter, electrolytic plating was performed by a conventional method in a eutectic solder plating bath of In / Cd = 74/26 until the diameter of the solder-coated wire became 200 μm. The thus-obtained solder-coated polystyrene wire was immersed in an epoxy resin composition (Alteco 3500, manufactured by Alpha Giken, modified epoxy resin / modified polyamine = 100/50) heated and melted at 80 ° C. And was welded on the wire until the resin thickness became 10 μm. Two polystyrene wires covered with resin and solder were placed in parallel contact, heated to 80 ° C. and fused to obtain a sealing material. The obtained sealing material was stuck on the periphery of 25 mm × 100 mm soda glass, heated and pressed at 1 Mpa for 10 minutes at the softening temperature of the resin (80 ° C.), and then another glass was faced. The resin was heated and pressed at 120 ° C. and 3 Mpa for 10 minutes to cure the resin, thereby obtaining a sample for measuring adhesive strength. On the other hand, sealing materials were stuck on four sides of a 100 mm × 100 mm soda glass. Thereafter, after softening temperature (80 ° C.), heating and pressing at 1 Mpa for 10 minutes, another piece of soda glass is bonded, and the resin is cured by heating and pressing at 120 ° C., 3 Mpa for 10 minutes, and a sample for moisture permeability measurement And Then, an evaluation test was performed under the conditions shown in Table 13, and the results shown in Table 13 were obtained.
[0336]
(Experiment g1) A sample was prepared under the conditions shown in Table 16. That is, except that the wire diameter of the polystyrene wire used in Experiment G1 was changed to 7 mm, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment G1. Then, an evaluation test was performed under the conditions shown in Table 16, and the results shown in Table 16 were obtained. Comparing Experiment g1 with Experiment G1, it can be seen that in Experiment g1, the moisture permeability is high, and that the 0.1 mm wire diameter of the plastic wire is more suitable than 0.7 mm.
[0337]
(Experiment G2) A sample was prepared under the conditions shown in Table 13. In other words, instead of the polystyrene pellets used in Experiment G1, polyethylene (manufactured by Iron and Steel Chemical Co., Ltd., flow beads CL12007, average particle diameter 1.0 mm) was used and the average wire diameter was 2.0 mm by the super-stretching method as in Experiment G1. Thus, a polyethylene plastic wire having a length of 0.1 m was obtained. After subjecting the obtained wire to a seeder treatment with palladium chloride, a nickel layer of 0.2 μm was deposited in an electroless nickel plating solution. Thereafter, electrolytic plating was performed by a conventional method in a eutectic solder plating bath having a Pb / Sn = 5/95 (melting point: 183 ° C.) until the diameter of the solder-coated wire became 0.7 mm. The solder-coated polyethylene wire thus obtained was immersed in an acrylic resin (manufactured by Hitachi Chemical Co., Ltd., TF-3348-15F2G, manufactured by Hitachi Chemical Co., Ltd.) heated and melted at 70 ° C. to a resin thickness of 25 μm. It was welded on the wire until it was. Two polyethylene wires coated with acrylic resin and solder were placed in parallel contact, heated to 70 ° C. and fused to obtain a sealing material. Further, a sealing material was placed on soda glass in the same manner as in Experiment G1, and curing was performed at 1.0 J / cm instead of heating in Experiment G1. ² The irradiation was performed in the same manner as in Experiment G1 to prepare a sample for measuring adhesive strength and a sample for measuring moisture permeability. Then, an evaluation test was performed under the conditions shown in Table 13, and the results shown in Table 133 were obtained.
[0338]
(Experiment g2) A sample was prepared under the conditions shown in Table 16. That is, an adhesive sample and a moisture permeability measurement sample were produced in the same manner as in Experiment G2, except that the polyethylene wire used in Experiment G2 was changed to one having a compression modulus of 0.1 GPa. Then, an evaluation test was performed under the conditions shown in Table 16, and the results shown in Table 16 were obtained. When this experiment g2 is compared with experiment G2, it can be seen that in experiment g2, the moisture permeability is high, and that the compression elastic modulus of 0.5 GPa is more suitable than 0.10 Gpa.
[0339]
(Experiment G3) A sample was prepared under the conditions shown in Table 13. That is, a wire having a wire diameter of 5 mm was prepared using PMMA pellets (acrylic pellets IRD-50, average particle size 5.0 mm, manufactured by Mitsubishi Rayon Co., Ltd.) instead of the polystyrene pellets used in Experiment G1, and used as a coating metal. Eutectic solder TI / Na = 93.7 / 6.3 (melting point: 238 ° C.) instead of In / Cd, and a phenol resin (Sumitomo Bakelite Co., Ltd. phenol) instead of an epoxy resin as a resin composition Using resin PM-8200), the eutectic solder was coated on the wire by fusing the metal, and the coating amount was adjusted with a diamond die so that the resin thickness became 50 μm. Otherwise, in the same manner as in Experiment 1, a sealing material was prepared, and a bonding sample and a moisture permeability measurement sample were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 13, and the results shown in Table 13 were obtained.
[0340]
(Experiment g3) A sample was prepared under the conditions shown in Table 16. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment G3 except that the composition of the coated metal used in Experiment G3 was changed to Pb 100%. Then, an evaluation test was performed under the conditions shown in Table 16, and the results shown in Table 16 were obtained. When this experiment g3 is compared with experiment G3, in experiment g3, the moisture permeability is high, and the composition of the coating metal is more suitable for lead (Pb) in the case of TI / NA = 93.7 / 6.3 than for lead (Pb) of 100%. You can see that.
[0341]
(Experiment G4) A sample was prepared under the conditions shown in Table 13. That is, a wire having a wire diameter of 0.5 mm was prepared using 66 nylon pellets (Alamine CM3007, manufactured by Toray Industries, Inc., average particle size: 0.5 mm) instead of the polystyrene pellets used in the experiment G1, and the coated metal was formed. Eutectic solder Sn35 / In45 / Bi instead of In / Cd ₂ The wire is coated with a eutectic solder by fusing a metal using O (melting point 98 ° C.), and a melamine resin (Melan 523 manufactured by Hitachi Chemical Co., Ltd.) is used as a resin composition instead of the epoxy resin. The coating amount was adjusted with a diamond die so that the resin thickness became 5 μm. Other than the above, a sealing material was prepared in the same manner as in Experiment G1, and a bonding sample and a moisture permeability measurement sample were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 13, and the results shown in Table 13 were obtained.
[0342]
(Experiment g4) A sample was prepared under the conditions shown in Table 16. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment G4 except that the thickness of the coated metal used in Experiment G4 was changed to 7 mm. Then, an evaluation test was performed under the conditions shown in Table 16, and the results shown in Table 16 were obtained. When this experiment g4 is compared with experiment G4, it can be seen that the adhesive force is low in experiment g4, and that the thickness of the coating metal is more suitable for 1.0 mm than for 7.0 mm.
[0343]
(Experiment G5) A sample was prepared under the conditions shown in Table 13. That is, instead of the polystyrene pellets used in Experiment G1, a polyester pellet (Siveras L204G35, average particle diameter 0.3 mm) manufactured by using polyester pellets was used to produce a wire having a wire diameter of 10 mm, and In / Eutectic solder Sn / In = 48/52 (melting point 117 ° C.) was used instead of Cd, and as a resin composition, xylene / acrylic resin = 80/20 (xylene resin: Mitsubishi Gas Chemical Co., Ltd.) instead of epoxy resin ), Nicanol HP-100, acrylic resin: HTR-860P-3, manufactured by Teikoku Chemical Industry Co., Ltd., and coated with solder and resin so that the resin thickness was 20 μm. Other than the above, a sealing material was prepared in the same manner as in Experiment G1, and a bonding sample and a moisture permeability measurement sample were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 13, and the results shown in Table 13 were obtained.
[0344]
(Experiment g5) A sample was prepared under the conditions shown in Table 16. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment G5, except that the coverage of the plastic wire with the metal used in Experiment G5 was 40%. Then, an evaluation test was performed under the conditions shown in Table 16, and the results shown in Table 16 were obtained. When this experiment g5 is compared with experiment G5, it can be seen that moisture permeability is high in experiment g5, and that the coverage of the plastic wire with the metal of 99% is more suitable than 40%.
[0345]
(Experiment G6) A sample was prepared under the conditions shown in Table 13. That is, instead of the polystyrene pellets used in the experiment G1, polypropylene pellets (Noblen H501, average particle size 0.03 mm, manufactured by Sumitomo Chemical Co., Ltd.) were used to produce a wire having a wire diameter of 0.5 mm, and used as a coating metal. Eutectic solder Bi / Cd = 60/40 (melting point 144 ° C.) instead of In / Cd, and polyester resin / crosslinking agent = 100/2 (polyester resin: Toyobo Co., Ltd.) instead of epoxy resin as a resin composition (Coronate L, manufactured by Nippon Polyurethane Co., Ltd., manufactured by Byron VG700, Inc.), and the resin-coated wire was covered with a solder and a resin so as to have a thickness of 20 μm. Otherwise, in the same manner as in Experiment G1, a sealing material was prepared, and a bonding sample and a moisture permeability measurement sample were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 13, and the results shown in Table 13 were obtained.
[0346]
(Experiment g6) A sample was prepared under the conditions shown in Table 16. That is, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment G6, except that the plastic wire used in Experiment G6 was changed to a wire having a wire diameter of 0.03 mm. Then, an evaluation test was performed under the conditions shown in Table 16, and the results shown in Table 16 were obtained. When this experiment g6 is compared with the experiment G6, it is understood that the moisture permeability is high in the experiment g6, and that the wire diameter of the plastic wire is more suitable for 0.5 mm than for 0.03 mm.
[0347]
(Experiment G7) A sample was prepared under the conditions shown in Table 13. That is, instead of the polystyrene pellets used in the experiment G1, a 10 mm-diameter wire was prepared using polyvinyl chloride pellets (Ryuron paste 772, manufactured by Tosoh Corporation, average particle size 0.05 mm), and the coated metal was coated. Eutectic solder Pb / Sn = 5/95 (melting point: 183 ° C.) was used instead of In / Cd, and an acrylic resin (made by Hitachi Chemical Co., Ltd., moisture-proof insulation Material TF-3348-15F2) was used and covered with solder and resin so that the resin thickness was 20 μm. Otherwise, a sealing material was produced in the same manner as in Experiment G1. The sealing material was placed on soda glass, and the curing of the resin was changed to 2.4 J / cm instead of heating in Experiment G1. ² Was performed, and a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment G1. Then, an evaluation test was performed under the conditions shown in Table 13, and the results shown in Table 13 were obtained.
[0348]
(Experiment g7) A sample was prepared under the conditions shown in Table 16. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment G7 except that the thickness of the resin applied to the metal-coated plastic wire used in Experiment G7 was 1.5 mm. Then, an evaluation test was performed under the conditions shown in Table 16, and the results shown in Table 16 were obtained. When this experiment g7 is compared with the experiment G7, it is understood that the moisture permeability is high in the experiment g7, and the thickness of the resin applied to the metal-coated plastic wire is more suitable for 0.02 mm than for 1.5 mm.
[0349]
(Experiment G8) A sample was prepared under the conditions shown in Table 13. That is, instead of the polystyrene pellets used in Experiment G1, 6-nylon pellets (Alamine CM1007, manufactured by Toray Industries, Inc., average particle size: 0.5 mm) were used to produce a wire having a wire diameter of 0.2 mm, and used as a coating metal. A eutectic solder In / Zn = 97.2 / 2.8 (melting point: 144 ° C.) was used instead of In / Cd and the resin thickness was 20 μm, and a sealing material was obtained in the same manner as in Experiment G1. The sealing material was placed on soda glass, and heated and pressed at a softening temperature and 120 ° C. to prepare a bonding sample and a moisture permeability measurement sample. Then, an evaluation test was performed under the conditions shown in Table 13, and the results shown in Table 13 were obtained.
[0350]
(Experiment g8) A sample was prepared under the conditions shown in Table 16. That is, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment G8 except that the temperature at which the resin composition used in Experiment G8 was cured was set to 215 ° C. Then, an evaluation test was performed under the conditions shown in Table 16, and the results shown in Table 16 were obtained. When this experiment g8 was compared with experiment G8, in experiment g8, an abnormality was observed in which the EL element turned black, and it was found that the EL element was oxidized and corroded. Therefore, it is understood that the curing temperature of the resin composition is more preferably 120 ° C. than 215 ° C.
[0351]
(Experiment H1) A sample was prepared under the conditions shown in Table 14. That is, the metallic copper ingot was melted at 1100 ° C., and the melt was jetted from the nozzle into the inside of the rotating drum storing water. The solidified copper fiber was wound inside the drum by centrifugal force to produce a copper wire having a wire diameter of 1 mm and a length of 1 m. The obtained copper wire was subjected to electrolytic plating in a conventional manner in a eutectic solder plating bath of In / Cd = 74/26 until the diameter of the solder-coated wire became 1.2 mm. The solder-coated copper wire thus obtained was immersed in an epoxy resin composition (Alteco 3500, manufactured by Alpha Giken, modified epoxy resin / modified polyamine = 100/50) melted by heating at 80 ° C. It was welded on the wire until the resin thickness became 10 μm. Two copper wires coated with epoxy resin and solder were placed in parallel contact, heated to 80 ° C. and fused to obtain a sealing material. The obtained sealing material was stuck on the periphery of a 25 mm × 100 mm soda glass, heated and pressed at a resin softening temperature (80 ° C.) and 1 Mpa for 10 minutes, and then another glass was faced. The sample was bonded and heated and pressed at 120 ° C. and 3 MPa for 60 minutes to cure the resin, thereby obtaining a sample for measuring adhesive strength. On the other hand, sealing materials were stuck on four sides of a 100 mm × 100 mm soda glass. Thereafter, after softening temperature (80 ° C.), heating and pressing at 1 Mpa for 10 minutes, another piece of soda glass is bonded, and the resin is cured by heating and pressing at 120 ° C., 3 Mpa for 10 minutes, and a sample for moisture permeability measurement And Then, an evaluation test was performed under the conditions shown in Table 14, and the results shown in Table 14 were obtained.
[0352]
(Experiment h1) A sample was prepared under the conditions shown in Table 17. That is, except that the copper wire used in Experiment H1 was changed to a wire having a wire diameter of 0.01 mm, a bonding sample and a moisture permeability measurement sample were produced in the same manner as in Experiment H1. Then, an evaluation test was performed under the conditions shown in Table 17, and the results shown in Table 17 were obtained. When this experiment h1 is compared with experiment H1, in experiment h1, it is understood that the moisture permeability is high and the adhesive strength is weak, and that the wire diameter of the metal wire is more suitable for 1.0 mm than for 0.01 mm.
[0353]
(Experiment H2) A sample was prepared under the conditions shown in Table 14. That is, a stainless wire having an average wire diameter of 0.5 mm and a length of 1.0 m was obtained in the same manner as in Experiment H1, except that stainless steel was used instead of the metal copper used in Experiment H1. The obtained wire was subjected to electrolytic plating in a conventional manner in a eutectic solder plating bath of Pb / Sn = 5/95 (melting point: 183 ° C.) until the diameter of the solder-coated wire became 1.5 mm. The solder-coated stainless wire thus obtained is immersed in an acrylic resin (manufactured by Hitachi Chemical Co., Ltd., moisture-proof insulating material TF-3348-15F2G) heated and melted at 70 ° C., so that the resin thickness becomes 25 μm. Until welded onto the wire. Two stainless steel wires coated with an acrylic resin and solder were placed in parallel contact, heated to 70 ° C. and fused to obtain a sealing material. The sealing material was placed on soda glass as in Experiment H1, and the curing of the resin was changed to 1.0 J / cm instead of heating in Experiment H1. ² In the same manner as in Experiment H1, to prepare a sample for measuring the adhesive force and a sample for measuring the moisture permeability. Then, an evaluation test was performed under the conditions shown in Table 14, and the results shown in Table 14 were obtained.
[0354]
(Experiment h2) A sample was prepared under the conditions shown in Table 17. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment H2 except that the eutectic solder used in Experiment H2 was changed to 100% Pb. Then, an evaluation test was performed under the conditions shown in Table 16, and the results shown in Table 16 were obtained. When this experiment h2 is compared with experiment H2, it is understood that the moisture permeability is high in experiment h2, and that the composition of the coating metal is more suitable for Pb / Sn = 5/95 than for Pb 100%.
[0355]
(Experiment H3) A sample was prepared under the conditions shown in Table 14. That is, iron was used instead of the metallic copper used in Experiment H1, and an iron wire having an average wire diameter of 10 mm and a length of 1.0 m was obtained in the same manner as in Experiment H1. Eutectic solder Bi / In = 67/33 (melting point 109 ° C.) was fused to the obtained wire and covered with the eutectic solder so that the wire diameter became 16 mm. Next, the solder-coated iron wire was immersed in a phenol resin (phenol resin PM-8200 manufactured by Sumitomo Bakelite Co., Ltd.) heated and melted at 70 ° C., and the resin was welded onto the wire. The amount of resin deposited was adjusted to 5 μm with a diamond die. Thereafter, in the same manner as in Experiment H1, a sealing material was prepared from the two coated wires, and a sample for measuring the adhesive force and a sample for measuring the moisture permeability were passed through the softening temperature on soda glass and the heating and pressing at 120 ° C. Produced. Then, an evaluation test was performed under the conditions shown in Table 14, and the results shown in Table 14 were obtained.
[0356]
(Experiment h3) A sample was prepared under the conditions shown in Table 17. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment H3 except that the thickness of the coating metal layer used in Experiment H3 was changed to 7.0 mm. Then, an evaluation test was performed under the conditions shown in Table 16, and the results shown in Table 16 were obtained. Comparing Experiment h3 with Experiment H3, it can be seen that in Experiment h3, the moisture permeability is high, and the thickness of the coating metal layer is more suitable for 3.0 mm than for 7.0 mm.
[0357]
(Experiment H4) A sample was prepared under the conditions shown in Table 14. That is, aluminum wire having an average wire diameter of 1.0 mm and a length of 1.0 m was obtained in the same manner as in Experiment H1, except that aluminum was used instead of the metal copper used in Experiment H1. Eutectic solder Sn35 / In45 / Bi was added to the obtained wire. ₂ O (melting point: 98 ° C.) was fused and covered with a eutectic solder so that the diameter of the coated wire became 3.0 mm. Next, the solder-coated aluminum wire was immersed in a melamine resin (Melan 523 manufactured by Hitachi Chemical Co., Ltd.) heated and melted at 70 ° C., and was welded on the wire until the resin thickness became 20 μm. Thereafter, in the same manner as in Experiment H1, a sealing material was prepared from the two coated wires, and a sample for measuring the adhesive force and a sample for measuring the moisture permeability were passed through the softening temperature on soda glass and the heating and pressing at 120 ° C. Produced. Then, an evaluation test was performed under the conditions shown in Table 14, and the results shown in Table 14 were obtained.
[0358]
(Experiment h4) A sample was prepared under the conditions shown in Table 17. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment 14 except that the covering rate of the aluminum wire with the coating metal used in Experiment H4 was changed to 40%. Then, an evaluation test was performed under the conditions shown in Table 17, and the results shown in Table 17 were obtained. When this experiment h4 is compared with experiment H4, it can be seen that in experiment h4, the moisture permeability is high, and the coverage of the aluminum wire with the metal of 100% is more suitable than 40%.
[0359]
(Experiment H5) A sample was prepared under the conditions shown in Table 14. That is, a nickel wire having an average wire diameter of 1.0 mm and a length of 1.0 m was obtained in the same manner as in Experiment H1, except that nickel was used instead of the metallic copper used in Experiment H1. The obtained wire is coated with eutectic solder Sn / In = 48/52 (melting point 117 ° C.), and as a resin composition, xylene / acrylic resin = 80/20 (xylene resin: manufactured by Mitsubishi Gas Chemical Co., Ltd.) , Nicanol HP-100, acrylic resin: HTR-860P-3, manufactured by Teikoku Chemical Industry Co., Ltd.) so that the resin thickness was 20 μm. Further, in the same manner as in Experiment H1, a sealing material was prepared from the two coated wires, and a bonding sample and a moisture permeability measurement sample were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. . Then, an evaluation test was performed under the conditions shown in Table 14, and the results shown in Table 14 were obtained.
[0360]
(Experiment h5) A sample was prepared under the conditions shown in Table 17. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment H5 except that the metal wire used in Experiment H5 was changed to a lead wire having a wire diameter of 10 mm. Then, an evaluation test was performed under the conditions shown in Table 17, and the results shown in Table 17 were obtained. When this experiment h5 is compared with experiment H5, in experiment h5, an abnormality such as a broken wire was found. Accordingly, it can be seen that the type and the diameter of the metal wire are more suitable for a nickel wire diameter of 1.0 mm than for a lead wire diameter of 10 mm.
[0361]
(Experiment H6) A sample was prepared under the conditions shown in Table 14. That is, a nickel wire having an average wire diameter of 0.5 mm and a length of 1.0 m was obtained in the same manner as in Experiment H1, except that stainless steel was used instead of the metal copper used in Experiment H1. The obtained wire is coated with eutectic solder Bi / Cd = 60/40 (melting point 144 ° C.), and as a resin composition, polyester resin / crosslinking agent = 100/2 (polyester resin: manufactured by Toyobo Co., Ltd.) Byron VG700, crosslinking agent: Nippon Polyurethane Co., Ltd., Coronate L)) was used to coat the resin so that the resin thickness became 20 μm. Further, in the same manner as in Experiment H1, a sealing material was prepared from the two coated wires, and a bonding sample and a moisture permeability measurement sample were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. . Then, an evaluation test was performed under the conditions shown in Table 14, and the results shown in Table 14 were obtained.
[0362]
(Experiment h6) A sample was prepared under the conditions shown in Table 17. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment H1, except that the metal wire used in Experiment H6 was changed to a copper wire having a wire diameter of 30 mm. Then, an evaluation test was performed under the conditions shown in Table 17, and the results shown in Table 17 were obtained. When this experiment h6 is compared with experiment H1, in experiment h6, the moisture permeability is high, and it can be seen that the wire diameter of the metal wire is more suitable for a wire diameter of 1.0 mm than for a wire diameter of 30.0 mm. .
[0363]
(Experiment H7) A sample was prepared under the conditions shown in Table 14. That is, a nickel wire having an average wire diameter of 0.5 mm and a length of 1.0 m was obtained in the same manner as in Experiment H1, except that stainless steel was used instead of the metal copper used in Experiment H1. The obtained wire is coated with a eutectic solder Pb / Sn = 5/95 (melting point: 183 ° C.), and an acrylic resin (manufactured by Hitachi Chemical Co., Ltd., moisture-proof insulating material TF-3348-15F2) is used as a resin composition. ) To cover the resin so as to have a resin thickness of 20 μm. Further, a sealing material was prepared from the two coated wires and placed on soda glass in the same manner as in Experiment H1, and the resin was cured at 2.4 J / cm instead of heating in Experiment 11. ² , And a sample for adhesion and a sample for moisture permeability measurement were prepared in the same manner as in Experiment H1. Then, an evaluation test was performed under the conditions shown in Table 14, and the results shown in Table 14 were obtained.
[0364]
(Experiment h7) A sample was prepared under the conditions shown in Table 17. That is, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment H3 except that the thickness of the coating metal layer used in Experiment H7 was changed to 0.0005 mm. Then, an evaluation test was performed under the conditions shown in Table 17, and the results shown in Table 17 were obtained. When this experiment h7 is compared with experiment H7, it can be seen that in experiment h7, the moisture permeability is high, and the thickness of the coating metal layer is 0.3 mm more suitable than 0.0005 mm.
[0365]
(Experiment H8) A sample was prepared under the conditions shown in Table 14. That is, a nickel wire having an average wire diameter of 0.5 mm and a length of 1.0 m was obtained in the same manner as in Experiment H1, except that stainless steel was used instead of the metal copper used in Experiment H1. The obtained wire is coated with eutectic solder In / Zn = 97.2 / 2.8 (melting point: 144 ° C.), and the same epoxy resin as in Experiment 1 is used as a resin composition, and the resin thickness becomes 20 μm. As described above. Thereafter, in the same manner as in Experiment H1, a sealing material was obtained from the two coated wires, and a sample for bonding and a sample for moisture permeability measurement were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. did. Then, an evaluation test was performed under the conditions shown in Table 14, and the results shown in Table 14 were obtained.
[0366]
(Experiment h8) A sample was prepared under the conditions shown in Table 17. That is, an adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment H8 except that the temperature at which the resin composition used in Experiment H8 was cured was set at 215 ° C. Then, an evaluation test was performed under the conditions shown in Table 17, and the results shown in Table 17 were obtained. When this experiment h8 was compared with experiment H8, in experiment h8, an abnormality was observed in which the EL element turned black, and it was found that the EL element was oxidized and corroded. Therefore, it is understood that the curing temperature of the resin composition is more preferably 120 ° C. than 215 ° C.
[0367]
(Experiment I1) A sample was prepared under the conditions shown in Table 15. That is, the metallic copper ingot was melted at 1100 ° C. in the same manner as in Experiment G1, and the melt was jetted from the nozzle into the inside of the rotating drum storing water. However, by making the cross-sectional shape of the nozzle annular, a copper tube having a hollow structure was produced. The solidified hollow copper wire (copper wire) was wound around the inside of the drum by centrifugal force to obtain a copper wire having a wire diameter of 1 mm, a wall thickness of 0.1 mm, and a length of 1 m. The obtained copper tube was electrolytically plated in a eutectic solder plating bath of In / Cd = 74/26 until the diameter of the solder-coated copper tube became 1.2 mm in the same manner as in Experiment G1. did. The solder-coated copper tube wire thus obtained is immersed in an epoxy resin composition (Alteco 3500, manufactured by Alpha Giken, modified epoxy resin / modified polyamine = 100/50) heated and melted at 80 ° C. And was welded on the wire until the resin thickness became 10 μm. Two copper tubes coated with epoxy resin and solder were placed in parallel contact, heated to 80 ° C. and fused to obtain a sealing material. The obtained sealing material was stuck on the periphery of a 25 mm × 100 mm soda glass, heated and pressed at 1 Mpa for 10 minutes at a softening temperature of the resin (80 ° C.), and then another glass was faced. The resin was bonded by heating and pressing at 120 ° C. and 3 Mpa for 10 minutes to cure the resin, thereby obtaining a sample for measuring adhesive strength. On the other hand, sealing materials were stuck on four sides of a 100 mm × 100 mm soda glass. Thereafter, after softening temperature (80 ° C.), heating and pressing at 1 Mpa for 10 minutes, another piece of soda glass is bonded, and the resin is cured by heating and pressing at 120 ° C., 3 Mpa for 10 minutes, and a sample for moisture permeability measurement And Then, an evaluation test was performed under the conditions shown in Table 15, and the results shown in Table 15 were obtained.
[0368]
(Experiment i1) A sample was prepared under the conditions shown in Table 18. That is, except that the copper wire used in Experiment I1 was changed to a wire having a wire diameter of 0.04 mm, a bonding sample and a moisture permeability measurement sample were produced in the same manner as in Experiment I1. Then, an evaluation test was performed under the conditions shown in Table 18, and the results shown in Table 18 were obtained. When this experiment i1 is compared with experiment I1, it can be seen that, in experiment i1, the moisture permeability is high and the adhesive strength is also weak, and the wire diameter of the metal tube wire is more suitable for 1.0 mm than for 0.04 mm. .
[0369]
(Experiment I2) A sample was prepared under the conditions shown in Table 15. That is, stainless steel was used in the same manner as in Experiment I2 except that stainless steel was used in place of the metallic copper used in Experiment I1, and a stainless steel wire having an average wire diameter of 0.5 mm, a wall thickness of 0.05 mm, and a length of 1.0 m was obtained. The obtained wire was subjected to electrolytic plating by a conventional method in a plating bath of a eutectic solder of Pb / Sn = 5/95 (melting point: 183 ° C.) until the diameter of the solder-coated tube wire became 1.5 mm. . The solder-coated stainless steel tube wire thus obtained was immersed in an acrylic resin (manufactured by Hitachi Chemical Co., Ltd., moisture-proof insulating material TF-3348-15F2G) heated and melted at 70 ° C. to a resin thickness of 25 μm. It was welded on the wire until it was. Two stainless steel wires coated with acrylic resin and solder were placed in parallel contact, heated to 70 ° C. and fused to obtain a sealing material. The sealing material was placed on soda glass in the same manner as in Experiment I1, and the curing of the resin was changed to 1.0 J / cm instead of heating in Experiment I1. ² The irradiation was performed in the same manner as in Experiment I1 to prepare a sample for measuring adhesive strength and a sample for measuring moisture permeability. Then, an evaluation test was performed under the conditions shown in Table 15, and the results shown in Table 15 were obtained.
[0370]
(Experiment i2) A sample was prepared under the conditions shown in Table 18. That is, an adhesion sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment I2 except that the composition of the coated metal used in Experiment I2 was changed to 100% of Pb. Then, an evaluation test was performed under the conditions shown in Table 18, and the results shown in Table 18 were obtained. When this experiment i2 is compared with experiment I2, it is found that the moisture permeability is high in experiment i2, and that the composition of the coating metal is more suitable for Pb / Sn = 5/95 than for Pb 100%.
[0371]
(Experiment I3) A sample was prepared under the conditions shown in Table 15. That is, iron was used instead of the metallic copper used in Experiment I1 to obtain an iron tube wire having an average wire diameter of 10 mm, a wall thickness of 0.5 mm, and a length of 1.0 m in the same manner as in Experiment I1. Eutectic solder Bi / In = 67/33 (melting point 109 ° C.) was fused to the obtained iron tube, and the tube was covered with the eutectic solder so that the diameter of the coated tube became 16 mm. Next, the solder-coated iron tube wire is immersed in a phenol resin (phenol resin PM-8200 manufactured by Sumitomo Bakelite Co., Ltd.) heated and melted at 70 ° C., and the resin is welded on the iron tube wire. Was adjusted to 5 μm. Two sealing wires were fused to obtain a sealing material. Thereafter, in the same manner as in Experiment I1, a sample for measuring the adhesive force and a sample for measuring the moisture permeability were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 15, and the results shown in Table 15 were obtained.
[0372]
(Experiment i3) A sample was prepared under the conditions shown in Table 18. That is, an adhesion sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment I3 except that the thickness of the coating metal layer used in Experiment I3 was changed to 7.0 mm. Then, an evaluation test was performed under the conditions shown in Table 18, and the results shown in Table 18 were obtained. Comparing Experiment i3 with Experiment I3, it can be seen that in Experiment i3, the moisture permeability is high, and the thickness of the coating metal layer is more suitable for 3.0 mm than for 7.0 mm.
[0373]
(Experiment I4) A sample was prepared under the conditions shown in Table 15. In other words, aluminum was used instead of the metallic copper used in Experiment I1, and an aluminum tube wire having an average wire diameter of 1.0 mm, a pipe wall thickness of 0.2 mm, and a length of 1.0 m was obtained in the same manner as in Experiment I1. Eutectic solder Sn35 / In45 / Bi was added to the obtained tube wire. ₂ O (melting point 98 ° C.) was fused and coated with eutectic solder so that the diameter of the coated tube wire was 3.0 mm. Next, the solder-coated aluminum tube wire was immersed in a melamine resin (Melan 523 manufactured by Hitachi Chemical Co., Ltd.) heated and melted at 70 ° C., and was welded onto the tube wire until the resin thickness became 20 μm. Thereafter, in the same manner as in Experiment I1, a sealing material was prepared from the two coated wires, and after passing through a softening temperature on soda glass and heating and pressing at 120 ° C., a sample for measuring an adhesive force and a sample for measuring moisture permeability. Was prepared. Then, an evaluation test was performed under the conditions shown in Table 15, and the results shown in Table 15 were obtained.
[0374]
(Experiment i4) A sample was prepared under the conditions shown in Table 18. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment I4 except that the coverage of the metal-coated aluminum tube wire used in Experiment I4 was changed to 40%. Then, an evaluation test was performed under the conditions shown in Table 18, and the results shown in Table 18 were obtained. When this experiment i4 is compared with experiment I4, it can be seen that in experiment i4, the moisture permeability is high, and the coverage of the metal tube wire with the metal is 100% more suitable than 40%.
[0375]
(Experiment I5) A sample was prepared under the conditions shown in Table 15. That is, a nickel tube wire having an average wire diameter of 1.0 mm, a wall thickness of 0.1 mm, and a length of 1.0 m was obtained in the same manner as in Experiment I1, except that nickel was used instead of the metallic copper used in Experiment I1. The obtained tube wire is coated with eutectic solder Sn / In = 48/52 (melting point 117 ° C.), and as a resin composition, xylene / acrylic resin = 80/20 (xylene resin: Mitsubishi Gas Chemical Co., Ltd.) Co., Ltd., Nicanol HP-100, acrylic resin: HTR-860P-3, manufactured by Teikoku Chemical Industry Co., Ltd.) so that the resin thickness was 20 μm. Hereinafter, in the same manner as in Experiment I1, a sealing material was prepared from the two coated wires, and a bonding sample and a moisture permeability measurement sample were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. . Then, an evaluation test was performed under the conditions shown in Table 15, and the results shown in Table 15 were obtained.
[0376]
(Experiment i5) A sample was prepared under the conditions shown in Table 18. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment I5 except that the metal tube wire used in Experiment I5 was changed to a lead tube having a wire diameter of 10 mm. Then, an evaluation test was performed under the conditions shown in Table 18, and the results shown in Table 18 were obtained. When this experiment i5 was compared with experiment I5, in experiment i5, an abnormality such as a broken wire was found. Accordingly, it can be seen that the type and wire diameter of the metal wire tube are more suitable for a nickel wire diameter of 1.0 mm than for a lead wire diameter of 10 mm.
[0377]
(Experiment I6) A sample was prepared under the conditions shown in Table 15. That is, stainless steel was used instead of the metallic copper used in Experiment I1, and a stainless steel wire having an average wire diameter of 0.5 mm, a wall thickness of 0.1 mm, and a length of 1.0 m was obtained in the same manner as in Experiment I1. The obtained tube wire is coated with eutectic solder Bi / Cd = 60/40 (melting point: 144 ° C.), and as a resin composition, polyester resin / crosslinking agent = 100/2 (polyester resin: manufactured by Toyobo Co., Ltd.) , Co., Byron VG700, cross-linking agent: Nippon Polyurethane Co., Ltd., Coronate L) so that the resin thickness became 20 μm. Thereafter, in the same manner as in Experiment I1, a sealing material was prepared from the two coated wires, and a bonding sample and a moisture permeability measurement sample were prepared through softening temperature on soda glass and heating and pressing at 120 ° C. did. Then, an evaluation test was performed under the conditions shown in Table 15, and the results shown in Table 15 were obtained.
[0378]
(Experiment i6) A sample was prepared under the conditions shown in Table 18. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment I1, except that the metal tube wire used in Experiment I1 was a copper tube having a wall thickness of 0.005 mm. Then, an evaluation test was performed under the conditions shown in Table 16, and the results shown in Table 16 were obtained. When the experiment i6 is compared with the experiment I1, in the experiment i6, the moisture permeability is high, and the type and the wire diameter of the metal wire tube are such that the stainless steel wire diameter of 0.1 mm has a copper wire diameter of 0.005 mm. It turns out that it is more suitable than the one.
[0379]
(Experiment I7) A sample was prepared under the conditions shown in Table 15. That is, stainless steel was used instead of the metallic copper used in Experiment I1, and a stainless steel wire having an average wire diameter of 0.5 mm, a wall thickness of 0.1 mm, and a length of 1.0 m was obtained in the same manner as in Experiment I1. The obtained tube wire was coated with eutectic solder Pb / Sn = 5/95 (melting point: 183 ° C.), and further, as a resin composition, an acrylic resin (manufactured by Hitachi Chemical Co., Ltd., moisture-proof insulating material TF-3348-). 15F2), and coated so that the resin thickness became 20 μm. As in Experiment I1, a sealing material was prepared from the two coated wires and placed on soda glass, and the curing of the resin was changed to 2.4 J / cm instead of heating in Experiment I1. ² , And a sample for adhesion and a sample for moisture permeability measurement were prepared in the same manner as in Experiment I1. Then, an evaluation test was performed under the conditions shown in Table I3, and the results shown in Table I3 were obtained.
[0380]
(Experiment i7) A sample was prepared under the conditions shown in Table 18. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment I3, except that the coating metal layer used in Experiment I3 was made 0.0005 mm thick by electrolytic plating. Then, an evaluation test was performed under the conditions shown in Table 18, and the results shown in Table 18 were obtained. Comparing Experiment i7 with Experiment I3, it can be seen that in Experiment i7, the moisture permeability is high, and that the thickness of the coating metal layer is 0.3 mm is more suitable than 0.0005 mm.
[0381]
(Experiment I8) A sample was prepared under the conditions shown in Table 15. That is, stainless steel was used instead of the metallic copper used in Experiment I1, and a stainless steel wire having an average wire diameter of 0.5 mm, a wall thickness of 0.1 mm, and a length of 1.0 m was obtained in the same manner as in Experiment I1. The obtained tube wire was coated with eutectic solder In / Zn = 97.2 / 2.8 (melting point: 144 ° C.), and the same epoxy resin as in Experiment I1 was used as a resin composition, and the resin thickness was reduced to 20 μm. Coating. In the same manner as in Experiment I1, a sealing material was prepared from the two coated wires, and a bonding sample and a moisture permeability measurement sample were prepared through a softening temperature on soda glass and heating and pressing at 120 ° C. Then, an evaluation test was performed under the conditions shown in Table 15, and the results shown in Table 15 were obtained.
[0382]
(Experiment i8) A sample was prepared under the conditions shown in Table 18. That is, a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment I8 except that the temperature at which the resin composition used in Experiment I8 was cured was set to 215 ° C. Then, an evaluation test was performed under the conditions shown in Table 18, and the results shown in Table 18 were obtained. When this experiment i8 is compared with experiment I8, in experiment i8, an abnormality was observed in which the EL element turned black, and it was found that the EL element was oxidized and corroded. Therefore, it is understood that the curing temperature of the resin composition is more preferably 120 ° C. than 215 ° C.
[0383]
[Table 13]

[Table 14]

[Table 15]

[Table 16]

[Table 17]

[Table 18]

(Experiment J1) A 1 KW plasma treatment was performed by a plasma treatment machine at a speed of 10 m / min while a nylon monofilament (manufactured by Toray Industries, Inc., average wire diameter: 0.1 mm, elastic modulus: 4.0 GPa) was conveyed as a core. Applied to the surface. After subjecting the surface-treated nylon monofilament to a seeder treatment with palladium chloride, 0.2 μm copper is precipitated in an electroless copper plating solution, and Sn / In = 48/52 eutectic solder is used in a conventional manner (melting point: 117 ° C.). In the plating bath, electrolytic plating was performed until the diameter of the solder-coated monofilament became 160 μm (coating thickness: 30 μm). The solder coverage was 99% or more.
[0384]
100 parts by weight of an epoxy resin composition (Alteco 3500, manufactured by Alpha Giken Co., Ltd., modified epoxy resin / modified polyamine = 100/50), 4 parts by weight of 4-methyl-2-ethylimidazole, and oxidation as a drying agent Add 10 parts by weight of barium (manufactured by Wako Pure Chemical Industries, Ltd.) and use an applicator so that the film thickness becomes 100 μm on a PET film (manufactured by Toyobo Co., Ltd., A-4100, film thickness 75 μm). It was applied to form an epoxy resin film. The above-mentioned solder-coated nylon monofilament was arranged on this film and buried as shown in FIG. 26 (c) to obtain a sheet-like sealing material.
[0385]
The obtained sheet-like sealing material is stuck on the outer periphery along four sides of a 25 mm × 100 mm soda glass so that the film width becomes 2 mm, and heated at 80 ° C. (softening temperature of resin) and 1 MPa for 10 minutes. Then, the PET film on the upper surface was peeled off. Next, another glass was bonded to the exposed epoxy resin so as to face each other, and the resin was cured by heating and pressing at 120 ° C. and 3 MPa for 60 minutes to obtain a sample for measuring adhesive strength. On the other hand, using two pieces of soda glass of 100 mm × 100 mm, according to JIS K-7129, a sealing material is attached to the outer peripheral portion along the four sides of the glass so that the film width becomes 2 mm, and the same temperature and temperature as described above are used. Glasses were joined together under pressure conditions to obtain a sample for moisture permeability measurement.
[0386]
An evaluation test was performed under the conditions shown in Table 19, and the results shown in Table 19 were obtained.
[0387]
(Experiment j1) An adhesion sample and a moisture permeability measurement sample were prepared and evaluated in the same manner as in Experiment J1, except that the wire diameter of the used nylon monofilament was changed to 7 mm. The result was obtained.
[0388]
The comparison between Experiment J1 and Experiment j1 shows the effect of the difference in the diameter of the monofilament on the moisture permeability and the adhesive strength. When the wire diameter of the monofilament increased, both the initial value and the value after standing at 1000 ° C. at a temperature of 60 ° C. and a humidity of 90% both increased. As the wire diameter became larger, both the initial value and the value after standing at 1000 ° C. at a temperature of 60 ° C. and a humidity of 90% both increased as the wire diameter increased. That is, as the wire diameter of the monofilament increases, the adhesive strength increases, but the moisture permeability also increases. Therefore, when the wire diameter of the monofilament is large, there is a problem in the long-term stability of the EL display device.
[0389]
(Experiment J2) Samples were prepared under the conditions shown in Table 19 by changing the procedure of Experiment J1 as follows. That is, PET monofilaments (manufactured by Toray Industries, Inc., polyester monofilaments, average wire diameter 0.8 mm, elastic modulus 10 GPa) were used in place of the nylon monofilaments used in the experiment J1, and the coating metal was replaced with Sn / In instead of Sn / In. Electroplating was performed using a crystal solder Sn / Bi = 43/57 (melting point: 139 ° C.) until the diameter of the solder-coated monofilament became 820 μm (coating thickness: 10 μm). The solder coverage was 99% or more.
[0390]
Further, as the resin adhesive, an acrylic resin (manufactured by Hitachi Chemical Co., Ltd., TF-3348-15F2G) was used instead of the epoxy resin, and barium oxide (manufactured by Wako Pure Chemical Industries, Ltd.) was added at 10 wt. The resulting mixture was coated on a PET film (A-4100, manufactured by Toyobo Co., Ltd., A-4100, film thickness 75 μm) using an applicator so that the film thickness became 820 μm, to obtain an acrylic resin film. The above-mentioned solder-coated PET monofilament was arranged and buried on the obtained resin film to obtain a sheet-like sealing material as shown in FIG.
[0391]
A sealing material was stuck on soda glass in the same manner as in Experiment J1, and the resin was cured under a pressure of 1.0 J / cm under the same conditions as in Experiment J1. ² , And heating at 150 ° C. was also performed at this time to prepare a sample for adhesion and a sample for moisture permeability measurement. An evaluation test was performed, and the results shown in Table 19 were obtained.
[0392]
(Experiment j2) The same as Experiment J2 except that a polyethylene monofilament having an average wire diameter of 0.8 mm and an elastic modulus of 0.1 GPa (a polyethylene monofilament manufactured by Toray Industries, Inc.) was used instead of the PET monofilament used. Then, a sample for adhesion and a sample for moisture permeability measurement were prepared.
[0393]
The comparison between Experiment J2 and Experiment j2 shows the effect of the difference in the material and elastic modulus of the monofilament on the moisture permeability and the adhesive strength. When the elastic modulus was lowered, both the initial value and the value after leaving at 1000 ° C. at a temperature of 60 ° C. and a humidity of 90% both decreased. Regarding the adhesive strength, even when the elastic modulus increased, the initial value and the value after standing at 1000 ° C. at a temperature of 60 ° C. and a humidity of 90% did not change. That is, when the elastic modulus of the monofilament decreases, the adhesive force does not change, but the moisture permeability increases. Therefore, when the elastic modulus of the monofilament is small, there is a problem in the long-term stability of the EL display device.
[0394]
(Experiment J3) A sample was produced under the conditions shown in Table 19 by changing the procedure of Experiment J1 as follows. That is, instead of the nylon monofilament used in Experiment J1, polypropylene monofilament (manufactured by Hagiwara Kogyo Co., Ltd., malfrene, average wire diameter 0.2 mm, elastic modulus 5.5 GPa) was used, and instead of Sn / In as a coating metal, Using eutectic solder Bi / Cd = 60/40 (melting point: 144 ° C.), electrolytic plating was performed until the diameter of the solder-coated monofilament became 240 μm (coating thickness: 20 μm). The solder coverage was 99% or more.
[0395]
Further, as the resin adhesive, a polyester resin / crosslinking agent = 100/2 (polyester resin: manufactured by Toyobo Co., Byron VG700, crosslinker: Nippon Polyurethane Co., Ltd., Coronate L) is used instead of the epoxy resin. Then, 20 parts by weight of calcium oxide as a desiccant (manufactured by Wako Pure Chemical Industries, Ltd.) was added, and a polypropylene film (manufactured by Hitachi Chemical Co., Ltd., K8-40) was used instead of PET as a base material. The above resin adhesive was applied to a substrate to form a polyester resin film having a thickness of 200 μm. The above-mentioned solder-coated polypropylene monofilament was arranged and buried on the obtained resin film to obtain a sheet-like sealing material of FIG. 26 (c).
[0396]
A sealing material was stuck on soda glass in the same manner as in Experiment J1, and the resin was cured by changing the heating temperature to 150 ° C. under the same pressure conditions as in Experiment J1, and a sample for adhesion and a sample for moisture permeability measurement were used. Was prepared. An evaluation test was performed, and the results shown in Table 19 were obtained.
[0397]
(Experiment j3) A bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment J3 except that Pb 100% was used as the coating metal.
[0398]
A comparison between Experiment J3 and Experiment j3 shows the effect of the difference in metal on moisture permeability and adhesion. When the coating metal was Pb, the initial value of the adhesive force and the value after standing at 1000 ° C. at a temperature of 60 ° C. and a humidity of 90% did not change much, but the moisture permeability increased in any value. did. Since Pb is a soft and easily deformable metal, it is considered that a gap is formed between the bonded substrates due to scratches or irregularities on the surface of the coated metal before sealing, and the moisture permeability is increased. However, such gaps are solved by melting the metal during sealing. This problem can be easily solved by heating at the time of sealing if Pb has a high melting point but a metal having a low melting point.
[0399]
(Experiment J4) Samples were produced under the conditions shown in Table 19 by changing the procedure of Experiment J1 as follows. That is, polyphenylene sulfide monofilament (manufactured by Toray Industries, Inc., average wire diameter: 0.5 mm, elastic modulus: 3.5 GPa) was used instead of nylon monofilament, and eutectic solder Ag / In = instead of Sn / In as a coating metal was used. Using 10/90 (melting point: 204 ° C.), electrolytic plating was performed until the diameter of the solder-coated monofilament became 510 μm (coating thickness: 5 μm). However, the monofilament was plated without performing the plasma treatment. The solder coverage was 99% or more.
[0400]
Further, as a resin adhesive, SBS rubber (Clayton D-1101CU manufactured by Shell Japan Co., Ltd.) was used instead of epoxy resin, and 15 parts by weight of calcium oxide (manufactured by Wako Pure Chemical Industries, Ltd.) as a desiccant was added. did. Further, a polycarbonate sheet (manufactured by Teijin Chemicals Ltd., Panlite L-1250, 135 ° C., 20 kgf / cm) instead of a PET film as a base material ² Press to adjust the thickness to 550 μm), and apply a resin adhesive to the substrate in the same manner as in Experiment J1 to form a 550 μm-thick film. A sheet-like sealing material of 26 (e) was obtained.
[0401]
The sealing material is placed on the soda glass in the same manner as in Experiment J1 and is adhered by heating to 100 ° C., and the resin is cured by changing the heating temperature to 210 ° C. under the same pressure conditions as in Experiment J1. And a sample for moisture permeability measurement were prepared. An evaluation test was performed, and the results shown in Table 19 were obtained.
[0402]
(Experiment j4) A sample for adhesion and a sample for moisture permeability measurement were produced in the same manner as in Experiment J4 except that the thickness of the coated metal was changed to 7 mm.
[0403]
The comparison between Experiment J4 and Experiment j4 shows the effect of the difference in the thickness of the coated metal on the moisture permeability and the adhesive strength. Regarding the moisture permeability, even when the thickness of the coating metal layer was increased, neither the initial value nor the value after standing at 1000 ° C. at a temperature of 60 ° C. and a humidity of 90% did not change. As the thickness of the coating metal layer increased, the initial value and the value after leaving the substrate at 1000 ° C. at a temperature of 60 ° C. and a humidity of 90% drastically decreased. That is, when the thickness of the coating metal layer is increased, the moisture permeability does not change, but the adhesive force is drastically reduced. Therefore, when the metal layer is thick, there is a problem in long-term stability of the EL display device.
[0404]
(Experiment J5) A sample was produced under the conditions shown in Table 19 by changing the procedure of Experiment J1 as follows. That is, instead of nylon monofilament, PET monofilament (manufactured by Toray Industries, Inc., polyester monofilament, average wire diameter 0.1 mm, elastic modulus 10 Gpa) is used, and eutectic solder Bi is used as a low melting point metal instead of Sn / In. Electroplating was performed using /Pb=56.5/43.5 (melting point 125 ° C.) until the diameter of the solder-coated monofilament became 110 μm (coating thickness 5 μm). The solder coverage was 99% or more.
[0405]
Further, as the resin adhesive, xylene / acrylic resin = 80/20 (xylene resin: Nikonol HP-100 manufactured by Mitsubishi Gas Chemical Co., Ltd.), acrylic resin: HTR- manufactured by Teikoku Chemical Industry Co., Ltd. instead of epoxy resin 860P-3), 20 parts by weight of calcium oxide (manufactured by Wako Pure Chemical Industries, Ltd.) is added as a desiccant, and a polyimide film (manufactured by Dupont Toray Kapton Co., Ltd.) is used instead of PET as a base material. 100H), a resin adhesive was applied to the substrate in the same manner as in Experiment J1, to form a 200 μm-thick xylene / acrylic resin film. The above-mentioned solder-coated PET monofilament was arranged and embedded on the obtained film to obtain a sheet-like sealing material shown in FIG. 26 (d).
[0406]
A sealing material was stuck on soda glass in the same manner as in Experiment J1, and the resin was cured by changing the heating temperature to 140 ° C. under the same pressurizing conditions as in Experiment J1, and a sample for adhesion and a sample for moisture permeability measurement were used. Was prepared. An evaluation test was performed, and the results shown in Table 19 were obtained.
[0407]
(Experiment j5) An adhesive sample and a moisture permeability measurement sample were produced in the same manner as in Experiment J5 except that the coverage of the core material with the metal was 40%.
[0408]
The comparison between Experiment J5 and Experiment j5 shows the effect of the difference in the coverage of the core material with the metal on the moisture permeability and the adhesive strength. As for the moisture permeability, when the coverage of the core material with the metal decreased, both the initial value and the value after standing at 1000 ° C. at a temperature of 60 ° C. and a humidity of 90% both increased drastically. Regarding the adhesive strength, even when the coverage of the core material with the metal decreased, the initial value and the value after standing at 1000 ° C. at 60 ° C. and 90% humidity did not change. In other words, when the coverage of the core material decreases, the moisture permeability increases sharply. Therefore, when the coverage of the core material by metal is low, there is a problem in the long-term stability of the EL display device.
[0409]
(Experiment J6) A sample was produced under the conditions of Table 19 by changing the procedure of Experiment J1 as follows. That is, instead of nylon monofilament, polypropylene monofilament (manufactured by Hagiwara Kogyo KK, Malfrene, average wire diameter 0.2 mm, elastic modulus 5.5 GPa) was used, and eutectic solder Bi was used instead of Sn / In as a coating metal. Using / Sn / Zn = 56/40/4 (130 ° C.), fusion plating was performed until the diameter of the solder-coated monofilament became 210 μm (coating thickness: 5 μm). The solder coverage was 99% or more.
[0410]
Further, as the resin adhesive, a polyester resin / crosslinking agent = 100/2 (polyester resin: manufactured by Toyobo Co., Byron VG700, crosslinker: Nippon Polyurethane Co., Ltd., Coronate L) is used instead of the epoxy resin. Then, 20 parts by weight of calcium oxide (manufactured by Wako Pure Chemical Industries, Ltd.) as a desiccant was added, and a resin adhesive was applied to the substrate in the same manner as in Experiment J1 to form a xylene / acrylic resin film having a thickness of 210 μm. Got. However, a polypropylene film (K8-40, manufactured by Hitachi Chemical Co., Ltd.) was used instead of PET as the substrate. The above-mentioned solder-coated polypropylene monofilament was arranged and buried on the obtained film to obtain a sheet-like sealing material shown in FIG.
[0411]
A sealing material was stuck on soda glass in the same manner as in Experiment J1, and the resin was cured by changing the heating temperature to 140 ° C. under the same pressurizing conditions as in Experiment J1, and a sample for adhesion and a sample for moisture permeability measurement were used. Was prepared. An evaluation test was performed, and the results shown in Table 19 were obtained.
[0412]
(Experiment j6) Except that the heating temperature for curing the resin adhesive was changed from 140 ° C. to 250 ° C., a bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment J6.
[0413]
The comparison between Experiment J6 and Experiment j6 shows the effect of the difference in the curing temperature of the resin adhesive on the appearance of the EL element. When the heating temperature was raised to 250 ° C., dark spots were generated, the appearance was deteriorated, and the quality as a display element was deteriorated. Therefore, when the heating temperature required for curing the resin adhesive is too high, the appearance and quality of the EL display device are deteriorated.
[0414]
(Experiment J7) A sample was produced under the conditions of Table 19 by changing the procedure of Experiment J1 as follows. That is, instead of nylon monofilament, polyvinyl chloride monofilament (Ryuron paste 772, manufactured by Tosoh Corporation, average wire diameter 0.5 mm, elastic modulus 3.8 GPa) was used, and instead of Sn / In as a coating metal, Using eutectic solder Pb / Sn = 5/95 (melting point: 183 ° C.), fusion plating was performed until the diameter of the solder-coated monofilament became 510 μm (coating thickness: 5 μm). The solder coverage was 99% or more.
[0415]
Further, as a resin adhesive, an acrylic resin (manufactured by Hitachi Chemical Co., Ltd., moisture-proof insulating material TF-3348-15F2) is used instead of the epoxy resin, and barium oxide (manufactured by Wako Pure Chemical Industries, Ltd.) as a desiccant is used. ) Was added in an amount of 5 parts by weight, and a resin adhesive was applied to the substrate in the same manner as in Experiment J1 to obtain an acrylic resin film having a thickness of 400 μm. However, a polyethylene film (manufactured by Hitachi Chemical Co., Ltd., CA-60) was used instead of PET. The above-mentioned solder-coated polyvinyl chloride monofilament was arranged and buried on the obtained resin film to obtain a sheet-like sealing material shown in FIG. 26 (c).
[0416]
A sealing material was stuck on soda glass in the same manner as in Experiment J1, and the resin was cured at 2.4 J / cm under the same pressure conditions as in Experiment J1. ² At 200 ° C., and a sample for adhesion and a sample for moisture permeability measurement were prepared. An evaluation test was performed, and the results shown in Table 19 were obtained.
[0417]
(Experiment j7) An adhesion sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment J7 except that the thickness of the resin adhesive applied on the substrate was 1.5 mm.
[0418]
The comparison between Experiment J7 and Experiment j7 shows the effect of the difference in the thickness of the resin adhesive film on the moisture permeability and the adhesive strength. As the thickness of the resin adhesive film increased, both the initial value and the value after standing at 1000 ° C. at a temperature of 60 ° C. and a humidity of 90% both increased as the moisture permeability increased. When the thickness of the resin adhesive film was increased, the initial value and the value after standing at 1000 ° C. at a temperature of 60 ° C. and a humidity of 90% did not change. That is, when the film thickness of the moisture-proof adhesive layer is increased, the adhesive force does not change but the moisture permeability increases. Therefore, when the resin adhesive film is thick, there is a problem in the long-term stability of the EL display device.
[0419]
(Experiment J8) Samples were prepared under the conditions shown in Table 19 by changing the procedure of Experiment J1 as follows. That is, a solder-coated monofilament was obtained in the same manner as in Experiment J1, except that the nylon monofilament was not subjected to the plasma treatment, and the solder was applied by fusion plating so that the diameter of the solder-coated monofilament became 110 μm (5 μm in thickness). Was. The solder coverage was 99% or more.
[0420]
Further, as a resin adhesive, instead of an epoxy resin, a UV-curable cationic polymer resin composition [Epicoat 1001 / Epicoat 828 (above, bisphenol type epoxy resin, Yuka Shell Co., Ltd.) / Nipol 1032 (Nitrile rubber, Nippon Zeon ( / Hitanol 2400 (Alkylphenol, manufactured by Hitachi Chemical Co., Ltd.) / Triphenylsulfonium salt-based curing agent (Triphenylsulfonium hexafluoroantimonate, manufactured by Asahi Denka Co., Ltd.) / Barium oxide = 50/20 / Resin composition having a mixing ratio of 20/10/4/10], and using a micro syringe, a PET film (manufactured by Toyobo Co., Ltd., A-4100, film thickness 75 µm), a film thickness of 120 µm, and a width of 120 µm. A resin film was formed by coating to a thickness of 2 mm. The coated nylon monofilament was placed and embedded to obtain a sheet-like sealing material shown in FIG. 26 (b).
[0421]
A sealing material was stuck on soda glass in the same manner as in Experiment J1, and the resin was cured at 6 J / cm under the same pressure conditions as in Experiment J1. ² , And heating at 120 ° C. was also performed at this time to prepare a bonding sample and a moisture permeability measurement sample. An evaluation test was performed, and the results shown in Table 19 were obtained.
[0422]
(Experiment j8) An adhesion sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment J8 except that the thickness of the resin adhesive applied on the substrate was 0.5 μm.
[0423]
The comparison between Experiment J8 and Experiment j8 shows the effect of the difference in the thickness of the resin adhesive film on the moisture permeability and the adhesive strength. When the film thickness of the resin adhesive became small, both the initial value and the value after leaving at 1000 ° C. at a temperature of 60 ° C. and a humidity of 90% both decreased when the film thickness of the resin adhesive became small. As the thickness of the resin adhesive became smaller, the initial value and the value after leaving the resin adhesive at 1000 ° C. at a temperature of 60 ° C. and a humidity of 90% were decreased. That is, as the thickness of the resin adhesive decreases, the adhesive strength decreases and the moisture permeability increases. Therefore, when the thickness of the resin adhesive is small, there is a problem in the long-term stability of the EL display device.
[0424]
[Table 19]

[Table 20]

(Experiment K1) While a nylon monofilament (manufactured by Toray Industries, Inc., average wire diameter: 0.1 mm, elastic modulus: 4.0 GPa) is vibrated and conveyed as a core material, a plasma processing machine performs 1 KW plasma processing at a speed of 10 m / min. Applied to the surface. A polyfunctional isocyanate compound (Coronate L, manufactured by Nippon Polyurethane Co., Ltd.) was added to 100 parts by weight of an epoxy resin composition (Alteco 3500, manufactured by Alpha Giken Co., Ltd., modified epoxy resin / modified polyamine = 100/50). The plasma-treated nylon monofilament was immersed in a 10% MEK solution of a primer prepared by adding parts by weight for 1 minute, and dried and cured at 120 ° C. for 10 minutes to perform a primer treatment. Thereafter, electrolytic plating was performed by a conventional method in a plating bath of Sn / In = 48/52 eutectic solder (melting point: 117 ° C.) until the diameter of the solder-coated monofilament became 160 μm (coating thickness: 30 μm). The solder coverage was 99% or more.
[0425]
100 parts by weight of an epoxy resin composition (Alteco 3500, manufactured by Alpha Giken Co., Ltd., modified epoxy resin / modified polyamine = 100/50), 4 parts by weight of 4-methyl-2-ethylimidazole, and oxidation as a drying agent 10 parts by weight of barium (manufactured by Wako Pure Chemical Industries, Ltd.) is added, and the thickness is set to 100 μm on a PET film (manufactured by Toyobo Co., Ltd., A-4100, film thickness 75 μm) using an applicator. It was applied to form an epoxy resin film. The above-mentioned solder-coated nylon monofilament was arranged on this film and buried as shown in FIG. 26 (c) to obtain a sheet-like sealing material.
[0426]
The obtained sheet-like sealing material is stuck on the outer periphery along four sides of a 25 mm × 100 mm soda glass so that the film width becomes 2 mm, and heated at 80 ° C. (softening temperature of resin) and 1 MPa for 10 minutes. Then, the PET film on the upper surface was peeled off. Next, another glass was bonded to the exposed epoxy resin so as to face each other, and the resin was cured by heating and pressing at 120 ° C. and 3 MPa for 60 minutes to obtain a sample for measuring adhesive strength. On the other hand, using two pieces of soda glass of 100 mm × 100 mm, according to JIS K-7129, a sealing material is attached to the outer peripheral portion along the four sides of the glass so that the film width becomes 2 mm, and the same temperature and temperature as described above are used. Glasses were joined together under pressure conditions to obtain a sample for moisture permeability measurement.
[0427]
An evaluation test was performed under the conditions shown in Table 21, and the results shown in Table 21 were obtained.
[0428]
(Experiment k1) A bonding sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment K1, except that the electrolytic plating was performed so that the coverage of the nylon monofilament with the solder was 40%. The results shown in Table 22 were obtained.
[0429]
The comparison between Experiment K1 and Experiment k1 shows the effect of the difference in the coverage by the solder on the moisture permeability and the adhesive strength. As the moisture permeability decreased, the initial value and the value after standing for 1000 hours at a temperature of 80 ° C. and a humidity of 90% both increased when the coverage by the solder became small. Regarding the adhesive strength, even when the coverage was reduced, neither the initial value nor the value after standing for 1000 hours at a temperature of 80 ° C. and a humidity of 90% did not change. That is, when the coverage by the solder decreases, the moisture permeability increases, and thus there is a problem in the long-term stability of the EL display device.
[0430]
(Experiment K2) A sample was produced under the conditions shown in Table 21 by changing the procedure of Experiment K1 as follows. That is, instead of the nylon monofilament used in the experiment K1, PET monofilament (manufactured by Toray Industries, Inc., polyester monofilament, average wire diameter 0.1 mm, elastic modulus 10 GPa) was used, and an acrylic resin (manufactured by Hitachi Chemical Co., Ltd.) was used. , Changed to a moisture-proof insulating material TF-3348-15F2G), and applied to a PET monofilament, 1.0 J / cm ² The acrylic resin was cured by UV irradiation. Electroplating this monofilament using a eutectic solder Sn / Bi = 43/57 (melting point 139 ° C.) instead of Sn / In as the coating metal until the diameter of the solder-coated monofilament becomes 120 μm (coating thickness 10 μm). Was given. The solder coverage was 99% or more.
[0431]
Further, as the resin adhesive, an acrylic resin (manufactured by Hitachi Chemical Co., Ltd., TF-3348-15F2G) was used instead of the epoxy resin, and barium oxide (manufactured by Wako Pure Chemical Industries, Ltd.) was added at 10 wt. The resulting mixture was applied to a PET film (A-4100, manufactured by Toyobo Co., Ltd., A-4100, film thickness: 75 μm) using an applicator so that the film thickness became 120 μm, to obtain an acrylic resin film. The above-mentioned solder-coated PET monofilament was arranged and embedded on the obtained resin film to obtain a sheet-like sealing material shown in FIG.
[0432]
A sealing material was stuck on soda glass in the same manner as in Experiment K1, and curing of the resin was performed under the same pressure conditions as in Experiment K1 at 1.0 J / cm. ² , And heating at 150 ° C. was also performed at this time to prepare a sample for adhesion and a sample for moisture permeability measurement. An evaluation test was performed, and the results shown in Table 21 were obtained.
[0433]
(Experiment k2) An adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment K2, except that neither the plasma treatment nor the primer treatment was performed.
[0434]
The comparison between Experiment K2 and Experiment k2 shows the effect of the presence or absence of the surface treatment of the monofilament with the plasma and the primer on the moisture permeability and the adhesive strength. In the experiment k2, the value of the moisture permeability decreased after being left at 1000 ° C. at a temperature of 80 ° C. and a humidity of 90% unless subjected to the surface treatment. Did not change). Even if the surface treatment was not performed, the initial value of the adhesive strength did not change, nor did the value after leaving for 1000 hours at a temperature of 80 ° C. and a humidity of 90%. In other words, when there is no surface treatment with plasma or primer, the adhesive strength does not change but the moisture permeability increases, and there is a problem in long-term stability of the EL display device under severe conditions.
[0435]
(Experiment K3) Samples were produced under the conditions shown in Table 21 by changing the procedure of Experiment K1 as follows. That is, a polypropylene monofilament (manufactured by Hagiwara Kogyo Co., Ltd., Malfrene, average wire diameter 0.2 mm, elastic modulus 5.5 GPa) was used instead of the nylon monofilament used in Experiment K1, and the primer was a polyester resin / crosslinking agent = 100 / 2 (polyester resin: manufactured by Toyobo Co., Ltd., Byron VG700, cross-linking agent: Nippon Polyurethane Co., Ltd., Coronate L), and without plasma treatment, polypropylene monofilament was added to a 10% MEK solution of a primer in 1%. After immersion for 10 minutes and drying and curing at 120 ° C. for 10 minutes, a primer treatment was performed. Then, using eutectic solder Bi / Cd = 60/40 (melting point 144 ° C.) instead of Sn / In as the coating metal, electrolytic plating was performed until the diameter of the solder-coated monofilament became 240 μm (coating thickness 20 μm). gave. The solder coverage was 99% or more.
[0436]
Further, as the resin adhesive, a polyester resin / crosslinking agent = 100/2 (polyester resin: manufactured by Toyobo Co., Byron VG700, crosslinker: Nippon Polyurethane Co., Ltd., Coronate L) is used instead of the epoxy resin. Then, 20 parts by weight of calcium oxide as a desiccant (manufactured by Wako Pure Chemical Industries, Ltd.) was added, and a polypropylene film (manufactured by Hitachi Chemical Co., Ltd., K8-40) was used instead of PET as a base material. The above resin adhesive was applied to a substrate to form a polyester resin film having a thickness of 200 μm. The above-mentioned solder-coated polypropylene monofilament was arranged and buried on the obtained resin film to obtain a sheet-like sealing material of FIG. 26 (c).
[0437]
In the same manner as in Experiment K1, a sealing material was stuck on soda glass, and the resin was cured by changing the heating temperature to 150 ° C. under the same pressurizing conditions as in Experiment K1, and used for adhesion samples and moisture permeability measurement. A sample was prepared. An evaluation test was performed, and the results shown in Table 21 were obtained.
[0438]
(Experiment k3) An adhesive sample and a moisture permeability measurement sample were prepared in the same manner as in Experiment K3 except that the primer treatment was not performed.
[0439]
The comparison between Experiment K3 and Experiment k3 shows the effect of the presence or absence of the primer treatment on the moisture permeability and the adhesive strength. Even if the adhesion was not performed, the initial value and the value after standing at a temperature of 80 ° C. and a humidity of 90% for 1000 hours did not change so much without performing the primer treatment. The value increased (however, when the temperature was 60 ° C., the value did not change even after 1000 hours. That is, when the surface treatment with the primer was not performed, the adhesive force did not change but the moisture permeability increased. However, there is a problem in long-term stability of EL display devices under severe conditions.
[0440]
(Experiment K4) The same procedure as in Experiment K3 was carried out, except that the surface of the core material was subjected to 1 KW plasma treatment with a plasma treatment machine at a speed of 10 m / min without performing the primer treatment. A measurement sample was prepared.
[0441]
As a result of the evaluation test, the value of the moisture permeability after leaving for 1000 hours at 80 ° C. and 90% humidity slightly increased. Also, good values were obtained.
[0442]
(Experiment K5) The same procedure as in Experiment K3 was carried out except that the core material surface was subjected to a 5 KW pucorona discharge treatment by a corona treatment machine at a speed of 20 m / min without performing the primer treatment. A sample for humidity measurement was prepared.
[0443]
As a result of the evaluation test, the value of the moisture permeability after leaving for 1000 hours at 80 ° C. and 90% humidity slightly increased. Also, good values were obtained.
[0444]
[Table 21]

[Table 22]

(Experiment L1) A nylon fiber having a diameter of 100 μm was immersed in isopropyl alcohol to be degreased, and then the surface was subjected to plasma treatment. Furthermore, after subjecting to a seeder treatment with palladium chloride, it was immersed in an electroless copper plating solution (CUST2000, manufactured by Hitachi Chemical Co., Ltd.) at a solution temperature of 25 ° C. for 10 minutes to precipitate 0.2 μm copper. The copper plating film at this time was brittle and easily peeled. Further, the current density is 0.003 A / cm in the electrolytic copper plating solution. ² , And the electrolytic copper plating was performed at a liquid temperature of 25 ° C. for 5 minutes. After washing this in distilled water, it was dried at 120 ° C. for 10 minutes using a drier. The diameter of the plating-coated fiber was 160 μm (coating thickness 30 μm, solder coverage was 99% or more), and the copper plating film had a strength that did not cause peeling. Further, the copper plated fiber was subjected to a current density of 0.25 A / cm using an electrolytic plating solution of Sn / In = 48/52 eutectic solder (manufactured by Ishihara Chemical Co., Ltd.). ² The current value was adjusted so as to obtain a solution temperature of 25 ° C. for 10 minutes to perform Sn / In eutectic alloy electrolytic plating. As a result, a good Sn / In eutectic alloy coating with a film thickness of 15 ± 1 μm was formed, and the uniformity of the film thickness of the Sn / In alloy plating was very high.
[0445]
(Experiment L2) A soft copper wire having a diameter of 100 μm was immersed in isopropyl alcohol and degreased for 10 minutes, and then the current density was increased to 0% using an electrolytic plating solution of Sn / In = 48/52 eutectic solder (manufactured by Ishihara Chemical Co., Ltd.). 3A / cm ² The current value was adjusted so as to obtain a solution temperature of 25 ° C. for 10 minutes to perform Sn / In eutectic alloy electrolytic plating. As a result, a good Sn / In eutectic alloy coating having a film thickness of 20 ± 1 μm was formed, and the uniformity of the film thickness of the Sn / In alloy plating was very high.
[0446]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the sealing material and the sealing structure which are excellent in the moisture-proof property after an initial stage and after heating and humidifying for a long time, and which can implement | achieve sealing with favorable adhesiveness of joining of a board | substrate and a counter substrate are provided. be able to.
[0447]
Further, according to the present invention, the substrate and the opposing substrate are sealed using the sealing structure having excellent adhesion and moisture-proof functions, so that the durability and reliability of the mounted functional elements are improved, and the moisture-proof property is improved. It is possible to provide a long-life package excellent in heat resistance and oxidation resistance.
[0448]
Further, it is possible to provide a sheet-like sealing material which can firmly join the substrate and the counter substrate in a temperature range where the functional element and the substrate are not damaged, has a spacer function, and is excellent in workability.
[Brief description of the drawings]
FIG. 1A is a cross-sectional view of a mounting body according to a first embodiment of the present invention, which is perpendicular to the substrate before the substrate is joined, FIG. FIG. 2C is a schematic configuration diagram (c) parallel to the substrate for explaining the arrangement of the sealing material of the mounting body in FIGS. 1A and 1B.
FIGS. 2A and 2B are cross-sectional views illustrating an example of a manufacturing process of a strip member of a sealing material according to the first embodiment.
FIGS. 3A and 3B are cross-sectional views (a) and (b) for explaining another example of the manufacturing process of the strip member of the sealing material according to the first embodiment.
FIGS. 4A and 4B are cross-sectional views (a) and (b) for explaining another example of the manufacturing process of the strip member of the sealing material according to the first embodiment.
5A, 5B, 5C, and 5D are cross-sectional views of a core material of a sealing material according to the first embodiment.
FIG. 6 shows an example of an arrangement state of a sealing member according to the first embodiment, wherein (b), (c), (d), and (e) are schematic configuration diagrams parallel to the substrate, and (a) is FIG. 7 is a cross-sectional view taken along line AA ′ of FIGS. 6 (b), (c), (d), and (e).
FIGS. 7A to 7F are schematic views (a) to (f) of a manufacturing process for explaining a method of manufacturing the mounted body according to the first embodiment.
FIGS. 8A to 8C are schematic diagrams (a) to (c) of a manufacturing process for explaining another example of the method for manufacturing the mounted body in the first embodiment.
FIG. 9 is a cross-sectional view of a main part showing a sealing structure under pressure in the manufacture of the mounted body according to the first embodiment.
FIG. 10 is a cross-sectional view of a main part viewed from the direction of line BB ′ in FIG. 6B for explaining a manufacturing process of the mounted body in the arrangement of the sealing structure in FIG. 6B; In the figure, (a) shows before bonding and (b) shows after bonding.
FIGS. 11A to 11G are cross-sectional views (a) to (g) perpendicular to the substrate, showing application examples of the sealing structure.
FIG. 12A is a cross-sectional view perpendicular to the substrate before the substrate is joined to the mounted body according to the second embodiment of the present invention; FIG. 12B is a cross-sectional view perpendicular to the substrate showing the mounted body after the substrate is bonded; FIG. 13C is a schematic configuration diagram (c) parallel to the substrate for explaining the arrangement of the sealing material of the mounting body in FIGS. 12A and 12B.
FIG. 13 is cross-sectional views (a), (b), and (c) for explaining an example of a sealing material according to the second embodiment.
FIGS. 14A to 14F are cross-sectional views (a) to (f) of a sealing material according to the second embodiment.
FIGS. 15A to 15E are schematic diagrams (a) to (e) of a manufacturing process for explaining a method of manufacturing a package according to the second embodiment.
FIG. 16 shows an example of an arrangement state of a sealing member in the second embodiment, where (b), (c), (d), and (e) are schematic configuration diagrams parallel to the substrate, and (a) is FIG. 17 is a cross-sectional view taken along line AA ′ of FIGS. 16 (b), (c), (d), and (e).
FIG. 17 is an essential part cross-sectional view showing a sealing structure under pressure in the manufacture of a package according to the second embodiment.
FIG. 18 is a cross-sectional view of a main part viewed from the direction of line BB ′ in FIG. 6 (b), for explaining the manufacturing process of the mounted body in the arrangement of the sealing structure in FIG. 16 (b). In the figure, (a) shows before bonding and (b) shows after bonding.
FIGS. 19A and 19B are cross-sectional views of the mounting body according to the third embodiment of the present invention, which are perpendicular to the substrate before the substrate is joined, FIG. FIG. 20C is a schematic configuration diagram (c) parallel to the substrate for explaining the arrangement of the sealing material of the mounting body in FIGS. 19A and 19B.
FIG. 20 is cross-sectional views (a), (b), and (c) illustrating an example of a sealing material according to the third embodiment.
FIGS. 21A to 21H are cross-sectional views of a sealing material according to a third embodiment.
FIGS. 22A to 22E are schematic views (a) to (e) of manufacturing steps for explaining a method of manufacturing a package according to the third embodiment.
FIG. 23 shows an example of an arrangement state of a sealing structure according to the third embodiment, wherein (b), (c), (d), and (e) are schematic configuration diagrams parallel to the substrate, and (a) is 23 (b), (c), (d), and (e) are sectional views taken along line AA 'of FIG.
FIG. 24 is a cross-sectional view of a main part showing a sealing structure under pressure in the manufacture of the package according to the third embodiment.
FIG. 25 is a cross-sectional view of a main part viewed from the direction of line BB ′ in FIG. 23 (b), for explaining the manufacturing process of the mounted body in the arrangement of the sealing components in FIG. 23 (b). In the figure, (a) shows before bonding and (b) shows after bonding.
26A to 26E are cross-sectional views showing deformations of the sheet-like sealing material according to the first embodiment of the present invention, and perspective perspective views of the sheet-like sealing material of FIG. (F).
FIGS. 27A to 27C are cross-sectional views showing another modification of the sheet-like sealing material according to the first embodiment of the present invention.
FIGS. 28A to 28D are cross-sectional views illustrating a sheet-like sealing material according to a second embodiment of the present invention.
FIGS. 29A and 29B are cross-sectional views (a) and (b) in each step for explaining the method for manufacturing a sheet-like sealing material according to the present invention.
FIGS. 30A to 30E are cross-sectional views in respective steps for describing a method for manufacturing an EL display device as one embodiment of a method for manufacturing a package using the sheet-shaped sealing material according to the present invention. FIG. 30C is a cross-sectional view taken along line AA ′ of FIG.
FIGS. 31A to 31D are plan views (a) to (d) of the substrate in FIG. 30 (c) for illustrating a modification of the arrangement of the sheet-like sealing material.
FIG. 32 is a plan view of a substrate for explaining another embodiment of the sheet-like sealing material according to the present invention.
FIG. 33 is a cross-sectional view in each step for explaining a method for manufacturing an EL display device using inorganic EL elements as another embodiment of the method for manufacturing a package using the sheet-shaped sealing material according to the present invention; (E).
FIG. 34 is a cross-sectional view in each step for describing a method for manufacturing a package in which a solar cell element is sealed as another embodiment of the method for manufacturing a package using the sheet-shaped sealing material according to the present invention ( a) to (e).
FIG. 35 is a cross-sectional view (a) of a strip member showing a modified example of the strip member of the sealing material according to the present invention and a mounting body using the same, and a cross section (b) of the mounting body perpendicular to the substrate. .
[Explanation of symbols]
1 core material, 1a plastic wire, 1b metal wire
1c metal tube, 2 metal layer, 3,3 ', 3 "adhesive layer
4a-4d, 4a'-4d ', 4a "-4d" sealing material
5 Substrate, 6 Counter substrate, 7 Lower electrode, 8 Electron transport layer
9 light emitting layer, 10 hole transport layer, 11 upper electrode
12 organic EL element, 13 member, 14 resin adhesive
15 insulating film, 16 base material, 17 conductive layer
Reference Signs List 20 inorganic EL element, 21, 23 insulating layer, 22 light emitting layer
24 electrode (Al), 30 solar cell element, 31 charge transport layer

Claims (124)

A strip member having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material. The strip member according to claim 1, wherein the metal layer has a thickness of 1 μm or more and 5 mm or less. The strip member according to claim 1, wherein the metal layer is formed of solder. The strip member according to claim 1, wherein the metal layer is formed of a low melting point alloy having a melting point of 80 ° C. or more and 250 ° C. or less. The metal layer is formed of a low melting point alloy containing at least one selected from the group consisting of lead, tin, bismuth, indium, cadmium and zinc and having a melting point of 80 ° C or more and 250 ° C or less. Article member described. The strip member according to any one of claims 1 to 5, wherein the metal layer is formed in a strip shape along the core material and covers 50% or more of an outer peripheral surface of the core material. The strip member according to claim 1, wherein the metal layer has a thickness of 5 μm or more and 30 μm or less. The strip member according to any one of claims 1 to 7, wherein the metal layer is formed of a low melting point alloy containing tin and indium. The strip member according to any one of claims 1 to 8, further comprising a conductive layer interposed between the metal layer and the strip member. The strip member according to claim 9, wherein the conductive layer is a plating layer containing copper. The sealing member according to any one of claims 1 to 10, which is used together with an adhesive to enhance a shielding property of bonding by the adhesive. The sealing member according to any one of claims 1 to 10, which is used together with a resin adhesive to enhance the shielding property against moisture or oxygen of bonding by the resin adhesive. The core material is formed of a plastic material or copper containing at least one selected from the group consisting of polyethylene, nylon, polyvinyl alcohol, aramid, polyethylene terephthalate, polystyrene, polypropylene, PAN, polyvinyl chloride, and polyphenylene sulfide. The strip member according to claim 1. The strip member according to any one of claims 1 to 13, wherein the core material is formed of a plastic that has been subjected to at least one type of surface treatment selected from the group consisting of plasma treatment, corona discharge treatment, and primer treatment. A sealing strip member having a strip-shaped metal material and a resiliently deformable strip-shaped core material incorporated in the metal material, for enhancing a shielding property of bonding by a resin adhesive. A method for producing a strip member, comprising: a step of preparing an elastically deformable strip-shaped core material; and a step of providing a metal layer covering at least a part of the core material. 17. The method according to claim 16, wherein the metal layer is formed using at least one method selected from the group consisting of an electrolytic plating method, an electroless plating method, and a metal fusion method. The core is a plastic wire, the metal layer is formed by an electrolytic plating method, and a step of forming a conductive layer interposed between the metal layer and the strip member before the step of providing the metal layer. The method for producing a strip member according to claim 16, comprising: The method according to claim 18, wherein the conductive layer is formed by electroless plating, and the metal layer is formed to a thickness of 5 to 30 m. 20. The method according to claim 18, wherein the conductive layer is a plating layer containing copper, and the metal layer is formed of a low melting point alloy containing tin and indium. The core is formed of plastic, and further,
21. The method according to claim 16, further comprising a step of subjecting the core material to at least one type of surface treatment selected from the group consisting of plasma treatment, corona discharge treatment, and primer treatment. A strip member having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material; and a sealing material having an adhesive layer attached to the strip member. 23. The adhesive layer is formed of a resin composition containing as a main component at least one resin selected from the group consisting of an acrylic resin, an epoxy resin, a phenol resin, a polyester resin, a melamine resin, and a xylene resin. The sealing material according to the above. 24. The sealing material according to claim 22, wherein the adhesive layer is formed of a resin composition having a melt index of 0.2 or more and 200 or less. The sealing material according to any one of claims 22 to 24, wherein the adhesive layer is formed of a resin composition having a curing temperature of 50C to 200C. The sealing material according to any one of claims 22 to 24, wherein the adhesive layer is formed of a resin composition that is cured by radiation. The sealing material according to any one of claims 22 to 26, wherein the metal layer is formed in a strip shape along the core material, and the adhesive layer has a thickness of 1 µm or more and 10 mm or less. The sealing material according to any one of claims 22 to 27, wherein the core material is formed of a plastic that has been subjected to at least one type of surface treatment selected from the group consisting of plasma treatment, corona discharge treatment, and primer treatment. . A plurality of strip members each having a resiliently deformable strip-shaped core material and a metal layer covering at least a part of the core material, and a sealing material having a resin layer connecting the plurality of strip members; . The metal layer is formed in a strip shape along the core material with a low melting point metal, and the resin layer is selected from the group consisting of an acrylic resin, an epoxy resin, a phenol resin, a polyester resin, a melamine resin, and a xylene resin. 30. The sealing material according to claim 29, wherein the sealing material is formed of an adhesive composition containing at least one resin as a main component. A step of preparing an elastically deformable strip-shaped core material,
A step of forming a strip member on which a metal layer covering at least a part of the core material is formed,
Forming an adhesive layer covering at least a part of the periphery of the strip member. The production of a sealing material according to claim 31, wherein the metal layer is formed in a strip shape along the core material, and the adhesive layer is formed on the strip member by dipping or spraying using a resin composition. Method. The core is formed of plastic, and further, before the step of forming the strip member,
33. The method for manufacturing a sealing material according to claim 31, further comprising a step of subjecting the core material to at least one type of surface treatment selected from the group consisting of plasma treatment, corona discharge treatment, and primer treatment. A substrate having a release surface;
A strip member having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material; and an adhesive supported with the strip member on the release surface of the base material. Sheet-shaped sealing material. 35. The sheet-like sealing material according to claim 34, wherein the strip member is at least partially embedded in the adhesive. 35. The sheet-like sealing material according to claim 34, wherein the strip member is attached on the adhesive. 35. The sheet-like sealing material according to claim 34, wherein the strip member is disposed in a strip slit provided in the adhesive. The metal layer is formed in a strip shape along the core material, and the adhesive is at least one selected from the group consisting of an acrylic resin, an epoxy resin, a phenol resin, a polyester resin, a melamine resin, and a xylene resin. The sheet-like sealing material according to any one of claims 34 to 37, which is a resin composition containing a resin as a main component. The adhesive contains a desiccant, and the core material is at least one selected from the group consisting of polyethylene, nylon, polyvinyl alcohol, aramid, polyethylene terephthalate, polystyrene, polypropylene, PAN, polyvinyl chloride, and polyphenylene sulfide. The sheet-like sealing material according to any one of claims 34 to 38, wherein the sheet-like sealing material is formed of a contained elastic material or copper. The sheet-like sealing material according to any one of claims 34 to 39, wherein the strip member is annular, and the adhesive is annularly arranged on the releasable surface so as to be parallel to the strip member. 41. The sheet-like seal according to any one of claims 34 to 40, wherein the core material is formed of a plastic that has been subjected to at least one type of surface treatment selected from the group consisting of plasma treatment, corona discharge treatment, and primer treatment. Stopping material. A substrate having a release surface;
A plurality of strip members each having an elastic strip-shaped core material and a metal layer covering at least a part of the core material arranged in parallel; and the plurality of strip members on the mold releasing surface of the base material A sheet-like sealing material having an adhesive supported on the sheet. A step of preparing a strip member covered by the metal layer at least a part of the elastically deformable strip-shaped core material,
A step of preparing a substrate having a release surface,
Arranging a resin adhesive on the release surface of the substrate,
Arranging the strip member on the releasable surface of the base material. 44. The method for manufacturing a sheet-like sealing material according to claim 43, wherein the strip member is arranged such that at least a part of the strip member is embedded in the resin adhesive. The method for manufacturing a sheet-like sealing material according to claim 43, wherein the strip member is placed on the resin adhesive. The method for manufacturing a sheet-like sealing material according to claim 43, wherein the resin adhesive is disposed so as to have a slit corresponding to the strip member, and the strip member is disposed in the slit of the resin adhesive. The metal layer is formed in a strip shape along the core material, and the core material is selected from the group consisting of polyethylene, nylon, polyvinyl alcohol, aramid, polyethylene terephthalate, polystyrene, polypropylene, PAN, polyvinyl chloride, and polyphenylene sulfide. The method for producing a sheet-like sealing material according to any one of claims 43 to 46, wherein the method is made of an elastic material containing at least one selected from the group consisting of copper and copper. Furthermore,
Blending a desiccant in the resin adhesive,
48. The method of manufacturing a sheet-like sealing material according to any one of claims 43 to 47, further comprising: covering the strip member and the resin adhesive disposed on the releasable surface with another releasable surface. The sheet-shaped sealing material according to any one of claims 43 to 48, wherein the strip member is annular, and the resin adhesive is annularly arranged on the releasable surface so as to be parallel to the strip member. Production method. The step of preparing the strip member,
A step of forming the core material from plastic;
A step of subjecting the core material to at least one type of surface treatment selected from the group consisting of plasma treatment, corona discharge treatment, and primer treatment; and a step of providing a metal layer covering the surface-treated core material. The method for producing a sheet-shaped sealing material according to any one of claims 43 to 49, comprising: A base member having a releasable surface; a strip member having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material; and the releasability of the base material together with the strip member. A sheet-like sealing material having a resin adhesive supported on the surface:
A sealing substrate comprising the sheet-shaped sealing material and a substrate to which the resin adhesive is adhered. substrate;
A strip member disposed on the substrate and having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material;
A sealing substrate having a resin adhesive disposed on the substrate together with the strip member; and a base material having a releasable surface and covering the resin adhesive with the releasable surface. A strip member disposed on the substrate and having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material; and an adhesive disposed on the substrate together with the strip member. A sealing structure for sealingly bonding the substrate to another substrate. The sealing structure according to claim 53, wherein the metal layer has a thickness of 1 µm or more and 5 mm or less. The sealing structure according to claim 53 or 54, wherein the metal layer is formed of solder. 55. The sealing structure according to claim 53, wherein the metal layer is formed of a low melting point alloy having a melting point of 80C or more and 250C or less. The sealing structure according to claim 53 or 54, wherein the metal layer is formed of a low melting point alloy containing at least one selected from the group consisting of lead, tin, bismuth, indium, cadmium, and zinc. The sealing structure according to any one of claims 53 to 57, wherein the metal layer is formed in a strip shape along the core material and covers 50% or more of an outer peripheral surface of the core material. 59. The adhesive according to claim 53, wherein the adhesive is a resin composition containing as a main component at least one resin selected from the group consisting of an acrylic resin, an epoxy resin, a phenol resin, a polyester resin, a melamine resin, and a xylene resin. The sealing structure according to any one of the above. The sealing structure according to any one of claims 53 to 59, wherein the adhesive is a resin composition having a melt index of 0.2 or more and 200 or less. The sealing composition according to any one of claims 53 to 60, wherein the adhesive is a resin composition having a curing temperature of 50C to 200C. The sealing structure according to any one of claims 53 to 60, wherein the adhesive is a resin composition that is cured by radiation. The sealing structure according to any one of claims 53 to 62, wherein the adhesive is formed in a strip-shaped layer having a thickness in a direction perpendicular to the substrate of 1 µm or more and 10 mm or less. A step of preparing a strip member having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material,
Arranging the strip member and the adhesive on a substrate, the method comprising the steps of: sealing and joining the substrate to another substrate. 65. The method of claim 64, wherein the step of disposing the strip member and the adhesive comprises immersing the strip member in the adhesive or spraying the adhesive on the substrate. Production method. A step of preparing a plurality of strip members each having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material,
Disposing the plurality of strip members and the adhesive on a substrate, and positioning the adhesive between the plurality of parallel strip members, for sealingly bonding the substrate to another substrate. A method for producing a sealing structure. A sealing structure provided on the substrate to seal and bond the substrate and the counter substrate,
A line-shaped moisture-proof layer,
An adhesive layer for bonding the substrate to the counter substrate,
A sealing structure having an elastic layer capable of pressing the moisture-proof layer to the substrate and the counter substrate by elastic deformation when the substrate is bonded to the counter substrate. 68. The sealing structure according to claim 67, wherein the elastic layer is formed of an elastically deformable strip-shaped core material, and the moisture-proof layer is formed of metal in parallel with the core material. 69. The sealing structure according to claim 68, wherein the core has a circular cross section, and a thickness of the adhesive layer in a direction perpendicular to the substrate is 20% to 400% of a diameter of the core. 70. The sealing structure according to claim 68 or 69, wherein the metal covers at least a part of the core material with a thickness of 1 m to 5 mm. 71. The sealing structure according to any one of claims 67 to 70, wherein the moisture-proof layer is formed of solder. 71. The sealing structure according to any one of claims 67 to 70, wherein the moisture-proof layer is formed of a low melting point alloy having a melting point of 80C or more and 250C or less. 71. The moisture-proof layer is formed of a low melting point alloy containing at least one selected from the group consisting of lead, tin, bismuth, indium, cadmium, and zinc and having a melting point of 80C or more and 250C or less. The sealing structure according to any one of the above. 74. The sealing structure according to any one of claims 68 to 73, wherein the metal is formed in a strip shape along the core material, and covers 50% or more of an outer peripheral surface of the core material. The adhesive layer is made of a resin composition containing, as a main component, at least one resin selected from the group consisting of an acrylic resin, an epoxy resin, a phenol resin, a polyester resin, a melamine resin, and a xylene resin, and has stress resistance. A sealing structure according to any one of claims 67 to 74. The sealing structure according to any one of claims 67 to 75, wherein the adhesive layer is formed of a resin composition having a melt index of 0.2 or more and 200 or less. 77. The sealing structure according to any one of claims 67 to 76, wherein the adhesive layer is formed of a resin composition having a curing temperature of 50C to 200C. 77. The sealing structure according to any one of claims 67 to 76, wherein the adhesive layer is formed of a resin composition that is cured by radiation. The sealing structure according to any one of claims 67 to 78, wherein the adhesive layer is formed as a strip-shaped layer having a thickness in a direction perpendicular to the substrate of 1 µm or more and 10 mm or less. A step of providing, on the substrate, a strip-shaped moisture-proof layer and an elastic layer which is in parallel with the moisture-proof layer and which can be pressed against the substrate and the counter substrate by elastic deformation when the substrate is bonded to the counter substrate. ,
Providing a bonding layer on the substrate for bonding the substrate to the counter substrate, the method comprising the steps of: A substrate and a counter substrate facing the substrate;
An adhesive for bonding the substrate and the counter substrate; and an elastically deformed strip-shaped core material, and covering at least a portion of the core material, and the elastically deformed core material forms both the substrate and the counter substrate. A sealing body having a strip member for shielding a space between the substrate and the counter substrate, the sealing member having a metal layer to be pressed. A substrate and a counter substrate facing the substrate;
An adhesive for joining the substrate and the counter substrate;
A strip-shaped metal layer for shielding a space between the substrate and the counter substrate; and an elastic deformation between the substrate and the counter substrate to press the metal layer against both the substrate and the counter substrate. A sealed body having a strip-shaped core material. A substrate and a counter substrate facing the substrate;
An adhesive layer that joins the substrate and the counter substrate;
A strip-shaped moisture-proof layer for shielding a space between the substrate and the counter substrate; and an elastic deformation between the substrate and the counter substrate to press the moisture-proof layer against both the substrate and the counter substrate. A sealed body having an elastic layer. A substrate and a counter substrate facing the substrate;
An adhesive for joining the substrate and the counter substrate;
An elastically deformed strip-shaped core material, and a metal layer covering at least a part of the core material and being pressed against both the substrate and the counter substrate by the elastically deformed core material; A mounting member having a strip member for shielding a space between the substrate and a functional element provided in the space between the substrate and the counter substrate. The functional element is an element selected from the group consisting of an organic EL element, an inorganic EL element, and a solar cell element, and the adhesive, the metal layer, and the core are disposed so as to surround the functional element. 85. The mounting body according to claim 84, wherein The metal layer has a melting point of 80 ° C. or more and 250 ° C. or less and is arranged in a strip shape along the core material, and the adhesive layer is arranged outside the metal layer along the strip member, and an acrylic resin; 86. The mounting according to claim 84 or 85, comprising a resin composition containing at least one resin selected from the group consisting of an epoxy resin, a phenol resin, a polyester resin, a melamine resin, and a xylene resin as a main component, and having stress resistance. body. The adhesive contains a desiccant, and the core material is at least one selected from the group consisting of polyethylene, nylon, polyvinyl alcohol, aramid, polyethylene terephthalate, polystyrene, polypropylene, PAN, polyvinyl chloride, and polyphenylene sulfide. 87. The package according to claim 84, wherein the package is formed of an elastic material or copper. A substrate and a counter substrate facing the substrate;
An adhesive for joining the substrate and the counter substrate;
A strip-shaped metal layer for shielding a space between the substrate and the counter substrate;
A strip-shaped core material that elastically deforms between the substrate and the counter substrate to press the metal layer against both the substrate and the counter substrate; and is provided in the space between the substrate and the counter substrate. Package having a functional element to be used. The functional element is an element selected from the group consisting of an organic EL element, an inorganic EL element, and a solar cell element, and the adhesive, the metal layer, and the core are disposed so as to surround the functional element. 90. The mounting body according to claim 88. The metal layer has a melting point of not less than 80 ° C. and not more than 250 ° C. and is arranged in parallel with the core material. The adhesive layer is arranged outside the metal layer along the strip member, and is made of an acrylic resin or an epoxy resin. 90. The mounting body according to claim 88, wherein the mounting body is made of a resin composition containing, as a main component, at least one resin selected from the group consisting of a phenol resin, a polyester resin, a melamine resin, and a xylene resin. The adhesive contains a desiccant, and the core material is at least one selected from the group consisting of polyethylene, nylon, polyvinyl alcohol, aramid, polyethylene terephthalate, polystyrene, polypropylene, PAN, polyvinyl chloride, and polyphenylene sulfide. The mounting body according to any one of claims 88 to 90, wherein the mounting body is formed of a contained elastic material or copper. A substrate and a counter substrate facing the substrate;
An adhesive layer that joins the substrate and the counter substrate;
A strip-shaped moisture-proof layer for shielding a space between the substrate and the counter substrate;
An elastic layer elastically deforming between the substrate and the counter substrate to press the moisture-proof layer against both the substrate and the counter substrate; and a functional element provided in the space between the substrate and the counter substrate A mounting body having: The functional element is an element selected from the group consisting of an organic EL element, an inorganic EL element, and a solar cell element, and the adhesive layer, the moisture-proof layer, and the elastic layer are arranged in parallel so as to surround the functional element. 93. The mounting body according to claim 92, wherein the mounting body is arranged in a vertical direction. The moisture-proof layer is a metal having a melting point of 80 ° C. or more and 250 ° C. or less and is provided in parallel with the core material. The adhesive layer is disposed outside the moisture-proof layer along the elastic layer, and is formed of an acrylic resin, an epoxy resin, The mounting body according to claim 92, wherein the mounting body is formed of a resin composition containing at least one resin selected from the group consisting of a resin, a phenol resin, a polyester resin, a melamine resin, and a xylene resin as a main component, and has stress resistance. . The adhesive layer contains a desiccant, and the elastic layer is at least one selected from the group consisting of polyethylene, nylon, polyvinyl alcohol, aramid, polyethylene terephthalate, polystyrene, polypropylene, PAN, polyvinyl chloride, and polyphenylene sulfide. The mounting body according to any one of claims 92 to 94, wherein the mounting body is formed of a contained elastic material or copper. A step of preparing a substrate provided with a functional element,
A step of disposing an elastically deformable strip-shaped core material and a strip member having a metal layer covering at least a part of the core material on the substrate so as to surround the functional element,
Arranging an adhesive on the substrate so as to be in parallel with the strip member;
Joining the substrate and the counter substrate with the adhesive while pressing the counter substrate against the strip member. The metal layer is formed of a low melting point metal having a melting point of 80 ° C. or more and 250 ° C. or less using at least one method selected from the group consisting of an electrolytic plating method, an electroless plating method, and a metal fusion method. A method for manufacturing a package according to claim 96. The manufacturing method of a mounting body according to claim 96 or 97, wherein the adhesive is a plastic resin composition or a resin molded body arranged by a dispenser, spray, or screen printing. The method for manufacturing a package according to any one of claims 96 to 98, wherein the adhesive is a resin composition that is cured by heat or radiation, and bonds the substrate and the counter substrate by curing the resin composition. . A step of preparing a substrate provided with a functional element,
An elastically deformable strip-shaped core material and a strip member having a metal layer covering at least a part of the core material are formed on the counter substrate so as to surround the functional element when the substrate and the counter substrate face each other. Arranging,
Arranging an adhesive on the counter substrate so as to be in parallel with the strip member;
Bonding the substrate and the opposing substrate with the adhesive while pressing the substrate against the strip member. The metal layer is formed of a low melting point metal having a melting point of 80 ° C. or more and 250 ° C. or less using at least one method selected from the group consisting of an electrolytic plating method, an electroless plating method, and a metal fusion method. A method for manufacturing a package according to claim 100. The manufacturing method of a mounting body according to claim 100 or 101, wherein the adhesive is a plastic resin composition or a resin molded body arranged by a dispenser, spray or screen printing. The method for manufacturing a package according to any one of claims 100 to 102, wherein the adhesive is a resin composition that is cured by heat or radiation, and bonds the substrate and the counter substrate by curing the resin composition. . A step of preparing a substrate provided with a functional element,
An elastically deformable strip-shaped core material and a strip member having a metal layer covering at least a part of the core material, and an adhesive arranged in parallel with the strip member, the substrate and the opposing substrate face each other when facing each other. A step of preparing the counter substrate provided so as to surround the functional element, and a step of joining the substrate and the counter substrate by the adhesive while pressing the strip member against the substrate. Production method. The metal layer is formed of a low melting point metal having a melting point of 80 ° C. or more and 250 ° C. or less using at least one method selected from the group consisting of an electrolytic plating method, an electroless plating method, and a metal fusion method. A method for manufacturing the package according to claim 104. The method for manufacturing a package according to claim 104 or 105, wherein the adhesive is a plastic resin composition or a resin molded body arranged by a dispenser, spray, or screen printing. The method for manufacturing a package according to any one of claims 104 to 106, wherein the adhesive is a resin composition that is cured by heat or radiation, and bonds the substrate and the counter substrate by curing the resin composition. . A step of preparing a substrate provided with a functional element,
A strip-shaped moisture-proof layer and an elastic layer that is arranged in parallel with the moisture-proof layer and that can press the moisture-proof layer against the substrate and the counter substrate by elastic deformation when the substrate and the counter substrate are bonded to each other. Providing on the substrate to surround it;
Providing an adhesive layer on the substrate in parallel with the moisture-proof layer;
Bonding the opposing substrate to the elastic substrate with the adhesive while pressing the opposing substrate against the elastic layer. 109. The method according to claim 108, wherein the adhesive layer is provided by disposing a plastic resin composition by dispenser, spray, or screen printing, or by disposing a resin molded body. The method for manufacturing a package according to claim 108 or 109, wherein the adhesive layer is formed of a resin composition that is cured by heat or radiation, and the substrate and the counter substrate are joined by curing the resin composition. A step of preparing a substrate provided with a functional element,
A strip-shaped moisture-proof layer, an elastic layer arranged in parallel with the moisture-proof layer, and elastically deforming the moisture-proof layer to the substrate and the counter substrate by elastic deformation when the substrate is bonded to the counter substrate; An adhesive layer to be provided, a step of preparing the counter substrate provided so as to surround the functional element when the substrate and the counter substrate face each other,
Bonding the substrate and the opposing substrate by the adhesive layer while pressing the substrate against the elastic layer. The method for manufacturing a package according to claim 111, wherein the adhesive layer is provided by disposing a plastic resin composition by dispenser, spray, or screen printing, or by disposing a resin molded body. The method for manufacturing a package according to claim 111, wherein the adhesive layer is formed of a resin composition that is cured by heat or radiation, and the substrate and the counter substrate are joined by curing the resin composition. A step of preparing a substrate provided with a functional element,
A strip-shaped metal layer, a strip-shaped elastic core member which is in parallel with the metal, and which can press the metal layer against the substrate and the counter substrate by elastic deformation when the substrate and the counter substrate are joined; and An adhesive in parallel with the layer, the step of preparing the counter substrate provided so as to surround the functional element when the substrate and the counter substrate face each other,
Bonding the substrate and the opposing substrate by the adhesive while pressing the substrate against the elastic core material. 115. The method according to claim 114, wherein the adhesive is provided by disposing a plastic resin composition by dispenser, spray, or screen printing, or by disposing a resin molded body. The method for manufacturing a package according to claim 114 or 115, wherein the adhesive is a resin composition that is cured by heat or radiation, and the substrate and the counter substrate are joined by curing of the resin composition. A step of preparing a substrate provided with a functional element,
A sealing structure in which a plurality of strip members each having an elastically deformable strip-shaped core material and a metal layer covering at least a part of the core material are arranged in parallel via an adhesive layer, Disposing on the substrate so as to surround it;
Joining the opposing substrate to the substrate by the adhesive layer while pressing the opposing substrate against the strip member. The metal layer is formed of a low melting point metal having a melting point of 80 ° C. or more and 250 ° C. or less using at least one method selected from the group consisting of an electrolytic plating method, an electroless plating method, and a metal fusion method. A method for manufacturing a package according to claim 117. 119. The method according to claim 117, wherein the adhesive layer is formed of a resin composition that is cured by heat or radiation, and the substrate and the counter substrate are joined by curing the resin composition. A step of preparing a substrate provided with a functional element,
A sheet-shaped member having a strip member in which a strip-shaped core material having elasticity is coated with a metal layer, a base material having a release surface, and an adhesive supported on the release surface together with the strip member. Affixing the adhesive of the sheet-shaped sealing material to the substrate so as to surround the functional element with a sealing material,
Peeling the substrate from the adhesive,
Bonding the substrate and the opposing substrate with the adhesive while pressing the opposing substrate against the strip member on the substrate. The metal layer is formed of a low melting point metal having a melting point of 80 ° C. or more and 250 ° C. or less using at least one method selected from the group consisting of an electrolytic plating method, an electroless plating method, and a metal fusion method. A method for manufacturing a package according to claim 120. 122. The method according to claim 120 or 121, wherein the adhesive is a resin composition that is cured by heat or radiation, and the substrate and the counter substrate are joined by curing the resin composition. A substrate and a counter substrate facing the substrate;
An adhesive layer that joins the substrate and the counter substrate;
A strip-shaped moisture-proof layer pressed into contact with both the substrate and the counter substrate to shield a space between the substrate and the counter substrate; and a functional element provided in the space between the substrate and the counter substrate. Mounting body. A substrate and a counter substrate bonded to the substrate;
A strip-shaped metal layer for shielding a space between the substrate and the counter substrate;
A strip-shaped core material elastically deformed between the substrate and the counter substrate to press the moisture-proof layer against both the substrate and the counter substrate; and provided in the space between the substrate and the counter substrate. Package having a functional element to be used.

Images