JP2004289140A5 - - Google Patents
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- JP2004289140A5 JP2004289140A5 JP2004058378A JP2004058378A JP2004289140A5 JP 2004289140 A5 JP2004289140 A5 JP 2004289140A5 JP 2004058378 A JP2004058378 A JP 2004058378A JP 2004058378 A JP2004058378 A JP 2004058378A JP 2004289140 A5 JP2004289140 A5 JP 2004289140A5
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- laser
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Claims (10)
前記第1のレーザビーム及び前記第2のレーザビームと、前記照射面とを相対的に移動させるレーザ照射方法であって、
前記第1のレーザビームは、前記照射面において長径方向の両端が切り取られ、
前記第2のレーザビームは、前記照射面において前記第1のレーザビームが照射される領域内を照射することを特徴とするレーザ照射方法。 The irradiation surface of the first continuous wave laser beam is a wavelength than that of visible light is incident, processing the first laser beam such that the elliptical beam, the continuous oscillation is basic wave 2 the laser beam is irradiated from an oblique at the same time as the previous SL first laser beam of,
It said first laser beam and said second laser beam, and the irradiation surface a relatively laser irradiation method of moving,
The first laser beam is cut at both ends in the major axis direction on the irradiation surface,
The laser irradiation method , wherein the second laser beam irradiates a region irradiated with the first laser beam on the irradiation surface.
前記複数の第1のレーザビーム及び前記第2のレーザビームと、前記照射面とを相対的に移動させるレーザ照射方法であって、A laser irradiation method for relatively moving the plurality of first laser beams and the second laser beam and the irradiation surface,
前記複数の第1のレーザビームは、前記照射面において、長径が一直線上となるように重ね合わせられ、The plurality of first laser beams are superimposed on the irradiation surface so that the major axis is in a straight line,
前記照射面において、前記重ね合わせられた複数の第1のレーザビームの長径方向の両端が切り取られ、In the irradiation surface, both ends of the superposed first laser beams in the major axis direction are cut off,
前記第2のレーザビームは、前記照射面において、前記重ね合わせられた複数の第1のレーザビームが照射される領域内を照射することを特徴とするレーザ照射方法。The laser irradiation method, wherein the second laser beam irradiates the irradiation surface in a region irradiated with the plurality of superimposed first laser beams.
前記複数の第1のレーザビーム及び前記複数の第2のレーザビームと、前記照射面とを相対的に移動させるレーザ照射方法であって、A laser irradiation method for relatively moving the plurality of first laser beams and the plurality of second laser beams and the irradiation surface,
前記複数の第1のレーザビームは、前記照射面において、長径が一直線上となるように重ね合わせられ、The plurality of first laser beams are superimposed on the irradiation surface so that the major axis is in a straight line,
前記照射面において、前記重ね合わせられた複数の第1のレーザビームの長径方向の両端が切り取られ、In the irradiation surface, both ends of the superposed first laser beams in the major axis direction are cut off,
前記複数の第2のレーザビームは、前記照射面において、前記両端が切り取られた第1のレーザビームが照射される領域内を照射することを特徴とするレーザ照射方法。The laser irradiation method, wherein the plurality of second laser beams irradiate a region irradiated with the first laser beam with both ends cut off on the irradiation surface.
前記第2のレーザビームは、光ファイバーを用いて、前記照射面に照射されることを特徴とするレーザ照射方法。The laser irradiation method, wherein the irradiation surface is irradiated with the second laser beam using an optical fiber.
前記第1のレーザビームは、前記照射面の上方に配置されたスリットにより、長径方向の両端が切り取られることを特徴とするレーザ照射方法。The laser irradiation method according to claim 1, wherein both ends of the major axis direction of the first laser beam are cut off by a slit disposed above the irradiation surface.
前記第1のレーザビームまたは前記第2のレーザビームは、気体レーザ、固体レーザまたは金属レーザから射出されることを特徴とするレーザ照射方法。 In any one of Claims 1 thru | or 5,
The first laser beam or the second laser beam, a laser irradiation method, wherein the emitted gas body laser, a solid laser or a metal laser.
前記第1のレーザビームまたは前記第2のレーザビームは、Arレーザ、Krレーザ、CO2レーザ、YAGレーザ、Y2O3レーザ、YVO4レーザ、YLFレーザ、YAlO3レーザ、アレキサンドライトレーザ、Ti:サファイヤレーザまたはヘリウムカドミウムレーザから射出されることを特徴とするレーザ照射方法。 In any one of Claims 1 thru | or 6,
The first laser beam or the second laser beam, Ar laser, Kr laser, CO 2 laser, YAG laser, Y 2 O 3 laser, YVO 4 laser, YLF laser, YAlO 3 laser, alexandrite wells laser, Ti : A laser irradiation method of emitting from a sapphire laser or a helium cadmium laser.
前記照射面は透光性基板上に成膜された半導体膜の面であることを特徴とするレーザ照射方法。The laser irradiation method, wherein the irradiation surface is a surface of a semiconductor film formed on a light-transmitting substrate.
前記照射面は前記第1のレーザビームに対して透光性を有する厚さdの基板に成膜された半導体膜の面であり、前記長いビームの長径または短径の長さをWとすると、前記第1のレーザビームの前記照射面に対する入射角度φは、
φ≧arctan(W/2d)
を満たすことを特徴とするレーザ照射方法。 In any one of Claims 1 thru | or 8,
The irradiation surface is a surface of a semiconductor film formed on a substrate having a thickness d that is transparent to the first laser beam, and the length of the major axis or minor axis of the long beam is W. , The incident angle φ of the first laser beam with respect to the irradiation surface is
φ ≧ arctan (W / 2d)
The laser irradiation method characterized by satisfy | filling.
前記照射面は前記第2のレーザビームに対して透光性を有する厚さdの基板に成膜された半導体膜の面であり、前記長いビームの長径または短径の長さをWとすると、前記第2のレーザビームの前記照射面に対する入射角度φは、The irradiation surface is a surface of a semiconductor film formed on a substrate having a thickness d that is transparent to the second laser beam, and the length of the major axis or minor axis of the long beam is W. , The incident angle φ of the second laser beam with respect to the irradiation surface is
φ≧arctan(W/2d)φ ≧ arctan (W / 2d)
を満たすことを特徴とするレーザ照射方法。The laser irradiation method characterized by satisfy | filling.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2004058378A JP4799825B2 (en) | 2003-03-03 | 2004-03-03 | Laser irradiation method |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2003055289 | 2003-03-03 | ||
JP2003055289 | 2003-03-03 | ||
JP2004058378A JP4799825B2 (en) | 2003-03-03 | 2004-03-03 | Laser irradiation method |
Publications (3)
Publication Number | Publication Date |
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JP2004289140A JP2004289140A (en) | 2004-10-14 |
JP2004289140A5 true JP2004289140A5 (en) | 2006-07-20 |
JP4799825B2 JP4799825B2 (en) | 2011-10-26 |
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Family Applications (1)
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JP2004058378A Expired - Fee Related JP4799825B2 (en) | 2003-03-03 | 2004-03-03 | Laser irradiation method |
Country Status (1)
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JP (1) | JP4799825B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9296068B2 (en) | 2004-03-26 | 2016-03-29 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and laser irradiation apparatus |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US7160762B2 (en) | 2002-11-08 | 2007-01-09 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device, semiconductor device, and laser irradiation apparatus |
JP4429586B2 (en) | 2002-11-08 | 2010-03-10 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
JP4481040B2 (en) * | 2003-03-07 | 2010-06-16 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
JP5068975B2 (en) * | 2006-09-29 | 2012-11-07 | 富士フイルム株式会社 | Laser annealing technology, semiconductor film, semiconductor device, and electro-optical device |
JP5688203B2 (en) * | 2007-11-01 | 2015-03-25 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor substrate |
KR101391695B1 (en) * | 2012-04-24 | 2014-05-07 | 삼성디스플레이 주식회사 | LASER CRYSTALLIZATION APPARATUS AND Method for manufacturing thin film transistor substrate USING THE SAME |
Family Cites Families (8)
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JPS57183023A (en) * | 1981-05-02 | 1982-11-11 | Fujitsu Ltd | Laser annealing |
JPH04282869A (en) * | 1991-03-11 | 1992-10-07 | G T C:Kk | Manufacturing method of thin film semiconductor device and device for executing this |
JP3477888B2 (en) * | 1995-02-07 | 2003-12-10 | ソニー株式会社 | Method for manufacturing thin film semiconductor device |
JPH09270393A (en) * | 1996-03-29 | 1997-10-14 | Sanyo Electric Co Ltd | Laser light irradiation device |
JPH11340160A (en) * | 1998-05-29 | 1999-12-10 | Sumitomo Heavy Ind Ltd | Apparatus and method for laser annealing |
JP2002139697A (en) * | 2000-11-02 | 2002-05-17 | Mitsubishi Electric Corp | Laser optical system using plural laser beams, and laser annealing apparatus |
JP4845309B2 (en) * | 2000-12-27 | 2011-12-28 | 株式会社半導体エネルギー研究所 | Laser annealing method and manufacturing method of semiconductor device |
JP2003045820A (en) * | 2001-07-30 | 2003-02-14 | Semiconductor Energy Lab Co Ltd | Laser irradiation apparatus, and method, and method of manufacturing semiconductor device |
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2004
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9296068B2 (en) | 2004-03-26 | 2016-03-29 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and laser irradiation apparatus |
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