JP2004289140A5 - - Google Patents

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JP2004289140A5
JP2004289140A5 JP2004058378A JP2004058378A JP2004289140A5 JP 2004289140 A5 JP2004289140 A5 JP 2004289140A5 JP 2004058378 A JP2004058378 A JP 2004058378A JP 2004058378 A JP2004058378 A JP 2004058378A JP 2004289140 A5 JP2004289140 A5 JP 2004289140A5
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laser
irradiation surface
laser beam
irradiation
beams
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JP2004058378A
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JP2004289140A (en
JP4799825B2 (en
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Claims (10)

可視光線以下の波長である連続発振の第1のレーザビームが入射される照射面において、前記第1のレーザビームを楕円状ビームとなるように加工し、基本波である連続発振の第2のレーザビームを前記第1のレーザビームと同時に斜めから照射し、
前記第1のレーザビーム及び前記第2のレーザビームと、前記照射面を相対的に移動させるレーザ照射方法であって、
前記第1のレーザビームは、前記照射面において長径方向の両端が切り取られ、
前記第2のレーザビームは、前記照射面において前記第1のレーザビームが照射される領域内を照射することを特徴とするレーザ照射方法
The irradiation surface of the first continuous wave laser beam is a wavelength than that of visible light is incident, processing the first laser beam such that the elliptical beam, the continuous oscillation is basic wave 2 the laser beam is irradiated from an oblique at the same time as the previous SL first laser beam of,
It said first laser beam and said second laser beam, and the irradiation surface a relatively laser irradiation method of moving,
The first laser beam is cut at both ends in the major axis direction on the irradiation surface,
The laser irradiation method , wherein the second laser beam irradiates a region irradiated with the first laser beam on the irradiation surface.
可視光線以下の波長である連続発振の複数の第1のレーザビームが入射される照射面において、前記複数の第1のレーザビームを楕円状ビームとなるように加工し、基本波である連続発振の第2のレーザビームを前記複数の第1のレーザビームと同時に斜めから照射し、The plurality of first laser beams are processed into an elliptical beam on an irradiation surface on which a plurality of continuous oscillation first laser beams having a wavelength shorter than or equal to visible light are incident. The second laser beam is irradiated at an angle simultaneously with the plurality of first laser beams,
前記複数の第1のレーザビーム及び前記第2のレーザビームと、前記照射面とを相対的に移動させるレーザ照射方法であって、A laser irradiation method for relatively moving the plurality of first laser beams and the second laser beam and the irradiation surface,
前記複数の第1のレーザビームは、前記照射面において、長径が一直線上となるように重ね合わせられ、The plurality of first laser beams are superimposed on the irradiation surface so that the major axis is in a straight line,
前記照射面において、前記重ね合わせられた複数の第1のレーザビームの長径方向の両端が切り取られ、In the irradiation surface, both ends of the superposed first laser beams in the major axis direction are cut off,
前記第2のレーザビームは、前記照射面において、前記重ね合わせられた複数の第1のレーザビームが照射される領域内を照射することを特徴とするレーザ照射方法。The laser irradiation method, wherein the second laser beam irradiates the irradiation surface in a region irradiated with the plurality of superimposed first laser beams.
可視光線以下の波長である連続発振の複数の第1のレーザビームが入射される照射面において、前記複数の第1のレーザビームを楕円状ビームとなるように加工し、基本波である連続発振の複数の第2のレーザビームを前記複数の第1のレーザビームと同時に斜めから照射し、The plurality of first laser beams are processed into an elliptical beam on an irradiation surface on which a plurality of continuous oscillation first laser beams having a wavelength shorter than or equal to visible light are incident. Irradiating the plurality of second laser beams at a time simultaneously with the plurality of first laser beams,
前記複数の第1のレーザビーム及び前記複数の第2のレーザビームと、前記照射面とを相対的に移動させるレーザ照射方法であって、A laser irradiation method for relatively moving the plurality of first laser beams and the plurality of second laser beams and the irradiation surface,
前記複数の第1のレーザビームは、前記照射面において、長径が一直線上となるように重ね合わせられ、The plurality of first laser beams are superimposed on the irradiation surface so that the major axis is in a straight line,
前記照射面において、前記重ね合わせられた複数の第1のレーザビームの長径方向の両端が切り取られ、In the irradiation surface, both ends of the superposed first laser beams in the major axis direction are cut off,
前記複数の第2のレーザビームは、前記照射面において、前記両端が切り取られた第1のレーザビームが照射される領域内を照射することを特徴とするレーザ照射方法。The laser irradiation method, wherein the plurality of second laser beams irradiate a region irradiated with the first laser beam with both ends cut off on the irradiation surface.
請求項1乃至請求項3のいずれか一において、In any one of Claim 1 thru | or 3,
前記第2のレーザビームは、光ファイバーを用いて、前記照射面に照射されることを特徴とするレーザ照射方法。The laser irradiation method, wherein the irradiation surface is irradiated with the second laser beam using an optical fiber.
請求項1乃至請求項4のいずれか一において、In any one of Claims 1 thru | or 4,
前記第1のレーザビームは、前記照射面の上方に配置されたスリットにより、長径方向の両端が切り取られることを特徴とするレーザ照射方法。The laser irradiation method according to claim 1, wherein both ends of the major axis direction of the first laser beam are cut off by a slit disposed above the irradiation surface.
請求項1乃至請求項5のいずれか一において、
前記第1のレーザビームまたは前記第2のレーザビームは、体レーザ、固体レーザまたは金属レーザから射出されることを特徴とするレーザ照射方法。
In any one of Claims 1 thru | or 5,
The first laser beam or the second laser beam, a laser irradiation method, wherein the emitted gas body laser, a solid laser or a metal laser.
請求項1乃至請求項6のいずれか一において、
前記第1のレーザビームまたは前記第2のレーザビームは、Arレーザ、Krレーザ、COレーザ、YAGレーザ、Yレーザ、YVOレーザ、YLFレーザ、YAlOレーザ、アレキサンドライレーザ、Ti:サファイヤレーザまたはヘリウムカドミウムレーザから射出されることを特徴とするレーザ照射方法。
In any one of Claims 1 thru | or 6,
The first laser beam or the second laser beam, Ar laser, Kr laser, CO 2 laser, YAG laser, Y 2 O 3 laser, YVO 4 laser, YLF laser, YAlO 3 laser, alexandrite wells laser, Ti : A laser irradiation method of emitting from a sapphire laser or a helium cadmium laser.
請求項1乃至請求項7のいずれか一において、In any one of Claims 1 thru | or 7,
前記照射面は透光性基板上に成膜された半導体膜の面であることを特徴とするレーザ照射方法。The laser irradiation method, wherein the irradiation surface is a surface of a semiconductor film formed on a light-transmitting substrate.
請求項1乃至請求項8のいずれか一において、
前記照射面は前記第1のレーザビームに対して透光性を有する厚さdの基板に成膜された半導体の面であり、前記長いビームの長径または短径の長さをWとすると、前記第1のレーザビームの前記照射面に対する入射角度φは、
φ≧arctan(W/2d)
を満たすことを特徴とするレーザ照射方法。
In any one of Claims 1 thru | or 8,
The irradiation surface is a surface of a semiconductor film formed on a substrate having a thickness d that is transparent to the first laser beam, and the length of the major axis or minor axis of the long beam is W. , The incident angle φ of the first laser beam with respect to the irradiation surface is
φ ≧ arctan (W / 2d)
The laser irradiation method characterized by satisfy | filling.
請求項1乃至請求項9のいずれか一において、In any one of Claims 1 thru | or 9,
前記照射面は前記第2のレーザビームに対して透光性を有する厚さdの基板に成膜された半導体膜の面であり、前記長いビームの長径または短径の長さをWとすると、前記第2のレーザビームの前記照射面に対する入射角度φは、The irradiation surface is a surface of a semiconductor film formed on a substrate having a thickness d that is transparent to the second laser beam, and the length of the major axis or minor axis of the long beam is W. , The incident angle φ of the second laser beam with respect to the irradiation surface is
φ≧arctan(W/2d)φ ≧ arctan (W / 2d)
を満たすことを特徴とするレーザ照射方法。The laser irradiation method characterized by satisfy | filling.

JP2004058378A 2003-03-03 2004-03-03 Laser irradiation method Expired - Fee Related JP4799825B2 (en)

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JP2004289140A JP2004289140A (en) 2004-10-14
JP2004289140A5 true JP2004289140A5 (en) 2006-07-20
JP4799825B2 JP4799825B2 (en) 2011-10-26

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9296068B2 (en) 2004-03-26 2016-03-29 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method and laser irradiation apparatus

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7160762B2 (en) 2002-11-08 2007-01-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device, semiconductor device, and laser irradiation apparatus
JP4429586B2 (en) 2002-11-08 2010-03-10 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP4481040B2 (en) * 2003-03-07 2010-06-16 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP5068975B2 (en) * 2006-09-29 2012-11-07 富士フイルム株式会社 Laser annealing technology, semiconductor film, semiconductor device, and electro-optical device
JP5688203B2 (en) * 2007-11-01 2015-03-25 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor substrate
KR101391695B1 (en) * 2012-04-24 2014-05-07 삼성디스플레이 주식회사 LASER CRYSTALLIZATION APPARATUS AND Method for manufacturing thin film transistor substrate USING THE SAME

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JPS57183023A (en) * 1981-05-02 1982-11-11 Fujitsu Ltd Laser annealing
JPH04282869A (en) * 1991-03-11 1992-10-07 G T C:Kk Manufacturing method of thin film semiconductor device and device for executing this
JP3477888B2 (en) * 1995-02-07 2003-12-10 ソニー株式会社 Method for manufacturing thin film semiconductor device
JPH09270393A (en) * 1996-03-29 1997-10-14 Sanyo Electric Co Ltd Laser light irradiation device
JPH11340160A (en) * 1998-05-29 1999-12-10 Sumitomo Heavy Ind Ltd Apparatus and method for laser annealing
JP2002139697A (en) * 2000-11-02 2002-05-17 Mitsubishi Electric Corp Laser optical system using plural laser beams, and laser annealing apparatus
JP4845309B2 (en) * 2000-12-27 2011-12-28 株式会社半導体エネルギー研究所 Laser annealing method and manufacturing method of semiconductor device
JP2003045820A (en) * 2001-07-30 2003-02-14 Semiconductor Energy Lab Co Ltd Laser irradiation apparatus, and method, and method of manufacturing semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9296068B2 (en) 2004-03-26 2016-03-29 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method and laser irradiation apparatus

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