JP2004281743A - Pressure-contact power semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To not only prevent the losing of mounting screws upon disassembling and assembling but also improve the reliability of mechanical strength as well as the productivity of a control substrate mounting equipment, in a pressure-contact power semiconductor device in which the control substrate for controlling the semiconductor element is mounted on the cooling fin of the same element by mounting screws through the control substrate mounting equipment. <P>SOLUTION: The control substrate mounting equipment is constituted of a control substrate connecting unit for connecting the control substrate mounting equipment to the main surface of the control substrate so as to be opposed to the same and the mounting unit for the cooling fin formed by bending the unit on one end extended from the control substrate connecting unit, while the mounting equipment is employed for a control substrate mounting plate for screwing the mounting screws to the mounting unit, and the mounting screws are prevented from being lost from the mounting unit upon removing the control substrate mounting plate. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an improvement in a power pressure contact type semiconductor device in which a control board for controlling the power pressure contact type semiconductor element is attached to a heat radiation fin for cooling the power pressure contact type semiconductor element via a control board attachment.
[0002]
[Prior art]
This type of conventional power pressure contact type semiconductor device uses an L-shaped fixing member to fix a control board to a cooling fin.
[0003]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 2002-203931 (Claim 1, FIG. 3)
[0004]
[Problems to be solved by the invention]
In this type of conventional power pressure contact type semiconductor device, the L-shaped fixing member is connected to the cooling fin by a screw and a nut penetrating one end of the L-shaped fixing member connected to the control board. There has been a problem that screws and nuts are dropped and lost when attaching and detaching the L-shaped fixing member.
[0005]
The present invention has been made in order to solve the above-described problems, and a first object is to attach and detach a control board to and from a cooling fin, and to use the attachment and detachment during the so-called disassembly and assembly. This prevents the screw parts from falling off or being lost.
A second object is to increase the reliability of the mechanical strength of the mounting tool for the mounting.
[0006]
Further, a third object is to provide the attachment with a simple structure and at low cost.
A fourth object is to reduce the thickness of the attachment to plate-like production.
[0007]
[Means for Solving the Problems]
The present invention provides a power press-contact type semiconductor element, a cooling fin press-contacting at least one main electrode of the power press-contact type semiconductor element, a control board on which a control component for controlling the power press-contact type semiconductor element is mounted, A control board mounting plate including a control board connecting plate portion having a main surface facing the main surface of the control board and connecting to each other, and a mounting portion provided at one end of the control board connecting plate portion; and the mounting portion A power press-contact type semiconductor device provided with a male screw for mounting which penetrates the control board and fixes the mounting portion to the cooling fin, wherein the control board is integrated with the control board bonding plate from one end of the control board bonding plate. A female screw to which the male screw is screwed is inserted into a male screw insertion side of an opposite plate portion formed by bending an extending portion extending in a direction away from the U-shape, and the male screw is screwed to the cooling fin side. To form a male screw loosely fitted hole for fitting, in a state removed control board fixture relative to the cooling fins, is obtained so as to prevent detachment of the male screw from the mounting portion by the internal thread.
[0008]
Further, the control board mounting plate is bent near the front end of the control board mounting extending portion, and the front end is brought into contact with the surface of the opposing plate portion.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiment 1 FIG.
FIGS. 1 to 4 show the first embodiment. FIG. 1 is a plan view of a power pressure contact type semiconductor element and a control board portion of a power pressure contact type semiconductor device, FIG. 2 is a side view, and FIG. FIG. 4 is a detailed view of a main part. In FIG. 1, reference numeral 1 denotes a gate commutated turn-off (hereinafter referred to as GCT) thyristor constituting a power pressure contact type semiconductor device, and cooling fins 2 at both ends. It has an anode electrode 1a and a cathode electrode 1b which are pressed against each other, a control cathode terminal 1b1 which has a ring shape and protrudes at an equal pitch on the outer periphery, and further has a gate terminal 1c which protrudes at an equal pitch on the outer circumference. Reference numeral 3 denotes a control board for controlling the GCT thyristor, on which a capacitor 4 constituting a control circuit and a transistor 6 supported by a wall-shaped member 5 having a heat sink function are mounted on its main surface, and a cathode terminal 1b1 And the gate terminal 1c is screwed to a predetermined circuit pattern (not shown) of the control board 3 by a screw 7. Reference numeral 8 denotes an L-shaped mounting plate, a control board connecting plate portion 8a having a main surface facing the front main surface of the control board 3, and an end of the control board connecting plate portion 8a separating from the front main surface of the control board 3. In the U-shape, and is formed to be bent into a U-shape from the middle thereof, and is attached to the cooling fin 2, a bent portion 8c formed by the U-shaped bend, and both ends of the bent portion 8c The bent portion 8c is formed with a female screw 8c1 penetrating both main surfaces of the bent portion 8c. A hole 8c2 is formed so as to penetrate both main surfaces and concentric with the female screw 8c1 and into which a male screw to be described later is loosely fitted and screwed to the female screw 8c1, and the control board coupling plate 8a is controlled by the screw 9 and the nut 10. Although it is combined with the substrate 3 It is. Reference numeral 11 denotes a male screw composed of a hexagon socket head bolt. A male screw part screwed into the female screw 8c1 is loosely fitted in the hole 8c2, and a nut 13 is screwed into a tip which penetrates a hole 12a formed in the flat mounting plate 12. , The flat mounting plate 12 and the L-shaped mounting plate 8 are combined. The flat mounting plate 12 is formed by connecting a coupling screw member (not shown) to one end of the L-shaped mounting plate 14, and the other end of the L-shaped mounting plate 14 is screwed to a fin portion of the cooling fin 2. Are connected by In the first embodiment, cooling fins 2 are disposed at both ends of a GCT thyristor 1 and two GCT thyristors 1 are electrically connected in series via one of the cooling fins. 2A functions as an anode terminal, 2K functions as a cathode terminal, and 2AK functions as an intermediate terminal. Reference numeral 15 denotes a pressing mechanism including a pair of pressing plates 15a, a tie bar 15b connecting the pair of pressing plates 15a, 15a, and nuts 15c screwed to both ends of the tie bar 15b, and by screwing the nut 15c. , The contact portions between the main electrodes at both ends of the GCT thyristor 1 and the cooling fins 2 are pressed to form a press-contact type semiconductor device.
[0010]
In the press-contact type semiconductor device configured as described above, the GCT thyristor 1 performs an on / off operation by a control signal from the control board 3 to connect the anode terminal 2A to the cathode terminal 2K and the anode terminal 2A to the intermediate terminal 2AK. It is well known that the ON / OFF operation is performed between the intermediate terminal 2AK and the cathode terminal 2K. Further, heat generated by the transistor 6 supported by the wall member 5 having a heat sink function is radiated from the wall member 5.
[0011]
Next, attachment and detachment of the control board 3 to and from the cooling fins 2 will be described. First, the case of mounting will be described. A hexagon socket head bolt 11 is screwed into the female screw 8c1 of the L-shaped mounting plate 8 coupled to the control board 3, and the male screw portion at the distal end thereof is loosely fitted into the hole 8c2 and the distal end penetrates the flat mounting plate 12. The nut 13 is screwed into the nut, and the flat mounting plate 12 and the L-shaped mounting plate 14 are joined to complete the mounting. Next, the case of removal will be described. At the time of removal, the hexagon socket head cap screw 11 is loosened until it is separated from the nut 13 while holding the nut 13, so that not only the removal is completed but also the female screw 8 c 1 prevents the hexagon socket head cap bolt 11 from dropping.
[0012]
Further, since the distal ends of the bent portions 8d and 8e provided at both ends of the bent portion 8c of the L-shaped mounting plate 8 are configured to contact the main surface of the extending portion, the thickness of the control board mounting plate 8 is increased. The rigidity of the mounting portion against the tightening of the hexagon socket head bolt 11 can be increased without the need to perform this, and as a result, the weight and cost of the control board mounting plate, and consequently, the power pressure contact type semiconductor device can be reduced.
[0013]
Embodiment 2 FIG.
Embodiment 2 will be described with reference to FIG. FIG. 5 corresponds to FIG. 4 in the first embodiment. In the figure, reference numeral 16 denotes a flat mounting plate having the functions of the flat mounting plate 12 and the nut 13 according to the first embodiment, and a female screw 16a penetrating both main surfaces thereof is screwed with a male screw portion at the tip of the bolt 11 having a hexagonal hole. It is what I wore. The other configuration is the same as that of the first embodiment, and the description is omitted.
[0014]
In such a configuration, the flat mounting plate 16 plays the role of the nut 13 of the first embodiment. Therefore, when the control board 3 is attached to and detached from the cooling fin 2, the nut 13 is held as in the first embodiment. Therefore, it is possible to eliminate parts that fall during disassembly and assembly.
[0015]
Note that the electrical operation is the same as in the first embodiment, and a description thereof will be omitted.
[0016]
In the structure configured as described above, when the control board 3 is attached to and detached from the cooling fins 2, the falling of the hexagon socket head cap screw 11 is prevented by the female screw 8c1 as in the first embodiment. It is not necessary to hold the nut 13 as in the first embodiment. Therefore, it is possible to improve the workability of disassembly and assembly and prevent the screw component from being lost due to dropping.
[0017]
【The invention's effect】
As described above, the present invention prevents the external screw from dropping off from the control board mounting plate when the control board mounting plate is attached to and detached from the radiating fins, that is, at the time of disassembly and assembly. In addition to preventing unclear problems, the above-mentioned drop-out is prevented by the control board mounting plate, so that there is no need for any special components, and an increase in cost can be prevented. In addition, since the control board mounting plate is formed only by bending, it is not only possible to eliminate the fear of lowering the reliability of bonding as in the case where a plurality of parts are bonded, but also to control the control board mounting plate, There is an effect that is extremely excellent in practical use, such as an effect that the productivity of the semiconductor device can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view of a power pressure contact type semiconductor device and a control board unit according to Embodiment 1 of the present invention.
FIG. 2 is a side view of the power pressure contact type semiconductor device according to the first embodiment of the present invention.
FIG. 3 is a partial side view of the power pressure contact type semiconductor device according to the first embodiment of the present invention.
FIG. 4 is a detailed view of a main part of the power pressure contact type semiconductor device according to the first embodiment of the present invention;
FIG. 5 is a detailed view of a main part of a power pressure contact type semiconductor device according to a second embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF REFERENCE NUMERALS 1 power pressure contact type semiconductor element, 2 cooling fin, 3 control board, 8 control board mounting plate, 8b mounting portion, 8c bent portion, 8d bent portion, 8e bent portion, 8c1 female screw, 8c2 hole, 11 male screw, 12 flat plate Mounting plate, 13 nut, 14 Flat mounting plate, 14a Female screw

Claims (2)

A power press-contact semiconductor element, a cooling fin press-contacting a main electrode at at least one end of the power press-contact semiconductor element, a control board on which a control component for controlling the power press-contact semiconductor element is mounted, and a main surface of the control board. A control board coupling plate portion facing the main surface of the control substrate and coupled to each other, and a control substrate attachment plate including a mounting portion provided at one end of the control substrate coupling plate portion; and In a power pressure contact type semiconductor device provided with a male screw for mounting for fixing a mounting portion to the cooling fin, in a direction away from the control substrate, being integral with the control substrate coupling plate portion from one end of the control substrate coupling plate portion. A male screw into which the male screw is screwed is inserted into the male screw insertion side of the opposite plate portion formed by bending the extending portion into a U-shape, and a male screw into which the male screw is loosely fitted on the cooling fin side. A press-fit type for electric power, wherein a loose fitting hole is formed and the female screw prevents the male screw from dropping off from the mounting portion when the control board mounting tool is removed from the cooling fin. Semiconductor device. 2. The power pressure contact type semiconductor device according to claim 1, wherein a portion near an end of the extending portion of the control board attachment is bent, and the end is brought into contact with a surface of the opposing plate portion.

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